WO2018096649A1 - Metal mask and manufacturing method for same - Google Patents

Metal mask and manufacturing method for same Download PDF

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Publication number
WO2018096649A1
WO2018096649A1 PCT/JP2016/084971 JP2016084971W WO2018096649A1 WO 2018096649 A1 WO2018096649 A1 WO 2018096649A1 JP 2016084971 W JP2016084971 W JP 2016084971W WO 2018096649 A1 WO2018096649 A1 WO 2018096649A1
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WO
WIPO (PCT)
Prior art keywords
pad
insulating layer
hole
metal mask
dry film
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PCT/JP2016/084971
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French (fr)
Japanese (ja)
Inventor
章稔 木村
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株式会社メイコー
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Priority to PCT/JP2016/084971 priority Critical patent/WO2018096649A1/en
Publication of WO2018096649A1 publication Critical patent/WO2018096649A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a metal mask suitable for a case where a symbol mark is formed on a substrate surface and a manufacturing method thereof.
  • a metal mask is known as a so-called printing plate for printing (transferring) a solder paste onto a printed circuit board when components and the like are surface-mounted.
  • the metal mask has a substantially plate shape using a SUS plate, and a plurality of through holes for pouring solder paste are formed.
  • solder paste is poured into the through hole, and the solder is transferred to the substrate by imprinting with a squeegee.
  • symbol marks are formed on the surface of the printed circuit board as identification numbers of components to be mounted.
  • the symbol mark is printed on the surface of the substrate using a thermosetting ink after the printed circuit board is manufactured. For this reason, the symbol mark is formed so as to protrude from the substrate surface.
  • the thickness of the symbol mark is about 30 ⁇ m.
  • the metal mask If the metal mask is pressed against the substrate surface as it is, the metal mask is lifted from the substrate surface by the thickness of the symbol mark, that is, a gap is generated between the metal mask and the substrate surface. When this gap exists, the solder paste enters the gap when the solder paste is poured into the through hole. This is not preferable because it causes bleeding of the transferred solder.
  • the solder paste that has flowed into the gap protrudes from the pad formed of the conductor pattern formed on the substrate surface. As a result, the solder is not sufficiently filled on the pad, and the adhesion between the solder and the pad is lowered. Then, when the metal mask is separated from the substrate surface after the solder transfer, the adhesion between the solder and the wall surface of the through hole is won, and a part of the solder is peeled off together with the metal mask. That is, when viewed from the whole substrate, it causes variation in the amount of solder transferred. Furthermore, after the transfer of the solder, the solder that has entered from the gap may stick to the back surface of the metal mask, and it is necessary to wipe it off in order to remove the solder.
  • the convex portion as in Patent Document 1 is formed by plating, it is troublesome and troublesome to form. In addition, it is difficult to form a shape that enhances the adhesion between the substrate surface and the metal mask by plating, and solder paste may enter from the lower side of the convex portion, and the solder paste may also flow into the gap. .
  • the present invention takes the above-described conventional technology into consideration, and improves the adhesion between the metal mask and the substrate surface at a position avoiding the symbol mark and prevents the solder paste from flowing into the gap. And it aims at providing the manufacturing method.
  • a basic insulating layer made of an insulating material, a pad made of a conductive material formed in a pattern on the surface of the basic insulating layer, and a surface of the basic insulating layer other than the pad
  • a surface insulating layer formed on the surface insulating layer A surface insulating layer formed on the surface insulating layer; a symbol mark formed protruding from the surface of the surface insulating layer; a boundary region formed in the vicinity of the boundary with the pad as a part of the surface of the surface insulating layer;
  • Shape as face A metal mask is provided, wherein the
  • a dry film pasting step of pasting a dry film on one surface of the metal plate to be the metal body a work film pasting step of pasting a work film having a transparent portion and a light shielding portion on the dry film, An exposure process for forming a cured part by curing the dry film corresponding to the transparent part by exposing with an exposure machine from the work film side, a work film removing process for removing the work film, and development
  • the tip surface of the guide piece is in close contact with the boundary region of the substrate surface, the adhesion between the metal mask and the substrate surface is enhanced at a position avoiding the symbol mark. Further, a gap generated between the metal main body and the printing area due to the thickness of the symbol mark is closed by the guide piece. For this reason, a passage is formed from the through hole to the pad with no gap between the guide pieces, and all the solder paste filled from the through hole is transferred onto the pad. Therefore, the solder paste is prevented from flowing into the gap between the metal mask and the substrate surface, that is, the printing area. Accordingly, bleeding of the transferred solder is prevented, variation in the transfer amount of the solder is suppressed, and a cleaning operation due to the solder sticking to the back surface of the metal mask becomes unnecessary.
  • a metal mask 1 according to the present invention includes a metal body 2 having a substantially plate shape made of metal.
  • a plurality of through holes 3 are formed in the metal body 2.
  • a guide piece 4 is formed extending along the edge of the through hole 3. That is, the guide piece 4 is continuously formed along the outer edge of the through hole 3.
  • the metal mask 1 of the present invention having such a structure is suitably used for a printed board 5 as shown in FIG.
  • a printed circuit board 5 to which the metal mask 1 according to the present invention is applied includes pads 6 made of a conductive material formed in a pattern on the substrate surface.
  • the pad 6 is a conductor pattern made of, for example, copper.
  • the substrate surface other than the pad 6 has a boundary region 7 and a printing region 8.
  • a symbol mark 9 is formed in the print area 8.
  • the symbol mark 9 functions as an identification number of an electronic component or the like that is electrically connected to the pad 6 via solder transferred thereto.
  • a print area 8 where the symbol mark 9 is not formed may be formed.
  • the metal mask 1 is mounted on the printed circuit board 5 and used.
  • the printed circuit board 5 has a basic insulating layer 10 made of an insulating material such as glass cloth.
  • a pad 6 made of a conductive material formed in a pattern is formed on the surface of the basic insulating layer 10.
