TW201533203A - Adhesive tape structure and adhesive tape container - Google Patents

Adhesive tape structure and adhesive tape container Download PDF

Info

Publication number
TW201533203A
TW201533203A TW103142984A TW103142984A TW201533203A TW 201533203 A TW201533203 A TW 201533203A TW 103142984 A TW103142984 A TW 103142984A TW 103142984 A TW103142984 A TW 103142984A TW 201533203 A TW201533203 A TW 201533203A
Authority
TW
Taiwan
Prior art keywords
tape
adhesive
adhesive layer
substrate
adhesive tape
Prior art date
Application number
TW103142984A
Other languages
Chinese (zh)
Inventor
Kazunori Hamazaki
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of TW201533203A publication Critical patent/TW201533203A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/403Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H21/00Apparatus for splicing webs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/10Handled articles or webs
    • B65H2701/11Dimensional aspect of article or web
    • B65H2701/113Size
    • B65H2701/1133Size of webs
    • B65H2701/11332Size of webs strip, tape, narrow web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/30Handled filamentary material
    • B65H2701/37Tapes
    • B65H2701/377Adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention provides a technique allowing a tremendous extension in length to be achieved for an adhesive tape without having to modify an existing base support or adhesive coating mechanism. The present invention is an adhesive tape structure (1) comprising a plurality of adhesive tapes (2) linked through linker tapes (3). A predetermined interval is provided between an extremity of an adhesive tape (2) and an extremity of a linker tape (3). In this state, an extremity of a base film (20) of the adhesive tape (2) and an extremity of a linker substrate (30) of the linker tape (3) are adhered together by a substrate-side adhesive member (41). At the same time, so that a release cover film (22) of the adhesive tape (2) and a release film (32) of the linker tape (3) can be released as one strip in the length direction of the tape, an extremity of the release cover film (22) and an extremity of the release film (32) are adhered together by a release-side adhesive member (42). The type of base resin for a pressure-sensitive adhesive layer (45A) of the substrate-side adhesive member (41) and the type of base resin for a pressure-sensitive adhesive layer (46B) of the release-side adhesive member (42) are different.

Description

接著帶構造體及接著帶收容體 Next with the structure and then with the receiving body

本發明係關於一種使得用於太陽電池之TAB線接合等的接著帶長形化的技術。 The present invention relates to a technique for making an extension tape for TAB wire bonding or the like of a solar cell.

習知以來,已知有用於將各種電子零件等接著的長形的接著帶。 Since the prior art, an elongate belt for elongating various electronic parts and the like has been known.

此種接著帶係以呈窄寬而形成於長形的剝離片上且呈捲狀捲取於轉盤的形態出貨。 Such an adhesive tape is formed in a form of a narrow strip formed on an elongated release sheet and wound up in a roll form on a turntable.

而且,於製造現場,自轉盤抽出接著帶而使用,若接著帶用盡,則使生產線暫時停止而連同轉盤一併更換接著帶。 Further, at the manufacturing site, the belt is taken out from the turntable and used, and if the belt is used up, the production line is temporarily stopped and replaced with the turntable.

然而,若接著帶之長度短,則每當更換轉盤時須使生產線停止,從而使生產效率下降。 However, if the length of the belt is short, the production line must be stopped every time the turntable is replaced, so that the production efficiency is lowered.

因此,近年來,希望使可捲繞於1個轉盤上之接著帶的長度儘量長,即所謂「長形化」。 Therefore, in recent years, it has been desired to make the length of the endless belt that can be wound around one turntable as long as possible, that is, "longer".

然而,若欲使接著帶長形化,則需要採取使塗布接著劑之捲筒之長度增長、或使塗布機構之捲出、捲取部大型化等應對措施,並且,大幅的長形化存在限制,如必須均勻地控制接著帶之塗布厚度等。 However, in order to increase the length of the adhesive tape, it is necessary to take measures such as increasing the length of the roll for applying the adhesive, or winding up the coating mechanism, and increasing the size of the winding portion, and the large lengthening exists. The limitation is that it is necessary to uniformly control the coating thickness of the subsequent tape and the like.

再者,作為與本發明相關的先行技術文獻,例如有以下所示者。 Further, as a prior art document related to the present invention, for example, the following is shown.

[先行技術文獻] [Advanced technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2011-52061號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-52061

本發明係考慮到上述習知之技術問題而完成,其目的在於提供一種無須變更現有的捲筒或接著劑之塗布機構便能達成接著帶之大幅的長形化的技術。 The present invention has been made in view of the above-described technical problems, and an object thereof is to provide a technique for achieving a large enlargement of a subsequent belt without changing a conventional coating mechanism of a reel or an adhesive.

為了達成上述目的,本發明係一種接著帶構造體,其係複數個接著帶經由連結帶連結而成者,該接著帶係於基底膜上依序設有接著劑層與剝離覆膜,該連結帶係於連結基材上依序設有黏著劑層與剝離膜;該接著帶構造體中,於在上述接著帶之端部與上述連結帶之端部之間設有既定間隔的狀態下,使上述接著帶之基底膜之端部與上述連結帶之連結基材之端部藉由基材側接著構件而接著,並且,以上述接著帶之剝離覆膜與上述連結帶之剝離膜可於帶長度方向一體地剝離的方式、使該剝離覆膜之端部與該剝離膜之端部藉由剝離側接著構件而接著,上述基材側接著構件之黏著層之基底樹脂的種類與上述剝離側接著構件之黏著層之基底樹脂的種類不同。 In order to achieve the above object, the present invention provides an adhesive tape structure in which a plurality of subsequent tapes are joined via a connecting tape, and the adhesive tape is sequentially provided with an adhesive layer and a release film on the base film. The adhesive tape layer and the release film are sequentially provided on the connecting substrate; and the adhesive tape structure is provided with a predetermined interval between the end portion of the adhesive tape and the end portion of the connecting tape. The end portion of the base film of the adhesive tape and the end portion of the connecting substrate of the connecting tape are connected by a substrate-side adhesive member, and the release film of the adhesive tape and the adhesive tape of the adhesive tape can be used. The method of integrally peeling the belt in the longitudinal direction, and the end portion of the peeling film and the end portion of the release film are separated by the peeling side joining member, and the type of the base resin of the adhesive layer of the base material side connecting member and the peeling The type of the base resin of the adhesive layer of the side-by-side member is different.

又,本發明係一種接著帶構造體,其係複數個接著帶經由連結帶連結而成者,該接著帶係於基底膜上依序設有接著劑層與剝離覆膜,該連結帶係於連結基材上依序設有黏著劑層與剝離膜;該接著帶構造體中,於在上 述接著帶之端部與上述連結帶之端部之間設有既定間隔的狀態下,使上述接著帶之基底膜之端部與上述連結帶之連結基材之端部藉由基材側接著構件而接著,並且,以上述接著帶之剝離覆膜與上述連結帶之剝離膜可於帶長度方向一體地剝離的方式、使該剝離覆膜之端部與該剝離膜之端部藉由剝離側接著構件而接著,上述基材側接著構件之黏著層之厚度與上述剝離側接著構件之黏著層之厚度不同。 Moreover, the present invention is an adhesive tape structure in which a plurality of subsequent tapes are connected via a connecting tape, and the adhesive tape is sequentially provided with an adhesive layer and a release film on the base film, and the adhesive tape is attached to the adhesive tape. An adhesive layer and a release film are sequentially disposed on the connecting substrate; In a state in which a predetermined interval is formed between the end portion of the tape and the end portion of the connecting tape, the end portion of the base film of the adhesive tape and the end portion of the connecting substrate of the connecting tape are followed by the substrate side. In addition, the peeling film of the above-mentioned adhesive tape and the peeling film of the said connecting tape can be peeled in the longitudinal direction of the tape, and the edge part of the peeling film and the edge part of the peeling film are peeled off. Next, the thickness of the adhesive layer of the substrate-side member is different from the thickness of the adhesive layer of the peel-side member.

本發明中,於上述基材側接著構件之黏著層之厚度與上述剝離側接著構件之黏著層之厚度不同的情況下亦有效。 In the present invention, it is also effective when the thickness of the adhesive layer of the substrate-side member is different from the thickness of the adhesive layer of the peel-side member.

本發明中,於上述剝離側接著構件之黏著層之厚度薄於上述基材側接著構件之黏著層之厚度的情況下亦有效。 In the present invention, it is also effective when the thickness of the adhesive layer of the peeling-side member is thinner than the thickness of the adhesive layer of the substrate-side member.

本發明中,於上述剝離側接著構件之黏著層之厚度相對於上述基材側接著構件之黏著層之厚度的比率小於50/100的情況下亦有效。 In the present invention, it is also effective when the ratio of the thickness of the adhesive layer of the peeling-side member to the thickness of the adhesive layer of the substrate-side adhesive member is less than 50/100.

本發明中,於上述連結帶之連結基材係由非透光性材料構成的情況下亦有效。 In the present invention, it is also effective when the connecting base material of the connecting belt is made of a non-translucent material.

另一方面,本發明係一種接著帶收容體,其係將上述之任一接著帶構造體以往復(traverse)纏捲之方式捲繞於轉盤構件,該轉盤構件具有寬度大於該接著帶構造體之帶寬的凸緣間隔。 In another aspect, the present invention is an adhesive tape holder which is wound around a turntable member in a traverse winding manner, the turntable member having a width larger than the adhesive tape structure. The flange spacing of the bandwidth.

本發明之接著帶構造體係以如下方式構成,即,接著帶之基底膜之端部與連結帶之連結基材之端部藉由基材側接著構件而接著,並且,以剝離覆膜與剝離膜可一體地剝離的方式、使接著帶之剝離覆膜之端部與連結帶之剝離膜之端部藉由剝離側接著構件而接著;故而,作為接著 用帶之基本構成及功能與習知之接著用帶相同,能使用現有的貼附裝置對於被接著體連續地貼附接著劑。 The adhesive tape structure system of the present invention is configured such that the end portion of the base film of the tape and the end portion of the connecting substrate of the bonding tape are followed by the substrate-side member, and the film is peeled off and peeled off. The film can be integrally peeled off, and the end portion of the release film of the adhesive tape and the end portion of the release film of the adhesive tape are followed by the peeling side adhesive member; The basic structure and function of the belt are the same as those of the conventional belt, and the adhesive can be continuously attached to the adherend using the conventional attaching device.

結果,根據本發明,無須變更現有的捲筒或接著劑之塗布機構便能達成接著帶之大幅的長形化。 As a result, according to the present invention, it is possible to achieve a large enlargement of the subsequent belt without changing the coating mechanism of the existing reel or the adhesive.

