[用以實施發明之形態] [0014] 以下,在有關本發明之實施形態的散熱零件用銅合金板中,舉出蒸氣室為例,更詳細地說明。 [銅合金之組成] 有關本發明之實施形態的銅合金係含有Mg:0.05~0.5質量%,且剩餘部分為由Cu及不可避免的雜質所構成。又,依需要,進一步各自或組合而含有(1)Zn:0.6質量%以下(不包含0質量%),(2)P:0.05質量%以下(不包含0質量%),(3)選自由Sn、Al、Mn、Fe、Ni、Co、Si、Ag、Ti、Cr、Zr之1種或2種以上的元素合計為0.3質量%以下(不包含0質量%)。 [0015] Mg係原子半徑比Cu更大,即使少量之添加,藉由固熔強化亦會提升銅合金之強度。但,Mg含量為未達0.05質量%時,高溫加熱後之強度不充分。另一方面,若Mg含量超過0.5質量%,被加熱至高溫時,Mg會蒸發而使擴散接合性及硬焊性降低,又,導電率會降低。因此,Mg含量設為0.05~0.5質量%之範圍。Mg含量之上限值較佳係0.4質量%,更佳係0.3質量%。 [0016] Zn會改善焊料之耐熱剝離性及Sn鍍敷之耐熱剝離性。蒸氣室係有時焊接在散熱部之電子零件上,又,為了改善耐蝕性,有時對蒸氣室進行Sn鍍敷。如此之情形,適宜使用含有Zn作為蒸氣室之殼體的原材料之銅合金板。Zn即使少量添加,亦具有改善上述耐熱剝離性之效果,其含量較佳係0.001質量%以上,更佳係0.01質量%以上。另一方面,若Zn含量超過0.6質量%,加熱至高溫時,Zn會蒸發,擴散接合性及硬焊性降低。因此,含有Zn時,Zn含量係設為0.6質量%以下(不含0質量%)之範圍。Zn含量之上限值較佳係0.4質量%,更佳係0.3質量%。 [0017] P會在銅合金中形成Mg-P化合物,使銅合金板之強度提高。為獲得以P提高強度之效果,只要使高溫加熱(擴散接合或硬焊)後之蒸氣室在400~600℃加熱30分鐘~4小時左右,使Mg-P化合物析出即可。P即使少量添加,亦具有提升強度之效果,其含量較佳係0.001質量%以上,更佳係0.005質量%以上。另一方面,若P含量超過0.05質量%,銅合金之導電率會降低。因此,含有P之時,P含量係設為0.05質量%以下(不包含0質量%)之範圍。 [0018] Sn、Al、Mn、Fe、Ni、Co、Si、Ag、Ti、Cr、Zr會使銅合金板之強度提升。但,該等之元素當為了使銅合金板的導電率降低,而含有此等之元素1種或2種以上時,該等之元素的1種或2種以上之合計含量的上限值係設為0.3質量%(不包含0質量%),高溫加熱後之導電率以不成為未達70%IACS之範圍添加。 其中,Sn、Al、Mn、Si、Ti使銅合金板之導電率降低之作用強,該等元素之含量較佳係各自為0.03質量%以下,2種以上之合計較佳為0.1質量%以下。Fe、Ni、Co係使銅合金固熔強化之外,銅合金含有P時,在銅合金中形成P化物,使銅合金進行析出強化。為了利用該效果,Fe、Ni、Co之含量較佳係各自或合計為0.05質量%以上。Cr、Zr係使銅合金進行析出強化之外,將銅合金板加熱至650℃以上之高溫時,具有防止結晶粒粗大化的效果。為了利用該效果,Cr、Zr之含量較佳係分別為0.005質量%以上。又,相較於Cu,Cr與Zr容易被氧化,在銅合金板之表面形成氧化膜,而使擴散接合性及硬焊性降低,因此有關Cr宜設為0.2%以下,有關Zr宜設為0.1%以下。Ag係具有提升銅合金之強度及耐熱性的效果。Ag含量較佳係設為0.005~0.1質量%之範圍。 [0019] 不可避免的雜質之H、O、S、Pb、Bi、Sb、Se、As,若銅合金板長時間被加熱至650℃以上之溫度,有可能聚集在粒界,並引起加熱中及加熱後之粒界龜裂以及粒界脆化等,較佳為降低該等之元素的含量。 其中,H係在加熱中聚集在粒界及介在物與母材之界面,且產生膨脹,故較佳係設為未達1.5ppm(質量ppm,以下相同),更佳係設為未達1ppm。O較佳係設為未達20ppm,更佳係設為未達15ppm。S、Pb、Bi、Sb、Se、As較佳係合計為未達30ppm,更佳係設為未達20ppm。尤其,有關Bi、Sb、Se、As較佳係使該等元素之合計含量設為未達10ppm,更佳係設為未達5ppm。 [0020] [銅合金板之特性] 本發明之實施形態的散熱零件用銅合金板係藉由具有上述合金組成,相較於無氧銅板,具有不遜色之優異的接合性(擴散接合性、硬焊性)。 散熱零件用銅合金板係在擴散接合或硬焊前,藉由衝壓成形、沖切加工、切削、蝕刻、彎曲加工等加工成預定形狀,經過高溫加熱(用以除去氣體、接合(硬焊、擴散接合、焊接(TIG、MIG、雷射等)、燒結等之加熱),加工成散熱零件,例如蒸氣室之殼體零件。銅合金板較佳係在前述加工時之運送及操作中具有不容易變形之強度,且具有不阻礙前述加工而可實施之機械特性。更具體地,本發明之實施形態的銅合金板係0.2%耐力為100MPa以上,延伸為3%以上,具有優異的彎曲加工性。延伸係以5%以上為佳。該等特性能夠以具有本發明之實施形態的組成之銅合金板而較容易達成。又,若具有該等特性,銅合金板之調質不成為問題。例如經熱處理,使經熱處理之材料經冷壓延者等任一者均可使用。 [0021] 加工成蒸氣室之殼體零件後的銅合金板,如上所述,經過高溫加熱(擴散接合或硬焊時等之加熱),被精加工成蒸氣室之殼體。在擴散接合與硬焊雖前述高溫加熱之加熱條件相異,但在本發明之實施形態係假定使前述高溫加熱以650℃~1050℃左右進行之情形。 本發明之實施形態的銅合金板係在850℃加熱30分鐘後經水冷後之強度(0.2%耐力)為50MPa以上,導電率為70%IACS以上。在850℃加熱30分鐘為假定在蒸氣室之殼體的製造中之接合製程(擴散接合、硬焊)的加熱條件。使用本發明之實施形態的銅合金板之蒸氣室的殼體比無氧銅板之強度高,安裝於散熱體、半導體裝置、或組入於PC殼體等時,可防止變形。又,本發明之實施形態的銅合金板係高溫加熱後之強度比無氧銅板還高,故可進行薄化(0.1~1.0mm厚),藉此,可提高蒸氣室之散熱性能,並彌補相較於無氧銅板時之導電率的降低量。 又,本發明之實施形態的銅合金板,即使高溫加熱之溫度為未達850℃(650℃以上)或超過850℃(1050℃以下),亦可達成50MPa附近或其以上之0.2%耐力、及70%IACS附近或其以上之導電率。 [0022] 使用本發明之實施形態的銅合金板所製造之蒸氣室係上述高溫加熱後,依需要,以耐蝕性及硬焊性之提升作為主要目的,至少在外表面之一部分形成Sn被覆層。在Sn被覆層係包含電鍍、無電解鍍敷或該等鍍敷後,加熱至Sn之熔點以下或熔點以上所形成者。於Sn被覆層係包含Sn金屬與Sn合金,Sn合金係可舉例如在Sn以外含有Bi、Ag、Cu、Ni、In、Zn之中1種以上合計為5質量%以下作為合金元素者。 [0023] 在Sn被覆層之下可形成Ni、Co、Fe等之基底鍍敷。該等之基底鍍敷係具有作為防止來自母材之Cu及合金元素之擴散的屏障之機能、及以增大散熱零件之表面硬度而防止刮傷的機能。在前述基底鍍敷之上鍍敷Cu,進一步鍍敷Sn後,進行加熱至Sn之熔點以下或熔點以上之熱處理而形成Cu-Sn合金層,亦可設為基底鍍敷、Cu-Sn合金層及Sn被覆層之3層構造。Cu-Sn合金層係具有防止來自母材之Cu及合金元素的擴散之屏障的機能,及以增大散熱零件之表面硬度藉而防止刮傷之機能。 [0024] 又,使用本發明之實施形態的銅合金板所製造之蒸氣室,於上述高溫加熱後,依需要,至少在外表面之一部分形成Ni被覆層。Ni被覆層係具有防止來自母材之Cu及合金元素之擴散的屏障,增大散熱零件之表面硬度以防止刮傷,及提升耐蝕性之機能。 [0025] [銅合金板之製造方法] 本發明之實施形態的銅合金板係與一般的固熔強化型銅合金板相同,可藉由熔解、鑄造、均質化處理、熱壓延、冷壓延、熱處理之步驟而製造。熱處理係可藉由批式爐或連續熱處理爐來進行。藉由批式爐進行熱處理時,以銅合金板材之實體溫度到達350~600℃後保持0.5~4小時之條件為佳。藉由連續熱處理爐進行熱處理時,只要使爐內環境溫度設為450~700℃之環境,進行連續通板即可。藉由該等之熱處理,銅合金板材係成為具備回復或再結晶,預定之強度與延伸及優異的彎曲加工性。冷壓延、熱處理之步驟可重複複數次。 冷壓延-熱處理之後,依需要進行冷壓延,進一步可依需要進行去變形退火。 藉由以上之製造方法,可製造0.2%耐力為100MPa以上、延伸為3%以上並具有優異的彎曲加工性,且具有優異的接合性之散熱零件用銅合金板。又,所製造之銅合金板係在850℃加熱30分鐘後冷卻時,具有50MPa以上之0.2%耐力、及70%IACS以上之導電率。 又,為了可於650℃以上之溫度藉由擴散接合、硬焊等之方法使良好的接合(無接合不良、接合強度高等)成為可能,銅合金板(製品)之表面粗度以算術平均粗度Ra計為0.3μm以下,以最大高度粗度Rz計為1.5μm以下,內部氧化深度為0.5μm以下,較佳係0.3μm以下。 為了使銅合金板(製品)之表面粗度為Ra:0.3μm、Rz:1.5μm以下,係使在最終冷壓延所使用之壓延輥的輥軸方向之表面粗度為例如Ra:0.15μm、Rz:1.0μm以下,或對最終冷壓延後之銅合金板進行拋光研磨、電解研磨等之研磨即可。又,使銅合金板(製品)之內部氧化深度為0.5μm以下,係只要使退火環境為還原性,以及使露點為 -5℃以下,或藉由使退火後之銅合金板進行機械研磨(拋光、刷磨等)或電解研磨,以除去所生成之內部氧化層或進行薄化即可。 [0026] 在前述彎曲加工中,要求在彎曲部不產生龜裂。進一步,在彎曲線及其附近,不產生表面粗糙為佳。即使為相同材質之銅合金板,因彎曲所致之龜裂及表面粗糙之產生容易性係依存於彎曲半徑R與板厚t之比率R/t。使用銅合金板而製造蒸氣室等之散熱零件時,就銅合金板之彎曲加工性而言,被要求至少在壓延直角方向(彎曲線垂直於壓延方向)進行R/t≦2之彎曲時不產生龜裂。就銅合金板之彎曲加工性而言,以R/t≦1.5之彎曲不產生龜裂為較佳,以R/t≦1.0之彎曲不產生龜裂為更佳。銅合金板之彎曲加工性一般以板寬度10mm之試驗片進行試驗(參照後述之實施例的彎曲加工性試驗)。將銅合金板材進行彎曲加工時,彎曲寬度愈大愈容易產生龜裂,故彎曲寬度特別大時,以板寬10mm之試驗片試驗時,以R/t=1.0之彎曲不產生龜裂為佳,以R/t=0.5之彎曲不產生龜裂為更佳。又,為了不使彎曲線及其附近產生表面粗糙,在銅合金板之表面中於板寬方向測定後之平均結晶粒徑(切斷法)為20μm以下較佳,以15μm以下為更佳,以10μm以下為再更佳。 [實施例] [0027] 使表1所示之組成的銅合金在真空環境中熔解/鑄造,分別製作厚度60mm、寬度200mm、長度80mm之鑄塊。在表1之No.1(無氧銅)中,不可避免的雜質之H為0.6ppm,O為7ppm,S、Pb、Bi、Sb、Se、As合計為6ppm。No.1以外之銅合金係不可避免的雜質之H為未達1ppm,O為未達15ppm,S、Pb、Bi、Sb、Se、As合計為未達15ppm。 [0028][0029] 對於各鑄塊,以900℃進行1小時之均熱處理,然後,進行熱壓延而為板厚20mm之熱壓延材(寬度200mm),從650℃以上之溫度進行水冷,將水冷後之熱壓延材的兩面每次1mm地進行削面(厚度18mm)。將削面後之材料冷壓延至厚度14.7mm。取得冷壓延材(厚度14.7mm)之一部分,以此作為供試材,依下述要領進行擴散接合性之測定。 [0030] 對於冷壓延材(厚度14.7mm)之剩餘部分,進一步進行冷壓延而為板厚0.4mm,繼而,進行400℃×2小時之熱處理,進一步進行冷壓延至板厚0.3mm(加工率:25%)。其後,藉由硝石爐以250℃熱處理15秒鐘(No.1)或以300℃熱處理20秒鐘(No.2~27),製造散熱零件用銅板(No.1)及銅合金板(No.2~27)。以該銅板及銅合金板作為供試材,依下述要領進行硬焊性及機械的特性之測定。又,以板厚0.3mm之各散熱零件用銅板分析後之組成亦為與表1之值相同。又,有關任一者之熱壓延材,其表面粗度係Ra:0.08~0.15μm,Rz:0.8~1.2μm,研磨板厚剖面而藉由掃描電子顯微鏡(觀察倍率15000倍)所測定後之內部氧化深度係0.1μm以下。 又,將前述銅板及銅合金板(板厚0.3mm)以850℃加熱30分鐘後水冷,以此作為供試材,依下述要領進行導電率及機械的特性之測定。 將各測定結果表示於表2。 [0031] [擴散接合性] 就擴散接合性之指標而言,求出擴散接合強度之原材料強度比(將擴散接合強度除以原材料強度者)。擴散接合強度、原材料強度、及擴散接合強度之原材料強度比係依以下之順序求出。 (擴散接合強度) (1)從No.1~27之各供試材切出14.7mm×70mm×30mm之塊體,進行400℃×2小時之熱處理後,進行冷壓延至板厚11mm(加工率25%)。又,該熱處理條件及最終冷壓延之加工率係與冷壓延成板厚0.3mm之供試材(散熱零件用銅板及銅合金板)的熱處理條件及最終冷壓延之加工率相同。 (2)從各塊體,製作直徑10mm、長度30mm之圓柱形的試驗片各6個。該試驗片之長方向係平行於壓延方向。 (3)各試驗片之一端面(直徑10mm之面)以剛砂紙研磨後,進行拋光研磨,將前述端面之表面粗度調整成為大約最大高度Rz:0.8μm、算術平均粗度Ra:0.06μm。 (4)擴散接合試驗裝置係為可進行腔室內之抽真空、氣體置換、昇溫、使端面互抵之試驗片彼此間的加壓、及加壓狀態的維持之試驗裝置。在裝置內置入使研磨後之端面彼此間對向之試驗片(以2個為1組),使裝置內進行真空排氣。 (5)真空度到達2×10-2