  • a surface insulating layer 11 is formed on the surface of the basic insulating layer 10 other than the pad 6. From the surface of the surface insulating layer 11, the above-described symbol mark 9 is formed so as to protrude.
  • the vicinity of the boundary of the pad 6 is formed as a boundary area 7, and the area other than the boundary area 7 is formed as a printing area 8. Both the boundary area 7 and the printing area 8 are part of the surface insulating layer 11.
  • the print area 8 is an area where the symbol mark 9 is formed.
  • the metal mask 1 is placed on the printed circuit board 5 having such a structure.
  • the through holes 3 formed in the metal main body 2 are formed in the same pattern as the pads 6. Therefore, the through hole 3 is arranged at a corresponding position in a shape corresponding to the pad 6.
  • a guide piece 4 is formed along the edge of the through hole 3 toward the printed circuit board 5.
  • a tip surface 12 as a surface is formed at the tip of the guide piece 4 on the protruding side.
  • the tip surface 12 has a shape that is in close contact with the boundary region 7. That is, if the boundary region 7 is a smooth surface, the tip surface 12 is also a smooth surface.
  • the front end surface 12 is similarly formed following the shape of the boundary region 7.
  • the metal body 2 is formed corresponding to a position covering the printing area 8. If the pads are close to each other or the printing area 8 is not necessary between the pads as the density of the parts increases, the guide pieces 4 corresponding to the adjacent through holes 3 may be integrally formed.
  • solder paste (not shown) is poured into the through hole 3.
  • the solder paste filled in the through hole 3 is firmly filled on the upper side of the pad 6 by the guide piece 4. And since the front end surface 12 and the boundary region 7 are in close contact, the solder paste does not flow into the print region 8 from this gap.
  • the solder paste filled in the through holes 3 in this way is all printed on the pads 6 by a squeegee.
  • the metal mask 1 is removed from the substrate 5.
  • the front end surface 12 of the guide piece 4 is in close contact with the boundary region 7 on the substrate surface. For this reason, the adhesion between the metal mask 1 and the substrate surface is enhanced at a position avoiding the symbol mark 9. Further, a gap generated between the metal main body 2 and the printing area 8 due to the thickness of the symbol mark 9 is closed by the guide piece 4. For this reason, a passage is formed from the through hole 3 to the pad 6 without a gap by the guide piece 4, and all the solder paste filled from the through hole 3 is transferred onto the pad 6. Accordingly, it is possible to prevent the solder paste from flowing into the gap between the metal mask 1 and the substrate surface, that is, the printing region 8. Therefore, bleeding of the transferred solder is prevented, variation in the transfer amount of the solder is suppressed, and a cleaning operation due to the solder sticking to the back surface of the metal mask 1 becomes unnecessary.
  • the metal mask 1 as described above is manufactured as follows.
  • the overall flowchart is shown in FIG. First, as shown in FIG. 4, a dry film sticking process (step S1) is performed.
  • This dry film attaching step is a step of attaching the dry film 13 to one surface of the metal plate 16 to be the metal body 2.
  • the metal plate 16 is, for example, a stainless steel SUS plate.
  • the dry film 13 is a photosensitive film and has a laminate shape.
  • a work film sticking process step S2 is performed.
  • This work film sticking step is a step of sticking the work film 14 to the dry film 13.
  • the work film 14 has a transparent portion 14a and a light shielding portion 14b.
  • the transparent portion 14a is transparent, light is transmitted therethrough, and the light shielding portion 14b does not transmit light.
  • the work film 14 is also laminated.
  • the light shielding portion 14 b is formed at a position corresponding to the print region 8. Therefore, the transparent portion 14 a is formed in a shape that combines the through hole 3 and the boundary region 7.
  • step S3 is performed as shown in FIG.
  • This exposure process is a process of exposing with an exposure machine (not shown) from the work film 14 side. Thereby, light passes through the transparent portion 14a, and the dry film 13 at a position corresponding to the transparent portion 14a is cured. This hardened portion is formed as a hardened portion 15. This utilizes the property that the dry film (dry film resist) 13 is cured by UV light. Then, as shown in FIG. 7, a work film removal process (step S4) is performed and the work film 14 is removed.
  • a dry film removal process (step S5) is performed.
  • This dry film removing step is a step of removing the dry film 13 other than the cured portion 15 with a developer. By removing the dry film 13, a part of the metal plate 16 is exposed. This exposed portion becomes the exposed portion 17.
  • a groove forming step (step S6) is performed. This step is a step of forming the groove-shaped groove portion 18 by dissolving the exposed portion 17 with an etching solution. That is, the metal plate 16 is dug down with an etching solution to form a groove shape. At this time, it is dissolved to such an extent that the metal plate 16 does not penetrate. This is so-called half etching.
  • a hardened part removing step (step S7) is performed.
  • This hardened portion removing step is a step of removing the hardened portion 15.
  • the protrusion part 19 which is a part of surface of the metal plate 16 other than the groove part 18 is exposed.
  • a through hole forming step (step S8) is performed.
  • This through-hole forming step is a step of providing the through-hole 3 with respect to the protruding portion 19 using a laser or the like.
  • the through-hole 3 is formed leaving such a width that the peripheral edge of the protrusion 19 becomes the guide piece 4.
  • the through hole 3 is formed in the same shape as the outer edge of the pad 6 in plan view.
  • the metal mask 1 is manufactured. In the metal mask 1 manufactured in this way, the through hole 3 corresponds to the pad 6 and the guide piece 4 is formed on the periphery thereof. For this reason, the effect as the metal mask 1 can be obtained.
  • a guide piece 4 is provided at a position corresponding to the periphery of the pad 6 so that the metal body 2 and the substrate surface It is considered that this object can be achieved not only by closing the gap, but also by a structure in which the guide piece 4 is formed in accordance with the shape of the symbol mark 9 itself and only the symbol mark 9 is covered.
  • the symbol mark 9 is often formed as a character, and it is difficult to form the guide piece 4 having a shape corresponding to this, which is not practical.
