TW201740127A - Apparatus for inspecting semiconductor device - Google Patents

Abstract

Disclosed is an apparatus for inspecting a semiconductor device. An inspection unit inspects semiconductor devices received in a tray transferred from a loading unit. A sorting unit comprises: a first waiting area in which an empty tray, transferred from an empty tray providing unit, waits; a second waiting area in which a tray, having inspected semiconductor devices, waits; and a buffer area in which another tray, having inspected semiconductor devices, is temporarily stored. A defective product storing unit receives, from the first waiting area, a tray having semiconductor devices that are sorted as defective products, and stores the received tray. The empty tray storing unit receives the empty tray from the buffer area and stores the received empty tray. An unloading unit receives, from the second waiting area, a tray where semiconductor devices classified as normal products are received, or are discharged after being received, and stores the received tray. A sorting picker picks up defective semiconductor devices from among semiconductor devices received in the tray of the second waiting area, and places the picked-up defective semiconductor devices into the empty tray of the first waiting area. Further, the sorting picker picks up normal semiconductor devices from among semiconductor devices received in the tray of the buffer area, and places the picked-up normal semiconductor devices into the tray of the second waiting area. A packaging unit packages the normal semiconductor devices received in the tray of the second waiting area.

Description

Semiconductor component inspection device

The present invention relates to a semiconductor element inspection apparatus, and more particularly to a semiconductor element inspection apparatus which is classified by inspection of a semiconductor element and which is classified as a good quality semiconductor element.

After the semiconductor device is manufactured through the semiconductor process, it is inspected before shipment. That is, the semiconductor element is not only defective in the inside of the package, but also has a fatal effect on performance when there is a defect in appearance. Therefore, not only the electrical operation inspection of the semiconductor element but also various inspections including the inspection of the appearance defect are performed.

On the other hand, the semiconductor element inspection apparatus can perform the operations classified into the good products and the defective products based on the inspection results after the semiconductor elements are inspected. However, in order to improve the productivity, it is necessary to automatically perform the inspection and the classification operation quickly and efficiently.

An object of the present invention is to provide a semiconductor element inspection apparatus capable of automatically and efficiently performing inspection and classification operations on semiconductor elements.

In order to achieve the above object, a semiconductor element inspecting apparatus according to the present invention includes a main body, a loading portion, an inspection portion, an empty tray supply portion, a sorting portion, a defective product storage portion, An empty tray storage portion, an unloading portion, first, second, third, fourth, and fifth tray conveying portions, a converter, a sorting pickup, and a packaging portion. The loading unit loads a tray that houses a semiconductor element to be inspected. The inspection unit inspects the semiconductor element housed in the tray conveyed from the loading unit. The empty tray supply unit loads an empty tray. The classification unit includes a first standby area for waiting for the empty tray transported from the empty tray supply unit, a second standby area for waiting for the tray in which the semiconductor element for inspection is stored, and another tray for storing the semiconductor element for which the inspection is completed. A buffer area that is temporarily kept. The defective product storage unit receives and loads the tray in which the semiconductor element classified as the defective product is received from the first standby area. The empty tray storage unit receives and loads the empty tray from the buffer area. The unloading unit receives and stores a tray in which a semiconductor element classified as a good product or a state in which all of the semiconductor elements are stored is received from the second standby area. The first, second, third, fourth, and fifth tray conveying units are coupled to the loading unit, the empty tray supply unit, the defective product storage unit, the empty tray storage unit, and the unloading unit, respectively, to transport the tray. The converter is disposed on the upper side of the body so as to be reciprocable between the first to fifth tray conveying portions. The sorting pickup is provided to be reciprocable between the first and second standby regions and the buffer region, and the defective semiconductor element is picked up and stored in the first standby area in the semiconductor element housed in the tray of the second standby area. The empty tray is a tray in which the qualified semiconductor element is picked up and stored in the second standby area in the semiconductor element housed in the tray of the buffer area. The packaging unit receives the good-quality semiconductor element housed in the tray of the second standby area through the package pickup and packages the over-load tape and the cover tape.

According to the present invention, the inspection and classification operation of the semiconductor element can be automatically performed quickly and efficiently. Further, according to the present invention, the inspection of the qualified semiconductor element in the carrier tape can be carried out efficiently and conveniently.