而且,根據本發明,因基材側接著構件之黏著層之基底樹脂的種類與剝離側接著構件之黏著層之基底樹脂的種類不同,故而,當於連結帶之端部將剝離膜自黏著劑層剝去時、以及於接著帶之端部將剝離覆膜自接著劑層剝去時,即便剝離側接著構件之黏著層接觸於基材側接著構件之黏著層,亦能防止黏著劑彼此接著,從而能順利地剝去剝離膜及剝離覆膜。 Further, according to the present invention, since the type of the base resin of the adhesive layer of the substrate-side member is different from the type of the base resin of the adhesive layer of the peel-side member, the release film self-adhesive agent is applied to the end portion of the adhesive tape. When the layer is peeled off and the release film is peeled off from the adhesive layer at the end of the tape, even if the adhesive layer of the peeling side contact member contacts the adhesive layer of the substrate side adhesive member, the adhesive can be prevented from following each other. Therefore, the release film and the release film can be smoothly peeled off.

本發明中,當基材側接著構件之黏著層之厚度與剝離側接著構件之黏著層之厚度不同時,例如若構成為剝離側接著構件之黏著層之厚度薄於上述基材側接著構件之黏著層之厚度時,與剝離側接著構件之黏著層之厚度形成為等同於基材側接著構件之黏著層之厚度的情況相比,能減小該等黏著層間之接著力,故而,當於連結帶之端部將剝離膜自黏著劑層剝去時、以及於接著帶之端部將剝離覆膜自接著劑層剝去時,即便基材側接著構件之黏著層接觸於剝離側接著構件之黏著層,亦能確實地防止該等黏著層彼此接著,從而能順利地剝去剝離膜。 In the present invention, when the thickness of the adhesive layer of the substrate-side member is different from the thickness of the adhesive layer of the peeling-side member, for example, the thickness of the adhesive layer formed as the peeling-side member is thinner than the substrate-side member. When the thickness of the adhesive layer is formed, the thickness of the adhesive layer of the peeling-side adhesive member is formed to be equivalent to the thickness of the adhesive layer of the substrate-side adhesive member, and the adhesion between the adhesive layers can be reduced. When the peeling film is peeled off from the adhesive layer at the end of the connecting tape, and the peeling film is peeled off from the adhesive layer at the end of the tape, even if the adhesive layer of the substrate-side adhesive member contacts the peeling-side member The adhesive layer can also reliably prevent the adhesive layers from coming to each other, so that the release film can be smoothly peeled off.

此時,若構成為剝離側接著構件之黏著層之厚度相對於基材側接著構件之黏著層之厚度的比率小於50/100,則能進一步確實地避免剝離側接著構件之黏著層接觸於基材側接著構件之黏著層,故而,能更順利地剝去剝離膜及剝離覆膜。 In this case, if the ratio of the thickness of the adhesive layer constituting the peeling-side member to the thickness of the adhesive layer of the substrate-side adhesive member is less than 50/100, the adhesive layer of the peeling-side member can be surely prevented from contacting the base. Since the material is adhered to the adhesive layer of the member, the release film and the release film can be peeled off more smoothly.

本發明中,當連結帶之連結基材係由非透光性材料構成時,能利用光感測器檢測出連結基材,藉此,能跳過連結帶之部分而對被接著體連續地貼附接著劑。 In the present invention, when the connecting substrate of the connecting tape is made of a non-translucent material, the connecting substrate can be detected by the photosensor, whereby the portion of the connecting tape can be skipped and the adherend can be continuously Attach an adhesive.

另一方面,本發明之接著帶收容體中,上述接著帶構造體係以往復纏捲之方式捲繞於轉盤,該轉盤具有寬於該接著帶構造體之帶寬的凸緣間隔,根據本發明之接著帶收容體,能捲繞極長的接著帶構造體且將其順利地抽出,故而,於接著帶之貼附步驟中,無須頻繁地更換轉盤,從而能大幅地提升生產效率。 In another aspect, in the adhesive tape container of the present invention, the adhesive tape structure system is wound around the turntable in a rewinding manner, the turntable having a flange interval wider than a bandwidth of the adhesive tape structure, according to the present invention Then, with the container, the extremely long end belt structure can be wound and smoothly extracted. Therefore, in the attaching step of the belt, the turntable does not need to be frequently replaced, and the production efficiency can be greatly improved.

1‧‧‧接著帶構造體 1‧‧‧With the structure

2‧‧‧接著帶 2‧‧‧With belt

3‧‧‧連結帶 3‧‧‧Links

20‧‧‧基底膜 20‧‧‧ basement membrane

21‧‧‧接著劑層 21‧‧‧ adhesive layer

22‧‧‧剝離覆膜 22‧‧‧ peeling film

30‧‧‧連結基材 30‧‧‧Linking substrate

31‧‧‧黏著劑層 31‧‧‧Adhesive layer

32‧‧‧剝離膜 32‧‧‧Release film

41‧‧‧基材側接著構件 41‧‧‧Substrate side follower

45、45A‧‧‧黏著層 45, 45A‧‧‧ adhesive layer

42‧‧‧剝離側接著構件 42‧‧‧ peeling side attachment members

46、46B‧‧‧黏著層 46, 46B‧‧‧ adhesive layer

50‧‧‧接著帶收容體 50‧‧‧With the receiving body

圖1(a)係本發明之接著帶構造體之實施形態之側視構成圖,圖1(b)係同接著帶構造體之主要部分之側視構成圖。 Fig. 1(a) is a side view showing a configuration of an embodiment of an adhesive tape structure according to the present invention, and Fig. 1(b) is a side view showing the main part of the tape structure.

圖2係用於說明使用本實施形態之接著帶構造體而將接著帶之接著劑層熱壓接於被接著體的步驟的圖。 Fig. 2 is a view for explaining a step of thermocompression bonding the adhesive layer of the subsequent tape to the adherend using the adhesive tape structure of the present embodiment.

圖3(a)、(b)係表示自同接著帶構造體將接著帶之剝離覆膜與連結帶之剝離膜剝離的狀態的說明圖。 (a) and (b) of FIG. 3 are explanatory views showing a state in which the release film of the subsequent tape and the release film of the connection tape are peeled off from the same tape structure.

圖4(a)、(b)係用於表示本發明之課題的說明圖。 4(a) and 4(b) are explanatory views for explaining the problem of the present invention.

圖5(a)~(c)係表示本發明之實施形態之主要部分的側視圖。 5(a) to 5(c) are side views showing essential parts of an embodiment of the present invention.

圖6係表示本發明之另一實施形態之主要部分的側視圖。 Fig. 6 is a side view showing the essential part of another embodiment of the present invention.

圖7係表示本發明之另一實施形態之主要部分的側視圖。 Fig. 7 is a side view showing the essential part of another embodiment of the present invention.

圖8(a)係表示本發明之接著帶收容體之實施形態之構成的前視圖,圖8(b)、(c)係表示捲繞於轉盤構件之捲芯軸部的接著膜之間隔的說明圖。 Fig. 8 (a) is a front view showing a configuration of an embodiment of the tape holder according to the present invention, and Figs. 8 (b) and (c) are views showing the interval between the film which is wound around the core portion of the turntable member. Illustrating.

以下,參照圖式對本發明之較佳實施形態進行詳細說明。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

圖1(a)係表示本發明之接著帶構造體之實施形態之基本構成的側視圖,圖1(b)係表示同接著帶構造體之主要部分的側視圖。 Fig. 1 (a) is a side view showing a basic configuration of an embodiment of an adhesive tape structure according to the present invention, and Fig. 1 (b) is a side view showing a main portion of the same tape structure.

本實施形態之接著帶構造體1係複數個接著帶2分別經由連結帶3而呈直線狀連結而成的一連串的長形者。 The subsequent belt structure 1 of the present embodiment is a series of elongated persons in which a plurality of subsequent belts 2 are linearly connected via the connecting belt 3, respectively.

此處,接著帶2具有分別相同的構成,且係於基底膜20之整個面上依序設有接著劑層21與剝離覆膜22之所謂3層構造者。 Here, the tape 2 has the same configuration, and is a so-called three-layer structure in which the adhesive layer 21 and the release film 22 are sequentially provided on the entire surface of the base film 20.

另一方面,連結帶3具有分別相同的構成,且係於連結基材30之整個面上依序設有黏著劑層31與剝離膜32之所謂3層構造者。 On the other hand, the connection tape 3 has the same configuration, and is a so-called three-layer structure in which the adhesive layer 31 and the release film 32 are sequentially provided on the entire surface of the connection substrate 30.

本實施形態中,連結帶3係以長度短於接著帶2之方式構成。再者,各接著帶2之長度、各連結帶3之長度既可分別相同又可分別不同。 In the present embodiment, the connecting belt 3 is configured to have a shorter length than the succeeding belt 2. Furthermore, the length of each of the subsequent belts 2 and the length of each of the connecting belts 3 may be the same or different.

接著帶2之基底膜20之端部的上表面(接著劑層21之相反側之面)、與連結帶3之連結基材30之端部的上表面(黏著劑層31之相反側之面)分別藉由基材側接著構件41而接著連結。 Then, the upper surface of the end portion of the base film 20 of the tape 2 (the surface opposite to the adhesive layer 21) and the upper surface of the end portion of the bonding substrate 30 of the bonding tape 3 (the opposite side of the adhesive layer 31) ) are respectively joined by the substrate-side member 41.

進而,接著帶2之剝離覆膜22之端部的上表面(接著劑層21之相反側之面)與連結帶3之剝離膜32之端部的上表面(黏著劑層31之相反側之面)藉由剝離側接著構件42而接著。 Further, the upper surface of the end portion of the peeling film 22 of the tape 2 (the surface opposite to the adhesive layer 21) and the upper surface of the end portion of the release film 32 of the joining tape 3 (the opposite side of the adhesive layer 31) The surface is followed by peeling off the side-contact member 42.

接著帶2之基底膜20可使用例如由PET構成者。 Next, the base film 20 of the belt 2 can be made of, for example, PET.

該基底膜20之厚度並無特別限定,但自確保材料強度與不增大捲徑之觀點出發,可較佳地使用厚度為10~100μm者。 The thickness of the base film 20 is not particularly limited, but a thickness of 10 to 100 μm can be preferably used from the viewpoint of ensuring the strength of the material and not increasing the winding diameter.

並且,基底膜20之寬度並無特別限定,但自確實地覆蓋各 種電子零件之觀點出發,可較佳地使用寬度為200~5000μm者。 Further, the width of the base film 20 is not particularly limited, but it is surely covered by each From the viewpoint of electronic components, a width of 200 to 5000 μm can be preferably used.

再者,基底膜20的上表面亦可例如利用聚矽氧樹脂實施剝離處理。 Further, the upper surface of the base film 20 may be subjected to a peeling treatment using, for example, a polyoxymethylene resin.

接著帶2之接著劑層21可使用通常的接著用帶之接著劑中採用的樹脂、尤其是熱固性樹脂(例如環氧系樹脂、苯氧系樹脂、胺基甲酸酯系樹脂等)。 Next, the adhesive layer 21 of the tape 2 can be a resin used in a usual adhesive for the tape, in particular, a thermosetting resin (for example, an epoxy resin, a phenoxy resin, a urethane resin, or the like).

