TWI774850B - Subsequent tape and subsequent tape winding reels - Google Patents
Subsequent tape and subsequent tape winding reels Download PDFInfo
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- TWI774850B TWI774850B TW107134367A TW107134367A TWI774850B TW I774850 B TWI774850 B TW I774850B TW 107134367 A TW107134367 A TW 107134367A TW 107134367 A TW107134367 A TW 107134367A TW I774850 B TWI774850 B TW I774850B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
- B65H35/02—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with longitudinal slitters or perforators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/18—Constructional details
- B65H75/28—Arrangements for positively securing ends of material
- B65H75/285—Holding devices to prevent the wound material from unwinding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/50—Auxiliary process performed during handling process
- B65H2301/51—Modifying a characteristic of handled material
- B65H2301/511—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
- B65H2301/5113—Processing surface of handled material upon transport or guiding thereof, e.g. cleaning applying adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Wire Bonding (AREA)
- Replacement Of Web Rolls (AREA)
Abstract
接著帶11於離型件12的一面12a側設有接著層13,於接著帶11的引帶部分L以至少在引帶部分L的前端側不露出接著層13的方式設有與所述引帶部分L於相同的位置終止的、厚度10μm以上且30μm以下的拾取帶21。 The adhesive tape 11 is provided with an adhesive layer 13 on the side of one surface 12a of the release member 12, and is provided with the adhesive layer 13 on the tape portion L of the adhesive tape 11 so that the adhesive layer 13 is not exposed at least at the front end side of the tape portion L. The pick-up tape 21 having a thickness of 10 μm or more and 30 μm or less in which the tape portion L terminates at the same position.
Description
本發明是有關於一種接著帶、接著帶捲繞捲筒和接著帶的製造方法。 The present invention relates to an adhesive tape, an adhesive tape winding reel, and a method of manufacturing the adhesive tape.
先前,使用用以將具有多個電極的被連接構件間予以連接的接著帶。作為此種接著帶,例如有異向導電性帶。若使用異向導電性帶,則例如於將積體電路(Integrated Circuit,IC)、大規模積體電路(Large Scale Integration,LSI)等半導體元件等連接於印刷配線基板、液晶顯示器(Liquid Crystal Display,LCD)用玻璃基板、可撓性(flexible)印刷基板等基板時,可使相對的電極間導通並保持鄰接的電極間的絕緣狀態。 Conventionally, an adhesive tape for connecting connected members having a plurality of electrodes has been used. As such an adhesive tape, for example, there is anisotropic conductive tape. If anisotropic conductive tapes are used, for example, semiconductor elements such as integrated circuits (ICs) and large-scale integrated circuits (LSIs) are connected to printed wiring boards, liquid crystal displays (Liquid Crystal Displays), etc. , LCD) with glass substrates, flexible (flexible) printed substrates and other substrates, can conduct conduction between the opposing electrodes and maintain the insulating state between the adjacent electrodes.
接著帶例如是藉由將包括含有熱硬化性樹脂的接著劑成分及視需要調配的導電粒子的接著劑層形成於聚對苯二甲酸乙二酯(Polyethylene Terephthalate,PET)等的基材上而成。接著帶是藉由將片狀的原材料以符合用途的寬度切割(slit)加工為長條而製作,並以捲繞於捲筒(reel)的捲繞體的狀態進行保存/搬運/使用(例如,參照專利文獻1)。 The adhesive tape is formed by, for example, forming an adhesive layer including an adhesive component containing a thermosetting resin and conductive particles prepared as needed on a base material such as polyethylene terephthalate (PET). to make. Next, the tape is produced by slitting the sheet-like raw material into a long strip at a width suitable for the purpose, and storing/transporting/using it in the state of a reel wound on a reel (for example, , refer to Patent Document 1).
[專利文獻1]日本專利特開2003-34468號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2003-34468
先前,對纏繞至捲筒的接著帶的引帶部分(拉出部分)貼附較接著帶的端部伸出的引線帶,並將引線帶貼附於捲筒,藉此達成引帶部分的固定。然而,近年來,對更窄寬度的接著帶的需求正在加強。因此,引線帶的厚度與接著帶的寬度相比相對地變大,於貼附有引線帶的狀態下難以對接著帶的引帶部分進行切割加工。現狀是,於將貼附於引帶部分的引線帶暫時剝落並進行了切割加工後,將引線帶貼附於變為窄寬度的接著帶的各者。因此,存在接著帶的製造步驟變得繁雜這一問題。 Previously, the lead tape protruding from the end of the tape is attached to the lead portion (pull-out portion) of the tape wound around the reel, and the lead tape is attached to the reel, thereby achieving the pull-out of the tape portion. fixed. However, in recent years, the demand for narrower width tapes has been increasing. Therefore, the thickness of the lead tape becomes relatively larger than the width of the adhesive tape, and it is difficult to cut the tape portion of the adhesive tape in a state where the lead tape is attached. In the current situation, after the lead tape attached to the tape portion is temporarily peeled off and diced, the lead tape is attached to each of the adhesive tapes having a narrow width. Therefore, there is a problem that the manufacturing steps of the adhesive tape become complicated.
