TW201856B - - Google Patents

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TW201856B
TW201856B TW080100786A TW80100786A TW201856B TW 201856 B TW201856 B TW 201856B TW 080100786 A TW080100786 A TW 080100786A TW 80100786 A TW80100786 A TW 80100786A TW 201856 B TW201856 B TW 201856B
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Taiwan
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substrate
hole
metal
directional line
plated
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TW080100786A
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American Telephone & Telegraph
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/12Coupling devices having more than two ports
    • H01P5/16Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/187Broadside coupled lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/0243Printed circuits associated with mounted high frequency components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672Superposed layout, i.e. in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126Assembling bases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

L01856 五、發明说明(l) 本發明為有鼸線條定向鎘合器,尤指網合器構造及製 造技術,不但成未低且可生産出極均勻之《氣及機械特性 〇 一種線條鎘合器典型组成有一對形狀並置於兩接地平 面間之相鄰平面傅翰線導饑。此構造可遮蔽導鎌免受附近 另件之霣氣影響並有助於包含霄磁場於兩接地平面匾内, i i * .由於以ΐβ輸線導讎製造之電路你包含於内部·且須與兩接地 平面分離,故須備有連接外部零件或霣路至内傅輸線之裝 置。 將線條定向鎘合器及其母板有效連接在先前技薦裝置 中為一昂貴之成本因數,典型之線條定向縞合器以機械固 定有線條通路之多重板組成,夾層並不常用,纘孔使外層 可有效銲接内傅輸線之方法也需努力密集之生産。 經濟部屮央樣準局εχ工消费合作社印31 (請先Μ讀背而之注意事項再場x-0 傅統方法連接内線條不經濟且不實用,但要一方面節 省成本一方面保持均勻鋇合特性及特定埠間之离度隔雜也 很困難,本文所指隔離傈為输入一埠功率比上隔離之另一 埠之功率。隔_傈量測基板有任何不均勻或接地平面的間 隔變動之方法。 裝設造些裝置於母板上要可靠,易銲接,但母板裝設 空間有限且須容納多數之零件。 先前技蓊有關線條定向網合器外部連接内部線條者, 如美國專利4, 821, 007以鍍穿孔經絶綠電路板及 内線條傳輸通路,然後將沿著通過各鍍穿孔之線將板一分 為二,切割形成半筒形鍍痕於分開處,此曝露之鍍面俗在 參紙張尺度遑用中國家«準(CNS)f 4規格(2丨0乂297公*) 81. 2. 20,000 Λ 6 Π 6 L01858 五、發明説明(2) (請舣閲讀背而之注意事項再埤{〈) 線條邊鐮,因此,可用作與母板珠銲之霣氣接觸,另外, 用鍍痕延伸於切割板兩邊使零件可任一邊銲於母板,此優 點在形成之接觸Η但由於需切割各接觸孔使鍍匾受應力會 導致連接不可靠及在限裝置區沒有效率之利用。 