JP4741045B2 - Electric circuit, manufacturing method thereof and electric circuit manufacturing apparatus - Google Patents

Electric circuit, manufacturing method thereof and electric circuit manufacturing apparatus Download PDF

Info

Publication number
JP4741045B2
JP4741045B2 JP07814998A JP7814998A JP4741045B2 JP 4741045 B2 JP4741045 B2 JP 4741045B2 JP 07814998 A JP07814998 A JP 07814998A JP 7814998 A JP7814998 A JP 7814998A JP 4741045 B2 JP4741045 B2 JP 4741045B2
Authority
JP
Japan
Prior art keywords
pattern
fluid
material
pattern forming
electric circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP07814998A
Other languages
Japanese (ja)
Other versions
JPH11274671A (en
Inventor
武富 上川
達也 下田
栄治 名取
節也 岩下
Original Assignee
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーエプソン株式会社 filed Critical セイコーエプソン株式会社
Priority to JP07814998A priority Critical patent/JP4741045B2/en
Publication of JPH11274671A publication Critical patent/JPH11274671A/en
Application granted granted Critical
Publication of JP4741045B2 publication Critical patent/JP4741045B2/en
Anticipated expiration legal-status Critical
Application status is Expired - Fee Related legal-status Critical

Links

Images

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for manufacturing an electric circuit on a substrate or the like, and more particularly to improvement of an electric circuit manufacturing technique for forming an arbitrary electric circuit by an ink jet method or the like.
[0002]
[Prior art]
Conventionally, a lithography method or the like has been used to manufacture a minute circuit, for example, an integrated circuit. In this lithography method, a photosensitive material called a resist is thinly applied on a silicon wafer, and a circuit pattern created by photolithography is printed on a glass dry plate by light transfer. Ions or the like are implanted into the transferred resist pattern to form wiring patterns and circuit elements. The production of an electric circuit using the lithography method requires steps such as photolithography, resist coating, exposure, and development. Therefore, the electric circuit cannot be produced unless the semiconductor factory is equipped with facilities.
In order to manufacture a large electric circuit, individual parts are arranged on the board by an insert machine or the like, and the board is passed through a solder bath to make an electric circuit board. Consistent manufacturing facilities such as an insert machine, a flux tank, and a solder tank have been required for electric circuits manufactured in such a manufacturing line.
On the other hand, a prototype of an electric circuit was manufactured by using a universal board or the like, and a developer attaching and soldering all components.
As described above, in order to mass-produce electric circuits, capital investment and complicated process management are required, but it took labor and time to produce prototypes.
[0003]
[Problems to be solved by the invention]
However, since it is now an era of high-mix low-volume production, conventional manufacturing methods have not always been efficient and economical. That is, in the production line, it is necessary to redo the setting of the manufacturing equipment every time the electric circuit to be manufactured is changed, so that the time required for setting and adjustment increases, making it difficult to reduce costs.
Also, in the production of prototypes, it is common practice to make multiple prototypes at the same time and add consideration, and it was uneconomical to spend time only on making prototypes by hand. In the prototype, the circuit constant is evaluated by variously changing the physical constant of the circuit element. However, in the method of attaching the circuit component to the substrate, it takes labor to replace the component when the physical constant is changed. Furthermore, since the physical constants are determined by circuit components, it is difficult to change the physical constants delicately. In addition, in the prototype, it is necessary to identify complicated wiring patterns in order to study the circuit, but it is difficult to see what kind of pattern it was at first glance by looking at the board with wiring using conventional solder or lead wires There was also a point. In view of the above problems, the present applicant has come up with the idea of giving a new option to the manufacturing technology of electric circuits by utilizing the fact that a technique such as an ink jet method can attach a fluid in an arbitrary pattern.
[0004]
[Means for Solving the Problems]
That is, the first object of the present invention is to provide an electric circuit suitable for small-scale production and trial production by forming a pattern by a method that has not existed conventionally.
A second object of the present invention is to provide an electric circuit suitable for small-scale production and trial production by forming circuit elements by a method that has not existed conventionally.
The third problem of the present invention is to provide an electric circuit suitable for trial manufacture by forming a pattern that can be easily identified.
The fourth problem of the present invention is to provide a method of manufacturing an electric circuit suitable for small-scale production and trial production by forming a pattern by a method that has not existed conventionally.
The fifth object of the present invention is to provide a method of manufacturing an electric circuit suitable for small-scale production and trial production by forming circuit elements by a method that did not exist conventionally.
A sixth problem of the present invention is to provide a method of manufacturing an electric circuit suitable for trial manufacture by forming a pattern that can be easily identified.
A seventh problem of the present invention is to provide an electric circuit manufacturing apparatus suitable for small-scale multi-production and trial production by providing a configuration for forming a pattern by a method that has not existed conventionally.
[0005]
An invention for solving the first problem is an electric circuit formed on a pattern forming surface, comprising a pattern formed by adhering and solidifying a fluid containing a pattern forming material on the pattern forming surface. It is an electric circuit.
[0006]
Here, various methods such as various printing methods can be applied as a method for attaching the fluid, but an ink jet method is preferable. This is because according to the ink jet method, the fluid can be attached at an arbitrary thickness on an arbitrary place on the pattern forming surface with an inexpensive facility. The ink jet method may be a piezo jet method in which a fluid is ejected by a change in volume of a piezoelectric element, or a method in which a fluid is ejected by the rapid generation of steam by application of heat. The fluid means a medium having a viscosity that can be discharged from a nozzle. It does not matter whether it is aqueous or oily. It is sufficient if it has fluidity (viscosity) that can be discharged from a nozzle or the like. The fluidity can be measured, for example, by the contact angle of the fluid. For example, the pattern forming material may include any one of a conductive material, a semiconductive material, an insulating material, and a dielectric material. These materials may be heated and melted to a temperature higher than the melting point, or may be stirred as fine particles in a solvent, or may be those added with dyes, pigments, or other functional materials in addition to the solvent.
In addition, the electric circuit is not limited to only a member formed by an electrical cooperative relationship between circuit elements, and is widely applied to, for example, a mechanical or design pattern. That is, the pattern to be formed need not have specific electrical characteristics, and the pattern forming material is not limited to having certain electrical characteristics.
In addition to the surface of the flat substrate, the pattern forming surface may be a curved substrate. Furthermore, the pattern forming surface does not need to have a high hardness, and may be a flexible surface such as a film, paper, or rubber.
[0007]
The present invention further includes an affinity layer for enhancing the adhesion between the pattern forming surface and the pattern. Further, a non-affinity layer is further provided to limit the pattern adhesion region. Here, non-affinity refers to the property of a relatively large contact angle with respect to the fluid. Affinity means that the contact angle with respect to the fluid is relatively small. These expressions are used in contrast to affinity to clarify the behavior of the membrane relative to the fluid.
[0008]
The invention for solving the second problem is an electric circuit including a wiring pattern in which a fluid containing a conductive material is solidified as a pattern forming material. Also, an insulating film in which a fluid containing an insulating material or a dielectric material is solidified as a pattern forming material, and an electrode in which a fluid containing a conductive material as a pattern forming material is solidified facing each other with the insulating film in between An electric circuit constituting a capacitor by a film. Moreover, it is an electric circuit provided with the coil which the fluid containing the electroconductive material as a pattern formation material adhered to the pattern formation surface in the shape of a vortex, and was solidified. Furthermore, the electric circuit includes a resistor in which a fluid containing a conductive material as a pattern forming material is solidified at both ends of a semiconductive film solidified as a fluid containing a semiconductive material as a pattern forming material. . In addition, the electric circuit includes a semiconductor circuit element formed by solidifying a fluid containing a semiconductive material doped with a predetermined element as a pattern forming material.
[0009]
The invention that solves the third problem is an electric circuit that includes a plurality of patterns and is provided with different colors to identify the patterns.
[0010]
The invention for solving the fourth problem includes a step of discharging a fluid containing a pattern forming material onto a pattern forming surface, and a pattern forming surface in a method of manufacturing an electric circuit for forming an electric circuit on a pattern forming surface. And a step of solidifying the fluid discharged to the substrate.
[0011]
For example, in the step of discharging the fluid, the material heated to the melting point or higher of the pattern forming material is discharged as a fluid, and in the step of solidifying the fluid, the temperature near the pattern forming surface is set to the pattern forming material. The fluid is solidified by maintaining the temperature below the melting point. Further, in the step of discharging the fluid, the pattern forming material stirred in a solvent as fine particles is discharged as a fluid, and the step of solidifying the fluid has a temperature near the pattern forming surface equal to or higher than the melting point of the pattern forming material. And a step of solidifying the dissolved material by applying a temperature lower than the melting point. Moreover, before discharging a fluid, the process of forming the affinity layer for improving the adhesiveness of a pattern formation surface and a pattern is provided. Furthermore, before discharging a fluid, the process of forming the non-affinity layer for restrict | limiting the adhesion area | region of a pattern is provided.
