JP2003188497A - Method of forming conductor circuit - Google Patents

Method of forming conductor circuit

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Publication number
JP2003188497A
JP2003188497A JP2001385103A JP2001385103A JP2003188497A JP 2003188497 A JP2003188497 A JP 2003188497A JP 2001385103 A JP2001385103 A JP 2001385103A JP 2001385103 A JP2001385103 A JP 2001385103A JP 2003188497 A JP2003188497 A JP 2003188497A
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insulating substrate
conductor circuit
repellent film
forming
water
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Pending
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JP2001385103A
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Japanese (ja)
Inventor
Shingo Kawasaki
Koji Yato
真吾 川崎
浩司 矢頭
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Yasunaga Corp
株式会社安永
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Abstract

PROBLEM TO BE SOLVED: To provide a method by which a high-density fine conductor circuit can be formed appropriately.
SOLUTION: After a water-repellent film is formed on the surface of an insulating substrate, the water-repellent film is partially removed by projecting a laser beam upon portions to be removed of the film in accordance with the wiring pattern of a conductor circuit to be formed on the insulating substrate. Then the wiring pattern of the conductor circuit is written on the insulating substrate by spraying ink grains containing independently dispersed hyperfine grains upon exposed areas of the insulating substrate formed by removing the water-repellent film by using an inkjet nozzle.
COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、所定の絶縁基板上に、例えば線幅20μmの微細な配線パターンからなる導体回路を形成するに好適な導体回路の形成方法に関する。 BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to certain insulating substrate, for example, suitable conductor circuit to form a conductor circuit comprised of fine wiring pattern having a line width of 20μm It relates to a method for forming. 【0002】 【関連する背景技術】半導体集積回路の高性能・高機能化、更には各種抵抗やコンデンサ等からなるチップ部品の微小化に伴い、これらの電子部品を搭載する印刷回路基板における導体回路の配線パターン幅や、その接続端子部をなすランド等の高密度微細化が進められている。 [0002] High performance and functionality of the Related Art Semiconductor integrated circuits, and more with the miniaturization of chip components including various resistors and capacitors and the like, the conductor circuit in the printed circuit board for mounting these electronic components wiring pattern width and high density miniaturized lands such as forming the connection terminal portion is promoted.
特にビルドアップ基板において多ピンフリップチップ接続を実現するような場合には、導体回路の配線ピッチを20μm、そのビア/ランド径を30/50μm程度に微細化することが要求されている。 Especially when the build-up substrate so as to realize the multi-pin flip-chip connection, 20 [mu] m the wiring pitch of the conductor circuit, it has been required to be miniaturized and the via / land diameter of about 30/50 [mu] m. 【0003】 【発明が解決しようとする課題】しかしながら従来一般的なサブトラクティブ法(導体膜のパターンエッチング処理)やアディティブ法(例えばスクリーン印刷)による導体回路の形成技術においては、導体回路のパターン幅やそのスペース幅を30μm程度に設定することが限界である。 [0003] The present invention is however in the technique of forming conductor circuits according to the prior common subtractive method (pattern etching of the conductive film) and additive method (such as screen printing), a conductor circuit pattern width and it is critical to set the space width of about 30 [mu] m. また最近では導電性の微粒子を含むトナーを用い、レーザビーム照射により描画した静電潜像担持体(感光体ドラム)を用いて導体回路を転写形成する技術も提唱されている。 