TW201821623A - Copper alloy plate for heat dissipation components, heat dissipation component, and method for producing heat dissipation component - Google Patents

Abstract

A copper alloy plate for heat dissipation components, which is characterized by: containing 0.05-0.5% by mass of Mg with the balance being made up of Cu and unavoidable impurities; and having a 0.2 proof stress of 100 MPa or more, an elongation of 3% or more, excellent bending workability, excellent diffusion bondability and excellent brazability. This copper alloy plate for heat dissipation components is also characterized by having a 0.2 proof stress of 50 MPa or more and an electrical conductivity of 70% IACS or more in cases where the copper alloy plate is heated at 850 DEG C for 30 minutes and is subsequently cooled, while being characterized in that a part of the process for producing heat dissipation components comprises diffusion bonding or bonding by means of brazing.

Description

Copper alloy plate for heat radiation part, heat radiation part and manufacturing method of heat radiation part

[0001] The present disclosure relates to a copper alloy plate for a heat-dissipating component used when manufacturing a plurality of heat-dissipating components such as a vapor chamber (a flat plate heat exchange tube) by joining a plurality of components, and a heat-dissipating component manufactured using the copper-alloy plate. In particular, a part of a process for manufacturing a heat-dissipating component includes a copper alloy plate for a heat-dissipating component used in a process heated to a temperature of 650 ° C. or higher, such as diffusion bonding or brazing, and a heat-dissipating component manufactured using the copper-alloy plate.

[0002] The desktop PC, notebook PC, tablet terminal, mobile phone represented by a smart phone, and the like are rapidly progressing in speed of operation and high-integration density of CPUs. The heat generation per unit area is further increased. If the temperature of the CPU rises to a certain temperature or higher, it may cause malfunctions, thermal runaway, etc., so effective heat dissipation from semiconductor devices such as the CPU becomes an urgent issue. In terms of heat-dissipating parts that absorb the heat of semiconductor devices and dissipate them to the atmosphere, heat sinks have been used. Since the heat sink is required to have high thermal conductivity, copper, aluminum, or the like having a large thermal conductivity is used as a raw material. In the desktop PC, a method of transferring heat from the CPU to a heat sink provided in a heat sink, etc., and removing the heat by a small fan installed in the desktop PC case is used. [0003] However, in a notebook PC, a tablet terminal, and the like having no space for installing a fan, a steam chamber (a flat-plate heat exchange tube) is used as a heat-dissipating part having a higher heat transfer capacity in a limited area. The heat exchange tube circulates the evaporation (heat absorption from the CPU) and condensation (release of the absorbed heat) of the refrigerant enclosed in the interior, which can exhibit higher heat dissipation characteristics than the heat sink. In addition, it is proposed to solve the heat generation problem of the semiconductor device by combining a heat exchange tube with a heat radiation component such as a heat sink or a fan. [0004] The steam chamber is a person that further improves the heat radiation performance of the tubular heat exchange tube (see Patent Documents 1 to 4). In the vapor chamber, in order to efficiently condense and evaporate the refrigerant, similarly to the tubular heat exchange tube, roughening processing on the inner surface, groove processing, and powder sintering to form fine holes have been proposed. In addition, as for the steam chamber, an external member (housing) and an internal member accommodated and fixed inside the external member have been proposed. In order to promote the condensation, evaporation, and transportation of the refrigerant, one or a plurality of internal members are arranged inside the external members, and they are processed into various shapes of fins, protrusions, holes, slits, and the like. This type of steam chamber is manufactured by arranging the internal components inside the external components and then joining the external components with each other and the external components and the internal components by diffusion bonding or brazing. The vapor chamber is filled with a refrigerant inside, and then sealed by a method such as brazing. When the heat generation of electronic parts is greater and exceeds the heat removal capability of the steam chamber, a heat-dissipating part having the same internal structure as the steam chamber and continuously supplying a refrigerant from the outside can be used (the internal pressure does not need to be low). The components of the casing used for this type of heat-dissipating parts and the manufacturing method of the casing are basically the same as those of the steam chamber (see Patent Document 5). [0005] Most of the raw materials of the casing of the steam chamber are made of oxygen-free copper (OFC) having excellent thermal conductivity, corrosion resistance, processability, and etching properties. For example, a soft material having a thickness of about 0.3 to 1.0 mm (quality O) ) ~ Sheets (including strips) of hard material (quality H). An example of the production process of a vapor chamber using an OFC plate material will be described with reference to FIG. 1 as follows. First, on one side of a rectangular plate member cut out of an OFC sheet material, patterns such as a plurality of grooves, irregularities, etc. are formed by etching or pressing using a mold. Next, the surface on which the aforementioned pattern is formed is used as the inner side, and the plate members 1 and 2 are stacked one on top of the other, and the plate members 1 and 2 are joined to each other by diffusion bonding or brazing. Diffusion bonding is a state where a stress (applied pressure) of about 2 to 6 MPa is applied to the joint in a vacuum environment with a pressure higher than 