TW201900750A - 高介電常數及低介電消散之聚合物複合物 - Google Patents
高介電常數及低介電消散之聚合物複合物 Download PDFInfo
- Publication number
- TW201900750A TW201900750A TW107115193A TW107115193A TW201900750A TW 201900750 A TW201900750 A TW 201900750A TW 107115193 A TW107115193 A TW 107115193A TW 107115193 A TW107115193 A TW 107115193A TW 201900750 A TW201900750 A TW 201900750A
- Authority
- TW
- Taiwan
- Prior art keywords
- average diameter
- composition
- conductive
- silicon
- polymer
- Prior art date
Links
- 229920000642 polymer Polymers 0.000 title claims description 16
- 239000002131 composite material Substances 0.000 title description 4
- 239000000203 mixture Substances 0.000 claims abstract description 45
- 239000000835 fiber Substances 0.000 claims abstract description 18
- 239000002245 particle Substances 0.000 claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- -1 polysiloxane Polymers 0.000 claims description 40
- 229920001296 polysiloxane Polymers 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 21
- 239000011159 matrix material Substances 0.000 claims description 9
- 239000002657 fibrous material Substances 0.000 claims description 4
- 239000002952 polymeric resin Substances 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000011236 particulate material Substances 0.000 claims 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000003054 catalyst Substances 0.000 description 21
- 239000002105 nanoparticle Substances 0.000 description 15
- 239000002134 carbon nanofiber Substances 0.000 description 14
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 11
- 125000003342 alkenyl group Chemical group 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 150000003961 organosilicon compounds Chemical class 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910010413 TiO 2 Inorganic materials 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000012065 filter cake Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 238000006459 hydrosilylation reaction Methods 0.000 description 3
- 125000005358 mercaptoalkyl group Chemical group 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002121 nanofiber Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002048 multi walled nanotube Substances 0.000 description 2
