JP2003318516A - Method and device for forming film, electronic apparatus, and method of manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a wiring pattern to be flattened and reduced in wire width. <P>SOLUTION: A wiring pattern forming method comprises a first discharge process of discharging out droplets containing a film forming component on a substrate W to form a film pattern, a drying process for drying out the film pattern so as to move the film forming component contained in the liquid discharged out on the substrate W to the edges 21 of the film pattern, and a second discharge process of discharging out droplets between the edges 21 protruding upright by the movement of the film forming component. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film forming method and device, an electronic apparatus, and a device manufacturing method.

[0002]

2. Description of the Related Art Lithography is used, for example, in the manufacture of wiring used in electronic circuits or integrated circuits. In this lithography method, a wiring is formed by applying a photosensitive material called a resist on a substrate on which a conductive film has been applied in advance, irradiating a circuit pattern for development, and etching the conductive film according to the resist pattern. is there.
This lithography method requires large-scale equipment such as a vacuum device and complicated steps, and the material usage efficiency is about several percent, and most of it must be discarded, resulting in high manufacturing cost.

On the other hand, in US Pat. No. 5,132,248, a liquid material in which conductive fine particles are dispersed is directly pattern-coated on a substrate by a droplet discharge method, and then heat treatment or laser irradiation is performed to convert it into a conductive film pattern. The method of doing is proposed. This method eliminates the need for photolithography, greatly simplifies the process, and
It has the advantage of using less raw materials.

As described above, when patterning is performed by the droplet discharge method, the obtained pattern shape greatly changes due to factors such as the wettability of the surface of the substrate, the intervals between the discharged droplets, and the physical properties of the liquid material. It is necessary to pay attention to each of these factors in order to obtain a good line pattern, for example.

For example, in order to obtain a thick and fine functional film pattern, the surface of the substrate is made liquid repellent, but if the surface of the substrate is liquid repellent, the line formed by the droplet discharge method is There is a possibility that a short circuit or disconnection may occur due to a liquid pool called a bulge that occurs because the liquid material easily moves on the substrate.

Therefore, in order to avoid this problem, the applicant of the present invention has proposed in Japanese Patent Application No. 2001-193679 that droplets are applied to a substrate having a moderate liquid repellency (the contact angle of the liquid material is 30 ° to 60 °). We proposed a method that controls the discharge so that the overlapping of the two becomes smaller. In addition, the applicant of the present application has a patent application 2001
In -323701, dots are separated from the substrate having a strong liquid repellency (the contact angle of the liquid material is 60 ° or more) in the first discharge, and the lines are formed by filling the gap in the second and subsequent discharges after drying. I proposed the method of doing.

[0007]

However, the above-mentioned conventional techniques have the following problems.
As shown in FIG. 5, the cross-sectional shape of a line formed by ejecting liquid droplets onto a liquid-repellent substrate may be a so-called semi-circular shape that bulges in a substantially arc shape. Such a shape poses a problem when flatness is required for the wiring pattern, such as a multilayer circuit board. Further, when the line cross-sectional shape is the above-described semi-cylindrical shape, when repeated ejection is performed on the line in order to increase the film thickness, if the liquid repellency of the substrate is not so strong, the accumulated droplets There is also a problem that the line width of the line is increased by flowing from the line onto the substrate.

The present invention has been made in consideration of the above points, and it is an object of the present invention to provide a film forming method, a device, an electronic apparatus, and a device manufacturing method for realizing flattening and thinning of a wiring pattern. To aim.

[0009]

In order to achieve the above object, the present invention employs the following constitutions. The film forming method of the present invention is a film forming method including a discharging step of forming a film pattern by discharging droplets of a liquid containing a film forming component onto a substrate. It includes a drying step of drying the film pattern so that the film forming component of the body moves to the edge of the film pattern, and a second discharging step of discharging a droplet between the edges protruding by the movement of the film forming component. It is characterized by that.