10 ^-2 , and the temperature is raised to a high temperature of 800 to 900 ° C. After reaching a predetermined temperature, it is maintained at the same temperature 10 ~ 120 minutes. Moreover, pressurization of the joining part in diffusion joining may be performed after the plate members 1 and 2 reach the said predetermined temperature. In addition, a nozzle (narrow diameter tube) (not shown) is fitted between the plate members 1 and 2, and the nozzles are also joined. After joining, the working fluid (water, etc.) is placed inside the vapor chamber through the nozzle in a vacuum or reduced pressure environment, and then the nozzle is sealed. [0006] When a steam chamber is made by brazing, a thin plate or foil of silver-copper solder, phosphor-copper solder, or the like in the shape of the joint portion is sandwiched between the plate members that are stacked vertically, and continuously inserted into the heating furnace in its state, and Heating and brazing. The brazing environment is a vacuum environment, a reducing environment, or an inert gas environment around 10 ^-1 atmospheric pressure, and the heating temperature is 650 to 900 ° C. In addition, in the brazing heating step, in order to avoid displacement at the joint due to vibration or the like, heating and brazing are performed in a state where a stress (applied pressure) of about 2 to 5 MPa is applied to the joint. [Prior Art Document] [Patent Document] [0007] [Patent Document 1] Japanese Patent Laid-Open No. 2004-238672 [Patent Document 2] Japanese Patent Laid-Open No. 2007-315745 [Patent Document 3] Japanese Patent Laid-Open No. 2014-134347 Gazette [Patent Document 4] Japanese Patent Laid-Open Publication No. 2015-121355 [Patent Document 5] International Publication No. 2014/171276

[Problems to be Solved by the Invention] [0008] Most of the raw materials of the housing of the heat radiation parts such as the steam chamber, the board of oxygen-free copper (OFC) is used (C1020 specified in JISH3100). Oxygen-free copper board system has good thermal conductivity (electric conductivity: 102% IACS), excellent thermal dissipation, excellent corrosion resistance and processability (bending, etching, stamping, etc.), diffusion bonding, and brazing Also excellent advantages. On the other hand, in the case of an oxygen-free copper plate such as a steam chamber, it is softened by high-temperature heating (diffusion bonding or heating during brazing) at the time of manufacture, and the steam chamber after manufacturing is transported and mounted on a heat sink or semiconductor device. Or easily deformed when assembled in a PC case. When the steam chamber is deformed, for example, when the flatness of the casing is deteriorated, it is difficult to make the steam chamber perform its intended performance. Further, since this deformation must be prevented, there is a problem that the copper plate of the raw material cannot be thinned (lightening of the vapor chamber). When using an oxygen-free copper board, the same problem occurs even in other heat-dissipating parts that include diffusion bonding or brazing in a part of the manufacturing process. [0009] Therefore, the embodiment of the present invention relates to the improvement of the copper plate of the raw material of the heat-dissipating parts such as the steam chamber, and the purpose is to improve the strength after high temperature heating during diffusion bonding or brazing, and to reduce the thickness and weight of the copper plate. [Means to Solve the Problem] [0010] A copper plate (copper alloy plate) for a heat-dissipating part according to an embodiment of the present invention is characterized in that it includes diffusion bonding or bonding by brazing, which is part of a process for manufacturing a heat-dissipating part. It is used under certain conditions and contains Mg: 0.05-0.5% by mass. The remaining part is composed of Cu and unavoidable impurities. It has a 0.2% endurance of 100MPa or more, an extension of 3% or more, excellent bending workability, and excellent diffusion. Bondability and brazing resistance. After heating at 850 ° C for 30 minutes, the 0.2% resistance when cooling is 50 MPa or more, and the conductivity is 70% IACS or more. In addition, the heat-dissipating component according to the embodiment of the present invention is characterized by containing Mg: 0.05 to 0.5% by mass, and the remaining portion is composed of Cu and unavoidable impurities, and is mutually bonded by diffusion bonding or brazing. It is composed of a plurality of joined copper alloy plates. The 0.2% resistance of the aforementioned copper alloy plate is 50 MPa or more, and the electrical conductivity is 70% IACS or more. [0011] The above-mentioned copper alloy plate is based on the premise that the above characteristics are satisfied, and further contains the elements (1) to (3) shown below as required, or an element group or a combination of (1) to (3). More than 2 types. (1) Zn: 0.6% by mass or less (excluding 0% by mass), (2) P: 0.05% by mass or less (excluding 0% by mass), and (3) selected from the group consisting of Sn, Al, Mn, Fe, Ni, and Co , Si, Ag, Ti, Cr, Zr, or a combination of one or more elements is 0.3% by mass or less. [Inventive effect] [0012] The above-mentioned copper alloy plate has a strength of 50 MPa or higher after heating at 850 ° C for 30 minutes (assuming heating by diffusion bonding or brazing), compared with the conventional oxygen-free copper Board, which has higher strength and can be thinned, which can make the heat-dissipating parts (shell) lighter. In addition, the above-mentioned copper alloy plate has a conductivity of 70% IACS or higher, so it has heat dissipating properties that are not inferior to those of conventional oxygen-free copper plates. In addition, the above-mentioned copper alloy plate is easy to evaporate when heated at high temperature, and can suppress the contents of Mg, Zn, and P that reduce the diffusion bonding and brazing properties to be low. Therefore, compared with the conventional one, in diffusion bonding or brazing, An oxygen-free copper plate has excellent bonding properties that are not inferior.