- 239000012038 nucleophile Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- COLOHWPRNRVWPI-UHFFFAOYSA-N 1,1,1-trifluoroethane Chemical compound [CH2]C(F)(F)F COLOHWPRNRVWPI-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 238000006596 Alder-ene reaction Methods 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N acetoacetic acid Chemical compound CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229910052768 actinide Inorganic materials 0.000 description 1
- 150000001255 actinides Chemical class 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical group C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 125000004188 dichlorophenyl group Chemical group 0.000 description 1
- PYBNTRWJKQJDRE-UHFFFAOYSA-L dodecanoate;tin(2+) Chemical compound [Sn+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O PYBNTRWJKQJDRE-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000011953 free-radical catalyst Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- AFCAKJKUYFLYFK-UHFFFAOYSA-N tetrabutyltin Chemical compound CCCC[Sn](CCCC)(CCCC)CCCC AFCAKJKUYFLYFK-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 1
- SYRHIZPPCHMRIT-UHFFFAOYSA-N tin(4+) Chemical class [Sn+4] SYRHIZPPCHMRIT-UHFFFAOYSA-N 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/08—Oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2231—Oxides; Hydroxides of metals of tin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
一種組成物，其包含：a)導電纖維，其等包含碳、導電氧化物或金屬；且具有1至20,000 nm之平均直徑及至少五倍該平均直徑之平均長度；及b)非導電粒子，其等具有1至20,000 nm之平均直徑。
Description
本發明關於一種包含纖維填料及粒子填料之聚合物複合物，尤其是一種包含纖維導電填料及非導電粒子填料之聚合物複合物，其可用於電致動應用中。其進一步關於一種將纖維填料結合至聚合基質中之方法。
除了電致動外，還有許多應用希望增加聚合物之介電常數。為此目的已經應用許多技術，包括化學修飾主鏈及側基，以及結合高介電常數填料。增加介電常數的共同缺點是介電損耗會一起增加。介電損耗增加可能造成較高的能量消耗、裝置操作期間的熱產生、信號延遲，並且增加洩漏電流。已經用鈦酸鋇來填充聚矽氧膜以提供介電膜致動器，參見例如Y. Liu et al.,Smart Mater.Struct
.,18
(2009) 095024。然而，此參考文獻揭示介電損耗會隨著鈦酸鋇量提高而增加。
要完全利用這些方法來增加介電常數尚有未解決的問題，但是利用創新技術可抑制介電損耗的增加。此外，彈性模數的增加應降至最低。
本發明提供一種組成物，其包含： a) 導電纖維，其等包含碳、導電氧化物或金屬；且具有1至20,000 nm之平均直徑及至少五倍該平均直徑之平均長度；及 b) 非導電粒子，其等具有1至20,000 nm之平均直徑。
