TW201856B - - Google Patents

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TW201856B
TW201856B TW080100786A TW80100786A TW201856B TW 201856 B TW201856 B TW 201856B TW 080100786 A TW080100786 A TW 080100786A TW 80100786 A TW80100786 A TW 80100786A TW 201856 B TW201856 B TW 201856B
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Taiwan
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substrate
hole
metal
directional line
plated
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TW080100786A
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American Telephone & Telegraph
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/187—Broadside coupled lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

L01856 五、發明说明（l) 本發明為有鼸線條定向鎘合器，尤指網合器構造及製 造技術，不但成未低且可生産出極均勻之《氣及機械特性 〇 一種線條鎘合器典型组成有一對形狀並置於兩接地平 面間之相鄰平面傅翰線導饑。此構造可遮蔽導鎌免受附近 另件之霣氣影響並有助於包含霄磁場於兩接地平面匾内， i i * .由於以ΐβ輸線導讎製造之電路你包含於内部·且須與兩接地 平面分離，故須備有連接外部零件或霣路至内傅輸線之裝 置。 將線條定向鎘合器及其母板有效連接在先前技薦裝置 中為一昂貴之成本因數，典型之線條定向縞合器以機械固 定有線條通路之多重板組成，夾層並不常用，纘孔使外層 可有效銲接内傅輸線之方法也需努力密集之生産。 經濟部屮央樣準局εχ工消费合作社印31 (請先Μ讀背而之注意事項再場x-0 傅統方法連接内線條不經濟且不實用，但要一方面節 省成本一方面保持均勻鋇合特性及特定埠間之离度隔雜也 很困難，本文所指隔離傈為输入一埠功率比上隔離之另一 埠之功率。隔_傈量測基板有任何不均勻或接地平面的間 隔變動之方法。 裝設造些裝置於母板上要可靠，易銲接，但母板裝設 空間有限且須容納多數之零件。 先前技蓊有關線條定向網合器外部連接内部線條者， 如美國專利4, 821, 007以鍍穿孔經絶綠電路板及 内線條傳輸通路，然後將沿著通過各鍍穿孔之線將板一分 為二，切割形成半筒形鍍痕於分開處，此曝露之鍍面俗在 參紙張尺度遑用中國家«準(CNS)f 4規格(2丨0乂297公*) 81. 2. 20,000 Λ 6 Π 6 L01858 五、發明説明（2) (請舣閲讀背而之注意事項再埤{〈) 線條邊鐮，因此，可用作與母板珠銲之霣氣接觸，另外， 用鍍痕延伸於切割板兩邊使零件可任一邊銲於母板，此優 點在形成之接觸Η但由於需切割各接觸孔使鍍匾受應力會 導致連接不可靠及在限裝置區沒有效率之利用。 本發明之線條定向«各器成本低，介入損失（insertion loss) 低且耦合特性均句。 / 另一目的在提供鋇合語銲接母板不佔空間之方法。 另一目的在提供置産網合器方法使其能匹配前级物件 並在裝配時提供高度均勻之霣氣與機械特性。 