For example, when a liquid material containing a solute is discharged onto a substrate having a lyophilic surface and dried, the evaporation rate of the solvent at the edge portion is higher than that at the central portion. The film-forming component, which is a solute in the liquid, moves to the edge due to internal flow inside the liquid, causing the edge to protrude and become higher than the central portion. Therefore,
In the film forming method of the present invention, the edge portion can be projected by performing the drying step on the film pattern formed in the discharging step. Then, in the second discharging step, it is possible to form a film pattern having a flat upper surface by discharging and filling the liquid droplets between the edges. Further, since the liquid material is discharged between the partition walls formed by the edges and the film pattern formed in the discharging step has undergone the drying step, even if the liquid materials are discharged in the second discharging step, This liquid does not flow out, and it is possible to prevent the pattern line width from increasing.

In order to project the edge portion in the drying process, it is preferable that the contact angle of the film forming surface on the substrate with respect to the liquid is 10 ° or less.

Further, it is preferable to include a solvent discharging step of discharging the solvent component of the liquid material between the edges. In this case, by performing an appropriate drying step after the solvent discharging step, the movement of the film-forming component that is the solute to the edge portion is promoted, and the protruding height of the edge portion can be increased.

In the discharging step and the second discharging step, it is possible to adopt a procedure of discharging a liquid material having different properties. In this case, it is preferable that the liquid discharged in the discharging step has a lower viscosity than the liquid discharged in the second discharging step. As a result, the movement of the film-forming component, which is the solute content, to the edge portion can be promoted.

It is also possible to employ a procedure in which the polarities of the solvent components of the liquid material are made different in the discharging step and the second discharging step, such as an organic solvent system and an aqueous system.

Furthermore, the present invention can be suitably applied when the film-forming component contains conductive fine particles. According to the present invention, it is possible to form a conductive film wiring which has a large film thickness, is advantageous for electrical conduction, is less likely to cause defects such as disconnection and short circuit, and can be formed minutely. In this case, it is preferable to have the same step of converting the film forming component into a conductive film by heat treatment, light treatment or the like. As a result, it is not necessary to provide a step of individually converting, and production efficiency can be improved. Incidentally, the present invention, the formation of the silicon film pattern,
It can also be suitably used for forming an insulating film pattern of polyimide or the like and forming a resist film pattern.

The device of the present invention is a device provided with a film wiring having a side surface and an upper surface, and is characterized in that the side surface and the upper surface of the film wiring are formed in different steps. Accordingly, in the present invention, by forming the upper surface after forming the side surface, the discharged liquid material does not flow out, and it is possible to prevent the pattern line width from increasing.
In this case, it is possible to flatten the upper surface by making the curvature forming the sectional contour of the upper surface smaller than the curvature forming the sectional contour of the side surface.

On the other hand, the device of the present invention comprises a first layer and a second layer.
A device having a film wiring formed of a layer, characterized in that the cross-sectional contour of the interface between the first layer and the second layer of the film wiring gradually increases upward from the central portion toward the end portion. . Thus, in the present invention, a device having a film wiring having a flat upper surface can be obtained by filling the central portion on the first layer partitioned by the end portion with the second layer. In this case, it is preferable that the curvature of the cross-sectional contour at the end portion is larger than the curvature of the cross-sectional contour at the central portion.

Further, the device of the present invention is a device having a substrate on which predetermined wiring is formed, and uses the film forming method according to any one of claims 1 to 8.
It is characterized in that wiring is formed on the substrate. As a result, according to the present invention, it is possible to efficiently obtain a thick film in a simple process, and obtain a device having a film wiring whose upper surface is flat and thinned.

Furthermore, the electronic equipment of the present invention is characterized by including the above device. Thus, in the present invention, it is possible to obtain an electronic device including a conductive film wiring which has a large film thickness, is advantageous for electrical conduction, and is less likely to cause defects such as disconnection and short circuit. Note that the electronic device also includes an electro-optical device including the above film wiring, such as a liquid crystal display device, an electrophoretic device, an organic electroluminescence display device, and a plasma display device.

Further, the non-contact type card medium of the present invention is characterized in that the above film wiring is provided as a conductive antenna circuit. Thus, according to the present invention, it is possible to obtain a non-contact type card medium having a thick film thickness, which is advantageous for electrical conduction and which is less likely to cause defects such as disconnection and short circuit.

