TWI588274B - A copper alloy sheet for a heat radiating component and a heat radiating component - Google Patents

Description

Copper alloy plate for exothermic parts and heat release parts

The present invention relates to a copper alloy sheet for an exothermic part and a heat releasing member.

The CPU of the desktop PC or the notebook PC has rapidly increased the speed of operation and high density, and the amount of heat generated by the CPU has increased significantly. When the temperature of the CPU rises to a certain temperature or higher, the operation is caused by an erroneous operation or a thermal shutdown. Therefore, the effect of heat release from a semiconductor device such as a CPU becomes a practical problem.

A heat sink is used as a heat releasing member that absorbs heat of the semiconductor device and is radiated to the atmosphere. Since heat sink is required to have high thermal conductivity, copper or aluminum having a large thermal conductivity is used as a material. However, convection heat resistance limits the performance of the heat sink, making it more difficult to meet the heat release requirements of high-performance electronic components with increased heat generation.

Therefore, as a heat release part with high heat release, there is proposed a tubular heat pipe having high heat conductivity and heat transfer capability. And a planar heat pipe (vapor chamber). The heat pipe exhibits high heat release characteristics by evaporation (condensation from the CPU) and condensation (absorption of absorbed heat) of the refrigerant sealed in the interior by cyclically. Moreover, it has been proposed to solve the problem of heat generation in a semiconductor device by combining a heat pipe with a heat radiating member such as a heat sink or a fan.

As a material for a heat releasing member such as a heat radiating plate, a heat sink, or a heat pipe, a plate or tube made of pure copper (oxygen-free copper: C1020) having excellent electrical conductivity and corrosion resistance is often used. In order to ensure the formability, a soft blunt material (O material) or a 1/4H tempering material is used as a material. However, in the manufacturing process of a heat releasing component to be described later, deformation or flaws are likely to occur, and when the hole is processed, It is prone to problems such as burrs or easy to wear punching dies. On the other hand, in the reference 1 to 2, the Fe-P-based copper alloy sheet is described as a material for the heat releasing member.

The heat release plate and the heat sink are processed into a specific shape by press forming, punching, cutting, drilling, etching, etc., and if necessary, Ni plating or Sn plating is performed with solder, wax or an adhesive, etc. with the CPU. The semiconductor devices are joined.

The tubular heat pipe (refer to Patent Document 3) is obtained by sintering copper powder in a tube to form a wick, and after heating and degassing, one end is sealed with a wax, and after the refrigerant is injected into the tube under vacuum or reduced pressure, the other end is used. The ends are made of a wax seal.

The planar heat pipe (refer to Patent Documents 4 and 5) can further improve the heat release performance of the tubular heat pipe. As a planar heat pipe, in order to efficiently carry out condensation and evaporation of the refrigerant, there is a proposal and a tubular heat pipe Similarly, roughening processing, groove processing, and the like are performed on the inner surface. Two pieces of the upper and lower pure copper sheets processed by press molding, punching, cutting, or etching are joined by waxing, diffusion bonding, or welding, and the refrigerant is injected into the inside, and then sealed by waxing or the like. Degassing is sometimes performed during the joining step.

Further, as the planar heat pipe, there is proposed a member including an outer member and an inner member housed inside the outer member. The internal members are arranged to facilitate condensation, evaporation, and transportation of the refrigerant, and one or more of the outer members are disposed inside, and fins, protrusions, holes, or slits of various shapes are processed. In the planar heat pipe of this type, after the internal member is disposed inside the outer member, the outer member and the inner member are joined and integrated by waxing or diffusion bonding, and after the refrigerant is injected, waxing or the like is applied. To seal.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-277853

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2014-189816

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2008-232563

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2007-315754

[Patent Document 5] Japanese Patent Laid-Open Publication No. 2014-134347

In the manufacturing steps of the exothermic parts, the heat release plate and the heat sink are heated to about 200 to 700 ° C in the step of applying solder or wax. The tubular heat pipe and the planar heat pipe are heated to about 800 to 1000 ° C by a step of waxing, diffusion bonding or melting using sintering, degassing or phosphorous copper boron (BCuP-2 or the like).

