TW201919872A - Adhesive tape, reel of adhesive tape, and production method for adhesive tape - Google Patents
Adhesive tape, reel of adhesive tape, and production method for adhesive tape Download PDFInfo
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- TW201919872A TW201919872A TW107134367A TW107134367A TW201919872A TW 201919872 A TW201919872 A TW 201919872A TW 107134367 A TW107134367 A TW 107134367A TW 107134367 A TW107134367 A TW 107134367A TW 201919872 A TW201919872 A TW 201919872A
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- Prior art keywords
- tape
- adhesive
- adhesive tape
- adhesive layer
- release member
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/02—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with longitudinal slitters or perforators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/18—Constructional details
- B65H75/28—Arrangements for positively securing ends of material
- B65H75/285—Holding devices to prevent the wound material from unwinding
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5113—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning applying adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Wire Bonding (AREA)
- Replacement Of Web Rolls (AREA)
Abstract
Description
本發明是有關於一種接著帶、接著帶捲繞捲筒和接著帶的製造方法。The present invention relates to a method for manufacturing an adhesive tape, an adhesive tape winding reel, and an adhesive tape.
先前,使用用以將具有多個電極的被連接構件間予以連接的接著帶。作為此種接著帶,例如有異向導電性帶。若使用異向導電性帶,則例如於將積體電路(Integrated Circuit,IC)、大規模積體電路(Large Scale Integration,LSI)等半導體元件等連接於印刷配線基板、液晶顯示器(Liquid Crystal Display,LCD)用玻璃基板、可撓性(flexible)印刷基板等基板時,可使相對的電極間導通並保持鄰接的電極間的絕緣狀態。Conventionally, an adhesive tape is used to connect connected members having a plurality of electrodes. Examples of such an adhesive tape include an anisotropic conductive tape. If an anisotropic conductive tape is used, for example, a semiconductor element such as an integrated circuit (IC) or a large scale integration (LSI) is connected to a printed wiring board or a liquid crystal display (Liquid Crystal Display). , LCD) When using a substrate such as a glass substrate or a flexible printed substrate, the opposite electrodes can be conducted and the insulation state between adjacent electrodes can be maintained.
接著帶例如是藉由將包括含有熱硬化性樹脂的接著劑成分及視需要調配的導電粒子的接著劑層形成於聚對苯二甲酸乙二酯(Polyethylene Terephthalate,PET)等的基材上而成。接著帶是藉由將片狀的原材料以符合用途的寬度切割(slit)加工為長條而製作,並以捲繞於捲筒(reel)的捲繞體的狀態進行保存/搬運/使用(例如,參照專利文獻1)。 [現有技術文獻] [專利文獻]The adhesive tape is formed, for example, on a substrate such as polyethylene terephthalate (PET) by forming an adhesive layer including an adhesive component containing a thermosetting resin and conductive particles prepared as necessary. to make. Next, the tape is produced by cutting a sheet-like raw material into strips with a width suitable for the application, and storing / transporting / using it in a state of being wound around a reel wound body (for example, See Patent Document 1). [Prior Art Literature] [Patent Literature]
[專利文獻1]日本專利特開2003-34468號公報[Patent Document 1] Japanese Patent Laid-Open No. 2003-34468
[發明所欲解決之課題][Problems to be Solved by the Invention]
先前,對纏繞至捲筒的接著帶的引帶部分(拉出部分)貼附較接著帶的端部伸出的引線帶,並將引線帶貼附於捲筒,藉此達成引帶部分的固定。然而,近年來,對更窄寬度的接著帶的需求正在加強。因此,引線帶的厚度與接著帶的寬度相比相對地變大,於貼附有引線帶的狀態下難以對接著帶的引帶部分進行切割加工。現狀是,於將貼附於引帶部分的引線帶暫時剝落並進行了切割加工後,將引線帶貼附於變為窄寬度的接著帶的各者。因此,存在接著帶的製造步驟變得繁雜這一問題。Previously, a lead tape protruding from an end of the adhesive tape was attached to a lead-out portion (pulled-out portion) of the adhesive tape wound around the reel, and the lead tape was attached to the reel, thereby achieving the fixed. However, in recent years, the demand for a narrower width adhesive tape is increasing. Therefore, the thickness of the lead tape is relatively larger than the width of the adhesive tape, and it is difficult to cut the lead tape portion of the adhesive tape in a state where the lead tape is attached. The current situation is that after the lead tape attached to the lead tape portion is temporarily peeled off and subjected to cutting processing, the lead tape is attached to each of the adhesive tapes having a narrow width. Therefore, there is a problem that the manufacturing steps of the adhesive tape become complicated.
本發明是為了解決所述課題而成,目的在於提供一種可簡化製造步驟的窄寬度的接著帶、接著帶捲繞捲筒和接著帶的製造方法。 [解決課題之手段]This invention is made in order to solve the said subject, and an object is to provide the manufacturing method of the narrow-width adhesive tape which can simplify a manufacturing process, an adhesive tape winding reel, and an adhesive tape. [Means for solving problems]
本發明的一方面的接著帶於第1離型件(separator)的一面側設有第1接著層,於接著帶的引帶部分,以至少在引帶部分的前端側不露出第1接著層的方式,設有與所述引帶部分於相同的位置終止(terminate)的、厚度10 μm以上且30 μm以下的拾取帶(pickup tape)。According to an aspect of the present invention, a first adhesive layer is provided on a side surface of a first separator, and a first adhesive layer is not exposed at least on a front end side of the adhesive tape at a leading portion of the adhesive tape. In the method, a pickup tape having a thickness of 10 μm or more and 30 μm or less is terminated at the same position as the lead-in part.
於此接著帶中,於引帶部分設有厚度10 μm以上且30 μm以下的拾取帶。藉由將拾取帶的厚度設為所述範圍,可相對地減小相對於接著帶的寬度的拾取帶的厚度。因此,能夠於貼附有拾取帶的狀態下藉由切割加工將接著帶切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分的前端側不露出第1接著層,所以即便於將引帶部分固定於捲筒等的情況下,亦可防止於使用時將引帶部分自捲筒等取下時第1接著層自第1離型件剝離。In this adhesive tape, a pick-up tape having a thickness of 10 μm or more and 30 μm or less is provided on the lead-in portion. By setting the thickness of the pickup tape to the range, the thickness of the pickup tape relative to the width of the adhesive tape can be relatively reduced. Therefore, the adhesive tape can be cut to a narrow width by a cutting process while the pickup tape is attached, thereby simplifying the manufacturing steps. In addition, since the first adhesive layer is not exposed at the front end side of the lead-in portion, even when the lead-in portion is fixed to a roll or the like, it is possible to prevent the lead-in portion from being removed from the roll or the like during use. The 1-adhesive layer is peeled from the first release member.
而且,亦可為:拾取帶於第2離型件的一面側具有第2接著層,並以第2接著層與接著帶側的第1接著層相向的方式固定於引帶部分。藉此,可將拾取帶牢固地固定於接著帶。In addition, the pick-up tape may have a second adhesive layer on one side of the second release member, and may be fixed to the tape guide portion so that the second adhesive layer faces the first adhesive layer on the adhesive tape side. This makes it possible to firmly fix the pickup tape to the adhesive tape.
而且,亦可為:拾取帶於第2離型件的另一面側具有第3接著層,於引帶部分的終止側設有第2離型件自第3接著層露出的露出區域。此時,可不使用另外的密封件(seal)而藉由第3接著層將引帶部分固定於捲筒等。而且,藉由於引帶部分的終止側設置露出區域,可於使用時容易地將引帶部分自捲筒等取下。In addition, the pick-up tape may have a third adhesive layer on the other surface side of the second release member, and an exposed area where the second release member is exposed from the third adhesive layer may be provided on the termination side of the lead-in portion. At this time, the lead-in portion can be fixed to the reel or the like by a third adhesive layer without using another seal. Furthermore, since the exposed area is provided on the termination side of the lead-in portion, the lead-in portion can be easily removed from the reel or the like during use.
