JPH11274671A - Electric circuit, its manufacture and manufacture device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an arbitrary electric circuit on a pattern forming face through the use of an ink jet system. SOLUTION: Fluid bodies 11-1n containing conductive materials and insulating materials as pattern forming materials are discharged from ink jet-type recording heads 21-2n on the pattern forming face 100 of a substrate 1. The fluid bodies 11-1n discharged on the pattern forming face 110 are caked and an electric circuit 102 is obtained. Since an arbitrary pattern is generated while the materials are changed into various types, the electric circuit containing the desired circuit elements of a capacitor, a coil, a resistor and an active element can be manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing an electric circuit on a substrate or the like, and more particularly to an improvement in an electric circuit manufacturing technique for forming an arbitrary electric circuit by an ink jet method or the like.

[0002]

2. Description of the Related Art Conventionally, a lithography method or the like has been used to manufacture a minute circuit, for example, an integrated circuit. In this lithography method, a photosensitive material called a resist is thinly applied on a silicon wafer, and a circuit pattern created by photoengraving is transferred to a glass dry plate by light. By implanting ions or the like into the transferred resist pattern, wiring patterns and circuit elements are formed. Since the production of an electric circuit using the lithography method required processes such as photoengraving, resist coating, exposure, and development, an electric circuit could not be produced without a well-equipped semiconductor factory. In order to manufacture a large electric circuit, individual components are placed on a board by an insert machine or the like,
The circuit board was made by passing the board through a solder bath. For electric circuits manufactured on such a manufacturing line,
Consistent manufacturing equipment such as an insert machine, a flux tank, and a solder tank was required. On the other hand, a prototype of an electric circuit has been manufactured by a developer using a universal board or the like to attach all components and solder them. As mentioned above,
Mass production of electrical circuits required capital investment and complex process control, while producing prototypes required labor and time.

[0003]

However, since the era of high-mix low-volume production has now come, the conventional manufacturing method has not always been efficient and economical. That is, in the manufacturing line, it is necessary to reset the manufacturing equipment each time the electric circuit to be manufactured is changed, so that the time required for the setting and adjustment increases, and it becomes difficult to suppress the cost. In the production of prototypes, several prototypes are made at the same time,
It is a routine practice to consider things, and it was uneconomical to spend time only making prototypes by hand. In the prototype, the circuit is evaluated by changing the physical constants of the circuit elements in various ways. However, in the method of attaching the circuit components to the substrate, when the physical constants are changed, labor is required to replace the components. Furthermore, since the physical constant is determined by the circuit components, it is difficult to change the physical constant delicately. Furthermore, in the prototype, it is necessary to identify complicated wiring patterns, etc. in order to examine the circuit, but it is difficult to see at a glance what kind of pattern it is with conventional wiring using solder or lead wires when looking at the board There were also points. In view of the above problems, the present applicant takes advantage of the fact that a technique such as an ink jet method can attach a fluid in an arbitrary pattern,
I came up with a new option for the manufacturing technology of electric circuits.

[0004]

That is, a first object of the present invention is to provide an electric circuit suitable for small-quantity production and trial production by forming a pattern by a method which has not existed conventionally. A second object of the present invention is to provide an electric circuit suitable for small-quantity production and trial production by forming circuit elements by a method which has not existed conventionally. A third object of the present invention is to provide an electric circuit suitable for trial production by forming a pattern that can be easily identified.
A fourth object of the present invention is to provide a method of manufacturing an electric circuit suitable for small-quantity production and trial production by forming a pattern by a method which has not existed conventionally. A fifth object of the present invention is to provide a method for manufacturing an electric circuit suitable for small-quantity production and trial production by forming circuit elements by a method which has not existed conventionally. A sixth object of the present invention is to provide a method of manufacturing an electric circuit suitable for trial manufacture by forming a pattern that is easy to identify. A seventh object of the present invention is to provide an electric circuit manufacturing apparatus suitable for small-lot production and trial production by providing a structure for forming a pattern by a method which has not existed conventionally.

[0005] The invention for solving the first problem is an electric circuit formed on a pattern forming surface, wherein a pattern containing a fluid containing a pattern forming material adheres to the pattern forming surface and solidifies. An electric circuit comprising:

Here, various methods such as various printing methods can be applied as a method for attaching the fluid, but an ink jet method is preferable. This is because, according to the ink jet method, the fluid can be attached to an arbitrary position on the pattern forming surface at an arbitrary thickness with inexpensive equipment. As the ink jet method, even if it is a piezo jet method that discharges a fluid by changing the volume of the piezoelectric element,
A method in which a fluid is discharged by sudden generation of steam by application of heat may be used. Further, a fluid refers to a medium having a viscosity that can be discharged from a nozzle. It does not matter whether it is aqueous or oily. It is sufficient that the material has fluidity (viscosity) that can be discharged from a nozzle or the like. Fluidity can be measured, for example, by the contact angle of the fluid. For example, any of a conductive material, a semiconductive material, an insulating material, and a dielectric material may be provided as the pattern forming material. These materials may be dissolved by being heated to a melting point or higher, may be stirred as fine particles in a solvent, or may contain a dye, a pigment and other functional materials in addition to the solvent. Further, the electric circuit is not limited to a member formed by an electric cooperative relationship between circuit elements, and is widely applied to, for example, a mechanical or design pattern. That is, the pattern to be formed does not need to have a specific electric characteristic, and the pattern forming material is not limited to having a certain electric characteristic. The pattern forming surface refers to the surface of the flat substrate, and may be a curved substrate. Further, the hardness of the pattern forming surface does not need to be high, and the surface may be a film, paper, rubber, or other flexible material.

The present invention further comprises an affinity layer for improving the adhesion between the pattern forming surface and the pattern. Further, a non-affinity layer for limiting an attachment region of the pattern is further provided. Here, the non-affinity means a property having a relatively large contact angle with a fluid. Affinity means that the contact angle with the fluid is relatively small. These expressions are used to clarify the behavior of the membrane with respect to the fluid
It is used in contrast to affinity.

The invention for solving the second problem is an electric circuit having a wiring pattern in which a fluid containing a conductive material as a pattern forming material is solidified. An electrode in which a fluid containing an insulating material or a dielectric material as a material for pattern formation is solidified and a fluid containing a conductive material as a material for pattern formation is opposed and solidified across the insulating film. It is an electric circuit that forms a capacitor with the film. Further, the present invention is an electric circuit including a coil in which a fluid containing a conductive material as a material for pattern formation is spirally attached to a pattern formation surface and solidified. Furthermore, the electric circuit includes a resistor in which a fluid containing a conductive material as a pattern forming material is solidified at both ends of a semiconductive film in which a fluid containing a semiconductive material as a material for pattern formation is solidified. . An electric circuit including a semiconductor circuit element formed by solidifying a fluid containing a semiconductive material doped with a predetermined element as a material for pattern formation.

