TW201703600A - Printed wiring board manufacturing method and printed wiring board - Google Patents

Abstract

The present invention comprises: a preparation step for preparing a laminate (2) having a structure in which a patterned conductive layer (4) is laminated on the surface of an insulating layer (3); a first protective film forming step for forming a first protective film (11) by applying an insulating material (10) by means of an inkjet system onto a first print region (17) which is on a surface of the laminate and which surrounds at least a part of the conductive layer in an exposed manner; and a second protective film forming step for forming a second protective film (12) by applying the insulating material (10) by means of an inkjet system onto a second print region (19) covering at least a part of the laminate which is exposed on the surface of the first protective film and in the region inside the first protective film. In the second protective film forming step, inkjet drawing is performed with a resolution higher than that in the first protective film forming step.

Description

Printed wiring substrate manufacturing method and printed wiring substrate

The present invention relates to a method of manufacturing a printed wiring board and a printed wiring board manufactured by the method of manufacturing the printed wiring board, and relates to printing a solder resist by an inkjet printer. A method of manufacturing a printed wiring board and a printed wiring board.

A printed wiring board has been used as a substrate for mounting electronic components such as a semiconductor chip, a resistor, and a capacitor. A conductive pad for mounting the electronic component or a wiring pattern for electrically connecting the electronic component is formed on the surface of the printed wiring board. Moreover, from the viewpoint of preventing corrosion and damage of the conductive pad and the wiring pattern and not adhering solder or the like to an unnecessary portion, a conductive pad and a wiring pattern are not formed on the surface of the printed wiring board. The area is formed with a coating layer composed of a solder resist.

As a method of forming a coating layer on the surface of a printed wiring board, a method of patterning using a photolithography technique after applying a solder resist to the entire surface has been known. Again For other methods, a screen printing method using a printing plate and a squeegee in which an opening pattern is formed in a region other than the conductive pad and the wiring pattern is also known.

However, in the case of using the photolithography technique described above and the case of the screen printing method, a photomask corresponding to the region in which the coating layer is formed is required, so that various printed wiring substrates are manufactured. In the case of the case, a mask corresponding to the type is required, and problems such as the manufacturing cost of the mask and the storage place may occur. Moreover, since the mask and the squeegee are consumable parts, maintenance and exchange are required, and it is also considered to be a problem. As a method for solving such a problem, Patent Document 1 and Patent Document 2 have proposed a method of printing a solder resist by performing ejection control by an inkjet method. Then, in the inkjet printing method, the drawing is performed with a certain resolution using a desired image, and the same image is used for re-drawing (that is, coating a plurality of times), thereby ensuring that the image can be secured. A coating layer of film thickness that is desired to be reliable.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2001-332840.

Patent Document 2: Japanese Laid-Open Patent Publication No. 2006-114807.

However, when a higher-definition drawing is performed in excess of the resolution of the inkjet head, it is necessary to move the head toward the sub-scanning direction a plurality of times, and to increase dots in a certain area. Therefore, the number of times of printing in one drawing using the desired image will be increased. Further, when the resolution in the main scanning direction is increased, it is necessary to reduce the printing speed, so that the tact time cannot be improved and the productivity of the printed wiring board can be lowered.

On the other hand, when printing is performed while reducing the resolution, the gap between dots is widened, a sufficient film thickness cannot be secured, and it is difficult to obtain sufficient reliability as a printed wiring board. Further, when it is desired to secure a necessary film thickness, the number of times of drawing using a desired image is increased, so that it is difficult to reproduce the printing shape, and it is difficult to secure the coating layer accompanying the positional shift of each drawing. The stability of its own shape.

The present invention has been developed in view of such a problem, and an object of the present invention is to provide a method for producing a printed wiring board capable of ensuring the stability of the shape of the coating layer itself while improving the production time and the stability of the shape. A low-cost printed wiring substrate with a higher coating layer.