[0012]
Similarly, the present invention provides a method for producing an electric circuit on a pattern forming surface, a step of discharging an adhesive material on the pattern forming surface, a step of spraying fine particles of a pattern forming material on the pattern forming surface, And a step of removing fine particles other than those adhering to the adhesive material from the pattern forming surface. Further, the method may include a step of dissolving the fine particles by adding a temperature in the vicinity of the pattern forming surface that is equal to or higher than the melting point of the pattern forming material, and a step of solidifying the dissolved material by applying a temperature lower than the melting point. . Furthermore, you may provide the process of compressing the microparticles | fine-particles adhering to adhesive material.
[0013]
Here, the pattern forming material is at least one of a conductive material, a semiconductive material, an insulating material, and a dielectric material.
[0014]
In the invention for solving the fifth problem, a fluid containing an insulating material is discharged to form an insulating film, and a fluid containing a conductive material is discharged so as to face the insulating film. Thus, an electric circuit manufacturing method for forming a capacitor by forming an electrode film. Further, it is a method of manufacturing an electric circuit in which a coil containing a conductive material is ejected in a spiral shape to form a coil. Further, by discharging a fluid containing a semiconductive material to form a semiconductive film, and discharging a fluid containing a conductive material to both ends of the semiconductive film to form a conductive film. It is a manufacturing method of an electric circuit forming a resistor. In addition, the process of forming a semiconductor film by discharging a fluid containing a semiconductive material doped with a predetermined element is repeated a plurality of times while changing the element to be doped in the fluid. It is a manufacturing method.
[0015]
The invention that solves the sixth problem described above is an electric that enables a plurality of patterns to be identified by forming a pattern by mixing pigments or dyes of different colors into a fluid for forming the pattern according to the pattern. A circuit manufacturing method. Further, the present invention is a method for manufacturing an electric circuit that allows a plurality of patterns to be identified by covering a pattern formed by a fluid and forming a layer containing a pigment or dye of a color corresponding to the pattern.
[0016]
An invention for solving the seventh problem is an electric circuit manufacturing apparatus for forming an arbitrary pattern on a pattern forming surface by a fluid containing a pattern forming material, and discharging the fluid onto the pattern forming surface. An ink jet recording head configured to be configured, a drive mechanism configured to be able to change the relative position between the ink jet recording head and the pattern forming surface, and an atmosphere to adjust the fluid on the pattern forming surface A solidifying device; and a control device that controls discharge of a fluid from an ink jet recording head, driving by a driving mechanism, and adjustment of an atmosphere by the solidifying device. Then, the control device discharges the fluid from the ink jet recording head while moving the ink jet recording head along an arbitrary pattern by the driving mechanism, and adjusts the atmosphere of the pattern forming surface by the solidifying device to adjust the pattern forming surface. An electric circuit can be formed by solidifying the discharged fluid.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
The best mode for carrying out the present invention will be described below with reference to the drawings. In the following embodiments, when the same reference numerals as those of the other embodiments are used, the same members are indicated.
(Embodiment 1)
Embodiment 1 of this invention manufactures the electric circuit containing a capacitor | condenser using an inkjet system.
FIG. 1 shows a configuration diagram of an electric circuit manufacturing apparatus used in the first embodiment. As shown in FIG. 1, the electric circuit manufacturing apparatus includes ink jet recording heads 21 to 2n (n is an arbitrary natural number), tanks 31 to 3n, a driving mechanism 4, and a control circuit 5. This electric circuit manufacturing apparatus is configured to be able to form a predetermined pattern (electric circuit) 102 by adhering a liquid droplet 10 to the pattern forming surface 100 of the substrate 1.
[0018]
It is sufficient that the ink jet recording heads 21 to 2n have the same structure and are configured to be able to discharge a fluid by the ink jet method. FIG. 29 is an exploded perspective view for explaining a structural example of an ink jet recording head. As shown in FIG. 29, the ink jet recording head 2x (x is any one of 1 to n) includes a nozzle plate 210 provided with nozzles 211 and a pressure chamber substrate 220 provided with a diaphragm 230, and a casing 250. It is configured to fit in. The main structure of the ink jet recording head 2x has a structure in which a pressure chamber substrate 220 is sandwiched between a nozzle plate 210 and a vibration plate 230, as shown in a partial sectional view of a perspective view of FIG. The nozzle 211 is formed at a position where the nozzle plate 210 corresponds to the cavity 221 when being bonded to the pressure chamber substrate 220. The pressure chamber substrate 220 is provided with a plurality of cavities 221 so that each can function as a pressure chamber by etching a silicon single crystal substrate or the like. The cavities 221 are separated by side walls (partition walls) 222. Each cavity 221 is connected via a supply port 224 to a reservoir 223 that is a common flow path. The diaphragm 230 is made of, for example, a thermal oxide film. The diaphragm 230 is provided with an ink tank port 231 so that an arbitrary fluid 1x can be supplied from the tank 3x. A piezoelectric element 240 is formed at a position corresponding to the cavity 221 on the vibration plate 230. The piezoelectric element 240 has a structure in which a piezoelectric ceramic crystal such as a PZT element is sandwiched between an upper electrode and a lower electrode (not shown). The piezoelectric element 240 is configured to be able to cause a volume change corresponding to the ejection signal Shx supplied from the control circuit 5.
[0019]
The ink jet recording head has a configuration in which the piezoelectric element is changed in volume and ejects the fluid. However, the ink jet recording head has a head configuration in which heat is applied to the fluid by the heating element and droplets are ejected by the expansion. There may be.
[0020]
The tanks 31 to 3n store the fluids 11 to 1n, respectively, and are configured to be able to supply the fluids 11 to 1n to the ink jet recording heads 21 to 2n through pipes. Each of the fluids 11 to 1n includes a pattern forming material and is installed according to the function of the pattern. In this embodiment, in particular, the fluid itself is composed of a material that exhibits electrical characteristics such as conductivity, semiconductivity, insulation, or dielectric properties when solidified. For example, a low melting point metal such as solder, gallium, or Pb is heated to a temperature higher than the melting point, or fluidity is imparted, or a pattern forming material contains a high density of fine particles. Things. In either case, the fluid is configured by adjusting the viscosity with a solvent or the like so as to exhibit fluidity that can be discharged from the ink jet recording head. In this embodiment, in order to make the story easy to understand, it is assumed that the fluid 11 includes an insulating material and the fluid 12 includes a conductive material.
[0021]
The drive mechanism 4 includes a motor 41, a motor 42, and a mechanical structure (not shown). The motor 41 is configured to be able to transport the ink jet recording head 2x in the X-axis direction (lateral direction in FIG. 1) in accordance with the drive signal Sx. The motor M2 is configured to be able to transport the ink jet recording head 2x in the Y-axis direction (the depth direction in FIG. 1) according to the drive signal Sy. It is sufficient that the drive mechanism 4 has a configuration capable of changing the position of the ink jet recording head 2x relative to the substrate 1. Therefore, in addition to the above configuration, the substrate 1 may move with respect to the ink jet recording head 2x, or the substrate 1 may move with the ink jet recording head 2x substrate 1.
[0022]
The control circuit 5 is a computer device, for example, and includes a CPU, a memory, an interface circuit, etc. (not shown). The control circuit 5 is configured to allow the apparatus to execute the method for manufacturing an electric circuit of the present invention by executing a predetermined program. That is, when the fluid droplet 10 is ejected, the ejection signals Sh1 to Shn are supplied to one of the ink jet recording heads 21 to 2n, and when the head is moved, the drive signal Sx or Sy is applied to the motor 41 or 42. It can be supplied.
[0023]
In the case where a certain atmosphere treatment is required for the fluid droplets 10 from the ink jet recording head 2x, a solidifying device 6 may be further provided. The solidifying device 6 is configured to be able to apply physical, physicochemical and chemical treatments to the droplet 10 or the pattern forming surface 100 in response to the control signal Sp supplied from the control circuit 5. For example, it is attached by hot air blowing, laser irradiation, heating / drying treatment by lamp irradiation, chemical change treatment by administration of a chemical substance, fixed surface modification treatment for controlling the degree of adhesion of the droplet 10 to the pattern forming surface 100, etc. The solidified fluid is solidified and adhesion of the droplets 10 is promoted.
[0024]
(Function)
In the configuration of the electric circuit manufacturing apparatus, when the substrate 1 is installed in the apparatus, the control circuit 5 outputs a drive signal Sx or Sy. The motor 41 or 42 changes the relative position between the ink jet recording head 2x and the pattern formation surface 100 of the substrate 1 in response to the drive signal Sx or Sy, and moves the head 2x to the pattern formation region. Next, in order to specify one of the fluids 11 to 1n according to the electrical characteristics of whether the type of pattern to be formed is conductive, semiconductive, insulating or dielectric, and to discharge the fluid The discharge signal Shx is supplied. Each of the fluids 11 to 1n flows into the cavity 221 of the corresponding ink jet recording head 2x. In the ink jet recording head 2x to which the ejection signal Shx is supplied, the volume of the piezoelectric element 240 is changed by the voltage applied between the upper electrode and the lower electrode. This volume change deforms the diaphragm 230 and changes the volume of the cavity 221. As a result, the liquid droplet 10 is ejected from the nozzle hole 211 of the cavity 221 toward the pattern forming surface 100. The fluid reduced by the discharge is newly supplied from the tank 3x to the cavity 221 from which the fluid has been discharged.
