JP2004304036A - Device for manufacturing electronic circuit substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for manufacturing an electronic circuit substrate capable of accurately positioning a solder resist pattern at a circuit pattern, and improving the yield of a product. <P>SOLUTION: An ink jet nozzle 2 for discharging liquid droplets of a fluid containing volatile components with which conductive particles are mixed, a laser head 4 for heating, an ink jet nozzle 5 for discharging liquid droplets of a fluid constituted of insulating materials, a laser head 7 for heating and an ink jet nozzle 8 for discharging ink for print are successively arranged so as to face an Y table 33 freely positioned to XY directions on which a substrate 1 is placed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic circuit board manufacturing apparatus for forming a circuit pattern having a line width of several μm to several tens μm, a solder resist pattern, and a symbol mark on a surface of a substrate material such as synthetic resin, glass, and ceramic.
[0002]
[Prior art]
An electronic circuit board is formed as a product after a circuit pattern is formed on the surface of the board, a solder resist pattern is formed, and a symbol mark is printed.
First, a conventional circuit pattern forming procedure will be described.
[0003]
FIG. 5 is a diagram showing a conventional circuit pattern forming procedure, in which (a1) to (f1) show a production example, and (a2) to (f2) show the surface of a substrate.
As shown in the figures (a1) and (a2), the double-sided board 12 has a structure in which a copper foil 12b is attached to upper and lower surfaces of an insulating resin 12a.
A photoresist 13 is applied to the entire upper surface of such a double-sided substrate 12 as shown in FIGS. (B1) and (b2), and then is formed as shown in FIGS. (C1) and (c2). A photomask 14 in which holes 14 a corresponding to the circuit pattern to be formed are formed is disposed above the double-sided substrate 12. In this state, a resist exposure device 15 is arranged above the photomask 14, and the photomask 14 is irradiated with light 16. Then, the photoresist 13 overlapping the hole 14a is exposed, and becomes the exposed resist 13a.
[0004]
Thereafter, as shown in FIGS. 2D and 2D, the exposed double-sided substrate 12 is immersed in a developer bath 17 and the double-sided substrate 12 from which the exposure resist 13a has been removed by the developer 17a is washed and dried. Thereafter, the double-sided substrate 12 is immersed in an etching solution bath 18 as shown in FIGS. Then, the copper foil 12b below the exposure resist 13a is dissolved (etched) by the etching solution 18a, and only the circuit pattern portion remains on the copper foil 12b attached to the surface of the double-sided substrate 11.
[0005]
After the etched double-sided substrate 12 is washed and dried, the double-sided substrate 12 is immersed in a resist stripping solution bath 19, and the photoresist 13 is removed with a resist stripping solution 19a, as shown in FIGS. After removal, the circuit pattern is formed by washing and drying.
[0006]
Next, a conventional solder resist pattern and symbol mark printing procedure will be described.
FIG. 6 is a diagram showing a conventional procedure for printing a solder resist pattern and a symbol mark, wherein (g1) to (i1) show a production example, and (g2) to (i2) show the surface of a substrate.
[0007]
As shown in FIG. 1G, a mask screen 20 a on which a solder resist pattern is formed in advance is disposed on the upper surface of the double-sided substrate 12. The mesh pattern is formed on the mask screen 20a so that the solder resist ink 22 is transmitted according to the solder resist pattern to be formed. In this state, when the solder resist ink 22 is arranged on the mask screen 20a and the squeegee 21 pushes out the solder resist ink 22 from the mask screen 20a as shown in FIG. As shown in (h1) and (h2), solder resist patterns 22a are formed.
[0008]
The double-sided substrate 12 on which the solder resist pattern is formed is dried, and a mask screen 20b on which a symbol mark pattern to be formed is formed is placed on the upper side of the double-sided substrate 12, as shown in FIG. The mask screen 20b has a mesh pattern formed so that the symbol mark ink 23 is transmitted therethrough. When the symbol mark ink 23 is arranged on the mask screen 20b and the squeegee 21 pushes the symbol mark ink 23 out of the mask screen 20b to perform screen printing on the double-sided substrate 12, the symbol mark ink is printed as shown in FIG. Is completed. When the symbol mark pattern 23a is dried, the double-sided board 12 (ie, electronic circuit board) as a product on which electronic components can be surface-mounted is completed.
