TW201938574A - 含矽化合物、胺甲酸乙酯樹脂、伸縮性膜、及其形成方法 - Google Patents
含矽化合物、胺甲酸乙酯樹脂、伸縮性膜、及其形成方法 Download PDFInfo
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- TW201938574A TW201938574A TW108106221A TW108106221A TW201938574A TW 201938574 A TW201938574 A TW 201938574A TW 108106221 A TW108106221 A TW 108106221A TW 108106221 A TW108106221 A TW 108106221A TW 201938574 A TW201938574 A TW 201938574A
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Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
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- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
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- C07F7/0872—Preparation and treatment thereof
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- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
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- C07F7/08—Compounds having one or more C—Si linkages
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- C07F7/0838—Compounds with one or more Si-O-Si sequences
- C07F7/0872—Preparation and treatment thereof
- C07F7/0876—Reactions involving the formation of bonds to a Si atom of a Si-O-Si sequence other than a bond of the Si-O-Si linkage
- C07F7/0878—Si-C bond
- C07F7/0879—Hydrosilylation reactions
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- B01J35/30—Catalysts, in general, characterised by their form or physical properties characterised by their physical properties
- B01J35/39—Photocatalytic properties
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- C—CHEMISTRY; METALLURGY
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- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
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- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1811—C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
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Abstract
Description
本發明係關於兼具伸縮性、強度、及撥水性之伸縮性膜及其形成方法、該伸縮性膜中使用的胺甲酸乙酯樹脂、及成為該胺甲酸乙酯樹脂之材料之含矽化合物。
近年來隨著物聯網(IoT,Internet of Things)之普及,穿戴式器件之開發進展。能夠連接於網路的鐘錶、眼鏡為其代表例。又,在醫療領域、運動領域,也需要能夠隨時監測身體狀態的穿戴式器件,為今後成長的領域。
就穿戴式器件而言,可揭示貼附在身體而隨時監控身體狀態之形態。如此的穿戴式器件,通常係由用以檢測來自身體的電訊號之生物體電極、用以將電訊號傳給感測器之配線、成為感測器之半導體晶片、及電池構成。又,通常,也需要用以黏著在皮膚的之黏著墊。針對生物體電極及周邊的配線、黏著墊之結構,詳載於專利文獻1。專利文獻1記載之穿戴式器件中,在生物體電極之周邊配置有聚矽氧系黏著膜,在生物體電極與感測器器件之間以被覆著伸縮性胺甲酸乙酯膜之蛇腹形狀之可伸縮之銀配線連接。
胺甲酸乙酯膜的伸縮性及強度高,具有作為伸縮配線之被覆膜的優良機械特性。但是胺甲酸乙酯膜有水解性,所以會有由於水解導致伸縮性及強度下降的缺點。另一方面,聚矽氧膜無水解性但有強度低的缺點。
有人探討在聚合物主鏈具有胺甲酸乙酯鍵與矽氧烷鍵兩者之聚矽氧胺甲酸乙酯聚合物。此聚合物之硬化物,比起聚矽氧單獨時有較高強度,比起聚胺甲酸乙酯單獨時有較低水解性。但是此聚合物之硬化物,其比起聚胺甲酸乙酯單獨時之強度低、聚矽氧單獨時之撥水性低,僅能獲得聚矽氧與聚胺甲酸乙酯中間的強度及撥水性。
又,另一方面,有人探討聚胺甲酸乙酯與聚矽氧摻混成的材料。例如:專利文獻2、專利文獻3記載將無反應性之聚矽氧與交聯性之聚胺甲酸乙酯摻混成的材料。若以如此的材料形成膜,聚矽氧會浮出(滲出)在硬化後之聚胺甲酸乙酯之膜表面,膜表面之撥水性提高。但是如此的膜中,聚矽氧並未交聯,故會有膜表面之聚矽氧剝落,撥水性易降低的問題。又,若聚矽氧不是存在表面則不會浮出在膜表面,因此當兩側以片材夾持而壓縮成型時,撥水性不高。
又,有人提案用以合成側鏈具矽氧烷之聚胺甲酸乙酯之二醇材料。專利文獻4、5揭示用以形成側鏈附有聚矽氧之聚胺甲酸乙酯之二醇化合物。在此所示之側鏈聚矽氧基,係矽氧烷之末端鍵結於二醇化合物的直鏈聚矽氧。