本發明是為了解決所述課題而成,目的在於提供一種可簡化製造步驟的窄寬度的接著帶、接著帶捲繞捲筒和接著帶的製造方法。 This invention was made in order to solve the said subject, and an object is to provide the manufacturing method of a narrow adhesive tape which can simplify a manufacturing process, an adhesive tape winding reel, and an adhesive tape.
本發明的一方面的接著帶於第1離型件(separator)的一面側設有第1接著層,於接著帶的引帶部分,以至少在引帶部分的前端側不露出第1接著層的方式,設有與所述引帶部分於相同的位置終止(terminate)的、厚度10μm以上且30μm以下的拾取帶(pickup tape)。 In one aspect of the adhesive tape of the present invention, a first adhesive layer is provided on one surface side of the first separator, and the first adhesive layer is not exposed at least on the leading end side of the tape guide portion in the tape guide portion of the adhesive tape. In this way, a pickup tape with a thickness of 10 μm or more and 30 μm or less is provided, which terminates at the same position as the leader tape portion.
於此接著帶中,於引帶部分設有厚度10μm以上且30μm以下的拾取帶。藉由將拾取帶的厚度設為所述範圍,可相對地 減小相對於接著帶的寬度的拾取帶的厚度。因此,能夠於貼附有拾取帶的狀態下藉由切割加工將接著帶切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分的前端側不露出第1接著層,所以即便於將引帶部分固定於捲筒等的情況下,亦可防止於使用時將引帶部分自捲筒等取下時第1接著層自第1離型件剝離。 In this adhesive tape, a pick-up tape having a thickness of 10 μm or more and 30 μm or less is provided in the leader tape portion. By setting the thickness of the pick-up tape to the above range, it is possible to relatively Decrease the thickness of the pick-up tape relative to the width of the follow-up tape. Therefore, the adhesive tape can be cut into a narrow width by the cutting process in the state where the pick-up tape is attached, and the simplification of the manufacturing process can be achieved. Furthermore, since the first adhesive layer is not exposed on the front end side of the tape leader, even if the tape leader is fixed to a reel or the like, it is possible to prevent the tape leader from being removed from the reel or the like during use. 1. The adhesive layer is peeled off from the first release material.
而且,亦可為:拾取帶於第2離型件的一面側具有第2接著層,並以第2接著層與接著帶側的第1接著層相向的方式固定於引帶部分。藉此,可將拾取帶牢固地固定於接著帶。 Furthermore, the pick-up tape may have a second adhesive layer on one surface side of the second release material, and may be fixed to the tape leader so that the second adhesive layer and the first adhesive layer on the adhesive tape side face each other. Thereby, the pick-up tape can be firmly fixed to the adhesive tape.
而且,亦可為:拾取帶於第2離型件的另一面側具有第3接著層,於引帶部分的終止側設有第2離型件自第3接著層露出的露出區域。此時,可不使用另外的密封件(seal)而藉由第3接著層將引帶部分固定於捲筒等。而且,藉由於引帶部分的終止側設置露出區域,可於使用時容易地將引帶部分自捲筒等取下。 Furthermore, the pick-up tape may have a third adhesive layer on the other surface side of the second release member, and an exposed area where the second release member is exposed from the third adhesive layer may be provided on the termination side of the lead tape portion. In this case, the tape part can be fixed to the reel or the like by the third adhesive layer without using a separate seal. Furthermore, by providing the exposed area on the termination side of the tape guide portion, the tape guide portion can be easily removed from a reel or the like during use.
而且,亦可為:拾取帶於第2離型件的另一面側具有第4接著層,並藉由將第2離型件貼附於接著帶側的第1接著層而固定於引帶部分,於引帶部分的終止側設有第2離型件自第4接著層露出的露出區域。此時,可不使用另外的密封件而藉由第4接著層將引帶部分固定於捲筒等。而且,藉由於引帶部分的終止側設置露出區域,可於使用接著帶時容易地將引帶部分自捲筒等取下。進而,藉由於第2離型件的一面側設置接著層,可抑制包括拾取帶在內的引帶部分的整體的厚度。因此,可進一步切實地實施於貼附有拾取帶的狀態下的切割加工。 Furthermore, the pick-up tape may have a fourth adhesive layer on the other surface side of the second release member, and the second release member may be attached to the first adhesive layer on the adhesive tape side to be fixed to the tape guide portion and an exposed area where the second release member is exposed from the fourth adhesive layer is arranged on the termination side of the lead tape portion. At this time, the tape part can be fixed to the roll etc. by the 4th adhesive layer without using another seal|sticker. Furthermore, by providing the exposed area on the termination side of the tape leader, the tape leader can be easily removed from a reel or the like when the adhesive tape is used. Furthermore, by providing the adhesive layer on one surface side of the second release material, the thickness of the entire tape guide portion including the pick-up tape can be suppressed. Therefore, the cutting process in the state in which the pick-up tape is attached can be performed more reliably.
