TW201916232A - Electronic part conveying device and electronic part inspection device can enable the inspection portion executing inspection to be in contact with the electronic part conductively while performing electric inspection for parts - Google Patents

Abstract

An issue of the invention is to provide an electronic part conveying device and electronic part inspection device capable of accurately positioning the retaining portion relative to the support portion through simple composition. The electronic part conveying device of the invention comprises: a region capable of configuring an inspection portion inspecting an electronic part; a shuttle of conveying the electronic part; and a mechanical hand of conveying the electronic part to the inspection portion from the shuttle and conveying it to the shuttle from the inspection portion. Moreover, the mechanical hand has: a retaining portion disposed with a several recess portions and retaining the electronic part; and a support portion disposed with several convex portions and movably supporting the retaining portion. The recess portions and the convex portions are inserted at a plurality of places.

Description

Electronic component transfer device and electronic component inspection device

The invention relates to an electronic component conveying device and an electronic component inspection device.

Conventionally, there has been known a test device that performs an electrical test on electronic parts (components) such as IC (integrated circuit) devices (for example, refer to Patent Document 1). In the test device described in Patent Document 1, when a test is performed on an IC device, the test device is used to transport the IC device to the measurement socket and place the test device on the measurement socket. The test device manipulator includes a swinging body that swings an IC device to press the measurement socket in accordance with the inclination of the measurement socket, and a movement that is arranged by hanging on the swinging body and moves in the X-axis Y-axis θ direction body. The swinging body has a film-like elastic member, such as a rubber film, for swinging the swinging portion body. In addition, the rubber film is deformed by the air supply, and by this deformation, the movable body can be moved in the X-axis Y-axis θ direction. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2003-262660

[Problems to be solved by the invention]

However, in the test device described in Patent Document 1, the robot of the test device may deviate from the position of the swinging body with respect to the swinging body, for example, when the IC device is pressed against the measurement socket or when the IC device is to be transported and accelerated. If this positional deviation is assumed to occur, the IC device and the measurement socket may not be in conductive contact with each other, and it may be difficult to perform the test accurately.

It is also possible to consider a configuration in which a camera (imaging unit) is mounted, and the position deviation is detected by the camera. Based on the detection result, the position deviation is corrected using a piezoelectric element. However, if a positional deviation occurs after the correction, this configuration is also the same as the test device described in Patent Document 1. There is a possibility that the IC device and the measurement socket are not in conductive contact with each other, and as a result, the test may be difficult to perform correctly. [Technical means to solve the problem]

The present invention has been made to solve at least a part of the problems described above, and can be implemented as the following.

The electronic component transfer device of the present invention is characterized by comprising: an area where an inspection unit for inspecting electronic components can be arranged; a shuttle that transports the electronic components; a robotic arm that transports the electronic components from the shuttle to the inspection unit; The inspection unit is transported to a shuttle; and the robot includes: a holding unit that holds the electronic parts; and a support unit that movably supports the holding unit; and the holding unit and the supporting unit each have a plurality of protrusions. The portion and the recessed portion are in contact with each other to position the holding portion relative to the supporting portion.

Thereby, the positioning portion which accurately positions the holding portion with respect to the supporting portion can be simply constituted by a plurality of convex portions and concave portions. In addition, in the positioning state of the positioning portion, even if the inertial force acts on the holding portion holding the electronic part when the robot is trying to move and accelerate, the position of the holding portion relative to the supporting portion can be prevented from deviating. Thereby, for example, in the case of performing an electrical inspection of an electronic component, the inspection section that can perform the inspection can be brought into conductive contact with the electronic component, and accordingly, the inspection of the electronic component can be performed accurately.

In the electronic component transfer device of the present invention, the holding portion is preferably movable to a first position where the convex portion and the concave portion are separated, and a second position where the convex portion and the concave portion are in contact.

Thereby, in the 1st position, the positioning state of a holding part with respect to a support part is cancelled | released. With the release of the positioning state, for example, when the holding part presses the electronic part against the inspection part for inspecting the electronic part, even if the inspection part is slightly tilted, the posture of the holding part can be tilted together with the electronic part following the inspection part. Thereby, the electronic component can be brought into conductive contact with the inspection portion, and thus the inspection of the electronic component can be performed accurately.

In the electronic component conveying device of the present invention, it is preferable that the convex portion is provided on the support portion, and the concave portion is provided on the holding portion.

Thereby, for example, when a convex part and a support part are comprised separately, a convex part can be arrange | positioned in a support part more stably than a moving holding part.

In the electronic component conveying apparatus of the present invention, it is preferable that the robot hand has a driving portion that moves the holding portion. Thereby, the holding portion can be moved at a desired timing.

In the electronic parts conveying device of the present invention, it is preferable that the driving section includes an air pressure section that moves the holding section in one direction by supplying an actuating fluid, and the holding section faces the one direction opposite to the one direction. Push the direction of the projectile.

Thereby, the driving portion can stably move the holding portion with a simple configuration in which the supply of the working fluid is switched and the supply is stopped.

In the electronic component conveying device of the present invention, it is preferable that the electronic component conveying device includes an imaging unit capable of imaging the electronic component held by the holding portion.

Thereby, the position and posture of the manipulator (holding portion) can be adjusted (corrected) according to the shooting result. For example, when the electrical inspection of electronic parts is performed by the inspection unit, the electronic parts and the inspection unit can be brought into conductive contact, so that the electronic parts can be inspected correctly.

The electronic component inspection device of the present invention is characterized by including: an inspection section that inspects the electronic components; a shuttle that transports the electronic components; and a robot arm that transports the electronic components from the shuttle to the inspection section, and from the inspection section And the robot includes: a holding portion that holds the electronic component; a support portion that movably supports the holding portion; and the holding portion and the support portion each having a plurality of convex portions and concave portions, etc. The holding portions are positioned in contact with the supporting portions while being in contact with each other.

Thereby, the positioning part which correctly positions a holding part with respect to a support part can be comprised simply with a some convex part and a recessed part. In addition, in the positioning state of the positioning portion, even if the inertial force acts on the holding portion holding the electronic part when the robot is trying to move and accelerate, the position of the holding portion relative to the supporting portion can be prevented from deviating. Thereby, for example, in the case of performing an electrical inspection of an electronic component, the inspection section that can perform the inspection can be brought into conductive contact with the electronic component, and accordingly, the inspection of the electronic component can be performed accurately.

In addition, the electronic component can be transported to the inspection unit, whereby the inspection of the electronic component can be performed by the inspection unit. In addition, the electronic parts after inspection can be transported from the inspection section.

Hereinafter, the electronic component conveying device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the attached drawings.

