KR102286222B1 - Adhesive tape structure and adhesive tape container - Google Patents

Abstract

An object of the present invention is to provide a technique capable of achieving significant lengthening of an adhesive tape, without changing an existing fabric or an adhesive application mechanism. The present invention is an adhesive tape structure (1) in which a plurality of adhesive tapes (2) are connected via a connecting tape (3). The end of the base film 20 of the adhesive tape 2 and the connecting base material of the connecting tape 3 ( While the end of 30 is adhered by the base-side adhesive member 41 , the release cover film 22 of the adhesive tape 2 and the release film 32 of the connecting tape 3 are integrally formed in the tape longitudinal direction. The end portion of the release cover film 22 and the end portion of the release film 32 are adhered to each other by a release-side adhesive member 42 so as to be peeled off. The type of the base resin of the adhesive layer 45A of the substrate-side adhesive member 41 is different from the type of the base resin of the adhesive layer 46B of the peeling-side adhesive member 42 .

Description

Adhesive tape structure and adhesive tape container TECHNICAL FIELD

TECHNICAL FIELD The present invention relates to a technique for making an adhesive tape elongate, such as for joining a tab wire of a solar cell.

DESCRIPTION OF RELATED ART Conventionally, the elongate adhesive tape for bonding various electronic components etc. is known.

Such an adhesive tape is formed on a long release sheet with a narrow width, and is shipped in a form wound up in rolls on a reel.

And in a manufacturing site, an adhesive tape is taken out from a reel and used, and when an adhesive tape is used up, a manufacturing line is temporarily stopped and the adhesive tape is exchanged for every reel.

However, when the length of an adhesive tape is short, it will be necessary to stop a manufacturing line every time a reel is replaced, and production efficiency will be reduced.

Therefore, in recent years, what is called "lengthening" which makes the length of the adhesive tape which can be wound around one reel as long as possible is desired.

However, if the adhesive tape is to be lengthened, it is necessary to take measures such as lengthening the length of the fabric to which the adhesive is applied, or enlarging the unwinding/winding part of the application mechanism, and the coating thickness of the adhesive tape is not uniformly controlled. It had to be done, and there was a limit to the extensive lengthening.

Further, as prior art documents related to the present invention, there are, for example, those shown below.

Japanese Patent Laid-Open No. 2011-52061

The present invention has been made in consideration of such prior technical problems, and its object is to provide a technology capable of achieving a significant lengthening of the adhesive tape without changing the existing fabric or adhesive application mechanism. is to provide

The present invention made to achieve the above object is an adhesive tape structure in which a plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially installed on a base film are connected via a connection tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate and, in a state where a predetermined distance is left between the end of the adhesive tape and the end of the connecting tape, the end of the base film of the adhesive tape and the end of the connecting base of the connecting tape are adhered by the base-side adhesive member and an end of the release cover film and an end of the release film are adhered by a release-side adhesive member such that the release cover film of the adhesive tape and the release film of the connecting tape are integrally peeled in the tape longitudinal direction, It is an adhesive tape structure from which the type of the base resin of the adhesive layer of the base material side adhesive member differs from the type of the base resin of the adhesive layer of the said peeling side adhesive member.

In addition, the present invention is an adhesive tape structure in which a plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially installed on a base film are connected via a connection tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate, the adhesive tape In a state where there is a predetermined gap between the end of the connecting tape and the end of the connecting tape, the end of the base film of the adhesive tape and the end of the connecting base of the connecting tape are adhered by the base-side adhesive member, and the bonding The end of the release cover film and the end of the release film are adhered by a release-side adhesive member so that the release cover film of the tape and the release film of the connecting tape are integrally peeled in the tape longitudinal direction, and It is an adhesive tape structure from which the thickness of an adhesive layer differs from the thickness of the adhesive layer of the said peeling side adhesive member.

In this invention, it is effective also when the thickness of the adhesive layer of the said base material side adhesive member differs from the thickness of the adhesive layer of the said peeling side adhesive member.

In this invention, it is effective also when the thickness of the adhesive layer of the said peeling side adhesive member is thinner than the thickness of the adhesive layer of the said base-material side adhesive member.

In the present invention, it is effective even when the ratio of the thickness of the adhesive layer of the peeling-side adhesive member to the thickness of the adhesive layer of the substrate-side adhesive member is smaller than 50/100.

In the present invention, it is also effective when the connecting base material of the connecting tape contains a non-transmissive material.

On the other hand, this invention is an adhesive tape receiver in which any of the adhesive tape structures mentioned above is wound by traverse winding on the reel member which has a flange spacing wider than the tape width|variety of the said adhesive tape structure.

The adhesive tape structure of the present invention comprises an end of a base film of the adhesive tape and an end of a connecting base of the connecting tape are adhered by a base-side adhesive member, and an end of a release cover film of the adhesive tape and a release film of the connecting tape. The basic configuration and function of the adhesive tape are the same as those of the conventional one, in that the ends are adhered by the peel-side adhesive member and the release cover film and the release film are integrally peeled off, and an existing attachment device is used. Thus, the adhesive can be continuously attached to the adherend.

As a result, according to the present invention, it is possible to achieve a significant lengthening of the adhesive tape without changing the existing fabric or the application mechanism of the adhesive.

Furthermore, according to the present invention, since the type of the base resin of the pressure-sensitive adhesive layer of the substrate-side adhesive member is different from the type of the base resin of the pressure-sensitive adhesive layer of the release-side adhesive member, the release film is removed from the pressure-sensitive adhesive layer at the end of the connecting tape. When peeling, when peeling the peeling cover film from the adhesive layer at the end of the adhesive tape, even when the adhesive layer of the peeling-side adhesive member comes into contact with the adhesive layer of the base-side adhesive member, the adhesives are prevented from sticking together and the peeling film and the peeling cover film can be peeled off smoothly.