本發明之線條定向«各器成本低,介入損失(insertion loss) 低且耦合特性均句。 / 另一目的在提供鋇合語銲接母板不佔空間之方法。 另一目的在提供置産網合器方法使其能匹配前级物件 並在裝配時提供高度均勻之霣氣與機械特性。 經濟部+央橾準局员工消费合作社印9i 本發明線條定向嫌合器包含多層印刷線路板其中内傅 输通路蝕刻於雙邊板之各相對邊,成型後的電路與外基板 接合,此外基板各由單邊鍍鋦板组成,其中内層被蝕光而 外層為固鼸銅,然後將組件嫌孔、霣鍍並蝕刻,以鍍穿孔 將外連接Η逋至内板條使線條連接,然後整镝组件以直立 位置銲接於另一板上以省空間最好,基板是由聚四«乙烯 做成並以嫌玻璃強化,在製造多重線條定向铒合器同時可 利用本發明方法,在實施例中有一種製造成本最低之線條 定向網合器説明如下。 圖1為線條裝置等效電路圖; 圖2為線條構造及特定重要結構參數; 圖3為線條多靥印刷線路板組件之透視圖; 圖4為圖1裝置垂直置於載板之透視圖;及 圖5為生産作業中多重定向網合器製程圖式說明。
本發明為有關製造所諝寬邊網合線條,載於TRAN 81. 2. 20,000 本紙張尺度遑《中家《準(CNS) T4規格(210X297公*) 4 L0185b 五、發明説明(3) S . IRE, PGM TT — 8, 6册633 — 637頁 (1 9 6 0十一月)0 0«[£哳作之"寬邊|»合線條傅輸 線特性阻抗"。此論文併此作相颶參考,但對熟悉技蕕人 士言,本發明亦可用於撖條或線條裝置及其製造。 圖1中,定向網合器以兩線條表示其《氣構造,其一 線條為符號10具有埠1與4,另一線條11具有埠2與 .3,將此兩線條互相實際控制靠近以産生預定需要之霣氣 網合,圖1中為其電路等效圖。根據上述COHEN諭文 ,藕合器具有任何所需之僳數皆可産生,其構造可如圆2 所示,其中U小為外部接地平面12與13間之距離。 為線條1 0與1 1之距離;I為線條寬,線條1 0舆 11製成等於所要操作裝置中心頻率之四分之一波長,上_ ,為根據上述C0HEN論文之線條參數;及板 材介«常數等一起可決定線條之《氣持性。 画3中,雙邊傳输基板20上形成有蝕刻之線條10 與1 1。最好基板20是以鐵玻璃加強之多四想乙烯製成 ,Chandler公司有售,或以TEFLON*織玻璃製作 板材。因為其電氣特性較合適且易於叠合,其他石英或陶 磁亦可選用。若SITEF0N®其介霣常數為2. 0至 10. 0以上,若蘧2. 5及耦合值3dB, 上_^ JflL_ 實質為:s = . 01", b = . 1",及 w = . 04"。 基板20是形成有所要的電路路徑但不具有穿孔,基 板21與22各组成為介電板23—邊塗層有銅層24, 基板20, 21與22疊合在一起,夾層製程包括將熱感. (請先閲讀背而之注意事項典場良 琪- 經濟部中央標準局ex工消费合作社印31 本紙張疋度遑用中家規格(210X297公;*) 81. 2. 20,000 Λ 6 Η 6 01858 五、發明説明(4) 片黏材(未示出)置於各相對基板間然後:DQ熱而成。 (請先閲讀背而之注意事項Λ-够又 ’) 在基板20, ‘2 1舆22軸30»孔,如園3示,纘 孔内部鍍成穿孔27,各板23銅曆24經蝕刻以雜別兩 接觸Η 2 5及Η S 2 6。 圃4為一完成線條定向供合器1组成有如圃3示之零 件直立銲於母板40,銲珠41使片匾25示範的固定於 ^ ' , m路35,基板23接地平面24銲於板40接地匾36 ,使縝合器10強固垂直裝於板40上且佔地棰小,同法 可將多數耦合器裝於板40上。 經濟部中央標準局员工消t合作社印製 圖5為説明如何以上述同等同《生産多數線條,即將 多重線條零件以相同製程步驊成形。基板50與53對應 圖3之基板2 0與2 3,多數接地平面匾54以上述鼸3 方法形成於基板53上,同樣將晒3片B25及其他金靥 化匾26形成區54,基板20區55線條如匾3之10 與1 1形成於其兩邊,内部基板50及兩外部基板53具 有所需金屬化層及穿孔,或通路如所述形成,在各匾54 與5 5所形成之鋇合器以傅統鋸掉或磨掉區5 3而取出, 此方法自多零件來層取出完全形成之鋇合器,其重要之電 路及通路不會受到切割之損壊。 81. 2. 20,000 本紙張疋本遑《 + 家β毕(CHS)T4規格(210x297公*) -6 -