[0025]
(Production method)
Next, a method for forming a capacitor according to this embodiment will be described with reference to FIGS. In each figure, (a) shows a manufacturing process sectional view cut along the center line of the circuit element, and (b) shows a plan view.
Insulating Film Forming Step (FIG. 2): First, the ink jet recording head 21 is moved to a region where an insulating film is formed as shown in FIG. 2A, and a fluid containing an insulating material as a pattern forming material from the head 21. 11 is discharged. As an insulating material, SiO2And Al2O3SrTiO is a dielectric3, BaTiO3, Pb (Zr, Ti) O3Etc. are considered. Examples of the solvent include PGMEA, cyclohexane, carbitol acetate and the like. As the wetting agent or binder, glycerin, diethylene glycol, ethylene glycol or the like may be added as necessary. Further, as the fluid 11 containing an insulating material, polysilazane or a metal alkoxide containing an insulating material may be used. In this case, the insulator material can be formed by heating or chemical reaction. The discharged fluid 11 lands on the pattern forming surface 100. The landed fluid 11 has a diameter of about several tens of μm. When the head 21 is moved as shown in FIG. 2B and the fluid 11 is continuously discharged along the pattern formation region, a macroscopic rectangular insulating film pattern can be formed. The width and length of the insulating film 101 and the dielectric constant of the insulating material are determined according to the capacitance of the capacitor to be formed. This is because the capacitance of the capacitor is determined by the area of the counter electrode, the gap, and the dielectric constant. In order to increase the thickness of the film, the laminated body may be manufactured such that the same fluid is further discharged and solidified on the solidified film.
[0026]
When the fluid contains an insulating material, there is no electrical adverse effect even if the solidified film is not a dense film, so it is only necessary to evaporate the solvent component. However, it is desirable to perform heat treatment to strengthen the film. Further, when the insulating film is solidified by a chemical reaction, it may be possible to treat with a chemical that causes the destruction of the dispersion system. For example, when the fluid 11 is mainly composed of an organic pigment dispersed with a styrene-acrylic resin, a magnesium nitrate aqueous solution is discharged as a reaction liquid. Moreover, when the fluid 11 has an epoxy resin as a main component, amines are discharged as a reaction liquid. It is preferable to perform a solidification process every time one pattern is formed. This is because, when a fluid containing other pattern forming material is ejected over the fluid that has not been solidified, the material is mixed and desired electrical characteristics cannot be obtained.
[0027]
A dielectric material may be used as the pattern forming material instead of the insulating material. This is because the capacitance of the capacitor can be increased by filling the dielectric material between the electrodes. A plurality of insulating films may be formed in parallel with a plurality of materials. This is because a function similar to a multilayer structure of a capacitor can be provided. In addition, when the gap between the electrodes is small, it is preferable to select an insulating material in which this insulating film shows no affinity for the fluid 12 containing the conductive material to be discharged later. This is because the insulating film to be formed repels the fluid 12 and the risk of short-circuiting the electrodes is reduced.
[0028]
Conductive Film Forming Step (FIGS. 3 and 4): When the insulating film 101 is solidified, the ink jet recording head 21 is moved to a region where a conductive film is formed as shown in FIGS. 3 (a) and 4 (a). Next, the head 22 is moved as indicated by arrows in FIG. 3B and FIG. 4B to discharge the fluid 12 containing a conductive material as a pattern forming material. As a result, a conductive film 102 to be a capacitor electrode is formed. As the conductive material of the pattern forming material, RuO2, IrO2, OsO2, MoO2, ReO2, WO2, YBa2Cu3O7-x, Pt, Au, Ag, In, In—Ga alloy, Ga, solder, and the like. Examples of the solvent include butyl carbitol acetate, 3-dimethyl-2-imidazolidine, BMA and the like. As the fluid 12 containing a conductive material, a low melting point metal such as In—Ga, In, or solder may be used in a melted state by heating or the like. The pattern of the conductive film can be changed to various shapes other than the shapes shown in FIGS. For example, the capacitance of the capacitor can be further increased if each conductive film or insulating film is formed in a sawtooth shape or an uneven shape so that the opposing electrodes are engaged with each other. In order to increase the capacitance of the capacitor, it is preferable to increase the height of the insulating film 101 and the height of the opposing surface of the conductive film 102 to increase the electrode area.
[0029]
Next, in order to obtain desired electrical characteristics, the conductive film is solidified. When the fluid 12 contains fine particles of a conductive material such as a metal as a pattern forming material, the fluid 12b ejected from the ink jet recording head 22 has a solvent as shown in FIGS. Fine particles are scattered inside. By simply evaporating the solvent from the fluid, the pattern forming material is not continuous and electrical conductivity cannot be ensured. For this reason, as shown in FIG. 6, it heats more than melting | fusing point of an electroconductive material with the solidification apparatus 6 grade | etc.,. In addition to the evaporation of the solvent by this treatment, the pattern forming material dissolves and the fine particles are connected and integrated. Even when the fluid 12 is obtained by dissolving the pattern forming material, the conductive material is deposited by evaporating the solvent by heat treatment. When the pattern forming material is a material such as a metal heated to the melting point or higher, the conductive material may be solidified by maintaining the pattern forming surface at a temperature lower than the melting point.
[0030]
Further, the conductive film may be formed by the steps shown in FIGS. In this method, first, as shown in FIGS. 7A and 7B, the fluid 13 containing the adhesive material is discharged from the ink jet recording head 23 to the pattern formation region of the conductive film. As such an adhesive material, a thermosetting resin adhesive, a rubber-based adhesive, an emulsion-based adhesive or the like is used when not heated at a high temperature. In the case of heating at a high temperature, polyaromatics, ceramic adhesive and the like can be mentioned. Next, as shown in FIGS. 8A and 8B, conductive fine particles 131, for example, metal powder, are dispersed over the entire pattern formation surface 100. Next, as shown in FIGS. 9A and 9B, when the conductive fine particles 131 are blown off from the pattern formation surface 100, the conductive fine particles 131 are adhered only to the pattern formation region where the adhesive material is applied. Remain. Thereafter, as described with reference to FIG. 6, when heated to a temperature equal to or higher than the melting point of the conductive fine particles, the fine particles 131 are melted and connected to each other on the surface of the adhesive material to form a conductive continuous pattern. Furthermore, heat treatment may be performed by applying ultrasonic waves simultaneously while spraying fine particles. By heating with ultrasonic waves, a pattern having good electrical characteristics can be formed. Further, if the fine particles are compressed after the fine particles are bonded, the fine particles are connected to each other to improve electrical characteristics. You may use together the compression of microparticles | fine-particles and said other method. In addition to the conductive material, a dielectric material may be applied to the fine particles. If applied to a capacitor, the capacitance of the capacitor can be increased. If the magnetic material is applied to the coil as the fine particles, the inductance of the coil can be increased.
[0031]
In the case where the conductive film has low adhesion to the pattern formation surface 100, an affinity film may be formed as a base layer using a fluid containing a material having high affinity for the fluid. For example, as shown in FIG. 10, a fluid 14 having a high affinity for the fluid 12 is ejected from the ink jet recording head 24 to the pattern formation region of the film. For example, if the fluid 12 is an organic material, the affinity film 104 is formed by discharging a porous material such as resin, paraffin, aluminum oxide, or silica. Since the affinity film 104 has good adhesion to the fluid 12, as shown in FIG. 11, if the fluid 12 is discharged onto the affinity film 104, the fluid 12 adheres and spreads on the affinity film 104. A conductive film 102 with good characteristics is formed. On the other hand, if the conductive film has too good adhesion to the pattern forming surface 100 and is too wide, even if the non-affinity film is formed using a fluid containing a material having non-affinity to the fluid. Good. For example, as shown in FIG. 12, a fluid 15 having a low affinity for the fluid 12 is ejected from the ink jet recording head 25 to both sides of the pattern formation region of the conductive film. For example, if the fluid 12 is a hydrophilic material, a non-affinity film 105 is formed by discharging a porous material such as resin, paraffin, aluminum oxide, or silica. Since the non-affinity film 105 repels the fluid 12, the fluid 12 is repelled by the non-affinity films 105 on both sides if the fluid 12 is discharged along the pattern formation region as shown in FIG. The fluid does not spread beyond the gap between the membranes 105. Therefore, a well-formed conductive film 102 is formed. Other effective materials for the underlying layer include low dielectric materials, SiO2, Al2O3TiO2And the like having adhesion and insulating properties. Note that the step of providing the affinity film or the non-affinity film may be applied to an insulating film or other films.
[0032]
Through the above steps, the capacitor 121 can be formed on the pattern forming surface 100 as an electric circuit. If the capacitance of the capacitor 121 is insufficient as a result of actual measurement, the conductive film 102 is lengthened to increase the area of the counter electrode, or a dielectric material is discharged onto the insulating film 101 or an extended portion of the conductive film 102. For example, the capacity can be finely adjusted. If the capacitor to be formed first is set slightly smaller than the desired capacity, the capacity can be increased later and set to an optimum capacity.
[0033]
As described above, according to the first embodiment, since the insulating film and the conductive film of the capacitor are formed by the ink jet method, an inexpensive and small apparatus conforming to the ink jet printer used in a home printer, and the like can be used. Capacitors can be manufactured. In particular, the capacitance can be easily increased even when the capacitance of the capacitor needs to be finely adjusted.
