TW201622987A - 生物相容性積層體及生物相容性電子零件 - Google Patents

生物相容性積層體及生物相容性電子零件 Download PDF

Info

Publication number
TW201622987A
TW201622987A TW104135435A TW104135435A TW201622987A TW 201622987 A TW201622987 A TW 201622987A TW 104135435 A TW104135435 A TW 104135435A TW 104135435 A TW104135435 A TW 104135435A TW 201622987 A TW201622987 A TW 201622987A
Authority
TW
Taiwan
Prior art keywords
biocompatible
metal
layer
film
insulating substrate
Prior art date
Application number
TW104135435A
Other languages
English (en)
Chinese (zh)
Inventor
克里斯多福 克多尼爾
本間英夫
Original Assignee
學校法人關東學院
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 學校法人關東學院 filed Critical 學校法人關東學院
Publication of TW201622987A publication Critical patent/TW201622987A/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K6/00—Preparations for dentistry
    • A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
    • A61K6/84—Preparations for artificial teeth, for filling teeth or for capping teeth comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Plastic & Reconstructive Surgery (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Chemically Coating (AREA)
  • Materials For Medical Uses (AREA)
  • Dental Preparations (AREA)
  • Laminated Bodies (AREA)
TW104135435A 2014-10-29 2015-10-28 生物相容性積層體及生物相容性電子零件 TW201622987A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014220177A JP2016083918A (ja) 2014-10-29 2014-10-29 生体適合性積層体及び生体適合性電子部品

Publications (1)

Publication Number Publication Date
TW201622987A true TW201622987A (zh) 2016-07-01

Family

ID=55857519

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104135435A TW201622987A (zh) 2014-10-29 2015-10-28 生物相容性積層體及生物相容性電子零件

Country Status (3)

Country Link
JP (1) JP2016083918A (ja)
TW (1) TW201622987A (ja)
WO (1) WO2016068184A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7120757B2 (ja) * 2017-12-12 2022-08-17 株式会社Jcu 酸化物膜形成用塗布剤、酸化物膜の製造方法及び金属めっき構造体の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0192377A (ja) * 1987-10-02 1989-04-11 Nippon Ozon Kk 無電解メッキ素材の前処理方法
JPH08253869A (ja) * 1995-03-14 1996-10-01 Sharp Corp 樹脂の無電解メッキ方法
JPH09328372A (ja) * 1996-06-04 1997-12-22 Asahi Optical Co Ltd セラミックスと金属の接合方法
JP3409714B2 (ja) * 1998-10-20 2003-05-26 株式会社村田製作所 チップ状電子部品の製造方法
JP2004186661A (ja) * 2002-10-07 2004-07-02 Tokai Rubber Ind Ltd フレキシブルプリント基板の製法
JP3999696B2 (ja) * 2003-04-16 2007-10-31 トヨタ自動車株式会社 無電解めっき方法及びめっき部品
JP5087910B2 (ja) * 2005-12-13 2012-12-05 東レ株式会社 電子機器用接着剤組成物、電子機器用接着剤シートおよびそれを用いた電子部品
JP2007231362A (ja) * 2006-03-01 2007-09-13 Kanto Gakuin Univ Surface Engineering Research Institute 樹脂製品の無電解めっき方法
JP5171090B2 (ja) * 2007-03-29 2013-03-27 日本特殊陶業株式会社 生体インプラント及びその製造方法
JP5448524B2 (ja) * 2008-04-23 2014-03-19 富士フイルム株式会社 めっき用積層フィルム、表面金属膜材料の作製方法及び表面金属膜材料
JP4930804B2 (ja) * 2009-09-17 2012-05-16 トヨタ自動車株式会社 無電解めっき素材の製造方法
JP5477576B2 (ja) * 2010-03-08 2014-04-23 凸版印刷株式会社 光基板の製造方法
JP5557382B2 (ja) * 2010-05-07 2014-07-23 国立大学法人九州大学 液晶性有機半導体ポリマー、その製造方法及び有機ナノポーラス材料
CA2819030C (en) * 2010-11-26 2020-02-25 C.R. Bard, Inc. Deposition of a silver layer on a nonconducting substrate
JP5694265B2 (ja) * 2012-10-02 2015-04-01 学校法人関東学院 無電解めっき方法及び無電解めっき膜
JP6070356B2 (ja) * 2013-03-28 2017-02-01 大日本印刷株式会社 タッチパネル用導電シートの製造方法、及びタッチパネル用導電シート

Also Published As

Publication number Publication date
WO2016068184A1 (ja) 2016-05-06
JP2016083918A (ja) 2016-05-19

Similar Documents

Publication Publication Date Title
KR100672872B1 (ko) ３차원 나노구조의 제조 방법
CN107113982A (zh) 印刷配线板用基板、制作印刷配线板用基板的方法、印刷配线板、制作印刷配线板的方法以及树脂基材
Homola et al. Fast and low-temperature (70° C) mineralization of inkjet printed mesoporous TiO2 photoanodes using ambient air plasma
JP5649150B1 (ja) 無電解メッキ用前処理液および無電解メッキ方法
TWI358421B (en) Method for forming inorganic thin film on polyimid
Manzoor et al. Recent progress of fabrication, characterization, and applications of anodic aluminum oxide (AAO) membrane: A review
JP2009209420A (ja) シリコンを母材とする複合材料及びその製造方法
Muench et al. Metal nanotubes and nanowires with rhombohedral cross-section electrolessly deposited in mica templates
JP2006282464A (ja) 金属酸化物膜の製造方法
Ahmad et al. Effect of polymer template on structure and membrane fouling of TiO2/Al2O3 composite membranes for wastewater treatment
He et al. H2O2-triggered rapid deposition of poly (caffeic acid) coatings: a mechanism-based entry to versatile and high-efficient molecular separation
Wu et al. Room‐Temperature Annealing‐Free Gold Printing via Anion‐Assisted Photochemical Deposition
TWI291382B (en) Method of forming a metal thin film with micro holes by ink-jet printing
TW201622987A (zh) 生物相容性積層體及生物相容性電子零件
TW201422855A (zh) 載持鍍覆處理用觸媒粒子之基板之處理方法
JP2013185216A (ja) 積層体、及び積層体の製造方法
JP2016119424A (ja) プリント配線板用基板及びプリント配線板並びにプリント配線板用基板の製造方法
Akamatsu et al. Site-selective direct photochemical deposition of copper on glass substrates using TiO2 nanocrystals
US20220399242A1 (en) Method of manufacturing a glass article to provide increased bonding of metal to a glass substrate via the generation of a metal oxide layer, and glass articles such as glass interposers including the metal oxide layer
JP2007103479A (ja) ポリイミド樹脂基材の無機薄膜パターン形成方法
Cordonier et al. Formation of micrometer scale metal structures on glass by selective electroless plating on photopatterned titanium and copper containing films
JP2005051151A (ja) 導電層の製造方法、導電層を有する基板、および電子デバイス
JP2019114681A (ja) プリント配線板用基材及びプリント配線板
JP7032126B2 (ja) プリント配線板用基材及びプリント配線板
JP2000261128A (ja) パターン基板、およびその製造方法