KR102285601B1 - Adhesive tape structure and adhesive tape housing - Google Patents

Abstract

An object of the present invention is to provide a technique capable of achieving significant lengthening of an adhesive tape without changing the existing fabric or adhesive application mechanism. In the present invention, a plurality of adhesive tapes (2) in which an adhesive layer (21) and a release cover film (22) are sequentially installed on a base film (20), an adhesive layer (31) and a release film (32) on a connecting substrate (30) This is the adhesive tape structure 1 connected via the connecting tape 3 provided in sequence. While the end of the base film 20 of the adhesive tape 2 and the end of the connecting base 30 of the connecting tape 3 are adhered by the base-side adhesive member 41, the release cover of the adhesive tape 2 The end of the film 22 and the end of the release film 32 of the connecting tape 3 are adhered by the release-side adhesive member 42 so that the release cover film 22 and the release film 32 are integrally formed. It is designed to be peeled off.

Description

Adhesive tape structure and adhesive tape receptor TECHNICAL FIELD

This invention relates to the technique of lengthening adhesive tapes, such as for tab wire bonding of a solar cell.

DESCRIPTION OF RELATED ART Conventionally, the elongate adhesive tape for bonding various electronic components etc. is known.

Such an adhesive tape is formed on a narrow and elongate release sheet, and is shipped in the form wound up in roll shape on a reel.

And at a manufacturing site, when an adhesive tape is taken out from a reel and used, and an adhesive tape is used up, a manufacturing line is temporarily stopped and the adhesive tape is exchanged for every reel.

However, when the length of an adhesive tape is short, it will be necessary to stop a manufacturing line every time a reel is replaced, and production efficiency will be reduced.

Therefore, in recent years, what is called "lengthening" which makes the length of the adhesive tape which can be wound around one reel as long as possible is desired.

However, if the adhesive tape is to be lengthened, it is necessary to take measures such as lengthening the length of the fabric to which the adhesive is applied, or enlarging the unwinding/winding part of the application mechanism, and it is necessary to uniformly control the coating thickness of the adhesive tape. As such, there was a limit to the extensive lengthening of the body.

Moreover, as a prior art document which concerns on this invention, there exist what is shown below, for example.

Japanese Patent Laid-Open No. 2011-52061

The present invention has been made in consideration of such conventional technical problems, and its object is to provide a technology capable of achieving a significant lengthening of the adhesive tape without changing the existing fabric or the application mechanism of the adhesive. is to provide

The present invention made to achieve the above object is an adhesive tape structure in which a plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially installed on a base film are connected through a connection tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate, The end of the base film of the adhesive tape and the end of the connecting base of the connecting tape are adhered by the base-side adhesive member, and the end of the release cover film of the adhesive tape and the end of the release film of the connecting tape are on the release side It is an adhesive tape structure adhere|attached by the adhesive member, and is comprised so that the said peeling cover film and the said peeling film may peel integrally.

In the present invention, it is also effective when the connecting substrate of the connecting tape contains a non-transmissive material.

In the present invention, it is also effective when the adhesive layer of the connecting tape contains a material different from that of the adhesive layer of the adhesive tape.

In the present invention, it is effective even when the adhesive layer of the connecting tape has a transmittance of visible light of 70% or more.

In the present invention, it is effective even when the peeling force between the adhesive layer of the connecting tape and the peeling film is not more than twice the peeling force of the adhesive layer of the adhesive tape and the peeling cover film.

In this invention, when conveying the said adhesive tape structure via a guide roller, WHEREIN: It is effective also when the adhesive force of the adhesive layer of the said connecting tape with respect to the said guide roller is 200 gf/5 mmphi or less.

On the other hand, this invention is an adhesive tape container in which any one of the adhesive tape structures mentioned above is wound by traverse winding on the reel member which has a flange space|interval wider than the tape width|variety of the said adhesive tape structure.

The adhesive tape structure of the present invention comprises an end of a base film of the adhesive tape and an end of a connecting base of the connecting tape are adhered by a base-side adhesive member, and an end of a release cover film of the adhesive tape and a release film of the connecting tape. Since the end is adhered by the peeling-side adhesive member, and the peeling cover film and the peeling film are integrally peeled off, the basic configuration and function of the adhesive tape are the same as those of the conventional one, Adhesive can be applied continuously to the complex.

As a result, according to the present invention, it is possible to achieve significant lengthening of the adhesive tape without changing the existing fabric or the application mechanism of the adhesive.