The invention which solves the third problem is an electric circuit having a plurality of patterns and different colors for distinguishing the patterns from each other.

[0010] The invention for solving the fourth object is a method of manufacturing an electric circuit for forming an electric circuit on a pattern forming surface, comprising: discharging a fluid containing a pattern forming material onto the pattern forming surface; Solidifying the fluid discharged on the pattern forming surface.

For example, in the step of discharging the fluid,
The step of solidifying the fluid is performed by maintaining the temperature near the pattern formation surface at a temperature lower than the melting point of the pattern forming material by discharging the material heated and melted above the melting point of the pattern forming material as a fluid and solidifying the fluid. To solidify. Further, in the step of discharging the fluid, the step of discharging the pattern forming material agitated in a solvent as fine particles as a fluid, and in the step of solidifying the fluid, the temperature in the vicinity of the pattern forming surface is equal to or higher than the melting point of the pattern forming material. And a step of applying a temperature lower than the melting point to solidify the dissolved material. The method may further include, before discharging the fluid, forming an affinity layer for improving the adhesion between the pattern forming surface and the pattern. The method further includes a step of forming a non-affinity layer for limiting a pattern attachment region before discharging the fluid.

According to the present invention, in a method of manufacturing an electric circuit for forming an electric circuit on a pattern forming surface, a step of discharging an adhesive material on the pattern forming surface and spraying fine particles of the pattern forming material on the pattern forming surface. A method of manufacturing an electric circuit, comprising: a step of removing fine particles other than those adhering to an adhesive material from a pattern forming surface.
Further, the method may include a step of applying a temperature near the pattern forming surface to a temperature equal to or higher than the melting point of the pattern forming material to dissolve the fine particles, and a step of applying a temperature lower than the melting point to solidify the melted material. . The method may further include a step of compressing the fine particles attached to the adhesive material.

Here, the pattern forming material is at least one of a conductive material, a semiconductive material, an insulating material and a dielectric material.

The invention for solving the fifth problem is directed to a fluid containing a conductive material, which is formed by discharging a fluid containing an insulating material to form an insulating film and face the insulating film. Is a method of manufacturing an electric circuit in which a capacitor is formed by discharging an electrode film to form an electrode film. The present invention also relates to a method of manufacturing an electric circuit in which a fluid containing a conductive material is discharged in a vortex shape to form a coil. Further, a fluid containing a semiconductive material is discharged to form a semiconductive film, and a fluid containing a conductive material is discharged at both ends of the semiconductive film to form a conductive film. 3 is a method for manufacturing an electric circuit forming a resistor. The step of discharging a fluid containing a semiconductive material doped with a predetermined element to form a semiconductor film is repeated a plurality of times while changing the element to be doped into the fluid. It is a manufacturing method.

According to the invention for solving the above-mentioned sixth problem, a plurality of patterns can be identified by forming a pattern by mixing pigments or dyes of different colors into a fluid for forming the pattern according to the pattern. This is a method for manufacturing an electric circuit. In addition, the present invention is a method of manufacturing an electric circuit that allows a plurality of patterns to be identified by covering a pattern formed by a fluid and forming a layer containing a pigment or dye having a color corresponding to the pattern.

The invention for solving the above-mentioned seventh object is an electric circuit manufacturing apparatus for forming an arbitrary pattern on a pattern forming surface by using a fluid containing a pattern forming material, wherein the fluid is subjected to pattern formation. An ink jet recording head configured to be capable of discharging onto a surface, a driving mechanism configured to change the relative position between the ink jet recording head and the pattern forming surface, and an atmosphere for solidifying a fluid on the pattern forming surface And a control device for controlling the ejection of the fluid from the ink jet recording head, the driving by the driving mechanism, and the adjustment of the atmosphere by the solidifying device. Then, the control device ejects the fluid from the ink jet recording head while moving the ink jet recording head along an arbitrary pattern by the driving mechanism, adjusts the atmosphere of the pattern forming surface by the solidification device, and adjusts the atmosphere on the pattern forming surface. An electric circuit can be formed by solidifying the discharged fluid.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The best mode for carrying out the present invention will be described below with reference to the drawings. In the following embodiments, the same members as those in the other embodiments are denoted by the same reference numerals. (Embodiment 1) Embodiment 1 of the present invention is to manufacture an electric circuit including a capacitor by using an ink jet method. FIG. 1 shows a configuration diagram of an electric circuit manufacturing apparatus used in the first embodiment. As shown in FIG. 1, the present electric circuit manufacturing apparatus includes ink jet recording heads 21 to 2n (n
Is an arbitrary natural number), tanks 31 to 3n, a driving mechanism 4, and a control circuit 5. This electric circuit manufacturing apparatus attaches a droplet 10 of a fluid to a pattern forming surface 100 of a substrate 1 to form a predetermined pattern (electric circuit) 102.
Is formed.

It suffices that the ink jet recording heads 21 to 2n have the same structure and are configured to be able to discharge a fluid by an ink jet method. FIG.
FIG. 9 is an exploded perspective view for explaining one configuration example of the ink jet recording head. As shown in FIG. 29, the ink jet recording head 2 x (x is any one of 1 to n) includes a nozzle plate 210 provided with a nozzle 211 and a pressure chamber substrate 220 provided with a vibration plate 230, and a housing 250.
It is configured so as to be fitted in. The main structure of the ink jet recording head 2x is such that, as shown in a perspective view and a partial cross-sectional view of FIG.
10 and a structure sandwiched between the diaphragm 230. The nozzle plate 210 has a nozzle 211 formed at a position corresponding to the cavity 221 when bonded to the pressure chamber substrate 220. The pressure chamber substrate 220 is provided with a plurality of cavities 221 each of which can function as a pressure chamber by etching a silicon single crystal substrate or the like. The cavities 221 are separated by side walls (partition walls) 222. Each cavity 221 is connected to a reservoir 223 which is a common flow path via a supply port 224. The diaphragm 230 is made of, for example, a thermal oxide film. The diaphragm 230 has an ink tank opening 231.
Is provided so that any fluid 1x can be supplied from the tank 3x. Cavity 22 on diaphragm 230
The piezoelectric element 240 is formed at a position corresponding to 1. The piezoelectric element 240 is made of a crystal of a piezoelectric ceramic such as a PZT element by using an upper electrode and a lower electrode (not shown).
It has a structure sandwiched between. The piezoelectric element 240 is configured to be capable of causing a volume change corresponding to the ejection signal Shx supplied from the control circuit 5.

