TW201911444A - Electronic component conveying device and inspection device, positioning device and method, and component conveying device - Google Patents

Abstract

The topic of the present invention is to provide an electronic component transport device and an inspection device, a positioning device and method, and a component transport device that can accurately position two targets (for example, an electronic component and an electronic component mounting part, or a first component and a second component). The feature of the electronic component transport device is including: an area in which an electronic component mounting part on which an electronic component is placed is disposed; an apparatus transport head to transport the electronic component to the electronic component mounting part in the area; a first correcting member that is used when proceeding the positioning of the electronic component at the electronic component mounting part, it having a first reference point that serves as a reference for positioning; a second correcting member that is used together with the first correcting member when proceeding the positioning, it having a second reference point that serves as a reference for positioning; a first imaging part that captures the image including the first reference point of the first correcting member and the electronic component mounting part; a second imaging part that captures the image including the second reference point of the second correcting member and the electronic component; a third imaging part that is configured in the apparatus transport head to capture the image of the first reference point including the first correcting member, and capture the image of the second reference point including the second correcting member; and a control part to calculate the position of the third imaging part with respect to the first reference point based on the image including the first reference point, and calculate the position of the third imaging part with respect to the second reference point based on the image including the second reference point.

Description

Electronic component transfer device and inspection device, positioning device and method, and component transfer device

The present invention relates to an electronic component transfer device, an electronic component inspection device, a positioning device, a component transfer device, and a positioning method.

Generally, a test device (IC processing machine) for electronic components such as semiconductor wafers includes a plurality of transfer robots for transferring electronic components. Furthermore, the electronic parts before inspection are transferred to the inspection socket for measurement by the transport robot, and are collected from the inspection socket after the inspection is completed. Specifically, for example, the electronic parts before inspection are sucked and held by the supply robot, separated and arranged in the supply grooves of the shuttle, and then moved to the position where the measurement robot is sucked and held by the shuttle. The electronic parts before inspection are separated by the measuring robot from the shuttle and arranged in the inspection socket. After the inspection is completed, the inspection robot is again held and held by the measuring robot to be separated and arranged in the recovery groove of the shuttle. In addition, the electronic components after inspection are moved to the position of the recovery robot by a shuttle, separated by the recovery robot, and arranged on a recovery tray corresponding to the test result. When the supply robot, the measurement robot, and the recovery robot sequentially transfer the inspection socket and each groove, the electronic parts must be arranged at a specific position of the inspection socket and each groove. In particular, when the electronic component is arranged in the inspection socket, the measurement terminal of the inspection socket must be in good contact with the terminal of the electronic component. Therefore, the relative deviation between the electronic component and the inspection socket is expected to be small. In addition, when disposed in other grooves, the relative deviation between each groove and the electronic component is also expected to be small. As a method of reducing the relative deviation between the electronic component and the inspection socket, there are the following methods: image processing is performed on the image data of the electronic component and the inspection socket photographed by the camera, and the relative deviation is calculated based on the calculation result Only position correction is performed on the relative deviation. Therefore, a method for directly photographing an electronic component and a test device is proposed (for example, refer to Patent Document 1). When the IC processing device described in Patent Document 1 is to place the electronic parts held before the inspection of the conveying device relatively above the test device, the camera is mounted on the same supporting member as the mirror, and the electronic device is placed on the electronics A mirror image of a mirror formed between the part and the test device and reflecting both the electronic part and the test device. [Prior Art Literature] [Patent Literature] [Patent Literature 1] Japanese Patent No. 3063899

[Problems to be Solved by the Invention] However, in the IC processor described in Patent Document 1, the configuration and adjustment of mirrors and mirrors are complicated and the accuracy is limited in order to make both electronic components and test devices appear on the mirrors. In addition, the configuration and adjustment of the camera used to shoot the image is not simple, so the accuracy is limited. In addition, it is necessary to consider the diachronic deviation of the position of the mirror and the camera. In addition, when photographing the electronic component and the test device, since the mirror is arranged between the electronic component and the test device, it takes time to dispose and retreat the mirror. [Technical means for solving the problem] The present invention has been accomplished in order to solve at least a part of the problems described above, and can be implemented as the following forms. The electronic component transfer device of the present invention is characterized by comprising: an area where an electronic component placement portion on which electronic components are placed can be arranged; and a device transfer head that can transfer the electronic component to the electronic component placement portion in the above area. The first calibration member is used when positioning the electronic component on the electronic component mounting portion; the second calibration member is used with the first calibration member when performing the positioning; the first imaging A second imaging unit that can capture an image including the first calibration member and the electronic component mounting portion; a second imaging unit that can capture an image including the second calibration member and the electronic component; and a third imaging device It is provided on the device transfer head and can take an image of the first correction member and can take an image of the second correction member. Therefore, when the electronic component is placed on the electronic component placement portion, the device transfer head can correct at least one of the position and posture of the electronic component relative to the electronic component placement portion based on each image before the placement. With this correction, the electronic component is correctly placed on the electronic component placement portion by obtaining an appropriate position or posture on the electronic component placement portion. In the electronic component conveying device of the present invention, it is preferable that the third imaging unit photographs the first correction member and the second correction member at different positions. This prevents, for example, the image of the second correction member from being reflected on the first correction member, or the image of the first correction member from being reflected on the second correction member, thereby enabling rapid image processing. In the electronic component conveying device of the present invention, it is preferable that the first correction member has a plate shape and has a first mark attached to one side, and the second correction member has a plate shape and has a first mark attached to one side. 2 mark and 3 mark on the other side. Thereby, the distance between each mark and an object (for example, an electronic component) can be detected. In addition, each of the detected distances is used for positioning the electronic component to the electronic component mounting portion. In the electronic component conveying apparatus of the present invention, it is preferable that each of the first mark, the second mark, and the third mark has a reference point that becomes a reference when performing the positioning. Thereby, the distance between each mark and an object (for example, an electronic component) can be detected accurately. In addition, each of the detected distances is used for positioning the electronic component to the electronic component mounting portion. In the electronic component transfer device of the present invention, it is preferable that each of the first mark, the second mark, and the third mark has a coordinate axis. Thereby, the distance between each mark and an object (for example, an electronic component) can be detected accurately. In addition, each of the detected distances is used for positioning the electronic component to the electronic component mounting portion. In the electronic component conveying device of the present invention, it is preferable that the first mark, the second mark, and the third mark each have a scale. Thereby, the distance between each mark and an object (for example, an electronic component) can be detected accurately. In addition, each of the detected distances is used for positioning the electronic component to the electronic component mounting portion. In the electronic component transfer device of the present invention, it is preferable that the imaging direction of the second imaging section and the imaging direction of the third imaging section are opposite to each other. Thereby, one second correction member can be photographed from the opposite sides. In the electronic component conveying device of the present invention, it is preferable that the position of the electronic component mounting portion with respect to the first mark is detected based on a photographing result of the first imaging portion. Thereby, the distance from the 1st mark to an electronic component mounting part can be calculated. In the electronic component transfer device of the present invention, it is preferable to detect the position and distance of the electronic component of the device transfer head with respect to the third mark based on a photographing result of the second imaging unit. With this, the distance from the third mark to the electronic part of the device transfer head can be calculated. In the electronic component transfer device of the present invention, it is preferable to detect the position of the electronic component of the device transfer head with respect to the second mark based on the photographing result of the second imaging unit and the photographing result of the third imaging unit. distance. With this, the position and distance of the electronic device from the second mark to the device transfer head can be calculated (calculated). In the electronic component conveying apparatus of the present invention, it is preferable that the second correction member has permeability. Thereby, for example, the second mark can double as the third mark, and conversely, the third mark can double as the second mark. In the electronic component transfer device of the present invention, it is preferable to sequentially perform the imaging of the first imaging unit, and then perform the imaging of the second imaging unit and the imaging of the second correction member by the third imaging unit at the same time. Then, the third imaging unit photographs the first correction member. This makes it easier to group control programs. In addition, if the control program needs to be re-examined, it can be re-examined relatively easily. In the electronic component transfer device of the present invention, it is preferable that the device transfer head includes: a base portion; a holding portion that holds the electronic component; and an adjustment portion that can adjust the electronic component held by the holding portion with respect to the base portion. At least one of position and posture. This allows fine adjustment of the electronic parts when the electronic parts held on the device transfer head are placed on the electronic parts mounting portion. Thereby, for example, when the electronic component mounting portion is an inspection portion that performs electrical inspection of the electronic component, the electronic component and the inspection portion can be brought into conductive contact with each other, whereby the inspection of the electronic component can be performed accurately. The electronic component inspection device of the present invention is characterized by comprising: an electronic component mounting section for mounting the electronic components; an area in which the electronic component mounting section can be arranged; and a device transfer head for transferring the electronic components in the area. The component is transported to the electronic component mounting section; the first calibration member is used when positioning the electronic component to the electronic component mounting section; the second calibration member is the same as the first component when performing the positioning The calibration member is used together; the first imaging section can capture an image including the first calibration member and the electronic component mounting section; the second imaging section can capture an image including the second calibration member and the electronics An image of a component; and a third imaging unit provided on the device transfer head, capable of capturing an image of the first calibration member, and capturing an image of the second calibration member, and mounting the electronic component The department inspects the electronic parts described above. Therefore, when the electronic component is placed in the inspection section, the device transfer head can correct at least one of the position and posture of the electronic component relative to the inspection section based on each image before the placement. With this correction, the electronic component is correctly placed on the inspection section by obtaining an appropriate position or posture on the inspection section. This allows accurate inspection of electronic components. In addition, the electronic component can be transported to an electronic component mounting portion as an inspection portion, whereby the inspection of the electronic component can be performed by the inspection portion. In addition, electronic parts after inspection can be transported from the inspection section. The positioning device of the present invention is a person who positions the first part and the second part by overlapping, and is characterized by comprising: a first correction member for performing one of the first part and the second part; It is used for positioning of another part. The second calibration member is used together with the first calibration member when performing the above positioning. The first imaging unit can capture images including the first calibration member and the first calibration member. Images of parts; a second imaging unit that can capture images including the second calibration member and the second component; and a third imaging unit that can capture images of the first calibration member, and can An image of the second correction member is taken. Thus, when the first part and the second part are overlapped, at least one of the relative position and posture of the first part and the second part can be corrected based on each image before the overlap. With this correction, the first component and the second component can be accurately positioned and positioned. The positioning device of the present invention preferably includes a processor. The processor reads instructions stored in the memory (memory), and detects the first calibration member and the first based on a photographing result captured by the first imaging unit. The positional relationship between the components (for example, the electronic component mounting portion) is detected based on the photographing result captured by the second imaging unit, and the positional relationship between the second calibration component and the second component (eg, the electronic component) is detected based on the third imaging As a result of the imaging performed by the camera, the positional relationship between the second member (for example, an electronic component) and the first correction member is detected. The component conveying device of the present invention is a person who positions the first component and the second component to perform positioning, and is characterized by including: a conveying unit that conveys the second component; and a first correction member that performs the first component It is used when positioning one of the second part and the other part. The second calibration member is used together with the first calibration member when the positioning is performed. The first imaging unit is capable of shooting. An image including the first correction member and the first component; a second imaging section that can take an image including the second correction member and the second component; and a third imaging section provided in the above The transfer unit can capture an image of the first correction member and an image of the second correction member. Thus, when the first part and the second part are overlapped, at least one of the relative position and posture of the first part and the second part can be corrected based on each image before the overlap. With this correction, the first component and the second component can be accurately positioned and positioned. The positioning method of the present invention is a positioning method in which the first part and the second part are overlapped and positioned, and is characterized in that when positioning the first part and the other part of the second part, use The first correction member and the second correction member have the following steps: using the first imaging unit to take a first image including the first correction member and the first part from the first direction; using the second imaging unit; , Taking a second image including the second correction member and the second part from a second direction different from the first direction; using a third imaging section, photographing the second correction member from the first direction A third image; and a fourth image of the first correction member is captured from the first direction using the third imaging unit. With this, when the first part and the second part are overlapped, it is possible to correct the first part and the second part based on the first image, the second image, the third image, and the fourth image before the overlap. At least one of a relative position and a posture. With this correction, the first component and the second component can be accurately positioned and positioned.