For example, when a pure copper plate is used as the material of the heat pipe, the softening at the time of heating at a temperature of 650 ° C or higher is intense. Therefore, when mounting on a heat sink or a semiconductor device, or a combination with a PC base, etc., the heat pipe to be manufactured is easily deformed, the structure inside the heat pipe is changed, and the desired heat release performance cannot be exerted. . Further, in order to prevent such deformation, the thickness of the pure copper plate may be increased, but if this is done, the quality and thickness of the heat pipe will increase. When the thickness is increased, the gap between the insides of the PC base becomes small, and there is a problem that the convective heat transfer performance is lowered.

Further, the copper alloy sheets (Fe-P type) described in Patent Documents 1 and 2 are also softened after being heated at a temperature of 650 ° C or higher, and the electrical conductivity is greatly lowered as compared with pure copper. Therefore, when a planar heat pipe is manufactured by a process such as sintering, degassing, waxing, diffusion bonding or melting, it is easier to deform when transporting and operating the same heat pipe or the step of combining the substrates. Moreover, since the electrical conductivity is lowered, the performance as a heat pipe is difficult to exert.

The present invention has been made in view of the fact that a part of the process for producing an exothermic part from a pure copper or copper alloy sheet includes a process of heating to a temperature of 650 ° C or higher, and the object of the present invention is to provide a copper alloy sheet which is heated to Exothermic zero produced by a process at temperatures above 650 ° C Pieces with sufficient strength and heat release properties.

The copper alloy plate for the exothermic part according to the present invention is used in a process including heating to 650 ° C or more as part of the process of manufacturing the exothermic part and the aging treatment, and contains Fe: 1.0 to 2.4% by mass, P: 0.005 to 0.1 mass. %, the residual part is made of Cu and unavoidable impurities. After heating at 850 ° C for 30 minutes, it is water-cooled, and then 0.2% of the endurance after aging treatment is 110 MPa or more, and the electrical conductivity is 50% IACS or more.

The copper alloy sheet for a heat-releasing component according to the present invention may further contain 2.0% by mass or less (excluding 0% by mass) of Zn, or/and 0.005 to 0.5% by mass of Sn as an alloying element, if necessary. Further, the copper alloy sheet for a heat-releasing component according to the present invention may further contain one of Mn, Mg, Si, Al, Cr, Ti, Zr, Ni, and Co in a total amount of 0.5% by mass or less (excluding 0% by mass). Or two or more.

The copper alloy sheet according to the present invention is used in a process including heating to 650 ° C or higher as part of a process for manufacturing a heat releasing member, and an aging treatment. That is to say, the heat-releasing component manufactured by using the copper alloy sheet according to the present invention is subjected to aging treatment after being heated to a temperature of 650 ° C or higher at a high temperature, so that the strength is increased.

The copper alloy sheet according to the present invention is heated at 850 ° C for 30 minutes, and then subjected to aging treatment, 0.2% of the endurance is 110 MPa or more, and the electrical conductivity is 50% IACS or more. The copper alloy sheet according to the present invention has a high strength after aging treatment, and therefore, when the heat releasing member such as a heat pipe manufactured by using the copper alloy sheet is attached to a heat sink or a semiconductor device, or is combined to a PC base or the like, the heat release is performed. Parts are more difficult to deform. Further, although the copper alloy sheet according to the present invention has a lower electrical conductivity than a pure copper plate, the strength after aging treatment is high, so that it can be flaky, and the portion where the electrical conductivity is lowered can be complemented by the heat release performance.

Hereinafter, the copper alloy sheet for a heat releasing component according to the present invention will be described in more detail.

