TWI642134B - Electronic component conveying device and electronic component inspection device - Google Patents

Electronic component conveying device and electronic component inspection device Download PDF

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Publication number
TWI642134B
TWI642134B TW107112548A TW107112548A TWI642134B TW I642134 B TWI642134 B TW I642134B TW 107112548 A TW107112548 A TW 107112548A TW 107112548 A TW107112548 A TW 107112548A TW I642134 B TWI642134 B TW I642134B
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electronic component
image
inspection
unit
test piece
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TW107112548A
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Chinese (zh)
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TW201839894A (en
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山崎孝
小谷憲昭
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日商精工愛普生股份有限公司
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Abstract

本發明之課題在於提供一種可以簡單之構成將電子零件正確地載置於電子零件載置部的電子零件搬送裝置及電子零件檢查裝置。 本發明之電子零件搬送裝置特徵在於:可配置供載置電子零件,且具有可於上述電子零件或試驗片形成抵接痕之抵接痕形成部的電子零件載置部,且具備:固持部,其固持並搬送上述電子零件或上述試驗片,且可將上述電子零件或上述試驗片按壓至抵接痕形成部;及攝像部,其可拍攝固持於上述固持部之上述電子零件或上述試驗片;上述攝像部拍攝上述固持部固持上述試驗片並使其抵接於上述抵接痕形成部後之上述試驗片之第1圖像、與拍攝上述第1圖像後拍攝固持於上述固持部之上述電子零件之第2圖像,上述固持部可基於上述第1圖像與上述第2圖像,調整上述電子零件相對於上述電子零件載置部之位置及姿勢之至少一者。An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can accurately mount an electronic component on an electronic component mounting portion. An electronic component transporting apparatus according to the present invention is characterized in that an electronic component mounting portion that can mount an electronic component and that can form an abutting mark forming portion of the electronic component or the test piece, and a holding portion is provided And holding the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component held by the holding portion or the test The image capturing unit captures a first image of the test piece after the holding portion holds the test piece and abuts against the contact mark forming portion, and captures and holds the first image, and holds the same image and holds the holding portion. In the second image of the electronic component, the holding unit may adjust at least one of a position and a posture of the electronic component with respect to the electronic component mounting portion based on the first image and the second image.

Description

電子零件搬送裝置及電子零件檢查裝置Electronic component conveying device and electronic component inspection device

本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。The present invention relates to an electronic component conveying device and an electronic component inspection device.

先前以來,已知有一種例如進行如IC器件等電子零件(零件)之電氣試驗之零件試驗裝置(例如參照專利文獻1)。於該專利文獻1記載之零件試驗裝置中,構成為於對電子零件進行試驗時,將IC器件搬送至插座,並載置於插座,而進行該試驗。又,於專利文獻1記載之零件試驗裝置中,於將IC器件搬送至插座之期間,以複數個相機(例如零件辨識相機、插座辨識相機等)拍攝IC器件之圖像。接著,可藉由基於該圖像適當地調整(修正)IC器件之位置而將IC器件正確地搬送至插座。 [先前技術文獻] [專利文獻] [專利文獻1]國際公開第2003/023430For example, a component testing device for performing an electrical test of an electronic component (part) such as an IC device has been known (for example, see Patent Document 1). In the component testing device described in Patent Document 1, when the electronic component is tested, the IC device is transported to the socket and placed on the socket to perform the test. Further, in the component testing device described in Patent Document 1, an image of the IC device is captured by a plurality of cameras (for example, a part identification camera, a socket identification camera, etc.) while the IC device is being transported to the socket. Then, the IC device can be correctly transferred to the socket by appropriately adjusting (correcting) the position of the IC device based on the image. [Prior Art Document] [Patent Document] [Patent Document 1] International Publication No. 2003/023430

[發明所欲解決之問題] 然而,於專利文獻1記載之零件試驗裝置中,使用複數個相機,而相應地有裝置之構成或控制複雜之問題。又,於使用複數個相機之情形時,必須進行相機彼此之校準(位置修正)。 [解決問題之技術手段] 本發明係為了解決上述課題之至少一部分而完成者,且可作為以下者而實現。 本發明之電子零件搬送裝置特徵在於:其可配置供載置電子零件,且具有可於上述電子零件或試驗片形成抵接痕之抵接痕形成部的電子零件載置部,且具備: 固持部,其固持並搬送上述電子零件或上述試驗片,且可將上述電子零件或上述試驗片按壓至抵接痕形成部;及 攝像部,其可拍攝由上述固持部固持之上述電子零件或上述試驗片;且 上述攝像部拍攝上述固持部固持上述試驗片並使其抵接於上述抵接痕形成部後之上述試驗片之第1圖像、與拍攝上述第1圖像後拍攝固持於上述固持部之上述電子零件之第2圖像, 上述固持部可基於上述第1圖像與上述第2圖像,調整上述電子零件相對於上述電子零件載置部之位置及姿勢之至少一者。 藉此,於將電子零件載置於電子零件載置部時,於該載置之前,固持部可基於由攝像部拍攝之第1圖像與第2圖像調整電子零件相對於電子零件載置部之位置及姿勢之任一者。藉由該調整,電子零件成適於載置於電子零件載置部之位置或姿勢,因此,正確地載置於電子零件載置部。又,於將電子零件載置至電子零件載置部之期間,可使用一個攝像部取得調整電子零件之位置或姿勢所需之圖像(第1圖像及第2圖像)。如此,可以使用一個攝像部之簡單構成進行上述各種調整。又,亦可省略如先前般使用2個攝像部時之攝像部彼此之校準(位置修正)。 又,於本發明之電子零件搬送裝置中,較佳為上述電子零件載置部具有可與上述電子零件導電地連接之複數個載置部側端子,且 上述抵接痕形成部由上述複數個載置部側端子中之至少一個載置部側端子構成。 藉此,可省略除載置部側端子外另行設置抵接痕形成部,因此,可將電子零件載置部之構成設為簡單者。 又,於本發明之電子零件搬送裝置中,較佳為上述電子零件載置部具有可與上述電子零件導電地連接之複數個載置部側端子,且 上述抵接痕形成部由與上述載置部側端子不同之部分構成。 藉此,例如可將抵接痕形成部設為較載置部側端子更容易形成抵接痕者。 又,於本發明之電子零件搬送裝置中,較佳為於上述第1圖像包含有上述抵接痕之圖像,於上述第2圖像包含有上述電子零件之端子之圖像。 藉此,例如可將第1圖像與第2圖像於共通之座標軸上合成而獲得合成圖像。且,可將該合成圖像用於調整電子零件相對於電子零件載置部之位置或姿勢。 又,於本發明之電子零件搬送裝置中,較佳為上述電子零件載置部具有複數個載置部側端子,且將上述複數個載置部側端子中之至少一個載置部側端子設為成上述抵接痕形成部之載置部側基準端子, 上述電子零件具有可與上述載置部側基準端子導電地連接之電子零件側基準端子, 上述固持部以使上述第2圖像中之上述電子零件側基準端子之位置與上述第1圖像中之上述載置部側基準端子形成之上述抵接痕之位置合致之方式調整上述電子零件之位置或姿勢之至少一者。 藉此,可迅速且正確地進行電子零件之位置或姿勢之調整,因此,亦可正確地進行隨後之電子零件向電子零件載置部之載置。 又,於本發明之電子零件搬送裝置中,較佳為上述固持部具有:位置調整機構,其調整上述電子零件之位置;及姿勢調整機構,其調整上述電子零件之姿勢。 藉此,於將電子零件載置於電子零件載置部時,可根據需要適當地調整電子零件之位置與姿勢兩者,因此,可正確地進行該載置。 又,於本發明之電子零件搬送裝置中,較佳為上述位置調整機構為使上述電子零件於與鉛直方向正交之方向移動者。 藉此,可將電子零件於與鉛直方向正交之方向微調整即修正,因此,可正確地進行電子零件向電子零件載置部之載置。 又,於本發明之電子零件搬送裝置中,較佳為上述姿勢調整機構為使上述電子零件繞鉛直軸旋動者。 藉此,可獨立地微調整即修正電子零件之姿勢,即繞鉛直軸之方向,因此,可正確地進行電子零件向電子零件載置部之載置。 又,於本發明之電子零件搬送裝置中,較佳為上述試驗片具有可藉由賦予力而變色或變形之構件。 藉此,以變色或變形之部分為抵接痕,結果,可迅速地形成抵接痕。 本發明之電子零件檢查裝置之特徵在於具備:電子零件載置部,其供載置電子零件,且具有可於上述電子零件或試驗片形成抵接痕之抵接痕形成部; 固持部,其固持並搬送上述電子零件或上述試驗片,且可將上述電子零件或上述試驗片按壓至抵接痕形成部;及 攝像部,其可拍攝由上述固持部固持之上述電子零件或上述試驗片;且 上述電子零件載置部為可載置並檢查上述電子零件之檢查部, 上述攝像部拍攝上述固持部固持上述試驗片並使其抵接於上述抵接痕形成部後之上述試驗片之第1圖像、與拍攝上述第1圖像後拍攝固持於上述固持部之上述電子零件之第2圖像, 上述固持部可基於上述第1圖像與上述第2圖像,調整上述電子零件相對於上述電子零件載置部之位置及姿勢之至少一者。 藉此,於將電子零件載置於電子零件載置部時,於該載置之前,固持部可基於由攝像部拍攝之第1圖像與第2圖像調整電子零件相對於電子零件載置部之位置及姿勢之任一者。藉由該調整,電子零件成適於載置於電子零件載置部之位置或姿勢,因此,正確地載置於電子零件載置部,即,可導電地連接。又,於將電子零件載置至電子零件載置部之期間,可使用一個攝像部取得調整電子零件之位置或姿勢所需之圖像(第1圖像及第2圖像)。如此,可以使用一個攝像部之簡單構成進行上述各種調整。 又,可將電子零件搬送至作為檢查部之電子零件載置部,因此,可於檢查部中對該電子零件進行檢查。又,可自檢查部搬送檢查後之電子零件。[Problems to be Solved by the Invention] However, in the component testing device described in Patent Document 1, a plurality of cameras are used, and accordingly, the configuration or control of the device is complicated. Also, in the case of using a plurality of cameras, it is necessary to perform calibration (position correction) of the cameras with each other. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the above problems, and can be realized as follows. An electronic component transporting apparatus according to the present invention is characterized in that it can be disposed to mount an electronic component, and has an electronic component mounting portion that can form an abutting mark forming portion of the contact portion of the electronic component or the test piece, and has: And holding the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component held by the holding portion or the And the imaging unit captures the first image of the test piece after the holding portion is held by the holding portion and is in contact with the contact mark forming portion, and the image is captured and held by the first image. In the second image of the electronic component of the holding portion, the holding portion adjusts at least one of a position and a posture of the electronic component with respect to the electronic component mounting portion based on the first image and the second image. Therefore, when the electronic component is placed on the electronic component mounting portion, the holding portion can adjust the electronic component to be placed on the electronic component based on the first image and the second image captured by the imaging unit before the mounting. Any of the positions and postures of the department. With this adjustment, the electronic component is placed at a position or posture that is placed on the electronic component mounting portion, and thus is accurately placed on the electronic component mounting portion. Further, while the electronic component is placed on the electronic component mounting portion, an image (a first image and a second image) necessary for adjusting the position or posture of the electronic component can be obtained by using one imaging unit. In this way, the various adjustments described above can be performed using a simple configuration of one imaging unit. Further, the alignment (position correction) of the imaging units when the two imaging units are used as before may be omitted. Further, in the electronic component transporting device of the present invention, preferably, the electronic component mounting portion has a plurality of mounting portion side terminals that are electrically connectable to the electronic component, and the abutting mark forming portion is formed by the plurality of At least one of the placement unit side terminals is configured as a terminal. Thereby, the contact mark forming portion can be omitted except for the terminal on the mounting portion side. Therefore, the configuration of the electronic component mounting portion can be simplified. Further, in the electronic component carrying device of the present invention, it is preferable that the electronic component mounting portion has a plurality of mounting portion side terminals that are electrically connectable to the electronic component, and the contact mark forming portion is configured to be The terminal side terminal is formed in a different part. Thereby, for example, the contact mark forming portion can be formed to be more likely to form an abutting mark than the mounting portion side terminal. Further, in the electronic component transport apparatus of the present invention, preferably, the first image includes an image of the contact mark, and the second image includes an image of a terminal of the electronic component. Thereby, for example, the first image and the second image can be combined on a common coordinate axis to obtain a composite image. Moreover, the composite image can be used to adjust the position or posture of the electronic component relative to the electronic component mounting portion. Further, in the electronic component carrying device of the present invention, it is preferable that the electronic component mounting portion has a plurality of mounting portion side terminals, and at least one of the plurality of mounting portion side terminals is provided. The electronic component includes an electronic component side reference terminal that is electrically connectable to the mounting portion side reference terminal, and the holding portion is configured to be in the second image, in order to form the mounting portion side reference terminal of the contact mark forming portion At least one of the position and the posture of the electronic component is adjusted such that the position of the electronic component side reference terminal coincides with the position of the contact mark formed by the mounting portion side reference terminal in the first image. Thereby, the position or posture of the electronic component can be adjusted quickly and accurately, and therefore, the subsequent placement of the electronic component on the electronic component mounting portion can be performed accurately. Further, in the electronic component conveying apparatus of the present invention, preferably, the holding portion includes a position adjusting mechanism that adjusts a position of the electronic component, and a posture adjusting mechanism that adjusts a posture of the electronic component. Thereby, when the electronic component is placed on the electronic component mounting portion, both the position and the posture of the electronic component can be appropriately adjusted as needed, and thus the mounting can be performed accurately. Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the position adjusting mechanism moves the electronic component in a direction orthogonal to a vertical direction. Thereby, the electronic component can be finely adjusted and corrected in the direction orthogonal to the vertical direction, so that the electronic component can be accurately placed on the electronic component mounting portion. Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the posture adjusting mechanism rotates the electronic component around a vertical axis. Thereby, the posture of the electronic component, that is, the direction around the vertical axis can be independently adjusted, that is, the placement of the electronic component on the electronic component mounting portion can be performed accurately. Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the test piece has a member that can be discolored or deformed by imparting a force. Thereby, the portion which is discolored or deformed is the abutting mark, and as a result, the abutting mark can be formed quickly. An electronic component inspection device according to the present invention includes an electronic component mounting portion that mounts an electronic component and has an abutting mark forming portion that can form an abutting mark on the electronic component or the test piece, and a holding portion. Holding and transporting the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component or the test piece held by the holding portion; The electronic component mounting portion is an inspection portion that can mount and inspect the electronic component, and the imaging portion captures the first test piece after the holding portion holds the test piece and abuts against the contact mark forming portion. 1 image, and capturing a second image of the electronic component held by the holding portion after the first image is captured, wherein the holding portion adjusts the electronic component based on the first image and the second image At least one of a position and a posture of the electronic component mounting portion. Therefore, when the electronic component is placed on the electronic component mounting portion, the holding portion can adjust the electronic component to be placed on the electronic component based on the first image and the second image captured by the imaging unit before the mounting. Any of the positions and postures of the department. With this adjustment, the electronic component is adapted to be placed at the position or posture of the electronic component mounting portion, and thus is accurately placed on the electronic component mounting portion, that is, electrically connected. Further, while the electronic component is placed on the electronic component mounting portion, an image (a first image and a second image) necessary for adjusting the position or posture of the electronic component can be obtained by using one imaging unit. In this way, the various adjustments described above can be performed using a simple configuration of one imaging unit. Further, since the electronic component can be transported to the electronic component mounting portion as the inspection portion, the electronic component can be inspected in the inspection portion. Moreover, the electronic parts after inspection can be transported from the inspection unit.

