TW201829108A - 打線接合裝置以及打線接合方法 - Google Patents

打線接合裝置以及打線接合方法 Download PDF

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Publication number
TW201829108A
TW201829108A TW106143294A TW106143294A TW201829108A TW 201829108 A TW201829108 A TW 201829108A TW 106143294 A TW106143294 A TW 106143294A TW 106143294 A TW106143294 A TW 106143294A TW 201829108 A TW201829108 A TW 201829108A
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Taiwan
Prior art keywords
wire
metal wire
bonding
capillary
engagement
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TW106143294A
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English (en)
Chinese (zh)
Inventor
関根直希
田中清貴
田村一成
長島康雄
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日商新川股份有限公司
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Publication of TW201829108A publication Critical patent/TW201829108A/zh

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
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TWI729885B (zh) * 2019-08-13 2021-06-01 日商新川股份有限公司 打線接合裝置
CN113451252A (zh) * 2020-03-27 2021-09-28 瑷司柏电子股份有限公司 具有保护接垫的高导热陶瓷基板及具该基板的大功率模块
TWI760708B (zh) * 2019-03-13 2022-04-11 日商新川股份有限公司 打線失敗檢查系統、打線失敗檢測裝置以及打線失敗檢測方法
TWI765352B (zh) * 2020-03-27 2022-05-21 璦司柏電子股份有限公司 具有保護接墊的高導熱陶瓷基板及具有該基板的大功率模組
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WO2021202211A1 (en) * 2020-03-29 2021-10-07 Kulicke And Soffa Industries, Inc. Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
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JP3527637B2 (ja) * 1998-06-15 2004-05-17 ローム株式会社 ワイヤボンディングの良否判別方法
JP2000183100A (ja) * 1998-12-18 2000-06-30 Kaijo Corp ワイヤボンディング装置
JP3567884B2 (ja) * 2000-11-22 2004-09-22 松下電器産業株式会社 超音波ボンディング方法
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JP2015153822A (ja) * 2014-02-12 2015-08-24 株式会社デンソー 半導体装置の製造方法

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TWI760708B (zh) * 2019-03-13 2022-04-11 日商新川股份有限公司 打線失敗檢查系統、打線失敗檢測裝置以及打線失敗檢測方法
TWI729885B (zh) * 2019-08-13 2021-06-01 日商新川股份有限公司 打線接合裝置
TWI722850B (zh) * 2020-03-27 2021-03-21 璦司柏電子股份有限公司 具有保護接墊的高導熱陶瓷基板及具有該基板的大功率模組
CN113451252A (zh) * 2020-03-27 2021-09-28 瑷司柏电子股份有限公司 具有保护接垫的高导热陶瓷基板及具该基板的大功率模块
TWI765352B (zh) * 2020-03-27 2022-05-21 璦司柏電子股份有限公司 具有保護接墊的高導熱陶瓷基板及具有該基板的大功率模組
CN113451252B (zh) * 2020-03-27 2024-05-14 瑷司柏电子股份有限公司 具有保护接垫的高导热陶瓷基板及具该基板的大功率模块
TWI825590B (zh) * 2021-02-22 2023-12-11 日商新川股份有限公司 打線接合裝置

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