Hereinafter, based on the preferred embodiments shown in the accompanying drawings, the electronic component transfer device, electronic component inspection device, positioning device, component transfer device, and positioning method of the present invention will be described in detail. <First Embodiment> Hereinafter, a first embodiment of an electronic component transfer device, an electronic component inspection device, a positioning device, and a positioning method according to the present invention will be described with reference to FIGS. 1 to 14. In the following, for convenience of explanation, as shown in FIG. 1, three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is also referred to as "Y direction (second direction)", and a direction parallel to the Z axis is also referred to as " Z direction (third direction) ". The direction in which the arrows in each direction are directed is called "forward", and the opposite direction is called "reverse". In addition, the "horizontal" mentioned in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined to a certain level (for example, less than about 5 °). The upper side in FIGS. 1 and 3 to 14 (the same applies to FIGS. 16 to 20) may be referred to as “upper” or “upper”, and the lower side may be referred to as “lower” or “lower”. The positioning device 30 of the present invention is a device that performs positioning by overlapping the first part with the second part. As shown in FIGS. 1 and 2, in the present embodiment, the positioning device 30 is provided in the electronic component transporting device 10 (electronic component inspection device 1). In addition, in the present embodiment, the first component is an inspection section 16 (electronic component mounting section) on which electronic components are placed and inspected. The second component is an electronic component (IC device 90). The positioning device 30 includes a first correction member 7 used for positioning one of the first part and the second part to the other part, and a second correction member 8 used for the above-mentioned positioning. Used with the first correction member 7; the first imaging section 6A can capture a first image IM including the first correction member 7 and the first part₁ (Image); The second imaging unit 6B can capture a second image IM including the second correction member 8 and the second component.₂ (Image); and a third imaging unit 6C that can capture a fourth image IM of the first correction member 7₄ (Image), and the third image IM of the second correction member 8 can be captured₃ (image). Moreover, the positioning device 30 can perform the positioning method of the present invention. The positioning method of the present invention is a method of positioning by overlapping the first part with the second part. This positioning method uses the first correction member 7 and the second correction member 8 when positioning one of the first part and the second part to the other part. In addition, the positioning method includes using the first imaging unit 6A to capture a first image IM including the first correction member 7 and the first component from the positive side (the first direction) in the Z-axis direction.₁ The first step (step); using the second imaging unit 6B, shooting from the negative side (second direction) of the Z axis direction which is different from the positive side (first direction) of the Z axis direction, including the second correction member 8 and the second Image 2 of the part IM₂ The second step (step); using the third imaging unit 6C, the third image IM of the second correction member 8 is taken from the positive side (first direction) of the Z-axis direction₃ The third step (step) step; and using the third imaging unit 6C, the fourth image IM of the first correction member 7 is taken from the positive side (first direction) in the Z-axis direction.₄ The fourth step (step). The electronic component transfer device 10 according to the present invention has the appearance shown in FIG. 1. The electronic component transfer device 10 of the present invention is a processing machine and includes: a first room for carrying electronic components; and a second room for transferring electronic components from the first room, and has an inspection section 16 (electronics) for placing electronic components. Parts placement section) Configurable inspection area A3 (area); device supply section 14 which can carry electronic parts from the first room to the second room; and a device transfer head 17 which can be used in the inspection area A3 (area). The device supply section 14 transports electronic components to the inspection section 16 (electronic component placement section); the first correction member 7 is used for positioning the electronic component to the inspection section 16 (electronic component placement section); the second correction The use member 8 is used together with the first correction member 7 when performing the above-mentioned positioning; and the first imaging unit 6A is capable of capturing the first image including the first correction member 7 and the inspection unit 16 (electronic component placement unit). Image IM₁ (Image); a second imaging unit 6B that can capture a second image IM including the second correction member 8 and the electronic component₂ (Image); and a third imaging unit 6C, which is provided on the device transfer head 17 and can capture a fourth image IM of the first correction member 7₄ (Image), and the third image IM of the second correction member 8 can be captured₃ (image). In this embodiment, the first chamber is a compartment surrounded by a first partition 231, a second partition 232, a fifth partition 235, a side cover 242, and a rear cover 244 (see FIG. 2). The second room is a compartment surrounded by a second partition 232, a third partition 233, and a rear cover 244 (see FIG. 2). According to the present invention, as described later, when the IC device 90 is placed on the inspection section 16, the device transfer head 17 can be based on the first image IM before the placement.₁ Second image IM₂ 3rd image IM₃ And 4th image IM₄ , At least one of the position and posture of the electronic component relative to the inspection section 16 is corrected. With this correction, the electronic component has an appropriate position and posture placed on the inspection section 16, and thus, after being placed on the inspection section 16, each terminal 902 and each probe pin 162 can be correctly and electrically connected. This allows accurate inspection of electronic components. As shown in FIG. 2, the electronic component inspection device 1 according to this embodiment includes an electronic component transfer device 10 and further includes an inspection unit 16 for inspecting the electronic components. That is, the electronic component inspection apparatus 1 of the present invention includes a first room for carrying in electronic components, an inspection section 16 serving as an electronic component placement section for placing electronic components, and a second room for transferring electronics from the first room Components, and has an inspection area A3 (area) in which the inspection section 16 (electronic component placement section) can be arranged; the device supply section 14 can carry electronic parts from the first room to the second room; In the inspection area A3 (area), electronic components can be transported from the device supply section 14 to the inspection section 16 (electronic component placement section); the first correction member 7 performs electronic parts to the inspection section 16 (electronic component placement) The second calibration member 8 is used together with the first calibration member 7 when performing the above-mentioned positioning; and the first imaging unit 6A is capable of capturing images including the first calibration member 7 and the inspection unit 16 (Electronic component mounting section) First image IM₁ (Image); a second imaging unit 6B that can capture a second image IM including the second correction member 8 and the electronic component₂ (Image); and a third imaging unit 6C, which is provided on the device transfer head 17 and can capture a fourth image IM of the first correction member 7₄ (Image), and the third image IM of the second correction member 8 can be captured₃ (image). As described above, the electronic component mounting portion is the inspection portion 16 that inspects the electronic components. Thereby, the electronic component inspection apparatus 1 which has the advantage of the said electronic component conveying apparatus 10 can be obtained. In addition, the electronic component can be transported to the inspection unit 16, whereby the inspection of the electronic component can be performed by the inspection unit 16. In addition, electronic components after inspection can be transported from the inspection unit 16. Hereinafter, the configuration of each unit will be described in detail. As shown in FIGS. 1 and 2, the electronic component inspection device 1 having the electronic component transfer device 10 is, for example, a device that transfers electronic components such as IC devices, such as BGA (Ball Grid Array) packages, and transfers them In the process of inspection, test (hereinafter referred to as "inspection") the electrical characteristics of electronic parts. In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component will be described as a representative, and it will be referred to as "IC device 90". The IC device 90 is a flat plate in this embodiment. In addition, the IC device 90 has a plurality of terminals (electronic-part-side terminals) 902 arranged in a matrix shape in a plan view on a lower surface thereof. Each terminal 902 has a hemispherical shape. In addition, as the IC device 90, for example, "LSI (Large Scale Integration)", "CMOS (Complementary Metal Oxide Semiconductor)", and "CCD (Charge Coupled Device)" : Charge-coupled device) ", and" module IC "that encapsulates multiple modules of IC devices, such as" crystal device "," pressure sensor "," inertial sensor (acceleration sensor) " , "Gyroscope sensor", and "Fingerprint sensor". The electronic component inspection device 1 (electronic component transfer device 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device recovery area A4, and a tray removal area A5. These areas are separated by respective wall portions as described later. . Further, the IC device 90 follows the arrow α from the tray supply area A1 to the tray removal area A5.₉₀ The direction passes through the above-mentioned areas in order, and inspection is performed in the inspection area A3 in the middle. In this way, the electronic component inspection apparatus 1 includes the following: an electronic component transporting apparatus 10 having a transport section 25 that transports the IC device 90 through each area; an inspection section 16 that performs inspection in the inspection area A3; and control Department 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal lamp 400, and an operation panel 700. In addition, the electronic component inspection apparatus 1 uses the side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and the side where the inspection area A3 is arranged, that is, the upper side in FIG. 2 is Use on the back side. In addition, the electronic component inspection apparatus 1 is used by mounting in advance a so-called "replacement jig" that is replaced for each type of the IC device 90. A mounting portion (electronic component mounting portion) on which the IC device 90 (electronic component) is mounted is provided in the replacement jig. In the electronic component inspection apparatus 1 according to this embodiment, the placement section is provided at a plurality of locations, and includes, for example, a temperature adjustment section 12, a device supply section 14, and a device recovery section 18 described later. In addition, in the mounting section (electronic component mounting section) on which the IC device 90 (electronic component) is mounted, in addition to the jig replacement as described above, there are also a tray 200 and a recycling tray 19 prepared by the user. Examination Department 16. The tray supply area A1 is a material supply section to which the tray 200 in which the plurality of IC devices 90 are arranged in an unchecked state is supplied. The tray supply area A1 may also be referred to as a mounting area where a plurality of trays 200 can be stacked and mounted. In this embodiment, a plurality of recesses (grooves) are arranged in a matrix in each tray 200. The IC devices 90 can be stored and placed one by one in each recess. The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 transferred from the tray supply area A1 are respectively transferred and supplied to the inspection area A3. In addition, tray conveying mechanisms 11A and 11B are provided so as to cross the tray supply area A1 and the device supply area A2 in the horizontal direction to convey the tray 200 one by one. The tray transfer mechanism 11A is a part of the transfer unit 25. The tray 200 and the IC device 90 placed on the tray 200 can be positioned on the positive side of the Y direction, which is the arrow α in FIG. 2_11A Move in the direction. Thereby, the IC device 90 can be stably fed into the device supply area A2. In addition, the tray transfer mechanism 11B can move the empty tray 200 to the negative side in the Y direction, which is the arrow α in FIG. 2._11B Moving part moving in the direction. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1. In the device supply area A2, a temperature adjustment section (a temperature holding plate (English: soap plate, Chinese description (one example): temperature equalizing plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. Also, a device supply unit 14 is provided which moves so as to cross the device supply area A2 and the inspection area A3. The temperature adjustment section 12 is a mounting section on which a plurality of IC devices 90 are mounted, and is referred to as a "temperature holding plate" that can heat or cool the mounted IC devices 90 together. With the temperature holding plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled in advance and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). The temperature adjustment section 12 as such a mounting section is fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment section 12 can be stably adjusted. The temperature adjustment unit 12 is grounded (grounded). In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. The IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A is transferred to any one of the temperature adjustment units 12. The device transfer head 13 is a person who holds the IC device 90 and is supported in the device supply area A2 so as to be movable in the X and Y directions, and further supported in the Z direction. This device transfer head 13 is also a part of the transfer unit 25, and is responsible for transferring the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the temperature adjustment unit 12 and a device supply unit 14 described later. The IC devices 90 are transported between them. In FIG. 2, the X-direction movement of the device transfer head 13 is indicated by an arrow α._13X Indicates that the Y-direction movement of the device transfer head 13 is indicated by an arrow α_{13 Y} Means. The device supply section 14 is a mounting section on which the IC device 90 temperature-adjusted by the temperature adjustment section 12 is placed, and is referred to as a "supply shuttle" or simply " Supply shuttle ". The device supply section 14 may be a part of the transfer section 25. The device supply section 14 includes a recessed portion (groove) 141 (see FIGS. 4 to 10) in which the IC device 90 is housed and placed. In addition, the device supply portion 14 as the mounting portion may be in the X direction, that is, the arrow α₁₄ The direction is supported to move back and forth (movably) between the device supply area A2 and the inspection area A3. With this, the device supply section 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection section 16 of the inspection area A3, and can be removed by the device transfer head 17 (hand unit 9) in the inspection area A3. The IC device 90 then returns to the supply area A2 again. In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the negative side in the Y direction may be referred to as a “device supply unit 14A”, and the device supply unit 14 on the positive side in the Y direction may be used. The device supply unit 14 is referred to as a “device supply unit 14B”. In addition, the IC device 90 on the temperature adjustment section 12 is transported to the device supply section 14A or the device supply section 14B in the device supply area A2. The device supply unit 14 is configured to heat or cool the IC device 90 mounted on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 temperature-adjusted by the temperature adjustment part 12 can be maintained in the temperature adjustment state, and can be conveyed to the vicinity of the inspection part 16 of the inspection area A3. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12. The tray transfer mechanism 15 is an empty tray 200 in a state where all IC devices 90 have been removed, in the device supply area A2, on the positive side in the X direction, that is, the arrow α₁₅ Directional transport agency. After the transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B. The inspection area A3 is an area where the IC device 90 is inspected. An inspection section 16 for inspecting the IC device 90 and a device transfer head 17 are provided in the inspection area A3. The device supply transfer head 17 is a part of the transfer section 25 and is configured to heat or cool the IC device 90 held by the same as the temperature adjustment section 12. As described later, this device transfer head 17 includes a hand unit 9 that holds an IC device 90 (electronic component). Thereby, the IC device 90 that maintains the temperature adjustment state can be held, and the IC device 90 can be transported in the detection area A3 while the temperature adjustment state is maintained. Such a device transfer head 17 is supported in the inspection area A3 so as to be able to move back and forth in the Y direction and the Z direction, and becomes a part of a mechanism called an "indexing arm". With this, the device transfer head 17 can lift the IC device 90 from the device supply section 14 carried in from the device supply area A2, and transfer and place the IC device 90 on the inspection section 16. In FIG. 2, the Y-direction reciprocating movement of the device transfer head 17 is indicated by an arrow α._17Y Means. In addition, the device transfer head 17 is supported to be capable of reciprocating in the Y direction, but is not limited thereto, and may be supported to be capable of reciprocating in the X direction. In the configuration shown in FIG. 2, two device transfer heads 17 are arranged in the Y direction, and the device transfer head 17 on the negative side in the Y direction may be referred to as “device transfer head 17A”, and the device transfer head 17 on the positive side in the Y direction may be used. The device transfer head 17 is referred to as a "device transfer head 17B". The device transfer head 17A may be responsible for transferring from the device supply unit 14A of the IC device 90 to the inspection unit 16 in the inspection area A3, and the device transfer head 17B may be responsible for transferring from the device supply unit 14B of the IC device 90 to the inspection unit in the inspection area A3 Transfer of 16. The inspection section 16 (socket) is a mounting section (electronic component mounting section) that mounts the IC device 90 that is an electronic component and checks the electrical characteristics of the IC device 90. The inspection section 16 includes a mounting section-side terminal base 161 for storing and mounting the IC device 90. A plurality of probe pins (mounting section-side terminals) 162 are provided on the bottom of the mounting section-side terminal base 161. (Refer to Fig. 4 to Fig. 10). The part in which the IC device 90 is housed or placed may not have a recess. Specifically, the shape may be a flat surface or a concave portion. Such a portion in which the IC device 90 is housed or placed is referred to as a "mounting-part-side terminal base" that serves as a base of the mounting-part-side terminals. In addition, by connecting the terminal 902 of the IC device 90 and the probe pin 162 conductively, that is, making contact, the inspection of the IC device 90 can be performed. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 16. In addition, the shape of the upper end portion of the probe pin 162 conforms to the shape of the terminal 902. In this embodiment, the shape conforms to the crown shape of the hemispherical terminal 902. In addition, similarly to the temperature adjustment unit 12, the inspection unit 16 can heat or cool the IC device 90 and adjust the IC device 90 to a temperature suitable for inspection. The device recovery area A4 is an area where an inspection is performed in the inspection area A3 and a plurality of IC devices 90 are recovered after the inspection is completed. In this device recovery area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. A device recovery unit 18 is also provided that moves across the inspection area A3 and the device recovery area A4. An empty tray 200 is also provided in the device recovery area A4. The device recovery section 18 is a mounting section that can place the IC device 90 that has been inspected by the inspection section 16 and transport the IC device 90 to the recovery area A4, and is called a "recycling shuttle" or simply "recycling shuttle". The device recovery section 18 may be a part of the transport section 25. The device recovery unit 18 may be an arrow α in the X direction.₁₈ The direction is supported to move back and forth between the inspection area A3 and the device recovery area A4. In the configuration shown in FIG. 2, the device recovery unit 18 is provided in the Y direction in the same manner as the device supply unit 14. The device recovery unit 18 on the negative side in the Y direction may be referred to as a “device recovery unit 18A ", The device recovery section 18 on the positive side in the Y direction is referred to as" device recovery section 18B ". In addition, the IC device 90 on the inspection section 16 is transported and placed in the device recovery section 18A or the device recovery section 18B. In addition, the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is performed by the device transfer head 17A, and the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18B is performed by the device transfer head 17B. The device recovery unit 18 is also grounded in the same manner as the temperature adjustment unit 12 and the device supply unit 14. The recovery tray 19 is a mounting portion on which the IC device 90 inspected by the inspection portion 16 is placed, and is fixed and does not move within the device recovery area A4. Thereby, even in the device recovery area A4 in which various movable parts such as a large number of device transfer heads 20 are arranged, the IC devices 90 that have been inspected are stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged in the X direction. Three empty trays 200 are also arranged in the X direction. The empty tray 200 is also a mounting portion on which the IC device 90 inspected by the inspection portion 16 is placed. Then, the IC device 90 on the device recovery section 18 that has moved to the device recovery area A4 is transported to and placed on any one of the recovery tray 19 and the empty tray 200. As a result, the IC devices 90 are sorted and recovered according to the results of each inspection. The device transfer head 20 includes a portion that can be moved in the X direction and the Y direction in the device recovery area A4 and can also be moved in the Z direction. The device transfer head 20 is a part of the transfer unit 25 and can transfer the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In FIG. 2, the X-direction movement of the device transfer head 20 is indicated by an arrow α._20X Indicates that the Y-direction movement of the device transfer head 20 is indicated by the arrow α_20Y Means. The tray transfer mechanism 21 is an empty tray 200 that is carried in from the tray removal area A5 in the X direction, that is, the arrow α in the device recovery area A4._{twenty one} Directional transport agency. In addition, after the transfer, the empty tray 200 is disposed at a position where the IC device 90 is collected, that is, it can be any of the three empty trays 200 described above. The tray removal area A5 is a material removal section that collects and removes the trays 200 in which the plurality of IC devices 90 of the inspection completion state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked. In addition, a tray transfer mechanism 22A and a tray transfer mechanism 22B that transfer the tray 200 one by one in the Y direction are provided so as to span the device recovery area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying section 25, and can make the tray 200 in the Y direction, which is the arrow α_22A Moving part moving in the direction back and forth. Thereby, the completed IC device 90 can be transferred from the device recovery area A4 to the tray removal area A5. In addition, the tray transfer mechanism 22B can be used to collect the empty tray 200 of the IC device 90 on the positive side of the Y direction, that is, the arrow α_22B Move in the direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4. The control unit 800 includes at least one processor that performs various determinations, various commands, and the like. The control unit 800 (processor) can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, and the device. The operations of the recovery unit 18, the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B, and the operations of the first imaging unit 6A, the second imaging unit 6B, and the third imaging unit 6C described later. The operator can set and confirm the operating conditions and the like of the electronic component inspection apparatus 1 through the monitor 300. The monitor 300 includes, for example, a display screen 301 composed of a liquid crystal screen, and is arranged on an upper portion of the front side of the electronic component inspection apparatus 1. As shown in FIG. 1, on the right side in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse is provided. This mouse is used when the screen displayed on the monitor 300 is operated. An operation panel 700 is disposed on the lower right of FIG. 1 with respect to the monitor 300. The operation panel 700 is separate from the monitor 300 and issues a required operation command to the electronic component inspection device 1. In addition, the signal lamp 400 can report the operation state of the electronic component inspection device 1 and the like by a combination of light emitting colors. The signal lamp 400 is arranged on the upper part of the electronic component inspection apparatus 1. In addition, a speaker 500 is built in the electronic component inspection device 1, and the operating state of the electronic component inspection device 1 and the like can be notified through the speaker 500. In the electronic component inspection device 1, the tray supply area A1 and the device supply area A2 are separated by a first partition 231, the device supply area A2 and the inspection area A3 are separated by a second partition 232, and the inspection area A3 and the device are recycled The areas A4 are separated by a third partition 233, and the device recovery area A4 and the tray removal area A5 are separated by a fourth partition 234. The device supply region A2 and the device recovery region A4 are also separated by a fifth partition plate 235. In addition, in this embodiment, a processing machine called a so-called low temperature machine is used as an example, so a partition plate is provided so as to be divided into the above-mentioned compartments (chambers) in order to ensure tightness and the like. However, in the case of a non-cryogenic machine, it is not necessary to ensure air-tightness, so it may not be divided into compartments, that is, not separated by a partition, for example, it can also be used as a bulk space without a partition. In addition, the device transfer head 17 (indexing arm) may directly transfer (including carry-in and carry-out) electronic components between the tray and the inspection section. The outermost part of the electronic component inspection device 1 is covered by a cover, which includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245. However, with the miniaturization of the IC device 90 in recent years, the distance between the terminals 902 of the IC device 90 has also become narrower. As a result, each terminal 902 and the probe pin 162 of the inspection section 16 which should be in contact with each terminal 902 become It may be difficult to access and may not be properly inspected. Therefore, the electronic component inspection apparatus 1 is configured to prevent such a problem. This configuration and effect will be described below. As shown in FIG. 3, the device transfer head 17 includes at least one hand unit 9. As shown in FIGS. 4 to 10, the hand unit 9 can hold the IC device 90 (electronic component) on the device supply section 14 and transport it to the inspection section 16. In addition, the total number or configuration of the hand units 9 (several in the X direction and several in the Y direction) is not particularly limited. The hand unit 9 (device transfer head 17) includes: a base portion 94; a holding portion 