而且,亦可為:拾取帶於第2離型件的另一面側具有第4接著層,並藉由將第2離型件貼附於接著帶側的第1接著層而固定於引帶部分,於引帶部分的終止側設有第2離型件自第4接著層露出的露出區域。此時,可不使用另外的密封件而藉由第4接著層將引帶部分固定於捲筒等。而且,藉由於引帶部分的終止側設置露出區域,可於使用接著帶時容易地將引帶部分自捲筒等取下。進而,藉由於第2離型件的一面側設置接著層,可抑制包括拾取帶在內的引帶部分的整體的厚度。因此,可進一步切實地實施於貼附有拾取帶的狀態下的切割加工。In addition, the pick-up tape may have a fourth adhesive layer on the other side of the second release member, and may be fixed to the lead-out portion by attaching the second release member to the first adhesive layer on the adhesive tape side. An exposed area where the second release member is exposed from the fourth adhesive layer is provided on the termination side of the lead-in portion. In this case, the lead-in portion may be fixed to the roll or the like by a fourth adhesive layer without using another seal. Moreover, since the exposed area is provided on the termination side of the tape guide portion, the tape guide portion can be easily removed from the reel or the like when the tape is used. Furthermore, since the adhesive layer is provided on one surface side of the second release member, the entire thickness of the lead tape portion including the pickup tape can be suppressed. Therefore, the cutting process can be performed more reliably in a state where the pickup tape is attached.
而且,亦可為:拾取帶僅包括第2離型件,並藉由將第2離型件貼附於接著帶側的第1接著層而固定於引帶部分。此時,可進一步抑制包括拾取帶在內的引帶部分的整體的厚度。因此,可進一步切實地實施於貼附有拾取帶的狀態下的切割加工。Furthermore, the pick-up tape may include only the second release member, and may be fixed to the lead-out portion by attaching the second release member to the first adhesive layer on the adhesive tape side. In this case, it is possible to further suppress the entire thickness of the lead tape portion including the pickup tape. Therefore, the cutting process can be performed more reliably in a state where the pickup tape is attached.
而且,亦可為:於拾取帶側的接著層著色有與第1接著層不同的色。藉此,可提高拾取帶的可見性及識別性。因此,可提升使用接著帶時對引帶部分進行切斷的情況等的作業性。Furthermore, the adhesive layer on the pickup belt side may be colored with a different color from the first adhesive layer. Thereby, the visibility and recognizability of a pickup belt can be improved. Therefore, workability, such as a case where the lead-in part is cut when using the adhesive tape, can be improved.
另外,亦可為:接著帶的與長邊方向正交的寬度為0.8 mm以下。於接著帶的寬度為0.8 mm以下的情況下,於貼附有先前般的引線帶的狀態下難以對接著帶的引帶部分進行切割加工。因此,於接著帶的寬度為0.8 mm以下的情況下,應用所述拾取帶尤其有用。The width of the adhesive tape orthogonal to the longitudinal direction may be 0.8 mm or less. When the width of the adhesive tape is 0.8 mm or less, it is difficult to cut the lead portion of the adhesive tape with the conventional lead tape attached. Therefore, when the width of the adhesive tape is 0.8 mm or less, the application of the pickup tape is particularly useful.
而且,本發明的一方面的接著帶捲繞捲筒包括:捲芯,纏繞有所述接著帶;以及一對側板,夾著捲芯而彼此相向,並且自捲芯引出的接著帶的引帶部分固定於側板的外表面側。Further, the adhesive tape winding reel according to an aspect of the present invention includes: a winding core on which the adhesive tape is wound; and a pair of side plates, which face each other with the winding core in between, and lead the adhesive tape from the winding core. The part is fixed to the outer surface side of the side plate.
於此接著帶捲繞捲筒中,於接著帶中的引帶部分設有厚度10 μm以上且30 μm以下的拾取帶。藉由將拾取帶的厚度設為所述範圍,可相對地減小相對於接著帶的寬度的拾取帶的厚度。因此,能夠於貼附有拾取帶的狀態下藉由切割加工將接著帶切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分的前端側不露出第1接著層,所以可防止於使用時將引帶部分自捲筒取下時第1接著層自第1離型件剝離。In this adhesive tape winding reel, a pickup tape having a thickness of 10 μm or more and 30 μm or less is provided on the lead-in part of the adhesive tape. By setting the thickness of the pickup tape to the range, the thickness of the pickup tape relative to the width of the adhesive tape can be relatively reduced. Therefore, the adhesive tape can be cut to a narrow width by a cutting process while the pickup tape is attached, thereby simplifying the manufacturing steps. In addition, since the first adhesive layer is not exposed on the front end side of the lead-in portion, it is possible to prevent the first adhesive layer from peeling off from the first release member when the lead-in portion is removed from the roll during use.
而且,本發明的一方面的接著帶的製造方法是於第1離型件的一面側設有第1接著層的接著帶的製造方法,其包括將接著帶自原材料抽出,並以使第1接著層變得不再露出的方式,將與原材料的寬度為相等寬度的、厚度10 μm以上且30 μm以下的拾取帶每隔一定的長度貼附於第1接著層;將貼附有拾取帶的接著帶沿長邊方向藉由切割加工切斷為多條接著帶;以及將多條接著帶與拾取帶一起沿寬度方向切斷而使引帶部分終止,之後將多條接著帶分別捲至捲筒。Furthermore, the method for producing an adhesive tape according to one aspect of the present invention is a method for producing an adhesive tape in which a first adhesive layer is provided on one side of a first release member, and the method includes extracting the adhesive tape from a raw material so that the first The next layer is no longer exposed, and a pick-up tape with a thickness equal to or greater than the width of the raw material, with a thickness of 10 μm or more and 30 μm or less, is attached to the first adhesive layer at regular intervals; The adhesive tape is cut into a plurality of adhesive tapes by a cutting process along the longitudinal direction; and the plurality of adhesive tapes are cut in the width direction together with the pickup tape to terminate the lead-in tape portion, and then the multiple adhesive tapes are rolled to reel.
於此接著帶的製造方法中,於引帶部分應用厚度10 μm以上且30 μm以下的拾取帶。藉由將拾取帶的厚度設為所述範圍,可相對地減小相對於接著帶的寬度的拾取帶的厚度。因此,能夠於貼附有拾取帶的狀態下藉由切割加工將接著帶切斷為窄寬度,從而實現製造步驟的簡化。而且,於所製作的接著帶中,於引帶部分的前端側不露出第1接著層,所以即便於將引帶部分固定於捲筒等的情況下,亦可防止於使用時將引帶部分自捲筒等取下時第1接著層自第1離型件剝離。 [發明的效果]In this adhesive tape manufacturing method, a pickup tape having a thickness of 10 μm or more and 30 μm or less is applied to the lead-in portion. By setting the thickness of the pickup tape to the range, the thickness of the pickup tape relative to the width of the adhesive tape can be relatively reduced. Therefore, the adhesive tape can be cut to a narrow width by a cutting process while the pickup tape is attached, thereby simplifying the manufacturing steps. In addition, in the produced adhesive tape, the first adhesive layer is not exposed on the front end side of the lead-in portion, so even when the lead-in portion is fixed to a roll or the like, the lead-in portion can be prevented from being used during use. When removed from a roll or the like, the first adhesive layer is peeled from the first release member. [Effect of the invention]
根據本發明,可簡化窄寬度的接著帶的製造步驟。According to the present invention, the manufacturing steps of a narrow-width adhesive tape can be simplified.