<First Embodiment> Hereinafter, a first embodiment of an electronic component conveying device and an electronic component inspection device according to the present invention will be described with reference to FIGS. 1 to 16. In the following, for convenience of explanation, as shown in FIG. 1, three axes that are orthogonal to each other are referred to as an X axis, a Y axis, and a Z axis. The XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. Also, a direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is also referred to as "Y direction (second direction)", and a direction parallel to the Z axis is also It is called "Z direction (third direction)". The direction in which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, the "horizontal" mentioned in the description of the present case is not limited to a complete level, as long as it does not hinder the transportation of electronic parts, it also includes a state inclined slightly (for example, less than 5 °) with respect to the level. The upper side in FIGS. 1 and 3 to 15 (the same applies to FIGS. 17 and 18), that is, the positive side in the Z-axis direction is sometimes referred to as “up” or “upper”, and the lower side, that is, the Z-axis The negative side is called "down" or "down".

The electronic component conveying device 10 of the present invention has an appearance as shown in FIG. 1. The electronic component transfer device 10 of the present invention is a processing machine, and includes: an inspection area A3 (area) in which an inspection section 16 for inspecting electronic parts can be arranged; a device supply section 14 (shuttle) and a device recovery section 18 (shuttle) The electronic components are transferred; the hand assembly 3 (manipulator) transfers the electronic components from the device supply unit 14 (shuttle) to the inspection unit 16, and from the inspection unit 16 to the device recovery unit 18 (shuttle). The hand unit 3 (manipulator) includes a holding portion 4 that holds electronic parts and a supporting portion 5 that movably supports the holding portion 4. Further, each of the holding portion 4 and the supporting portion 5 has a plurality of convex portions 55 and concave portions 45 that are in contact with each other and position the holding portion 4 with respect to the supporting portion 5.

Thereby, as described below, in the electronic component conveying device 10, the positioning portion 8 is formed by a plurality of pairs of the convex portion 55 and the concave portion 45, and the positioning portion 8 has a simple configuration. In addition, by the positioning portion 8, the holding portion 4 can be accurately positioned with respect to the supporting portion 5.

In the positioning state, for example, as shown in FIG. 9 to FIG. 10, when the hand assembly 3 is to be moved to the positive side of the Y-axis direction to accelerate, even if the inertial force acts on the holding portion 4 holding the electronic components, that is, acts In the case of a force of 14 N or less, the deviation of the position of the holding portion 4 from the supporting portion 5 can be suppressed to 5 μm or less. With this, the electronic component can be brought into conductive contact with the inspection section 16 described later, and therefore, the electronic component can be accurately inspected.

As shown in FIG. 2, the electronic component inspection device 1 of the present invention includes an electronic component transfer device 10 and further includes an inspection unit 16 for inspecting electronic components. That is, the electronic component inspection device 1 of the present invention includes: an inspection unit 16 that inspects electronic parts; a device supply unit 14 (shuttle) and a device recovery unit 18 (shuttle), which transport electronic parts; and a hand assembly 3 (manipulator) It transports electronic components from the device supply section 14 (shuttle) to the inspection section 16, and from the inspection section 16 to the device recovery section 18 (shuttle). The hand unit 3 (manipulator) includes a holding portion 4 that holds electronic parts and a supporting portion 5 that movably supports the holding portion 4. Further, each of the holding portion 4 and the supporting portion 5 has a plurality of convex portions 55 and concave portions 45 that are in contact with each other and position the holding portion 4 with respect to the supporting portion 5.

This makes it possible to obtain the electronic component inspection device 1 having the advantages of the electronic component transfer device 10 described above. In addition, since the electronic component can be transported to the inspection unit 16, the inspection unit 16 can inspect the electronic component. In addition, the electronic components after the inspection may be transferred from the inspection unit 16.

Hereinafter, the configuration of each unit will be described in detail. As shown in FIG. 1 and FIG. 2, the electronic component inspection device 1 having the electronic component transfer device 10 transfers electronic components such as IC devices packaged in BGA (Ball Grid Array), and during the transfer process, A device for inspecting and testing the electrical characteristics of electronic parts (hereinafter referred to as "inspection"). In the following, for convenience of explanation, a case where an IC device is used as the above-mentioned electronic component will be described as a representative, and it will be referred to as "IC device 90". The IC device 90 is a flat plate in this embodiment. In addition, the IC device 90 has a plurality of terminals (electronic component-side terminals) 902 arranged in a matrix shape in a plan view on a lower surface thereof. Each terminal 902 has a hemispherical shape.

In addition, as the IC device, in addition to the above, for example, "LSI (Large Scale Intergation)", "CMOS (Complementary Metal Oxide Semiconductor)", "CCD (Charge Coupled Device) ", and" Module IC "which encapsulates IC devices into multiple modules, or" Quartz devices "," Pressure sensors "," Inertial sensors (acceleration sensors) Sensor) "," gyro sensor "," fingerprint sensor ", etc.

The electronic component inspection device 1 (electronic component transfer device 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device recovery area A4, and a tray removal area A5. These areas are separated by respective wall portions as described below. . Further, the IC device 90 is inspected in the inspection area A3 in the middle from the tray supply area A1 to the tray removal area A5 in the direction of the arrow α ₉₀ in this order. As described above, the electronic component inspection device 1 includes the following: an electronic component transfer device 10 having a transfer unit 25 that transfers an IC device 90 (electronic component) through each area; and an inspection unit 16 that is performed in the inspection area A3. Inspection; and control unit 800. In addition, the electronic component inspection apparatus 1 includes a monitor 300, a signal light 400, and an operation panel 700.

In addition, the electronic component inspection apparatus 1 has a side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side, and a side where the inspection area A3 is arranged, that is, the upper side in FIG. Used for the back side.

In addition, the electronic component inspection apparatus 1 is used in advance by a person called a "replacement kit" that replaces each type of the IC device 90. The change kit includes a mounting portion (electronic component mounting portion) on which the IC device 90 (electronic component) is mounted. In the electronic component inspection apparatus 1 according to this embodiment, the placement section is provided at a plurality of locations, and includes, for example, a temperature adjustment section 12, a device supply section 14, and a device recovery section 18 described below. In addition, in addition to the replacement kit as described above, in the mounting portion (electronic component mounting portion) on which the IC device 90 (electronic component) is mounted, there are a tray 200 and a recycling tray 19 prepared by the user. Also includes an inspection section 16.

The tray supply area A1 is a material supply section for supplying a tray 200 in which a plurality of IC devices 90 in an unchecked state are arranged. The tray supply area A1 can also be said to be a mounting area in which a plurality of trays 200 can be stacked and mounted. In this embodiment, a plurality of recesses (grooves) are arranged in a matrix in each tray 200. One IC device 90 can be housed in each of the recesses.