The method of manufacturing the device of the present invention is
A device manufacturing method comprising a wiring pattern forming step of forming a predetermined wiring pattern by discharging droplets of a liquid material containing a film forming component onto a substrate, wherein the wiring pattern forming step is a droplet discharge device. An ejection step of ejecting droplets onto the substrate to form a film pattern by means of a drying step of drying the droplets ejected onto the substrate so that the film forming component moves to the edge of the wiring pattern; A second discharging step of discharging a droplet between the edge portions that are projected by the movement of the film forming component by the discharging device.

Thus, in the present invention, for example, when a liquid material containing a solute is discharged onto a substrate having a lyophilic surface and dried, the evaporation rate of the solvent at the edge portion is higher than that at the central portion. Due to such factors, a phenomenon in which the film-forming component, which is a solute in the liquid, moves to the edge due to the internal flow inside the liquid, and the edge projects and becomes higher than the central portion. Therefore, in the device manufacturing method of the present invention, the edge can be projected by performing the drying process on the film pattern formed in the discharging process. Then, in the second discharging step, it is possible to form a film pattern having a flat upper surface by discharging and filling the liquid droplets between the edges. Further, since the liquid material is discharged between the partition walls formed by the edges and the film pattern formed in the discharging step has undergone the drying step, even if the liquid materials are discharged in the second discharging step, This liquid does not flow out, and it is possible to prevent the pattern line width from increasing.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the droplet discharge method is a method of forming a desired pattern including an object to be discharged by discharging droplets to a desired area, and is also called an inkjet method. is there. However, in this case, the discharged droplets are not so-called ink used for printed matter, but a liquid material containing a material substance that constitutes a device, and this material substance functions as, for example, a conductive substance or an insulating substance that constitutes a device. It contains substances that can Further, the droplet discharge is not limited to the case of being sprayed at the time of discharge, but also includes the case where each droplet of the liquid material is continuously discharged.

Hereinafter, an embodiment of a film forming method, a device, an electronic apparatus, and a device manufacturing method of the present invention will be described with reference to FIG.
It will be described with reference to FIGS. Here, first, a film forming apparatus for forming a film wiring on a substrate will be described.

FIG. 1 is a schematic perspective view of a film forming apparatus according to this embodiment. As shown in FIG. 1, a film forming apparatus (wiring forming apparatus) 100 includes a droplet discharge head group 1, an X-direction guide shaft 2 for driving the droplet discharge head group 1 in the X direction,
An X-direction drive motor 3 that rotates the X-direction guide shaft 2 is provided. Further, the film forming apparatus 100 includes a mounting table 4 for mounting the substrate W, a Y-direction guide shaft 5 for driving the mounting table 4 in the Y direction, and a Y-direction drive for rotating the Y-direction guide shaft 5. And a motor 6.

The X-direction guide shaft 2 and the Y-direction guide shaft 5 are fixed to respective predetermined positions of the base 7, and a control device 8 is provided below the base 7. Further, the film forming apparatus 100 is provided with the cleaning mechanism unit 14 and the heater 15.

The droplet discharge head group 1 is provided with a plurality of droplet discharge heads for discharging a dispersion liquid containing conductive fine particles from a nozzle (discharge port) and applying it to a substrate at predetermined intervals.
Then, the dispersion liquid can be individually ejected from each of the plurality of droplet ejection heads in accordance with the ejection voltage supplied from the control device 8.

The droplet discharge head group 1 is fixed to the X-direction guide shaft 2, and the X-direction drive motor 3 is connected to the X-direction guide shaft 2. The X-direction drive motor 3 is a stepping motor or the like, and is configured to rotate the X-direction guide shaft 2 when a drive pulse signal in the X-axis direction is supplied from the control device 8. When the X-direction guide shaft 2 is rotated, the droplet discharge head group 1 moves in the X-axis direction with respect to the base 7.

The mounting table 4 mounts the substrate W to which the dispersion liquid is applied by the wiring forming apparatus 100, and has a mechanism for fixing the substrate W at the reference position. The mounting table 4 is fixed to the Y-direction guide shaft 5,
The Y-direction drive motors 6 and 16 are connected to. Y
The direction drive motors 6 and 16 are stepping motors or the like, and are configured to rotate the Y-direction guide shaft 5 when a drive pulse signal in the Y-axis direction is supplied from the control device 8. Then, when the Y-direction guide shaft 5 is rotated, the mounting table 4 moves in the Y-axis direction with respect to the base 7.