[Mode for Carrying Out the Invention] [0014] Hereinafter, a copper alloy plate for a heat-dissipating component according to an embodiment of the present invention will be described in more detail with a steam chamber as an example. [Composition of Copper Alloy] The copper alloy according to the embodiment of the present invention contains Mg: 0.05 to 0.5% by mass, and the remaining portion is made of Cu and unavoidable impurities. Further, as needed, (1) Zn: 0.6% by mass or less (excluding 0% by mass), (2) P: 0.05% by mass or less (excluding 0% by mass), and (3) selected from the group consisting of The total amount of one or more elements of Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, and Zr is 0.3% by mass or less (excluding 0% by mass). [0015] The Mg atomic radius is larger than Cu. Even if it is added in a small amount, the strength of the copper alloy will be improved by solid solution strengthening. However, when the Mg content is less than 0.05% by mass, the strength after high-temperature heating is insufficient. On the other hand, if the content of Mg exceeds 0.5% by mass, when heated to a high temperature, Mg will evaporate, which will reduce diffusion bonding and brazing properties, and decrease the electrical conductivity. Therefore, the Mg content is set in a range of 0.05 to 0.5% by mass. The upper limit of the Mg content is preferably 0.4% by mass, and more preferably 0.3% by mass. [0016] Zn improves the heat-resistant peelability of solder and the heat-resistant peelability of Sn plating. The vapor chamber is sometimes soldered to the electronic component of the heat sink, and in order to improve the corrosion resistance, the vapor chamber is sometimes plated with Sn. In this case, a copper alloy plate containing Zn as a raw material of the casing of the vapor chamber is suitably used. Even if Zn is added in a small amount, it has the effect of improving the above-mentioned heat-resistant peelability, and its content is preferably 0.001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, when the Zn content exceeds 0.6% by mass, when heated to a high temperature, Zn will evaporate, and the diffusion bonding properties and brazeability will decrease. Therefore, when Zn is contained, the Zn content is set to a range of 0.6% by mass or less (excluding 0% by mass). The upper limit of the Zn content is preferably 0.4% by mass, and more preferably 0.3% by mass. [0017] P will form a Mg-P compound in the copper alloy, which improves the strength of the copper alloy plate. In order to obtain the effect of increasing the strength with P, the vapor chamber after heating at high temperature (diffusive bonding or brazing) can be heated at 400 to 600 ° C. for about 30 minutes to 4 hours to precipitate the Mg-P compound. Even if P is added in a small amount, it has the effect of improving strength, and its content is preferably 0.001% by mass or more, and more preferably 0.005% by mass or more. On the other hand, if the P content exceeds 0.05% by mass, the electrical conductivity of the copper alloy decreases. Therefore, when P is contained, the P content is set to a range of 0.05% by mass or less (excluding 0% by mass). [0018] Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, Zr will increase the strength of the copper alloy plate. However, when one or more of these elements are contained in order to reduce the conductivity of the copper alloy plate, the upper limit of the total content of one or two or more of these elements is It is set to 0.3% by mass (excluding 0% by mass), and the electrical conductivity after heating at high temperature is added in a range not to reach 70% IACS. Among them, Sn, Al, Mn, Si, and Ti have a strong effect on reducing the conductivity of the copper alloy plate. The content of these elements is preferably 0.03% by mass or less, and the total of two or more types is preferably 0.1% by mass or less. . In addition to Fe, Ni, and Co systems, which solidify and strengthen copper alloys, when the copper alloy contains P, P compounds are formed in the copper alloy to precipitate and strengthen the copper alloy. In order to use this effect, the content of Fe, Ni, and Co is preferably 0.05% by mass or more, respectively or in total. Cr and Zr systems have the effect of preventing the coarsening of crystal grains when the copper alloy plate is heated to a high temperature of 650 ° C or higher in addition to precipitation strengthening of the copper alloy. In order to use this effect, the contents of Cr and Zr are preferably 0.005% by mass or more. In addition, Cr and Zr are more easily oxidized than Cu, and an oxide film is formed on the surface of the copper alloy plate, which reduces the diffusion bonding and brazeability. Therefore, the Cr content should be 0.2% or less, and the Zr content should be set to 0.1% or less. Ag has the effect of improving the strength and heat resistance of copper alloys. The Ag content is preferably in the range of 0.005 to 0.1% by mass. [0019] Inevitable impurities H, O, S, Pb, Bi, Sb, Se, As, if the copper alloy plate is heated to a temperature above 650 ° C for a long time, it may accumulate at the grain boundary and cause heating Grain boundary cracking and grain boundary embrittlement and the like after heating are preferred, and the content of these elements is preferably reduced. Among them, H is aggregated at the grain boundary and the interface between the intermediary and the base material during heating, and swells. Therefore, it is preferably set to less than 1.5 ppm (mass ppm, the same below), and more preferably set to less than 1 ppm. . O is preferably less than 20 ppm, and more preferably less than 15 ppm. S, Pb, Bi, Sb, Se, and As are preferably less than 30 ppm in total, and more preferably less than 20 ppm. In particular, for Bi, Sb, Se, and As, the total content of these elements is preferably less than 10 ppm, and more preferably less than 5 ppm. [Characteristics of Copper Alloy Plate] The copper alloy plate for heat-dissipating parts according to the embodiment of the present invention has the above-mentioned alloy composition, and has superior bonding properties (diffusive bonding properties, diffusion bonding properties, etc.) compared to oxygen-free copper plates. Brazing). The copper alloy plate for heat-dissipating parts is processed into a predetermined shape by stamping, punching, cutting, etching, bending, etc. before diffusion bonding or brazing, and is heated at high temperature (for removing gas, bonding (brazing, Diffusion bonding, welding (heating of TIG, MIG, laser, etc.), sintering, etc., processed into heat-dissipating parts, such as the housing parts of the steam chamber. The copper alloy plate is preferably in the transportation and operation during the aforementioned processing. It is easy to deform and has mechanical characteristics that can be implemented without hindering the aforementioned processing. More specifically, the copper alloy sheet of the embodiment of the present invention has a 0.2% endurance of 100 MPa or more and an elongation of 3% or more, and has excellent bending processing. The extension is preferably 5% or more. These characteristics can be easily achieved with a copper alloy plate having the composition of the embodiment of the present invention. If these characteristics are provided, the tempering of the copper alloy plate is not a problem. For example, after the heat treatment, the heat-treated material can be used by cold rolling, etc. [0021] The copper alloy plate processed into the shell parts of the steam chamber is subjected to high temperature as described above. Heat (heating during diffusion bonding or brazing) is finished into the housing of the vapor chamber. Although the heating conditions for the high temperature heating described above are different between diffusion bonding and brazing, in the embodiment of the present invention, it is assumed that High-temperature heating is performed at about 650 ° C to 1050 ° C. The copper alloy plate according to the embodiment of the present invention has a water-cooled strength (0.2% endurance) of 50 MPa or more after heating at 850 ° C for 30 minutes, and a conductivity of 70% IACS. Above. Heating at 850 ° C for 30 minutes is assumed to be a heating condition for a bonding process (diffusion bonding, brazing) in the manufacture of a steam chamber casing. The casing ratio of the steam chamber using the copper alloy plate according to the embodiment of the present invention The oxygen-free copper plate has high strength, and can be prevented from being deformed when mounted on a heat sink, a semiconductor device, or incorporated in a PC case. In addition, the copper alloy plate according to the embodiment of the present invention has a higher strength than an oxygen-free copper plate after high temperature heating. It is also high, so it can be thinned (0.1 to 1.0 mm thick), thereby improving the heat dissipation performance of the steam chamber and making up for the decrease in electrical conductivity when compared to an oxygen-free copper plate. In addition, embodiments of the present invention Copper alloy plate, even The high-temperature heating temperature is less than 850 ° C (more than 650 ° C) or more than 850 ° C (less than 1050 ° C). It can also achieve 0.2% endurance near 50MPa or more, and electrical conductivity near 70% IACS or more. [0222] After the steam chamber manufactured by using the copper alloy plate according to the embodiment of the present invention is heated at the above-mentioned temperature, if necessary, the main purpose of improving corrosion resistance and brazing resistance is to form a Sn coating layer on at least a part of the outer surface. The Sn coating layer includes electroplating, electroless plating, or those formed by heating to a temperature below or above the melting point of Sn. The Sn coating layer includes Sn metal and Sn alloy, and the Sn alloy system can be exemplified by Those containing one or more of Bi, Ag, Cu, Ni, In, and Zn other than Sn in a total amount of 5% by mass or less as alloy elements. [0023] Ni, Co, Fe, and other base plating may be formed under the Sn coating layer. These base platings have a function of preventing the diffusion of Cu and alloy elements from the base material, and a function of increasing the surface hardness of the heat-dissipating parts to prevent scratches. A Cu-Sn alloy layer is formed by plating Cu on the above-mentioned base plating, further plating Sn, and heating to a temperature below or above the melting point of Sn to form a Cu-Sn alloy layer. It can also be used as a base plating or a Cu-Sn alloy layer. And 3-layer structure of Sn coating. The Cu-Sn alloy layer has a function of preventing the diffusion of Cu and alloy elements from the base material, and a function of increasing the surface hardness of the heat-dissipating part to prevent scratches. [0024] In a steam chamber manufactured using the copper alloy plate according to the embodiment of the present invention, after the above-mentioned high-temperature heating, a Ni coating layer is formed on at least a part of the outer surface if necessary. The Ni coating layer has the function of preventing the diffusion of Cu and alloy elements from the base material, increasing the surface hardness of the heat-dissipating parts to prevent scratches, and improving the corrosion resistance. [Production method of copper alloy plate] The copper alloy plate of the embodiment of the present invention is the same as a general solid-solution strengthened copper alloy plate, and can be melted, cast, homogenized, hot rolled, and cold rolled. And manufacturing steps. The heat treatment can be performed by a batch furnace or a continuous heat treatment furnace. When heat treatment is performed in a batch furnace, it is preferable that the solid temperature of the copper alloy sheet reaches 350 to 600 ° C and is maintained for 0.5 to 4 hours. When the heat treatment is performed in a continuous heat treatment furnace, it is only necessary to set the ambient temperature in the furnace to an environment of 450 to 700 ° C. and continuously pass the plate. By these heat treatments, the copper alloy sheet material has recovery or recrystallization, predetermined strength and elongation, and excellent bending workability. The steps of cold rolling and heat treatment can be repeated several times. Cold rolling-After heat treatment, cold rolling is performed as required, and further, deformation-relief annealing may be performed as required. By the above manufacturing method, a copper alloy plate for a heat-dissipating part having a 0.2% endurance of 100 MPa or more, an elongation of 3% or more, excellent bending workability, and excellent bonding properties can be manufactured. In addition, the manufactured copper alloy sheet had a 0.2% endurance of 50 MPa or more and a conductivity of 70% IACS or more when heated at 850 ° C for 30 minutes and