[先前技術文獻]
[專利文獻]
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2004-033468號公報
[專利文獻2]日本特開2011-194757號公報
[專利文獻3]日本特開2013-139534號公報
[專利文獻4]日本專利第2583412號
[專利文獻5]日本專利第2624060號
[專利文獻2]日本特開2011-194757號公報
[專利文獻3]日本特開2013-139534號公報
[專利文獻4]日本專利第2583412號
[專利文獻5]日本專利第2624060號
(發明欲解決之課題)
基於如此的背景,希望開發出具有和聚胺甲酸乙酯同程度之優良伸縮性及強度且有和聚矽氧同程度之優良撥水性之伸縮性膜及其形成方法。
本發明係為了解決上述問題,目的在於提供有優良的伸縮性及強度,且膜表面之撥水性也優良的伸縮性膜及其形成方法、該伸縮性膜中使用的胺甲酸乙酯樹脂、及成為該胺甲酸乙酯樹脂之材料之含矽化合物。
(解決課題之方式)
(解決課題之方式)
為了解決上述課題,本發明提供下式(1)表示之含矽化合物。
【化1】
式中,R1 、R2 、R3 、R4 、R5 、及R6 係碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 的含意相同,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
【化1】
式中,R1 、R2 、R3 、R4 、R5 、及R6 係碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 的含意相同,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
若為如本發明之含矽化合物,會成為適合使用在有優良的伸縮性及強度且膜表面之撥水性也優良的伸縮性膜中使用的胺甲酸乙酯樹脂的材料中的含矽化合物。
又,前述通式(1)之含矽化合物宜為下列通式(2)表示者較佳。
【化2】
式中,m如上所述。
【化2】
式中,m如上所述。
若為如此的含矽化合物,會成為強度的下降少且撥水性更優良的伸縮性膜中使用的胺甲酸乙酯樹脂的材料中適合使用的含矽化合物。
又,本發明提供有下列通式(3)表示之結構之胺甲酸乙酯樹脂。
【化3】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 的含意與R1 ~R6 相同,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
【化3】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 的含意與R1 ~R6 相同,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
若為如此的胺甲酸乙酯樹脂,會成為有優良的伸縮性及強度且膜表面之撥水性也優良的伸縮性膜中適合使用的胺甲酸乙酯樹脂。
又,下列通式(4)表示之在末端帶有(甲基)丙烯酸酯基之結構較佳。
【化4】
式中,R1 ~R6 、A、m同前所述,R12 為氫原子、甲基。p、q為1分子中之單元數,為1≦p≦100、1≦q≦3之範圍之整數。
【化4】
式中,R1 ~R6 、A、m同前所述,R12 為氫原子、甲基。p、q為1分子中之單元數,為1≦p≦100、1≦q≦3之範圍之整數。
若具有如此的在末端帶有(甲基)丙烯酸酯基的結構,會成為有更優良的伸縮性及強度且膜表面之撥水性也優良的伸縮性膜中適合使用的胺甲酸乙酯樹脂。
又,本發明提供含有前述胺甲酸乙酯樹脂之伸縮性膜。
若為如此的伸縮性膜,會成為有優良的伸縮性及強度且膜表面之撥水性也優良的伸縮性膜。
又,前述伸縮性膜依據JIS K 6251規定之拉伸試驗中測得的伸縮率為40~500%者較佳。
若為如此的伸縮率伸縮性膜,特別適合作為伸縮配線之被覆膜使用。
又,前述伸縮性膜宜作為接觸有伸縮性之導電性配線的膜使用較佳。
本發明之伸縮性膜尤其適合使用於如此的用途。
又,本發明提供一種伸縮性膜之形成方法,係形成伸縮性膜之方法,係將下式(1)表示之化合物與有異氰酸酯基之化合物混合並將該混合物製膜,利用加熱以使其硬化。
【化5】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 與R1 ~R6 的含意相同,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
【化5】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 與R1 ~R6 的含意相同,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
若為如本發明之伸縮性膜之形成方法,能夠輕易地形成有優良的伸縮性及強度且膜表面之撥水性也優良的伸縮性膜。
又,本發明提供一種伸縮性膜之形成方法,係形成伸縮性膜之方法,將下式(4)表示之在末端有(甲基)丙烯酸酯基之化合物進行製膜,並藉由加熱及/或光照射使其硬化;
【化6】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 的含意和R1 ~R6 相同樣,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,R12 為氫原子、甲基。m為1~3之範圍之整數。p、q為1分子中之單元數且為1≦p≦100、1≦q≦3之範圍之整數。
【化6】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 的含意和R1 ~R6 相同樣,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,R12 為氫原子、甲基。m為1~3之範圍之整數。p、q為1分子中之單元數且為1≦p≦100、1≦q≦3之範圍之整數。
本發明之伸縮性膜之形成方法中,也可如此將熱硬化與光硬化組合。
(發明之效果)
(發明之效果)