1, 1'‧‧‧ carrier tape

1a‧‧‧ pocket

1b‧‧‧ delivery hole

2‧‧‧Semiconductor components

3‧‧ ‧ cover tape

4‧‧‧Adhesive tape

4a‧‧‧Adhesive sheet

4b‧‧‧ release paper

5‧‧‧Adhesive tape

100‧‧‧ body

210‧‧‧Loading Department

220‧‧‧ Empty tray supply department

230‧‧‧Classification Department

231‧‧‧First standby area

232‧‧‧second standby area

233‧‧‧Buffer area

240‧‧‧Defective Storage Department

250‧‧‧ Empty tray storage

260‧‧‧Unloading Department

300‧‧‧Inspection Department

310‧‧‧First Visual Inspector

320‧‧‧Second Visual Inspector

330‧‧‧ Third Visual Inspector

410, 420, 430, 440, 450‧‧‧Tray conveyor

500‧‧‧ converter

510‧‧‧ converter body

520‧‧‧ column

530‧‧‧Clamp

531‧‧‧ claw

540‧‧‧Upper fixture

541, 551‧‧ ‧ clamping parts

550‧‧‧Bottom fixture

560‧‧‧ rotator

600‧‧‧Class Pickup

700‧‧‧Packaging Department

701‧‧‧ Chassis

710‧‧‧ Carrier tape supply reel

711‧‧‧ Supply Guidance Department

720‧‧‧Carriage conveyor unit

721‧‧‧Conveyor

721a‧‧‧First conveyor

721b‧‧‧Second conveyor

722‧‧‧Sprocket

722a‧‧‧Sawtooth

723‧‧‧Sprocket rotation mechanism

724‧‧‧Transportation track

725‧‧‧Interval adjustment mechanism

730‧‧ ‧ cover tape supply unit

730a‧‧‧Supply reel support table

731‧‧‧ Cover tape supply reel

732‧‧‧ Cover tape supply reel rotation mechanism

733‧‧ ‧ cover belt guide roller

734‧‧ ‧ cover tape tension guide

734a‧‧‧ movable roller

734b‧‧‧Linear actuator

740‧‧‧Seal unit

741‧‧‧ Thermal bonding mechanism

742‧‧‧ blades

743‧‧‧heater

744‧‧‧ Blade mounting block

745‧‧‧Installation block support

746‧‧‧Installation block drive mechanism

747‧‧‧Cylinder support table

748‧‧‧Interval adjustment mechanism

750‧‧‧ Carrier tape winding unit

751‧‧‧Winding reel

752‧‧‧Rolling reel rotating mechanism

752a‧‧‧Axis

752b‧‧‧Rotary motor

752c‧‧‧Axis support table

753‧‧‧Rolling reel linear movement mechanism

753a‧‧ ‧ level support

753b‧‧‧Linear guide for level shifting

753c‧‧A linear actuator for level shifting

754‧‧‧Winding reel lifting mechanism

754a‧‧‧Vertical support table

754b‧‧‧Linear guide for lifting

754c‧‧‧ Linear Actuator for Lifting

755‧‧‧ Sensing Agency

755a‧‧‧Sensor rod

755b‧‧‧roll

755c‧‧‧Sensor Guide

755d‧‧‧Flexible parts

755e‧‧‧ position sensor

760‧‧‧Cutting unit

761‧‧‧ cut-off station

762‧‧‧Cut cutter

763‧‧‧Cutter linear movement mechanism

764‧‧‧Cutter support table

770‧‧‧ Attachment unit

770a‧‧‧Reel support table

771‧‧‧Adhesive tape supply reel

772‧‧‧Adhesive tape supply reel rotating mechanism

773‧‧‧ Stripper

773a‧‧‧Protruding

774‧‧‧Adhesive sheet pressurizing mechanism

774a‧‧‧Pressure rod

774b‧‧‧roll

774c‧‧‧Pressure rod guide

774d‧‧‧Pressure rod lifting mechanism

775‧‧‧ release paper recycling reel

776‧‧‧ release paper recycling reel rotating mechanism

777‧‧‧Adhesive tape tension guide

778‧‧‧ release paper conveying mechanism

781‧‧‧Fourth visual inspection

782‧‧‧ Fifth Visual Inspector

800‧‧‧Package Picker

T1, T2, T3, T4, T5‧‧‧ pallets

DZ‧‧‧ storage area

1 is a perspective view of a semiconductor element inspecting apparatus according to an embodiment of the present invention.

Figure 2 is a plan view of Figure 1.

Fig. 3 is a schematic configuration diagram of the semiconductor element inspecting device shown in Fig. 1.

Fig. 4 is a perspective view showing the converter of Fig. 1 taken out.

Fig. 5 is a schematic view for explaining an operation example of the converter shown in Fig. 4;

Fig. 6 is a perspective view of the packaging portion of Fig. 1.

Fig. 7 is a front view of Fig. 6.

8 is a view for explaining a process in which a semiconductor element is housed in a carrier tape and sealed by a cover tape.

Fig. 9 is a perspective view showing the carrier tape transport unit of Fig. 6;

Fig. 10 is a perspective view showing the cover tape supply unit of Fig. 6;

Figure 11 is a side view showing the sealing unit of Figure 6.

Fig. 12 is a perspective view showing the carrier tape winding unit of Fig. 6;

Fig. 13 is a view for explaining an operation example of the sensor mechanism of Fig. 12.

Figure 14 is a side view showing the cutting unit of Figure 6.

Fig. 15 is a front elevational view showing the attachment unit of Fig. 6.

16 and 17 are views for explaining the action of the stripper of Fig. 15.

The invention will now be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same structures, and the detailed description of the known functions and structures that are unnecessarily obscured by the gist of the present invention will be omitted. The embodiments of the present invention are provided to more fully illustrate the present invention to those of ordinary skill in the art. Therefore, the shape, size, and the like of the elements in the drawings may be exaggerated for more specific explanation.

1 is a perspective view of a semiconductor element inspecting apparatus according to an embodiment of the present invention. Figure 2 is a plan view of Figure 1. 3 is a semiconductor element inspection device shown in FIG. 1. Schematic composition.

1 to 3, the semiconductor element inspection apparatus includes a main body 100, a loading unit 210, an inspection unit 300, an empty tray supply unit 220, a sorting unit 230, a defective product storage unit 240, an empty tray storage unit 250, an unloading unit 260, The first, second, third, fourth, and fifth tray conveying portions 410, 420, 430, 440, 450, the converter 500, the sorting pickup 600, and the packaging portion 700.

The loading unit 210 loads a tray in which the semiconductor element to be inspected is stored. Here, in the case where the semiconductor element is of a BGA (Ball Ball Array Package) type, the semiconductor element can be mounted on the tray with the solder balls on the lower surface facing upward. The loading portion 210 may be disposed in front of the body 100.

The inspection unit 300 inspects the semiconductor element housed in the tray transported from the loading unit 210. The inspection portion 300 can include first and second visual inspectors 310, 320. The first visual inspection device 310 performs two-dimensional inspection on one surface of the semiconductor element housed in the tray conveyed by the first tray conveying unit 410 from the loading unit 210. The first visual inspection device 310 can inspect the state of the solder ball or the like of the lower surface of the semiconductor element housed in the tray. The first visual inspection device 310 may be disposed on the upper side of the body 100 to perform horizontal reciprocation in the left-right direction.

The second visual inspection device 320 performs two-dimensional inspection on the other surface of the semiconductor element housed in the tray that has been transported to the sorting unit 230 by the first visual inspection device 310. For example, although not shown, when the marking portion is provided between the first visual inspection device 310 and the second visual inspection device 320 and the identification number is marked on the upper surface of the semiconductor element, the second visual inspection device 320 can check The mark state of the upper surface of the semiconductor element. The second visual inspection device 320 is mounted to the sorting picker 600, and is capable of horizontally reciprocating along the left and right direction of the body 100 together with the sorting picker 600.

Moreover, the inspection portion 300 can include a third visual inspection device 330, the third viewing The inspection tool 330 performs three-dimensional inspection on one side of the semiconductor element housed in the tray conveyed by the first tray conveying unit 410 from the loading unit 210. The third visual inspection device 330 can recognize the three-dimensional shape of the solder ball of the semiconductor element, thereby detecting defects or the like with high precision. The third visual inspection device 330 may be disposed on the upper side of the body 100 to perform horizontal reciprocation in the left-right direction.

The empty tray supply unit 220 loads an empty tray. The empty tray of the empty tray supply unit 220 can be used to supply the defective semiconductor element to the first standby area 231 of the sorting unit 230 or to supply the defective semiconductor element to the converter 500 to invert the semiconductor element upside down. The empty tray supply unit 220 may be disposed in front of the body 100.

The classification unit 230 includes a first standby area 231 that waits for the empty tray T1 transported from the empty tray supply unit 220, a second standby area 232 that waits for the tray T2 in which the semiconductor element for inspection is stored, and a second standby area 232 that stores the completed inspection. A buffer region 233 temporarily stored in the other tray T3 of the semiconductor element. The classification unit 230 may be disposed on the center side of the body 100.

The first and second standby areas 231, 232 and the buffer area 233 may be arranged in the left-right direction. The buffer area 233 may be disposed between the first standby area 231 and the second standby area 232. When the packaging unit 700 is disposed on the right side of the main body 100, the second standby area 232 may be disposed closest to the packaging unit 700.

The defective product storage unit 240 receives and loads the tray T1 in which the semiconductor element classified as the defective product is received from the first standby area 231. The defective product storage unit 240 may be disposed in front of the body 100. The tray T1 of the first standby area 231 can be transported to the defective product storage unit 240 after all of the defective semiconductor elements are filled.

