JPWO2016178269A1 - Printed wiring board manufacturing method and printed wiring board - Google Patents

Abstract

A preparing step of preparing a laminate (2) having a structure in which a patterned conductor layer (4) is laminated on the surface of the insulating layer (3); and at least the conductor layer on the surface of the laminate. A first protective film forming step in which an insulating material (10) is applied to the first printed region (17) partially exposed and surrounded by an ink jet method to form a first protective film (11); and the first protection An insulating material (10) is applied to the second printed region (19) covering at least a part of the laminate exposed at the surface of the film and the inner region of the first protective film by applying an ink-jet method to the second protective film. A second protective film forming step of forming (12), wherein the second protective film forming step performs ink jet drawing with a resolution higher than the resolution in the first protective film forming step.

Description

  The present invention relates to a method for manufacturing a printed wiring board and a printed wiring board manufactured by the method, and more particularly to printing a solder resist by an ink jet printer.

  A printed wiring board is used for mounting electronic components such as a semiconductor chip, a resistor, and a capacitor. On the surface of the printed wiring board, conductive pads for mounting the electronic component and a wiring pattern for making electrical connection with the electronic component are formed. In addition, from the viewpoint of preventing corrosion and damage to the conductive pad and wiring pattern and preventing bonding parts such as solder from being attached to unnecessary portions, the conductive pad and wiring pattern are formed on the surface of the printed wiring board. A coating layer made of a solder resist is formed in the unfinished area.

  As a method of forming a coating layer on the surface of a printed wiring board, a method of patterning using a photolithography technique after applying a solder resist on the entire surface has been conventionally known. As another method, a screen printing method using a printing plate and a squeegee in which an opening pattern is formed in a region other than the conductive pad and the wiring pattern is also known.

  However, when using the above-described photolithography technology and the screen printing method, a photomask corresponding to the region where the coating layer is formed is necessary. Therefore, a photomask according to the type is required, and problems such as the manufacturing cost and storage location of the photomask occur. Further, since the photomask and the squeegee are consumable parts, there is a problem that maintenance and replacement are necessary. As a method for solving such a problem, Patent Literature 1 and Patent Literature 2 propose a method of printing a solder resist by performing ejection control by an ink jet method. In the printing method using the ink jet method, drawing is performed at a certain resolution using a desired image, and further drawing is performed using the same image (that is, a plurality of times of application), thereby achieving desired reliability. The coating layer is formed with a film thickness that can ensure the above.

JP 2001-332840 A JP 2006-114807 A

  However, when performing higher definition drawing beyond the resolution of the inkjet head, it is necessary to move the inkjet head multiple times in the sub-scanning direction to increase the number of dots in a certain area, so that a desired image can be obtained. The number of printings in one used drawing increases. Further, when the resolution in the main scanning direction is increased, it is necessary to reduce the printing speed, the tact time cannot be improved, and the productivity of the printed wiring board is lowered.

  On the other hand, when printing is performed at a reduced resolution, the gaps between the dots are widened and a sufficient film thickness cannot be ensured, making it difficult to obtain sufficient reliability as a printed wiring board. In addition, if the required film thickness is to be secured, the number of times of drawing using a desired image will increase, making it difficult to reproduce the printed shape, and the shape of the coating layer itself with each drawing misalignment. It becomes difficult to ensure the stability.

  The present invention has been made in view of such problems, and the object of the present invention is to produce a printed wiring board capable of ensuring the stability of the shape of the coating layer itself while improving the tact time. A method and a low-cost printed wiring board provided with a coating layer having high shape stability.

  In order to achieve the above object, a method for manufacturing a printed wiring board according to the present invention includes a preparation step of preparing a laminate including a structure in which a patterned conductor layer is laminated on a surface of an insulating layer, and a surface of the laminate. A first protective film forming step for forming a first protective film by applying an insulating material to the first printed region on the top and exposing at least a part of the conductive layer by an inkjet method; and A second protective film is formed by applying an insulating material to the second printed region covering at least a part of the laminate exposed at the surface of the protective film and the inner region of the first protective film by an inkjet method. A protective film forming step, wherein the second protective film forming step is to perform ink jet drawing with a resolution higher than the resolution in the first protective film forming step.