  • the guide piece 4 is formed with reference to the pad 6 formed with high positional accuracy, and as a result, the yield is prevented from being lowered.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Plates And Materials Therefor (AREA)

Abstract

A metal mask (1) comprises: a substantially plate-shaped metal member (2) placed on a substrate (5) that is provided with a pad (6) and surface insulating layer (11) formed on a surface of a base insulating layer (10), a boundary region (7) formed in the vicinity of a boundary with the pad (6), and a printing region (8) in which a symbol mark (9) is formed; a through-hole (3) formed in the same pattern shape as the pad (6); a guide piece (4) extending toward the substrate (5) along an edge of the through-hole (3); and a distal end surface (12) of the guide piece (4). The distal end surface (12) has a shape that adheres to the boundary region (7), and the metal member (2) corresponds to a position that covers the printing region (8).

Description

メタルマスク及びその製造方法Metal mask and manufacturing method thereof
　本発明は、シンボルマークが基板表面に形成されている場合に好適なメタルマスク及びその製造方法に関する。 The present invention relates to a metal mask suitable for a case where a symbol mark is formed on a substrate surface and a manufacturing method thereof.
　メタルマスクはプリント基板に対して部品等を表面実装する際に、この基板にはんだペーストを印刷（転写）するためのいわゆる印刷版として知られている。メタルマスクはＳＵＳ板を利用した略板形状であり、はんだペーストを流し込むための貫通孔が複数形成されている。はんだを転写する際、まずメタルマスクはプリント基板の表面に押し当てられる。そして貫通孔にはんだペーストが流し込まれ、スキージにて刷り込むことではんだが基板に転写される。 A metal mask is known as a so-called printing plate for printing (transferring) a solder paste onto a printed circuit board when components and the like are surface-mounted. The metal mask has a substantially plate shape using a SUS plate, and a plurality of through holes for pouring solder paste are formed. When transferring the solder, the metal mask is first pressed against the surface of the printed circuit board. Then, solder paste is poured into the through hole, and the solder is transferred to the substrate by imprinting with a squeegee.
　このとき、プリント基板表面には実装すべき部品等の識別番号としてシンボルマークが形成されている。このシンボルマークはプリント基板製造後に熱硬化性のインクを用いて基板表面に印刷される。このため、シンボルマークは基板表面から突出して形成されている。一般的には、シンボルマークの厚みは３０μｍ程度である。 At this time, symbol marks are formed on the surface of the printed circuit board as identification numbers of components to be mounted. The symbol mark is printed on the surface of the substrate using a thermosetting ink after the printed circuit board is manufactured. For this reason, the symbol mark is formed so as to protrude from the substrate surface. Generally, the thickness of the symbol mark is about 30 μm.
　このままメタルマスクを基板表面に押し当てると、シンボルマークの厚みだけメタルマスクが基板表面から浮いた状態、すなわちメタルマスクと基板表面との間に隙間が生じた状態となる。この隙間があると、はんだペーストを貫通孔に流し込んだ際に、はんだペーストが隙間に入り込んでしまう。このことは、転写されたはんだのにじみの原因となり好ましくない。 If the metal mask is pressed against the substrate surface as it is, the metal mask is lifted from the substrate surface by the thickness of the symbol mark, that is, a gap is generated between the metal mask and the substrate surface. When this gap exists, the solder paste enters the gap when the solder paste is poured into the through hole. This is not preferable because it causes bleeding of the transferred solder.
　また、隙間に流れたはんだペーストは基板表面に形成された導体パターンからなるパッドからもはみ出てしまう。これによりはんだが十分にパッド上に充填されなくなってしまい、はんだとパッドとの密着性が低下してしまう。そうするとはんだ転写後にメタルマスクを基板表面から離間した際に、はんだと貫通孔の壁面との密着性が勝ってしまい、メタルマスクとともにはんだの一部が引きはがされてしまう。すなわち、基板全体で見るとはんだ転写量のばらつきの原因となってしまう。さらに、はんだの転写後、隙間から入り込んだはんだがメタルマスク裏面にくっついてしまうことがあり、これを除去するため拭き取る作業も必要となっている。 Also, the solder paste that has flowed into the gap protrudes from the pad formed of the conductor pattern formed on the substrate surface. As a result, the solder is not sufficiently filled on the pad, and the adhesion between the solder and the pad is lowered. Then, when the metal mask is separated from the substrate surface after the solder transfer, the adhesion between the solder and the wall surface of the through hole is won, and a part of the solder is peeled off together with the metal mask. That is, when viewed from the whole substrate, it causes variation in the amount of solder transferred. Furthermore, after the transfer of the solder, the solder that has entered from the gap may stick to the back surface of the metal mask, and it is necessary to wipe it off in order to remove the solder.
　メタルマスクの貫通孔からパッドに向けての経路にて、隙間を塞ぐような部材があれば上記課題は解決されると思われる。例えば、特許文献１のような凸部をメタルマスクに形成することが考えられる。 If there is a member that closes the gap in the path from the through hole of the metal mask to the pad, the above problem seems to be solved. For example, it is conceivable to form convex portions as in Patent Document 1 on a metal mask.
特開２００８－２１３４０４号公報JP 2008-213404 A
　しかしながら、特許文献１のような凸部はめっきにて形成されているため、形成に当たって手間がかかり面倒である。また、めっきでは基板表面とメタルマスクとの密着性を高めるような形状を形成することは困難であり、凸部の下側からはんだペーストが入り込み、やはり隙間にはんだペーストが流れ込んでしまうおそれがある。 However, since the convex portion as in Patent Document 1 is formed by plating, it is troublesome and troublesome to form. In addition, it is difficult to form a shape that enhances the adhesion between the substrate surface and the metal mask by plating, and solder paste may enter from the lower side of the convex portion, and the solder paste may also flow into the gap. .