The empty tray storage unit 250 receives and loads the empty tray T3 from the buffer area 233. The empty tray storage portion 250 may be disposed in front of the body 100. In the semiconductor element housed in the tray T3 of the buffer region 233, only one type of defective product may be transported to the tray T1 of the first standby area 231, and other types of defective products may remain in the tray T3 of the buffer area 233 to be empty. tray The storage unit 250 is transported and loaded. In this case, since the semiconductor element can be classified into two types of defective products, it is possible to discard serious defective products in which solder ball defects are present, and to reproduce the defective products in which the mark defects are present.

The unloading unit 260 receives the tray T2 in which the semiconductor element classified as a good product or the state in which all of them are discharged after being stored is received from the second standby area 232 and loaded. The qualified semiconductor element housed in the tray T2 of the second standby area 232 can be packaged by the packaging unit 700 or can be transported to the unloading unit 260 without being packaged by the packaging unit 700. The unloading portion 260 may be disposed in front of the body 100.

First, second, third, fourth, and fifth tray conveying units 410, 420, 430, 440, and 450, loading unit 210, empty tray supply unit 220, defective product storage unit 240, empty tray storage unit 250, The unloading unit 260 is connected to each other to transport the tray. The first, second, third, fourth, and fifth tray conveying portions 410, 420, 430, 440, and 450 may be arranged in the left-right direction. The first tray transport unit 410 transports the tray loaded on the loading unit 210 to the rear of the body 100. The second tray transport unit 420 transports the tray loaded on the empty tray supply unit 220 to the rear of the main body 100.

The third tray transport unit 430 transports the tray from the rear of the main body 100 through the first standby area 231 to the defective product storage unit 240. The fourth tray transport unit 440 transports the tray from the rear of the body 100 through the buffer area 233 to the empty tray storage unit 250. The fifth tray transport unit 450 transports the tray from the rear of the body 100 through the second standby area 232 to the unloading unit 260.

The first tray conveying portion 410 may include a movable block that linearly moves in the front-rear direction of the body 100 in a state in which the tray is mounted, a rail that guides linear movement of the movable block, and a linear actuator that linearly moves the movable block. The linear actuator may include a ball screw that is screwed to the lower side of the movable block, and a rotary motor that rotates the ball screw. The second, third, fourth, and fifth tray conveying portions 420, 430, 440, and 450 may be configured in the same manner as the first tray conveying portion 410.

The converter 500 is disposed on the upper side of the body 100 so as to be reciprocable between the first to fifth tray conveying portions 410, 420, 430, 440, and 450. The converter 500 can also have a function of stacking the upper and lower trays in the upper portion of the tray in which the semiconductor elements of the first visual inspection device 310 have been stored, and then flipping the semiconductor elements upside down. The empty tray is moved to the second visual inspection device 320. The configuration of the converter 500 is described below.

The sorting pickup 600 is provided in such a manner as to be reciprocable between the first and second standby areas 231 and 232 and the buffer area 233. The sorting picker 600 is capable of transporting a semiconductor element by vacuum pressure. The sorting picker 600 picks up the defective semiconductor element in the semiconductor element housed in the tray T2 of the second standby area 232 and stores it in the empty tray T1 of the first standby area 231, and stores it in the tray T3 of the buffer area 233. Among the semiconductor elements, the good-quality semiconductor element is picked up and stored in the disk T2 of the second standby area 232.

The packaging unit 700 receives the good-quality semiconductor element housed in the tray T2 of the second standby area 232 through the package pickup 800, and wraps it through the overload tape 1 and the cover tape 3. The package pickup 800 is capable of transporting a semiconductor element by vacuum pressure. The configuration of the package portion 700 is described below.

As an example, as shown in FIGS. 4 and 5 , the converter 500 is provided such that the converter main body 510 can be lifted and lowered while the column 520 on the upper side of the main body 100 is horizontally reciprocated in the left-right direction. The actuator that causes the converter body 510 to reciprocate and raise and lower can be constituted by a conventional actuator.

The converter 500 may include a gripper 530, upper and lower side clamps 540, 550, and a rotator 560. The holder 530 is provided to the converter body 510 so as to be movable up and down. The holder 530 is configured to hold or release the tray by narrowing or widening the pair of claws 531.

The upper and lower side clamps 540, 550 will be one by twisting or widening each other The tray or the stacked 2 trays are fixed or released. The upper side jig 540 can allow the tray to enter and exit by narrowing or widening the pair of clamping members 541. The lower jig 550 can also allow the tray to enter and exit by narrowing or widening the clamping member 551. The upper and lower side jigs 540, 550 can be constructed in the same manner.

The rotator 560 is turned upside down by rotating the upper and lower side clamps 540 and 550 together, thereby turning the tray between the upper and lower side clamps 540 and 550 upside down. The actuators of the holder 530, the upper and lower side clamps 540, 550, and the rotator 560 may be constituted by a conventional actuator.

The process of turning the semiconductor element upside down by the converter 500 is described below.

First, the converter main body 510 moves to a position where the empty tray T4 stands by. Next, the clamp member 551 of the lower jig 550 is widened, the gripper 530 is lowered, the empty tray T4 is gripped, and the empty tray T4 is positioned between the lower jig 550 and the upper jig 540. Next, the clamp member 551 of the lower jig 550 is narrowed, and the upper and lower clamps 540 and 550 are narrowed to fix the empty tray T4, and then the upper and lower clamps 540 and 550 are rotated by 180 degrees by the rotator 560. Thus, the empty tray T4 is turned upside down. At the same time, the converter body 510 moves to the tray T5 which is inspected by the first visual inspection device 310.

Next, after the gripper 530 is lowered to hold the empty tray T4, the gripping member 541 of the upper jig 540 that has moved to the lower side is widened. Next, the gripper 530 stacks the empty tray T4 on the upper portion of the tray T5 that has been inspected, and holds it up and then raises it so that the trays T4 and T5 are located between the lower side clamp 550 and the upper side clamp 540. Next, the clamp member 541 of the upper jig 540 is narrowed, and the upper and lower clamps 540 and 550 are narrowed to fix the trays T4 and T5 in the stacked state, and then the upper and lower clamps 540 and 550 are rotated by 180 degrees by the rotator 560. Thus, the semiconductor element of the tray T5 that has been inspected is turned upside down and moved to the empty tray T4. At the same time, the converter main body 510 moves to the fourth tray conveying unit 440 or the fifth tray conveying unit 450.

Next, the holder 530 holds the trays T4 and T5 in a stacked state, and then The clamping member 551 of the side clamp 550 is widened. Next, the holder 530 inserts the tray T4 in which the semiconductor element that has been turned upside down is placed in the fourth tray conveyance unit 440 or the fifth tray conveyance unit 450, and holds the tray T5 in the empty state on the upper side, and then raises the tray T5. Located between the lower side clamp 550 and the upper side clamp 540. Next, the clamp member 551 of the lower jig 550 is narrowed, and the upper and lower side clamps 540 and 550 are narrowed to fix the empty tray T5. The tray T5 in the empty state is used in the process of transferring the semiconductor elements of the new tray which are inspected by the first visual inspection device 310 by the aforementioned process.

The operation example of the aforementioned semiconductor element inspection device will be schematically described below.