  In order to achieve the above object, a printed wiring board according to the present invention includes a laminated body having a laminated structure in which an insulating layer and a conductor layer patterned on the surface of the insulating layer are laminated, and a surface of the laminated body. A coating layer formed so as to expose and surround at least a part of the conductor layer, and the coating layer is on the surface of the laminate and exposes at least a part of the conductor layer. And a first protective film that surrounds the first protective film, and a second protective film that covers at least a part of the stacked body exposed in the first protective film and an inner region of the first protective film.

  INDUSTRIAL APPLICABILITY According to the present invention, a printed wiring board manufacturing method capable of ensuring the stability of the shape of the coating layer itself while improving the tact time, and a low-cost printed wiring board having a coating layer having a high shape stability. Can be provided.

It is a front view of the laminated body which comprises the printed wiring board which concerns on the Example of this invention. It is sectional drawing of the laminated body which comprises the printed wiring board along line II-II of FIG. It is sectional drawing in the manufacturing process of the printed wiring board based on an Example shown similarly to FIG. It is a schematic front view in the manufacturing process of the printed wiring board which concerns on the Example of this invention. It is a schematic front view in the manufacturing process of the printed wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the printed wiring board based on an Example shown similarly to FIG. It is a schematic front view in the manufacturing process of the printed wiring board which concerns on the Example of this invention. It is a schematic front view in the manufacturing process of the printed wiring board which concerns on the Example of this invention. It is sectional drawing in the manufacturing process of the printed wiring board based on an Example shown similarly to FIG. It is sectional drawing in the manufacturing process of the printed wiring board based on a modification shown similarly to FIG.

  Embodiments of the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. The drawings used to describe the embodiments schematically show the printed wiring board and its constituent members according to the present invention, and are partially emphasized, enlarged, reduced, omitted, etc., for better understanding. In some cases, it does not accurately represent the scale and shape of the printed wiring board and its constituent members. Furthermore, various numerical values used in the embodiments may be examples, and can be changed variously as necessary.

<Example>
Hereinafter, the manufacturing process of the printed wiring board according to the embodiment of the present invention will be described in detail with reference to FIGS. Here, FIG. 1 is a front view of the laminate constituting the printed wiring board according to the present embodiment. 2 is a cross-sectional view of the laminate taken along line II-II in FIG. 3, 6, and 9 are cross-sectional views in the manufacturing process of the printed wiring board shown in the same manner as FIG. 2. 4, FIG. 5, FIG. 7, and FIG. 8 are schematic front views in the manufacturing process of the printed wiring board according to the present embodiment.

  First, as shown in FIG.1 and FIG.2, the laminated body 2 which is a structural member of the printed wiring board 1 which concerns on a present Example is prepared (preparation process). In this example, a base material provided with a structure in which the insulating layer 3 and the conductor layer 4 formed on the first surface 3a of the insulating layer 3 are stacked as the stacked body 2 was assumed. Here, patterning corresponding to connection terminals of electronic components such as a semiconductor chip, a resistor, and a capacitor to be mounted on the printed wiring board 1 or patterning for forming a desired electrical wiring is formed on the conductor layer 4. Is given.

  In FIGS. 1 and 2, only one pad-like conductor layer 4 is shown for easy understanding of the features of the present invention and for convenience of explanation. In this case, a plurality of pads and a plurality of wiring patterns are formed. In addition, for the same reason, the laminated body 2 is assumed to be composed of one insulating layer 3 and one conductor layer 4, but in a general printed wiring board, a plurality of insulating layers, In addition, a plurality of conductor layers serving as internal wirings are stacked to form via holes, through holes, and the like.

  Next, using a coating apparatus for applying a solder resist 10 that is an insulating material, ink jet drawing is performed by an ink jet method to form a coating layer 13 composed of a first protective film 11 and a second protective film 12 described later. . In this embodiment, as shown in FIG. 3, the coating apparatus includes a print head 16 including an inkjet head 14 and an ultraviolet light source 15. From such a configuration of the print head 16, when the print head 16 is moved in the main scanning direction X and the solder resist 10 is applied, ultraviolet irradiation can be performed immediately after the application. That is, the solder resist 10 can be applied and cured by one movement of the print head 16 in the main scanning direction X. In addition, the resolution of the inkjet head 14 in this embodiment is 360 dpi, but the resolution can be changed as appropriate.

