TW201637762A - 標記裝置及方法、圖案產生裝置、以及被加工物 - Google Patents

標記裝置及方法、圖案產生裝置、以及被加工物 Download PDF

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Publication number
TW201637762A
TW201637762A TW104142170A TW104142170A TW201637762A TW 201637762 A TW201637762 A TW 201637762A TW 104142170 A TW104142170 A TW 104142170A TW 104142170 A TW104142170 A TW 104142170A TW 201637762 A TW201637762 A TW 201637762A
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TW
Taiwan
Prior art keywords
drawing pattern
pattern
marking
workpiece
laser
Prior art date
Application number
TW104142170A
Other languages
English (en)
Chinese (zh)
Inventor
Masanori Tao
Hitoshi Okabe
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW201637762A publication Critical patent/TW201637762A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
TW104142170A 2015-01-20 2015-12-15 標記裝置及方法、圖案產生裝置、以及被加工物 TW201637762A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015008320 2015-01-20

Publications (1)

Publication Number Publication Date
TW201637762A true TW201637762A (zh) 2016-11-01

Family

ID=56416784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142170A TW201637762A (zh) 2015-01-20 2015-12-15 標記裝置及方法、圖案產生裝置、以及被加工物

Country Status (2)

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TW (1) TW201637762A (fr)
WO (1) WO2016117224A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI723532B (zh) * 2018-10-22 2021-04-01 日商Ｓｕｍｃｏ股份有限公司 具雷射標記矽晶圓的製造方法及具雷射標記矽晶圓

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6855955B2 (ja) * 2017-06-19 2021-04-07 株式会社Sumco レーザマークの印字方法、レーザマーク付きシリコンウェーハの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10315425A (ja) * 1997-05-20 1998-12-02 Dainippon Screen Mfg Co Ltd レーザ製版装置
JPH11156564A (ja) * 1997-11-28 1999-06-15 Toshiba Ceramics Co Ltd 耐熱性透明体およびその製造方法
JP3280619B2 (ja) * 1998-03-26 2002-05-13 松下電工株式会社 回路板の製造方法
JP2002261315A (ja) * 2001-03-05 2002-09-13 Kanegafuchi Chem Ind Co Ltd 薄膜光電変換モジュールの製造方法
JP2011040446A (ja) * 2009-08-07 2011-02-24 Bridgestone Corp ディスプレイ用光学フィルタの製造方法、それに用いるレーザ加工装置、及びディスプレイ用光学フィルタ
JP2011121106A (ja) * 2009-12-14 2011-06-23 Hitachi High-Technologies Corp レーザパターニング方法及びその装置
CN104884205A (zh) * 2012-12-20 2015-09-02 伊雷克托科学工业股份有限公司 经由激光微加工形成影像的方法
US8927069B1 (en) * 2013-10-02 2015-01-06 Eritek, Inc. Method and apparatus for improving radio frequency signal transmission through low-emissivity coated glass

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI723532B (zh) * 2018-10-22 2021-04-01 日商Ｓｕｍｃｏ股份有限公司 具雷射標記矽晶圓的製造方法及具雷射標記矽晶圓
US11515263B2 (en) 2018-10-22 2022-11-29 Sumco Corporation Method of producing laser-marked silicon wafer and laser-marked silicon wafer

Also Published As

Publication number Publication date
WO2016117224A1 (fr) 2016-07-28

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