該接著劑層21之厚度並無特別限定,但自將各種電子零件之高度存在不均之端子確實地連接的觀點出發,更佳為將其厚度設定為10~100μm。 The thickness of the adhesive layer 21 is not particularly limited. However, from the viewpoint of reliably connecting terminals having uneven heights of various electronic components, the thickness thereof is preferably set to 10 to 100 μm.

接著帶2之剝離覆膜22係保護接著劑層21者,且係使用時被剝離者。 Next, the release film 22 of the tape 2 protects the adhesive layer 21 and is peeled off when used.

該剝離覆膜22可使用例如由PET構成者。 As the release film 22, for example, a member made of PET can be used.

本發明中,剝離覆膜22之厚度並無特別限定,但自確保材料強度與不增大捲徑之觀點出發,更佳為設定為10~100μm。 In the present invention, the thickness of the release film 22 is not particularly limited, but is preferably set to 10 to 100 μm from the viewpoint of ensuring the strength of the material and not increasing the winding diameter.

綜上所述,較佳的接著帶2之厚度為30~300μm。 In summary, the preferred thickness of the adhesive tape 2 is 30 to 300 μm.

另一方面,上述接著帶2之長度並無特別限定,但若考慮到使用接著帶構造體1時減少跳過的次數及接著帶2之塗布設備的最大塗布長度,則可較佳地使用長度為50~1000m者。 On the other hand, the length of the above-mentioned adhesive tape 2 is not particularly limited, but the length can be preferably used in consideration of the number of times of skipping when using the tape structure 1 and the maximum coating length of the coating device of the tape 2 For 50~1000m.

另一方面,作為連結帶3之連結基材30,可使用由能被光感測器檢測出之非透光性材料構成者。 On the other hand, as the connecting base material 30 of the connecting tape 3, a non-translucent material which can be detected by a photo sensor can be used.

作為此種連結基材30,可使用例如於由PET構成之樹脂中分散有例如黑色的填料(填充材)者。 As such a connecting base material 30, for example, a filler (filler) in which black is dispersed in a resin composed of PET can be used.

連結基材30之厚度並無特別限定,但自藉由確保與接著帶2之基底膜20等同之厚度而防止捲取時產生階差的觀點出發,可較佳地使 用厚度為10~100μm者。 The thickness of the connecting base material 30 is not particularly limited, but it can be preferably made from the viewpoint of ensuring a thickness equivalent to the base film 20 of the tape 2 to prevent a step difference during winding. Use a thickness of 10 ~ 100μm.

另一方面,連結基材30之寬度並無特別限定,但自順利地進行接著帶構造體1之捲取、抽出及移行之觀點出發,較佳為設定為與接著帶2之基底膜20之寬度等同。 On the other hand, the width of the connecting base material 30 is not particularly limited, but from the viewpoint of smoothly winding, extracting, and traversing the adhesive tape structure 1, it is preferable to set the base film 20 with the tape 2 The width is equal.

連結帶3之黏著劑層31係用於順利地剝離連結帶3之剝離膜32者。 The adhesive layer 31 of the connecting tape 3 is used to smoothly peel off the peeling film 32 of the connecting tape 3.

即,如下文所述,連結帶3之剝離膜32係與接著帶2之剝離覆膜22一同被剝離,但若於連結帶3之剝離膜32與連結基材30之間不存在具有黏著性之物質,則當剝去剝離膜32時其速度會臨時變快,故而,生產線之搬送速度可能會產生偏差。 That is, as described below, the release film 32 of the connection tape 3 is peeled off together with the release film 22 of the tape 2, but there is no adhesion between the release film 32 of the connection tape 3 and the connection substrate 30. When the material is peeled off, the speed of the peeling film 32 is temporarily increased, and thus the conveying speed of the production line may vary.

並且,若於連結帶3之剝離膜32與連結基材30之間不存在具有黏著性之物質,則當製造接著帶構造體1時之開縫(slit,切斷)時會產生蛇行,從而,帶可能會產生褶皺、或帶會斷開。 Further, when there is no adhesive property between the release film 32 of the connecting tape 3 and the connecting base material 30, a serpentine occurs when the slit is formed when the tape structure 1 is subsequently produced. The belt may wrinkle or the belt may break.

本發明之黏著劑層31係用於防止上述不良狀況者。 The adhesive layer 31 of the present invention is used to prevent the above-mentioned problems.

若考慮到此目的,則較佳為,構成為連結帶3之黏著劑層31與剝離膜32之剝離力為接著帶2之接著劑層21與剝離覆膜22之剝離力的0.2倍以上2.0倍以下。 In view of the above, it is preferable that the peeling force of the adhesive layer 31 and the release film 32 of the connecting tape 3 is 0.2 times or more of the peeling force of the adhesive layer 21 and the peeling film 22 of the tape 2 Less than the following.

此處,「剝離力」可基於JIS K 6854-3、使用OLIENTEC(股)製造之TENSILON作為拉伸試驗機、且以剝離速度300mm/min進行T型剝離試驗而測定。 Here, the "peeling force" can be measured based on JIS K 6854-3, using TENSILON manufactured by OLIENTEC as a tensile tester, and performing a T-peel test at a peeling speed of 300 mm/min.

若連結帶3之黏著劑層31與剝離膜32之剝離力小於接著帶2之接著劑層21與剝離覆膜22之剝離力的0.2倍,則可能會因剝去剝離膜 32時之速度上升而使生產線之搬送速度產生偏差、或者可能會因開縫時之蛇行而使帶產生褶皺或使帶斷開。 If the peeling force of the adhesive layer 31 of the joining tape 3 and the peeling film 32 is less than 0.2 times the peeling force of the adhesive layer 21 of the tape 2 and the peeling film 22, peeling film may be peeled off. The speed of 32 o'clock rises to cause a deviation in the conveying speed of the production line, or the belt may wrinkle or break the belt due to the meandering during the slitting.

另一方面,若連結帶3之黏著劑層31與剝離膜32之剝離力大於接著帶2之接著劑層21與剝離覆膜22之剝離力的2.0倍,則可能無法自連結帶3之黏著劑層31順利地剝去剝離膜32。 On the other hand, if the peeling force of the adhesive layer 31 of the joining tape 3 and the peeling film 32 is more than 2.0 times of the peeling force of the adhesive layer 21 and the peeling film 22 of the tape 2, the adhesive tape of the adhesive tape 3 may not be adhered. The agent layer 31 smoothly peels off the release film 32.

只要滿足以上之條件,則連結帶3之黏著劑層31可使用組成與接著帶2之接著劑層21相同或不同的任一種樹脂。再者,作為組成與接著帶2之接著劑層21不同之樹脂,可列舉例如聚矽氧系樹脂。 As long as the above conditions are satisfied, the adhesive layer 31 of the bonding tape 3 may be any resin which has the same or different composition as the adhesive layer 21 of the tape 2 subsequent thereto. Further, as the resin having a composition different from that of the adhesive layer 21 of the tape 2, for example, a polyoxynenoid resin is exemplified.

並且,為了滿足上述條件,黏著劑層31之厚度可設定為10~100μm。 Further, in order to satisfy the above conditions, the thickness of the adhesive layer 31 can be set to 10 to 100 μm.

另一方面,連結帶3之黏著劑層31係原本並不轉印至被接著體而跳過的部分,故而,藉由僅對黏著劑層31之部分使用非硬化系之樹脂或硬化完之樹脂,能提升保存穩定性。 On the other hand, the adhesive layer 31 of the connecting tape 3 is not originally transferred to the portion to be skipped by the adherend, and therefore, the non-hardening resin or hardened portion is used only for the portion of the adhesive layer 31. Resin for improved storage stability.

並且,當接著帶2之接著劑層21使用例如高價的填料等時,藉由以相對低價的材料來形成黏著劑層31,能抑制製造成本。 Further, when the adhesive layer 21 of the tape 2 is used, for example, a high-priced filler or the like, by forming the adhesive layer 31 with a relatively low-cost material, the manufacturing cost can be suppressed.

本發明中,亦可利用透光性材料來構成黏著劑層31。 In the present invention, the adhesive layer 31 may be formed of a light transmissive material.

即,藉由如上所述利用非透光性材料來構成連結帶3之連結基材30,能藉由光感測器檢測出連結帶3之連結基材30,但當光感測器位於黏著劑層31之側時,有時,黏著劑層31會遮住光而使得無法檢測出連結基材30。 That is, by connecting the connecting substrate 30 of the connecting tape 3 with the non-translucent material as described above, the connecting substrate 30 of the connecting tape 3 can be detected by the photo sensor, but when the photo sensor is attached When the side of the agent layer 31 is present, the adhesive layer 31 may block light so that the connection substrate 30 cannot be detected.

因此,此情況下,藉由利用透光性材料來構成連結帶3之黏著劑層31,可由光感測器經由黏著劑層31而檢測出連結基材30。 Therefore, in this case, the adhesive layer 31 of the connection tape 3 is formed by the light-transmitting material, and the connection substrate 30 can be detected by the photosensor via the adhesive layer 31.

本發明中,雖未特別限定,但自利用光感測器經由黏著劑層31而確實地檢測出連結基材30的觀點出發,更佳為,黏著劑層31構成為可視光線之 穿透率(透光率)為70%以上。 In the present invention, the adhesive layer 31 is preferably configured to be visible light from the viewpoint of reliably detecting the connection base material 30 via the adhesive layer 31 by the photosensor. The transmittance (light transmittance) is 70% or more.

連結帶3之剝離膜32係保護黏著劑層31者,且係使用時被剝離者。 The release film 32 of the connection tape 3 protects the adhesive layer 31 and is peeled off during use.

該剝離膜32可使用例如由PET構成者。 As the release film 32, for example, a member made of PET can be used.

本發明中,剝離膜32之厚度並無特別限定,但自藉由確保與接著帶2之剝離覆膜22等同之厚度而防止捲取時產生階差的觀點出發,更佳為設定為10~100μm。 In the present invention, the thickness of the release film 32 is not particularly limited, but it is preferably set to 10 from the viewpoint of ensuring a thickness equal to the thickness of the release film 22 of the tape 2 to prevent stepping during winding. 100 μm.

綜上所述,較佳的連結帶3之厚度為30~300μm,且較佳為使用具有與接著帶2等同之厚度者。 In summary, the preferred connecting strip 3 has a thickness of 30 to 300 μm, and preferably has a thickness equivalent to that of the succeeding strip 2.

另一方面,上述連結帶3之長度並無特別限定,但自可利用光感測器進行感測、且使線之搬送速度儘量不下降的觀點出發,更佳為設定為5~100cm。 On the other hand, the length of the above-mentioned connecting belt 3 is not particularly limited, but it is preferably set to 5 to 100 cm from the viewpoint of being able to be sensed by the photosensor and the line conveying speed is not lowered as much as possible.