如上,若為本發明之伸縮性膜,會成為和聚胺甲酸乙酯有同程度之優良的伸縮性及強度且膜表面有和主鏈係矽氧烷鍵之聚矽氧為同程度或更好之優良的撥水性之高撥水性伸縮性膜。又,若為本發明之胺甲酸乙酯樹脂,可適用如此的伸縮性膜。再者,若為本發明之含矽化合物,可適用作為如此的胺甲酸乙酯樹脂之材料。本發明之伸縮性膜係以側鏈附有2個以上含矽基之胺甲酸乙酯樹脂為基礎樹脂,故2個以上附在側鏈之含矽基能以少量有效率地提高伸縮性膜之撥水性,主鏈之胺甲酸乙酯鍵能提高伸縮性膜之伸縮性及強度。2個以上的側鏈的含矽基總是面向伸縮性膜之表面側,故即使是例如在將伸縮性膜形成用組成物之兩面以片材夾持之密閉狀態形成伸縮性膜,撥水性仍為高。若為藉由使如此的伸縮性膜接觸導電性配線、或將導電性配線之單一面、兩面被覆而獲得之伸縮性配線膜,則不僅伸縮性及強度優異,表面之撥水性也優良。因此若為本發明之伸縮性膜,特別適合作為不只在穿戴式器件中將生物體電極與感測器連接之配線部,也能承載生物體電極、感測器全部之伸縮性膜使用。又,若為本發明之伸縮性膜之形成方法,可輕易地形成和聚胺甲酸乙酯有同程度之優良伸縮性及強度,且膜表面有和主鏈為矽氧烷鍵之聚矽氧為同程度或更好之優良的撥水性之高撥水性伸縮性膜。
如上述,聚胺甲酸乙酯有充分伸縮性及強度,但是撥水性低,有因水解導致強度及伸縮性降低的缺點,聚矽氧的撥水性高但有強度低的缺點。又,在主鏈具有胺甲酸乙酯鍵及矽氧烷鍵兩者之聚矽氧胺甲酸乙酯聚合物之硬化物,強度、撥水性居於聚胺甲酸乙酯及聚矽氧的中間,會有不及聚胺甲酸乙酯單獨時之強度、聚矽氧單獨時之撥水性的問題。再者,藉由將聚胺甲酸乙酯與聚矽氧摻混並烘烤而使聚矽氧集中在膜表面以提高撥水性並成膜之方法,膜表面之強度弱且若聚矽氧不存在表面則不會浮出在表面,故會有例如以兩面以片材夾持之密閉狀態則撥水性不會提高的缺點。此外,此方法為了加快聚矽氧之表面集中,需要事先摻混沸點為100~200℃之範圍之溶劑,會有無法以無溶劑製膜等對於組成物、製膜處理出現限制的缺點。考量如此的背景,希望開發出和聚胺甲酸乙酯有同程度之優良的伸縮性及強度且膜表面之強度也充分高,且和聚矽氧有同程度或更好之優良的撥水性及表面硬度之伸縮性膜及其形成方法。
本案發明人等為了達成上述目的努力研究,結果發現:若為將側鏈具有可撓性高之醚基及撥水性高之2~4個含矽基且主鏈具有胺甲酸乙酯鍵之樹脂作為基礎樹脂的有高撥水性且伸縮性及強度優異之膜,則可成為和聚胺甲酸乙酯有同程度或更好之優良的伸縮性及強度且膜表面有和聚矽氧同等或更好之優良的撥水性之伸縮性膜,特別適合作為穿戴式器件之伸縮配線的被覆膜,乃完成本發明。
有疏水性的矽及有可撓性的醚基的側鏈,會和親水性的胺甲酸乙酯鍵的主鏈相排斥,配位成含矽側鏈遠離胺甲酸乙酯鍵。胺甲酸乙酯鍵的周圍沒有成為立體障礙的側鏈,所以胺甲酸乙酯鍵的氫鍵可保持,藉此會有不僅伸縮性與強度不下降而是更好的情形。位在和胺甲酸乙酯為相反側的含矽側鏈,因為朝向外側所以會展現高疏水性。藉此能夠形成高強度、高伸縮、高撥水的膜。
亦即本案發明人等了解到:利用2~4個側鏈有醚基及矽且主鏈有胺甲酸乙酯鍵樹脂製得的膜,和聚胺甲酸乙酯有同等的伸縮性及強度而且有高撥水性,作為伸縮性之生物體電極被覆用膜為有效。
亦即本發明係下列通式(1)表示之含矽化合物。
【化7】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
【化7】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
又,本發明係有下列通式(3)表示之結構之胺甲酸乙酯樹脂。
【化8】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
【化8】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
又,本發明提供一種伸縮性膜之形成方法,係形成伸縮性膜之方法,係將下式(1)表示之含矽化合物與有異氰酸酯基之化合物混合並將該混合物製膜,利用加熱以使其硬化。
【化9】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
【化9】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
以下針對本發明詳細說明,但本發明不限定於此等。
[含矽化合物]
本發明之含矽化合物以下列通式(1)表示。
【化10】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
本發明之含矽化合物以下列通式(1)表示。
【化10】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
R1
~R11
之烷基之具體例可列舉甲基、乙基、正丙基、正丁基、異丙基、異丁基、第三丁基、環丁基、環戊基、環己基等。
通式(1)表示之在2~4個側鏈具有醚基及含矽基之二醇化合物,可藉由例如使在側鏈具有含有2~4個雙鍵之醚基的二醇與在矽氧烷鏈中具SiH基之矽化合物在鉑觸媒中反應而獲得。羥基可為未保護的狀態,但有時會使鉑觸媒的活性下降,所以也可預先利用三甲基矽基、酸不安定基等予以保護,於反應後進行脫保護。
通式(1)所示之二醇化合物的二醇部分皆是1級,故與異氰酸酯的反應性高,容易形成後述通式(3)所示之胺甲酸乙酯鍵。就使用1級的二醇的其他好處而言,因為藉此形成的胺甲酸乙酯鍵的旋轉自由度高,胺甲酸乙酯鍵彼此的氫鍵性增高,能夠形成高強度的膜。
就側鏈具有含有2~4個雙鍵之醚基之二醇之合成方法而言,可列舉將選自內消旋赤癬糖醇、D-蘇糖醇、L-蘇糖醇、DL-蘇糖醇、福壽草醇、DL-阿拉伯糖醇、D-(+)-阿拉伯糖醇、L-(-)-阿拉伯糖醇、核糖醇、木糖醇、蒜糖醇、半乳糖醇、D-艾杜糖醇、L-艾杜糖醇、D-甘露醇、L-甘露醇、D-山梨醇、L-山梨醇、D-塔羅糖醇、L-塔羅糖醇、甜醇(dulcitol)中的2個1級羥基與有2~4個2級羥基之材料作為出發物質,先將2個1級羥基保護好,將2級羥基予以烯醚化,再和有烯醚基與SiH基之矽化合物反應,以使含矽基懸吊,之後將1級羥基予以脫保護。1級羥基之脫保護亦可在導入含矽基前進行。
作為於2~4個側鏈具有醚基及含矽基之二醇化合物,具體而言可列舉如下。
【化11】
【化12】
【化13】
【化14】
【化15】
【化16】
【化17】
【化18】
【化19】
【化20】
【化21】
就通式(1)所示之含矽化合物而言,含矽基之鏈長較短者,形成伸縮性膜時之強度下降較少。另一方面,含矽基之鏈長較長者,撥水性較好。若為有分支結構之含矽基,能夠以較短鏈長使撥水性更好。故本發明之含矽化合物宜為下列通式(2)表示之聚矽氧化合物較佳。
【化22】
式中,m如上所述。
【化22】
式中,m如上所述。
若為如此的本發明之含矽化合物,藉由製成伸縮性膜中使用的胺甲酸乙酯樹脂的材料,能夠形成和聚胺甲酸乙酯有同程度之優良的伸縮性及強度,且膜表面有和主鏈為矽氧烷鍵之聚矽氧係同程度或更好之優良的撥水性的高撥水性的伸縮性膜。
<胺甲酸乙酯樹脂(胺甲酸乙酯聚合物)>
本發明之胺甲酸乙酯樹脂具有下列通式(3)表示之結構。