98 that holds an IC device 90 (electronic component); and an adjustment portion 91 that adjusts and holds the IC device 90 (electronic component) held on the holding portion 98. At least one of the position and posture of the base portion 94. The adjusting section 91 includes a first moving section 95 supported by the base section 94 and capable of moving back and forth in the X direction relative to the base section 94, and a second moving section 96 supported by the first moving section 95 and capable of moving relative to the first The portion 95 reciprocates in the Y direction; the rotating portion (rotating portion) 97 is supported by the second moving portion 96 and can rotate (rotate) about the Z axis with respect to the second moving portion 96; the shaft 99 is provided at Rotating portion 97; first piezoelectric actuator 911 that moves first moving portion 95 relative to base portion 94; second piezoelectric actuator 912 that moves second moving portion 96 relative to first moving portion 95 And a third piezoelectric actuator (a piezoelectric actuator for a rotating part) 913 that rotates the rotating part 97 relative to the second moving part 96. A holding portion 98 is fixed to a lower portion of the shaft 99. With the adjustment portion 91 configured in this way, in this embodiment, both the position and posture of the IC device 90 held by the holding portion 98 with respect to the base portion 94 can be adjusted. Thereby, when the IC device 90 held by the holding portion 98 is placed on the inspection portion 16, fine adjustment of the IC device 90 can be performed. Thereby, each terminal 902 of the IC device 90 can be brought into contact with each probe pin 162 of the inspection unit 16, so that the inspection of the IC device 90 can be performed accurately. The base portion 94 has a plate-like portion 941 formed in a plate shape having a thickness in the Z direction, and a buckling portion 942 and a buckling portion 943 which are provided on the lower surface of the plate-like portion 941 and are used to place the first moving portion 95 Guide in X direction. The engaging portions 942 and the engaging portions 943 each extend in the X direction and are separated from each other in the Y direction. The configurations of the engaging portion 942 and the engaging portion 943 are not particularly limited, but in the present embodiment, each has a groove that is opened in the longitudinal direction of the rail 952 and the rail 953 described later. In other words, the engaging portion 942 and the engaging portion 943 are each constituted by an elongated portion having an elongated groove opened downward in FIG. 3. In addition, the base portion 94 includes a contact portion 947 that protrudes from the plate-like portion 941 to the negative side in the Z direction and is in contact with the first piezoelectric actuator 911. The abutting portion 947 extends to the second moving portion 96 and is provided so as to be aligned in the Y direction with respect to the first moving portion 95 and the second moving portion 96. The lower surface 947a of the contact portion 947 extends in the X direction, and the convex portion 911a (upper end portion) of the first piezoelectric actuator 911 is in contact with the lower surface 947a. It is preferable that the surface of the lower surface 947a be subjected to a treatment to increase the frictional resistance with the convex portion 911a or to form a high friction layer. The first moving portion includes a base portion 951; a guide rail 952 provided on the base portion 951 to be engaged with the engaging portion 942 of the base portion 94; and a guide rail 953 provided on the base portion 951 to be engaged with the engaging portion 943 of the base portion 94. Thereby, the movement of the first moving part 95 outside the X direction is restricted, and the first moving part 95 is smoothly and surely moved in the X direction. The first moving portion 95 includes a first fixing portion 954 extending from the base portion 951 to the negative side in the Z direction, and the first piezoelectric actuator 911 is fixed. The first fixed portion 954 extends in the XZ plane, has a plate shape having a thickness in the Y direction, and is provided so as to be aligned in the Y direction with respect to the second moving portion 96 (base portion 961). A first piezoelectric actuator 911 is fixed to a surface of the first fixing portion 954. The first piezoelectric actuator 911 is formed in a plate shape, and is fixed to the first fixing portion 954 so that the Y direction has a thickness. By arranging the first piezoelectric actuator 911 in this way, it is possible to suppress the first piezoelectric actuator 911 from protruding excessively outward, and to reduce the size of the hand unit 9. The first moving portion 95 includes a second fixing portion (not shown), which projects from the base portion 951 to the negative side in the Z direction, and fixes the second piezoelectric actuator 912. The second fixing portion is expanded in the YZ plane, has a plate shape having a thickness in the X direction, and is provided so as to be aligned in the X direction with respect to the second moving portion 96 (base portion 961). A second piezoelectric actuator 912 is fixed to a rear surface of the second fixing portion. The second piezoelectric actuator 912 has a plate shape and is fixed to the second fixing portion such that the X direction has a thickness. By arranging the second piezoelectric actuator 912 in this way, it is possible to suppress the second piezoelectric actuator 912 from protruding excessively outward, and to reduce the size of the hand unit 9. The upper end portion of the second piezoelectric actuator 912 abuts on the second moving portion 96 from the lower side. In addition, the first moving portion 95 includes an engaging portion (guide portion) 956 for guiding the second moving portion 96 in the Y direction. The engaging portion 956 extends in the Y direction. The configuration of the engaging portion 956 is not particularly limited, but in the present embodiment, it has a groove that is open in the longitudinal direction of the guide rail 963 described later. In other words, the engaging portion 956 is constituted by an elongated portion having an elongated groove opened downward in FIG. 3. The second moving portion 96 includes a columnar base portion 961 and a guide rail 963 provided on the base portion 961 and engaged with the engaging portion 956 of the first moving portion 95. Thereby, the movement of the second moving part 96 outside the Y direction is restricted, and the second moving part 96 moves smoothly and reliably in the Y direction. Further, a base 961 of the second moving part 96 is formed with a surface 961a which is more recessed than other parts, and a third piezoelectric actuator 913 is fixed on the surface 961a so as to rotate the rotary part 97. The surface 961a is constituted by a YZ plane, and the plate-shaped third piezoelectric actuator 913 is fixed to the surface 961a so as to have a thickness in the X direction. By arranging the third piezoelectric actuator 913 in this manner, it is possible to suppress the third piezoelectric actuator 913 from protruding excessively outward, and to reduce the size of the hand unit 9. In the hand unit 9, the position adjustment mechanism 92 is configured by the first moving portion 95 and the second moving portion 96 configured as described above. The position adjustment mechanism 92 moves the IC device 90 (electronic component) held by the holding portion 98 in a direction that is straight to the Z direction (vertical direction), that is, the X direction and the Y direction. The movement in the X direction is performed by the first moving unit 95, and the movement in the Y direction is performed by the second moving unit 96. Thereby, in the device transfer head 17 supported to be capable of reciprocating in the Y direction and the Z direction, the positions in the X direction and the Y direction of the IC device 90 can be finely adjusted independently, that is, corrected. The rotating portion 97 is located below the second moving portion 96 (negative side in the Z direction). The rotating portion 97 includes a tubular support portion 971 fixed to a lower end of the base portion 961 of the second moving portion 96. Inside the supporting portion 971, for example, a rotating body (not shown) provided coaxially with the supporting portion 971 and through which the shaft 99 is inserted, and a bearing (rotatably supporting the rotating body to the supporting portion 971) ( (Not shown), etc. Moreover, in the above-mentioned rotating body, the convex portion 913a of the third piezoelectric actuator 913 abuts on a position eccentric from the rotating shaft. In addition, by the driving of the third piezoelectric actuator 913, the rotating body rotates with respect to the support portion 971 (the second moving portion 96). In the hand unit 9, the posture adjustment mechanism 93 is configured by the first moving section 97 configured as described above. The attitude adjustment mechanism 93 is a person who rotates the IC device 90 (electronic component) held by the holding portion 98 about the Z axis (vertical axis). Thereby, in the device transfer head 17 supported to be capable of reciprocating in the Y direction and the Z direction, the posture of the IC device 90, that is, the direction around the Z axis can be independently fine-tuned, that is, corrected. As described above, the hand unit 9 (holding portion) includes a position adjustment mechanism 92 that adjusts the position of the IC device 90 (electronic component), and a posture adjustment mechanism 93 that adjusts the posture of the IC device 90 (electronic component). Thereby, as described later, when the IC device 90 is placed on the inspection section 16, both the position and the posture of the IC device 90 can be appropriately adjusted as necessary, so that the placement can be performed correctly. The shaft 99 extends to the plate-like portion 941 of the base portion 94. A copying mechanism (adaptive mechanism) 948 is built in the base portion 94. The shaft 99 is connected to the profiling mechanism 948. Thereby, the posture of the shaft mechanism 99 can mimic the external force that the shaft 99 receives. A holding portion 98 that holds the IC device 90 is arranged at the lower end of the shaft 99. The holding portion 98 is supported by the rotating portion 97 via a shaft 99 and is capable of rotating with the second moving portion 96 integrally with the rotating body. Further, the holding portion 98 includes an adsorption surface 981 facing the IC device 90, an adsorption hole 982 opened to the adsorption surface 981, and a pressure reducing pump 983 to decompress the inside of the adsorption hole 982. If the suction surface 981 is in contact with the IC device 90 by capping the suction hole 982, and the pressure in the suction hole 982 is reduced by the pressure reducing pump 983, the IC device 90 can be suctioned and held on the suction surface 981 . Conversely, if the decompression pump 983 is stopped and the inside of the adsorption hole 982 is released, the IC device 90 can be released. As the first piezoelectric actuator 911, the second piezoelectric actuator 912, and the third piezoelectric actuator 913, for example, a structure having a short strip-shaped piezoelectric element can be used. The piezoelectric element expands and contracts in its longitudinal direction by applying an AC voltage. In addition, by using this telescopic movement, the first moving portion 95 can be moved relative to the base portion 94, the second moving portion 96 can be moved relative to the first moving portion 95, or the rotating portion 97 can be rotated relative to the second moving portion 96. move. The constituent material of the piezoelectric element is not particularly limited, and lead zirconate titanate (PZT), crystal, lithium niobate, barium titanate, lead titanate, lead metaniobate, polyvinylidene fluoride, and lead Various materials, such as zinc niobate and rhenium lead niobate. When the IC device 90 is transported from the device supply section 14 to the inspection section 16 and placed on the inspection section 16, positioning of the IC device 90 with respect to the inspection section 16 (hereinafter sometimes referred to as “positioning of the IC device 90”) is performed. That is, the position correction or posture correction of the IC device 90 may be required. In this case, in order to obtain a correction value, the first correction member 7 and the second correction member 8 are used. In addition, if the positioning (correction) is omitted, contact between the terminals 902 of the IC device 90 and the probe pins 162 of the inspection unit 16 becomes difficult, which may make it difficult to inspect the IC device 90. As described above, the device supply unit 14 includes the device supply unit 14A and the device supply unit 14B. Here, the configuration of the device supply unit 14A side will be described with reference to FIGS. 4 to 14. The first correction member 7 is located at a center O described later after detection.₇₂ With the center of the mounting section side terminal base (recessed section in this embodiment) 161 of the inspection section 16₁₆₁ Positional relationship₁₆₁ Relative to center O₇₂ Where it is used. Alternatively, it can replace the center O₁₆₁ For example, it is set as the center of one probe pin 162 among the plurality of probe pins 162 located in the inspection section 16. The second correction member 8 is located at the center O described later after detection.₈₂ Optical axis O with the third imaging section 6C_6C Positional relationship_6C Relative to center O₈₂ Where it is used. The second correction member 8 is located at a center O which will be described later.₈₄ Center with IC device 90₉₀ Positional relationship₉₀ Relative to center O₈₄ Where it is used. Alternatively, it can replace the center O₉₀ For example, it is set at the center of one terminal 902 among the plurality of terminals 902 of the IC device 90. As shown in FIGS. 4 to 10, the first correction member 7 is supported and fixed to the negative side in the Y direction of the inspection section 16. The first correction member 7 has a plate shape and is arranged parallel to the XY plane. The position in the Z direction of the first correction member 7, that is, the arrangement height, is preferably the same height as the upper portion of the probe pin 162 of the inspection section 16. In addition, the first correction member 7 is plate-shaped and has a first mark 72 attached to a front surface (one surface) 71, that is, a surface facing the positive side in the Z direction. As shown in FIGS. 11 and 14, the first mark 72 includes a first coordinate axis 721 and a second coordinate axis 722. The first coordinate axis 721 is a coordinate axis parallel to the X direction, and the second coordinate axis 722 is a coordinate axis parallel to the Y direction. The intersection of the first coordinate axis 721 and the second coordinate axis 722 is the center that becomes the reference when positioning the IC device 90.