In the present invention, when the connecting base material of the connecting tape contains a non-transmissive material, the connecting base can be detected by the optical sensor, whereby the adhesive is continuously applied to the adherend while skipping the part of the connecting tape. can be attached

In the present invention, when the adhesive layer of the connecting tape contains a material different from that of the adhesive layer of the adhesive tape, for example, only a portion of the pressure-sensitive adhesive layer uses a non-cured resin or a cured resin, whereby storage stability is achieved. can improve

Moreover, when the adhesive layer of an adhesive tape is using an expensive filler etc., for example, manufacturing cost can be reduced by forming an adhesive layer with a comparatively inexpensive material.

In the present invention, when the pressure-sensitive adhesive layer of the connecting tape has a visible light transmittance of 70% or more, the connecting substrate can be detected by the optical sensor through the pressure-sensitive adhesive layer even when the optical sensor is located on the pressure-sensitive adhesive layer side of the connecting tape. .

In the present invention, when the peeling force between the adhesive layer of the connecting tape and the release film is 2.0 times or less of the peeling force between the adhesive layer of the adhesive tape and the release cover film, at a rate equivalent to the peeling speed of the release cover film of the adhesive tape. , the release film can be smoothly peeled from the pressure-sensitive adhesive layer.

In the present invention, in the case of conveying the adhesive tape structure via the guide roller, when the adhesive force of the adhesive layer of the connecting tape to the guide roller is 200 gf/5 mmφ or less, the pressure-sensitive adhesive layer of the connecting substrate is applied to the guide roller When contacted, the adhesive does not electrodeposit on the guide roller, and the adhesive tape structure can be smoothly run.

On the other hand, according to the adhesive tape receptor of the present invention in which the above-described adhesive tape structure is wound by traverse winding on a reel having a flange spacing wider than the tape width of the adhesive tape structure, a very long adhesive tape structure is wound and Since it can take out smoothly, it is the attachment process of an adhesive tape. WHEREIN: It is not necessary to replace|exchange a reel frequently, and production efficiency can be improved significantly.

Fig. 1 (a) is a side configuration view of an embodiment of an adhesive tape structure according to the present invention, (b) is a side configuration view showing a main part of the adhesive tape structure, (c) is a connection part of the adhesive tape structure A side configuration diagram showing an enlarged view.
It is a figure for demonstrating the process of thermocompressing the adhesive bond layer of an adhesive tape to a to-be-adhered body using the adhesive tape structure of this embodiment.
3A and 3B are explanatory views showing a state in which the release cover film of the adhesive tape and the release film of the connecting tape are peeled from the adhesive tape structure;
Fig.4 (a), (b) is explanatory drawing which shows the state which detects the connection base material of a connection tape with an optical sensor.
Fig. 5 is an explanatory view showing a relationship between an adhesive layer remaining on an adhesive tape structure and a guide roller;
Fig. 6 (a) is a front view showing the configuration of an embodiment of the film container according to the present invention; do.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail with reference to drawings.

Fig. 1 (a) is a side configuration diagram of an embodiment of an adhesive tape structure according to the present invention, Fig. 1 (b) is a side configuration diagram showing a main part of the adhesive tape structure, and Fig. 1 (c) is the above It is an enlarged side view showing the connection part of the adhesive tape structure.

As for the adhesive tape structure 1 of this embodiment, the some adhesive tape 2 is a series of long thing connected via the connection tape 3, respectively.

Here, each of the adhesive tapes 2 has the same configuration, and has a so-called three-layer structure in which an adhesive layer 21 and a release cover film 22 are sequentially provided over the entire surface on a base film 20 .

On the other hand, each of the connecting tapes 3 has the same configuration, and has a so-called three-layer structure in which the pressure-sensitive adhesive layer 31 and the release film 32 are sequentially provided over the entire surface on the connecting substrate 30 .

In the case of this embodiment, the connecting tape 3 is comprised so that the length may become shorter than the adhesive tape 2 . In addition, the length of each adhesive tape 2 and the length of each connection tape 3 may be the same or different, respectively.

The upper surface of the end of the base film 20 of the adhesive tape 2 (the surface opposite to the adhesive layer 21), and the upper surface of the end of the connecting substrate 30 of the connecting tape 3 (opposite to the adhesive layer 31) surfaces) are respectively adhesively connected by the base-side adhesive member 41 .

Further, the upper surface of the end portion of the release cover film 22 of the adhesive tape 2 (the surface opposite to the adhesive layer 21) and the upper surface of the end portion of the release film 32 of the connecting tape 3 (the pressure-sensitive adhesive layer 31) ) and the opposite side) are adhered by a peeling-side adhesive member 42 .

The base film 20 of the adhesive tape 2 can use a thing containing PET, for example.