【化23】
式中,R1 ~R6 、A、m如上所述。
本發明之胺甲酸乙酯樹脂具有下列通式(3)表示之結構。
【化23】
式中,R1 ~R6 、A、m如上所述。
本發明之胺甲酸乙酯樹脂之具體例不特別限定,可採用和就含有含矽基之側鏈而言於前述含矽化合物之具體例中列舉者為同樣者。
胺甲酸乙酯樹脂宜由硬鏈段及軟鏈段構成,該硬鏈段由胺甲酸乙酯鍵部分構成,該軟鏈段由鏈長延長的聚醚、聚酯、聚碳酸酯部分構成。藉由相當於硬鏈段部分之胺甲酸乙酯鍵之聚合物間的氫鍵,強度會改善。藉由胺甲酸乙酯鍵之聚合物間之氫鍵,據說硬鏈段形成結晶化結構。
本發明之胺甲酸乙酯樹脂,如通式(3)所示,特徵為在側鏈懸吊了多數有醚基及矽原子之基,藉由高撥水之含矽基存在,高親水性的胺甲酸乙酯鍵會被擠出到含矽基之相反側,胺甲酸乙酯鍵之局部電子配向在外側。藉此可以形成更堅牢的氫鍵。主鏈導入聚矽氧時,撥水性提高但強度下降,於側鏈導入聚矽氧時,由於上述理由,不僅是撥水性提高,強度也會提高。再者,藉由設置多個側鏈的含矽基,其效果可大幅提高。
一般而言,伸縮性高的膜係柔軟,如此的伸縮性高而柔軟的膜,越是薄膜則黏著性越增加,膜彼此沾黏而難以分離。若為貼在皮膚之用途之伸縮性膜時,為了減小貼附時之約束感,需為較薄膜之伸縮性膜。藉由導入含矽基,膜表面之黏著性、黏膩感會降低,成為舒爽的觸感。藉由設置多個側鏈的含矽基,可降低膜表面之黏膩感。越是薄膜則膜強度越下降,所以本發明之胺甲酸乙酯樹脂,為了提高強度,並不是如上述將含矽基導入到主鏈而是導入到多個側鏈。
又,本發明之胺甲酸乙酯樹脂,宜有下列通式(4)表示之在末端帶有(甲基)丙烯酸酯基之結構較佳。
【化24】
式中,R1 ~R6 、A同前所述,R12 為氫原子、甲基。p、q係在1分子中之單元數且為1≦p≦100、1≦q≦3之範圍。
【化24】
式中,R1 ~R6 、A同前所述,R12 為氫原子、甲基。p、q係在1分子中之單元數且為1≦p≦100、1≦q≦3之範圍。
[胺甲酸乙酯樹脂之製作方法]
本發明之胺甲酸乙酯樹脂之製作方法不特別限定,宜以上述本發明之含矽化合物作為原料,使此含矽化合物與具異氰酸酯基之化合物(異氰酸酯化合物)反應而製作較佳。
本發明之胺甲酸乙酯樹脂之製作方法不特別限定,宜以上述本發明之含矽化合物作為原料,使此含矽化合物與具異氰酸酯基之化合物(異氰酸酯化合物)反應而製作較佳。
和本發明之含矽化合物反應之異氰酸酯化合物不特別限定,具體而言可列舉如下。
【化25】
【化26】
式中,s為1以上之整數。
式中,s為1以上之整數。
藉由上述異氰酸酯化合物之中,尤其藉由有(甲基)丙烯酸酯基之化合物和通式(1)表示之含矽化合物反應,可獲得具通式(4)表示之在末端帶有(甲基)丙烯酸酯基之結構的胺甲酸乙酯樹脂。藉由將具有具羥基之(甲基)丙烯酸酯基的化合物和異氰酸酯化合物反應後,與本發明之含矽化合物進行反應,亦可獲得具有通式(4)表示之在末端具(甲基)丙烯酸酯基之結構之聚合物。
上述異氰酸酯化合物宜使用具異氰酸酯基經取代基保護之封端異氰酸酯基之化合物較佳。藉此,即使上述異氰酸酯化合物和上式(1)表示之含矽化合物之反應性高,仍可輕易控制反應。又,異氰酸酯化合物有時會在保存中和大氣中之水分反應而造成異氰酸酯基失活,所以保存時需十分小心充分防止濕度等,但若為有封端異氰酸酯基之化合物則可預防該等情事。
封端異氰酸酯基由於加熱會將封端基脫保護而成為異氰酸酯基,具體而言可列舉經醇、苯酚、硫醇、亞胺、酮亞胺(ketimine)、胺、內醯胺、吡唑、肟、β-二酮等取代之異氰酸酯基。
當使用有封端異氰酸酯基之化合物時,為了使封端異氰酸酯基之脫保護溫度為低溫,可添加觸媒。此觸媒不特別限定,已知有二月桂酸二丁基錫等有機錫、鉍鹽、2-乙基己酸鋅、乙酸鋅等羧酸鋅等。
宜如日本特開2012-152725號公報記載,使用α,β-不飽和羧酸鋅作為封端異氰酸酯解離觸媒較佳。
又,製作本發明之胺甲酸乙酯樹脂時,除了添加式(1)表示之含矽化合物、異氰酸酯化合物以外,可添加有多數羥基之化合物。藉由添加如此的有多數羥基之化合物,能夠進行本發明之胺甲酸乙酯樹脂之鏈長延長、分子間交聯。
有多數羥基之化合物不特別限定,具體而言可列舉如下。
【化27】
【化28】
【化29】
式中,附有括弧的重複單元的重複數為任意數。
式中,附有括弧的重複單元的重複數為任意數。
又,也可以添加有胺基之化合物。異氰酸酯基若和胺基反應,會形成脲鍵。胺甲酸乙酯鍵與脲鍵之部分為硬鏈段,藉由該等氫鍵,強度提高。藉由不只有胺甲酸乙酯鍵尚對其加入脲鍵,能提高強度。
藉由含有鏈長延長之聚醚、聚酯、聚碳酸酯之二醇化合物形成之部分稱為軟鏈段。其中,伸縮性最高者為聚醚,然後按聚酯、聚碳酸酯順序,伸縮性下降。另一方面,拉伸強度之順序和伸縮性之順序顛倒。可依軟鏈段之種類、重複單元之選擇來調整強度及伸縮性。
本發明之胺甲酸乙酯樹脂宜為重量平均分子量500以上者較佳。若為如此,能理想地使用在本發明之伸縮性膜。又,胺甲酸乙酯樹脂之重量平均分子量之上限値宜為500,000以下較佳。
若為如此的本發明之胺甲酸乙酯樹脂,可適用於作為有和聚胺甲酸乙酯同程度之優良的伸縮性及強度且膜表面有和主鏈為矽氧烷鍵之聚矽氧係同程度或更好的優良的撥水性的高撥水性的伸縮性膜的材料。
<伸縮性膜>
又,本發明提供含有前述本發明之胺甲酸乙酯樹脂之伸縮性膜。
又,本發明提供含有前述本發明之胺甲酸乙酯樹脂之伸縮性膜。
本發明之伸縮性膜係前述本發明之胺甲酸乙酯樹脂的硬化物,此胺甲酸乙酯樹脂於2~4個側鏈具有醚基及含矽基且於主鏈具有胺甲酸乙酯鍵。
又,本發明之伸縮性膜依JIS K 6251規定之拉伸試驗中的伸縮率宜為40~500%較佳。若為如此的伸縮率,特別適合使用於作為伸縮配線之被覆膜。
又,本發明之伸縮性膜宜作為使用在接觸有伸縮性之導電性配線之膜較佳。本發明之伸縮性膜特別適用於如此的用途。
若為如以上說明之本發明之伸縮性膜,則會成為具有和聚胺甲酸乙酯同程度之優良的伸縮性及強度且膜表面有和聚矽氧同程度之優良撥水性之伸縮性膜。
<伸縮性膜之形成方法>
本發明提供一種伸縮性膜之形成方法,係形成伸縮性膜之方法,將下式(1)表示之化合物、與有異氰酸酯基之化合物混合,並將該混合物製膜,利用加熱使其硬化。
【化30】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
本發明提供一種伸縮性膜之形成方法,係形成伸縮性膜之方法,將下式(1)表示之化合物、與有異氰酸酯基之化合物混合,並將該混合物製膜,利用加熱使其硬化。
【化30】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