₇₂ . In addition, scales 723 are added to the first coordinate axis 721, for example, at regular intervals. Similarly, scales 724 are added to the second coordinate axis 722 at equal intervals. The second correction member 8 is supported and fixed between the inspection section 16 and the device supply section 14A stopped in the inspection area A3. The second correction member 8 is formed in a plate shape and is arranged parallel to the XY plane. The Z-direction position of the second correction member 8 is the disposition height, and is preferably the same height as the terminal 902 of the IC device 90 transported in the Y-direction by the device transport head 17A, or within a range of height ± 5 mm. This can reduce the recognition error in the plane direction caused by the depth difference when shooting. In addition, in FIG. 7, the position of the second correction member 8 in the Z direction and the height of the terminal 902 of the IC device 90 transported in the Y direction by the device transfer head 17A are deviated (different), but the deviation range is ± 5. mm. In addition, the second correction member 8 is plate-shaped and has a second mark 82 attached to a front surface (one surface) 81, that is, a surface facing the positive side in the Z direction. In addition, the second correction member 8 has a third mark 84 attached to a rear surface (the other surface) 83, that is, a surface facing the negative side in the Z direction. As shown in FIG. 13, the second mark 82 includes a first coordinate axis 821 and a second coordinate axis 822. The first coordinate axis 821 is a coordinate axis parallel to the X direction, and the second coordinate axis 822 is a coordinate axis parallel to the Y direction. The intersection of the first coordinate axis 821 and the second coordinate axis 822 is the center that becomes the reference when positioning the IC device 90.₈₂ . A scale 823 is added to the first coordinate axis 821 at, for example, an equal interval. Similarly, scales 824 are added to the second coordinate axis 822 at equal intervals. As shown in FIG. 12, the third mark 84 includes a first coordinate axis 841 and a second coordinate axis 842. The first coordinate axis 841 is a coordinate axis parallel to the X direction, and the second coordinate axis 842 is a coordinate axis parallel to the Y direction. The intersection of the first coordinate axis 841 and the second coordinate axis 842 is the center that becomes the reference when the IC device 90 is positioned.₈₄ . Also, center O₈₄ With center O₈₂ It is preferable that the second correction members 8 overlap each other in plan view, that is, they coincide with each other. In addition, scales 843 are added to the first coordinate axis 841, for example, at regular intervals. Similarly, scales 844 are added to the second coordinate axis 842 at equal intervals. As described above, the first correction member 7 has a plate shape and has the first mark 72 attached to the front surface (one surface) 71. On the other hand, the second correction member is also plate-shaped and has a second mark 82 attached to the front side (one side) 81 and a third mark 84 attached to the back side (the other side) 83. The first mark 72, the second mark 82, and the third mark 84 each have a coordinate axis. Each of the first mark 72, the second mark 82, and the third mark 84 is an intersection of two coordinate axes, and has a reference point that serves as a reference when performing positioning. The first mark 72, the second mark 82, and the third mark 84 each have a scale attached to the coordinate axis. With such a first mark 72, the center O can be accurately detected.₇₂ The center of the mounting section terminal base (recessed section in this embodiment) 161 of the inspection section 16 O₁₆₁ the distance between. In addition, the second mark 82 can accurately detect the center O.₈₂ Optical axis O with the third imaging section 6C_6C the distance between. The third mark 84 can accurately detect the center O.₈₄ Center with IC device 90₉₀ the distance between. Each of the detected distances is used for positioning the IC device 90. The second correction member 8 may be a transparent one. In this case, the second mark 82 may double as the third mark 84, and conversely, the third mark 84 doubles as the second mark 82. The positional relationship between the second mark 82 and the third mark 84 can also be grasped. The first correction member 7 and the second correction member 8 are not particularly limited. For example, a glass substrate made of various glasses such as ordinary glass (float glass), a silicon substrate made of silicon, or the like can be used. The substrate used as the first correction member 7 may be the same as or different from the substrate used as the second correction member 8. Each of the thicknesses of the first correction member 7 and the second correction member 8 is not particularly limited, but is preferably, for example, 80 μm or more and 1,000 μm or less, and more preferably 80 μm or more and 120 μm or less. The thickness of the first correction member 7 and the thickness of the second correction member 8 may be the same or different. In addition, the shapes of the first correction member 7 and the second correction member 8 are each plate-shaped in the present embodiment, but are not limited thereto, and may be block-shaped, for example. The method of adding the first mark 72, the second mark 82, and the third mark 84 is not particularly limited, and examples thereof include a method using printing and a method using machining such as cutting. Each of the first mark 72, the second mark 82, and the third mark 84 has a coordinate, a scale, and the like, but is not limited thereto, and may be, for example, a character, a figure, a symbol, or the like. As shown in FIGS. 4 to 10, a first imaging unit 6A, a second imaging unit 6B, and a third imaging unit 6C are arranged in the inspection area A3, respectively. The first imaging unit 6A is supported and fixed above the inspection unit 16. The first imaging unit 6A has its imaging direction facing downward. Thereby, the first imaging unit 6A can capture a first image IM including the inspection unit 16 (electronic component placement unit) and the first correction member 7.₁ (See Figure 11). The second imaging unit 6B is supported and fixed between the inspection unit 16 and the device supply unit 14 stopped in the inspection area A3. The second imaging unit 6B is positioned below the second correction member 8. The second imaging section 6B has its imaging direction directed upward. This allows the second imaging unit 6B to capture the second image IM including the IC device 90 and the second correction member 8 held on the device transfer head 17A, while moving toward the positive side in the Y direction of the device transfer head 17A.₂ (Refer to Figure 12). The third imaging unit 6C is connected and fixed to the base portion 94 of the hand unit 9 of the device transfer head 17A via a connection portion 949. The third imaging unit 6C is located on the negative side in the Y direction with respect to the hand unit 9 in this embodiment, but it is not limited to this. The third imaging unit 6C has its imaging direction facing downward. Thereby, the third imaging unit 6C can capture the third image IM of the second correction member 8 while moving toward the Y-direction positive side of the device transfer head 17A.₃ (Refer to Figure 13). The third imaging unit 6C is above the inspection unit 16 and can capture a fourth image IM including the inspection unit 16 and the first correction member 7.₄ (Refer to Figure 14). In this way, the third imaging unit 6C can be moved together with the device transfer head 17A, so that the first correction member 7 and the second correction member 8 can be imaged at different positions. The imaging direction of the second imaging section 6B is directed upward, and the imaging direction of the third imaging section 6C is directed downward. That is, the imaging direction of the second imaging section 6B and the imaging direction of the third imaging section 6C are opposite to each other. Thereby, one second correction member 8 can be imaged from both the upper and lower sides. The first imaging unit 6A, the second imaging unit 6B, and the third imaging unit 6C are each preferably configured by various cameras such as a CCD (Charge Coupled Devices) camera or a three-dimensional camera. The images captured by the first imaging unit 6A, the second imaging unit 6B, and the third imaging unit 6C may be still pictures or animations. Next, with reference to FIGS. 4 to 14, the hand unit 9 (device transfer head 17A) in the inspection area A3 will be used to transfer the IC device 90 from the device supply unit 14A to the inspection unit 16 until the IC device 90 can be inspected. Action (one example). As shown in FIG. 4, the device transfer head 17A is in a state where the hand unit 9 is located directly above the recessed portion 141 of the device supply portion 14A, and the holding portion 98 of the hand unit 9 faces the recessed portion 141. An IC device 90 is housed in the recess 141. In the state shown in FIG. 4, the first imaging unit 6A is operated (first step). Thereby, the first image IM is obtained₁ (See Figure 11). The position of the inspection section 16 (electronic component placement section) relative to the first mark 72 is detected based on the imaging result of the first imaging section 6A. That is, from the first image IM₁ To detect the center O of the first mark 72 of the first correction member 7₇₂ , And the center O of the mounting portion-side terminal base (recessed portion of this embodiment) 161 of the inspection portion 16₁₆₁ . This detection is performed by the control unit 800. And, based on the scale 724 of the first mark 72, the operation center O₇₂ To the center O₁₆₁ Distance Y₁ . This calculation is also performed by the control unit 800. For example, if center O₇₂ Set to "0" and from the center O₇₂ There is a center O at the position of "17" on the positive side of the Y direction₁₆₁ , Distance Y₁ "17". Next, as shown in FIG. 5, the hand unit 9 is lowered until the holding portion 98 of the hand unit 9 comes into contact with the IC device 90 placed on the recessed portion 141 of the device supply portion 14A. Thereby, the IC device 90 can be held on the holding portion 98. Next, as shown in FIG. 6, the hand unit 9 is raised to the same height as the hand unit 9 in FIG. 4. Next, as shown in FIG. 7, the hand unit 9 is moved on the positive side in the Y direction, that is, on the inspection unit 16 side, and temporarily stopped in the middle. The stop position of the hand unit 9 is a position at which the IC device 90 and the second correction member 8 can be captured by the second imaging unit 6B together. In the state shown in FIG. 7, the second imaging unit 6B is operated (second step). Thereby, the second image IM is obtained₂ (Refer to Figure 12). The position of the IC device 90 (electronic component) of the detection device transfer head 17A with respect to the third mark 84 is based on the imaging result of the second imaging unit 6B. That is, from the second image IM₂ To detect the center O of the third mark 84 of the second correction member 8₈₄ Center with IC device 90₉₀ . This detection is performed by the control unit 800. In addition, based on the scale 844 of the third mark 84, the calculation center O₈₄ To the center O₉₀ Distance Y₃ . This calculation is also performed by the control unit 800. For example, if center O₈₄ Set to "0" and from the center O₈₄ There is a center O at the position of "15" on the positive side of the Y direction₉₀ , Distance Y₃ "15". Further, the third imaging unit 6C is operated while the hand unit 9 is stopped (the third step). Thereby, a third image IM is obtained₃ (Refer to Figure 13). In addition, based on the imaging result of the second imaging unit 6B and the imaging result of the third imaging unit 6C, the position and distance of the detection device transport head 17A with respect to the second mark 82. That is, from the third image IM₃ To detect the center O of the second mark 82 of the second correction member 8₈₂ Optical axis O with the third imaging section 6C_6C . In this embodiment, the position of the device transfer head 17A is converted to the optical axis O of the third imaging unit 6C._6C Its location. This detection is performed by the control unit 800. The calculation center O is based on the scale 824 of the second mark 82.₈₂ To optical axis O_6C Distance Y₂ . This calculation is also performed by the control unit 800. For example, if center O₈₂ Set to "0" and from the center O₈₂ There is an optical axis O at the position "1" on the positive side of the Y direction_6C , Distance Y₂ Is "1". Thereafter, the center O of the operation IC device 90₉₀ Optical axis O with the third imaging section 6C_6C Distance between Y₄ . This calculation is also performed by the control unit 800. In the above case, the distance Y₄ Becomes distance Y₃ "15"-distance Y₂ "1" = "14". Next, as shown in FIG. 8, the hand unit 9 is moved further on the positive side in the Y direction, that is, on the inspection section 16 side, and stopped immediately above the inspection section 16. In the state shown in FIG. 8, the third imaging unit 6C is operated (fourth step). Thereby, the fourth image IM is obtained₄ (Refer to Figure 14). From the 4th image IM₄ To detect the center O of the first mark 72 of the first correction member 7₇₂ Optical axis O with the third imaging section 6C_6C . This detection is performed by the control unit 800. And, based on the scale 724 of the first mark 72, the operation center O₇₂ To optical axis O_6C Distance Y₅ . This calculation is also performed by the control unit 800. For example, if center O₇₂ Set to "0" and from the center O₇₂ There is an optical axis O at the position "2" on the positive side of the Y direction_6C , Distance Y₅ Is "2". Thereafter, the calculation distance Y₁ Distance Y₄ And distance Y₅ Sum and difference △ Y. This difference ΔY is the correction amount (adjustment amount). In the above case, the difference △ Y is the distance Y₁ "17"-(distance Y₄ "14" + distance Y₅ "2") = "1". Next, as shown in FIG. 9, the hand unit 9 is moved to the positive side in the Y direction and further moved by the difference ΔY, and then stopped. Next, as shown in FIG. 10, the hand unit 9 is lowered. Thereby, each terminal 902 of the IC device 90 and each of the probe pins 162 of the inspection section 16 can be electrically conductively connected, whereby the IC device 90 can be inspected. In addition, in this embodiment, when the movement of the difference ΔY is omitted, the IC device 90 does not enter the mounting portion side terminal base (recessed portion of this embodiment) 161 of the inspection portion 16 or even enters. The terminals 902 of the IC device 90 are brought into contact with the probe pins 162 of the inspection unit 16. As a result, the IC device 90 cannot be inspected. In addition, the operation to be in a state before the IC device 90 can be inspected is to adjust the position in the Y direction of the IC device 90, but it is not limited to this. According to the IC device 90 held on the hand unit 9, there are also appropriate combinations such as adjusting the position of the X direction of the IC device 90, adjusting the posture of the IC device 90 about the Z axis, adjusting the position of the X direction, adjusting the position of the Y direction, and turning the Z The posture of the shaft is adjusted. As described above, when the IC device 90 is placed on the inspection section 16 in the electronic part inspection device 1 (electronic part transfer device 10) having the positioning device 30 built in, the hand unit 9 can be based on the first figure before the placement. Like IM₁ Second image IM₂ 3rd image IM₃ And 4th image IM₄ , At least one of the position and posture of the IC device 90 relative to the inspection section 16 is corrected. With this correction, the IC device 90 obtains an appropriate position and posture on the inspection section 16, and thus, after being placed on the inspection section 16, each terminal 902 and each probe pin 162 can be correctly and electrically connected. Thereby, the inspection of the IC device 90 can be performed correctly. Both the first correction member 7 and the second correction member 8 are constituted by plate members. Thereby, the installation space of the 1st correction member 7 and the 2nd correction member 8 can be easily ensured. In the image obtained by the shooting, each center (center O of the first mark 72) caused by the thickness (height) of each correction member can be suppressed as much as possible.