以下,參照圖示,對本發明的一方面的接著帶、接著帶捲繞捲筒和接著帶的製造方法的較佳的實施方式進行詳細說明。Hereinafter, referring to the drawings, preferred embodiments of the method for manufacturing the adhesive tape, the adhesive tape winding roll, and the adhesive tape according to one aspect of the present invention will be described in detail.
圖1為表示接著帶捲繞捲筒的一實施方式的側面圖。如圖所示,接著帶捲繞捲筒1包括:供纏繞接著帶11的捲芯2、及夾著捲芯2而彼此相向的一對側板3、3。接著帶捲繞捲筒1是接著帶11的製造、供給、保存中所使用的捲筒,具有藉由一對側板3、3來防止纏繞至捲芯2的接著帶11的捲崩塌的作用。FIG. 1 is a side view showing an embodiment of a continuous tape winding reel. As shown in the figure, the adhesive tape winding reel 1 includes a core 2 for winding the adhesive tape 11 and a pair of side plates 3 and 3 facing each other with the core 2 interposed therebetween. The next tape winding reel 1 is a reel used for manufacturing, supplying, and storing the next tape 11 and has a function of preventing the roll of the second tape 11 wound around the core 2 from collapsing by a pair of side plates 3 and 3.
捲芯2為纏繞接著帶11的部分。捲芯2例如包括塑膠,並呈與接著帶11的寬度相同的厚度的圓環狀。於本實施方式中,以使接著帶11的接著層13(參照圖2)朝向內側(捲芯2側)的方式將接著帶11纏繞至捲芯2。於捲芯2的中空部分2a能夠安裝例如供用於向接著帶捲繞捲筒1纏繞接著帶11的纏繞裝置或者用於自接著帶捲繞捲筒1抽出接著帶11的抽出裝置的旋轉軸插入的軸孔(未圖示)。藉由於將纏繞裝置或抽出裝置的旋轉軸插入至軸孔的狀態下使旋轉軸驅動,接著帶捲繞捲筒1進行旋轉而不會空轉。The core 2 is a portion wound around the tape 11. The core 2 includes, for example, plastic, and has a ring shape having the same thickness as the width of the adhesive tape 11. In this embodiment, the adhesive tape 11 is wound on the core 2 such that the adhesive layer 13 (see FIG. 2) of the adhesive tape 11 faces inward (the core 2 side). To the hollow portion 2 a of the core 2, for example, a winding shaft for winding the tape 11 onto the tape winding roll 1 or a rotary shaft for withdrawing the tape 11 from the tape winding roll 1 can be installed. Shaft hole (not shown). Since the rotating shaft is driven while the rotating shaft of the winding device or the extraction device is inserted into the shaft hole, the tape winding reel 1 is then rotated without idling.
側板3例如包括與捲芯2相同的塑膠,並呈圓板狀。側板3的厚度例如為0.5 mm~5.0 mm,較佳為0.9 mm~3.0 mm,更佳為1.0 mm~2.0 mm。側板3的直徑根據纏繞至捲芯2的接著帶T的長度,以相對於捲芯2的直徑而成為足夠大的直徑的方式適當設定。於側板3的中央部分設有與捲芯2的中空部分2a連通的圓形的開口,以使所述軸孔的配置成為可能。The side plate 3 includes, for example, the same plastic as the core 2 and has a circular plate shape. The thickness of the side plate 3 is, for example, 0.5 mm to 5.0 mm, preferably 0.9 mm to 3.0 mm, and more preferably 1.0 mm to 2.0 mm. The diameter of the side plate 3 is appropriately set so as to be a sufficiently large diameter with respect to the diameter of the core 2 according to the length of the adhesive tape T wound around the core 2. The central portion of the side plate 3 is provided with a circular opening that communicates with the hollow portion 2 a of the winding core 2 so as to enable the arrangement of the shaft hole.
於側板3的內表面設有自接著帶捲繞捲筒1的中心側朝周緣側呈放射狀延伸的多個肋條(rip)4。於圖1的示例中,以22.5°的相位角設有16根直線狀的肋條4。肋條4例如具有圓弧狀的剖面形狀,例如以0.05 mm~1.00 mm左右的範圍自側板3的內表面突出。藉由此種肋條4的配置,起到如下等效果:纏繞至捲芯2的接著帶11的捲崩塌的抑制、及對側板3的衝撞導致的接著帶11的接著層13(參照圖2)的剝落(黏連(blocking)現象)的抑制。A plurality of ribs 4 are provided on the inner surface of the side plate 3 and extend radially from the center side toward the peripheral edge side of the tape winding roll 1. In the example of FIG. 1, 16 linear ribs 4 are provided at a phase angle of 22.5 °. The rib 4 has, for example, an arc-shaped cross-sectional shape, and protrudes from the inner surface of the side plate 3 in a range of, for example, about 0.05 mm to 1.00 mm. The arrangement of such ribs 4 has the effects of suppressing the roll collapse of the adhesive tape 11 wound around the core 2 and the adhesive layer 13 of the adhesive tape 11 caused by the collision with the side plate 3 (see FIG. 2). Inhibition of spalling (blocking phenomenon).
其次,對接著帶11進行詳細說明。Next, the adhesive tape 11 will be described in detail.
圖2為表示接著帶的一實施方式的示意性的剖面圖。如圖所示,接著帶11具有藉由離型件(第1離型件)12及形成於離型件12的一面12a側的接著層(第1接著層)13構成的雙層結構。於本實施方式中,關於接著帶11,例示了用於被連接構件間的連接的異向導電性帶。異向導電性帶是例如於將IC、LSI等半導體元件等連接於印刷配線基板、LCD用玻璃基板、可撓性印刷基板等各種基板時使用的接著帶。異向導電性帶可使相對的電極間導通,並保持鄰接的電極間的絕緣狀態。FIG. 2 is a schematic cross-sectional view showing an embodiment of the adhesive tape. As shown in the figure, the adhesive tape 11 has a double-layered structure including a release member (first release member) 12 and an adhesive layer (first adhesive layer) 13 formed on one surface 12 a side of the release member 12. In this embodiment, the adhesive tape 11 is exemplified by an anisotropic conductive tape for connection between the members to be connected. The anisotropic conductive tape is, for example, an adhesive tape used when connecting semiconductor elements such as ICs and LSIs to various substrates such as printed wiring boards, glass substrates for LCDs, and flexible printed boards. The anisotropic conductive tape can conduct conduction between the opposite electrodes and maintain the insulation state between adjacent electrodes.
接著帶11的長度例如為10 m以上且1000 m以下。於本實施方式中,例如為300 m。接著帶11藉由使用所述接著帶捲繞捲筒1,而以捲繞體的狀態得到保存及搬運。接著帶11的寬度例如為0.8 mm以下,較佳為0.6 mm以下。接著帶11的厚度(離型件12與接著層13的合計厚度)例如為5 μm以上且100 μm以下,較佳為10 μm以上且40 μm以下,更佳為10 μm以上且20 μm以下。The length of the subsequent belt 11 is, for example, 10 m or more and 1000 m or less. In this embodiment, it is 300 m, for example. The subsequent tape 11 is wound and stored in the state of a wound body by winding the reel 1 with the aforementioned adhesive tape. The width of the adhesive tape 11 is, for example, 0.8 mm or less, and preferably 0.6 mm or less. The thickness of the adhesive tape 11 (total thickness of the release member 12 and the adhesive layer 13) is, for example, 5 μm or more and 100 μm or less, preferably 10 μm or more and 40 μm or less, and more preferably 10 μm or more and 20 μm or less.
