TWI642134B - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which can accurately mount an electronic component on an electronic component mounting portion. An electronic component transporting apparatus according to the present invention is characterized in that an electronic component mounting portion that can mount an electronic component and that can form an abutting mark forming portion of the electronic component or the test piece, and a holding portion is provided And holding the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component held by the holding portion or the test The image capturing unit captures a first image of the test piece after the holding portion holds the test piece and abuts against the contact mark forming portion, and captures and holds the first image, and holds the same image and holds the holding portion. In the second image of the electronic component, the holding unit may adjust at least one of a position and a posture of the electronic component with respect to the electronic component mounting portion based on the first image and the second image.

Description

Electronic component conveying device and electronic component inspection device

The present invention relates to an electronic component conveying device and an electronic component inspection device.

For example, a component testing device for performing an electrical test of an electronic component (part) such as an IC device has been known (for example, see Patent Document 1). In the component testing device described in Patent Document 1, when the electronic component is tested, the IC device is transported to the socket and placed on the socket to perform the test. Further, in the component testing device described in Patent Document 1, an image of the IC device is captured by a plurality of cameras (for example, a part identification camera, a socket identification camera, etc.) while the IC device is being transported to the socket. Then, the IC device can be correctly transferred to the socket by appropriately adjusting (correcting) the position of the IC device based on the image. [Prior Art Document] [Patent Document] [Patent Document 1] International Publication No. 2003/023430

[Problems to be Solved by the Invention] However, in the component testing device described in Patent Document 1, a plurality of cameras are used, and accordingly, the configuration or control of the device is complicated. Also, in the case of using a plurality of cameras, it is necessary to perform calibration (position correction) of the cameras with each other. [Technical means for solving the problem] The present invention has been completed in order to solve at least a part of the above problems, and can be realized as follows. An electronic component transporting apparatus according to the present invention is characterized in that it can be disposed to mount an electronic component, and has an electronic component mounting portion that can form an abutting mark forming portion of the contact portion of the electronic component or the test piece, and has: And holding the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component held by the holding portion or the And the imaging unit captures the first image of the test piece after the holding portion is held by the holding portion and is in contact with the contact mark forming portion, and the image is captured and held by the first image. In the second image of the electronic component of the holding portion, the holding portion adjusts at least one of a position and a posture of the electronic component with respect to the electronic component mounting portion based on the first image and the second image. Therefore, when the electronic component is placed on the electronic component mounting portion, the holding portion can adjust the electronic component to be placed on the electronic component based on the first image and the second image captured by the imaging unit before the mounting. Any of the positions and postures of the department. With this adjustment, the electronic component is placed at a position or posture that is placed on the electronic component mounting portion, and thus is accurately placed on the electronic component mounting portion. Further, while the electronic component is placed on the electronic component mounting portion, an image (a first image and a second image) necessary for adjusting the position or posture of the electronic component can be obtained by using one imaging unit. In this way, the various adjustments described above can be performed using a simple configuration of one imaging unit. Further, the alignment (position correction) of the imaging units when the two imaging units are used as before may be omitted. Further, in the electronic component transporting device of the present invention, preferably, the electronic component mounting portion has a plurality of mounting portion side terminals that are electrically connectable to the electronic component, and the abutting mark forming portion is formed by the plurality of At least one of the placement unit side terminals is configured as a terminal. Thereby, the contact mark forming portion can be omitted except for the terminal on the mounting portion side. Therefore, the configuration of the electronic component mounting portion can be simplified. Further, in the electronic component carrying device of the present invention, it is preferable that the electronic component mounting portion has a plurality of mounting portion side terminals that are electrically connectable to the electronic component, and the contact mark forming portion is configured to be The terminal side terminal is formed in a different part. Thereby, for example, the contact mark forming portion can be formed to be more likely to form an abutting mark than the mounting portion side terminal. Further, in the electronic component transport apparatus of the present invention, preferably, the first image includes an image of the contact mark, and the second image includes an image of a terminal of the electronic component. Thereby, for example, the first image and the second image can be combined on a common coordinate axis to obtain a composite image. Moreover, the composite image can be used to adjust the position or posture of the electronic component relative to the electronic component mounting portion. Further, in the electronic component carrying device of the present invention, it is preferable that the electronic component mounting portion has a plurality of mounting portion side terminals, and at least one of the plurality of mounting portion side terminals is provided. The electronic component includes an electronic component side reference terminal that is electrically connectable to the mounting portion side reference terminal, and the holding portion is configured to be in the second image, in order to form the mounting portion side reference terminal of the contact mark forming portion At least one of the position and the posture of the electronic component is adjusted such that the position of the electronic component side reference terminal coincides with the position of the contact mark formed by the mounting portion side reference terminal in the first image. Thereby, the position or posture of the electronic component can be adjusted quickly and accurately, and therefore, the subsequent placement of the electronic component on the electronic component mounting portion can be performed accurately. Further, in the electronic component conveying apparatus of the present invention, preferably, the holding portion includes a position adjusting mechanism that adjusts a position of the electronic component, and a posture adjusting mechanism that adjusts a posture of the electronic component. Thereby, when the electronic component is placed on the electronic component mounting portion, both the position and the posture of the electronic component can be appropriately adjusted as needed, and thus the mounting can be performed accurately. Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the position adjusting mechanism moves the electronic component in a direction orthogonal to a vertical direction. Thereby, the electronic component can be finely adjusted and corrected in the direction orthogonal to the vertical direction, so that the electronic component can be accurately placed on the electronic component mounting portion. Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the posture adjusting mechanism rotates the electronic component around a vertical axis. Thereby, the posture of the electronic component, that is, the direction around the vertical axis can be independently adjusted, that is, the placement of the electronic component on the electronic component mounting portion can be performed accurately. Moreover, in the electronic component conveying apparatus of the present invention, it is preferable that the test piece has a member that can be discolored or deformed by imparting a force. Thereby, the portion which is discolored or deformed is the abutting mark, and as a result, the abutting mark can be formed quickly. An electronic component inspection device according to the present invention includes an electronic component mounting portion that mounts an electronic component and has an abutting mark forming portion that can form an abutting mark on the electronic component or the test piece, and a holding portion. Holding and transporting the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component or the test piece held by the holding portion; The electronic component mounting portion is an inspection portion that can mount and inspect the electronic component, and the imaging portion captures the first test piece after the holding portion holds the test piece and abuts against the contact mark forming portion. 1 image, and capturing a second image of the electronic component held by the holding portion after the first image is captured, wherein the holding portion adjusts the electronic component based on the first image and the second image At least one of a position and a posture of the electronic component mounting portion. Therefore, when the electronic component is placed on the electronic component mounting portion, the holding portion can adjust the electronic component to be placed on the electronic component based on the first image and the second image captured by the imaging unit before the mounting. Any of the positions and postures of the department. With this adjustment, the electronic component is adapted to be placed at the position or posture of the electronic component mounting portion, and thus is accurately placed on the electronic component mounting portion, that is, electrically connected. Further, while the electronic component is placed on the electronic component mounting portion, an image (a first image and a second image) necessary for adjusting the position or posture of the electronic component can be obtained by using one imaging unit. In this way, the various adjustments described above can be performed using a simple configuration of one imaging unit. Further, since the electronic component can be transported to the electronic component mounting portion as the inspection portion, the electronic component can be inspected in the inspection portion. Moreover, the electronic parts after inspection can be transported from the inspection unit.

Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the additional drawings. <First Embodiment> A first embodiment of an electronic component conveying apparatus and an electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 1 to 15 . In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are defined as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X-axis is referred to as "X direction (first direction)", the direction parallel to the Y-axis is referred to as "Y direction (second direction)", and the direction parallel to the Z-axis is referred to as " Z direction (third direction)". Further, the direction in which the arrows in the respective directions are directed is referred to as "positive", and the opposite direction is referred to as "negative". Moreover, the "level" mentioned in the specification of the present invention is not limited to the complete level, and includes a state of being slightly inclined with respect to the horizontal (for example, less than about 5°) as long as it does not hinder the conveyance of the electronic component. In addition, the upper side in FIG. 1 and FIG. 3 to FIG. 14 (the same as in FIGS. 16 to 29) may be referred to as "upper" or "upper" in the Z-axis direction, and the Z-axis direction in the lower side. The negative side is called "down" or "lower". The electronic component conveying device 10 of the present invention has the appearance as shown in Fig. 1. The electronic component conveying device 10 of the present invention is a processor, and is configured to be mounted with an electronic component and has a reference probe pin 162a (abutment mark forming portion) capable of forming an abutment mark 821 on the electronic component or the test piece 8. The device of the inspection unit 16 (electronic component mounting unit). The electronic component conveying device 10 includes a hand unit 9 (holding portion) that holds and transports the electronic component or the test piece 8 and can press the electronic component or the test piece 8 to the reference probe pin 162a (contact mark forming portion). And an imaging unit 26 that can capture an electronic component or test piece 8 held by the hand unit 9 (holding portion). The imaging unit 26 captures the first image IM of the test piece 8 after the test piece 8 is held by the hand unit 9 (holding portion) and abuts against the reference probe pin 162a (contact mark forming portion).  ₁And shooting the first image IM  ₁The second image IM of the electronic component that is later held by the hand unit 9 (holding portion)  ₂. Next, the hand unit 9 (holding portion) can be based on the first image IM  ₁With the second image IM  ₂At least one of the position and posture of the electronic component with respect to the inspection unit 16 (electronic component mounting portion) is adjusted. As a result, when the electronic component is placed on the inspection unit 16 as described later, the hand unit 9 (holding portion) can be based on the first image IM captured by the imaging unit 26 before the placement.  ₁With the second image IM  ₂Any one of the position and posture of the electronic component with respect to the inspection unit 16 is adjusted. With this adjustment, the electronic component is placed at a position or posture that is placed on the inspection portion 16, and therefore, after being placed on the inspection portion 16, the inspection portion 16 can be electrically and accurately connected. Further, while the electronic component is placed on the inspection unit 16, an image obtained by adjusting the position or posture of the electronic component can be obtained by using one imaging unit 26 (first image IM)  ₁And the second image IM  ₂). Thus, the above various adjustments can be performed using a simple configuration of one imaging unit 26. Moreover, as shown in FIG. 2, the electronic component inspection apparatus 1 of this invention has the electronic component conveyance apparatus 10, and further has the inspection part 16 which inspects an electronic component. In other words, the electronic component inspection device 1 of the present invention includes an electronic component mounting portion that mounts an electronic component and has a reference probe pin 162a that can form an abutment mark 821 on the electronic component or the test piece 8 (abutting a hand unit 9 (holding portion) that holds and transports the electronic component or the test piece 8, and can press the electronic component or the test piece 8 to the reference probe pin 162a (abutment mark forming portion); The imaging unit 26 can capture an electronic component or a test piece 8 held by the hand unit 9 (holding portion). The electronic component mounting portion is an inspection portion 16 on which electronic components can be placed and inspected. The imaging unit 26 captures the first image IM of the test piece 8 after the test piece 8 is held by the hand unit 9 (holding portion) and abuts against the reference probe pin 162a (contact mark forming portion).  ₁And shooting the first image IM  ₁The second image IM of the electronic component that is later held by the hand unit 9 (holding portion)  ₂. Next, the hand unit 9 (holding portion) can be based on the first image IM  ₁With the second image IM  ₂At least one of the position and posture of the electronic component with respect to the inspection unit 16 (electronic component mounting portion) is adjusted. Thereby, the electronic component inspection apparatus 1 having the advantages of the electronic component conveying apparatus 10 described above can be obtained. Moreover, since the electronic component can be transported to the inspection unit 16, the electronic component can be inspected in the inspection unit 16. Moreover, the electronic parts after inspection can be carried out from the inspection unit 16. Hereinafter, the configuration of each unit will be described in detail. As shown in FIG. 1 and FIG. 2, the electronic component inspection apparatus 1 including the electronic component conveying apparatus 10 transports electronic components such as an IC device such as a BGA (Ball Grid Array) package, and carries them during transportation. Inspection/test (hereinafter referred to as "inspection") Electrically-specific devices for electronic components. In the following, for the sake of convenience of explanation, a case where an IC device is used as the above-described electronic component will be representatively described, and this will be referred to as "IC device 90". In the present embodiment, the IC device 90 is in the form of a flat plate. Further, the IC device 90 has a plurality of terminals (electronic component side terminals) 902 arranged in a matrix in a plan view on the lower surface thereof. Each terminal 902 has a hemispherical shape. In addition, as an IC device, for example, "LSI (Large Scale Integration)", "CMOS (Complementary MOS)", "CCD (Charge Coupled Device)" "Charge-coupled device" or "module IC", or "quartz device", "pressure sensor", "inertial sensor (acceleration sensor)", which encapsulates a plurality of IC device modules, "Gyro sensor", "fingerprint sensor", etc. The electronic component inspection device 1 (electronic component conveying device 10) includes a tray supply region A1, a component supply region A2, an inspection region A3, a device collection region A4, and a tray removal region A5. These areas are partially separated by walls as will be described later. And, IC device 90 is at arrow α  ₉₀The direction passes through the above-described respective areas of the tray supply area A1 to the tray removal area A5 in order, and is inspected in the inspection area A3 in the middle. In this way, the electronic component inspection apparatus 1 includes an electronic component transport apparatus 10 that transports the transport unit 25 of the IC device 90 through each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 800. Further, the electronic component inspection device 1 further includes a monitor 300, a signal lamp 400, and an operation panel 700. In addition, the electronic component inspection apparatus 1 is configured such that the tray supply area A1 and the tray removal area A5 are disposed, that is, the lower side in FIG. 2 is used as the front side, and the inspection area A3 is disposed, that is, the upper side in FIG. 2 is the back side. Side use. In addition, the electronic component inspection device 1 is used by being referred to as a "replacement kit" in which each type of the IC device 90 is replaced. The replacement kit has a mounting portion (electronic component mounting portion) on which the IC device 90 (electronic component) is placed. In the electronic component inspection device 1 of the present embodiment, the mounting portion is provided in a plurality of locations, and includes, for example, a temperature adjustment unit 12, a device supply unit 14, and a device collection unit 18 which will be described later. Further, in the mounting portion (electronic component mounting portion) on which the IC device 90 (electronic component) is placed, in addition to the replacement kit as described above, the tray 200 prepared by the user and the recovery tray 19 are provided. And inspection unit 16. The tray supply area A1 is a supply unit that supplies the trays 200 of the plurality of IC devices 90 in an unchecked state. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked. Further, in the present embodiment, a plurality of concave portions (recesses) are arranged in a matrix on each of the trays 200. The IC device 90 can be housed and placed one by one in each recess. The device supply region A2 is a region in which a plurality of IC devices 90 on the tray 200 transported from the tray supply region A1 are transported and supplied to the inspection region A3. Further, the tray transport mechanisms 11A and 11B of the tray 200 are transported one by one in the horizontal direction so as to straddle the tray supply area A1 and the device supply area A2. The tray transport mechanism 11A is a part of the transport unit 25, and the tray 200 can be placed on the positive side in the Y direction together with the IC device 90 placed on the tray 200, that is, the arrow α in FIG.  _11AMove in direction. Thereby, the IC device 90 can be stably supplied to the device supply region A2. Further, the tray transport mechanism 11B is an arrow α in FIG. 2 in which the empty tray 200 can be placed on the negative side in the Y direction.  _11BThe moving part that moves in the direction. Thereby, the empty tray 200 can be moved from the device supply region A2 to the tray supply region A1. In the device supply region A2, a temperature adjustment unit (a temperature plate (English description: soak plate, Chinese description (one case): temperature equalization plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. Further, a device supply unit 14 that moves so as to straddle the device supply region A2 and the inspection region A3 is also provided. The temperature adjustment unit 12 is a mounting portion on which a plurality of IC devices 90 are placed, and is referred to as a "warm plate" in which the IC device 90 to be mounted is heated or cooled. The IC device 90 before inspection by the inspection portion 16 can be preheated or cooled by the temperature holding plate to be adjusted to a temperature suitable for inspection (high temperature inspection or low temperature inspection). The temperature adjustment unit 12 as such a mounting portion is fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment portion 12 can be stably adjusted. Further, the temperature adjustment unit 12 is grounded. In the configuration shown in FIG. 2, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Further, the IC device 90 on the tray 200 carried by the tray transport mechanism 11A from the tray supply area A1 is transported to any of the temperature adjustment units 12. The device transfer head 13 holds the holding portion of the IC device 90, is movably supported in the X direction and the Y direction in the device supply region A2, and is also movably supported in the Z direction. The device transport head 13 is also a part of the transport unit 25, and is responsible for transporting the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the temperature adjustment unit 12 and the device supply unit 14 which will be described later. The transfer of the IC device 90 between. In addition, in FIG. 2, the movement of the device transport head 13 in the X direction is indicated by an arrow α.  _13XIndicates that the movement of the device transport head 13 in the Y direction is indicated by an arrow α.  _13YSaid. The device supply unit 14 is a mounting portion for the IC device 90 on which the temperature adjustment unit 12 is temperature-adjusted, and the IC device 90 can be transported to the vicinity of the inspection unit 16 as a “supply shuttle plate” or simply as "Supply shuttle". The device supply unit 14 may be a part of the transport unit 25. The device supply unit 14 has a recess (cavity) 141 in which the IC device 90 is housed and placed (see, for example, FIG. 8). Further, the device supply portion 14 as the placing portion can be along the X direction, that is, the arrow α between the device supply region A2 and the inspection region A3.  ₁₄The direction is supported reciprocally (movably). Thereby, the device supply unit 14 can stably transport the IC device 90 from the device supply region A2 to the vicinity of the inspection portion 16 of the inspection region A3, and can be removed by the device transfer head 17 (hand unit 9) in the inspection region A3. The IC device 90 is returned to the device supply region A2 again. In the configuration shown in FIG. 2, the device supply unit 14 is disposed in the Y direction, and the device supply unit 14 on the negative side in the Y direction is referred to as the “device supply unit 14A”, and the device supply unit on the positive side in the Y direction is provided. 14 is referred to as "device supply unit 14B". Further, the IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or the device supply unit 14B in the device supply region A2. Further, the device supply unit 14 is preferably configured to heat or cool the IC device 90 placed on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 whose temperature is adjusted by the temperature adjustment unit 12 can be transported to the vicinity of the inspection unit 16 of the inspection area A3 while maintaining the temperature adjustment state. Further, the device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12. The tray transport mechanism 15 is an empty tray 200 that removes the state of all the IC devices 90 in the device supply region A2 on the positive side in the X direction, that is, the arrow α.  ₁₅The mechanism of the direction of transportation. Then, after the transfer, the empty tray 200 is returned from the device supply region A2 to the tray supply region A1 by the tray transport mechanism 11B. The inspection area A3 is an area for inspecting the IC device 90. An inspection unit 16 that inspects the IC device 90 and a device transfer head 17 are provided in the inspection area A3. The device transfer head 17 may be a part of the transfer unit 25, and may be configured to be capable of heating or cooling the held IC device 90 in the same manner as the temperature adjustment unit 12. The device transfer head 17 has a hand unit 9 (holding portion) that holds the IC device 90 (electronic component) as will be described later. Thereby, the IC device 90 that maintains the temperature adjustment state described above can be held, and the IC device 90 can be transported in the inspection region A3 while maintaining the temperature adjustment state. Such a device transfer head 17 can be supported in the inspection area A3 so as to reciprocate in the Y direction and the Z direction, and is part of a mechanism called an "index arm". Thereby, the device transfer portion 17 in which the device transfer head 17 can be carried in the device supply region A2 can pull up the IC device 90, transport it, and load it on the inspection portion 16. In addition, in FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α.  _{17 Y}Said. Further, the device transfer head 17 is supported to be reciprocally movable in the Y direction. However, the present invention is not limited thereto, and may be supported to reciprocate in the X direction. Further, in the configuration shown in FIG. 2, the device transfer head 17 is disposed in the Y direction, and the device transfer head 17 on the negative side in the Y direction may be referred to as "device transfer head 17A", and the positive side in the Y direction may be referred to. The device transfer head 17 is referred to as a "device transfer head 17B." The device transfer head 17A may be responsible for transporting the IC device 90 from the device supply portion 14A to the inspection portion 16 in the inspection region A3, and the device transfer head 17B may be responsible for moving the IC device 90 from the device supply portion 14B to the inspection portion 16 in the inspection region A3. Transfer. The inspection unit 16 (socket) is a mounting portion (electronic component mounting portion) that mounts the IC device 90, which is an electronic component, and inspects the electrical characteristics of the IC device 90. The inspection unit 16 has a concave portion (cavity) 161 in which the IC device 90 is housed and placed, and a plurality of probe pins (mounting portion side terminals) 162 are provided at the bottom of the concave portion 161 (see, for example, FIG. 14). Also, terminal 902 of IC device 90 is electrically conductively coupled to probe pin 162. That is, the inspection of the IC device 90 can be performed by contact. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit provided in the tester connected to the inspection unit 16. Further, the shape of the upper end portion of the probe pin 162 is adapted to the shape of the terminal 902. In the present embodiment, it is in the shape of a crown suitable for the hemispherical terminal 902 (see, for example, FIG. 14). Such an inspection portion 16 can heat or cool the IC device 90 in the same manner as the temperature adjustment portion 12, and adjust the IC device 90 to a temperature suitable for inspection. The device recovery area A4 is recovered in the area of the plurality of IC devices 90 in which the inspection area A3 is inspected and the inspection is completed. In the device collection area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. Further, a device recovery unit 18 that moves across the inspection area A3 and the device recovery area A4 is also provided. Further, an empty tray 200 is also provided in the device recovery area A4. The device recovery unit 18 is an IC device 90 that is placed in the inspection unit 16 to perform inspection, and can transport the IC device 90 to the mounting portion of the device recovery area A4, which is called a “recycling shuttle plate” or simply "Recycling shuttle". The device recovery unit 18 may be a part of the transport unit 25. Moreover, the device recovery portion 18 can be in the X direction, that is, the arrow α between the inspection region A3 and the device recovery region A4.  ₁₈The direction is supported reciprocally. In the configuration shown in FIG. 2, the device recovery unit 18 is arranged in the Y direction in the same manner as the device supply unit 14, and the device recovery unit 18 on the negative side in the Y direction is referred to as a "device recovery unit 18A". The device recovery unit 18 on the positive side in the Y direction is referred to as a "device recovery unit 18B." The IC device 90 on the inspection unit 16 is transported and placed on the device recovery unit 18A or the device recovery unit 18B. The transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is performed by the device transfer head 17A, and the transfer from the inspection unit 16 to the device recovery unit 18B is performed by the device transfer head 17B. Further, the device recovery unit 18 is grounded in the same manner as the temperature adjustment unit 12 and the device supply unit 14. The recovery tray 19 is placed on the mounting portion of the IC device 90 that is placed in the inspection unit 16 and is fixed so as not to move in the device recovery region A4. As a result, even in the collection area A4 in which a plurality of movable portions such as the device transfer head 20 are disposed, the inspected IC device 90 is stably placed on the recovery tray 19. Further, in the configuration shown in Fig. 2, three collection trays 19 are arranged in the X direction. Further, the empty trays 200 are also arranged in three in the X direction. The empty tray 200 is also a mounting portion for the IC device 90 that is placed in the inspection unit 16 to be inspected. Then, the IC device 90 moved to the device recovery unit 18 of the device collection area A4 is transported and placed on either of the collection tray 19 and the empty tray 200. Thereby, the IC device 90 is classified and recovered based on the inspection result. The device transfer head 20 has a portion that can be supported in the device recovery region A4 so as to be movable in the X direction and the Y direction, and further movable in the Z direction. The device transport head 20 is a part of the transport unit 25, and the IC device 90 can be transported from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. In addition, in FIG. 2, the movement of the device transport head 20 in the X direction is indicated by an arrow α.  _20XIndicates that the movement of the device in the Y direction of the head 20 is indicated by an arrow α.  _20YSaid. The tray transport mechanism 21 is an empty tray 200 loaded from the tray removal area A5 in the device recovery area A4 in the X direction, that is, an arrow α.  _{twenty one}The mechanism of the direction of transportation. Further, after the transfer, the empty tray 200 is disposed at a position where the IC device 90 is collected, that is, any of the above three empty trays 200. The tray removal area A5 is a material removal unit that collects and removes the tray 200 in which a plurality of IC devices 90 in the inspection state are arranged. In the tray removal area A5, a plurality of trays 200 can be stacked. Further, the tray transport mechanism 22A and the tray transport mechanism 22B are transported one by one in the Y-direction transport tray 200 so as to span the device recovery area A4 and the tray removal area A5. The tray transport mechanism 22A is a part of the transport unit 25, and the tray 200 can be in the Y direction, that is, the arrow α.  _22AA moving portion that reciprocates in the direction. Thereby, the inspected IC device 90 can be transferred from the device recovery area A4 to the tray removal area A5. Moreover, the tray transport mechanism 22B can use the arrow α of the empty tray 200 for recovering the IC device 90 on the positive side in the Y direction.  _22BMove in direction. Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4. The control unit 800 can control, for example, the following operations: the tray transport mechanism 11A, the tray transport mechanism 11B, the temperature adjustment unit 12, the device transport head 13, the device supply unit 14, the tray transport mechanism 15, the inspection unit 16, and the device transport head 17, The device recovery unit 18, the device transfer head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B. The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is disposed on the upper portion of the front side of the electronic component inspection device 1. As shown in Fig. 1, on the right side of the drawing of the tray removing area A5, a mouse table 600 for placing a mouse is provided. This mouse is used when operating the screen displayed on the monitor 300. Further, in the lower right of FIG. 1, an operation panel 700 is disposed on the monitor 300. The operation panel 700 is separated from the monitor 300, and instructs the electronic component inspection apparatus 1 to the desired author. Further, the signal lamp 400 can notify the operating state of the electronic component inspection device 1 or the like by a combination of illuminating colors. The signal lamp 400 is disposed on the upper portion of the electronic component inspection device 1. Further, the electronic component inspection device 1 incorporates a speaker 500, and the speaker 500 can be used to notify the operation state of the electronic component inspection device 1 and the like. The electronic component inspection apparatus 1 separates the tray supply region A1 and the component supply region A2 by the first separator 231, and separates the device supply region A2 from the inspection region A3 by the second separator 232, and is separated by the third separator 233. Between the inspection area A3 and the device recovery area A4, the fourth separator 234 separates the device recovery area A4 from the tray removal area A5. Further, the device supply region A2 and the device recovery region A4 are also separated by the fifth spacer 235. The outermost part of the electronic component inspection device 1 is covered by a cover, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245. However, with the miniaturization of the IC device 90 in recent years, the terminals 902 of the IC device 90 are also narrowed from each other, and as a result, the terminal 902 is difficult to be attached to the probe pin 162 of the inspection portion 16 which should be in contact with the terminal 902. Contact, and there is no way to check the correct value. Therefore, the electronic component inspection apparatus 1 is configured to prevent such a defect. Hereinafter, the configuration and operation will be described. As shown in FIG. 3, the device transfer head 17 has at least one hand unit 9 (holding portion). The hand unit 9 is an IC device 90 (electronic component) on the holding device supply unit 14 and is transported to the inspection unit 16. In addition, the number of configurations of the hand unit 9 is not particularly limited. The hand unit 9 has a base portion 94, a first moving portion 95 supported by the base portion 94, and reciprocally movable in the X direction with respect to the base portion 94. The second moving portion 96 is supported by the first moving portion 95 and is relatively movable. The first moving portion 95 reciprocates in the Y direction; the rotating portion (rotating portion) 97 is supported by the second moving portion 96 and is rotatable (rotated) about the Z axis with respect to the second moving portion 96; 99 is provided in the rotating portion 97; the holding portion 98 is fixed to the rotating shaft 99; the first piezoelectric actuator 911 moves the first moving portion 95 relative to the base portion 94; the second piezoelectric actuator 912, which moves the second moving portion 96 to the first moving portion 95, and a third piezoelectric actuator (piezoelectric actuator for the rotating portion) 913 that moves the rotating portion 97 with respect to the second movement The part 96 is rotated. The base portion 94 has a plate-like plate portion 941 having a thickness in the Z direction, and a fastening portion 942 and a fastening portion 943 which are disposed on the lower surface of the plate portion 941 and used for the first The moving unit 95 guides in the X direction. Each of the engaging portion 942 and the engaging portion 943 extends in the X direction and is separated from each other in the Y direction. The configuration of the engaging portion 942 and the engaging portion 943 is not particularly limited. However, in the present embodiment, each of the guide rails 952 and the guide rails 953 which are described later has a groove which is open in the longitudinal direction. In other words, the engaging portion 942 and the engaging portion 943 are formed of an elongated portion having a long groove opened at the lower side in FIG. Further, the base portion 94 extends from the plate-like portion 941 toward the negative side in the Z direction, and has an abutting portion 947 that abuts against the first piezoelectric actuator 911. The abutting portion 947 extends to the second moving portion 96 and is disposed to be aligned with respect to the first moving portion 95 and the second moving portion 96 in the Y direction. Further, the lower surface 947a of the contact portion 947 extends in the X direction, and the convex portion 911a (upper end portion) of the first piezoelectric actuator 911 abuts against the lower surface 947a. It is preferable to perform a treatment for improving the frictional resistance with the convex portion 911a on the surface of the lower surface 947a, or to form a high friction layer. The first moving portion 95 has a base portion 951, a guide rail 952 that is provided on the base portion 951 and that is engaged with the engaging portion 942 of the base portion 94, and a guide rail 953 that is provided on the base portion 951 and that is engaged with the engaging portion 943 of the base portion 94. Thereby, the movement of the first moving portion 95 other than the X direction is restricted, and the first moving portion 95 is smoothly and surely moved in the X direction. Further, the first moving portion 95 has a first fixing portion 954 that extends from the base portion 951 toward the negative side in the Z direction and that fixes the first piezoelectric actuator 911. The first fixing portion 954 has a plate shape extending in the XZ plane and having a thickness in the Y direction, and is provided to be aligned with respect to the second moving portion 96 (base portion 961) in the Y direction. Further, the first piezoelectric actuator 911 is fixed to the surface of the first fixing portion 954. The first piezoelectric actuator 911 has a plate shape and is fixed to the first fixing portion 954 so as to have a thickness in the Y direction. By disposing the first piezoelectric actuator 911 in this way, it is possible to suppress excessive protrusion of the first piezoelectric actuator 911 to the outside, and it is possible to reduce the size of the hand unit 9. Further, the first moving portion 95 has a second fixing portion (not shown) that extends from the base portion 951 toward the negative side in the Z direction and that is fixed to the second piezoelectric actuator 912. The second fixing portion has a plate shape that is expanded in the YZ plane and has a thickness in the X direction, and is provided in the X direction with respect to the second moving portion 96 (base portion 961). Further, a second piezoelectric actuator 912 is fixed to the back surface of the second fixing portion. The second piezoelectric actuator 912 has a plate shape and is fixed to the second fixing portion so