The device supply area A2 is an area where a plurality of IC devices 90 on the tray 200 transferred from the tray supply area A1 are transferred and supplied to the inspection area A3, respectively. Furthermore, tray transfer mechanisms 11A and 11B are provided so as to straddle the tray supply area A1 and the device supply area A2, and carry the tray 200 piece by piece in the horizontal direction. The tray transfer mechanism 11A is a part of the transfer unit 25 and can move the tray 200 together with the IC device 90 placed on the tray 200 toward the positive side of the Y direction, that is, the direction of the arrow α _{11A in} FIG. 2. Thereby, the IC device 90 can be stably fed into the device supply area A2. The tray conveyance mechanism 11B is a moving unit that can move the empty tray 200 to the negative side in the Y direction, that is, in the direction of the arrow α _11B in FIG. 2. Thereby, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

In the device supply area A2, a temperature adjustment section (a temperature equalizing plate (English expression: soap plate, Chinese expression (one example): temperature holding plate)) 12, a device transfer head 13, and a tray transfer mechanism 15 are provided. A device supply unit 14 is also provided that moves across the device supply area A2 and the inspection area A3.

The temperature adjustment section 12 is a mounting section for mounting a plurality of IC devices 90, and can heat or cool the mounted IC devices 90 at a time, and is called a "temperature equalizing plate". With the temperature equalizing plate, the IC device 90 before the inspection by the inspection unit 16 can be heated or cooled in advance, and adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection).

The temperature adjustment section 12 as such a mounting section is fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment section 12 can be stably adjusted. The temperature adjustment unit 12 is grounded.

In the configuration shown in FIG. 2, two temperature adjustment sections 12 are arranged and fixed in the Y direction. Further, the IC devices 90 on the tray 200 carried in from the tray supply area A1 by the tray transfer mechanism 11A are transferred to any one of the temperature adjustment sections 12.

The device transfer head 13 is a device that holds 90 IC devices, and is supported so that it can move in the X and Y directions within the device supply area A2, and is also supported that can move in the Z direction. The device transfer head 13 is also a part of the transfer unit 25, and is responsible for transferring the IC device 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the temperature adjustment unit 12 and the following device supply unit Transfer of IC devices 90 between 14. In FIG. 2, the movement of the device transfer head 13 in the X direction is indicated by an arrow α _13X, and the movement of the device transfer head 13 in the Y direction is indicated by an arrow α _13Y .

The device supply section 14 is a mounting section for mounting the IC device 90 that has been temperature-adjusted by the temperature adjustment section 12, and is a device that can transport the IC device 90 to the vicinity of the inspection section 16 and is called a "supply shuttle" or Referred to as the "supply shuttle". The device supply section 14 may be a part of the transfer section 25. The device supply section 14 includes a recessed portion (groove) 141 (for example, see FIG. 5) in which the IC device 90 is housed and placed.

In addition, the device supply section 14 as a mounting section is supported so as to be able to reciprocate (movably) in the X direction, that is, in the direction of the arrow α ₁₄ between the device supply area A2 and the inspection area A3. With this, the device supply section 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection section 16 of the inspection area A3. Furthermore, the device supply section 14 can use the device transfer head 17 in the inspection area A3. (Hand assembly 3) After removing the IC device 90, it returns to the device supply area A2 again.

In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction. The device supply unit 14 on the negative side in the Y direction is sometimes referred to as “device supply unit 14A”, and the device on the positive side in the Y direction is sometimes referred to. The supply unit 14 is referred to as a "device supply unit 14B". The IC device 90 on the temperature adjustment section 12 is transported to the device supply section 14A or the device supply section 14B in the device supply region A2. The device supply unit 14 is configured to heat or cool the IC device 90 mounted on the device supply unit 14 in the same manner as the temperature adjustment unit 12. Thereby, the IC device 90 temperature-adjusted by the temperature adjustment part 12 can be carried to the vicinity of the inspection part 16 of the inspection area A3 while maintaining the temperature adjustment state. The device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

The tray transfer mechanism 15 is a mechanism that transfers the empty tray 200 from which all IC devices 90 are removed to the positive side in the X direction, that is, in the direction of arrow α ₁₅ in the device supply area A2. After the transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

The inspection area A3 is an area where the IC device 90 is inspected. In this inspection area A3, an inspection section 16 and a device transfer head 17 for inspecting the IC device 90 are provided.

The device transfer head 17 is a part of the transfer unit 25 and, similarly to the temperature adjustment unit 12, can be configured to heat or cool the held IC device 90. The device transfer head 17 includes a hand assembly 3 that holds an IC device 90 (electronic component) as described below. Accordingly, the IC device 90 can be maintained while maintaining the temperature adjustment state, and the IC device 90 can be transported in the inspection area A3 while the temperature adjustment state is maintained.

Such a device transfer head 17 is supported in the inspection area A3 so as to be capable of reciprocating in the Y direction and the Z direction, and is a part of a mechanism called an "indexing arm". Thereby, the device transfer head 17 can lift up the IC device 90 from the device supply section 14 which is carried in from the device supply area A2, and transfer and place the IC device 90 on the inspection section 16.

In FIG. 2, the reciprocating movement of the device transfer head 17 in the Y direction is indicated by an arrow α _17Y . The device transfer head 17 is supported so as to be capable of reciprocating in the Y direction, but is not limited thereto, and may be supported so as to be capable of reciprocating in the X direction. In the configuration shown in FIG. 2, two device transfer heads 17 are arranged in the Y direction, and the device transfer heads 17 on the negative side in the Y direction are sometimes referred to as “device transfer heads 17A”, and the Y direction is positive. The device transfer head 17 on the side is referred to as a "device transfer head 17B". The device transfer head 17A is responsible for transferring the IC device 90 from the device supply section 14A to the inspection section 16 in the inspection area A3, and the device transfer head 17B is responsible for transferring the IC device 90 from the device supply section 14B to the inspection section 16 in the inspection area A3 Transfer of 16.

The inspection portion 16 (socket) is a placement portion (electronic component placement portion) on which the IC device 90, which is an electronic component, is placed and the electrical characteristics of the IC device 90 are inspected. The inspection section 16 has a recessed portion (groove) 161 for accommodating and placing the IC device 90, and a plurality of probe pins (mounting-section-side terminals) 162 are provided at the bottom of the recessed portion 161 (see, for example, FIG. 5 ). In addition, the inspection of the IC device 90 can be performed by the terminal 902 of the IC device 90 and the probe pin 162 being conductively connected or contacted. The inspection of the IC device 90 is performed based on a program stored in an inspection control section provided in a tester connected to the inspection section 16. In addition, the shape of the upper end portion of the probe pin 162 matches the shape of the terminal 902. In this embodiment, it has a crown shape matching the hemispherical terminal 902 (see, for example, FIG. 5).

Such an inspection unit 16 can heat or cool the IC device 90 in the same manner as the temperature adjustment unit 12 and adjust the IC device 90 to a temperature suitable for inspection.