本發明亦提供一種方法，其包含： c) 藉由物理吸附或化學氧化而在纖維材料上產生表面電荷； d) 在該表面上添加帶有相反電荷之粒子材料以形成混合物；及 e) 將該混合物與聚合物混合。
除非特別註明，否則百分比為重量百分比(wt%)且溫度使用℃。除非特別註明，否則操作是在室溫下執行。如本文中所使用，除非另有指示，否則分子量、Mn
、Mw
、及Mz
具有習知意義，且係藉由凝膠滲透層析術判定。在本文中以g/mol之單位記述分子量。矽醇指數係以FT-IR來判定，如實例中所述。
較佳的是，該組成物進一步包含聚合物基質，較佳的是包含聚矽氧烷者。較佳的是，聚矽氧烷係生產自選自下列者之可固化聚矽氧組成物：(a)矽氫化可固化聚矽氧組成物；(b)縮合可固化聚矽氧組成物；(c)硫醇-烯(thiol-ene)反應可固化聚矽氧組成物；(d)自由基可固化聚矽氧組成物；及(e)開環反應可固化聚矽氧組成物。以上各者可使用所述者以外之方式或藉由多種方式之組合來固化。
矽氫化可固化聚矽氧組成物一般包含：(A)有機聚矽氧烷(organopolysiloxane)，其每分子平均具有至少兩個矽鍵結烯基或矽鍵結氫原子；(B)有機矽化合物，其每分子平均具有至少兩個能夠與該有機聚矽氧烷(A)中之矽鍵結烯基或矽鍵結氫原子反應的矽鍵結氫原子或矽鍵結烯基；以及(C)矽氫化催化劑。有機聚矽氧烷(A)及有機矽化合物(B)可獨立地係線性、支鏈、環狀、或樹脂質的。特定而言，有機聚矽氧烷(A)及有機矽化合物(B)可包含M、D、T、及Q單元之任何組合。M代表單官能單元R0 3
SiO1/2
。D代表二官能單元R0 2
SiO2/2
。T代表三官能單元R0
SiO3/2
。Q代表四官能單元SiO4/2
。各R0
可係任何烴、芳族、脂族、烷基、烯基、或炔基。包含重複D單元之有機聚矽氧烷係實質上線性的，但可包括一些由T及/或Q單元而來的支鏈。當有機聚矽氧烷主要係線性的，所得結構係彈性的(elastomeric)。在較佳實施例中，有機聚矽氧烷(A)具有通式： (R1
R2 2
SiO1/2
)w
(R2 2
SiO2/2
)x
(R2
SiO3/2
)y
(SiO4/2
)z
(I) 其中R1
係經獨立地選擇之烴基，其可經取代或未經取代且可在該烴基內包括雜原子（例如，O、N、S），並且各R2
係獨立地選自R1
及烯基，限制條件是至少兩個R2
係烯基，且w、x、y、及z係莫耳分率並使得w+x+y+z=1。針對線性有機聚矽氧烷，下標y及z通常係0，而針對樹脂，下標y及/或z ＞0。較佳的是，下標w具有0至0.9、較佳地0至0.6、較佳地0至0.3、較佳地0至0.1、較佳地0.00001至0.001之值。較佳的是，下標x具有0至0.99999、較佳地0至0.9999、較佳地0至0.999、較佳地0至0.99、較佳地0.9至0.99999、較佳地0.9至0.9999、較佳地0.9至0.999之值。下標y較佳地具有0至0.99、較佳地0至0.45、較佳地0至0.25、較佳地0.25至0.8、較佳地0.5至0.8之值。下標z較佳地具有0至0.99、較佳地0至0.85、較佳地0.85至0.95、較佳地0.6至0.85、較佳地0.4至0.65、較佳地0.2至0.5、較佳地0.1至0.45、較佳地0至0.5、較佳地0至0.25、較佳地0至0.15之值。較佳的是，當R1係經鹵素取代時，其係3,3,3-三氟丙基、3-氯丙基、氯苯基、二氯苯基、2,2,2-三氟乙基、2,2,3,3-四氟丙基、或2,2,3,3,4,4,5,5-八氟戊基。較佳的是，R1
係C1
至C10
羥基；較佳的是，烷基、芳基、或芳烷基。較佳的是，由R2
所代表之烯基（其等在有機聚矽氧烷(A)內可係相同或不同）具有2至10個碳原子、較佳地2至6個碳原子、較佳地乙烯基或烯丙基、較佳地乙烯基。
較佳的是，該等聚矽氧組成物之至少一者包含縮合可固化聚矽氧組成物，其包含：(Aꞌ)有機聚矽氧烷，其每分子平均具有至少兩個矽鍵結羥基或可水解基團；可選地(Bꞌ)有機矽化合物，其每分子平均具有至少兩個矽鍵結氫原子或可水解基團；及(Cꞌ)縮合催化劑。較佳的是，縮合催化劑(C’)係一般用來促進矽鍵結羥基（矽醇）之縮合以形成Si-O-Si鍵聯之任何縮合催化劑；或者鈦、鉛、錫、鋯、及鐵與羧酸、烷基、及烷氧基之化合物；較佳的是錫(II)及錫(IV)化合物，諸如二月桂酸錫、二辛酸錫、二月桂酸二丁錫、二乙酸二丁錫、及四丁基錫；及鈦化合物，諸如四丁氧鈦。
較佳的是，該等聚矽氧組成物之至少一者包含自由基可固化聚矽氧組成物，其一般包含：(A’’)有機聚矽氧烷，其平均具有至少兩個矽鍵結不飽和基團；及(C’’)自由基起始劑。
較佳的是，該等聚矽氧組成物之至少一者包含開環反應可固化聚矽氧組成物，其一般包含：(A’’’)有機聚矽氧烷，其具有至少兩個經環氧基取代之基團、矽雜環丁烷(silacyclobutane)環、及/或苯并環丁烯(benzocyclobutene)環、及(C’’’)固化劑。