as to have a thickness in the X direction. By arranging the second piezoelectric actuator 912 in this manner, the second piezoelectric actuator 912 can be prevented from protruding outward, and the size of the hand unit 9 can be reduced. Further, the upper end portion of the second piezoelectric actuator 912 abuts against the second moving portion 96 from the lower side. Further, the first moving portion 95 has a fastening portion (guide portion) 956 for guiding the second moving portion 96 in the Y direction. The fastening portion 956 extends in the Y direction. The configuration of the engaging portion 956 is not particularly limited, but in the present embodiment, the groove is opened in the longitudinal direction of the guide rail 963 which will be described later. In other words, the engaging portion 956 is constituted by an elongated portion having a long groove opened at the lower side in FIG. The second moving portion 96 has a columnar base portion 961 and a guide rail 963 that is provided on the base portion 961 and that is engaged with the engaging portion 956 of the first moving portion 95. Thereby, the movement of the second moving unit 96 in the Y direction is restricted, and the second moving unit 96 is smoothly and surely moved in the Y direction. Further, a surface 961a that is recessed from the other portion is formed in the base portion 961 of the second moving portion 96, and a third piezoelectric actuator 913 for rotating the swirling portion 97 is fixed to the surface 961a. The surface 961a is composed of a YZ plane, and the plate-shaped third piezoelectric actuator 913 is fixed to the surface 961a so as to have a thickness in the X direction. By arranging the third piezoelectric actuator 913 in this way, it is possible to suppress excessive protrusion of the third piezoelectric actuator 913 to the outside, and it is possible to reduce the size of the hand unit 9. In the hand unit 9, the first moving unit 95 and the second moving unit 96 configured as described above constitute a position adjusting mechanism 92. The position adjustment mechanism 92 moves the IC device 90 (electronic component) held by the holding portion 98 in a direction orthogonal to the Z direction (vertical direction), that is, in the X direction and the Y direction. The movement in the X direction is performed by the first moving unit 95, and the movement in the Y direction is performed by the second moving unit 96. Thereby, even in the device transfer head 17 which is supported by the reciprocating movement in the Y direction and the Z direction, the positions of the IC device 90 in the X direction and the Y direction can be individually finely adjusted. The swirling portion 97 is located below the second moving portion 96 (negative side in the Z direction). The swirling portion 97 has a tubular support portion 971 that is fixed to the lower end of the base portion 961 of the second moving portion 96. A rotating body (not shown) that is provided coaxially with the support portion 971 and that is inserted into the rotating shaft 99 is disposed inside the support portion 971, or the rotating body can be rotatably supported with respect to the support portion 971. Bearings (not shown), etc. Further, in the above-described rotating body, the convex portion 913a of the third piezoelectric actuator 913 is abutted at a position eccentric from the rotation axis. Further, the above-described rotating body is rotated with respect to the support portion 971 (second moving portion 96) by the driving of the third piezoelectric actuator 913. In the hand unit 9, the posture adjusting mechanism 93 is constituted by the turning portion 97 configured as described above. The posture adjustment mechanism 93 rotates the IC device 90 (electronic component) held by the holding portion 98 around the Z axis (vertical axis). Thereby, even in the device transfer head 17 which is supported by the reciprocating movement in the Y direction and the Z direction, the posture of the IC device 90, that is, the direction around the Z axis, can be independently adjusted. In this manner, the hand unit 9 (holding portion) has a position adjusting mechanism 92 that adjusts the position of the IC device 90 (electronic component), and a posture adjusting mechanism 93 that adjusts the posture of the IC device 90 (electronic component). As a result, when the IC device 90 is placed on the inspection unit 16 as will be described later, both the position and the posture of the IC device 90 can be appropriately adjusted as needed, and therefore, the placement can be performed accurately. The rotating shaft 99 extends to the plate portion 941 of the base portion 94. A profile mechanism (cis-shaped mechanism) 948 is built in the base portion 94. The rotating shaft 99 is coupled to the contouring mechanism 948. Thereby, the posture of the rotating shaft 99 can be contoured by the external force of the rotating shaft 99. At the lower end of the rotating shaft 99, a holding portion 98 for holding the IC device 90 is disposed. The holding portion 98 is supported by the turning portion 97 via the rotating shaft 99, and is rotatable integrally with the second moving portion 96 with the above-described rotating body. Further, the holding portion 98 has an adsorption surface 981 that faces the IC device 90, an adsorption hole 982 that is open to the adsorption surface 981, and a pressure reducing pump 983 that decompresses the adsorption hole 982. When the adsorption surface 981 is brought into contact with the IC device 90 so as to cover the adsorption hole 982, the IC device 90 can be adsorbed and held on the adsorption surface 981 by depressurizing the adsorption hole 982 by the pressure reducing pump 983. Conversely, if the decompression pump 983 is stopped and the adsorption hole 982 is released, the IC device 90 can be released. As the first piezoelectric actuator 911, the second piezoelectric actuator 912, and the third piezoelectric actuator 913, for example, a piezoelectric element having a short strip shape can be used. The piezoelectric element expands and contracts in the longitudinal direction thereof by applying an alternating voltage. Further, the first moving portion 95 can be moved relative to the base portion 94 by the expansion and contraction operation, or the second moving portion 96 can be moved relative to the first moving portion 95, or the rotating portion 97 can be rotated with respect to the second moving portion 96. . Further, the constituent material of the piezoelectric element is not particularly limited, but lead zirconate titanate (PZT), quartz, lithium niobate, barium titanate, lead titanate, lead metasilicate, polyvinylidene fluoride, zinc may be used. Lead citrate, lead citrate and other various types. Further, the hand unit 9 (holding portion) can hold and transport the test piece 8 in addition to the IC device 90 (electronic component) (see FIGS. 4 to 7). The test piece 8 is pressed to the reference probe pin 162a (contact mark forming portion) of the inspection portion 16 to be described later in a state of being held by the hand unit 9, and the contact mark 821 is formed. The contact mark 821 is used for position correction or posture correction of the IC device 90 when the IC device 90 is transported from the device supply unit 14 to the inspection unit 16 and placed on the inspection unit 16. The test piece 8 has a member which can be discolored or deformed by imparting force. In the present embodiment, the test piece 8 is a member having discoloration by imparting force, and as shown in FIGS. 4 to 7, for example, a substrate 81 having a sheet shape and dispersed on the substrate 81 are dispersed. A microcapsule layer 82 having microcapsules is formed. The microcapsule layer is an in-package developer. In addition, the "force" is a reaction force from the reference probe pin 162a (contact mark forming portion) which is generated when the test piece 8 is pressed against the reference probe pin 162a (contact mark forming portion). Further, the microcapsules are crushed by the reaction force to release the internal developer, so that one of the microcapsule layers 82 is partially discolored. Thereby, the portion which is discolored becomes the contact mark 821 (refer to FIG. 5). The contact mark 821 can be quickly formed by using the test piece 8 of such a configuration. As shown in FIGS. 4 to 14, the imaging unit 26 is disposed and fixed in the inspection area A3. The imaging unit 26 is located between the inspection unit 16 and the device supply unit 14 that is stopped in the inspection area A3. As described above, the device supply unit 14 has the device supply unit 14A and the device supply unit 14B. Therefore, the imaging unit 26 is located between the inspection unit 16 and the device supply unit 14A, and between the inspection unit 16 and the device supply unit 14B. Hereinafter, the imaging unit 26 on the device supply unit 14A side will be representatively described. The imaging unit 26 is configured by various cameras such as a CCD (Charge Coupled Devices) camera or a three-dimensional camera. The imaging unit 26 can image the IC device 90 (see FIG. 11) or the test piece 8 (see FIG. 7) held by the hand unit 9 (holding portion) with the imaging direction facing upward. In the order of the imaging (timing), the imaging unit 26 first captures the test piece 8 after the test piece 8 is held by the hand unit 9 (holding portion) and is brought into contact with the reference probe pin 162a (contact mark forming portion). The first image IM  ₁. Next, take the first image IM  ₁After that, the imaging unit 26 captures the second image IM of the IC device 90 (electronic component) held by the hand unit 9 (holding portion).  ₂. As shown in Figure 15, in the first image IM  ₁Image containing the abutment mark 821, in the second image IM  ₂An image of terminal 902 of IC device 90 (electronic component) is included. As described above, the inspection unit 16 (electronic component mounting unit) is a person who mounts and inspects the IC device 90 (electronic component). The inspection unit 16 (electronic component mounting unit) has a plurality of probe pins (mounting portion side terminals) 162 that can be electrically connected to the IC device 90 (electronic component). Further, at least one of the plurality of probe pin (mounting portion side terminals) 162 (the leftmost side of the present embodiment as an example) is mounted on the probe pin (positioned on the leftmost side of FIG. 4 to FIG. 14) The portion-side terminal 162 is formed as a reference probe pin (mounting portion side reference terminal) 162a in which the test piece 8 forms the abutment mark forming portion of the contact mark 821. In this way, the contact mark forming portion is composed of at least one probe pin (mounting portion side terminal) 162 of the plurality of probe pins (mounting portion side terminals) 162, that is, the reference probe in the present embodiment. A pin (mounting part side reference terminal) 162a is formed. Thereby, the contact mark forming portion can be omitted except for the probe pin 162. Therefore, the configuration of the inspection portion 16 can be simplified. On the other hand, in the IC device 90, the terminal 902 which is electrically conductively connectable to the reference probe pin 162a among the plurality of terminals 902 is referred to as a reference terminal (electronic component side reference terminal) 902a. Next, in the inspection area A3, the hand unit 9 (the device transfer head 17A) transports the IC device 90 to the inspection unit 16 until it is in a state in which the IC device 90 can be inspected (an example), and FIGS. 4 to 15 are referred to. Be explained. As shown in FIG. 4, it is assumed that the hand unit 9 holds the test piece 8. Moreover, the position of the hand unit 9 is a state in which the test piece 8 faces the concave portion 161 directly above the concave portion 161 of the inspection portion 16. Next, as shown in FIG. 5, the hand unit 9 is lowered until the microcapsule layer 82 of the test piece 8 is pressed against the probe pin 162. Thereby, a plurality of abutting marks 821 are formed on the microcapsule layer 82. Next, as shown in FIG. 6, the hand unit 9 is raised to the same height as the hand unit 9 in FIG. Moreover, in FIG. 6, the rising direction and the rising amount of the hand unit 9 at this time are indicated by an arrow α.  _9ZSaid. Next, as shown in FIG. 7, the hand unit 9 is moved toward the negative side in the Y direction, that is, on the side of the device supply portion 14A, and is temporarily stopped in the middle. The stop position of the hand unit 9 is such that the test piece 8 is directly above the imaging unit 26, and the position of the test piece 8 can be imaged by the imaging unit 26. Next, the imaging unit 26 is activated at this position, thereby obtaining the first image IM.  ₁(Refer to Figure 15). From the first image IM  ₁The center of the abutment mark 821 (hereinafter referred to as "reference abutment mark 821a") formed by the reference probe pin 162a is detected.  _821a. This detection is performed by the control unit 800. Further, in FIG. 7, the moving direction and the amount of movement before the hand unit 9 is stopped are indicated by an arrow α.  _9YSaid. Next, as shown in FIG. 8, the hand unit 9 is further moved toward the negative side in the Y direction, that is, on the side of the device supply portion 14A, and is stopped right above the device supply portion 14A. Subsequently, the test piece 8 is removed from the hand unit 9. Next, as shown in FIG. 9, the hand unit 9 is lowered until the hand unit 9 abuts against the IC device 90 placed on the device supply portion 14A. Thereby, the IC device 90 can be held by the hand unit 9. Next, as shown in FIG. 10, the hand unit 9 is raised to the same height as the hand unit 9 in FIG. Next, as shown in FIG. 11, the hand unit 9 is moved toward the positive side in the Y direction, that is, on the side of the inspection unit 16, and is temporarily stopped in the middle. The stop position of the hand unit 9 is such that the IC device 90 is directly above the imaging unit 26, and the position of the IC device 90 can be captured by the imaging unit 26. Next, the imaging unit 26 is activated at this position, thereby obtaining the second image IM.  ₂(Refer to Figure 15). From the second image IM  ₂The center of the reference terminal 902a is detected.  _902a. This detection is performed by the control unit 800. As described above, in the first image IM  ₁Image containing the abutment mark 821, in the second image IM  ₂An image of the terminal 902 of the IC device 90 (electronic component) is included (refer to FIG. 15). Thereby, the first image IM can be  ₁With the second image IM  ₂Synthesize on the common coordinate axis (arrow C1) to obtain a composite image IM  ₃. Further, as described above, the inspection unit 16 (electronic component mounting portion) has a plurality of probe pins (mounting portion side terminals) 162. In addition, the inspection unit 16 (electronic component mounting unit) sets at least one of the plurality of probe pins (mounting portion side terminals) 162 of the plurality of probe pins (mounting portion side terminals) 162 The reference probe pin (mounting portion side reference terminal) 162a of the trace forming portion. Further, the IC device 90 (electronic component) has a reference terminal (electronic component side reference terminal) 902a that can be electrically connected to the reference probe pin (mounting portion side reference terminal) 162a. Self-synthesis image IM  ₃The center of the reference terminal 902a is detected.  _902aRelative to the center of the reference abutment mark 821a  _821aThe offset ΔY. This detection is also performed by the control unit 800. Next, if the IC device 90 is moved by the offset amount ΔY by appropriately operating the position adjusting mechanism 92 or the posture adjusting mechanism 93 of the hand unit 9, the center O can be made.  _821aAnd center O  _902aConsistent, even if it is consistent. Thus, the hand unit 9 (holding portion) can make the second image IM  ₂Center of the reference terminal (electronic component side reference terminal) 902a  _902a(location) with the first image IM  ₁The center of the reference abutment mark 821a formed by the reference probe pin (mounting portion side reference terminal) 162a  _821aAt least one of the position and posture of the IC device 90 (electronic component) is adjusted so that (the position of the contact mark 821) coincides (coincident) (hereinafter, this adjustment is referred to as "correction"). In the present embodiment, the position of the IC device 90 is adjusted by the operation of the position adjusting mechanism 92 of the hand unit 9, and the adjusted state is shown in FIG. Next, as shown in FIG. 13, the hand unit 9 is further moved toward the positive side in the Y direction, that is, on the side of the inspection unit 16, and is stopped right above the inspection unit 16. In FIG. 13, the moving direction and the amount of movement before stopping the hand unit 9 are indicated by an arrow β.  _9YSaid. Arrow β  _9YIts direction and arrow α  _9YOn the contrary, the amount of movement and the arrow α  _9YThe amount of movement is the same. Next, as shown in FIG. 14, the hand unit 9 is lowered. In FIG. 14, the falling direction and the falling amount of the hand unit 9 at this time are indicated by an arrow β.  _9ZSaid. Arrow β  _9ZIts direction and arrow α  _9ZOn the contrary, the amount of decline and the arrow α  _9ZThe amount of rise is the same. Therefore, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are electrically connected to each other, and the remaining terminals 902 are also electrically connected to the probe pin 162. Therefore, The IC device 90 performs an inspection. Further, in the present embodiment, when the above correction is omitted, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are not brought into contact with each other, and as a result, the IC device 90 cannot be inspected. . As described above, in the electronic component inspection apparatus 1 (electronic component conveying apparatus 10), when the IC device 90 is placed on the inspection unit 16, the hand unit 9 (holding portion) can be based on the imaging unit before the placement 26 shots of the first image IM  ₁With the second image IM  ₂At least one of the position and posture of the IC device 90 (electronic component) with respect to the inspection portion 16 (electronic component mounting portion) is adjusted. With this adjustment, the IC device 90 is placed in a position or posture suitable for being placed on the inspection portion 16, and therefore, after being placed on the inspection portion 16, each terminal 902 and each probe pin 162 can be electrically and accurately connection. Further, while the IC device 90 is placed on the inspection unit 16, an image obtained by adjusting the position or posture of the IC device 90 is obtained by using one imaging unit 26 (first image IM)  ₁And the second image IM  ₂). Thus, various adjustments can be made using a simple configuration of one imaging unit 26. In addition, in order to make the reference abutment mark 821a center O  _821aCenter with reference terminal 902a  _902aIn the present embodiment, the position of the IC device 90 in the Y direction is adjusted, but the present invention is not limited thereto. There is also an IC device 90 held by the hand unit 9, for example, adjusting the position of the IC device 90 in the X direction, or adjusting the posture of the IC device 90 around the Z axis, or appropriately combining the position adjustment in the X direction, and the Y direction. Position adjustment, adjustment of the posture around the Z axis. Further, a plurality of reference contact marks 821a or a plurality of reference terminals 902a may be set for the various adjustments described above. <Second Embodiment> A second embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 16 and 17, but the differences from the above-described embodiments will be mainly described. The matter is omitted from the description. This embodiment is the same as the above-described first embodiment except that the configuration of the contact mark forming portion is different. As described in the first embodiment, the inspection unit 16 (electronic component mounting unit) has a plurality of probe pins (mounting portion side terminals) 162 that can be electrically connected to the IC device 90 (electronic component). As shown in FIG. 16 and FIG. 17, in the present