As shown in FIGS. 5 to 14, the electronic component inspection device 1 (electronic component transfer device 10) includes an IC device 90 (electronic component) capable of capturing images held by the holding portion 4 of the device transfer head 17 (hand assembly 3). Camera section 26. The imaging unit 26 is arranged and fixed to the inspection area A3. The imaging section 26 is located between the inspection section 16 and the device supply section 14 (or the device recovery section 18) stopped in the inspection area A3. As described above, the device supply unit 14 includes the device supply unit 14A and the device supply unit 14B. Therefore, the imaging unit 26 is located between the inspection unit 16 and the device supply unit 14A, and between the inspection unit 16 and the device supply unit 14B. Hereinafter, the imaging unit 26 on the side of the device supply 14A (the device recovery unit 18A) will be representatively described. The imaging unit 26 is configured by various cameras such as a CCD (Charge Coupled Device) camera or a three-dimensional camera. The imaging unit 26 has the imaging direction facing upward, and can image the IC device 90 held by the hand unit 3 (see FIG. 9). According to the photographing result, the position and posture of the hand assembly 3 can be adjusted (corrected) so that each terminal 902 of the IC device 90 and the probe pin 162 of the inspection portion 16 corresponding to each terminal 902 can be brought into conductive contact (see FIG. 11). ). Thereby, the inspection of the IC device 90 can be performed correctly.

In addition, the method of adjusting the position and posture of the hand assembly 3 is not particularly limited, and examples thereof include a method of mounting a piezoelectric element on the hand assembly 3 and performing adjustment by driving the piezoelectric element. . The piezoelectric element expands and contracts in the longitudinal direction by applying an AC voltage. In addition, by using the telescopic action, the hand assembly 3 can be moved in the X-axis direction or the Y-axis direction, and the hand assembly 3 can be rotated around the Z-axis. This adjusts the position and posture of the hand assembly 3. The constituent material of the piezoelectric element is not particularly limited, and lead zirconate titanate (PZT), quartz, lithium niobate, barium titanate, lead titanate, lead metaniobate, polyvinylidene fluoride, and zinc niobate can be used. Various kinds of lead, lead niobate, etc.

The device recovery area A4 is an area where a plurality of IC devices 90 are to be inspected in the inspection area A3 and the inspection is completed. In this device recovery area A4, a recovery tray 19, a device transfer head 20, and a tray transfer mechanism 21 are provided. In addition, a device recovery unit 18 is also provided that moves across the inspection area A3 and the device recovery area A4. An empty tray 200 is also prepared in the device recovery area A4.

The device recovery section 18 is an IC device 90 for placing the IC device 90 placed in the inspection section 16 and completing the inspection, and the IC device 90 can be transported to the device recovery area A4. shuttle". The device recovery section 18 may be a part of the transport section 25. The device recovery unit 18 includes a recessed portion (groove) 181 (for example, refer to FIG. 11) in which the IC device 90 is housed and placed.

In addition, the device recovery unit 18 is supported so as to be able to reciprocate between the inspection region A3 and the device recovery region A4 in the X direction, that is, in the direction of the arrow α ₁₈ . In the configuration shown in FIG. 2, the device recovery unit 18 is arranged in the Y direction in the same manner as the device supply unit 14. The device recovery unit 18 on the negative side in the Y direction may be referred to as “device recovery”. The part recovery part 18A "refers to the device recovery part 18 on the positive side in the Y direction as the" device recovery part 18B. " The IC device 90 on the inspection section 16 is transported and placed in the device recovery section 18A or the device recovery section 18B. In addition, the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18A is performed by the device transfer head 17A, and the transfer of the IC device 90 from the inspection unit 16 to the device recovery unit 18B is performed by the device transfer head 17B. The device recovery unit 18 is also grounded in the same manner as the temperature adjustment unit 12 or the device supply unit 14.

The recovery tray 19 is a mounting portion on which the IC device 90 inspected by the inspection portion 16 is placed, and is fixed so as not to move within the device recovery area A4. Thereby, even if it is a device recovery area A4 in which various movable parts such as a relatively large number of device transfer heads 20 are arranged, the inspected IC devices 90 are stably placed on the recovery tray 19. In the configuration shown in FIG. 2, three collection trays 19 are arranged in the X direction.

Three empty trays 200 are also arranged in the X direction. The empty tray 200 is also a mounting portion on which the IC device 90 that is inspected by the inspection portion 16 is placed. Then, the IC device 90 moved to the device recovery section 18 in the device recovery area A4 is transported and placed in any one of the recovery tray 19 and the empty tray 200. Thereby, the IC devices 90 are sorted and collected according to each inspection result.

The device transfer head 20 includes a portion that is supported in the X and Y directions in the device recovery area A4 and can also move in the Z direction. The device transfer head 20 is a part of the transfer unit 25 and can transfer the IC device 90 from the device collection unit 18 to the collection tray 19 or the empty tray 200. In FIG. 2, the movement of the device transfer head 20 in the X direction is represented by an arrow α _20X, and the movement of the device transfer head 20 in the Y direction is represented by an arrow α _20Y .

The tray transfer mechanism 21 is a mechanism that transfers the empty tray 200 carried in from the tray removal area A5 in the device recovery area A4 in the X direction, that is, in the direction of the arrow α ₂₁ . After the transfer, the empty tray 200 is placed at the position where the IC device 90 is collected, that is, it may become any of the three empty trays 200 described above.

The tray removal area A5 is a material discharge portion for collecting and removing the trays 200 in which the plurality of IC devices 90 in the inspected state are arranged. In the tray removing area A5, a plurality of trays 200 can be stacked.

In addition, a tray transfer mechanism 22A and a tray transfer mechanism 22B that transfer the tray 200 one by one in the Y direction are provided across the device recovery area A4 and the tray removal area A5. The tray conveying mechanism 22A is a part of the conveying section 25 and is a moving section that can reciprocate the tray 200 in the Y direction, that is, the direction of the arrow α _22A . Thereby, the inspected IC device 90 can be transferred from the device recovery area A4 to the tray removal area A5. The tray transfer mechanism 22B can be used to move the empty tray 200 of the recovered IC device 90 to the positive side in the Y direction, that is, in the direction of the arrow α _22B . Thereby, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

The control unit 800 can control, for example, the tray transfer mechanism 11A, the tray transfer mechanism 11B, the temperature adjustment unit 12, the device transfer head 13, the device supply unit 14, the tray transfer mechanism 15, the inspection unit 16, the device transfer head 17, the device recovery unit 18, The operations of the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B.