The copper alloy sheet according to the present invention is processed to a specific shape by, press forming, punching, cutting or etching, and is heated at a high temperature (for degassing, bonding (wax coating, diffusion bonding or melting) or sintering, etc.) , complete the exothermic parts. The heating conditions of the high-temperature heating may differ depending on the type of the heat-releasing component or the manufacturing method. However, in the present invention, the high-temperature heating is performed at about 650 ° C to 1050 ° C (the solid temperature of the heated material is 650 to 1000). °C). The copper alloy sheet according to the present invention is formed of an Fe-P-based copper alloy having a composition described later, and after heating to the above temperature range, at least a part of elements such as Fe and P are solid-solved, crystal grains are grown, and softening occurs. The decrease in electrical conductivity.

The copper alloy sheet according to the present invention is water-cooled after heating at 850 ° C for 30 minutes, and then the strength (0.2% proof) after the aging treatment is 110 MPa or more, and the electric conductivity is 50% IACS or more. 30 minutes at 850 ° C The heating is a heating condition for the above-described high-temperature heating process in the manufacture of the heat-releasing component. When the copper alloy sheet according to the present invention is heated at a high temperature under such conditions, elements such as Fe or P precipitated before heating are solid-solved, crystal grains are grown, softening occurs, and electrical conductivity is lowered. Next, after the copper alloy sheet is subjected to aging treatment, fine Fe-P compound or Fe or the like is precipitated. Thereby, the strength and electrical conductivity which are lowered by the aforementioned high-temperature heating are remarkably improved.

The aging treatment can be maintained in the precipitation temperature range for a certain period of time in (a) the high-temperature heating step, (b) high-temperature heating, and then cooled to room temperature, and then heated to the precipitation temperature range for a certain period of time, (c) the foregoing ( After the step a), the method is further heated until the precipitation temperature range is maintained for a certain period of time.

As specific aging treatment conditions, the conditions are maintained in the temperature range of 300 to 620 ° C for 5 minutes to 10 hours. When priority is given to the improvement of the strength, the temperature-time conditions generated by the fine Fe or Fe-P precipitates may be appropriately selected, and when the conductivity is increased as a priority, the solid solution of Fe and P is appropriately selected to be reduced. It is faster than the aging temperature-time condition.

The copper alloy plate after the aging treatment has a lower electrical conductivity than the pure copper plate after the high temperature heating, but the strength is significantly higher than that of the pure copper plate. In order to obtain this effect, the heat releasing member of the heat pipe or the like manufactured using the copper alloy sheet according to the present invention is subjected to aging treatment after high temperature heating. The aging treatment conditions are as described above. The heat-dissipating component (copper alloy plate) after the aging treatment has high strength, and can be prevented from being deformed when mounted to a heat sink or a semiconductor device or combined to a PC base or the like. And related to the present invention Compared with the pure copper plate, the copper alloy plate (after aging treatment) has higher strength, so it can be thinned (0.1 to 1.0 mm thick), thereby improving the heat release performance of the exothermic part and complementing the time of the pure copper plate. The reduced portion of conductivity.

Moreover, even if the temperature of the high temperature heating of the copper alloy sheet according to the present invention is less than 850 ° C (650 ° C or more) or more than 850 ° C (1050 ° C or less), after the aging treatment, 0.2% of the endurance of 110 MPa or more can be achieved. And the conductivity near or above 50% IACS.

The copper alloy sheet according to the present invention can be processed into a member constituting a heat releasing member by press forming, piercing, cutting, etching, or the like before being heated at a high temperature to a temperature of 650 ° C or higher. The copper alloy sheet has strength that is not easily deformed during transportation and handling during the above-described processing, and has mechanical properties that can perform the above-described processing without any trouble. More specifically, the copper alloy sheet according to the present invention has a 0.2% proof stress of 150 MPa or more, a tension of 5% or more, an average crystal grain size of the surface of the sheet of 20 μm or less, and excellent bending workability (refer to the following description for implementation). Example) is preferred. As long as the above characteristics are satisfied, there is no problem in the conditioning of the copper alloy sheet. For example, any of the solution treatment material, the aging treatment material, or the aging treatment material can be used for cold rolling.

As described above, the exothermic part manufactured by the processed copper alloy sheet according to the present invention is softened after being heated at a high temperature to a temperature of 650 ° C or higher. The heat-dissipating member after the high-temperature heating further has a strength which is not easily deformed during the conveyance and the operation at the time of performing the aging treatment. Therefore, the step of water cooling after heating at 850 ° C for 30 minutes has a resistance of 0.2% or more of 0.2 MPa or more.