　本発明は、上記従来技術を考慮したものであって、シンボルマークを避けた位置にてメタルマスクと基板表面との密着性を高め、隙間にはんだペーストが流れ込むことを防止することができるメタルマスク及びその製造方法を提供することを目的とする。 The present invention takes the above-described conventional technology into consideration, and improves the adhesion between the metal mask and the substrate surface at a position avoiding the symbol mark and prevents the solder paste from flowing into the gap. And it aims at providing the manufacturing method.
　前記目的を達成するため、本発明では、絶縁材料からなる基本絶縁層と、該基本絶縁層の表面にパターン状に形成された導電材料からなるパッドと、該パッド以外の前記基本絶縁層の表面に形成された表面絶縁層と、該表面絶縁層の表面から突出して形成されたシンボルマークと、前記表面絶縁層の表面の一部として前記パッドとの境界近傍に形成された境界領域と、該境界領域以外の前記表面絶縁層の表面の一部として前記シンボルマークが形成されている印字領域とを備えた基板に対して載置されるべきメタルマスクであって、略板形状のメタル本体と、該メタル本体に前記パッドと同一のパターン状に形成された貫通孔と、該貫通孔の縁に沿って前記基板に向けて延びているガイド片と、該ガイド片の突出した側の先端に面として形成されている先端面とを備え、前記先端面は前記境界領域に密着する形状であり、前記メタル本体は前記印字領域を覆う位置に対応して形成されていることを特徴とするメタルマスクを提供する。 In order to achieve the above object, in the present invention, a basic insulating layer made of an insulating material, a pad made of a conductive material formed in a pattern on the surface of the basic insulating layer, and a surface of the basic insulating layer other than the pad A surface insulating layer formed on the surface insulating layer; a symbol mark formed protruding from the surface of the surface insulating layer; a boundary region formed in the vicinity of the boundary with the pad as a part of the surface of the surface insulating layer; A metal mask to be placed on a substrate provided with a printing region in which the symbol mark is formed as a part of the surface of the surface insulating layer other than the boundary region, and a substantially plate-shaped metal body; A through hole formed in the metal body in the same pattern as the pad, a guide piece extending toward the substrate along an edge of the through hole, and a tip of the guide piece on the protruding side. Shape as face A metal mask is provided, wherein the tip surface has a shape that is in close contact with the boundary region, and the metal body is formed corresponding to a position covering the print region. To do.
　また、前記メタル本体となるべき金属板の一方の表面にドライフィルムを貼付けるドライフィルム貼り付け工程と、前記ドライフィルムに透明部及び遮光部を有するワークフィルムを貼付けるワークフィルム貼り付け工程と、前記ワークフィルム側から露光機にて露光して前記透明部に対応している前記ドライフィルムを硬化させて硬化部を形成するする露光工程と、前記ワークフィルムを除去するワークフィルム除去工程と、現像液にて前記硬化部以外の前記ドライフィルムを除去して前記金属板の一部である露出部を露出させるドライフィルム除去工程と、エッチング液にて前記露出部を溶解させて溝形状の溝部を形成する溝部形成工程と、前記硬化部を除去して前記溝部以外の前記金属板の表面の一部である突出部を形成する硬化部除去工程と、前記突出部周縁部を前記ガイド片として該ガイド片の内側を貫通して前記貫通孔を形成する貫通孔形成工程とを備え、前記遮光部は、前記印字領域に対応した位置に形成され、前記貫通孔は、平面視にて前記パッドの外縁の形状と同一形状に形成されることを特徴とするメタルマスクの製造方法を提供する。 Also, a dry film pasting step of pasting a dry film on one surface of the metal plate to be the metal body, a work film pasting step of pasting a work film having a transparent portion and a light shielding portion on the dry film, An exposure process for forming a cured part by curing the dry film corresponding to the transparent part by exposing with an exposure machine from the work film side, a work film removing process for removing the work film, and development A dry film removing step of removing the dry film other than the cured portion with a liquid to expose an exposed portion that is a part of the metal plate, and dissolving the exposed portion with an etching solution to form a groove-shaped groove portion Groove part forming step to be formed and a hardened part that removes the hardened part and forms a protruding part that is a part of the surface of the metal plate other than the groove A leaving step and a through hole forming step of forming the through hole by penetrating the inside of the guide piece using the peripheral edge of the protruding portion as the guide piece, and the light shielding portion is located at a position corresponding to the print area. The metal mask manufacturing method is characterized in that the formed through hole is formed in the same shape as the outer edge of the pad in plan view.
　本発明によれば、ガイド片が有する先端面が基板表面の境界領域に密着するので、シンボルマークを避けた位置にてメタルマスクと基板表面との密着性が高まる。またシンボルマークの厚みによってメタル本体と印字領域との間に生じる隙間は、ガイド片にて塞がれる。このため、貫通孔からパッドまではガイド片で隙間なく通路が形成され、貫通孔から充填されたはんだペーストは全てパッド上に転写される。したがって、メタルマスクと基板表面との間の隙間、すなわち印字領域にはんだペーストが流れ込むことが防止される。よって転写されたはんだのにじみが防止され、はんだの転写量のばらつきを抑制し、はんだがメタルマスクの裏面にくっつくことによるクリーニング作業が不要となる。 According to the present invention, since the tip surface of the guide piece is in close contact with the boundary region of the substrate surface, the adhesion between the metal mask and the substrate surface is enhanced at a position avoiding the symbol mark. Further, a gap generated between the metal main body and the printing area due to the thickness of the symbol mark is closed by the guide piece. For this reason, a passage is formed from the through hole to the pad with no gap between the guide pieces, and all the solder paste filled from the through hole is transferred onto the pad. Therefore, the solder paste is prevented from flowing into the gap between the metal mask and the substrate surface, that is, the printing area. Accordingly, bleeding of the transferred solder is prevented, variation in the transfer amount of the solder is suppressed, and a cleaning operation due to the solder sticking to the back surface of the metal mask becomes unnecessary.