In the present invention, when the thickness of the adhesive layer of the substrate-side adhesive member is different from the thickness of the adhesive layer of the release-side adhesive member, for example, the thickness of the adhesive layer of the peeling-side adhesive member is the adhesion of the substrate-side adhesive member. If it is configured to be thinner than the thickness of the layer, compared with the case where the thickness of the adhesive layer of the peeling-side adhesive member is equal to the thickness of the adhesive layer of the adhesive layer on the substrate side, the adhesive force between these adhesive layers can be reduced, so When the release film is peeled off from the adhesive layer at the end of the tape, and when the release cover film is peeled off from the adhesive layer at the end of the adhesive tape, the adhesive layer of the substrate-side adhesive member and the adhesive layer of the release-side adhesive member Even when it contacts, adhesion|attachment of these adhesive layers can be prevented reliably, and a peeling film can be peeled off smoothly.

In this case, if the ratio of the thickness of the adhesive layer of the peeling-side adhesive member to the thickness of the adhesive layer of the substrate-side adhesive member is configured to be smaller than 50/100, the adhesive layer of the peeling-side adhesive member adheres to the adhesive on the substrate side. Since adhesion to the layer is more reliably avoided, the release film and the release cover film can be peeled off more smoothly.

In the present invention, when the connecting substrate of the connecting tape contains a non-transmissive material, the connecting substrate can be detected by the optical sensor, whereby the adhesive is continuously applied to the adherend while skipping the portion of the connecting tape. can be attached

On the other hand, according to the adhesive tape receptor of the present invention in which the above-described adhesive tape structure is wound by traverse winding on a reel having a flange spacing wider than the tape width of the adhesive tape structure, a very long adhesive tape structure is wound smoothly Therefore, in the step of attaching the adhesive tape, it is not necessary to frequently replace the reels, and the production efficiency can be significantly improved.

[FIG. 1] (a): a side configuration diagram of an embodiment of the adhesive tape structure according to the present invention
(b): Side view showing the main part of the copper adhesive tape structure
Fig. 2 is a diagram for explaining the step of thermocompressing the adhesive layer of the adhesive tape to the adherend using the adhesive tape structure of the present embodiment
Fig. 3 (a) (b): explanatory view showing a state in which the release cover film of the adhesive tape and the release film of the connecting tape are peeled from the adhesive tape structure
[FIG. 4] (a) (b): explanatory drawing for showing the subject of the present invention
[FIG. 5] (a) to (c): side views showing main parts of an embodiment of the present invention
[FIG. 6] A side view showing the main part of another embodiment of the present invention
[Fig. 7] A side view showing the main part of another embodiment of the present invention
Fig. 8 (a): a front view showing the configuration of an embodiment of an adhesive tape container according to the present invention;
(b) (c): explanatory diagram showing the spacing of the adhesive film wound around the core shaft portion of the reel member

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail with reference to drawings.

Fig.1 (a) is a side view which shows the basic structure of embodiment of the adhesive tape structure which concerns on this invention, (b) is a side view which shows the principal part of the same adhesive tape structure.

In the adhesive tape structure 1 of this embodiment, a plurality of adhesive tapes 2 are a series of elongated ones in which a plurality of adhesive tapes 2 are respectively connected in a straight line via a connecting tape 3 .

Here, each of the adhesive tapes 2 has the same configuration, and has a so-called three-layer structure in which an adhesive layer 21 and a release cover film 22 are sequentially provided on the entire surface on a base film 20 .

On the other hand, each of the connecting tapes 3 has the same configuration, and has a so-called three-layer structure in which the pressure-sensitive adhesive layer 31 and the release film 32 are sequentially provided on the entire surface on the connecting substrate 30 .

In the case of this embodiment, the connecting tape 3 is comprised so that the length may become shorter than the adhesive tape 2 . In addition, the length of each adhesive tape 2 and the length of each connection tape 3 may be the same or different, respectively.

The upper surface of the end of the base film 20 of the adhesive tape 2 (the surface opposite to the adhesive layer 21), and the upper surface of the end of the connecting base 30 of the connecting tape 3 (the pressure-sensitive adhesive layer 31) the opposite side) are adhesively connected to each other by the substrate-side adhesive member 41 .

Further, the upper surface of the end portion of the release cover film 22 of the adhesive tape 2 (the surface opposite to the adhesive layer 21), and the upper surface of the end portion of the release film 32 of the connecting tape 3 (the adhesive layer ( 31) are adhered to each other by a peeling-side adhesive member 42 .

The base film 20 of the adhesive tape 2 can use a thing containing PET, for example.

Although the thickness of this base film 20 is not specifically limited, From a viewpoint of ensuring material strength and not enlarging a winding diameter, a thing of 10-100 micrometers can be used suitably.

In addition, although the width|variety of the base film 20 is not specifically limited, From a viewpoint of covering various electronic components reliably, the thing of 200-5000 micrometers can be used suitably.

In addition, the upper surface of the base film 20 can also perform peeling processing by a silicone resin, for example.

For the adhesive layer 21 of the adhesive tape 2, a resin used for an adhesive of an ordinary adhesive tape, particularly a thermosetting resin (eg, an epoxy-based resin, a phenoxy-based resin, a urethane-based resin, etc.) can be used.