以下,基於附加圖式所示之較佳之實施形態詳細地說明本發明之電子零件搬送裝置及電子零件檢查裝置。 <第1實施形態> 以下,參照圖1~圖15,對本發明之電子零件搬送裝置及電子零件檢查裝置之第1實施形態進行說明。另,於以下,為了說明之方便起見,如圖1所示,將相互正交之3軸設為X軸、Y軸及Z軸。又,包含X軸與Y軸之XY平面為水平,Z軸為鉛直。又,將平行於X軸之方向稱為「X方向(第1方向)」,將平行於Y軸之方向稱為「Y方向(第2方向)」,將平行於Z軸之方向稱為「Z方向(第3方向)」。又,將各方向之箭頭所向之方向稱為「正」,將其相反方向稱為「負」。又,本案說明書中所提之「水平」不限定於完全之水平,只要不阻礙電子零件之搬送,亦包含相對於水平略微(例如未達5°左右)傾斜之狀態。又,有時將圖1及圖3~圖14中(關於圖16~圖29亦同樣)之上側,即Z軸方向正側稱為「上」或「上方」,將下側即Z軸方向負側稱為「下」或「下方」。 本發明之電子零件搬送裝置10為具有圖1所示之外觀者。本發明之電子零件搬送裝置10為處理器,為可配置供載置電子零件,且具有能於電子零件或試驗片8形成抵接痕821之基準探針引腳162a(抵接痕形成部)之檢查部16(電子零件載置部)的裝置。電子零件搬送裝置10具備:手單元9(固持部),其固持並搬送電子零件或試驗片8,且可將電子零件或試驗片8按壓至基準探針引腳162a(抵接痕形成部);及攝像部26,其可拍攝由手單元9(固持部)固持之電子零件或試驗片8。攝像部26拍攝由手單元9(固持部)固持試驗片8並使其抵接於基準探針引腳162a(抵接痕形成部)後之試驗片8之第1圖像IM 1、與拍攝第1圖像IM 1後固持於手單元9(固持部)之電子零件之第2圖像IM 2。接著,手單元9(固持部)可基於第1圖像IM 1與第2圖像IM 2調整電子零件相對於檢查部16(電子零件載置部)之位置及姿勢之至少一者。 藉此,如後述般,於將電子零件載置於檢查部16時,於該載置之前,手單元9(固持部)可基於由攝像部26拍攝之第1圖像IM 1與第2圖像IM 2調整電子零件相對於檢查部16之位置及姿勢之任一者。藉由該調整,電子零件成適於載置於檢查部16之位置或姿勢,因此,於向檢查部16載置後,可與檢查部16導電地正確地連接。又,於將電子零件載置至檢查部16之期間,可使用一個攝像部26取得調整電子零件之位置或姿勢所需之圖像(第1圖像IM 1及第2圖像IM 2)。如此,可以使用一個攝像部26之簡單構成進行上述各種調整。 又,如圖2所示,本發明之電子零件檢查裝置1具有電子零件搬送裝置10,進而具有檢查電子零件之檢查部16。即,本發明之電子零件檢查裝置1具備:電子零件載置部,其供載置電子零件,且具有可於電子零件或試驗片8形成抵接痕821之基準探針引腳162a(抵接痕形成部);手單元9(固持部),其固持並搬送電子零件或試驗片8,且可將電子零件或試驗片8按壓至基準探針引腳162a(抵接痕形成部);及攝像部26,其可拍攝藉由手單元9(固持部)固持之電子零件或試驗片8。電子零件載置部為可載置並檢查電子零件之檢查部16。攝像部26拍攝由手單元9(固持部)固持試驗片8並使其抵接於基準探針引腳162a(抵接痕形成部)後之試驗片8之第1圖像IM 1、與拍攝第1圖像IM 1後固持於手單元9(固持部)之電子零件之第2圖像IM 2。接著,手單元9(固持部)可基於第1圖像IM 1與第2圖像IM 2調整電子零件相對於檢查部16(電子零件載置部)之位置及姿勢之至少一者。 藉此,可獲得具有上述之電子零件搬送裝置10之優點之電子零件檢查裝置1。又,可將電子零件搬送至檢查部16,因此,可於檢查部16中對該電子零件進行檢查。又,可自檢查部16搬送檢查後之電子零件。 以下,對各部之構成詳細地進行說明。 如圖1、圖2所示,具有電子零件搬送裝置10之電子零件檢查裝置1為搬送例如BGA(Ball Grid Array:球狀柵格陣列)封裝即IC器件等電子零件,且於其搬送過程中檢查/試驗(以下簡稱為「檢查」)電子零件之電氣特定的裝置。另,於以下,為了說明之方便起見,對使用IC器件作為上述電子零件之情形代表性地進行說明,並將其設為「IC器件90」。IC器件90於本實施形態中為呈平板狀者。又,IC器件90於其下表面具有俯視時矩陣狀配置之複數個端子(電子零件側端子)902。各端子902呈半球狀。 另,作為IC器件,除了以上所述者以外,還列舉例如「LSI(Large Scale Integration:大型積體電路)」、「CMOS(Complementary MOS:互補金屬氧化物半導體)」、「CCD(Charge Coupled Device:電荷耦合裝置)」、或將複數個IC器件模組封裝化之「模組IC」、或「石英器件」、「壓力感測器」、「慣性感測器(加速度感測器)」、「陀螺感測器」、「指紋感測器」等。 電子零件檢查裝置1(電子零件搬送裝置10)具備:托盤供給區域A1、器件供給區域A2、檢查區域A3、器件回收區域A4、及托盤去除區域A5。該等區域如後述般以各壁部分隔。且,IC器件90於箭頭α 90方向依序經過托盤供給區域A1至托盤去除區域A5之上述各區域,並於中途之檢查區域A3進行檢查。如此,電子零件檢查裝置1具備:具有以經過各區域之方式搬送IC器件90之搬送部25之電子零件搬送裝置10、於檢查區域A3內進行檢查之檢查部16、及控制部800。又,此外電子零件檢查裝置1還具備監視器300、信號燈400、及操作面板700。 另,電子零件檢查裝置1係將配置有托盤供給區域A1、托盤去除區域A5者,即圖2中之下側作為正面側使用,將配置有檢查區域A3者,即圖2中之上側作為背面側使用。 又,電子零件檢查裝置1預先搭載依IC器件90之每個種類而進行更換之被稱為「更換套組」者而使用。於該更換套組具有供載置IC器件90(電子零件)之載置部(電子零件載置部)。於本實施形態之電子零件檢查裝置1中,該載置部設置於複數個部位,且有例如後述之溫度調整部12、器件供給部14、及器件回收部18。又,於供載置IC器件90(電子零件)之載置部(電子零件載置部),除如上所述之更換套組外,另具有使用者準備之托盤200、與回收用托盤19、及檢查部16。 托盤供給區域A1為供給排列有未檢查狀態之複數個IC器件90之托盤200之供材部。托盤供給區域A1亦可說是能堆疊搭載複數個托盤200之搭載區域。另,於本實施形態中,於各托盤200矩陣狀地配置有複數個凹部(凹穴)。可於各凹部逐一收納、載置IC器件90。 器件供給區域A2為將自托盤供給區域A1搬送之托盤200上之複數個IC器件90分別搬送、供給至檢查區域A3的區域。另,以跨及托盤供給區域A1與器件供給區域A2之方式設置於水平方向逐片地搬送托盤200之托盤搬送機構11A、11B。托盤搬送機構11A為搬送部25之一部分,可使托盤200連同載置於該托盤200之IC器件90於Y方向正側,即圖2中之箭頭α 11A方向移動。藉此,可將IC器件90穩定地送入至器件供給區域A2。又,托盤搬送機構11B為可使空托盤200於Y方向負側即圖2中之箭頭α 11B方向移動之移動部。藉此,可使空托盤200自器件供給區域A2移動至托盤供給區域A1。 於器件供給區域A2,設有溫度調整部(持溫板(英文記述:soak plate,中文記述(一例):均溫板))12、器件搬送頭13、托盤搬送機構15。又,亦設有以跨及器件供給區域A2與檢查區域A3之方式移動之器件供給部14。 溫度調整部12係供載置複數個IC器件90之載置部,為可將該載置之IC器件90一併加熱或冷卻之稱為「持溫板」者。可藉由該持溫板,將由檢查部16檢查前之IC器件90預先加熱或冷卻,而調整至適於檢查(高溫檢查或低溫檢查)之溫度。 作為此種載置部之溫度調整部12被固定。藉此,可對該溫度調整部12上之IC器件90穩定地調整溫度。 又,溫度調整部12接地(Grounding)。 於圖2所示之構成中,溫度調整部12於Y方向配置、固定有2個。且,由托盤搬送機構11A自托盤供給區域A1搬入之托盤200上之IC器件90被搬送至任一溫度調整部12。 器件搬送頭13係固持IC器件90之固持部,於器件供給區域A2內於X方向及Y方向可移動地被支持,進而亦於Z方向可移動地被支持。該器件搬送頭13亦為搬送部25之一部分,負責自托盤供給區域A1搬入之托盤200與溫度調整部12之間的IC器件90之搬送,及溫度調整部12與後述之器件供給部14之間的IC器件90之搬送。另,圖2中,將器件搬送頭13之X方向之移動以箭頭α 13X表示,將器件搬送頭13之Y方向之移動以箭頭α 13Y表示。 器件供給部14為供載置經溫度調整部12溫度調整之IC器件90之載置部,為可將該IC器件90搬送至檢查部16附近之被稱為「供給用梭板」或簡稱為「供給梭」者。該器件供給部14亦可為搬送部25之一部分。該器件供給部14具有收納、載置IC器件90之凹部(凹穴)141(例如參照圖8)。 又,作為載置部之器件供給部14可於器件供給區域A2與檢查區域A3之間沿著X方向,即箭頭α 14方向往復移動地(可移動地)受支持。藉此,器件供給部14可將IC器件90自器件供給區域A2穩定地搬送至檢查區域A3之檢查部16附近,又,可於檢查區域A3中由器件搬送頭17(手單元9)卸去IC器件90後再次返回至器件供給區域A2。 於圖2所示之構成中,器件供給部14於Y方向配置有2個,有將Y方向負側之器件供給部14稱為「器件供給部14A」,將Y方向正側之器件供給部14稱為「器件供給部14B」之情形。且,溫度調整部12上之IC器件90係於器件供給區域A2內被搬送至器件供給部14A或器件供給部14B。又,器件供給部14較佳為與溫度調整部12同樣地,構成為可將載置於該器件供給部14之IC器件90加熱或冷卻。藉此,對於經溫度調整部12溫度調整之IC器件90,可維持其溫度調整狀態而搬送至檢查區域A3之檢查部16附近。又,器件供給部14亦與溫度調整部12同樣地接地。 托盤搬送機構15係將去除所有IC器件90之狀態之空托盤200於器件供給區域A2內於X方向之正側、即箭頭α 15方向搬送之機構。且,於該搬送後,將空托盤200由托盤搬送機構11B自器件供給區域A2返回至托盤供給區域A1。 檢查區域A3為檢查IC器件90之區域。於該檢查區域A3設置有對IC器件90進行檢查之檢查部16、及器件搬送頭17。 器件搬送頭17亦可為搬送部25之一部分,可與溫度調整部12同樣地構成為能將固持之IC器件90加熱或冷卻。該器件搬送頭17係如後述般具有固持IC器件90(電子零件)之手單元9(固持部)。藉此,可固持經維持上述溫度調整狀態之IC器件90,並維持上述溫度調整狀態地於檢查區域A3內搬送IC器件90。 此種器件搬送頭17可於檢查區域A3內於Y方向及Z方向往復移動地被支持,且成為被稱為「分度臂」之機構之一部分。藉此,器件搬送頭17可自由器件供給區域A2搬入之器件供給部14拉起IC器件90並搬送、載置於檢查部16上。 另,於圖2中,將器件搬送頭17之Y方向之往復移動以箭頭α 17 Y表示。又,器件搬送頭17可於Y方向往復移動地被支持,但並非限定於此,亦可為於X方向亦可往復移動地被支持。又,於圖2所示之構成中,器件搬送頭17於Y方向配置有2個,有時將Y方向負側之器件搬送頭17稱為「器件搬送頭17A」,將Y方向正側之器件搬送頭17稱為「器件搬送頭17B」。器件搬送頭17A可負責於檢查區域A3內將IC器件90自器件供給部14A向檢查部16搬送,器件搬送頭17B可負責於檢查區域A3內將IC器件90自器件供給部14B向檢查部16搬送。 檢查部16(插座)為載置電子零件即IC器件90,且檢查該IC器件90之電氣特性之載置部(電子零件載置部)。該檢查部16具有收納、載置IC器件90之凹部(凹穴)161,且於該凹部161之底部設置有複數根探針引腳(載置部側端子)162(例如參照圖14)。且,將IC器件90之端子902與探針引腳162可導電地連接。即,可藉由接觸進行IC器件90之檢查。IC器件90之檢查係基於連接於檢查部16之測試器所具備之檢查控制部所記憶之程式而進行。另,探針引腳162之上端部形狀適於端子902之形狀,於本實施形態中,呈適於半球狀之端子902之王冠狀(例如參照圖14)。 此種檢查部16可與溫度調整部12同樣地加熱或冷卻IC器件90,而將該IC器件90調整成適於檢查之溫度。 器件回收區域A4係回收於檢查區域A3經檢查且完成該檢查之複數個IC器件90之區域。於該器件回收區域A4,設置有回收用托盤19、器件搬送頭20、及托盤搬送機構21。又,亦設有以跨及檢查區域A3與器件回收區域A4之方式移動之器件回收部18。又,於器件回收區域A4亦備有空托盤200。 器件回收部18為供載置於檢查部16中完成檢查之IC器件90,且可將該IC器件90搬送至器件回收區域A4之載置部,被稱為「回收用梭板」或簡稱為「回收梭」。該器件回收部18亦可為搬送部25之一部分。 又,器件回收部18可於檢查區域A3與器件回收區域A4之間沿X方向即箭頭α 18方向往復移動地被支持。又,於圖2所示之構成中,器件回收部18與器件供給部14同樣地於Y方向配置有2個,將Y方向負側之器件回收部18稱為「器件回收部18A」,將Y方向正側之器件回收部18稱為「器件回收部18B」。且,檢查部16上之IC器件90被搬送、載置於器件回收部18A或器件回收部18B。另,IC器件90自檢查部16向器件回收部18A之搬送係由器件搬送頭17A負責,自檢查部16向器件回收部18B之搬送係由器件搬送頭17B負責。又,器件回收部18亦與溫度調整部12及器件供給部14同樣地接地。 回收用托盤19係供載置於檢查部16中經檢查之IC器件90之載置部,且以不於器件回收區域A4內移動之方式固定。藉此,即使為配置有相對較多之器件搬送頭20等各種可動部之回收區域A4,亦於回收用托盤19上穩定地載置檢查完畢之IC器件90。另,於圖2所示之構成中,回收用托盤19沿X方向配置有3個。 又,空托盤200亦沿X方向配置有3個。該空托盤200亦為供載置於檢查部16中經檢查之IC器件90之載置部。而且,移動至器件回收區域A4之器件回收部18上之IC器件90被搬送、載置於回收用托盤19及空托盤200中之任一者。藉此,IC器件90係根據檢查結果被分類、回收。 器件搬送頭20具有可於器件回收區域A4內於X方向及Y方向移動地被支持、進而亦可於Z方向移動之部分。該器件搬送頭20為搬送部25之一部分,可將IC器件90自器件回收部18搬送至回收用托盤19或空托盤200。另,於圖2中,將器件搬送頭20之X方向之移動以箭頭α 20X表示,將器件搬送頭20之Y方向之移動以箭頭α 20Y表示。 托盤搬送機構21為將自托盤去除區域A5搬入之空托盤200於器件回收區域A4內於X方向即箭頭α 21方向搬送之機構。且,於該搬送後,空托盤200被配置於回收IC器件90之位置,即,可為上述3個空托盤200中之任一者。 托盤去除區域A5為將排列有檢查完畢狀態之複數個IC器件90之托盤200回收、去除之除材部。於托盤去除區域A5中,可堆疊多個托盤200。 又,以跨及器件回收區域A4與托盤去除區域A5之方式,設置有於Y方向逐片搬送托盤200之托盤搬送機構22A、托盤搬送機構22B。托盤搬送機構22A為搬送部25之一部分,且為可使托盤200於Y方向即箭頭α 22A方向往復移動之移動部。藉此,可將檢查完畢之IC器件90自器件回收區域A4搬送至托盤去除區域A5。又,托盤搬送機構22B可將用以回收IC器件90之空托盤200於Y方向之正側即箭頭α 22B方向移動。藉此,可使空托盤200自托盤去除區域A5移動至器件回收區域A4。 控制部800可控制例如如下各部之作動:托盤搬送機構11A、托盤搬送機構11B、溫度調整部12、器件搬送頭13、器件供給部14、托盤搬送機構15、檢查部16、器件搬送頭17、器件回收部18、器件搬送頭20、托盤搬送機構21、托盤搬送機構22A、及托盤搬送機構22B。 操作者可經由監視器300,設定或確認電子零件檢查裝置1之動作條件等。該監視器300具有例如以液晶畫面構成之顯示畫面301,且配置於電子零件檢查裝置1之正面側上部。如圖1所示,於托盤去除區域A5之圖中之右側,設有供載置滑鼠之滑鼠台600。該滑鼠係於操作監視器300所顯示之畫面時使用。 又,於圖1之右下方,對於監視器300配置有操作面板700。操作面板700係與監視器300分開,且對電子零件檢查裝置1指令期望之動作者。 又,信號燈400可藉由發光顏色之組合,報知電子零件檢查裝置1之作動狀態等。信號燈400配置於電子零件檢查裝置1之上部。另,於電子零件檢查裝置1內置有揚聲器500,亦可藉由該揚聲器500報知電子零件檢查裝置1之作動狀態等。 電子零件檢查裝置1係由第1隔板231分隔托盤供給區域A1與器件供給區域A2之間,由第2隔板232分隔器件供給區域A2與檢查區域A3之間,由第3隔板233分隔檢查區域A3與器件回收區域A4之間,由第4隔板234分隔器件回收區域A4與托盤去除區域A5之間。又,器件供給區域A2與器件回收區域A4之間亦係由第5隔板235分隔。 電子零件檢查裝置1之最外裝係由蓋覆蓋,於該蓋有例如前蓋241、側蓋242、側蓋243、後蓋244、頂蓋245。 然而,隨著近年之IC器件90之小型化,IC器件90之端子902彼此之間距亦變窄,其結果,該端子902難以與應與該端子902接觸之檢查部16之探針引腳162接觸,而有無法實現正確值檢查之虞。 因此,電子零件檢查裝置1構成為可防止此種不良。以下,對該構成及作用進行說明。 如圖3所示,器件搬送頭17至少具有一個手單元9(固持部)。手單元9為固持器件供給部14上之IC器件90(電子零件)並搬送至檢查部16者。另,手單元9之配置數量不特別限定。 手單元9具有:基部94;第1移動部95,其支持於基部94,且可相對於基部94於X方向往復移動;第2移動部96,其支持於第1移動部95,且可相對於第1移動部95於Y方向往復移動;旋動部(旋轉部)97,其支持於第2移動部96,且可相對於第2移動部96繞Z軸旋動(旋轉);旋轉軸99,其設置於旋動部97;保持部98,其固定於旋轉軸99;第1壓電致動器911,其使第1移動部95相對於基部94移動;第2壓電致動器912,其使第2移動部96相對於第1移動部95移動;及第3壓電致動器(旋動部用壓電致動器)913,其使旋動部97相對於第2移動部96旋動。 基部94具有:呈板狀之板狀部941,其於Z方向上具有厚度;及扣合部942及扣合部943,其等設置於板狀部941之下表面,且用以將第1移動部95向X方向引導。扣合部942及扣合部943各自於X方向延伸,又,彼此於Y方向上分開。扣合部942及扣合部943之構成無特別限定,但於本實施形態中,各自具有於後述之導軌952及導軌953之長邊方向開放之溝槽。換言之,扣合部942及扣合部943由具有於圖3中之下方開放之長條溝槽之長條部構成。 又,基部94自板狀部941朝Z方向負側延伸,且具有與第1壓電致動器911抵接之抵接部947。抵接部947延伸至第2移動部96,且以相對於第1移動部95及第2移動部96於Y方向排列之方式設置。又,抵接部947之下表面947a於X方向延伸,且第1壓電致動器911之凸部911a(上端部)抵接於該下表面947a。較佳對下表面947a之表面實施用以提高與凸部911a間之摩擦阻力之處理,或形成高摩擦層。 第1移動部95具有:基部951、設置於基部951且與基部94之扣合部942扣合之導軌952、設置於基部951且與基部94之扣合部943扣合之導軌953。藉此,限制第1移動部95向X方向以外之移動,使第1移動部95順暢且確實地於X方向移動。 又,第1移動部95具有自基部951朝Z方向負側延伸,且固定有第1壓電致動器911之第1固定部954。第1固定部954呈於XZ平面擴展且於Y方向上具有厚度之板狀,且以相對於第2移動部96(基部961)於Y方向排列之方式設置。且,於第1固定部954之表面固定有第1壓電致動器911。 第1壓電致動器911呈板狀,且以將Y方向設為厚度之方式固定於第1固定部954。藉由如此配置第1壓電致動器911可抑制第1壓電致動器911向外側之過度突出,而可謀求手單元9之小型化。 又,第1移動部95具有自基部951朝Z方向負側延伸,且固定有第2壓電致動器912之第2固定部(未圖示)。該第2固定部呈於YZ平面擴展且於X方向上具有厚度之板狀,且以相對於第2移動部96(基部961)於X方向排列之方式設置。且,於第2固定部之背面固定有第2壓電致動器912。 第2壓電致動器912呈板狀,且以將X方向設為厚度之方式固定於上述第2固定部。藉由如此配置第2壓電致動器912可抑制第2壓電致動器912向外側之突出,而可謀求手單元9之小型化。又,第2壓電致動器912之上端部自下側抵接於第2移動部96。 又,第1移動部95具有用以將第2移動部96向Y方向引導之扣合部(引導部)956。扣合部956於Y方向延伸。扣合部956之構成無特別限定,但於本實施形態中,具有於後述之導軌963之長邊方向開放之溝槽。換言之,扣合部956由具有於圖3中之下方開放之長條溝槽之長條部構成。 第2移動部96具有:柱狀之基部961、設置於基部961且與第1移動部95之扣合部956扣合之導軌963。藉此,限制第2移動部96向Y方向以外之移動,使第2移動部96順暢且確實地於Y方向移動。 又,於第2移動部96之基部961形成有較其他部分更凹陷之面961a,且於該面961a固定有用以使旋動部97旋動之第3壓電致動器913。面961a由YZ平面構成,板狀之第3壓電致動器913以將X方向設為厚度之方式固定於面961a。藉由如此配置第3壓電致動器913可抑制第3壓電致動器913向外側之過度突出,而可謀求手單元9之小型化。 於手單元9中,由如上構成之第1移動部95與第2移動部96構成位置調整機構92。位置調整機構92為使保持於保持部98之IC器件90(電子零件)於與Z方向(鉛直方向)正交之方向,即X方向與Y方向移動者。向X方向之移動係由第1移動部95負責,向Y方向之移動係由第2移動部96負責。藉此,即使於可於Y方向及Z方向往復移動地受支持之器件搬送頭17中,亦可分別獨立地微調整,即修正IC器件90之X方向、Y方向之位置。 旋動部97位於第2移動部96之下方(Z方向負側)。旋動部97具有固定於第2移動部96之基部961下端之管狀之支持部971。於該支持部971之內側配置有例如與支持部971同軸地設置,且供插通旋轉軸99之旋動體(未圖示),或可相對於支持部971旋動地支持旋動體之軸承(未圖示)等。 又,於上述旋動體,於自該旋動軸偏心之位置,抵接有第3壓電致動器913之凸部913a。且,藉由第3壓電致動器913之驅動,上述旋動體相對於支持部971(第2移動部96)旋動。 於手單元9中,藉由如上構成之旋動部97構成姿勢調整機構93。姿勢調整機構93為使保持於保持部98之IC器件90(電子零件)繞Z軸(鉛直軸)旋動者。藉此,即使於可於Y方向及Z方向往復移動地受支持之器件搬送頭17中,亦可獨立地微調整,即修正IC器件90之姿勢,即繞Z軸之方向。 如此,手單元9(固持部)具有:位置調整機構92,其調整IC器件90(電子零件)之位置;及姿勢調整機構93,其調整IC器件90(電子零件)之姿勢。藉此,如後述般,於將IC器件90載置於檢查部16時,可根據需要適當地調整IC器件90之位置與姿勢兩者,因此,可正確地進行該載置。 旋轉軸99延伸至基部94之板狀部941。於基部94內置有仿形機構(順形機構)948。旋轉軸99連結於仿形機構948。藉此,旋轉軸99之姿勢可藉由旋轉軸99受到之外力而仿形。 於旋轉軸99之下端,配置有保持IC器件90之保持部98。該保持部98經由旋轉軸99支持於旋動部97,且可與上述旋動體一體地相對於第2移動部96旋動。 又,保持部98具有:吸附面981,其與IC器件90對向;吸附孔982,其於吸附面981開放;及減壓泵983,其將吸附孔982內減壓。當以蓋住吸附孔982之方式使吸附面981與IC器件90接觸之狀態,藉由減壓泵983將吸附孔982內減壓時,可將IC器件90吸附、保持於吸附面981。相反,若停止減壓泵983而將吸附孔982內釋放,則可放開IC器件90。 作為第1壓電致動器911、第2壓電致動器912、第3壓電致動器913,可使用例如具有短條狀之壓電元件之構成者。壓電元件藉由施加交流電壓而於其長邊方向伸縮。且,可利用該伸縮動作使第1移動部95相對於基部94移動,或使第2移動部96相對於第1移動部95移動,或使旋動部97相對於第2移動部96旋動。另,作為壓電元件之構成材料無特別限定,但可使用鈦酸鋯酸鉛(PZT)、石英、鈮酸鋰、鈦酸鋇、鈦酸鉛、偏鈮酸鉛、聚偏氟乙烯、鋅鈮酸鉛、鈧鈮酸鉛等各種者。 又,手單元9(固持部)除了IC器件90(電子零件)以外還可固持並搬送試驗片8(參照圖4~圖7)。試驗片8於被固持於手單元9之狀態,被按壓至後述之檢查部16之基準探針引腳162a(抵接痕形成部),而形成抵接痕821。該抵接痕821於將IC器件90自器件供給部14搬送至檢查部16,並載置於檢查部16時,用於IC器件90之位置修正或姿勢修正。 試驗片8具有可藉由賦予力而變色或變形之構件。於本實施形態中,試驗片8為具有可藉由賦予力而變色之構件者,如圖4~圖7所示,例如,由片材狀之基材81、與形成於基材81且分散有微膠囊之微膠囊層82構成。微膠囊層為內包顯色劑者。又,「力」為將試驗片8按壓至基準探針引腳162a(抵接痕形成部)時產生之來自基準探針引腳162a(抵接痕形成部)之反作用力。且,藉由該反作用力碰撞將微膠囊壓壞而釋放出內部之顯色劑,故微膠囊層82之一部分變色。藉此,變色之部分成為抵接痕821(參照圖5)。藉由使用此種構成之試驗片8可迅速地形成抵接痕821。 如圖4~圖14所示,於檢查區域A3配置、固定有攝像部26。攝像部26位於檢查部16、與於檢查區域A3內停止之器件供給部14之間。如上所述,於器件供給部14具有器件供給部14A與器件供給部14B。因此,攝像部26有位於檢查部16與器件供給部14A之間者,與位於檢查部16與器件供給部14B之間者。於以下,代表性地對器件供給部14A側之攝像部26進行說明。 攝像部26由例如CCD(Charge Coupled Devices)相機或3維相機等各種相機構成。攝像部26可使其攝像方向朝上方而拍攝藉由手單元9(固持部)固持之IC器件90(參照圖11)或試驗片8(參照圖7)。作為拍攝之順序(時序),首先,攝像部26拍攝由手單元9(固持部)固持試驗片8並使其抵接於基準探針引腳162a(抵接痕形成部)後之試驗片8之第1圖像IM 1。接著,於拍攝第1圖像IM 1後,攝像部26拍攝固持於手單元9(固持部)之IC器件90(電子零件)之第2圖像IM 2。如圖15所示,於第1圖像IM 1包含抵接痕821之圖像,於第2圖像IM 2包含IC器件90(電子零件)之端子902之圖像。 如上所述,檢查部16(電子零件載置部)為載置並檢查IC器件90(電子零件)者。該檢查部16(電子零件載置部)具有可與IC器件90(電子零件)導電地連接之複數根探針引腳(載置部側端子)162。且,將該等複數根探針引腳(載置部側端子)162中之至少一根(於本實施形態中作為一例係圖4~圖14之最左側)之探針引腳(載置部側端子)162設為成於試驗片8形成抵接痕821之抵接痕形成部之基準探針引腳(載置部側基準端子)162a。如此,抵接痕形成部由複數根探針引腳(載置部側端子)162中之至少一根探針引腳(載置部側端子)162,即於本實施形態中係基準探針引腳(載置部側基準端子)162a構成。藉此,可省略除探針引腳162外另行設置抵接痕形成部,因此,可將檢查部16之構成設為簡單者。 另一方面,於IC器件90中,將複數個端子902中之可與基準探針引腳162a導電地連接之端子902設為基準端子(電子零件側基準端子)902a。 接著,針對於檢查區域A3內,手單元9(器件搬送頭17A)將IC器件90搬送至檢查部16,直至成為可對IC器件90檢查之狀態之動作(一例),參照圖4~圖15進行說明。 如圖4所示,設為手單元9固持試驗片8之狀態。又,手單元9之位置設為使試驗片8於檢查部16之凹部161之正上方而面向該凹部161之狀態。 接著,如圖5所示,使手單元9下降直至將試驗片8之微膠囊層82按壓抵接至探針引腳162為止。藉此,於微膠囊層82形成複數個抵接痕821。 接著,如圖6所示,使手單元9上升至與圖4中之手單元9相同之高度。又,於圖6中,將此時之手單元9之上升方向與上升量以箭頭α 9Z表示。 接著,如圖7所示,使手單元9朝Y方向負側,即器件供給部14A側移動,且於其中途暫時停止。手單元9之停止位置為於攝像部26之正上方有試驗片8,且可利用攝像部26拍攝試驗片8之位置。接著,於該位置使攝像部26作動,藉此獲得第1圖像IM 1(參照圖15)。自第1圖像IM 1檢測出基準探針引腳162a所形成之抵接痕821(以下稱為「基準抵接痕821a」)之中心O 821a。另,該檢測由控制部800進行。又,於圖7中,將手單元9停止之前之移動方向與移動量以箭頭α 9Y表示。 接著,如圖8所示,使手單元9進而朝Y方向負側,即器件供給部14A側移動,且於器件供給部14A之正上方停止。隨後,自手單元9去除試驗片8。 接著,如圖9所示,使手單元9下降直至手單元9與載置於器件供給部14A之IC器件90抵接。藉此,可由手單元9固持IC器件90。 接著,如圖10所示,使手單元9上升至與圖8中之手單元9相同之高度。 接著,如圖11所示,使手單元9朝Y方向正側,即檢查部16側移動,且於其中途暫時停止。手單元9之停止位置為於攝像部26之正上方有IC器件90,且可利用攝像部26拍攝IC器件90之位置。接著,於該位置使攝像部26作動,藉此獲得第2圖像IM 2(參照圖15)。自第2圖像IM 2檢測出基準端子902a之中心O 902a。另,該檢測由控制部800進行。 如上所述,於第1圖像IM 1包含抵接痕821之圖像,於第2圖像IM 2包含IC器件90(電子零件)之端子902之圖像(參照圖15)。藉此,可將第1圖像IM 1與第2圖像IM 2於共通之座標軸上合成(箭頭C1),而獲得合成圖像IM 3。 又,如上所述,檢查部16(電子零件載置部)具有複數根探針引腳(載置部側端子)162。又,檢查部16(電子零件載置部)將該等複數根探針引腳(載置部側端子)162中之至少一根探針引腳(載置部側端子)162設為成抵接痕形成部之基準探針引腳(載置部側基準端子)162a。又,IC器件90(電子零件)具有可與基準探針引腳(載置部側基準端子)162a導電地連接之基準端子(電子零件側基準端子)902a。自合成圖像IM 3檢測出基準端子902a之中心O 902a相對於基準抵接痕821a之中心O 821a之偏移量ΔY。另,該檢測亦由控制部800進行。接著,若藉由使手單元9之位置調整機構92或姿勢調整機構93適當作動而使IC器件90移動偏移量ΔY,則可使中心O 821a與中心O 902a一致,亦即使其等合致。如此,手單元9(固持部)可以使第2圖像IM 2中之基準端子(電子零件側基準端子)902a之中心O 902a(位置)與第1圖像IM 1中之基準探針引腳(載置部側基準端子)162a所形成之基準抵接痕821a之中心O 821a(抵接痕821之位置)一致(重合)之方式,調整IC器件90(電子零件)之位置及姿勢之至少一者(以下將該調整稱為「修正」)。