基材側接著構件41係藉由設於基底43上之黏著層45而將接著帶2之基底膜20之端部與連結帶3之連結基材30之端部牢固地接著者。 The substrate-side member 41 is firmly adhered to the end portion of the base film 20 of the tape 2 and the end portion of the connection substrate 30 of the connection tape 3 by the adhesive layer 45 provided on the substrate 43.

另一方面,剝離側接著構件42係藉由設於基底44上之黏著層46而將接著帶2之剝離覆膜22之端部與連結帶3之剝離膜32之端部牢固地接著者。 On the other hand, the peeling side following member 42 is firmly adhered to the end portion of the peeling film 22 of the adhesive tape 2 and the end portion of the peeling film 32 of the connecting tape 3 by the adhesive layer 46 provided on the base 44.

再者,本發明中,接著帶2之端部與連結帶3之端部係如下文所述般設有微小的間隙。 Further, in the present invention, the end portion of the tape 2 and the end portion of the connecting tape 3 are provided with minute gaps as will be described later.

而且,本發明之接著帶構造體1係利用上述連結帶3將2個以上的上述接著帶2分別連結而得者。 Further, the adhesive tape structure 1 of the present invention is obtained by connecting two or more of the above-described adhesive tapes 2 to each other by the above-mentioned connecting tape 3.

圖2係用於說明使用本實施形態之接著帶構造體將接著帶之接著劑層熱壓接於被接著體之步驟的圖,圖3(a)、(b)係表示自同接著 帶構造體將接著帶之剝離覆膜與連結帶之剝離膜剝離之狀態的說明圖。 Fig. 2 is a view for explaining a step of thermocompression bonding a subsequent adhesive layer to a member to be bonded using the adhesive tape structure of the present embodiment, and Figs. 3(a) and (b) show the same steps. An explanatory view of a state in which the tape structure peels off the release film of the tape and the release film of the connection tape.

如圖2所示,本實施形態中,自捲取於轉盤構件10之接著帶構造體1之卷1A抽出接著帶構造體1,經由抽出輥11轉換方向,利用剝離輥12將上述接著帶2之剝離覆膜22與連結帶3之剝離膜32剝離。 As shown in Fig. 2, in the present embodiment, the roll-up structure 1 is taken out from the roll 1A of the tape structure 1 wound on the turntable member 10, and the direction is switched by the take-up roll 11, and the above-mentioned tape 2 is removed by the peeling roller 12. The release film 22 is peeled off from the release film 32 of the connection tape 3.

此處,係利用剝離輥12之動作而自接著劑層21剝去接著帶2之剝離覆膜22,但因剝離覆膜22係藉由剝離側接著構件42而與連結帶3之剝離膜32接著,故而,能一體地剝去接著帶2之剝離覆膜22與連結帶3之剝離膜32(參照圖3(a)、(b))。 Here, the release film 22 of the adhesive tape 2 is peeled off from the adhesive layer 21 by the operation of the peeling roller 12, but the release film 22 is separated from the release tape 32 of the adhesive tape 3 by the peeling side adhesive member 42. Then, the release film 32 of the peeling film 22 of the tape 2 and the connection tape 3 can be integrally peeled off (refer FIG. 3 (a), (b)).

之後,利用輥13~15搬送接著帶構造體1,將接著帶構造體1之應熱壓接的部分配置於熱壓接頭16與被接著體17之間,於該位置使熱壓接頭16動作而將接著帶2之接著劑層21轉印於被接著體17。 Thereafter, the subsequent belt structure 1 is conveyed by the rollers 13 to 15, and the portion to be thermocompression bonded to the belt structure 1 is placed between the thermocompression joint 16 and the to-be-attached body 17, and the thermocompression joint 16 is operated at this position. On the other hand, the adhesive layer 21 of the tape 2 is transferred to the adherend 17 .

此時,利用光感測器5檢測有無連結帶3之非透光性連結基材30,當已檢測出連結基材30時,以連結帶3不位於熱壓接頭16與被接著體17之間的方式、即連結帶3之黏著劑層31不會被轉印至被接著體17的方式控制接著帶構造體1的搬送。 At this time, the non-transmissive connecting substrate 30 of the connecting tape 3 is detected by the photo sensor 5, and when the connecting substrate 30 has been detected, the connecting tape 3 is not located in the thermocompression bonding joint 16 and the adherend 17 The manner in which the adhesive layer 31 of the connecting tape 3 is transferred to the adherend 17 is controlled so as not to be transported by the tape structure 1 .

本發明中,藉由如上述所述利用透光性材料來構成連結帶3之黏著劑層31,從而,不僅於光感測器5位於連結帶3之連結基材30側時、而且於光感測器5位於連結帶3之黏著劑層31側時,均能由光感測器5經由黏著劑層31而檢測出連結基材30。 In the present invention, the adhesive layer 31 of the connecting tape 3 is formed of a light-transmitting material as described above, so that not only when the photosensor 5 is positioned on the side of the connecting substrate 30 of the connecting tape 3 but also in the light When the sensor 5 is located on the side of the adhesive layer 31 of the connection tape 3, the connection substrate 30 can be detected by the photo sensor 5 via the adhesive layer 31.

而且,上述熱壓接步驟結束後,利用導輥18使接著帶構造體1轉換方向而進行搬送,且利用捲取裝置19捲取接著帶構造體1。 After the completion of the thermocompression bonding step, the belt structure 18 is conveyed by the guide roller 18, and the belt structure 19 is taken up by the winding device 19.

此時,本實施形態中,因連結帶3之黏著劑層31不會被轉印至被接著 體17,故而,當利用捲取裝置19捲取接著帶構造體1時,殘留於接著帶構造體1上之黏著劑層31接著於導輥18時會轉著。 At this time, in the present embodiment, the adhesive layer 31 of the connecting tape 3 is not transferred to be attached. Since the body 17 is taken up by the winding device 19, the adhesive layer 31 remaining on the tape structure 1 is rotated next to the guide roller 18.

本發明中,為了防止此種不良狀況,可將連結帶3之黏著劑層31對導輥18之黏力調整為200gf/5mm φ以下。 In the present invention, in order to prevent such a problem, the adhesive force of the adhesive layer 31 of the connecting tape 3 to the guide roller 18 can be adjusted to 200 gf/5 mm φ or less.

此時,作為導輥18,可使用聚矽氧樹脂製之導輥、或亦可使用對導輥18之表面利用聚矽氧樹脂或聚四氟乙烯樹脂等剝離性之樹脂進行加工後所得的導輥。 In this case, as the guide roller 18, a conductive roller made of polyoxyn resin may be used, or a surface of the guide roller 18 may be processed by using a resin such as polyether oxide resin or polytetrafluoroethylene resin. Guide rollers.

圖4(a)、(b)係用於表示本發明之課題的說明圖。 4(a) and 4(b) are explanatory views for explaining the problem of the present invention.

如上所述,本發明中,於接著帶2之端部與連結帶3之端部之間設有微小的間隙(參照圖4(a))。 As described above, in the present invention, a slight gap is provided between the end portion of the tape 2 and the end portion of the connecting tape 3 (see Fig. 4(a)).

其理由如下:考慮到,若使接著帶2之端部與連結帶3之端部以重疊的狀態而藉由剝離側接著構件42接著連結,則難以順利地將接著帶2之剝離覆膜22與連結帶3之剝離膜32一體剝離;且考慮到製造接著帶構造體1時之裕度(margin)。 The reason for this is that it is considered that if the end portion of the adhesive tape 2 and the end portion of the connecting tape 3 are overlapped with each other and the peeling-side adhesive member 42 is subsequently joined, it is difficult to smoothly peel the adhesive film 22 of the adhesive tape 2 . The peeling film 32 of the connecting tape 3 is peeled off integrally; and the margin when the tape structure 1 is manufactured is considered.

因如此於接著帶2之端部與連結帶3之端部之間設有微小的間隙,故而,當於連結帶3之端部將剝離膜32自黏著劑層31剝去時、以及於接著帶2之端部將剝離覆膜22自接著劑層21剝去時,剝離側接著構件42之黏著層46會接觸於基材側接著構件41之黏著層45而使黏著層45、46彼此接著,結果,有時無法剝去剝離膜32(參照圖4(b))。 Therefore, since a slight gap is formed between the end portion of the tape 2 and the end portion of the connecting tape 3, when the peeling film 32 is peeled off from the adhesive layer 31 at the end portion of the connecting tape 3, and then When the peeling film 22 is peeled off from the adhesive layer 21 at the end portion of the tape 2, the adhesive layer 46 of the peeling side adhesive member 42 comes into contact with the adhesive layer 45 of the substrate side adhesive member 41 to cause the adhesive layers 45 and 46 to follow each other. As a result, the release film 32 may not be peeled off (see FIG. 4(b)).

因此,本發明中,如下所述地解決該問題。 Therefore, in the present invention, the problem is solved as described below.

圖5(a)~(c)、圖6及圖7係表示本發明之實施形態之主要部分的側視圖。 5(a) to 5(c), Fig. 6 and Fig. 7 are side views showing essential parts of an embodiment of the present invention.

圖5(a)~(c)所示之實施形態中,可使用基材側接著構件41之黏著層45A之基底樹脂的種類(例如聚矽氧系樹脂)與剝離側接著構件42之黏著層46B之基底樹脂的種類不同(例如丙烯酸系樹脂)者。 In the embodiment shown in Figs. 5(a) to 5(c), the adhesive layer of the type of the base resin (for example, polyfluorinated resin) and the peeling side adhesive member 42 of the adhesive layer 45A of the substrate-side member 41 can be used. The type of the base resin of 46B is different (for example, an acrylic resin).

另一方面,本發明中,如上所述,較佳的接著帶2之厚度為30~300μm,且較佳的連結帶3之厚度為30~300μm。 On the other hand, in the present invention, as described above, the thickness of the preferred adhesive tape 2 is 30 to 300 μm, and the thickness of the preferred bonding tape 3 is 30 to 300 μm.

並且,當使用基材側接著構件41及剝離側接著構件42將接著帶2與連結帶3連結時,若如上所述考慮到順利地將接著帶2之剝離覆膜22與連結帶3之剝離膜32一體剝離、以及製造接著帶構造體1時之裕度,則更佳為,將接著帶2之端部與連結帶3之端部之間的間隙W設定為10~1000μm。 Further, when the adhesive tape 2 and the peeling-side adhesive member 42 are used to connect the adhesive tape 2 to the adhesive tape 3, it is considered that the peeling film 22 of the adhesive tape 2 and the adhesive tape 3 are smoothly peeled off as described above. When the film 32 is integrally peeled off and the margin of the tape structure 1 is manufactured, it is more preferable to set the gap W between the end portion of the tape 2 and the end portion of the tape 3 to 10 to 1000 μm.