Although the thickness of this adhesive bond layer 21 is not specifically limited, From a viewpoint of reliably connecting the terminal with nonuniformity to the height of various electronic components, it is more preferable to set to 10-100 micrometers.

The peeling cover film 22 of the adhesive tape 2 protects the adhesive bond layer 21, and peels at the time of use.

As this peeling cover film 22, a thing containing PET can be used, for example.

In the case of this invention, although the thickness of the peeling cover film 22 is not specifically limited, From a viewpoint of ensuring material strength and not increasing a winding diameter, it is more preferable to set to 10-100 micrometers.

Incorporating the above, the preferred thickness of the adhesive tape 2 is 30 to 300 mu m.

On the other hand, the length of the adhesive tape 2 described above is not particularly limited, but considering that the number of skips when using the adhesive tape structure 1 is reduced and the maximum application length of the application equipment of the adhesive tape 2 is considered , a thing of 50 to 1000 m can be used suitably.

In addition, as the connecting base material 30 of the connecting tape 3, the thing containing the non-transmissive material detectable by an optical sensor can be used.

As such a connection base material 30, what disperse|distributed the black filler (filler), for example in resin containing PET can be used.

The thickness of the connecting substrate 30 is not particularly limited, but from the viewpoint of preventing a step difference during winding by ensuring a thickness equivalent to that of the base film 20 of the adhesive tape 2, 10 to 100 μm can be used appropriately.

On the other hand, the width of the connecting substrate 30 is not particularly limited, but is equal to the width of the base film 20 of the adhesive tape 2 from the viewpoint of smoothly winding, pulling out, and running the adhesive tape structure 1 . It is desirable to set it so that

The pressure-sensitive adhesive layer 31 of the connecting tape 3 is for smoothly peeling the release film 32 of the connecting tape 3 .

That is, as will be described later, the release film 32 of the connecting tape 3 is peeled off together with the release cover film 22 of the adhesive tape 2 , and is connected to the release film 32 of the connecting tape 3 . If the adhesive substance does not exist between the base material 30 and the peeling film 32, since the speed temporarily increases when peeling, there exists a possibility that a shift|offset|difference in the conveyance speed of a manufacturing line may arise.

In addition, if there is no adhesive substance between the release film 32 of the connecting tape 3 and the connecting substrate 30, meandering (cutting) at the time of slitting (cutting) in manufacturing the adhesive tape structure 1蛇行) occurs, and there is a fear that the tape may be wrinkled or the tape may break.

The pressure-sensitive adhesive layer 31 of the present invention is to prevent such a problem.

Considering this purpose, the peel force of the adhesive layer 31 and the release film 32 of the connecting tape 3 is 0.2 of the peel force of the adhesive layer 21 and the release cover film 22 of the adhesive tape 2 . It is more preferable to comprise so that it may become more than twice and not more than 2.0 times.

Here, the "peel force" can be measured by performing a T-type peeling test at a peeling rate of 300 mm/min, using TENSILON manufactured by Orientec Co., Ltd. as a tensile testing machine in accordance with JIS K 6854-3. .

When the peeling force of the adhesive layer 31 of the connecting tape 3 and the peeling film 32 is less than 0.2 times the peeling force of the adhesive layer 21 of the adhesive tape 2 and the peeling cover film 22, the peeling There exists a possibility that the shift|offset|difference of the conveyance speed of a production line by the speed increase at the time of peeling the film 32, generation|occurrence|production of the wrinkle of the tape by the meandering at the time of a slit, or a breakage of a tape may generate|occur|produce.

On the other hand, when the peeling force of the adhesive layer 31 of the connecting tape 3 and the release film 32 is greater than 2.0 times the peeling force of the adhesive layer 21 of the adhesive tape 2 and the release cover film 22, There exists a possibility that the peeling film 32 may not peel smoothly from the adhesive layer 31 of the connection tape 3 .

As long as the above conditions are satisfied, the adhesive layer 31 of the connecting tape 3 may use any resin having the same composition or a different composition from the adhesive layer 21 of the adhesive tape 2 . Moreover, as resin which differs in composition from the adhesive bond layer 21 of the adhesive tape 2, silicone type resin is mentioned, for example.

In addition, the thickness of the pressure-sensitive adhesive layer 31 for satisfying the above-described conditions may be set to 10 to 100 µm.

On the other hand, since the pressure-sensitive adhesive layer 31 of the connecting tape 3 is not inherently transferred to the adherend and is a skipped portion, only the portion of the pressure-sensitive adhesive layer 31 is a non-cured resin or cured resin. By using it, storage stability can be improved.

Moreover, when the adhesive bond layer 21 of the adhesive tape 2 is using an expensive filler etc., for example, manufacturing cost can be suppressed by forming the adhesive layer 31 with a comparatively inexpensive material.

In the case of the present invention, the pressure-sensitive adhesive layer 31 may be made of a light-transmitting material.

That is, as described above, by configuring the connecting substrate 30 of the connecting tape 3 with a non-transmissive material, the connecting substrate 30 of the connecting tape 3 can be detected by the optical sensor, but the optical sensor When it is located on the side of the pressure-sensitive adhesive layer 31 , the light is blocked by the pressure-sensitive adhesive layer 31 , so that the connecting base material 30 cannot be detected in some cases.

Therefore, in such a case, the connection base material 30 can be detected by the optical sensor through the adhesive layer 31 by comprising the adhesive layer 31 of the connection tape 3 with a light-transmissive material.

Although not particularly limited in the case of the present invention, from the viewpoint of reliably detecting the connecting substrate 30 by the optical sensor through the pressure-sensitive adhesive layer 31, the pressure-sensitive adhesive layer 31, the transmittance of visible light (light transmittance) It is more preferable to comprise so that it may become this 70% or more.