Pa之後,以平均昇溫速度100℃/min進行昇溫,試驗片溫度到達850℃後,端面彼此間以壓力4MPa互抵,保持30分鐘。然後,在裝置內導入N2
氣體,在加壓下冷卻至200℃(平均冷卻速度約20℃/分鐘)。到達200℃後,從裝置取出被擴散接合之試驗片(接合試驗片)。 (6)接合試驗片係製作每一供試材各3個。從各接合試驗片製作全長60mm、平行部直徑6mm、平行部長度30mm、抓取部直徑10mm、抓取部長度各10mm之拉伸試驗片。對於該拉伸試驗片在室溫進行拉伸試驗,測定拉伸強度,使3個之接合試驗片的拉伸強度之最小值設為擴散接合強度。又,後述之擴散接合強度的原材料強度比為0.95(95%)以上之合格材中,係在拉伸試驗片之長方向的中央部扎緊後產生破裂。 [0032] (原材料強度) (1)從No.1~27之各供試材,切出14.7mm×40mm× 60mm之塊體,進行400℃×2小時之熱處理後,進行冷壓延至板厚11mm(加工率25%),該熱處理條件及最終冷壓延之加工率係與冷壓延成板厚0.3mm後之供試材(散熱零件用銅板及銅合金板)的熱處理條件及最終冷壓延之加工率為相同。 (2)從各塊體,製作全長60mm、平行部直徑6mm、平行部長度30mm、抓取部直徑10mm、抓取部長度各10mm之拉伸試驗片各3個。拉伸試驗片之長方向係平行於壓延方向。 (3)將各拉伸試驗片置入於熱處理裝置內,在真空度下(2×10-2
Pa)以平均昇溫速度100℃/min昇溫,試驗片溫度到達850℃後,保持30分鐘。然後,在裝置內導入N2
氣體冷卻至200℃(平均冷卻速度約20℃/分鐘),到達200℃後,從裝置取出拉伸試驗片。該熱處理條件係除了在擴散接合強度之測定進行的擴散接合時之加熱冷卻條件、及不加上加壓力之點以外,為相同。 (4)使用各試驗片,依據JISZ2241之規定,在室溫進行拉伸試驗。將其結果所得之拉伸強度(3個平均值)設為各別之原材料強度。 [0033] (擴散接合強度之原材料強度比) 從兩試驗結果,求出擴散接合強度之原材料強度比(將擴散接合強度除以原材料強度者)。將該值視為散熱零件用銅板及銅合金板之擴散接合強度的原材料強度比,該值以0.95(95%)以上作為合格。 若藉由SEM(掃描型電子顯微鏡)觀察拉伸試驗後之破面,在合格材中,全面被小凹坑(dimple)被覆,呈現典型之延性破面。此係表示經互抵之試驗材的端面彼此間藉由擴散接合形成一體化。另一方面,在不合格材之破面中,小凹坑之面積比少,表示未充分產生因擴散接合所致之一體化。又,不合格材之情形,在擴散接合試驗後,為了可從裝置外觀察擴散接合裝置內部所設置之石英玻璃的窗口之內面側,可看到半透明之附著物。藉由EPMA(電子探針微分析儀)分析該附著物,結果檢測出在試驗片之材料所含的Zn、Mg。從此等之事實,推測在不合格材中,因擴散接合時之高溫加熱,Zn、Mg從試驗片之表面蒸發時,因壓力直接妨礙擴散接合,所蒸發之Zn、Mg附著於試驗材之接合端面而受到環境中所含之氧而氧化,或Zn、Mg從接合端面蒸發時被氧化,成為氧化物而附著,阻礙在端面之擴散接合。 [0034] [硬焊性] 硬焊性係以焊料之潤濕擴展試驗測定。 將供試材進行酸洗而除去氧化膜後,從各冷壓延材,切取正方形(50mm×50mm)之試驗片,以#2000剛砂紙研磨,及拋光研磨而調整成表面粗度Ra:0.07μm,進一步進行溶劑脫脂及電解脫脂。焊料材係使用直徑2mm之BCuP-2(Cu-7質量%P),將此切出質量0.38g之長度(相當於長度15mm)而使用。在試驗片上載置焊料材並放入真空爐中,在室溫中形成壓力10-3
Pa之真空環境後,保持該真空環境而加熱至840℃(平均昇溫速度100℃/分鐘)。試驗片之溫度到達840℃後保持30秒鐘,然後,冷卻至室溫(至200℃之平均降溫速度20℃/分鐘),從爐內取出試驗片。試驗片上之焊料藉由CCD照相機VHX-600(Keyence股份公司製)觀察,藉由該照相機內所內藏之圖像解析裝置,將焊料擴展之部分與其以外之部分進行2值化而識別,求出焊料之潤濕擴展面積。潤濕擴展面積為5cm2
以上者作為合格。 推測在不合格材中係與擴散接合試驗同樣地,藉由高溫加熱,Zn、Mg從試驗材之表面蒸發,藉由與擴散接合之情形同樣之機制,妨礙焊料之潤濕展開。 [0035] [機械特性] 從供試材,以長方向成為壓延平行方向之方式切出JIS5號拉伸試驗片,依據JIS-Z2241實施拉伸試驗,測定耐力及延伸。耐力係相當於永久延伸0.2%之拉伸強度。 [彎曲加工性] 彎曲加工性之測定係依照在伸銅協會標準JBMA-T307所規定之W彎曲試驗方法實施。從各供試材切出寬度10mm、長度30mm之試驗片,使用成為R/t=0.5之治具,進行G.W.(Good Way(彎曲線垂直於壓延方向))之彎曲。然後,藉由100倍之光學顯微鏡目視觀察在彎曲部之龜裂的有無,無龜裂發生者評估為P(P:Pass、合格)。 [導電率] 導電率之測定係依據JIS-H0505所規定之非鐵金屬材料導電率測定法,以使用雙電橋(Double Bridge)之四端子法進行。 [0036][0037] 如表1,2所示,由無氧銅所構成之No.1(習知材)係擴散接合強度之原材料強度比高,焊料潤濕擴展面積大,擴散接合性及硬焊性優異。在擴散接合中亦看不到石英窗之模糊。又,No.1之850℃×30分鐘加熱後的特性係導電率高(102%IACS),0.2%耐力極低(38MPa)。 另一方面,合金組成為本發明之實施形態的規定範圍內之No.3~7、9~11、13~15、17~19、21、22、26、27係擴散接合強度之原材料強度比為95%以上,焊料潤濕擴展面積為5.0cm2
以上,習知材之No.1具有不遜色之擴散接合性及硬焊性。在擴散接合中亦看不到石英窗之模糊。又,在850℃加熱30分鐘後之特性係0.2%耐力為50MPa以上,相較於習知材之No.1,相當高,導電率為70%IACS以上。 [0038] 相對於此,合金組成為本發明之實施形態的規定範圍外之No.2、8、12、16、20、23~25係擴散接合強度之原材料強度比(擴散接合性)、焊料潤濕擴展面積(硬焊性)、在850℃加熱30分鐘後之0.2%耐力或導電率之任一個以上之特性差。 No.2係因Mg含量不足,故在850℃×30分鐘加熱後之0.2%耐力未達50MPa。 No.8係因Mg含量過剩,故擴散接合性及硬焊性差,在擴散接合中產生石英窗之模糊。又,850℃×30分鐘加熱後之導電率低。 No.12係因Zn含量過剩,故擴散接合性及硬焊性差,在擴散接合中產生石英窗之模糊。 No.16係因P含量過剩,故850℃×30分鐘加熱後之導電率低。 No.20係因Zn含量過剩,故擴散接合性及硬焊性差,在擴散接合中產生石英窗之模糊。又,因P含量過剩,故850℃×30分鐘加熱後之導電率低。 No.23係因P含量過剩,故在850℃加熱30分鐘後之導電率低至58%IACS。 No.24係其他元素(Al、Si、Mn)之合計含量過剩,故850℃×30分鐘加熱後之導電率低。又,擴散接合性及硬焊性差。推測此係850℃×30分鐘加熱時,Al、Si、Mn在板表面進行氧化,妨礙接合。 No.25係因其他元素(Fe、Sn)之合計含量過剩,故850℃×30分鐘加熱後之導電率低。 [0039] 本說明書之揭示內容係包含以下之態樣。 態樣1: 一種散熱零件用銅合金板,其特徵係含有Mg:0.05~0.5質量%,剩餘部分為由Cu及不可避免的雜質所構成,具有100MPa以上之0.2%耐力、3%以上之延伸及優異的彎曲加工性,及優異的擴散接合性及硬焊性,在850℃加熱30分鐘後經冷卻時之0.2%耐力為50MPa以上,且導電率為70%IACS以上,於製造散熱零件之製程的一部分包含擴散接合或以硬焊所為之接合。 態樣2: 如態樣1之散熱零件用銅合金板,其中進一步含有Zn:0.6質量%以下(不包含0質量%)。 態樣3: 如態樣1或2之散熱零件用銅合金板,其中進一步含有P:0.05質量%以下(不包含0質量%)。 態樣4: 如態樣1~3中任一項之散熱零件用銅合金板,其中進一步含有選自由Sn、Al、Mn、Fe、Ni、Co、Si、Ag、Ti、Cr、Zr之1種或2種以上的元素合計為0.3質量%以下(不包含0質量%)。 態樣5: 一種散熱零件,其特徵係具有含有Mg:0.05~0.5質量%,且剩餘部分為由Cu及不可避免的雜質所構成之組成,由藉由擴散接合或硬焊而互相接合之複數的銅合金板所構成,前述銅合金板之0.2%耐力為50MPa以上,且導電率為70%IACS以上。 態樣6: 如態樣5之散熱零件,其中前述銅合金板進一步包含Zn:0.6質量%以下(不包含0質量%)。 態樣7: 如態樣5或6之散熱零件,其中前述銅合金板進一步包含P:0.05質量%以下(不包含0質量%)。 態樣8: 如態樣5~7中任一項之散熱零件,其中前述銅合金板進一步含有選自由Sn、Al、Mn、Fe、Ni、Co、Si、Ag、Ti、Cr、Zr之1種或2種以上的元素合計為0.3質量%以下(不包含0質量%)。 態樣9: 一種散熱零件之製造方法,其特徵係將態樣1~4中任一項之散熱零件用銅合金板加工成預定形狀之後,施予加熱至650℃以上之製程,獲得具有50MPa以上之0.2%耐力及70%IACS以上之導電率的散熱零件。 態樣10: 如態樣9之散熱零件之製造方法,其中,加熱至650℃以上之製程後,在散熱零件之外表面的至少一部分形成Sn被覆層。 態樣11: 如態樣9之散熱零件之製造方法,其中,加熱至650℃以上之製程後,在散熱零件之外表面的至少一部分形成Ni被覆層。 [0040] 本申請案係伴隨申請日為2016年10月3日之日本專利申請案,且以日本特願第2016-195431號作為基礎申請案之優先權主張。日本特願第2016-195431號係藉由參照而摘入於本說明書中。[Mode for Carrying Out the Invention] [0014] Hereinafter, a copper alloy plate for a heat-dissipating component according to an embodiment of the present invention will be described in more detail with a steam chamber as an example. [Composition of Copper Alloy] The copper alloy according to the embodiment of the present invention contains Mg: 0.05 to 0.5% by mass, and the remaining portion is made of Cu and unavoidable impurities. Further, as needed, (1) Zn: 0.6% by mass or less (excluding 0% by mass), (2) P: 0.05% by mass or less (excluding 0% by mass), and (3) selected from the group consisting of The total amount of one or more elements of Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, and Zr is 0.3% by mass or less (excluding 0% by mass). [0015] The Mg atomic radius is larger than Cu. Even if it is added in a small amount, the strength of the copper alloy will be improved by solid solution strengthening. However, when the Mg content is less than 0.05% by mass, the strength after high-temperature heating is insufficient. On the other hand, if the content of Mg exceeds 0.5% by mass, when heated to a high temperature, Mg will evaporate, which will reduce diffusion bonding and brazing properties, and decrease the electrical conductivity. Therefore, the