[0034]
(Embodiment 2)
The second embodiment of the present invention manufactures an electric circuit including a capacitor having a form different from that of the first embodiment. In the second embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used.
[0035]
(Production method)
Next, a method for forming a capacitor according to the present embodiment will be described with reference to FIGS. In each figure, (a) shows a manufacturing process sectional view cut along the center line of the circuit element, and (b) shows a plan view.
[0036]
Conductive film forming step (FIG. 14): First, the ink jet recording head 22 is moved to a region where a conductive film is to be formed as shown in FIG. 14A, and a fluid containing a conductive material as a pattern forming material from the head 22. 12 is discharged. The fluid 12 is the same as in the first embodiment. In order to increase the capacitance of the capacitor, the conductive film 102 is formed in as large a region as possible. If the fluid 12 is ejected by moving the head 22 as indicated by the arrow in FIG. 14B, the conductive film 102 serving as the lower electrode of the capacitor can be formed. What is necessary is just to process similarly to the said Embodiment 1 regarding solidification.
[0037]
Insulating Film Forming Step (FIG. 15): Next, the ink jet recording head 21 is moved so as to cover the lower electrode as shown in FIG. 15A, and the fluid 11 containing an insulating material is used as a pattern forming material from the head 21. Discharge. The fluid 11 is the same as that in the second embodiment. The head 21 is moved as shown in FIG. 15B, and the fluid 11 is discharged to the pattern formation region that covers the conductive film 102 as the lower electrode. The thinner the insulating film 101, the higher the capacitance of the capacitor, but there is also a risk of a short circuit between the electrodes. Therefore, the insulating film 101 is formed to a thickness that can provide sufficient insulation. Further, if the insulating film 101 is formed of a dielectric material, the capacitance of the capacitor can be increased. The solidification of the fluid 11 is the same as in the first embodiment.
[0038]
Conductive Film Formation Step (FIG. 16): When the insulating film 101 is solidified, the ink jet recording head 21 is moved on the insulating film as shown in FIG. 16A, and the fluid 12 containing a conductive material is transferred from the head 22. Then, the conductive film 102 is further stacked. As shown by the arrow in FIG. 16B, the head 22 is moved to discharge and solidify the fluid 12, thereby forming the conductive film 102 to be the upper electrode of the capacitor. The fluid 12 and its solidification treatment are the same as in the first embodiment.
[0039]
Through the above steps, the capacitor 122 can be formed on the pattern forming surface 100 as an electric circuit. In addition, it is preferable to form the area of the upper electrode smaller than the area of the lower electrode. This is because the capacity can be easily increased if the area of the upper electrode is increased by the ink jet method when the capacity is to be changed later.
[0040]
As described above, according to the second embodiment, in addition to the same effects as those of the first embodiment, a large-capacity capacitor can be manufactured since the area of the electrode can be set large. In particular, if the upper electrode is formed smaller, the capacitance of the capacitor can be finely adjusted by simply increasing the area of the upper electrode.
[0041]
(Embodiment 3)
Embodiment 3 of the present invention manufactures an electric circuit including a coil. In the third embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used.
[0042]
(Production method)
A method for forming a coil according to the present embodiment will be described with reference to FIGS. In each figure, (a) shows a manufacturing process sectional view cut along the center line of the circuit element, and (b) shows a plan view.
Conductive film forming step (FIG. 17): First, the fluid 12 containing a conductive material is ejected while moving the ink jet recording head 22 as shown in FIGS. 17A and 17B, which corresponds to the lead wire of the coil. A conductive film 102 is formed. The fluid 12 and its solidification treatment are the same as in the first embodiment. If a magnetic material is applied on the pattern forming surface 100 in advance or a magnetic material is applied between the spiral conductive films 102, the inductance of the coil can be increased.
[0043]
Insulating Film Forming Step (FIG. 18): Next, the ink jet recording head 21 is moved as shown in FIG. 18A to discharge the fluid 11 containing an insulating material, and the conductive film 102 as shown in FIG. 18B. The insulating film 101 is formed leaving the tip of the film. As shown in this figure, an insulating film may be provided only at the intersection of the conductive film formed in FIG. 17 and the conductive film formed in FIG. 19 without providing a large insulating film. The fluid 11 and its solidification treatment are the same as in the first embodiment.
[0044]
Swirl conductive film forming step (FIG. 19): Next, while the fluid 12 containing a conductive material is ejected from the ink jet recording head 21, the spiral conductive film 102 is moved as shown in FIG. 19A. Form. As shown in FIG. 19B, the center of the spiral conductive film 102 is in contact with the conductive film 102 formed in FIG. None of the spiral portions contact the previously formed conductive film. The number of vortex turns and the width of the conductive film 102 are determined according to the inductance value of the coil to be manufactured. The fluid 12 and its solidification treatment are the same as in the first embodiment.
[0045]
The coil 123 can be formed on the pattern forming surface 100 as an electric circuit by the above process. In order to increase the inductance of the coil 123 later, the spiral conductive film 102 may be further extended from the spiral end. In addition, when inductance is caused to occur, a lead wire may be added from the middle of the spiral conductive film 102 already formed.
[0046]
As described above, according to the third embodiment, the coil can be easily manufactured as an electric circuit by the ink jet method. Further, it is possible to easily make fine adjustments such as increasing or decreasing the inductance later.
[0047]
  (Embodiment 4) Embodiment 4 of the present invention manufactures an electric circuit including a resistor. In the fourth embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used. However, fluid containing semi-conductive resistive material as pattern forming material16Are further provided with a tank 33 and an ink jet recording head 23. As the resistance material, a mixture of conductive powder and insulating powder, Ni—Cr, Cr—SiO, Cr—MgF, Au—SiO2, AuMgF, PtTa2OFive, AuTa2OFiveTa2, CrThreeSi, TaSi2 etcExamples of the solvent include PGMEA, cyclohexane, carbitol acetate, and the like. As the wetting agent or binder, glycerin, diethylene glycol, ethylene glycol or the like may be added as necessary. Also fluid containing insulating material16Alternatively, a metal alkoxide containing polysilazane or an insulator material may be used. In this case, the insulator material can be formed by heating or chemical reaction. The resistance material is determined according to the resistance value of the resistor to be formed.
[0048]
  (Manufacturing Method) A method of forming the resistor according to this embodiment will be described with reference to FIGS. In each figure, (a) shows a manufacturing process sectional view cut along the center line of the circuit element, and (b) shows a plan view.
Resistance Film Forming Step (FIG. 20): First, the ink jet recording head 23 is moved as shown in FIGS. And the fluid containing the resistance material from the head 2316Resistive film that discharges and gives electrical resistance106Form. The solidification process is the same as in the first embodiment. Resistive film106The width, height and length are determined according to the resistance value of the resistor to be formed. This is because the resistance value of the resistor is proportional to the length and inversely proportional to the cross-sectional area. This resistive film106It is preferable to set the height and width so that the resistance value is larger than the target resistance value. After resistance film106This is because the resistance value can be lowered to an appropriate value by increasing the height and width of the film.
[0049]
  Conductive film forming step (FIGS. 21 and 22): Semiconductive film106When the ink is solidified, the ink jet recording head 22 is moved as shown in FIG. 21 and FIG.106A conductive film 102 is formed on both ends of the substrate. The fluid 12 and its solidification treatment are the same as in the first embodiment.
[0050]
  The resistor 124 can be formed on the pattern forming surface 100 as an electric circuit by the above process. If the resistance value of the resistor 124 is to be finely adjusted later, the semiconductive film106More fluid12Discharging semi-conductive film106If the thickness of the film is increased or the width is increased, the resistance value can be lowered to an appropriate value.
[0051]
As described above, according to the fourth embodiment, the resistor can be easily manufactured as an electric circuit by the ink jet method. Further, the resistance value can be easily finely adjusted later.
[0052]
(Embodiment 5)
In the fifth embodiment of the present invention, a conventional discrete component is used as a circuit element, and the present invention is applied to the wiring therebetween. In the fifth embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used. However, an apparatus for arranging components on the pattern forming surface of the substrate 1 or a manual process is required.
Based on FIG. 23 and FIG. 24, the electric circuit manufacturing method of this embodiment is demonstrated. Each figure is a plan view of a pattern forming surface.
Component placement step (FIG. 23): Individual components are placed at appropriate positions on the pattern forming surface 100 of the substrate 1 by an insert machine or manually. The arrangement is determined according to the electric circuit to be manufactured. In FIG. 23, a resistor 110, a capacitor 111, and a transistor 112 are arranged as chip components. Each part is desirably bonded with a bond or the like. In addition, it is preferable to perform this adhesion by an ink jet method. For example, as shown in FIGS. 25A and 25B, a fluid 17 containing an adhesive material is discharged from an ink jet recording head 27 in an area where components are to be bonded, and an adhesive film 107 is formed. Since the adhesive film 107 only needs to be able to temporarily fix the component, it may be formed in a region smaller than the area covered by the component. Then, as shown in FIG. 26, a component (resistor 110) may be attached on the adhesive film 107 by the insert machine 7 or the like. As the adhesive material, an epoxy resin or a resin that is cured by energy is used. For example, if a thermosetting resin or a thermoplastic resin is used, the parts can be bonded by setting the temperature of the applied heat.
[0053]