本発明に係るメタルマスクの概略斜視図である。It is a schematic perspective view of the metal mask which concerns on this invention. 本発明に係るメタルマスクが適用されるプリント基板の概略図である。It is the schematic of the printed circuit board to which the metal mask which concerns on this invention is applied. メタルマスクの使用状態を示す概略断面図である。It is a schematic sectional drawing which shows the use condition of a metal mask. ドライフィルム貼り付け工程の説明図である。It is explanatory drawing of a dry film sticking process. ワークフィルム貼り付け工程の説明図である。It is explanatory drawing of a work film sticking process. 露光工程の説明図である。It is explanatory drawing of an exposure process. ワークフィルム除去工程の説明図である。It is explanatory drawing of a work film removal process. ドライフィルム除去工程の説明図である。It is explanatory drawing of a dry film removal process. 溝部形成工程の説明図である。It is explanatory drawing of a groove part formation process. 硬化部除去工程の説明図である。It is explanatory drawing of a hardening part removal process. 貫通孔形成工程の説明図である。It is explanatory drawing of a through-hole formation process. 本発明に係るメタルマスクの製造方法のフローチャートである。It is a flowchart of the manufacturing method of the metal mask which concerns on this invention.
　図１に示すように、本発明に係るメタルマスク１は、金属製の略板形状のメタル本体２を備えている。このメタル本体２には、貫通孔３が複数形成されている。そしてこの貫通孔３の縁に沿ってガイド片４が延びて形成されている。すなわちガイド片４は貫通孔３の外縁に沿って連続的に形成されている。このような構造を有する本発明のメタルマスク１は、図２に示すようなプリント基板５に対して好適に使用される。本発明に係るメタルマスク１が適用されるプリント基板５は、基板表面にパターン状に形成された導電材料からなるパッド６を備えている。このパッド６は例えば銅からなる導体パターンである。このパッド６以外の基板表面は境界領域７と印字領域８を有している。印字領域８にはシンボルマーク９が形成されている。このシンボルマーク９はパッド６に対して転写されたはんだを介して電気的に接続される電子部品等の識別番号として機能するものである。なお、パッド６の形状によってはシンボルマーク９が形成されない印字領域８も形成されることもある。 As shown in FIG. 1, a metal mask 1 according to the present invention includes a metal body 2 having a substantially plate shape made of metal. A plurality of through holes 3 are formed in the metal body 2. A guide piece 4 is formed extending along the edge of the through hole 3. That is, the guide piece 4 is continuously formed along the outer edge of the through hole 3. The metal mask 1 of the present invention having such a structure is suitably used for a printed board 5 as shown in FIG. A printed circuit board 5 to which the metal mask 1 according to the present invention is applied includes pads 6 made of a conductive material formed in a pattern on the substrate surface. The pad 6 is a conductor pattern made of, for example, copper. The substrate surface other than the pad 6 has a boundary region 7 and a printing region 8. A symbol mark 9 is formed in the print area 8. The symbol mark 9 functions as an identification number of an electronic component or the like that is electrically connected to the pad 6 via solder transferred thereto. Depending on the shape of the pad 6, a print area 8 where the symbol mark 9 is not formed may be formed.
　図３を参照すれば明らかなように、メタルマスク１はプリント基板５に載置されて使用される。プリント基板５は、ガラスクロス等の絶縁材料からなる基本絶縁層１０を有している。基本絶縁層１０の表面には、パターン状に形成された導電材料からなるパッド６が形成されている。このパッド６以外の基本絶縁層１０の表面には、表面絶縁層１１が形成されている。表面絶縁層１１の表面からは、上述したシンボルマーク９が突出して形成されている。パッド６の境界近傍は境界領域７として形成され、この境界領域７以外は印字領域８として形成されている。境界領域７も印字領域８も表面絶縁層１１の一部である。印字領域８はシンボルマーク９が形成されている領域である。 Referring to FIG. 3, the metal mask 1 is mounted on the printed circuit board 5 and used. The printed circuit board 5 has a basic insulating layer 10 made of an insulating material such as glass cloth. A pad 6 made of a conductive material formed in a pattern is formed on the surface of the basic insulating layer 10. A surface insulating layer 11 is formed on the surface of the basic insulating layer 10 other than the pad 6. From the surface of the surface insulating layer 11, the above-described symbol mark 9 is formed so as to protrude. The vicinity of the boundary of the pad 6 is formed as a boundary area 7, and the area other than the boundary area 7 is formed as a printing area 8. Both the boundary area 7 and the printing area 8 are part of the surface insulating layer 11. The print area 8 is an area where the symbol mark 9 is formed.
　メタルマスク１はこのような構造を有するプリント基板５に載置される。メタル本体２に形成された貫通孔３は、パッド６と同一のパターン状に形成されている。したがって貫通孔３はパッド６に対応した形状で対応した位置に配される。貫通孔３の縁に沿って、プリント基板５に向けてガイド片４が延びて形成されている。このガイド片４の突出した側の先端は、面としての先端面１２が形成されている。この先端面１２は境界領域７に密着する形状を有している。すなわち、境界領域７が平滑面であれば先端面１２も平滑面である。先端面１２は境界領域７の形状に追従して同様に形成される。そして、メタル本体２は印字領域８を覆う位置に対応して形成されている。なお、部品の高密度化に伴いパッドが近接していたり、パッド間に印字領域８が必要ない場合は隣り合う貫通孔３に対応するガイド片４が一体として形成されることもある。 The metal mask 1 is placed on the printed circuit board 5 having such a structure. The through holes 3 formed in the metal main body 2 are formed in the same pattern as the pads 6. Therefore, the through hole 3 is arranged at a corresponding position in a shape corresponding to the pad 6. A guide piece 4 is formed along the edge of the through hole 3 toward the printed circuit board 5. A tip surface 12 as a surface is formed at the tip of the guide piece 4 on the protruding side. The tip surface 12 has a shape that is in close contact with the boundary region 7. That is, if the boundary region 7 is a smooth surface, the tip surface 12 is also a smooth surface. The front end surface 12 is similarly formed following the shape of the boundary region 7. The metal body 2 is formed corresponding to a position covering the printing area 8. If the pads are close to each other or the printing area 8 is not necessary between the pads as the density of the parts increases, the guide pieces 4 corresponding to the adjacent through holes 3 may be integrally formed.