而且,亦可為:拾取帶僅包括第2離型件,並藉由將第2離型件貼附於接著帶側的第1接著層而固定於引帶部分。此時,可進一步抑制包括拾取帶在內的引帶部分的整體的厚度。因此,可進一步切實地實施於貼附有拾取帶的狀態下的切割加工。 Furthermore, the pick-up tape may include only the second release member, and the second release member may be attached to the first adhesive layer on the adhesive tape side to be fixed to the tape guide portion. In this case, the thickness of the entire tape portion including the pick-up tape can be further suppressed. Therefore, the cutting process in the state in which the pick-up tape is attached can be performed more reliably.
而且,亦可為:於拾取帶側的接著層著色有與第1接著層不同的色。藉此,可提高拾取帶的可見性及識別性。因此,可提升使用接著帶時對引帶部分進行切斷的情況等的作業性。 Furthermore, the adhesive layer on the pickup tape side may be colored with a color different from that of the first adhesive layer. Thereby, the visibility and identification of the pick-up tape can be improved. Therefore, workability such as cutting the tape leader portion when using the adhesive tape can be improved.
另外,亦可為:接著帶的與長邊方向正交的寬度為0.8mm以下。於接著帶的寬度為0.8mm以下的情況下,於貼附有先前般的引線帶的狀態下難以對接著帶的引帶部分進行切割加工。因此,於接著帶的寬度為0.8mm以下的情況下,應用所述拾取帶尤其有用。 In addition, the width of the adhesive tape orthogonal to the longitudinal direction may be 0.8 mm or less. When the width of the adhesive tape is 0.8 mm or less, it is difficult to cut the tape portion of the adhesive tape in a state where the conventional lead tape is attached. Therefore, when the width of the adhesive tape is 0.8 mm or less, it is particularly useful to apply the pickup tape.
而且,本發明的一方面的接著帶捲繞捲筒包括:捲芯,纏繞有所述接著帶;以及一對側板,夾著捲芯而彼此相向,並且自捲芯引出的接著帶的引帶部分固定於側板的外表面側。 Further, a tape winding reel according to an aspect of the present invention includes: a core on which the tape is wound; and a pair of side plates facing each other with the core sandwiched therebetween, and a tape leader for the tape drawn out from the core Parts are fixed to the outer surface side of the side plate.
於此接著帶捲繞捲筒中,於接著帶中的引帶部分設有厚度10μm以上且30μm以下的拾取帶。藉由將拾取帶的厚度設為所述範圍,可相對地減小相對於接著帶的寬度的拾取帶的厚度。因此,能夠於貼附有拾取帶的狀態下藉由切割加工將接著帶切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分的前端側不露出第1接著層,所以可防止於使用時將引帶部分自捲筒等取下時第1接著層自第1離型件剝離。 In this adhesive tape winding reel, a pick-up tape having a thickness of 10 μm or more and 30 μm or less is provided in the tape leader portion of the adhesive tape. By making the thickness of a pick-up tape into the said range, the thickness of a pick-up tape with respect to the width|variety of a subsequent tape can be made relatively small. Therefore, the adhesive tape can be cut into a narrow width by the cutting process in the state where the pick-up tape is attached, and the simplification of the manufacturing process can be achieved. Furthermore, since the first adhesive layer is not exposed on the front end side of the tape leader, peeling of the first adhesive layer from the first release material can be prevented when the tape leader is removed from a reel or the like during use.
而且,本發明的一方面的接著帶的製造方法是於第1離型件的一面側設有第1接著層的接著帶的製造方法,其包括將接著帶自原材料抽出,並以使第1接著層變得不再露出的方式,將與原材料的寬度為相等寬度的、厚度10μm以上且30μm以下的拾取帶每隔一定的長度貼附於第1接著層;將貼附有拾取帶的接著帶沿長邊方向藉由切割加工切斷為多條接著帶;以及將多條接著帶與拾取帶一起沿寬度方向切斷而使引帶部分終止,之後將多條接著帶分別捲至捲筒。 Moreover, the manufacturing method of the adhesive tape which concerns on one aspect of this invention is the manufacturing method of the adhesive tape provided with the 1st adhesive layer on the one surface side of the 1st release material, which comprises pulling out the adhesive tape from the raw material, and making the 1st adhesive tape In such a way that the adhesive layer is no longer exposed, a pick-up tape with a width equal to the width of the raw material and a thickness of 10 μm or more and 30 μm or less is attached to the first adhesive layer at regular intervals; The tape is cut into a plurality of adhesive tapes by cutting along the longitudinal direction; and the plurality of adhesive tapes are cut in the width direction together with the pick-up tape to terminate the leading portion, and then the plurality of adhesive tapes are respectively wound onto reels .