較佳的是，該等聚矽氧組成物之至少一者包含硫醇-烯可固化聚矽氧組成物，其包含：(A’’’’)有機聚矽氧烷，其每分子平均具有至少兩個矽鍵結烯基或矽鍵結巰基-烷基；(B’’’’)有機矽化合物，其每分子平均具有至少兩個能夠與有機聚矽氧烷(A’’’’)中之矽鍵結烯基或矽鍵結巰基-烷基反應的矽鍵結巰基-烷基或矽鍵結烯基；(C’’’’)催化劑；及(D’’’’)可選有機化合物，其包含兩或更多個巰基。催化劑(C’’’’)可係適用於催化有機聚矽氧烷(A’’’’)與有機矽化合物(B’’’’)及/或有機化合物(D’’’’)之間的反應之任何催化劑。一般而言，催化劑(C’’’’)係選自：i)自由基催化劑；ii)親核試劑；及iii) i)與ii)之組合。適用於作為催化劑(C’’’’)使用之自由基催化劑包括光活化自由基催化劑、熱活化自由基催化劑、室溫自由基催化劑（諸如氧化還原催化劑及烷基硼烷催化劑）、及其組合。適用於作為催化劑(C’’’’)使用之親核試劑包括胺、膦、及其組合。
較佳的是，該等聚矽氧組成物之至少一者包含矽氫化物-矽醇反應可固化聚矽氧組成物，其包含：(A’’’’’)有機聚矽氧烷，其每分子平均具有至少兩個矽鍵結氫原子或至少兩個矽鍵結羥基；(B’’’’’)有機矽化合物，其每分子平均具有能夠與有機聚矽氧烷(A’’’’’)中之矽鍵結氫原子或矽鍵結羥基反應的至少兩個矽鍵結羥基或至少兩個矽鍵結氫原子；(C’’’’’)催化劑；及(D’’’’’)可選的含活性氫化合物。一般而言，催化劑(C’’’’’)係選自：i)含第X族金屬（諸如鉑）催化劑；ii)鹼，諸如金屬氫氧化物、胺、或膦；及iii)其組合。
聚合物基質不限於聚矽氧。其他聚合物亦係適合的，包括熱塑性聚合物（諸如聚烯烴、聚醚、聚酮、聚酯、聚胺甲酸酯、聚醯亞胺、聚丙烯酸酯）、及熱固性聚合物（諸如環氧化物、氰酸酯、聚醯亞胺、聚胺甲酸酯等）。
較佳的是，導電纖維具有0.1至1×108
西門/米(S/m)、較佳地1至1×108
S/m、較佳地4至1×108
S/m、較佳地10至1×108
S/m、較佳地100至1×108
S/m、較佳地1×103
至1×108
S/m之導電率。較佳的是，纖包含經表面氧化之碳。
較佳的是，非導電粒子具有至少1 nm、較佳地至少5 nm、較佳地至少10 nm之平均直徑；較佳地不大於20,000 nm、較佳地不大於10,000 nm、較佳地不大於1,000 nm之平均直徑。平均直徑係以算術平均來判定，並且可藉由許多技術來測量，較佳的是穿透式電子顯微鏡再加上影像分析。較佳的是，奈米粒子係非導電的，亦即其等具有不大於0.1 S/m、較佳地不大於1×10-2
S/m、較佳地不大於1×10-3
S/m之導電率。較佳的是，奈米粒子包含無機或有機聚合組成物。無機粒子包括但不限於鈦酸鋇及具有鈣鈦礦結構之其他氧化物組成物、二氧化鈦、二氧化鋯、二氧化矽、及其他金屬（諸如鉿、鍺、錫、鉛、鋁、鎵、銦、鈮、鈧、釔、釩、及鑭系和錒系元素如鉺、及銪）之氧化物、硼化物、氮化物、碳化物、及矽化物。有機聚合粒子包括但不限於聚苯乙烯、聚丙烯酸酯、聚氯乙烯、丙烯腈-丁二烯-苯乙烯三聚物、聚二氟亞乙烯、聚四氟乙烯、聚乙酸乙烯酯、及各式共聚物。
較佳的是，導電纖維具有至少2 nm、較佳地至少3 nm、較佳地至少5 nm、較佳地至少10 nm；較佳地不大於10,000 nm、較佳地不大於5,000 nm、較佳地不大於1,000 nm、較佳地不大於500 nm、較佳地不大於100 nm、較佳地不大於50 nm之平均直徑。較佳的是，導電纖維具有至少8倍直徑之平均長度、較佳地至少10倍；較佳地不大於1,000,000倍、較佳地不大於100,000倍。
較佳的是，奈米粒子對導電纖維之重量比係0.01:50至50:1、較佳地0.1:10至10:1、較佳地0.2:2至5:1。較佳的是，當組成物包含聚合物基質時，奈米粒子及導電纖維之總重量係聚合物基質、奈米粒子及導電纖維之總重量的0.1至80 wt%、較佳地至少0.5 wt%、較佳地至少1 wt%；較佳地不大於80 wt%、較佳地不大於60 wt%。
在本發明之方法中，較佳的是將粒子及纖維與聚合物樹脂組合，接著使其固化。實例 表 1 所使用之原始材料、供應商、及說明
經氧化碳奈米纖維(CNF)之製備。
將2.84 g的Pyrograf III PR-19-XT-PS碳奈米纖維（氣相生長，平均直徑大約150 nm，表面上有CVD沉積的碳）放在三頸圓底燒瓶中，燒瓶配備有機械攪拌器、回流冷凝器、及溫度計。將90 g的70 wt% HNO3
用去離子水稀釋至250 ml之總體積以製備1M HNO3
溶液，然後將溶液添加至燒瓶中。伴隨攪拌使溫度升至105.1℃並維持回流110小時。接著使內容物冷卻，並通過#1濾紙過濾。將留在濾紙上的濾餅用DI水洗滌八次。將75%的濾餅分散於20 g DI水中以製造穩定漿體。根據熱乾燥測量，判定此漿體中之固體含量係~10 wt%。使濾餅的其餘部分在通風烘箱中在95℃下乾燥20小時，接著在120℃下1小時。 BaTiO3
奈米粒子之處理及分散
將10 g的50 nm BaTiO3