Claims (1)

  1. 六、申請專利範園 A7 B7 C7 D7 第80100786號專利申請案 中文申請專利範圍修正本 民國82年1月呈 1 . 一種製造定向線條耦合器之方法,此定向線條耦 合器包含一對間隔之線條,此方法包含步驟: 形成第一和第二金羼線條於内部絶緣基板之相對邊, 各該線條具有第一和第二埠置於實質相鄰於該基板選擇邊 緣; 成形第一和第二外基板和包含一絶緣板一邊有金羼塗 層; 將該外基板®合於該内基板之各邊,使該埠處於已知 和預定之平面座標關俗,即相對該外基板金屬面之出入點 成形孔穿過該夾層組件於該出入點; 金屬鍍穿該孔使其有效電氣連接於該鍍孔之該各孔及 對應該内基板該埠之一間;及 在各出入點鍍穿孔入口附近蝕刻一區以形成金屬片延 伸自該入口至該基板該邊緣以電氣隔離該孔入口與周圍金 屬塗層。 2. —種實質以申請專利範圍第1項方法生産之定向 線條耦合器。 3. 如申請專利範圍第1項製造定向線條耦合器方法 其中該内部及該兩外部基板材料傜織玻璃加強之聚四氟乙 本紙張尺度適用中國國家標準<CNS)甲4規格(210 X 297公楚) (請先閲讀背面之注意事項再蜞寫本頁) 丨裝· 訂· .線. 經濟部中央標準扃S工消費合作社印製 81.9.10,000 01858 Α7 Β7 C7 D7 經濟部中央標準局R工消費合作社印« 六、申請專利範園 4. 一種實質以申請專利範圍第3項方法生産之定向 線條耦合器。 5. 如申請專利範圍第3項製造定向線條耦合器之方 法,其中該基板材料有一介電常數在2. 0至實質10. 0範圍内間。 6. —種實質以申請專利範圍第5項方法生産之定向 線條耦合器。 7. 如申請專利範圍第6項之定向線條耦合器,其中 該基板材料介電係數實質為2. 5,及其中重要之尺寸^_ ,b_^. w 界定規格係:s = . 01"’ b = . 1";及w = .04"。 8. 如申請專利範圍第1, 3或5項之方法包含另外 步驟將一Η熱激黏性材料置於内基板及各該兩外基板間, 使所有該基板結合一起並加熱。 9. 一種製造電路板之方法包含一或多個定向線條耦 合器,包含步驟: 形成第一和第二金屬線條於一内絶緣基板之相對邊, 各該線條具有第一和第二埠; 成形第一和第二外基板和包含一絶緣板一邊有金屬塗 層; 將該外基板叠合於該内基板各邊,使該埠處於已知及 預定之平面座標關僳,即相對該外基板金羼面之出入點; 成形孔穿過該夾層組件於該出入點; (請先閲讀背面乏注意事項再填寫本頁) -裝. 訂· .線. 本紙張尺度適用中國國家標準(CNS)甲4規格(210 X 297公釐) 一 2 — 81.9.10,000 A7 B7 C7 D7 (〇18δδ 六、申請專利範園 金屬鍍穿該孔使其有效電氣連接於該鍍孔之該各孔及 對應該内基板該埠之一間; 在各出入點鍍穿孔入口附近蝕刻一區以電氣隔離該孔 入口與周圍之金屬塗層,使沿著該外基板邊緣産生各該鍍 穿孔之連接片;及 垂直固定所成之該定向耦合器於母板包含接地金屬區 及電路,以銲接該耦合器片至該電路於該母板上及以銲接 該外基板之該接地平面至該母板之金屬區。 (請先閲讀.背面乏注意事項再填寫本頁) •丨裝· 訂· 線_ 經濟部中央標準局S工消費合作社印製 81.9.10,000 本紙張尺度適用中國國家標準(CNS)甲4規格(210 X 297公楚) 一 3 —
TW080100786A 1990-02-02 1991-01-31 TW201856B (zh)

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US07/474,563 US5032803A (en) 1990-02-02 1990-02-02 Directional stripline structure and manufacture

Publications (1)

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TW201856B true TW201856B (zh) 1993-03-11