作為離型件12的材料,就接著帶11的強度及接著層13的剝離性的觀點而言,例如可使用延伸聚丙烯(oriented polypropylene,OPP)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚萘二甲酸乙二酯、聚間苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚烯烴、聚乙酸酯、聚碳酸酯、聚苯硫醚、聚醯胺、乙烯-乙酸乙烯酯共聚物、聚氯乙烯、聚偏二氯乙烯、合成橡膠系、液晶聚合物等。As the material of the release member 12, from the viewpoint of the strength of the adhesive tape 11 and the peelability of the adhesive layer 13, for example, oriented polypropylene (OPP), polyethylene terephthalate (Polyethylene terephthalate) can be used. , PET), polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide , Ethylene-vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, synthetic rubber, liquid crystal polymer, etc.
亦可對離型件12的另一面12b側實施脫模處理。作為進行脫模處理的脫模劑,例如可使用烯烴系脫模劑、乙二醇褐煤酸酯(ethylene glycol montanic acid ester)、棕櫚蠟(carnauba wax)、石油系蠟等低熔點蠟、低分子量氟樹脂、矽酮系或氟系的界面活性劑、油、蠟、樹脂、聚酯改質矽酮樹脂等矽酮樹脂等。一般而言,使用矽酮樹脂。A mold release process may be performed on the other surface 12b side of the release member 12. Examples of the release agent for release treatment include low-melting-point waxes such as olefin-based release agents, ethylene glycol montanic acid ester, carnauba wax, and petroleum-based waxes, and low molecular weight. Silicone resins such as fluororesins, silicone-based or fluorine-based surfactants, oils, waxes, resins, polyester modified silicone resins, etc. Generally, a silicone resin is used.
作為接著層13的材料例如可使用包含熱塑性樹脂、熱硬化性樹脂、或者熱塑性樹脂與熱硬化性樹脂的混合系(混合樹脂)等樹脂的接著劑。作為代表性的熱塑性樹脂,例如可列舉苯乙烯樹脂系、聚酯樹脂系。作為代表性的熱硬化性樹脂,例如可列舉:環氧樹脂系、丙烯酸樹脂系、矽酮樹脂系。As the material of the adhesive layer 13, for example, an adhesive containing a resin such as a thermoplastic resin, a thermosetting resin, or a mixed system (mixed resin) of a thermoplastic resin and a thermosetting resin can be used. Typical examples of the thermoplastic resin include a styrene resin system and a polyester resin system. Examples of typical thermosetting resins include epoxy resins, acrylic resins, and silicone resins.
於接著帶11為異向導電性帶的情況下,接著帶13包括接著劑成分及視需要含有的導電粒子。作為接著劑成分,例如就可廣泛應用藉由熱或光而呈現硬化性的材料、並且連接後的耐熱性或耐濕性優異的觀點而言,較佳為使用交聯性材料。含有作為熱硬化性樹脂的環氧樹脂作為主成分的環氧系接著劑就可實現短時間硬化而連接作業性良好,且分子結構上接著性良好等特徵而言較佳。作為環氧系接著劑,例如可使用以如下者為主成分者:高分子量環氧、固體環氧或液狀環氧、或者利用胺基甲酸酯、聚酯、丙烯酸橡膠、丁腈橡膠(Nitrile Rubber,NBR)、合成線狀聚醯胺等將該些改質而成的環氧。環氧系接著劑通常為對構成主成分的所述環氧添加硬化劑、觸媒、偶合劑(coupling agent)、填充劑等而成者。When the adhesive tape 11 is an anisotropic conductive tape, the adhesive tape 13 includes an adhesive agent component and conductive particles contained as necessary. As the adhesive component, for example, a crosslinkable material is preferably used from the viewpoint that a material exhibiting hardenability by heat or light can be widely used and excellent in heat resistance or moisture resistance after joining. An epoxy-based adhesive containing an epoxy resin as a thermosetting resin as a main component can be cured in a short period of time, has good connection workability, and has good molecular structure adhesiveness. As the epoxy-based adhesive, for example, a high-molecular-weight epoxy, solid epoxy, or liquid epoxy can be used, or a urethane, polyester, acrylic rubber, or nitrile rubber ( Nitrile Rubber (NBR), synthetic linear polyamide and other modified epoxy. The epoxy-based adhesive is usually one obtained by adding a hardener, a catalyst, a coupling agent, a filler, and the like to the epoxy constituting the main component.
作為導電粒子,例如可列舉:金(Au)、銀(Ag)、鉑(Pt)、鎳(Ni)、銅(Cu)、鎢(W)、銻(Sb)、錫(Sn)、焊料等金屬或者碳的粒子。而且,亦可使用如下的包覆粒子:以非導電性的玻璃、陶瓷(ceramic)、塑膠(plastic)等為核,且利用所述金屬或碳包覆所述核而成。就分散性及導電性的觀點而言,導電粒子的平均粒徑例如較佳為1 μm以上且18 μm以下。另外,亦可使用利用絕緣層包覆導電粒子而成的絕緣包覆粒子,就提升鄰接的電極間的絕緣性的觀點而言亦可併用導電粒子與絕緣性粒子。Examples of the conductive particles include gold (Au), silver (Ag), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), antimony (Sb), tin (Sn), solder, and the like. Metal or carbon particles. In addition, it is also possible to use a coating particle formed by using non-conductive glass, ceramic, plastic, or the like as a core and coating the core with the metal or carbon. From the viewpoint of dispersibility and conductivity, the average particle diameter of the conductive particles is preferably 1 μm or more and 18 μm or less, for example. Moreover, you may use the insulating coating particle which coated the conductive particle with the insulating layer, and you may use a conductive particle and an insulating particle together from a viewpoint of improving the insulation between adjacent electrodes.
於接著帶11的引帶部分L(自接著帶捲繞捲筒1的引出部分)設有拾取帶21。拾取帶21如圖1所示,於將接著帶11纏繞至接著帶捲繞捲筒1的狀態下自側板3、側板3間引出,並藉由密封件S固定於其中一個側板3的外表面。使用接著帶11時,可於剝落密封件S後,藉由把持拾取帶21而將接著帶11自接著帶捲繞捲筒1引出。密封件S並無特別限制,可使用一般性的密封件。使用接著帶11時,亦可將引帶部分L與拾取帶21一起切斷。A pickup belt 21 is provided on the lead-out portion L (the lead-out portion of the self-adhesive tape winding roll 1) of the adhesive tape 11. As shown in FIG. 1, the pickup belt 21 is drawn out from the side plate 3 and the side plate 3 in a state where the adhesive tape 11 is wound around the adhesive tape winding roll 1 and is fixed to the outer surface of one of the side plates 3 by a seal S. . When the adhesive tape 11 is used, after the seal S is peeled off, the adhesive tape 11 can be pulled out from the adhesive tape winding roll 1 by holding the pickup tape 21. The seal S is not particularly limited, and a general seal can be used. When the adhesive tape 11 is used, the lead tape portion L may be cut together with the pickup tape 21.
拾取帶21如圖2所示,具有藉由離型件(第2離型件)22及形成於離型件12的一面22a側的接著層(第2接著層)23構成的雙層結構。拾取帶21以接著層23與接著帶11側的接著層13相向的方式貼附於引帶部分L。而且,拾取帶21的終止位置F2與接著帶11的引帶部分L的終止位置F1一致。藉此,於接著帶11的引帶部分L中,接著層13藉由離型件12與拾取帶21夾持,接著層13不露出至外側。As shown in FIG. 2, the pickup belt 21 has a two-layer structure including a release member (second release member) 22 and an adhesive layer (second adhesive layer) 23 formed on one surface 22 a side of the release member 12. The pickup tape 21 is affixed to the tape guide portion L so that the adhesive layer 23 and the adhesive layer 13 on the adhesive tape 11 side face each other. Further, the end position F2 of the pickup tape 21 coincides with the end position F1 of the lead-out portion L following the tape 11. Thereby, in the lead-in portion L of the adhesive tape 11, the adhesive layer 13 is held by the release member 12 and the pickup tape 21, and the adhesive layer 13 is not exposed to the outside.