並且,本實施形態中,如圖5(a)所示,基材側接著構件41之黏著層45A之厚度與剝離側接著構件42之黏著層46B之厚度等同。 Further, in the present embodiment, as shown in FIG. 5(a), the thickness of the adhesive layer 45A of the substrate-side member 41 is equal to the thickness of the adhesive layer 46B of the peel-side member 42.

於此種條件下,作為基材側接著構件41,並無特別限定,但自確保必要的接著力的觀點出發,更佳為使用黏著層45A之厚度為40μm以上者。 Under the above-described conditions, the substrate-side adhesive member 41 is not particularly limited. However, from the viewpoint of securing the necessary adhesive force, it is more preferable to use the adhesive layer 45A to have a thickness of 40 μm or more.

另一方面,作為剝離側接著構件42,並無特別限定,但自確保必要的接著力的觀點出發,更佳為使用黏著層46B之厚度為40μm以上者。 On the other hand, the peeling side adhesive member 42 is not particularly limited, but it is more preferable to use the adhesive layer 46B to have a thickness of 40 μm or more from the viewpoint of securing the necessary adhesive force.

並且,基材側接著構件41之長度並無特別限定,但自具有確實地將接著帶2及連結帶3連接之接著力、且使黏合時之作業性儘量變得容易的觀點出發,更佳為設定為1~10cm。 In addition, the length of the substrate-side member 41 is not particularly limited, but it is preferable from the viewpoint of ensuring the adhesion between the adhesive tape 2 and the connecting tape 3 and the workability at the time of bonding as much as possible. Set to 1~10cm.

另一方面,剝離側接著構件42之長度並無特別限定,但自具有確實地將接著帶2及連結帶3連接之接著力、且使黏合時之作業性儘量變得容易的觀點出發,更佳為設定為1~10cm。 On the other hand, the length of the peeling-side member 42 is not particularly limited, but from the viewpoint of ensuring the adhesion between the adhesive tape 2 and the connecting tape 3 and the workability at the time of bonding as much as possible, The best setting is 1~10cm.

根據具有上述構成之本實施形態,因基材側接著構件41之 黏著層45A之基底樹脂的種類與剝離側接著構件42之黏著層46B之基底樹脂的種類不同,故而,例如,當於連結帶3之端部將剝離膜32自黏著劑層31剝去時,即便剝離側接著構件42之黏著層46B接觸於基材側接著構件41之黏著層45A,亦能防止黏著層45A、46B彼此接著,從而能順利地剝去剝離膜32(參照圖5(b)、(c))。 According to the embodiment having the above configuration, the substrate-side member 41 is The type of the base resin of the adhesive layer 45A is different from the type of the base resin of the adhesive layer 46B of the peeling side adhesive member 42. Therefore, for example, when the release film 32 is peeled off from the adhesive layer 31 at the end portion of the adhesive tape 3, Even if the adhesive layer 46B of the peeling side joining member 42 comes into contact with the adhesive layer 45A of the substrate side connecting member 41, the adhesive layers 45A, 46B can be prevented from coming to each other, so that the peeling film 32 can be smoothly peeled off (refer to FIG. 5(b) , (c)).

並且,同樣,當於接著帶2之端部將剝離覆膜22自接著劑層21剝去時,即便剝離側接著構件42之黏著層46B接觸於基材側接著構件41之黏著層45A,亦能防止黏著層45A、46B彼此接著,從而能順利地剝去剝離覆膜22。 Further, when the release film 22 is peeled off from the adhesive layer 21 at the end portion of the adhesive tape 2, even if the adhesive layer 46B of the peeling side adhesive member 42 comes into contact with the adhesive layer 45A of the substrate side adhesive member 41, The adhesion layers 45A and 46B can be prevented from coming to each other, so that the release film 22 can be smoothly peeled off.

圖6表示本發明之另一實施形態。 Fig. 6 shows another embodiment of the present invention.

如圖6所示,本實施形態中,於上述圖5(a)~(c)所示之實施形態中,基材側接著構件41之黏著層45A之厚度與剝離側接著構件42之黏著層46B之厚度不同。 As shown in Fig. 6, in the embodiment shown in Figs. 5(a) to 5(c), the thickness of the adhesive layer 45A of the substrate-side adhesive member 41 and the adhesive layer of the peel-side adhesive member 42 are as shown in Figs. 5(a) to 5(c). The thickness of 46B is different.

此時,構成為,剝離側接著構件42之黏著層46B之厚度薄於基材側接著構件41之黏著層45A之厚度。 At this time, the thickness of the adhesive layer 46B of the peeling-side member 42 is thinner than the thickness of the adhesive layer 45A of the substrate-side member 41.

本發明中,雖未特別限定,但自當將連結帶3之剝離膜32自黏著劑層31剝去時、以及將接著帶2之剝離覆膜22自接著劑層21剝去時,更確實地避免剝離側接著構件42之黏著層46B接著於基材側接著構件41之黏著層45A的觀點出發,更佳為,設定為,剝離側接著構件42之黏著層46B之厚度相對於基材側接著構件41之黏著層45A之厚度的比率小於50/100。 In the present invention, although the release film 32 of the connection tape 3 is peeled off from the adhesive layer 31 and the release film 22 of the adhesive tape 2 is peeled off from the adhesive layer 21, it is more sure. From the viewpoint of avoiding the adhesive layer 46B of the peeling side adhesive member 42 and then the adhesive layer 45A of the substrate side adhesive member 41, it is more preferable to set the thickness of the adhesive layer 46B of the peeling side adhesive member 42 to the substrate side. The ratio of the thickness of the adhesive layer 45A of the member 41 is then less than 50/100.

具體而言,於上述尺寸關係下,較佳為,亦考慮到必要的接著力,將 剝離側接著構件42之黏著層46B之厚度設定為5~20μm。 Specifically, in the above dimensional relationship, it is preferable to take into consideration the necessary adhesion force, The thickness of the adhesive layer 46B of the peeling side follower member 42 is set to 5 to 20 μm.

根據具有上述構成之本實施形態,構成為,剝離側接著構件42之黏著層46B之厚度薄於基材側接著構件41之黏著層45A之厚度,與黏著層46B之厚度形成為與黏著層45A之厚度等同的情況相比,能減小黏著層45A與黏著層46B之間的接著力,故而,例如當於連結帶3之端部將剝離膜32自黏著劑層31剝去時,即便黏著層45A與黏著層46B接觸,亦能確實地防止黏著層45A、46B彼此接著,從而能更順利地剝去剝離膜32。 According to the present embodiment having the above-described configuration, the thickness of the adhesive layer 46B of the peeling-side member 42 is thinner than the thickness of the adhesive layer 45A of the substrate-side member 41, and the thickness of the adhesive layer 46B is formed to be the adhesive layer 45A. The adhesion between the adhesive layer 45A and the adhesive layer 46B can be reduced as compared with the case where the thickness is equivalent. Therefore, for example, when the peeling film 32 is peeled off from the adhesive layer 31 at the end portion of the adhesive tape 3, even if it is adhered The contact of the layer 45A with the adhesive layer 46B also reliably prevents the adhesive layers 45A, 46B from coming to each other, so that the release film 32 can be peeled off more smoothly.

並且,因同樣的理由,於接著帶2之端部將剝離覆膜22自接著劑層21剝去時,即便剝離側接著構件42之黏著層46B接觸於基材側接著構件41之黏著層45A,亦能順利地剝去剝離覆膜22。 Further, for the same reason, when the peeling film 22 is peeled off from the adhesive layer 21 at the end portion of the tape 2, the adhesive layer 46B of the peeling side adhesive member 42 comes into contact with the adhesive layer 45A of the substrate side adhesive member 41. The peeling film 22 can also be peeled off smoothly.

圖7表示本發明之另一實施形態。 Fig. 7 shows another embodiment of the present invention.

本實施形態中,構成為,基材側接著構件41之黏著層45之基底樹脂的種類與剝離側接著構件42之黏著層46之基底樹脂的種類相同,進而,剝離側接著構件42之黏著層46之厚度薄於基材側接著構件41之黏著層45之厚度。 In the present embodiment, the type of the base resin of the adhesive layer 45 of the base material side follower member 41 is the same as the type of the base resin of the adhesive layer 46 of the peeling side adhesive member 42, and the adhesive layer of the peeling side adhesive member 42 is further removed. The thickness of 46 is thinner than the thickness of the adhesive layer 45 of the substrate side follower member 41.

此時,作為基材側接著構件41之黏著層45及剝離側接著構件42之黏著層46的黏著劑,可較佳地使用含有丙烯酸系之基底樹脂的黏著劑。 In this case, as the adhesive of the adhesive layer 45 of the substrate-side adhesive member 41 and the adhesive layer 46 of the peeling-side adhesive member 42, an adhesive containing an acrylic base resin can be preferably used.

並且,於與上述實施形態相同的尺寸關係下,作為基材側接著構件41,並無特別限定,但自確保必要的接著力的觀點出發,更佳為使用黏著層45之厚度為40μm以上者。 In addition, in the same dimensional relationship as the above-described embodiment, the substrate-side adhesive member 41 is not particularly limited. However, from the viewpoint of securing the necessary adhesive force, it is more preferable to use the adhesive layer 45 to have a thickness of 40 μm or more. .

另一方面,關於剝離側接著構件42之黏著層46之厚度,並無特別限定,但自當將連結帶3之剝離膜32自黏著劑層31剝去時、以及將 接著帶2之剝離覆膜22自接著劑層21剝去時,更確實地避免剝離側接著構件42之黏著層46接著於基材側接著構件41之黏著層45的觀點出發,更佳為,設定為剝離側接著構件42之黏著層46之厚度相對於基材側接著構件41之黏著層45之厚度的比率小於50/100。 On the other hand, the thickness of the adhesive layer 46 of the peeling side follower member 42 is not particularly limited, but the peeling film 32 of the connecting tape 3 is peeled off from the adhesive layer 31, and When the release film 22 of the tape 2 is peeled off from the adhesive layer 21, it is more preferable to prevent the adhesive layer 46 of the peeling side adhesive member 42 from adhering to the adhesive layer 45 of the substrate side adhesive member 41, and more preferably, The ratio of the thickness of the adhesive layer 46 set to the peeling side adhesive member 42 to the thickness of the adhesive layer 45 of the substrate side adhesive member 41 is less than 50/100.

具體而言,於上述尺寸關係下,較佳為,亦考慮到必要的接著力,將剝離側接著構件42之黏著層46之厚度設定為5~20μm。 Specifically, in the above-described dimensional relationship, it is preferable to set the thickness of the adhesive layer 46 of the peeling-side member 42 to 5 to 20 μm in consideration of the necessary adhesive force.