乾粒子放在40 ml玻璃小瓶中，將20 g的DI水加入，接著將0.13 g的34至37 wt%鹽酸加入。藉由磁棒使混合物在室溫下攪拌20小時，接著藉由IKA T18 Ultra Turrax轉子定子混合器在20k rpm下混合60秒。將分散液用於下一個步驟中而未經進一步處理。 吸附有BaTiO3
之CNF (CNF@BaTiO3
)的製備
將以上製備CNF漿體量取出一半的量然後將65 g的DI水添加至其中。搖晃混合物以製造穩定分散液。為確保均質混合，使混合物藉由IKA T18 Ultra Turrax轉子定子混合器在20k rpm下混合60秒。在藉由轉子定子混合器維持攪拌的同時，將10 g以上製備的BaTiO3
分散液加入。使混合再持續60秒，接著將內容物放在玻璃容器中，然後藉由將上方打開的容器放在通風烘箱中在95℃下20小時，接著在120℃下1小時來移除水。獲得4.5 g的乾材料，並且估計其由1重量份的經處理CNF在2/4重量份的經處理BaTiO3
中所組成。 吸附有二氧化矽奈米粒子之CNF (CNF@SiO2
)的製備
將8.62 g的以上經處理CNF漿體放在40 ml玻璃小瓶中然後與8 g DI水混合。用超音波處理器（機型GEX 130，最大功率130 W）、及機型CV18振動產生器、及3/8”直徑不鏽鋼尖端在90%振幅下將混合物混合3分鐘。接著將5 g的Nalco DVSZN002膠態二氧化矽加入然後用相同超音波處理器及相同處理參數將其混合。所得分散液係穩定的。接著將其倒入培養皿然後放在通風烘箱中乾燥：3℃/min至95℃，95℃/8小時，1℃/min至100℃，100℃/1小時，1℃/min至115℃，115℃/2小時。獲得2.2 g的固體材料。估計CNF對二氧化矽之重量比例係1至2.32。 ITO於Sylgard 184聚矽氧彈性體中的製備
將適當量的100 nm ITO粒子（平均直徑，大約150 nm）於IPA之分散液與Sylgard 184基底聚合物於單頸圓底燒瓶中混合。計算後者之量以達到所欲之ITO/聚矽氧比例。將混合物放在設定於80℃之旋轉蒸發器上然後持續降低真空以移除IPA。最終壓力係1 mm Hg。接著將不含IPA之混合物冷卻，以起始Sylgard 184基底重量的1/10的量將Sylgard 184固化催化劑加入然後充分混合以進行固化。針對不同樣本調整ITO量以在最終經固化組成物中達到所欲之總ITO含量。 用於介電測量之比較樣本碟片的製備
將5 g的Sylgard 184基底及0.5 g的Sylgard 184固化劑於FlackTek混合器上的10 g容量杯中在3500 rpm下混合2分鐘。將2 g的混合物放在自拋光鋁板上切出之0.8 mm厚隔片的2吋直徑開口中，隔片下襯以Teflon片，Teflon片放在下面的拋光不鏽鋼板(6" × 6")上。將另外一個Teflon片放在上方接著用另一個拋光不鏽鋼板覆蓋。將總成放在加熱壓機中並使其處於130℃之溫度及4000 lb之力下。使總成在此條件下保持30分鐘，接著用流經壓機台板之冷卻水使其冷卻。收集經固化之2吋直徑、0.8 mm厚碟片並用於介電測試。改變隔片之厚度以獲得不同厚度之樣本以供測試。 用於介電測量之含ITO粒子之比較樣本碟片的製備
依照相同上述程序，使用含ITO之Sylgard 184基底及催化劑混合物來製造碟片。 用於介電測量之含Ag奈米粒子之比較樣本碟片的製備
將適當量的18 nm平均直徑乾Ag奈米粒子放在10 g容量牙科混合杯中，接著將5 g的Sylgard 184基底秤入。將10個抗腐蝕不鏽鋼軸承珠（ 各直徑為3 mm）放在杯中，然後在FlackTec混合器上在3500 rpm下混合2分鐘（1分鐘，等待5分鐘，接著1分鐘，以將加熱降至最低）。在冷卻10分鐘之後，將0.5 g的Sylgard 184固化劑秤入然後在3500 rpm下混合30秒鐘。將2 g的混合物取出，依照上述相同碟片製造程序來製造用於介電測量之碟片。調整Ag奈米粒子量以在碟片中達到所欲之Ag含量。 用於介電測量之含碳奈米纖維之比較樣本碟片的製備
使用如上相同程序來製備含未經處理Pyrograf III CNF之碟片，僅使用未經處理Pyrograf III CNF取代Ag奈米粒子。 用於介電測量之含MWCNT-TiO2
之實例碟片的製備
使用如上相同程序來製備含MWCNT（多壁式碳奈米管，內直徑5至15 nm，外直徑＞50 nm，長度5至20微米）-TiO2
之碟片，僅使用MWCNT-TiO2
來取代Ag奈米粒子或未經處理Pyrograf III CNF。 用於介電測量之含CNF@BaTiO3
粒子之實例碟片的製備
使用如上相同程序來製備含CNF@BaTiO3
之碟片，僅使用以上製備之CNF@BaTiO3
來取代MWCNT-TiO2
、Ag奈米粒子、或未經處理Pyrograf III CNF。 用於介電測量之含CNF@SiO2
之實例碟片的製備
使用如上相同程序來製備含CNF@SiO2
之碟片，僅使用CNF@SiO2
來取代MWCNT-TiO2
、Ag奈米粒子、或未經處理Pyrograf III CNF。 表2.樣本組成物及介電測試結果。