於本實施形態中,藉由手單元9之位置調整機構92之作動調整IC器件90之位置,且於圖12顯示該調整後之狀態。 接著,如圖13所示,使手單元9進而朝Y方向正側,即檢查部16側移動,且於檢查部16之正上方停止。於圖13中,將手單元9停止之前之移動方向與移動量以箭頭β 9Y表示。箭頭β 9Y係其方向與箭頭α 9Y正相反,移動量與箭頭α 9Y之移動量相同。 接著,如圖14所示,使手單元9下降。於圖14中,將此時之手單元9之下降方向與下降量以箭頭β 9Z表示。箭頭β 9Z係其方向與箭頭α 9Z正相反,下降量與箭頭α 9Z之上升量相同。藉此,當然將IC器件90之基準端子902a、與檢查部16之基準探針引腳162a可導電地連接,其他剩餘之端子902亦與探針引腳162可導電地連接,因此,可對IC器件90進行檢查。另,於本實施形態中,於省略上述修正之情形時,不進行IC器件90之基準端子902a、與檢查部16之基準探針引腳162a之接觸,結果,亦無法對IC器件90進行檢查。 如上所述,於電子零件檢查裝置1(電子零件搬送裝置10)中,於將IC器件90載置於檢查部16時,於該載置之前,手單元9(固持部)可基於由攝像部26拍攝之第1圖像IM 1與第2圖像IM 2,調整IC器件90(電子零件)相對於檢查部16(電子零件載置部)之位置及姿勢之至少一者。藉由該調整,IC器件90成適於載置於檢查部16之位置或姿勢,因此,於向檢查部16載置後,可將各端子902與各探針引腳162可導電地正確地連接。又,於將IC器件90載置至檢查部16之期間,使用一個攝像部26取得調整IC器件90之位置或姿勢所需之圖像(第1圖像IM 1及第2圖像IM 2)。如此,可以使用一個攝像部26之簡單構成進行各種調整。 另,為了使基準抵接痕821a之中心O 821a與基準端子902a之中心O 902a一致,於本實施形態中,調整IC器件90之Y方向之位置,但並不限定於此。亦有根據固持於手單元9之IC器件90,而例如調整IC器件90之X方向之位置,或調整IC器件90之繞Z軸之姿勢、或適當地組合X方向之位置調整、Y方向之位置調整、繞Z軸之姿勢調整之情形。 又,可對上述各種調整設定複數個基準抵接痕821a或複數個基準端子902a。 <第2實施形態> 以下,參照圖16及圖17對本發明之電子零件搬送裝置及電子零件檢查裝置之第2實施形態進行說明,但以與上述之實施形態之不同點為中心進行說明,同樣之事項係省略其說明。 本實施形態除了抵接痕形成部之構成不同以外均與上述第1實施形態同樣。 如上述第1實施形態所述,檢查部16(電子零件載置部)具有可與IC器件90(電子零件)導電地連接之複數根探針引腳(載置部側端子)162。且,如圖16、圖17所示,於本實施形態中,抵接痕形成部由與探針引腳(載置部側端子)162不同之引腳構件163(部分)構成。藉此,例如可將引腳構件163(抵接痕形成部)設為較探針引腳162可更容易形成抵接痕821者。作為此種引腳構件163無特別限定,但可使用例如由較探針引腳162更硬質之硬質樹脂材料構成者、使上端163a之形狀較探針引腳162之上端形狀更適於形成抵接痕821者等。另,作為硬質樹脂材料列舉例如丙烯酸樹脂。又,作為上端163a之形狀可設為例如帶圓度之形狀。 另,引腳構件163之配置部位不限定於圖16或圖17所示之位置。 又,引腳構件163可由金屬材料構成。於該情形時,較佳於引腳構件163形成絕緣性之被膜。 <第3實施形態> 以下,參照圖18及圖19對本發明之電子零件搬送裝置及電子零件檢查裝置之第3實施形態進行說明,但以與上述之實施形態之不同點為中心進行說明,同樣之事項係省略其說明。 本實施形態係除了試驗片之構成與抵接痕形成部之構成不同以外均與上述第1實施形態同樣。 如圖18、圖19所示,於本實施形態中,試驗片8為例如由硬質樹脂材料構成之小片。又,抵接痕形成部為於抵接於試驗片8時,於該試驗片8以例如墨水賦予標記83(參照圖19)之標記賦予部164。標記83為抵接痕。 藉由此種構成,可使用單層者作為試驗片8而將試驗片8之構成設為簡單者。 <第4實施形態> 以下,參照圖20~圖22對本發明之電子零件搬送裝置及電子零件檢查裝置之第4實施形態進行說明,但以與上述之實施形態之不同點為中心進行說明,同樣之事項係省略其說明。 本實施形態係除了試驗片之構成以外均與上述第1實施形態同樣。 如上述第1實施形態所述,試驗片8具有可藉由賦予力而變色或變形之構件。如圖20~圖22所示,於本實施形態中,試驗片8為具有可藉由賦予力而變形之構件者,例如具有:片材狀之基材81、與形成於基材81且由塑造用黏土構成之黏土層84。作為塑造用黏土無特別限定,可使用例如油性黏土或蠟性黏土等。藉此,黏土層84於受到來自基準探針引腳162a(抵接痕形成部)之反作用力時,該部分發生塑性變形。藉此,塑性變形後之部分為抵接痕841(圖21、圖22)。藉由使用此種構成之試驗片8亦可迅速地形成抵接痕841。 又,可於黏土層84中混練粒子狀之研磨材。藉此,於黏土層84形成抵接痕841時,可藉由研磨材研磨探針引腳162(基準探針引腳162a)而削落附著於探針引腳162之污垢。 又,試驗片8於本實施形態中為塑性變形者,但不限定於此,亦可為彈性變形者。於該情形時,作為彈性變形之材料無特別限定,例如較佳為如胺基甲酸酯橡膠等之低反彈材料,藉此,可維持抵接痕。 <第5實施形態> 以下,參照圖23~圖30對本發明之電子零件搬送裝置及電子零件檢查裝置之第5實施形態進行說明,但以與上述之實施形態之不同點為中心進行說明,同樣之事項係省略其說明。 本實施形態係除了將IC器件載置於檢查部時之IC器件之位置、姿勢之調整方法不同以外均與上述第1實施形態同樣。 如圖23~圖29所示,於本實施形態中,檢查部16具有:朝上方突出之導銷165、及與導銷165同樣朝上方突出之導銷166。導銷165與導銷166隔著凹部161配置。 於檢查部16之上方配置有攝像部(第2攝像部)27。攝像部27與攝像部26同樣,由例如CCD(Charge Coupled Devices)相機或3維相機等各種相機構成。攝像部27係其攝像方向朝下方,且可拍攝檢查部16。藉此,可獲得檢查部圖像IM 4(參照圖30)。 又,器件搬送頭17A(器件搬送頭17)具有導板171。導板171例如連結於手單元9之基部94。於導板171形成貫通大開口部172、導孔173、及導孔174。於大開口部172之內側配置有手單元9之保持部98。該大開口部172係充分大至即使因位置調整機構92或姿勢調整機構93之作動引起保持部98位移,亦不會與保持部98干涉之程度。導孔173為供檢查部16之導銷165嵌合之部分,導孔174為供導銷166嵌合之部分(參照圖29)。 接著,針對於檢查區域A3內,手單元9(器件搬送頭17A)將IC器件90搬送至檢查部16,直至成為可對IC器件90檢查之狀態之動作(一例)進行說明。 如圖23所示,手單元9為尚未固持IC器件90之狀態,且位於器件供給部14A之正上方。接著,於該狀態下,藉由使攝像部27作動,可獲得檢查部圖像IM 4。自檢查部圖像IM 4檢測出基準探針引腳162a之中心O 162a、與導銷165之中心O 165(參照圖30)。藉此,檢測出中心O 162a與中心O 165之位置關係,即中心O 162a相對於中心O 165位於哪個位置。另,各檢測由控制部800進行。 接著,如圖24所示,使手單元9下降直至手單元9與載置於器件供給部14A之IC器件90抵接為止。藉此,可使IC器件90固持於手單元9。 接著,如圖25所示,使手單元9上升至與圖23中之手單元9相同之高度。 接著,如圖26所示,使手單元9朝Y方向正側,即檢查部16側移動,且於其中途暫時停止。手單元9之停止位置為於攝像部26之正上方有IC器件90,且可利用攝像部26拍攝IC器件90之位置。接著,於該位置使攝像部26作動,藉此獲得器件圖像IM 5(參照圖30)。自器件圖像IM 5檢測出基準端子902a之中心O 902a、與導孔173之中心O 173(參照圖30)。藉此,檢測出中心O 902 a與中心O 173之位置關係,即中心O 902 a相對於中心O 173位於哪個位置。另,各檢測由控制部800進行。 接著,比較檢查部圖像IM 4、與器件圖像IM 5(箭頭C2),並以器件圖像IM 5中之中心O 902a與中心O 173之位置關係成為與檢查部圖像IM 4中之中心O 162a與中心O 165之位置關係等效的位置關係之方式,調整IC器件90之位置及姿勢之至少一者。於本實施形態中,藉由手單元9之位置調整機構92之作動,調整IC器件90之位置,且於圖27顯示該調整後之狀態。又,圖30中之器件圖像IM 5'為假想該調整後之狀態(箭頭C3)而設想出之假想圖像。 接著,如圖28所示,使手單元9進而朝Y方向正側,即檢查部16側移動,且於檢查部16之正上方停止。 接著,如圖29所示,使手單元9下降。藉此,當然將IC器件90之基準端子902a、與檢查部16之基準探針引腳162a可導電地連接,其他剩餘之端子902亦與探針引腳162可導電地連接,因此,可對IC器件90進行檢查。另,於本實施形態中,於省略上述調整之情形時,不進行IC器件90之基準端子902a、與檢查部16之基準探針引腳162a之接觸,結果,亦無法對IC器件90進行檢查。 以上,對圖示本發明之電子零件搬送裝置及電子零件檢查裝置之實施形態進行了說明,但本發明並非限定於此者,構成電子零件搬送裝置及電子零件檢查裝置之各部可置換為能發揮同樣功能之任意構成者。又,亦可附加任意之構成物。 又,本發明之電子零件搬送裝置及電子零件檢查裝置可為將上述各實施形態中之任意2個以上之構成(特徵)組合而成者。 又,攝像部為於檢查區域內固定者,但並非限定於此,例如,亦可為能與器件供給部一起移動者。 又,於IC器件之位置調整或姿勢調整時,於上述各實施形態中於試驗片形成抵接痕而進行該調整,但不限定於此,亦可於IC器件(電子零件)形成抵接痕而進行該調整。 Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the additional drawings. <First Embodiment> A first embodiment of an electronic component conveying apparatus and an electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 1 to 15 . In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is referred to as "X direction (first direction)", the direction parallel to the Y-axis is referred to as "Y direction (second direction)", and the direction parallel to the Z-axis is referred to as " Z direction (third direction)". Further, the direction in which the arrows in the respective directions are directed is referred to as "positive", and the opposite direction is referred to as "negative". Moreover, the "level" mentioned in the specification of the present invention is not limited to the complete level, and includes a state of being slightly inclined with respect to the horizontal (for example, less than about 5°) as long as it does not hinder the conveyance of the electronic component. In addition, the upper side in FIG. 1 and FIG. 3 to FIG. 14 (the same as in FIGS. 16 to 29) may be referred to as "upper" or "upper" in the Z-axis direction, and the Z-axis direction in the lower side. The negative side is called "down" or "lower". The electronic component conveying device 10 of the present invention has the appearance as shown in Fig. 1. The electronic component conveying device 10 of the present invention is a processor, and is configured to be mounted with an electronic component and has a reference probe pin 162a (abutment mark forming portion) capable of forming an abutment mark 821 on the electronic component or the test piece 8. The device of the inspection unit 16 (electronic component mounting unit). The electronic component conveying device 10 includes a hand unit 9 (holding portion) that holds and transports the electronic component or the test piece 8 and can press the electronic component or the test piece 8 to the reference probe pin 162a (contact mark forming portion). And an imaging unit 26 that can capture an electronic component or test piece 8 held by the hand unit 9 (holding portion). The imaging unit 26 captures the first image IM of the test piece 8 after the test piece 8 is held by the hand unit 9 (holding portion) and abuts against the reference probe pin 162a (contact mark forming portion).  1And shooting the first image IM  1The second image IM of the electronic component that is later held by the hand unit 9 (holding portion)  2. Next, the hand unit 9 (holding portion) can be based on the first image IM  1With the second image IM  2At least one of the position and posture of the electronic component with respect to the inspection unit 16 (electronic component mounting portion) is adjusted. As a result, when the electronic component is placed on the inspection unit 16 as described later, the hand unit 9 (holding portion) can be based on the first image IM captured by the imaging unit 26 before the placement.  1With the second image IM  2Any one of the position and posture of the electronic component with respect to the inspection unit 16 is adjusted. With this adjustment, the electronic component is placed at a position or posture that is placed on the inspection portion 16, and therefore, after being placed on the inspection portion 16, the inspection portion 16 can be electrically and accurately connected. Further, while the electronic component is placed on the inspection unit 16, an image obtained by adjusting the position or posture of the electronic component can be obtained by using one imaging unit 26 (first image IM)  1And the second image IM  2). Thus, the above various adjustments can be performed using a simple configuration of one imaging unit 26. Moreover, as shown in FIG. 2, the electronic component inspection apparatus 1 of this invention has the electronic component conveyance apparatus 10, and further has the inspection part 16 which inspects an electronic component. In other words, the electronic component inspection device 1 of the present invention includes an electronic component mounting portion that mounts an electronic component and has a reference probe pin 162a that can form an abutment mark 821 on the electronic component or the test piece 8 (abutting a hand unit 9 (holding portion) that holds and transports the electronic component or the test piece 8, and can press the electronic component or the test piece 8 to the reference probe pin 162a (abutment mark forming portion); The imaging unit 26 can capture an electronic component or a test piece 8 held by the hand unit 9 (holding portion). The electronic component mounting portion is an inspection portion 16 on which electronic components can be placed and inspected. The imaging unit 26 captures the first image IM of the test piece 8 after the test piece 8 is held by the hand unit 9 (holding portion) and abuts against the reference probe pin 162a (contact mark forming portion).  1And shooting the first image IM  1The second image IM of the electronic component that is later held by the hand unit 9 (holding portion)  2. Next, the hand unit 9 (holding portion) can be based on the first image IM  1With the second image IM  2At least one of the position and posture of the electronic component with respect to the inspection unit 16 (electronic component mounting portion) is adjusted. Thereby, the electronic component inspection apparatus 1 having the advantages of the electronic component conveying apparatus 10 described above can be obtained. Moreover, since the electronic component can be transported to the inspection unit 16, the electronic component can be inspected in the inspection unit 16. Moreover, the electronic parts after inspection can be carried out from the inspection unit 16. Hereinafter, the configuration of each unit will be described in detail. As shown in FIG. 1 and FIG. 2, the electronic component inspection apparatus 1 including the electronic component conveying apparatus 10 transports electronic components such as an IC device such as a BGA (Ball Grid Array) package, and carries them during transportation. Inspection/test (hereinafter referred to as "inspection") Electrically-specific devices for electronic components. In the following, for the sake of convenience of explanation, a case where an IC device is used as the above-described electronic component will be representatively described, and this will be referred to as "IC device 90". In the present embodiment, the IC device 90 is in the form of a flat plate. Further, the IC device 90 has a plurality of terminals (electronic component side terminals) 902 arranged in a matrix in a plan view on the lower surface thereof. Each terminal 902 has a hemispherical shape. In addition, as an IC device, for example, "LSI (Large Scale Integration)", "CMOS (Complementary MOS)", "CCD (Charge Coupled Device)" "Charge-coupled device" or "module IC", or "quartz device", "pressure sensor", "inertial sensor (acceleration sensor)", which encapsulates a plurality of IC device modules, "Gyro sensor", "fingerprint sensor", etc. The electronic component inspection device 1 (electronic component conveying device 10) includes a tray supply region A1, a component supply region A2, an inspection region A3, a device collection region A4, and a tray removal region A5. These areas are partially separated by walls as will be described later. And, IC device 90 is at arrow α  90The direction passes through the above-described respective areas of the tray supply area A1 to the tray removal area A5 in order, and is inspected in the inspection area A3 in the middle. In this way, the electronic component inspection apparatus 1 includes an electronic component transport apparatus 10 that transports the transport unit 25 of the IC device 90 through each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 800. Further, the electronic component inspection device 1 further includes a monitor 300, a signal lamp 400, and an operation panel 700. In addition, the electronic component inspection apparatus 1 is configured such that the tray supply area A1 and the tray removal area A5 are disposed, that is, the lower side in FIG. 2 is used as the front side, and the inspection area A3 is disposed, that is, the upper side in FIG. 2 is the back side. Side use. In addition, the electronic component inspection device 1 is used by being referred to as a "replacement kit" in which each type of the IC device 90 is replaced. The replacement kit has a mounting portion (electronic component mounting portion) on which the IC device 90 (electronic component) is placed. In the electronic component inspection device 1 of the present embodiment, the mounting portion is provided in a plurality of locations, and includes, for example, a temperature adjustment unit 12, a device supply unit 14, and a device collection unit 18 which will be described later. Further, in the mounting portion (electronic component mounting portion) on which the IC device 90 (electronic component) is placed, in addition to the replacement kit as described above, the tray 200 prepared by the user and the recovery tray 19 are provided. And inspection unit 16. The tray supply area A1 is a supply unit that supplies the trays 200 of the plurality of IC devices 90 in an unchecked state. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked. Further, in the present embodiment, a plurality of concave portions (recesses) are arranged in a matrix on each of the trays 200. The IC device 90 can be housed and placed one by one in each recess. The device supply region A2 is a region in which a plurality of IC devices 90 on the tray 200 transported from the tray supply region A1 are transported and supplied to the inspection region A3. Further, the tray transport mechanisms 11A and 11B of the tray 200 are transported one by one in the horizontal direction so as to straddle the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A is a part of the transport unit 25, and the tray 200 can be placed on the positive side in the Y direction together with the IC device 90 placed on the tray 200, that is, the arrow α in FIG.  11AMove in direction. Thereby, the IC device 90 can be stably supplied to the device supply region A2. Further, the tray transport mechanism 11B is an arrow α in FIG. 2 in which the empty tray 200 can be placed on the negative side in the Y direction.  11BThe moving part that moves in the direction. Thereby, the empty tray 200 can be moved from the device supply region A2 to the tray supply region A1. In the device supply region A2, a temperature adjustment unit (a temperature plate (English description: soak plate, Chinese description (one case): temperature equalization plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. Further, a device supply unit 14 that moves so as to straddle the device supply region A2 and the inspection region A3 is also provided. The temperature adjustment unit 12 is a mounting portion on which a plurality of IC devices 90 are placed, and is referred to as a "warm plate" in which the IC device 90 to be mounted is heated or cooled. The IC device 90 before inspection by the inspection portion 16 can be preheated or cooled by the temperature holding plate to be adjusted to a temperature suitable for inspection (high temperature inspection or low temperature inspection). The temperature adjustment unit 12 as such a mounting portion is fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment portion 12 can be stably adjusted. Further, the temperature adjustment unit 12 is grounded. In the configuration shown in FIG. 2, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Further, the IC device 90 on the tray 200 carried by the tray transport mechanism 11A from the tray supply area A1 is transported to any of the temperature adjustment units 12. The device transfer head 13 holds the holding portion of the IC device 90, is movably supported in the X direction and the Y direction in the device supply region A2, and is also movably supported in the Z direction. The device transport head 13 is also a part of the transport unit 25, and is responsible for transporting the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the temperature adjustment unit 12 and the device supply unit 14 which will be described later. The transfer of the IC device 90 between. In addition, in FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α.  13XIndicates that the movement of the device transport head 13 in the Y direction is indicated by an arrow α.  13YSaid. The device supply unit 14 is a mounting portion for the IC device 90 on which the temperature adjustment unit 12 is temperature-adjusted, and the IC device 90 can be transported to the vicinity of the inspection unit 16 as a “supply shuttle plate” or simply as "Supply shuttle". The device supply unit 14 may be a part of the transport unit 25. The device supply unit 14 has a recess (cavity) 141 in which the IC device 90 is housed and placed (see, for example, FIG. 8). Further, the device supply portion 14 as the placing portion can be along the X direction, that is, the arrow α between the device supply region A2 and the inspection region A3.  14The direction is supported reciprocally (movably). Thereby, the device supply unit 14 can stably transport the IC device 90 from the device supply region A2 to the vicinity of the inspection portion 16 of the inspection region A3, and can be removed by the device transfer head 17 (hand unit 9) in the inspection region A3. The IC device 90 is returned to the device supply region A2 again. In the configuration shown in FIG. 2, the device supply unit 14 is disposed in the Y direction, and the device supply unit 14 on the negative side in the Y direction is referred to as the “device supply unit 14A”, and the device supply unit on the positive side in the Y direction is provided. 14 is referred to as "device supply unit 14B". Further, the IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or the device supply unit 14B in the device supply region A2. Further, the device supply unit 14 is preferably configured to heat or cool the IC device 90 placed on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 whose temperature is adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 of the inspection area A3 while maintaining the temperature adjustment state. Further, the device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12. The tray transport mechanism 15 is an empty tray 200 that removes the state of all the IC devices 90 in the device supply region A2 on the positive side in the X direction, that is, the arrow α.  15The mechanism of the direction of transportation. Then, after the transfer, the empty tray 200 is returned from the device supply region A2 to the tray supply region A1 by the tray transport mechanism 11B. The inspection area A3 is an area for inspecting the IC device 90. An inspection unit 16 that inspects the IC device 90 and a device transfer head 17 are provided in the inspection area A3. The device transfer head 17 may be a part of the transfer unit 25, and may be configured to be capable of heating or cooling the held IC device 90 in the same manner as the temperature adjustment unit 12. The device transfer head 17 has a hand unit 9 (holding portion) that holds the IC device 90 (electronic component) as will be described later. Thereby, the IC device 90 that maintains the temperature adjustment state described above can be held, and the IC device 90 can be transported in the inspection region A3 while maintaining the temperature adjustment state. Such a device transfer head 17 can be supported in the inspection area A3 so as to reciprocate in the Y direction and the Z direction, and is part of a mechanism called an "index arm". Thereby, the device transfer portion 17 in which the device transfer head 17 can be carried in the device supply region A2 can pull up the IC device 90, transport it, and load it on the inspection portion 16. In addition, in FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α.  17 YSaid. Further, the device transfer head 17 is supported to be reciprocally movable in the Y direction. However, the present invention is not limited thereto, and may be supported to reciprocate in the X direction. Further, in the configuration shown in FIG. 2, the device transfer head 17 is disposed in the Y direction, and the device transfer head 17 on the negative side in the Y direction may be referred to as "device transfer head 17A", and the positive side in the Y direction may be referred to. The device transfer head 17 is referred to as a "device transfer head 17B." The device transfer head 17A may be responsible for transporting the IC device 90 from the device supply portion 14A to the inspection portion 16 in the inspection region A3, and the device transfer head 17B may be responsible for moving the IC device 90 from the device supply portion 14B to the inspection portion 16 in the inspection region A3. Transfer. The inspection unit 16 (socket) is a mounting portion (electronic component mounting portion) that mounts the IC device 90, which is an electronic component, and inspects the electrical characteristics of the IC device 90. The inspection unit 16 has a concave portion (cavity) 161 in which the IC device 90 is housed and placed, and a plurality of probe pins (mounting portion side terminals) 162 are provided at the bottom of the concave portion 161 (see, for example, FIG. 14). Also, terminal 902 of IC device 90 is electrically conductively coupled to probe pin 162. That is, the inspection of the IC device 90 can be performed by contact. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 16. Further, the shape of the upper end portion of the probe pin 162 is adapted to the shape of the terminal 902. In the present embodiment, it is in the shape of a crown suitable for the hemispherical terminal 902 (see, for example, FIG. 14). Such an inspection portion 16 can heat or cool the IC device 90 in the same manner as the temperature adjustment portion 12, and adjust the IC device 90 to a temperature suitable for inspection. The device recovery area A4 is recovered in the area of the plurality of IC devices 90 in which the inspection area A3 is inspected and the inspection is completed. In the device collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. Further, a device recovery unit 18 that moves across the inspection area A3 and the device recovery area A4 is also provided. Further, an empty tray 200 is also provided in the device recovery area A4. The device recovery unit 18 is an IC device 90 that is placed in the inspection unit 16 to perform inspection, and can transport the IC device 90 to the mounting portion of the device recovery area A4, which is called a “recycling shuttle plate” or simply "Recycling shuttle". The device recovery unit 18 may be a part of the transport unit 25. Moreover, the device recovery portion 18 can be in the X direction, that is, the arrow α between the inspection region A3 and the device recovery region A4.  18The direction is supported reciprocally. In the configuration shown in FIG. 2, the device recovery unit 18 is arranged in the Y direction in the same manner as the device supply unit 14, and the device recovery unit 18 on the negative side in the Y direction is referred to as a "device recovery unit 18A". The device recovery unit 18 on the positive side in the Y direction is referred to as a "device recovery unit 18B." The IC device 90 on the inspection unit 16 is transported and placed on the device recovery unit 18A or the device recovery unit 18B. The transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is performed by the device transfer head 17A, and the transfer from the inspection unit 16 to the device recovery unit 18B is performed by the device transfer head 17B. Further, the device recovery unit 18 is grounded in the same manner as the temperature adjustment unit 12 and the device supply unit 14. The recovery tray 19 is placed on the mounting portion of the IC device 90 that is placed in the inspection unit 16 and is fixed so as not to move in the device recovery region A4. As a result, even in the collection area A4 in which a plurality of movable portions such as the device transfer head 20 are disposed, the inspected IC device 90 is stably placed on the recovery tray 19. Further, in the configuration shown in Fig. 2, three collection trays 19 are arranged in the X direction. Further, the empty trays 200 are also arranged in three in the X direction. The empty tray 200 is also a mounting portion for the IC device 90 that is placed in the inspection unit 16 to be inspected. Then, the IC device 90 moved to the device recovery unit 18 of the device collection area A4 is transported and placed on either of the collection tray 19 and the empty tray 200. Thereby, the IC device 90 is classified and recovered based on the inspection result. The device transfer head 20 has a portion that can be supported in the device recovery region A4 so as to be movable in the X direction and the Y direction, and further movable in the Z direction. The device transport head 20 is a part of the transport unit 25, and the IC device 90 can be transported from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In addition, in FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α.  20XIndicates that the movement of the device in the Y direction of the head 20 is indicated by an arrow α.  20YSaid. The tray transport mechanism 21 is an empty tray 200 loaded from the tray removal area A5 in the device recovery area A4 in the X direction, that is, an arrow α.  twenty oneThe mechanism of the direction of transportation. Further, after the transfer, the empty tray 200 is disposed at a position where the IC device 90 is collected, that is, any of the above three empty trays 200. The tray removal area A5 is a material removal unit that collects and removes the tray 200 in which a plurality of IC devices 90 in the inspection state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked. Further, the tray transport mechanism 22A and the tray transport mechanism 22B are transported one by one in the Y-direction transport tray 200 so as to span the device recovery area A4 and the tray removal area A5. The tray transport mechanism 22A is a part of the transport unit 25, and the tray 200 can be in the Y direction, that is, the arrow α.  22AA moving portion that reciprocates in the direction. Thereby, the inspected IC device 90 can be transferred from the device recovery area A4 to the tray removal area A5. Moreover, the tray transport mechanism 22B can use the arrow α of the empty tray 200 for recovering the IC device 90 on the positive side in the Y direction.  