如此的伸縮性膜之形成方法之一例,例如將上式(1)表示之含矽化合物和保護或未保護之異氰酸酯化合物、及用以將鏈長延長、交聯之具多數羥基之化合物、及視情形之有胺基之化合物、觸媒等予以混合,將此混合物塗佈在剝離用基板上並製膜、進行加熱硬化而成膜之方法。
在此方法中,藉由異氰酸酯與醇之反應,邊形成胺甲酸乙酯鍵邊高分子量化,可形成聚合物網絡。若添加羥基、異氰酸酯基為3個以上之化合物,交聯反應會進行,伸縮性下降,但膜強度提高。因此藉由調整羥基、異氰酸酯基為2個或3個之化合物之添加量,可以調整硬度、伸縮性、強度。又,硬化後從基板將膜剝下,可獲得獨立的伸縮性膜。
就伸縮性膜形成用組成物中之羥基與異氰酸酯基之莫耳數之比例而言,宜為羥基與異氰酸酯基為同莫耳數、或羥基為較多莫耳數,亦即羥基之莫耳數除以異氰酸酯基之莫耳數之數値為1以上較佳。異氰酸酯基之莫耳數若較少,則多餘的異氰酸酯基和水反應而產生二氧化碳氣體的情形不會發生,能抑制膜內因起泡產生孔洞。又,一般而言,製作發泡胺甲酸乙酯時,異氰酸酯基係過量,但本發明之伸縮性膜之形成方法因為伸縮性膜需帶有高強度的特性,故膜內宜不存在起泡所致之孔洞較佳。
本發明之伸縮性膜中之樹脂若如上述以羥基之莫耳數多於異氰酸酯基的狀態形成,則在聚合物末端,上式(1)表示之含矽化合物僅在單側形成胺甲酸乙酯鍵,會有產生不會像上式(3)表示之結構在兩側形成胺甲酸乙酯鍵之結構之部分的情形。於此情形,聚合物末端成為下列通式(3’)表示之結構。
【化31】
式中,R1 ~R6 、m、A如上所述。
【化31】
式中,R1 ~R6 、m、A如上所述。
本發明之伸縮性膜之形成方法中,使製膜之組成物硬化時之加熱溫度宜使用室溫至200℃之範圍之溫度。較佳為40~160℃之範圍,時間為5秒至60分鐘之範圍。使其加熱硬化時,有以剝離膜被覆已製膜之組成物之單一側的情形、及被覆已製膜之組成物之兩側的情形,邊以輥捲繞邊硬化時宜為單一側、以單片硬化時宜為兩側較佳,但不限定於此。
又,本發明提供一種伸縮性膜之形成方法,係形成伸縮性膜之方法,將下式(4)表示之於末端具(甲基)丙烯酸酯基之化合物製膜,利用加熱及/或光照射使其硬化。
【化32】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,R12 為氫原子、甲基。m為1~3之範圍之整數。p、q為在1分子中之單元數且為1≦p≦100、1≦q≦3之範圍之整數。
【化32】
式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基。R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數。A為碳數3~6之直鏈狀、分支狀之伸烷基,R12 為氫原子、甲基。m為1~3之範圍之整數。p、q為在1分子中之單元數且為1≦p≦100、1≦q≦3之範圍之整數。
如此的伸縮性膜之形成方法之一例,例如:藉由異氰酸酯與醇之反應合成胺甲酸乙酯聚合物,對其在上式(4)表示之末端形成(甲基)丙烯酸酯基,將此聚合物製膜並加熱及/或光照射以使其硬化,藉此形成伸縮性膜之方法。具體而言,將上式(1)表示之含矽化合物、與保護或未保護之異氰酸酯化合物、用以使鏈長延長、交聯之有多數羥基之化合物進行混合、使其聚合,使用聚合物末端為(甲基)丙烯酸酯之胺甲酸乙酯聚合物形成伸縮性膜之方法。於此情形,係將(甲基)丙烯酸酯以自由基反應並進行交聯。自由基交聯之方法宜為自由基發生劑之添加。自由基發生劑有因熱分解而產生自由基之熱自由基發生劑、因照光而產生自由基之光自由基發生劑。
熱自由基發生劑不特別限定,例如:偶氮系自由基發生劑、過氧化物系自由基發生劑,偶氮系自由基發生劑可以列舉2,2’-偶氮雙異丁腈(AIBN)、2,2’-偶氮雙(2,4-二甲基戊腈)、2,2’-偶氮雙(2-甲基丙酸)二甲酯、2,2’-偶氮雙(4-甲氧基-2,4-二甲基戊腈)、2,2’-偶氮雙(環己烷-1-甲腈)、4,4’-偶氮雙(4-氰基戊酸)等。過氧化物系自由基發生劑可列舉過氧化苯甲醯、過氧化癸醯、過氧化月桂醯、過氧化琥珀酸、過氧化2-乙基己酸第三丁酯、過氧化三甲基乙酸第三丁酯、過氧化-2-乙基己酸1,1,3,3-四甲基丁酯等。
光自由基發生劑不特別限定,例如:苯乙酮、4,4’-二甲氧基二苯基乙二酮、二苯基乙二酮、苯偶因、二苯酮、2-苯甲醯基苯甲酸、4,4’-雙(二甲胺基)二苯酮、4,4’-雙(二乙胺基)二苯酮、苯偶因甲醚、苯偶因乙醚、苯偶因異丙醚、苯偶因丁醚、苯偶因異丁醚、4-苯甲醯基苯甲酸、2,2’-雙(2-氯苯基)-4,4’,5,5’-四苯基-1,2’-聯咪唑、2-苯甲醯基苯甲酸甲酯、2-(1,3-苯并間二氧雜環戊烯-5-基)-4,6-雙(三氯甲基)-1,3,5-三、2-苄基-2-(二甲胺基)-4’-啉代苯丁酮、4,4’-二氯二苯酮、2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,4-二乙基硫 -9-酮、二苯基(2,4,6-三甲基苯甲醯基)氧化膦、1,4-二苯甲醯基苯、2-乙基蒽醌、1-羥基環己基苯酮、2-羥基-2-甲基苯丙酮、2-羥基-4’-(2-羥基乙氧基)-2-甲基苯丙酮、2-異亞硝基苯丙酮、2-苯基-2-(對甲苯磺醯氧基)苯乙酮(BAPO)、樟腦醌。
又,熱或光自由基發生劑之添加量,相對於樹脂100質量份宜為0.1~50質量份之範圍較佳。
又,也可添加多數(甲基)丙烯酸酯、有硫醇之交聯劑。藉此,能使自由基交聯之效率更好。
也可以添加有烷基、芳基之單體、有含矽基、經氟取代之烷基、芳基之單體。藉此能使溶液之黏度下降,形成更薄膜之伸縮性膜。該等單體若有聚合性雙鍵,膜之硬化時會固定在膜中。
有烷基、芳基之單體不特別限定,可以列舉丙烯酸異莰酯、丙烯酸月桂酯、丙烯酸十四酯、丙烯酸硬脂酯、丙烯酸異硬脂酯、丙烯酸二十二酯、丙烯酸金剛烷酯、丙烯酸苯氧基乙二醇酯、丙烯酸苯氧基二乙二醇酯等。
當使用末端有(甲基)丙烯酸酯基之化合物形成伸縮性膜時,可將熱硬化與光硬化組合並使其硬化。例如成為基礎之伸縮性膜可先以熱硬化形成,然後其上之伸縮性膜可以光硬化形成。光硬化的好處是不一定需加熱及可短時間硬化。針對光未到達的部分的硬化,以熱硬化形成即可。藉由將熱硬化與光硬化組合,可選擇發揮其個自長處的硬化方法。
為了形成伸縮性膜,可列舉將組成物塗佈在平板基板上、輥上之方法。塗佈組成物之方法不特別限定,例如:旋塗、桿塗、輥塗、流塗、浸塗、噴塗、刮刀塗佈等。又,宜塗佈成使塗佈膜厚為1μm~2mm較佳。
有凹凸之零件之密封宜採用輥塗、噴塗等方法、以網版印刷等僅在必要部分塗佈之方法較佳。又,為了進行各種塗佈、印刷,需調整混合溶液之黏度。調成低黏度時,混合有機溶劑,調成高黏度則混合二氧化矽等填充劑。