The operator can set and confirm the operating conditions of the electronic component inspection device 1 and the like via the monitor 300. The monitor 300 includes a display screen 301 composed of, for example, a liquid crystal screen, and is arranged on the upper portion of the front side of the electronic component inspection device 1. As shown in FIG. 1, on the right side in the drawing of the tray removal area A5, a mouse stage 600 for placing a mouse is provided. This mouse is used when the screen displayed on the monitor 300 is operated.

An operation panel 700 is disposed on the lower right of FIG. 1 with respect to the monitor 300. The operation panel 700 is a person who issues a required operation command to the electronic component inspection apparatus 1 separately from the monitor 300.

In addition, the signal lamp 400 can report the operation state of the electronic component inspection device 1 and the like by the combination of the colors of light emission. The signal lamp 400 is arranged on the upper part of the electronic component inspection apparatus 1. Furthermore, the electronic component inspection device 1 has a built-in speaker 500, and the speaker 500 can also be used to report the operating state of the electronic component inspection device 1 and the like.

The electronic component inspection device 1 partitions the tray supply area A1 and the device supply area A2 by a first partition wall 231, and partitions the device supply area A2 and the inspection area A3 by a second partition wall 232. The third partition wall 233 partitions the inspection area A3 and the device recovery area A4, and the fourth partition wall 234 partitions the device recovery area A4 and the tray removal area A5. The device supply region A2 and the device recovery region A4 are also separated by a fifth partition wall 235.

The outermost part of the electronic component inspection device 1 is covered by a cover, which includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

As shown in FIGS. 3 and 4, the device transfer head 17 includes at least one hand unit 3 (manipulator). As shown in FIGS. 5 to 11, the hand assembly 3 can hold the IC device 90 (electronic component) on the device supply section 14 and transport it to the inspection section 16. In addition, as shown in FIGS. 11 to 15, after the hand component 3 is inspected by the IC device 90, the IC device 90 on the inspection section 16 can be held and transferred to the device recovery section 18. The number of dispositions of the hand unit 3 is not particularly limited. As shown in FIGS. 3 and 4, the hand unit 3 includes a holding portion 4, a supporting portion 5, a driving portion 6, and a detecting portion 7. In addition, a lifting device and a rotating device (not shown) are arranged on the upper side of the hand unit 3. The lifting device is a device that raises and lowers the hand assembly 3 in the Z-axis direction. The rotating device is a device for rotating the hand assembly 3 about the central axis O4.

The holding portion 4 is a portion that holds the IC device 90. The holding portion 4 includes a pressing portion 41, a heating portion 42, and a suction portion 43.

The pressing portion 41 has a cylindrical shape, and has a flange portion (upper flange portion) 411 with an enlarged outer diameter at an upper portion and a flange portion (lower flange portion) 412 with an enlarged outer diameter at a lower portion. The outer diameters of the flange portion 411 and the flange portion 412 may be the same or different. A rib (projection) 413 is formed on the outer peripheral portion of the flange portion 411 so as to protrude annularly in the circumferential direction.

Below the flange portion 412 of the pressing portion 41, a heating portion 42 for heating the IC device 90 is fixed. The heating section 42 has a cylindrical shape, and a heater 421 is built in the heating section 42. Heat is generated by the operation of the heater 421. This heat is transferred to the IC device 90 via the adsorption section 43. Thereby, the IC device 90 can be heated and adjusted in advance to a temperature suitable for inspection. The holding portion 4 may include a cooling portion that cools the IC device 90 in addition to the heating portion 42.

Below the heating portion 42, an adsorption portion 43 that adsorbs and holds the IC device 90 is fixed. The suction section 43 includes a suction section body 431 and a suction pad (sucker) 432. The suction part main body 431 is formed in the first recessed part 433 opened on the lower surface of the suction part main body 431 and the second recessed part 434 opened in the first recessed part 433 and deeper than the first recessed part 433. An adsorption pad 432 is fixed to the second concave portion 434. The suction pad 432 is connected to one end side of a flow path 435 formed inside the suction part body 431. The other end of the flow path 435 is connected to a pipe 44. The piping 44 is connected to a vacuum pump via a solenoid valve (not shown). This solenoid valve can switch the pressure of the piping 44 to negative pressure and atmospheric pressure. In addition, when the pressure of the piping 44 is a negative pressure, an attraction force is generated on the adsorption pad 432 and the IC device 90 can be adsorbed and held. When the pressure of the piping 44 is atmospheric pressure, the IC device 90 can be released from the adsorption pad 432.

The support part 5 is a part which supports the holding part 4 so that it can move between a 1st position (refer FIG. 3), and a 2nd position (refer FIG. 4) lower than a 1st position. The support portion 5 includes a base portion 51, a hollow support portion body 52 located below the base portion 51, and a connection portion 53 located above the base portion 51. The base portion 51 is connected to the rotation device via a connection portion 53. A through-hole 522 is formed in the support portion body 52 and communicates with the hollow portion 521. A portion between the flange portion 411 and the flange portion 412 of the pressing portion 41 is inserted into the through hole 522 with a gap left. In addition, the support portion 5 has a flow path 54 formed by penetrating the base portion 51 and the support portion body 52 together. One end of the flow path 54 communicates with the hollow part 521 of the support part body 52, and the other end is connected to a pump (not shown) via a pipe.

The hand unit 3 (manipulator) includes a driving unit 6 that moves the holding unit 4 in the Z-axis direction. With the driving section 6, the holding section 4 can be moved to the first position or the second position at a desired timing.

The driving portion 6 includes an air pressure portion 61 that moves the holding portion 4 downward (in one direction) by the supply of air (working fluid), and a bomb that pushes the holding portion 4 upward (in the opposite direction to one direction). Push section 62.

The air pressure part 61 is provided so that the hollow part 521 of the support part body 52 is divided into two parts, and it has the diaphragm 63 to which the flange part 411 of the pressing part 41 is fixed, and the said connection via the flow path 54 and the said pipe Pump. When the pump is actuated, air is supplied to a space surrounded by the diaphragm 63 and the support portion body 52 on the upper side, and the pressure in the space is increased. Thereby, the holding portion 4 can move downward against the elastic thrust of the elastic pushing portion 62, that is, move from the first position to the second position.

The pushing portion 62 is configured by a coil spring disposed in the hollow portion 521 of the support portion body 52. The coil spring is compressed between the inner lower surface 523 of the support portion body 52 and the rib portion 413 of the pressing portion 41. Thereby, the holding portion 4 is pushed upward, that is, pushed in the direction from the second position to the first position. In addition, in a state where the air pressure portion 61 is stopped, that is, a state in which the supply of air is stopped, the holding portion 4 is located at the first position by the elastic pushing force of the elastic pushing portion 62. In addition, when the holding portion 4 is located at the first position, the diaphragm 63 may also abut the inner upper surface 524 of the support portion body 52, but as shown in FIG. 3, it is preferable to form a gap with the inner upper surface 524. In this case, it is preferable that the hand unit 3 has a restricting portion (stop) that restricts the movement limit of the holding portion 4 to the first position.