22BMove in direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4. The control unit 800 can control, for example, the following operations: the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, and the device transport head 17, The device recovery unit 18, the device transfer head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B. The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed on the upper portion of the front side of the electronic component inspection device 1. As shown in Fig. 1, on the right side of the drawing of the tray removing area A5, a mouse table 600 for placing a mouse is provided. This mouse is used when operating the screen displayed on the monitor 300. Further, in the lower right of FIG. 1, an operation panel 700 is disposed on the monitor 300. The operation panel 700 is separated from the monitor 300, and instructs the electronic component inspection apparatus 1 to the desired author. Further, the signal lamp 400 can notify the operating state of the electronic component inspection device 1 or the like by a combination of illuminating colors. The signal lamp 400 is disposed on the upper portion of the electronic component inspection device 1. Further, the electronic component inspection device 1 incorporates a speaker 500, and the speaker 500 can be used to notify the operation state of the electronic component inspection device 1 and the like. The electronic component inspection apparatus 1 separates the tray supply region A1 and the component supply region A2 by the first separator 231, and separates the device supply region A2 from the inspection region A3 by the second separator 232, and is separated by the third separator 233. Between the inspection area A3 and the device recovery area A4, the fourth separator 234 separates the device recovery area A4 from the tray removal area A5. Further, the device supply region A2 and the device recovery region A4 are also separated by the fifth spacer 235. The outermost part of the electronic component inspection device 1 is covered by a cover, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245. However, with the miniaturization of the IC device 90 in recent years, the terminals 902 of the IC device 90 are also narrowed from each other, and as a result, the terminal 902 is difficult to be attached to the probe pin 162 of the inspection portion 16 which should be in contact with the terminal 902. Contact, and there is no way to check the correct value. Therefore, the electronic component inspection apparatus 1 is configured to prevent such a defect. Hereinafter, the configuration and operation will be described. As shown in FIG. 3, the device transfer head 17 has at least one hand unit 9 (holding portion). The hand unit 9 is an IC device 90 (electronic component) on the holding device supply unit 14 and is transported to the inspection unit 16. In addition, the number of configurations of the hand unit 9 is not particularly limited. The hand unit 9 has a base portion 94, a first moving portion 95 supported by the base portion 94, and reciprocally movable in the X direction with respect to the base portion 94. The second moving portion 96 is supported by the first moving portion 95 and is relatively movable. The first moving portion 95 reciprocates in the Y direction; the rotating portion (rotating portion) 97 is supported by the second moving portion 96 and is rotatable (rotated) about the Z axis with respect to the second moving portion 96; 99 is provided in the rotating portion 97; the holding portion 98 is fixed to the rotating shaft 99; the first piezoelectric actuator 911 moves the first moving portion 95 relative to the base portion 94; the second piezoelectric actuator 912, which moves the second moving portion 96 to the first moving portion 95, and a third piezoelectric actuator (piezoelectric actuator for the rotating portion) 913 that moves the rotating portion 97 with respect to the second movement The part 96 is rotated. The base portion 94 has a plate-like plate portion 941 having a thickness in the Z direction, and a fastening portion 942 and a fastening portion 943 which are disposed on the lower surface of the plate portion 941 and used for the first The moving unit 95 guides in the X direction. Each of the engaging portion 942 and the engaging portion 943 extends in the X direction and is separated from each other in the Y direction. The configuration of the engaging portion 942 and the engaging portion 943 is not particularly limited. However, in the present embodiment, each of the guide rails 952 and the guide rails 953 which are described later has a groove which is open in the longitudinal direction. In other words, the engaging portion 942 and the engaging portion 943 are formed of an elongated portion having a long groove opened at the lower side in FIG. Further, the base portion 94 extends from the plate-like portion 941 toward the negative side in the Z direction, and has an abutting portion 947 that abuts against the first piezoelectric actuator 911. The abutting portion 947 extends to the second moving portion 96 and is disposed to be aligned with respect to the first moving portion 95 and the second moving portion 96 in the Y direction. Further, the lower surface 947a of the contact portion 947 extends in the X direction, and the convex portion 911a (upper end portion) of the first piezoelectric actuator 911 abuts against the lower surface 947a. It is preferable to perform a treatment for improving the frictional resistance with the convex portion 911a on the surface of the lower surface 947a, or to form a high friction layer. The first moving portion 95 has a base portion 951, a guide rail 952 that is provided on the base portion 951 and that is engaged with the engaging portion 942 of the base portion 94, and a guide rail 953 that is provided on the base portion 951 and that is engaged with the engaging portion 943 of the base portion 94. Thereby, the movement of the first moving portion 95 other than the X direction is restricted, and the first moving portion 95 is smoothly and surely moved in the X direction. Further, the first moving portion 95 has a first fixing portion 954 that extends from the base portion 951 toward the negative side in the Z direction and that fixes the first piezoelectric actuator 911. The first fixing portion 954 has a plate shape extending in the XZ plane and having a thickness in the Y direction, and is provided to be aligned with respect to the second moving portion 96 (base portion 961) in the Y direction. Further, the first piezoelectric actuator 911 is fixed to the surface of the first fixing portion 954. The first piezoelectric actuator 911 has a plate shape and is fixed to the first fixing portion 954 so as to have a thickness in the Y direction. By disposing the first piezoelectric actuator 911 in this way, it is possible to suppress excessive protrusion of the first piezoelectric actuator 911 to the outside, and it is possible to reduce the size of the hand unit 9. Further, the first moving portion 95 has a second fixing portion (not shown) that extends from the base portion 951 toward the negative side in the Z direction and that is fixed to the second piezoelectric actuator 912. The second fixing portion has a plate shape that is expanded in the YZ plane and has a thickness in the X direction, and is provided in the X direction with respect to the second moving portion 96 (base portion 961). Further, a second piezoelectric actuator 912 is fixed to the back surface of the second fixing portion. The second piezoelectric actuator 912 has a plate shape and is fixed to the second fixing portion so as to have a thickness in the X direction. By arranging the second piezoelectric actuator 912 in this manner, the second piezoelectric actuator 912 can be prevented from protruding outward, and the size of the hand unit 9 can be reduced. Further, the upper end portion of the second piezoelectric actuator 912 abuts against the second moving portion 96 from the lower side. Further, the first moving portion 95 has a fastening portion (guide portion) 956 for guiding the second moving portion 96 in the Y direction. The fastening portion 956 extends in the Y direction. The configuration of the engaging portion 956 is not particularly limited, but in the present embodiment, the groove is opened in the longitudinal direction of the guide rail 963 which will be described later. In other words, the engaging portion 956 is constituted by an elongated portion having a long groove opened at the lower side in FIG. The second moving portion 96 has a columnar base portion 961 and a guide rail 963 that is provided on the base portion 961 and that is engaged with the engaging portion 956 of the first moving portion 95. Thereby, the movement of the second moving unit 96 in the Y direction is restricted, and the second moving unit 96 is smoothly and surely moved in the Y direction. Further, a surface 961a that is recessed from the other portion is formed in the base portion 961 of the second moving portion 96, and a third piezoelectric actuator 913 for rotating the swirling portion 97 is fixed to the surface 961a. The surface 961a is composed of a YZ plane, and the plate-shaped third piezoelectric actuator 913 is fixed to the surface 961a so as to have a thickness in the X direction. By arranging the third piezoelectric actuator 913 in this way, it is possible to suppress excessive protrusion of the third piezoelectric actuator 913 to the outside, and it is possible to reduce the size of the hand unit 9. In the hand unit 9, the first moving unit 95 and the second moving unit 96 configured as described above constitute a position adjusting mechanism 92. The position adjustment mechanism 92 moves the IC device 90 (electronic component) held by the holding portion 98 in a direction orthogonal to the Z direction (vertical direction), that is, in the X direction and the Y direction. The movement in the X direction is performed by the first moving unit 95, and the movement in the Y direction is performed by the second moving unit 96. Thereby, even in the device transfer head 17 which is supported by the reciprocating movement in the Y direction and the Z direction, the positions of the IC device 90 in the X direction and the Y direction can be individually finely adjusted. The swirling portion 97 is located below the second moving portion 96 (negative side in the Z direction). The swirling portion 97 has a tubular support portion 971 that is fixed to the lower end of the base portion 961 of the second moving portion 96. A rotating body (not shown) that is provided coaxially with the support portion 971 and that is inserted into the rotating shaft 99 is disposed inside the support portion 971, or the rotating body can be rotatably supported with respect to the support portion 971. Bearings (not shown), etc. Further, in the above-described rotating body, the convex portion 913a of the third piezoelectric actuator 913 is abutted at a position eccentric from the rotation axis. Further, the above-described rotating body is rotated with respect to the support portion 971 (second moving portion 96) by the driving of the third piezoelectric actuator 913. In the hand unit 9, the posture adjusting mechanism 93 is constituted by the turning portion 97 configured as described above. The posture adjustment mechanism 93 rotates the IC device 90 (electronic component) held by the holding portion 98 around the Z axis (vertical axis). Thereby, even in the device transfer head 17 which is supported by the reciprocating movement in the Y direction and the Z direction, the posture of the IC device 90, that is, the direction around the Z axis, can be independently adjusted. In this manner, the hand unit 9 (holding portion) has a position adjusting mechanism 92 that adjusts the position of the IC device 90 (electronic component), and a posture adjusting mechanism 93 that adjusts the posture of the IC device 90 (electronic component). As a result, when the IC device 90 is placed on the inspection unit 16 as will be described later, both the position and the posture of the IC device 90 can be appropriately adjusted as needed, and therefore, the placement can be performed accurately. The rotating shaft 99 extends