Mg content is set in a range of 0.05 to 0.5% by mass. The upper limit of the Mg content is preferably 0.4% by mass, and more preferably 0.3% by mass. [0016] Zn improves the heat-resistant peelability of solder and the heat-resistant peelability of Sn plating. The vapor chamber is sometimes soldered to the electronic component of the heat sink, and in order to improve the corrosion resistance, the vapor chamber is sometimes plated with Sn. In this case, a copper alloy plate containing Zn as a raw material of the casing of the vapor chamber is suitably used. Even if Zn is added in a small amount, it has the effect of improving the above-mentioned heat-resistant peelability, and its content is preferably 0.001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, when the Zn content exceeds 0.6% by mass, when heated to a high temperature, Zn will evaporate, and the diffusion bonding properties and brazeability will decrease. Therefore, when Zn is contained, the Zn content is set to a range of 0.6% by mass or less (excluding 0% by mass). The upper limit of the Zn content is preferably 0.4% by mass, and more preferably 0.3% by mass. [0017] P will form a Mg-P compound in the copper alloy, which improves the strength of the copper alloy plate. In order to obtain the effect of increasing the strength with P, the vapor chamber after heating at high temperature (diffusive bonding or brazing) can be heated at 400 to 600 ° C. for about 30 minutes to 4 hours to precipitate the Mg-P compound. Even if P is added in a small amount, it has the effect of improving strength, and its content is preferably 0.001% by mass or more, and more preferably 0.005% by mass or more. On the other hand, if the P content exceeds 0.05% by mass, the electrical conductivity of the copper alloy decreases. Therefore, when P is contained, the P content is set to a range of 0.05% by mass or less (excluding 0% by mass). [0018] Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, Zr will increase the strength of the copper alloy plate. However, when one or more of these elements are contained in order to reduce the conductivity of the copper alloy plate, the upper limit of the total content of one or two or more of these elements is It is set to 0.3% by mass (excluding 0% by mass), and the electrical conductivity after heating at high temperature is added in a range not to reach 70% IACS. Among them, Sn, Al, Mn, Si, and Ti have a strong effect on reducing the conductivity of the copper alloy plate. The content of these elements is preferably 0.03% by mass or less, and the total of two or more types is preferably 0.1% by mass or less. . In addition to Fe, Ni, and Co systems, which solidify and strengthen copper alloys, when the copper alloy contains P, P compounds are formed in the copper alloy to precipitate and strengthen the copper alloy. In order to use this effect, the content of Fe, Ni, and Co is preferably 0.05% by mass or more, respectively or in total. Cr and Zr systems have the effect of preventing the coarsening of crystal grains when the copper alloy plate is heated to a high temperature of 650 ° C or higher in addition to precipitation strengthening of the copper alloy. In order to use this effect, the contents of Cr and Zr are preferably 0.005% by mass or more. In addition, Cr and Zr are more easily oxidized than Cu, and an oxide film is formed on the surface of the copper alloy plate, which reduces the diffusion bonding and brazeability. Therefore, the Cr content should be 0.2% or less, and the Zr content should be set to 0.1% or less. Ag has the effect of improving the strength and heat resistance of copper alloys. The Ag content is preferably in the range of 0.005 to 0.1% by mass. [0019] Inevitable impurities H, O, S, Pb, Bi, Sb, Se, As, if the copper alloy plate is heated to a temperature above 650 ° C for a long time, it may accumulate at the grain boundary and cause heating Grain boundary cracking and grain boundary embrittlement and the like after heating are preferred, and the content of these elements is preferably reduced. Among them, H is aggregated at the grain boundary and the interface between the intermediary and the base material during heating, and swells. Therefore, it is preferably set to less than 1.5 ppm (mass ppm, the same below), and more preferably set to less than 1 ppm. . O is preferably less than 20 ppm, and more preferably less than 15 ppm. S, Pb, Bi, Sb, Se, and As are preferably less than 30 ppm in total, and more preferably less than 20 ppm. In particular, for Bi, Sb, Se, and As, the total content of these elements is preferably less than 10 ppm, and more preferably less than 5 ppm. [Characteristics of Copper Alloy Plate] The copper alloy plate for heat-dissipating parts according to the embodiment of the present invention has the above-mentioned alloy composition, and has superior bonding properties (diffusive bonding properties, diffusion bonding properties, etc.) compared to oxygen-free copper plates. Brazing). The copper alloy plate for heat-dissipating parts is processed into a predetermined shape by stamping, punching, cutting, etching, bending, etc. before diffusion bonding or brazing, and is heated at high temperature (for removing gas, bonding (brazing, Diffusion bonding, welding (heating of TIG, MIG, laser, etc.), sintering, etc., processed into heat-dissipating parts, such as the housing parts of the steam chamber. The copper alloy plate is preferably in the transportation and operation during the aforementioned processing. It