The cleaning mechanism section 14 has a mechanism for cleaning the droplet discharge head group 1. The cleaning mechanism unit 14 is driven by the drive motor 16 in the Y direction.
It is configured to move along the direction guide shaft 5. The movement of the cleaning mechanism unit 14 is also controlled by the control device 8.

The heater 15 is a means for heat-treating the substrate W by lamp annealing here, and is a liquid discharged onto the substrate (including a liquid containing conductive fine particles;
A liquid material (referred to as a liquid material) is evaporated and dried, and a heat treatment for converting it into a conductive film is performed. The controller 8 also controls the turning on and off of the power of the heater 15.

In the film forming apparatus 100 having the above structure, in order to discharge the dispersion liquid as a liquid material to a predetermined wiring formation region, a predetermined drive pulse signal is sent from the control device 8 to the X-direction drive motor 3 and / or Y. Supply to the direction drive motor 6,
By moving the droplet discharge head group 1 and / or the mounting table 4, the droplet discharge head group 1 and the substrate W (mounting table 4) are relatively moved. Then, during this relative movement, a discharge voltage is supplied from the control device 8 to a predetermined droplet discharge head in the droplet discharge head group 1, and the dispersion liquid is discharged as droplets from the droplet discharge head.

The amount of droplets discharged from each head of the droplet discharge head group 1 can be adjusted by the magnitude of the discharge voltage supplied from the controller 8. The pitch of the droplets discharged onto the substrate W is the same as the droplet discharge head group 1 and the substrate W (mounting table 4).
And the ejection frequency from the droplet ejection head group 1 (frequency of ejection voltage supply). That is, by controlling the size of the droplets ejected from each head, the relative movement speed of the droplet ejection head group 1 and the substrate W, and the ejection frequency from the droplet ejection head group 1, the line on the substrate W is controlled. Film pattern can be formed.

Next, the substrate W is formed by the above film forming apparatus 100.
A method of forming a conductive film wiring as a film pattern on it will be described.

The substrate on which the conductive film wiring is to be formed is S
Various materials such as i-wafer, quartz glass, glass, plastic film, and metal plate can be used. In addition, semiconductor films, metal films,
A dielectric film, an organic film or the like formed as a base layer may be used as a substrate on which conductive film wiring is to be formed. Here, a quartz glass substrate is used as the substrate.

The surface of the substrate on which the conductive film wiring is to be formed is subjected to surface treatment so that the predetermined contact angle with the liquid containing the conductive fine particles is 10 ° [deg] or less. Specifically, the surface of the substrate is washed with IPA (isopropyl alcohol), and then UV light having a wavelength of 172 nm is used for 10 times.
Irradiation was carried out at an intensity of mW / cm 2 for 10 minutes, and further cleaning and surface lyophilic treatment were performed. The contact angle of the liquid material with respect to this substrate was about 5 °.

Next, the liquid material containing the conductive fine particles to be discharged onto the surface-treated substrate W will be described.

As the liquid containing the conductive fine particles,
A dispersion liquid in which conductive fine particles are dispersed in a dispersion medium (solvent component) is used. The conductive fine particles used here are gold, silver,
In addition to metal fine particles containing any of copper, palladium and nickel, fine particles of conductive polymers and superconductors are used. These conductive fine particles may be used by coating the surface with an organic substance or the like in order to improve dispersibility. Examples of the coating material for coating the surface of the conductive fine particles include organic solvents such as xylene and toluene, citric acid and the like. The particle size of the conductive fine particles is preferably 5 nm or more and 0.1 μm or less. 0.
If it is larger than 1 μm, the nozzle is likely to be clogged, and it becomes difficult to discharge by the droplet discharge method. On the other hand, if it is less than 5 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of organic substances in the obtained film becomes excessive.