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Country Link
US (1) US5032803A (zh)
EP (1) EP0439928B1 (zh)
JP (1) JPH0583015A (zh)
KR (1) KR920000148A (zh)
AU (1) AU627100B2 (zh)
CA (1) CA2031058C (zh)
DE (1) DE69028765T2 (zh)
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Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105171A (en) * 1991-04-29 1992-04-14 Hughes Aircraft Company Coplanar waveguide directional coupler and flip-clip microwave monolithic integrated circuit assembly incorporating the coupler
ES2036943B1 (es) * 1991-11-11 1996-06-01 Alcatel Standard Electrica Acopladores direccionales pasivos autoencapsulados
JPH05152814A (ja) * 1991-11-27 1993-06-18 Murata Mfg Co Ltd チツプ型方向性結合器
JP2817487B2 (ja) * 1991-12-09 1998-10-30 株式会社村田製作所 チップ型方向性結合器
JP3083416B2 (ja) * 1992-11-06 2000-09-04 進工業株式会社 ディレイライン素子およびその製造方法
JPH0763115B2 (ja) * 1993-03-25 1995-07-05 日本電気株式会社 高周波モジュール装置及びその製造方法
US5285570A (en) * 1993-04-28 1994-02-15 Stratedge Corporation Process for fabricating microwave and millimeter wave stripline filters
US5486798A (en) * 1994-03-07 1996-01-23 At&T Ipm Corp. Multiplanar hybrid coupler
JPH08162812A (ja) * 1994-12-07 1996-06-21 Fujitsu Ltd 高周波結合器
US5625328A (en) * 1995-09-15 1997-04-29 E-Systems, Inc. Stripline directional coupler tolerant of substrate variations
US5703544A (en) * 1996-03-13 1997-12-30 Ericsson Inc. RF printed circuit module and method of making same
US6765455B1 (en) * 2000-11-09 2004-07-20 Merrimac Industries, Inc. Multi-layered spiral couplers on a fluropolymer composite substrate
DE10107141A1 (de) * 2001-02-15 2002-08-29 Infineon Technologies Ag Verfahren zum Ansteuern eines elektrischen Schaltungselements und elektrische Schaltungsanordnung
US6686812B2 (en) 2002-05-22 2004-02-03 Honeywell International Inc. Miniature directional coupler
US6965279B2 (en) * 2003-07-18 2005-11-15 Ems Technologies, Inc. Double-sided, edge-mounted stripline signal processing modules and modular network
US6903625B2 (en) * 2003-10-16 2005-06-07 Northrop Grumman Corporation Microstrip RF signal combiner
US7049905B2 (en) * 2004-01-02 2006-05-23 Scientific Components Coporation High power directional coupler
US20060044074A1 (en) * 2004-09-02 2006-03-02 Sheng-Fuh Chang High-directivity spurline directional coupler
US7728694B2 (en) * 2007-07-27 2010-06-01 Anaren, Inc. Surface mount stripline devices having ceramic and soft board hybrid materials
JP4987764B2 (ja) * 2008-03-14 2012-07-25 株式会社東芝 方向性結合器
US8749989B1 (en) 2009-12-28 2014-06-10 Scientific Components Corporation Carrier for LTCC components
CN102986084B (zh) * 2010-07-06 2015-08-05 株式会社村田制作所 定向耦合器
US9888568B2 (en) 2012-02-08 2018-02-06 Crane Electronics, Inc. Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module
US8969733B1 (en) 2013-09-30 2015-03-03 Anaren, Inc. High power RF circuit
US9230726B1 (en) 2015-02-20 2016-01-05 Crane Electronics, Inc. Transformer-based power converters with 3D printed microchannel heat sink
WO2018212273A1 (ja) * 2017-05-19 2018-11-22 株式会社村田製作所 積層型電子部品
WO2018212270A1 (ja) * 2017-05-19 2018-11-22 株式会社村田製作所 方向性結合器および高周波モジュール
WO2019173091A1 (en) * 2018-03-06 2019-09-12 Avx Corporation Thin film surface mountable high frequency coupler
CN111511108B (zh) * 2019-01-31 2021-11-09 华为技术有限公司 一种电路板组件、电子终端
CN110854499B (zh) * 2019-10-25 2021-06-08 摩比科技(深圳)有限公司 应用于多波束天线馈电网络的定向耦合器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1528085A (fr) * 1967-04-28 1968-06-07 Thomson Houston Comp Francaise Perfectionnements aux coupleurs directifs par superposition de lignes
FR95372E (fr) * 1967-04-28 1970-09-11 Thomson Houston Comp Francaise Perfectionnements aux coupleurs directifs par superposition de lignes.
FR1552207A (zh) * 1967-11-22 1969-01-03
SE426894B (sv) * 1981-06-30 1983-02-14 Ericsson Telefon Ab L M Impedansriktig koaxialovergang for mikrovagssignaler
JPS60124101A (ja) * 1983-12-09 1985-07-03 Mitsubishi Electric Corp ブランチラインカツプラ
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
JPS60214602A (ja) * 1984-04-10 1985-10-26 Mitsubishi Electric Corp ブランチラインカツプラ
JPS61184901A (ja) * 1985-02-12 1986-08-18 Mitsubishi Electric Corp サスペンデツド線路形方向性結合器
JPS6313502A (ja) * 1986-07-04 1988-01-20 Yuniden Kk マイクロ波方向性結合器
US4821007A (en) * 1987-02-06 1989-04-11 Tektronix, Inc. Strip line circuit component and method of manufacture
US4862120A (en) * 1988-02-29 1989-08-29 Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee Wideband stripline to microstrip transition
US4864722A (en) * 1988-03-16 1989-09-12 International Business Machines Corporation Low dielectric printed circuit boards

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CA2031058C (en) 1994-09-13
DE69028765D1 (de) 1996-11-07
DE69028765T2 (de) 1997-02-06
KR920000148A (ko) 1992-01-10
EP0439928A1 (en) 1991-08-07
JPH0583015A (ja) 1993-04-02
AU6932891A (en) 1991-08-29
AU627100B2 (en) 1992-08-13
US5032803A (en) 1991-07-16
CA2031058A1 (en) 1991-08-03
ES2091808T3 (es) 1996-11-16
EP0439928B1 (en) 1996-10-02

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