Although the thickness of this base film 20 is not specifically limited, From a viewpoint of ensuring material strength and not enlarging a winding diameter, the thing of 10-100 micrometers can be used suitably.

In addition, the width|variety in particular of the base film 20 is although it does not specifically limit, From a viewpoint of covering various electronic components reliably, the thing of 20-2000 micrometers can be used suitably.

In addition, the upper surface of the base film 20 can also perform peeling processing by a silicone resin, for example.

For the adhesive layer 21 of the adhesive tape 2, a resin used for an adhesive of an ordinary adhesive tape, particularly a thermosetting resin (eg, an epoxy-based resin, a phenoxy-based resin, a urethane-based resin, etc.) can be used.

Although the thickness of this adhesive bond layer 21 is not specifically limited, It is more preferable to set to 10-100 micrometers from a viewpoint of reliably connecting the terminals with dispersion|variation in the height of various electronic components.

The release cover film 22 of the adhesive tape 2 protects the adhesive layer 21 and is peeled off during use.

As this peeling cover film 22, a thing containing PET can be used, for example.

In the case of this invention, although the thickness of the peeling cover film 22 is not specifically limited, From a viewpoint of ensuring material strength and not increasing a winding diameter, it is more preferable to set to 10-100 micrometers.

In addition, the length of the adhesive tape 2 described above is not particularly limited, but consider reducing the number of skips when using the adhesive tape structure 1 and the maximum application length of the application equipment of the adhesive tape 2 . If it does, the thing of 50-1000 m can be used suitably.

In addition, as the connecting base material 30 of the connecting tape 3, the thing containing the non-transmissive material detectable by an optical sensor can be used.

As such a connecting base material 30, what disperse|distributed the black filler (filler), for example in resin containing PET can be used.

The thickness of the connecting substrate 30 is not particularly limited, but from the viewpoint of preventing a step difference during winding by ensuring a thickness equal to that of the base film 20 of the adhesive tape 2, a thickness of 10 to 100 μm It can be used appropriately.

On the other hand, the width of the connecting substrate 30 is not particularly limited, but is equal to the width of the base film 20 of the adhesive tape 2 from the viewpoint of smoothly winding, pulling out, and running the adhesive tape structure 1 . It is preferable to set it so that

The pressure-sensitive adhesive layer 31 of the connecting tape 3 is for smoothly peeling the release film 32 of the connecting tape 3 .

That is, as will be described later, the release film 32 of the connecting tape 3 is peeled off together with the release cover film 22 of the adhesive tape 2 , but is connected with the release film 32 of the connecting tape 3 . If the adhesive substance does not exist between the base materials 30, since the speed temporarily increases when peeling the peeling film 32, there exists a possibility that a shift|offset|difference in the conveyance speed of a manufacturing line may arise.

In addition, if there is no adhesive substance between the release film 32 of the connecting tape 3 and the connecting substrate 30 , meandering occurs at the time of slitting (cutting) in manufacturing the adhesive tape structure 1 . As a result, there is a risk that the tape may be wrinkled or the tape may break.

The pressure-sensitive adhesive layer 31 of the present invention is to prevent such a problem.

Considering this purpose, the peeling force of the pressure-sensitive adhesive layer 31 and the release film 32 of the connecting tape 3 is equal to that of the peeling force between the adhesive layer 21 of the adhesive tape 2 and the release cover film 22 . It is more preferable to comprise so that it may become 0.2 times or more and 2.0 times or less.

When the peeling force of the adhesive layer 31 of the connecting tape 3 and the peeling film 32 is less than 0.2 times the peeling force of the adhesive layer 21 of the adhesive tape 2 and the peeling cover film 22, There exists a possibility that the shift|offset|difference of the conveyance speed of a manufacturing line by the speed increase at the time of peeling the peeling film 32, generation|occurrence|production of the wrinkle of the tape by the meandering at the time of a slit, or a breakage of a tape may generate|occur|produce.

On the other hand, when the peeling force of the adhesive layer 31 of the connecting tape 3 and the peeling film 32 is greater than 2.0 times the peeling force of the adhesive layer 21 of the adhesive tape 2 and the peeling cover film 22, , There exists a possibility that the peeling film 32 may not peel smoothly from the adhesive layer 31 of the connecting tape 3 .

As long as the above conditions are satisfied, the adhesive layer 31 of the connecting tape 3 may use all of the resin having the same composition or a different composition from the adhesive layer 21 of the adhesive tape 2 . Moreover, as resin which differs in composition from the adhesive bond layer 21 of the adhesive tape 2, silicone type resin is mentioned, for example.