在本發明中，令人驚訝地發現本質上不導電的奈米粒子在被吸附至導電纖維之表面上時，其可非常有效地減輕複合物變得導電的傾向。再者，本方法可讓令人驚訝地高量導電纖維能夠結合以有效增加介電常數，同時仍維持低介電損耗。
更廣泛而言，在嘗試利用各式不同組成物之日益增加可利用奈米纖維方面尚有長久存在的問題，但常見的挑戰在於將其等均勻分散至聚合物基質中，因為常用奈米纖維生產技術會導致緊密集束之纖維。令人驚訝地發現，本發明方法會讓緊密集束之奈米纖維能夠輕易均勻分散至聚合物基質中。
無
無
Claims (10)
- 一種組成物，其包含： a) 導電纖維，其等包含碳、導電氧化物或金屬；且具有1至20,000 nm之平均直徑及至少五倍該平均直徑之平均長度；及 b) 非導電粒子，其等具有1至20,000 nm之平均直徑。
- 如請求項1之組成物，其中該組成物進一步包含圍繞該等導電纖維及該等非導電粒子之聚合物基質。
- 如請求項2之組成物，其中該聚合物基質係聚矽氧烷。
- 如請求項3之組成物，其中該等導電纖維具有3 nm至1,000 nm之平均直徑且具有10至1×108 S/m之導電率。
- 如請求項4之組成物，其中該等非導電粒子具有5 nm至1,000 nm之平均直徑且具有不大於0.1 S/m之導電率。
- 一種方法，包含： c) 藉由物理吸附或化學氧化而在纖維材料上產生表面電荷； d) 在該表面上添加帶有相反電荷之粒子材料以形成混合物；及 e) 將該混合物與聚合物或聚合物樹脂混合。
- 如請求項6之方法，其中該粒子材料具有5 nm至1,000 nm之平均直徑及不大於0.1 S/m之導電率。
- 如請求項7之方法，其中該纖維材料具有3 nm至1,000 nm之平均直徑且具有10至1×108 S/m之導電率。
- 如請求項8之方法，其中該聚合物或聚合物樹脂係矽氧烷樹脂。
- 如請求項9之方法，其中聚矽氧烷係藉由於該導電纖維材料及該粒子材料存在下使該矽氧烷樹脂固化而形成。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762505270P | 2017-05-12 | 2017-05-12 | |
| US62/505270 | 2017-05-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201900750A true TW201900750A (zh) | 2019-01-01 |
| TWI763838B TWI763838B (zh) | 2022-05-11 |
Family
ID=62116618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107115193A TWI763838B (zh) | 2017-05-12 | 2018-05-04 | 包括聚合物複合物之組成物及用於製備包括聚合物複合物之組成物的方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11124625B2 (zh) |
| JP (1) | JP7231558B2 (zh) |
| KR (1) | KR102500420B1 (zh) |
| CN (1) | CN110612322B (zh) |
| TW (1) | TWI763838B (zh) |
| WO (1) | WO2018208446A1 (zh) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3153264B2 (ja) * | 1991-05-17 | 2001-04-03 | ジーイー東芝シリコーン株式会社 | スポンジ用シリコーンゴム組成物 |
| JPH09321191A (ja) * | 1996-05-31 | 1997-12-12 | Tokai Rubber Ind Ltd | 熱伝導性高分子成形体 |
| JP3017145B2 (ja) * | 1997-10-09 | 2000-03-06 | 大塚化学株式会社 | 樹脂組成物 |
| US20050059754A1 (en) * | 2003-07-31 | 2005-03-17 | Lunt Michael S. | Electrically conductive, flame retardant fillers, method of manufacture, and use thereof |
| US7507472B2 (en) | 2004-03-09 | 2009-03-24 | The United States Of America As Represented By The Administator Of National Aeronatics And Space Adminstration | Multilayer electroactive polymer composite material comprising carbon nanotubes |