then cooled. In addition, in order to enable good bonding (no bonding failure, high bonding strength, etc.) by means of diffusion bonding, brazing, etc. at a temperature of 650 ° C or higher, the surface roughness of the copper alloy plate (product) is calculated using an arithmetic average roughness. The degree Ra is 0.3 μm or less, the maximum height roughness Rz is 1.5 μm or less, and the internal oxidation depth is 0.5 μm or less, and preferably 0.3 μm or less. In order to make the surface roughness of the copper alloy plate (product) Ra: 0.3 μm, Rz: 1.5 μm or less, the surface roughness of the roll axis direction of the calender roll used in the final cold rolling is, for example, Ra: 0.15 μm, Rz: 1.0 μm or less, or polishing the copper alloy plate after final cold rolling, such as polishing and electrolytic polishing. The internal oxidation depth of the copper alloy plate (product) is 0.5 μm or less, as long as the annealing environment is reduced and the dew point is −5 ° C. or less, or the annealed copper alloy plate is mechanically polished ( Polishing, brushing, etc.) or electrolytic grinding to remove the internal oxide layer formed or to thin it. [0026] In the aforementioned bending process, it is required that no cracks be generated in the bent portion. Further, it is preferable that surface roughness does not occur at or near the curved line. Even if it is a copper alloy plate of the same material, the easiness of cracking and surface roughness due to bending depends on the ratio R / t of the bending radius R to the thickness t of the plate. When using copper alloy plates to manufacture heat dissipation parts such as steam chambers, the bending workability of copper alloy plates is required to bend at least R / t ≦ 2 when rolling at right angles (the bending line is perpendicular to the rolling direction). Cracks occur. In terms of the bending workability of the copper alloy sheet, it is more preferable that no cracking occurs when the bending is R / t ≦ 1.5, and it is more preferable that no cracking occurs when the bending is R / t ≦ 1.0. The bending workability of a copper alloy plate is generally tested with a test piece having a plate width of 10 mm (refer to the bending workability test of the examples described later). When the copper alloy sheet is subjected to bending processing, the larger the bending width, the more likely it is to crack. Therefore, when the bending width is particularly large, it is better to use a test piece with a plate width of 10mm to bend without cracking. It is better to bend without R / t = 0.5. In addition, in order not to cause surface roughness in the bending line and its vicinity, the average crystal grain size (cutting method) of the copper alloy plate measured in the plate width direction is preferably 20 μm or less, and more preferably 15 μm or less. It is more preferably 10 μm or less. [Examples] [0027] The copper alloy having the composition shown in Table 1 was melted / cast in a vacuum environment, and ingots each having a thickness of 60 mm, a width of 200 mm, and a length of 80 mm were produced. In No. 1 (oxygen-free copper) of Table 1, H of the inevitable impurities was 0.6 ppm, O was 7 ppm, and the total of S, Pb, Bi, Sb, Se, and As was 6 ppm. For copper alloys other than No. 1, H is less than 1 ppm, O is less than 15 ppm, and S, Pb, Bi, Sb, Se, and As are less than 15 ppm in total. [0028] [0029] Each ingot was subjected to a homogenization heat treatment at 900 ° C for 1 hour, and then hot-rolled to a hot-rolled material (width 200mm) having a thickness of 20 mm, and water-cooled from a temperature of 650 ° C or higher. Both sides of the subsequent hot-rolled material were shaved (thickness 18 mm) 1 mm at a time. The rolled material was cold rolled to a thickness of 14.7mm. A part of the cold rolled material (thickness: 14.7 mm) was obtained and used as a test material to measure the diffusion bonding properties according to the following procedure. [0030] The remaining portion of the cold rolled material (thickness 14.7 mm) was further cold rolled to a thickness of 0.4 mm, followed by heat treatment at 400 ° C for 2 hours, and further cold rolled to a thickness of 0.3 mm (processing rate). : 25%). Thereafter, heat treatment was performed at 250 ° C for 15 seconds (No. 1) or 300 ° C for 20 seconds (No. 2 to 27) in a saltpeter furnace to produce a copper plate (No. 1) and a copper alloy plate ( No. 2 to 27). Using this copper plate and copper alloy plate as test materials, the brazing properties and mechanical properties were measured in the following manner. In addition, the composition of each heat-dissipating component having a thickness of 0.3 mm was analyzed with a copper plate, and the values were the same as those in Table 1. Regarding any of the hot rolled materials, the surface roughness was Ra: 0.08 to 0.15 μm, Rz: 0.8 to 1.2 μm, the thickness of the plate was polished, and the thickness was measured by a scanning electron microscope (observation magnification: 15000 times). The internal oxidation depth is 0.1 μm or less. The copper plate and copper alloy plate (thickness: 0.3 mm) were heated at 850 ° C. for 30 minutes and then water-cooled. As a test material, the conductivity and mechanical properties were measured in the following manner. Each measurement result is shown in Table 2. [Diffusion Bondability] As an index of diffusion bondability, the raw material strength ratio of the diffusion bonding strength (the one obtained by dividing the diffusion bonding strength by the raw material strength) is determined. The raw material strength ratio of the diffusion bonding strength, the raw material strength, and the diffusion bonding strength is obtained in the following order. (Diffusion bonding strength) (1) A 14.7 mm × 70 mm × 30 mm block was cut out from each of the test materials No. 1 to 27, and heat-treated at 400 ° C. for 2 hours, and then cold-rolled to a thickness of 11 mm (processing Rate 25%). The heat treatment conditions and the final cold rolling process rate are the same as the heat treatment conditions and final cold rolling process rate of the test material (copper plate and copper alloy plate for heat-dissipating parts) to be cold rolled to a thickness of 0.3 mm. (2) From each block, six test pieces each having a cylindrical shape with a diameter of 10 mm and a length of 30 mm were produced. The longitudinal direction of this test piece is parallel to the rolling direction. (3) After polishing