As the dispersion medium for the liquid material containing the conductive fine particles, the vapor pressure at room temperature is 0.001 mmHg or more 20
0 mmHg or less (about 0.133 Pa or more and 26600 Pa
The following are preferred. Vapor pressure is 200 mmHg
This is because if it is higher, the dispersion medium evaporates rapidly after ejection, and it becomes difficult to form a good film. The vapor pressure of the dispersion medium is 0.001 mmHg or more 5
More preferably, it is 0 mmHg or less (about 0.133 Pa or more and 6650 Pa or less). Vapor pressure is 50 mmHg
This is because if the value is higher, nozzle clogging due to drying tends to occur when a droplet is ejected by the droplet ejection method, and stable ejection becomes difficult.

On the other hand, the vapor pressure at room temperature is 0.001 mmH.
When the dispersion medium is lower than g, the drying becomes slow and the dispersion medium is likely to remain in the film, and it is difficult to obtain a good-quality conductive film after the heat and / or light treatment in the subsequent step.

The dispersion medium (solvent) to be used is not particularly limited as long as it can disperse the above-mentioned conductive fine particles and does not cause aggregation, but in addition to water, methanol, ethanol, propanol, butanol, etc. Alcohols, hydrocarbon compounds such as n-heptane, n-octane, decane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene, cyclohexylbenzene,
Further, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, p-
Examples include ether compounds such as dioxane, and polar compounds such as propylene carbonate, γ-butyrolactone, N-methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, and cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferable, and more preferable dispersion, from the viewpoints of dispersibility of fine particles, stability of dispersion liquid, and ease of application to the droplet discharge method. Examples of the medium include water and hydrocarbon compounds. These dispersion media can be used alone or as a mixture of two or more kinds.

When the conductive fine particles are dispersed in the dispersion medium, the dispersoid concentration is 1% by mass or more and 80% by mass or less and can be adjusted according to the desired film thickness of the conductive film. 80
When the content is more than mass%, aggregation is likely to occur and it is difficult to obtain a uniform film.

The surface tension of the dispersion liquid of the conductive fine particles is preferably in the range of 0.02 N / m or more and 0.07 N / m or less. When the liquid material is discharged by the droplet discharge method, if the surface tension is less than 0.02 N / m, the wettability of the ink composition with respect to the nozzle surface increases, so that flight bending easily occurs and 0.07 N / m If m is exceeded, the shape of the meniscus at the tip of the nozzle will not be stable, making it difficult to control the ejection amount and ejection timing.

To adjust the surface tension, a small amount of a fluorine-based, silicone-based, nonionic-based surface tension modifier or the like can be added to the above dispersion liquid within a range that does not unduly reduce the contact angle with the substrate. . The nonionic surface tension adjusting agent is useful for improving the wettability of the liquid material with respect to the substrate, improving the leveling property of the film, and preventing the occurrence of crushing of the coating film and the occurrence of orange peel skin. The above-mentioned dispersion liquid may contain organic compounds such as alcohols, ethers, esters, and ketones, if necessary.

The viscosity of the above dispersion is 1 mPa · s or more 50
It is preferably mPa · s or less. When ejecting by the droplet ejection method, if the viscosity is less than 1 mPa · s, the peripheral area of the nozzle is easily contaminated by the outflow of ink, and if the viscosity is more than 50 mPa · s, the clogging frequency in the nozzle hole This is because it becomes difficult to smoothly discharge the liquid droplets.

(Example) Xylene was added to a silver particle dispersion liquid (trade name "Perfect Silver", manufactured by Vacuum Metallurgy Co., Ltd.) in which silver particles having a diameter of 10 nm were dispersed in toluene, and the solute concentration was 30 wt% and the viscosity thereof was adjusted. A liquid material having 5 mPa · s and a surface tension of 25 N / m was discharged by the film forming apparatus 100 at a predetermined pitch to form a conductive film line. A commercially available printer (trade name “MJ930” is used as the droplet discharge head.
C ”) head was used. However, since the ink suction part was made of plastic, a metal jig was used to change the suction part so that it would not dissolve in the organic solvent. The relative movement speed between the substrate and the droplet discharge head was fixed, and the pitch was changed by adjusting only the discharge frequency.