於此接著帶的製造方法中,於引帶部分應用厚度10μm以上且30μm以下的拾取帶。藉由將拾取帶的厚度設為所述範圍,可相對地減小相對於接著帶的寬度的拾取帶的厚度。因此,能夠於貼附有拾取帶的狀態下藉由切割加工將接著帶切斷為窄寬度,從而實現製造步驟的簡化。而且,於所製作的接著帶中,於引帶部分的前端側不露出第1接著層,所以即便於將引帶部分固定於捲筒等的情況下,亦可防止於使用時將引帶部分自捲筒等取下時第1接著層自第1離型件剝離。 In this method of manufacturing an adhesive tape, a pick-up tape having a thickness of 10 μm or more and 30 μm or less is applied to the tape part. By making the thickness of a pick-up tape into the said range, the thickness of a pick-up tape with respect to the width|variety of a subsequent tape can be made relatively small. Therefore, the adhesive tape can be cut into a narrow width by the cutting process in the state where the pick-up tape is attached, and the simplification of the manufacturing process can be achieved. Furthermore, in the produced adhesive tape, since the first adhesive layer is not exposed on the front end side of the tape leader portion, even when the tape leader portion is fixed to a reel or the like, the tape leader portion can be prevented from being removed during use. When removing from a roll etc., a 1st adhesive layer peels from a 1st release material.
根據本發明,可簡化窄寬度的接著帶的製造步驟。 According to the present invention, the manufacturing steps of the narrow-width adhesive tape can be simplified.
1:接著帶捲繞捲筒 1: Then take the winding reel
2:捲芯 2: roll core
2a:中空部分 2a: hollow part
3:側板 3: side panel
4:肋條 4: Ribs
11、31、51、71:接著帶 11, 31, 51, 71: Next
12:離型件(第1離型件) 12: Release part (1st release part)
12a、22a:一面 12a, 22a: one side
12b、22b:另一面 12b, 22b: the other side
13:接著層(第1接著層) 13: Adhesion layer (the first adhesive layer)
21、41、61、81:拾取帶 21, 41, 61, 81: Pick up tape
22:離型件(第2離型件) 22: Release part (2nd release part)
23:接著層(第2接著層) 23: Then layer (2nd layer)
43:接著層(第3接著層) 43: Then layer (3rd layer)
63:接著層(第4接著層) 63: Then layer (4th layer)
101:製造裝置 101: Manufacturing device
102:抽出裝置 102: Extraction device
103:纏繞裝置 103: Winding device
104:加工裝置 104: Processing device
F1、F2:終止位置 F1, F2: end position
L:引帶部分 L: lead part
P:原材料 P: raw material
R:露出區域 R: exposed area
S:密封件 S: Seal
圖1為表示接著帶捲繞捲筒的一實施方式的側面圖。 FIG. 1 is a side view showing an embodiment of a tape winding reel.
圖2為表示接著帶的一實施方式的示意性的剖面圖。 FIG. 2 is a schematic cross-sectional view showing an embodiment of the adhesive tape.
圖3為表示接著帶的製造方法的一實施方式的示意性的圖。 FIG. 3 is a schematic diagram showing an embodiment of a method of manufacturing an adhesive tape.
圖4為表示接著帶的變形例的示意性的剖面圖。 4 is a schematic cross-sectional view showing a modification of the adhesive tape.
圖5為表示接著帶的其他變形例的示意性的剖面圖。 FIG. 5 is a schematic cross-sectional view showing another modification of the adhesive tape.
圖6為表示接著帶的其他變形例的示意性的剖面圖。 FIG. 6 is a schematic cross-sectional view showing another modification of the adhesive tape.
以下,參照圖示,對本發明的一方面的接著帶、接著帶捲繞捲筒和接著帶的製造方法的較佳的實施方式進行詳細說明。 Hereinafter, preferred embodiments of the adhesive tape, the adhesive tape winding reel, and the adhesive tape manufacturing method according to one aspect of the present invention will be described in detail with reference to the drawings.
圖1為表示接著帶捲繞捲筒的一實施方式的側面圖。如圖1所示,接著帶捲繞捲筒1包括:供纏繞接著帶11的捲芯2、及夾著捲芯2而彼此相向的一對側板3、3。接著帶捲繞捲筒1是接著帶11的製造、供給、保存中所使用的捲筒,具有藉由一對側板3、3來防止纏繞至捲芯2的接著帶11的捲崩塌的作用。
FIG. 1 is a side view showing an embodiment of a tape winding reel. As shown in FIG. 1 , the adhesive tape winding reel 1 includes a