is easy to deform and has mechanical characteristics that can be implemented without hindering the aforementioned processing. More specifically, the copper alloy sheet of the embodiment of the present invention has a 0.2% endurance of 100 MPa or more and an elongation of 3% or more, and has excellent bending processing. The extension is preferably 5% or more. These characteristics can be easily achieved with a copper alloy plate having the composition of the embodiment of the present invention. If these characteristics are provided, the tempering of the copper alloy plate is not a problem. For example, after the heat treatment, the heat-treated material can be used by cold rolling, etc. [0021] The copper alloy plate processed into the shell parts of the steam chamber is subjected to high temperature as described above. Heat (heating during diffusion bonding or brazing) is finished into the housing of the vapor chamber. Although the heating conditions for the high temperature heating described above are different between diffusion bonding and brazing, in the embodiment of the present invention, it is assumed that High-temperature heating is performed at about 650 ° C to 1050 ° C. The copper alloy plate according to the embodiment of the present invention has a water-cooled strength (0.2% endurance) of 50 MPa or more after heating at 850 ° C for 30 minutes, and a conductivity of 70% IACS. Above. Heating at 850 ° C for 30 minutes is assumed to be a heating condition for a bonding process (diffusion bonding, brazing) in the manufacture of a steam chamber casing. The casing ratio of the steam chamber using the copper alloy plate according to the embodiment of the present invention The oxygen-free copper plate has high strength, and can be prevented from being deformed when mounted on a heat sink, a semiconductor device, or incorporated in a PC case. In addition, the copper alloy plate according to the embodiment of the present invention has a higher strength than an oxygen-free copper plate after high temperature heating. It is also high, so it can be thinned (0.1 to 1.0 mm thick), thereby improving the heat dissipation performance of the steam chamber and making up for the decrease in electrical conductivity when compared to an oxygen-free copper plate. In addition, embodiments of the present invention Copper alloy plate, even The high-temperature heating temperature is less than 850 ° C (more than 650 ° C) or more than 850 ° C (less than 1050 ° C). It can also achieve 0.2% endurance near 50MPa or more, and electrical conductivity near 70% IACS or more. [0222] After the steam chamber manufactured by using the copper alloy plate according to the embodiment of the present invention is heated at the above-mentioned temperature, if necessary, the main purpose of improving corrosion resistance and brazing resistance is to form a Sn coating layer on at least a part of the outer surface. The Sn coating layer includes electroplating, electroless plating, or those formed by heating to a temperature below or above the melting point of Sn. The Sn coating layer includes Sn metal and Sn alloy, and the Sn alloy system can be exemplified by Those containing one or more of Bi, Ag, Cu, Ni, In, and Zn other than Sn in a total amount of 5% by mass or less as alloy elements. [0023] Ni, Co, Fe, and other base plating may be formed under the Sn coating layer. These base platings have a function of preventing the diffusion of Cu and alloy elements from the base material, and a function of increasing the surface hardness of the heat-dissipating parts to prevent scratches. A Cu-Sn alloy layer is formed by plating Cu on the above-mentioned base plating, further plating Sn, and heating to a temperature below or above the melting point of Sn to form a Cu-Sn alloy layer. It can also be used as a base plating or a Cu-Sn alloy layer. And 3-layer structure of Sn coating. The Cu-Sn alloy layer has a function of preventing the diffusion of Cu and alloy elements from the base material, and a function of increasing the surface hardness of the heat-dissipating part to prevent scratches. [0024] In a steam chamber manufactured using the copper alloy plate according to the embodiment of the present invention, after the above-mentioned high-temperature heating, a Ni coating layer is formed on at least a part of the outer surface if necessary. The Ni coating layer has the function of preventing the diffusion of Cu and alloy elements from the base material, increasing the surface hardness of the heat-dissipating parts to prevent scratches, and improving the corrosion resistance. [Production method of copper alloy plate] The copper alloy plate of the embodiment of the present invention is the same as a general solid-solution strengthened copper alloy plate, and can be melted, cast, homogenized, hot rolled, and cold rolled. And manufacturing steps. The heat treatment can be performed by a batch furnace or a continuous heat treatment furnace. When heat treatment is performed in a batch furnace, it is preferable that the solid temperature of the copper alloy sheet reaches 350 to 600 ° C and is maintained for 0.5 to 4 hours. When the heat treatment is performed in a continuous heat treatment furnace, it is only necessary to set the ambient temperature in the furnace to an environment of 450 to 700 ° C. and continuously pass the plate. By these heat treatments, the copper alloy sheet material has recovery or recrystallization, predetermined strength and elongation, and excellent bending workability. The