to the plate portion 941 of the base portion 94. A profile mechanism (cis-shaped mechanism) 948 is built in the base portion 94. The rotating shaft 99 is coupled to the contouring mechanism 948. Thereby, the posture of the rotating shaft 99 can be contoured by the external force of the rotating shaft 99. At the lower end of the rotating shaft 99, a holding portion 98 for holding the IC device 90 is disposed. The holding portion 98 is supported by the turning portion 97 via the rotating shaft 99, and is rotatable integrally with the second moving portion 96 with the above-described rotating body. Further, the holding portion 98 has an adsorption surface 981 that faces the IC device 90, an adsorption hole 982 that is open to the adsorption surface 981, and a pressure reducing pump 983 that decompresses the adsorption hole 982. When the adsorption surface 981 is brought into contact with the IC device 90 so as to cover the adsorption hole 982, the IC device 90 can be adsorbed and held on the adsorption surface 981 by depressurizing the adsorption hole 982 by the pressure reducing pump 983. Conversely, if the decompression pump 983 is stopped and the adsorption hole 982 is released, the IC device 90 can be released. As the first piezoelectric actuator 911, the second piezoelectric actuator 912, and the third piezoelectric actuator 913, for example, a piezoelectric element having a short strip shape can be used. The piezoelectric element expands and contracts in the longitudinal direction thereof by applying an alternating voltage. Further, the first moving portion 95 can be moved relative to the base portion 94 by the expansion and contraction operation, or the second moving portion 96 can be moved relative to the first moving portion 95, or the rotating portion 97 can be rotated with respect to the second moving portion 96. . Further, the constituent material of the piezoelectric element is not particularly limited, but lead zirconate titanate (PZT), quartz, lithium niobate, barium titanate, lead titanate, lead metasilicate, polyvinylidene fluoride, zinc may be used. Lead citrate, lead citrate and other various types. Further, the hand unit 9 (holding portion) can hold and transport the test piece 8 in addition to the IC device 90 (electronic component) (see FIGS. 4 to 7). The test piece 8 is pressed to the reference probe pin 162a (contact mark forming portion) of the inspection portion 16 to be described later in a state of being held by the hand unit 9, and the contact mark 821 is formed. The contact mark 821 is used for position correction or posture correction of the IC device 90 when the IC device 90 is transported from the device supply unit 14 to the inspection unit 16 and placed on the inspection unit 16. The test piece 8 has a member which can be discolored or deformed by imparting force. In the present embodiment, the test piece 8 is a member having discoloration by imparting force, and as shown in FIGS. 4 to 7, for example, a substrate 81 having a sheet shape and dispersed on the substrate 81 are dispersed. A microcapsule layer 82 having microcapsules is formed. The microcapsule layer is an in-package developer. In addition, the "force" is a reaction force from the reference probe pin 162a (contact mark forming portion) which is generated when the test piece 8 is pressed against the reference probe pin 162a (contact mark forming portion). Further, the microcapsules are crushed by the reaction force to release the internal developer, so that one of the microcapsule layers 82 is partially discolored. Thereby, the portion which is discolored becomes the contact mark 821 (refer to FIG. 5). The contact mark 821 can be quickly formed by using the test piece 8 of such a configuration. As shown in FIGS. 4 to 14, the imaging unit 26 is disposed and fixed in the inspection area A3. The imaging unit 26 is located between the inspection unit 16 and the device supply unit 14 that is stopped in the inspection area A3. As described above, the device supply unit 14 has the device supply unit 14A and the device supply unit 14B. Therefore, the imaging unit 26 is located between the inspection unit 16 and the device supply unit 14A, and between the inspection unit 16 and the device supply unit 14B. Hereinafter, the imaging unit 26 on the device supply unit 14A side will be representatively described. The imaging unit 26 is configured by various cameras such as a CCD (Charge Coupled Devices) camera or a three-dimensional camera. The imaging unit 26 can image the IC device 90 (see FIG. 11) or the test piece 8 (see FIG. 7) held by the hand unit 9 (holding portion) with the imaging direction facing upward. In the order of the imaging (timing), the imaging unit 26 first captures the test piece 8 after the test piece 8 is held by the hand unit 9 (holding portion) and is brought into contact with the reference probe pin 162a (contact mark forming portion). The first image IM  1. Next, take the first image IM  1After that, the imaging unit 26 captures the second image IM of the IC device 90 (electronic component) held by the hand unit 9 (holding portion).  2. As shown in Figure 15, in the first image IM  1Image containing the abutment mark 821, in the second image IM  2An image of terminal 902 of IC device 90 (electronic component) is included. As described above, the inspection unit 16 (electronic component mounting unit) is a person who mounts and inspects the IC device 90 (electronic component). The inspection unit 16 (electronic component mounting unit) has a plurality of probe pins (mounting portion side terminals) 162 that can be electrically connected to the IC device 90 (electronic component). Further, at least one of the plurality of probe pin (mounting portion side terminals) 162 (the leftmost side of the present embodiment as an example) is mounted on the probe pin (positioned on the leftmost side of FIG. 4 to FIG. 14) The portion-side terminal 162 is formed as a reference probe pin (mounting portion side reference terminal) 162a in which the test piece 8 forms the abutment mark forming portion of the contact mark 821. In this way, the contact mark forming portion is composed of at least one probe pin (mounting portion side terminal) 162 of the plurality of probe pins (mounting portion side terminals) 162, that is, the reference probe in the present embodiment. A pin (mounting part side reference terminal) 162a is formed. Thereby, the contact mark forming portion can be omitted except for the probe pin 162. Therefore, the configuration of the inspection portion 16 can be simplified. On the other hand, in the IC device 90, the terminal 902 which is electrically conductively connectable to the reference probe pin 162a among the plurality of terminals 902 is referred to as a reference terminal (electronic component side reference terminal) 902a. Next, in the inspection area A3, the hand unit 9 (the device transfer head 17A) transports the IC device 90 to the inspection unit 16 until it is in a state in which the IC device 90 can be inspected (an example), and FIGS. 4 to 15 are referred to. Be explained. As shown in FIG. 4, it is assumed that the hand unit 9 holds the test piece 8. Moreover, the position of the hand unit 9 is a state in which the test piece 8 faces the concave portion 161 directly above the concave portion 161 of the inspection portion 16. Next, as shown in FIG. 5, the hand unit 9 is lowered until the microcapsule layer 82 of the test piece 8 is pressed against the probe pin 162. Thereby, a plurality of abutting marks 821 are formed on the microcapsule layer 82. Next, as shown in FIG. 6, the hand unit 9 is raised to the same height as the hand unit 9 in FIG. Moreover, in FIG. 6, the rising direction and the rising amount of the hand unit 9 at this time are indicated by an arrow α.  9ZSaid. Next, as shown in FIG. 7, the hand unit 9 is moved toward the negative side in the Y direction, that is, on the side of the device supply portion 14A, and is temporarily stopped in the middle. The stop position of the hand unit 9 is such that the test piece 8 is directly above the imaging unit 26, and the position of the test piece 8 can be imaged by the imaging unit 26. Next, the imaging unit 26 is activated at this position, thereby obtaining the first image IM.  1(Refer to Figure 15). From the first image IM  1The center of the abutment mark 821 (hereinafter referred to as "reference abutment mark 821a") formed by the reference probe pin 162a is detected.  821a. This detection is performed by the control unit 800. Further, in FIG. 7, the moving direction and the amount of movement before the hand unit 9 is stopped are indicated by an arrow α.  9YSaid. Next, as shown in FIG. 8, the hand unit 9 is further moved toward the negative side in the Y direction, that is, on the side of the device supply portion 14A, and is stopped right above the device supply portion 14A. Subsequently, the test piece 8 is removed from the hand unit 9. Next, as shown in FIG. 9, the hand unit 9 is lowered until the hand unit 9 abuts against the IC device 90 placed on the device supply portion 14A. Thereby, the IC device 90 can be held by the hand unit 9. Next, as shown in FIG. 10, the hand unit 9 is raised to the same height as the hand unit 9 in FIG. Next, as shown in FIG. 11, the hand unit 9 is moved toward the positive side in the Y direction, that is, on the side of the inspection unit 16, and is temporarily stopped in the middle. The stop position of the hand unit 9 is such that the IC device 90 is directly above the imaging unit 26, and the position of the IC device 90 can be captured by the imaging unit 26. Next, the imaging unit 26 is activated at this position, thereby obtaining the second image IM.  2(Refer to Figure 15). From the second image IM  2The center of the reference terminal 902a is detected.  902a. This detection is performed by the control unit 800. As described above, in the first image IM  1Image containing the abutment mark 821, in the second image IM  2An image of the terminal 902 of the IC device 90 (electronic component) is included (refer to FIG. 15). Thereby, the first image IM can be  1With the second image IM  2Synthesize on the common coordinate axis (arrow C1) to obtain a composite image IM  3. Further, as described above, the inspection unit 16 (electronic component mounting portion) has a plurality of probe pins (mounting portion side terminals) 162. In addition, the inspection unit 16 (electronic component mounting unit) sets at least one of the plurality of probe pins (mounting portion side terminals) 162 of the plurality of probe pins (mounting portion side terminals) 162 The reference probe pin (mounting portion side reference terminal) 162a of the trace forming portion. Further, the IC device 90 (electronic component) has a reference terminal (electronic component side reference terminal) 902a that can be electrically connected to the reference probe pin (mounting portion side reference terminal) 162a. Self-synthesis image IM  3The center of the reference terminal 902a is detected.  902aRelative to the center of the reference abutment mark 821a  821aThe offset ΔY. This detection is also performed by the control unit 800. Next, if the IC device 90 is moved by the offset amount ΔY by appropriately operating the position adjusting mechanism 92 or the posture adjusting mechanism 93 of the hand unit 9, the center O can be made.  821aAnd center O  902aConsistent, even if it is consistent. Thus, the hand unit 9 (holding portion) can make the second image IM  2Center of the reference terminal (electronic component side reference terminal) 902a  902a(location) with the first image IM  1The center of the reference abutment mark 821a formed by the reference probe pin (mounting portion side reference terminal) 162a  821aAt least one of the position and posture of the IC device 90 (electronic component) is adjusted so that (the position of the contact mark 821) coincides (coincident) (hereinafter, this adjustment is referred to as "correction"). In the present embodiment, the position of the IC device 90 is adjusted by the operation of the position adjusting mechanism 92 of the hand unit 9, and the adjusted state is shown in FIG. Next, as shown in FIG. 13, the hand unit 9 is further moved toward the positive side in the Y direction, that is, on the side of the inspection unit 16, and is stopped right above the inspection unit 16. In FIG. 13, the moving direction and the amount of movement before stopping the hand unit 9 are indicated by an arrow β.  9YSaid. Arrow β  9YIts direction and arrow α  9YOn the contrary, the amount of movement and the arrow α  9YThe amount of movement is the same. Next, as shown in FIG. 14, the hand unit 9 is lowered. In FIG. 14, the falling direction and the falling amount of the hand unit 9 at this time are indicated by an arrow β.  9ZSaid. Arrow β  9ZIts direction and arrow α  9ZOn the contrary, the amount of decline and the arrow α  9ZThe amount of rise is the same. Therefore, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are electrically connected to each other, and the