₇₂ Etc.) detection error. In the IC processing machine, in order to calculate the relative deviation between the transport head and the test socket, it is necessary to mount the camera to each transport head with high accuracy. In addition, when the relative positional relationship between the transport head and the camera changes due to expansion and contraction due to heat, etc., the change cannot be detected and reflected in the calculation of the relative deviation. In addition, as for the alignment of the electronic parts and the test device, there are also considered methods of attaching marks to the holding part holding the electronic parts and the test device separately, and using the alignment of these marks with each other. However, in this case, it is preferable that the heights of the marks are consistent with each other when the marks are photographed by a camera, but it is actually difficult due to structural reasons such as assembly errors. In addition, since a camera is used for the shooting of marks, the accuracy of camera calibration (position correction) is also limited. In addition, a holding portion or the like that holds electronic components generates heat by driving. In addition, it is also considered that the position of the camera is deviated over time due to the heat (thermal expansion). In the case of testing (inspecting) a plurality of electronic parts together, although it is preferable to add a mark for each device to the holding part and the test device, there are also structural reasons such as limited space for additional marks in this regard. Its difficult. For each center (center O of the first mark 72)₇₂ For example, the first correction member 7 and the second correction member 8 are used for detection. Thereby, it is possible to prevent assembly errors, thermal expansion, and the like of the entire electronic component inspection apparatus 1 from affecting the detection of each center. In the electronic component transporting device 10, the first image IM₁ Second image IM₂ 3rd image IM₃ 4th image IM₄ Each pixel can be converted into the coordinate point of the corresponding mark (scale). In addition, before the IC device 90 can be inspected, the first imaging unit 6A is sequentially photographed, and then the second imaging unit 6B is photographed and the third imaging unit 6C is used for the second correction member 8 simultaneously. Then, the third imaging unit 6C photographs the first correction member. With this, it is relatively easy to compose the control program until the correction value, that is, the difference ΔY is obtained. In addition, if the control program needs to be re-examined, A can perform the re-examination operation relatively easily. The imaging of the second imaging section 6B and the imaging of the second correction section member 8 by the third imaging section 6C are preferably performed simultaneously. The elapsed time from one shot to another is preferably short. This is because the deviation between one captured image and the other captured image will disappear. The imaging of the first imaging unit 6A, the imaging of the second imaging unit 6B, and the imaging of the second correction member 8 by the third imaging unit 6C may be performed simultaneously. The order of the imaging of the first imaging unit 6A, the imaging of the second imaging unit 6B, and the imaging of the second correction member 8 by the third imaging unit 6C may be reversed. In addition, by this, it is possible to reduce a position recognition error of the IC device 90 with respect to the third imaging unit 6C due to an influence such as vibration. The third imaging unit 6C captures the first correction member 7 and the second correction member 8 at different positions. This prevents, for example, the first correction member 7 from being reflected in the third image IM.₃ , Or the second correction member 8 is reflected in the fourth image IM₄ , Which can quickly perform image processing. <Second Embodiment> Hereinafter, a second embodiment of the electronic component transfer device, the electronic component inspection device, the positioning device, and the positioning method according to the present invention will be described with reference to FIG. 15. The description is the same, and the description is omitted. This embodiment is basically the same as the first embodiment except that the support patterns of the first imaging unit, the second imaging unit, and the second correction member are different. As shown in FIG. 15, in the present embodiment, the first imaging unit 6A is supported by the support mechanism 26. The support mechanism 26 supports the first imaging unit 6A so as to be movable in the X direction and the Y direction. Thereby, the 1st imaging part 6A can be arrange | positioned above the target position (imaging subject part) of the inspection part 16, and an imaging subject part can be imaged. When the first imaging unit 6A is not shooting, the support mechanism 26 may cause the first imaging unit 6A to wait at the position shown in FIG. 15. This can prevent, for example, interference between the first imaging unit 6A and the device transfer head 17. The second imaging unit 6B and the second correction member 8 are supported by each device supply unit 14. This allows the second imaging unit 6B and the second correction member 8 to move in the X direction together with the device supply unit 14. In addition, in a case where the imaging is performed by the second imaging unit 6B or the imaging of the second imaging unit 6B by the third imaging unit 6C, the second imaging unit 6B and the second correction member 8 may enter together with the device supply unit 14 Check area A3. In addition, although the 1st imaging part 6A is arrange | positioned in this embodiment, it is not limited to this. In addition, in the present embodiment, two second imaging units 6B are arranged in each of the device supply units 14 in the Y direction, but it is not limited to this. In addition, in the present embodiment, two third image pickup units 6C are arranged in the X direction in each of the device transport heads 17, but are not limited thereto. The two first correction members 7 are arranged in the inspection section 16 in the X direction and the Y direction in the present embodiment, but the invention is not limited to this. In addition, in the present embodiment, two second correction members 8 are arranged in the Y direction in each of the device supply sections 14, but the invention is not limited to this. In addition, when the electronic component transporting device 10 captures an image with the second imaging unit 6B, it is preferable that a light sensor is provided so that the height of the IC device 90 and the second correction member 8 match. <Third Embodiment> Hereinafter, an embodiment of the component transfer device according to the present invention will be described with reference to FIGS. 16 to 20. However, the differences from the above embodiment will be mainly described, and the description of the same matters will be omitted. This embodiment is the same as the first embodiment described above, except that the device using the positioning device is different. As shown in FIG. 16, in the present embodiment, the part transfer device 40 of the present invention is a single-arm 6-axis robot that superimposes the first part and the second part to perform positioning. The parts transfer device 40 includes a positioning device 30. That is, the component transfer device 40 includes a transfer unit 41 that transfers the second component, and a first correction member 7 that is used when positioning one of the first component and the second component to the other component; The second correction member 8 is used together with the first correction member 7 when performing the above-mentioned positioning; and the first imaging unit 6A can capture a first image IM including the first correction member 7 and the first part.₁ (Image); The second imaging unit 6B can capture a second image IM including the second correction member 8 and the second component.₂ (Image); and a third imaging unit 6C, which is provided in the conveying unit 41 and can capture a fourth image IM of the first correction member 7₄ (Image), and the third image IM of the second correction member 8 can be captured₃ (image). In this embodiment, the first component is a circuit board 50 on which the IC device 90 is mounted (see FIG. 17). The second component is an IC device 90 (see FIGS. 18 to 20). Although the circuit board 50 has a plurality of terminals 51 on the front side, the front side is a flat surface that is smooth, ie, has no unevenness. According to the present invention as described above, when the IC device 90 and the circuit board 50 are overlapped in the same manner as the first embodiment described above, the conveyance unit 41 may be based on the first image IM before the overlap.₁ Second image IM₂ 3rd image IM₃ And 4th image IM₄ Correct at least one of the position and posture of the IC device 90 relative to the circuit board 50. With this correction, the IC device 90 obtains an appropriate position or posture overlapping the circuit board 50 (see FIG. 19). Thereby, after the IC device 90 is mounted on the circuit substrate 50, each terminal 902 and each terminal 51 of the circuit substrate 50 can be correctly and electrically connected (see FIG. 20). As shown in FIG. 16, the transfer unit 41 includes a base 411, a first arm 412, a second arm 413, a third arm 414, a fourth arm 415, a fifth arm 416, and a sixth arm 417. At the end of the sixth arm 417, an end effector 418 such as a suction hand is detachably mounted. The abutment 111 is provided on a ceiling, a wall, a workbench, a floor, or a floor. The first arm 412 is a base end portion about the first rotation axis O₄₁₂ It is rotatably connected to the base 411. The second arm 413 has a base end portion about the second rotation axis O₄₁₃ It is rotatably connected to a distal end portion of the first arm 412. The third arm 414 has its base end around the third rotation axis O₄₁₄ It is rotatably connected to a distal end portion of the second arm 413. The fourth arm 415 is a base end portion about the fourth rotation axis O₄₁₅ It is rotatably connected to a distal end portion of the third arm 414. The fifth arm 416 is the base end portion around the fifth rotation axis O₄₁₆ It is rotatably connected to a distal end portion of the fourth arm 415. The sixth arm 417 is a base end portion about the sixth rotation axis O₄₁₇ It is rotatably connected to a distal end portion of the fifth arm 416. As shown in FIG. 18, the third imaging section 6C is connected to the sixth arm 417 via the connection section 42. As shown in FIG. 17, the circuit board 50 is disposed adjacent to the left side of the first correction member 7 in the figure. The first imaging unit 6A can image the first correction member 7 and the circuit board 50 from above. As shown in FIG. 18, the second imaging unit 6B can image the second correction member 8 and the IC device 90 held on the end effector 418 from below. With the above configuration, as described above, the IC device 90 can be accurately mounted on the circuit board 50. In addition, in this embodiment, the positioning of one of the first part and the second part with respect to the other part is the positioning of the second component, that is, the IC device 90 with the circuit board 50 as the first part, but it is not limited to this. this. For example, the circuit board 50 as the first component may be positioned on the IC device 90 as the second component. Moreover, in this embodiment, the part transfer device 40 is a single-arm 6-axis robot, but it is not limited to this, and it may be a dual-arm 6-axis robot, a robot having three or more arms, a horizontal articulated robot, and the like. The electronic component transfer device, electronic component inspection device, positioning device, component transfer device, and positioning method of the present invention have been described with reference to the illustrated embodiments, but the present invention is not limited thereto. Each part constituting the electronic component transfer device, the electronic component inspection device, the positioning device, and the component transfer device can be replaced with an arbitrary component capable of performing the same function. Moreover, you may add arbitrary structures. The electronic component transfer device, the electronic component inspection device, the positioning device, the component transfer device, and the positioning method of the present invention may be a combination (attribute) of any two or more of the above embodiments. In addition, as the electronic component mounting portion for positioning with the electronic component, the inspection portion is described in the first embodiment, but it is not limited to this, and may be, for example, a temperature adjustment portion, a device supply portion, a device recovery portion, Tray, recycling tray.