In order to achieve the above object, a method of manufacturing a printed wiring board according to the present invention includes a preparation step of preparing a laminated body having a structure in which a conductor layer patterned on a surface of an insulating layer is laminated; first protection a film forming step of coating an insulating material on the surface of the laminate body and exposing at least a portion of the conductor layer and surrounding the conductive layer to form a first protective film; and a second protective film a forming step of coating an insulating material by an inkjet method to form at least a portion of the laminated body exposed on an inner region of the first protective film and a second printing region of the entire surface of the first protective film a second protective film; the second protective film forming step is performed by inkjet drawing by a resolution higher than a resolution in the first protective film forming step.

In order to achieve the above object, a printed wiring board of the present invention includes a laminated body including a laminated structure in which an insulating layer and a conductor layer patterned on a surface of the insulating layer are laminated, and a coating layer in which The surface of the laminated body is formed by exposing at least a part of the conductor layer and surrounding the conductive layer; the coating layer is provided with at least a first protective film and a second protective film, and the first protective film is on the surface of the laminated body At least a part of the conductor layer is exposed and surrounded, and the second protective film covers at least a part of the laminated body exposed in an inner region of the first protective film and the entire surface of the first protective film.

According to the present invention, it is possible to provide a method for producing a printed wiring board capable of ensuring the stability of the shape of the coating layer while improving the production time, and a low-cost printing having a coating layer having a high dimensional stability. Wiring board.

1, 1'‧‧‧Printed wiring substrate

2, 2'‧‧‧ laminated body

3‧‧‧Insulation

3a‧‧‧ first surface

4, 4'‧‧‧ conductor layer

4a‧‧‧ side

10‧‧‧ solder resist

11, 11'‧‧‧ first protective film

11a‧‧‧ first surface

11b‧‧‧ inside

12, 12'‧‧‧Second protective film

13, 13' ‧ ‧ coating

14‧‧‧Inkjet head

15‧‧‧UV light source

16‧‧‧Print head

17‧‧‧First printing area

17a‧‧‧ inner edge

18‧‧‧Box area

19‧‧‧Second printing area

20‧‧‧Box area

A, D‧‧‧ separation distance

G‧‧‧ size

X‧‧‧ main scanning direction

Y‧‧‧Sub Scanning Direction

Fig. 1 is a front elevational view showing a laminated body of a printed wiring board constituting an embodiment of the present invention.

Fig. 2 is a cross-sectional view showing a laminated body of a printed wiring board taken along line II-II of Fig. 1.

Fig. 3 is a cross-sectional view showing a manufacturing step of the printed wiring board of the embodiment similar to Fig. 2;

Fig. 4 is a schematic front view showing a manufacturing step of a printed wiring board according to an embodiment of the present invention.

Fig. 5 is a schematic front view showing a manufacturing step of a printed wiring board according to an embodiment of the present invention.

Fig. 6 is a cross-sectional view showing a manufacturing step of the printed wiring board of the embodiment similar to Fig. 2;

Fig. 7 is a schematic front view showing a manufacturing step of a printed wiring board according to an embodiment of the present invention.

Fig. 8 is a schematic front view showing a manufacturing step of a printed wiring board according to an embodiment of the present invention.

Fig. 9 is a cross-sectional view showing a manufacturing step of the printed wiring board of the embodiment similar to Fig. 2;

Fig. 10 is a cross-sectional view showing a manufacturing step of a printed wiring board according to a modification similar to Fig. 2 .

Hereinafter, embodiments of the present invention will be described in detail based on embodiments with reference to the drawings. The present invention is not limited to the contents described below, and can be arbitrarily changed and implemented without departing from the spirit and scope of the invention. In addition, the drawings used in the description of the embodiments schematically show the printed wiring board of the present invention and its constituent members, and are partially emphasized, enlarged, reduced, or omitted for the sake of thorough understanding, and there are The scale, shape, and the like of the printed wiring board and its constituent members are accurately displayed. In addition, various numerical values used in the examples are also shown as an example, and various changes can be made as needed.

[Examples]

Hereinafter, the manufacturing steps of the printed wiring board according to the embodiment of the present invention will be described in detail with reference to FIGS. 1 to 8. Here, FIG. 1 is a front view of a laminated body constituting the printed wiring board of the present embodiment. 2 is a cross-sectional view of the laminated body taken along line II-II of FIG. 1. 3, FIG. 6, and FIG. 9 are cross-sectional views showing the manufacturing steps of the printed wiring board similar to those in FIG. 2. 4, 5, 7, and 8 are schematic front views of the manufacturing steps of the printed wiring board of the present embodiment.