The heat-releasing member manufactured using the copper alloy sheet according to the present invention is subjected to aging treatment, and the corrosion resistance and the solder coating property are preferably increased as necessary, and an Sn coating layer is formed on at least a part of the outer surface. The Sn coating layer includes electroplating or electroless plating, or the like, and is heated to a point below the melting point of Sn or above the melting point. In the Sn coating layer, a Sn metal and a Sn alloy are contained, and as the Sn alloy, one or more of Bi, Ag, Cu, Ni, In, and Zn, which are 5% by mass or less in total, are used as alloying elements other than Sn.

Substrate plating such as Ni, Co or Fe can be formed under the Sn coating layer. These base plating functions have a function as a barrier function for preventing diffusion of Cu or an alloying element from the substrate, and a flaw caused by an increase in surface hardness of the heat releasing member. Cu is electroplated on the base plating, and after the Sn is electroplated, heat treatment is performed below the melting point of Sn or above the melting point to form a Cu-Sn alloy layer, and the base plating, the Cu-Sn alloy layer, and the Cu-Sn alloy layer can be used. The Sn coating layer is composed of three layers. The Cu-Sn alloy layer has a function as a barrier function for preventing diffusion of Cu or an alloying element from the substrate, and a flaw caused by an increase in surface hardness of the heat releasing member.

Further, after the aging treatment using the heat-dissipating member manufactured using the copper alloy sheet according to the present invention, a Ni coating layer is formed on at least a part of the outer surface as necessary. The Ni coating layer has a barrier function for preventing diffusion of Cu or an alloying element from the substrate, a function of preventing scratches caused by an increase in surface hardness of the heat releasing member, and a function of improving corrosion resistance.

Next, the composition of the copper alloy sheet according to the present invention will be described.

Fe forms a Fe monomer or forms a compound with P and precipitates, and has the effect of enhancing the strength and conductivity of the copper alloy sheet after the aging treatment. However, when the Fe content is less than 1.0% by mass, the 0.2% endurance after the aging treatment may be less than 110 MPa. On the other hand, when the Fe content exceeds 2.4% by mass, the strength increase ratio is saturated, and coarse Fe crystals are formed in the dissolution casting step, which is difficult to be eliminated in the subsequent processing steps. The coarse Fe crystal grains can lower the corrosion resistance, the bending workability, the plating property, and the like. Therefore, the Fe content is set to 1.0 to 2.4% by mass. The lower limit of the Fe content is preferably 1.2% by mass, and the upper limit is preferably 2.2% by mass.

P reduces the amount of oxygen contained in the copper alloy by deoxidation and has the effect of preventing hydrogen embrittlement when the exothermic part is heated in a reducing environment containing hydrogen. For the prevention of hydrogen embrittlement, the P content is required to be 0.005% by mass or more. Further, P after solid solution lowers the electrical conductivity of the copper alloy, but by heating to the precipitation temperature, an Fe-P compound is formed, whereby the strength, heat resistance, and electrical conductivity of the copper alloy can be improved. However, if the content of P exceeds 0.1% by mass, the amount of solid solution P increases, and the electrical conductivity may be less than 50% IACS. Therefore, the content of P is set to be 0.005 to 0.1% by mass.

Zn has an effect of improving the heat-resistant peeling property of the solder of the copper alloy sheet and the heat-resistant peeling property of the Sn plating, and therefore can be added as necessary. When a heat-dissipating component is combined in a semiconductor device, solder coating may be required, and after the heat-releasing component is manufactured, Sn plating may be performed for improvement of corrosion resistance. In the manufacture of such a heat releasing member, a copper alloy plate containing Zn is suitably used. However, when the content of Zn exceeds 2.0% by mass, the solder wettability is lowered, so the content of Zn is 2.0% by mass or less. Zn The upper limit of the content is preferably 0.7% by mass or less, more preferably 0.5% by mass or less. On the other hand, when the Zn content is less than 0.01% by mass, the improvement of the heat-resistant peeling property is insufficient, and the content of Zn is preferably 0.01% by mass or more. The lower limit of the Zn content is more preferably 0.05% by mass, and more preferably 0.1% by mass.