The use of a toner containing conductive fine particles and recently, it has also been proposed a technique for transferring forming a conductor circuit by using the electrostatic latent image bearing member (photosensitive drum) drawn by the laser beam irradiation. しかしその装置自体の構成が大掛かりである等の問題がある。 But construction of the device itself has problems such a large-scale. 【0004】本発明はこのような事情を考慮してなされたもので、その目的は、簡易にして効果的に高密度で微細な導体回路を形成するに好適な導体回路の形成方法を提供することにある。 [0004] The present invention has been made in view of such circumstances, and its object is to provide a method of forming a suitable conductor circuit to form a fine conductor circuit is effectively a high density and a simple It lies in the fact. 【0005】 【課題を解決するための手段】上述した目的を達成するべく本発明に係る導体回路の形成方法は、所定の絶縁基体上に導体回路を形成するに際して、前記絶縁基体の表面に撥水加工膜を形成した後、前記絶縁基体上に形成すべき導体回路の配線パターンに応じて上記撥水加工膜にレーザ光を照射して該レーザ光照射部位の撥水加工膜を除去し、次いで前記絶縁基体の上記撥水加工膜の除去により露出した領域に、インクジェットノズルを用いて導電性の独立分散超微粒子を含むインク粒を噴射して前記配線パターンを描画してなることを特徴としている。 [0005] Means for Solving the Problems] method for forming a conductive circuit according to the present invention in order to achieve the above object, in forming a conductor circuit on a given dielectric substrate repellent to a surface of said insulating substrate after forming the water processed film is irradiated with laser light to the water repellent film is removed water repellent film of said laser beam irradiation site in accordance with the wiring pattern of the conductor circuit to be formed on the insulating substrate, then the region exposed by the removal of the water repellent film of the insulating substrate, as characterized by being drawn the wiring pattern by ejecting ink particles containing conductive independent dispersed ultrafine particles using a jet nozzle there. 【0006】即ち、本発明に係る導体回路の形成方法は、インクジェットノズルを用いて、例えば銅、銀、 Namely, the method of forming the conductor circuit according to the present invention, by using an ink jet nozzle, for example, copper, silver,
金、パラジウム、ニッケル等の導電性素材をナノレベルに微粒化した導電性超微粒子を含む微小径のインク粒を噴射しながら所定の絶縁基体上に導体回路パターンを描画していくものであって、特に上記絶縁基体の表面に、 Gold, palladium, conductive material such as nickel be those going by drawing a conductor circuit pattern on a predetermined insulating substrate while spraying the ink particles of small diameter comprising a conductive ultrafine particles atomized nano level , especially the surface of the insulating substrate,
予めフッ素系樹脂等をコーティングして撥水加工膜を形成し、該絶縁基体に形成すべき導体回路の配線パターンに応じて前記撥水加工膜にレーザ光を照射して該レーザ光照射部位の撥水加工膜を除去し、この撥水加工膜の除去により露出した領域に前記インク粒を噴射することで、前記撥水加工膜によりインク粒による描画パターン幅を規定した高密度で微細な導体回路を形成することを特徴としている。 Pre fluorine-based resin or the like is coated to form a water repellent film, of the laser beam irradiation site is irradiated with laser light to the water repellent film according to the wiring pattern of the conductor circuit to be formed on the insulating substrate removing the water repellent film, by injecting the ink particles to the exposed region by the removal of the water repellent film, a high density and fine conductors defining a drawing pattern width by ink particles by the water repellent film It is characterized by forming a circuit. 【0007】 【発明の実施の形態】以下、図面を参照して本発明の一実施形態に係る導体回路の形成方法について説明する。 DETAILED DESCRIPTION OF THE INVENTION Hereinafter, a method for forming a conductive circuit according to an embodiment of the present invention with reference to the drawings.