The release film 32 of the connecting tape 3 protects the pressure-sensitive adhesive layer 31 and is peeled off during use.

As this peeling film 32, a thing containing PET can be used, for example.

In the case of the present invention, the thickness of the release film 32 is not particularly limited, but from the viewpoint of preventing a step difference during winding by ensuring a thickness equal to that of the release cover film 22 of the adhesive tape 2 , , more preferably set to 10 to 100 µm.

Incorporating the above, the preferable thickness of the connecting tape 3 is 30 to 300 mu m, and it is preferable to use one having a thickness equivalent to that of the adhesive tape 2 .

On the other hand, the length of the above-described connecting tape 3 is not particularly limited, but it is more preferable to set it to 5 to 100 cm from the viewpoint of enabling sensing by an optical sensor and not reducing the transport speed of the line as much as possible. .

The base material-side adhesive member 41 connects the end of the base film 20 of the adhesive tape 2 and the end of the connecting base 30 of the connecting tape 3 by the adhesive layer 45 provided on the base 43 . to be firmly attached.

On the other hand, the peeling-side adhesive member 42 is connected to the end of the peeling cover film 22 of the adhesive tape 2 and the peeling film 32 of the connecting tape 3 by the adhesive layer 46 provided on the base 44 . to firmly bond the ends of

Moreover, in the case of this invention, the edge part of the adhesive tape 2 and the edge part of the connection tape 3 are provided with a slight clearance gap so that it may mention later.

And the adhesive tape structure 1 of this invention is obtained by respectively connecting two or more of the adhesive tapes 2 mentioned above with the connection tape 3 mentioned above.

2 is a view for explaining a step of thermocompressing an adhesive layer of an adhesive tape to an adherend using the adhesive tape structure of the present embodiment. It is explanatory drawing which shows the state which peels a peeling cover film and the peeling film of a connection tape.

As shown in FIG. 2 , in the present embodiment, the adhesive tape structure 1 is taken out from the roll 1A of the adhesive tape structure 1 wound on the reel member 10 , and the take-out roller 11 is interposed therebetween. The direction is changed, and the peeling cover film 22 of the adhesive tape 2 and the peeling film 32 of the connecting tape 3 mentioned above are peeled by the peeling roller 12.

Here, the peeling cover film 22 of the adhesive tape 2 is peeled off from the adhesive layer 21 by the operation of the peeling roller 12 , but the peeling cover film 22 is removed by the peeling-side adhesive member 42 . Since it is adhered to the release film 32 of the connecting tape 3, the release cover film 22 of the adhesive tape 2 and the release film 32 of the connecting tape 3 are integrally detached ( 3 (a) (b)).

Thereafter, the adhesive tape structure 1 is conveyed by the rollers 13 to 15, and the portion to be thermocompressed of the adhesive tape structure 1 is placed between the thermocompression head 16 and the adherend 17. and the thermocompression head 16 is operated at that position to transfer the adhesive layer 21 of the adhesive tape 2 to the adherend 17 .

At this time, the presence or absence of the non-transmissive connecting substrate 30 of the connecting tape 3 is detected by the optical sensor 5, and when the connecting substrate 30 is detected, the connecting tape 3 is attached to the thermocompression head ( The conveyance of the adhesive tape structure 1 is controlled so that it is not located between the 16) and the adherend 17, that is, the pressure-sensitive adhesive layer 31 of the connecting tape 3 is not transferred to the adherend 17. .

In the present invention, as described above, by configuring the pressure-sensitive adhesive layer 31 of the connecting tape 3 with a light-transmitting material, the optical sensor 5 is located on the connecting substrate 30 side of the connecting tape 3 . In addition to the case, when the optical sensor 5 is located on the adhesive layer 31 side of the connection tape 3 , the connection substrate 30 is detected by the optical sensor 5 through the adhesive layer 31 . can do.

And after completion|finish of such a thermocompression-bonding process, the direction of the adhesive tape structure body 1 is changed by the guide roller 18, and it is conveyed, and the adhesive tape structure 1 is wound up by the winding-up apparatus 19. As shown in FIG.

In this case, in this embodiment, since the adhesive layer 31 of the connecting tape 3 is not transferred to the to-be-adhered body 17, when winding up the adhesive tape structure 1 with the winding device 19, adhesion|attachment When the pressure-sensitive adhesive layer 31 remaining on the tape structure 1 contacts the guide roller 18 , there is a risk of electrodeposition.

In this invention, in order to prevent such a problem, what is necessary is just to adjust so that the tack|tack force with respect to the guide roller 18 of the adhesive layer 31 of the connection tape 3 may become 200 gf/5 mmphi or less.

In this case, as the guide roller 18, one made of a silicone resin may be used, or one in which the surface of the guide roller 18 is processed with a releasable resin such as a silicone resin or polytetrafluoroethylene resin may be used.

4(a)(b) is explanatory drawing for showing the subject of this invention.

As described above, in the present invention, a slight gap is provided between the end of the adhesive tape 2 and the end of the connecting tape 3 (see Fig. 4(a)).

The reason for this is that when the end of the adhesive tape 2 and the end of the connecting tape 3 are overlapped and adhesively connected by the peeling-side adhesive member 42, the adhesive tape 2 is connected to the release cover film 22 of the adhesive tape 2 It is difficult to peel the peeling film 32 of the tape 3 integrally smoothly, and the margin at the time of manufacturing the adhesive tape structure 1 is considered.