(First Discharging Step) In the present embodiment, the case where the conductive film wiring has a line shape will be described. In the first discharging step as the discharging step, droplets of the silver particle dispersion liquid were discharged onto the substrate W having a contact angle of the silver particle dispersion liquid of about 5 °. For this ejection, the head drive voltage and the head drive waveform were adjusted so that the volume of the dispersion liquid was 4 pl. The diameter of the discharged droplets after landing on the substrate was about 83 μm. Then, the discharge frequency is 7.14 kHz, the substrate W (mounting table 4)
When a line was formed as a discharge film pattern so that the droplet pitch was 70 μm by setting the moving speed of the film to 500 mm / s, a line pattern having a line width of 87 μm was formed. The cross-sectional shape of the formed line is shown in FIG.
As shown in (a), the edge portion (edge portion) 21 has a central portion 2
2, the protrusion is higher than that of the concave portion 2, and the concave portion 23 is formed in the central portion 22.
Was formed. This is because the solute component in the liquid material moved to the edge portion due to the internal flow inside the liquid material due to the fact that the evaporation rate of the solvent at the edge was higher than that in the central portion. .

The cross-sectional contour of the line formed in the first discharging step has an arc portion 24a forming the side surface 24, an arc portion 23a forming a recess 23 near the central portion 22, and an edge portion 21.
It is roughly formed from a circular arc portion 23b that constitutes the concave portion 23 in the vicinity. Then, the circular arc portion 23 that constitutes the concave portion 23
The a and 23b are formed so as to gradually go upward from the central portion toward the end portion, and the curvature of the arc portion 23b is larger than the curvature of the arc portion 23a.

(Drying Step) The substrate W on which this line is formed
Was dried. The heater 15 and the hot plate can be used for the drying process. Here, 100
Heating was carried out at 0 ° C for 5 minutes. In the line after the drying treatment, the solvent content in the semi-dried state was smaller than that immediately after the discharge, but FIG.
As shown in (b), the contour of the cross-sectional shape was almost maintained. Note that the drying step in the present invention includes not only the heat treatment described above, but also the time during which the solvent evaporates from the droplets that have landed on the substrate W in the first discharging step.

(Second Discharging Step) In order to fill the concave portion 23 between the edge portions 21 formed in the above step, the drying step is sandwiched with respect to the semi-dry line, and the film forming apparatus 100 is further subjected to a plurality of times. Droplets were discharged. As a result, as shown in FIG. 2 (c), the line cross-sectional shape was formed to be a substantially flat upper surface 25 constituted by the circular arc portion 25 a having a curvature smaller than that of the circular arc portion 24 a forming the side surface 24. That is, this line is formed on the substrate W in the first discharge step and constitutes the side surface 24, and the first layer 26 and the first layer 26.
It can be regarded as having a second layer 27 which is formed on the upper surface and constitutes the upper surface 25.
The cross-sectional contour of the interface with 7 is formed by the arc portions 23a and 23b.

(Heat Treatment Step) The line substrate W on which the film pattern is formed is subjected to heat treatment at 300 ° C. for 30 minutes using a heater 15 or a muffle furnace to completely remove the solvent and burn silver particles. Finally, a silver line having a substantially flat upper surface could be obtained as shown in FIG. The heat treatment is usually carried out in the air, but if necessary, it can be carried out in an atmosphere of an inert gas such as nitrogen, argon or helium. The heat treatment temperature takes into consideration the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as the dispersibility and oxidizability of the particles, the presence and amount of the coating material, and the heat resistant temperature of the base material. And determined appropriately. For example, in order to remove the organic coating material, it is necessary to bake at about 300 ° C.
When a substrate such as plastic is used, it is preferably performed at room temperature or higher and 100 ° C. or lower.

The heat treatment can be carried out by lamp annealing as well as the above-mentioned treatment using a normal hot plate, an electric furnace or the like. The light source of light used for lamp annealing is not particularly limited, but an infrared lamp, a xenon lamp, a YAG laser, an argon laser, a carbon dioxide laser, XeF, XeCl, XeBr, Kr.
An excimer laser such as F, KrCl, ArF, or ArCl can be used as a light source. Generally, these light sources have a power output of 10 W or more and 5000 W or less, but in the present embodiment, 100 W or more and 10 W or more.
A range of 00 W or less is sufficient. Through the above steps, the dried film after the discharging step secures electrical contact between the fine particles and is converted into a conductive film.

