TW201610577A - 感光性樹脂組成物、感光性元件、阻劑圖案的製造方法及印刷線路板的製造方法 - Google Patents

感光性樹脂組成物、感光性元件、阻劑圖案的製造方法及印刷線路板的製造方法 Download PDF

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Publication number
TW201610577A
TW201610577A TW104124407A TW104124407A TW201610577A TW 201610577 A TW201610577 A TW 201610577A TW 104124407 A TW104124407 A TW 104124407A TW 104124407 A TW104124407 A TW 104124407A TW 201610577 A TW201610577 A TW 201610577A
Authority
TW
Taiwan
Prior art keywords
resin composition
mass
photosensitive resin
polymer
meth
Prior art date
Application number
TW104124407A
Other languages
English (en)
Chinese (zh)
Inventor
Kazumasa Takeuchi
Syohta OKADE
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW201610577A publication Critical patent/TW201610577A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F293/00—Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW104124407A 2014-07-28 2015-07-28 感光性樹脂組成物、感光性元件、阻劑圖案的製造方法及印刷線路板的製造方法 TW201610577A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014152830 2014-07-28

Publications (1)

Publication Number Publication Date
TW201610577A true TW201610577A (zh) 2016-03-16

Family

ID=55217496

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104124407A TW201610577A (zh) 2014-07-28 2015-07-28 感光性樹脂組成物、感光性元件、阻劑圖案的製造方法及印刷線路板的製造方法

Country Status (3)

Country Link
JP (1) JP6620747B2 (ja)
TW (1) TW201610577A (ja)
WO (1) WO2016017596A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI725168B (zh) * 2016-04-19 2021-04-21 日商鐘化股份有限公司 印刷佈線板及其製造方法
CN114222766A (zh) * 2019-08-14 2022-03-22 昭和电工材料株式会社 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019244724A1 (ja) * 2018-06-22 2019-12-26 旭化成株式会社 感光性樹脂組成物およびレジストパターンの形成方法
KR20220133933A (ko) * 2020-02-28 2022-10-05 후지필름 가부시키가이샤 도전성 패턴의 제조 방법, 터치 센서, 전자파 실드, 안테나, 배선 기판, 도전성 가열 소자, 및 구조체

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119014A (ja) * 1989-10-03 1991-05-21 Mitsubishi Petrochem Co Ltd ネガ型ドライフィルムフォトレジスト組成物
JP2000169531A (ja) * 1998-12-03 2000-06-20 Kansai Paint Co Ltd ブロック共重合体の製造方法
JP4895034B2 (ja) * 2006-05-24 2012-03-14 Ｊｓｒ株式会社 感放射線性樹脂組成物、スペーサーおよびその形成方法
JP2008024915A (ja) * 2006-06-23 2008-02-07 Jsr Corp スペーサー用感放射線性樹脂組成物ならびにスペーサーおよびその形成方法
JP4748322B2 (ja) * 2007-03-01 2011-08-17 Ｊｓｒ株式会社 感放射線性樹脂組成物およびスペーサーの形成方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI725168B (zh) * 2016-04-19 2021-04-21 日商鐘化股份有限公司 印刷佈線板及其製造方法
CN114222766A (zh) * 2019-08-14 2022-03-22 昭和电工材料株式会社 感光性树脂组合物、感光性元件、抗蚀剂图案的形成方法及印刷线路板的制造方法

Also Published As

Publication number Publication date
JPWO2016017596A1 (ja) 2017-04-27
WO2016017596A1 (ja) 2016-02-04
JP6620747B2 (ja) 2019-12-18

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