one end surface (surface with a diameter of 10 mm) of each test piece with emery paper, the surface roughness of the aforementioned end surface was adjusted to approximately the maximum height Rz: 0.8 μm, and the arithmetic average roughness Ra: 0.06 μm. . (4) The diffusion bonding test device is a test device that can perform vacuum evacuation, gas replacement, and temperature increase in the chamber, pressurize the test pieces with their end faces against each other, and maintain the pressurized state. A test piece (with two groups as a set) facing the polished end faces facing each other was built in the device, and the inside of the device was evacuated. (5) After the degree of vacuum reaches 2 × 10 ^-2 Pa, the temperature is raised at an average heating rate of 100 ° C./min. After the temperature of the test piece reaches 850 ° C., the end faces mutually resist each other at a pressure of 4 MPa and are held for 30 minutes. Then, N ₂ gas was introduced into the apparatus and cooled to 200 ° C. under pressure (average cooling rate was about 20 ° C./minute). After reaching 200 ° C., the diffusion-bonded test piece (joined test piece) was taken out of the apparatus. (6) Three test pieces were prepared for each test piece. A tensile test piece having a total length of 60 mm, a parallel portion diameter of 6 mm, a parallel portion length of 30 mm, a gripping portion diameter of 10 mm, and a gripping portion length of 10 mm was prepared from each joint test piece. This tensile test piece was subjected to a tensile test at room temperature, and the tensile strength was measured. The minimum value of the tensile strength of the three joint test pieces was set as the diffusion bonding strength. In addition, in a qualified material having a raw material strength ratio of 0.95 (95%) or more of the diffusion bonding strength described later, cracks occurred after the central portion of the tensile test piece was tightened in the longitudinal direction. [0032] (Raw material strength) (1) From each of the test materials No. 1 to 27, a 14.7 mm × 40 mm × 60 mm block was cut out, heat-treated at 400 ° C. × 2 hours, and then cold rolled to a plate thickness. 11mm (processing rate 25%). The heat treatment conditions and the final cold rolling processing rate are the same as those of the test materials (copper plates and copper alloy plates for heat-dissipating parts) and the final cold rolling. The processing rate is the same. (2) From each block, three tensile test pieces each having a total length of 60 mm, a parallel portion diameter of 6 mm, a parallel portion length of 30 mm, a gripping portion diameter of 10 mm, and a gripping portion length of 10 mm were prepared. The longitudinal direction of the tensile test piece is parallel to the rolling direction. (3) Each tensile test piece was placed in a heat treatment device, and the temperature was raised at a vacuum rate (2 × 10 ^-2 Pa) at an average heating rate of 100 ° C./min. After the test piece temperature reached 850 ° C., it was held for 30 minutes. Then, N ₂ gas was introduced into the apparatus to cool it to 200 ° C. (average cooling rate was about 20 ° C./minute), and after reaching 200 ° C., the tensile test piece was taken out of the apparatus. The heat treatment conditions are the same except for the heating and cooling conditions at the time of diffusion bonding during the measurement of the diffusion bonding strength, and the point where no pressure is applied. (4) Using each test piece, perform a tensile test at room temperature in accordance with JISZ2241. The tensile strength (three average values) obtained as a result was set as the strength of each raw material. [0033] (Raw Material Strength Ratio of Diffusion Bonding Strength) From the results of the two tests, the raw material strength ratio of the diffusion bonding strength (the one obtained by dividing the diffusion bonding strength by the raw material strength) was determined. This value was regarded as the raw material strength ratio of the diffusion bonding strength of the copper plate and copper alloy plate for heat-dissipating parts, and the value was considered to be 0.95 (95%) or more. If the fracture surface after the tensile test is observed with a SEM (scanning electron microscope), the qualified material is completely covered with small dimples, showing a typical ductile fracture surface. This means that the end faces of the test materials that are mutually offset are integrated by diffusion bonding. On the other hand, in the broken surface of the defective material, the small area ratio of the small pits indicates that the integration due to diffusion bonding has not sufficiently occurred. In the case of non-conforming materials, after the diffusion bonding test, in order to observe the inner side of the window of the quartz glass provided inside the diffusion bonding device from the outside of the device, a translucent adherend can be seen. The attached matter was analyzed by an EPMA (electron probe microanalyzer), and as a result, Zn and Mg contained in the material of the test piece were detected. From these facts, it is speculated that in the unqualified materials, due to the high-temperature heating during diffusion bonding, when Zn and Mg are evaporated from the surface of the test piece, the pressure directly hinders diffusion bonding, and the evaporated Zn and Mg adhere to the bonding of the test material The end faces are oxidized by oxygen contained in the environment, or Zn and Mg are oxidized when they evaporate from the joining end faces, become oxides and adhere, and hinder diffusion joining at the end faces. [Brazability] The brazeability is measured by a solder wetting spread test. After the test material was acid-washed to remove the oxide film, a square (50 mm × 50 mm) test piece was cut from each cold rolled material, polished with # 2000 emery paper, and polished to adjust the surface roughness Ra: 0.07 μm For further solvent degreasing and electrolytic degreasing. For the solder material, BCuP-2 (Cu-7 mass% P) having a diameter of 2 mm was used, and a length of 0.38 g (equivalent to a length of 15 mm) was cut out and used. The test piece was placed with a solder material and placed in a vacuum furnace, and a vacuum environment with a pressure of 10 ^-3 Pa was formed at room temperature, and the vacuum environment was maintained and heated to 840 ° C (average temperature rise rate 100 ° C / min). After the temperature of the test piece