Further, when the copper alloy sheet of the present invention contains Zn, if it is heated at a temperature of 500 ° C or higher, Zn is vaporized by the heating environment, which may contaminate the heating furnace. The content of Zn is preferably 0.5% by mass or less, more preferably 0.3% by mass or less, and still more preferably 0.2% by mass or less from the viewpoint of preventing vaporization of Zn.

Sn is solid-solubilized in the copper alloy mother phase and has the effect of increasing the strength of the copper alloy, so it can be added as necessary. Moreover, the addition of Sn is also effective for improving the stress relaxation resistance. When the environment in which the heat-dissipating component is used is 80 ° C or higher, the creeping deformation occurs, and the contact surface with the heat source such as the CPU becomes small, and the heat radiation property is lowered. However, the stress relaxation property can be improved to suppress the phenomenon. In order to obtain the effect of improving the strength and the stress relaxation resistance, the Sn content is 0.005% by mass or more, preferably 0.01% by mass or more, more preferably 0.02% by mass or more, and still more preferably 0.05% by mass or more. On the other hand, if the content of Sn exceeds 0.5% by mass, the electrical conductivity of the copper alloy sheet after the aging treatment may be less than 50% IACS. Therefore, the content of Sn is set to 0.5% by mass or less.

Mn, Mg, Si, Al, Cr, Ti, Zr, Ni, and Co have an effect of improving the strength and heat resistance of the copper alloy, and one or more of these may be added as necessary. However, if these elements are When the total content of one kind or two or more is more than 0.5% by mass, the electrical conductivity is lowered. Therefore, the content is 0.5% by mass or less (excluding 0% by mass). The lower limit of the total content of one or two or more of these elements is preferably 0.01% by mass, more preferably 0.02%, still more preferably 0.03%.

Further, when Zn, Sn, and other strengthening elements (Mn, Mg, Si, Al, Cr, Ti, Zr, Ni, and Co) of any element are added in combination, they are heated at 850 ° C for 30 minutes, and then water-cooled, followed by water cooling. The conductivity after the aging treatment is added in the range of less than 50% IACS.

H, O, S, Pb, Bi, Sb, Se, and As, which are unavoidable impurities, if the copper alloy plate is heated to a temperature of 650 ° C or more for a long time, it will accumulate at the grain boundary, which may cause heating and heating. It is preferable to reduce the content of such elements by rupture of grain boundaries and embrittlement of grain boundaries. H aggregates at the grain boundary and the interface between the material and the substrate during heating, which causes expansion. Therefore, it is preferably set to less than 1.5 ppm (ppm by mass, the same below), and more preferably set to less than 1 ppm. . O is preferably less than 20 ppm, more preferably less than 15 ppm. S, Pb, Bi, Sb, Se and As are preferably less than 30 ppm in total, and more preferably less than 20 ppm. In particular, in the case of Bi, Sb, Se, and As, it is preferable that the total content of the elements is less than 10 ppm, and more preferably less than 5 ppm.

The copper alloy sheet according to the present invention can be produced, for example, by calendering the ingot, and repeating the cold rolling and the heat treatment (aging treatment) one or two times or more. A copper alloy sheet produced by the following conditions has a 0.2% proof stress of 150 MPa or more, a tension of 5% or more, and an average crystal grain size of 20 μm or less on the surface of the sheet, and is excellent. Different bending workability. Further, it was heated at 850 ° C for 30 minutes, and then subjected to aging treatment to have a 0.2% proof stress of 110 MPa or more and a conductivity of 50% IACS or more.

Dissolution and casting can be carried out by a usual method such as continuous casting or semi-continuous casting. Further, as the copper dissolution raw material, it is preferred to use a small content of S, Pb, Bi, Se, and As. In addition, it is preferable to reduce O and H by red heat (moisture removal), bare metal, residue raw material, groove, drying of the mold, and deoxidation of molten metal coated with the molten copper of the copper alloy.