As described above, the driving unit 6 can switch the supply of air and stop the supply of the air, so that the holding unit 4 can move stably.

The detection portion 7 is a portion that detects the inclination of the holding portion 4 with respect to the horizontal direction, that is, the XY plane. The detection section 7 includes a light sensor 71 fixed to the support section 5 and a shielding plate 72 fixed to the holding section 4. These are paired (one group), and a plurality of pairs are arranged. In this embodiment, a group of the light sensor 71 and the shielding plate 72 are arranged on the positive side of the X-axis direction with respect to the holding portion 4 (hereinafter referred to as "the first group"), and a group is arranged on the negative side of the X-axis direction. (Hereinafter referred to as "the second group"), one group is disposed on the positive side of the Y-axis direction (hereinafter referred to as "the third group"), and one group is disposed on the negative side of the Y-axis direction (hereinafter referred to as the "fourth group") team 1. Moreover, the inclination of the holding portion 4 can be detected by the shielding state of the light sensor 71 by the shielding plates 72 of each group. In this embodiment, the first and second groups detect the tilt (rotation) of the holding portion 4 about the Y axis, and the third and fourth groups detect the tilt (rotation) of the holding portion 4 about the X axis.

As shown in FIG. 4, the hand assembly 3 includes a positioning portion 8 that positions the holding portion 4 at the second position relative to the supporting portion 5. The positioning portion 8 is composed of a convex portion 55 provided in the support portion body 52 of the support portion 5 and a concave portion 45 provided in the pressing portion 41 of the holding portion 4.

The convex portion 55 and the concave portion 45 are paired, and a plurality of pairs are arranged. As shown in FIG. 16, in this embodiment, two sets of the convex portion 55 and the concave portion 45 are arranged around the central axis O4 of the holding portion 4, that is, one set is arranged on the left and right sides of the center axis O4 in the figure. In addition, the convex portion 55 and the concave portion 45 of each group are connected to each other when the holding portion 4 is moved from the first position to the second position by supplying air by the actuation of the driving portion 6 as described above. Connected. Thereby, the movement in the XY plane direction (horizontal direction) of the holding portion 4 located at the second position is restricted, and the holding portion 4 is positioned relative to the supporting portion 5. This state is hereinafter referred to as a "positioning state".

As shown in FIG. 3 and FIG. 4, the convex portion 55 protrudes from the inner lower surface 523 of the support portion body 52 of the support portion 5 and is formed by a cylindrical guide pin having a constant outer diameter.

On the other hand, the concave portion 45 is formed on the lower surface of the flange portion 411 of the pressing portion 41 of the holding portion 4 to face the convex portion 55. The recessed portion 45 is formed of a through hole having a constant inner diameter.

With this shape, when the convex portion 55 and the concave portion 45 of each group are located at the second position of the holding portion 4, the convex portion 55 can easily enter the concave portion 45 and then contact each other. Thereby, every time the holding portion 4 is located at the second position, the positioning state is reproduced.

In addition, when the holding portion 4 is located at the second position, the convex portion 55 and the concave portion 45 have a size relationship with each other. Moreover, the geometric tolerance is not particularly limited, and it is preferable that, for example, the convex portion 55 is "g6" and the concave portion 45 is "H7".

As described above, in the electronic component inspection device 1 (electronic component conveying device 10), the positioning portion 8 is constituted by a plurality of pairs of the convex portions 55 and the concave portions 45, and the positioning portion 8 has a simple configuration. In addition, by the positioning portion 8, the holding portion 4 at the second position can be accurately positioned with respect to the support portion 5.

Moreover, in the positioning state, for example, as shown in FIG. 9 to FIG. 10, when the hand assembly 3 is to be moved to the positive side of the Y-axis direction to accelerate, even if an inertial force acts on the holding portion 4 holding the IC device 90, it can be prevented. The holding portion 4 is offset from the supporting portion 5. Thereby, the correction state of the hand assembly 3 according to the imaging result of the imaging section 26 described above is maintained, and thus, each terminal 902 of the IC device 90 and the probe pin of the inspection section 16 corresponding to each terminal 902 can be made. 162 may be conductively contacted (see FIG. 11). Thereby, the inspection of the IC device 90 can be performed correctly.

As described above, the convex portion 55 is provided on the support portion body 52 of the support portion 5, and the concave portion 45 is provided on the pressing portion 41 of the holding portion 4. Therefore, for example, when the convex portion 55 and the support portion body 52 are separately configured, the convex portion 55 can be more stably and easily disposed on the inner lower surface 523 of the support portion body 52 than the moving holding portion 4.

In addition, the holding portion 4 can be moved to a first position where the convex portion 55 and the concave portion 45 are separated (see FIG. 3) and a second position where the convex portion 55 and the concave portion 45 are in contact (see FIG. 4). Thereby, the positioning state is released at the first position. With the release of this positioning state, for example, when the IC device 90 is pressed against the inspection unit 16 by the holding unit 4, even if the inspection unit 16 is slightly inclined with respect to the XY plane, the posture of the retaining unit 4 can be similar to the inspection unit and the IC device 90 Leaning together. Thereby, the IC device 90 can be brought into conductive contact with the inspection portion 16, and therefore, the IC device 90 can be inspected accurately.

Next, the operation of the hand assembly 3 (device transfer head 17A) in the inspection area A3 will be described with reference to FIGS. 5 to 15.

As shown in FIG. 5, the hand assembly 3 is in a state where the holding portion 4 is located at the first position and the IC device 90 has not been held yet. In addition, the hand unit 3 is in a state facing the concave portion 141 directly above the concave portion 141 of the device supply portion 14A. An IC device 90 is housed and placed in the recess 141.

Thereafter, as shown in FIG. 6, the driving unit 6 is operated to move the holding unit 4 to the second position. At this time, as described above, the holding portion 4 is positioned by the positioning portion 8. The operation of the driving unit 6 is continued until the state shown in FIG. 15 is reached.

Thereafter, as shown in FIG. 7, the hand unit 3 is lowered until the suction unit 43 of the hand unit 3 (the holding unit 4) presses the IC device 90 placed on the device supply unit 14A. In addition, since the attraction portion 43 is attracted in this state, the adsorption portion 43 can be caused to attract (hold) the IC device 90. The holding portion 4 receives a reaction force from the IC device 90 and moves upward from the second position. Thereby, the positioning state of the holding portion 4 is released.

Thereafter, as shown in FIG. 8, the hand assembly 3 is raised to the same height as the hand assembly 3 in FIG. 5. Thereby, the IC device 90 rises together with the hand unit 3. Since the holding portion 4 is released from the reaction force described above, the holding portion 4 returns to the second position again and enters a positioning state.