図1はこの実施形態に係る導体回路の形成方法の概略的な処理手順を示す図であって、1は導体回路の形成対象とする絶縁基板(絶縁基体)を示している。 Figure 1 is a diagram showing a schematic procedure of a method for forming a conductive circuit according to this embodiment, 1 denotes an insulating substrate to form the subject of the conductor circuits (insulating base). この絶縁基板1は、例えばポリイミド系やガラスエポキシ系の、いわゆるプリント配線回路用基板からなる。 The insulating substrate 1, for example of polyimide or glass epoxy, consisting substrate for the so-called printed circuit. 【0008】この絶縁基板1に対する導体回路の形成は、例えば銅、銀、金、パラジウム、ニッケル等の導電性素材をナノレベルに微粒化した超微粒子(ナノ粒子) [0008] Formation of the conductor circuit for the insulating substrate 1, for example, copper, silver, gold, palladium, ultrafine particles (nanoparticles) of an electrically conductive material such as nickel atomized nano level
を独立分散させたペースト状のインクを、図2に示すようにインクジェットノズル2を用いて微小径のインク粒3として噴射しながら、上記絶縁基板1上に所定の導体パターン4を描画することによって行われる。 Independently dispersed paste ink was a while ejecting the ink particles 3 of small diameter by using an ink jet nozzle 2 as shown in FIG. 2, by drawing the predetermined conductor pattern 4 on the insulating substrate 1 It takes place. この導体パターン4の描画は、例えば絶縁基板1を載置したX- Drawing the conductive pattern 4, for example, placing the insulating substrate 1 X-
Yテーブルを、該絶縁基板1に形成すべき導体回路の配線パターンに応じて移動させながら行われる。 The Y table, is performed while moving in accordance with the wiring pattern of the conductor circuit to be formed on the insulating substrate 1. 尚、X- In addition, X-
Yテーブルを用いて絶縁基板1を移動することに代えて、インクジェットノズル2をX-Y方向に変位させながら配線パターンを描画することも勿論可能である。 Instead of moving the insulating substrate 1 using a Y table, it is also possible to draw a wiring pattern while displacing the ink-jet nozzle 2 onto the X-Y direction. 【0009】ちなみに上記インクジェットノズル2は、 [0009] By the way, the ink jet nozzle 2,
例えば発熱を伴うことなく駆動されて前記ナノ粒子の分散を保ちながら20μm径程度の微小径のインク粒を噴射するピエゾ駆動方式のインクジェットヘッドに組み込まれたものからなる。 For example, it is driven without heating consisting of those incorporated in the ink-jet head of piezoelectric driving method for injecting fine diameter of the ink particle of 20μm diameter of about keeping the dispersion of the nanoparticles. そして前述したX-Yテーブルとの相対的な移動により、その描画点の連なりとして導体パターン4を形成していくように構成される。 And the relative movement of the X-Y table described above, and as will form the conductive pattern 4 as a series of the drawing point. 【0010】この発明に係る導体回路の形成方法は、上述したインクジェットノズル2を用いて導電性のナノ粒子を含むインクをジェット噴射して前記絶縁基板1上に導体回路を描画するに際し、図1に示すように先ず絶縁基板1の表面をフッ素系樹脂を用いる等して撥水加工し(撥水加工処理11)、図3(a)に示すように絶縁基板1の表面を撥水加工膜5にてコーティングする。 [0010] Upon formation method of the conductor circuit according to the present invention draws the conductor circuits on the insulating substrate 1 of the ink containing the nanoparticles of conductivity by jetting using an inkjet nozzle 2 described above, FIG. 1 on the first surface of the insulating substrate 1 as shown by such as using a fluorine-based resin and water-repellent (water-repellent treatment 11), water-repellent film surface of the insulating substrate 1 as shown in FIG. 3 (a) coating at 5. 【0011】そして絶縁基板1の表面に形成した撥水加工膜5に、該絶縁基板1に形成すべき導体回路の配線パターンに応じて図3(b)に示すようにレーザ光を照射し、そのレーザ光照射部位の撥水加工膜5を除去し(レーザ光描画処理12)、これによって前記配線パターンに応じて絶縁基板1の表面を露出させる。 [0011] And water repellent film 5 formed on the surface of the insulating substrate 1, a laser beam is irradiated as shown in FIG. 3 (b) in accordance with the wiring pattern of the conductor circuit to be formed on the insulating substrate 1, As the laser light irradiation removes water repellent film 5 parts (laser beam marking process 12), thereby exposing the surface of the insulating substrate 1 according to the wiring pattern. このレーザ光描画処理12は、前記撥水加工膜5にて表面がコーティングされた絶縁基板1をX-Yテーブル12a上に載置し、描画制御装置13の制御の下でX-Yテーブル12 The laser beam drawing process 12, the insulating substrate 1 whose surface is coated with the water repellent film 5 is placed on the X-Y table 12a, X-Y table 12 under the control of the drawing control unit 13
aを移動駆動しながらレーザ装置12bからレーザ光を照射することによって行われる。 While moving drives a carried out by irradiating a laser beam from the laser device 12b. 【0012】この際、レーザ光の照射により絶縁基板1 [0012] insulating substrate 1 by irradiation of this time, the laser beam
の表面が図3(c)に示すように掘削されて粗地化されるような場合には、絶縁基板11の表面を洗浄してその掘削カスを除去した後(洗浄処理14)、絶縁基板1を乾燥させる(乾燥処理15)。 If the surface is as excavated crude underground as shown in FIG. 3 (c) of, after removing the drilling debris and clean the surface of the insulating substrate 11 (cleaning process 14), an insulating substrate 1 is dried (drying 15). しかしレーザ光の照射により絶縁基板1上の撥水加工膜5を除去し、絶縁基板1の表面のレーザ光照射部位を露出させるだけであるならば、上述した洗浄・乾燥処理14,15は不要である。 But by laser light irradiation to remove water repellent film 5 on the insulating substrate 1, if only to expose the laser beam irradiated portion of the surface of the insulating substrate 1, the cleaning and drying, 15 as described above unnecessary it is. 【0013】しかる後、レーザ光の照射により撥水加工膜5を配線パターンに応じて部分的に除去した絶縁基板1をX-Yテーブル16aに載置し、前述したインクジェットノズル2を備えたインクジェット装置16bを用いて前記導電性ナノ粒子を含むインク粒を上記絶縁基板1に噴射して導体回路を描画形成する(導体回路描画処理16)。 [0013] inkjet Thereafter, the insulating substrate 1 is partially removed in accordance with the water repellent film 5 to the wiring pattern by the laser light irradiation is placed onto the X-Y table 16a, with the ink jet nozzle 2 described above the ink particles containing the conductive nano particles using apparatus 16b forming by drawing a conductor circuit by injecting the above insulating substrate 1 (the conductor circuit drawing process 16). この導体回路の描画は、前記描画制御装置1 Drawing of the conductor circuit, the drawing control unit 1
3の制御の下で絶縁基板1上に形成すべき配線パターンに応じてX-Yテーブル16aを駆動しながら行われる。 It performed while driving the X-Y table 16a according to the wiring pattern to be formed on the insulating substrate 1 under the control of 3. 特にこのインク粒の噴射による導体回路の描画は、 In particular the drawing of the conductor circuit of the ink particles of the injection,
予めX-Yテーブル16aに対する絶縁基板1の載置位置を、例えば絶縁基板1に設けた位置合わせマーク等を利用して高精度に規定した上で行われる。 The mounting position of the insulating substrate 1 for pre-X-Y table 16a, for example, is performed on that by using an alignment mark or the like provided in the insulating substrate 1 defined with high precision. これによって前述したレーザ光の照射によって絶縁基板1を露出させた領域だけにインク粒が噴射され、図3(d)に示すように導電性ナノ粒子を含むインク6による導体回路の描画が行われる。 This ink particles are injected only in the area to expose the insulating substrate 1 by the irradiation of the laser light described above, the drawing of the conductor circuit due to ink 6 containing conductive nanoparticles is performed as shown in FIG. 3 (d) . 【0014】その後、必要に応じて前記撥水加工膜5を洗浄除去し(洗浄処理17)、絶縁基板1を乾燥させることで(乾燥処理18)、図3(e)に示すように絶縁基板1上に導電性ナノ粒子を含むインク6により描画された導体回路が形成されることになる。 [0014] Thereafter, washing and removing the water repellent film 5 as required (cleaning process 17), the insulating substrate 1 by drying (drying process 18), the insulating substrate as shown in FIG. 3 (e) so that the conductor circuit is rendered by the ink 6 containing conductive nanoparticles onto 1 is formed. 尚、撥水加工膜5 In addition, water-repellent film 5