  As a specific step of forming the coating layer 13, first, the solder resist 10 is applied by an inkjet method so as to expose and surround at least a part of the conductor layer 4 on the surface of the multilayer body 2. In particular, in this embodiment, the solder resist 10 is applied on the first surface 3a of the insulating layer 3 so as to surround and surround the formation region of the conductor layer 4. The area to which the solder resist 10 is to be applied in the present embodiment is the first printing area 17 shown with dots in FIG. That is, the solder resist 10 is applied so as to expose the peripheral portion of the conductor layer 4 without covering the entire surface of the first surface 3 a of the insulating layer 3. In other words, the first printing region 17 includes an opening having a size larger than that of the conductor layer 4.

  Here, the separation distance A from the inner edge 17a of the first printing region 17 to the side surface 4a of the conductor layer 4 is preferably 10 μm or more, and is set to 100 μm in this embodiment. Moreover, the said separation distance is good also as 1 times or more and 20 times or less of the dot pitch at the time of formation of the 2nd protective film 12 mentioned later.

  In this embodiment, the solder resist 10 is applied to the first printing region 17 by performing ink jet drawing at a resolution of 720 dpi. Here, since the resolution of the inkjet head 14 is 360 dpi, the solder resist 10 is continuously applied in the main scanning direction X (that is, dots are formed) to the block region 18 surrounded by a broken line in FIG. In addition, one scan in which the solder resist 10 is applied every other block in the sub-scanning direction Y is repeated while being shifted in the sub-scanning direction Y. Thereby, since the solder resist 10 is applied to all the block areas 18 in the first printing area 17 to form dots, a resolution of 720 dpi is realized. Here, the block area 18 shown in FIG. 5 is an area for schematically indicating the resolution of ink jet drawing, and one block area 18 corresponds to a resolution of 720 dpi.

  More specifically, when the number of inkjet nozzles in the sub-scanning direction Y is two, the solder resist 10 is applied and cured while moving the print head 16 in the direction of arrow B in FIG. 5 as the first scan. At this time, the solder resist 10 is applied and cured on the block region 18 of FIG. 5 simultaneously in two rows (first row and third row). Further, the moving speed in the main scanning direction X is controlled so that the solder resist 10 can be applied to all the block regions 18 in the first and third rows by a single scan in the direction of arrow B. . When the first scan is completed, the direction of the print head 16 is rotated by 180 °, and further moved by one block region 18 in the sub-scanning direction Y. Then, as the second scan, the solder head 10 is applied and cured simultaneously in two rows (second row and fourth row) while moving the print head 16 in the direction of arrow C in FIG. By performing the printing of the solder resist 10 by the movement of the print head 16 in the main scanning direction X and the sub-scanning direction Y in the entire first printing region 17, a higher resolution can be obtained by using the lower resolution inkjet head 14. Inkjet drawing can be realized.

  In the description of FIG. 5, for convenience of explanation, two inkjet nozzles in the sub-scanning direction Y are used. However, from the viewpoint of improving productivity, it is desirable to increase the actual number of inject nozzles. . Even if the number of inject nozzles is increased, there is no change in the above-described ink jet drawing method.

  In the ink jet drawing related to the first print region 17, emphasis is placed on reducing the tact time rather than the stability of the drawing shape of the first protective film 11. This is because the drawing shape of the first protective film 11 does not affect the drawing shape of the coating layer 13. The reason for this will be described in detail later.

  Note that the printing method described above is merely an example, and can be changed as appropriate according to the structure of the coating apparatus. For example, if the inkjet head 14 cannot be rotated, the inkjet head 14 may be moved after the first scan is completed, and the second scan may be performed in a direction set in the same direction as the first scan direction. Good. Further, the above-described overlap degree is appropriately changed according to the resolution of the inkjet head 14 and the resolution required for the actual drawing. Furthermore, you may increase the application quantity of the soldering resist 10 in each inkjet drawing with a multidrop method.

