TW201726973A - 覆Ｎｉ銅粉及使用其之導電性糊、導電性塗料、導電性片以及覆Ｎｉ銅粉之製造方法 - Google Patents

覆Ｎｉ銅粉及使用其之導電性糊、導電性塗料、導電性片以及覆Ｎｉ銅粉之製造方法 Download PDF

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Publication number
TW201726973A
TW201726973A TW105131305A TW105131305A TW201726973A TW 201726973 A TW201726973 A TW 201726973A TW 105131305 A TW105131305 A TW 105131305A TW 105131305 A TW105131305 A TW 105131305A TW 201726973 A TW201726973 A TW 201726973A
Authority
TW
Taiwan
Prior art keywords
copper powder
coated
copper
dendritic
alloy
Prior art date
Application number
TW105131305A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroshi Okada
Original Assignee
Sumitomo Metal Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015190482A external-priority patent/JP2017066445A/ja
Priority claimed from JP2015190479A external-priority patent/JP2017066442A/ja
Priority claimed from JP2015190481A external-priority patent/JP2017066444A/ja
Priority claimed from JP2015190480A external-priority patent/JP2017066443A/ja
Priority claimed from JP2015192151A external-priority patent/JP2017066463A/ja
Application filed by Sumitomo Metal Mining Co filed Critical Sumitomo Metal Mining Co
Publication of TW201726973A publication Critical patent/TW201726973A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C5/00—Electrolytic production, recovery or refining of metal powders or porous metal masses
    • C25C5/02—Electrolytic production, recovery or refining of metal powders or porous metal masses from solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Powder Metallurgy (AREA)
TW105131305A 2015-09-28 2016-09-29 覆Ｎｉ銅粉及使用其之導電性糊、導電性塗料、導電性片以及覆Ｎｉ銅粉之製造方法 TW201726973A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015190482A JP2017066445A (ja) 2015-09-28 2015-09-28 ニッケルコート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート、並びにニッケルコート銅粉の製造方法
JP2015190479A JP2017066442A (ja) 2015-09-28 2015-09-28 Ｎｉコート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート、並びにＮｉコート銅粉の製造方法
JP2015190481A JP2017066444A (ja) 2015-09-28 2015-09-28 Ｎｉコート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート、並びにＮｉコート銅粉の製造方法
JP2015190480A JP2017066443A (ja) 2015-09-28 2015-09-28 Ｎｉコート銅粉、及びそれを用いた導電性ペースト、導電性塗料、導電性シート
JP2015192151A JP2017066463A (ja) 2015-09-29 2015-09-29 Ｎｉコート銅粉及びそれを用いた導電性ペースト、導電性塗料、導電性シート、並びにＮｉコート銅粉の製造方法

Publications (1)

Publication Number Publication Date
TW201726973A true TW201726973A (zh) 2017-08-01

Family

ID=58427538

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131305A TW201726973A (zh) 2015-09-28 2016-09-29 覆Ｎｉ銅粉及使用其之導電性糊、導電性塗料、導電性片以及覆Ｎｉ銅粉之製造方法

Country Status (2)

Country Link
TW (1) TW201726973A (fr)
WO (1) WO2017057231A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6990437B2 (ja) * 2019-06-14 2022-01-12 清川メッキ工業株式会社 樹枝状ニッケル結晶粒子およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4182234B2 (ja) * 2002-09-20 2008-11-19 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用銅粉およびその製造方法
JP6159505B2 (ja) * 2010-12-28 2017-07-05 三井金属鉱業株式会社 扁平銅粒子

Also Published As

Publication number Publication date
WO2017057231A1 (fr) 2017-04-06

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