拾取帶21的長度為與接著帶11的引帶部分L對應的長度,例如為30 mm以上且300 mm以下。而且,拾取帶21的寬度例如為0.8 mm以下,較佳為0.6 mm以下,為與接著帶11的寬度相等的寬度。拾取帶21的厚度(離型件12與接著層13的合計厚度)例如為10 μm以上且30 μm以下,較佳為10 μm以上且20 μm以下。於拾取帶21的厚度不足10 μm的情況下,考慮:向接著帶11貼附時拾取帶21捲曲(curl),而於接著層13、接著層23間產生氣泡。而且,於拾取帶21的厚度超過30 μm的情況下,難以將拾取帶21切斷為與接著帶11相等的寬度。因此,若為所述厚度範圍,則可抑制氣泡的產生並容易地實施拾取帶21的切斷。The length of the pickup belt 21 is a length corresponding to the lead-in portion L of the adhering belt 11, and is, for example, 30 mm or more and 300 mm or less. The width of the pickup belt 21 is, for example, 0.8 mm or less, preferably 0.6 mm or less, and is equal to the width of the adhesive tape 11. The thickness of the pickup belt 21 (total thickness of the release member 12 and the adhesive layer 13) is, for example, 10 μm or more and 30 μm or less, and preferably 10 μm or more and 20 μm or less. When the thickness of the pickup tape 21 is less than 10 μm, it is considered that when the pickup tape 21 is attached to the adhesive tape 11, the pickup tape 21 curls, and air bubbles are generated between the adhesive layer 13 and the adhesive layer 23. Further, when the thickness of the pickup belt 21 exceeds 30 μm, it is difficult to cut the pickup belt 21 to the same width as the adhesive tape 11. Therefore, if it is the said thickness range, the generation | occurrence | production of a bubble can be suppressed and cutting | disconnection of the pick-up tape 21 can be performed easily.
作為離型件22的材料,與接著帶11的離型件12同樣地,例如可使用延伸聚丙烯(OPP)、聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯、聚間苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚烯烴、聚乙酸酯、聚碳酸酯、聚苯硫醚、聚醯胺、乙烯-乙酸乙烯酯共聚物、聚氯乙烯、聚偏二氯乙烯、合成橡膠系、液晶聚合物等。As the material of the release member 22, similar to the release member 12 to which the tape 11 is attached, for example, stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, Polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene-vinyl acetate copolymer, polyvinyl chloride , Polyvinylidene chloride, synthetic rubber, liquid crystal polymer, etc.
作為接著層23的材料,例如可使用矽酮系黏著劑或者丙烯酸系黏著劑。若考慮顧客最終產品的規格上,要求包括接著層13以外的輔助材料在內不含矽酮(silicone free)的情況,則較佳為使用丙烯酸系黏著劑作為接著層23的材料。而且,就拾取帶21的可見性及識別性的提升的觀點而言,較佳為於接著層23著色有與接著帶11側的接著層13不同的色。接著層13、接著層23的色並無特別限制,作為一例可使接著帶11側的接著層13的色為無色透明,並使拾取帶21側的接著層23的色為藍色。而且,於對離型件12使用了白色PET的情況下,亦可就對比的關係而言,使拾取帶21的離型件22及接著層23的色為黑色。As the material of the adhesive layer 23, for example, a silicone-based adhesive or an acrylic-based adhesive can be used. In consideration of the specifications of the customer's final product, it is required that silicone-free (including auxiliary materials other than the adhesive layer 13) is not included, so it is preferable to use an acrylic adhesive as the material of the adhesive layer 23. From the viewpoint of improving the visibility and visibility of the pickup tape 21, it is preferable that the adhesive layer 23 be colored with a different color from the adhesive layer 13 on the adhesive tape 11 side. The color of the adhesive layer 13 and the adhesive layer 23 is not particularly limited. For example, the color of the adhesive layer 13 on the adhesive tape 11 side can be colorless and transparent, and the color of the adhesive layer 23 on the pickup tape 21 side can be blue. When white PET is used for the release member 12, the color of the release member 22 and the adhesive layer 23 of the pickup belt 21 may be made black in terms of contrast.
繼而,對接著帶11的製造方法進行說明。Next, a method for manufacturing the adhesive tape 11 will be described.
圖3為表示接著帶的製造方法的一實施方式的示意性的圖。如圖所示,於接著帶11的製造中使用製造裝置101。製造裝置101包括:抽出裝置102,纏繞有接著帶11的原材料P;纏繞裝置103,以能夠旋轉的方式安裝有多個接著帶捲繞捲筒1;以及加工裝置104,進行接著帶11的切割加工。FIG. 3 is a schematic diagram showing an embodiment of a method for producing a bonding tape. As shown in the figure, a manufacturing apparatus 101 is used for manufacturing the subsequent tape 11. The manufacturing apparatus 101 includes a pull-out device 102 around which the raw material P of the adhesive tape 11 is wound, a winding device 103 to which a plurality of adhesive tape winding reels 1 are rotatably mounted, and a processing device 104 that performs cutting of the adhesive tape 11 machining.
自抽出裝置102以固定的速度自原材料P抽出接著帶11。針對自抽出裝置102抽出的接著帶11,每隔一定的長度貼附與原材料P的寬度為相等寬度的厚度10 μm以上且30 μm以下的大張的拾取帶21。此時,使拾取帶21的接著層23與接著帶11的接著層13相向。藉此,於貼附有拾取帶21的部分,接著帶11的接著層13變得不露出至外側。The self-extracting device 102 extracts the raw material P at a constant speed and then takes the belt 11. For the adhesive tape 11 extracted from the extraction device 102, a large-sized pickup tape 21 having a thickness equal to or greater than the width of the raw material P and having a thickness of 10 μm or more and 30 μm or less is attached at regular intervals. At this time, the adhesive layer 23 of the pickup tape 21 and the adhesive layer 13 of the adhesive tape 11 are opposed to each other. Thereby, at the portion where the pickup tape 21 is attached, the adhesive layer 13 of the adhesive tape 11 is not exposed to the outside.
貼附拾取帶21後,將接著帶11送至加工裝置104。然後,將貼附有拾取帶21的接著帶11沿長邊方向進行切割加工,切斷為寬度0.8 mm以下的多條接著帶11。對接著帶11進行切割加工後,將多條接著帶11與拾取帶21一起沿寬度方向切斷,使引帶部分L終止(圖3中的A-A線)。藉此,成為接著帶11的引帶部分L的終止位置F1與拾取帶21的終止位置F2一致的狀態。After the pickup tape 21 is attached, the subsequent tape 11 is sent to the processing device 104. Then, the adhesive tape 11 to which the pickup tape 21 is attached is cut in the longitudinal direction, and cut into a plurality of adhesive tapes 11 having a width of 0.8 mm or less. After cutting the adhesive tape 11, the plurality of adhesive tapes 11 are cut in the width direction together with the pickup tape 21 to terminate the lead-in portion L (A-A line in FIG. 3). Thereby, the end position F1 of the lead-in tape part L following the tape 11 and the end position F2 of the pick-up tape 21 are made into a state.
使引帶部分L終止後,藉由纏繞裝置103將貼附有拾取帶21的多條接著帶11分別纏繞至接著帶捲繞捲筒1的捲芯2。然後,將引帶部分L自接著帶捲繞捲筒1的側板3、側板3間引出,並藉由密封件S固定於其中一個側板3的外表面。藉此,獲得如圖1所示纏繞至接著帶捲繞捲筒1的接著帶11。After terminating the lead-in portion L, the plurality of adhesive tapes 11 to which the pickup tape 21 is attached are wound by the winding device 103 to the core 2 of the adhesive tape winding drum 1, respectively. Then, the tape guide portion L is drawn out between the side plate 3 and the side plate 3 of the adhesive tape winding reel 1 and is fixed to the outer surface of one of the side plates 3 by a seal S. Thereby, the adhesive tape 11 wound to the adhesive tape winding reel 1 as shown in FIG. 1 is obtained.