  When the first protective film forming step, which is the ink jet drawing described above, is performed, the first protection is performed so as to surround the formation region of the conductor layer 4 on the first surface 3a of the insulating layer 3 as shown in FIG. A film 11 is formed. Here, the separation distance D between the first protective film 11 and the conductor layer 4 corresponds to the separation distance A from the inner edge 17a of the first printing region 17 to the side surface 4a of the conductor layer 4, and is 100 μm in this embodiment. It becomes.

  As a specific step of forming the coating layer 13, the first surface 11 a of the first protective film 11 and at least a part of the laminate 2 exposed in the inner region of the first protective film 11 are then covered. The solder resist 10 is applied by an inkjet method. In particular, in this embodiment, the solder resist 10 is formed so as to cover the first surface 11a of the first protective film 11 and a part of the first surface 3a of the insulating layer 3 exposed in the inner region of the first protective film 11. Apply. Here, the solder resist 10 used is the same as that used when forming the first protective film 11, and the print head 16 is also the same. This is to ensure reliability such as the strength of the coating layer 13 described later, and to simplify and shorten the manufacturing process.

  And the area | region which should apply | coat the soldering resist 10 in a present Example becomes the 2nd printing area | region 19 which attaches | subjects a dot in FIG. That is, the solder resist 10 is applied so as to completely cover the first protective film 11 and to expose the peripheral portion of the conductor layer 4 without covering the exposed first surface 3a of the insulating layer 3. . In other words, the second printing area 19 is provided with an opening that is larger than the conductor layer 4 and smaller in size than the opening of the first printing area 17 described above.

  Here, it is preferable that the second printing region 19 is set to 10 μm or more from the inner side surface 11b of the first protective film 11 and further to the inner side (that is, the region closer to the conductor layer 4). did.

  In the present embodiment, the application of the solder resist 10 relating to the second printing region 19 is performed by performing ink jet drawing at a resolution of 1440 dpi. Here, since the resolution of the inkjet head 14 is 360 dpi, the solder resist 10 is continuously applied in the main scanning direction X to the block region 20 surrounded by the broken line in FIG. One scan in which the solder resist 10 is applied every three blocks is repeated while being shifted in the sub-scanning direction Y. Thereby, since the solder resist 10 is applied to all the block areas 20 in the second printing area 19 to form dots, a resolution of 1440 dpi is realized. Here, the block area 20 shown in FIG. 8 is an area for schematically showing the resolution of ink jet drawing, and one block area 20 corresponds to a resolution of 1440 dpi.

  That is, when the second print area 19 is drawn, ink jet drawing is performed with a higher resolution than when the first print area 17 is drawn. Therefore, when performing ink-jet drawing for the second print region 19, the same ink-jet head 14 as that for ink-jet drawing is used for the first print region 17, but the dot pitch is substantially reduced. Become. In the present embodiment, the dot pitch for drawing the first print area 17 is about 0.035 mm, and the dot pitch for drawing the second print area 19 is about 0.0175 mm.

  More specifically, when there are two inkjet nozzles in the sub-scanning direction Y, the solder resist 10 is applied and cured while moving the print head 16 in the direction of arrow E in FIG. 8 as the first scan. At this time, the solder resist 10 is applied and cured on the block region 20 of FIG. 8 simultaneously in two rows (first row and fifth row). The moving speed in the main scanning direction is controlled so that the solder resist 10 can be applied to all the block regions 20 in the first row and the fifth row by one scan in the direction of arrow E. That is, in the present embodiment, when the second printing area 19 is drawn by inkjet, the moving speed in the main scanning direction is 0.5 times that of the case where the first printing area 17 is drawn by inkjet.

  When the first scan is completed, the direction of the print head 16 is rotated by 180 °, and further moved by one block region 20 in the sub-scanning direction Y. Then, as the second scan, the solder head 10 is applied and cured simultaneously in two rows (second row and sixth row) while moving the print head 16 in the direction of arrow F in FIG. By performing the printing of the solder resist 10 by the movement of the print head 16 in the main scanning direction X and the sub-scanning direction Y in the entire second print area 19, a higher resolution can be obtained using the low resolution inkjet head 14. Inkjet drawing can be realized. In particular, in the present embodiment, the number of times of printing (that is, the number of times of movement in the sub-scanning direction Y) is increased as compared with the ink-jet drawing in the first print region 17, so Drawing can be realized.