reached 840 ° C, it was held for 30 seconds, and then cooled to room temperature (an average temperature decrease rate of 200 ° C to 200 ° C / min), and the test piece was taken out of the furnace. The solder on the test piece was observed with a CCD camera VHX-600 (manufactured by Keyence Co., Ltd.), and an image analysis device built into the camera was used to binarize the expanded portion of the solder and other portions to identify it. Wet spread area of solder. Those with a wet spread area of 5 cm ² or more were considered acceptable. It is presumed that in a non-conforming material, Zn and Mg are evaporated from the surface of the test material by high-temperature heating in the same manner as in the diffusion bonding test, and the wetting and spreading of the solder is prevented by the same mechanism as in the case of diffusion bonding. [Mechanical Properties] A JIS No. 5 tensile test piece was cut out from the test material so that the longitudinal direction became parallel to the rolling direction, and a tensile test was performed in accordance with JIS-Z2241 to measure the endurance and elongation. Endurance is equivalent to 0.2% of tensile strength. [Bendability] The measurement of the bendability was carried out in accordance with the W bending test method specified in the copper drawing standard JBMA-T307. A test piece having a width of 10 mm and a length of 30 mm was cut out from each test material, and a GW (Good Way (the bending line is perpendicular to the rolling direction)) was bent using a jig having R / t = 0.5. Then, the presence or absence of cracks in the bent portion was visually observed with a 100-fold optical microscope, and those without cracks were evaluated as P (P: Pass, Pass). [Conductivity] The measurement of conductivity is based on the non-ferrous metal material conductivity measurement method specified in JIS-H0505, and is performed using the four-terminal method using a double bridge. [0036] [0037] As shown in Tables 1 and 2, the No. 1 (conventional material) diffusion bonding strength made of oxygen-free copper has a high raw material strength ratio, a large solder wetting and expansion area, and excellent diffusion bonding and brazing properties. The blur of the quartz window was also not seen in the diffusion bonding. In addition, the characteristic of No. 1 after heating at 850 ° C for 30 minutes is high electrical conductivity (102% IACS), and 0.2% endurance is extremely low (38 MPa). On the other hand, the alloy composition is a raw material strength ratio of No. 3 to 7, 9 to 11, 13 to 15, 17 to 19, 21, 22, 26, and 27 diffusion bonding strengths within a predetermined range of the embodiment of the present invention. It is 95% or more, the solder wetting expansion area is 5.0 cm ² or more, and No. 1 of the conventional material has inferior diffusion bonding and brazing properties. The blur of the quartz window was also not seen in the diffusion bonding. In addition, after heating at 850 ° C for 30 minutes, the 0.2% endurance is 50 MPa or more, which is considerably higher than that of No. 1 of conventional materials, and the conductivity is 70% IACS or more. [0038] In contrast, the alloy composition is the raw material strength ratio (diffusive bondability) of No. 2, 8, 12, 16, 20, 23 to 25 series diffusion bonding strength outside the prescribed range of the embodiment of the present invention, and solder Wet spreading area (brazing resistance), 0.2% of endurance or conductivity after heating at 850 ° C for 30 minutes are inferior in characteristics. No. 2 is because the Mg content is insufficient, the 0.2% endurance after heating at 850 ° C for 30 minutes does not reach 50 MPa. No. 8 is because the Mg content is excessive, the diffusion bonding property and the brazing property are poor, and the blur of the quartz window is generated during the diffusion bonding. In addition, the conductivity after heating at 850 ° C for 30 minutes was low. The No. 12 system has an excessive Zn content, and therefore has poor diffusion bonding and brazing properties. Blur of a quartz window occurs during diffusion bonding. No. 16 has an excessive P content, so the conductivity after heating at 850 ° C for 30 minutes is low. No. 20 is due to an excessive Zn content, which results in poor diffusion bonding and brazing properties, and blurring of a quartz window occurs during diffusion bonding. In addition, since the P content is excessive, the conductivity after heating at 850 ° C for 30 minutes is low. No.23 is because the P content is excessive, so the conductivity after heating at 850 ° C for 30 minutes is as low as 58% IACS. No. 24 is excessive in the total content of other elements (Al, Si, Mn), so the conductivity after heating at 850 ° C for 30 minutes is low. In addition, the diffusion bonding property and the brazing property were poor. It is estimated that when this system is heated at 850 ° C. for 30 minutes, Al, Si, and Mn are oxidized on the surface of the plate, preventing the bonding. No. 25 is because the total content of other elements (Fe, Sn) is excessive, so the conductivity after heating at 850 ° C for 30 minutes is low. [0039] The disclosure of this specification includes the following aspects. Aspect 1: A copper alloy plate for heat-dissipating parts, which is characterized by containing Mg: 0.05-0.5% by mass, and the remaining portion is composed of Cu and unavoidable impurities, and has a 0.2% endurance of 100 MPa or more and an extension of 3% or more. And excellent bending workability, and excellent diffusion bonding and brazing properties. After heating at 850 ° C for 30 minutes, the 0.2% endurance when cooling is 50 MPa or more, and the conductivity is 70% IACS or more. Part of the process includes diffusion bonding or brazing. Aspect 2: The copper alloy plate for heat-dissipating parts as in aspect 1, further containing Zn: 0.6% by mass or less (excluding 0% by mass). Aspect 3: The copper alloy plate for heat-dissipating parts as in aspect 1 or 2, further containing P: 0.05% by mass or less (excluding 0% by mass). Aspect 4: The copper alloy plate for heat-dissipating parts according to any one of aspects 1 to 3, further comprising 1 selected from the group consisting of Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, and Zr The total of one or two or more elements is 0.3% by mass or less (excluding 0% by mass). Aspect 5: A heat-dissipating component, which is characterized by containing Mg: 0.05-0.5% by mass, and the