It is preferred to homogenize the ingot, and the homogenization treatment is preferably carried out for 30 minutes or more after reaching the temperature of 800 ° C inside the ingot. The holding time of the homogenization treatment is more preferably 1 hour or more, still more preferably 2 hours or more.

After the homogenization treatment, the inter-heat rolling starts at a temperature of 800 ° C or higher, so that coarse Fe or Fe-P precipitates are not formed on the inter-heated rolled material, and the inter-heat rolling is terminated at a temperature of 600 ° C or higher. This temperature is preferably cooled by a method such as water cooling. When the rapid cooling start temperature after the hot rolling is lower than 600 ° C, coarse Fe and Fe-P precipitates are formed, the structure is more likely to be uneven, and the strength of the copper alloy plate (product plate) is lowered.

After the inter-heat rolling, (a) the inter-heating rolled material is cold-rolled to the thickness of the product, subjected to aging treatment, (b) the inter-heating rolled material is subjected to cold rolling and aging treatment, and further cold-rolled to the thickness of the product, or c) After the aforementioned (b), low temperature burning (return of ductility) is carried out.

The aging treatment (precipitation treatment) is performed at a heating temperature of about 300 to 620 ° C. It is carried out under conditions of 0.5 to 10 hours. When the heating temperature is less than 300 ° C, the amount of precipitation is small, and when it exceeds 620 ° C, the precipitate is likely to be coarsened. The lower limit of the heating temperature is preferably 350 ° C, more preferably 400 ° C, the upper limit is preferably 600 ° C, and more preferably 580 ° C. The holding time of the aging treatment can be appropriately selected depending on the heating temperature, and is carried out in the range of 0.5 to 10 hours. When the holding time is 0.5 hours or less, precipitation is insufficient, and even if it exceeds 10 hours, the amount of precipitation is saturated, and productivity is lowered. The lower limit of the holding time is preferably 1 hour, more preferably 2 hours. The aging treatment may be repeated twice or more within the above heating temperature and holding time.

[Example 1]

A copper alloy having a composition shown in Table 1 (Comparative Example 9, pure copper only) was cast, and ingots each having a thickness of 45 mm were produced. In the copper and copper alloy, H of the unavoidable impurity is less than 1 ppm, O is less than 20 ppm, and S, Pb, Bi, Sb, Se, and As are less than 20 ppm in total.

Each of the ingots was subjected to a soaking treatment at 950 ° C for 2 hours, followed by hot rolling, to obtain a hot intercalation material having a thickness of 15 mm, and quenching (water cooling) from a temperature of 700 ° C or higher. After grinding the two sides of the quenched hot-rolled material by 1 mm, the cold-thickness was roughly rolled to a target thickness of 0.6 mm, and the aging treatment was carried out at 500 ° C for 2 hours (with recrystallization), and then 50% of the application was completed. Calendered between cold, and a copper alloy plate having a thickness of 0.3 mm was produced.

Then, after the obtained copper alloy sheet was evacuated at room temperature, it was replaced with Ar gas and heated, and the sheet temperature reached 850 ° C for 30 minutes, and then water-cooled, and the water-cooled material was further heated at 500 ° C for 2 hours (aging treatment). Each of them was used as a test material to perform various measurements of electrical conductivity and mechanical properties.

The results of each test are shown in Table 1.

(Measurement of conductivity)

The conductivity was measured in accordance with the conductivity measurement method of the non-ferrous metal material specified in JIS-H0505, and was carried out by a four-terminal method using a double bridge. The size of the test piece was 15 mm in width and 300 mm in length.

(mechanical characteristics)

The JIS No. 5 tensile test piece was cut out from the test material in such a manner that the longitudinal direction was a rolling parallel direction, and a tensile test was carried out in accordance with JIS-Z2241 to measure endurance and elongation. Endurance is equivalent to a tensile strength of 0.2% of permanent tension.