如以上所說明般,於接著帶11中,於引帶部分L設有厚度10 μm以上且30 μm以下的拾取帶21。藉由將拾取帶21的厚度設為所述範圍,可相對地減小相對於接著帶11的寬度的拾取帶21的厚度。因此,能夠於貼附有拾取帶21的狀態下藉由切割加工將接著帶11切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分L的前端側不露出接著層13,所以即便於將引帶部分L固定於接著帶捲繞捲筒1的情況下,亦可防止於使用時將引帶部分L自接著帶捲繞捲筒1取下時接著層13自離型件12剝離。As described above, in the adhesive tape 11, a pickup tape 21 having a thickness of 10 μm or more and 30 μm or less is provided on the lead-in portion L. By setting the thickness of the pickup belt 21 to the above range, the thickness of the pickup belt 21 with respect to the width of the adhesive tape 11 can be relatively reduced. Therefore, the adhesive tape 11 can be cut to a narrow width by a cutting process in a state where the pickup tape 21 is attached, thereby simplifying the manufacturing steps. In addition, since the adhesive layer 13 is not exposed on the front end side of the lead-in portion L, even when the lead-in portion L is fixed to the take-up reel 1, the lead-in portion L can be prevented from being self-adhered during use When the tape winding roll 1 is removed, the adhesive layer 13 is peeled from the release member 12.
而且,於本實施方式中,拾取帶21於離型件22的一面22a側具有接著層23,以接著層23與接著帶11側的接著層13相向的方式固定於引帶部分L。藉此,可將拾取帶21牢固地固定於接著帶11。Further, in the present embodiment, the pickup tape 21 has an adhesive layer 23 on one side 22 a side of the release member 22, and is fixed to the lead-in portion L so that the adhesive layer 23 faces the adhesive layer 13 on the adhesive tape 11 side. Thereby, the pickup belt 21 can be firmly fixed to the adhesive tape 11.
而且,於本實施方式中,於拾取帶21側的接著層23著色有與接著帶11側的接著層13不同的色。藉此,可提高拾取帶21的可見性及識別性。因此,可提升使用接著帶11時對引帶部分L進行切斷的情況等的作業性。Further, in the present embodiment, the adhesive layer 23 on the pickup belt 21 side is colored with a different color from the adhesive layer 13 on the adhesive belt 11 side. Thereby, the visibility and recognizability of the pickup belt 21 can be improved. Therefore, workability, such as a case where the lead-out portion L is cut when the adhesive tape 11 is used, can be improved.
而且,於本實施方式中,接著帶11的與長邊方向正交的寬度為0.8 mm以下。例如,於對接著帶11進行切割加工的加工裝置104中,使上刀與下刀重疊(lap)來進行接著帶11的切斷,但若切割寬度變窄,則上刀與下刀之間的間隙(clearance)亦變窄。因此,若切斷對象的厚度與寬度相比相對變大,則難以使刀通過切斷對象。關於此方面,例如藉由將上刀薄型化而能夠一定程度上應對,但就刀的磨耗性等問題而言,上刀的薄型化亦有限度。根據所述情況,於接著帶的寬度為0.8 mm以下的情況下,於貼附有先前般的引線帶的狀態下難以對接著帶的引帶部分進行切割加工。因此,於如本實施方式般接著帶11的寬度為0.8 mm以下的情況下,對引帶部分L應用厚度10 μm以上且30 μm以下的拾取帶21尤其有用。In the present embodiment, the width of the adhesive tape 11 orthogonal to the longitudinal direction is 0.8 mm or less. For example, in the processing device 104 that cuts the adhesive tape 11, the upper blade and the lower blade are overlapped (lap) to cut the adhesive tape 11. However, if the cutting width is narrowed, the gap between the upper blade and the lower blade is reduced. The clearance is also narrowed. Therefore, if the thickness of the cutting target is relatively larger than the width, it is difficult to pass the knife through the cutting target. In this regard, for example, it is possible to cope with a certain degree by reducing the thickness of the upper blade. However, in terms of the abrasiveness of the blade, the thickness of the upper blade is also limited. According to the above, when the width of the adhesive tape is 0.8 mm or less, it is difficult to cut the lead tape portion of the adhesive tape with the conventional lead tape attached. Therefore, when the width of the adhesive tape 11 is 0.8 mm or less as in the present embodiment, it is particularly useful to apply the pickup tape 21 having a thickness of 10 μm or more and 30 μm or less to the lead-in portion L.
接著帶可採用各種變形。圖4為表示接著帶的變形例的示意性的剖面圖。於圖所示的接著帶31中,引帶部分L中所設的拾取帶41的構成與所述實施方式不同。具體而言,拾取帶41具有藉由離型件(第2離型件)22、形成於離型件22的一面22a側的接著層(第2接著層)23及形成於離型件22的另一面22b側的接著層(第3接著層)43構成的三層結構。拾取帶41的厚度(離型件22、接著層23與接著層43的合計厚度)例如為10 μm以上且30 μm以下,較佳為10 μm以上且20 μm以下。The belt can then be used in various deformations. FIG. 4 is a schematic cross-sectional view showing a modification of the adhesive tape. In the adhesive tape 31 shown in the figure, the configuration of the pickup tape 41 provided in the lead-in portion L is different from that of the above-described embodiment. Specifically, the pickup belt 41 includes a release member (second release member) 22, an adhesive layer (second adhesive layer) 23 formed on one surface 22 a side of the release member 22, and a pickup layer 41 formed on the release member 22. A three-layer structure including a bonding layer (third bonding layer) 43 on the other surface 22b side. The thickness of the pickup belt 41 (total thickness of the release member 22, the adhesive layer 23, and the adhesive layer 43) is, for example, 10 μm or more and 30 μm or less, and preferably 10 μm or more and 20 μm or less.
接著層43例如包括與接著層23相同的材料。接著層43亦可與接著層23同樣地,著色有與接著帶31側的接著層13不同的色。於接著帶31中,拾取帶41的終止位置F2與接著帶31的引帶部分L的終止位置F1一致,但於引帶部分L的終止側設有離型件22的另一面22b自接著層13露出的露出區域R。自終止位置F2起的露出區域R的長度例如為5 mm以上且不足30 mm。The adhesion layer 43 includes, for example, the same material as the adhesion layer 23. The adhesive layer 43 may be colored differently from the adhesive layer 13 on the adhesive tape 31 side similarly to the adhesive layer 23. In the adhesive tape 31, the ending position F2 of the pickup tape 41 is consistent with the ending position F1 of the lead-out portion L of the adhesive tape 31, but the other side 22b of the release member 22 is provided on the terminating side of the lead-in portion L. 13 Exposed exposed area R. The length of the exposed region R from the end position F2 is, for example, 5 mm or more and less than 30 mm.
即便於此種接著帶31中,亦能夠於貼附有拾取帶41的狀態下藉由切割加工將接著帶31切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分L的前端側不露出接著層13,所以即便於將引帶部分L固定於接著帶捲繞捲筒1的情況下,亦可防止於使用時將引帶部分L自接著帶捲繞捲筒1取下時接著層13自離型件12剝離。Even if it is convenient for such an adhesive tape 31, the adhesive tape 31 can be cut to a narrow width by cutting in a state where the pickup tape 41 is attached, thereby simplifying the manufacturing steps. In addition, since the adhesive layer 13 is not exposed on the front end side of the lead-in portion L, even when the lead-in portion L is fixed to the take-up reel 1, the lead-in portion L can be prevented from being self-adhered during use. When the tape winding roll 1 is removed, the adhesive layer 13 is peeled from the release member 12.