有機溶劑宜為在大氣壓之沸點係115~200℃之範圍之有機溶劑較佳。具體而言,宜從2-辛酮、2-壬酮、2-庚酮、3-庚酮、4-庚酮、2-己酮、3-己酮、二異丁酮、甲基環己酮、苯乙酮、甲基苯乙酮、乙酸丙酯、乙酸丁酯、乙酸異丁酯、乙酸戊酯、乙酸丁烯酯、乙酸異戊酯、乙酸苯酯、甲酸丙酯、甲酸丁酯、甲酸異丁酯、甲酸戊酯、甲酸異戊酯、戊酸甲酯、戊烯酸甲酯、巴豆酸甲酯、巴豆酸乙酯、丙二醇單甲醚、乙二醇單甲醚、丙二醇單乙醚、乙二醇單乙醚、丙二醇二甲醚、二乙二醇二甲醚、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯選用1種以上較佳。
將於末端有(甲基)丙烯酸酯基之化合物利用加熱以使其硬化時,加熱硬化,例如可利用於熱板、烘箱中或遠紅外線之照射以進行。加熱條件宜為30~150℃、10秒~60分鐘較理想,50~120℃、30秒~20分鐘更理想。烘烤環境為大氣中、鈍性氣體中、真空中皆可。
將於末端有(甲基)丙烯酸酯基之化合物利用光照射使其硬化時,利用光照射所為之硬化宜以波長200~500nm之光進行較佳。光源可以使用例如:鹵素燈、氙燈、準分子雷射、LED等。又,也可為電子束之照射。照射量設為1mJ/cm2
~100J/cm2
之範圍較佳。
本發明之通式(3)表示之具胺甲酸乙酯鍵之胺甲酸乙酯樹脂,不只可使用在形成伸縮性膜之用途,也可製成使用此樹脂的纖維。纖維化後可將其編織成為伸縮性之布、製成不織布。又,也可利用本發明之胺甲酸乙酯樹脂進行聚酯、棉之塗佈、也可獲得由此製得的布、不織布。
又,通式(3)所示之具胺甲酸乙酯鍵之胺甲酸乙酯樹脂也可製成胺甲酸乙酯凝膠。藉由使交聯密度低,可形成高撥水且高彈性、低硬度的凝膠。柔軟的凝膠的觸感舒服,且有撥汗、水的性能。
在此,圖1~9顯示本發明之伸縮性膜之使用例。圖1係顯示以本發明之伸縮性膜被覆之狀態之心電計之剖面圖,圖2係顯示從生物體電極側觀察圖1之心電計之概略圖。又,圖3係顯示以本發明之伸縮性膜被覆前之狀態之心電計1之剖面圖,圖4係從生物體電極側觀察圖3之心電計1之概略圖,圖3、4之心電計1係專利文獻1記載者。如圖3、4,心電計1中,3個生物體電極2利用傳送電訊號的配線3連結,並連接到中心器件4。
配線3之材料一般可使用金、銀、鉑、鈦、不銹鋼等金屬、碳等導電性材料。又,為了展現伸縮性,也可如專利文獻1記載般,製成蛇腹形狀之配線,也可在伸縮性薄膜上貼附前述導電性材料之粉末、線化之導電性材料、或印刷上含前述導電性材料之導電印墨、或使用導電性材料與纖維複合成的導電性布來形成配線。
心電計1需貼附在皮膚,故圖3、4之心電計1中,為了不使生物體電極2脫離皮膚,在生物體電極2的周邊配置有黏著部5。又,生物體電極2有黏著性時,不一定需要有周邊之黏著部5。
將此心電計1,如圖1所示,以本發明之伸縮性膜即伸縮性膜6被覆。惟,如圖2,生物體電極2與黏著部5需黏著於皮膚,故它們不以伸縮性膜6被覆。
心電計1以伸縮性膜6被覆時,可以將心電計1之表面和背面同時被覆,也可以將表面和背面逐一被覆。又,和皮膚接觸的生物體電極2與黏著部5事先沒有被覆蓋時,可例如圖5,在有剝離性之基板7上放置心電計1並以伸縮性膜材料被覆,使其接觸黏著部5,並利用光、熱使該伸縮性膜材料硬化而形成伸縮性膜6,之後從基板7剝下,以獲得如圖1之經伸縮性膜6被覆的心電計1。
又,如圖6,可列舉在伸縮性膜6上形成生物體電極2、黏著部5、及配線3並連接中心器件4,於其上如圖7所示塗佈伸縮性膜材料而使其硬化,形成伸縮性膜6’之方法。於此情形,可於在有剝離性基板7上形成的伸縮性膜6上形成生物體電極2、黏著部5、及配線3。
再者,如圖8,於布8上形成伸縮性膜6並於其上形成生物體電極2與配線3並和中心器件4連接,於其上如圖9所示,形成伸縮性膜6’並將配線3與中心器件4被覆亦可。
又,如圖5、7、9,當於有凹凸之零件形成伸縮性膜6、6’時,如上述,宜採用輥塗、噴塗等方法、利用網版印刷等僅在必要部分塗佈之方法較佳。
又,如圖6~9,在伸縮性膜6之上形成伸縮性膜6’時,若使用通式(3)表示之化合物,能先以熱硬化形成伸縮性膜6,再以光硬化形成於其上之伸縮性膜6’。
若為如以上說明之本發明之伸縮性膜之形成方法,則可輕易地形成和聚胺甲酸乙酯有同程度或更好之優良的伸縮性及強度且膜表面有高撥水性之伸縮性膜。
[實施例]
[實施例]
以下使用實施例及比較例對於本發明具體說明,但本發明不限於此等。又,重量平均分子量(Mw)代表利用GPC測得之聚苯乙烯換算之重量平均分子量。
[懸吊了聚矽氧之二醇化合物1之合成]
實施下式(5)記載之反應式所示之反應。
實施下式(5)記載之反應式所示之反應。
【化33】
(二醇(5-I)之合成)
於1L的2口燒瓶中裝入內消旋丁四醇50g、DMF500g、三乙胺104g及N,N-二甲胺基吡啶0.5g,於氮氣環境下在室溫攪拌。然後於冰冷下加入三苯甲基氯後,於室溫攪拌3小時。將反應液移到2L燒杯,加入水1L並攪拌後,以布氏漏斗濾取析出物。獲得之粉末放回2L燒杯內,以乙酸乙酯500mL與己烷500mL洗淨3次後,進行真空乾燥,以獲得有下列性質之二醇(5-I)207g。
於1L的2口燒瓶中裝入內消旋丁四醇50g、DMF500g、三乙胺104g及N,N-二甲胺基吡啶0.5g,於氮氣環境下在室溫攪拌。然後於冰冷下加入三苯甲基氯後,於室溫攪拌3小時。將反應液移到2L燒杯,加入水1L並攪拌後,以布氏漏斗濾取析出物。獲得之粉末放回2L燒杯內,以乙酸乙酯500mL與己烷500mL洗淨3次後,進行真空乾燥,以獲得有下列性質之二醇(5-I)207g。
二醇(5-I)
黃白色粉體
1 H-NMR(500MHz,DMSO-d6):δ=7.45-7.10(30H,m),4.75(2H,s),3.66-3.61(2H,m),3.00-2.93(4H,m)
黃白色粉體
1 H-NMR(500MHz,DMSO-d6):δ=7.45-7.10(30H,m),4.75(2H,s),3.66-3.61(2H,m),3.00-2.93(4H,m)
(二烯丙基化合物(5-II)之合成)
於2L的2口燒瓶中裝入二醇(5-I)100g及DMF700g,於氮氣環境下於40℃攪拌,使其溶解後,使用冰浴將溶液冷卻。然後,加入氫化鈉24g,攪拌2小時後,滴加烯丙基溴44g。於室溫攪拌2.5小時後,將反應液以冰浴冷卻,加入水700g。然後,以布氏漏斗濾取生成的析出物,以水1000g洗淨2次,以THF150g與己烷400g洗淨1次後,進行真空乾燥,以獲得有下列性質之二烯丙基化合物(5-II)100g。
於2L的2口燒瓶中裝入二醇(5-I)100g及DMF700g,於氮氣環境下於40℃攪拌,使其溶解後,使用冰浴將溶液冷卻。然後,加入氫化鈉24g,攪拌2小時後,滴加烯丙基溴44g。於室溫攪拌2.5小時後,將反應液以冰浴冷卻,加入水700g。然後,以布氏漏斗濾取生成的析出物,以水1000g洗淨2次,以THF150g與己烷400g洗淨1次後,進行真空乾燥,以獲得有下列性質之二烯丙基化合物(5-II)100g。