が絶縁性のあるフッ素系樹脂からなる場合には、この撥水加工膜5をそのまま残しておくことも可能である。 There when made of a fluorine resin with insulating properties, it is also possible to leave intact the water repellent film 5. 従ってこの場合には、上記洗浄・乾燥処理17,18が不要となる。 Therefore, in this case, the cleaning and drying 17 becomes unnecessary. 【0015】かくして上述した如くして導電性ナノ粒子を含むインク6をインクジェットノズル2から噴出して絶縁基板1上に導体回路を形成するに際して、予め絶縁基板1の表面に撥水加工膜5を形成し、この撥水加工膜5にレーザ光を照射して前記絶縁基板1上に形成すべき導体回路の配線パターンに応じた露出領域を形成した後、この露出領域に導電性ナノ粒子を含むインク6を噴出するので、該インク6が絶縁基板1の表面に拡がってその描画線幅が太くなることがない。 [0015] Thus when the ink 6 comprising as to conductive nanoparticles described above with jetted from the inkjet nozzle 2 to form a conductor circuit on an insulating substrate 1, a water repellent film 5 in advance insulating surface of the substrate 1 formed, after forming the exposed region corresponding to the wiring pattern of the conductor circuit to be formed on the insulating substrate 1 is irradiated with laser light to the water repellent film 5 comprises a conductive nanoparticles on the exposed area since ejecting ink 6, the ink 6 is never the drawing line width becomes thick spread on the surface of the insulating substrate 1. 【0016】即ち、その表面を撥水加工することなく絶縁基板1の表面に導電性ナノ粒子を含むインク6をジェット噴射した場合、図4に模式的に示すようにインクジェットノズル2から噴出されたインク粒6が直径20μ [0016] That is, when the ink 6 containing conductive nanoparticles on the surface of the insulating substrate 1 was jetting without the surfaces water-repellent, ejected from the ink jet nozzle 2 as schematically shown in FIG. 4 ink particles 6 in diameter 20μ
m程度の微小径なものであっても、絶縁基板1の濡れ性により該絶縁基板1の表面に付着した際、そのインク塊7は直径100μm程度に拡がることが否めない。 Even a very small diameter of the ones about m, when attached to the surface of the insulating substrate 1 by the wettability of the insulating substrate 1, the ink lumps 7 undeniable be spread diameter of about 100 [mu] m. この点、上述したように絶縁基板1の表面にコーティングした撥水加工膜5にレーザ光を照射し、絶縁基板1に形成すべき導体回路の配線パターン幅に応じた領域だけを露出させ、この露出領域にインク粒6を噴射すれば、そのインクは撥水加工膜5により撥水されて絶縁基板1の露出領域にだけ付着することになる。 In this regard, a laser beam is irradiated to the water repellent film 5 coated on the surface of the insulating substrate 1 as described above, to expose only the region corresponding to the wiring pattern width of the conductor circuit to be formed on the insulating substrate 1, the if ejects ink particles 6 in the exposed area, the ink will adhere only to the exposed area of ​​the water-repellent insulating substrate 1 by water-repellent film 5. この結果、微小径のインク粒6は絶縁基板1の表面に拡がることなく、レーザ光の照射により撥水加工膜5を除去して開口した絶縁基板1の露出領域にだけ付着することになり、ここに微細な線幅の導体回路を高精度に描画形成することが可能となる。 As a result, ink particles 6 of small diameter will be adhered only to the exposed region of the insulating substrate 1 without, which opens to remove the water repellent film 5 by irradiation of the laser beam that spreads on the surface of the insulating substrate 1, here it is possible to draw forming a conductor circuit of fine line width with high accuracy. 