[0009]
As the miniaturization of electronic circuits progresses, it is required that the distance between the land and the line of a via (a hole for electrically connecting a conductor disposed in an upper layer and a lower layer) be several to several tens μm. It has become so.
[0010]
[Problems to be solved by the invention]
However, in the conventional electronic circuit board manufacturing procedure, it is difficult to arrange the solder resist pattern with respect to the circuit pattern. For example, the solder resist pattern is displaced on the land and the circuit pattern is exposed. As a result, the product yield was reduced. In addition, the equipment cost has been increased due to the improvement in positioning accuracy.
[0011]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems in the prior art, and to provide an electronic circuit board manufacturing apparatus capable of accurately positioning a solder resist pattern with respect to a circuit pattern and improving product yield. It is in.
[0012]
[Means for Solving the Problems]
The above-described problem is to provide an electronic circuit board manufacturing apparatus, which includes a table on which a substrate is placed, a circuit pattern forming unit using a solution, a drying unit, and a solder resist pattern forming unit using a solution. Thus, the problem is solved by disposing the circuit pattern forming means, the drying means, and the solder resist pattern forming means, and forming an electronic circuit board without removing the substrate from the table.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
1A and 1B are configuration diagrams of an electronic circuit board manufacturing apparatus according to a first embodiment of the present invention, wherein FIG. 1A is a front view, FIG. 1B is a side view, and FIG. 1C is an enlarged view of a head unit. .
In the figure, the X table 31 of the electronic circuit board manufacturing apparatus M can be positioned on the X-axis guide device 30 arranged in the X direction. On the X table 31, a Y-axis guide device 32 is arranged in the Y direction. The Y table 33 can be positioned on the Y-axis guide device 32. The substrate 1 made of an insulating material is fixed on a Y table 33.
[0014]
A head holding device 40 is arranged at a position facing the Y table 33 of the electronic circuit board manufacturing apparatus M. In the Y direction of the head holding device 40, the inkjet nozzle 2, the heating laser head 4, the inkjet nozzle 5, the heating laser head 7, and the inkjet nozzle 8 are arranged in this order. A plurality of the inkjet nozzles 2, the inkjet nozzles 5, and the inkjet nozzles 8 are respectively arranged in the X direction.
[0015]
The inkjet nozzle 2 discharges a droplet 3 of a fluid containing a volatile component into which conductive particles are mixed. The heating laser heads 4 and 7 output a laser. The ink jet nozzle 5 discharges a fluid droplet 6 made of an insulating material. The ink jet nozzle 8 discharges printing ink.
[0016]
Next, a procedure for manufacturing the electronic circuit board will be described.
2 and 3 are schematic views for explaining a manufacturing procedure of the electronic circuit board. The upper part is a plan view, and the lower part is a side view.
[0017]
(1) First step (circuit pattern forming step)
As shown in FIG. 1A, a fluid containing a volatile component mixed with conductive particles (not shown) by the inkjet nozzle 2 while moving the substrate 1 in the X direction (to the right in the figure). Is discharged according to the circuit pattern to form a conductive pattern 3 a on the substrate 1.
When the line width of the circuit pattern is set to several μm to several tens of μm, good results can be obtained by setting the diameter of the droplet to around 2 μm and the size of the conductive particles mixed into the droplet to around several nm to 50 nm. Can be.
When a circuit pattern having a line width of 10 μm is formed, if one droplet has a diameter of 2 μm, one droplet spreads on the surface of the substrate 1 to a diameter of about 5 to 7 μm. It is preferable that the spreads overlap by about 50%, for example.
Further, as the fluid mixed with the conductive particles, for example, “Nanopaste” (trade name of Harima Chemicals, Inc.) can be used.
[0018]
(2) Second step (circuit pattern drying and solidifying step)
As shown in FIG. 2B, the substrate 1 is moved in the Y direction (downward in the figure) by a desired distance. Thereafter, while the substrate 1 is moved in the X direction (left side in the figure), droplets of a fluid containing a volatile component mixed with conductive particles are ejected by the inkjet nozzle 2 in accordance with the circuit pattern, and the substrate 1 is discharged. Then, a conductive pattern 3a is formed.