根據具有上述構成之本實施形態,構成為,剝離側接著構件42之黏著層46之厚度薄於基材側接著構件41之黏著層45之厚度,與黏著層46之厚度形成為與黏著層45之厚度等同的情況相比,能減小黏著層45與黏著層46之間的接著力,故而,當於連結帶3之端部將剝離膜32自黏著劑層31剝去時、以及於接著帶2之端部將剝離覆膜22自接著劑層21剝去時,即便剝離側接著構件42之黏著層46接觸於基材側接著構件41之黏著層45,亦能防止黏著層45、46彼此接著,從而能順利地剝去剝離膜32及剝離覆膜22。 According to the present embodiment having the above configuration, the thickness of the adhesive layer 46 of the peeling side follower member 42 is thinner than the thickness of the adhesive layer 45 of the substrate side connecting member 41, and the thickness of the adhesive layer 46 is formed to be the adhesive layer 45. The adhesion between the adhesive layer 45 and the adhesive layer 46 can be reduced as compared with the case where the thickness is equivalent. Therefore, when the release film 32 is peeled off from the adhesive layer 31 at the end of the adhesive tape 3, and then When the peeling film 22 is peeled off from the adhesive layer 21 at the end portion of the tape 2, the adhesive layer 45, 46 can be prevented even if the adhesive layer 46 of the peeling-side adhesive member 42 comes into contact with the adhesive layer 45 of the substrate-side adhesive member 41. After each other, the release film 32 and the release film 22 can be smoothly peeled off.

圖8(a)係表示本發明之接著帶收容體之實施形態之構成的前視圖,圖8(b)、(c)係表示捲繞於轉盤構件之捲芯軸部的接著膜的間隔的說明圖。 Fig. 8 (a) is a front view showing a configuration of an embodiment of the adhesive tape storage body of the present invention, and Figs. 8 (b) and (c) are views showing the interval of the adhesive film wound around the winding core portion of the turntable member. Illustrating.

本實施形態之接著帶收容體50中,接著帶構造體1以往復纏捲之方式捲繞於轉盤構件53之捲芯軸部54,該轉盤構件53具有凸緣51、52,且該凸緣51、52之間隔寬於接著帶構造體1之帶寬。 In the adhesive tape holder 50 of the present embodiment, the tape structure 1 is wound around the winding core portion 54 of the turntable member 53 in a reciprocating manner, the turntable member 53 having the flanges 51, 52, and the flange The interval between 51 and 52 is wider than the bandwidth of the subsequent belt structure 1.

此處,所謂往復纏捲係指,將長形的接著帶構造體1以既定的間距(間隔)且以螺旋狀、呈多層地捲繞於轉盤構件53之捲芯軸部54 上。 Here, the reciprocating winding means that the elongate back-belt structure 1 is wound around the winding core portion 54 of the turntable member 53 in a spiral shape and in a plurality of layers at a predetermined pitch (interval). on.

此處,接著帶構造體1以鄰接之接著帶構造體1的間隔成為既定間隔p的方式捲繞於轉盤構件53之捲芯軸部54上(參照圖8(b)),進而,於該等接著帶構造體1上,以鄰接之接著帶構造體1的間隔成為既定的值p的方式重疊地捲繞接著帶構造體1(參照圖8(c))。 Here, the belt structure 1 is wound around the winding core portion 54 of the turntable member 53 so that the interval between the adjacent belt structures 1 becomes a predetermined interval p (see FIG. 8(b)). Then, the tape structure 1 is placed on the tape structure 1 so as to overlap the tape structure 1 so that the interval between the adjacent tape structures 1 becomes a predetermined value p (see FIG. 8( c )).

此時,鄰接之接著帶構造體1之間隔p可設定為如下值:不可能會因於帶寬方向露出之接著劑而使鄰接之接著帶構造體1彼此接著、且當捲取接著帶構造體1時不會發生松脫。 At this time, the interval p of the adjacent belt structure 1 can be set to a value in which it is impossible to cause the adjacent belt structure 1 to be adhered to each other due to the adhesive which is exposed in the direction of the width, and to take up the belt structure. At 1 o'clock, no looseness will occur.

根據以上所述之本實施形態之接著帶收容體50,能捲繞極長的接著帶構造體1且能將其順利地抽出,故而,於接著用帶之貼附步驟中,無需頻繁地更換轉盤,從而能大幅地提升生產效率。 According to the adhesive tape holder 50 of the present embodiment described above, the extremely long adhesive tape structure 1 can be wound and can be smoothly extracted. Therefore, it is not necessary to frequently replace the adhesive tape in the subsequent attaching step. The turntable can greatly increase production efficiency.

再者,本發明並不限於上述實施形態,可進行各種變更。 Furthermore, the present invention is not limited to the above embodiment, and various modifications can be made.

例如,圖6所示之實施形態中,雖構成為,剝離側接著構件42之黏著層46B之厚度薄於基材側接著構件41之黏著層45A之厚度,但本發明並不限於此,亦可構成為,基材側接著構件41之黏著層45A之厚度薄於剝離側接著構件42之黏著層46B之厚度。 For example, in the embodiment shown in FIG. 6, the thickness of the adhesive layer 46B of the peeling-side member 42 is thinner than the thickness of the adhesive layer 45A of the substrate-side member 41, but the present invention is not limited thereto. The thickness of the adhesive layer 45A of the substrate-side member 41 may be thinner than the thickness of the adhesive layer 46B of the peel-side member 42.

然而,自防止因剝離側接著構件42之黏著層46B之黏著劑接觸於接著帶2之接著劑層21及連結帶3之黏著劑層31、而使得當剝去連結帶3之剝離膜32及接著帶2之剝離覆膜22時產生黏連的觀點出發,較佳為,如圖6中所示之實施形態所示,構成為,剝離側接著構件42之黏著層46B之厚度薄於基材側接著構件41之黏著層45A之厚度。 However, since the adhesive for preventing the adhesive layer 46B of the peeling side member 42 comes into contact with the adhesive layer 31 of the adhesive layer 21 and the adhesive tape 3 of the adhesive tape 2, the peeling film 32 of the adhesive tape 3 is peeled off and Next, from the viewpoint of the adhesion when the release film 22 of the tape 2 is peeled off, it is preferable that the thickness of the adhesive layer 46B of the peeling side adhesive member 42 is thinner than the substrate as shown in the embodiment shown in FIG. The thickness of the adhesive layer 45A of the side member 41 is followed.

[實施例] [Examples]

以下,列舉實施例及比較例對本發明進行具體說明,但本發明並不限於以下實施例。 Hereinafter, the present invention will be specifically described by way of examples and comparative examples, but the present invention is not limited to the following examples.

根據以下之條件,製成作為接著帶構造體之構成要素的接著帶與連結帶。 An adhesive tape and a connecting tape which are constituent elements of the adhesive tape structure are produced under the following conditions.

〔接著帶之製成〕 [and then made with]

作為接著帶,使用如下類型:於寬度1.5mm且由PET構成之厚度50μm之基底膜上形成厚度20μm之接著劑層,進而於接著劑層上設有厚度25μm且由PET構成之剝離覆膜。 As the adhesive tape, a type of adhesive layer having a thickness of 20 μm was formed on a base film having a width of 1.5 mm and a thickness of 50 μm made of PET, and a release film made of PET having a thickness of 25 μm was further provided on the adhesive layer.

此處,接著劑之組成係含有苯氧樹脂(新日鐵化學公司製YP-50)30重量份、液狀環氧樹脂(三菱化學公司製JER828)20重量份、橡膠成分(長瀨化成公司製SG80H)10重量份、硬化劑(旭化成公司製Novacure 3941HP)40重量份、矽烷偶合劑(Momentive Performance Materials公司(邁圖高新材料公司)製A-187)1重量份。 Here, the composition of the adhesive agent contains 30 parts by weight of a phenoxy resin (YP-50 manufactured by Nippon Steel Chemical Co., Ltd.), 20 parts by weight of a liquid epoxy resin (JER828 manufactured by Mitsubishi Chemical Corporation), and a rubber component (Changfu Chemical Co., Ltd.) 10 parts by weight of SG80H), 40 parts by weight of a curing agent (Novacure 3941HP, manufactured by Asahi Kasei Co., Ltd.), and 1 part by weight of a decane coupling agent (A-187 manufactured by Momentive Performance Materials Co., Ltd.).

將該接著劑組成物溶解於甲苯溶劑之後塗布於基底膜上,以60℃之環境溫度加熱10分鐘而使溶劑揮發,形成接著劑層。 The adhesive composition was dissolved in a toluene solvent, applied to a base film, and heated at an ambient temperature of 60 ° C for 10 minutes to volatilize the solvent to form an adhesive layer.

〔連結帶之製成〕 [made of the link]

作為連結帶,使用如下類型:於寬度1.5mm且由黑色PET構成之厚度50μm之基底膜上形成厚度20μm之黏著劑層,進而於黏著劑層上設有厚度25μm且由PET構成之膜。 As the connecting tape, an adhesive layer having a thickness of 20 μm was formed on a base film having a width of 1.5 mm and a thickness of 50 μm made of black PET, and a film having a thickness of 25 μm and made of PET was further provided on the adhesive layer.

此處,黏著劑之組成包含聚矽氧系樹脂(Dow Corning Toray 公司(東麗道康寧公司)製SD4584PSA)100重量份、硬化劑(Dow Corning Toray公司製BY24-741)0.7重量份、矽烷偶合劑(Momentive Performance Materials公司製A-187)1重量份、鉑觸媒(Dow Corning Toray公司製NC-25)0.6重量份。 Here, the composition of the adhesive includes 100 parts by weight of polyfluorene-based resin (SD4584PSA manufactured by Dow Corning Toray Co., Ltd.), 0.7 parts by weight of a curing agent (BY24-741 manufactured by Dow Corning Toray Co., Ltd.), and a decane coupling agent. (Momentive Performance 1 part by weight of A-187) manufactured by Materials Co., Ltd., and 0.6 part by weight of a platinum catalyst (NC-25 manufactured by Dow Corning Toray Co., Ltd.).

利用棒式塗布機將該組成物塗布於連結基材上,以溫度70℃加熱5分鐘之後,進而以150℃加熱4分鐘而使其硬化,形成厚度20μm之黏著劑層。 This composition was applied onto a bonded substrate by a bar coater, heated at a temperature of 70 ° C for 5 minutes, and further cured by heating at 150 ° C for 4 minutes to form an adhesive layer having a thickness of 20 μm.

<實施例1> <Example 1>

使用上述接著帶及連結帶,製成具有如圖5(a)所示之構成的接著帶構造體的樣本。 A sample having an adhesive tape structure having the configuration shown in Fig. 5 (a) was produced by using the above-mentioned adhesive tape and the connecting tape.

此時,作為基材側接著構件,使用長度5cm之聚矽氧系接著帶(Dexerials(迪睿合)公司製T4082S),該聚矽氧系接著帶係於厚度25μm之PET基材上形成有厚度40μm且由聚矽氧樹脂構成的黏著層。 In this case, as a substrate-side member, a polysulfide-based adhesive tape (T4082S manufactured by Dexires Co., Ltd.) having a length of 5 cm was used, and the polyfluorene-based adhesive tape was formed on a PET substrate having a thickness of 25 μm. An adhesive layer having a thickness of 40 μm and composed of a polyoxyn resin.

