TW201825598A - 聚矽氧樹脂組成物、含有波長轉換材料之聚矽氧樹脂組成物及含有波長轉換材料之薄片 - Google Patents
聚矽氧樹脂組成物、含有波長轉換材料之聚矽氧樹脂組成物及含有波長轉換材料之薄片 Download PDFInfo
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- TW201825598A TW201825598A TW106130220A TW106130220A TW201825598A TW 201825598 A TW201825598 A TW 201825598A TW 106130220 A TW106130220 A TW 106130220A TW 106130220 A TW106130220 A TW 106130220A TW 201825598 A TW201825598 A TW 201825598A
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- resin composition
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- structural unit
- polysiloxane resin
- oligomer
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- 239000000463 material Substances 0.000 title claims description 103
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- 125000000217 alkyl group Chemical group 0.000 claims abstract description 37
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- 239000000203 mixture Substances 0.000 claims abstract description 24
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- 238000004806 packaging method and process Methods 0.000 description 1
- GCKZNUDNTDWGFM-UHFFFAOYSA-N pentane-2,4-dione;tin Chemical compound [Sn].CC(=O)CC(C)=O GCKZNUDNTDWGFM-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- IBIRZFNPWYRWOG-UHFFFAOYSA-N phosphane;phosphoric acid Chemical class P.OP(O)(O)=O IBIRZFNPWYRWOG-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- DNXIASIHZYFFRO-UHFFFAOYSA-N pyrazoline Chemical compound C1CN=NC1 DNXIASIHZYFFRO-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 239000004172 quinoline yellow Substances 0.000 description 1
- 229940051201 quinoline yellow Drugs 0.000 description 1
- 235000012752 quinoline yellow Nutrition 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052950 sphalerite Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- AFCAKJKUYFLYFK-UHFFFAOYSA-N tetrabutyltin Chemical compound CCCC[Sn](CCCC)(CCCC)CCCC AFCAKJKUYFLYFK-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- VXKWYPOMXBVZSJ-UHFFFAOYSA-N tetramethyltin Chemical compound C[Sn](C)(C)C VXKWYPOMXBVZSJ-UHFFFAOYSA-N 0.000 description 1
- JTGNPNLBCGBCMP-UHFFFAOYSA-N tetraoctylstannane Chemical compound CCCCCCCC[Sn](CCCCCCCC)(CCCCCCCC)CCCCCCCC JTGNPNLBCGBCMP-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001392 ultraviolet--visible--near infrared spectroscopy Methods 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical class [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Led Device Packages (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016175089 | 2016-09-07 | ||
| JP2016-175089 | 2016-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201825598A true TW201825598A (zh) | 2018-07-16 |
Family
ID=61562092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106130220A TW201825598A (zh) | 2016-09-07 | 2017-09-05 | 聚矽氧樹脂組成物、含有波長轉換材料之聚矽氧樹脂組成物及含有波長轉換材料之薄片 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20210284843A1 (enExample) |
| EP (1) | EP3511377A4 (enExample) |
| JP (1) | JP6423500B2 (enExample) |
| KR (1) | KR20190051015A (enExample) |
| CN (1) | CN109689789A (enExample) |
| TW (1) | TW201825598A (enExample) |
| WO (1) | WO2018047756A1 (enExample) |
Cited By (1)
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|---|---|---|---|---|
| TWI855310B (zh) * | 2021-04-01 | 2024-09-11 | 日商日本電氣硝子股份有限公司 | 波長轉換構件及發光裝置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7281649B2 (ja) | 2019-08-29 | 2023-05-26 | パナソニックＩｐマネジメント株式会社 | 照明装置 |