At the same time, by irradiating a laser from the heating laser head 4 to heat the circuit pattern formed in the first step, the volatile components are volatilized and dried, and the conductive particles are positively solidified.
In the case of the substrate 1 shown in the figure, a solder resist pattern 6a forming step described later is simultaneously performed.
[0019]
(3) Third step (solder resist pattern forming step)
As shown in FIG. 3C, the substrate 1 is moved by a desired distance in the Y direction (downward in the figure). Thereafter, a solder resist pattern 6a is formed on the substrate 1 by the inkjet nozzle 5 while moving the substrate 1 in the X direction (right side in the figure).
In the case of the substrate 1 shown in the figure, as shown in FIG. 3C, a laser beam is irradiated from a heating laser head 7 to heat the solder resist pattern 6a formed in the third step, so that the volatile property is increased. The components are volatilized to form a solidified solder resist pattern 6b.
[0020]
(4) Fourth step (symbol mark printing step)
As shown in FIG. 4D, the substrate 1 is moved by a desired distance in the Y direction (downward in the figure). Thereafter, while the substrate 1 is moved in the X direction (left side in the figure), droplets of the symbol printing ink, which is a black or near-color paint, are ejected onto the substrate 1 by the inkjet nozzles 8 to form the symbol mark. 9a is printed. Then, the printed and applied symbol mark 9a is naturally dried.
As described above, since it is not necessary to remove the substrate 1 from the Y table 33, the solder resist pattern can be accurately arranged for a circuit pattern having a line width of several μm to several tens μm.
Instead of the ink jet nozzles 2, 5, and 7, for example, the respective inks may be made to flow through slits, similarly to the pen tip of a fountain pen.
Prior to forming a circuit pattern, the surface of the substrate 1 may be roughened to about 5 μm.
[0021]
(Second embodiment)
FIG. 4 is a view showing a second embodiment of the present invention, and shows a substrate in which each of the inkjet nozzle 2, the heating laser head 4, the inkjet nozzle 5, the heating laser head 7, and the inkjet nozzle 8 is one. It is a figure explaining a preparation procedure, (a1)-(e1) is a figure showing a manufacturing procedure, and (a2)-(e2) is a figure showing a substrate surface.
[0022]
In the case of the second embodiment, although the number of table movements is increased as compared with the first embodiment, the time required for circuit formation is longer, but the apparatus configuration is simpler and control is easier.
The operation is substantially the same as that of the first embodiment, and a detailed description is omitted.
[0023]
【The invention's effect】
As described above, according to the present invention, the solder resist pattern can be accurately positioned with respect to the circuit pattern, and the product yield can be improved. Further, since no cleaning step is required, the configuration of the apparatus is simplified.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an electronic circuit board manufacturing apparatus according to the present invention.
FIG. 2 is a schematic diagram illustrating a procedure for manufacturing an electronic circuit board according to the present invention.
FIG. 3 is a schematic diagram illustrating a procedure for manufacturing an electronic circuit board according to the present invention.
FIG. 4 is a schematic view illustrating a procedure for manufacturing another electronic circuit board according to the present invention.
FIG. 5 is an explanatory diagram of a conventional technique.
FIG. 6 is an explanatory diagram of a conventional technique.
[Explanation of symbols]
Reference Signs List 1 substrate 2 inkjet nozzle 4 heating laser head 5 inkjet nozzle 7 heating laser head 8 inkjet nozzle 33 Y table

Claims (2)

A table on which the substrate is placed, a circuit pattern forming unit using a solution, a drying unit, and a solder resist pattern forming unit using a solution are provided,
The circuit pattern forming means, the drying means, and the solder resist pattern forming means are arranged to face the table, and an electronic circuit board is formed without removing the board from the table. Equipment for manufacturing electronic circuit boards. 2. The apparatus for manufacturing an electronic circuit board according to claim 1, wherein a symbol mark forming means using a solution is provided, and the symbol mark forming means is arranged to face the table.

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