remaining terminals 902 are also electrically connected to the probe pin 162. Therefore, The IC device 90 performs an inspection. Further, in the present embodiment, when the above correction is omitted, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are not brought into contact with each other, and as a result, the IC device 90 cannot be inspected. . As described above, in the electronic component inspection apparatus 1 (electronic component conveying apparatus 10), when the IC device 90 is placed on the inspection unit 16, the hand unit 9 (holding portion) can be based on the imaging unit before the placement 26 shots of the first image IM  1With the second image IM  2At least one of the position and posture of the IC device 90 (electronic component) with respect to the inspection portion 16 (electronic component mounting portion) is adjusted. With this adjustment, the IC device 90 is placed in a position or posture suitable for being placed on the inspection portion 16, and therefore, after being placed on the inspection portion 16, each terminal 902 and each probe pin 162 can be electrically and accurately connection. Further, while the IC device 90 is placed on the inspection unit 16, an image obtained by adjusting the position or posture of the IC device 90 is obtained by using one imaging unit 26 (first image IM)  1And the second image IM  2). Thus, various adjustments can be made using a simple configuration of one imaging unit 26. In addition, in order to make the reference abutment mark 821a center O  821aCenter with reference terminal 902a  902aIn the present embodiment, the position of the IC device 90 in the Y direction is adjusted, but the present invention is not limited thereto. There is also an IC device 90 held by the hand unit 9, for example, adjusting the position of the IC device 90 in the X direction, or adjusting the posture of the IC device 90 around the Z axis, or appropriately combining the position adjustment in the X direction, and the Y direction. Position adjustment, adjustment of the posture around the Z axis. Further, a plurality of reference contact marks 821a or a plurality of reference terminals 902a may be set for the various adjustments described above. <Second Embodiment> A second embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 16 and 17, but the differences from the above-described embodiments will be mainly described. The matter is omitted from the description. This embodiment is the same as the above-described first embodiment except that the configuration of the contact mark forming portion is different. As described in the first embodiment, the inspection unit 16 (electronic component mounting unit) has a plurality of probe pins (mounting portion side terminals) 162 that can be electrically connected to the IC device 90 (electronic component). As shown in FIG. 16 and FIG. 17, in the present embodiment, the contact mark forming portion is constituted by a lead member 163 (portion) different from the probe pin (mounting portion side terminal) 162. Thereby, for example, the lead member 163 (contact mark forming portion) can be formed to be more likely to form the abutting mark 821 than the probe pin 162. The lead member 163 is not particularly limited. However, for example, a hard resin material which is harder than the probe lead 162 can be used, and the shape of the upper end 163a is more suitable for forming the upper end of the probe pin 162. Contact 821 and so on. Further, as the hard resin material, for example, an acrylic resin is exemplified. Further, the shape of the upper end 163a can be, for example, a shape having a roundness. Further, the arrangement position of the lead member 163 is not limited to the position shown in FIG. 16 or FIG. Also, the lead member 163 may be made of a metal material. In this case, it is preferable that the lead member 163 form an insulating film. <Third Embodiment> A third embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 18 and 19, but the description will be focused on differences from the above-described embodiments, and the same description will be given. The matter is omitted from the description. In the present embodiment, the configuration of the test piece is the same as that of the first embodiment except that the configuration of the contact mark forming portion is different. As shown in Figs. 18 and 19, in the present embodiment, the test piece 8 is a small piece made of, for example, a hard resin material. In addition, when the contact mark forming portion is in contact with the test piece 8, the test piece 8 is provided with a mark providing portion 164 of a mark 83 (see FIG. 19), for example. Marker 83 is an abutment mark. With such a configuration, it is possible to use a single layer as the test piece 8 and to simplify the configuration of the test piece 8. (Fourth Embodiment) A fourth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 20 to 22, but the differences from the above-described embodiments will be mainly described. The matter is omitted from the description. This embodiment is the same as the above-described first embodiment except for the configuration of the test piece. As described in the first embodiment, the test piece 8 has a member that can be discolored or deformed by imparting force. As shown in FIG. 20 to FIG. 22, in the present embodiment, the test piece 8 is a member which can be deformed by a given force, and has, for example, a base material 81 having a sheet shape and formed on the base material 81. A clay layer 84 made of clay is molded. The clay for molding is not particularly limited, and for example, oily clay or waxy clay can be used. Thereby, when the clay layer 84 receives a reaction force from the reference probe pin 162a (abutment mark forming portion), the portion is plastically deformed. Thereby, the portion after the plastic deformation is the abutment mark 841 (FIG. 21, FIG. 22). The contact mark 841 can be quickly formed by using the test piece 8 having such a configuration. Further, a particulate abrasive material can be kneaded in the clay layer 84. Thereby, when the contact layer 841 is formed on the clay layer 84, the probe pin 162 (reference probe pin 162a) can be polished by the abrasive to cut off the dirt adhering to the probe pin 162. Further, the test piece 8 is plastically deformed in the present embodiment, but is not limited thereto, and may be an elastic deformer. In this case, the material to be elastically deformed is not particularly limited, and for example, a low rebound material such as urethane rubber is preferable, whereby the contact mark can be maintained. (Fifth Embodiment) Hereinafter, a fifth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to Figs. 23 to 30, but the differences from the above-described embodiments will be mainly described. The matter is omitted from the description. This embodiment is the same as the above-described first embodiment except that the position and posture of the IC device when the IC device is placed on the inspection portion are different. As shown in FIG. 23 to FIG. 29, in the present embodiment, the inspection portion 16 has a guide pin 165 that protrudes upward and a guide pin 166 that protrudes upward like the guide pin 165. The guide pin 165 and the guide pin 166 are disposed via the recess 161. An imaging unit (second imaging unit) 27 is disposed above the inspection unit 16 . Similarly to the imaging unit 26, the imaging unit 27 is configured by various cameras such as a CCD (Charge Coupled Devices) camera or a three-dimensional camera. The imaging unit 27 is configured such that the imaging direction thereof is downward and the imaging unit 16 can be imaged. Thereby, the inspection unit image IM can be obtained  4(Refer to Figure 30). Further, the device transfer head 17A (device transfer head 17) has a guide 171. The guide plate 171 is coupled to the base portion 94 of the hand unit 9, for example. The large opening portion 172, the guide hole 173, and the guide hole 174 are formed in the guide plate 171. A holding portion 98 of the hand unit 9 is disposed inside the large opening portion 172. The large opening portion 172 is sufficiently large that the holding portion 98 does not interfere with the holding portion 98 even if the holding portion 98 is displaced by the operation of the position adjusting mechanism 92 or the posture adjusting mechanism 93. The guide hole 173 is a portion to which the guide pin 165 of the inspection portion 16 is fitted, and the guide hole 174 is a portion to which the guide pin 166 is fitted (see Fig. 29). Next, in the inspection area A3, the hand unit 9 (the device transfer head 17A) transports the IC device 90 to the inspection unit 16 until an operation (an example) in which the IC device 90 can be inspected is described. As shown in FIG. 23, the hand unit 9 is in a state in which the IC device 90 has not been held, and is located directly above the device supply portion 14A. Next, in this state, by operating the imaging unit 27, the inspection unit image IM can be obtained.  4. Self-inspection image IM  4Detecting the center of the reference probe pin 162a  162aAnd the center of the guide 165  165(Refer to Figure 30). In this way, the center O is detected.  162aAnd center O  165Positional relationship  162aRelative to the center O  165Where is it located. Further, each detection is performed by the control unit 800. Next, as shown in FIG. 24, the hand unit 9 is lowered until the hand unit 9 comes into contact with the IC device 90 placed on the device supply portion 14A. Thereby, the IC device 90 can be held by the hand unit 9. Next, as shown in FIG. 25, the hand unit 9 is raised to the same height as the hand unit 9 in FIG. Next, as shown in FIG. 26, the hand unit 9 is moved toward the positive side in the Y direction, that is, on the side of the inspection unit 16, and is temporarily stopped in the middle. The stop position of the hand unit 9 is such that the IC device 90 is directly above the imaging unit 26, and the position of the IC device 90 can be captured by the imaging unit 26. Next, the imaging unit 26 is activated at this position, thereby obtaining the device image IM.  5(Refer to Figure 30). Self device image IM  5The center of the reference terminal 902a is detected.  902aAnd the center of the guide hole 173 O  173(Refer to Figure 30). In this way, the center O is detected.  902 aAnd center O  173Positional relationship  902 aRelative to the center O  173Where is it located. Further, each detection is performed by the control unit 800. Next, compare the inspection unit image IM  4And device image IM  5(arrow C2) with device image IM  5Center of O  902aAnd center O  173The positional relationship becomes the image of the inspection unit IM  4Center of O  162aAnd center O  165At least one of the position and orientation of the IC device 90 is adjusted in such a manner that the positional relationship is equivalent to the positional relationship. In the present embodiment, the position of the IC device 90 is adjusted by the operation of the position adjusting mechanism 92 of the hand unit 9, and the adjusted state is shown in FIG. Again, the device image IM in Figure 30  5'A hypothetical image assumed for the state after the adjustment (arrow C3). Next, as shown in FIG. 28, the hand unit 9 is further moved toward the positive side in the Y direction, that is, on the side of the inspection unit 16, and is stopped right above the inspection unit 16. Next, as shown in FIG. 29, the hand unit 9 is lowered. Therefore, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are electrically connected to each other, and the remaining terminals 902 are also electrically connected to the probe pin 162. Therefore, The IC device 90 performs an inspection. Further, in the present embodiment, when the adjustment is omitted, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are not brought into contact with each other, and as a result, the IC device 90 cannot be inspected. . In the above, the embodiment of the electronic component conveying device and the electronic component inspection device of the present invention has been described. However, the present invention is not limited thereto, and the components constituting the electronic component conveying device and the electronic component inspection device can be replaced with each other. Any constitutive component of the same function. Further, any constituent may be added. Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be formed by combining any two or more of the above-described configurations (features). Further, the imaging unit is fixed in the examination region, but is not limited thereto. For example, the imaging unit may be moved together with the device supply unit. Further, in the case of the position adjustment or the posture adjustment of the IC device, the adjustment is performed on the test piece in the above-described embodiments, but the adjustment is not limited thereto, and an offset may be formed on the IC device (electronic component). And make this adjustment.  