1‧‧‧Electronic parts inspection device

6A‧‧‧The first camera section

6B‧‧‧Second camera section

6C‧‧‧Third camera section

7‧‧‧The first calibration member

8‧‧‧The second correction member

9‧‧‧hand unit

10‧‧‧Electronic parts transfer device

11A‧‧‧Tray transfer mechanism

11B‧‧‧Tray transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧ device transfer head

14‧‧‧Device Supply Department

14A‧‧‧Device Supply Department

14B‧‧‧Device Supply Department

15‧‧‧pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ device transfer head

17A‧‧‧device transfer head

17B‧‧‧ Device Transfer Head

18‧‧‧Device Recycling Department

18A‧‧‧Device Recycling Department

18B‧‧‧Device Recycling Department

19‧‧‧Recycling tray

20‧‧‧ device transfer head

21‧‧‧Tray transfer mechanism

22A‧‧‧Tray transfer mechanism

22B‧‧‧Tray transfer mechanism

25‧‧‧Transportation Department

26‧‧‧ Supporting Agency

30‧‧‧ Positioning device

40‧‧‧Part transfer device

41‧‧‧Transportation Department

42‧‧‧Connection Department

50‧‧‧circuit board

51‧‧‧terminal

71‧‧‧Front side (one side)

72‧‧‧The first mark

81‧‧‧front side (one side)

82‧‧‧No. 2

83‧‧‧ dorsal side (the other side)

84‧‧‧3rd mark

90‧‧‧IC device

91‧‧‧ Adjustment Department

92‧‧‧Position adjustment mechanism

93‧‧‧ Posture adjustment mechanism

94‧‧‧ base

95‧‧‧ the first mobile unit

96‧‧‧The second mobile unit

97‧‧‧Rotating part (rotating part)

98‧‧‧holding department

99‧‧‧ axis

141‧‧‧Concave (groove)

161‧‧‧Mounting part side terminal base (recess, recess)

162‧‧‧probe pin (mounting-side terminal)

200‧‧‧tray

231‧‧‧The first partition

232‧‧‧Second partition

233‧‧‧3rd partition

234‧‧‧ 4th partition

235‧‧‧5th partition

241‧‧‧Front cover

242‧‧‧side cover

243‧‧‧side cover

244‧‧‧back cover

245‧‧‧Top cover

300‧‧‧ monitor

301‧‧‧display

400‧‧‧ signal light

411‧‧‧ abutment

412‧‧‧1st arm

413‧‧‧ 2nd arm

414‧‧‧3rd arm

415‧‧‧4th arm

416‧‧‧5th arm

417‧‧‧6th arm

418‧‧‧End effector

500‧‧‧Speaker

600‧‧‧Mouse Station

700‧‧‧ operation panel

721‧‧‧ 1st coordinate axis

722‧‧‧ 2nd coordinate axis

723‧‧‧scale

724‧‧‧scale

800‧‧‧ Control Department

821‧‧‧ 1st coordinate axis

822‧‧‧ 2nd coordinate axis

823‧‧‧scale

824‧‧‧scale

841‧‧‧ 1st coordinate axis

842‧‧‧ 2nd coordinate axis

843‧‧‧ scale

844‧‧‧scale

902‧‧‧Terminal (electronic component side terminal)