| JP4245514B2 (ja) | 2004-05-24 | 2009-03-25 | 日信工業株式会社 | 炭素繊維複合材料及びその製造方法、炭素繊維複合金属材料の製造方法、炭素繊維複合非金属材料の製造方法 |
| JP2007039649A (ja) * | 2005-06-30 | 2007-02-15 | Nissin Kogyo Co Ltd | 複合材料 |
| US8143337B1 (en) | 2005-10-18 | 2012-03-27 | The Ohio State University | Method of preparing a composite with disperse long fibers and nanoparticles |
| JP5344451B2 (ja) * | 2007-12-28 | 2013-11-20 | 独立行政法人産業技術総合研究所 | 高分子樹脂成形体およびその製造方法 |
| US8048341B2 (en) | 2008-05-28 | 2011-11-01 | Applied Sciences, Inc. | Nanocarbon-reinforced polymer composite and method of making |
| KR101095024B1 (ko) | 2010-04-27 | 2011-12-20 | 한국과학기술연구원 | 고분자 복합체 액츄에이터 |
| US10978629B2 (en) * | 2014-12-05 | 2021-04-13 | Unm Rainforest Innovations | Method of dispersing nanoparticles in different mediums and methods to achieve superior thermoelectric performances in carbon nanotube polymer systems |
| JP6384437B2 (ja) | 2015-09-17 | 2018-09-05 | 信越化学工業株式会社 | シリコーンゴム組成物及び電力ケーブル |
| JP6301978B2 (ja) * | 2016-01-26 | 2018-03-28 | デクセリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置 |
| EP3270386A1 (en) * | 2016-07-11 | 2018-01-17 | Heraeus Deutschland GmbH & Co. KG | Electrically conductive composition for use as an electrically conductive adhesive for mechanically and electrically connecting electrical conductors to electrical contacts of solar cells |
-
2018
- 2018-04-18 WO PCT/US2018/028088 patent/WO2018208446A1/en active Application Filing
- 2018-04-18 JP JP2019557588A patent/JP7231558B2/ja active Active
- 2018-04-18 KR KR1020197035094A patent/KR102500420B1/ko active IP Right Grant
- 2018-04-18 US US16/487,133 patent/US11124625B2/en active Active
- 2018-04-18 CN CN201880027043.5A patent/CN110612322B/zh active Active
- 2018-05-04 TW TW107115193A patent/TWI763838B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7231558B2 (ja) | 2023-03-01 |
| KR102500420B1 (ko) | 2023-02-17 |
| CN110612322A (zh) | 2019-12-24 |
| US20200291202A1 (en) | 2020-09-17 |
| KR20200006549A (ko) | 2020-01-20 |
| TWI763838B (zh) | 2022-05-11 |
| CN110612322B (zh) | 2023-05-05 |
| US11124625B2 (en) | 2021-09-21 |
| WO2018208446A1 (en) | 2018-11-15 |