In addition, the thickness of the pressure-sensitive adhesive layer 31 for satisfying the above-described conditions may be set to 10 to 100㎛.

On the other hand, since the pressure-sensitive adhesive layer 31 of the connecting tape 3 is not transferred to the adherend and is skipped by nature, only the portion of the pressure-sensitive adhesive layer 31 is a non-cured resin or cured resin. , the storage stability can be improved.

Moreover, when the adhesive bond layer 21 of the adhesive tape 2 uses an expensive filler etc., for example, manufacturing cost can be reduced by forming the adhesive layer 31 with a comparatively inexpensive material.

In the case of the present invention, the pressure-sensitive adhesive layer 31 may be made of a light-transmitting material.

That is, as described above, by configuring the connecting substrate 30 of the connecting tape 3 with a non-transmissive material, the connecting substrate 30 of the connecting tape 3 can be detected by the optical sensor, but the optical sensor In the case in which the P is located on the side of the pressure-sensitive adhesive layer 31 , the light is blocked by the pressure-sensitive adhesive layer 31 , and the connection substrate 30 may not be detected.

Therefore, in such a case, the connection base material 30 can be detected by the optical sensor through the adhesive layer 31 by comprising the adhesive layer 31 of the connection tape 3 with a light-transmitting material.

In the case of the present invention, although not particularly limited, from the viewpoint of reliably detecting the connecting substrate 30 by the optical sensor through the pressure-sensitive adhesive layer 31 , the visible light transmittance (light transmittance) with respect to the pressure-sensitive adhesive layer 31 is It is more preferable to comprise so that it may become 70% or more.

The release film 32 of the connecting tape 3 protects the pressure-sensitive adhesive layer 31 and is peeled off during use.

As this peeling film 32, a thing containing PET can be used, for example.

In the case of the present invention, the thickness of the release film 32 is not particularly limited, but from the viewpoint of preventing a step difference during winding by ensuring a thickness equivalent to that of the release cover film 22 of the adhesive tape 2, It is more preferable to set it to 10-100 micrometers.

In addition, the length of the above-mentioned connecting tape 3 is not particularly limited, but it is possible to sense by an optical sensor, and from the viewpoint of not lowering the conveyance speed of the production line as much as possible, it is better to set it to 5 to 100 cm desirable.

The base material-side adhesive member 41 firmly bonds the end of the base film 20 of the adhesive tape 2 and the end of the connecting base 30 of the connecting tape 3 with the adhesive 45 provided on the base 43 . to be glued

As the material of the adhesive 45, for example, one containing an acrylic resin can be used.

In addition, when peeling treatment is given to the upper surface of the base film 20 of the adhesive tape 2 and the upper surface of the connecting substrate 30 of the connecting tape 3, as the material of the adhesive 45, a silicone resin you can also use

In addition, although the length of the above-mentioned base material side adhesive member 41 is not specifically limited, It has adhesive force which connects the adhesive tape 2 and the connection tape 3 reliably, and workability|operativity at the time of bonding is made as easy as possible. From the viewpoint of doing it, it is more preferable to set it to 1 to 10 cm.

On the other hand, the release-side adhesive member 42 is connected to the end of the release cover film 22 of the adhesive tape 2 and the end of the release film 32 of the connecting tape 3 by means of an adhesive 46 provided on the base 44 . to be firmly attached.

As the material of the adhesive 46, for example, one containing an acrylic resin can be used.

Moreover, when peeling treatment is given to the upper surface of the release cover film 22 of the adhesive tape 2 and the upper surface of the release film 32 of the connecting tape 3, as a material of the adhesive agent 46, a silicone resin type You can also use the

In addition, although the length of the peeling side adhesive member 42 mentioned above is not specifically limited, It has adhesive force which connects the adhesive tape 2 and the connection tape 3 reliably, and workability|operativity at the time of bonding is made as easy as possible. From the viewpoint of doing it, it is more preferable to set it to 1 to 10 cm.

Moreover, in the case of this invention, as shown, for example in FIG.1(c), the edge part of the adhesive tape 2 and the edge part of the connection tape 3 are formed with a slight clearance gap.

The reason for this is that the release cover film 22 of the adhesive tape 2 and the release film 32 of the connecting tape 3 are smoothly and integrally peeled off, and a margin at the time of manufacturing the adhesive tape structure 1 . will take into account

Considering this point of view, it is more preferable that the gap between the end of the adhesive tape 2 and the end of the connecting tape 3 be set to 500 to 1000 µm.