A plurality of trays in which semiconductor elements for performing inspection are housed are mounted on the loading unit 210. At this time, the semiconductor element can be mounted on the tray with the solder balls located on the respective lower surfaces facing upward. Thereafter, a plurality of empty trays are loaded in the empty tray supply unit 220 to complete the preparation for performing the inspection.

In this state, when the semiconductor element inspection apparatus is operated, the empty tray of the empty tray supply unit 220 is conveyed to the rear of the main body 100 by the second tray conveyance unit 420. In this way, the empty tray is transported to the third tray transport unit 430 by the converter 500, and then transported to the first standby area 231 of the sorting unit 230 by the third tray transport unit 430 to stand by. On the other hand, the other empty tray of the empty tray supply unit 220 is conveyed to the rear of the main body 100 for the upside down of the semiconductor element, and stands by.

The tray loaded on the loading unit 210 is transported to the first visual inspection device 310 by the first tray transport unit 410, and the first visual inspection device 310 checks the state of the solder balls on the lower surface of the semiconductor elements housed in the tray. The tray that has been inspected by the first visual inspection device 310 is conveyed to the third visual inspection device 330 by the first tray conveying portion 410, and the third visual inspection device 330 can recognize the three-dimensional shape of the solder ball of the semiconductor element housed in the tray, Thus checking with high precision Bad and so on.

The semiconductor element of the tray which is inspected by the third visual inspection device 330 is turned upside down by the aforementioned converter 500 to move to the empty tray. The tray in which the semiconductor elements that are turned upside down are transported to the fourth and fifth tray transport units 440 and 450 by the converter 500, and then passed through the fourth and fifth tray transport units 440 and 450 to the second visual checker. 320 delivery. The second visual inspection device 320 is capable of inspecting the mark state or the like of the upper surface of the semiconductor element. The tray that has been inspected by the second visual inspection device 320 is conveyed to the second standby area 232 and the buffer area 233 of the classification unit 230 by the fourth and fifth tray conveyance units 440 and 450, and stands by.

When there is no defective product in the semiconductor element of the tray accommodated in the second standby area 232, the tray of the second standby area 232 can be transported to the unloading unit 260 by the fifth tray transport unit 450 and loaded. At this time, the package pickup 800 can pick up the good products from the semiconductor elements of the trays accommodated in the buffer area 233 and transport them to the packaging unit 700, and wrap them through the overload tape 1 and the cover tape 3.

On the other hand, when there is a defective product in the semiconductor element of the tray accommodated in the second standby area 232, the sorting picker 600 performs picking up of defective products from the semiconductor elements of the tray accommodated in the second standby area 232. This is stored in the empty tray of the first waiting area 231, and the defective component is picked up in the semiconductor element of the tray accommodated in the buffer area 233, and the tray is stored in the second standby area 232.

When the tray of the first waiting area 231 is completely filled with the defective products by the sorting operation, the tray containing the defective product is transported to the defective product storage unit 240 by the third tray transport unit 430 and loaded. If the good product no longer exists in the tray of the buffer area 233, the empty tray is transported to the empty tray storage unit 250 to be loaded. The good-quality semiconductor element housed in the tray of the second standby area 232 is conveyed to the packaging unit 700 by the package pickup 800, and is packaged by the overload tape 1 and the cover tape 3.

Fig. 6 is a perspective view of the packaging portion of Fig. 1. Fig. 7 is a front view of Fig. 6. 8 is a view for explaining a process in which a semiconductor element is housed in a carrier tape and sealed by a cover tape.

Referring to FIGS. 6 to 8, the packaging portion 700 includes a carrier tape supply reel 710, a carrier tape conveying unit 720, a cover tape supply unit 730, a sealing unit 740, a carrier tape winding unit 750, a cutting unit 760, and an attachment unit 770.

The carrier tape supply reel 710 supplies the carrier tape 1. Here, in the carrier tape 1, the pockets 1a for accommodating the semiconductor element 2 are formed by arranging a plurality of pockets 1a in a row along the longitudinal direction. Further, in the carrier tape 1, the conveying holes 1b may be formed by arranging the one side edge portions in the longitudinal direction.

The carrier tape supply reel 710 can unwind the carrier tape 1 from the wound state by rotation and supply it to the carrier tape transport unit 720. At this time, the carrier tape supply reel 710 can be rotated by the force of the carrier tape conveying unit 720 to convey the carrier tape 1, thereby unwinding the carrier tape 1.

The carrier tape supply reel 710 may be disposed on the lower side of the transport table 721 of the carrier tape transport unit 720 and rotatably provided to the chassis 701. The carrier tape 1 supplied from the carrier tape supply reel 710 can be guided to the upper side of the conveyance table 721 by the supply guide portion 711. The supply guide portion 711 may be constituted by a pipe member having a shape that is wider toward the inlet of the carrier tape supply reel 710 than toward the outlet of the conveyance table 721.

The carrier tape transport unit 720 transports the carrier tape 1 received from the carrier tape supply reel 710 in one direction with the respective inlets of the pockets 1a facing upward. The carrier tape transport unit 720 includes a storage area DZ, and the qualified semiconductor element 2 is received by the package pickup 800 in the storage area DZ, and is accommodated in the pocket 1a of the carrier tape 1.

The cover tape supply unit 730 supplies the cover tape 3 when the carrier tape 1 passes the overload tape transport unit 720, and carries the tape carrier of the semiconductor element 2 that is supplied to the storage region DZ of the carrier tape transport unit 720 by the package pickup 800. The pocket 1a of 1 is covered.

The sealing unit 740 bonds the cover tape 3 received from the cover tape supply unit 730 to the carrier The belt 1a is sealed with a belt 1 to seal the carrier tape 1.

The carrier tape winding unit 750 sequentially moves each of the winding reels 751 in an empty state to a position where the carrier tape 1' sealed by the sealing unit 740 is wound, and the carrier tape 1' is wound around each of the carrier tapes 1'. Winding reel 751.

The cutting unit 760 cuts the carrier tape 1' conveyed from the sealing unit 740 to the carrier tape winding unit 750 in correspondence with the length to be wound around each of the winding reels 751, respectively. That is, the winding reel 751 can wind the carrier tape 1' in accordance with the lot of the semiconductor element 2. At this time, the cutting unit 760 can cut the carrier tape 1' in accordance with the batch of the semiconductor element 2.

When the carrier tape 1' is wound around the winding reel 751, the attachment unit 770 attaches the leading end of the carrier tape 1' to the winding reel 751, and attaches the rear end of the carrier tape 1' cut by the cutting unit 760 to The wound portion of the carrier tape 1'.

On the other hand, the packaging portion 700 may include a fourth visual inspection device 781 and a fifth visual inspection device 782. The fourth visual inspection device 781 is disposed between the storage region DZ of the carrier tape transport unit 720 and the cover tape supply unit 730 to inspect the state in which the carrier tape 1 in which the semiconductor element 2 is housed is inspected. The fourth visual inspection device 781 may be disposed on the upper side of the transport table 721. The fourth visual inspection device 781 captures the upper portion of the carrier tape 1 in which the semiconductor element 2 is housed, and can check whether or not the semiconductor element 2 housed in the pocket 1a is turned over or not, and whether it is the empty pocket 1a or the pocket 1a based on the captured image. Tilt or not.