The above-mentioned ink jet recording head has a structure in which a fluid is ejected by causing a volume change in the piezoelectric element. However, heat is applied to the fluid by a heating element, and a droplet is ejected by expansion of the fluid. A head configuration may be used.

The tanks 31 to 3n store the fluids 11 to 1n, respectively, and pass the fluids 11 to 1n through pipes.
1n can be supplied to the ink jet recording heads 21 to 2n. Each of the fluids 11 to 1n includes a pattern forming material and is installed according to the function of the pattern. In this embodiment, in particular, the fluid itself is formed of a material exhibiting electrical properties such as conductivity, semi-conductivity, insulation, or dielectric property when solidified. For example, a material obtained by heating a metal having a low melting point such as solder, gallium, or Pb to a temperature higher than the melting point to impart fluidity, or having a high density of fine particles of a pattern forming material, exhibiting electrical characteristics only by discharging a fluid and then drying it. Things. In any case, the fluid is configured by adjusting the viscosity with a solvent or the like so as to exhibit fluidity that can be ejected from the ink jet recording head. In this embodiment, in order to facilitate understanding of the description, it is assumed that the fluid 11 contains an insulating material and the fluid 12 contains a conductive material.

The drive mechanism 4 has a motor 41, a motor 42 and a mechanical structure (not shown). The motor 41 is configured to be able to convey the ink jet recording head 2x in the X-axis direction (horizontal direction in FIG. 1) according to the drive signal Sx. The motor M2 is configured to be able to convey the ink jet recording head 2x in the Y-axis direction (the depth direction in FIG. 1) according to the drive signal Sy. It is sufficient for the drive mechanism 4 to have a configuration capable of relatively changing the position of the ink jet recording head 2x with respect to the substrate 1. Therefore, in addition to the above configuration, the substrate 1 may move with respect to the ink jet recording head 2x, or the substrate 1 may move together with the ink jet recording head 2x.

The control circuit 5 is, for example, a computer device and includes a CPU, a memory, an interface circuit, and the like (not shown). The control circuit 5 is configured to execute a predetermined program to cause the device to execute the method of manufacturing an electric circuit according to the present invention. That is, when ejecting the liquid droplets 10 of the fluid, the ejection signals Sh1 to Shn are sent to any of the ink jet recording heads 21 to 2n.
Is supplied to the motor 41 to move the head.
Or 42 is configured to be able to supply the drive signal Sx or Sy.

When a certain atmosphere treatment is required for the liquid droplets 10 from the ink jet recording head 2x, a solidifying device 6 may be further provided. The solidifying device 6 is configured to be able to perform a physical, physicochemical, or chemical treatment on the droplet 10 or the pattern forming surface 100 in accordance with the control signal Sp supplied from the control circuit 5. For example, hot air blowing, laser irradiation, heating / drying treatment by lamp irradiation, chemical change treatment by administration of chemical substance, constant surface modification treatment to control the degree of adhesion of droplet 10 to pattern forming surface 100, etc. It solidifies the fluid obtained and promotes the adhesion of the droplets 10.

(Operation) In the configuration of the above-described electric circuit manufacturing apparatus, when the substrate 1 is installed on the apparatus, the control circuit 5 outputs a drive signal Sx or Sy. Motor 41 or 4
Reference numeral 2 denotes an ink jet recording head 2x and a pattern forming surface 100 of the substrate 1 corresponding to the drive signal Sx or Sy.
Is changed, and the head 2x is moved to the pattern formation area. Next, in order to specify any one of the fluids 11 to 1n according to the electrical characteristics of the type of pattern to be formed such as conductive, semiconductive, insulating or dielectric, and to discharge the fluid Is supplied.
Each of the fluids 11 to 1n flows into the cavity 221 of the corresponding ink jet recording head 2x. In the ink jet recording head 2x to which the ejection signal Shx is supplied, the piezoelectric element 240 causes a volume change due to a voltage applied between the upper electrode and the lower electrode. This volume change deforms diaphragm 230 and changes the volume of cavity 221. As a result, the droplet 10 of the fluid flows from the nozzle hole 211 of the cavity 221 to the pattern forming surface 1.
Discharged toward 00. The fluid reduced by the discharge is newly supplied to the cavity 221 from which the fluid has been discharged from the tank 3x.

(Manufacturing Method) Next, a method for forming the capacitor of the present embodiment will be described with reference to FIGS. In each figure, (a) shows a cross-sectional view of the manufacturing process cut along the center line of the circuit element, and (b) shows a plan view. Insulating film forming step (FIG. 2): First, the ink jet recording head 21 is moved to a region where an insulating film is to be formed as shown in FIG. 2A, and a fluid containing an insulating material as a pattern forming material is transferred from the head 21. 11 is discharged. Examples of the insulating material include SiO ₂ and Al ₂ O ₃ , and dielectrics such as SrTiO ₃ , BaTiO ₃ , and Pb (Zr, Ti) O ₃
And so on. Examples of the solvent include PGMEA, cyclohexane, carbitol acetate and the like. Glycerin, diethylene glycol, ethylene glycol, or the like may be added as a wetting agent or binder as needed. As the fluid 11 containing an insulating material, polysilazane or a metal alkoxide containing an insulating material may be used. In this case, the insulator material can be formed by heating, a chemical reaction, or the like. The discharged fluid 11 lands on the pattern forming surface 100. The landed fluid 11 has a diameter of about several tens of μm. By moving the head 21 as shown in FIG. 2B and continuously ejecting the fluid 11 along the pattern forming region, a macroscopically rectangular insulating film pattern can be formed. The width and length of the insulating film 101 and the dielectric constant of the insulating material are determined according to the capacitance of a capacitor to be formed. This is because the capacitance of the capacitor is determined by the area, gap, and dielectric constant of the counter electrode. When the thickness of the film is increased, the film may be manufactured in a laminated structure such that the same fluid is further discharged onto the solidified film and solidified.