(average crystal grain size)

The average crystal grain size (circle equivalent diameter) was measured using SEM (Scanning Electron Microscope) and backscattered electron diffraction analysis (EBSD: Electron Back-Scatter Diffraction).

(bending workability)

The measurement of the bending workability was carried out in accordance with the W bending test method prescribed by the Copper Extension Society Standard JBMA-T307. A test piece having a width of 10 mm and a length of 30 mm was cut out from each test material, and GW (Good Way (vertical axis and rolling direction)) and BW (Bad Way) were used using a mold of R/t = 0.5 (Bad Way) Parallel))). Next, the presence or absence of cracking in the bent portion was visually observed by a 100-fold optical microscope, and it was evaluated as ○ (qualified) in the case where neither GW nor BW was broken, and the crack or the GW or BW was evaluated as × (failed).

(solder wettability)

A tape test piece was taken from each test material, and the inactive flux was immersed for 1 second and coated, and the solder wet time was measured by a crescent type method. The solder was applied under the test conditions of Sn-3 mass% Ag-0.5 mass% Cu maintained at 260 ± 5 ° C, impregnation speed of 25 mm/sec, impregnation depth of 5 mm, and immersion time of 5 sec. When the solder wettable time was 2 seconds or less, it was evaluated that the solder wettability was excellent. Further, in addition to Comparative Example 7, the solder wettable time was 2 seconds or shorter.

The copper alloy sheets of Examples 1 to 12 shown in Table 1 have an alloy composition satisfying the requirements of the present invention, and are heated at 850 ° C for 30 minutes, and then the strength (0.2% proof) after the aging treatment is 110 MPa or more, and is electrically conductive. The rate is 50% IACS or more. Further, the characteristics of the copper alloy sheet before heating at 850 ° C are strength (0.2% proof) of 150 MPa or more, tension of 5% or more, average crystal grain size of 20 μm or less, bending workability and soldering. The wetness is also excellent. After heating at 850 ° C, it also had a strength of higher than 70 MPa (0.2% proof) compared to Comparative Example 9 of the conventional material.

On the other hand, the copper alloy sheets of Comparative Examples 1 to 8 and the pure copper sheets of Comparative Example 9 were inferior in some characteristics as described below.

In Comparative Examples 1 and 2, since the Fe content was small, the strength after the aging treatment was low.

In Comparative Example 3, the P content was too large, and P which did not contribute to the precipitation of the Fe-P compound was solid-solved, and the electrical conductivity after the aging treatment was low.

In Comparative Example 4, the total content of Zn and Sn was relatively large, and the total amount of Zn and Sn after solid solution was also increased. Therefore, the electrical conductivity after the aging treatment was less than 50% IACS.

In Comparative Examples 5 and 6, the Sn content was excessive, and the conductivity after the aging treatment was lowered due to the solid solution of Sn.

In Comparative Example 7, the Zn content was excessive, and the solder wettability was poor as described earlier.

In Comparative Example 8, the total content of Zn, Sn, and other elements was relatively large, and the electrical conductivity after the aging treatment was lower than 50% IACS.

Comparative Example 9 is a conventional pure copper plate, and although the electrical conductivity is high, the strength is also low after the aging treatment.

[Embodiment 2]

Representatives of the copper alloy sheets shown in Table 1 (Examples 3 and 7 and Comparative Examples 1 and 4) were heated at 1000 ° C for 30 minutes, then water-cooled, and further heated at 500 ° C for 2 hours (aging treatment). The copper The alloy plate was used as a test material, and various measurement tests of electrical conductivity and mechanical properties were carried out by the method described in Example 1. The results are shown in Table 2.

As shown in Table 2, Examples 3 and 7 and Comparative Examples 1 and 4 were heated at 1000 ° C for 30 minutes, and then the strength (0.2% proof) and conductivity after aging treatment were heated for 30 minutes at 850 ° C. The strength and conductivity (see Table 1) after the aging treatment are then lower. However, in Examples 3 and 7, the strength (0.2% proof) and the decrease in electrical conductivity were small, and the heat and temperature at 1000 ° C for 30 minutes, followed by the strength and conductivity after the aging treatment, were obtained in the vicinity of 110 MPa and 50% IACS. Or a value above it.