In this way, since a slight gap is provided between the end of the adhesive tape 2 and the end of the connecting tape 3 , the release film 32 is removed from the pressure-sensitive adhesive layer 31 at the end of the connecting tape 3 . At the time of peeling, and when peeling the peeling cover film 22 from the adhesive bond layer 21 in the edge part of the adhesive tape 2, the adhesive layer 46 of the peeling side adhesive member 42 is the base material side adhesive member. The adhesive layers 45 and 46 adhere to each other by contacting the adhesive layer 45 of (41), and as a result, the release film 32 may not be able to be peeled off (refer FIG.4(b)).

Therefore, in this invention, it is trying to solve this subject as follows.

Fig. 5 (a) to (c), Fig. 6 and Fig. 7 are side views showing the main part of the embodiment of the present invention.

In the embodiment shown in FIGS. 5A to 5C , the type of the base resin (eg, silicone-based resin) of the adhesive layer 45A of the substrate-side adhesive member 41 and the peeling-side adhesive member 42 are A different kind of base resin (for example, acrylic resin) is used for the adhesive layer 46B.

On the other hand, in the case of this invention, as mentioned above, the thickness of the preferable adhesive tape 2 is 30-300 micrometers, and the thickness of the preferable connection tape 3 is 30-300 micrometers.

In addition, when these adhesive tapes 2 and the connecting tape 3 are connected using the base material side adhesive member 41 and the peeling side adhesive member 42, as described above, the release cover of the adhesive tape 2 is In consideration of the smooth and integral peeling of the film 22 and the release film 32 of the connecting tape 3 , and the margin at the time of manufacturing the adhesive tape structure 1 , the It is more preferable to set the clearance gap W between the edge part and the edge part of the connecting tape 3 to 10-1000 micrometers.

In addition, in the case of this embodiment, as shown to Fig.5 (a), the thickness of the adhesive layer 45A of the base-material side adhesive member 41, and the adhesive layer 46B of the peeling side adhesive member 42 The thickness is equal.

Although it does not specifically limit as the base material side adhesive member 41 under these conditions, From a viewpoint of ensuring the required adhesive force, it is more preferable to use the thing whose thickness of adhesive layer 45A is 40 micrometers or more.

On the other hand, although it does not specifically limit as the peeling side adhesive member 42, From a viewpoint of ensuring the required adhesive force, it is more preferable to use the thing whose thickness of the adhesive layer 46B is 40 micrometers or more.

In addition, the length of the substrate-side adhesive member 41 is not particularly limited, but it has an adhesive force that securely connects the adhesive tape 2 and the connecting tape 3 and makes workability at the time of bonding as easy as possible. From a viewpoint, it is more preferable to set to 1-10 cm.

On the other hand, the length of the peeling-side adhesive member 42 is not particularly limited, but it has an adhesive force that reliably connects the adhesive tape 2 and the connecting tape 3 and makes workability at the time of bonding as easy as possible. From a viewpoint, it is more preferable to set to 1-10 cm.

According to the present embodiment having such a configuration, the type of the base resin of the adhesive layer 45A of the substrate-side adhesive member 41 and the type of the base resin of the adhesive layer 46B of the peeling-side adhesive member 42 are From a different point, for example, when peeling the peeling film 32 from the adhesive layer 31 in the edge part of the connection tape 3, the adhesive layer 46B of the peeling side adhesive member 42 is a base material side adhesive member. Even when in contact with the adhesive layer 45A of (41), adhesion of the adhesive layers 45A, 46B is prevented, and the release film 32 can be peeled off smoothly (FIG. 5(b)(c)) ) reference).

Similarly, when the peeling cover film 22 is peeled off from the adhesive layer 21 at the end of the adhesive tape 2, the adhesive layer 46B of the peeling-side adhesive member 42 is applied to the substrate-side adhesive member 41. ), adhesion between the adhesive layers 45A and 46B can be prevented, and the release cover film 22 can be peeled off smoothly.

6 shows another embodiment of the present invention.

As shown in Fig. 6, in the case of this embodiment, in the embodiment shown in Figs. 5 (a) to (c) described above, the thickness of the adhesive layer 45A of the substrate-side adhesive member 41, The thickness of the adhesive layer 46B of the peeling-side adhesive member 42 is different.

In this case, the thickness of the adhesive layer 46B of the peeling-side adhesive member 42 is configured to be smaller than the thickness of the adhesive layer 45A of the base-side adhesive member 41 .

Although it does not specifically limit in the case of this invention, When peeling the peeling film 32 of the connecting tape 3 from the adhesive layer 31, and the peeling cover film 22 of the adhesive tape 2, an adhesive bond layer From the viewpoint of more reliably avoiding adhesion of the adhesive layer 46B of the peeling-side adhesive member 42 to the adhesive layer 45A of the base-side adhesive member 41 when peeling from (21), peel-side adhesiveness It is more preferable to set so that the ratio with respect to the thickness of the adhesive layer 45A of the base-material side adhesive member 41 of the thickness of the adhesive layer 46B of the member 42 may become smaller than 50/100.

Specifically, in the dimensional relationship described above, it is preferable to set the thickness of the adhesive layer 46B of the peeling-side adhesive member 42 to 5 to 20 µm in consideration of the required adhesive force.

According to this embodiment having such a structure, the thickness of the adhesive layer 46B of the peeling-side adhesive member 42 is configured to be thinner than the thickness of the adhesive layer 45A of the base-side adhesive member 41, and the adhesive Since the adhesive force between the adhesive layer 45A and the adhesive layer 46B can be made small compared with the case where the thickness of the layer 46B is formed equal to the thickness of the adhesive layer 45A, for example, a connection tape When the peeling film 32 is peeled off from the adhesive layer 31 in the edge part of (3), even when the adhesive layer 45A and the adhesive layer 46B contact, adhesion of the adhesive layers 45A, 46B comrades can be reliably prevented, and the release film 32 can be removed more smoothly.