embodiment, the contact mark forming portion is constituted by a lead member 163 (portion) different from the probe pin (mounting portion side terminal) 162. Thereby, for example, the lead member 163 (contact mark forming portion) can be formed to be more likely to form the abutting mark 821 than the probe pin 162. The lead member 163 is not particularly limited. However, for example, a hard resin material which is harder than the probe lead 162 can be used, and the shape of the upper end 163a is more suitable for forming the upper end of the probe pin 162. Contact 821 and so on. Further, as the hard resin material, for example, an acrylic resin is exemplified. Further, the shape of the upper end 163a can be, for example, a shape having a roundness. Further, the arrangement position of the lead member 163 is not limited to the position shown in FIG. 16 or FIG. Also, the lead member 163 may be made of a metal material. In this case, it is preferable that the lead member 163 form an insulating film. <Third Embodiment> A third embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 18 and 19, but the description will be focused on differences from the above-described embodiments, and the same description will be given. The matter is omitted from the description. In the present embodiment, the configuration of the test piece is the same as that of the first embodiment except that the configuration of the contact mark forming portion is different. As shown in Figs. 18 and 19, in the present embodiment, the test piece 8 is a small piece made of, for example, a hard resin material. In addition, when the contact mark forming portion is in contact with the test piece 8, the test piece 8 is provided with a mark providing portion 164 of a mark 83 (see FIG. 19), for example. Marker 83 is an abutment mark. With such a configuration, it is possible to use a single layer as the test piece 8 and to simplify the configuration of the test piece 8. (Fourth Embodiment) A fourth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described below with reference to Figs. 20 to 22, but the differences from the above-described embodiments will be mainly described. The matter is omitted from the description. This embodiment is the same as the above-described first embodiment except for the configuration of the test piece. As described in the first embodiment, the test piece 8 has a member that can be discolored or deformed by imparting force. As shown in FIG. 20 to FIG. 22, in the present embodiment, the test piece 8 is a member which can be deformed by a given force, and has, for example, a base material 81 having a sheet shape and formed on the base material 81. A clay layer 84 made of clay is molded. The clay for molding is not particularly limited, and for example, oily clay or waxy clay can be used. Thereby, when the clay layer 84 receives a reaction force from the reference probe pin 162a (abutment mark forming portion), the portion is plastically deformed. Thereby, the portion after the plastic deformation is the abutment mark 841 (FIG. 21, FIG. 22). The contact mark 841 can be quickly formed by using the test piece 8 having such a configuration. Further, a particulate abrasive material can be kneaded in the clay layer 84. Thereby, when the contact layer 841 is formed on the clay layer 84, the probe pin 162 (reference probe pin 162a) can be polished by the abrasive to cut off the dirt adhering to the probe pin 162. Further, the test piece 8 is plastically deformed in the present embodiment, but is not limited thereto, and may be an elastic deformer. In this case, the material to be elastically deformed is not particularly limited, and for example, a low rebound material such as urethane rubber is preferable, whereby the contact mark can be maintained. (Fifth Embodiment) Hereinafter, a fifth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to Figs. 23 to 30, but the differences from the above-described embodiments will be mainly described. The matter is omitted from the description. This embodiment is the same as the above-described first embodiment except that the position and posture of the IC device when the IC device is placed on the inspection portion are different. As shown in FIG. 23 to FIG. 29, in the present embodiment, the inspection portion 16 has a guide pin 165 that protrudes upward and a guide pin 166 that protrudes upward like the guide pin 165. The guide pin 165 and the guide pin 166 are disposed via the recess 161. An imaging unit (second imaging unit) 27 is disposed above the inspection unit 16 . Similarly to the imaging unit 26, the imaging unit 27 is configured by various cameras such as a CCD (Charge Coupled Devices) camera or a three-dimensional camera. The imaging unit 27 is configured such that the imaging direction thereof is downward and the imaging unit 16 can be imaged. Thereby, the inspection unit image IM can be obtained  ₄(Refer to Figure 30). Further, the device transfer head 17A (device transfer head 17) has a guide 171. The guide plate 171 is coupled to the base portion 94 of the hand unit 9, for example. The large opening portion 172, the guide hole 173, and the guide hole 174 are formed in the guide plate 171. A holding portion 98 of the hand unit 9 is disposed inside the large opening portion 172. The large opening portion 172 is sufficiently large that the holding portion 98 does not interfere with the holding portion 98 even if the holding portion 98 is displaced by the operation of the position adjusting mechanism 92 or the posture adjusting mechanism 93. The guide hole 173 is a portion to which the guide pin 165 of the inspection portion 16 is fitted, and the guide hole 174 is a portion to which the guide pin 166 is fitted (see Fig. 29). Next, in the inspection area A3, the hand unit 9 (the device transfer head 17A) transports the IC device 90 to the inspection unit 16 until an operation (an example) in which the IC device 90 can be inspected is described. As shown in FIG. 23, the hand unit 9 is in a state in which the IC device 90 has not been held, and is located directly above the device supply portion 14A. Next, in this state, by operating the imaging unit 27, the inspection unit image IM can be obtained.  ₄. Self-inspection image IM  ₄Detecting the center of the reference probe pin 162a  _162aAnd the center of the guide 165  ₁₆₅(Refer to Figure 30). In this way, the center O is detected.  _162aAnd center O  ₁₆₅Positional relationship  _162aRelative to the center O  ₁₆₅Where is it located. Further, each detection is performed by the control unit 800. Next, as shown in FIG. 24, the hand unit 9 is lowered until the hand unit 9 comes into contact with the IC device 90 placed on the device supply portion 14A. Thereby, the IC device 90 can be held by the hand unit 9. Next, as shown in FIG. 25, the hand unit 9 is raised to the same height as the hand unit 9 in FIG. Next, as shown in FIG. 26, the hand unit 9 is moved toward the positive side in the Y direction, that is, on the side of the inspection unit 16, and is temporarily stopped in the middle. The stop position of the hand unit 9 is such that the IC device 90 is directly above the imaging unit 26, and the position of the IC device 90 can be captured by the imaging unit 26. Next, the imaging unit 26 is activated at this position, thereby obtaining the device image IM.  ₅(Refer to Figure 30). Self device image IM  ₅The center of the reference terminal 902a is detected.  _902aAnd the center of the guide hole 173 O  ₁₇₃(Refer to Figure 30). In this way, the center O is detected.  _{902 a}And center O  ₁₇₃Positional relationship  _{902 a}Relative to the center O  ₁₇₃Where is it located. Further, each detection is performed by the control unit 800. Next, compare the inspection unit image IM  ₄And device image IM  ₅(arrow C2) with device image IM  ₅Center of O  _902aAnd center O  ₁₇₃The positional relationship becomes the image of the inspection unit IM  ₄Center of O  _162aAnd center O  ₁₆₅At least one of the position and orientation of the IC device 90 is adjusted in such a manner that the positional relationship is equivalent to the positional relationship. In the present embodiment, the position of the IC device 90 is adjusted by the operation of the position adjusting mechanism 92 of the hand unit 9, and the adjusted state is shown in FIG. Again, the device image IM in Figure 30  ₅'A hypothetical image assumed for the state after the adjustment (arrow C3). Next, as shown in FIG. 28, the hand unit 9 is further moved toward the positive side in the Y direction, that is, on the side of the inspection unit 16, and is stopped right above the inspection unit 16. Next, as shown in FIG. 29, the hand unit 9 is lowered. Therefore, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are electrically connected to each other, and the remaining terminals 902 are also electrically connected to the probe pin 162. Therefore, The IC device 90 performs an inspection. Further, in the present embodiment, when the adjustment is omitted, the reference terminal 902a of the IC device 90 and the reference probe pin 162a of the inspection unit 16 are not brought into contact with each other, and as a result, the IC device 90 cannot be inspected. . In the above, the embodiment of the electronic component conveying device and the electronic component inspection device of the present invention has been described. However, the present invention is not limited thereto, and the components constituting the electronic component conveying device and the electronic component inspection device can be replaced with each other. Any constitutive component of the same function. Further, any constituent may be added. Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be formed by combining any two or more of the above-described configurations (features). Further, the imaging unit is fixed in the examination region, but is not limited thereto. For example, the imaging unit may be moved together with the device supply unit. Further, in the case of the position adjustment or the posture adjustment of the IC device, the adjustment is performed on the test piece in the above-described embodiments, but the adjustment is not limited thereto, and an offset may be formed on the IC device (electronic component). And make this adjustment.  