The fifth visual inspection device 782 is disposed between the sealing unit 740 and the cutting unit 760 to check the state of the carrier tape 1' sealed by the sealing unit 740. The fifth visual inspection device 782 may be disposed on the upper side of the transport table 721. The fifth visual inspection device 782 photographs the sealed carrier tape 1', and can check the sealed state of the carrier tape 1' based on the captured image.

The fifth visual inspection device 782 can be constituted by OTI (Over Tape Inspection). In this case, the fifth visual inspection device 782 can acquire the sealed carrier tape 1' The tomographic image is checked for the sealed state of the carrier tape 1'. The fifth visual inspection device 782 can photograph the carrier tape 1' in a state where the lower surface of the carrier tape 1' is illuminated by a backlight. The operator is notified of the inspection results based on the fourth and fifth visual checkers 781, 782, and the operator can take appropriate measures based on the inspection results.

As an example, referring to FIG. 9, the carrier tape transport unit 720 may include a transport table 721, a sprocket 722, a sprocket rotating mechanism 723, and a transport track 724.

The transport stage 721 receives the carrier tape 1 from the carrier tape supply reel 710. The transport table 721 can be configured in a manner that is above the surface level. The transport table 721 can be supported on the chassis 701. A conveyance guide roller that prevents the conveyed carrier tape 1 from floating may be provided on the upper side of the conveyance table 721. The transport table 721 can be divided into first and second transport stages 721a, 721b. The first and second transport stages 721a and 721b are arranged at intervals in the width direction of the carrier tape 1.

When the width of the carrier tape 1 is changed, the interval between the first transport stage 721a and the second transport stage 721b can be changed by the interval adjusting mechanism 725 in accordance with the changed width of the carrier tape 1. The interval adjusting mechanism 725 may include a linear actuator that linearly moves the first and second conveying stages 721a, 721b in a direction parallel to the width direction of the carrier tape 1, and guides the first and second conveying stages 721a, 721b. Linear guide that moves linearly. The linear actuator may be constituted by a rotary motor and a ball screw for converting a rotational motion of the rotary motor into a linear motion, or may be constituted by a linear motor or a cylinder.

The sprocket 722 conveys the carrier tape 1 by rotating the respective serrations 722a in the state of the transport holes 1b of the carrier tapes 1, 1' supplied to the transport table 721. The sprocket 722 is provided on the transport table 721 so as to be rotatable about a horizontal axis parallel to the width direction of the carrier tape 1 . The sprocket wheels 722 are arranged along the longitudinal direction of the transport table 721. One of the sprocket wheels 722 may be disposed between the supply guide portion 711 and the fourth visual inspection device 781, and the other may be disposed between the sealing unit 740 and the fifth visual inspection device 782.

The sprocket rotation mechanism 723 rotates the sprocket 722. The sprocket rotation mechanism 723 can rotate the sprocket 722 independently. The sprocket rotation mechanism 723 may be configured to include a rotary motor or the like that rotates the sprocket 722.

When the operator inserts the carrier tape 1 into the sprocket 722 closest to the supply guide portion 711 in the sprocket 722, when the sprocket rotation mechanism 723 is operated, the sprocket rotation mechanism 723 can be controlled to carry the carrier tape 1 toward the carrier tape. The storage area DZ of the transport unit 720, the fourth visual inspection device 781, the sealing unit 740, the fifth visual inspection device 782, and the carrier tape winding unit 750 are intermittently transported. The sprocket rotation mechanism 723 can be controlled by a control unit (not shown) that controls the entire package unit 700.

The conveyance rail 724 is attached to the upper side of the conveyance stage 721 so as to guide the conveyance of the carrier tapes 1, 1' with the conveyance stage 721. The conveying rails 724 are arranged at intervals in the width direction of the carrier tape 1, and the side edge portions of the carrier tapes 1, 1' are respectively inserted between the conveying rail 724 and the conveying table 721 to guide the conveyance of the carrier tapes 1, 1'. . The interval of the conveyance rails 724 can be adjusted according to the interval adjustment of the first and second conveyance stages 721a, 721b.

As an example, referring to FIG. 10, the cover tape supply unit 730 may include a cover tape supply reel 731, a cover tape supply reel rotation mechanism 732, a cover tape guide roller 733, and a cover tape tension guide portion 734.

The cover tape supply reel 731 is fed by rotating the cover tape 3 from the wound state. The cover tape supply reel 731 is rotatably provided on the supply reel support table 730a on the transport table 721. The cover tape supply reel rotation mechanism 732 rotates the cover tape supply reel 731 and may include a rotary motor such as a torque motor. The cover tape guide roller 733 guides the conveyance of the cover tape 3 supplied from the cover tape supply reel 731 to the carrier tape 1 in which the semiconductor element 2 is housed.

The cover tape tension guiding portion 734 applies a set tension to the cover tape 3 which is unwound from the cover tape supply reel 731. The cover tape tension guiding portion 734 includes a movable roller 734a that linearly moves on the conveying path of the cover tape 3, and a wire that pulls or unwinds the cover tape 3 as the movable roller 734a linearly reciprocates The actuator 734b can thereby impart a set tension to the cover tape 3.

As an example, referring to FIG. 11, the sealing unit 740 may include a pair of thermal bonding mechanisms 741 that thermally bond both side edge portions of the cover tape 3 to the carrier tape 1.

Each thermal bonding mechanism 741 can include a blade 742, a heater 743, a blade mounting block 744, a mounting block support 745, and a mounting block drive mechanism 746. The blade 742 is disposed to face the edge portion of the cover tape 3. The heater 743 heats the blade 742. The heater 743 can be mounted between the blade 742 and the blade mounting block 744. The heater 743 may be constituted by a cartridge type heater. The blade mounting block 744 mounts the blade 742.

The mounting block support table 745 supports a pivoting action of the blade mounting block 744 to bring the blade 742 into contact with or separate from the edge portion of the cover tape 3. Therefore, the blade 742 is lowered in contact with the edge portion of the cover tape 3 by being heated by the heater 743, whereby the cover tape 3 can be thermally bonded to the carrier tape 1. The mounting block drive mechanism 746 causes the blade mounting block 744 to perform a swinging motion. Mounting block drive mechanism 746 can be constructed including a cylinder. The cylinder main body of the cylinder is hinged to the cylinder support base 747, and the cylinder rod is hinged to the vane mounting block 744, whereby the cylinder rod can swing the vane mounting block 744 by the telescopic action.

When the width of the carrier tape 1 is changed, the interval of the thermal bonding mechanism 741 can be changed by the interval adjusting mechanism 748 in accordance with the changed width of the carrier tape 1. The interval adjusting mechanism 748 may include a linear actuator that linearly moves the thermal bonding mechanism 741 in a direction parallel to the width direction of the carrier tape 1, and a linear guide that guides linear movement of the thermal bonding mechanism 741. The linear actuator may be constituted by a rotary motor and a ball screw for converting a rotational motion of the rotary motor into a linear motion, or may be constituted by a linear motor or a cylinder.