remaining portion is composed of Cu and unavoidable impurities, and is plurally bonded to each other by diffusion bonding or brazing. It is composed of a copper alloy plate. The 0.2% endurance of the copper alloy plate is 50 MPa or more, and the electrical conductivity is 70% IACS or more. Aspect 6: The heat-dissipating part of Aspect 5, wherein the aforementioned copper alloy plate further contains Zn: 0.6% by mass or less (excluding 0% by mass). Aspect 7: The heat-dissipating component according to aspect 5 or 6, wherein the aforementioned copper alloy plate further includes P: 0.05% by mass or less (excluding 0% by mass). Aspect 8: The heat dissipating component according to any one of aspects 5 to 7, wherein the copper alloy plate further contains 1 selected from the group consisting of Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, and Zr The total of one or two or more elements is 0.3% by mass or less (excluding 0% by mass). Aspect 9: A method for manufacturing a heat-dissipating component, which is characterized in that the heat-dissipating component of any of aspects 1 to 4 is processed into a predetermined shape and then subjected to a process of heating to 650 ° C or higher to obtain a pressure of 50 MPa. Above 0.2% endurance and above 70% IACS heat dissipation parts. Aspect 10: The method for manufacturing a heat-dissipating component as described in Aspect 9, wherein a Sn coating layer is formed on at least a part of the outer surface of the heat-dissipating component after the process of heating to 650 ° C or higher. Aspect 11: The method for manufacturing a heat-dissipating component according to aspect 9, wherein after the process of heating to 650 ° C or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating component. [0040] This application is accompanied by a Japanese patent application with a filing date of October 3, 2016, and claims priority based on Japanese Patent Application No. 2016-195431. Japanese Patent Application No. 2016-195431 is incorporated into this specification by reference.

[0041] 1, 2‧‧‧ plate member

[0013] FIG. 1 is a cross-sectional view illustrating a state of diffusion bonding of a steam chamber, and a state in which two plate members (shell parts of the steam chamber) are joined and overlapped after a pattern is formed.

Claims (16)

A copper alloy plate for heat-dissipating parts, which is characterized by containing Mg: 0.05-0.5% by mass, and the remaining portion is composed of Cu and unavoidable impurities, and has a 0.2% endurance of 100 MPa or more, an extension of 3% or more, and excellent Bending processability, and excellent diffusion bonding and brazing properties. After heating at 850 ° C for 30 minutes, the 0.2% endurance when cooling is 50 MPa or more, and the electrical conductivity is 70% IACS or more. Part of the process of manufacturing heat dissipation parts Including diffusion bonding or brazing. For example, the copper alloy plate for heat-dissipating parts of claim 1 further contains Zn: 0.6% by mass or less (excluding 0% by mass). For example, the copper alloy plate for heat-dissipating parts of claim 1 further contains P: 0.05% by mass or less (excluding 0% by mass). For example, the copper alloy plate for heat-dissipating parts of claim 2 further contains P: 0.05% by mass or less (excluding 0% by mass). The copper alloy plate for heat-dissipating parts according to any one of claims 1 to 4, further comprising one or two selected from the group consisting of Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, and Zr The total of the above elements is 0.3% by mass or less (excluding 0% by mass). A heat-dissipating component characterized by containing Mg: 0.05-0.5% by mass, and the remaining portion is composed of Cu and unavoidable impurities, and is composed of a plurality of copper alloy plates bonded to each other by diffusion bonding or brazing. As a result, the 0.2% endurance of the copper alloy plate is 50 MPa or more, and the electrical conductivity is 70% IACS or more. The heat-dissipating component according to claim 6, wherein the copper alloy plate further contains Zn: 0.6% by mass or less (excluding 0% by mass). For example, the heat-dissipating component of claim 6, wherein the aforementioned copper alloy plate further contains P: 0.05% by mass or less (excluding 0% by mass). For example, the heat-dissipating component of claim 7, wherein the aforementioned copper alloy plate further contains P: 0.05% by mass or less (excluding 0% by mass). The heat dissipating component according to any one of claims 6 to 9, wherein the copper alloy plate further contains one or two selected from the group consisting of Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, and Zr The total of the above elements is 0.3% by mass or less (excluding 0% by mass). A method for manufacturing a heat-dissipating part, which is characterized by processing a copper alloy plate of a heat-dissipating part according to any one of claims 1 to 4 into a predetermined shape, and then applying a process of heating to a temperature of 650 ° C or higher to obtain a 0.2 of 50MPa or higher Heat dissipation parts with% endurance and conductivity above 70% IACS. A method for manufacturing a heat-dissipating component, which is characterized by processing a copper alloy plate of a heat-dissipating component as described in claim 5 into a predetermined shape, and then applying a process of heating to 650 ° C or higher to obtain a 0.2% endurance and 70% IACS of 50 MPa or more. The heat-conducting parts with the above conductivity. For example, the method for manufacturing a heat-dissipating component according to claim 11, wherein after a process of heating to 650 ° C or higher, an Sn coating layer is formed on at least a part of the outer surface of the heat-dissipating component. For example, the method for manufacturing a heat-dissipating part according to claim 12, wherein a Sn coating layer is formed on at least a part of the outer surface of the heat-dissipating part after the process of heating to 650 ° C or higher. For example, the method for manufacturing a heat-dissipating part according to claim 11, wherein a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating part after the process of heating to 650 ° C or higher. The method for manufacturing a heat-dissipating component according to claim 12, wherein a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating component after the process of heating to 650 ° C or higher.