911‧‧‧The first piezoelectric actuator

911a‧‧‧ convex

912‧‧‧Second Piezo Actuator

913‧‧‧Third piezoelectric actuator (piezo actuator for rotating part)

913a‧‧‧ convex

941‧‧‧ Plate

942‧‧‧Locking Department

943‧‧‧Locking Department

947‧‧‧Abutting Department

947a‧‧‧lower surface

948‧‧‧ imitation agency (soft agency)

949‧‧‧Connection Department

951‧‧‧Base

952‧‧‧rail

953‧‧‧rail

954‧‧‧The first fixed part

956‧‧‧Locking part (Guiding part)

961‧‧‧base

961a‧‧‧

963‧‧‧rail

971‧‧‧ Support Department

981‧‧‧ adsorption surface

982‧‧‧ adsorption hole

983‧‧‧pressure reducing pump

A1‧‧‧Tray supply area

A2‧‧‧Device supply area

A3‧‧‧ Inspection area

A4‧‧‧device recycling area

A5‧‧‧Tray removal area

The first image IM ₁ ‧‧‧

IM ₂ ‧‧‧ 2nd image

IM ₃ ‧‧‧3rd image

IM ₄ ‧‧‧Image 4

O _6C ‧‧‧ Optical axis

O ₁₆₁ ‧‧‧ Centre

O ₄₁₂ ‧‧‧1st rotation axis

O ₄₁₃ ‧‧‧ 2nd rotating shaft

O ₄₁₄ ‧‧‧3rd rotating shaft

O ₄₁₅ ‧‧‧4th rotation axis

O ₄₁₆ ‧‧‧5th rotation axis

O ₄₁₇ ‧‧‧6th rotation axis

O ₇₂ ‧‧‧ Centre

O ₈₂ ‧‧‧ Center

O ₈₄ ‧‧‧ Center

O ₉₀ ‧‧‧ Centre

Y ₁ ‧‧‧ distance

Y ₂ ‧‧‧distance

Y ₃ ‧‧‧distance

Y ₄ ‧‧‧ distance

Y ₅ ‧‧‧distance

△ Y‧‧‧Poor

α _11A ‧‧‧ Arrow

α _11B ‧‧‧ Arrow

α _13X ‧‧‧ Arrow

α _13Y ‧‧‧ Arrow

α ₁₄ ‧‧‧arrow

α ₁₅ ‧‧‧arrow

α _17Y ‧‧‧ Arrow

α ₁₈ ‧‧‧ arrow

α _20X ‧‧‧ Arrow

α _20Y ‧‧‧ Arrow

α ₂₁ ‧‧‧ Arrow

α _22A ‧‧‧ Arrow

α _22B ‧‧‧ Arrow

α ₉₀ ‧‧‧ arrow

FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection device according to the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a partial cross-sectional side view of a device transfer head disposed in an inspection area of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 4 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in order. FIG. 5 is a partial cross-sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1. FIG. 6 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 7 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 8 is a partial cross-sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1. FIG. 9 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 10 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in order. FIG. 11 is an example of an image captured in an inspection area of the electronic component inspection apparatus shown in FIG. 1. FIG. 12 is an example of an image captured in an inspection area of the electronic component inspection apparatus shown in FIG. 1. FIG. 13 is an example of an image captured in an inspection area of the electronic component inspection apparatus shown in FIG. 1. FIG. 14 is an example of an image captured in an inspection area of the electronic component inspection apparatus shown in FIG. 1. Fig. 15 is a schematic plan view showing an inspection area of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 16 is a schematic perspective view of an embodiment of the component transfer device of the present invention, as viewed from the back side. FIG. 17 is a partial cross-sectional side view showing the operation of the part transfer device shown in FIG. 16 in sequence. FIG. 18 is a partial cross-sectional side view showing the operation of the part transfer device shown in FIG. 16 in sequence. FIG. 19 is a partial cross-sectional side view showing the operation of the part transfer device shown in FIG. 16 in sequence. FIG. 20 is a partial cross-sectional side view showing the operation of the part transfer device shown in FIG. 16 in sequence.

Claims (17)

An electronic component transfer device, comprising: an area where an electronic component placement portion on which electronic components are placed is arranged; a device transfer head that transfers the electronic component to the electronic component placement portion within the area; a first correction A member for use in positioning the electronic component on the electronic component mounting portion by the electronic component, and having a first reference point serving as a reference for the positioning; and a second correction member for performing the positioning with the first correction. It is used together with a component and has a second reference point serving as a reference for the positioning; a first imaging unit that captures an image of the first reference point including the first correction member and the electronic component mounting portion; the second An imaging unit that captures images of the second reference point and the electronic component including the second calibration member; a third imaging unit that is provided on the device transfer head and captures the first calibration member including the first calibration member 1 reference point image, and captures an image of the second reference point including the second correction member; and a control unit based on the first reference point The position of the third imaging unit relative to the first reference point is calculated from the on-point image, and the position of the third imaging unit relative to the second reference point is calculated based on the image including the second reference point. . For example, the electronic component transfer device according to claim 1, wherein the position where the third imaging unit photographs the first correction member is different from the position where the second correction member is photographed. For example, the electronic component transfer device according to claim 1, wherein the first correction member is plate-shaped and has a first mark attached to one side; the second correction member is plate-shaped and has a second mark attached to one side And a third mark attached to the other side; the first mark includes the first reference point; the second mark and the third mark include the second reference point. For example, the electronic component transfer device of claim 3, wherein the third mark includes a third reference point that overlaps with the second reference point in a plan view. For example, the electronic component transfer device of claim 3, wherein the first mark, the second mark, and the third mark have a coordinate axis. For example, the electronic component transfer device of claim 3, wherein the first mark, the second mark, and the third mark have a scale. For example, the electronic component transporting device of claim 3, wherein the imaging direction of the second imaging unit and the imaging direction of the third imaging unit are opposite directions to each other. For example, the electronic component transporting device according to claim 3, wherein the position of the electronic component mounting portion relative to the first mark is detected based on a photographing result of the first imaging portion. For example, the electronic component transfer device of claim 3, wherein at least one of a position or a distance of the electronic component of the device transfer head with respect to the third mark is detected based on a photographing result of the second imaging unit. For example, the electronic component transfer device of claim 3, wherein the position or distance of the electronic component of the device transfer head with respect to the second mark is detected based on the photographing result of the second imaging unit and the photographing result of the third imaging unit. At least one of them. The electronic component transfer device according to claim 3, wherein the second correction member is transparent. For example, if the electronic component conveying device of item 1 is requested, the imaging of the first imaging unit is sequentially performed, and then the imaging of the second imaging unit and the imaging of the second correction member by the third imaging unit are performed simultaneously, and then The third imaging unit photographs the first correction member. For example, the electronic component transfer device of claim 1, wherein the device transfer head includes: a base portion; a holding portion that holds the electronic component; and an adjustment portion that can adjust the position of the electronic component held in the holding portion relative to the base portion. Or at least one of the gestures. An electronic component inspection device, comprising: an electronic component mounting section for mounting electronic components; a device transfer head for transferring the electronic components to the electronic component mounting section; and a first calibration member for performing The electronic component is used when positioning the electronic component mounting portion, and has a first reference point serving as a reference for the positioning. A second correction member is used together with the first correction member when performing the positioning, and has A second reference point serving as a reference for the positioning; a first imaging section that captures an image including the first reference point of the first correction member and the electronic component placement section; a second imaging section that includes an image including An image of the second reference point of the second correction member and the electronic component; a third imaging unit provided on the device transfer head, and capturing an image of the first reference point including the first correction member And capture an image including the second reference point of the second correction member; and a control unit that calculates based on the image including the first reference point A position of the third imaging unit relative to the first reference point, and a position of the third imaging unit relative to the second reference point based on the image including the second reference point; and the electronic component placement The department inspects the electronic parts described above. A positioning device for positioning a first component and a second component by superimposing them, comprising: a first correction member for performing one of the first component and one of the second component; It is used for positioning another part and has a first reference point that serves as a reference for the above-mentioned positioning; a second correction member that is used together with the first correction member when performing the above-mentioned positioning and has a reference that serves as a reference for the above-mentioned positioning A second reference point; a first imaging unit that captures an image of the first reference point and the first part including the first correction member; a second imaging unit that captures the above image that includes the second correction member An image of the second reference point and the second component; and a third imaging unit that captures an image of the first reference point including the first correction member, and captures the second image of the second correction member An image of a reference point; and a control unit that calculates a position of the third imaging unit relative to the first reference point based on the image including the first reference point, and based on the above including the second reference point Calculated as the first imaging section 3 with respect to the position of the second point of reference. A component conveying device is a person who positions a first component and a second component to perform positioning, and is characterized by comprising: a conveying unit that conveys the second component; and a first correction member that performs the first component. It is used for the positioning of one of the second part and the other part, and has a first reference point serving as a reference for the positioning; a second correction member, which is used for the first correction when performing the positioning. The components are used together and have a second reference point serving as a reference for the positioning; a first imaging unit that captures an image of the first reference point and the first part including the first correction member; a second imaging unit, It captures images of the second reference point and the second part including the second calibration member; and a third imaging unit, which is provided in the transport unit, captures the first reference including the first calibration member. Point image, and capture an image of the second reference point including the second correction member; and a control unit that calculates the third imaging unit relative to the top based on the image including the first reference point. The first position of the reference point, and based on the second image including the calculated reference point of the first imaging section 3 with respect to the position of the second point of reference. A positioning method is used for positioning a first part and a second part by overlapping, and is characterized in that it is used for positioning the first part and the other part of the second part. The first correction member having the first reference point serving as the reference for the positioning and the second correction member having the second reference point serving as the reference for the positioning, and has the following steps: Use the first imaging unit from the first The first image of the first reference point and the first component including the first correction member is taken in a direction; and the second image of the member including the second correction member is taken from a second direction different from the first direction using the second imaging unit. A second image of the second reference point and the second part; a third image of the second reference point including the second correction member is taken from the first direction using a third imaging unit; based on the above The third image is used to calculate the position of the third imaging unit relative to the second reference point; using the third imaging unit, a fourth image of the first reference point including the first correction member is captured from the first direction using the third imaging unit Like; and based on the above 4 the first image is calculated with respect to the imaging unit 3 to the first point of reference.