steps of cold rolling and heat treatment can be repeated several times. Cold rolling-After heat treatment, cold rolling is performed as required, and further, deformation-relief annealing may be performed as required. By the above manufacturing method, a copper alloy plate for a heat-dissipating part having a 0.2% endurance of 100 MPa or more, an elongation of 3% or more, excellent bending workability, and excellent bonding properties can be manufactured. In addition, the manufactured copper alloy sheet had a 0.2% endurance of 50 MPa or more and a conductivity of 70% IACS or more when heated at 850 ° C for 30 minutes and then cooled. In addition, in order to enable good bonding (no bonding failure, high bonding strength, etc.) by means of diffusion bonding, brazing, etc. at a temperature of 650 ° C or higher, the surface roughness of the copper alloy plate (product) is calculated using an arithmetic average roughness. The degree Ra is 0.3 μm or less, the maximum height roughness Rz is 1.5 μm or less, and the internal oxidation depth is 0.5 μm or less, and preferably 0.3 μm or less. In order to make the surface roughness of the copper alloy plate (product) Ra: 0.3 μm, Rz: 1.5 μm or less, the surface roughness of the roll axis direction of the calender roll used in the final cold rolling is, for example, Ra: 0.15 μm, Rz: 1.0 μm or less, or polishing the copper alloy plate after final cold rolling, such as polishing and electrolytic polishing. The internal oxidation depth of the copper alloy plate (product) is 0.5 μm or less, as long as the annealing environment is reduced and the dew point is −5 ° C. or less, or the annealed copper alloy plate is mechanically polished ( Polishing, brushing, etc.) or electrolytic grinding to remove the internal oxide layer formed or to thin it. [0026] In the aforementioned bending process, it is required that no cracks be generated in the bent portion. Further, it is preferable that surface roughness does not occur at or near the curved line. Even if it is a copper alloy plate of the same material, the easiness of cracking and surface roughness due to bending depends on the ratio R / t of the bending radius R to the thickness t of the plate. When using copper alloy plates to manufacture heat dissipation parts such as steam chambers, the bending workability of copper alloy plates is required to bend at least R / t ≦ 2 when rolling at right angles (the bending line is perpendicular to the rolling direction). Cracks occur. In terms of the bending workability of the copper alloy sheet, it is more preferable that no cracking occurs when the bending is R / t ≦ 1.5, and it is more preferable that no cracking occurs when the bending is R / t ≦ 1.0. The bending workability of a copper alloy plate is generally tested with a test piece having a plate width of 10 mm (refer to the bending workability test of the examples described later). When the copper alloy sheet is subjected to bending processing, the larger the bending width, the more likely it is to crack. Therefore, when the bending width is particularly large, it is better to use a test piece with a plate width of 10mm to bend without cracking. It is better to bend without R / t = 0.5. In addition, in order not to cause surface roughness in the bending line and its vicinity, the average crystal grain size (cutting method) of the copper alloy plate measured in the plate width direction is preferably 20 μm or less, and more preferably 15 μm or less. It is more preferably 10 μm or less. [Examples] [0027] The copper alloy having the composition shown in Table 1 was melted / cast in a vacuum environment, and ingots each having a thickness of 60 mm, a width of 200 mm, and a length of 80 mm were produced. In No. 1 (oxygen-free copper) of Table 1, H of the inevitable impurities was 0.6 ppm, O was 7 ppm, and the total of S, Pb, Bi, Sb, Se, and As was 6 ppm. For copper alloys other than No. 1, H is less than 1 ppm, O is less than 15 ppm, and S, Pb, Bi, Sb, Se, and As are less than 15 ppm in total. [0028] [0029] Each ingot was subjected to a homogenization heat treatment at 900 ° C for 1 hour, and then hot-rolled to a hot-rolled material (width 200mm) having a thickness of 20 mm, and water-cooled from a temperature of 650 ° C or higher. Both sides of the subsequent hot-rolled material were shaved (thickness 18 mm) 1 mm at a time. The rolled material was cold rolled to a thickness of 14.7mm. A part of the cold rolled material (thickness: 14.7 mm) was obtained and used as a test material to measure the diffusion bonding properties according to the following procedure. [0030] The remaining portion of the cold rolled material (thickness 14.7 mm) was further cold rolled to a thickness of 0.4 mm, followed by heat treatment at 400 ° C for 2 hours, and further cold rolled to a thickness of 0.3 mm (processing rate). : 25%). Thereafter, heat treatment was performed at 250 ° C for 15 seconds (No. 1) or 300 ° C for 20 seconds (No. 2 to 27) in a saltpeter furnace to produce a copper plate (No. 1) and a copper alloy plate ( No. 2 to 27). Using this copper plate and copper alloy plate as test materials, the brazing properties and mechanical properties were measured in the following manner. In addition, the composition of each heat-dissipating component having a thickness of 0.3 mm was analyzed with a copper plate, and the values were the same as those in Table 1. Regarding any of the hot rolled materials, the surface roughness was Ra: 0.08 to 0.15 μm, Rz: 0.8 to 1.2 μm, the thickness of the plate was