　このような状態で、はんだペースト（不図示）は貫通孔３に流し込まれる。貫通孔３内に充填されたはんだペーストは、ガイド片４によりパッド６の上側にしっかりと充填される。そして、先端面１２と境界領域７とが密着していることによりこの隙間から印字領域８にはんだペーストが流れ込むことはない。このようにして貫通孔３内に充填されたはんだペーストはスキージにより全てパッド６上に印刷される。はんだが転写されると、メタルマスク１は基板５から取り外される。 In this state, the solder paste (not shown) is poured into the through hole 3. The solder paste filled in the through hole 3 is firmly filled on the upper side of the pad 6 by the guide piece 4. And since the front end surface 12 and the boundary region 7 are in close contact, the solder paste does not flow into the print region 8 from this gap. The solder paste filled in the through holes 3 in this way is all printed on the pads 6 by a squeegee. When the solder is transferred, the metal mask 1 is removed from the substrate 5.
　このような構成により、ガイド片４が有する先端面１２は基板表面の境界領域７に密着することになる。このため、シンボルマーク９を避けた位置にてメタルマスク１と基板表面との密着性が高まる。またシンボルマーク９の厚みによってメタル本体２と印字領域８との間に生じる隙間は、ガイド片４にて塞がれる。このため、貫通孔３からパッド６まではガイド片４で隙間なく通路が形成され、貫通孔３から充填されたはんだペーストは全てパッド６上に転写される。したがって、メタルマスク１と基板表面との間の隙間、すなわち印字領域８にはんだペーストが流れ込むことが防止される。よって転写されたはんだのにじみが防止され、はんだの転写量のばらつきを抑制し、はんだがメタルマスク１の裏面にくっつくことによるクリーニング作業が不要となる。 With this configuration, the front end surface 12 of the guide piece 4 is in close contact with the boundary region 7 on the substrate surface. For this reason, the adhesion between the metal mask 1 and the substrate surface is enhanced at a position avoiding the symbol mark 9. Further, a gap generated between the metal main body 2 and the printing area 8 due to the thickness of the symbol mark 9 is closed by the guide piece 4. For this reason, a passage is formed from the through hole 3 to the pad 6 without a gap by the guide piece 4, and all the solder paste filled from the through hole 3 is transferred onto the pad 6. Accordingly, it is possible to prevent the solder paste from flowing into the gap between the metal mask 1 and the substrate surface, that is, the printing region 8. Therefore, bleeding of the transferred solder is prevented, variation in the transfer amount of the solder is suppressed, and a cleaning operation due to the solder sticking to the back surface of the metal mask 1 becomes unnecessary.
　以上のようなメタルマスク１は、以下のようにして製造される。なお、全体のフローチャートは図１２に示している。まずは図４に示すように、ドライフィルム貼り付け工程（ステップＳ１）が行われる。このドライフィルム貼り付け工程は、メタル本体２となるべき金属板１６の一方の表面にドライフィルム１３を貼付ける工程である。金属板１６は例えばステンレス製のＳＵＳ板である。ドライフィルム１３は感光性のフィルムであり、ラミネート状である。次に、図５に示すようにワークフィルム貼り付け工程（ステップＳ２）が行われる。このワークフィルム貼り付け工程は、ドライフィルム１３にワークフィルム１４を貼付ける工程である。ワークフィルム１４は、透明部１４ａ及び遮光部１４ｂを有している。透明部１４ａは透明であるため光を通し、遮光部１４ｂは光を通さない。ワークフィルム１４もラミネート状である。このとき、遮光部１４ｂは印字領域８に対応した位置に形成される。したがって透明部１４ａは貫通孔３と境界領域７とを合わせた形状に形成される。 The metal mask 1 as described above is manufactured as follows. The overall flowchart is shown in FIG. First, as shown in FIG. 4, a dry film sticking process (step S1) is performed. This dry film attaching step is a step of attaching the dry film 13 to one surface of the metal plate 16 to be the metal body 2. The metal plate 16 is, for example, a stainless steel SUS plate. The dry film 13 is a photosensitive film and has a laminate shape. Next, as shown in FIG. 5, a work film sticking process (step S2) is performed. This work film sticking step is a step of sticking the work film 14 to the dry film 13. The work film 14 has a transparent portion 14a and a light shielding portion 14b. Since the transparent portion 14a is transparent, light is transmitted therethrough, and the light shielding portion 14b does not transmit light. The work film 14 is also laminated. At this time, the light shielding portion 14 b is formed at a position corresponding to the print region 8. Therefore, the transparent portion 14 a is formed in a shape that combines the through hole 3 and the boundary region 7.
　そして、図６に示すように露光工程（ステップＳ３）が行われる。この露光工程は、ワークフィルム１４側から露光機（不図示）にて露光する工程である。これにより、透明部１４ａを光が透過してこの透明部１４ａに対応している位置のドライフィルム１３が硬化する。この硬化した部分は硬化部１５として形成される。これは、ドライフィルム（ドライフィルムレジスト）１３がＵＶ光にて硬化する性質を利用している。この後、図７に示すようにワークフィルム除去工程（ステップＳ４）を行ってワークフィルム１４を除去する。 And an exposure process (step S3) is performed as shown in FIG. This exposure process is a process of exposing with an exposure machine (not shown) from the work film 14 side. Thereby, light passes through the transparent portion 14a, and the dry film 13 at a position corresponding to the transparent portion 14a is cured. This hardened portion is formed as a hardened portion 15. This utilizes the property that the dry film (dry film resist) 13 is cured by UV light. Then, as shown in FIG. 7, a work film removal process (step S4) is performed and the work film 14 is removed.