1 Electronic component inspection device 8 Test piece 9 Hand unit 10 Electronic component transport device 11A Pallet transport mechanism 11B Pallet transport mechanism 12 Temperature adjustment unit 13 Device transfer head 14 Device supply unit 14A Device supply unit 14B Device supply unit 15 Pallet transport mechanism 16 Check Part 17 Device transfer head 17A Device transfer head 17B Device transfer head 18 Device recovery unit 18A Device recovery unit 18B Device recovery unit 19 Recovery tray 20 Device transfer head 21 Pallet transport mechanism 22A Pallet transport mechanism 22B Pallet transport mechanism 25 Transport unit 26 Camera Part 27 Imaging unit (second imaging unit) 81 Substrate 82 Microcapsule layer 83 Marking 84 Clay layer 90 IC device 92 Position adjustment mechanism 93 Position adjustment mechanism 94 Base portion 95 First moving portion 96 Second moving portion 97 Rotating portion ( Rotating portion) 98 Holding portion 99 Rotating shaft 141 Concave portion (recess) 161 Concave portion (recess) 162 Probe pin (mounting side terminal) 162a Reference probe pin (mounting side reference terminal) 163 Pin Member 164 Marking portion 165 Guide pin 166 Guide pin 171 Guide plate 172 Large opening portion 173 Guide hole 174 Guide hole 200 Pallet 231 First partition 232 Second partition 233 Third partition 234 Fourth partition 235 Fifth partition 241 Front cover 242 Side cover 243 Side cover 244 Rear cover 245 Top cover 300 Monitor 301 Display screen 400 Signal light 500 Speaker 600 Mouse table 700 Operation panel 800 Control unit 821 Abutment mark 821a Reference abutment mark 841 Abutment mark 902 Terminal (Electronic component side terminal) 902a Reference terminal (electronic component side reference terminal) 911 First piezoelectric actuator 911a Projection portion 912 Second piezoelectric actuator 913 Third piezoelectric actuator (Piezo actuator for rotation) 913a convex portion 941 plate portion 942 fastening portion 943 fastening portion 947 abutment portion 947a lower surface 948 contouring mechanism (cis-shaped mechanism) 951 base portion 952 rail 953 rail 954 first fixing portion 956 fastening portion (guidance) 961 Base 961a Face 963 Rail 971 Support 981 Adsorption surface 982 Adsorption hole 983 Decompression pump A1 Pallet supply area A2 Device supply area A3 Inspection area A4 Device recovery area A5 Pallet removal area C1 Arrow C2 Arrow C3 Arrow IM ₁ 1 Image IM ₂ second image IM ₃ composite image IM ₄ inspection portion image IM ₅ device image IM ₅ 'device image O _162a center O ₁₇₃ center O _821a center O _902a center α _9Y arrow α _9Z arrow α _11A Arrow α _11B arrow α _13X arrow α _13Y arrow α ₁₄ arrow α ₁₅ Arrow α _17Y arrow α ₁₈ arrow α _20X arrow α _20Y arrow α ₂₁ arrow α _22A arrow α _22B arrow α ₉₀ arrow β _9Y arrow β _9Z arrow ΔY offset X direction Y direction Z direction

Fig. 1 is a schematic perspective view showing a first embodiment of the electronic component inspection device of the present invention as seen from the front side. Fig. 2 is a schematic plan view showing an operation state of the electronic component inspection device shown in Fig. 1. Fig. 3 is a partial cross-sectional side view showing the device transfer head disposed in the inspection region of the electronic component inspection device shown in Fig. 1. Fig. 4 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 5 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 6 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 7 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 8 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 9 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 10 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 11 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 12 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 13 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 14 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device shown in Fig. 1 in order. Fig. 15 is an example of an image taken in an inspection area of the electronic component inspection apparatus shown in Fig. 1. Fig. 16 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (second embodiment) of the present invention. Fig. 17 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (second embodiment) of the present invention. Fig. 18 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (third embodiment) of the present invention. Fig. 19 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (third embodiment) of the present invention. Fig. 20 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fourth embodiment) of the present invention. Fig. 21 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fourth embodiment) of the present invention. Fig. 22 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fourth embodiment) of the present invention. Fig. 23 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment) in order. Fig. 24 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 25 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 26 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 27 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 28 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 29 is a partial cross-sectional side view showing the operation of the device transfer head in the inspection region of the electronic component inspection device (fifth embodiment). Fig. 30 is an example of an image taken in an inspection area of the electronic component inspection device (fifth embodiment).

Claims (10)

An electronic component transporting apparatus that is configured to mount an electronic component and has an electronic component mounting portion that can form an abutting mark forming portion of the contact portion of the electronic component or the test piece, and has: And holding the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component held by the holding portion or the And the imaging unit captures the first image of the test piece after the holding portion is held by the holding portion and is in contact with the contact mark forming portion, and the image is captured and held by the first image. In the second image of the electronic component of the holding portion, the holding portion adjusts at least one of a position and a posture of the electronic component with respect to the electronic component mounting portion based on the first image and the second image. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting portion has a plurality of mounting portion side terminals electrically connectable to the electronic component, and the contact mark forming portion is provided by the plurality of mounting portion sides At least one of the terminals is configured to be a terminal on the mounting side. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting portion has a plurality of mounting portion side terminals that are electrically connectable to the electronic component, and the contact mark forming portion is connected to the mounting portion side terminal Different parts are formed. The electronic component transporting apparatus of claim 1, wherein the first image includes an image of the abutting mark, and the second image includes an image of a terminal of the electronic component. The electronic component mounting device according to claim 4, wherein the electronic component mounting portion has a plurality of mounting portion side terminals, and at least one of the plurality of mounting portion side terminals is set to be The mounting portion side reference terminal of the contact forming portion, the electronic component having an electronic component side reference terminal electrically connectable to the mounting portion side reference terminal, wherein the holding portion causes the electronic component in the second image At least one of the position and the posture of the electronic component is adjusted such that the position of the side reference terminal coincides with the position of the contact mark formed by the mounting portion side reference terminal in the first image. The electronic component transporting apparatus of claim 1, wherein the holding portion has a position adjusting mechanism that adjusts a position of the electronic component, and a posture adjusting mechanism that adjusts a posture of the electronic component. The electronic component transporting apparatus of claim 6, wherein the position adjusting mechanism moves the electronic component in a direction orthogonal to a vertical direction. The electronic component transporting apparatus of claim 6, wherein the posture adjusting mechanism is configured to rotate the electronic component about a vertical axis. The electronic component transporting apparatus of claim 1, wherein the test piece has a member that can be discolored or deformed by imparting a force. An electronic component inspection device comprising: an electronic component mounting portion on which an electronic component is placed, and an abutting mark forming portion that can form an abutting mark on the electronic component or the test piece; and a holding portion that holds the component Carrying the electronic component or the test piece, and pressing the electronic component or the test piece to the contact mark forming portion; and the imaging unit capable of capturing the electronic component or the test piece held by the holding portion; The electronic component mounting portion is an inspection portion that can mount and inspect the electronic component, and the imaging portion captures the first image of the test piece after the holding portion holds the test piece and abuts against the contact mark forming portion. And capturing the second image of the electronic component held by the holding portion after the first image is captured, wherein the holding portion adjusts the electronic component relative to the first image and the second image At least one of the position and posture of the electronic component mounting portion.