Wiring process (FIG. 24): After the components are bonded, a wiring pattern that connects the components is formed using the fluid 12 containing a conductive material as a pattern forming material. The conductive material and its solidification treatment are the same as in the first embodiment. When wiring patterns are crossed, an insulating film 101 is provided at the crossing portion of the wiring after forming the conductive film 102 to be below, and a conductive film 102 is further formed thereon. Note that the wiring pattern formed of the conductive film 102 and the terminals of each component may be soldered. Soldering may be performed by an inkjet method. If the solder is heated to the melting temperature or higher and discharged from the ink jet recording head, soldering can be easily performed.
[0054]
In the embodiment described above, the circuit elements are wired with the individual components by the ink jet method. However, part or all of the circuit elements may be manufactured by the ink jet method as in the above embodiments. That is, individual components are used for large-capacity capacitors, high-inductance coils, and active elements with complicated configurations, and the inkjet method is applied to circuit elements that can be easily formed on the pattern forming surface.
[0055]
As described above, according to the fifth embodiment, wiring can be easily performed by the ink jet method even when individual components are used. In particular, an electric circuit can be manufactured even if there are circuit elements that are difficult to form by an ink jet method. In addition, if a fixed substrate on which individual components are arranged in a predetermined arrangement is manufactured in advance, an arbitrary electric circuit can be assembled using an ink jet method.
[0056]
(Embodiment 6)
The sixth embodiment of the present invention relates to a method of manufacturing an electric circuit that identifies each other when a large number of wiring patterns are formed on the pattern forming surface as in the fifth embodiment. In the fifth embodiment, the same electric circuit manufacturing apparatus as in the first embodiment is used. However, a plurality of tanks 22 and ink jet recording heads 22 for discharging the fluid 12 containing a conductive material are provided corresponding to the types of wiring patterns. Each fluid 12 is configured by mixing dyes or pigments of different colors. As the dye, fluorescent whitening dyes such as stilbene, oxazole, imidazolone, and coumarin can be used. Azo dyes, anthraquinone dyes, indico dyes, and sulfur dyes can be used as general dyes. Specifically, 2,4-dinitrophenol is used for black, m-toluylenediamine is used for yellow, and phenodine is used for red. As the pigment, insoluble azo, azo lake, phthalocyanine, and the like can be used. Since the pigment is composed of colored particles, a single molecule does not hinder electrical conduction unlike a dye. For this reason, it is more preferable to use a pigment. Each wiring pattern is color-coded by, for example, power supply wiring, ground wiring, and other wiring, or color-coded by analog circuit wiring and digital circuit wiring. For example, in FIG. 27, the power supply wiring 108, the ground wiring 109, and the other wiring 102 are color-coded. When the wiring patterns intersect, an insulating film 101 may be formed at the wiring intersection as shown in FIG.
[0057]
The wiring pattern itself may be color-coded with a colored film covering the wiring pattern without color-coding. For example, in FIG. 28, the conductive film 102 that is a wiring pattern is covered with a colored film 130. The colored film 130 may be formed by discharging a resin or the like containing a pigment or a dye by an inkjet method. If the colored film 130 is formed of a resin or the like, it has insulation, so that insulation can be ensured even when the wiring patterns intersect. Further, since the conductive film 102 contains no pigment or dye, there is no possibility of hindering electrical conduction. Further, the conductive material itself may have a unique color, and the color may be classified by using the conductive material according to the wiring pattern without using the dye. For example, red for copper, white for silver or platinum, and yellow for gold. Therefore, instead of changing the pigment or dye, a certain degree of color separation is possible by forming a conductive film by discharging a fluid containing different conductive materials.
[0058]
Further, the wiring pattern is not necessarily manufactured by the inkjet method, and may be manufactured by another method, for example, a photolithography method. This is because the same effect can be obtained as long as the wiring pattern is color-coded.
[0059]
As described above, according to the sixth embodiment, the wiring patterns are manufactured by color-coding each other. Therefore, according to the electric circuit, it is easy to distinguish the wiring route and parts at the time of failure or circuit improvement, and the work is facilitated. Connected. In addition, maintenance and inspection can be facilitated even when color coding is adopted in the production line.
[0060]
(Other variations)
The present invention can be applied with various modifications regardless of the above embodiment. For example, in the above embodiment, a method for manufacturing a capacitor, a coil, and a resistor has been described. However, the present invention may be applied to manufacturing an active element such as a diode or a transistor. As the fluid, a semiconductor material such as silicon or germanium doped with various elements may be used. Doping may be performed later. It is also possible to manufacture semiconductors manufactured by epitaxial growth by an inkjet method by stacking a large number of electron majority carrier semiconductor films and hole majority carrier reaction films in various shapes while adjusting the carrier density. . Any known semiconductor element can be manufactured by forming a laminated structure similar to various semiconductors manufactured by a normal semiconductor process.
[0061]
In addition, various surface modification treatments may be performed before discharging the fluid by the ink jet method. For example, the treatment for modifying the surface so that the pattern forming surface has affinity includes a method of applying a silane coupling agent, a method of applying reverse sputtering with argon or the like, depending on the presence or absence of polar molecules in the fluid, Various known methods such as discharge treatment, plasma treatment, ultraviolet irradiation treatment, ozone treatment, and degreasing treatment are applied. When the fluid does not contain polar molecules, a method of applying a silane coupling agent, a method of forming a porous film such as aluminum oxide or silica, a method of applying reverse sputtering with argon, a corona discharge treatment, a plasma treatment Various known methods such as ultraviolet irradiation treatment, ozone treatment, and degreasing treatment can be applied. Affinities may be adjusted by etching the pattern formation surface or a film formed by an inkjet method to provide unevenness.
[0062]
Furthermore, the pattern formed by the ink jet method is not limited to an electric circuit, and may be formed on a pattern forming surface for mechanical or design purposes. This is because the advantage of the ink jet system that a fine pattern can be easily formed with inexpensive equipment can be enjoyed as it is.
[0063]
【The invention's effect】
According to the present invention, since an arbitrary pattern can be formed on the pattern forming surface by adhering a fluid, it is possible to provide an electric circuit, a manufacturing method and a manufacturing apparatus suitable for small-scale multi-production and trial production. That is, it is possible to provide an electric circuit of a certain quality at a low cost without using a large factory facility. Further, according to the ink jet method, it is easy to add a pattern, so that it is possible to easily change circuit constants and add wiring in the circuit element.
[0064]
According to the present invention, since the color is changed according to the pattern and the pattern is easily identified, it is possible to provide an electric circuit suitable for trial manufacture and a manufacturing method thereof. Therefore, even in trial production, circuit analysis can be performed in a short time, and circuit evaluation efficiency can be improved.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an electric circuit manufacturing apparatus according to a first embodiment of the present invention.
FIG. 2 is an insulating film forming step of the capacitor forming method according to the first embodiment.
3 is a conductive film forming step of the capacitor forming method in Embodiment 1. FIG.
4 is a conductive film forming step of the capacitor forming method in Embodiment 1. FIG.
FIG. 5 is a discharge process when a fluid containing fine particles is used.
FIG. 6 shows a heating process when a fluid containing fine particles is used.
FIG. 7 is an adhesive film forming step when an adhesive is used.
FIG. 8 is a fine particle spraying process when an adhesive is used.
FIG. 9 is a microparticle removal process when an adhesive is used.
FIG. 10 is an affinity film forming step.
FIG. 11 is a step of forming a conductive film when an affinity film is used.
FIG. 12 is a non-affinity film forming step.
FIG. 13 is a step of forming a conductive film when using a non-affinity film.
FIG. 14 is a conductive film forming step of the capacitor forming method according to the second embodiment.
15 is an insulating film forming step of the capacitor forming method in Embodiment 2. FIG.
FIG. 16 is a conductive film forming step of the capacitor forming method according to the second embodiment.
FIG. 17 is a conductive film forming step of the coil forming method according to the third embodiment.
18 is an insulating film forming step of the coil forming method in Embodiment 3. FIG.
FIG. 19 is a conductive film forming step of the coil forming method according to the third embodiment.
20 is a resistance film forming step of the resistor forming method in Embodiment 4. FIG.
FIG. 21 is a conductive film forming step of the resistor forming method according to the fourth embodiment.
FIG. 22 is a conductive film forming step of the resistor forming method according to the fourth embodiment.
FIG. 23 is an individual component placement step in the fifth embodiment.
FIG. 24 is a conductive film formation step in the fifth embodiment.
25 is a process for forming an adhesive film in Embodiment 5. FIG.
FIG. 26 is an adhesion process of individual parts in the historical form 5;
FIG. 27 is a color coding example of a wiring pattern in the sixth embodiment.
FIG. 28 is a modification of the wiring pattern coloring method according to the sixth embodiment.
FIG. 29 is an exploded perspective view of an ink jet recording head.
FIG. 30 is a partial cross-sectional view of a perspective view of a main part of an ink jet recording head.
[Explanation of symbols]
1 ... Board
2, 2x, 21-2n ... Inkjet recording head
3, 3x, 31-3n ... Processing device
4 ... Drive mechanism
5 ... Control circuit
6 ... Solidification device
1x, 11-1n ... fluid (pattern forming material)
100 ... pattern formation surface
101: Insulating film
102 ... conductive film
103 ... Adhesive film
131 ... fine particles
104 ... Affinity film (undercoat film)
105 ... non-affinity membrane
106: resistive film
107: Adhesive film