First, as shown in FIG. 1 and FIG. 2, a laminated body 2 as a constituent member of the printed wiring board 1 of the present embodiment is prepared (preparation step). In the present embodiment, as the laminated body 2, a base material having a structure in which an insulating layer 3 and a conductor layer 4 formed on the first surface 3a of the insulating layer 3 are laminated is assumed. Here, the conductor layer 4 is applied to and mounted on the printed wiring board 1 The connection terminals of the electronic components such as the conductor chip, the resistor, and the capacitor are patterned correspondingly or patterned to form a desired electrical wiring.

In addition, in FIG. 1 and FIG. 2, in order to facilitate understanding of the features of the present invention and convenience of description, only one conductor layer 4 in a dot shape is described. However, in a general printed wiring board, a plurality of dots are formed. A plurality of wiring patterns. Further, the laminated body 2 is assumed to be composed of one insulating layer 3 and one conductive layer 4 for the same reason. However, in a general printed wiring board, a plurality of insulating layers and a plurality of internal wirings are laminated. Each of the conductor layers is formed with a via hole, a through hole, and the like.

Next, a coating device for applying the solder resist 10 as an insulating material is used, and inkjet drawing depending on the ink jet method is performed, thereby forming a first protective film 11 and a second protective film 12 which will be described later. Coating layer 13. In the present embodiment, as shown in FIG. 3, the coating apparatus includes an inkjet head 14 and a print head 6 composed of an ultraviolet (UV) light source 15. According to the configuration of the print head 16 as described above, when the print head 16 is moved in the main scanning direction X and the solder resist 10 is applied, ultraviolet irradiation can be performed immediately after the application. That is, the application and hardening of the solder resist 10 can be performed by moving the print head 16 once in the main scanning direction X. Further, although the resolution of the ink jet head 14 in the present embodiment is 360 dpi, the resolution can be appropriately changed.

As a specific step of forming the coating layer 13, first, the solder resist 10 is applied by an inkjet method so as to expose at least a part of the conductor layer 4 on the surface of the laminated body 2. In particular, in the present embodiment, the solder resist 10 is applied on the first surface 3a of the insulating layer 3 and spaced apart from the formation region of the conductor layer 4. The area in which the solder resist 10 should be applied in this embodiment is the first printing area 17 shown in the attachment point of Fig. 4. That is, the solder resist 10 does not cover the entirety of the first surface 3a of the insulating layer 3, but is applied in such a manner as to expose the peripheral portion of the conductor layer 4. In other words, the first printing region 17 is provided with an opening having a larger size than the conductor layer 4.

Here, the separation distance A from the inner edge 17a of the first printing region 17 to the side surface 4a of the conductor layer 4 is preferably 10 μm or more, and is 100 μm in the present embodiment. Further, the separation distance may be set to be 1 time or more and 20 times or less the dot pitch at the time of forming the second protective film 12 described later.

In the present embodiment, the application of the solder resist 10 to the first printing region 17 is performed by inkjet drawing at a resolution of 720 dpi. Here, since the resolution of the inkjet head 14 is 360 dpi, the coating of the solder resist 10 (ie, forming a dot) is continuously performed in the main scanning direction X for the square region 18 surrounded by a broken line in FIG. 5, and the sub-scanning is performed. The direction Y is shifted and the one-time scanning of the solder resist 10 is applied every other block in the sub-scanning direction Y. Thereby, since the solder resist 10 is applied to all the square regions 18 in the first printing region 17 to form dots, the resolution of 720 dpi can be achieved. here, The block area 18 shown in Fig. 5 is an area for schematically showing the resolution of the ink jet drawing, and one block area 18 is a resolution corresponding to 720 dpi.