　そして、図８に示すように、ドライフィルム除去工程（ステップＳ５）を行う。このドライフィルム除去工程は、現像液にて硬化部１５以外のドライフィルム１３を除去する工程である。ドライフィルム１３を除去することで、金属板１６の一部が露出する。この露出した部分が露出部１７となる。次に図９に示すように、溝部形成工程（ステップＳ６）を行う。この工程は、エッチング液にて露出部１７を溶解させて溝形状の溝部１８を形成する工程である。すなわち、エッチング液にて金属板１６は掘り下げられて溝形状となる。このとき、金属板１６が貫通しない程度に溶解される。いわゆるハーフエッチングである。 And as shown in FIG. 8, a dry film removal process (step S5) is performed. This dry film removing step is a step of removing the dry film 13 other than the cured portion 15 with a developer. By removing the dry film 13, a part of the metal plate 16 is exposed. This exposed portion becomes the exposed portion 17. Next, as shown in FIG. 9, a groove forming step (step S6) is performed. This step is a step of forming the groove-shaped groove portion 18 by dissolving the exposed portion 17 with an etching solution. That is, the metal plate 16 is dug down with an etching solution to form a groove shape. At this time, it is dissolved to such an extent that the metal plate 16 does not penetrate. This is so-called half etching.
　そして、図１０に示すように硬化部除去工程（ステップＳ７）を行う。この硬化部除去工程は、硬化部１５を除去する工程である。これにより、溝部１８以外の金属板１６の表面の一部である突出部１９が露出する。次に図１１に示すように貫通孔形成工程（ステップＳ８）を行う。この貫通孔形成工程は、突出部１９に対してレーザー等を利用して貫通孔３を設ける工程である。このとき、突出部１９の周縁部がガイド片４となるような幅を残して貫通孔３が形成される。この貫通孔３は、平面視にてパッド６の外縁の形状と同一形状に形成される。これにより、メタルマスク１が製造される。このようにして製造されたメタルマスク１は、貫通孔３がパッド６に対応し、その周縁にガイド片４が形成されることになる。このため、上記メタルマスク１としての効果を得ることができる。 Then, as shown in FIG. 10, a hardened part removing step (step S7) is performed. This hardened portion removing step is a step of removing the hardened portion 15. Thereby, the protrusion part 19 which is a part of surface of the metal plate 16 other than the groove part 18 is exposed. Next, as shown in FIG. 11, a through hole forming step (step S8) is performed. This through-hole forming step is a step of providing the through-hole 3 with respect to the protruding portion 19 using a laser or the like. At this time, the through-hole 3 is formed leaving such a width that the peripheral edge of the protrusion 19 becomes the guide piece 4. The through hole 3 is formed in the same shape as the outer edge of the pad 6 in plan view. Thereby, the metal mask 1 is manufactured. In the metal mask 1 manufactured in this way, the through hole 3 corresponds to the pad 6 and the guide piece 4 is formed on the periphery thereof. For this reason, the effect as the metal mask 1 can be obtained.
　なお、本発明の目的はシンボルマーク９の厚みの影響をはんだペーストの充填に及ぼさないことであるため、パッド６の周縁に対応する位置にガイド片４を設けてメタル本体２と基板表面との隙間を塞ぐだけではなく、シンボルマーク９自体の形状に合わせてガイド片４を形成し、シンボルマーク９のみを覆ってしまう構造でもこの目的は達成されると思われる。しかしながらシンボルマーク９は文字として形成されることが多く、これに応じた形状のガイド片４を形成することは困難であり、現実的ではない。また、シンボルマーク９は精度よく形成されるものではないため、このシンボルマーク９を基準としてガイド片４を形成することは歩留まりの低下の原因となり、好ましくない。本発明は位置精度が高く形成されるパッド６を基準としてガイド片４を形成することで、結果的に歩留まりの低下も防いでいる。 Since the object of the present invention is to prevent the thickness of the symbol mark 9 from affecting the filling of the solder paste, a guide piece 4 is provided at a position corresponding to the periphery of the pad 6 so that the metal body 2 and the substrate surface It is considered that this object can be achieved not only by closing the gap, but also by a structure in which the guide piece 4 is formed in accordance with the shape of the symbol mark 9 itself and only the symbol mark 9 is covered. However, the symbol mark 9 is often formed as a character, and it is difficult to form the guide piece 4 having a shape corresponding to this, which is not practical. Further, since the symbol mark 9 is not formed with high accuracy, it is not preferable to form the guide piece 4 with the symbol mark 9 as a reference because it causes a decrease in yield. In the present invention, the guide piece 4 is formed with reference to the pad 6 formed with high positional accuracy, and as a result, the yield is prevented from being lowered.