  In the ink jet drawing related to the second print region 19, the emphasis is placed on the stability of the drawing shape of the second protective film 12 rather than the reduction of the tact time. This is because the drawing shape of the second protective film 12 greatly affects the drawing shape of the coating layer 13. The reason for this will be described in detail later.

  Note that the printing method described above is merely an example, and can be changed as appropriate according to the structure of the coating apparatus.

  When the second protective film forming process, which is the ink jet drawing described above, is performed, the insulating layer 3 exposed on the first surface 11a of the first protective film 11 and in the inner region of the first protective film 11 as shown in FIG. The second protective film 12 is formed so as to cover a part. Here, the dimension G in which the second protective film 12 is formed in the inner region beyond the inner side surface 11b of the first protective film 11 is caused by the setting of the second print region 19 described above, and is 40 μm in this embodiment. It becomes.

  And the coating layer 13 is formed through the 1st protective film formation process and 2nd protective film formation process which were mentioned above, and the manufacturing process of the printed wiring board 1 is complete | finished. As can be seen from FIG. 9, in the printed wiring board 1 according to this example, the entire side surface of the first protective film 11 is covered with the second protective film, and the periphery of the conductor layer 4 is protected by the coating layer 13. It will be. In the present embodiment, the thickness of the first protective film 11 is smaller than the thickness of the second protective film 12, and the shape of the first protective film 11 may affect the shape of the coating layer 13 itself. Has been reduced. In addition, the film thickness of the 1st protective film 11 is made larger than the film thickness of the 2nd protective film 12 by increasing the application quantity of the soldering resist 10 in the inkjet drawing of the 1st protective film 11 by the multidrop method. Also good.

  In this embodiment, since the first protective film 11 is first formed with a relatively low resolution, the tact time at the initial stage of forming the coating layer 13 can be shortened. Further, since the ink-jet drawing is set so that the second printing region 19 covers the first printing region 17, the drawing shape of the first protective film 11 may affect the drawing shape of the coating layer 13 itself. Disappear. Furthermore, since the second protective film 12 is formed while covering the first protective film 11 with a relatively high resolution, the drawing shape of the coating 13 layer itself depends on the drawing shape of the second protective film 12 and is stable. A drawing shape can be realized.

  Therefore, in this embodiment, the instability of the drawing shape, which is a demerit of low-resolution ink-jet drawing, is resolved by high-resolution ink-jet drawing, and the decrease in tact time, which is a demerit of high-resolution ink-jet drawing, is reduced. This can be compensated by the drawing time tact. That is, in this embodiment, it is possible to realize a manufacturing method that ensures the stability of the shape of the coating layer itself while improving the tact time, and further, a low cost including a coating layer having a high shape stability. The printed wiring board 1 can be provided.

  In the embodiment described above, the coating layer 13 is formed away from the conductor layer 4 without covering the conductor layer 4, but as shown in FIG. 10, the coating layer 13 'is formed of the conductor layer 4'. You may coat | cover an outer edge part. Here, FIG. 10 is a cross-sectional view in the manufacturing process of the printed wiring board 1 ′ according to the modification shown in the same manner as FIG. 2.

  As shown in FIG. 10, the coating layer 13 ′ according to the modification is formed on the surface of the multilayer body 2 ′ so as to expose and surround at least a part of the conductor layer 4 ′. In addition, the coating layer 13 ′ according to the modification includes a first protective film 11 ′ on the surface of the multilayer body 2 ′ and exposing at least a part of the conductor layer 4 ′, and the first protective film 11 ′, The second protective film 12 ′ covers at least a part of the laminated body 2 ′ exposed in the inner region of the first protective film 11 ′. Further, in the modification shown in FIG. 10, the first protective film 11 ′ may surround the conductor layer 4 ′ while exposing the periphery, and only the second protective film 12 ′ may cover the outer edge portion of the conductor layer 4 ′. .