polished, and the thickness was measured by a scanning electron microscope (observation magnification: 15000 times). The internal oxidation depth is 0.1 μm or less. The copper plate and copper alloy plate (thickness: 0.3 mm) were heated at 850 ° C. for 30 minutes and then water-cooled. As a test material, the conductivity and mechanical properties were measured in the following manner. Each measurement result is shown in Table 2. [Diffusion Bondability] As an index of diffusion bondability, the raw material strength ratio of the diffusion bonding strength (the one obtained by dividing the diffusion bonding strength by the raw material strength) is determined. The raw material strength ratio of the diffusion bonding strength, the raw material strength, and the diffusion bonding strength is obtained in the following order. (Diffusion bonding strength) (1) A 14.7 mm × 70 mm × 30 mm block was cut out from each of the test materials No. 1 to 27, and heat-treated at 400 ° C. for 2 hours, and then cold-rolled to a thickness of 11 mm (processing Rate 25%). The heat treatment conditions and the final cold rolling process rate are the same as the heat treatment conditions and final cold rolling process rate of the test material (copper plate and copper alloy plate for heat-dissipating parts) to be cold rolled to a thickness of 0.3 mm. (2) From each block, six test pieces each having a cylindrical shape with a diameter of 10 mm and a length of 30 mm were produced. The longitudinal direction of this test piece is parallel to the rolling direction. (3) After polishing one end surface (surface with a diameter of 10 mm) of each test piece with emery paper, the surface roughness of the aforementioned end surface was adjusted to approximately the maximum height Rz: 0.8 μm, and the arithmetic average roughness Ra: 0.06 μm. . (4) The diffusion bonding test device is a test device that can perform vacuum evacuation, gas replacement, and temperature increase in the chamber, pressurize the test pieces with their end faces against each other, and maintain the pressurized state. A test piece (with two groups as a set) facing the polished end faces facing each other was built in the device, and the inside of the device was evacuated. (5) After the degree of vacuum reaches 2 × 10 -2 Pa, the temperature is raised at an average heating rate of 100 ° C./min. After the temperature of the test piece reaches 850 ° C., the end faces mutually resist each other at a pressure of 4 MPa and are held for 30 minutes. Then, N 2 gas was introduced into the apparatus and cooled to 200 ° C. under pressure (average cooling rate was about 20 ° C./minute). After reaching 200 ° C., the diffusion-bonded test piece (joined test piece) was taken out of the apparatus. (6) Three test pieces were prepared for each test piece. A tensile test piece having a total length of 60 mm, a parallel portion diameter of 6 mm, a parallel portion length of 30 mm, a gripping portion diameter of 10 mm, and a gripping portion length of 10 mm was prepared from each joint test piece. This tensile test piece was subjected to a tensile test at room temperature, and the tensile strength was measured. The minimum value of the tensile strength of the three joint test pieces was set as the diffusion bonding strength. In addition, in a qualified material having a raw material strength ratio of 0.95 (95%) or more of the diffusion bonding strength described later, cracks occurred after the central portion of the tensile test piece was tightened in the longitudinal direction. [0032] (Raw material strength) (1) From each of the test materials No. 1 to 27, a 14.7 mm × 40 mm × 60 mm block was cut out, heat-treated at 400 ° C. × 2 hours, and then cold rolled to a plate thickness. 11mm (processing rate 25%). The heat treatment conditions and the final cold rolling processing rate are the same as those of the test materials (copper plates and copper alloy plates for heat-dissipating parts) and the final cold rolling. The processing rate is the same. (2) From each block, three tensile test pieces each having a total length of 60 mm, a parallel portion diameter of 6 mm, a parallel portion length of 30 mm, a gripping portion diameter of 10 mm, and a gripping portion length of 10 mm were prepared. The longitudinal direction of the tensile test piece is parallel to the rolling direction. (3) Each tensile test piece was placed in a heat treatment device, and the temperature was raised at a vacuum rate (2 × 10 -2 Pa) at an average heating rate of 100 ° C./min. After the test piece temperature reached 850 ° C., it was held for 30 minutes. Then, N 2 gas was introduced into the apparatus to cool it to 200 ° C. (average cooling rate was about 20 ° C./minute), and after reaching 200 ° C., the tensile test piece was taken out of the apparatus. The heat treatment conditions are the same except for the heating and cooling conditions at the time of diffusion bonding during the measurement of the diffusion bonding strength, and the point where no pressure is applied. (4) Using each test piece, perform a tensile test at room temperature in accordance with JISZ2241. The tensile strength (three average values) obtained as a result was set as the strength of each raw material. [0033] (Raw Material Strength Ratio of Diffusion Bonding Strength) From the results of the two tests, the raw material strength ratio of the diffusion bonding strength (the one obtained by dividing the diffusion bonding strength by the raw material strength) was determined. This value was