And the adhesive tape structure 1 of this invention is obtained by connecting two or more of the adhesive tapes 2 mentioned above with the connection tape 3 mentioned above, respectively.

2 is a view for explaining a process of thermocompressing an adhesive layer of an adhesive tape to an adherend using the adhesive tape structure of the present embodiment, FIGS. 3 (a) and (b) are an adhesive tape from the adhesive tape structure An explanatory view showing a state of peeling the release cover film of the connecting tape and the release film of the connecting tape, FIGS. It is explanatory drawing which shows the relationship between the adhesive layer which remained on the adhesive tape structure, and a guide roller.

As shown in FIG. 2 , in this embodiment, the adhesive tape structure 1 is taken out from the roll 1A of the adhesive tape structure 1 wound on the reel member 10 , and the direction is passed through the take-out roller 11 . It is switched, and the peeling cover film 22 of the adhesive tape 2 mentioned above and the peeling film 32 of the connection tape 3 are peeled by the peeling roller 12.

Here, by the operation of the peeling roller 12, the peeling cover film 22 of the adhesive tape 2 is peeled from the adhesive layer 21, as shown in Fig. 3(a), but the peeling cover film ( 22) is adhered to the release film 32 of the connecting tape 3 by the release-side adhesive member 42, and therefore, as shown in Fig. 3(b), the release cover film ( 22) and the peeling film 32 of the connecting tape 3 come to peel integrally.

Thereafter, the adhesive tape structure 1 is conveyed by the rollers 13 to 15 shown in FIG. 2 , and the adhesive tape structure 1 is thermocompressed between the thermocompression head 16 and the adherend 17 . The portion to be to be placed is placed, and the thermocompression head 16 is operated at that position to transfer the adhesive layer 21 of the adhesive tape 2 to the adherend 17 .

At this time, the presence or absence of the non-transmissive connecting substrate 30 of the connecting tape 3 is detected by the optical sensor 5, and when the connecting substrate 30 is detected, the connecting tape 3 is attached to the thermocompression head ( The conveyance of the adhesive tape structure 1 is controlled so as not to be located between the 16 ) and the adherend 17 , that is, so that the pressure-sensitive adhesive layer 31 of the connecting tape 3 is not transferred to the adherend 17 .

In the present invention, as described above, when the optical sensor 5 is positioned on the connecting substrate 30 side of the connecting tape 3 by configuring the pressure-sensitive adhesive layer 31 of the connecting tape 3 with a light-transmitting material. (See Fig. 4(a)) as well as when the optical sensor 5 is located on the adhesive layer 31 side of the connecting tape 3, by the optical sensor 5 through the adhesive layer 31 The connection substrate 30 can be detected (refer to FIG. 4(b) ).

And after completion of such a thermocompression-bonding process, the direction of the adhesive tape structure body 1 is changed and conveyed by the guide roller 18 shown in FIG. wind up

By the way, in this embodiment, since the adhesive layer 31 of the connecting tape 3 is not transferred to the to-be-adhered body 17, when winding the adhesive tape structure 1 by the winding device 19, the adhesive tape structure ( 1) When the adhesive layer 31 remaining on the top adheres to the guide roller 18, there is a risk of electrodeposition (see Fig. 5).

In this invention, in order to prevent such a problem, it can adjust so that the adhesive force with respect to the guide roller 18 of the adhesive layer 31 of the connection tape 3 may become 200 gf/5 mmphi or less.

In this case, as the guide roller 18, one made of a silicone resin may be used, or one in which the surface of the guide roller 18 is processed with a releasable resin such as a silicone resin or polytetrafluoroethylene resin may be used.

Fig. 6 (a) is a front view showing the configuration of an embodiment of the film container according to the present invention, Fig. 6 (b), (c) is a gap between the adhesive film wound around the winding core shaft portion of the reel member. is an explanatory diagram.

The film receptor 50 of the present embodiment is attached to the winding core shaft portion 54 of the reel member 53 having flanges 51 and 52 at intervals wider than the tape width of the adhesive tape structure 1, the adhesive tape structure 1 ) is wound by traverse winding.

Here, traverse winding means winding the elongate adhesive tape structure 1 in multiple layers spirally at predetermined pitch (interval) on the winding core shaft part 54 of the reel member 53. As shown in FIG.

Here, on the winding core shaft part 54 of the reel member 53, the adhesive tape structure 1 is wound so that the space|interval of the adjacent adhesive tape structure 1 may become a predetermined value p (FIG. 6(b)) reference), and on these adhesive tape structures 1, the adhesive tape structures 1 are overlapped and wound so that the interval between the adjacent adhesive tape structures 1 becomes a predetermined value p (refer to Fig. 6(c)).