As described above, in the present embodiment, the film forming component moves by the internal flow and the droplets are ejected between the edge portions 21 and 21 which are formed high, whereby the conductive film wiring having flatness is formed. Can be easily formed. Also,
In the present embodiment, since the droplets are ejected onto the semi-dried first layer 26, the droplets do not flow out even when the overlapping ejection is performed, and the line width of the line can be prevented from increasing. It becomes possible to realize thinning.

As the electro-optical device having the conductive film wiring of the above-described embodiment, a liquid crystal device in which liquid crystal is sealed between substrates or a light emitting layer made of a light emitting material such as an organic fluorescent material is provided between an anode and a cathode. An organic EL display device using an organic electroluminescence (organic EL) material having a sandwiched structure,
A plasma display device in which a discharge display portion is formed between opposing substrates can be given. The conductive film wiring of this embodiment mode can be applied to a signal wiring or the like connected to a driver circuit in these electro-optical devices.

Next, examples of electronic equipment provided with the electro-optical device according to the above-mentioned embodiment will be described. FIG. 3A is a perspective view showing an example of a mobile phone. In FIG. 3A, reference numeral 1000 indicates a mobile phone body, and reference numeral 1001.
Indicates a display unit using the above electro-optical device.

FIG. 3B is a perspective view showing an example of a wrist watch type electronic device. In FIG. 3B, reference numeral 110
Reference numeral 0 denotes a watch body, and reference numeral 1101 denotes a display unit using the above electro-optical device.

FIG. 3C is a perspective view showing an example of a portable information processing device such as a word processor and a personal computer. Figure 3
In (c), reference numeral 1200 is an information processing device, reference numeral 1
Reference numeral 202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing apparatus main body, and reference numeral 1206 denotes a display unit using the above electro-optical device.

Since the electronic equipment shown in FIGS. 3A to 3C is equipped with the electro-optical device according to the above-mentioned embodiment, defects such as disconnection and short circuit of each wiring are unlikely to occur, and further miniaturization. Thus, the electronic device can be made thinner.

Further, the present invention is not limited to the above-mentioned electro-optical device, but can be applied to the non-contact type card medium shown in FIG. The non-contact type card medium 400 includes a card base 40.
2 and a card cover 418, a semiconductor integrated circuit chip 408 and an antenna circuit 412 are built in, and at least one of power supply and data transfer by an external transceiver (not shown) and / or electromagnetic wave or electrostatic capacitance coupling. I am supposed to do it. In this embodiment, the antenna circuit 412 is formed by the film forming method and the film wiring according to the above embodiment.

According to the non-contact type card medium of the present embodiment, a defect such as disconnection or short circuit of the antenna circuit 412 is unlikely to occur, and further, the non-contact type card medium can be downsized and thinned. it can.

The technical scope of the present invention is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, you may include the solvent discharge process which discharges the droplet of a silver particle dispersion liquid in a 1st discharge process, and then discharges the droplet which consists of a solvent component, and the drying process after a solvent discharge process. In this case, the internal flow continues to occur, which promotes the movement of the solute component to the edge portion,
It becomes possible to form the edge portion higher.

Further, as the silver fine particle dispersion liquid, the organic solvent type solvent is used in the above embodiment, but it is also possible to use the above water type solvent. Further, the liquid material discharged in the first discharging step and the liquid material discharged in the second discharging step may be different. For example, the polarities of the solvent components can be changed so that the dispersion liquid of the aqueous solvent is discharged in the first discharging step and the dispersion liquid of the organic solvent is discharged in the second discharging step. When different liquid materials are discharged in the first discharge step and the second discharge step, the viscosity of the liquid material discharged in the first discharge step should be smaller than the viscosity of the liquid material discharged in the second discharge step. Is desirable. in this case,
It becomes possible to generate the internal flow more smoothly.