More specifically, when the ink jet nozzles in the sub-scanning direction Y are two, the print head 16 is moved in the direction of the arrow B in FIG. 5, and the solder resist 10 is performed. Coating and hardening as the first scan. At this time, the application and hardening of the solder resist 10 can be simultaneously performed in the square region 18 of FIG. 5 and the two rows (the first column and the third column). Further, the moving speed in the main scanning direction X is controlled so that the solder resist 10 can be applied to all of the block regions 18 of the first column and the third column by one scan in the direction of the arrow B. When the first scan is completed, the direction of the print head 16 is rotated by 180°, thereby moving only one block area 18 toward the sub-scanning direction Y. Then, while the print head 16 is moved in the direction of the arrow C of FIG. 5, the application and hardening of the solder resist 10 are simultaneously performed in two rows (the second row and the fourth column) as the second scan. By performing printing of the solder resist 10 by the movement of the main scanning direction X and the sub-scanning direction Y of the printing head 16 as a whole in the first printing area 17, it is possible to utilize a lower resolution ink jet head. 14 to achieve a higher resolution inkjet depiction.

Further, in the description of Fig. 5, for the sake of convenience of explanation, the number of ink jet nozzles in the sub-scanning direction Y is two, but the number of actual ink-jet nozzles is preferably from the viewpoint of productivity improvement. It is more. Also, even if the number of ink jet nozzles is increased, the method of inkjet drawing described above is not changed.

Then, regarding the inkjet drawing of the first printing region 17, the stability of the drawing shape of the first protective film 11 is focused on the reduction in the production time. This is because the drawing shape of the first protective film 11 does not affect the drawing shape of the coating layer 13. This reason will be explained in detail later.

Further, the printing method described above is merely an example, and can be appropriately changed in accordance with the structure of the coating device. For example, when the inkjet head 14 cannot be rotated, the inkjet head 14 may be moved after the completion of the first scanning, and the second scanning may be performed in a direction set to the same direction as the first scanning direction. Further, the degree of repetition described above is appropriately changed in accordance with the resolution of the ink jet head 14 and the resolution required for actual drawing. Furthermore, the amount of the solder resist 10 in each inkjet drawing can also be increased by a multidrop method.

When the first protective film forming step as the ink jet drawing described above is performed, as shown in FIG. 6, the formation region of the conductor layer 4 is separated from the first surface 3a of the insulating layer 3, and is surrounded. A first protective film 11 is formed. Here, since the distance D between the first protective film 11 and the conductor layer 4 corresponds to the distance A from the inner edge 17a of the first printing region 17 to the side surface 4a of the conductor layer 4, in this embodiment. Medium is 100μm.

Next, the first surface 11a of the first protective film 11 is covered, and The solder resist 10 is applied by an inkjet method as a specific coating layer 13 in such a manner that at least a part of the laminate 2 exposed in the inner region of the protective film 11 is formed. In particular, in the present embodiment, the resist is coated in such a manner as to cover a portion of the first surface 11a of the first protective film 11 and a portion of the first surface 3a of the insulating layer 3 exposed in the inner region of the first protective film 11. Flux 10. Here, the solder resist 10 used is the same as that of the user who forms the first protective film 11, and the print head 16 also uses the same. This is to ensure the reliability of the strength and the like of the coating layer 13 described later, and to simplify and shorten the manufacturing steps.

Then, the region in which the solder resist 10 should be applied in this embodiment is the second printing region 19 shown in the attachment point in Fig. 7. That is, the solder resist 10 completely covers the first protective film 11 and does not cover the exposed first surface 3a of the insulating layer 3, but is coated so as to expose the peripheral portion of the conductor layer 4. In other words, the second printing region 19 includes an opening portion that is larger than the conductor layer 4 and smaller than the opening portion of the first printing region 17 described above.

Here, the second printing region 19 is set at a distance of 10 μm or more from the inner side surface 11b of the first protective film 11, preferably further inside (that is, a region closer than the conductor layer 4), which is set in the present embodiment. 40μm.

In the present embodiment, the application of the solder resist 10 to the second printing region 19 is performed by inkjet drawing at a resolution of 1440 dpi. in Since the resolution of the inkjet head 14 is 360 dpi, the solder resist 10 is continuously applied to the square region 20 surrounded by a broken line in FIG. 8 in the main scanning direction X, and is shifted from the sub-scanning direction Y to be repeated in the sub-scanning direction Y. One scan of the solder resist 10 is applied every three squares in the scanning direction Y. Thereby, since the solder resist 10 is applied to all the square regions 20 in the second printing region 19 to form dots, the resolution of 1440 dpi can be achieved. Here, the block area 20 shown in FIG. 8 is an area for schematically displaying the resolution of the ink jet drawing, and one block area 20 is a resolution corresponding to 1440 dpi.