１：メタルマスク、２：メタル本体、３：貫通孔、４：ガイド片、５：プリント基板、６：パッド、７：境界領域、８：印字領域、９：シンボルマーク、１０：基本絶縁層、１１：表面絶縁層、１２：先端面、１３：ドライフィルム、１４：ワークフィルム、１４ａ：透明部、１４ｂ：遮光部、１５：硬化部、１６：金属板、１７：露出部、１８：溝部、１９：突出部、２０： 1: metal mask, 2: metal body, 3: through hole, 4: guide piece, 5: printed circuit board, 6: pad, 7: boundary area, 8: printing area, 9: symbol mark, 10: basic insulating layer, 11: surface insulating layer, 12: tip surface, 13: dry film, 14: work film, 14a: transparent part, 14b: light shielding part, 15: hardened part, 16: metal plate, 17: exposed part, 18: groove part, 19: protrusion, 20:

Claims (2)

  1. 　絶縁材料からなる基本絶縁層と、
    　該基本絶縁層の表面にパターン状に形成された導電材料からなるパッドと、
    　該パッド以外の前記基本絶縁層の表面に形成された表面絶縁層と、
    　該表面絶縁層の表面から突出して形成されたシンボルマークと、
    　前記表面絶縁層の表面の一部として前記パッドとの境界近傍に形成された境界領域と、
    　該境界領域以外の前記表面絶縁層の表面の一部として前記シンボルマークが形成されている印字領域とを備えた基板に対して載置されるべきメタルマスクであって、
    　略板形状のメタル本体と、
    　該メタル本体に前記パッドと同一のパターン状に形成された貫通孔と、
    　該貫通孔の縁に沿って前記基板に向けて延びているガイド片と、
    　該ガイド片の突出した側の先端に面として形成されている先端面とを備え、
    　前記先端面は前記境界領域に密着する形状であり、
    　前記メタル本体は前記印字領域を覆う位置に対応して形成されていることを特徴とするメタルマスク。     A basic insulating layer made of an insulating material;
    A pad made of a conductive material formed in a pattern on the surface of the basic insulating layer;
    A surface insulating layer formed on the surface of the basic insulating layer other than the pad;
    A symbol mark formed protruding from the surface of the surface insulating layer;
    A boundary region formed in the vicinity of the boundary with the pad as a part of the surface of the surface insulating layer;
    A metal mask to be placed on a substrate provided with a printing region in which the symbol mark is formed as a part of the surface of the surface insulating layer other than the boundary region,
    A substantially plate-shaped metal body;
    A through hole formed in the metal body in the same pattern as the pad;
    A guide piece extending toward the substrate along an edge of the through hole;
    A tip surface formed as a surface at the tip of the protruding side of the guide piece,
    The tip surface has a shape that is in close contact with the boundary region;
    The metal mask, wherein the metal body is formed corresponding to a position covering the print area.
  2. 　前記メタル本体となるべき金属板の一方の表面にドライフィルムを貼付けるドライフィルム貼り付け工程と、
    　前記ドライフィルムに透明部及び遮光部を有するワークフィルムを貼付けるワークフィルム貼り付け工程と、
    　前記ワークフィルム側から露光機にて露光して前記透明部に対応している前記ドライフィルムを硬化させて硬化部を形成するする露光工程と、
    　前記ワークフィルムを除去するワークフィルム除去工程と、
    　現像液にて前記硬化部以外の前記ドライフィルムを除去して前記金属板の一部である露出部を露出させるドライフィルム除去工程と、
    　エッチング液にて前記露出部を溶解させて溝形状の溝部を形成する溝部形成工程と、
    　前記硬化部を除去して前記溝部以外の前記金属板の表面の一部である突出部を形成する硬化部除去工程と、
    　前記突出部周縁部を前記ガイド片として該ガイド片の内側を貫通して前記貫通孔を形成する貫通孔形成工程とを備え、
    　前記遮光部は、前記印字領域に対応した位置に形成され、
    　前記貫通孔は、平面視にて前記パッドの外縁の形状と同一形状に形成されることを特徴とする請求項１に記載のメタルマスクの製造方法。     A dry film attaching step of attaching a dry film to one surface of the metal plate to be the metal body;
    A work film pasting step of pasting a work film having a transparent part and a light shielding part on the dry film;
    An exposure step of forming a cured part by curing the dry film corresponding to the transparent part by exposing with an exposure machine from the work film side;
    A work film removal step of removing the work film;
    A dry film removing step of removing the dry film other than the cured portion with a developer to expose an exposed portion which is a part of the metal plate;
    A groove forming step of forming the groove-shaped groove by dissolving the exposed portion with an etching solution;
    A cured portion removing step of removing the cured portion to form a protruding portion that is a part of the surface of the metal plate other than the groove portion;
    A through hole forming step of forming the through hole by penetrating the inside of the guide piece with the protruding portion peripheral edge as the guide piece,
    The light shielding portion is formed at a position corresponding to the printing area,
    The method of manufacturing a metal mask according to claim 1, wherein the through hole is formed in the same shape as the outer edge of the pad in plan view.
PCT/JP2016/084971 2016-11-25 2016-11-25 Metal mask and manufacturing method for same WO2018096649A1 (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311856U (en) * 1986-07-07 1988-01-26
JPH03228392A (en) * 1990-02-02 1991-10-09 Hitachi Ltd Printed board
JPH05208571A (en) * 1992-01-31 1993-08-20 Fujitsu Isotec Ltd Multi-layer metal mask
JPH0632078A (en) * 1992-07-16 1994-02-08 Kyushu Hitachi Maxell Ltd Metal mask and its production
JPH11321146A (en) * 1998-05-21 1999-11-24 Sony Corp Mask for solder-printing, and its manufacture
JP2005262830A (en) * 2004-03-22 2005-09-29 Sharp Corp Mask for creamy solder printing, printing pallet, and mounting method for electronic component
JP2007152613A (en) * 2005-12-01 2007-06-21 Taiyo Kagaku Kogyo Kk Manufacturing method of metal mask plate for screen printing, and metal mask plate for screen printing
JP2014110401A (en) * 2012-12-04 2014-06-12 Dainippon Printing Co Ltd Method of forming paste bump

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6311856U (en) * 1986-07-07 1988-01-26
JPH03228392A (en) * 1990-02-02 1991-10-09 Hitachi Ltd Printed board
JPH05208571A (en) * 1992-01-31 1993-08-20 Fujitsu Isotec Ltd Multi-layer metal mask
JPH0632078A (en) * 1992-07-16 1994-02-08 Kyushu Hitachi Maxell Ltd Metal mask and its production
JPH11321146A (en) * 1998-05-21 1999-11-24 Sony Corp Mask for solder-printing, and its manufacture
JP2005262830A (en) * 2004-03-22 2005-09-29 Sharp Corp Mask for creamy solder printing, printing pallet, and mounting method for electronic component
JP2007152613A (en) * 2005-12-01 2007-06-21 Taiyo Kagaku Kogyo Kk Manufacturing method of metal mask plate for screen printing, and metal mask plate for screen printing
JP2014110401A (en) * 2012-12-04 2014-06-12 Dainippon Printing Co Ltd Method of forming paste bump

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