另一方面,作為剝離側接著構件,使用長度5cm之聚矽氧系接著帶,該聚矽氧系接著帶係於厚度38μm之PET基材上形成有厚度40μm且由丙烯酸樹脂(總研化學公司製SK Dyne1717)構成的黏著層。 On the other hand, as the peeling-side member, a polyfluorene-based adhesive tape having a length of 5 cm was used, and the polyfluorene-based adhesive tape was formed on a PET substrate having a thickness of 38 μm to have a thickness of 40 μm and made of acrylic resin (Token Chemical Co., Ltd.) The adhesive layer formed by SK Dyne1717).

而且,使用上述基材側接著構件及剝離側接著構件,利用長度30cm之上述連結帶將長度5cm之2個上述接著帶接著,製成接著帶構造體之樣本。 Then, using the above-mentioned base material side joining member and the peeling side joining member, two of the above-mentioned joining tapes having a length of 30 cm were used to carry out the above-mentioned two subsequent lengths of the tape to form a sample of the tape structure.

ㄑ實施例2> ㄑExample 2>

將剝離側接著構件之黏著層之厚度設為10μm,除此以外,以與實施例1相同的條件製成接著帶構造體之樣本。其具有圖6所示之構成。 A sample of the adhesive tape structure was produced under the same conditions as in Example 1 except that the thickness of the adhesive layer of the peeling-side member was set to 10 μm. It has the configuration shown in FIG.

<實施例3> <Example 3>

將剝離側接著構件之黏著層之厚度設為20μm,除此以外,以與實施例1相同的條件製成接著帶構造體之樣本。其具有圖6所示之構成。 A sample of the adhesive tape structure was produced under the same conditions as in Example 1 except that the thickness of the adhesive layer of the peeling-side member was set to 20 μm. It has the configuration shown in FIG.

ㄑ比較例1> ㄑComparative example 1>

作為剝離側接著構件,使用長度5cm之聚矽氧系接著帶(Dexerials公司製T4082S),該聚矽氧系接著帶係於厚度25μm之PET基材上形成有厚度40μm且由聚矽氧樹脂構成的黏著層,除此以外,以與實施例1相同的條件製成接著帶構造體之樣本。 As a peeling-side member, a polyoxynene-based adhesive tape (T4082S manufactured by Dexrials Co., Ltd.) having a length of 5 cm was used, and the polyfluorene-based adhesive tape was formed on a PET substrate having a thickness of 25 μm to have a thickness of 40 μm and composed of polyoxyxylene resin. A sample of the subsequent tape structure was produced under the same conditions as in Example 1 except for the adhesive layer.

ㄑ比較例2> ㄑComparative example 2>

將基材側接著構件之黏著層之厚度設為10μm,將剝離側接著構件之黏著層之厚度設為10μm,除此以外,以與實施例1相同的條件製成接著帶構造體之樣本。 A sample of the adhesive tape structure was produced under the same conditions as in Example 1 except that the thickness of the adhesive layer of the substrate-side member was 10 μm and the thickness of the adhesive layer of the peeling-side member was 10 μm.

《評價方法》 Evaluation Method

將實施例及比較例之接著帶構造體之樣本分別捲繞於由聚苯乙烯構成且外徑為φ 130mm、內徑為φ 50mm的轉盤構件。 The samples of the subsequent belt structure of the examples and the comparative examples were each wound around a turntable member made of polystyrene and having an outer diameter of φ 130 mm and an inner diameter of φ 50 mm.

將該等接著帶構造體之轉盤構件裝設於圖2所示之裝置,將接著帶之剝離覆膜與連結帶之剝離膜剝離,目測確認剝離覆膜及剝離膜的剝離性。 The turntable member having the subsequent belt structure was attached to the apparatus shown in Fig. 2, and the release film of the subsequent tape was peeled off from the release film of the connection tape, and the peeling property of the release film and the release film was visually confirmed.

此時,帶的傳送速度設為200mm/scc,帶的傳送間距設為200mm。 At this time, the belt conveyance speed was set to 200 mm/scc, and the belt conveyance pitch was set to 200 mm.

樹脂A:使用聚矽氧系樹脂之黏著帶 Resin A: Adhesive tape using polyoxyl resin

樹脂B:使用丙烯酸系樹脂之黏著帶 Resin B: Adhesive tape using acrylic resin

◎:使用時無問題 ◎: No problem when using

○:抽出時略微卡住(可使用的程度) ○: Slightly stuck when pulled out (degree of use)

×*1:黏著劑面彼此接著、未能剝去剝離覆膜 × *1 : Adhesive surfaces follow each other and peeling off the film

×*2:基材側接著構件之接著部分被剝去而斷開 × *2 : the subsequent portion of the substrate-side member is peeled off and disconnected

《評價結果》 "Evaluation results"

基材側接著構件之黏著層之基底樹脂的種類與剝離側接著構件之黏著層之基底樹脂不同、且剝離側接著構件之黏著層之厚度相對於基材側接著構件之黏著層之厚度的比率為10/40的實施例2之接著帶構造體中,可無問題地剝離接著帶之剝離覆膜及連結帶之剝離膜。 The ratio of the type of the base resin of the adhesive layer of the substrate-side adhesive member to the base resin of the adhesive layer of the peeling-side adhesive member, and the thickness of the adhesive layer of the peeling-side adhesive member with respect to the thickness of the adhesive layer of the substrate-side adhesive member In the adhesive tape structure of Example 2 of 10/40, the release film of the adhesive tape and the release film of the connection tape were peeled off without any problem.

另一方面,基材側接著構件之黏著層之基底樹脂的種類與剝離側接著構件之黏著層之基底樹脂不同、且剝離側接著構件之黏著層之厚度相對於基材側接著構件之黏著層之厚度的比率為40/40的實施例1之接著帶構造體中、以及同比率為20/40的實施例3之接著帶構造體中,抽出時略微卡住,但為可使用的程度。 On the other hand, the type of the base resin of the adhesive layer of the substrate-side member is different from the base resin of the adhesive layer of the peel-side member, and the thickness of the adhesive layer of the peel-side member is opposite to the adhesive layer of the substrate-side member. In the subsequent tape structure of Example 1 having a thickness ratio of 40/40 and the subsequent tape structure of Example 3 having a ratio of 20/40, the tape was slightly stuck at the time of extraction, but was usable.

相對於此,基材側接著構件之黏著層之基底樹脂的種類與剝離側接著構件之黏著層之基底樹脂相同、且剝離側接著構件之黏著層之厚度相對於基材側接著構件之黏著層之厚度的比率為40/40的比較例1之接著帶構造體中,基材側接著構件之黏著層與剝離側接著構件之黏著層的接著劑面彼此接著,未能剝去剝離覆膜。 On the other hand, the type of the base resin of the adhesive layer of the substrate-side member is the same as the base resin of the adhesive layer of the peel-side member, and the thickness of the adhesive layer of the peel-side member is opposite to the adhesive layer of the substrate-side member. In the adhesive tape structure of Comparative Example 1 in which the ratio of the thickness was 40/40, the adhesive layer of the substrate-side adhesive member and the adhesive surface of the adhesive layer of the peel-side adhesive member were adhered to each other, and the peeling film was not peeled off.

並且,基材側接著構件之黏著層之基底樹脂的種類與剝離側接著構件之黏著層之基底樹脂不同、且剝離側接著構件之黏著層之厚度相對於基材側接著構件之黏著層之厚度的比率為10/10的比較例2之接著帶構 造體中,基材側接著構件之接著力不足,出現基材側接著構件之接著構件被剝去而使膜斷開的現象。 Further, the type of the base resin of the adhesive layer of the substrate-side member is different from the base resin of the adhesive layer of the peel-side member, and the thickness of the adhesive layer of the peel-side member is opposite to the thickness of the adhesive layer of the substrate-side member. The ratio of the ratio of 10/10 to the subsequent band of Comparative Example 2 In the embossing, the adhesion force of the substrate-side member is insufficient, and the subsequent member of the substrate-side member is peeled off to break the film.

根據以上結果,可證實本發明之效果。 From the above results, the effects of the present invention can be confirmed.

1‧‧‧接著帶構造體 1‧‧‧With the structure

2‧‧‧接著帶 2‧‧‧With belt

3‧‧‧連結帶 3‧‧‧Links

20‧‧‧基底膜 20‧‧‧ basement membrane

21‧‧‧接著劑層 21‧‧‧ adhesive layer

22‧‧‧剝離覆膜 22‧‧‧ peeling film

30‧‧‧連結基材 30‧‧‧Linking substrate

31‧‧‧黏著劑層 31‧‧‧Adhesive layer

32‧‧‧剝離膜 32‧‧‧Release film

41‧‧‧基材側接著構件 41‧‧‧Substrate side follower

42‧‧‧剝離側接著構件 42‧‧‧ peeling side attachment members

43、44‧‧‧基底 43, 44‧‧‧ base

45A、46B‧‧‧黏著層 45A, 46B‧‧‧ adhesive layer

Claims (8)