【0017】特に前述したようにレーザ光の照射により絶縁基板1の表面を粗地化しておけばインクの付着強度を効果的に高めることができるので、耐剥離性(密着性)に優れた導体回路を容易に形成することが可能となる等の実用上多大なる効果が奏せられる。 [0017] In particular, since the laser light irradiation as described above can increase the adhesion strength of the ink if by crude underground surface of the insulating substrate 1 effectively, the conductor having excellent peeling resistance (adhesion) practically tremendous effect such it is possible to form a circuit easily be Sose. また導電性のナノ粒子を含むインク粒6をジェット噴射して導電回路を描画形成するので、電気伝導度の高い、つまり導電抵抗の小さい微細パターンからなる導電回路を容易に形成することができる等の効果が奏せられる。 Since the ink particles 6 comprising nanoparticles of a conducting writing and forming a conductive circuit by jetting, high electrical conductivity, that is such a conductive circuit formed of a small fine pattern of conductive resistance can be easily formed effect of are obtained if. 【0018】尚、本発明は上述した実施形態に限定されるものではない。 [0018] The present invention is not limited to the embodiments described above. 例えばナノ粒子を含むインクの粘性は、インクジェットノズル2のノズル径やインク噴出力等に応じて定めれば良いものである。 For example the viscosity of the ink containing nanoparticles are those that may be determined depending on the nozzle diameter and the ink ejection force or the like of the ink jet nozzles 2. また撥水加工膜5 The water-repellent film 5
の種別やその厚みについては、絶縁基板1の種別や導体回路の配線パターン幅等に応じて定めれば良いものである。 For the type and the thickness thereof, it is those which may be determined according to the wiring pattern width of the type and the conductor circuit of the insulating substrate 1. またここではプリント配線回路用の印刷基板に導体回路を形成する例について示したが、その他の絶縁体上に導体回路を形成する場合にも同様に適用することができる。 Although shown for example in forming a conductor circuit on the print board for printed wiring circuit here it can be similarly applied to the case of forming a conductor circuit on the other insulating member. 【0019】また撥水加工膜5にレーザ光を照射する際に描画制御するX-Yテーブル12aと、絶縁基板1にナノ粒子を含むインク粒6を噴射する際に用いるX-Y [0019] use in injection and X-Y table 12a for controlling rendering when irradiating a laser beam to the water repellent film 5, the ink particles 6 comprising nanoparticles on the insulating substrate 1 X-Y
テーブル16aとして同じものを用いることの勿論可能である。 Of course possible to use the same as a table 16a. その他、本発明はその要旨を逸脱しない範囲で種々変形して実施することができる。 Besides, the present invention can be modified in various ways without departing from the scope thereof. 【0020】 【発明の効果】以上説明したように本発明によれば、絶縁基体の表面に設けた撥水加工膜にレーザ光を照射し、 According to the present invention described above, according to the present invention, a laser beam is irradiated to the water repellent film provided on a surface of the insulating substrate,
上記絶縁基体に形成すべき導体回路の配線パターンに応じて上記撥水加工膜をパターニングして絶縁基体を露出させ、この絶縁基体の露出領域に導電性の独立分散超微粒子を含むインク粒をジェット噴射して導体回路を描画するので、簡易にして効果的に微細な配線パターンからなる導体回路を高精度に形成することができる。 Depending on the wiring pattern of the conductor circuit to be formed on the insulating substrate to expose the patterned insulating substrate to the water repellent film, a jet of ink particles containing conductive independent dispersed ultrafine particles to the exposed region of the insulating substrate since injection to draw the conductor circuit, it is possible to form a conductor circuit comprised of effectively fine wiring pattern with easily with high accuracy. 従ってその実用的利点が多大である。 Therefore its practical benefits are great.