捲芯2為纏繞接著帶11的部分。捲芯2例如包括塑膠,並呈與接著帶11的寬度相同的厚度的圓環狀。於本實施方式中,以使接著帶11的接著層13(參照圖2)朝向內側(捲芯2側)的方式將接著帶11纏繞至捲芯2。於捲芯2的中空部分2a能夠安裝例如供用於向接著帶捲繞捲筒1纏繞接著帶11的纏繞裝置或者用於自接著帶捲繞捲筒1抽出接著帶11的抽出裝置的旋轉軸插入的軸孔(未圖示)。藉由於將纏繞裝置或抽出裝置的旋轉軸插入至軸孔的狀態下使旋轉軸驅動,接著帶捲繞捲筒1進行旋轉而不會空轉。
The winding
側板3例如包括與捲芯2相同的塑膠,並呈圓板狀。側
板3的厚度例如為0.5mm~5.0mm,較佳為0.9mm~3.0mm,更佳為1.0mm~2.0mm。側板3的直徑根據纏繞至捲芯2的接著帶11的長度,以相對於捲芯2的直徑而成為足夠大的直徑的方式適當設定。於側板3的中央部分設有與捲芯2的中空部分2a連通的圓形的開口,以使所述軸孔的配置成為可能。
For example, the
於側板3的內表面設有自接著帶捲繞捲筒1的中心側朝周緣側呈放射狀延伸的多個肋條(rip)4。於圖1的示例中,以22.5°的相位角設有16根直線狀的肋條4。肋條4例如具有圓弧狀的剖面形狀,例如以0.05mm~1.00mm左右的範圍自側板3的內表面突出。藉由此種肋條4的配置,起到如下等效果:纏繞至捲芯2的接著帶11的捲崩塌的抑制、及對側板3的衝撞導致的接著帶11的接著層13(參照圖2)的剝落(黏連(blocking)現象)的抑制。
The inner surface of the
其次,對接著帶11進行詳細說明。
Next, the
圖2為表示接著帶的一實施方式的示意性的剖面圖。如圖2所示,接著帶11具有藉由離型件(第1離型件)12及形成於離型件12的一面12a側的接著層(第1接著層)13構成的雙層結構。於本實施方式中,關於接著帶11,例示了用於被連接構件間的連接的異向導電性帶。異向導電性帶是例如於將IC、LSI等半導體元件等連接於印刷配線基板、LCD用玻璃基板、可撓性印刷基板等各種基板時使用的接著帶。異向導電性帶可使相對的電極間導通,並保持鄰接的電極間的絕緣狀態。
FIG. 2 is a schematic cross-sectional view showing an embodiment of the adhesive tape. As shown in FIG. 2 , the
接著帶11的長度例如為10m以上且1000m以下。於本實施方式中,例如為300m。接著帶11藉由使用所述接著帶捲繞捲筒1,而以捲繞體的狀態得到保存及搬運。接著帶11的寬度例如為0.8mm以下,較佳為0.6mm以下。接著帶11的厚度(離型件12與接著層13的合計厚度)例如為5μm以上且100μm以下,較佳為10μm以上且40μm以下,更佳為10μm以上且20μm以下。
Next, the length of the
作為離型件12的材料,就接著帶11的強度及接著層13的剝離性的觀點而言,例如可使用延伸聚丙烯(oriented polypropylene,OPP)、聚對苯二甲酸乙二酯(Polyethylene terephthalate,PET)、聚萘二甲酸乙二酯、聚間苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚烯烴、聚乙酸酯、聚碳酸酯、聚苯硫醚、聚醯胺、乙烯-乙酸乙烯酯共聚物、聚氯乙烯、聚偏二氯乙烯、合成橡膠系、液晶聚合物等。
As the material of the
亦可對離型件12的另一面12b側實施脫模處理。作為進行脫模處理的脫模劑,例如可使用烯烴系脫模劑、乙二醇褐煤酸酯(ethylene glycol montanic acid ester)、棕櫚蠟(carnauba wax)、石油系蠟等低熔點蠟、低分子量氟樹脂、矽酮系或氟系的界面活性劑、油、蠟、樹脂、聚酯改質矽酮樹脂等矽酮樹脂等。一般而言,使用矽酮樹脂。
The mold release process may also be performed on the
作為接著層13的材料例如可使用包含熱塑性樹脂、熱硬化性樹脂、或者熱塑性樹脂與熱硬化性樹脂的混合系(混合樹
脂)等樹脂的接著劑。作為代表性的熱塑性樹脂,例如可列舉苯乙烯樹脂系、聚酯樹脂系。作為代表性的熱硬化性樹脂,例如可列舉:環氧樹脂系、丙烯酸樹脂系、矽酮樹脂系。
As the material of the
於接著帶11為異向導電性帶的情況下,接著帶13包括接著劑成分及視需要含有的導電粒子。作為接著劑成分,例如就可廣泛應用藉由熱或光而呈現硬化性的材料、並且連接後的耐熱性或耐濕性優異的觀點而言,較佳為使用交聯性材料。含有作為熱硬化性樹脂的環氧樹脂作為主成分的環氧系接著劑就可實現短時間硬化而連接作業性良好,且分子結構上接著性良好等特徵而言較佳。作為環氧系接著劑,例如可使用以如下者為主成分者:高分子量環氧樹脂、固體環氧樹脂或液狀環氧樹脂、或者利用胺基甲酸酯、聚酯、丙烯酸橡膠、丁腈橡膠(Nitrile Rubber,NBR)、合成線狀聚醯胺等將該些改質而成的環氧樹脂。環氧系接著劑通常為對構成主成分的所述環氧樹脂添加硬化劑、觸媒、偶合劑(coupling agent)、填充劑等而成者。
When the
作為導電粒子,例如可列舉:金(Au)、銀(Ag)、鉑(Pt)、鎳(Ni)、銅(Cu)、鎢(W)、銻(Sb)、錫(Sn)、焊料等金屬或者碳的粒子。而且,亦可使用如下的包覆粒子:以非導電性的玻璃、陶瓷(ceramic)、塑膠(plastic)等為核,且利用所述金屬或碳包覆所述核而成。就分散性及導電性的觀點而言,導電粒子的平均粒徑例如較佳為1μm以上且18μm以下。另外,亦可使用利用絕緣層包覆導電粒子而成的絕緣包覆粒子,就提升鄰 接的電極間的絕緣性的觀點而言亦可併用導電粒子與絕緣性粒子。 Examples of conductive particles include gold (Au), silver (Ag), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), antimony (Sb), tin (Sn), solder, and the like. Particles of metal or carbon. In addition, coated particles obtained by using non-conductive glass, ceramic, plastic, etc. as a core and coating the core with the metal or carbon can also be used. From the viewpoint of dispersibility and electrical conductivity, the average particle diameter of the conductive particles is preferably, for example, 1 μm or more and 18 μm or less. In addition, insulating coated particles in which conductive particles are coated with an insulating layer can also be used to improve adjacent From the viewpoint of the insulating properties between the electrodes to be connected, conductive particles and insulating particles may be used together.