二烯丙基化合物(5-II)
黃白色粉體
1 H-NMR(500MHz,THF-d8):δ=7.50-7.40(12H,m),7.26-7.14(18H,m),5.82-5.73(2H,m),5.13(2H,d),5.01(2H,d),4.10-4.04(2H,m),3.94-3.88(2H,m),3.66-3.60(2H,m),3.36(2H,d),3.19(2H,d)
黃白色粉體
1 H-NMR(500MHz,THF-d8):δ=7.50-7.40(12H,m),7.26-7.14(18H,m),5.82-5.73(2H,m),5.13(2H,d),5.01(2H,d),4.10-4.04(2H,m),3.94-3.88(2H,m),3.66-3.60(2H,m),3.36(2H,d),3.19(2H,d)
(二烯丙基二醇(5-III)之合成)
於2L的1口燒瓶中裝入二烯丙基化合物(5-II)99.7g及甲酸300g,於氮氣環境下於60℃攪拌1日。添加異丙醚300g,再於60℃攪拌1日後,回到室溫,加入甲醇300g與水300g,去除產生的不溶成分。將濾液濃縮,並將獲得之殘渣以矽膠管柱層析精製,獲得有下列性質之二烯丙基二醇(5-III)28.4g。
於2L的1口燒瓶中裝入二烯丙基化合物(5-II)99.7g及甲酸300g,於氮氣環境下於60℃攪拌1日。添加異丙醚300g,再於60℃攪拌1日後,回到室溫,加入甲醇300g與水300g,去除產生的不溶成分。將濾液濃縮,並將獲得之殘渣以矽膠管柱層析精製,獲得有下列性質之二烯丙基二醇(5-III)28.4g。
二烯丙基二醇(5-III)
黃白色粉體
1 H-NMR(500MHz,CDCL3):δ=5.91-5.82(2H,m),5.27(2H,d),5.19(2H,d),4.58(2H,d),4.24(2H,d),4.18-4.12(2H,m),4.06-4.00(2H,m),3.68-3.64(2H,m)
黃白色粉體
1 H-NMR(500MHz,CDCL3):δ=5.91-5.82(2H,m),5.27(2H,d),5.19(2H,d),4.58(2H,d),4.24(2H,d),4.18-4.12(2H,m),4.06-4.00(2H,m),3.68-3.64(2H,m)
(懸吊了聚矽氧之二醇化合物1(5-IV)之合成)
於300mL的3口燒瓶中裝入二烯丙基二醇(5-III)28.0g、甲苯43.8g及PL50N0.1g,於氮氣環境下加溫到55℃。然後使用100mL滴加漏斗費時1小時半滴加七甲基三矽氧烷61.7g。滴加結束後攪拌7小時後,回到室溫,加入活性碳1g。攪拌2小時後,進行矽藻土過濾,將獲得之溶液減壓濃縮,獲得有下列性質之懸吊了聚矽氧之二醇化合物1(5-IV)67.1g。
於300mL的3口燒瓶中裝入二烯丙基二醇(5-III)28.0g、甲苯43.8g及PL50N0.1g,於氮氣環境下加溫到55℃。然後使用100mL滴加漏斗費時1小時半滴加七甲基三矽氧烷61.7g。滴加結束後攪拌7小時後,回到室溫,加入活性碳1g。攪拌2小時後,進行矽藻土過濾,將獲得之溶液減壓濃縮,獲得有下列性質之懸吊了聚矽氧之二醇化合物1(5-IV)67.1g。
懸吊了聚矽氧之二醇化合物1(5-IV)
黃色油
1 H-NMR(500MHz,CDCl3):δ=4.59(2H,d),4.23(2H,d),3.61-3.54(4H,m),3.39-3.34(2H,m),1.57-1.51(4H,m),0.45-0.39(4H,m),0.08(36H,s),0.01(6H,s)
黃色油
1 H-NMR(500MHz,CDCl3):δ=4.59(2H,d),4.23(2H,d),3.61-3.54(4H,m),3.39-3.34(2H,m),1.57-1.51(4H,m),0.45-0.39(4H,m),0.08(36H,s),0.01(6H,s)
[懸吊了聚矽氧之二醇化合物2~4、懸吊了聚矽氧之比較二醇化合物1之合成]
除了使用的二醇以外,和式(5)記載之反應式所示之氫矽基化反應同樣地合成懸吊了聚矽氧之二醇化合物2~4、懸吊了聚矽氧之比較二醇化合物1。
除了使用的二醇以外,和式(5)記載之反應式所示之氫矽基化反應同樣地合成懸吊了聚矽氧之二醇化合物2~4、懸吊了聚矽氧之比較二醇化合物1。
摻合在伸縮性膜形成用組成物中的懸吊了聚矽氧之二醇化合物1~4、比較懸吊了聚矽氧之二醇化合物1、異氰酸酯化合物1~5、羥基化合物1~7,如下所示。
【化34】
式中之重複數代表平均値。
式中之重複數代表平均値。
【化35】
式中之重複數代表平均値。
式中之重複數代表平均値。
於伸縮性膜形成用組成物中摻合的作為在末端有(甲基)丙烯酸酯基之化合物的懸吊了聚矽氧之胺甲酸乙酯(甲基)丙烯酸酯1~7、比較胺甲酸乙酯(甲基)丙烯酸酯1,如下所示。
【化36】
【化37】
【化38】
式中之重複數代表平均値,t1 +t2 平均為20,t3 平均為10。
式中之重複數代表平均値,t1 +t2 平均為20,t3 平均為10。
在伸縮性膜形成用組成物中作為添加劑而摻合的光自由基發生劑1~3、熱自由基發生劑1,如下所示。
光自由基發生劑1:4,4’-二甲氧基二苯乙二酮
光自由基發生劑2:2,2-二甲氧基-2-苯基苯乙酮
光自由基發生劑3:(±)-樟腦醌
熱自由基發生劑1:2,2’-偶氮雙(2-甲基丙酸)二甲酯
光自由基發生劑1:4,4’-二甲氧基二苯乙二酮
光自由基發生劑2:2,2-二甲氧基-2-苯基苯乙酮
光自由基發生劑3:(±)-樟腦醌
熱自由基發生劑1:2,2’-偶氮雙(2-甲基丙酸)二甲酯
伸縮性膜形成用組成物中摻合的有機溶劑,如下所示。
有機溶劑:丙二醇單甲醚乙酸酯(PGMEA)
有機溶劑:丙二醇單甲醚乙酸酯(PGMEA)
伸縮性膜形成用組成物中摻合的有烷基、芳基之單體如下所示。
有烷基、芳基之單體:丙烯酸異莰酯
有烷基、芳基之單體:丙烯酸異莰酯
[實施例、比較例]
按表1記載之組成將懸吊了聚矽氧之二醇化合物、異氰酸酯化合物、羥基化合物、添加劑進行混合、脫泡,製備成伸縮性膜形成用組成物(伸縮性膜材料1-1~1-6、比較伸縮性膜材料1-1)。脫氣後,將伸縮性膜材料1-1~1-6、比較伸縮性膜材料1-1以塗佈棒塗佈在聚乙烯基板上,於130℃烘烤20分鐘,在基板上製作伸縮性膜(Film1-1~1-6、比較Film1-1)。又,伸縮性膜形成用組成物中的羥基與異氰酸酯基之莫耳數之比合併示於表1。