而且,於接著帶31中,可藉由接著層43將引帶部分L固定於接著帶捲繞捲筒1而不另外使用密封件S(參照圖1)。而且,藉由於引帶部分L的終止側設置露出區域R,露出區域R成為將引帶部分L自接著帶捲繞捲筒1剝落時的把持部,從而可於使用時容易地將引帶部分L自接著帶捲繞捲筒1取下。Further, in the adhesive tape 31, the tape lead portion L can be fixed to the adhesive tape winding roll 1 by the adhesive layer 43 without using a seal S (see FIG. 1). In addition, since the exposed area R is provided on the termination side of the tape lead portion L, the exposed area R becomes a grip portion when the tape lead portion L is peeled off from the self-adhesive tape winding roll 1, so that the tape lead portion can be easily used during use. L is removed from the adhesive tape winding reel 1.
圖5為表示接著帶的另一變形例的示意性的剖面圖。於圖所示的接著帶51中,引帶部分L中所設的拾取帶61的構成與所述實施方式進而不同。具體而言,拾取帶61具有藉由離型件(第2離型件)22及形成於離型件22的另一面22b側的接著層(第4接著層)63構成的雙層結構。拾取帶61藉由將離型件22的一面22a側直接貼附於接著帶51側的接著層13,而固定於接著帶51。拾取帶61的厚度(離型件22與接著層63的合計厚度)例如為10 μm以上且30 μm以下,較佳為10 μm以上且20 μm以下。FIG. 5 is a schematic cross-sectional view showing another modified example of the adhesive tape. In the adhesive tape 51 shown in the figure, the configuration of the pickup tape 61 provided in the lead-in portion L is further different from that of the embodiment described above. Specifically, the pickup belt 61 has a two-layer structure including a release member (second release member) 22 and an adhesive layer (fourth adhesive layer) 63 formed on the other surface 22 b side of the release member 22. The pickup belt 61 is fixed to the adhesive tape 51 by directly attaching the one surface 22a side of the release member 22 to the adhesive layer 13 on the adhesive tape 51 side. The thickness of the pickup belt 61 (total thickness of the release member 22 and the adhesive layer 63) is, for example, 10 μm or more and 30 μm or less, and preferably 10 μm or more and 20 μm or less.
接著層63例如具有與接著層23相同的構成。即,接著層63包括與接著層23相同的材料。而且,於接著層63著色有與接著帶51側的接著層13不同的色。拾取帶61的終止位置F2與接著帶51的引帶部分L的終止位置F1一致,但於引帶部分L的終止側設有離型件22的另一面22b自接著層63露出的露出區域R。自終止位置F2起的露出區域R的長度例如為5 mm以上且不足30 mm。The adhesion layer 63 has, for example, the same structure as the adhesion layer 23. That is, the adhesive layer 63 includes the same material as the adhesive layer 23. The adhesive layer 63 is colored differently from the adhesive layer 13 on the adhesive tape 51 side. The end position F2 of the pick-up tape 61 is the same as the end position F1 of the lead-out portion L following the tape 51, but the other side 22b of the release member 22 on the termination side of the lead-out portion L is provided with an exposed area R exposed from the adhesive layer 63 . The length of the exposed region R from the end position F2 is, for example, 5 mm or more and less than 30 mm.
即便於此種接著帶51中,亦能夠於貼附有拾取帶61的狀態下藉由切割加工將接著帶51切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分L的前端側不露出接著層13,所以即便於將引帶部分L固定於接著帶捲繞捲筒1的情況下,亦可防止於使用時將引帶部分L自接著帶捲繞捲筒1取下時接著層13自離型件12剝離。Even if it is convenient for such an adhesive tape 51, the adhesive tape 51 can be cut to a narrow width by cutting in a state where the pickup tape 61 is attached, thereby simplifying the manufacturing steps. In addition, since the adhesive layer 13 is not exposed on the front end side of the lead-in portion L, even when the lead-in portion L is fixed to the take-up reel 1, the lead-in portion L can be prevented from being self-adhered during use. When the tape winding roll 1 is removed, the adhesive layer 13 is peeled from the release member 12.
而且,於接著帶51中,可藉由接著層63將引帶部分L固定於接著帶捲繞捲筒1而不另外使用密封件S(參照圖1)。而且,藉由於引帶部分L的終止側設置露出區域R,露出區域R成為將引帶部分L自接著帶捲繞捲筒1剝落時的把持部,從而可於使用時容易地將引帶部分L自接著帶捲繞捲筒1取下。進而,於接著帶51中,於拾取帶61的離型件22的一面22a側未設置接著層,藉此可抑制包括拾取帶61在內的引帶部分L的整體的厚度。因此,可進一步切實地實施於貼附有拾取帶61的狀態下的切割加工。Further, in the adhesive tape 51, the tape guide portion L can be fixed to the adhesive tape winding roll 1 by the adhesive layer 63 without using a seal S (see FIG. 1). In addition, since the exposed area R is provided on the termination side of the tape lead portion L, the exposed area R becomes a grip portion when the tape lead portion L is peeled off from the self-adhesive tape winding roll 1, so that the tape lead portion can be easily used during use L is removed from the adhesive tape winding reel 1. Furthermore, in the adhesive tape 51, an adhesive layer is not provided on one side 22a side of the release member 22 of the pickup tape 61, so that the entire thickness of the lead tape portion L including the pickup tape 61 can be suppressed. Therefore, the dicing process in a state where the pickup belt 61 is attached can be performed more reliably.
圖6為表示接著帶的另一變形例的示意性的剖面圖。於圖所示的接著帶71中,引帶部分L中所設的拾取帶81的構成與所述實施方式進而不同。具體而言,拾取帶81為僅具有離型件(第2離型件)22的單層結構。拾取帶81藉由將離型件22的一面22a側直接貼附於接著帶71側的接著層13,而固定於接著帶71。於將此接著帶71的引帶部分L固定於接著帶捲繞捲筒1的情況下,與圖1時同樣地使用密封件S即可。拾取帶81的厚度(離型件22的厚度)例如為10 μm以上且30 μm以下,較佳為10 μm以上且20 μm以下。FIG. 6 is a schematic cross-sectional view showing another modified example of the adhesive tape. In the adhesive tape 71 shown in the figure, the configuration of the pickup tape 81 provided in the lead-in portion L is further different from that of the embodiment described above. Specifically, the pickup belt 81 has a single-layer structure including only the release member (second release member) 22. The pickup tape 81 is fixed to the adhesive tape 71 by directly attaching the one surface 22 a side of the release member 22 to the adhesive layer 13 on the adhesive tape 71 side. In the case where the lead-out portion L of the adhesive tape 71 is fixed to the adhesive tape winding roll 1, the seal S may be used in the same manner as in FIG. 1. The thickness of the pickup belt 81 (thickness of the release member 22) is, for example, 10 μm or more and 30 μm or less, and preferably 10 μm or more and 20 μm or less.
即便於此種接著帶71中,亦能夠於貼附有拾取帶81的狀態下藉由切割加工將接著帶71切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分L的前端側不露出接著層13,所以即便於將引帶部分L固定於接著帶捲繞捲筒1的情況下,亦可防止於使用時將引帶部分L自接著帶捲繞捲筒1取下時接著層13自離型件12剝離。而且,於接著帶71中,拾取帶81成為僅包括離型件22的單層結構,所以可進一步抑制包括拾取帶81在內的引帶部分L的整體的厚度。因此,可更切實地實施於貼附有拾取帶81的狀態下的切割加工。Even if it is convenient for such an adhesive tape 71, the adhesive tape 71 can be cut to a narrow width by cutting in a state where the pickup tape 81 is attached, thereby simplifying the manufacturing steps. In addition, since the adhesive layer 13 is not exposed on the front end side of the lead-in portion L, even when the lead-in portion L is fixed to the take-up reel 1, the lead-in portion L can be prevented from being self-adhered during use When the tape winding roll 1 is removed, the adhesive layer 13 is peeled from the release member 12. Further, in the adhesive tape 71, the pickup tape 81 has a single-layer structure including only the release member 22, so that the entire thickness of the lead tape portion L including the pickup tape 81 can be further suppressed. Therefore, the dicing process in a state where the pickup belt 81 is attached can be performed more reliably.