In addition, for the same reason, when peeling the peeling cover film 22 from the adhesive bond layer 21 in the edge part of the adhesive tape 2, the adhesive layer 46B of the peeling side adhesive member 42 is the base material side. Even when it comes into contact with the adhesive layer 45A of the adhesive member 41, the peeling cover film 22 can be peeled off smoothly.

7 shows another embodiment of the present invention.

In the present embodiment, the type of the base resin of the adhesive layer 45 of the substrate-side adhesive member 41 and the type of the base resin of the adhesive layer 46 of the peeling-side adhesive member 42 are the same, and The thickness of the adhesive layer 46 of the adhesive member 42 is configured to be thinner than the thickness of the adhesive layer 45 of the adhesive member 41 on the substrate side.

In this case, as the adhesive for the adhesive layer 45 of the base adhesive member 41 and the adhesive layer 46 of the peeling adhesive member 42 , an adhesive containing an acrylic base resin can be suitably used.

In addition, in the same dimensional relationship as in the above embodiment, the substrate-side adhesive member 41 is not particularly limited, but from the viewpoint of securing the required adhesive force, it is more preferable to use the adhesive layer 45 having a thickness of 40 µm or more. desirable.

On the other hand, although it does not specifically limit about the thickness of the adhesive layer 46 of the peeling side adhesive member 42, When peeling the peeling film 32 of the connection tape 3 from the adhesive layer 31, and, When the release cover film 22 of the tape 2 is peeled off from the adhesive layer 21 , the adhesive layer 46 of the peeling-side adhesive member 42 adheres to the adhesive layer 45 of the substrate-side adhesive member 41 . From the viewpoint of more reliably avoiding adhesion, the ratio of the thickness of the adhesive layer 46 of the peeling-side adhesive member 42 to the thickness of the adhesive layer 45 of the substrate-side adhesive member 41 is greater than 50/100. It is more preferable to set it so that it may become small.

Specifically, in the dimensional relationship described above, it is preferable to set the thickness of the adhesive layer 46 of the peeling-side adhesive member 42 to 5 to 20 µm in consideration of the required adhesive force.

According to this embodiment having such a configuration, the thickness of the adhesive layer 46 of the peeling-side adhesive member 42 is configured to be thinner than the thickness of the adhesive layer 45 of the base-side adhesive member 41, and the adhesive Compared with the case where the thickness of the layer 46 is formed equal to the thickness of the adhesive layer 45 , the adhesive force between the adhesive layer 45 and the adhesive layer 46 can be reduced, so that the When peeling the peeling film 32 from the adhesive layer 31 in the edge part, when peeling the peeling cover film 22 from the adhesive bond layer 21 in the edge part of the adhesive tape 2, peeling side adhesion|attachment Even when the adhesive layer 46 of the member 42 is in contact with the adhesive layer 45 of the adhesive member 41 on the base side, the adhesive layers 45 and 46 are prevented from adhering to each other, and the release film 32 and The peeling cover film 22 can be peeled off smoothly.

Fig.8 (a) is a front view which shows the structure of embodiment of the adhesive tape container which concerns on this invention, (b) (c) is an explanation which shows the space|interval of the adhesive film wound around the core shaft part of a reel member. It is also

The adhesive tape container 50 of this embodiment is attached to the core shaft portion 54 of the reel member 53 having flanges 51 and 52 wider than the tape width of the adhesive tape structure 1, the adhesive tape structure ( 1) is wound with a traverse winding.

Here, the traverse winding refers to winding the elongate adhesive tape structures 1 spirally in multiple layers at a predetermined pitch (intervals) on the core shaft portion 54 of the reel member 53 .

Here, the adhesive tape structure 1 is wound so that the interval between the adhesive tape structures 1 adjacent to each other on the core shaft portion 54 of the reel member 53 is a predetermined interval p (see Fig. 8(b)). ), and the adhesive tape structures 1 are overlapped and wound so that the spacing between the adhesive tape structures 1 adjacent on these adhesive tape structures 1 is a predetermined value p (see Fig. 8(c)).

In this case, the interval p between the adjacent adhesive tape structures 1 is free from the fear of adhering the adjacent adhesive tape structures 1 to each other by the adhesive protruding in the width direction of the tape, and the adhesive tape structure 1 can be wound. It can be set to a value at which winding collapse does not occur.

According to the adhesive tape container 50 of this embodiment demonstrated above, since the very long adhesive tape structure 1 can be wound and taken out smoothly, it is the attachment process of an adhesive tape WHEREIN: It is not necessary to replace|exchange the reel frequently. As a result, the production efficiency can be significantly improved.

In addition, this invention is not limited to the said embodiment, Various changes can be made.

For example, in the embodiment shown in FIG. 6 , the thickness of the adhesive layer 46B of the peeling-side adhesive member 42 was configured to be thinner than the thickness of the adhesive layer 45A of the base-side adhesive member 41 . The invention is not limited to this, and it is also possible to configure the thickness of the adhesive layer 45A of the adhesive member 41 on the base side to be smaller than the thickness of the adhesive layer 46B of the adhesive member 42 on the peeling side.