| US11584882B2 (en) * | 2020-02-14 | 2023-02-21 | Osram Opto Semiconductors Gmbh | Wavelength converter; method of its making and light-emitting device incorporating the element |
| JP7377765B2 (ja) * | 2020-05-21 | 2023-11-10 | 信越化学工業株式会社 | オルガノポリシロキサン、およびそれを含有する組成物 |
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| RU2401846C2 (ru) * | 2006-04-25 | 2010-10-20 | Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) | Функциональные полиорганосилоксаны и композиция, способная к отверждению на их основе |
| JP5420166B2 (ja) * | 2006-12-28 | 2014-02-19 | 東レ・ダウコーニング株式会社 | 無溶剤型剥離性硬化皮膜形成性オルガノポリシロキサン組成物および剥離性硬化皮膜を有するシート状基材 |
| JP2009173694A (ja) * | 2008-01-21 | 2009-08-06 | Kaneka Corp | シリコーン系重合体粒子および該粒子を含有する硬化性樹脂組成物 |
| JP5625182B2 (ja) * | 2008-04-22 | 2014-11-19 | 東亞合成株式会社 | 硬化性組成物及び有機ケイ素化合物の製造方法 |
| CN102089356B (zh) * | 2008-07-11 | 2014-10-29 | 道康宁东丽股份有限公司 | 剥离改良剂和形成剥离性涂层的有机聚硅氧烷组合物 |
| JP5099911B2 (ja) * | 2008-09-11 | 2012-12-19 | 日東電工株式会社 | 熱硬化性組成物及び光半導体装置 |
| JP2010132726A (ja) * | 2008-12-02 | 2010-06-17 | Kaneka Corp | エポキシ基を含有するオルガノポリシロキサン変性体粒子 |
| CN102791801B (zh) * | 2010-02-19 | 2014-08-27 | 东丽株式会社 | 含有荧光体的硅氧烷固化物、其制造方法、含有荧光体的硅氧烷组合物、其组合物前体、片状成型物、led封装、发光装置及led安装基板的制造方法 |
| JP2011231145A (ja) * | 2010-04-23 | 2011-11-17 | Nitto Denko Corp | シリコーン樹脂用組成物 |
| JP5821761B2 (ja) * | 2011-04-20 | 2015-11-24 | セントラル硝子株式会社 | シロキサン化合物およびその硬化物 |
| JP5862066B2 (ja) | 2011-06-16 | 2016-02-16 | 東レ株式会社 | 蛍光体含有シート、それを用いたｌｅｄ発光装置およびその製造方法 |
| KR20130018561A (ko) * | 2011-08-08 | 2013-02-25 | 닛토덴코 가부시키가이샤 | 무기 산화물 입자 함유 실리콘 수지 시트 |
| JP2013095849A (ja) | 2011-11-01 | 2013-05-20 | Nippon Electric Glass Co Ltd | 波長変換部材およびそれを用いてなる発光デバイス |
| JP2013124324A (ja) * | 2011-12-15 | 2013-06-24 | Mitsubishi Chemicals Corp | 硬化性ポリオルガノシロキサン組成物および該組成物を硬化させてなるポリオルガノシロキサン硬化物 |
| JP2013159776A (ja) * | 2012-02-09 | 2013-08-19 | Adeka Corp | ケイ素含有硬化性白色樹脂組成物及びその硬化物並びに該硬化物を用いた光半導体パッケージ及び反射材料 |
| EP2861687B1 (en) * | 2012-06-14 | 2018-08-15 | Lumileds Holding B.V. | Optical composition |
| CN105637061A (zh) * | 2013-08-05 | 2016-06-01 | 康宁股份有限公司 | 发光的涂层和装置 |
| JP6616305B2 (ja) * | 2014-07-28 | 2019-12-04 | 住友化学株式会社 | シリコーン系封止材組成物及び半導体発光装置 |
| CN105368070A (zh) * | 2014-08-27 | 2016-03-02 | 旭化成株式会社 | 光学涂膜形成用前体、光学涂膜以及光学涂膜的制造方法 |
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2017
- 2017-09-04 EP EP17848696.5A patent/EP3511377A4/en not_active Withdrawn
- 2017-09-04 CN CN201780054475.0A patent/CN109689789A/zh active Pending
- 2017-09-04 US US16/330,435 patent/US20210284843A1/en not_active Abandoned
- 2017-09-04 KR KR1020197009934A patent/KR20190051015A/ko not_active Withdrawn
- 2017-09-04 WO PCT/JP2017/031728 patent/WO2018047756A1/ja not_active Ceased
- 2017-09-05 TW TW106130220A patent/TW201825598A/zh unknown
- 2017-09-07 JP JP2017172506A patent/JP6423500B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI855310B (zh) * | 2021-04-01 | 2024-09-11 | 日商日本電氣硝子股份有限公司 | 波長轉換構件及發光裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190051015A (ko) | 2019-05-14 |
| CN109689789A (zh) | 2019-04-26 |
| WO2018047756A1 (ja) | 2018-03-15 |
| JP6423500B2 (ja) | 2018-11-14 |
| EP3511377A1 (en) | 2019-07-17 |
| US20210284843A1 (en) | 2021-09-16 |
| EP3511377A4 (en) | 2020-04-22 |
| JP2018044156A (ja) | 2018-03-22 |
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