Claims (14)

  1. An electrical circuit formed on the pattern forming surface,
    The fluid to a fluid containing a pattern forming material is discharged by the discharge can be configured ink jet recording head in the pattern forming surface, the pattern adheres to the forming surface and solidified to formed pattern, With
    The pattern forming material stirred in a solvent as fine particles is discharged as the fluid,
    An electric circuit, wherein the fine particles are dissolved by applying a temperature equal to or higher than the melting point of the pattern forming material in the vicinity of the pattern forming surface, and the dissolved material is solidified by applying a temperature lower than the melting point .
  2.   The electric circuit according to claim 1, further comprising an affinity layer for improving adhesion between the pattern formation surface and the pattern.
  3. Electrical circuit according to claim 1, before Symbol pattern including the conductive material as a material for forming fluid comprises a wiring pattern solidified.
  4.   An insulating film in which a fluid containing an insulating material or a dielectric material is solidified as the pattern forming material and a fluid containing a conductive material as the pattern forming material are solidified opposite to each other across the insulating film. The electric circuit according to claim 1, wherein a capacitor is constituted by the electrode film.
  5.   The electric circuit according to claim 1, further comprising a coil in which a fluid containing a conductive material as the pattern forming material is attached to the pattern forming surface in a vortex and solidified.
  6.   The resistor containing the solidified fluid containing the conductive material as the pattern forming material is provided at both ends of the semiconductive film solidified with the fluid containing the semiconductive material as the pattern forming material. Electrical circuit as described in.
  7. With the pattern of multiple, electrical circuit according to claim 1 in which different colors to identify each other's patterns are given.
  8. In the method of manufacturing an electric circuit for forming an electric circuit on the pattern forming surface,
    A step of discharging the fluid onto the pattern forming surface by an ink jet recording head configured to discharge a fluid containing a pattern forming material onto the pattern forming surface, and a flow discharged onto the pattern forming surface. A step of solidifying the body ,
    In the step of discharging the fluid, the pattern forming material stirred in a solvent as fine particles is discharged as the fluid,
    The step of solidifying the fluid includes a step of dissolving the fine particles by applying a temperature higher than the melting point of the pattern forming material in the vicinity of the pattern forming surface, and a step of solidifying the dissolved material by applying a temperature lower than the melting point. A method of manufacturing an electric circuit comprising the steps of:
  9. In the step of discharging the fluid, a material heated to a melting point or higher of the pattern forming material is discharged as the fluid, and in the step of solidifying the fluid, the temperature in the vicinity of the pattern forming surface is set to the pattern. The method of manufacturing an electric circuit according to claim 8 , wherein the fluid is solidified by maintaining the temperature lower than the melting point of the forming material.
  10. Before discharging the pre Symbol fluid, method of manufacturing electrical circuit according to claim 8 comprising the step of forming an affinity layer for enhancing the adhesion between the pattern and the pattern formation surface.
  11. Before SL as the pattern forming material by ejecting an insulating material or fluid containing the dielectric material to form an insulating film, comprising a conductive material as the pattern forming material so as to face each other across the insulating film method of manufacturing an electrical circuit according to any one of claims 8 to 10 to form a capacitor by forming an electrode film by discharging the fluid's.
  12. Method of manufacturing an electrical circuit according to any one of claims 8 to 10 to form a coil by discharging said pattern including a conductive material as a material for forming fluid to swirl.
  13. By forming a pattern by mixing the different colored pigments or dyes fluid for forming the pattern according to the pattern, in any one of claims 8 to 10 to allow identifying a plurality of patterns The manufacturing method of the electric circuit of description.
  14. By forming a layer containing a pigment or dye of a color corresponding to the pattern covering the pattern formed by the fluid, according to any one of claims 8 to 10 to allow identifying a plurality of patterns Method of manufacturing an electric circuit .
JP07814998A 1998-03-25 1998-03-25 Electric circuit, manufacturing method thereof and electric circuit manufacturing apparatus Expired - Fee Related JP4741045B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP07814998A JP4741045B2 (en) 1998-03-25 1998-03-25 Electric circuit, manufacturing method thereof and electric circuit manufacturing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07814998A JP4741045B2 (en) 1998-03-25 1998-03-25 Electric circuit, manufacturing method thereof and electric circuit manufacturing apparatus