一種接著帶構造體,其係複數個接著帶經由連結帶連結而成者,該接著帶係於基底膜上依序設有接著劑層與剝離覆膜,該連結帶係於連結基材上依序設有黏著劑層與剝離膜;於在該接著帶之端部與該連結帶之端部之間設有既定間隔的狀態下,該接著帶之基底膜之端部與該連結帶之連結基材之端部藉由基材側接著構件而接著,並且,以該接著帶之剝離覆膜與該連結帶之剝離膜可於帶長度方向一體地剝離的方式、使該剝離覆膜之端部與該剝離膜之端部藉由剝離側接著構件而接著;該基材側接著構件之黏著層之基底樹脂的種類與該剝離側接著構件之黏著層之基底樹脂的種類不同。 An adhesive tape structure in which a plurality of subsequent tapes are connected via a connecting tape, and the adhesive tape is sequentially provided with an adhesive layer and a release film on the base film, and the adhesive tape is attached to the bonded substrate. The adhesive layer and the release film are sequentially disposed; and the end portion of the base film of the adhesive tape is connected to the joint tape in a state where a predetermined interval is provided between the end portion of the adhesive tape and the end portion of the adhesive tape The end portion of the substrate is followed by the substrate-side member, and the release film of the adhesive tape and the release film of the adhesive tape are integrally peeled off in the longitudinal direction of the tape, and the end of the release film is formed. The end portion of the release film and the end portion of the release film are followed by a peeling-side adhesive member; the type of the base resin of the adhesive layer of the substrate-side adhesive member is different from the type of the base resin of the adhesive layer of the peel-side adhesive member. 一種接著帶構造體,其係複數個接著帶經由連結帶連結而成者,該接著帶係於基底膜上依序設有接著劑層與剝離覆膜,該連結帶係於連結基材上依序設有黏著劑層與剝離膜;於在該接著帶之端部與該連結帶之端部之間設有既定間隔的狀態下,使該接著帶之基底膜之端部與該連結帶之連結基材之端部藉由基材側接著構件而接著,並且,以該接著帶之剝離覆膜與該連結帶之剝離膜可於帶長度方向一體地剝離的方式、使該剝離覆膜之端部與該剝離膜之端部藉由剝離側接著構件而接著;該基材側接著構件之黏著層之厚度與該剝離側接著構件之黏著層之厚度不同。 An adhesive tape structure in which a plurality of subsequent tapes are connected via a connecting tape, and the adhesive tape is sequentially provided with an adhesive layer and a release film on the base film, and the adhesive tape is attached to the bonded substrate. An adhesive layer and a release film are sequentially disposed; and an end portion of the base film of the adhesive tape and the joint tape are disposed in a state where a predetermined interval is provided between an end portion of the adhesive tape and an end portion of the adhesive tape The end portion of the connection substrate is followed by the substrate-side member, and the release film of the adhesive tape and the release film of the connection tape are integrally peeled off in the tape length direction, and the release film is removed. The end portion and the end portion of the release film are followed by a peeling side joining member; the thickness of the adhesive layer of the substrate side joining member is different from the thickness of the adhesive layer of the peeling side joining member. 如申請專利範圍第1項之接著帶構造體,其中,該基材側接著構件之 黏著層之厚度與該剝離側接著構件之黏著層之厚度不同。 An adhesive tape structure according to the first aspect of the patent application, wherein the substrate is adjacent to the member The thickness of the adhesive layer is different from the thickness of the adhesive layer of the peeling side follower member. 如申請專利範圍第2或3項之接著帶構造體,其中,該剝離側接著構件之黏著層之厚度薄於該基材側接著構件之黏著層之厚度。 An adhesive tape structure according to claim 2, wherein the adhesive layer of the peeling side member is thinner than the thickness of the adhesive layer of the side member of the substrate. 如申請專利範圍第2項之接著帶構造體,其中,該剝離側接著構件之黏著層之厚度相對於該基材側接著構件之黏著層之厚度的比率小於50/100。 The adhesive tape structure of claim 2, wherein the ratio of the thickness of the adhesive layer of the peeling side member to the thickness of the adhesive layer of the side member of the substrate is less than 50/100. 如申請專利範圍第1項之接著帶構造體,其中,該連結帶之連結基材係由非透光性材料構成。 The adhesive tape structure according to claim 1, wherein the connecting base material of the connecting tape is made of a non-translucent material. 一種接著帶收容體,其具有接著帶構造體,該接著帶構造體係複數個接著帶經由連結帶連結而成者,該接著帶係於基底膜上依序設有接著劑層與剝離覆膜,該連結帶係於連結基材上依序設有黏著劑層與剝離膜,於在該接著帶之端部與該連結帶之端部之間設有既定間隔的狀態下,該接著帶之基底膜之端部與該連結帶之連結基材之端部藉由基材側接著構件而接著,並且,以該接著帶之剝離覆膜與該連結帶之剝離膜可於帶長度方向一體地剝離的方式、使該剝離覆膜之端部與該剝離膜之端部藉由剝離側接著構件而接著,該基材側接著構件之黏著層之基底樹脂的種類與該剝離側接著構件之黏著層之基底樹脂的種類不同;該接著帶構造體係以往復纏捲之方式捲繞於轉盤構件,該轉盤構件具有寬度大於該接著帶構造體之帶寬的凸緣間隔。 An adhesive tape holder having an adhesive tape structure, wherein the plurality of adhesive tapes are connected to each other via a connecting tape, and the adhesive tape is sequentially provided with an adhesive layer and a release film on the base film. The connecting tape is provided with an adhesive layer and a release film in sequence on the connecting substrate, and the base of the adhesive tape is provided at a predetermined interval between the end portion of the adhesive tape and the end portion of the adhesive tape. The end portion of the film and the end portion of the connecting substrate of the connecting tape are joined by the substrate-side member, and the release film of the adhesive tape and the release film of the connecting tape can be integrally peeled off in the tape length direction. In the method, the end portion of the release film and the end portion of the release film are separated by the peeling side follower member, and the type of the base resin of the adhesive layer of the substrate side adhesive member and the adhesive layer of the peeling side adhesive member The type of the base resin is different; the subsequent belt construction system is wound in a reciprocating manner around the turntable member having a flange spacing having a width greater than the bandwidth of the adhesive tape structure. 一種接著帶收容體,其具有接著帶構造體,該接著帶構造體係複數個接著帶經由連結帶連結而成者,該接著帶係於基底膜上依序設有接著劑層與剝離覆膜,該連結帶係於連結基材上依序設有黏著劑層與剝離膜, 於在該接著帶之端部與該連結帶之端部之間設有既定間隔的狀態下,使該接著帶之基底膜之端部與該連結帶之連結基材之端部藉由基材側接著構件而接著,並且,以該接著帶之剝離覆膜與該連結帶之剝離膜可於帶長度方向一體地剝離的方式、使該剝離覆膜之端部與該剝離膜之端部藉由剝離側接著構件而接著,該基材側接著構件之黏著層之厚度與該剝離側接著構件之黏著層之厚度不同;該接著帶收容體中,該接著帶構造體係以往復纏捲之方式捲繞於轉盤構件,該轉盤構件具有寬度大於該接著帶構造體之帶寬的凸緣間隔。 An adhesive tape holder having an adhesive tape structure, wherein the plurality of adhesive tapes are connected to each other via a connecting tape, and the adhesive tape is sequentially provided with an adhesive layer and a release film on the base film. The connecting tape is provided with an adhesive layer and a release film in sequence on the connecting substrate. The end portion of the base film of the adhesive tape and the end portion of the connecting substrate of the connecting tape are made of a substrate in a state where a predetermined interval is provided between the end portion of the adhesive tape and the end portion of the connecting tape. Then, the peeling film of the adhesive tape and the release film of the adhesive tape are integrally peeled off in the longitudinal direction of the tape, and the end portion of the peeling film and the end portion of the release film are borrowed. The thickness of the adhesive layer of the substrate-side adhesive member is different from the thickness of the adhesive layer of the peel-side adhesive member by the peeling-side adhesive member; the adhesive tape-forming structure is reciprocally wound Winding on the turntable member, the turntable member having a flange spacing having a width greater than the bandwidth of the adhesive tape structure.
TW103142984A 2013-12-10 2014-12-10 Adhesive tape structure and adhesive tape container TW201533203A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013255258A JP6322405B2 (en) 2013-12-10 2013-12-10 Adhesive tape structure and adhesive tape container

Publications (1)

Publication Number Publication Date
TW201533203A true TW201533203A (en) 2015-09-01

Family

ID=53371185

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103142984A TW201533203A (en) 2013-12-10 2014-12-10 Adhesive tape structure and adhesive tape container

Country Status (5)

Country Link
JP (1) JP6322405B2 (en)
KR (1) KR102286222B1 (en)
CN (1) CN105793377B (en)
TW (1) TW201533203A (en)
WO (1) WO2015087883A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3418339B1 (en) * 2016-02-16 2020-07-15 Panasonic Intellectual Property Management Co., Ltd. Encased adhesive tape and method for manufacturing solar cell module
JP6696826B2 (en) * 2016-05-20 2020-05-20 デクセリアルズ株式会社 Adhesive tape structure
JP6783552B2 (en) * 2016-05-20 2020-11-11 デクセリアルズ株式会社 Adhesive tape structure
US10538072B2 (en) * 2018-04-10 2020-01-21 Gulfstream Aerospace Corporation Devices and methods for dispensing adhesive elements
JP6912020B2 (en) * 2019-03-04 2021-07-28 Dic株式会社 Adhesive tape and adhesive

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616109A (en) * 1969-06-18 1971-10-26 Fitchburg Coated Products Inc Splice for pressure-sensitive adhesive stock
JPH0520524Y2 (en) * 1987-10-28 1993-05-27
JPH085579B2 (en) * 1988-07-26 1996-01-24 富士写真フイルム株式会社 Web joining method
US6863945B2 (en) * 2001-12-31 2005-03-08 Kimberly-Clark Worldwide, Inc. Usable splice for a stabilized absorbent
JP4239585B2 (en) * 2002-12-24 2009-03-18 日立化成工業株式会社 Adhesive tape connection method and adhesive tape connector
JP2004059776A (en) * 2002-07-30 2004-02-26 Hitachi Chem Co Ltd Anisotropic conductive material tape
JP2005060488A (en) * 2003-08-11 2005-03-10 Nitto Denko Corp Heat-bonding sheet for thermally peelable adhesive sheet seam and method for connecting thermally peelable adhesive sheet
JP2008297027A (en) * 2007-05-29 2008-12-11 Fujifilm Corp Photosensitive web joining structure and its joining tape member
JP4434281B2 (en) * 2008-01-11 2010-03-17 日立化成工業株式会社 Adhesive tape connection method and adhesive tape connector
JP5410204B2 (en) 2009-08-31 2014-02-05 日東電工株式会社 Adhesive tape application method and adhesive tape application device
KR20200042010A (en) * 2012-08-03 2020-04-22 데쿠세리아루즈 가부시키가이샤 Reel member, film container, and method for manufacturing film container
JP6333539B2 (en) * 2013-10-31 2018-05-30 デクセリアルズ株式会社 Adhesive tape structure and adhesive tape container

Also Published As

Publication number Publication date
WO2015087883A1 (en) 2015-06-18
CN105793377B (en) 2018-12-14
KR102286222B1 (en) 2021-08-06
KR20160095112A (en) 2016-08-10
CN105793377A (en) 2016-07-20
JP6322405B2 (en) 2018-05-09
JP2015113382A (en) 2015-06-22

Similar Documents

Publication Publication Date Title
TWI646164B (en) Adhesive tape structure and adhesive tape container
TW201533203A (en) Adhesive tape structure and adhesive tape container
TWI634993B (en) Adhesive tape structure and adhesive tape container
CN109072025B (en) Adhesive tape structure
JP6696828B2 (en) Adhesive tape structure
JP6696826B2 (en) Adhesive tape structure
JP6696827B2 (en) Adhesive tape structure
KR20050023355A (en) Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape
JP6063435B2 (en) Sheet sticking method and sheet sticking apparatus
JP6689135B2 (en) Adhesive tape structure
JP2011187641A (en) Method for manufacturing flexible board
JP6668164B2 (en) Adhesive tape structure
JP2017105630A (en) Manufacturing method of glass roll, and glass roll
CN105703192A (en) Sheet material adhesion method and sheet material adhesion device
JP2016115546A (en) Sheet sticking apparatus
JP2016115547A (en) Sheet sticking apparatus