That is, when the second printing area 19 is drawn, inkjet drawing is performed by a higher resolution than when the first printing area 17 is drawn. Therefore, although the inkjet head 14 which is the same as the inkjet drawing is used for the first printing region 17 when inkjet drawing is performed for the second printing region 19, the dot pitch thereof is substantially reduced. In the present embodiment, the dot pitch in the depiction of the first printed area 17 is about 0.035 mm, and the dot pitch in the depiction of the second printed area 19 is about 0.0175 mm.

More specifically, when the number of the inkjet nozzles in the sub-scanning direction Y is two, the print head 16 is moved in the direction of the arrow E of FIG. 8 and the solder resist 10 is applied and cured. As the first scan. At this time, application and hardening of the solder resist 10 can be simultaneously performed in the two rows (the first column and the fifth column) in the block region 20 of FIG. Further, the moving speed in the main scanning direction is controlled so that the solder resist 10 can be applied to all of the block regions 20 of the first row and the fifth column by one scan in the direction of the arrow E. That is, in the present embodiment, the moving speed in the main scanning direction is 0.5 times in the case where the second printing region 19 is ink-jet-drawn as compared with the case where the first printing region 17 is drawn by ink.

When the first scan is completed, the direction of the print head 16 is rotated by 180°, thereby moving only one block area 20 toward the sub-scanning direction Y. Then, while the print head 16 is moved in the direction of the arrow F of FIG. 8, the application and hardening of the solder resist 10 are simultaneously performed in two rows (the second column and the sixth column) as the second scan. By performing printing of the solder resist 10 by the movement of the main scanning direction X and the sub-scanning direction Y of the printing head 16 as a whole in the second printing area 19, it is possible to utilize a lower resolution ink jet head. 14 to achieve a higher resolution inkjet depiction. In particular, in the present embodiment, since the number of printings (i.e., the number of movements in the sub-scanning direction Y) is increased more than the ink-jet drawing in the first printing area 17, a higher resolution than the first printing area 17 can be realized. Under the inkjet depiction.

Then, the inkjet drawing of the second printing region 19 is focused on the stability of the drawing shape of the second protective film 12 in comparison with the decrease in the production time. This is because the drawing shape of the second protective film 12 does not have a large influence on the drawing shape of the coating layer 13. This reason will be explained in detail later.

Further, the printing method described above is merely an example, and can be appropriately changed in accordance with the structure of the coating device.

When the second protective film forming step as the above-described inkjet drawing is performed, as shown in FIG. 9, the first surface 11a of the first protective film 11 is covered and the inner side of the first protective film 11 is exposed. A second protective film 12 is formed in a manner of one portion of the insulating layer 3. Here, the dimension G formed by the second protective film 12 over the inner side surface 11b of the first protective film 11 in the inner region is caused by the setting of the second printing region 19 described above, and is 40 μm in the present embodiment. .

Then, the coating layer 13 is formed through the first protective film forming step and the second protective film forming step described above, and the manufacturing steps of the printed wiring substrate 1 are ended. As is apparent from FIG. 9, in the printed wiring board 1 of the present embodiment, the entire side surface of the first protective film 11 is covered by the second protective film, and the conductor layer 4 can be obtained by the coating layer 13. The protection around. Further, in the present embodiment, the film thickness of the first protective film 11 becomes smaller than the film thickness of the second protective film 12, whereby the shape of the first protective film 11 can be reduced to affect the coating layer 13 itself. The possibility of shape. In addition, the coating amount of the solder resist 10 in the inkjet drawing of the first protective film 11 can be increased by a multi-point method, whereby the film thickness of the first protective film 11 is formed to be larger than that of the second protective film 12. Thicker.