Publications (2)

Publication Number Publication Date
JPH11274671A JPH11274671A (en) 1999-10-08
JP4741045B2 true JP4741045B2 (en) 2011-08-03

Family

ID=13653860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP07814998A Expired - Fee Related JP4741045B2 (en) 1998-03-25 1998-03-25 Electric circuit, manufacturing method thereof and electric circuit manufacturing apparatus

Country Status (1)

Country Link
JP (1) JP4741045B2 (en)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6754551B1 (en) * 2000-06-29 2004-06-22 Printar Ltd. Jet print apparatus and method for printed circuit board manufacturing
JP2002290009A (en) * 2001-03-27 2002-10-04 Toppan Forms Co Ltd Conductive circuit forming device
JP2002290008A (en) * 2001-03-27 2002-10-04 Toppan Forms Co Ltd Method of forming conductive circuit
JP2003080694A (en) 2001-06-26 2003-03-19 Seiko Epson Corp Method for forming membrane pattern, apparatus for forming membrane pattern, electrically conductive membrane wiring, electrooptic apparatus, electronic instrument and non-contact type card medium
JP4039035B2 (en) 2001-10-31 2008-01-30 セイコーエプソン株式会社 A method for forming a line pattern, line pattern, an electro-optical device, electronic apparatus, non-contact card medium
JP4126996B2 (en) 2002-03-13 2008-07-30 セイコーエプソン株式会社 Production method and device manufacturing apparatus of the device
JP3925283B2 (en) 2002-04-16 2007-06-06 セイコーエプソン株式会社 A manufacturing method of an electronic device, a manufacturing method of an electronic device
JP3578162B2 (en) 2002-04-16 2004-10-20 セイコーエプソン株式会社 A method for forming a pattern, the pattern forming apparatus, a conductive film wiring, a method of manufacturing a device, an electro-optical device, and electronic equipment
JP4168795B2 (en) 2002-04-19 2008-10-22 セイコーエプソン株式会社 Film forming method, film forming apparatus, a device, a device manufacturing method, and electronic equipment
JP3603896B2 (en) 2002-04-19 2004-12-22 セイコーエプソン株式会社 Method of manufacturing a device, the device manufacturing apparatus, devices and electronic equipment
JP2004012902A (en) 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd Plotting device and plotting method using the plotting device
JP2004055965A (en) 2002-07-23 2004-02-19 Seiko Epson Corp Wiring board, semiconductor device, manufacturing method of them, circuit board, and electronic apparatus
JP4852224B2 (en) 2002-07-30 2012-01-11 セイコーエプソン株式会社 Organic EL device manufacturing equipment
US6890050B2 (en) * 2002-08-20 2005-05-10 Palo Alto Research Center Incorporated Method for the printing of homogeneous electronic material with a multi-ejector print head
JP4098039B2 (en) 2002-08-30 2008-06-11 シャープ株式会社 Patterning the substrate and the pattern forming method
JP4170049B2 (en) 2002-08-30 2008-10-22 シャープ株式会社 Patterning the substrate and the pattern forming method
JP4323257B2 (en) * 2002-09-24 2009-09-02 コニカミノルタホールディングス株式会社 A method of manufacturing a circuit board, the circuit board and the circuit board manufacturing apparatus
JP4228677B2 (en) 2002-12-06 2009-02-25 パナソニック株式会社 Circuit board
JP4549866B2 (en) 2003-02-05 2010-09-22 株式会社半導体エネルギー研究所 Method for manufacturing a display device
WO2004070821A1 (en) 2003-02-06 2004-08-19 Semiconductor Energy Laboratory Co., Ltd. Display manufacturing method
CN101848594B (en) 2003-02-06 2013-03-13 株式会社半导体能源研究所 Plasma apparatus
JP4357189B2 (en) 2003-03-07 2009-11-04 株式会社リコー Apparatus and method for manufacturing a semiconductor device
JP3966293B2 (en) 2003-03-11 2007-08-29 セイコーエプソン株式会社 Method for producing a pattern forming method and device
JP4505191B2 (en) * 2003-03-31 2010-07-21 日立ビアメカニクス株式会社 Apparatus for manufacturing an electronic circuit board
JP2004321880A (en) 2003-04-22 2004-11-18 Seiko Epson Corp Cleaning method, preservation method, pattern formation method, device production method, electro-optical device, and electronic equipment
JP2004363560A (en) 2003-05-09 2004-12-24 Seiko Epson Corp Substrate, device, process for fabricating device, process for producing active matrix substrate,electrooptic device and electronic apparatus
JP3823981B2 (en) * 2003-05-12 2006-09-20 セイコーエプソン株式会社 Pattern and the wiring pattern forming method, a device and a manufacturing method thereof, an electro-optical device, electronic apparatus, and method for manufacturing an active matrix substrate
JP4572868B2 (en) * 2003-05-12 2010-11-04 セイコーエプソン株式会社 A wiring pattern forming method, a method of manufacturing the non-contact card medium, manufacturing method and a manufacturing method of an active matrix substrate of the electro-optical device
JP2005012179A (en) 2003-05-16 2005-01-13 Seiko Epson Corp Method of forming thin film pattern, device, its manufacturing method, electrooptic device, electronic equipment, and method of manufacturing active matrix substrate
US7192859B2 (en) * 2003-05-16 2007-03-20 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device and display device
JP4103830B2 (en) 2003-05-16 2008-06-18 セイコーエプソン株式会社 Forming method and pattern forming apparatus of a pattern, a device manufacturing method, a manufacturing method of an active matrix substrate
JP3861854B2 (en) 2003-05-28 2006-12-27 セイコーエプソン株式会社 A method of manufacturing an electro-circuit
JP3788467B2 (en) 2003-05-28 2006-06-21 セイコーエプソン株式会社 Pattern forming method, a device manufacturing method and device, an electro-optical device, a manufacturing method of an electronic device and an active matrix substrate
JP2005012173A (en) 2003-05-28 2005-01-13 Seiko Epson Corp Film pattern forming method, device and its manufacturing method, electro-optical device, and electronic apparatus
JP2005013986A (en) 2003-05-30 2005-01-20 Seiko Epson Corp Device and its production method, production method of active matrix substrate and electro-optic apparatus as well as electronic equipment
US7438944B2 (en) 2003-07-11 2008-10-21 Seiko Epson Corporation Droplet information measuring method and apparatus therefor, film pattern forming method, device manufacturing method, droplet discharge apparatus, electro-optical apparatus, and electronic apparatus
US7601386B2 (en) 2003-07-11 2009-10-13 Seiko Epson Corporation Process for forming a film, process for manufacturing a device, electro-optical device and electronic equipment
JP2005072475A (en) * 2003-08-27 2005-03-17 Seiko Epson Corp Method for manufacturing capacitor, capacitor, and semiconductor device
JP3835449B2 (en) 2003-10-29 2006-10-18 セイコーエプソン株式会社 Droplet application method and the droplet applying apparatus, and a device and electronic equipment
JP2005167060A (en) 2003-12-04 2005-06-23 Seiko Epson Corp Capacitor, its manufacturing method, and semiconductor device
JP2005353682A (en) * 2004-06-08 2005-12-22 Seiko Epson Corp Method of manufacturing circuit element, method of manufacturing electronic device, and circuit board, electronic apparatus, and electro-optical device
JP4800594B2 (en) * 2004-06-09 2011-10-26 三菱電機株式会社 High frequency device
JP4052295B2 (en) 2004-08-25 2008-02-27 セイコーエプソン株式会社 Method of manufacturing a multilayer wiring board, an electronic device and electronic apparatus
DE102004044144B4 (en) 2004-09-13 2018-10-18 Robert Bosch Gmbh Method for producing a printed circuit
JP4096933B2 (en) 2004-09-30 2008-06-04 セイコーエプソン株式会社 Pattern forming method of
JP3922280B2 (en) * 2004-09-30 2007-05-30 セイコーエプソン株式会社 Method for manufacturing a forming method and a device interconnection pattern
JP2006114585A (en) 2004-10-13 2006-04-27 Seiko Epson Corp Barrier rib structure, formation method thereof, device, electro-optical device, and electronic equipment
JP3874003B2 (en) 2004-10-27 2007-01-31 セイコーエプソン株式会社 A wiring pattern forming method, and pattern forming method
TWI472037B (en) * 2005-01-28 2015-02-01 Semiconductor Energy Lab Semiconductor device, electronic device, and method of manufacturing semiconductor device
JP4179288B2 (en) 2005-02-01 2008-11-12 セイコーエプソン株式会社 Film pattern forming method
JP4337746B2 (en) * 2005-03-09 2009-09-30 セイコーエプソン株式会社 Photomasks and manufacturing method thereof, manufacturing method of an electronic device
JP4207917B2 (en) 2005-04-01 2009-01-14 セイコーエプソン株式会社 Method of manufacturing a multi-layer structure substrate
EP1720389B1 (en) 2005-04-25 2019-07-03 Brother Kogyo Kabushiki Kaisha Method for forming pattern and a wired board
JP4507978B2 (en) 2005-05-16 2010-07-21 セイコーエプソン株式会社 Method of forming a film pattern
JP2006332094A (en) 2005-05-23 2006-12-07 Seiko Epson Corp Process for producing electronic substrate, process for manufacturing semiconductor device and process for manufacturing electronic apparatus
JP4200983B2 (en) 2005-05-24 2008-12-24 セイコーエプソン株式会社 The method forming a film pattern, the active matrix substrate, an electro-optical device, and electronic apparatus
JP2006326541A (en) 2005-05-30 2006-12-07 Seiko Epson Corp Droplet injection method, head unit, droplet injection apparatus, electro-optical device, and electronic equipment
US8147903B2 (en) 2005-06-22 2012-04-03 Canon Kabushiki Kaisha Circuit pattern forming method, circuit pattern forming device and printed circuit board
JP4241675B2 (en) 2005-06-22 2009-03-18 キヤノン株式会社 The circuit pattern forming device and the circuit pattern forming method
US7972650B1 (en) * 2005-07-13 2011-07-05 Nscrypt, Inc. Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections
JP4677937B2 (en) 2005-07-20 2011-04-27 セイコーエプソン株式会社 The method forming a film pattern, a device, an electro-optical device, electronic apparatus, and method for manufacturing an active matrix substrate
JP2007053333A (en) 2005-07-20 2007-03-01 Seiko Epson Corp Method of forming film pattern, device, electro-optical device, electronic equipment, and method of manufacturing active matrix substrate
JP2007035911A (en) 2005-07-27 2007-02-08 Seiko Epson Corp Bonding pad, manufacturing method thereof, electronic device, and manufacturing method thereof
US7527361B2 (en) 2005-07-27 2009-05-05 Brother Kogyo Kabushiki Kaisha Liquid transporting apparatus, actuator unit, and method of producing liquid transporting apparatus
KR100649445B1 (en) * 2005-10-17 2006-11-17 삼성전기주식회사 Wiring forming method and device
JP4670596B2 (en) 2005-11-04 2011-04-13 セイコーエプソン株式会社 Film pattern forming method, a device, an electro-optical device, and electronic apparatus
JP4572814B2 (en) 2005-11-16 2010-11-04 セイコーエプソン株式会社 The active matrix substrate and method of manufacturing the same, and an electro-optical device and electronic equipment
JP2007281416A (en) 2006-03-17 2007-10-25 Seiko Epson Corp Metal wiring forming method and method of manufacturing active matrix substrate
JP2007286469A (en) 2006-04-19 2007-11-01 Seiko Epson Corp Method of forming film pattern, method of manufacturing active matrix substrate, device, electrooptical apparatus and electronic device
JP5117705B2 (en) * 2006-10-26 2013-01-16 株式会社テラミクロス Manufacturing method of semiconductor device
JP4908194B2 (en) * 2006-12-28 2012-04-04 日本航空電子工業株式会社 Conductive ink, printed wiring board using the same, and manufacturing method thereof
JP4506773B2 (en) 2007-03-28 2010-07-21 ブラザー工業株式会社 Electrical connection between both sides of the substrate
JP4748108B2 (en) * 2007-05-25 2011-08-17 セイコーエプソン株式会社 Film pattern forming method, film pattern forming apparatus, conductive film wiring, electro-optical device, electronic device, non-contact card medium
JP2008306031A (en) * 2007-06-08 2008-12-18 Smk Corp Method of designing circuit pattern using conductive paint and printed circuit board
JP2009099916A (en) * 2007-10-19 2009-05-07 Ricoh Co Ltd Manufacturing device of electronic device or electronic circuit, electronic device board and electronic circuit board
KR101007118B1 (en) * 2007-10-29 2011-01-10 주식회사 엘지화학 Device for ejecting catalyst ink used for fuel cell in various pattern
JP2009194084A (en) * 2008-02-13 2009-08-27 Ricoh Co Ltd Manufacturing apparatus of electronic device or electronic circuit, electronic device board, and electronic circuit board
JP5219612B2 (en) * 2008-05-12 2013-06-26 パナソニック株式会社 Semiconductor through electrode forming method
JP2009295936A (en) * 2008-06-09 2009-12-17 Ricoh Co Ltd Electronic device chip and pattern wiring sheet
JP2009301964A (en) * 2008-06-17 2009-12-24 Sony Chemical & Information Device Corp Method for manufacturing of protection element, and method for manufacturing of electronic equipment
JP4617480B2 (en) * 2008-08-14 2011-01-26 独立行政法人産業技術総合研究所 Board with a fine line
JP5360816B2 (en) * 2009-03-27 2013-12-04 古河電気工業株式会社 Method for forming conductive material
JP5467246B2 (en) * 2010-03-24 2014-04-09 学校法人福岡大学 Wiring pattern forming method and wiring board
GB2483922B (en) * 2010-09-25 2013-11-20 M Solv Ltd Method and apparatus for dividing thin film device into separate cells
JP5777137B2 (en) * 2011-01-28 2015-09-09 富士機械製造株式会社 component mounting board production system
JP2013065680A (en) * 2011-09-16 2013-04-11 Canon Inc Manufacturing method of electronic circuit and electronic circuit board
WO2014041670A1 (en) 2012-09-13 2014-03-20 富士機械製造株式会社 Electronic device manufacturing apparatus and method for manufacturing same
CN107073817A (en) * 2014-09-19 2017-08-18 富士机械制造株式会社 Manufacturing apparatus and manufacturing method