When the fluid contains an insulating material, there is no electrical adverse effect even if the solidified film is not a dense film, so that it is only necessary to evaporate the solvent component. However, it is desirable to perform a heat treatment to strengthen the film. In the case where the insulating film is solidified by a chemical reaction, it is conceivable that the insulating film is treated with a chemical that causes destruction of the dispersion system. For example, when the fluid 11 is mainly composed of an organic pigment dispersed in a styrene-acryl resin, a magnesium nitrate aqueous solution is discharged as a reaction liquid.
When the fluid 11 contains an epoxy resin as a main component, amines are discharged as a reaction liquid. It is preferable to perform the solidification treatment every time one pattern is formed. This is because, when a fluid containing another pattern forming material is discharged over a fluid that has not been solidified, desired electrical characteristics cannot be obtained because the materials are mixed.

Note that a dielectric material may be used instead of an insulating material as a pattern forming material. This is because the capacity of the capacitor can be increased by filling a dielectric material between the electrodes. Further, a plurality of insulating films may be formed of a plurality of materials in parallel. This is because a function similar to the multilayer structure of the capacitor can be provided. When the gap between the electrodes is small, it is preferable to select an insulating material such that the insulating film has incompatibility with the fluid 12 containing a conductive material to be discharged later. This is because the formed insulating film repels the fluid 12, so that the risk of short-circuiting the electrodes is reduced.

Conductive Film Forming Step (FIGS. 3 and 4): After the insulating film 101 is solidified, the ink jet recording head 21 is placed in the region where the conductive film is to be formed as shown in FIGS. 3 (a) and 4 (a). Move. Next, FIG. 3 (b) and FIG.
The fluid 22 containing the conductive material as the pattern forming material is discharged by moving the head 22 as indicated by the arrow in FIG. Thus, a conductive film 102 serving as an electrode of the capacitor is formed. As the conductive material of the pattern forming material,
RuO ₂ , IrO ₂ , OsO ₂ , MoO ₂ , ReO ₂ ,
_{WO 2, YBa 2 Cu 3 O} 7-x, Pt, Au, Ag,
In, In-Ga alloy, Ga, solder, and the like can be considered. Examples of the solvent include butyl carbitol acetate, 3-dimethyl-2-imitazolidine, and BMA. As the fluid 12 containing a conductive material, In-Ga, In,
A low melting point metal such as solder may be used in a state of being melted by heating or the like. The pattern of the conductive film can be changed to various shapes other than the shapes shown in FIGS. For example, the capacitance of the capacitor can be further increased by forming each conductive film or insulating film in a saw-tooth or uneven shape so that the opposing electrodes mesh with each other. In order to increase the capacitance of the capacitor, it is preferable to increase the height of the insulating film 101 and the height of the opposing surface of the conductive film 102 to increase the electrode area.

Next, the conductive film is solidified to obtain desired electrical characteristics. When the fluid 12 contains fine particles of a conductive material such as a metal as a pattern forming material, the fluid 12b discharged from the ink jet recording head 22 contains a solvent, as shown in FIGS. 5A and 5B. Fine particles are scattered inside. Only by evaporating the solvent from this fluid, the pattern forming material is not continuous and the conductivity cannot be ensured. Therefore, as shown in FIG. 6, the conductive material is heated to a temperature equal to or higher than the melting point of the conductive material by the solidifying device 6 or the like. This treatment evaporates the solvent, dissolves the pattern forming material, and connects and integrates the fine particles with each other. Even when the fluid 12 is a solution in which the pattern forming material is dissolved, the conductive material is deposited by evaporating the solvent by heat treatment. When the pattern forming material is a material such as a metal heated to a melting point or higher, the conductive material may be solidified by maintaining the pattern forming surface at a temperature lower than the melting point.

Further, the conductive film may be formed by the steps shown in FIGS. In this method, first, FIG.
As shown in (b), the fluid 13 containing the adhesive material is discharged from the ink jet recording head 23 to the pattern formation region of the conductive film. As the adhesive material, when not heated at a high temperature, a thermosetting resin adhesive, a rubber adhesive, an emulsion adhesive, or the like is used. When heating at a high temperature, polyaromatics, ceramics-based adhesives, and the like can be used. Next, as shown in FIGS. 8A and 8B, the conductive fine particles 13 are formed on the entire surface of the pattern forming surface 100.
1. Spray metal powder, for example. Next, FIG.
As shown in (b), when the conductive fine particles 131 are blown off from the pattern forming surface 100, the conductive fine particles 1 are only applied to the pattern forming region where the adhesive material is applied.
31 remains adhered. Thereafter, as described in FIG. 6, when heated to a temperature equal to or higher than the melting point of the conductive fine particles,
The fine particles 131 melt on the surface of the adhesive material and are connected to each other to form a continuous pattern having conductivity. Further, heat treatment may be performed by simultaneously applying ultrasonic waves while spraying fine particles. According to the heating by the ultrasonic wave, a pattern with good electric characteristics can be formed. If the fine particles are compressed after the adhesion of the fine particles, the fine particles are connected to each other, so that the electric characteristics can be improved. Compression of the fine particles and the other methods described above may be used in combination. Note that, in addition to the conductive material, a dielectric material may be applied to the fine particles. When applied to a capacitor, the capacity of the capacitor can be increased. If a magnetic material is applied to the coil as the fine particles, the inductance of the coil can be increased.

When the conductive film has low adhesion to the pattern forming surface 100, an affinity film may be formed as a base layer using a fluid containing a material having a high affinity for the fluid. . For example, as shown in FIG. 10, a fluid 14 having a high affinity for the fluid 12 is ejected from the ink jet recording head 24 to the pattern formation region of the film. For example, if the fluid 12 is an organic material, the affinity film 104 is formed by discharging a porous material such as resin, paraffin, aluminum oxide, and silica. Since the affinity film 104 has good adhesion to the fluid 12, the fluid 12 is discharged onto the affinity film 104 as shown in FIG.
The conductive film 102 with good adhesion and spread over the top is formed. On the other hand, if the conductive film has too good adhesion to the pattern forming surface 100 and spreads too much, the non-affinity film may be formed using a fluid containing a material having non-affinity for the fluid. Good. For example, as shown in FIG. 12, a fluid 15 having a low affinity for the fluid 12 is ejected from the ink jet recording head 25 to both sides of the pattern formation region of the conductive film. For example, if the fluid 12 is a material exhibiting hydrophilicity, the non-affinity film 105 is formed by discharging a porous material such as resin, paraffin, aluminum oxide and silica. Since the non-affinity film 105 repels the fluid 12, the fluid 12 is repelled by the non-affinity films 105 on both sides if the fluid 12 is discharged along the pattern formation region as shown in FIG. The fluid does not spread beyond the gap of the membrane 105. Thus, a well-formed conductive film 102 is formed. Other materials that are effective as an underlayer include low dielectric materials and SiO.
₂ , Al ₂ O ₃ , TiO _{2, and the} like having adhesion and insulation properties. The step of providing the affinity film or the non-affinity film may be applied to an insulating film or another film.