However, since the adhesive of the adhesive layer 46B of the peeling-side adhesive member 42 comes into contact with the adhesive layer 21 of the adhesive tape 2 and the adhesive layer 31 of the connecting tape 3, the connection tape From the viewpoint of preventing blocking from occurring when the release film 32 of (3) and the release cover film 22 of the adhesive tape 2 are peeled off, as in the embodiment shown in Fig. 6, the release-side adhesive member ( It is preferable to configure so that the thickness of the adhesive layer 46B of 42 is smaller than the thickness of the adhesive layer 45A of the base-side adhesive member 41 .

Example

Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.

According to the following conditions, the adhesive tape which is a component of an adhesive tape structure, and the connection tape were produced.

[Production of adhesive tape]

As an adhesive tape, an adhesive layer having a thickness of 20 μm is formed on a base film having a thickness of 50 μm including PET having a width of 1.5 mm, and a release cover film containing PET having a thickness of 25 μm is additionally installed on the adhesive layer. that was used

Here, the composition of the adhesive is 30 parts by weight of phenoxy resin (YP-50 manufactured by Nippon Tetsu Chemical Corporation), 20 parts by weight of liquid epoxy resin (JER828 manufactured by Mitsubishi Chemical Corporation), 10 parts by weight of a rubber component (SG80H manufactured by Nagase Chemtech), a curing agent (Novacure 3941HP manufactured by Asahi Kasei Corporation) 40 parts by weight and 1 part by weight of a silane coupling agent (A-187 manufactured by Momentive Performance Materials) are contained.

After this adhesive composition was melt|dissolved with the solvent toluene, it apply|coated on the base film, heated at 60 degreeC atmospheric temperature for 10 minutes, the solvent was volatilized, and the adhesive bond layer was formed.

[production of connecting tape]

As a connecting tape, a 20 μm-thick adhesive layer is formed on a 50 μm-thick base film including black PET with a width of 1.5 mm, and a release film containing 25 μm-thick PET is additionally installed on the adhesive layer. that was used

Here, the composition of the pressure-sensitive adhesive is 100 parts by weight of a silicone resin (SD4584PSA manufactured by Toray Dow Corning), 0.7 parts by weight of a curing agent (BY24-741 manufactured by Toray Dow Corning), and a silane coupling agent (A-187 manufactured by Momentive Performance Materials). ) 1 part by weight and 0.6 parts by weight of a platinum catalyst (NC-25 manufactured by Toray Dow Corning).

This composition was applied on a connecting substrate with a bar coater, heated at a temperature of 70°C for 5 minutes, and then cured by heating at 150°C for 4 minutes to form an adhesive layer having a thickness of 20 µm.

<Example 1>

Using the adhesive tape and the connecting tape mentioned above, the sample of the adhesive tape structure of the structure shown to Fig.5 (a) was produced.

In this case, as the substrate-side adhesive member, a silicone adhesive tape (T4082S manufactured by Decuceria Luz Co., Ltd.) having a length of 5 cm in which an adhesive layer containing a silicone resin having a thickness of 40 μm was formed on a PET substrate having a thickness of 25 μm was used.

On the other hand, as the peeling-side adhesive member, a silicone-based adhesive tape having a length of 5 cm in which an adhesive layer containing an acrylic resin (SK Dyne 1717, manufactured by Soken Chemical Co., Ltd.) having a thickness of 40 μm was formed on a PET substrate having a thickness of 38 μm was used.

And using the above-mentioned base material side adhesive member and peeling side adhesive member, the said 50 m length said adhesive tapes were adhere|attached with the said connecting tape of length 30 cm, The sample of the adhesive tape structure was produced.

<Example 2>

A sample of the adhesive tape structure was produced under the same conditions as in Example 1 except that the thickness of the adhesive layer of the peeling-side adhesive member was 10 µm. This has the configuration shown in FIG. 6 .

<Example 3>

A sample of the adhesive tape structure was produced under the same conditions as in Example 1 except that the thickness of the adhesive layer of the peeling-side adhesive member was set to 20 µm. This has the configuration shown in FIG. 6 .

<Comparative Example 1>

As the peeling-side adhesive member, a 5 cm-long silicone adhesive tape (T4082S manufactured by Decuceria Luz Co., Ltd.) in which an adhesive layer containing a silicone resin having a thickness of 40 μm was formed on a PET substrate having a thickness of 25 μm was used, except for Example 1 A sample of the adhesive tape structure was prepared under the same conditions as the above.

<Comparative Example 2>

A sample of the adhesive tape structure was prepared under the same conditions as in Example 1, except that the thickness of the adhesive layer of the adhesive member on the substrate side was 10 μm and the thickness of the adhesive layer of the adhesive layer on the peeling side was 10 μm.

"Assessment Methods"

The sample of the adhesive tape structure of an Example and a comparative example was wound up, respectively, on the reel member whose outer diameter and inner diameter are (phi) 50 mm which consist of polystyrene.

The reel member of these adhesive tape structures was attached to the apparatus shown in FIG. 2, the peeling cover film of the adhesive tape and the peeling film of the connecting tape were peeled, and the peelability of the peeling cover film and the peeling film was confirmed visually.

In this case, the feeding speed of the tape was 200 mm/sec, and the sending pitch of the tape was 200 mm.

"Evaluation results"

The type of the base resin of the adhesive layer of the substrate-side adhesive member and the base resin of the adhesive layer of the peeling-side adhesive member are different, and the thickness of the adhesive layer of the peeling-side adhesive member depends on the thickness of the adhesive layer of the substrate-side adhesive member. In the adhesive tape structure of Example 2 in which the ratio was 10/40, the release cover film of the adhesive tape and the release film of the connecting tape could be peeled off without any problem.