1‧‧‧接著帶捲繞捲筒1‧‧‧ followed by a winding reel
2‧‧‧捲芯2‧‧‧ core
2a‧‧‧中空部分2a‧‧‧Hollow
3‧‧‧側板3‧‧‧Side
4‧‧‧肋條4‧‧‧ rib
11、31、51、71‧‧‧接著帶11, 31, 51, 71‧‧‧ followed by
12‧‧‧離型件(第1離型件)12‧‧‧ Release (the first release)
12a、22a‧‧‧一面12a, 22a ‧‧‧ side
12b、22b‧‧‧另一面12b, 22b‧‧‧ the other side
13‧‧‧接著層(第1接著層)13‧‧‧ Adjacent Layer (1 Adjacent Layer)
21、41、61、81‧‧‧拾取帶21, 41, 61, 81‧‧‧ pickup belt
22‧‧‧離型件(第2離型件)22‧‧‧ Release (the second release)
23‧‧‧接著層(第2接著層)23‧‧‧ Adjacent Layer (2nd Adjacent Layer)
43‧‧‧接著層(第3接著層)43‧‧‧ Adjacent Layer (3rd Adjacent Layer)
63‧‧‧接著層(第4接著層)63‧‧‧ Adjacent Layer (4th Adjacent Layer)
101‧‧‧製造裝置101‧‧‧ manufacturing equipment
102‧‧‧抽出裝置102‧‧‧ Extraction device
103‧‧‧纏繞裝置103‧‧‧ Winding device
104‧‧‧加工裝置104‧‧‧Processing equipment
F1、F2‧‧‧終止位置F1, F2‧‧‧End position
L‧‧‧引帶部分L‧‧‧ Leading section
P‧‧‧原材料P‧‧‧Raw materials
R‧‧‧露出區域R‧‧‧ exposed area
S‧‧‧密封件S‧‧‧Seal
圖1為表示接著帶捲繞捲筒的一實施方式的側面圖。 圖2為表示接著帶的一實施方式的示意性的剖面圖。 圖3為表示接著帶的製造方法的一實施方式的示意性的圖。 圖4為表示接著帶的變形例的示意性的剖面圖。 圖5為表示接著帶的其他變形例的示意性的剖面圖。 圖6為表示接著帶的其他變形例的示意性的剖面圖。FIG. 1 is a side view showing an embodiment of a continuous tape winding reel. FIG. 2 is a schematic cross-sectional view showing an embodiment of the adhesive tape. FIG. 3 is a schematic diagram showing an embodiment of a method for producing a bonding tape. FIG. 4 is a schematic cross-sectional view showing a modification of the adhesive tape. FIG. 5 is a schematic cross-sectional view showing another modified example of the adhesive tape. FIG. 6 is a schematic cross-sectional view showing another modified example of the adhesive tape.
Claims (9)
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JP2017-190298 | 2017-09-29 | ||
JP2017190298 | 2017-09-29 |
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TWI774850B TWI774850B (en) | 2022-08-21 |
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TW107134367A TWI774850B (en) | 2017-09-29 | 2018-09-28 | Subsequent tape and subsequent tape winding reels |
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JP (1) | JP7180606B2 (en) |
KR (1) | KR102534610B1 (en) |
CN (1) | CN111133069B (en) |
TW (1) | TWI774850B (en) |
WO (1) | WO2019065881A1 (en) |
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JPH0679695A (en) * | 1992-08-28 | 1994-03-22 | New Oji Paper Co Ltd | Cutting method for pressure adhesive paper |
DE19632689A1 (en) * | 1996-08-14 | 1998-02-19 | Beiersdorf Ag | Adhesive tape and method of using it |
JP3573717B2 (en) * | 2000-01-28 | 2004-10-06 | 日東電工包装システム株式会社 | Pressure sensitive adhesive tape |
US6413606B1 (en) * | 2000-03-20 | 2002-07-02 | Carlos R. Calderon | Drywall tape |
JP2001270649A (en) * | 2000-03-27 | 2001-10-02 | Kamoi Kakoshi Kk | End treatment method and device for adhesive tape |
JP4465788B2 (en) * | 2000-03-28 | 2010-05-19 | 日立化成工業株式会社 | Anisotropic conductive tape and reel |
JP3517195B2 (en) * | 2000-09-21 | 2004-04-05 | 池田機械産業株式会社 | Adhesive tape connection device and method |
JP3959247B2 (en) | 2001-02-16 | 2007-08-15 | ソニーケミカル&インフォメーションデバイス株式会社 | Reel member and film winding method |
JP2007128993A (en) * | 2005-11-02 | 2007-05-24 | Sony Corp | Adhesive tape for semiconductor substrate and adhesive tape feeder |
KR101100595B1 (en) * | 2006-10-31 | 2011-12-29 | 히다치 가세고교 가부시끼가이샤 | Adhesive tape and adhesive tape roll |
CN102037615B (en) * | 2009-02-27 | 2013-08-28 | 日立化成株式会社 | Adhesive material reel |
DE102009011164A1 (en) * | 2009-03-04 | 2010-09-09 | Tesa Se | Adhesive tape, in particular for bonding photovoltaic laminates |
CN102037614B (en) * | 2009-03-26 | 2014-03-19 | 日立化成株式会社 | Adhesive material reel |
JP2013065625A (en) * | 2011-09-15 | 2013-04-11 | Sekisui Chem Co Ltd | Dicing-die bonding tape, manufacturing kit of semiconductor chip with adhesive layer and manufacturing method of semiconductor chip with adhesive layer |
JP2014146639A (en) * | 2013-01-28 | 2014-08-14 | Toray Ind Inc | Method of manufacturing wiring board with adhesive layer |
KR20140132973A (en) * | 2013-05-09 | 2014-11-19 | 백남님 | Non-Slip Adhesive Tape and Manufacturing Method Thereof |
JP6186941B2 (en) * | 2013-06-26 | 2017-08-30 | 日立化成株式会社 | Adhesive reel |
JP6742723B2 (en) * | 2015-01-16 | 2020-08-19 | 日東電工株式会社 | Surface protection film and optical member |
JP6693161B2 (en) * | 2016-02-16 | 2020-05-13 | デクセリアルズ株式会社 | Film connection body, film winding body, reel body, and method for manufacturing film connection body |
-
2018
- 2018-09-27 KR KR1020207009453A patent/KR102534610B1/en active IP Right Grant
- 2018-09-27 WO PCT/JP2018/036045 patent/WO2019065881A1/en active Application Filing
- 2018-09-27 JP JP2019545626A patent/JP7180606B2/en active Active
- 2018-09-27 CN CN201880062239.8A patent/CN111133069B/en active Active
- 2018-09-28 TW TW107134367A patent/TWI774850B/en active
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KR20200062212A (en) | 2020-06-03 |
WO2019065881A1 (en) | 2019-04-04 |
KR102534610B1 (en) | 2023-05-19 |
CN111133069A (en) | 2020-05-08 |
CN111133069B (en) | 2023-01-10 |
JP7180606B2 (en) | 2022-11-30 |
JPWO2019065881A1 (en) | 2020-10-22 |
TWI774850B (en) | 2022-08-21 |
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