Through the above steps, the capacitor 121 can be formed on the pattern forming surface 100 as an electric circuit. If the capacitance of the capacitor 121 is insufficient as a result of the actual measurement, the conductive material 102 is lengthened to increase the area of the counter electrode, or a dielectric material is discharged onto the insulating film 101 or an extension of the conductive film 102. Otherwise, the capacity can be finely adjusted. If the capacitor formed first is set to be slightly smaller than the desired capacity, the capacity can be increased later to set the optimum capacity.

As described above, according to the first embodiment, since the insulating film and the conductive film of the capacitor are formed by the ink-jet method, an inexpensive and small-sized apparatus similar to an ink-jet printer used in a home printer can be used. Capacitors of any shape can be manufactured. In particular, the capacitance can be easily increased even when the capacitance of the capacitor needs to be finely adjusted.

(Embodiment 2) Embodiment 2 of the present invention is to manufacture an electric circuit including a capacitor having a form different from that of Embodiment 1 described above. In the second embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used.

(Manufacturing Method) Next, a method for forming the capacitor according to the present embodiment will be described with reference to FIGS.
In each figure, (a) shows a cross-sectional view of the manufacturing process cut along the center line of the circuit element, and (b) shows a plan view.

Conductive film forming step (FIG. 14): First, the ink jet recording head 22 is moved to a region where a conductive film is to be formed as shown in FIG. 14A, and a conductive material is formed from the head 22 as a pattern forming material. The containing fluid 12 is discharged. The fluid 12 is the same as in the first embodiment. In order to increase the capacitance of the capacitor, the conductive film 102 is formed in a region as large as possible. FIG.
The head 22 is moved as indicated by the arrow in FIG.
Is discharged, the conductive film 102 serving as the lower electrode of the capacitor is discharged.
Can be formed. Solidification may be performed in the same manner as in the first embodiment.

Insulating film forming step (FIG. 15): Next, as shown in FIG. 15A, the ink jet type recording head 21 is moved so as to cover the lower electrode, and a flow including an insulating material as a pattern forming material from the head 21. The body 11 is discharged. The fluid 11 is the same as in the second embodiment. By moving the head 21 as shown in FIG. 15B, the fluid 11 is discharged to a pattern formation region covering the conductive film 102 which is a lower electrode. As the width of the insulating film 101 is smaller, the capacitance of the capacitor can be increased, but there is a risk of short-circuit between the electrodes. Therefore, the insulating film 101 is formed to have a thickness enough to obtain sufficient insulation. If the insulating film 101 is formed of a dielectric material, the capacity of the capacitor can be increased. The solidification of the fluid 11 is the same as in the first embodiment.

Step of forming conductive film (FIG. 16): insulating film 10
When 1 is solidified, the ink jet recording head 21 is moved on the insulating film as shown in FIG. 16A, and the fluid 22 containing the conductive material is discharged from the head 22 to further laminate the conductive film 102. . The fluid 22 is discharged and solidified by moving the head 22 as indicated by the arrow in FIG. 16B, thereby forming the conductive film 102 serving as the upper electrode of the capacitor. The fluid 12 and the solidification thereof are the same as in the first embodiment.

Through the above steps, the capacitor 122 can be formed on the pattern forming surface 100 as an electric circuit. It is preferable that the area of the upper electrode is smaller than the area of the lower electrode. This is because, when the capacity is to be changed later, the capacity can be easily increased by increasing the area of the upper electrode by the ink jet method.

As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained, and a large-capacity capacitor can be manufactured because the area of the electrode can be set large.
In particular, if the upper electrode is formed to be small, the capacitance of the capacitor can be finely adjusted only by increasing the area of the upper electrode.

(Embodiment 3) Embodiment 3 of the present invention is to manufacture an electric circuit including a coil. In the third embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used.

(Manufacturing Method) A method of forming a coil according to the present embodiment will be described with reference to FIGS. In each figure, (a) shows a cross-sectional view of the manufacturing process cut along the center line of the circuit element, and (b) shows a plan view. Conductive film forming step (FIG. 17): First, the fluid 12 containing a conductive material is discharged while moving the ink jet recording head 22 as shown in FIGS. 17A and 17B, which corresponds to the lead wire of the coil. A conductive film 102 is formed. The fluid 12 and the solidification thereof are described in the first embodiment.
Is the same as If a magnetic material is applied on the pattern formation surface 100 in advance or a magnetic material is applied between the spiral conductive films 102, the inductance of the coil can be increased.

Insulating film forming step (FIG. 18): Next, the ink jet recording head 21 is moved as shown in FIG. 18 (a) to discharge the fluid 11 containing an insulating material, as shown in FIG. 18 (b). The insulating film 101 is formed leaving the tip of the conductive film 102. As shown in this figure, an insulating film may be provided only at the intersection of the conductive film formed in FIG. 17 and the conductive film formed in FIG. 19 without providing a large insulating film. The fluid 11 and the solidification thereof are the same as in the first embodiment.

Step of forming spiral conductive film (FIG. 19): Next, the fluid 12 containing a conductive material is ejected from the ink jet recording head 21 and spirally moved as shown in FIG. A film 102 is formed. As shown in FIG. 19B, the center of the spiral conductive film 102 is in contact with the conductive film 102 formed in FIG. No part of the spiral contacts the previously formed conductive film. The number of spirals and the width of the conductive film 102 are determined according to the inductance value of the coil to be manufactured. The fluid 12 and the solidification thereof are the same as in the first embodiment.

By the above steps, the coil 1 is used as an electric circuit.
23 can be formed on the pattern forming surface 100.
If it is desired to increase the inductance of the coil 123 later, the spiral conductive film 102 may be further extended from the spiral end. When the inductance is reduced, a lead may be added from the middle of the already formed spiral conductive film 102.

As described above, according to the third embodiment, the coil can be easily manufactured as an electric circuit by the ink jet method. Further, fine adjustment such as increasing or decreasing the inductance can be easily performed later.

