TW201633469A - 半導體裝置及其製造方法 - Google Patents

半導體裝置及其製造方法 Download PDF

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Publication number
TW201633469A
TW201633469A TW104142200A TW104142200A TW201633469A TW 201633469 A TW201633469 A TW 201633469A TW 104142200 A TW104142200 A TW 104142200A TW 104142200 A TW104142200 A TW 104142200A TW 201633469 A TW201633469 A TW 201633469A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
semiconductor element
mounting
layer
semiconductor
Prior art date
Application number
TW104142200A
Other languages
English (en)
Chinese (zh)
Inventor
Noriko Kano
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Publication of TW201633469A publication Critical patent/TW201633469A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW104142200A 2014-12-17 2015-12-16 半導體裝置及其製造方法 TW201633469A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014255310A JP2016115884A (ja) 2014-12-17 2014-12-17 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW201633469A true TW201633469A (zh) 2016-09-16

Family

ID=56126205

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142200A TW201633469A (zh) 2014-12-17 2015-12-16 半導體裝置及其製造方法

Country Status (3)

Country Link
JP (1) JP2016115884A (ja)
TW (1) TW201633469A (ja)
WO (1) WO2016098296A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111403630A (zh) * 2017-03-08 2020-07-10 堺显示器制品株式会社 有机el设备的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021118337A (ja) * 2020-01-29 2021-08-10 株式会社ディスコ デバイスパッケージの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327803A (ja) * 2003-04-25 2004-11-18 Hitachi Chem Co Ltd 多層回路基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法
JP2007019394A (ja) * 2005-07-11 2007-01-25 Toshiba Corp 半導体パッケージの製造方法及びこの製造方法により形成された半導体パッケージ
JP2008130701A (ja) * 2006-11-20 2008-06-05 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた半導体装置及び半導体装置の製造方法
JP2010016291A (ja) * 2008-07-07 2010-01-21 Shinko Electric Ind Co Ltd 配線基板及び半導体装置の製造方法
JP5481724B2 (ja) * 2009-12-24 2014-04-23 新光電気工業株式会社 半導体素子内蔵基板
JP2013016763A (ja) * 2011-07-06 2013-01-24 Hitachi Chem Co Ltd 半導体素子搭載用部材及び半導体装置
JP6056386B2 (ja) * 2012-11-02 2017-01-11 凸版印刷株式会社 貫通電極付き配線基板及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111403630A (zh) * 2017-03-08 2020-07-10 堺显示器制品株式会社 有机el设备的制造方法

Also Published As

Publication number Publication date
WO2016098296A1 (ja) 2016-06-23
JP2016115884A (ja) 2016-06-23

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