In the present embodiment, since the first protective film 11 is first formed with a relatively low resolution, the production time in the initial stage of formation of the coating layer 13 can be shortened. Also, because the first printing area 17 is covered by the second printing area 19 Since the setting of the inkjet drawing is completed, the drawing shape of the first protective film 11 does not affect the drawing shape of the coating layer 13 itself. Further, since the second protective film 12 is formed while covering the first protective film 11 with a relatively high resolution, the drawing shape of the coating layer 13 itself can be dependent on the drawing shape of the second protective layer 12, Achieve a stable depiction shape.

Therefore, in the present embodiment, the instability of the drawing shape which is a disadvantage of the low-resolution inkjet drawing can be eliminated by the high-resolution inkjet drawing, and the inkjet drawing can be produced by the low-resolution inkjet. Time to compensate for the reduction in the production time of the shortcomings of high resolution inkjet depictions. In other words, in the present embodiment, it is possible to realize a manufacturing method for ensuring the stability of the shape of the coating layer while improving the production time, and further, it is possible to provide a coating having a coating having a high dimensional stability. Printed wiring board 1.

Although in the above-described embodiment, the coating layer 13 is not covered by the conductor layer 4 but separated from the conductor layer 4, as shown in FIG. 10, the coating layer 13' may also be coated with the conductor layer 4'. The outer edge part. Here, Fig. 10 is a cross-sectional view showing a manufacturing step of the printed wiring board 1' according to the modification of Fig. 2 .

As shown in Fig. 10, the coating layer 13' of the modification is formed so as to surround at least a part of the surface of the laminated body 2' and expose the conductor layer 4'. Further, the coating layer 13' of the modification is composed of the first protective film 11' And the second protective film 12' is formed on the surface of the laminated body 2' and exposes at least a portion of the conductive layer 4' and is surrounded by the second protective film 12'. The protective film 11' and at least a part of the laminated body 2' exposed in the inner region of the first protective film 11'. Further, in the modification shown in FIG. 10, the first protective film 11' may be surrounded by the conductor layer 4' while being surrounded, and only the second protective film 12' may be covered by the conductor layer 4'. The edge part.

Here, in the manufacturing method of the printed wiring board 1' of such a variation, only the sizes of the first printing area 17 and the second printing area 19 in the above-described embodiment are different, and other specific manufacturing steps are different. It is the same. Specifically, the first printing region of the modified example is set so as to expose at least a part of the conductor layer 4 ′ (ie, a portion other than the edge portion) on the surface of the laminated body 2 ′, and the variation is The second printing region is set so as to cover at least a part of the surface of the first protective film 11' and the laminated body 2' exposed in the inner region of the first protective film 11' (that is, a portion exposed by the conductor layer 4'). . In addition, other specific manufacturing steps are omitted.

Then, in the above-described embodiment, although the coating layer 13 is formed by one first protective film 11 and one second protective film 12, a plurality of first protective films 11 may be stacked and above The second protective film 12 is formed. In this case, the first protective film forming step in the above-described embodiment is repeated before the second protective film forming step. That is, it can be repeated A repeating step of the first protective film forming step. Thereby, even when the layer thickness of the coating layer 13 is increased in accordance with the required layer thickness of the coating layer 13 or the layer thickness of the conductor layer 4, it is possible to ensure the coating while improving the production time. The stability of the shape of the coating 13 itself.

[Embodiment of the present invention]

A method of manufacturing a printed wiring board according to a first embodiment of the present invention includes a preparation step of preparing a laminated body having a structure in which a conductor layer patterned on a surface of the insulating layer is laminated; a protective film forming step of coating an insulating material on the surface of the laminated body and exposing at least a portion of the conductor layer and surrounding the conductive layer to form a first protective film; and second protecting a film forming step of coating an insulating material by an inkjet method at least a part of the laminated body exposed on an inner region of the first protective film and a second printing region of the entire surface of the first protective film Forming a second protective film; the second protective film forming step performs inkjet drawing by a resolution higher than a resolution in the first protective film forming step.

In the first embodiment, since the first protective film is formed at a relatively low resolution, the initial production time of the coating layer composed of the first protective film and the second protective film can be shortened. . Further, since the inkjet drawing is set so that the second printing area covers the first printing area, the drawing shape at the time of forming the first protective film does not affect the drawing shape of the coating layer itself. Moreover, because after the formation of the first protective film, Since the second protective film is formed while covering the first protective film with a relatively high resolution, the drawing shape of the coating layer itself can be determined depending on the drawing shape at the time of forming the second protective film, thereby realizing a stable drawing shape. Therefore, in the first embodiment, it is possible to ensure the stability of the shape of the coating layer itself while improving the production time.