於接著帶11的引帶部分L(自接著帶捲繞捲筒1的引出部分)設有拾取帶21(參照圖2)。拾取帶21如圖1所示,於將接著帶11纏繞至接著帶捲繞捲筒1的狀態下自側板3、側板3間引出,並藉由密封件S固定於其中一個側板3的外表面。使用接著帶11時,可於剝落密封件S後,藉由把持拾取帶21而將接著帶11自接著帶捲繞捲筒1引出。密封件S並無特別限制,可使用一般性的密封件。使用接著帶11時,亦可將引帶部分L與拾取帶21一起切斷。
A pick-up tape 21 (see FIG. 2 ) is provided at the lead-out portion L of the adhesive tape 11 (the lead-out portion from the adhesive tape winding reel 1 ). As shown in FIG. 1 , the pick-up
拾取帶21如圖2所示,具有藉由離型件(第2離型件)22及形成於離型件12的一面22a側的接著層(第2接著層)23構成的雙層結構。拾取帶21以接著層23與接著帶11側的接著層13相向的方式貼附於引帶部分L。而且,拾取帶21的終止位置F2與接著帶11的引帶部分L的終止位置F1一致。藉此,於接著帶11的引帶部分L中,接著層13藉由離型件12與拾取帶21夾持,接著層13不露出至外側。
As shown in FIG. 2 , the
拾取帶21的長度為與接著帶11的引帶部分L對應的長度,例如為30mm以上且300mm以下。而且,拾取帶21的寬度例如為0.8mm以下,較佳為0.6mm以下,為與接著帶11的寬度相等的寬度。拾取帶21的厚度(離型件22與接著層23的合計厚度)例如為10μm以上且30μm以下,較佳為10μm以上且20μm
以下。於拾取帶21的厚度不足10μm的情況下,考慮:向接著帶11貼附時拾取帶21捲曲(curl),而於接著層13、接著層23間產生氣泡。而且,於拾取帶21的厚度超過30μm的情況下,難以將拾取帶21切斷為與接著帶11相等的寬度。因此,若為所述厚度範圍,則可抑制氣泡的產生並容易地實施拾取帶21的切斷。
The length of the pick-up
作為離型件22的材料,與接著帶11的離型件12同樣地,例如可使用延伸聚丙烯(OPP)、聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯、聚間苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚烯烴、聚乙酸酯、聚碳酸酯、聚苯硫醚、聚醯胺、乙烯-乙酸乙烯酯共聚物、聚氯乙烯、聚偏二氯乙烯、合成橡膠系、液晶聚合物等。
As the material of the
作為接著層23的材料,例如可使用矽酮系黏著劑或者丙烯酸系黏著劑。若考慮顧客最終產品的規格上,要求包括接著層13以外的輔助材料在內不含矽酮(silicone free)的情況,則較佳為使用丙烯酸系黏著劑作為接著層23的材料。而且,就拾取帶21的可見性及識別性的提升的觀點而言,較佳為於接著層23著色有與接著帶11側的接著層13不同的色。接著層13、接著層23的色並無特別限制,作為一例可使接著帶11側的接著層13的色為無色透明,並使拾取帶21側的接著層23的色為藍色。而且,於對離型件12使用了白色PET的情況下,亦可就對比的關係而言,使拾取帶21的離型件22及接著層23的色為黑色。
As a material of the
繼而,對接著帶11的製造方法進行說明。
Next, the manufacturing method of the
圖3為表示接著帶的製造方法的一實施方式的示意性的圖。如圖3所示,於接著帶11的製造中使用製造裝置101。製造裝置101包括:抽出裝置102,纏繞有接著帶11的原材料P;纏繞裝置103,以能夠旋轉的方式安裝有多個接著帶捲繞捲筒1;以及加工裝置104,進行接著帶11的切割加工。
FIG. 3 is a schematic diagram showing an embodiment of a method of manufacturing an adhesive tape. As shown in FIG. 3 , the
自抽出裝置102以固定的速度自原材料P抽出接著帶11。針對自抽出裝置102抽出的接著帶11,每隔一定的長度貼附與原材料P的寬度為相等寬度的厚度10μm以上且30μm以下的大張的拾取帶21。此時,使拾取帶21的接著層23與接著帶11的接著層13相向。藉此,於貼附有拾取帶21的部分,接著帶11的接著層13變得不露出至外側。
The
貼附拾取帶21後,將接著帶11送至加工裝置104。然後,將貼附有拾取帶21的接著帶11沿長邊方向進行切割加工,切斷為寬度0.8mm以下的多條接著帶11。對接著帶11進行切割加工後,將多條接著帶11與拾取帶21一起沿寬度方向切斷,使引帶部分L終止(圖3中的A-A線)。藉此,成為接著帶11的引帶部分L的終止位置F1與拾取帶21的終止位置F2一致的狀態。
After the pick-up
使引帶部分L終止後,藉由纏繞裝置103將貼附有拾取帶21的多條接著帶11分別纏繞至接著帶捲繞捲筒1的捲芯2。然後,將引帶部分L自接著帶捲繞捲筒1的側板3、側板3間引出,並藉由密封件S固定於其中一個側板3的外表面。藉此,獲得如圖1所示纏繞至接著帶捲繞捲筒1的接著帶11。