In this case, the interval p between the adjacent adhesive tape structures 1 is free from the fear of adhering the adjacent adhesive tape structures 1 to each other by the adhesive protruding in the width direction of the tape, and the adhesive tape structure 1 can be wound. It can be set to a value at which winding collapse does not occur at this time.

Example

Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.

According to the following conditions, the Example and the comparative example of the connecting tape which are a component of an adhesive tape structure were created.

<Example 1>

A connecting tape was prepared by sequentially forming an adhesive layer and a release film on a connecting substrate made of black PET with a thickness of 50 μm.

An adhesive layer contains the following resin A.

That is, the composition of Resin A is 100 parts by weight of a silicone-based resin (SD4584PSA manufactured by Toray Dow Corning), 0.7 parts by weight of a curing agent (BY24-741 manufactured by Toray Dow Corning), and a silane coupling agent (A- manufactured by Momentive Performance Materials). 187) 1 part by weight and 0.6 parts by weight of a platinum catalyst (NC-25 manufactured by Toray Dow Corning).

This composition was applied on a connecting substrate by a bar coater, heated at a temperature of 70°C for 5 minutes, and further heated and cured at 150°C for 4 minutes to form a pressure-sensitive adhesive layer having a thickness of 20 µm.

In addition, as a peeling film, the thing containing PET with a thickness of 25 micrometers was used.

<Example 2>

As a material of an adhesive layer, the connection tape was created on the conditions similar to Example 1 except using the thing containing the following resin B.

Here, the composition of the resin B is 30 parts by weight of a phenoxy resin (YP-50 manufactured by Nippon Tetsu Chemical Co., Ltd.), 20 parts by weight of a liquid epoxy resin (JER828 manufactured by Mitsubishi Chemical Co., Ltd.), and 10 parts by weight of a rubber component (SG80H manufactured by Nagase Chemtech) , 40 parts by weight of a curing agent (Novacure 3941HP manufactured by Asahi Kasei Corporation) and 1 part by weight of a silane coupling agent (A-187 manufactured by Momentive Performance Materials).

<Example 3>

A connecting tape was prepared under the same conditions as in Example 1 except that 5% by weight of a fused silica filler (FB-5D manufactured by Denka Corporation) was added to the resin A.

<Example 4>

A connecting tape was prepared under the same conditions as in Example 1 except that 10% by weight of the fused silica filler was added to the resin A.

<Comparative Example 1>

Without forming an adhesive layer and a release film on the connecting tape, only the same connecting substrate as in Example 1 having a thickness of 50 µm was used.

"Assessment Methods"

(1) Adhesive force of the pressure-sensitive adhesive layer

Samples of the adhesive tape structures corresponding to Examples 1 to 4, each having a width of 1.5 mm and a length of 100 m were prepared.

In this case, two adhesive tapes of 50 m in length were connected with the connecting tape of length 30 cm.

The sample of these adhesive tape structures was attached to the tacking tester (made by RHESCA), and the tacking test based on JISZ3284 was done.

In this case, the probe of the detection unit was ?5 mm, the probe was lowered at a speed of 30 mm/min, brought into contact with the pressure-sensitive adhesive layer, and the adhesive force was measured when raised by pressing with a force of 200 gf/5 mm phi for 1 second. The results are shown in Table 1.

(2) Line drivability

Samples of the adhesive tape structures corresponding to Examples 1 to 4, each having a width of 1.5 mm and a length of 100 m were prepared.

In this case, two 50 m long adhesive tapes were connected with a 30 cm long connecting tape.

The samples of these adhesive tape structures were wound up, respectively, on the reel member which consists of polystyrene and whose outer diameter is (phi) 200 mm and inner diameter is (phi) 50 mm.

Electrodeposition of the pressure-sensitive adhesive layer when the reel member of these adhesive tape structures is attached to the apparatus shown in FIG. 2 to peel the release film, and the pressure-sensitive adhesive layer remaining on the connecting substrate comes into contact with a guide roller containing polytetrafluoroethylene , and the influence on drivability was visually confirmed. The results are shown in Table 1.

In this case, the portion of the guide roller in contact with the pressure-sensitive adhesive layer was set to one place.

In addition, the feed rate of the tape was 200 mm/sec, and the feed pitch of the tape was 200 mm.

(3) Relationship between the peeling force of the peeling film of a connection tape, and the peeling force of the peeling cover film of an adhesive tape

Samples of connecting tapes corresponding to Examples 1 to 4, each having a width of 50 mm and a length of 200 mm were prepared.