A method of manufacturing a printed wiring board according to a second embodiment of the present invention is the first embodiment described above, wherein in the first protective film forming step, the surface of the laminated body is spaced apart from the surface a region surrounded by the formation region of the conductor layer as the first printing region; and in the second protective film forming step, the surface of the first protective film and the insulating layer exposed at an inner region of the first protective film are exposed A region of at least a portion of the layer serves as the aforementioned second printing region. Thereby, it is possible to optimize the formation regions of the first protective film and the second protective film, and it is possible to reduce the manufacturing cost.

A method of manufacturing a printed wiring board according to a third embodiment of the present invention is the second aspect of the present invention, wherein in the step of forming the first protective film, the conductor layer is separated from the first protective film The opening distance is set to be 1 time or more and 20 times or less the dot pitch in the second protective film forming step. Thereby, the drawing shape of the coating layer itself can be further reduced by the shape of the drawing when the first protective film is formed.

A method of manufacturing a printed wiring board according to a fourth embodiment of the present invention is In the third embodiment described above, in the first protective film forming step, the distance between the conductor layer and the first protective film is set to 10 μm or more. Thereby, the drawing shape of the coating layer itself can be further reduced by the shape of the drawing when the first protective film is formed.

A method of manufacturing a printed wiring board according to a fifth embodiment of the present invention is any one of the first to fourth embodiments described above, further comprising: repeating steps for The foregoing first protective film forming step is repeated before the second protective film forming step. Thereby, even when the layer thickness of the coating layer is increased in accordance with the required layer thickness of the coating layer or the layer thickness of the conductor layer, the coating layer itself can be ensured while improving the production time. The stability of the shape. In other words, it is possible to ensure the stability of the shape of the coating layer itself while improving the production time, and to easily increase the layer thickness of the coating layer.

A method of manufacturing a printed wiring board according to a sixth embodiment of the present invention is any one of the first to fifth embodiments described above, wherein the first protective film forming step is In the second protective film forming step, the moving speed in the main scanning direction is lowered, and the number of movements in the sub-scanning direction is increased. Thereby, a more stable drawing shape can be realized, and the stability of the shape of the coating layer itself can be ensured while improving the production time.

A printed wiring board according to a seventh embodiment of the present invention has a laminated layer And a coating structure having an insulating layer and a conductor layer patterned on a surface of the insulating layer; and a coating layer on the surface of the laminated body and exposing at least a portion of the conductor layer Forming the coating layer; the coating layer comprising at least a first protective film and a second protective film, wherein the first protective film is on the surface of the laminated body and exposes at least a portion of the conductive layer and surrounds the first protective film The second protective film covers at least a part of the laminated body exposed in an inner region of the first protective film and the entire surface of the first protective film.

In the seventh embodiment, at least a part of the first protective film and the laminated body exposed in the inner region of the first protective film are covered by the second protective film, so that the coating having high stability of shape can be realized. A low-cost printed wiring board coated.

A printed wiring board according to an eighth aspect of the present invention is the seventh aspect of the present invention, wherein the second protective film covers the entire inner side surface of the first protective film. Thereby, the drawing shape of the coating layer itself can be further reduced by the drawing shape at the time of forming the first protective film, and the coating layer having a higher shape stability can be provided.

A printed wiring board according to a ninth embodiment of the present invention is the seventh aspect, wherein the first protective film is on the surface of the laminated body and the conductor layer is spaced apart Forming and surrounding the region; the second protective film is coated on the inner side of the first protective film At least a portion of the insulating layer exposed in the region and the entire surface of the first protective film. Thereby, it is possible to optimize the formation regions of the first protective film and the second protective film, and it is possible to achieve cost reduction.