[0063]

As described above, according to the film forming method of the present invention, a film pattern having flatness can be easily formed, and the line width of the line increases due to the repeated ejection. This can also be prevented, and thinning can be realized. Further, the device and the manufacturing method thereof according to the present invention can be a device having a large film thickness, which is advantageous for electric conduction, is less likely to cause defects such as disconnection and short circuit, and has film wiring which can be finely formed. Furthermore, in the electronic device and the non-contact type card medium of the present invention, it is difficult for defects such as disconnection and short circuit of each wiring to occur, and further, miniaturization,
It is possible to provide an electronic device and a non-contact type card medium that can be thinned.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a film forming apparatus used when performing a film forming method of the present invention.

2 (a) to (d) are cross-sectional views showing a procedure of a film forming method according to the present invention.

3A and 3B are diagrams illustrating an example of an electronic device having a conductive film wiring, in which FIG. 3A is a perspective view of a mobile phone, FIG. 3B is a wristwatch type electronic device, and FIG. .

FIG. 4 is an exploded perspective view of a plasma display device having conductive film wiring.

FIG. 5 is a cross-sectional view of droplets discharged onto a lyophilic substrate by a conventional technique.

[Explanation of symbols]

W board 21 Edge (edge) 22 Central part 100 Film forming equipment (wiring forming equipment)

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H092 MA10 MA22 MA35 NA15 NA16                       NA27 NA28 NA29 PA01                 3K007 AB18 DB03 GA00                 4M104 BB04 BB05 BB07 BB08 BB09                       DD51                 5E343 AA02 AA12 AA22 AA26 BB16                       BB23 BB24 BB25 BB44 BB48                       BB72 BB75 DD15 ER32 FF05                       GG06 GG08 GG11

Claims (15)

[Claims] 1. A film forming method comprising a discharging step of forming a film pattern by discharging droplets of a liquid material containing a film forming component onto a substrate, wherein the liquid material is discharged onto the substrate. A drying step of drying the film pattern so that the film forming component moves to an edge portion of the film pattern; and a second ejection for ejecting the droplet between the edge portions projected by the movement of the film forming component. A film forming method comprising the steps of: 2. The film forming method according to claim 1, wherein the film forming surface on the substrate has a contact angle with the liquid material of 10 ° or less. 3. The film forming method according to claim 1, further comprising a solvent discharging step of discharging a solvent component of the liquid material between the edge portions. 4. The film forming method according to claim 1, wherein a liquid material having different properties is discharged in the discharging step and the second discharging step. 5. The film forming method according to claim 4, wherein the liquid material discharged in the discharging step has a lower viscosity than the liquid material discharged in the second discharging step. 6. The film forming method according to claim 4, wherein the polarity of the solvent component of the liquid material is made different in the discharging step and the second discharging step. 7. The film forming method according to claim 1, wherein the film forming component contains conductive fine particles. 8. The film forming method according to claim 1, wherein the liquid material discharged in the discharging step and the second discharging step is converted into a film in the same step. Method. 9. A device comprising a film wiring having a side surface and an upper surface, wherein the side surface and the upper surface of the film wiring are formed in different steps. 10. The device of claim 9, wherein the curvature forming the cross-sectional contour of the top surface is less than the curvature forming the cross-sectional contour of the side surface. 11. A device having a film wiring formed of a first layer and a second layer, wherein a cross-sectional contour of an interface between the first layer and the second layer of the film wiring is from a central portion. A device characterized by progressively upward movement toward the edges. 12. The device of claim 11, wherein the curvature of the cross sectional contour at the end is greater than the curvature of the cross sectional contour at the central portion. 13. A device having a substrate on which predetermined wiring is formed, wherein the wiring is formed on the substrate by using the film forming method according to any one of claims 1 to 8. A device characterized by being done. 14. An electronic apparatus comprising the device according to claim 9. Description: 15. A method of manufacturing a device, comprising a wiring pattern forming step of forming a predetermined wiring pattern by discharging liquid droplets of a liquid material containing a film forming component onto a substrate. The process includes a discharging process of discharging the liquid droplets onto the substrate by a liquid droplet discharging device to form a film pattern, and discharging the film forming component onto the substrate so as to move to an edge portion of the wiring pattern. And a second discharging step of discharging the droplets between the edge portions projected by the movement of the film-forming component by a droplet discharging device. Device manufacturing method.