As an example, referring to FIG. 12, the carrier tape winding unit 750 may include a winding reel rotating mechanism 752, a winding reel linear moving mechanism 753, and a winding reel lifting mechanism 754.

The winding reel rotating mechanism 752 passes the winding reel 751 along the load to be wound When the belts 1' are arranged in a direction parallel to the width direction and are mounted, the belts 1' are wound around the respective windings, and the carrier tape 1' is wound around the winding reel 751 at the winding position. The winding reel rotating mechanism 752 may include a shaft 752a and a rotation motor 752b. The shaft 752a is rotatably supported by the shaft support base 752c. The shaft 752a can be inserted into the center of each of the winding reels 751 to arrange the winding reels 751 in a row. The shaft 752a may be inserted and coupled to the winding reel 751 in such a manner that the winding reel 751 is rotated together during rotation. The rotary motor 752b provides a rotational force to the shaft 752a through the pulley and the belt.

The winding reel linear movement mechanism 753 linearly moves the winding reel rotating mechanism 752 in a direction parallel to the arrangement direction of the winding reel 751, thereby sequentially moving the winding reel 751 in accordance with the winding position. That is, when the carrier tape 1 is completed, the winding of the empty winding reel 751 at the front end of the winding position is completed, and the winding reel linear moving mechanism 753 can make the subsequent empty winding reel 751 correspond to the winding position. Move on the ground. Therefore, the exchange of the winding reel 751 can be realized in an automatic manner.

The winding reel linear movement mechanism 753 may include a level support table 753a, a level shifting linear guide portion 753b, and a level shifting linear actuator 753c. The level shifting linear guide portion 753b guides the winding reel rotating mechanism 752 so as to be linearly movable in the horizontal direction. The horizontal movement linear guide portion 753b includes a rail attached to the level support table 753a, and a slider attached to the shaft support base 752c of the winding reel rotation mechanism 752 to be coupled to the rail so as to be linearly movable. The level shifting linear actuator 753c may be constituted by a rotary motor and a ball screw for converting a rotary motion of the rotary motor into a linear motion, or may be constituted by a linear motor or a cylinder.

The winding reel lifting mechanism 754 raises and lowers the winding reel 751 by raising and lowering the winding reel linear moving mechanism 753. The winding reel lifting mechanism 754 raises the empty winding reel 751 in accordance with the height of the winding position. In this state, as the carrier tape 1' is wound around the winding reel 751 and the radius wound around the winding reel 751 is increased, the reel reeling mechanism is wound. 754 enables the winding reel 751 to decrease in amplitude by the increase in the winding radius of the carrier tape 1'. Therefore, the carrier tape 1' can be adjusted in such a manner that the winding start height with respect to the winding reel 751 is fixed.

The winding reel lifting mechanism 754 may include a vertical support table 754a, a lifting linear guide 754b, and a lifting linear actuator 754c. The vertical support table 754a is supported by the chassis 701. The lifting linear guide portion 754b guides the lifting and lowering of the winding reel linear movement mechanism 753. The lifting linear guide portion 754b includes a rail attached to the vertical support base 754a and a slider attached to the horizontal support base 753a of the winding reel linear movement mechanism 753 to be linearly movable to be coupled to the rail. The lifting linear actuator 754c may be constituted by a rotary motor and a ball screw for converting a rotational motion of the rotary motor into a linear motion, or may be constituted by a linear motor or a cylinder.

On the other hand, as shown in Fig. 13, the winding radius of the carrier tape 1' can be detected by the sensor mechanism 755. The winding reel lifting mechanism 754 can be controlled to lower the winding reel 751 based on information detected by the sensing mechanism 755. The sensing mechanism 755 can include a sensing rod 755a, a sensing rod guide 755c, an elastic member 755d, and a position sensor 755e.

The sensing lever 755a can be brought into contact with the carrier tape 1' in the winding reel 751 by a roller 755b attached to the lower end. The sensing lever guiding portion 755c guides the linear movement of the sensing lever 755a in a direction in which the sensing lever 755a approaches or separates from the carrier tape 1' in the winding reel 751. The sensor lever guide portion 755c can be supported by the reel support table 770a of the attachment unit 770. The elastic member 755d can maintain the state in which the roller 755b of the sensing lever 755a is in contact with the carrier tape 1' in the winding reel 751 by applying an elastic force to the sensing lever 755a. The position sensor 755e detects the position of the sensing lever 755a. When the winding radius of the carrier tape 1' increases, the position of the sensing lever 755a changes. At this time, the position sensor 755a can detect the winding radius of the carrier tape 1' by detecting the position of the sensing lever 755a.

As an example, referring to FIG. 14, the cutting unit 760 may include a cutting table 761, a cutter 762, and a cutter linear movement mechanism 763.

The cutting table 761 can be attached to the end of the conveying table 721 adjacent to the carrier tape winding unit 750. The cutter 762 is disposed such that the carrier tape 1' passes through a gap partitioned from the cutting table 761, and the carrier tape 1' is cut by linearly moving across the cutting table 761. The cutter linear movement mechanism 763 causes the cutter 762 to move linearly.

The cutter 762 is disposed on the lower side of the cutting table 761, and the cutter linear movement mechanism 763 can raise and lower the cutter 762. Therefore, the cutter 762 rises by the cutter linear movement mechanism 763 and intersects with the cutting table 761, whereby the carrier tape 1' can be cut. The cutter 762 can be guided up and down by the cutter support table 764. The cutter linear movement mechanism 763 may be constituted by a cylinder or the like.

As an example, referring to FIGS. 15 to 17, the attachment unit 770 may include an adhesive tape supply reel 771, an adhesive tape supply reel rotation mechanism 772, a peeler 773, an adhesive tape pressing mechanism 774, and a release paper recovery reel. 775, and a release paper recovery reel rotation mechanism 776.

The adhesive tape supply reel 771 is supplied by unwinding the adhesive tape 4 from the state of being wound by rotation. Here, the pressure-sensitive adhesive tape 4 is configured such that the pressure-sensitive adhesive sheet 4a is arranged in a line on one surface of the release paper 4b. The adhesive tape supply reel 771 is rotatably provided to the reel support table 770a. The adhesive tape supply reel rotating mechanism 772 rotates the adhesive tape supply reel 771 and may be constituted by a rotary motor such as a torque motor.

The peeler 773 peels the adhesive sheet 4a from the release paper 4b in the adhesive tape 4 supplied from the adhesive tape supply reel 771, so that the adhesive sheet 4a spans the inner peripheral surface of the winding reel 751 and the carrier tape 1 The front end of the 'attachment' or is attached across the rear end of the carrier tape 1' and the wound portion of the carrier tape 1'. By adhering the PSA sheet 4a across the inner circumferential surface of the winding reel 751 and the leading end of the carrier tape 1', the carrier tape 1' can be wound with its leading end fixed to the winding reel 751. Further, by attaching the adhesive sheet 4a across the rear end of the carrier tape 1' and the wound portion of the carrier tape 1', the carrier tape 1' can be fixed so as not to be completed from the winding of the winding reel 751. The state is unlocked.