regarded as the raw material strength ratio of the diffusion bonding strength of the copper plate and copper alloy plate for heat-dissipating parts, and the value was considered to be 0.95 (95%) or more. If the fracture surface after the tensile test is observed with a SEM (scanning electron microscope), the qualified material is completely covered with small dimples, showing a typical ductile fracture surface. This means that the end faces of the test materials that are mutually offset are integrated by diffusion bonding. On the other hand, in the broken surface of the defective material, the small area ratio of the small pits indicates that the integration due to diffusion bonding has not sufficiently occurred. In the case of non-conforming materials, after the diffusion bonding test, in order to observe the inner side of the window of the quartz glass provided inside the diffusion bonding device from the outside of the device, a translucent adherend can be seen. The attached matter was analyzed by an EPMA (electron probe microanalyzer), and as a result, Zn and Mg contained in the material of the test piece were detected. From these facts, it is speculated that in the unqualified materials, due to the high-temperature heating during diffusion bonding, when Zn and Mg are evaporated from the surface of the test piece, the pressure directly hinders diffusion bonding, and the evaporated Zn and Mg adhere to the bonding of the test material The end faces are oxidized by oxygen contained in the environment, or Zn and Mg are oxidized when they evaporate from the joining end faces, become oxides and adhere, and hinder diffusion joining at the end faces. [Brazability] The brazeability is measured by a solder wetting spread test. After the test material was acid-washed to remove the oxide film, a square (50 mm × 50 mm) test piece was cut from each cold rolled material, polished with # 2000 emery paper, and polished to adjust the surface roughness Ra: 0.07 μm For further solvent degreasing and electrolytic degreasing. For the solder material, BCuP-2 (Cu-7 mass% P) having a diameter of 2 mm was used, and a length of 0.38 g (equivalent to a length of 15 mm) was cut out and used. The test piece was placed with a solder material and placed in a vacuum furnace, and a vacuum environment with a pressure of 10 -3 Pa was formed at room temperature, and the vacuum environment was maintained and heated to 840 ° C (average temperature rise rate 100 ° C / min). After the temperature of the test piece reached 840 ° C, it was held for 30 seconds, and then cooled to room temperature (an average temperature decrease rate of 200 ° C to 200 ° C / min), and the test piece was taken out of the furnace. The solder on the test piece was observed with a CCD camera VHX-600 (manufactured by Keyence Co., Ltd.), and an image analysis device built into the camera was used to binarize the expanded portion of the solder and other portions to identify it. Wet spread area of solder. Those with a wet spread area of 5 cm 2 or more were considered acceptable. It is presumed that in a non-conforming material, Zn and Mg are evaporated from the surface of the test material by high-temperature heating in the same manner as in the diffusion bonding test, and the wetting and spreading of the solder is prevented by the same mechanism as in the case of diffusion bonding. [Mechanical Properties] A JIS No. 5 tensile test piece was cut out from the test material so that the longitudinal direction became parallel to the rolling direction, and a tensile test was performed in accordance with JIS-Z2241 to measure the endurance and elongation. Endurance is equivalent to 0.2% of tensile strength. [Bendability] The measurement of the bendability was carried out in accordance with the W bending test method specified in the copper drawing standard JBMA-T307. A test piece having a width of 10 mm and a length of 30 mm was cut out from each test material, and a GW (Good Way (the bending line is perpendicular to the rolling direction)) was bent using a jig having R / t = 0.5. Then, the presence or absence of cracks in the bent portion was visually observed with a 100-fold optical microscope, and those without cracks were evaluated as P (P: Pass, Pass). [Conductivity] The measurement of conductivity is based on the non-ferrous metal material conductivity measurement method specified in JIS-H0505, and is performed using the four-terminal method using a double bridge. [0036] [0037] As shown in Tables 1 and 2, the No. 1 (conventional material) diffusion bonding strength made of oxygen-free copper has a high raw material strength ratio, a large solder wetting and expansion area, and excellent diffusion bonding and brazing properties. The blur of the quartz window was also not seen in the diffusion bonding. In addition, the characteristic of No. 1 after heating at 850 ° C for 30 minutes is high electrical conductivity (102% IACS), and 0.2% endurance is extremely low (38 MPa). On the other hand, the alloy composition is a raw material strength ratio of No. 3 to 7, 9 to 11, 13 to 15, 17 to 19, 21, 22, 26, and 27 diffusion bonding strengths within a predetermined range of the embodiment of the present invention. It is 95% or more, the solder wetting expansion area is 5.0 cm 2 or more, and No. 1 of the conventional material has inferior diffusion bonding and brazing properties. The blur of the quartz window was also not seen in the diffusion bonding. In addition, after heating at 850 ° C for 30 minutes, the 0.2% endurance is 50 MPa