(Embodiment 4) Embodiment 4 of the present invention is to manufacture an electric circuit including a resistor. In the fourth embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used. However, the ink jet recording head 23 further includes a tank 33 for discharging the fluid 13 containing a semiconductive resistive material as a pattern forming material. As the resistance material, a mixture of conductive powder and insulating powder, Ni
-Cr, Cr-SiO, Cr-MgF, Au-Si
O ₂ , AuMgF, PtTa ₂ O ₅ , AuTa ₂ O ₅ T
a ₂ , Cr ₃ Si, TaSi _{2 and the} like . Examples of the solvent include PGMEA, cyclohexane, carbitol acetate and the like. Glycerin, diethylene glycol, ethylene glycol, or the like may be added as a wetting agent or binder as needed. As the fluid 13 containing an insulating material, polysilazane or metal alkoxide containing an insulating material may be used. In this case, the insulator material can be formed by heating, a chemical reaction, or the like. The resistance material is determined according to the resistance value of the resistor to be formed.

(Manufacturing Method) A method of forming the resistor according to the present embodiment will be described with reference to FIGS. In each figure, (a) shows a cross-sectional view of the manufacturing process cut along the center line of the circuit element, and (b) shows a plan view. Resistive film forming step (FIG. 20): First, the ink jet recording head 23 is moved as shown in FIGS. Then, the fluid film 13 containing a resistive material is discharged from the head 23 to provide an electric resistance.
Form 3 The solidification process is the same as in the first embodiment. Note that the width, height, and length of the resistance film 103 are determined according to the resistance value of a resistor to be formed. This is because the resistance value of the resistor is proportional to the length and inversely proportional to the cross-sectional area. Note that it is preferable that the height and width of the resistance film 103 be set so as to have a resistance value larger than a target resistance value. This is because the resistance value can be reduced to an appropriate value by increasing the height and width of the resistance film 103 later.

Step of forming conductive film (FIGS. 21 and 22):
When the semiconductive film 103 is solidified, the ink jet recording head 22 is moved as shown in FIGS. 21 and 22, the fluid 12 containing the conductive material is discharged, and the conductive film 102 is applied to both ends of the semiconductive film 103. Form. The fluid 12 and the solidification thereof are the same as in the first embodiment.

According to the above process, the resistor 1 is used as an electric circuit.
24 can be formed on the pattern forming surface 100.
If it is desired to finely adjust the resistance value of the resistor 124 later, the fluid 13 is further discharged to the semiconductive film 103 to increase the thickness or the width of the semiconductive film 103 so that the resistance value is appropriately adjusted. Can be reduced to the value.

As described above, according to the fourth embodiment, the resistor can be easily manufactured as an electric circuit by the ink jet method. It is also easy to fine-tune the resistance value later.

(Embodiment 5) In Embodiment 5 of the present invention, a conventional discrete component is used as a circuit element, and the present invention is applied to wiring therebetween. In the fifth embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used. However, an apparatus for arranging components on the pattern formation surface of the substrate 1 or a manual process is required. An electric circuit manufacturing method according to the present embodiment will be described with reference to FIGS. Each drawing is a plan view of the pattern forming surface. Component placement step (FIG. 23): Individual components are placed at appropriate positions on the pattern forming surface 100 of the substrate 1 by an insert machine or manually. The arrangement is determined according to the electric circuit to be manufactured. In FIG. 23, a resistor 110, a capacitor 111, and a transistor 112 are arranged as chip components. It is desirable that each component is bonded with a bond or the like. It is preferable that this bonding is also performed by an ink jet method. For example, as shown in FIGS. 25A and 25B, a fluid 17 containing an adhesive material is discharged from an ink jet recording head 27 to a region where a component is to be adhered, thereby forming an adhesive film 107. The adhesive film 107 may be formed in a region smaller than the area covered by the component, as long as the component can be temporarily fixed. Then, as shown in FIG. 26, a component (resistor 110) may be attached on the adhesive film 107 by the insert machine 7 or the like. Note that an epoxy resin, a resin that is cured by energy, or the like is used as the adhesive material. For example, if a thermosetting resin or a thermoplastic resin is used, the components can be bonded by setting the temperature of the applied heat.

Wiring step (FIG. 24): After the components are bonded, a fluid 1 containing a conductive material as a pattern forming material
2, a wiring pattern for connecting the components is formed. The conductive material and the solidification thereof are the same as in the first embodiment. When the wiring patterns are crossed, the insulating film 1 is formed at the crossing portion of the wiring after forming the conductive film 102 below.
01 may be provided and the conductive film 102 may be further formed thereon. Note that the wiring pattern formed of the conductive film 102 and the terminals of each component may be soldered. The soldering may be performed by an inkjet method. If the solder is heated above the melting temperature and discharged from the ink jet recording head, the soldering can be easily performed.

In the above embodiment, the circuit elements are formed of individual components and the wiring is performed by the ink jet method. However, a part or all of the circuit elements may be manufactured by the ink jet method as in the above embodiments. In other words, individual components are employed for large-capacity capacitors, high-inductance coils, and active elements having a complicated configuration, and the ink jet method is applied to circuit elements that can be easily formed on a pattern formation surface.

As described above, according to the fifth embodiment, even when individual components are used, wiring can be easily performed by the ink jet method. In particular, an electric circuit can be manufactured even if there is a circuit element that is difficult to form by an ink jet method. In addition, if a fixed substrate on which individual components are arranged in a fixed arrangement is manufactured in advance, an arbitrary electric circuit can be assembled using an ink jet method.

(Embodiment 6) Embodiment 6 of the present invention relates to a method of manufacturing an electric circuit for distinguishing each other when forming a large number of wiring patterns on a pattern formation surface as in Embodiment 5. In the fifth embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used. However, a plurality of tanks 22 and ink jet recording heads 22 for discharging the fluid 12 containing a conductive material are provided in accordance with the type of the wiring pattern. Dyes and pigments of different colors are mixed into the individual fluids 12 to constitute them. As the dye, stilbene-based, oxazole-based, imidazolone-based, coumarin-based, and the like can be used as fluorescent whitening dyes. Azo dyes, anthraquinone dyes, indico dyes and sulfurized dyes can be used as general dyes. Specific examples include 2,4-dinitrophenols for black, m-toluylenediamines for yellow, and phenodines for red. As the pigment, insoluble azo, azo lake, phthalocyanine and the like can be used. Since the pigment is composed of colored particles, a single molecule does not hinder electric conduction unlike a dye. For this reason, it is more preferable to use a pigment. Each wiring pattern is
For example, the power supply wiring, the ground wiring, and the other wiring are color-coded, or the analog circuit wiring and the digital circuit wiring are color-coded. For example, in FIG. 27, the power supply wiring 108, the ground wiring 109, and the other wiring 102 are color-coded. When the wiring patterns intersect, the insulating film 101 may be formed at the intersections of the wirings as shown in FIG.