  Here, regarding the manufacturing method of the printed wiring board 1 ′ according to such a modification, only the dimensions of the first print region 17 and the second print region 19 in the above-described embodiment are different, and other specific examples. The manufacturing process is the same. Specifically, the first printing region according to the modification is set so as to expose and surround at least a part (that is, a part other than the edge part) of the conductor layer 4 ′ on the surface of the multilayer body 2 ′. The second printed region according to the modification is at least a part of the multilayer body 2 ′ exposed on the surface of the first protective film 11 ′ and the inner region of the first protective film 11 ′ (that is, the conductor layer 4 ′ is exposed). Part). Other specific manufacturing steps are omitted.

  In the above-described embodiment, the coating layer 13 is formed from one first protective film 11 and one second protective film 12, but a plurality of first protective films 11 are stacked on top of each other. The second protective film 12 may be formed. In this case, the first protective film forming step in the above-described embodiment is repeatedly performed before the second protective film forming step. That is, the repetition process which repeats a 1st protective film formation process is performed. Thereby, even when the layer thickness of the coating layer 13 is increased according to the required layer thickness of the coating layer 13 or the layer thickness of the conductor layer 4, the coating layer 13 itself is improved while improving the tact time. The stability of the shape can be ensured.

<Embodiment of the present invention>
The method for manufacturing a printed wiring board according to the first embodiment of the present invention includes a preparation step of preparing a laminate including a structure in which a patterned conductor layer is laminated on a surface of an insulating layer, and a surface of the laminate. A first protective film forming step for forming a first protective film by applying an insulating material to the first printed region that exposes and surrounds at least a part of the conductor layer by an inkjet method; and the first protective film A second protective film that forms a second protective film by applying an insulating material to the second printed region covering at least a part of the laminate exposed at the inner surface of the first protective film and the surface of the first protective film by an inkjet method The second protective film forming step is to perform ink jet drawing with a resolution higher than the resolution in the first protective film forming step.

  In the first embodiment, since the first protective film is first formed with a relatively low resolution, the tact time of the initial formation of the coating layer composed of the first protective film and the second protective film can be shortened. Further, since the ink-jet drawing is set so that the second print area covers the first print area, the drawing shape at the time of forming the first protective film does not affect the drawing shape of the coating layer itself. . Furthermore, after forming the first protective film, the second protective film is formed while covering the first protective film with a relatively high resolution, so that the drawing shape of the coating layer itself is changed to the drawing shape at the time of forming the second protective film. This makes it possible to achieve a stable drawing shape. Therefore, in the first embodiment, it is possible to ensure the stability of the shape of the coating layer itself while improving the tact time.

  The printed wiring board manufacturing method according to the second embodiment of the present invention is the above-described first embodiment, wherein in the first protective film forming step, the conductor layer is formed on the surface of the conductor layer. A region surrounding the first protective film is defined as the first print region, and in the second protective film forming step, at least a part of the insulating layer exposed at the surface of the first protective film and the inner region of the first protective film. The area covering the surface is defined as the second print area. Thereby, the formation region of the first protective film and the second protective film can be optimized, and the manufacturing cost can be reduced.

  In the method for manufacturing a printed wiring board according to the third embodiment of the present invention, in the second embodiment described above, in the first protective film forming step, the distance between the conductor layer and the first protective film is set to the second distance. The dot pitch in the protective film forming step is 1 to 20 times. Thereby, the influence which the drawing shape of coating layer itself receives with the drawing shape at the time of 1st protective film formation can be reduced more.

  In the method for manufacturing a printed wiring board according to the fourth embodiment of the present invention, in the third embodiment described above, in the first protective film forming step, a separation distance between the conductor layer and the first protective film is 10 μm or more. It is to be. Thereby, the influence which the drawing shape of coating layer itself receives with the drawing shape at the time of 1st protective film formation can be reduced further.