Moreover, as an adhesive tape, the thing by which the adhesive bond layer and the peeling cover film were sequentially formed on the base film was created.

In this case, the base film includes PET having a thickness of 50 μm, the adhesive layer includes the resin B having a thickness of 20 μm, and the release cover film includes PET having a thickness of 25 μm. A sample of a 200 mm adhesive tape was prepared.

Then, the samples of the connecting tapes of Examples 1 to 4 are attached to a peel force measuring device (TENSILON manufactured by Orientec Co., Ltd.), and the peeling force of the peeling film to the pressure-sensitive adhesive layer is measured by a method conforming to JIS K 6854, respectively. measured.

In addition, the sample of the adhesive tape was mounted on the same peeling force meter, and the peeling force of the peeling cover film with respect to the adhesive bond layer was measured by the said method.

And ratio (Y/X) of the peeling force (Y) of the peeling film of a connection tape with respect to the peeling force (X) of the peeling cover film of an adhesive tape was computed, respectively. The results are shown in Table 1.

(4) Peelability of the release film of the connecting tape

Samples of the adhesive tape structure corresponding to Examples 1 to 4 and having a width of 1.5 mm and a length of 100 m were created.

In this case, two adhesive tapes with a width of 1.5 mm and a length of 50 m having the same laminated structure as the adhesive tape of (3) were connected with a connecting tape having a length of 30 cm.

The sample of this adhesive tape structure was wound up on the reel member which contained polystyrene and whose outer diameter is (phi) 200 mm and inner diameter (phi) 50 mm, respectively.

And the reel member of each adhesive tape structure was attached to the apparatus shown in FIG. 2, the peeling film was peeled, and the peelability of the peeling film was confirmed visually. The results are shown in Table 1.

In this case, the feed rate of the tape was 200 mm/sec, and the feed pitch of the tape was 200 mm.

(5) Light transmittance of the adhesive layer of the connecting tape

The sample of the adhesive tape structure of width 1.5mm and length 200m corresponding to Examples 1-4 was created.

In this case, 4 adhesive tapes of 50 m in length were connected with the connecting tape of length 30 cm.

The samples of these adhesive tape structures were mounted on a spectrophotometer (CM-3600d by KONIKA MINOLTA), and the light transmittance in wavelength 600nm was measured, respectively. The results are shown in Table 1.

(6) slit property

The sample of the adhesive tape structure of 300 mm in width and 100 m in length corresponding to Examples 1-4 and Comparative Example 1 was created.

In this case, two 50 m long adhesive tapes were connected with a 30 cm long connecting tape.

Next, in the slit apparatus which provided the cutter blade at 1.5 mm intervals on the surface plate, the sample of the adhesive tape structure was moved at the speed|rate of 50 mm/sec, and slitting was performed. At that time, runability was visually confirmed.

In addition, the slit property was performed about the thing immediately after sample preparation, and the thing after aging at the temperature of 40 degreeC for 72 hours.

(7) light sensor recognition

The sample of the adhesive tape structure of width 1.5mm and length 100m corresponding to Examples 1-4 was created.

In this case, two 50 m long adhesive tapes were connected with a 30 cm long connecting tape.

The sample of this adhesive tape structure was wound up on the reel member each containing polystyrene and having an outer diameter of (phi) 200 mm and an inner diameter of (phi) 50 mm.

And the reel member of each adhesive tape structure was attached to the apparatus shown in FIG. 2, and it was made to run, the peeling film was peeled, and it was confirmed whether the optical sensor recognized the connection base material through the adhesive bond layer. The results are shown in Table 1.

In this case, the feed rate of the tape was 200 mm/sec, and the feed pitch of the tape was 200 mm.

In addition, as an optical sensor, the digital fiber sensor (E3X-DA11-S manufactured by OMRON) was used, and the threshold value was set to 1750.

"Evaluation results"

<Relationship between adhesive strength of adhesive layer and line running properties>

As is clear from Table 1, among Examples 1 to 4, in Examples 3 and 4, in which the adhesive force of the pressure-sensitive adhesive layer was 200 gf/5 mmφ or less, the pressure-sensitive adhesive was formed when the pressure-sensitive adhesive layer of the connecting substrate was in contact with the guide roller. Electrodeposition was not carried out on the guide roller, and smooth running property was obtained.

On the other hand, in Examples 1 and 2 in which the adhesive force of the pressure-sensitive adhesive layer exceeded 200 gf/5 mmφ, when the pressure-sensitive adhesive layer of the connecting substrate contacted the guide roller, the pressure-sensitive adhesive was electrodeposited on the guide roller, and There was some jamming.