A printed wiring board according to a tenth embodiment of the present invention is the ninth aspect of the invention, wherein the second protective film is formed in an inner region having a distance of 10 μm or more from an inner side surface of the first protective film. Thereby, the drawing shape of the coating layer itself can be further reduced by the drawing shape at the time of forming the first protective film, and the coating layer having a higher shape stability can be provided.

The printed wiring board according to the eleventh embodiment of the present invention is any one of the seventh aspect to the tenth aspect, wherein the film thickness of the second protective film is larger than the foregoing The film thickness of a protective film is also large. Thereby, the second protective film can be formed with higher resolution than the first protective film, and a low-cost printed wiring board having a coating layer having a high shape stability can be realized.

A printed wiring board according to a twelfth aspect of the present invention is any one of the seventh aspect to the eleventh aspect, wherein the coating film has a plurality of layers after stacking The structure of the aforementioned second protective film is formed on the surface of the aforementioned first protective film. Thereby, it is possible to ensure the stability of the shape of the coating layer itself while improving the production time, and to increase the layer thickness of the coating layer.

1‧‧‧Printed wiring substrate

2‧‧‧Laminated body

3‧‧‧Insulation

4‧‧‧Conductor layer

11‧‧‧First protective film

12‧‧‧Second protective film

13‧‧‧ coating

G‧‧‧ size

Claims (12)

A method of manufacturing a printed wiring board, comprising: a preparation step of preparing a laminated body having a structure in which a conductor layer patterned on a surface of the insulating layer is laminated; and a first protective film forming step for a first printing region on the surface of the laminated body exposing at least a portion of the conductor layer and surrounding the conductor layer, an insulating material is applied by an inkjet method to form a first protective film; and a second protective film forming step is used for coating At least a part of the laminated body exposed in an inner region of the first protective film and a second printed region of the entire surface of the first protective film are coated with an insulating material by an inkjet method to form a second protective film; The second protective film forming step performs inkjet drawing by a resolution higher than the resolution in the first protective film forming step. The method of manufacturing a printed wiring board according to claim 1, wherein in the first protective film forming step, a region surrounded by a formation region of the conductor layer on a surface of the laminated body is used as the a first printing region; in the second protective film forming step, a region covering at least a portion of the surface of the first protective film and the insulating layer exposed at an inner region of the first protective film is used as the second printing region. The method of manufacturing a printed wiring board according to claim 2, wherein in the first protective film forming step, the conductor layer and the first layer are The separation distance of one protective film is set to be 1 time or more and 20 times or less the dot pitch in the second protective film forming step. The method of manufacturing a printed wiring board according to claim 3, wherein in the first protective film forming step, a distance between the conductor layer and the first protective film is 10 μm or more. The method of manufacturing a printed wiring board according to claim 1, further comprising: repeating the step of repeating the first protective film forming step before the second protective film forming step. The method of manufacturing a printed wiring board according to claim 1, wherein the moving speed in the main scanning direction is decreased and the sub-scanning is increased in the second protective film forming step as compared with the first protective film forming step. The number of movements in the direction. A printed wiring board comprising: a laminated body comprising a laminated structure in which an insulating layer and a conductor layer patterned on a surface of the insulating layer are laminated; and a coating layer on the surface of the laminated body and exposed The conductive layer is formed by surrounding at least a portion of the conductive layer; the coating layer is provided with at least a first protective film and a second protective film, and the first protective film is on the surface of the laminated body and exposes the conductive layer At least a part of the first protective film is coated on at least a part of the laminated body exposed in an inner region of the first protective film and the entire surface of the first protective film. The printed wiring board according to claim 7, wherein the second protective film covers the entire inner side surface of the first protective film. The printed wiring board according to claim 7 or 8, wherein the first protective film is provided on a surface of the laminated body and is surrounded by a formation region of the conductor layer; and the second protective film is covered by the first At least a portion of the insulating layer exposed at an inner region of a protective film and an entire surface of the first protective film. The printed wiring board according to claim 9, wherein the second protective film is formed in an inner region having a distance of 10 μm or more from an inner side surface of the first protective film. The printed wiring board according to claim 7, wherein the film thickness of the second protective film is larger than the film thickness of the first protective film. The printed wiring board according to claim 7, wherein the coating film has a structure in which the second protective film is formed on a surface of a plurality of the first protective films after stacking.