  In the printed wiring board manufacturing method according to the fifth embodiment of the present invention, in any one of the first to fourth embodiments described above, the first protective film forming step is repeated before the second protective film forming step. It further has a repeating step to be performed. As a result, even if the layer thickness of the coating layer is increased according to the required layer thickness of the coating layer or the conductor layer, the shape of the coating layer itself can be stabilized while improving the tact time. Sex can be secured. In other words, it is possible to easily increase the layer thickness of the coating layer while ensuring the stability of the shape of the coating layer itself while improving the tact time.

  A printed wiring board according to a sixth embodiment of the present invention includes a laminate including a laminated structure in which an insulating layer and a conductor layer patterned on the surface of the insulating layer are laminated, and on the surface of the laminate. A coating layer formed so as to expose and surround at least a part of the conductor layer, and the coating layer is on the surface of the laminate and exposes and surrounds at least a part of the conductor layer. And at least a first protective film and a second protective film covering at least a part of the stacked body exposed in the first protective film and an inner region of the first protective film.

  In the sixth embodiment, since the second protective film covers at least a part of the first protective film and the laminated body exposed in the inner region of the first protective film, a coating layer having high shape stability is provided. A low-cost printed wiring board will be realized.

  The printed wiring board according to a seventh embodiment of the present invention is that, in the sixth embodiment described above, the second protective film covers the entire inner surface of the first protective film. Thereby, the influence which the drawing shape of coating layer itself receives with the drawing shape at the time of 1st protective film formation can be reduced more, and it becomes possible to provide a coating layer with higher shape stability.

  In the printed wiring board according to the eighth embodiment of the present invention, in the sixth or seventh embodiment described above, the coating layer is on the surface of the conductor layer and surrounds the formation area of the conductor layer in a spaced manner. And at least a first protective film and a second protective film covering at least a part of the insulating layer exposed in the inner region of the first protective film and the first protective film. Thereby, the formation region of the first protective film and the second protective film can be optimized, and the cost can be reduced.

  The printed wiring board according to the ninth embodiment of the present invention is that, in the above-described eighth embodiment, the second protective film is formed from the inner side surface of the first protective film to an inner region of 10 μm or more. . Thereby, the influence which the drawing shape of coating layer itself receives with the drawing shape at the time of 1st protective film formation can be reduced further, and it becomes possible to provide the coating layer whose shape stability is still higher.

  In the printed wiring board according to the tenth embodiment of the present invention, in any of the sixth to ninth embodiments described above, the film thickness of the second protective film is larger than the film thickness of the first protective film. As a result, a low-cost printed wiring board having a coating layer having a higher resolution than the first protective film and having a higher shape stability is realized.

  A printed wiring board according to an eleventh embodiment of the present invention is the printed circuit board according to any one of the sixth to tenth embodiments described above, wherein the second protection is provided on the surfaces of the plurality of first protection films on which the coating layers are stacked. A structure in which a film is formed. Thereby, it is possible to increase the layer thickness of the coating layer while ensuring the stability of the shape of the coating layer itself while improving the tact time.

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Laminated body 3 Insulating layer 3a 1st surface 4 Conductor layer 4a Side surface 10 Solder resist 11 1st protective film 11a 1st surface 11b Inner side surface 12 2nd protective film 13 Coating layer 14 Inkjet head 15 UV light source 16 Printing Head 17 First printing area 17a Inner edge 18 Block area 19 Second printing area 20 Block area

In order to achieve the above object, a method for manufacturing a printed wiring board according to the present invention includes a preparation step of preparing a laminate including a structure in which a patterned conductor layer is laminated on a surface of an insulating layer, and a surface of the laminate. the first print area to a top enclosed by exposing at least a portion of said conductive layer, a first protective film forming step of forming a first protective film by applying an insulating material by an ink jet method, wherein the first protection An insulating material is applied by an ink jet method to form a second protective film on at least a part of the laminate exposed in the inner region of the film and a second printing region that covers the entire surface of the first protective film. A second protective film forming step, wherein the second protective film forming step is to perform ink jet drawing with a resolution higher than the resolution in the first protective film forming step.