After the tape leader portion L is terminated, the plurality of
如以上所說明般,於接著帶11中,於引帶部分L設有厚度10μm以上且30μm以下的拾取帶21。藉由將拾取帶21的厚度設為所述範圍,可相對地減小相對於接著帶11的寬度的拾取帶21的厚度。因此,能夠於貼附有拾取帶21的狀態下藉由切割加工將接著帶11切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分L的前端側不露出接著層13,所以即便於將引帶部分L固定於接著帶捲繞捲筒1的情況下,亦可防止於使用時將引帶部分L自接著帶捲繞捲筒1取下時接著層13自離型件12剝離。
As described above, in the
而且,於本實施方式中,拾取帶21於離型件22的一面22a側具有接著層23,以接著層23與接著帶11側的接著層13相向的方式固定於引帶部分L。藉此,可將拾取帶21牢固地固定於接著帶11。
Moreover, in this embodiment, the pick-up
而且,於本實施方式中,於拾取帶21側的接著層23著色有與接著帶11側的接著層13不同的色。藉此,可提高拾取帶21的可見性及識別性。因此,可提升使用接著帶11時對引帶部分L進行切斷的情況等的作業性。
Furthermore, in this embodiment, the
而且,於本實施方式中,接著帶11的與長邊方向正交的寬度為0.8mm以下。例如,於對接著帶11進行切割加工的加工裝置104中,使上刀與下刀重疊(lap)來進行接著帶11的切斷,但若切割寬度變窄,則上刀與下刀之間的間隙(clearance)亦變窄。因此,若切斷對象的厚度與寬度相比相對變大,則難以使刀通過切斷對象。關於此方面,例如藉由將上刀薄型化而能夠一定
程度上應對,但就刀的磨耗性等問題而言,上刀的薄型化亦有限度。根據所述情況,於接著帶的寬度為0.8mm以下的情況下,於貼附有先前般的引線帶的狀態下難以對接著帶的引帶部分進行切割加工。因此,於如本實施方式般接著帶11的寬度為0.8mm以下的情況下,對引帶部分L應用厚度10μm以上且30μm以下的拾取帶21尤其有用。
Moreover, in this embodiment, the width|variety orthogonal to the longitudinal direction of the
接著帶可採用各種變形。圖4為表示接著帶的變形例的示意性的剖面圖。於圖4所示的接著帶31中,引帶部分L中所設的拾取帶41的構成與所述實施方式不同。具體而言,拾取帶41具有藉由離型件(第2離型件)22、形成於離型件22的一面22a側的接著層(第2接著層)23及形成於離型件22的另一面22b側的接著層(第3接著層)43構成的三層結構。拾取帶41的厚度(離型件22、接著層23與接著層43的合計厚度)例如為10μm以上且30μm以下,較佳為10μm以上且20μm以下。
The straps can then take various modifications. 4 is a schematic cross-sectional view showing a modification of the adhesive tape. In the
接著層43例如包括與接著層23相同的材料。接著層43亦可與接著層23同樣地,著色有與接著帶31側的接著層13不同的色。於接著帶31中,拾取帶41的終止位置F2與接著帶31的引帶部分L的終止位置F1一致,但於引帶部分L的終止側設有離型件22的另一面22b自接著層43露出的露出區域R。自終止位置F2起的露出區域R的長度例如為5mm以上且不足30mm。
The
即便於此種接著帶31中,亦能夠於貼附有拾取帶41的狀態下藉由切割加工將接著帶31切斷為窄寬度,從而實現製造步
驟的簡化。而且,於引帶部分L的前端側不露出接著層13,所以即便於將引帶部分L固定於接著帶捲繞捲筒1的情況下,亦可防止於使用時將引帶部分L自接著帶捲繞捲筒1取下時接著層13自離型件12剝離。
Even in such an
而且,於接著帶31中,可藉由接著層43將引帶部分L固定於接著帶捲繞捲筒1而不另外使用密封件S(參照圖1)。而且,藉由於引帶部分L的終止側設置露出區域R,露出區域R成為將引帶部分L自接著帶捲繞捲筒1剝落時的把持部,從而可於使用時容易地將引帶部分L自接著帶捲繞捲筒1取下。
Furthermore, in the
圖5為表示接著帶的另一變形例的示意性的剖面圖。於圖5所示的接著帶51中,引帶部分L中所設的拾取帶61的構成與所述實施方式進而不同。具體而言,拾取帶61具有藉由離型件(第2離型件)22及形成於離型件22的另一面22b側的接著層(第4接著層)63構成的雙層結構。拾取帶61藉由將離型件22的一面22a側直接貼附於接著帶51側的接著層13,而固定於接著帶51。拾取帶61的厚度(離型件22與接著層63的合計厚度)例如為10μm以上且30μm以下,較佳為10μm以上且20μm以下。
FIG. 5 is a schematic cross-sectional view showing another modification of the adhesive tape. In the
接著層63例如具有與接著層23(參照圖2)相同的構成。即,接著層63包括與接著層23相同的材料。而且,於接著層63著色有與接著帶51側的接著層13不同的色。拾取帶61的終止位置F2與接著帶51的引帶部分L的終止位置F1一致,但於引帶部分L的終止側設有離型件22的另一面22b自接著層63露