<Relationship between the peel force ratio of the peeling film and the peeling state of the peeling film>

Examples 3 and 4, wherein the ratio (Y/X) of the peeling force (Y) of the peeling film of the connecting tape to the peeling force (X) of the peeling cover film of the adhesive tape is 2.0 or less, It peeled smoothly, and also about the peeling rate, it was equivalent to the peeling rate of the peeling cover film of an adhesive tape.

On the other hand, for Examples 1 and 2 in which the ratio (Y/X) of the peeling force (Y) of the peeling film of the connecting tape to the peeling force (X) of the peeling cover film of the adhesive tape is greater than 2.0, It peeled slightly slower than the peeling cover film of an adhesive tape.

<Relationship between the light transmittance of the adhesive layer and the recognition property of the light sensor>

As for the light transmittance of the pressure-sensitive adhesive layer and the light sensor recognizability, Examples 1 to 3, in which the light transmittance was 70% or more, were reliably recognized by the light sensor.

On the other hand, about Example 4 in which the light transmittance of an adhesive layer is 58 %, it was not recognized by the optical sensor extremely rarely (once in 100 times or less).

<Slit Castle>

Among Examples 1 to 4, Examples 1, 3, and 4 using those containing Resin A as a material for the pressure-sensitive adhesive layer were able to perform slitting without any problem immediately after sample preparation and after aging.

On the other hand, in Example 2, in which a material containing resin B was used as a material for the pressure-sensitive adhesive layer, meandering accompanied by partial peeling of the release film at the time of slitting occurred, but it was at a usable level.

On the other hand, in Comparative Example 1 in which the pressure-sensitive adhesive layer and the release film were not provided on the connecting substrate, breakage occurred at the time of slitting immediately after sample preparation and after aging.

From the above results, the effect of the present invention could be verified.

1: adhesive tape structure
2: adhesive tape
3: connecting tape
5: light sensor
20: base film
21: adhesive layer
22: release cover film
30: connection description
31: adhesive layer
32: release film
41: substrate side adhesive member
42: peel side adhesive member

Claims (12)

It is an adhesive tape structure in which a plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially installed on a base film are connected through a connection tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate,
While the end of the base film of the adhesive tape and the end of the connecting base of the connecting tape are adhered by the base-side adhesive member,
an end of the release cover film of the adhesive tape and an end of the release film of the connecting tape are adhered by a release-side adhesive member;
and the release cover film and the release film are integrally peeled off;
An adhesive tape structure in which the adhesive layer of the connecting tape is made of a material different from that of the adhesive layer of the adhesive tape. The adhesive tape structure according to claim 1, wherein the connecting substrate of the connecting tape includes a non-transmissive material. The adhesive tape structure of claim 1, wherein the adhesive layer of the connection tape has a transmittance of visible light of 70% or more. The adhesive tape structure of Claim 1 whose peeling force of the adhesive layer of the said connection tape and the peeling film is 2 times or less of the peeling force of the adhesive bond layer of the said adhesive tape, and a peeling cover film. The adhesive tape structure of Claim 1 whose adhesive force of the adhesive layer of the said connection tape with respect to the said guide roller is 200 gf/5 mmphi or less, when conveying the said adhesive tape structure via a guide roller. A plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially installed on a base film are connected through a connection tape in which an adhesive layer and a release film are sequentially installed on a connecting substrate, and an end of the base film of the adhesive tape; The end of the connecting substrate is adhered by the substrate-side adhesive member, and the end of the release cover film of the adhesive tape and the end of the release film of the connecting tape are adhered by the release-side adhesive member, the release cover film and the above an adhesive tape structure configured such that the release film is integrally peeled off, and the adhesive layer of the connecting tape is made of a material different from that of the adhesive layer of the adhesive tape;
The adhesive tape container in which the said adhesive tape structure is wound by traverse winding on the reel member which has a flange space|interval wider than the tape width|variety of the said adhesive tape structure. The adhesive tape container according to claim 6, wherein the connecting substrate of the connecting tape contains a non-transmissive material. The adhesive tape receptor according to claim 6, wherein the adhesive layer of the connecting tape has a transmittance of visible light of 70% or more. The adhesive tape container of Claim 6 whose peeling force of the adhesive layer of the said connection tape, and a peeling film is 2 times or less of the peeling force of the adhesive bond layer of the said adhesive tape, and a peeling cover film. The adhesive tape container of Claim 6 whose adhesive force of the adhesive layer of the said connection tape with respect to the said guide roller is 200 gf/5 mmphi or less, when conveying the said adhesive tape structure via a guide roller. delete delete

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