Next, as shown in FIG. 9, the hand unit 3 is moved to the positive side in the Y direction, that is, the inspection unit 16 side, and is temporarily stopped in the middle. The stop position of the hand assembly 3 is a position where the IC device 90 is directly above the imaging section 26 and the IC device 90 can be photographed by the imaging section 26. Then, the imaging unit 26 is operated at this position. Thereafter, as described above, the position and posture of the hand unit 3 are corrected based on the imaging results.

Thereafter, as shown in FIG. 10, the hand assembly 3 is further moved to the positive side in the Y direction, that is, the inspection section 16 side, and stopped just above the inspection section 16.

However, when the hand assembly 3 is to be moved to the positive side in the Y-axis direction and accelerated, an inertial force acts on the holding portion 4. Although the holding portion 4 intends to move to the negative side in the Y-axis direction together with the IC devices 90 due to the inertial force, the holding portion 4 is restricted in movement to the negative side in the Y-axis direction because it is in a positioning state. With this, the positional deviation of the holding portion 4 relative to the supporting portion 5 can be prevented, and therefore, the correction state of the hand assembly 3 remains unchanged.

In addition, even when the correction is performed after imaging, and a force of 14 N or less is exerted on the holding portion due to the corrected acceleration inertial force, the deviation between the holding portion and the supporting portion is suppressed to 5 μm or less, so that the inspection can be performed accurately.

Thereafter, as shown in FIG. 11, the hand assembly 3 is lowered until the IC device 90 is pressed against the inspection unit 16. Thereby, the positioning state is maintained until each terminal 902 of the IC device 90 and the probe pin 162 of the inspection section 16 corresponding to each terminal 902 can be conductively contacted, so that the IC device 90 can be inspected correctly.

The holding unit 4 receives a reaction force from the inspection unit 16 via the IC device 90 and moves upward from the second position. Thereby, the positioning state of the holding portion 4 is released. Thereby, even if it is assumed that the inspection section 16 is slightly inclined with respect to the XY plane, the posture of the holding section 4 can be tilted together with the IC device 90 similarly to the inspection section 16. Thereby, the IC device 90 can be brought into conductive contact with the inspection portion 16, and therefore, the IC device 90 can be inspected accurately.

The device supply unit 14A retreats from the inspection area A3, and instead, the device recovery unit 18A is located in the inspection area A3.

Thereafter, as shown in FIG. 12, the hand assembly 3 is raised to the same height as the hand assembly 3 in FIG. 10. Thereby, the inspected IC device 90 rises together with the hand unit 3. The positioning state with respect to the holding portion 4 is reproduced.

Thereafter, as shown in FIG. 13, the hand assembly 3 is further moved to the negative side in the Y direction, that is, it is moved to the device recovery unit 18A side, and stopped just above the device recovery unit 18A.

However, when the hand assembly 3 is to be moved to the negative side in the Y-axis direction to accelerate, an inertial force acts on the holding portion 4. Although the holding portion 4 intends to move to the positive side in the Y-axis direction together with each IC device 90 due to the inertial force, the holding portion 4 is restricted from moving to the positive side in the Y-axis direction due to the positioning state. This can prevent the position of the holding portion 4 from being deviated from the supporting portion 5.

Thereafter, as shown in FIG. 14, the hand unit 3 (the holding portion 4 in the positioning state) is lowered, and thereafter, the suction force is stopped at the suction portion 43. As a result, the IC device 90 is released from the suction portion 43 and is accurately stored and placed in the recessed portion 181 of the device recovery portion 18A.

Thereafter, as shown in FIG. 15, the hand assembly 3 is raised to the same height as the hand assembly 3 in FIG. 13.

In addition, in the present structure, the plurality of concave portions 45 and the convex portions 55 are separated at the same time. For example, both sides of the holding portion 4 and the supporting portion 5 are separated in parallel to a direction orthogonal to the pressing direction. The plurality of concave portions 45 and the convex portions 55 are simultaneously contacted. For example, both sides of the holding portion 4 and the supporting portion 5 are in contact with each other in a direction orthogonal to the pressing direction.

<Second Embodiment> Hereinafter, a second embodiment of the electronic component transfer device and the electronic component inspection device according to the present invention will be described with reference to FIG. 17, but the differences from the above embodiment will be mainly described, and the same matters will be omitted. Its description.

This embodiment is the same as the first embodiment described above except that the number of the concave portions and the convex portions constituting the positioning portion is different.

As shown in FIG. 17, in the present embodiment, three sets of convex portions 55 and concave portions 45 constituting the positioning portion 8 are arranged at equal angular intervals around the central axis O4 of the holding portion 4. Thereby, the positioning accuracy is further improved as compared with the first embodiment.

<Third Embodiment> Hereinafter, a third embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIG. 18, but the differences from the above embodiment will be mainly described, and the same matters will be omitted Its description.

This embodiment is the same as the second embodiment described above except that the number of the concave portions and the convex portions constituting the positioning portion is different.

As shown in FIG. 18, in the present embodiment, four sets of convex portions 55 and concave portions 45 constituting the positioning portion 8 are arranged at equal angular intervals around the central axis O4 of the holding portion 4. Thereby, the positioning accuracy is further improved as compared with the second embodiment.

The electronic component transfer device and the electronic component inspection device of the present invention have been described above with reference to the illustrated embodiment. However, the present invention is not limited to this. Each part constituting the electronic component transfer device and the electronic component inspection device can be replaced with one that can perform the same function. Arbitrary constituents. Moreover, you may add another arbitrary structure.

In addition, the electronic component transfer device and the electronic component inspection device of the present invention may be a combination (a feature) of any two or more of the embodiments described above.

The imaging unit is fixed in the inspection area, but it is not limited to this. For example, it may be a person who can move with the device supply unit.

The working fluid used in the driving unit that moves the holding unit is air in each of the above embodiments, but it is not limited to this, and may be, for example, liquid (oil).

In addition, although the air pressure portion of the driving portion is configured with a diaphragm, it is not limited to this. For example, a structure including a pressure regulating valve or a piston-type hydraulic cylinder may be used.

In addition, the groups of the convex portion and the concave portion constituting the positioning portion are two groups in the first embodiment and the second embodiment, three groups in the second embodiment, and four groups in the third embodiment. It is not limited to this, and may be 5 or more groups, for example.

In each of the above embodiments, the convex portion and the concave portion constituting the positioning portion are provided with the convex portion on the support portion and the concave portion on the holding portion, but the invention is not limited to this. For example, the convex portion may be provided on the holding portion. , Set the recessed portion to the support portion.