出的露出區域R。自終止位置F2起的露出區域R的長度例如為5mm以上且不足30mm。
The
即便於此種接著帶51中,亦能夠於貼附有拾取帶61的狀態下藉由切割加工將接著帶51切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分L的前端側不露出接著層13,所以即便於將引帶部分L固定於接著帶捲繞捲筒1的情況下,亦可防止於使用時將引帶部分L自接著帶捲繞捲筒1取下時接著層13自離型件12剝離。
Even in such an
而且,於接著帶51中,可藉由接著層63將引帶部分L固定於接著帶捲繞捲筒1而不另外使用密封件S(參照圖1)。而且,藉由於引帶部分L的終止側設置露出區域R,露出區域R成為將引帶部分L自接著帶捲繞捲筒1剝落時的把持部,從而可於使用時容易地將引帶部分L自接著帶捲繞捲筒1取下。進而,於接著帶51中,於拾取帶61的離型件22的一面22a側未設置接著層,藉此可抑制包括拾取帶61在內的引帶部分L的整體的厚度。因此,可進一步切實地實施於貼附有拾取帶61的狀態下的切割加工。
Furthermore, in the
圖6為表示接著帶的另一變形例的示意性的剖面圖。於圖6所示的接著帶71中,引帶部分L中所設的拾取帶81的構成與所述實施方式進而不同。具體而言,拾取帶81為僅具有離型件(第2離型件)22的單層結構。拾取帶81藉由將離型件22的一面22a側直接貼附於接著帶71側的接著層13,而固定於接著帶
71。於將此接著帶71的引帶部分L固定於接著帶捲繞捲筒1的情況下,與圖1時同樣地使用密封件S即可。拾取帶81的厚度(離型件22的厚度)例如為10μm以上且30μm以下,較佳為10μm以上且20μm以下。
6 is a schematic cross-sectional view showing another modification of the adhesive tape. In the
即便於此種接著帶71中,亦能夠於貼附有拾取帶81的狀態下藉由切割加工將接著帶71切斷為窄寬度,從而實現製造步驟的簡化。而且,於引帶部分L的前端側不露出接著層13,所以即便於將引帶部分L固定於接著帶捲繞捲筒1的情況下,亦可防止於使用時將引帶部分L自接著帶捲繞捲筒1取下時接著層13自離型件12剝離。而且,於接著帶71中,拾取帶81成為僅包括離型件22的單層結構,所以可進一步抑制包括拾取帶81在內的引帶部分L的整體的厚度。因此,可更切實地實施於貼附有拾取帶81的狀態下的切割加工。
Even in such an
11:接著帶 11: Then bring
12:離型件(第1離型件) 12: Release part (1st release part)
12a、22a:一面 12a, 22a: one side
12b:另一面 12b: The other side
13:接著層(第1接著層) 13: Adhesion layer (the first adhesive layer)
21:拾取帶 21: Pickup Tape
22:離型件(第2離型件) 22: Release part (2nd release part)
23:接著層(第2接著層) 23: Then layer (2nd layer)
F1、F2:終止位置 F1, F2: end position
L:引帶部分 L: lead part
Claims (4)
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JP (1) | JP7180606B2 (en) |
KR (1) | KR102534610B1 (en) |
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- 2018-09-27 KR KR1020207009453A patent/KR102534610B1/en active IP Right Grant
- 2018-09-27 WO PCT/JP2018/036045 patent/WO2019065881A1/en active Application Filing
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JP2001279198A (en) * | 2000-01-28 | 2001-10-10 | Nitto Denko Hoso System Kk | Pressure sensitive adhesive tape |
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WO2019065881A1 (en) | 2019-04-04 |
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CN111133069B (en) | 2023-01-10 |
JP7180606B2 (en) | 2022-11-30 |
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JPWO2019065881A1 (en) | 2020-10-22 |
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