The stripper 773 is provided with a pointed nose 773a. When the pressure-sensitive adhesive tape 4 is fed from the adhesive tape to the protruding portion 773a of the peeling device 773, the pressure-sensitive adhesive sheet 4a can be peeled off from the release paper 4b and supplied to the winding reel 751 side.

The adhesive sheet pressing mechanism 774 pressurizes the adhesive sheet 4a attached to the inner circumferential surface of the winding reel 751 and the leading end of the carrier tape 1', or the rear end of the carrier tape 1' and the carrier tape 1' The pressure-sensitive adhesive sheet 4a to which the wound portion is attached is pressurized. The adhesive sheet pressurizing mechanism 774 may include a pressurizing rod 774a, a pressurizing rod guide portion 774c, and a pressurizing rod elevating mechanism 774d.

The pressurizing rod 774a can be in contact with the adhesive sheet 4a by a roller 774b attached to the lower end thereof. The pressurizing rod 774a may be disposed such that its lower end faces the center of the winding reel 751. The pressing lever guide portion 774c guides the lifting and lowering of the pressing lever 774a. The pressurizing rod guide portion 774c is supported by the reel support base 770a. The pressurizing lever lifting mechanism 774d raises and lowers the pressurizing lever 774a. Therefore, the pressurizing rod 774a can be lowered by the pressurizing rod elevating mechanism 774d, and the adhesive sheet 4a can be pressurized toward the carrier tape 1' by the roller 774b. The pressurizing rod lifting mechanism 774d may be configured to include a cylinder or the like.

The release paper recovery reel 775 winds the release paper 4b from which the PSA sheet 4a is peeled off. The release paper recovery reel 775 is rotatably provided to the reel support table 770a. The release paper recovery reel rotating mechanism 776 rotates the release paper recovery reel 775 and may be constituted by a rotary motor such as a torque motor.

Further, the adhesive tape tension guiding portion 777 is provided between the adhesive tape supply reel 771 and the peeler 773, so that the set tension can be imparted to the adhesive tape 4. The adhesive tape tension guiding portion 777 may be configured in the same or similar manner as the cover tape tension guiding portion 734. The release paper conveying mechanism 778 is disposed between the peeling device 773 and the release paper recovery reel 775, so that the release paper 4b can be conveyed. The release paper conveying mechanism 778 may be configured to include a conveying roller and a rotary motor that rotates the conveying roller.

Next, an operation example of the above-described packaging unit 700 will be described.

First, the operator unloads the carrier tape 1 from the carrier tape supply reel 710 and transports it to the carrier tape transport unit 720, and inserts the sawtooth 722a of the sprocket 722 closest to the front end of the carrier tape 1 in the sprocket 722 into the carrier tape. 1 The conveying hole 1b at the front end. At this time, the carrier tape 1 is provided on the transport table 721 such that the entrance of the pocket 1a faces upward.

Thereafter, the operator operates the packaging unit 700. Thus, the carrier tape transport unit 720 transports the carrier tape 1 to the storage area DZ. The package pickup device 800 picks up the defective semiconductor element 2 from the semiconductor inspection device and conveys it to the storage area DZ, and then stores it in the pocket 1a of the carrier tape 1 respectively.

Next, the carrier tape transport unit 720 transports the carrier tape 1 containing the semiconductor element 2 to the fourth visual inspection device 781, and the fourth visual inspection device 781 checks the carrier tape 1 in which the semiconductor element 2 is housed. Next, the carrier tape transport unit 720 transports the carrier tape 1 that has been inspected by the fourth visual inspection device 781 to the sealing unit 740. At this time, the cover tape supply unit 730 supplies the cover tape 3 so as to cover the pocket 1a of the carrier tape 1. Thus, the sealing unit 740 bonds the cover tape 3 to the carrier tape 1 to seal the pocket 1a of the carrier tape 1.

Next, the carrier tape transport unit 720 transports the sealed carrier tape 1' to the fifth visual inspection device 782, and the fifth visual inspection device 782 checks the sealed carrier tape 1'. Next, the carrier tape transport unit 720 transports the carrier tape 1' in the sealed state which has passed the fifth visual inspection device 782 and completes the inspection to the winding reel 751 at the winding position. Thus, the attachment unit 770 adheres the leading end of the carrier tape 1' in the sealed state to the inner circumferential surface of the winding reel 751 via the adhesive sheet 4a.

Next, the winding reel rotating mechanism 752 rotates the winding reel 751 to wind the carrier tape 1' in the sealed state around the winding reel 751. At the same time, the winding reel lifting mechanism 754 increases the winding radius of the carrier tape 1' in which the winding reel 751 is lowered in a sealed state.

Next, the cutting unit 750 cuts the carrier tape 1' in a sealed state in correspondence with the lot of the semiconductor element 2 to be wound around the winding reel 751. Next, the attachment unit 770 attaches the rear end of the carrier tape 1' in the sealed state to the wound portion of the carrier tape 1' via the adhesive sheet 4a, thereby It is possible to prevent the carrier tape 1' from being unraveled.

Thereafter, the winding reel linear moving mechanism 753 moves the subsequent empty winding reel 751 in correspondence with the winding position, and the winding reel lifting mechanism 754 raises the subsequent empty winding reel 751 to the winding position. Thereafter, the process of winding the carrier tape 1' in the sealed state on the exchanged empty winding reel 751 is carried out in the same manner as the aforementioned process.

As described above, after the carrier tape 1 is initially supplied from the carrier tape supply reel 710 to the carrier tape transport unit 720, the semiconductor element 2 is housed in the carrier tape 1 and sealed, and the sealed carrier tape 1' is wound around The process of winding the reel 751 and the process of exchanging the reel 751 are automated, so that the packaging work efficiency of the semiconductor element 2 can be improved.

The present invention has been described with reference to an embodiment shown in the drawings, but this is merely exemplary, and those skilled in the art will be able to understand other embodiments capable of carrying out various modifications and equivalents. . Therefore, the true scope of the invention should be limited only by the appended claims.