| JP2020519705A (ja) | 2020-07-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Chen et al. | Synthesis and characterization of polyimide/silica hybrid composites | |
| JP5450103B2 (ja) | 含ケイ素粒子、その製造方法、有機ポリマー組成物、セラミック、およびその製造方法 | |
| CN108219139B (zh) | 一种官能化石墨烯及其制备方法和聚有机硅氧烷 | |
| CN101942271A (zh) | 从可光交联的聚硅氧烷混合物制造聚硅氧烷涂层和聚硅氧烷成型体的方法 | |
| JP4733933B2 (ja) | 硬化性オルガノポリシロキサン組成物 | |
| Simon et al. | Nanoclay reinforcement of liquid silicone rubber | |
| TW200401008A (en) | Electrically conductive silicone rubber composition | |
| JP5102179B2 (ja) | 熱伝導性組成物およびその製造方法 | |
| Kong et al. | Carbon nanotubes-bridged-fumed silica as an effective binary nanofillers for reinforcement of silicone elastomers | |
| KR20100055319A (ko) | 열전도성 시트 및 열전도성 시트의 제조 방법 | |
| Zhang et al. | Epoxy-silicone copolymer synthesis via efficient hydrosilylation reaction catalyzed by high-activity platinum and its effect on structure and performance of silicone rubber coatings | |
| Huang et al. | Reinforcement of polysiloxane with superhydrophobic nanosilica | |
| CN112724685B (zh) | 有机硅导热片材及其制备方法 | |
| CN115960464B (zh) | 一种液态乙烯基笼型聚倍半硅氧烷改性的加成型液体硅橡胶及其制备方法 | |
| Yu et al. | Enhanced Dielectric Properties of Polydimethylsiloxane Elastomer-Based Composites with Cyanosilicone | |
| CN110234711B (zh) | 导热性聚硅氧烷组合物 | |
| TWI763838B (zh) | 包括聚合物複合物之組成物及用於製備包括聚合物複合物之組成物的方法 | |
| TW200819503A (en) | Silicone rubber composition which cures by condensation | |
| JP2008520803A (ja) | オルガノハイドロジェンポリシロキサン樹脂及びシリコーン組成物 | |
| Saxena et al. | Beneficial role of “sol–gel” synthesized mesoscale silica networks on the performance of liquid silicone elastomer | |
| WO2018139632A1 (ja) | シリコーン系ハイブリッドポリマー被覆ＡｌＮフィラー | |
| CN116745351A (zh) | 含有琥珀酸酐官能性硅氧烷触变剂的填充的有机硅组合物 | |
| Mu et al. | Preparation and Properties of Additive Polysiloxane/POSS Hybrid Composites | |
| Goldberg et al. | The effect of multiwall carbon nanotubes on the properties of room temperature-vulcanized silicone adhesives | |
| Mao | Effects of silica, vinyl-terminated polydimethylsiloxane (VPDMS) and PMHS-grafted-POSS (PH) nanocomposites: morphology, thermal behavior and mechanical property |