【図面の簡単な説明】 【図1】本発明の一実施形態に係る導体回路の形成方法の概略的な処理手順を示す図。 It shows a schematic procedure of a method for forming a conductive circuit according to an embodiment of the BRIEF DESCRIPTION OF THE DRAWINGS [Figure 1] present invention. 【図2】インクジェットノズルを用いたインク粒の噴射による導体回路の描画形成の概念を示す図。 FIG. 2 shows a conceptual drawing formation of the conductor circuit due to the ink particle jetting using an inkjet nozzle. 【図3】本発明に係る導体回路の形成手順を段階的に示す模式図。 Schematic diagram showing stepwise the procedure for forming the conductor circuit according to the present invention; FIG. 【図4】絶縁基板に付着するインク粒の濡れ性による拡がりの様子を示す図。 4 is a diagram showing a state of spread due to ink particle wettability adhering to the insulating substrate. 【符号の説明】 1 絶縁基板(絶縁基体) 2 インクジェットノズル3 導電性のナノ粒子を含むインク粒5 撥水加工膜12 レーザ光描画処理16 導体回路描画処理 [EXPLANATION OF SYMBOLS] 1 insulating substrate (insulating substrate) 2 ink particles comprising an inkjet nozzle 3 conductive nanoparticles 5 water repellent film 12 laser light drawing processing 16 conductor circuit drawing process

フロントページの続き Fターム(参考) 4E351 AA03 AA04 BB01 BB31 CC11 DD04 DD05 DD06 DD19 DD20 DD52 EE01 GG20 5E343 AA02 AA15 AA17 AA18 AA37 BB03 BB23 BB24 BB25 BB44 BB48 BB72 DD17 EE32 FF05 GG08 Front page of the continued F-term (reference) 4E351 AA03 AA04 BB01 BB31 CC11 DD04 DD05 DD06 DD19 DD20 DD52 EE01 GG20 5E343 AA02 AA15 AA17 AA18 AA37 BB03 BB23 BB24 BB25 BB44 BB48 BB72 DD17 EE32 FF05 GG08

Claims (1)

  1. 【特許請求の範囲】 【請求項1】 所定の絶縁基体上に導体回路を形成するに際し、 前記絶縁基体の表面に撥水加工膜を形成した後、前記絶縁基体上に形成すべき導体回路の配線パターンに応じて上記撥水加工膜にレーザ光を照射して該レーザ光照射部位の撥水加工膜を除去し、 次いで前記絶縁基体の上記撥水加工膜の除去により露出した領域に、インクジェットノズルを用いて導電性の超微粒子を含むインク粒を噴射して前記配線パターンを描画してなることを特徴とする導体回路の形成方法。 When forming the conductor circuit to the Claims 1] predetermined insulation on the substrate, wherein after forming the water-repellent film on the surface of the insulating base, the conductive circuit to be formed on the insulating substrate by irradiating a laser beam to the water repellent film is removed water repellent film of said laser beam irradiation site in accordance with the wiring pattern, then the region exposed by the removal of the water repellent film of the insulating substrate, an inkjet method of forming a conductor circuit, characterized by comprising drawing the wiring pattern by ejecting ink particles containing conductive ultrafine particles using a nozzle. 【請求項2】 前記撥水加工膜は、フッ素系の素材からなり、 前記導電性の超微粒子は、銅、銀、金、パラジウム、ニッケル等の導電性素材をナノレベルに微粒化したものであって、前記インクジェットノズルは、上記超微粒子を独立分散させて含有したペースト状のインクを粒子化して噴射するものである請求項1に記載の導体回路の形成方法。 Wherein said water repellent film is made of fluorine-based material, the conductive ultrafine particles, copper, silver, gold, palladium, conductive material such as nickel which was atomized nano level there are, the inkjet nozzles, the method of forming the conductor circuit of claim 1 is for injection into particles a paste-like ink containing by independently dispersing the ultrafine particles.