In order to achieve the above object, a printed wiring board according to the present invention includes a laminated body having a laminated structure in which an insulating layer and a conductor layer patterned on the surface of the insulating layer are laminated, and a surface of the laminated body. anda coating layer formed to surround the exposed a part also less of the conductive layer, the coating layer, exposing at least a portion of the conductive layer to a surface of the laminate And at least a second protective film covering at least a part of the stacked body exposed in an inner region of the first protective film and the entire surface of the first protective film. .

The printed wiring board manufacturing method according to the second embodiment of the present invention is the above-described first embodiment. In the first protective film forming step, the conductor layer forming region is on the surface of the laminate. A region surrounding the first protective film is defined as the first print region, and in the second protective film forming step, at least a part of the insulating layer exposed at the surface of the first protective film and the inner region of the first protective film. The area covering the surface is defined as the second print area. Thereby, the formation region of the first protective film and the second protective film can be optimized, and the manufacturing cost can be reduced.

In the printed wiring board according to an eighth embodiment of the present invention, in the sixth or seventh embodiment described above, the first protective film is on the surface of the multilayer body and separates the formation region of the conductor layer. enclose Te, the second protective film is that you cover the entire at least a portion and a surface of the first protective layer of the insulating layer exposed in the inner region of the first protective film. Thereby, the formation region of the first protective film and the second protective film can be optimized, and the cost can be reduced.

In the printed wiring board according to the tenth embodiment of the present invention, in any of the sixth to ninth embodiments described above, the film thickness of the second protective film is larger than the film thickness of the first protective film. . As a result, a low-cost printed wiring board having a coating layer having a higher resolution than the first protective film and having a higher shape stability is realized.

Claims (11)

Preparing a laminate including a structure in which a patterned conductor layer is laminated on the surface of the insulating layer; and
A first protective film forming step for forming a first protective film by applying an insulating material to the first printed region on the surface of the multilayer body by exposing at least a part of the conductor layer by surrounding the conductive layer by an inkjet method; ,
An insulating material is applied by an inkjet method to form a second protective film on a second printing region that covers at least a part of the laminate exposed on the surface of the first protective film and the inner region of the first protective film. And a second protective film forming step.
The second protective film forming step is a method of manufacturing a printed wiring board in which ink jet drawing is performed with a resolution higher than the resolution in the first protective film forming step. In the first protective film forming step, an area on the surface of the conductor layer that surrounds and separates the formation area of the conductor layer is defined as the first print area,
In the second protective film forming step, a region covering at least a part of the insulating layer exposed on a surface of the first protective film and an inner region of the first protective film is defined as the second print region. A method for producing a printed wiring board according to 1.   3. The print according to claim 2, wherein in the first protective film forming step, a distance between the conductor layer and the first protective film is set to be not less than 1 and not more than 20 times a dot pitch in the second protective film forming step. A method for manufacturing a wiring board.   The method for manufacturing a printed wiring board according to claim 3, wherein in the first protective film forming step, a distance between the conductor layer and the first protective film is 10 μm or more.   5. The method for manufacturing a printed wiring board according to claim 1, further comprising a repeating step of repeatedly performing the first protective film forming step before the second protective film forming step. A laminate comprising a laminated structure in which an insulating layer and a conductor layer patterned on the surface of the insulating layer are laminated;
A coating layer formed on the surface of the laminate so as to expose and surround at least a part of the conductor layer;
The coating layer is on the surface of the multilayer body and exposes at least a part of the conductor layer and surrounds the first protective film, and the first protective film and an inner region of the first protective film are exposed. A printed wiring board comprising at least a second protective film covering at least a part of the laminate.   The printed wiring board according to claim 6, wherein the second protective film covers the entire inner surface of the first protective film.   The coating layer is on the surface of the conductor layer and surrounds the formation region of the conductor layer in a spaced manner, and the insulation exposed in the first protection film and the inner region of the first protection film. The printed wiring board according to claim 6, further comprising at least a second protective film that covers at least a part of the layer.   The printed wiring board according to claim 8, wherein the second protective film is formed from an inner surface of the first protective film to an inner region of 10 μm or more.   The printed wiring board according to claim 6, wherein a thickness of the second protective film is larger than a thickness of the first protective film. The printed wiring board according to claim 6, wherein the coating layer has a structure in which the second protective film is formed on the surface of the plurality of stacked first protective films.

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