On the other hand, the type of the base resin of the adhesive layer of the substrate-side adhesive member and the base resin of the adhesive layer of the peeling-side adhesive member are different, and the thickness of the adhesive layer of the peeling-side adhesive member is of the adhesive layer of the substrate-side adhesive member. The adhesive tape structures of Example 1 with a thickness-to-thickness ratio of 40/40 and Example 3 with a copper ratio of 20/40 had some jamming at the time of drawing out, but were at a usable level.

On the other hand, the type of the base resin of the adhesive layer of the substrate-side adhesive member and the base resin of the adhesive layer of the peeling-side adhesive member are the same, and the thickness of the adhesive layer of the peeling-side adhesive member is the adhesive layer of the substrate-side adhesive member. In the adhesive tape structure of Comparative Example 1 in which the ratio to the thickness of was 40/40, the adhesive surfaces of the adhesive layer of the substrate-side adhesive member and the adhesive layer of the peel-side adhesive member were adhered to each other, and the release cover film was not peeled off.

In addition, the type of the base resin of the adhesive layer of the substrate-side adhesive member and the base resin of the adhesive layer of the peeling-side adhesive member are different, and the thickness of the adhesive layer of the peeling-side adhesive member is the thickness of the adhesive layer of the adhesive layer on the substrate side. In the adhesive tape structure of Comparative Example 2 having a thickness-to-thickness ratio of 10/10, the adhesive force of the substrate-side adhesive member was insufficient, and the adhesive member of the substrate-side adhesive member was peeled off and the film was broken.

From the above result, the effect of this invention was able to be demonstrated.

One… adhesive tape structure
2… adhesive tape
3… connecting tape
20… base film
21… adhesive layer
22… release cover film
30… connection material
31… adhesive layer
32… release film
41… Adhesive member on the substrate side
45, 45A... adhesive layer
42… Peeling side adhesive member
46, 46B... adhesive layer
50… adhesive tape receptor

Claims (12)

An adhesive tape structure in which a plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially installed on a base film are connected via a connection tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate,
In a state where there is a predetermined gap between the end of the adhesive tape and the end of the connecting tape, the end of the base film of the adhesive tape and the end of the connecting substrate of the connecting tape are adhered by the base-side adhesive member , an end of the release cover film and an end of the release film are adhered by a release-side adhesive member so that the release cover film of the adhesive tape and the release film of the connecting tape are integrally peeled in the tape longitudinal direction;
The type of the base resin of the adhesive layer of the substrate-side adhesive member is different from the type of the base resin of the adhesive layer of the peeling-side adhesive member,
The adhesive tape structure in which the ratio with respect to the thickness of the adhesive layer of the said base material side adhesive member of the thickness of the adhesive layer of the said peeling side adhesive member is smaller than 50/100. An adhesive tape structure in which a plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially installed on a base film are connected via a connection tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate,
In a state where there is a predetermined gap between the end of the adhesive tape and the end of the connecting tape, the end of the base film of the adhesive tape and the end of the connecting substrate of the connecting tape are adhered by the base-side adhesive member , an end of the release cover film and an end of the release film are adhered by a release-side adhesive member so that the release cover film of the adhesive tape and the release film of the connecting tape are integrally peeled in the tape longitudinal direction;
The thickness of the adhesive layer of the adhesive member on the substrate side is different from the thickness of the adhesive layer on the peeling side adhesive member,
The adhesive tape structure in which the ratio with respect to the thickness of the adhesive layer of the said base material side adhesive member of the thickness of the adhesive layer of the said peeling side adhesive member is smaller than 50/100. The adhesive tape structure according to claim 1 or 2, wherein the connecting substrate of the connecting tape contains a non-transmissive material. A plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially provided on a base film are connected via a connecting tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate,
In a state where there is a predetermined gap between the end of the adhesive tape and the end of the connecting tape, the end of the base film of the adhesive tape and the end of the connecting substrate of the connecting tape are adhered by the base-side adhesive member , an end of the release cover film and an end of the release film are adhered by a release-side adhesive member so that the release cover film of the adhesive tape and the release film of the connecting tape are integrally peeled in the tape longitudinal direction;
The type of the base resin of the adhesive layer of the substrate-side adhesive member is different from the type of the base resin of the adhesive layer of the peeling-side adhesive member,
an adhesive tape structure in which the ratio of the thickness of the adhesive layer of the peeling-side adhesive member to the thickness of the adhesive layer of the substrate-side adhesive member is smaller than 50/100;
The adhesive tape container in which the said adhesive tape structure is wound by traverse winding on the reel member which has a flange spacing wider than the tape width|variety of the said adhesive tape structure. A plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially provided on a base film are connected via a connecting tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate,
In a state where there is a predetermined gap between the end of the adhesive tape and the end of the connecting tape, the end of the base film of the adhesive tape and the end of the connecting substrate of the connecting tape are adhered by the base-side adhesive member , an end of the release cover film and an end of the release film are adhered by a release-side adhesive member so that the release cover film of the adhesive tape and the release film of the connecting tape are integrally peeled in the tape longitudinal direction;
The thickness of the adhesive layer of the adhesive member on the substrate side is different from the thickness of the adhesive layer on the peeling side adhesive member,
an adhesive tape structure in which the ratio of the thickness of the adhesive layer of the peeling-side adhesive member to the thickness of the adhesive layer of the substrate-side adhesive member is smaller than 50/100;
The adhesive tape container in which the said adhesive tape structure is wound by traverse winding on the reel member which has a flange spacing wider than the tape width|variety of the said adhesive tape structure. The adhesive tape container according to claim 4 or 5, wherein the connecting substrate of the connecting tape contains a non-transmissive material. delete delete delete delete delete delete

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