TW201613005A - Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly - Google Patents

Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly

Info

Publication number
TW201613005A
TW201613005A TW104119489A TW104119489A TW201613005A TW 201613005 A TW201613005 A TW 201613005A TW 104119489 A TW104119489 A TW 104119489A TW 104119489 A TW104119489 A TW 104119489A TW 201613005 A TW201613005 A TW 201613005A
Authority
TW
Taiwan
Prior art keywords
thermal control
control element
malfunctioning
auto
correction
Prior art date
Application number
TW104119489A
Other languages
English (en)
Other versions
TWI677037B (zh
Inventor
Ole Waldmann
Eric A Pape
Keith William Gaff
Harmeet Singh
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW201613005A publication Critical patent/TW201613005A/zh
Application granted granted Critical
Publication of TWI677037B publication Critical patent/TWI677037B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Control Of Temperature (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW104119489A 2014-06-17 2015-06-17 半導體基板支持組件之溫度控制板中的失效溫度控制元件之自動校正 TWI677037B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/307,062 US9543171B2 (en) 2014-06-17 2014-06-17 Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element
US14/307,062 2014-06-17

Publications (2)

Publication Number Publication Date
TW201613005A true TW201613005A (en) 2016-04-01
TWI677037B TWI677037B (zh) 2019-11-11

Family

ID=54836778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104119489A TWI677037B (zh) 2014-06-17 2015-06-17 半導體基板支持組件之溫度控制板中的失效溫度控制元件之自動校正

Country Status (6)

Country Link
US (1) US9543171B2 (zh)
JP (1) JP2016006875A (zh)
KR (1) KR20150144722A (zh)
CN (1) CN105183031B (zh)
SG (1) SG10201504736WA (zh)
TW (1) TWI677037B (zh)

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CN108873983A (zh) * 2018-06-27 2018-11-23 沈阳拓荆科技有限公司 半导体加热盘复合控温系统及控温方法
CN109490721A (zh) * 2018-09-11 2019-03-19 惠科股份有限公司 一种监控装置和监控方法
KR101931969B1 (ko) * 2018-10-15 2018-12-24 안종팔 반도체 웨이퍼 세정장치에서 웨이퍼 표면 온도 측정을 위한 온도센서 설치 위치 조정장치 및 그 방법
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Also Published As

Publication number Publication date
CN105183031A (zh) 2015-12-23
US9543171B2 (en) 2017-01-10
CN105183031B (zh) 2018-12-04
US20150364388A1 (en) 2015-12-17
KR20150144722A (ko) 2015-12-28
SG10201504736WA (en) 2016-01-28
TWI677037B (zh) 2019-11-11
JP2016006875A (ja) 2016-01-14

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