The disclosure of this specification contains the following types.

Type 1:

A copper alloy plate for exothermic parts, characterized in that it contains Fe: 1.0 to 2.4% by mass, P: 0.005 to 0.1% by mass, and the residual portion is formed of Cu and unavoidable impurities, and is heated at 850 ° C for 30 minutes and then water-cooled. Then, the 0.2% proof stress after the aging treatment is 110 MPa or more, and the electric conductivity is 50% IACS or more. A part of the process of manufacturing the exothermic part includes a process of heating to 650 ° C or more and an aging treatment.

Type 2:

A copper alloy plate for a heat releasing component of the first aspect, which further contains 2.0% by mass or less of Zn (excluding 0% by mass).

Type 3:

A copper alloy plate for a heat releasing component of the type 1 or 2, which further contains 0.005 to 0.5% by mass of Sn.

Type 4:

A copper alloy plate for a heat releasing component according to any one of the types 1 to 3, wherein In addition, one or two or more of Mn, Mg, Si, Al, Cr, Ti, Zr, Ni, and Co are contained in a total amount of 0.5% by mass or less (excluding 0% by mass).

Type 5:

An exothermic part characterized by being produced from a copper alloy sheet for a heat releasing part according to any one of the types 1 to 4, and subjected to an aging treatment after heating to a temperature of 650 ° C or higher.

Type 6:

A heat releasing component of the type 5 is formed by forming a Sn coating layer on at least a portion of the outer surface.

Type 7:

The exothermic part of the form 5 has a Ni coating layer formed on at least a portion of the outer surface.

In this case, the priority is claimed based on the basic application of Japan Patent Application No. 2015-066518, which is filed on March 27, 2015. This specification is incorporated by reference to Japanese Patent Application No. 2015-066518.

Claims (11)

A copper alloy plate for exothermic parts, characterized in that it contains Fe: 1.0 to 2.4% by mass, P: 0.005 to 0.1% by mass, and the residual portion is formed of Cu and unavoidable impurities, and is heated at 850 ° C for 30 minutes and then water-cooled. Then, the 0.2% proof stress after the aging treatment is 110 MPa or more, and the electric conductivity is 50% IACS or more. A part of the process of manufacturing the exothermic part includes a process of heating to 650 ° C or more and an aging treatment. The copper alloy sheet for a heat releasing member according to claim 1, which further contains 2.0% by mass or less of Zn (excluding 0% by mass). A copper alloy plate for a heat releasing component according to claim 1, which further contains 0.005 to 0.5% by mass of Sn. A copper alloy plate for a heat releasing component according to claim 2, which further contains 0.005 to 0.5% by mass of Sn. A copper alloy plate for a heat-releasing component according to claim 1 which further contains 0.5% by mass or less (excluding 0% by mass) and contains one of Mn, Mg, Si, Al, Cr, Ti, Zr, Ni, and Co. Or two or more. The copper alloy sheet for a heat-releasing component of claim 2, which further contains 0.5% by mass or less (excluding 0% by mass) and contains one of Mn, Mg, Si, Al, Cr, Ti, Zr, Ni, and Co. Or two or more. The copper alloy plate for a heat-releasing component of claim 3, which further contains 0.5% by mass or less (excluding 0% by mass) and contains one of Mn, Mg, Si, Al, Cr, Ti, Zr, Ni, and Co. Or two or more. The copper alloy plate for a heat releasing component according to claim 4, wherein the total amount is 0.5% by mass or less (excluding 0% by mass), and Mn, Mg, One or two or more of Si, Al, Cr, Ti, Zr, Ni, and Co. An exothermic part characterized by being produced from a copper alloy sheet for an exothermic part according to any one of claims 1 to 8, and subjected to an aging treatment after heating to a temperature of 650 ° C or higher. The exothermic part of claim 9 which forms an Sn coating layer on at least a portion of the outer surface. The exothermic part of claim 9 which forms a Ni coating layer on at least a portion of the outer surface.