Note that the wiring pattern itself may be colored with a colored film covering the wiring pattern without being colored. For example, FIG.
In this example, the conductive film 102 as a wiring pattern is formed so as to cover the colored film 130. The colored film 130 may be formed by discharging a resin or the like containing a pigment or a dye by an inkjet method. If the colored film 130 is formed of a resin or the like, since the insulating property is provided, the insulating property can be ensured even when the wiring patterns cross. In addition, since the conductive film 102 does not contain a pigment or a dye, there is no risk of impeding electric conduction. Further, the conductive material itself may have a unique color, and the color may be color-coded by selectively using the conductive material according to the wiring pattern without using a dye. For example, copper is red, silver and platinum are white, and gold is yellow. Therefore, instead of changing the pigment or the dye, if a fluid containing a different conductive material is discharged to form a conductive film, a certain degree of color separation can be achieved.

The wiring pattern does not necessarily need to be manufactured by the ink jet method, but may be manufactured by another method such as a photolithography method. This is because the same effect is obtained as long as the wiring pattern is color-coded.

As described above, according to the sixth embodiment, since the wiring patterns are manufactured in different colors, according to the electric circuit, it is easy to identify the wiring paths and parts at the time of failure or improvement of the circuit. It leads to ease. Maintenance and inspection can be facilitated even when color coding is adopted in the production line.

(Other Modifications) The present invention can be applied in various modifications without depending on the above embodiment. For example, in the above-described embodiment, a method for manufacturing a capacitor, a coil, and a resistor has been described. As the fluid, a material in which a semiconductor material such as silicon or germanium is doped with various elements may be used. Doping may be performed later. By stacking a large number of semiconductor films of electron majority carriers and reaction films of hole majority carriers in various shapes while adjusting the carrier density, it is also possible to manufacture semiconductors manufactured by epitaxial growth by an inkjet method. . By forming a laminated structure similar to various semiconductors manufactured by a normal semiconductor process, all known semiconductor elements can be manufactured.

Further, various surface modification treatments may be performed before discharging the fluid by the above-mentioned ink jet method. For example, as a treatment for modifying the surface so that the pattern forming surface has an affinity, a method of applying a silane coupling agent, a method of applying reverse sputtering with argon or the like, a method of applying corona, depending on the presence or absence of polar molecules in the fluid. Various known methods such as a discharge treatment, a plasma treatment, an ultraviolet irradiation treatment, an ozone treatment, and a degreasing treatment are applied. When the fluid does not contain polar molecules, a method of applying a silane coupling agent, a method of forming a porous film such as aluminum oxide or silica,
Various known methods such as a method of performing reverse sputtering with argon or the like, a corona discharge treatment, a plasma treatment, an ultraviolet irradiation treatment, an ozone treatment, a degreasing treatment, and the like can be applied. The affinity may be adjusted by etching the pattern formation surface or the film formed by the inkjet method to form irregularities.

The pattern formed by the ink jet method is not limited to an electric circuit, but may be a pattern formed on a pattern forming surface for mechanical or design purposes. This is because the advantage of the inkjet method that a fine pattern can be easily formed with inexpensive equipment can be enjoyed as it is.

[0063]

According to the present invention, since an arbitrary pattern can be formed on a pattern forming surface by adhering a fluid, an electric circuit suitable for small-quantity production and trial production, and a method and an apparatus for producing the electric circuit are provided. be able to. That is, an electric circuit of a certain quality can be provided at low cost without using large-scale factory equipment. In addition, according to the ink-jet method, a pattern can be easily added, so that a circuit constant of a circuit element can be easily changed or a wiring can be easily added.

According to the present invention, since the color is changed according to the pattern to facilitate the identification of the pattern, it is possible to provide an electric circuit suitable for trial manufacture and a method of manufacturing the same. Therefore, even in a prototype, the circuit can be analyzed in a short time, and the efficiency of circuit evaluation can be improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an electric circuit manufacturing apparatus according to a first embodiment of the present invention.

FIG. 2 is an insulating film forming step of the method for forming a capacitor according to the first embodiment.

FIG. 3 shows a conductive film forming step of the method for forming a capacitor according to the first embodiment.

FIG. 4 is a conductive film forming step of the method for forming a capacitor according to the first embodiment.

FIG. 5 is a discharge step when a fluid containing fine particles is used.

FIG. 6 shows a heating step when a fluid containing fine particles is used.

FIG. 7 shows an adhesive film forming step when an adhesive is used.

FIG. 8 shows a fine particle scattering step when an adhesive is used.

FIG. 9 shows a fine particle removing step when an adhesive is used.

FIG. 10 shows an affinity film forming step.

FIG. 11 shows a conductive film forming step when an affinity film is used.

FIG. 12 shows a non-affinity film forming step.

FIG. 13 shows a conductive film forming step in the case of using a non-affinity film.

FIG. 14 shows a conductive film forming step of the capacitor forming method according to the second embodiment.

FIG. 15 shows an insulating film forming step of the capacitor forming method according to the second embodiment.

FIG. 16 shows a conductive film forming step of the capacitor forming method according to the second embodiment.

FIG. 17 shows a conductive film forming step of the coil forming method in the third embodiment.

FIG. 18 shows an insulating film forming step of the coil forming method according to the third embodiment.

FIG. 19 shows a conductive film forming step of the coil forming method in the third embodiment.

FIG. 20 shows a resistance film forming step of the method for forming a resistor according to the fourth embodiment.

FIG. 21 shows a conductive film forming step of the resistor forming method in the fourth embodiment.

FIG. 22 shows a conductive film forming step of the resistor forming method in the fourth embodiment.

FIG. 23 shows an individual component placement step in the fifth embodiment.

FIG. 24 shows a conductive film forming step in the fifth embodiment.

FIG. 25 shows a step of forming an adhesive film in the fifth embodiment.

FIG. 26 shows an individual component bonding step in Samurai History Mode 5.

FIG. 27 is an example of color coding of a wiring pattern according to the sixth embodiment.

FIG. 28 is a modification of the wiring pattern coloring method according to the sixth embodiment.

FIG. 29 is an exploded perspective view of the ink jet recording head.