JP2001385103A 2001-12-18 2001-12-18 Method of forming conductor circuit Pending JP2003188497A (en)

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Cited By (12)

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JP2005339808A (en) * 2004-05-24 2005-12-08 Ricoh Co Ltd Functional element substrate and manufacturing apparatus thereof
JP2007277526A (en) * 2006-03-17 2007-10-25 Matsushita Electric Ind Co Ltd Conductive resin composition, connection method between electrodes using the composition and method for electrically connecting electronic component to printed circuit board
JP2007299988A (en) * 2006-05-01 2007-11-15 Sij Technology:Kk Electric connector, method for forming same, and cartridge
US7405156B2 (en) 2004-07-07 2008-07-29 Nec Lcd Technologies, Ltd. Method of forming wiring pattern
JP2009094412A (en) * 2007-10-11 2009-04-30 Sumitomo Chemical Co Ltd Manufacturing method for wiring board, display device and thin-film active-element substrate
JP2009094153A (en) * 2007-10-04 2009-04-30 Olympus Corp Wiring board and method of manufacturing the same
JP2011044481A (en) * 2009-08-19 2011-03-03 Roland Dg Corp Manufacturing device for electronic circuit board
JP2011512644A (en) * 2007-12-11 2011-04-21 インクテック カンパニー リミテッド Method for producing a blackened conductive pattern
JP2011091351A (en) * 2009-10-23 2011-05-06 Samsung Electro-Mechanics Co Ltd Trench substrate, and method of manufacturing the same
JP2011139097A (en) * 2005-04-25 2011-07-14 Brother Industries Ltd Method for forming pattern
WO2012161517A2 (en) * 2011-05-23 2012-11-29 주식회사 아모그린텍 Flexible printed circuit board and manufacturing method thereof
JP2014017360A (en) * 2012-07-09 2014-01-30 Ricoh Co Ltd Wiring formation method and wiring formation device

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005339808A (en) * 2004-05-24 2005-12-08 Ricoh Co Ltd Functional element substrate and manufacturing apparatus thereof
US7405156B2 (en) 2004-07-07 2008-07-29 Nec Lcd Technologies, Ltd. Method of forming wiring pattern
US8435440B2 (en) 2005-04-25 2013-05-07 Brother Kogyo Kabushiki Kaisha Method for forming a conductive pattern and a wired board
JP2011139097A (en) * 2005-04-25 2011-07-14 Brother Industries Ltd Method for forming pattern
US8647560B2 (en) 2005-04-25 2014-02-11 Brother Kogyo Kabushiki Kaisha Method for forming pattern and a wired board
JP2007277526A (en) * 2006-03-17 2007-10-25 Matsushita Electric Ind Co Ltd Conductive resin composition, connection method between electrodes using the composition and method for electrically connecting electronic component to printed circuit board
JP2007299988A (en) * 2006-05-01 2007-11-15 Sij Technology:Kk Electric connector, method for forming same, and cartridge
JP2009094153A (en) * 2007-10-04 2009-04-30 Olympus Corp Wiring board and method of manufacturing the same
JP2009094412A (en) * 2007-10-11 2009-04-30 Sumitomo Chemical Co Ltd Manufacturing method for wiring board, display device and thin-film active-element substrate
JP2011512644A (en) * 2007-12-11 2011-04-21 インクテック カンパニー リミテッド Method for producing a blackened conductive pattern
JP2011044481A (en) * 2009-08-19 2011-03-03 Roland Dg Corp Manufacturing device for electronic circuit board
JP2011091351A (en) * 2009-10-23 2011-05-06 Samsung Electro-Mechanics Co Ltd Trench substrate, and method of manufacturing the same
WO2012161517A2 (en) * 2011-05-23 2012-11-29 주식회사 아모그린텍 Flexible printed circuit board and manufacturing method thereof
WO2012161517A3 (en) * 2011-05-23 2013-03-14 주식회사 아모그린텍 Flexible printed circuit board and manufacturing method thereof
JP2014017360A (en) * 2012-07-09 2014-01-30 Ricoh Co Ltd Wiring formation method and wiring formation device

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