100‧‧‧ body

210‧‧‧Loading Department

220‧‧‧ Empty tray supply department

240‧‧‧Defective Storage Department

250‧‧‧ Empty tray storage

260‧‧‧Unloading Department

320‧‧‧Second Visual Inspector

330‧‧‧ Third Visual Inspector

500‧‧‧ converter

700‧‧‧Packaging Department

800‧‧‧Package Picker

Claims (11)

A semiconductor element inspection apparatus includes: a body; a loading unit for loading a tray in which a semiconductor element to be inspected is stored; an inspection unit that inspects a semiconductor element housed in a tray conveyed from the loading unit; and an empty tray supply a loading unit that includes a first waiting area for waiting for an empty tray transported from the empty tray supply unit, a second standby area for waiting for a tray in which the semiconductor element for inspection is stored, and a buffer area in which a separate tray of the semiconductor element for inspection is temporarily stored; and a defective product storage unit that receives and stores a tray in which the semiconductor element classified as a defective product is received from the first standby area; a tray storage unit that receives and loads an empty tray from the buffer area; and an unloading unit that receives and stores a tray in which a semiconductor element classified as a good product or a state in which all of the semiconductor elements are stored is received from the second standby area; Connecting to the loading unit, the empty tray supply unit, the defective product storage unit, the empty tray storage unit, and the unloading unit a first tray conveying portion, a second tray conveying portion, a third tray conveying portion, a fourth tray conveying portion, and a fifth tray conveying portion of the conveying tray; a converter disposed on an upper side of the body to be capable of Reciprocating between the first tray conveying portion, the second tray conveying portion, the third tray conveying portion, the fourth tray conveying portion, and the fifth tray conveying portion; and a sorting pickup configured to be capable of being in the first standby area And reciprocating between the second standby area and the buffer area, and half of the trays accommodated in the second standby area In the conductor element, the defective semiconductor element is picked up and stored in the empty tray of the first standby area, and the qualified semiconductor element is picked up and stored in the semiconductor element housed in the tray of the buffer area. a tray of the second standby area; and a packaging unit that receives the qualified semiconductor component housed in the tray of the second standby area through the package pickup and packages the overload tape and the cover tape. The semiconductor element inspection device according to claim 1, wherein the inspection unit includes: a first visual inspection device that is housed in a tray conveyed from the loading portion by the first tray conveying portion Two-dimensional inspection of one side of the semiconductor element; and a second visual inspection device that performs two-dimensional inspection on the other side of the semiconductor element housed in the tray conveyed by the first visual inspection device to the classification unit; The converter is stacked such that the empty tray is turned upside down on the upper portion of the tray in which the semiconductor element of the first visual inspection device has been stored, and then turned upside down, and the semiconductor element that is turned upside down is moved to the empty tray. Delivery to the second visual inspection device. The semiconductor element inspection apparatus according to claim 2, wherein the inspection unit further includes a third visual inspection device, and the third visual inspection device is housed in the first tray from the loading portion. One side of the semiconductor element in the tray being transported is three-dimensionally inspected. The semiconductor component inspection apparatus according to claim 1, wherein the packaging unit includes a carrier tape supply reel that supplies a carrier tape, and a plurality of the carrier tapes are arranged in a row along the longitudinal direction for storage. a pocket of a semiconductor element; a carrier tape transport unit that transports the carrier tape received from the carrier tape supply reel in one direction with each inlet of the pocket facing upward; a cover tape supply unit that supplies a cover tape when the carrier tape is transported by the carrier tape transport unit to load a carrier tape of the semiconductor component that is supplied to the storage region of the carrier tape transport unit by the package pickup device a pocket covering; a sealing unit that bonds the cover tape received from the cover tape supply unit to the carrier tape to seal the pocket of the carrier tape; and a carrier tape winding unit that sequentially turns the winding reel in an empty state Winding a winding position of the carrier tape sealed by the sealing unit, and winding the carrier tape around the winding reel respectively moved to the winding position; a cutting unit that will move from the sealing unit The carrier tape transported by the tape winding unit is cut corresponding to the length to be wound around the winding reel, respectively; and an attachment unit that is loaded when the carrier tape is wound around the winding reel The leading end of the belt is attached to the winding reel, and the rear end of the carrier tape cut by the cutting unit is attached to the wound portion of the carrier tape. The semiconductor component inspection apparatus according to claim 4, wherein the packaging section further includes: a fourth visual inspection device disposed between the storage area of the carrier tape transport unit and the cover tape supply unit, A state in which the carrier tape in which the semiconductor element is housed is inspected; and a fifth visual inspection device disposed between the sealing unit and the cutting unit to inspect a state of the carrier tape sealed by the sealing unit. The semiconductor component inspection apparatus according to claim 4, wherein the carrier tape winding unit includes: a winding reel rotation mechanism that causes the winding reel to be wound along a carrier tape to be wound a winding reel in which the carrier tape is wound around the winding axis in a state in which the width directions are arranged in parallel and is mounted, and the carrier tape is wound around the winding axis; a winding reel linear moving mechanism that linearly moves the winding reel rotating mechanism in a direction parallel to an arrangement direction of the winding reel, so that the winding reel and the winding position are sequentially And a winding reel lifting mechanism that raises and lowers the winding reel by moving the winding reel linear movement mechanism. The semiconductor component inspection apparatus according to claim 4, wherein the attachment unit comprises: an adhesive tape supply reel which is rotated to adhere an adhesive sheet in a row on one surface of the release paper. The adhesive tape is unwound from the wound state for feeding; the adhesive tape is supplied to the reel rotating mechanism, which feeds the adhesive tape to the reel; and the peeler supplies the reel from the adhesive tape In the supplied adhesive tape, the adhesive sheet is peeled off from the release paper, and the adhesive sheet is attached across the inner circumferential surface of the winding reel and the front end of the carrier tape, or across the rear end of the carrier tape and the carrier tape. Attached to the wound portion; an adhesive sheet pressing mechanism that pressurizes the adhesive sheet attached to the inner circumferential surface of the winding reel and the leading end of the carrier tape, or to the rear end of the carrier tape and The adhesive sheet attached to the wound portion of the carrier tape is pressurized; the release paper recovery reel is wound with the release sheet from which the adhesive sheet is peeled off; and the release paper recovery reel rotation mechanism is provided The release paper rewinds the reel. The semiconductor component inspection apparatus of claim 4, wherein the sealing unit comprises a pair of thermal bonding mechanisms that thermally bond both side edge portions of the cover tape to the carrier tape, each of the thermal bonding The mechanism includes: a blade disposed opposite the edge portion of the cover tape; a heater that heats the blade; and a blade mounting block that mounts the blade; A block support table that supports a swinging motion of the blade mounting block to contact or separate the blade from an edge portion of the cover tape, and a mounting block driving mechanism that causes the blade mounting block to perform a swinging motion. The semiconductor component inspection apparatus according to claim 4, wherein the carrier tape conveying unit comprises: a conveying table that receives a carrier tape from the carrier tape supply reel; and a sprocket that passes through to insert each serration a carrier tape is rotated in a state of a conveyance hole of a carrier tape supplied to the conveyance table; a sprocket rotation mechanism that rotates the sprocket; and a conveyance rail that is attached to an upper side of the conveyance table to The transport of the carrier tape is guided between the transport track and the transport station. The semiconductor element inspection apparatus according to claim 4, wherein the cover tape supply unit includes: a cover tape supply reel which is supplied by unwinding the cover tape from the wound state; the cover tape supply a reel rotating mechanism that feeds the cover tape to the reel; and a cover tape guiding roller that guides conveyance of the cover tape supplied from the cover tape supply reel to the carrier tape on which the semiconductor element is housed; A cover tape tension guiding portion that applies a set tension to the cover tape that is unwound from the cover tape supply reel. The semiconductor component inspection apparatus according to claim 4, wherein the cutting unit comprises: a cutting table; and a cutter configured to separate the carrier tape from the cutting table by the cutter a gap, and cutting the carrier tape by linearly moving across the cutting table; and a cutter linear movement mechanism that linearly moves the cutter.