FIG. 30 is a perspective view, partly in section, of a main part of an ink jet recording head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate 2, 2x, 21-2n ... Ink jet recording head 3, 3x, 31-3n ... Processing device 4 ... Drive mechanism 5 ... Control circuit 6 ... Solidification device 1x, 11-1n ... Fluid (pattern forming material) REFERENCE SIGNS LIST 100 pattern forming surface 101 insulating film 102 conductive film 103 adhesive film 131 fine particles 104 affinity film (base film) 105 non-affinity film 106 resistive film 107 adhesive film

Continued on the front page (72) Inventor Tatsuya Shimoda 3-5-5 Yamato, Suwa-shi, Nagano Seiko Epson Corporation

Claims (26)

[Claims] 1. An electric circuit formed on a pattern forming surface, wherein the electric circuit includes a pattern formed by solidifying a fluid containing a pattern forming material on the pattern forming surface. Electrical circuit. 2. An apparatus according to claim 1, further comprising an affinity layer for improving the adhesion between said pattern forming surface and said pattern.
An electric circuit according to claim 1. 3. The electric circuit according to claim 1, further comprising a non-affinity layer for limiting an attachment area of the pattern. 4. The electric circuit according to claim 1, wherein the pattern forming material is one of a conductive material, a semiconductive material, an insulating material, and a dielectric material. 5. The electric circuit according to claim 1, further comprising a wiring pattern in which a fluid containing a conductive material is solidified as the pattern forming material. 6. An insulating film in which a fluid containing an insulating material or a dielectric material as the pattern forming material is solidified, and a fluid containing a conductive material as the pattern forming material sandwiches the insulating film. The electric circuit according to claim 1, wherein the capacitor is constituted by the solidified electrode film opposed to each other. 7. The electric circuit according to claim 1, further comprising a coil in which a fluid containing a conductive material as the material for forming the pattern is spirally attached to the pattern forming surface and solidified. 8. A resistor in which a fluid containing a conductive material as the pattern forming material is solidified at both ends of a semi-conductive film in which a fluid containing a semi-conductive material as the pattern forming material is solidified. The electric circuit according to claim 1, comprising: 9. The electric circuit according to claim 1, further comprising a semiconductor circuit element formed by solidifying a fluid containing a semiconductive material doped with a predetermined element as the pattern forming material. . 10. The electric circuit according to claim 1, comprising a plurality of said patterns, each of which is given a different color to identify each other. 11. A method for manufacturing an electric circuit for forming an electric circuit on a pattern forming surface, comprising: discharging a fluid containing a pattern forming material onto the pattern forming surface; and discharging the fluid containing the pattern forming material onto the pattern forming surface. And a step of solidifying the fluid. 12. In the step of discharging the fluid, a material heated and melted at a temperature equal to or higher than the melting point of the pattern forming material is discharged as the fluid, and in the step of solidifying the fluid, the vicinity of the pattern forming surface is provided. The method for manufacturing an electric circuit according to claim 11, wherein the temperature is kept lower than the melting point of the pattern forming material to solidify the fluid. 13. The step of discharging the fluid, the step of discharging the pattern forming material agitated by a solvent as fine particles as the fluid, and the step of solidifying the fluid includes the step of: Applying a temperature equal to or higher than the melting point of the pattern forming material to dissolve the fine particles; and applying a temperature lower than the melting point to solidify the melted material. Production method. 14. The method of manufacturing an electric circuit according to claim 11, further comprising a step of forming an affinity layer for improving the adhesion between the pattern forming surface and the pattern before discharging the fluid. . 15. The method of manufacturing an electric circuit according to claim 11, further comprising a step of forming a non-affinity layer for restricting an attachment area of the pattern before discharging the fluid. 16. A method for manufacturing an electric circuit for forming an electric circuit on a pattern forming surface, comprising: a step of discharging an adhesive material on the pattern forming surface; and a step of spraying fine particles of a pattern forming material on the pattern forming surface. And a step of removing the fine particles other than those adhering to the adhesive material from the pattern forming surface. 17. After the step of removing the fine particles from the pattern forming surface, applying a temperature near the pattern forming surface to a temperature equal to or higher than the melting point of the pattern forming material to dissolve the fine particles; The method for manufacturing an electric circuit according to claim 16, further comprising: a step of applying a low temperature to solidify a melted material. 18. The method according to claim 16, further comprising, after the step of removing the fine particles from the pattern forming surface, a step of compressing the fine particles attached to the adhesive material. 19. The method of manufacturing an electric circuit according to claim 11, wherein the material for forming a pattern is at least one of a conductive material, a semiconductive material, an insulating material, and a dielectric material. Method. 20. An insulating film is formed by discharging a fluid containing the insulating material, and a fluid containing the conductive material is discharged so as to face the electrode film by sandwiching the insulating film. 19. The method for manufacturing an electric circuit according to claim 11, wherein the capacitor is formed by forming the capacitor. 21. A coil formed by spirally discharging a fluid containing the conductive material.
3. The method for producing an electric circuit according to claim 1. 22. A fluid containing the semiconductive material is discharged to form a semiconductive film, and a fluid containing the conductive material is discharged to both ends of the semiconductive film to form a conductive film. The method for manufacturing an electric circuit according to claim 11, wherein the resistor is formed by forming a film. 23. A step of discharging a fluid containing a semiconductive material doped with a predetermined element to form a semiconductor film is repeated a plurality of times while changing the element to be doped into the fluid, thereby forming a semiconductor circuit element. The method for manufacturing an electric circuit according to claim 11, wherein the electric circuit is formed. 24. A plurality of patterns can be identified by forming a pattern by mixing pigments or dyes of different colors into a fluid for forming the pattern according to the pattern. 3. The method for producing an electric circuit according to claim 1. 25. A plurality of patterns can be identified by covering a pattern formed by the fluid and forming a layer containing a pigment or a dye having a color corresponding to the pattern. 3. The method for producing an electric circuit according to claim 1. 26. An electric circuit manufacturing apparatus for forming an arbitrary pattern on a pattern forming surface with a fluid containing a pattern forming material, wherein the fluid is dischargeable to the pattern forming surface. An ink jet recording head, a driving mechanism configured to change a relative position between the ink jet recording head and the pattern forming surface, and a solidification adjusting an atmosphere to solidify a fluid on the pattern forming surface. And a control device for controlling the discharge of the fluid from the ink jet recording head, the driving by the driving mechanism, and the adjustment of the atmosphere by the solidifying device. The control device controls the ink jet by the driving mechanism. While moving the ink jet recording head along an arbitrary pattern, An electric circuit formed by discharging a fluid, adjusting an atmosphere of the pattern forming surface by the solidifying device, and solidifying the fluid discharged on the pattern forming surface. Circuit manufacturing equipment.