經濟部+央橾準局员工消费合作社印9i 本發明線條定向嫌合器包含多層印刷線路板其中内傅 输通路蝕刻於雙邊板之各相對邊，成型後的電路與外基板 接合，此外基板各由單邊鍍鋦板组成，其中内層被蝕光而 外層為固鼸銅，然後將組件嫌孔、霣鍍並蝕刻，以鍍穿孔 將外連接Η逋至内板條使線條連接，然後整镝组件以直立 位置銲接於另一板上以省空間最好，基板是由聚四«乙烯 做成並以嫌玻璃強化，在製造多重線條定向铒合器同時可 利用本發明方法，在實施例中有一種製造成本最低之線條 定向網合器説明如下。 圖1為線條裝置等效電路圖； 圖2為線條構造及特定重要結構參數； 圖3為線條多靥印刷線路板組件之透視圖； 圖4為圖1裝置垂直置於載板之透視圖；及 圖5為生産作業中多重定向網合器製程圖式說明。
本發明為有關製造所諝寬邊網合線條，載於TRAN 81. 2. 20,000 本紙張尺度遑《中家《準(CNS) T4規格(210X297公*) 4 L0185b 五、發明説明（3) S . IRE, PGM TT — 8, 6册633 — 637頁 (1 9 6 0十一月）0 0«[£哳作之"寬邊|»合線條傅輸 線特性阻抗"。此論文併此作相颶參考，但對熟悉技蕕人 士言，本發明亦可用於撖條或線條裝置及其製造。 圖1中，定向網合器以兩線條表示其《氣構造，其一 線條為符號10具有埠1與4,另一線條11具有埠2與 .3,將此兩線條互相實際控制靠近以産生預定需要之霣氣 網合，圖1中為其電路等效圖。根據上述COHEN諭文 ，藕合器具有任何所需之僳數皆可産生，其構造可如圆2 所示，其中U小為外部接地平面12與13間之距離。 為線條1 0與1 1之距離；I為線條寬，線條1 0舆 11製成等於所要操作裝置中心頻率之四分之一波長，上_ ,為根據上述C0HEN論文之線條參數；及板 材介«常數等一起可決定線條之《氣持性。 画3中，雙邊傳输基板20上形成有蝕刻之線條10 與1 1。最好基板20是以鐵玻璃加強之多四想乙烯製成 ,Chandler公司有售，或以TEFLON*織玻璃製作 板材。因為其電氣特性較合適且易於叠合，其他石英或陶 磁亦可選用。若SITEF0N®其介霣常數為2. 0至 10. 0以上，若蘧2. 5及耦合值3dB, 上_^ JflL_ 實質為：s = . 01", b = . 1",及 w = . 04"。 基板20是形成有所要的電路路徑但不具有穿孔，基 板21與22各组成為介電板23—邊塗層有銅層24, 基板20, 21與22疊合在一起，夾層製程包括將熱感. (請先閲讀背而之注意事項典場良 琪- 經濟部中央標準局ex工消费合作社印31 本紙張疋度遑用中家規格(210X297公;*) 81. 2. 20,000 Λ 6 Η 6 01858 五、發明説明（4) 片黏材（未示出）置於各相對基板間然後:DQ熱而成。 (請先閲讀背而之注意事項Λ-够又 ’) 在基板20, ‘2 1舆22軸30»孔，如園3示，纘 孔内部鍍成穿孔27,各板23銅曆24經蝕刻以雜別兩 接觸Η 2 5及Η S 2 6。 圃4為一完成線條定向供合器1组成有如圃3示之零 件直立銲於母板40,銲珠41使片匾25示範的固定於 ^ ' , m路35,基板23接地平面24銲於板40接地匾36 ，使縝合器10強固垂直裝於板40上且佔地棰小，同法 可將多數耦合器裝於板40上。 經濟部中央標準局员工消t合作社印製 圖5為説明如何以上述同等同《生産多數線條，即將 多重線條零件以相同製程步驊成形。基板50與53對應 圖3之基板2 0與2 3，多數接地平面匾54以上述鼸3 方法形成於基板53上，同樣將晒3片B25及其他金靥 化匾26形成區54,基板20區55線條如匾3之10 與1 1形成於其兩邊，内部基板50及兩外部基板53具 有所需金屬化層及穿孔，或通路如所述形成，在各匾54 與5 5所形成之鋇合器以傅統鋸掉或磨掉區5 3而取出， 此方法自多零件來層取出完全形成之鋇合器，其重要之電 路及通路不會受到切割之損壊。 81. 2. 20,000 本紙張疋本遑《 + 家β毕(CHS)T4規格(210x297公*) -6 -