1 電子零件檢查裝置 8 試驗片 9 手單元 10 電子零件搬送裝置 11A 托盤搬送機構 11B 托盤搬送機構 12 溫度調整部 13 器件搬送頭 14 器件供給部 14A 器件供給部 14B 器件供給部 15 托盤搬送機構 16 檢查部 17 器件搬送頭 17A 器件搬送頭 17B 器件搬送頭 18 器件回收部 18A 器件回收部 18B 器件回收部 19 回收用托盤 20 器件搬送頭 21 托盤搬送機構 22A 托盤搬送機構 22B 托盤搬送機構 25 搬送部 26 攝像部 27 攝像部(第2攝像部) 81 基材 82 微膠囊層 83 標記 84 黏土層 90 IC器件 92 位置調整機構 93 姿勢調整機構 94 基部 95 第1移動部 96 第2移動部 97 旋動部(旋轉部) 98 保持部 99 旋轉軸 141 凹部(凹穴) 161 凹部(凹穴) 162 探針引腳(載置部側端子) 162a 基準探針引腳(載置部側基準端子) 163 引腳構件 164 標記賦予部 165 導銷 166 導銷 171 導板 172 大開口部 173 導孔 174 導孔 200 托盤 231 第1隔板 232 第2隔板 233 第3隔板 234 第4隔板 235 第5隔板 241 前蓋 242 側蓋 243 側蓋 244 後蓋 245 頂蓋 300 監視器 301 顯示畫面 400 信號燈 500 揚聲器 600 滑鼠台 700 操作面板 800 控制部 821 抵接痕 821a 基準抵接痕 841 抵接痕 902 端子(電子零件側端子) 902a 基準端子(電子零件側基準端子) 911 第1壓電致動器 911a 凸部 912 第2壓電致動器 913 第3壓電致動器(旋動用壓電致動器) 913a 凸部 941 板狀部 942 扣合部 943 扣合部 947 抵接部 947a 下表面 948 仿形機構(順形機構) 951 基部 952 導軌 953 導軌 954 第1固定部 956 扣合部(引導部) 961 基部 961a 面 963 導軌 971 支持部 981 吸附面 982 吸附孔 983 減壓泵 A1 托盤供給區域 A2 器件供給區域 A3 檢查區域 A4 器件回收區域 A5 托盤去除區域 C1 箭頭 C2 箭頭 C3 箭頭 IM 1第1圖像 IM 2第2圖像 IM 3合成圖像 IM 4檢查部圖像 IM 5器件圖像 IM 5' 器件圖像 O 162a中心 O 173中心 O 821a中心 O 902a中心 α 9Y箭頭 α 9Z箭頭 α 11A箭頭 α 11B箭頭 α 13X箭頭 α 13Y箭頭 α 14箭頭 α 15箭頭 α 17Y箭頭 α 18箭頭 α 20X箭頭 α 20Y箭頭 α 21箭頭 α 22A箭頭 α 22B箭頭 α 90箭頭 β 9Y箭頭 β 9Z箭頭 ΔY 偏移量 X 方向 Y 方向 Z 方向 1 Electronic component inspection device 8 Test piece 9 Hand unit 10 Electronic component transport device 11A Pallet transport mechanism 11B Pallet transport mechanism 12 Temperature adjustment unit 13 Device transfer head 14 Device supply unit 14A Device supply unit 14B Device supply unit 15 Pallet transport mechanism 16 Check Part 17 Device transfer head 17A Device transfer head 17B Device transfer head 18 Device recovery unit 18A Device recovery unit 18B Device recovery unit 19 Recovery tray 20 Device transfer head 21 Pallet transport mechanism 22A Pallet transport mechanism 22B Pallet transport mechanism 25 Transport unit 26 Camera Part 27 Imaging unit (second imaging unit) 81 Substrate 82 Microcapsule layer 83 Marking 84 Clay layer 90 IC device 92 Position adjustment mechanism 93 Position adjustment mechanism 94 Base portion 95 First moving portion 96 Second moving portion 97 Rotating portion ( Rotating portion) 98 Holding portion 99 Rotating shaft 141 Concave portion (recess) 161 Concave portion (recess) 162 Probe pin (mounting side terminal) 162a Reference probe pin (mounting side reference terminal) 163 Pin Member 164 Marking portion 165 Guide pin 166 Guide pin 171 Guide plate 172 Large opening portion 173 Guide hole 174 Guide hole 200 Pallet 231 First partition 232 Second partition 233 Third partition 234 Fourth partition 235 Fifth partition 241 Front cover 242 Side cover 243 Side cover 244 Rear cover 245 Top cover 300 Monitor 301 Display screen 400 Signal light 500 Speaker 600 Mouse table 700 Operation panel 800 Control unit 821 Abutment mark 821a Reference abutment mark 841 Abutment mark 902 Terminal (Electronic component side terminal) 902a Reference terminal (electronic component side reference terminal) 911 First piezoelectric actuator 911a Projection portion 912 Second piezoelectric actuator 913 Third piezoelectric actuator (Piezo actuator for rotation) 913a convex portion 941 plate portion 942 fastening portion 943 fastening portion 947 abutment portion 947a lower surface 948 contouring mechanism (cis-shaped mechanism) 951 base portion 952 rail 953 rail 954 first fixing portion 956 fastening portion (guidance) 961 Base 961a Face 963 Rail 971 Support 981 Adsorption surface 982 Adsorption hole 983 Decompression pump A1 Pallet supply area A2 Device supply area A3 Inspection area A4 Device recovery area A5 Pallet removal area C1 Arrow C2 Arrow C3 Arrow IM 1 1 Image IM 2 second image IM 3 composite image IM 4 inspection portion image IM 5 device image IM 5 'device image O 162a center O 173 center O 821a center O 902a center α 9Y arrow α 9Z arrow α 11A Arrow α 11B arrow α 13X arrow α 13Y arrow α 14 arrow α 15 Arrow α 17Y arrow α 18 arrow α 20X arrow α 20Y arrow α 21 arrow α 22A arrow α 22B arrow α 90 arrow β 9Y arrow β 9Z arrow ΔY offset X direction Y direction Z direction

圖1係自正面側觀察本發明之電子零件檢查裝置之第1實施形態的概略立體圖。 圖2係顯示圖1所示之電子零件檢查裝置之動作狀態的概略俯視圖。 圖3係配置於圖1所示之電子零件檢查裝置之檢查區域之器件搬送頭的部分剖面側視圖。 圖4係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖5係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖6係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖7係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖8係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖9係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖10係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖11係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖12係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖13係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖14係依序顯示圖1所示之電子零件檢查裝置之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖15係於圖1所示之電子零件檢查裝置之檢查區域內拍攝之圖像的一例。 圖16係依序顯示本發明之電子零件檢查裝置(第2實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖17係依序顯示本發明之電子零件檢查裝置(第2實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖18係依序顯示本發明之電子零件檢查裝置(第3實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖19係依序顯示本發明之電子零件檢查裝置(第3實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖20係依序顯示本發明之電子零件檢查裝置(第4實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖21係依序顯示本發明之電子零件檢查裝置(第4實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖22係依序顯示本發明之電子零件檢查裝置(第4實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖23係依序顯示電子零件檢查裝置(第5實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖24係依序顯示電子零件檢查裝置(第5實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖25係依序顯示電子零件檢查裝置(第5實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖26係依序顯示電子零件檢查裝置(第5實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖27係依序顯示電子零件檢查裝置(第5實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖28係依序顯示電子零件檢查裝置(第5實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖29係依序顯示電子零件檢查裝置(第5實施形態)之檢查區域內之器件搬送頭之動作的部分剖面側視圖。 圖30係於電子零件檢查裝置(第5實施形態)之檢查區域內拍攝之圖像的一例。Fig. 1 is a schematic perspective view showing a first embodiment of the electronic component inspection device of the present invention as seen from the front side. Fig. 2 is a schematic plan view showing an operation state of the electronic component inspection device shown in Fig. 1. Fig. 3 is a partial cross-sectional side view showing the device transfer head disposed in the inspection region of the electronic component inspection device shown in Fig. 1. Fig. 4 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 5 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 6 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 7 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 8 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 9 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 10 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 11 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 12 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 13 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 14 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 15 is an example of an image taken in an inspection area of the electronic component inspection apparatus shown in Fig. 1. Fig. 16 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (second embodiment) of the present invention. Fig. 17 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (second embodiment) of the present invention. Fig. 18 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (third embodiment) of the present invention. Fig. 19 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (third embodiment) of the present invention. Fig. 20 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fourth embodiment) of the present invention. Fig. 21 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fourth embodiment) of the present invention. Fig. 22 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fourth embodiment) of the present invention. Fig. 23 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment) in order. Fig. 24 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 25 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 26 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 27 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 28 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 29 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 30 is an example of an image taken in an inspection area of the electronic component inspection device (fifth embodiment).

Claims (10)

一種電子零件搬送裝置,其特徵在於:其可配置供載置電子零件,且具有可於上述電子零件或試驗片形成抵接痕之抵接痕形成部的電子零件載置部,且具備: 固持部,其固持並搬送上述電子零件或上述試驗片,且可將上述電子零件或上述試驗片按壓至抵接痕形成部;及 攝像部,其可拍攝由上述固持部固持之上述電子零件或上述試驗片;且 上述攝像部拍攝上述固持部固持上述試驗片並使其抵接於上述抵接痕形成部後之上述試驗片之第1圖像、與拍攝上述第1圖像後拍攝固持於上述固持部之上述電子零件之第2圖像, 上述固持部可基於上述第1圖像與上述第2圖像,調整上述電子零件相對於上述電子零件載置部之位置及姿勢之至少一者。An electronic component transporting apparatus that is configured to mount an electronic component and has an electronic component mounting portion that can form an abutting mark forming portion of the contact portion of the electronic component or the test piece, and has: And holding the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component held by the holding portion or the And the imaging unit captures the first image of the test piece after the holding portion is held by the holding portion and is in contact with the contact mark forming portion, and the image is captured and held by the first image. In the second image of the electronic component of the holding portion, the holding portion adjusts at least one of a position and a posture of the electronic component with respect to the electronic component mounting portion based on the first image and the second image. 如請求項1之電子零件搬送裝置,其中上述電子零件載置部具有可與上述電子零件導電地連接之複數個載置部側端子,且 上述抵接痕形成部由上述複數個載置部側端子中之至少一個載置部側端子構成。The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting portion has a plurality of mounting portion side terminals electrically connectable to the electronic component, and the contact mark forming portion is provided by the plurality of mounting portion sides At least one of the terminals is configured to be a terminal on the mounting side. 如請求項1之電子零件搬送裝置,其中上述電子零件載置部具有可與上述電子零件導電地連接之複數個載置部側端子,且 上述抵接痕形成部由與上述載置部側端子不同之部分構成。The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting portion has a plurality of mounting portion side terminals that are electrically connectable to the electronic component, and the contact mark forming portion is connected to the mounting portion side terminal Different parts are formed. 如請求項1之電子零件搬送裝置,其中於上述第1圖像包含有上述抵接痕之圖像,於上述第2圖像包含有上述電子零件之端子之圖像。The electronic component transporting apparatus of claim 1, wherein the first image includes an image of the abutting mark, and the second image includes an image of a terminal of the electronic component. 如請求項4之電子零件搬送裝置,其中上述電子零件載置部具有複數個載置部側端子,且將上述複數個載置部側端子中之至少一個載置部側端子設為成上述抵接痕形成部之載置部側基準端子, 上述電子零件具有可與上述載置部側基準端子導電地連接之電子零件側基準端子, 上述固持部以使上述第2圖像中之上述電子零件側基準端子之位置與上述第1圖像中之上述載置部側基準端子形成之上述抵接痕之位置合致之方式調整上述電子零件之位置或姿勢之至少一者。The electronic component mounting device according to claim 4, wherein the electronic component mounting portion has a plurality of mounting portion side terminals, and at least one of the plurality of mounting portion side terminals is set to be The mounting portion side reference terminal of the contact forming portion, the electronic component having an electronic component side reference terminal electrically connectable to the mounting portion side reference terminal, wherein the holding portion causes the electronic component in the second image At least one of the position and the posture of the electronic component is adjusted such that the position of the side reference terminal coincides with the position of the contact mark formed by the mounting portion side reference terminal in the first image. 如請求項1之電子零件搬送裝置,其中上述固持部具有:位置調整機構,其調整上述電子零件之位置;及姿勢調整機構,其調整上述電子零件之姿勢。The electronic component transporting apparatus of claim 1, wherein the holding portion has a position adjusting mechanism that adjusts a position of the electronic component, and a posture adjusting mechanism that adjusts a posture of the electronic component. 如請求項6之電子零件搬送裝置,其中上述位置調整機構為使上述電子零件於與鉛直方向正交之方向移動者。The electronic component transporting apparatus of claim 6, wherein the position adjusting mechanism moves the electronic component in a direction orthogonal to a vertical direction. 如請求項6之電子零件搬送裝置,其中上述姿勢調整機構為使上述電子零件繞鉛直軸旋動者。The electronic component transporting apparatus of claim 6, wherein the posture adjusting mechanism is configured to rotate the electronic component about a vertical axis. 如請求項1之電子零件搬送裝置,其中上述試驗片具有可藉由賦予力而變色或變形之構件。The electronic component transporting apparatus of claim 1, wherein the test piece has a member that can be discolored or deformed by imparting a force. 一種電子零件檢查裝置,其特徵在於具備: 電子零件載置部,其載置電子零件,且具有可於上述電子零件或試驗片形成抵接痕之抵接痕形成部; 固持部,其固持並搬送上述電子零件或上述試驗片,且可將上述電子零件或試驗片按壓至抵接痕形成部;及 攝像部,其可拍攝藉由上述固持部固持之上述電子零件或上述試驗片;且 上述電子零件載置部為可載置並檢查上述電子零件之檢查部, 上述攝像部拍攝上述固持部固持上述試驗片並使其抵接於上述抵接痕形成部後之上述試驗片之第1圖像、與拍攝上述第1圖像後拍攝固持於上述固持部之上述電子零件之第2圖像, 上述固持部可基於上述第1圖像與上述第2圖像,調整上述電子零件相對於上述電子零件載置部之位置及姿勢之至少一者。An electronic component inspection device comprising: an electronic component mounting portion on which an electronic component is placed, and an abutting mark forming portion that can form an abutting mark on the electronic component or the test piece; and a holding portion that holds the component Carrying the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component or the test piece held by the holding portion; The electronic component mounting portion is an inspection portion that can mount and inspect the electronic component, and the imaging portion captures the first image of the test piece after the holding portion holds the test piece and abuts against the contact mark forming portion. And capturing the second image of the electronic component held by the holding portion after the first image is captured, wherein the holding portion adjusts the electronic component relative to the first image and the second image At least one of the position and posture of the electronic component mounting portion.
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