or more, which is considerably higher than that of No. 1 of conventional materials, and the conductivity is 70% IACS or more. [0038] In contrast, the alloy composition is the raw material strength ratio (diffusive bondability) of No. 2, 8, 12, 16, 20, 23 to 25 series diffusion bonding strength outside the prescribed range of the embodiment of the present invention, and solder Wet spreading area (brazing resistance), 0.2% of endurance or conductivity after heating at 850 ° C for 30 minutes are inferior in characteristics. No. 2 is because the Mg content is insufficient, the 0.2% endurance after heating at 850 ° C for 30 minutes does not reach 50 MPa. No. 8 is because the Mg content is excessive, the diffusion bonding property and the brazing property are poor, and the blur of the quartz window is generated during the diffusion bonding. In addition, the conductivity after heating at 850 ° C for 30 minutes was low. The No. 12 system has an excessive Zn content, and therefore has poor diffusion bonding and brazing properties. Blur of a quartz window occurs during diffusion bonding. No. 16 has an excessive P content, so the conductivity after heating at 850 ° C for 30 minutes is low. No. 20 is due to an excessive Zn content, which results in poor diffusion bonding and brazing properties, and blurring of a quartz window occurs during diffusion bonding. In addition, since the P content is excessive, the conductivity after heating at 850 ° C for 30 minutes is low. No.23 is because the P content is excessive, so the conductivity after heating at 850 ° C for 30 minutes is as low as 58% IACS. No. 24 is excessive in the total content of other elements (Al, Si, Mn), so the conductivity after heating at 850 ° C for 30 minutes is low. In addition, the diffusion bonding property and the brazing property were poor. It is estimated that when this system is heated at 850 ° C. for 30 minutes, Al, Si, and Mn are oxidized on the surface of the plate, preventing the bonding. No. 25 is because the total content of other elements (Fe, Sn) is excessive, so the conductivity after heating at 850 ° C for 30 minutes is low. [0039] The disclosure of this specification includes the following aspects. Aspect 1: A copper alloy plate for heat-dissipating parts, which is characterized by containing Mg: 0.05-0.5% by mass, and the remaining portion is composed of Cu and unavoidable impurities, and has a 0.2% endurance of 100 MPa or more and an extension of 3% or more. And excellent bending workability, and excellent diffusion bonding and brazing properties. After heating at 850 ° C for 30 minutes, the 0.2% endurance when cooling is 50 MPa or more, and the conductivity is 70% IACS or more. Part of the process includes diffusion bonding or brazing. Aspect 2: The copper alloy plate for heat-dissipating parts as in aspect 1, further containing Zn: 0.6% by mass or less (excluding 0% by mass). Aspect 3: The copper alloy plate for heat-dissipating parts as in aspect 1 or 2, further containing P: 0.05% by mass or less (excluding 0% by mass). Aspect 4: The copper alloy plate for heat-dissipating parts according to any one of aspects 1 to 3, further comprising 1 selected from the group consisting of Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, and Zr The total of one or two or more elements is 0.3% by mass or less (excluding 0% by mass). Aspect 5: A heat-dissipating component, which is characterized by containing Mg: 0.05-0.5% by mass, and the remaining portion is composed of Cu and unavoidable impurities, and is plurally bonded to each other by diffusion bonding or brazing. It is composed of a copper alloy plate. The 0.2% endurance of the copper alloy plate is 50 MPa or more, and the electrical conductivity is 70% IACS or more. Aspect 6: The heat-dissipating part of Aspect 5, wherein the aforementioned copper alloy plate further contains Zn: 0.6% by mass or less (excluding 0% by mass). Aspect 7: The heat-dissipating component according to aspect 5 or 6, wherein the aforementioned copper alloy plate further includes P: 0.05% by mass or less (excluding 0% by mass). Aspect 8: The heat dissipating component according to any one of aspects 5 to 7, wherein the copper alloy plate further contains 1 selected from the group consisting of Sn, Al, Mn, Fe, Ni, Co, Si, Ag, Ti, Cr, and Zr The total of one or two or more elements is 0.3% by mass or less (excluding 0% by mass). Aspect 9: A method for manufacturing a heat-dissipating component, which is characterized in that the heat-dissipating component of any of aspects 1 to 4 is processed into a predetermined shape and then subjected to a process of heating to 650 ° C or higher to obtain a pressure of 50 MPa. Above 0.2% endurance and above 70% IACS heat dissipation parts. Aspect 10: The method for manufacturing a heat-dissipating component as described in Aspect 9, wherein a Sn coating layer is formed on at least a part of the outer surface of the heat-dissipating component after the process of heating to 650 ° C or higher. Aspect 11: The method for manufacturing a heat-dissipating component according to aspect 9, wherein after the process of heating to 650 ° C or higher, a Ni coating layer is formed on at least a part of the outer surface of the heat-dissipating component. [0040] This application is accompanied by a Japanese patent application with a filing date of October 3, 2016, and claims priority based on Japanese Patent Application No. 2016-195431. Japanese Patent Application No. 2016-195431 is incorporated into this specification by reference.