按表1記載之組成將懸吊了聚矽氧之二醇化合物、異氰酸酯化合物、羥基化合物、添加劑進行混合、脫泡,製備成伸縮性膜形成用組成物(伸縮性膜材料1-1~1-6、比較伸縮性膜材料1-1)。脫氣後,將伸縮性膜材料1-1~1-6、比較伸縮性膜材料1-1以塗佈棒塗佈在聚乙烯基板上,於130℃烘烤20分鐘,在基板上製作伸縮性膜(Film1-1~1-6、比較Film1-1)。又,伸縮性膜形成用組成物中的羥基與異氰酸酯基之莫耳數之比合併示於表1。
【表1】
按表2記載之組成將懸吊了聚矽氧之胺甲酸乙酯(甲基)丙烯酸酯、光自由基發生劑1~3、熱自由基發生劑1、丙烯酸異莰酯進行混合,製備成伸縮性膜形成用組成物(伸縮性膜材料2-1~2-6、比較伸縮性膜材料2-1)。將製備的伸縮性膜形成用組成物以塗佈棒塗佈在聚乙烯基板上,為伸縮性膜材料2-1~2-5、比較伸縮性膜材料2-1的情形,於氮氣環境下以1,000W的氙燈照射500mJ/cm2
之光,使組成物塗佈膜硬化,製成伸縮性膜(Film2-1~2-5、比較Film2-1)。為伸縮性膜材料2-6的情形,將製備的伸縮性膜形成用組成物以塗佈棒塗佈於聚乙烯基板上,於氮氣環境下於120℃烘烤20分鐘,製得伸縮性膜(Film2-6)。
【表2】
(膜厚、接觸角、伸縮率、強度之測定)
測定硬化後之伸縮性膜的膜厚、及表面的水的接觸角。又,測定了伸縮性膜表面的水的接觸角後,從基板將伸縮性膜剝下,利用依據JIS K 6251之方法來測定伸縮率及強度。結果示於表3。
測定硬化後之伸縮性膜的膜厚、及表面的水的接觸角。又,測定了伸縮性膜表面的水的接觸角後,從基板將伸縮性膜剝下,利用依據JIS K 6251之方法來測定伸縮率及強度。結果示於表3。
【表3】
如表3所示,使懸吊了2個含矽基之二醇化合物與異氰酸酯化合物反應的實施例1-1~1-6、使用了懸吊了2個含矽基之化合物作為在末端有(甲基)丙烯酸酯基之化合物的實施例2-1~2-6的伸縮性膜,水的接觸角高,亦即可獲得撥水性高且同時伸縮性強度優異之伸縮性膜。
另一方面,使用了沒有矽氧烷鍵的化合物作為在末端有(甲基)丙烯酸酯基之化合物的比較例2-1之伸縮性膜,相較於實施例1-1~1-6、2-1~2-6,水的接觸角低亦即撥水性低,強度也不佳。又,使習知型之懸吊了1個直鏈之聚矽氧之二醇化合物與異氰酸酯化合物反應的比較例1-1之伸縮性膜,水的接觸角高但是尤其相較於含矽基以外皆為相同組成的實施例1-1,強度較不理想。
由以上可知,若為本發明之伸縮性膜,有優良的伸縮性及強度且膜表面的撥水性優良,所以作為穿戴式器件等中使用的伸縮性之被覆配線之膜而言有優良的特性。
又,本發明不限於上述實施形態。上述實施形態係例示,凡和本發明之申請專利範圍記載之技術思想有實質上相同構成且發揮同樣作用效果者皆包括在本發明之技術範圍內。
1‧‧‧心電計
2‧‧‧生物體電極
3‧‧‧配線
4‧‧‧中心器件
5‧‧‧黏著部
6,6’‧‧‧伸縮性膜
7‧‧‧基板
8‧‧‧布
圖1係顯示以本發明之伸縮性膜被覆之狀態之心電計之剖面圖。
圖2係顯示從生物體電極側觀察圖1之心電計之概略圖。
圖3係顯示以本發明之伸縮性膜被覆前之狀態之心電計之剖面圖。。
圖4係顯示從生物體電極側觀察圖3之心電計之概略圖。
圖5係顯示使心電計接觸基板上,並以本發明之伸縮性膜被覆之狀態之剖面圖。
圖6係顯示在本發明之伸縮性膜上形成生物體電極、黏著部、及配線並進一步連接了中心器件之狀態之剖面圖。
圖7係顯示將圖6之配線與中心器件以本發明之伸縮性膜被覆之狀態之剖面圖。
圖8係顯示在布上形成本發明之伸縮性膜,並於其上形成配線及電極,再連接中心器件之狀態之剖面圖。
圖9係顯示將圖8之配線及中心器件以本發明之伸縮性膜被覆之狀態之剖面圖。
Claims (9)
- 一種含矽化合物,其特徵為以下列通式(1)表示; 式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基;R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數;A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
- 如申請專利範圍第1項之含矽化合物,其中,該通式(1)之含矽化合物以下列通式(2)表示; 式中,m如上所述。
- 一種胺甲酸乙酯樹脂,其特徵為有下列通式(3)表示之結構; 式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基;R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數;A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
- 如申請專利範圍第3項之胺甲酸乙酯樹脂,係有下列通式(4)表示之末端帶有(甲基)丙烯酸酯基之結構者; 式中,R1 ~R6 、A、m同前所述,R12 為氫原子、甲基;p、q為1分子中之單元數,為1≦p≦100、1≦q≦3之範圍之整數。
- 一種伸縮性膜,其特徵為含有如申請專利範圍第3或4項之胺甲酸乙酯樹脂。
- 如申請專利範圍第5項之伸縮性膜,其中,該伸縮性膜依據JIS K 6251規定之拉伸試驗測得的伸縮率為40~500%。
- 如申請專利範圍第5或6項之伸縮性膜,其中,該伸縮性膜係作為接觸有伸縮性之導電性配線的膜使用。
- 一種伸縮性膜之形成方法,係形成伸縮性膜之方法,其特徵為: 將下式(1)表示之化合物與具異氰酸酯基之化合物混合,將該混合物製膜,並利用加熱使其硬化; 式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基;R7 、R8 、R9 、R10 、及R11 和R1 ~R6 為相同含意,n為0~100之範圍之整數;A為碳數3~6之直鏈狀、分支狀之伸烷基,m為1~3之範圍之整數。
- 一種伸縮性膜之形成方法,係形成伸縮性膜之方法,其特徵為: 將下式(4)表示之在末端具(甲基)丙烯酸酯基之化合物製膜,並加熱及/或光照射使其硬化; 式中,R1 、R2 、R3 、R4 、R5 、及R6 為碳數1~6之直鏈狀、分支狀、環狀之烷基、苯基、3,3,3-三氟丙基、或-(OSiR7 R8 )n -OSiR9 R10 R11 表示之基;R7 、R8 、R9 、R10 、及R11 和R1 ~R6 的含意相同,n為0~100之範圍之整數;A為碳數3~6之直鏈狀、分支狀之伸烷基,R12 為氫原子、甲基;m為1~3之範圍之整數;p、q為1分子中之單元數且為1≦p≦100、1≦q≦3之範圍之整數。
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