Claims (1)

  1. 六、申請專利範園 A7 B7 C7 D7 第80100786號專利申請案 中文申請專利範圍修正本 民國82年1月呈 1 . 一種製造定向線條耦合器之方法，此定向線條耦 合器包含一對間隔之線條，此方法包含步驟： 形成第一和第二金羼線條於内部絶緣基板之相對邊， 各該線條具有第一和第二埠置於實質相鄰於該基板選擇邊 緣； 成形第一和第二外基板和包含一絶緣板一邊有金羼塗 層； 將該外基板®合於該内基板之各邊，使該埠處於已知 和預定之平面座標關俗，即相對該外基板金屬面之出入點 成形孔穿過該夾層組件於該出入點； 金屬鍍穿該孔使其有效電氣連接於該鍍孔之該各孔及 對應該内基板該埠之一間；及 在各出入點鍍穿孔入口附近蝕刻一區以形成金屬片延 伸自該入口至該基板該邊緣以電氣隔離該孔入口與周圍金 屬塗層。 2. —種實質以申請專利範圍第1項方法生産之定向 線條耦合器。 3. 如申請專利範圍第1項製造定向線條耦合器方法 其中該内部及該兩外部基板材料傜織玻璃加強之聚四氟乙 本紙張尺度適用中國國家標準<CNS)甲4規格（210 X 297公楚） (請先閲讀背面之注意事項再蜞寫本頁) 丨裝· 訂· .線. 經濟部中央標準扃S工消費合作社印製 81.9.10,000 01858 Α7 Β7 C7 D7 經濟部中央標準局R工消費合作社印« 六、申請專利範園 4. 一種實質以申請專利範圍第3項方法生産之定向 線條耦合器。 5. 如申請專利範圍第3項製造定向線條耦合器之方 法，其中該基板材料有一介電常數在2. 0至實質10. 0範圍内間。 6. —種實質以申請專利範圍第5項方法生産之定向 線條耦合器。 7. 如申請專利範圍第6項之定向線條耦合器，其中 該基板材料介電係數實質為2. 5,及其中重要之尺寸^_ ,b_^. w 界定規格係：s = . 01"’ b = . 1";及w = .04"。 8. 如申請專利範圍第1, 3或5項之方法包含另外 步驟將一Η熱激黏性材料置於内基板及各該兩外基板間， 使所有該基板結合一起並加熱。 9. 一種製造電路板之方法包含一或多個定向線條耦 合器，包含步驟： 形成第一和第二金屬線條於一内絶緣基板之相對邊， 各該線條具有第一和第二埠； 成形第一和第二外基板和包含一絶緣板一邊有金屬塗 層； 將該外基板叠合於該内基板各邊，使該埠處於已知及 預定之平面座標關僳，即相對該外基板金羼面之出入點； 成形孔穿過該夾層組件於該出入點； (請先閲讀背面乏注意事項再填寫本頁) -裝. 訂· .線. 本紙張尺度適用中國國家標準（CNS)甲4規格（210 X 297公釐） 一 2 — 81.9.10,000 A7 B7 C7 D7 (〇18δδ 六、申請專利範園 金屬鍍穿該孔使其有效電氣連接於該鍍孔之該各孔及 對應該内基板該埠之一間； 在各出入點鍍穿孔入口附近蝕刻一區以電氣隔離該孔 入口與周圍之金屬塗層，使沿著該外基板邊緣産生各該鍍 穿孔之連接片；及 垂直固定所成之該定向耦合器於母板包含接地金屬區 及電路，以銲接該耦合器片至該電路於該母板上及以銲接 該外基板之該接地平面至該母板之金屬區。 (請先閲讀.背面乏注意事項再填寫本頁) •丨裝· 訂· 線_ 經濟部中央標準局S工消費合作社印製 81.9.10,000 本紙張尺度適用中國國家標準（CNS)甲4規格（210 X 297公楚） 一 3 —
TW080100786A 1990-02-02 1991-01-31 TW201856B (zh)

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US07/474,563 US5032803A (en) 1990-02-02 1990-02-02 Directional stripline structure and manufacture

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TW201856B true TW201856B (zh) 1993-03-11

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Publication number Publication date
CA2031058C (en) 1994-09-13
DE69028765D1 (de) 1996-11-07
DE69028765T2 (de) 1997-02-06
KR920000148A (ko) 1992-01-10
EP0439928A1 (en) 1991-08-07
JPH0583015A (ja) 1993-04-02
AU6932891A (en) 1991-08-29
AU627100B2 (en) 1992-08-13
US5032803A (en) 1991-07-16
CA2031058A1 (en) 1991-08-03
ES2091808T3 (es) 1996-11-16
EP0439928B1 (en) 1996-10-02

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