1‧‧‧Electronic parts inspection device

3‧‧‧hand assembly

4‧‧‧ holding department

5‧‧‧Support Department

6‧‧‧Driver

7‧‧‧Testing Department

8‧‧‧ Positioning Department

10‧‧‧Electronic parts transfer device

11A‧‧‧Tray transfer mechanism

11B‧‧‧Tray transfer mechanism

12‧‧‧Temperature Adjustment Department

13‧‧‧ device transfer head

14‧‧‧Device Supply Department

14A‧‧‧Device Supply Department

14B‧‧‧Device Supply Department

15‧‧‧pallet transfer mechanism

16‧‧‧ Inspection Department

17‧‧‧ device transfer head

17A‧‧‧device transfer head

17B‧‧‧ Device Transfer Head

18‧‧‧Device Recycling Department

18A‧‧‧Device Recycling Department

18B‧‧‧Device Recycling Department

19‧‧‧Recycling tray

20‧‧‧ device transfer head

21‧‧‧Tray transfer mechanism

22A‧‧‧Tray transfer mechanism

22B‧‧‧Tray transfer mechanism

25‧‧‧Transportation Department

26‧‧‧ Camera Department

41‧‧‧Pressing section

42‧‧‧Heating section

43‧‧‧ Adsorption Department

44‧‧‧Piping

45‧‧‧ recess

51‧‧‧ base

52‧‧‧ Support Department

53‧‧‧Connection Department

54‧‧‧flow

55‧‧‧ convex

61‧‧‧Air compressor

62‧‧‧Bomb Pusher

63‧‧‧ diaphragm

71‧‧‧light sensor

72‧‧‧shield

90‧‧‧IC device

141‧‧‧Concave (groove)

161‧‧‧ recess (groove)

162‧‧‧probe pin

181‧‧‧concave (groove)

200‧‧‧tray

231‧‧‧The first partition

232‧‧‧Second partition

233‧‧‧ 3rd partition

234‧‧‧ 4th partition

235‧‧‧ 5th partition

241‧‧‧Front cover

242‧‧‧side cover

243‧‧‧side cover

244‧‧‧back cover

245‧‧‧Top cover

300‧‧‧ monitor

301‧‧‧display

400‧‧‧ signal light

411‧‧‧ flange

412‧‧‧ flange

413‧‧‧ rib (projection)

421‧‧‧heater

431‧‧‧Adsorption unit body

432‧‧‧Adsorption pad (suction cup)

433‧‧‧1st recess

434‧‧‧2nd recess

435‧‧‧flow

500‧‧‧Speaker

521‧‧‧Hollow Department

522‧‧‧through hole

523‧‧‧ inside lower surface

524‧‧‧ inside upper surface

600‧‧‧Mouse Station

700‧‧‧ operation panel

800‧‧‧ Control Department

902‧‧‧Terminal (electronic component side terminal)

A1‧‧‧Tray supply area

A2‧‧‧Device supply area

A3‧‧‧ Inspection area

A4‧‧‧device recycling area

A5‧‧‧Tray removal area

O4‧‧‧center axis

X‧‧‧ direction

Y‧‧‧ direction

Z‧‧‧ direction

α _11A ‧‧‧ Arrow

α _11B ‧‧‧ Arrow

α _13X ‧‧‧ Arrow

α _13Y ‧‧‧ Arrow

α ₁₄ ‧‧‧arrow

α ₁₅ ‧‧‧arrow

α _17Y ‧‧‧ Arrow

α ₁₈ ‧‧‧ arrow

α _20X ‧‧‧ Arrow

α _20Y ‧‧‧ Arrow

α ₂₁ ‧‧‧ Arrow

α _22A ‧‧‧ Arrow

α _22B ‧‧‧ Arrow

α ₉₀ ‧‧‧ arrow

Fig. 1 is a schematic perspective view showing an electronic component inspection device (first embodiment) of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection device shown in FIG. 1. FIG. FIG. 3 is a vertical cross-sectional side view of a device transfer head disposed in an inspection area of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 4 is a vertical cross-sectional side view of a device transfer head disposed in an inspection area of the electronic component inspection apparatus shown in FIG. 1. FIG. FIG. 5 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 6 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 7 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 8 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 9 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 10 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 11 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 12 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 13 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in sequence. FIG. 14 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in order. FIG. 15 is a vertical cross-sectional side view showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. 1 in order. FIG. 16 is a top view of the device transfer head shown in FIG. 4. FIG. FIG. 17 is a plan view of a device transfer head disposed in an inspection area of an electronic component inspection apparatus (second embodiment) of the present invention. FIG. 18 is a plan view of a device transfer head arranged in an inspection area of the electronic component inspection apparatus (third embodiment) of the present invention.

Claims (8)

An electronic component conveying device comprising an area where an inspection section for inspecting electronic components is arranged, and is characterized by: a shuttle that transports the electronic components, and a robot that transports the electronic components from the shuttle to the inspection section, And the robot is provided with: a holding portion provided with a plurality of concave portions, and holding the electronic parts, and a support portion provided with a plurality of convex portions, and the holding portion is movable Ground support; the concave portion and the convex portion are fitted at a plurality of positions. An electronic component conveying device comprising an area where an inspection section for inspecting electronic components is arranged, and is characterized by: a shuttle that transports the electronic components, and a robot that transports the electronic components from the shuttle to the inspection section, And the robot is provided with: a holding portion provided with a plurality of convex portions, and holding the electronic parts, and a support portion provided with a plurality of concave portions, and the holding portion is movable Ground support; the concave portion and the convex portion are fitted at a plurality of positions. The electronic component transfer device according to claim 1 or 2, wherein the holding portion is moved to a first position where the convex portion is separated from the concave portion, and a second position where the convex portion is in contact with the concave portion. The electronic component conveying device according to claim 1 or 2, wherein the robot includes a driving section for moving the holding section. The electronic component conveying device according to claim 4, wherein the driving section has an air pressure section that moves the holding section in one direction by supplying an actuating fluid, and the spring section pushes the holding section in a direction opposite to the one direction. Bullet Pusher. The electronic component conveying device according to claim 1 or 2, further comprising an image pickup section for imaging the electronic component held by the holding section. An electronic component inspection device includes an inspection unit that inspects electronic components, a shuttle that transports the electronic components, and a robot that transports the electronic components from the shuttle to the inspection unit, and from the inspection unit. And the robot includes: a holding portion provided with a plurality of concave portions and holding the electronic parts; and a support portion provided with a plurality of convex portions and movably supporting the holding portion; the concave portion It fits into the said convex part in multiple places. An electronic component inspection device includes an inspection unit that inspects electronic components, a shuttle that transports the electronic components, and a robot that transports the electronic components from the shuttle to the inspection unit, and from the inspection unit. And the robot includes: a holding portion provided with a plurality of convex portions and holding the electronic parts, and a support portion provided with a plurality of concave portions and movably supporting the holding portion; the concave portion It fits into the said convex part in multiple places.