Also Published As

Publication number Publication date
JPH11274671A (en) 1999-10-08

Similar Documents

Publication Publication Date Title
DE60309996T2 (en) Ink jet printhead and process for its preparation
KR100563356B1 (en) Direct imaging polymer fluid jet orifice
CN1234530C (en) Ink jet device
JP3173439B2 (en) Ceramic multilayer substrate and a manufacturing method thereof
US5229785A (en) Method of manufacture of a thermal inkjet thin film printhead having a plastic orifice plate
DE3008487C2 (en)
US5639508A (en) Method for producing a layered piezoelectric element
CN100416752C (en) Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus
JP3549232B2 (en) Inkjet printhead and a method of manufacturing the same
JP2716174B2 (en) Ink jet print head
US6767473B2 (en) Method for fine pattern formation
US20110013349A1 (en) Electronic component module and method of manufacturing the electronic component module
JP2994344B2 (en) Inkjet printhead and a method of forming
US5322594A (en) Manufacture of a one piece full width ink jet printing bar
US6660545B2 (en) Semiconductor device and manufacturing method therefor, circuit substrate, and electronic apparatus
US20060263930A1 (en) Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
US5132707A (en) Ink jet printhead
US6310304B1 (en) Electronic part fabricated by intaglio printing
US4639748A (en) Ink jet printhead with integral ink filter
US6051448A (en) Method of manufacturing an electronic component
US5935331A (en) Apparatus and method for forming films
DE3520703C2 (en)
US20040197493A1 (en) Apparatus, methods and precision spray processes for direct write and maskless mesoscale material deposition
JP3268937B2 (en) Ink jet print head substrate and a head using the same
US5389962A (en) Ink jet recording head assembly

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041105

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20050114

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050114

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050117

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080201

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080331

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080722

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080918

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20080930

A912 Removal of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20081031

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110114

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110506

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140513

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees