TW201536673A - Method and system for purifying helium gas - Google Patents

Method and system for purifying helium gas Download PDF

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TW201536673A
TW201536673A TW103142467A TW103142467A TW201536673A TW 201536673 A TW201536673 A TW 201536673A TW 103142467 A TW103142467 A TW 103142467A TW 103142467 A TW103142467 A TW 103142467A TW 201536673 A TW201536673 A TW 201536673A
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adsorption
gas
concentration
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helium
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TWI625297B (en
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Mitsuru Kishii
Long You
Kouichi Shima
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Sumitomo Seika Chemicals
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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B23/00Noble gases; Compounds thereof
    • C01B23/001Purification or separation processes of noble gases
    • C01B23/0036Physical processing only
    • C01B23/0052Physical processing only by adsorption in solids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/02Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
    • B01D53/04Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
    • B01D53/047Pressure swing adsorption
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/102Carbon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/104Alumina
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/106Silica or silicates
    • B01D2253/108Zeolites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2253/00Adsorbents used in seperation treatment of gases and vapours
    • B01D2253/10Inorganic adsorbents
    • B01D2253/116Molecular sieves other than zeolites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2256/00Main component in the product gas stream after treatment
    • B01D2256/18Noble gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/10Single element gases other than halogens
    • B01D2257/102Nitrogen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/10Single element gases other than halogens
    • B01D2257/104Oxygen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2259/00Type of treatment
    • B01D2259/40Further details for adsorption processes and devices
    • B01D2259/40007Controlling pressure or temperature swing adsorption
    • B01D2259/40009Controlling pressure or temperature swing adsorption using sensors or gas analysers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2259/00Type of treatment
    • B01D2259/40Further details for adsorption processes and devices
    • B01D2259/403Further details for adsorption processes and devices using three beds
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B2210/00Purification or separation of specific gases
    • C01B2210/0029Obtaining noble gases
    • C01B2210/0031Helium
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B2210/00Purification or separation of specific gases
    • C01B2210/0043Impurity removed
    • C01B2210/0048Air

Abstract

Provided are a method and a system by which rarefied helium gas is industrially and efficiently purified with small-scale equipment to a high degree. In each of the adsorption towers (2a, 2b, 2c) for concentration of a first pressure swing adsorption device (1), an adsorption step, a depressurization step, a desorption step, and a pressurization step are successively performed to adsorb impurity gases contained in the rarefied helium gas onto an adsorbent and to discharge concentrated helium gas, which has remained unadsorbed onto the adsorbent. A passageway for introducing the concentrated helium gas into each of the multiple adsorption towers (102a, 102b, 102c) for reconcentration of a second pressure swing adsorption device (101) is connected to a passageway for discharging the concentrated helium gas from the first pressure swing adsorption device (1). In each of the adsorption towers for reconcentration, an adsorption step, a depressurization step, a desorption step, and a pressurization step are successively performed to adsorb impurity gases contained in the concentrated helium gas onto an adsorbent and to discharge reconcentrated helium gas, which has remained unadsorbed onto the adsorbent.

Description

氦氣之純化方法及純化系統 Helium purification method and purification system

本發明係關於一種藉由對包含雜質氣體之原料氦氣進行純化而獲得高純度氦氣之方法與系統,尤其適於原料氦氣為氦濃度較低之稀薄氦氣之情形時之純化。 The present invention relates to a method and system for obtaining high-purity helium by purifying a helium gas containing an impurity gas, and is particularly suitable for purification in the case where the raw material helium gas is a thin helium gas having a low radon concentration.

例如,作為MRI(Magnetic Resonance Imaging,核磁共振成像)之冷卻用液體、光纖製造時之多孔質母材形成步驟或拉線步驟等中之環境氣體或冷卻氣體所使用的氦氣僅以美國或中東各國等之海外產天然氣之副生品形式被少量生產。又,目前於世界範圍內氦氣之供給吃緊,隨之而來氦氣價格不斷上升。進而,一般認為以亞洲為中心之新興國之製造業中對氦氣之需要今後亦會增加。然而,今後氦氣之穩定供給令人擔憂。如此,氦氣之資源性較高且較貴重,故而自使用設備回收氦氣以進行再利用較為有用。因此,期望對混入有大量空氣等雜質氣體之稀薄氦氣進行回收並純化為高純度。 For example, helium gas used as a cooling liquid for MRI (Magnetic Resonance Imaging), a porous base material forming step at the time of optical fiber production, or a wire drawing step, is only used in the United States or the Middle East. The form of by-products of overseas natural gas, such as countries, is produced in small quantities. Moreover, at present, the supply of suffocating gas is tight in the world, and the price of suffocating gas continues to rise. Furthermore, it is generally believed that the need for radon in the manufacturing industries of emerging countries with Asia as the center will increase in the future. However, the stable supply of suffocating gas in the future is worrying. In this way, helium is more resourceful and more expensive, so it is useful to recover helium from the equipment for reuse. Therefore, it is desirable to recover and purify the diluted helium gas mixed with an impurity gas such as a large amount of air to a high purity.

先前,作為將稀薄氦氣純化為高純度之方法,已知將雜質氣體利用液氮等進行液化而自氦氣進行分離之深冷分離法(參照專利文獻1)。又,已知藉由對雜質氣體使用變壓式吸附裝置使之吸附於吸附劑而將其自氦氣分離之變壓式吸附法(PSA法)(參照專利文獻2)。於變壓式吸附法中,反覆實行吸附步驟、減壓步驟、解吸步驟、清洗步驟及 升壓步驟,該吸附步驟係使被導入至吸附塔內之原料氦氣所含之雜質氣體於加壓下吸附於吸附劑並將未被吸附劑吸附之濃縮氦氣排出,該減壓步驟係減小吸附塔之內部壓力,該解吸步驟係使雜質氣體自吸附劑解吸而作為逸氣排出,該清洗步驟係對吸附塔內部進行清洗而排出逸氣,該升壓步驟係提昇吸附塔之內部壓力。 In the past, a cryogenic separation method in which an impurity gas is liquefied by liquid nitrogen or the like and separated from helium gas is known as a method of purifying the lean helium gas into a high purity (see Patent Document 1). In addition, a pressure swing adsorption method (PSA method) in which an impurity gas is adsorbed to an adsorbent by a pressure swing adsorption device and is separated from helium gas is known (see Patent Document 2). In the pressure swing adsorption method, the adsorption step, the pressure reduction step, the desorption step, the washing step and a step of pressurizing, the adsorption gas contained in the raw material helium introduced into the adsorption tower is adsorbed to the adsorbent under pressure and the concentrated helium gas not adsorbed by the adsorbent is discharged, and the depressurization step is performed. The internal pressure of the adsorption tower is reduced. The desorption step is to desorb the impurity gas from the adsorbent and discharge as an outgas. The cleaning step is to clean the inside of the adsorption tower to discharge the outgas. The step of boosting is to raise the inside of the adsorption tower. pressure.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利第3639087號 [Patent Document 1] Japanese Patent No. 3639087

[專利文獻2]日本專利第5372607號 [Patent Document 2] Japanese Patent No. 5372607

於藉由深冷分離法進行純化之情形時,需要液氮等冷熱源,裝置呈大規模化,於處理量較少之情形時成本變高。又,即便於處理量較少之情形時,氣體液化設備亦成為高壓氣體製造保安法之適用對象,手續或管理較繁雜。 In the case of purification by the cryogenic separation method, a cold heat source such as liquid nitrogen is required, and the apparatus is large-scale, and the cost becomes high in the case where the amount of processing is small. Moreover, even in the case where the amount of processing is small, the gas liquefaction equipment becomes a suitable object of the high-pressure gas manufacturing security law, and the procedures or management are complicated.

變壓式吸附裝置並非高壓氣體製造保安法之適用對象,但憑藉如專利文獻2記載之先前技術,難以利用小規模裝置效率良好地純化稀薄氦氣。 The pressure swing type adsorption device is not applied to the high pressure gas production security method. However, with the prior art described in Patent Document 2, it is difficult to efficiently purify the lean helium gas using a small-scale apparatus.

又,關於變壓式吸附法,於縮短吸附步驟之重複間隔並增多一定純化處理時間內之變壓次數之情形時,吸附次數變多而濃縮氦氣之純度變高。然而,於該情形時,由於解吸次數變多,故而逸氣排出次數增加,濃縮氦氣流量減小,逸氣內包含氦氣,因而氦氣回收率亦下降。因此,利用先前技術無法效率良好地獲得高純度氦氣。 Further, in the pressure swing adsorption method, when the repetition interval of the adsorption step is shortened and the number of times of transformation in a certain purification treatment time is increased, the number of adsorption times is increased, and the purity of the concentrated helium gas is increased. However, in this case, since the number of desorption times is increased, the number of outgassing is increased, the flow rate of the concentrated helium gas is decreased, and helium gas is contained in the outgas, and the helium gas recovery rate is also lowered. Therefore, high purity helium cannot be obtained efficiently using the prior art.

進而,關於吸附步驟中吸附劑之失效時間,原料氦氣中之雜質氣體濃度越高則該失效時間越短。尤其於將如自光纖製造步驟等所排出之稀薄氦氣用作原料氦氣之情形時,因空氣等雜質氣體之混入而導 致氦濃度成為20vol%以下,吸附劑之失效時間變短。因此,若欲藉由先前技術純化大量之稀薄氦氣,則吸附塔之吸附劑體積變大且吸附系統呈大規模化。 Further, regarding the failure time of the adsorbent in the adsorption step, the higher the impurity gas concentration in the raw material helium, the shorter the failure time. In particular, when a thin helium gas discharged from a fiber manufacturing step or the like is used as a raw material helium gas, it is guided by the incorporation of an impurity gas such as air. The cerium concentration becomes 20 vol% or less, and the failure time of the adsorbent becomes short. Therefore, if a large amount of thin helium gas is to be purified by the prior art, the adsorbent volume of the adsorption tower becomes large and the adsorption system becomes large-scale.

即,若欲藉由先前技術工業性地將大量之稀薄氦氣純化為高純度,則存在純化效率下降、系統呈大規模化之問題。本發明之目的在於提供一種可解決使用變壓式吸附法之先前技術之問題的氦氣之純化方法與純化系統。 That is, if a large amount of thin helium gas is to be industrially purified to a high purity by the prior art, there is a problem that the purification efficiency is lowered and the system is large-scale. It is an object of the present invention to provide a purification method and purification system for helium which can solve the problems of the prior art using the pressure swing adsorption method.

本發明方法係使用具有複數個濃縮用吸附塔之第1變壓式吸附裝置與具有複數個再濃縮用吸附塔之第2變壓式吸附裝置對包含雜質氣體之原料氦氣進行純化之方法。於本發明方法中,上述各濃縮用吸附塔及上述各再濃縮用吸附塔收納有優先於氦氣吸附雜質氣體之吸附劑,向上述各濃縮用吸附塔依序導入上述原料氦氣,於上述各濃縮用吸附塔中依序實行吸附步驟、減壓步驟、解吸步驟及升壓步驟,該吸附步驟係使所導入之上述原料氦氣所含之雜質氣體於加壓下吸附於上述吸附劑並將未被上述吸附劑吸附之濃縮氦氣排出,該減壓步驟係減小內部壓力,該解吸步驟係使雜質氣體自上述吸附劑解吸而作為逸氣排出,該升壓步驟係提昇內部壓力;對用以自上述第1變壓式吸附裝置排出上述濃縮氦氣之流路連接用以向上述第2變壓式吸附裝置之複數個上述再濃縮用吸附塔各者導入上述濃縮氦氣之流路,向上述各再濃縮用吸附塔依序導入上述濃縮氦氣,於上述各再濃縮用吸附塔中依序實行吸附步驟、減壓步驟、解吸步驟及升壓步驟,該吸附步驟係使所導入之上述濃縮氦氣所含之雜質氣體於加壓下吸附於上述吸附劑並將未被上述吸附劑吸附之再濃縮氦氣排出,該減壓步驟係減小內部壓力,該解吸步驟係使雜質氣體自上述吸附劑解吸而作為逸氣排出,該升壓步驟係提昇內部壓力。 The method of the present invention is a method for purifying a raw material helium gas containing an impurity gas by using a first pressure swing adsorption device having a plurality of adsorption columns for concentration and a second pressure swing adsorption device having a plurality of adsorption columns for reconcentration. In the method of the present invention, each of the adsorption column for concentration and the adsorption column for each of the reconcentration stores an adsorbent which adsorbs the impurity gas in preference to the helium gas, and sequentially introduces the raw material helium gas into each of the adsorption columns for concentration. Each of the adsorption adsorption towers sequentially performs an adsorption step, a depressurization step, a desorption step, and a pressure increasing step, wherein the adsorption step is performed by adsorbing the impurity gas contained in the introduced raw material helium gas under pressure to the adsorbent. The concentrated helium gas which is not adsorbed by the adsorbent is discharged, and the depressurizing step is to reduce the internal pressure, and the desorbing step is to desorb the impurity gas from the adsorbent and discharge as an outgas, and the step of increasing the pressure is to increase the internal pressure; Introducing a flow path for discharging the concentrated helium gas from the first pressure swing adsorption device to introduce the concentrated helium gas flow to each of the plurality of adsorption bases for reconcentration of the second pressure swing adsorption device The step of introducing the concentrated helium gas into each of the adsorption towers for reconcentration, and sequentially performing the adsorption step, the pressure reduction step, the desorption step, and the liter in each of the adsorption columns for reconcentration In the step of adsorbing, the impurity gas contained in the introduced concentrated helium gas is adsorbed to the adsorbent under pressure and the reconcentrated helium gas which is not adsorbed by the adsorbent is discharged, and the depressurization step is reduced. The internal pressure, the desorption step is such that the impurity gas is desorbed from the adsorbent and discharged as an outgas, and the step of boosting increases the internal pressure.

根據本發明方法,藉由使用第1變壓式吸附裝置純化原料氦氣可連續地排出氦氣富集之濃縮氦氣,藉由使用第2變壓式吸附裝置再次純化該濃縮氦氣可續地排出氦氣進一步富集之再濃縮氦氣連。即,藉由變壓式吸附法分2階段純化原料氦氣,可連續地獲得作為高純度氦氣之濃縮氦氣。藉此,與如先前般以1階段純化原料氦氣之情形相比,未使吸附系統大規模化便可靈活應對原料氣體流量與濃度之變動,可效率良好地獲得目標純度之氦氣。 According to the method of the present invention, the helium-enriched concentrated helium gas can be continuously discharged by purifying the raw material helium gas by using the first pressure swing adsorption device, and the concentrated helium gas can be further purified by using the second pressure swing adsorption device. The ground gas is further enriched and further concentrated in the helium gas. That is, the raw helium gas is purified in two stages by a pressure swing adsorption method, and concentrated helium gas as a high purity helium gas can be continuously obtained. In this way, compared with the case where the raw material helium gas is purified in one stage as before, the fluctuation of the raw material gas flow rate and the concentration can be flexibly handled without making the adsorption system large-scale, and the target purity helium gas can be efficiently obtained.

本發明之氦氣之純化系統具備具有複數個濃縮用吸附塔之第1變壓式吸附裝置與具有複數個再濃縮用吸附塔之第2變壓式吸附裝置,上述各濃縮用吸附塔及上述各再濃縮用吸附塔收納有優先於氦氣吸附雜質氣體之吸附劑。上述第1變壓式吸附裝置具有用以向上述各濃縮用吸附塔導入上述原料氦氣之原料氣體導入流路、用以自上述各濃縮用吸附塔內排出濃縮氦氣之濃縮氣體流路、用以自上述各濃縮用吸附塔內排出逸氣之第1逸氣流路、用以使上述濃縮用吸附塔中之某個塔與另外某個塔相互連通之第1連通流路、對上述各濃縮用吸附塔與上述原料氣體導入流路之間個別地進行開關之原料氣體導入路開關閥、對上述各濃縮用吸附塔與上述濃縮氣體流路之間個別地進行開關之濃縮氣體路開關閥、對上述各濃縮用吸附塔與上述第1逸氣流路之間個別地進行開關之第1逸氣路開關閥及對上述各濃縮用吸附塔與上述第1連通流路之間個別地進行開關之第1連通路開關閥。上述第2變壓式吸附裝置具有用以與上述濃縮氣體流路連接並向上述各再濃縮用吸附塔導入上述濃縮氦氣之濃縮氣體導入流路、用以自上述各再濃縮用吸附塔內排出再濃縮氦氣之再濃縮氣體流路、用以自上述各再濃縮用吸附塔內排出逸氣之第2逸氣流路、用以使上述再濃縮用吸附塔中之某個塔與另外某個塔相互連通之第2連通流路、對上述各再濃縮用吸附塔與上述濃縮氣體導入流路之間個別地進行開關之濃縮氣體導入路開關 閥、對上述各再濃縮用吸附塔與上述再濃縮氣體流路之間個別地進行開關之再濃縮氣體路開關閥、對上述各再濃縮用吸附塔與上述第2逸氣流路之間個別地進行開關之第2逸氣路開關閥及對上述各再濃縮用吸附塔與上述第2連通流路之間個別地進行開關之第2連通路開關閥。上述各開關閥分別被製成具有開關用致動器之自動閥並與控制裝置連接以可個別地執行開關動作。藉由上述控制裝置控制上述各開關閥,以於上述各濃縮用吸附塔中依序實行吸附步驟、減壓步驟、解吸步驟及升壓步驟並於上述各再濃縮用吸附塔中依序實行吸附步驟、減壓步驟、解吸步驟及升壓步驟,上述各濃縮用吸附塔中之吸附步驟係使所導入之上述原料氦氣所含之雜質氣體於加壓下吸附於上述吸附劑並將未被上述吸附劑吸附之濃縮氦氣排出,減壓步驟係減小內部壓力,解吸步驟係使雜質氣體自上述吸附劑解吸而作為逸氣排出,升壓步驟係提昇內部壓力;上述各再濃縮用吸附塔中之吸附步驟係使所導入之上述濃縮氦氣所含之雜質氣體於加壓下吸附於上述吸附劑並將未被上述吸附劑吸附之再濃縮氦氣排出,減壓步驟係減小內部壓力,解吸步驟係使雜質氣體自上述吸附劑解吸而作為逸氣排出,升壓步驟係提昇內部壓力。 The helium purification system of the present invention comprises a first pressure swing adsorption device having a plurality of adsorption adsorption columns and a second pressure swing adsorption device having a plurality of adsorption columns for reconcentration, each of the adsorption adsorption columns and the above Each of the reconcentration adsorption towers contains an adsorbent that preferentially adsorbs the impurity gas in the helium gas. The first pressure swing adsorption device includes a raw material gas introduction flow path for introducing the raw material helium gas into each of the concentration adsorption columns, and a concentrated gas flow path for discharging concentrated helium gas from the respective adsorption adsorption columns. a first communication flow path for discharging the outgas from the adsorption column for concentration, and a first communication flow path for allowing one of the adsorption adsorption columns to communicate with another column, a raw material gas introduction switch valve that is separately opened and closed between the adsorption adsorption column and the raw material gas introduction flow path, and a concentrated gas path on-off valve that individually switches between the concentration adsorption column and the concentrated gas flow path a first escape valve opening and closing valve that individually switches between the concentration adsorption column and the first flow path, and individually switches between the concentration adsorption column and the first communication channel The first communication path switching valve. The second pressure swing type adsorption device has a concentrated gas introduction flow path for connecting the concentrated gas flow path to the respective reconcentration adsorption columns and introducing the concentrated helium gas, and is used in the adsorption column for each reconcentration a reconcentrated gas flow path for discharging the re-concentrated helium gas, a second escape gas flow path for discharging the outgas from the respective reconcentration adsorption towers, and a column for the reconcentration adsorption tower and another a second communication channel in which the columns are connected to each other, and a concentrated gas introduction path switch that individually switches between the adsorption column for reconcentration and the concentrated gas introduction channel a valve, a reconcentrated gas path switching valve that individually switches between the respective reconcentrating adsorption columns and the reconcentrated gas flow path, and the respective reconcentration adsorption towers and the second escape flow path are individually A second air passage switching valve that performs switching, and a second communication path switching valve that individually switches between the respective reconcentrating adsorption towers and the second communication passage. Each of the above-described switching valves is respectively formed as an automatic valve having a switching actuator and is connected to a control device to individually perform a switching operation. The respective switching valves are controlled by the control device to sequentially perform an adsorption step, a pressure reduction step, a desorption step, and a pressure increasing step in each of the concentration adsorption columns, and sequentially perform adsorption in each of the reconcentration adsorption columns. a step of depressurizing, a desorption step, and a step of pressurizing, wherein the adsorption step in each of the adsorption columns for concentration is such that the impurity gas contained in the introduced raw material helium gas is adsorbed to the adsorbent under pressure and is not The concentrated helium gas adsorbed by the adsorbent is discharged, and the depressurizing step is to reduce the internal pressure. The desorbing step is to desorb the impurity gas from the adsorbent and discharge as an outgas, and the step of increasing the pressure is to increase the internal pressure; The adsorption step in the column is such that the impurity gas contained in the introduced concentrated helium gas is adsorbed to the adsorbent under pressure and the re-concentrated helium gas which is not adsorbed by the adsorbent is discharged, and the depressurization step reduces the internal portion. The pressure and desorption steps are such that the impurity gas is desorbed from the adsorbent and discharged as an outgas, and the step of boosting increases the internal pressure.

根據本發明系統,可實施本發明方法。 The method of the invention can be carried out in accordance with the system of the invention.

於本發明方法中,較佳為對上述原料氦氣混入自上述第1變壓式吸附裝置與上述第2變壓式吸附裝置中之至少一者所排出之上述逸氣。於該情形時,本發明系統較佳為具備用以將上述第1逸氣流路及上述第2逸氣流路中之至少一者與上述原料氣體導入流路進行連接之循環流路。 In the method of the present invention, it is preferable that the raw material helium gas is mixed with the outgas discharged from at least one of the first pressure swing adsorption device and the second pressure swing adsorption device. In this case, the system of the present invention preferably includes a circulation flow path for connecting at least one of the first gas flow path and the second gas flow path to the material gas introduction flow path.

藉此,可對逸氣中所含之氦氣進行再利用,因此可提高回收率。 Thereby, the helium gas contained in the outgas can be reused, so that the recovery rate can be improved.

於本發明方法中,即便導入至上述各濃縮用吸附塔內之上述原 料氦氣之氦濃度為20vol%以下,亦可效率良好地獲得目標純度之氦氣。藉此,可將本發明方法有效地應用於稀薄氦氣之純化。再者,關於原料氦氣之氦濃度,由於與再利用之逸氣進行混合之情形時係於混合後導入至第1變壓式吸附裝置內,故而於混合後成為20vol%以下之情形時亦可藉由本發明方法而效率良好地獲得目標純度之氦氣。 In the method of the present invention, even if introduced into the above-mentioned respective adsorption towers for concentration The helium gas concentration of the helium gas is 20 vol% or less, and helium gas of a target purity can also be obtained efficiently. Thereby, the method of the invention can be effectively applied to the purification of lean helium. In addition, when the raw material argon gas is mixed with the recycled gas, it is introduced into the first pressure swing adsorption device after mixing, so that it is 20 vol% or less after mixing. The target purity helium can be efficiently obtained by the method of the present invention.

於本發明方法中,較佳為以上述濃縮氦氣之氦濃度成為40vol%~80vol%之方式設定上述第1變壓式吸附裝置中之上述吸附步驟之重複間隔。藉此,可使第2變壓式吸附裝置中自氦氣分離之雜質氣體之量成為適量。 In the method of the present invention, it is preferable to set the repetition interval of the adsorption step in the first pressure swing adsorption device so that the concentration of the concentrated helium gas is 40 vol% to 80 vol%. Thereby, the amount of the impurity gas separated from the helium gas in the second pressure swing type adsorption device can be made an appropriate amount.

於本發明方法中,較佳為以自上述各再濃縮用吸附塔於上述吸附步驟所排出之上述再濃縮氦氣之氦濃度成為目標純度之方式、例如成為99.999vol%以上之方式設定上述第2變壓式吸附裝置中之上述吸附步驟之重複間隔。藉此可獲得高純度氦氣。進而,亦可以自上述各再濃縮用吸附塔於上述吸附步驟所排出之濃縮氦氣之氦濃度成為99.9999vol%以上之方式設定上述第2變壓式吸附裝置中之上述吸附步驟之重複間隔。 In the method of the present invention, it is preferable that the concentration of the reconcentrated helium gas discharged from the adsorption column in the adsorption step is the target purity, for example, 99.999 vol% or more. 2 The repetition interval of the above adsorption step in the pressure swing adsorption device. Thereby, high purity helium gas can be obtained. Furthermore, the repetition interval of the adsorption step in the second pressure swing adsorption device may be set so that the concentration of the concentrated helium gas discharged from the adsorption column in the adsorption step is 99.9999 vol% or more.

於本發明方法中,藉由向處於上述解吸步驟後且上述升壓步驟前之狀態的上述某個濃縮用吸附塔內部,導入處於上述減壓步驟之上述另外某個濃縮用吸附塔之內部氣體後並作為逸氣排出,而實行對處於上述解吸步驟後且上述升壓步驟前之狀態的上述某個濃縮用吸附塔內部進行清洗之清洗步驟,較佳為根據向上述濃縮用吸附塔導入之上述原料氦氣之氦濃度之變化而變更上述清洗步驟中自處於上述減壓步驟之上述另外某個濃縮用吸附塔向上述某個濃縮用吸附塔內部所導入之氣體量。於該情形時,於向上述濃縮用吸附塔導入之上述原料氦氣之氦濃度為預先設定之設定值以下時,較佳為不實行上述清洗步驟。 In the method of the present invention, the internal gas of the other concentration adsorption column in the depressurization step is introduced into the adsorption tower after the desorption step and the pressure increase step. Thereafter, the cleaning step of performing the cleaning of the inside of the concentration adsorption column after the desorption step and before the step of the pressure increasing step is performed, and is preferably introduced into the adsorption column for concentration. The amount of gas introduced into the above-mentioned certain adsorption adsorption tower from the other adsorption column in the above-described decompression step in the above-described washing step is changed in the above-described washing step. In this case, when the enthalpy concentration of the raw material helium gas introduced into the concentration adsorption column is equal to or lower than a predetermined set value, it is preferable not to carry out the above-described washing step.

藉由實行清洗步驟,可將解吸步驟後滯留於吸附塔內部之雜質 氣體作為逸氣排出,因此可效率良好地提高濃縮氦氣之濃度。另一方面,處於減壓步驟之濃縮用吸附塔之氣體排出口附近之內部氣體之氦濃度接近濃縮氦氣之目標氦濃度,因此若將該內部氣體與雜質氣體一併於清洗步驟中作為逸氣排出,則氦氣回收率下降。又,原料氦氣之氦濃度越低,則處於減壓步驟之濃縮用吸附塔之氣體排出口附近以外之內部氣體中之雜質越多,因此用於清洗之氣體之雜質濃度與解吸步驟後滯留於吸附塔內部之雜質氣體之雜質濃度越成為同一程度。即,原料氦氣之氦濃度越低,則實行清洗步驟之價值越小。因此,藉由隨著向各濃縮用吸附塔導入之原料氦氣之氦濃度變低而減少用以對第1變壓式吸附裝置中之某個濃縮用吸附塔內部實行清洗步驟所導入之氣體量,可防止氦氣回收率發生不必要之下降。於向各濃縮用吸附塔所導入之原料氦氣之氦濃度為設定值以下時,亦可不實施清洗步驟。 By performing a washing step, the impurities remaining in the interior of the adsorption tower after the desorption step can be Since the gas is discharged as an outgas, the concentration of the concentrated helium gas can be efficiently increased. On the other hand, the concentration of the internal gas in the vicinity of the gas discharge port of the adsorption column for concentration in the depressurization step is close to the target concentration of the concentrated helium gas, so if the internal gas and the impurity gas are combined together in the cleaning step, When the gas is discharged, the helium recovery rate is lowered. Further, the lower the concentration of the helium gas of the raw material, the more impurities in the internal gas other than the vicinity of the gas discharge port of the adsorption column for concentration in the depressurization step, so the impurity concentration of the gas for cleaning and the desorption step are retained. The impurity concentration of the impurity gas inside the adsorption tower becomes the same level. That is, the lower the concentration of the helium gas of the raw material, the smaller the value of performing the washing step. Therefore, the gas introduced into the inside of one of the adsorption towers for concentration in the first pressure swing adsorption apparatus is reduced by the concentration of the helium gas introduced into the adsorption towers for concentration. The amount can prevent an unnecessary drop in the recovery rate of helium. When the ruthenium concentration of the raw material helium gas introduced into each concentration adsorption column is equal to or less than the set value, the washing step may not be performed.

因此,本發明系統較佳為利用上述控制裝置控制上述各開關閥,以藉由向處於上述解吸步驟後且上述升壓步驟前之狀態的上述某個濃縮用吸附塔內部,導入處於上述減壓步驟之上述另外某個濃縮用吸附塔之內部氣體後並作為逸氣排出,而實行對處於上述解吸步驟後且上述升壓步驟前之狀態的上述某個濃縮用吸附塔內部進行清洗之清洗步驟;具備對上述第1連通流路中所流通之氣體流量進行調節之流量控制閥,上述流量控制閥被製成具有流量調節用致動器之自動閥並與上述控制裝置連接以可執行流量調節動作,具備對上述原料氦氣之氦濃度進行檢測並與上述控制裝置連接之感測器,將上述清洗步驟之預先設定之一定實行時間記憶於上述控制裝置內,將上述清洗步驟中自處於上述減壓步驟之上述另外某個濃縮用吸附塔向上述某個濃縮用吸附塔導入之氣體於上述第1連通流路中之流量、與向上述濃縮用吸附塔導入之上述原料氦氣之氦濃度之間的預先設定之對應關係記憶於上述控制裝置內,藉由上述控制裝置為了實行所記憶之上述實行時間 對應之上述清洗步驟而控制上述開關閥,並基於上述對應關係利用上述流量控制閥變更調節氣體流量,以根據由上述感測器所檢測出之氦濃度之變化而變更上述清洗步驟中向上述某個濃縮用吸附塔導入之氣體量。 Therefore, in the system of the present invention, it is preferable that the respective switching valves are controlled by the control device to introduce the decompression in the inside of the concentration adsorption column in the state after the desorption step and the pressure increasing step. In the step of the other internal gas of the adsorption adsorption column, the gas is discharged as a gas, and the cleaning step of cleaning the inside of the concentration adsorption column after the desorption step and before the pressure increasing step is performed. And a flow rate control valve for regulating a flow rate of the gas flowing through the first communication passage, wherein the flow rate control valve is formed as an automatic valve having a flow rate adjusting actuator and is connected to the control device to perform flow rate adjustment The operation includes a sensor that detects the radon concentration of the raw material helium gas and is connected to the control device, and stores a predetermined execution time of the cleaning step in the control device, and the cleaning step is a gas introduced into the above-mentioned adsorption tower by a certain adsorption tower of the above-mentioned concentration in the depressurization step The preset relationship between the flow rate in the first communication channel and the enthalpy concentration of the raw material helium introduced into the concentration adsorption column is stored in the control device, and the control device is used to The above implementation time of memory Controlling the on-off valve in response to the cleaning step, and changing the flow rate of the adjustment gas by the flow rate control valve based on the correspondence relationship, and changing the cleaning step to the above-described cleaning step according to a change in the concentration of germanium detected by the sensor The amount of gas introduced by the adsorption tower for concentration.

或者較佳為具備對向上述濃縮用吸附塔導入之上述原料氦氣之氦濃度進行檢測並與上述控制裝置連接之感測器,將上述清洗步驟之實行時間與上述原料氦氣中之氦濃度之間的預先設定之對應關係記憶於上述控制裝置內,藉由上述控制裝置基於上述對應關係而變更上述清洗步驟之實行時間,以根據由上述感測器所檢測出之氦濃度之變化而變更上述清洗步驟中向上述某個濃縮用吸附塔導入之氣體量。 Or preferably, a sensor for detecting the radon concentration of the raw material helium introduced into the concentration adsorption column and connected to the control device, and performing the cleaning step and the radon concentration in the raw material helium gas The pre-set correspondence relationship is stored in the control device, and the control device changes the execution time of the cleaning step based on the correspondence relationship to change according to the change in the radon concentration detected by the sensor. The amount of gas introduced into the above-described adsorption column for concentration in the above-described washing step.

根據本發明,可提供一種適於工業性地將稀薄氦氣以小規模設備效率良好地純化為高純度之方法與系統。 According to the present invention, it is possible to provide a method and system suitable for industrially purifying lean helium gas into high purity in a small scale apparatus.

1‧‧‧第1變壓式吸附裝置 1‧‧‧1st variable pressure adsorption device

2a、2b、2c‧‧‧濃縮用吸附塔 2a, 2b, 2c‧‧‧ Concentration adsorption tower

2a'、2b'、2c'‧‧‧形成於各濃縮用吸附塔2a、2b、2c之一端之氣體通過口 2a', 2b', 2c'‧‧‧ gas passages formed at one end of each of the adsorption adsorption towers 2a, 2b, 2c

2a"、2b"、2c"‧‧‧形成於各濃縮用吸附塔2a、2b、2c之另一端之氣體通過口 2a", 2b", 2c"‧‧‧ gas passages formed at the other end of each of the adsorption adsorption towers 2a, 2b, 2c

3‧‧‧原料氣體導入配管(原料氣體導入流路) 3‧‧‧Material gas introduction piping (raw material gas introduction flow path)

4‧‧‧濃縮氣體配管(濃縮氣體流路) 4‧‧‧Concentrated gas piping (concentrated gas flow path)

5‧‧‧第1逸氣配管(第1逸氣流路) 5‧‧‧1st escape pipe (1st air flow path)

6a、6b、6c‧‧‧第1~第3開關閥(原料氣體導入路開關閥) 6a, 6b, 6c‧‧‧1st to 3rd on-off valves (raw material gas introduction switch valve)

7a、7b、7c‧‧‧第4~第6開關閥(濃縮氣體路開關閥) 7a, 7b, 7c‧‧‧4th to 6th on-off valves (concentrated gas circuit switching valves)

8a、8b、8c‧‧‧第7~第9開關閥(第1逸氣路開關閥) 8a, 8b, 8c‧‧‧7th to 9th on-off valves (1st escape valve)

9‧‧‧第1連通配管(第1連通流路) 9‧‧‧1st connecting pipe (first connecting flow path)

9a‧‧‧第1連通配管9之第1連通部 9a‧‧‧1st communication part of the first communication pipe 9

9b‧‧‧第1連通配管9之第2連通部 9b‧‧‧the second communication part of the first communication pipe 9

9c‧‧‧第1連通配管9之第3連通部 9c‧‧‧the third communication part of the first communication pipe 9

10a、10b、10c‧‧‧第10~第12開關閥(第1連通路開關閥) 10a, 10b, 10c‧‧‧10th to 12th on-off valves (first communication path switching valve)

11a、11b、11c‧‧‧第13~第15開關閥(第1連通路開關閥) 11a, 11b, 11c‧‧‧13th to 15th on-off valves (1st connected way switch valve)

12‧‧‧第16開關閥(第1連通路開關閥) 12‧‧‧16th on-off valve (1st connected way switch valve)

13‧‧‧第1流量控制閥 13‧‧‧1st flow control valve

14‧‧‧第17開關閥(第1連通路開關閥) 14‧‧‧17th on-off valve (1st connected way switch valve)

15‧‧‧第2流量控制閥 15‧‧‧2nd flow control valve

20‧‧‧控制裝置 20‧‧‧Control device

21‧‧‧第1流量感測器 21‧‧‧1st flow sensor

22‧‧‧原料氣體用緩衝槽 22‧‧‧Material gas buffer tank

22a‧‧‧緩衝槽22之貯藏量測定用感測器 22a‧‧‧Sensor for measuring the storage volume of the buffer tank 22

23‧‧‧壓縮機 23‧‧‧Compressor

24‧‧‧第1濃度感測器 24‧‧‧1st concentration sensor

25‧‧‧第3流量控制閥 25‧‧‧3rd flow control valve

26a‧‧‧第1壓力調節閥 26a‧‧‧1st pressure regulating valve

26b‧‧‧第2壓力調節閥 26b‧‧‧2nd pressure regulating valve

27a、27b、27c‧‧‧對濃縮用吸附塔2a、2b、2c各自之內部壓力進行檢測之壓力感測器 27a, 27b, 27c‧‧‧ Pressure sensor for detecting the internal pressure of each of the adsorption adsorption towers 2a, 2b, 2c

28‧‧‧輸入裝置 28‧‧‧ Input device

29‧‧‧輸出裝置 29‧‧‧ Output device

41‧‧‧第1循環配管(循環流路) 41‧‧‧1st circulating pipe (circulating flow path)

42‧‧‧第1切換閥 42‧‧‧1st switching valve

43‧‧‧第2循環配管(循環流路) 43‧‧‧2nd cycle piping (circulating flow path)

44‧‧‧第1釋放用配管 44‧‧‧1st release piping

101‧‧‧第2變壓式吸附裝置 101‧‧‧2nd variable pressure adsorption device

102a、102b、102c‧‧‧再濃縮用吸附塔 102a, 102b, 102c‧‧‧reconcentration adsorption tower

102a'、102b'、102c'‧‧‧形成於各再濃縮用吸附塔102a、102b、102c之一端之氣體通過口 102a', 102b', 102c'‧‧‧ gas passages formed at one end of each of the reconcentration adsorption towers 102a, 102b, 102c

102a"、102b"、102c"‧‧‧形成於各再濃縮用吸附塔102a、102b、102c之另一端之氣體通過口 102a", 102b", 102c"‧‧‧ gas passages formed at the other end of each of the reconcentration adsorption towers 102a, 102b, 102c

103‧‧‧濃縮氣體導入配管(濃縮氣體導入流路) 103‧‧‧Concentrated gas introduction piping (concentrated gas introduction flow path)

104‧‧‧再濃縮氣體配管(再濃縮氣體流路) 104‧‧‧Reconcentrated gas piping (reconcentrated gas flow path)

105‧‧‧第2逸氣配管(第2逸氣流路) 105‧‧‧2nd gas pipeline (2nd air flow path)

106a、106b、106c‧‧‧第18~第20開關閥(再濃縮氣體導入路開關閥) 106a, 106b, 106c‧‧‧18th to 20th on-off valves (reconcentrated gas introduction switch valve)

107a、107b、107c‧‧‧第21~第23開關閥(再濃縮氣體路開關閥) 107a, 107b, 107c‧‧‧21st to 23rd on-off valves (reconcentrated gas circuit switching valves)

108a、108b、108c‧‧‧第24~第26開關閥(第2逸氣路開關閥) 108a, 108b, 108c‧‧‧24th to 26th on-off valves (2nd airway switch valve)

109‧‧‧第2連通配管(第2連通流路) 109‧‧‧2nd connecting pipe (2nd connecting flow path)

109a‧‧‧第2連通配管109之第1再濃縮用連通部 109a‧‧ The first re-concentration communication part of the second communication pipe 109

109b‧‧‧第2連通配管109之第2再濃縮用連通部 109b‧‧・2nd re-concentration communication part of the second communication pipe 109

109c‧‧‧第2連通配管109之第3再濃縮用連通部 109c‧‧・3rd re-concentration communication part of the second communication pipe 109

110a、110b、110c‧‧‧第27~第29開關閥(第2連通路開關閥) 110a, 110b, 110c‧‧‧27th to 29th on-off valves (2nd communication switch valve)

111a、111b、111c‧‧‧第30~第32開關閥(第2連通路開關閥) 111a, 111b, 111c‧‧‧30th to 32nd on-off valves (second communication path switch valve)

112‧‧‧第33開關閥(第2連通路開關閥) 112‧‧‧33rd switch valve (2nd connecting way switch valve)

113‧‧‧第3流量控制閥 113‧‧‧3rd flow control valve

114‧‧‧第34開關閥(第2連通路開關閥) 114‧‧‧34th on-off valve (2nd connected way switch valve)

115‧‧‧第4流量控制閥 115‧‧‧4th flow control valve

121‧‧‧第2流量感測器 121‧‧‧2nd flow sensor

122‧‧‧濃縮氣體用緩衝槽 122‧‧‧Buffer tank for concentrated gas

124‧‧‧第2濃度感測器 124‧‧‧2nd concentration sensor

126a‧‧‧第3壓力調節閥 126a‧‧‧3rd pressure regulating valve

126b‧‧‧第4壓力調節閥 126b‧‧‧4th pressure regulating valve

127a、127b、127c‧‧‧對再濃縮用吸附塔102a、102b、102c各自之內部壓力進行檢測之壓力感測器 127a, 127b, 127c‧‧‧ Pressure sensors for detecting the internal pressure of each of the adsorption columns 102a, 102b, and 102c for reconcentration

141‧‧‧第3循環配管(循環流路) 141‧‧‧3rd cycle piping (circulating flow path)

142‧‧‧第2切換閥 142‧‧‧2nd switching valve

143‧‧‧第4循環配管(循環流路) 143‧‧‧4th cycle piping (circulating flow path)

144‧‧‧第2釋放用配管 144‧‧‧Second release piping

G1‧‧‧原料氦氣 G1‧‧‧ raw material helium

G2‧‧‧濃縮氦氣 G2‧‧‧ Concentrated helium

G3、G3'‧‧‧逸氣 G3, G3'‧‧‧ 逸气

G4‧‧‧處於減壓步驟之濃縮用吸附塔之內部氣體 G4‧‧‧ Internal gas of the adsorption tower for concentration in the depressurization step

G5‧‧‧處於解吸用均壓步驟之濃縮用吸附塔之內部氣體 G5‧‧‧ Internal gas in the adsorption tower for concentration in the depressurization pressure equalization step

G7‧‧‧再濃縮氦氣 G7‧‧‧ reconcentrated helium

G8、G8'‧‧‧逸氣 G8, G8'‧‧‧ 逸气

G9‧‧‧處於減壓步驟之再濃縮用吸附塔之內部氣體 G9‧‧‧ Internal gas for reconcentration adsorption tower in a depressurization step

G10‧‧‧處於解吸用均壓步驟之再濃縮用吸附塔之內部氣體 G10‧‧‧ Internal gas for the reconcentration adsorption tower in the depressurization pressure equalization step

α‧‧‧氦氣之純化系統 Α‧‧‧氦气的净化系统

圖1係本發明之實施形態之純化系統之構成說明圖。 Fig. 1 is a view showing the configuration of a purification system according to an embodiment of the present invention.

圖2係本發明之實施形態之第1變壓式吸附裝置之構成說明圖。 Fig. 2 is an explanatory view showing the configuration of a first pressure swing type adsorption apparatus according to an embodiment of the present invention.

圖3係本發明之實施形態之第2變壓式吸附裝置之構成說明圖。 Fig. 3 is an explanatory view showing the configuration of a second pressure swing type adsorption apparatus according to an embodiment of the present invention.

圖4係本發明之實施形態之純化系統之控制裝置之說明圖。 Fig. 4 is an explanatory view showing a control device of a purification system according to an embodiment of the present invention.

圖5係表示本發明之實施形態之第1變壓式吸附裝置之運轉狀態(a)~(i)的圖。 Fig. 5 is a view showing operational states (a) to (i) of the first pressure swing adsorption apparatus according to the embodiment of the present invention.

圖6係表示本發明之實施形態之第1變壓式吸附裝置之運轉狀態與各吸附塔中之純化處理步驟及開關閥之狀態的對應關係之圖。 Fig. 6 is a view showing the correspondence relationship between the operating state of the first pressure swing adsorption apparatus according to the embodiment of the present invention, the purification processing steps in each adsorption tower, and the state of the on-off valve.

圖7係表示本發明之實施形態之第2變壓式吸附裝置之運轉狀態(a)'~(i)'的圖。 Fig. 7 is a view showing an operation state (a) '~(i)' of a second pressure swing type adsorption apparatus according to an embodiment of the present invention.

圖8係表示本發明之實施形態之第2變壓式吸附裝置之運轉狀態與各吸附塔中之純化處理步驟及開關閥之狀態的對應關係之圖。 Fig. 8 is a view showing the correspondence relationship between the operating state of the second pressure swing adsorption apparatus according to the embodiment of the present invention, the purification processing steps in each adsorption tower, and the state of the on-off valve.

圖1所示之本發明之實施形態之氦氣之純化系統α具備用於對包含雜質氣體之原料氦氣G1進行純化之第1變壓式吸附裝置1與第2變壓式吸附裝置101。 The helium purification system α according to the embodiment of the present invention shown in FIG. 1 includes a first pressure swing adsorption device 1 and a second pressure swing adsorption device 101 for purifying the raw material helium G1 containing an impurity gas.

如圖2所示,第1變壓式吸附裝置1具有複數個濃縮用吸附塔2a、2b、2c。於本實施形態中,設置有第1~第3濃縮用吸附塔2a、2b、2c,於各濃縮用吸附塔2a、2b、2c之一端與另一端形成有氣體通過口2a'、2b'、2c'、2a"、2b"、2c"。 As shown in Fig. 2, the first pressure swing adsorption apparatus 1 has a plurality of adsorption towers 2a, 2b, and 2c for concentration. In the present embodiment, the first to third concentration adsorption columns 2a, 2b, and 2c are provided, and gas passage ports 2a' and 2b' are formed at one end and the other end of each of the concentration adsorption columns 2a, 2b, and 2c. 2c', 2a", 2b", 2c".

如圖3所示,第2變壓式吸附裝置101具有複數個再濃縮用吸附塔102a、102b、102c。於本實施形態中,設置有第1~第3再濃縮用吸附塔102a、102b、102c,於各再濃縮用吸附塔10102a、102b、102c之一端與另一端形成有氣體通過口102a'、102b'、102c'、102a"、102b"、102c"。 As shown in FIG. 3, the second pressure swing adsorption apparatus 101 has a plurality of adsorption towers 102a, 102b, and 102c for reconcentration. In the present embodiment, the first to third reconcentration adsorption columns 102a, 102b, and 102c are provided, and gas passage ports 102a' and 102b are formed at one end and the other end of each of the reconcentration adsorption columns 10102a, 102b, and 102c. ', 102c', 102a", 102b", 102c".

各吸附塔2a、2b、2c、102a、102b、102c內收納有優先於氦氣吸附雜質氣體之吸附劑。該吸附劑只要為可優先於氦氣吸附雜質氣體者則並無特別限定,例如可使用活性碳、合成沸石、碳分子篩、氧化鋁凝膠等。 Each of the adsorption towers 2a, 2b, 2c, 102a, 102b, and 102c houses an adsorbent that adsorbs impurity gas in preference to the helium gas. The adsorbent is not particularly limited as long as it can adsorb the impurity gas in preference to the helium gas. For example, activated carbon, synthetic zeolite, carbon molecular sieve, alumina gel or the like can be used.

如圖2所示,對濃縮用吸附塔2a、2b、2c各者連接原料氣體導入配管3、濃縮氣體配管4及第1逸氣配管5。 As shown in FIG. 2, the raw material gas introduction pipe 3, the concentrated gas pipe 4, and the first escape pipe 5 are connected to each of the concentration adsorption towers 2a, 2b, and 2c.

原料氣體導入配管3之一端與原料氦氣G1之供給源連接。例如將光纖製造裝置作為供給源。原料氣體導入配管3之另一端朝向第1~第3濃縮用吸附塔2a、2b、2c成為3個分支管並經由構成原料氣體導入路開關閥之第1~第3開關閥6a、6b、6c分別與濃縮用吸附塔2a、2b、2c各自之一端之氣體通過口2a'、2b'、2c'連接。藉此,原料氣體導入配管3構成用以向濃縮用吸附塔2a、2b、2c各者導入原料氦氣G1之原料氣體導入流路。又,藉由利用第1~第3開關閥6a、6b、6c對濃縮用吸 附塔2a、2b、2c各自與原料氣體導入流路之間個別地進行開關,可經由原料氣體導入流路向濃縮用吸附塔2a、2b、2c各者個別地導入原料氦氣G1。 One end of the material gas introduction pipe 3 is connected to a supply source of the raw material helium gas G1. For example, a fiber manufacturing device is used as a supply source. The other end of the raw material gas introduction pipe 3 is formed into three branch pipes toward the first to third concentration adsorption columns 2a, 2b, and 2c, and passes through the first to third on-off valves 6a, 6b, and 6c constituting the material gas introduction path switching valve. The gas passage ports 2a', 2b', and 2c' are connected to one end of each of the adsorption adsorption towers 2a, 2b, and 2c. In this way, the material gas introduction pipe 3 constitutes a material gas introduction flow path for introducing the raw material helium gas G1 to each of the concentration adsorption towers 2a, 2b, and 2c. Moreover, the suction for concentration is utilized by the first to third on-off valves 6a, 6b, and 6c. Each of the auxiliary towers 2a, 2b, and 2c is individually and electrically connected to the raw material gas introduction flow path, and the raw material argon gas G1 can be individually introduced into each of the concentration adsorption towers 2a, 2b, and 2c via the raw material gas introduction flow path.

原料氦氣G1為氦氣與雜質氣體之混合氣體。向濃縮用吸附塔2a、2b、2c各者所導入之原料氦氣G1更佳為氦濃度為1vol%以上。於本實施形態中自供給源所供給之稀薄氦氣係選擇為濃度、流量變動者。原料氦氣G1例如為包含空氣作為雜質氣體之稀薄氦氣,氦濃度為5vol%時空氣濃度為95vol%,氦濃度於1~20vol%間變動,氦氣流量於10~100Nm3/h間變動。 The raw material helium G1 is a mixed gas of helium gas and impurity gas. The raw material helium gas G1 introduced into each of the concentration adsorption columns 2a, 2b, and 2c is preferably a cerium concentration of 1 vol% or more. In the present embodiment, the lean helium gas supplied from the supply source is selected as the concentration and flow rate change. The raw material helium gas G1 is, for example, a thin helium gas containing air as an impurity gas, the air concentration is 95 vol% when the cerium concentration is 5 vol%, the cerium concentration is varied between 1 and 20 vol%, and the helium gas flow rate is varied between 10 and 100 Nm 3 /h. .

濃縮氣體配管4之一端朝向第1~第3濃縮用吸附塔2a、2b、2c成為3個分支管並經由構成濃縮氣體路開關閥之第4~第6開關閥7a、7b、7c分別與濃縮用吸附塔2a、2b、2c各自之另一端之氣體通過口2a"、2b"、2c"連接。濃縮氣體配管4之另一端成為濃縮氦氣G2之出口,與第2變壓式吸附裝置101連接。藉此,濃縮氣體配管4構成用以自濃縮用吸附塔2a、2b、2c各者排出濃縮氦氣G2之濃縮氣體流路。又,藉由利用第4~第6開關閥7a、7b、7c對濃縮用吸附塔2a、2b、2c各自與濃縮氣體流路之間個別地進行開關,可自濃縮用吸附塔2a、2b、2c各者個別地排出濃縮氦氣G2。經由濃縮氣體配管4所排出之濃縮氦氣G2被送至第2變壓式吸附裝置101內。 One end of the concentrated gas pipe 4 is turned into three branch pipes toward the first to third concentration adsorption columns 2a, 2b, and 2c, and is concentrated by the fourth to sixth on-off valves 7a, 7b, and 7c constituting the concentrated gas path switching valve. The gas at the other end of each of the adsorption towers 2a, 2b, and 2c is connected through the ports 2a", 2b", and 2c". The other end of the concentrated gas pipe 4 becomes an outlet of the concentrated helium gas G2, and the second pressure swing type adsorption device 101 In this way, the concentrated gas pipe 4 constitutes a concentrated gas flow path for discharging the concentrated helium gas G2 from each of the adsorption adsorption towers 2a, 2b, and 2c. Further, by using the fourth to sixth on-off valves 7a and 7b 7c, the respective adsorption towers 2a, 2b, and 2c for concentration are individually and separately switched between the concentration gas channels, and the concentrated helium gas G2 can be separately discharged from each of the adsorption adsorption towers 2a, 2b, and 2c. The discharged concentrated helium gas G2 is sent to the second pressure swing type adsorption device 101.

於濃縮氣體配管4之另一端設置有背壓調節用之第1壓力調節閥26a,而可將濃縮用吸附塔2a、2b、2c各自中之內部壓力調節為對吸附步驟所預先設定之吸附壓力。 The other end of the concentrated gas pipe 4 is provided with a first pressure regulating valve 26a for adjusting the back pressure, and the internal pressure in each of the concentration adsorption columns 2a, 2b, and 2c can be adjusted to a predetermined adsorption pressure for the adsorption step. .

第1逸氣配管5之一端朝向第1~第3濃縮用吸附塔2a、2b、2c成為3個分支管並經由構成第1逸氣路開關閥之第7~第9開關閥8a、8b、8c分別與濃縮用吸附塔2a、2b、2c各自之一端之氣體通過口2a'、2b'、2c'連接。第1逸氣配管5之另一端成為逸氣G3、G3'之出口。又,對與 第1逸氣配管5連接之第1循環配管41設置有背壓調節用之第2壓力調節閥26b,而可調節吸附塔2a、2b、2c各自中之內部壓力以使解吸步驟中逸氣G3、G3'具有預先設定之壓力。藉此,第1逸氣配管5構成用以自濃縮用吸附塔2a、2b、2c各者排出逸氣G3、G3'之第1逸氣流路。又,藉由利用第7~第9開關閥8a、8b、8c對濃縮用吸附塔2a、2b、2c各自與第1逸氣流路之間個別地進行開關,可自濃縮用吸附塔2a、2b、2c各者個別地排出逸氣G3、G3'。 One of the first outflow pipes 5 is formed into three branch pipes toward the first to third concentration adsorption towers 2a, 2b, and 2c, and passes through the seventh to ninth on-off valves 8a and 8b that constitute the first escape valve. 8c is connected to the gas passage ports 2a', 2b', 2c' at one end of each of the adsorption adsorption towers 2a, 2b, 2c. The other end of the first escape pipe 5 serves as an outlet for the outgassing G3 and G3'. Again, right The first circulation pipe 41 to which the first escape pipe 5 is connected is provided with a second pressure regulating valve 26b for adjusting the back pressure, and the internal pressure in each of the adsorption towers 2a, 2b, 2c can be adjusted to make the escape gas G3 in the desorption step. , G3' has a preset pressure. Thereby, the first escape pipe 5 constitutes a first escape flow path for discharging the outgass G3 and G3' from each of the adsorption adsorption towers 2a, 2b, and 2c. In addition, by separately switching between the concentration adsorption columns 2a, 2b, and 2c and the first flow path by the seventh to ninth on-off valves 8a, 8b, and 8c, the adsorption columns 2a and 2b can be self-concentrated. Each of 2c and 2c discharges the outgassing G3 and G3' individually.

設置有第1連通配管9,其構成用以使濃縮用吸附塔2a、2b、2c中之某個塔與另外某個塔相互連通之第1連通流路。第1連通配管9具有第1連通部9a、第2連通部9b及第3連通部9c。第1連通部9a之一端朝向第1~第3濃縮用吸附塔2a、2b、2c成為3個分支管並經由構成第1連通路開關閥之第10~第12開關閥10a、10b、10c分別與濃縮用吸附塔2a、2b、2c各自之另一端之氣體通過口2a"、2b"、2c"連接。第2連通部9b之一端朝向第1~第3濃縮用吸附塔2a、2b、2c成為3個分支管並經由構成第1連通路開關閥之第13~第15開關閥11a、11b、11c分別與濃縮用吸附塔2a、2b、2c各自之另一端之氣體通過口2a"、2b"、2c"連接。第1連通部9a之另一端與第2連通部9b之另一端經由構成第1連通路開關閥之第16開關閥12及構成對第1連通流路中流通之氣體流量進行調節之流量控制閥的第1流量控制閥13而相互連接。第3連通部9c之一端經由構成第1連通路開關閥之第17開關閥14及構成對第1連通流路中流通之氣體流量進行調節之流量控制閥的第2流量控制閥15而與第1連通部9a及第2連通部9b連接。第3連通部9c之另一端與濃縮氣體配管4連接。藉此,藉由對濃縮用吸附塔2a、2b、2c各自與第1連通流路之間個別地進行開關,可將濃縮用吸附塔2a、2b、2c中之某個塔與另外某個塔間之狀態於相互間打開而相互連通之狀態與相互間閉鎖而未連通之狀態間切換。 The first communication pipe 9 is provided, and constitutes a first communication flow path for allowing one of the concentration adsorption towers 2a, 2b, and 2c to communicate with another tower. The first communication pipe 9 has a first communication portion 9a, a second communication portion 9b, and a third communication portion 9c. One end of the first communication portion 9a is formed as three branch pipes toward the first to third concentration adsorption towers 2a, 2b, and 2c, and is connected to the tenth to twelfth switch valves 10a, 10b, and 10c that constitute the first communication path switching valve. The gas passage ports 2a", 2b", and 2c" are connected to the other ends of the adsorption columns 2a, 2b, and 2c for concentration. One end of the second communication portion 9b faces the first to third concentration adsorption columns 2a, 2b, and 2c. The three branch pipes are connected to the gas passage ports 2a" and 2b of the other ends of the concentration adsorption towers 2a, 2b, and 2c via the thirteenth to fifteenth on-off valves 11a, 11b, and 11c constituting the first communication path switching valve. ", 2c" connection. The other end of the first communication portion 9a and the other end of the second communication portion 9b pass through the 16th on-off valve 12 constituting the first communication passage opening and closing valve and a flow rate control valve that regulates the flow rate of the gas flowing through the first communication passage. The first flow control valve 13 is connected to each other. One end of the third communication portion 9c is connected to the first flow control valve 15 that constitutes the first on-off valve of the first communication passage and the second flow control valve 15 that constitutes the flow control valve that regulates the flow rate of the gas flowing through the first communication passage. The 1 communication portion 9a and the second communication portion 9b are connected. The other end of the third communication portion 9c is connected to the concentrated gas pipe 4. By individually switching between the concentration adsorption columns 2a, 2b, and 2c and the first communication channel, one of the concentration adsorption columns 2a, 2b, and 2c can be connected to another column. The states of the states are switched between the states in which they are opened and connected to each other and the states in which they are locked and not connected.

如圖3所示,對再濃縮用吸附塔102a、102b、102c各者連接濃縮氣體導入配管103、再濃縮氣體配管104及第2逸氣配管105。 As shown in FIG. 3, the concentrated gas introduction pipe 103, the reconcentrated gas pipe 104, and the second escape pipe 105 are connected to each of the reconcentration adsorption towers 102a, 102b, and 102c.

濃縮氣體導入配管103之一端經由第1壓力調節閥26a與濃縮氣體配管4之另一端連接。濃縮氣體導入配管103之另一端朝向第1~第3再濃縮用吸附塔102a、102b、102c成為3個分支管並經由構成濃縮氣體導入路開關閥之第18~第20開關閥106a、106b、106c與再濃縮用吸附塔102a、102b、102c各自之一端之氣體通過口102a'、102b'、102c'連接。藉此,濃縮氣體導入配管103構成用以向再濃縮用吸附塔102a、102b、102c各者導入濃縮氦氣G2之濃縮氣體導入流路。即,對用以自第1變壓式吸附裝置1內排出濃縮氦氣G2之濃縮氣體流路連接用以向第2變壓式吸附裝置101之再濃縮用吸附塔102a、102b、102c各者導入濃縮氦氣G2之濃縮氣體導入流路。又,藉由利用第18~第20開關閥106a、106b、106c對再濃縮用吸附塔102a、102b、102c各自與濃縮氣體導入流路之間個別地進行開關,可經由濃縮氣體導入流路向再濃縮用吸附塔102a、102b、102c各者個別地導入濃縮氦氣G2。 One end of the concentrated gas introduction pipe 103 is connected to the other end of the concentrated gas pipe 4 via the first pressure regulating valve 26a. The other end of the concentrated gas introduction pipe 103 is turned into three branch pipes toward the first to third reconcentration adsorption columns 102a, 102b, and 102c, and passes through the 18th to 20th on-off valves 106a and 106b constituting the concentrated gas introduction path switching valve. 106c is connected to the gas passage ports 102a', 102b', 102c' at one end of each of the reconcentration adsorption columns 102a, 102b, 102c. Thereby, the concentrated gas introduction pipe 103 constitutes a concentrated gas introduction flow path for introducing the concentrated helium gas G2 to each of the reconcentration adsorption towers 102a, 102b, and 102c. In other words, each of the adsorption towers 102a, 102b, and 102c for reconcentration for the second pressure swing adsorption device 101 is connected to the concentrated gas flow path for discharging the concentrated helium gas G2 from the first pressure swing adsorption device 1. The concentrated gas introduction channel of the concentrated helium G2 is introduced. Further, by the 18th to 20th on-off valves 106a, 106b, and 106c, the reconcentration adsorption towers 102a, 102b, and 102c are individually and individually switched between the adsorption gas introduction channels 102a, 102b, and 102c, and can be introduced into the flow path via the concentrated gas. The concentrated helium gas G2 is individually introduced into each of the adsorption adsorption towers 102a, 102b, and 102c.

再濃縮氣體配管104之一端朝向第1~第3再濃縮用吸附塔102a、102b、102c成為3個分支管並經由構成再濃縮氣體路開關閥之第21~第23開關閥107a、107b、107c與再濃縮用吸附塔102a、102b、102c各自之另一端之氣體通過口102a"、102b"、102c"連接。再濃縮氣體配管104之另一端成為再濃縮氦氣G7之出口。藉此,再濃縮氣體配管104構成用以自再濃縮用吸附塔102a、102b、102c各者排出再濃縮氦氣G7之再濃縮氣體流路。又,藉由利用第21~第23開關閥107a、107b、107c對再濃縮用吸附塔102a、102b、102c各自與再濃縮氣體流路之間個別地進行開關,可自再濃縮用吸附塔102a、102b、102c各者個別地排出再濃縮氦氣G7而回收。所回收之再濃縮氦氣G7之用途並無限定。 One end of the re-concentrated gas pipe 104 is turned into three branch pipes toward the first to third re-concentration adsorption towers 102a, 102b, and 102c, and passes through the 21st to 23rd on-off valves 107a, 107b, 107c constituting the reconcentrated gas path switching valve. The other end of each of the adsorption columns 102a, 102b, and 102c for reconcentration is connected to the gas passage ports 102a", 102b", and 102c". The other end of the reconcentration gas pipe 104 becomes an outlet for reconcentrating the helium gas G7. The concentrated gas pipe 104 constitutes a reconcentrated gas flow path for discharging the reconcentrated helium G7 from each of the adsorption towers 102a, 102b, and 102c for reconcentration. Further, by using the 21st to 23th on-off valves 107a, 107b, 107c Each of the reconcentration adsorption columns 102a, 102b, and 102c is individually and selectively switched between the reconcentration gas channels, and the reconcentration helium gas G7 can be separately discharged from the reconcentration adsorption columns 102a, 102b, and 102c. The use of the recovered reconcentrated helium G7 is not limited.

於再濃縮氣體配管104之另一端設置有背壓調節用之第3壓力調節閥126a,再濃縮氣體配管104之出口經由第3壓力調節閥126a與再濃縮氦氣G7之回收區域連通。再濃縮氦氣G7之回收區域之壓力被設為低於吸附壓力,根據所回收之再濃縮氦氣G7之用途而設定所需壓力。例如將貯存所回收之再濃縮氦氣G7之特定容器之內部或所回收之再濃縮氦氣G7經由再濃縮氣體流路直接被供給之氦氣使用設備之內部作為回收區域。藉由第3壓力調節閥126a,可將再濃縮用吸附塔102a、102b、102c各自中之內部壓力調節為對吸附步驟所預先設定之吸附壓力。 The third pressure regulating valve 126a for back pressure adjustment is provided at the other end of the reconcentrated gas pipe 104, and the outlet of the reconcentrated gas pipe 104 communicates with the recovery region of the reconcentrated helium gas G7 via the third pressure regulating valve 126a. The pressure in the recovery zone of the reconcentrated helium G7 is set to be lower than the adsorption pressure, and the required pressure is set according to the use of the recovered reconcentrated helium G7. For example, the inside of the specific container in which the recovered reconcentrated helium G7 is stored or the recovered reconcentrated helium G7 directly supplied through the reconcentrated gas flow path is used as a recovery area. By the third pressure regulating valve 126a, the internal pressure in each of the reconcentrating adsorption towers 102a, 102b, and 102c can be adjusted to the adsorption pressure set in advance for the adsorption step.

第2逸氣配管105之一端朝向第1~第3再濃縮用吸附塔102a、102b、102c成為3個分支管並經由構成第2逸氣路開關閥之第24~第26開關閥108a、108b、108c與再濃縮用吸附塔102a、102b、102c各自之一端之氣體通過口102a'、102b'、102c'連接。第2逸氣配管105之另一端成為逸氣G8、G8'之出口。又,對與第2逸氣配管105連接之第3循環配管141設置有背壓調節用之第4壓力調節閥126b,而可調節吸附塔102a、102b、102c各自中之內部壓力以使解吸步驟中逸氣G8、G8'具有預先設定之壓力。藉此,第2逸氣配管105構成用以自再濃縮用吸附塔102a、102b、102c各者排出逸氣G8、G8'之第2逸氣流路。又,藉由利用第24~第26開關閥108a、108b、108c對再濃縮用吸附塔102a、102b、102c各自與第2逸氣流路之間個別地進行開關,可自再濃縮用吸附塔102a、102b、102c各者個別地排出逸氣G8、G8'。 One end of the second outflow pipe 105 is turned into three branch pipes toward the first to third reconcentration adsorption towers 102a, 102b, and 102c, and passes through the 24th to 26th on-off valves 108a and 108b that constitute the second escape pipe switching valve. And 108c is connected to the gas passage ports 102a', 102b', and 102c' at one end of each of the adsorption columns 102a, 102b, and 102c for reconcentration. The other end of the second escape pipe 105 serves as an outlet for the outgassing G8 and G8'. Further, the third circulation pipe 141 connected to the second escape pipe 105 is provided with a fourth pressure regulating valve 126b for adjusting the back pressure, and the internal pressure in each of the adsorption towers 102a, 102b, and 102c can be adjusted to desorb the step. Zhongyiqi G8, G8' have a preset pressure. Thereby, the second outgas pipe 105 constitutes a second escape flow path for discharging the outgass G8 and G8' from each of the adsorption towers 102a, 102b, and 102c for reconcentration. Further, by the 24th to 26th on-off valves 108a, 108b, and 108c, the re-concentration adsorption towers 102a, 102b, and 102c are individually and electrically switched between the second and the second flow paths, and the self-reconcentration adsorption tower 102a can be used. Each of 102b, 102c individually discharges outgassing G8, G8'.

設置有第2連通配管109,其構成用以使再濃縮用吸附塔102a、102b、102c中之某個塔與另外某個塔相互連通之第2連通流路。第2連通配管109具有第1再濃縮用連通部109a、第2再濃縮用連通部109b及第3再濃縮用連通部109c。第1再濃縮用連通部109a之一端朝向第1~第3再濃縮用吸附塔102a、102b、102c成為3個分支管並經由構成第2 連通路開關閥之第27~第29開關閥110a、110b、110c與再濃縮用吸附塔102a、102b、102c各自之另一端之氣體通過口102a"、102b"、102c"連接。第2再濃縮用連通部109b之一端朝向第1~第3再濃縮用吸附塔102a、102b、102c成為3個分支管並經由構成第2連通路開關閥之第30~第32開關閥111a、111b、111c與再濃縮用吸附塔102a、102b、102c各自之另一端之氣體通過口102a"、102b"、102c"連接。第1再濃縮用連通部109a之另一端與第2再濃縮用連通部9b之另一端經由構成第2連通路開關閥之第33開關閥112及構成對第2連通流路中所流通之氣體流量進行調節之流量控制閥的第3流量控制閥113而相互連接。第3再濃縮用連通部109c之一端經由構成第2連通路開關閥之第34開關閥114及構成對第2連通流路中所流通之氣體流量進行調節之流量控制閥的第4流量控制閥115而與第1連通部109a及第2連通部109b連接。第3再濃縮用連通部109c之另一端與再濃縮氣體配管104連接。藉此,藉由對再濃縮用吸附塔102a、102b、102c各自與第2連通流路之間個別地進行開關,可將再濃縮用吸附塔102a、102b、102c中之某個塔與另外某個塔間之狀態於相互間打開而相互連通之狀態與相互間閉鎖而未連通之狀態間切換。 The second communication pipe 109 is provided, and constitutes a second communication flow path for allowing one of the reconcentration adsorption towers 102a, 102b, and 102c to communicate with another tower. The second communication pipe 109 has a first reconcentration communication portion 109a, a second reconcentration communication portion 109b, and a third reconcentration communication portion 109c. One end of the first re-concentration communication portion 109a is directed to the first to third re-concentration adsorption towers 102a, 102b, and 102c to form three branch pipes and constitute the second The 27th to 29th on-off valves 110a, 110b, and 110c of the communication path switching valve are connected to the gas passage ports 102a", 102b", and 102c" at the other ends of the reconcentration adsorption towers 102a, 102b, and 102c. One of the communication portions 109b is turned into three branch pipes toward the first to third reconcentration adsorption towers 102a, 102b, and 102c, and is connected to the 30th to 32nd switch valves 111a, 111b, and 111c that constitute the second communication path switching valve. The gas at the other end of each of the adsorption-concentrating adsorption towers 102a, 102b, and 102c is connected to the gas passage ports 102a", 102b", and 102c". The other end of the first re-concentration communication portion 109a and the other end of the second re-concentration communication portion 9b pass through the 33rd on-off valve 112 constituting the second communication passage opening and closing valve and constitute a gas flowing through the second communication passage. The third flow rate control valve 113 of the flow rate control valve whose flow rate is adjusted is connected to each other. The fourth flow control valve of the flow control valve that regulates the flow rate of the gas flowing through the second communication passage is connected to one end of the third reconcentration communication portion 109c via the 34th on-off valve 114 that constitutes the second communication passage opening and closing valve 115 is connected to the first communication portion 109a and the second communication portion 109b. The other end of the third re-concentration communicating portion 109c is connected to the re-concentrated gas pipe 104. By individually switching between the reconcentration adsorption columns 102a, 102b, and 102c and the second communication channel, one of the reconcentration adsorption columns 102a, 102b, and 102c can be connected to another column. The state between the towers is switched between the states in which they are opened and connected to each other and the states in which they are locked and not connected.

第1~第34開關閥6a、6b、6c、7a、7b、7c、8a、8b、8c、10a、10b、10c、11a、11b、11c、12、14、106a、106b、106c、107a、107b、107c、108a、108b、108c、110a、110b、110c、111a、111b、111c、112、114分別由公知之自動閥構成,藉此具有用以使閥作動之螺線管、馬達等開關用致動器。如圖4所示,各開關閥藉由與構成純化系統α之控制裝置20連接而由控制裝置20進行控制,從而可個別地執行開關動作。控制裝置20可由電腦構成。 First to 34th on-off valves 6a, 6b, 6c, 7a, 7b, 7c, 8a, 8b, 8c, 10a, 10b, 10c, 11a, 11b, 11c, 12, 14, 106a, 106b, 106c, 107a, 107b 107c, 108a, 108b, 108c, 110a, 110b, 110c, 111a, 111b, 111c, 112, 114 are respectively formed by a known automatic valve, thereby having a switch for a solenoid or a motor for actuating the valve. Actuator. As shown in FIG. 4, each of the on-off valves is controlled by the control device 20 by being connected to the control device 20 constituting the purification system α, so that the switching operation can be individually performed. The control device 20 can be constituted by a computer.

第1~第4流量控制閥13、15、113、115分別由公知之自動閥構成,藉此具有用以使閥作動之馬達等流量調節用致動器。如圖4所 示,各流量控制閥藉由與控制裝置20連接而由控制裝置20進行控制,從而可個別地執行流量調節動作。第1~第4壓力調節閥26a、26b、126a、126b分別由公知之自動閥構成,藉此具有用以使閥作動之馬達等壓力調節用致動器。如圖4所示,各壓力調節閥26a、26b、126a、126b藉由與控制裝置20連接而由控制裝置20進行控制,從而可個別地執行壓力調節動作。 Each of the first to fourth flow control valves 13, 15, 113, and 115 is constituted by a known automatic valve, and has a flow rate adjusting actuator such as a motor for actuating the valve. As shown in Figure 4 It is shown that each flow control valve is controlled by the control device 20 by being connected to the control device 20, so that the flow rate adjustment operation can be performed individually. Each of the first to fourth pressure regulating valves 26a, 26b, 126a, and 126b is constituted by a known automatic valve, and has a pressure adjusting actuator such as a motor for actuating the valve. As shown in FIG. 4, each of the pressure regulating valves 26a, 26b, 126a, and 126b is controlled by the control device 20 by being connected to the control device 20, so that the pressure regulating operation can be performed individually.

對原料氣體導入配管3設置有對自供給源所供給之原料氦氣G1之流量進行檢測之第1流量感測器21,暫時貯存原料氦氣G1之原料氣體用緩衝槽22,緩衝槽22之貯藏量測定用感測器22a,壓縮機23,對導入至濃縮用吸附塔2a、2b、2c內之原料氦氣G1之氦濃度進行檢測之第1濃度感測器24,及自原料氣體導入配管3向各濃縮用吸附塔2a、2b、2c內導入之原料氦氣G1之流量調節用之第3流量控制閥25。將緩衝槽22內壓力設為低於處於解吸步驟末期及清洗步驟末期之各吸附塔2a、2b、2c、102a、102b、102c之內部壓力且為大氣壓以上。壓縮機23係抽吸原料氦氣G1直至壓力升至預先設定之壓力。第3流量控制閥25係由公知之自動閥構成,藉此具有用以使閥作動之馬達等流量調節用致動器。 The raw material gas introduction pipe 3 is provided with a first flow rate sensor 21 that detects the flow rate of the raw material helium gas G1 supplied from the supply source, and temporarily stores the raw material gas buffer tank 22 of the raw material helium gas G1, and the buffer tank 22 The storage amount measuring sensor 22a, the compressor 23, and the first concentration sensor 24 for detecting the enthalpy concentration of the raw material krypton G1 introduced into the concentration adsorption columns 2a, 2b, and 2c, and the raw material gas are introduced. The third flow rate control valve 25 for adjusting the flow rate of the raw material helium gas G1 introduced into the respective adsorption adsorption towers 2a, 2b, and 2c. The pressure in the buffer tank 22 is set to be lower than the internal pressure of each of the adsorption towers 2a, 2b, 2c, 102a, 102b, and 102c at the end of the desorption step and the end of the washing step, and is equal to or higher than atmospheric pressure. The compressor 23 draws the raw material helium gas G1 until the pressure rises to a predetermined pressure. The third flow rate control valve 25 is constituted by a known automatic valve, and has a flow rate adjusting actuator such as a motor for actuating the valve.

對濃縮氣體導入配管103設置有暫時貯存自第1變壓式吸附裝置1所排出之濃縮氦氣G2的濃縮氣體用緩衝槽122、對導入至第2變壓式吸附裝置101內之濃縮氦氣G2之流量進行測定之第2流量感測器121、對濃縮氦氣G2之氦濃度進行檢測之第2濃度感測器124。 The concentrated gas introduction pipe 103 is provided with a concentrated gas buffer tank 122 for temporarily storing the concentrated helium gas G2 discharged from the first pressure swing type adsorption device 1, and a concentrated helium gas introduced into the second pressure swing type adsorption device 101. The second flow rate sensor 121 that measures the flow rate of G2 and the second concentration sensor 124 that detects the enthalpy concentration of the concentrated helium gas G2.

對第1逸氣配管5連接第1循環配管41之一端,第1循環配管41之另一端與第1切換閥42連接。第1切換閥42係與第2循環配管43之一端及第1釋放用配管44之一端連接。第2循環配管43之另一端與原料氣體用緩衝槽22連接,第1釋放用配管44之另一端通向大氣壓下之常壓空間。藉此,藉由第1切換閥42將第1逸氣流路之狀態於通向緩衝槽22之 狀態與經由第1釋放用配管44通向常壓空間之狀態間切換。又,藉由第1切換閥42將第1循環配管41之狀態於與第2循環配管43連通之狀態及與第1釋放用配管44連通之狀態間切換。再者,亦可省略第1切換閥42、第1釋放用配管44而使第1循環配管41與第2循環配管43始終處於連接狀態。 One end of the first circulation pipe 41 is connected to the first escape pipe 5, and the other end of the first circulation pipe 41 is connected to the first switching valve 42. The first switching valve 42 is connected to one end of the second circulation pipe 43 and one end of the first release pipe 44. The other end of the second circulation pipe 43 is connected to the material gas buffer tank 22, and the other end of the first release pipe 44 is opened to the atmospheric pressure space under atmospheric pressure. Thereby, the state of the first escape flow path is made to the buffer tank 22 by the first switching valve 42. The state is switched between the state in which the first release pipe 44 is led to the normal pressure space. In addition, the state of the first circulation pipe 41 is switched between the state in which the first circulation pipe 41 is in communication with the second circulation pipe 43 and the state in which the first release pipe 44 is in communication with each other. In addition, the first switching valve 42 and the first release pipe 44 may be omitted, and the first circulation pipe 41 and the second circulation pipe 43 may be always connected.

又,對第2逸氣配管105連接第3循環配管141之一端,第3循環配管141之另一端與第2切換閥142連接。第2切換閥142係與第4循環配管143之一端及第2釋放用配管144之一端連接。第4循環配管143之另一端經由第2循環配管43與原料氣體用緩衝槽22連接,第2釋放用配管144之另一端通向大氣壓下之常壓空間。藉此,藉由第2切換閥142將第2逸氣流路之狀態於通向緩衝槽22之狀態與經由第2釋放用配管144通向常壓空間之狀態間切換。又,藉由第2切換閥42將第3循環配管141之狀態於與第4循環配管143連通之狀態及與第2釋放用配管144連通之狀態間切換。再者,亦可省略第2切換閥142、第2釋放用配管144而使第3循環配管141與第4循環配管143始終處於連接狀態。 Further, one end of the third circulation pipe 141 is connected to the second escape pipe 105, and the other end of the third circulation pipe 141 is connected to the second switching valve 142. The second switching valve 142 is connected to one end of the fourth circulation pipe 143 and one end of the second release pipe 144. The other end of the fourth circulation pipe 143 is connected to the material gas buffer tank 22 via the second circulation pipe 43, and the other end of the second release pipe 144 is opened to the atmospheric pressure space under atmospheric pressure. By the second switching valve 142, the state of the second airflow path is switched between the state in which it flows to the buffer tank 22 and the state which passes through the second release pipe 144 to the normal pressure space. In addition, the state of the third circulation pipe 141 is switched between the state in which the third circulation pipe 141 is in communication with the fourth circulation pipe 143 and the state in which the second release pipe 144 is in communication. In addition, the second switching valve 142 and the second release pipe 144 may be omitted, and the third circulation pipe 141 and the fourth circulation pipe 143 may be always connected.

第1~第4循環配管41、43、141、143構成使第1逸氣流路及第2逸氣流路經由原料氣體用緩衝槽22而與原料氣體導入流路連接之循環流路。再者,亦可僅使第1逸氣流路與第2逸氣流路中之一者通過循環流路而與原料氣體導入流路連接,使另一者不與原料氣體導入流路連接而與常壓空間連接。藉此,可對原料氦氣G1混入自第1變壓式吸附裝置1與第2變壓式吸附裝置101中之至少一者所排出之逸氣。即,逸氣G3、G3'、G8、G8'可被釋放至常壓空間中,亦可經由原料氣體用緩衝槽22而循環至原料氣體導入流路中。 The first to fourth circulation pipes 41, 43, 141, and 143 constitute a circulation flow path that connects the first air flow path and the second air flow path to the material gas introduction flow path via the material gas buffer tank 22. Further, only one of the first escape flow path and the second escape flow path may be connected to the material gas introduction flow path through the circulation flow path, and the other may not be connected to the material gas introduction flow path. Pressure space connection. Thereby, the raw material helium G1 can be mixed into the outgas discharged from at least one of the first pressure swing adsorption device 1 and the second pressure swing adsorption device 101. In other words, the outgassing G3, G3', G8, and G8' can be released into the atmospheric pressure space, or can be circulated into the raw material gas introduction flow path via the raw material gas buffer tank 22.

如圖4所示,將第1流量感測器21、貯藏量測定用感測器22a、第1濃度感測器24、第3流量控制閥25、第2流量感測器121、第2濃度感測器124連接於控制裝置20。又,對控制裝置20連接有對濃縮用吸附塔 2a、2b、2c各自之內部壓力進行檢測之壓力感測器27a、27b、27c,對再濃縮用吸附塔102a、102b、102c各自之內部壓力進行檢測之壓力感測器127a、127b、127c,鍵盤等輸入裝置28,顯示器等輸出裝置29。 As shown in FIG. 4, the first flow rate sensor 21, the storage amount measuring sensor 22a, the first concentration sensor 24, the third flow rate control valve 25, the second flow rate sensor 121, and the second concentration are shown. The sensor 124 is connected to the control device 20. Further, a control tower 20 is connected to the adsorption tower for concentration Pressure sensors 27a, 27b, and 27c for detecting the internal pressure of each of 2a, 2b, and 2c, and pressure sensors 127a, 127b, and 127c for detecting the internal pressure of each of the adsorption columns 102a, 102b, and 102c for reconcentration, An input device 28 such as a keyboard, and an output device 29 such as a display.

藉由將原料氦氣G1暫時貯存於原料氣體用緩衝槽22內,可緩和原料氦氣G1之組成變動。緩衝槽22較佳為由根據貯藏氣體量而變形之氣球構成。又,藉由根據來自控制裝置20之信號控制第3流量控制閥25而執行流量調節動作,從而調節向各濃縮用吸附塔2a、2b、2c內導入之原料氦氣G1之流量。藉此,將向各濃縮用吸附塔2a、2b、2c內導入之原料氦氣G1之流量控制為通常情況下與流量感測器21之檢測流量一致。於由感測器22a所檢測出之緩衝槽22之貯藏氣體量超過上限設定值時,使向各濃縮用吸附塔2a、2b、2c內導入之原料氦氣G1之流量大於流量感測器21之檢測流量以減小貯藏氣體量。於由壓力感測器23所檢測出之緩衝槽22之貯藏氣體量未達下限設定值時,使向各濃縮用吸附塔2a、2b、2c內導入之原料氦氣G1之流量小於流量感測器21之檢測流量以增大貯藏氣體量。 By temporarily storing the raw material helium G1 in the raw material gas buffer tank 22, the composition fluctuation of the raw material helium G1 can be alleviated. The buffer tank 22 is preferably constituted by a balloon that is deformed in accordance with the amount of stored gas. Further, by controlling the third flow rate control valve 25 based on the signal from the control device 20, the flow rate adjustment operation is performed to adjust the flow rate of the raw material helium gas G1 introduced into each of the concentration adsorption towers 2a, 2b, and 2c. Thereby, the flow rate of the raw material helium gas G1 introduced into each of the concentration adsorption towers 2a, 2b, and 2c is controlled so as to normally match the detected flow rate of the flow rate sensor 21. When the amount of stored gas in the buffer tank 22 detected by the sensor 22a exceeds the upper limit set value, the flow rate of the raw material helium gas G1 introduced into each of the concentration adsorption towers 2a, 2b, and 2c is larger than that of the flow rate sensor 21 The flow rate is detected to reduce the amount of stored gas. When the amount of stored gas in the buffer tank 22 detected by the pressure sensor 23 does not reach the lower limit set value, the flow rate of the raw material helium gas G1 introduced into each of the concentration adsorption towers 2a, 2b, and 2c is smaller than the flow rate sensing. The flow rate of the detector 21 is increased to increase the amount of stored gas.

藉由將濃縮氦氣G2暫時貯存於濃縮氣體用緩衝槽122內,可緩和濃縮氦氣G2之組成變動。 By temporarily storing the concentrated helium G2 in the buffer tank 122 for concentrated gas, the composition fluctuation of the concentrated helium G2 can be alleviated.

為了使用第1變壓式吸附裝置1與第2變壓式吸附裝置101對原料氦氣G1進行純化,向濃縮用吸附塔2a、2b、2c各者依序導入原料氦氣G1。於濃縮用吸附塔2a、2b、2c各自中,反覆進行依序實行複數個濃縮用純化處理步驟之濃縮用純化處理循環。又,向再濃縮用吸附塔102a、102b、102c各者依序導入自第1變壓式吸附裝置1所排出之濃縮氦氣G2。於再濃縮用吸附塔102a、102b、102c各自中,反覆進行依序實行複數個再濃縮用純化處理步驟之再濃縮用純化處理循環。 In order to purify the raw material helium gas G1 by using the first pressure swing type adsorption device 1 and the second pressure swing type adsorption device 101, the raw material helium gas G1 is sequentially introduced into each of the concentration adsorption towers 2a, 2b, and 2c. In each of the adsorption adsorption towers 2a, 2b, and 2c for concentration, a plurality of purification treatment cycles for concentration-concentration purification steps are sequentially performed in sequence. In addition, the concentrated helium gas G2 discharged from the first pressure swing adsorption device 1 is sequentially introduced into each of the adsorption columns 102a, 102b, and 102c for reconcentration. Each of the adsorption columns 102a, 102b, and 102c for reconcentration is repeatedly subjected to a purification treatment cycle in which a plurality of reconcentration purification steps are sequentially performed by reconcentration.

於第1變壓式吸附裝置1中依序實行構成濃縮用純化處理循環中 之1個循環的複數個濃縮用純化處理步驟,即吸附步驟、減壓步驟、解吸用均壓步驟、解吸步驟、清洗步驟、升壓用均壓步驟及升壓步驟。關於各濃縮用純化處理步驟之實行時間,只要根據所需之濃縮氦氣G2之純度或回收率,預先經過實驗求解而設定即可。濃縮用吸附塔2a、2b、2c各自中之純化處理步驟之實行時序互不相同。藉此,於第1變壓式吸附裝置1中,如圖5所示,依序具體呈現濃縮用吸附塔2a、2b、2c各自中之濃縮用純化處理步驟互不相同之運轉狀態(a)~(i),連續地排出濃縮氦氣G2。圖5中之箭頭表示氣體之流動方向。 In the first pressure swing adsorption device 1, the purification treatment cycle for concentration is sequentially performed. The plurality of purification purification treatment steps of one cycle, that is, the adsorption step, the depressurization step, the depressurization pressure equalization step, the desorption step, the washing step, the pressure increasing step, and the pressure increasing step. The execution time of each purification purification treatment step may be set in advance based on the purity or recovery rate of the desired concentrated helium gas G2. The execution timings of the purification treatment steps in each of the adsorption adsorption columns 2a, 2b, and 2c are different from each other. As a result, in the first pressure swing adsorption apparatus 1, as shown in FIG. 5, the operation steps of the purification processing steps for concentration in each of the adsorption adsorption towers 2a, 2b, and 2c are sequentially different (a). ~(i), the concentrated helium G2 is continuously discharged. The arrows in Fig. 5 indicate the flow direction of the gas.

為了依序實行第1變壓式吸附裝置1中之濃縮用純化處理步驟,由控制裝置20分別對第1~第17開關閥6a、6b、6c、7a、7b、7c、8a、8b、8c、10a、10b、10c、11a、11b、11c、12、14及第1、第2流量控制閥13、15進行控制。圖6表示運轉狀態(a)~(i)與濃縮用吸附塔2a、2b、2c各自中所實行之純化處理步驟及第1~第17開關閥各自之狀態的對應關係,○標記表示開關閥之打開狀態,×標記表示開關閥之關閉狀態。 The first to seventeenth on-off valves 6a, 6b, 6c, 7a, 7b, 7c, 8a, 8b, 8c are respectively controlled by the control device 20 in order to sequentially perform the purification processing steps for concentration in the first pressure swing adsorption device 1. The 10a, 10b, 10c, 11a, 11b, 11c, 12, and 14 and the first and second flow rate control valves 13, 15 are controlled. Fig. 6 shows the correspondence between the operation steps (a) to (i) and the purification processing steps and the states of the first to seventeenth on-off valves, respectively, in the concentration adsorption columns 2a, 2b, and 2c, and the ○ mark indicates the on-off valve. In the open state, the × mark indicates the closed state of the on-off valve.

於第2變壓式吸附裝置101中依序實行構成再濃縮用純化處理循環中之1個循環的複數個濃縮用純化處理步驟,即吸附步驟、減壓步驟、解吸用均壓步驟、解吸步驟、清洗步驟、升壓用均壓步驟及升壓步驟。關於各再濃縮用純化處理步驟之實行時間,只要根據所需之再濃縮氦氣G7之純度或回收率,預先經過實驗求解而設定即可。再濃縮用吸附塔102a、102b、102c各自中之純化處理步驟之實行時序互不相同。藉此,於第2變壓式吸附裝置101中,如圖7所示,依序具體呈現再濃縮用吸附塔102a、102b、102c各自中之再濃縮用純化處理步驟互不相同之運轉狀態(a)'~(i)',連續地排出再濃縮氦氣G7。圖7中之箭頭表示氣體之流動方向。 In the second pressure swing adsorption apparatus 101, a plurality of purification processing steps for concentrating one cycle in the purification processing cycle for reconcentration, that is, an adsorption step, a pressure reduction step, a pressure equalization step for desorption, and a desorption step are sequentially performed. , a cleaning step, a pressure equalization step, and a pressure step. The execution time of each purification treatment step for reconcentration may be set in advance based on the purity or recovery rate of the reconcentrated helium G7 required. The execution timings of the purification treatment steps in each of the reconcentration adsorption columns 102a, 102b, and 102c are different from each other. As a result, in the second pressure swing adsorption apparatus 101, as shown in FIG. 7, the operation steps of the reconcentration purification processing steps in the reconcentration adsorption towers 102a, 102b, and 102c are different from each other ( a) '~(i)', continuously discharges and re-concentrates helium G7. The arrows in Fig. 7 indicate the flow direction of the gas.

為了依序實行第2變壓式吸附裝置101中之再濃縮用純化處理步 驟,由控制裝置20分別對第18~第34開關閥106a、106b、106c、107a、107b、107c、108a、108b、108c、110a、110b、110c、111a、111b、111c、112、114及第3、第4流量控制閥113、115進行控制。圖8表示運轉狀態(a)'~(i)'與再濃縮用吸附塔102a、102b、102c各自中所實行之純化處理步驟及第18~第34開關閥各自之狀態的對應關係,○標記表示開關閥之打開狀態,×標記表示開關閥之關閉狀態。 In order to carry out the purification treatment step for reconcentration in the second pressure swing adsorption device 101 in order The control device 20 respectively controls the 18th to 34th on-off valves 106a, 106b, 106c, 107a, 107b, 107c, 108a, 108b, 108c, 110a, 110b, 110c, 111a, 111b, 111c, 112, 114 and 3. The fourth flow rate control valves 113, 115 are controlled. 8 shows the correspondence between the operation state (a) '~(i)' and the purification processing steps performed in each of the reconcentration adsorption columns 102a, 102b, and 102c and the states of the 18th to 34th on-off valves, ○ mark Indicates the open state of the on-off valve, and the × mark indicates the closed state of the on-off valve.

於第1變壓式吸附裝置1之運轉狀態(a)中,將第1、第4、第8、第11、第15、第16開關閥6a、7a、8b、10b、11c、12打開,將剩餘之開關閥關閉。藉由將第1、第4開關閥6a、7a打開,而於第1濃縮用吸附塔2a中實行吸附步驟。藉由將第8、第11、第15、第16開關閥8b、10b、11c、12打開,而於第2濃縮用吸附塔2b中實行清洗步驟,於第3濃縮用吸附塔2c中實行減壓步驟。 In the operating state (a) of the first pressure swing adsorption device 1, the first, fourth, eighth, eleventh, fifteenth, and sixteenth on-off valves 6a, 7a, 8b, 10b, 11c, and 12 are opened. Turn off the remaining on/off valves. The adsorption step is carried out in the first concentration adsorption column 2a by opening the first and fourth on-off valves 6a and 7a. By opening the eighth, eleventh, fifteenth, and sixteenth on-off valves 8b, 10b, 11c, and 12, the cleaning step is performed in the second concentration adsorption column 2b, and the third concentration adsorption column 2c is subjected to subtraction. Pressure step.

於第2變壓式吸附裝置101之運轉狀態(a)'中,將第18、第21、第25、第28、第32、第33開關閥106a、107a、108b、110b、111c、112打開,將剩餘之開關閥關閉。藉由將第18、第21開關閥106a、107a打開,而於第1再濃縮用吸附塔102a中實行吸附步驟。藉由將第25、第28、第32、第33開關閥108b、110b、111c、112打開,而於第2再濃縮用吸附塔102b中實行清洗步驟,於第3再濃縮用吸附塔102c中實行減壓步驟。 In the operating state (a) of the second pressure swing adsorption device 101, the 18th, 21st, 25th, 28th, 32nd, and 33rd on-off valves 106a, 107a, 108b, 110b, 111c, 112 are opened. , the remaining on-off valves are closed. The adsorption step is carried out in the first reconcentration adsorption column 102a by opening the 18th and 21st on-off valves 106a and 107a. By opening the 25th, 28th, 32nd, and 33rd on-off valves 108b, 110b, 111c, and 112, the second reconcentration adsorption tower 102b performs a washing step in the third reconcentration adsorption tower 102c. Perform a decompression step.

於第1變壓式吸附裝置1之運轉狀態(b)中,將第1、第4、第11、第15、第16開關閥6a、7a、10b、11c、12打開,將剩餘之開關閥關閉。藉由將第1、第4開關閥6a、7a打開,而於第1濃縮用吸附塔2a中緊接著運轉狀態(a)繼續實行吸附步驟。藉由將第11、第15、第16開關閥10b、11c、12打開,而於第2濃縮用吸附塔2b中實行升壓用均壓步驟,於第3濃縮用吸附塔2c中實行解吸用均壓步驟。 In the operating state (b) of the first pressure swing adsorption device 1, the first, fourth, eleventh, fifteenth, and sixteenth on-off valves 6a, 7a, 10b, 11c, and 12 are opened, and the remaining on-off valves are opened. shut down. By opening the first and fourth on-off valves 6a and 7a, the adsorption step is continued in the first concentration adsorption column 2a in the operating state (a). By opening the eleventh, fifteenth, and sixteenth on-off valves 10b, 11c, and 12, the pressure equalization step is performed in the second concentration adsorption column 2b, and the desorption is performed in the third concentration adsorption column 2c. Pressure equalization step.

於第2變壓式吸附裝置101之運轉狀態(b)'中,將第18、第21、第 28、第32、第33開關閥106a、107a、110b、111c、112打開,將剩餘之開關閥關閉。藉由將第18、第21開關閥106a、107a打開,而於第1再濃縮用吸附塔102a中緊接著運轉狀態(a)'繼續實行吸附步驟。藉由將第28、第32、第33開關閥110b、111c、112打開,而於第2再濃縮用吸附塔102b中實行升壓用均壓步驟,於第3再濃縮用吸附塔102c中實行解吸用均壓步驟。 In the operating state (b) of the second pressure swing adsorption device 101, the 18th, 21st, and the 28. The 32nd and 33rd on-off valves 106a, 107a, 110b, 111c, 112 are opened to close the remaining on-off valves. By opening the 18th and 21st on-off valves 106a and 107a, the adsorption step is continued in the first reconcentration adsorption tower 102a in the operating state (a)'. By the opening of the 28th, 32nd, and 33rd on-off valves 110b, 111c, and 112, the pressure equalization step is performed in the second re-concentration adsorption tower 102b, and is carried out in the third re-concentration adsorption tower 102c. The depressurization step is used for desorption.

於第1變壓式吸附裝置1之運轉狀態(c)中,將第1、第4、第9、第14、第17開關閥6a、7a、8c、11b、14打開,將剩餘之開關閥關閉。藉由將第1、第4、第14、第17開關閥6a、7a、11b、14打開,而於第1濃縮用吸附塔2a中緊接著運轉狀態(b)繼續實行吸附步驟,於第2濃縮用吸附塔2b中實行升壓步驟。藉由將第9開關閥8c打開,而於第3濃縮用吸附塔2c中實行解吸步驟。 In the operating state (c) of the first pressure swing adsorption device 1, the first, fourth, ninth, fourteenth, and seventeenth on-off valves 6a, 7a, 8c, 11b, and 14 are opened, and the remaining on-off valves are opened. shut down. By opening the first, fourth, fourteenth, and seventeenth on-off valves 6a, 7a, 11b, and 14 , the adsorption step is continued in the first concentration adsorption column 2a in the operating state (b), and the second adsorption step is performed. The pressure increasing step is carried out in the adsorption column 2b for concentration. The desorption step is carried out in the third concentration adsorption column 2c by opening the ninth on-off valve 8c.

於第2變壓式吸附裝置101之運轉狀態(c)'中,將第18、第21、第26、第31、第34開關閥106a、107a、108c、111b、114打開,將剩餘之開關閥關閉。藉由將第18、第21、第31、第34開關閥106a、107a、111b、114打開,而於第1再濃縮用吸附塔102a中緊接著運轉狀態(b)'繼續實行吸附步驟,於第2再濃縮用吸附塔102b中實行升壓步驟。藉由將第26開關閥108c打開,而於第3再濃縮用吸附塔102c中實行解吸步驟。 In the operating state (c) of the second pressure swing adsorption device 101, the 18th, 21st, 26th, 31st, and 34th on-off valves 106a, 107a, 108c, 111b, and 114 are opened, and the remaining switches are turned on. The valve is closed. By opening the 18th, 21st, 31st, and 34th on-off valves 106a, 107a, 111b, and 114, the adsorption step is continued in the first reconcentration adsorption tower 102a in the operating state (b)'. The second reconcentration adsorption column 102b performs a pressure increasing step. The desorption step is carried out in the third reconcentration adsorption column 102c by opening the 26th on-off valve 108c.

於第1變壓式吸附裝置1之運轉狀態(d)中,將第2、第5、第9、第12、第13、第16開關閥6b、7b、8c、10c、11a、12打開,將剩餘之開關閥關閉。藉由將第2、第5開關閥6b、7b打開,而於第2濃縮用吸附塔2b中實行吸附步驟。藉由將第9、第12、第13、第16開關閥8c、10c、11a、12打開,而於第1濃縮用吸附塔2a中實行減壓步驟,於第3濃縮用吸附塔2c中實行清洗步驟。 In the operating state (d) of the first pressure swing adsorption device 1, the second, fifth, ninth, twelfth, thirteenth, and sixteenth on-off valves 6b, 7b, 8c, 10c, 11a, and 12 are opened. Turn off the remaining on/off valves. The adsorption step is carried out in the second concentration adsorption column 2b by opening the second and fifth on-off valves 6b and 7b. By opening the ninth, twelfth, thirteenth, and sixteenth on-off valves 8c, 10c, 11a, and 12, the first concentration adsorption column 2a is subjected to a pressure reduction step, and is carried out in the third concentration adsorption column 2c. Cleaning step.

於第2變壓式吸附裝置101之運轉狀態(d)'中,將第19、第22、第 26、第29、第30、第33開關閥106b、107b、108c、110c、111a、112打開,將剩餘之開關閥關閉。藉由將第19、第22開關閥106b、107b打開,而於第2再濃縮用吸附塔102b中實行吸附步驟。藉由將第26、第29、第30、第33開關閥108c、110c、111a、112打開,而於第1再濃縮用吸附塔102a中實行減壓步驟,於第3再濃縮用吸附塔102c中實行清洗步驟。 In the operating state (d) of the second pressure swing adsorption device 101, the 19th, 22nd, and the 26. The 29th, 30th, and 33rd on-off valves 106b, 107b, 108c, 110c, 111a, 112 are opened to close the remaining on-off valves. The adsorption step is carried out in the second reconcentration adsorption column 102b by opening the 19th and 22nd on-off valves 106b and 107b. By opening the 26th, 29th, 30th, and 33th on-off valves 108c, 110c, 111a, and 112, the first reconcentration adsorption tower 102a performs a depressurization step, and the third reconcentration adsorption tower 102c The cleaning step is carried out.

於第1變壓式吸附裝置1之運轉狀態(e)中,將第2、第5、第12、第13、第16開關閥6b、7b、10c、11a、12打開,將剩餘之開關閥關閉。藉由將第2、第5開關閥6b、7b打開,而於第2濃縮用吸附塔2b中緊接著運轉狀態(d)繼續實行吸附步驟。藉由將第12、第13、第16開關閥10c、11a、12打開,而於第1濃縮用吸附塔2a中實行解吸用均壓步驟,於第3濃縮用吸附塔2c中實行升壓用均壓步驟。 In the operating state (e) of the first pressure swing adsorption device 1, the second, fifth, twelfth, thirteenth, and sixteenth on-off valves 6b, 7b, 10c, 11a, and 12 are opened, and the remaining on-off valves are opened. shut down. By opening the second and fifth on-off valves 6b and 7b, the adsorption step is continued in the second concentration adsorption column 2b in the operating state (d). By opening the 12th, 13th, and 16th on-off valves 10c, 11a, and 12, the desorption desorption step 2a is performed in the first concentration adsorption column 2a, and the third concentration adsorption column 2c is used for the pressure increase. Pressure equalization step.

於第2變壓式吸附裝置101之運轉狀態(e)'中,將第19、第22、第29、第30、第33開關閥106b、107b、110c、111a、112打開,將剩餘之開關閥關閉。藉由將第19、第22開關閥106b、107b打開,而於第2再濃縮用吸附塔102b中緊接著運轉狀態(d)'繼續實行吸附步驟。藉由將第29、第30、第33開關閥110c、111a、112打開,而於第1再濃縮用吸附塔102a中實行解吸用均壓步驟,於第3再濃縮用吸附塔102c中實行升壓用均壓步驟。 In the operating state (e) of the second pressure swing adsorption device 101, the 19th, 22nd, 29th, 30th, and 33rd on-off valves 106b, 107b, 110c, 111a, and 112 are opened, and the remaining switches are turned on. The valve is closed. By opening the 19th and 22nd on-off valves 106b and 107b, the adsorption step is continued in the second reconcentration adsorption tower 102b in the operating state (d)'. By opening the 29th, 30th, and 33th on-off valves 110c, 111a, and 112, the first reconcentration adsorption tower 102a performs the desorption equalization step, and the third reconcentration adsorption tower 102c performs the liter. Press the pressure equalization step.

於第1變壓式吸附裝置1之運轉狀態(f)中,將第2、第5、第7、第15、第17開關閥6b、7b、8a、11c、14打開,將剩餘之開關閥關閉。藉由將第2、第5、第15、第17開關閥6b、7b、11c、14打開,而於第2濃縮用吸附塔2b中緊接著運轉狀態(e)繼續實行吸附步驟,於第3濃縮用吸附塔2c中實行升壓步驟。藉由將第7開關閥8a打開,而於第1濃縮用吸附塔2a中實行解吸步驟。 In the operating state (f) of the first pressure swing adsorption device 1, the second, fifth, seventh, fifteenth, and seventeenth on-off valves 6b, 7b, 8a, 11c, and 14 are opened, and the remaining on-off valves are opened. shut down. By opening the second, fifth, fifteenth, and seventeenth on-off valves 6b, 7b, 11c, and 14 and continuing the adsorption step in the second concentration adsorption column 2b in the operating state (e), the third step is performed. The pressure increasing step is carried out in the adsorption column 2c for concentration. The desorption step is carried out in the first concentration adsorption column 2a by opening the seventh on-off valve 8a.

於第2變壓式吸附裝置101之運轉狀態(f)'中,將第19、第22、第 24、第32、第34開關閥106b、107b、108a、111c、114打開,將剩餘之開關閥關閉。藉由將第19、第22、第32、第34開關閥106b、107b、111c、114打開,而於第2再濃縮用吸附塔102b中緊接著運轉狀態(e)'繼續實現吸附步驟,於第3再濃縮用吸附塔102c中實行升壓步驟。藉由將第24開關閥108a打開,而於第1再濃縮用吸附塔102a中實行解吸步驟。 In the operating state (f) of the second pressure swing adsorption device 101, the 19th, 22nd, and the 24. The 32nd and 34th on-off valves 106b, 107b, 108a, 111c, 114 are opened to close the remaining on-off valves. By opening the 19th, 22nd, 32nd, and 34th on-off valves 106b, 107b, 111c, and 114, the adsorption step is continued in the second reconcentration adsorption column 102b in the operating state (e)'. The pressure increasing step is carried out in the third reconcentration adsorption column 102c. The desorption step is carried out in the first reconcentration adsorption column 102a by opening the 24th on-off valve 108a.

於第1變壓式吸附裝置1之運轉狀態(g)中,將第3、第6、第7、第10、第14、第16開關閥6c、7c、8a、10a、11b、12打開,將剩餘之開關閥關閉。藉由將第3、第6開關閥6c、7c打開,而於第3濃縮用吸附塔2c中實行吸附步驟。藉由將第7、第10、第14、第16開關閥8a、10a、11b、12打開,而於第1濃縮用吸附塔2a中實行清洗步驟,於第2濃縮用吸附塔2b中實行減壓步驟。 In the operating state (g) of the first pressure swing adsorption device 1, the third, sixth, seventh, tenth, fourteenth, and sixteenth on-off valves 6c, 7c, 8a, 10a, 11b, and 12 are opened. Turn off the remaining on/off valves. The adsorption step is carried out in the third concentration adsorption column 2c by opening the third and sixth on-off valves 6c and 7c. By opening the seventh, tenth, fourteenth, and sixteenth on-off valves 8a, 10a, 11b, and 12, the first concentration adsorption column 2a performs a washing step, and the second concentration adsorption column 2b performs subtraction. Pressure step.

於第2變壓式吸附裝置101之運轉狀態(g)'中,將第20、第23、第24、第27、第31、第33開關閥106c、107c、108a、110a、111b、112打開,將剩餘之開關閥關閉。藉由將第20、第23開關閥106c、107c打開,而於第3再濃縮用吸附塔102c中實行吸附步驟。藉由將第24、第27、第31、第33開關閥108a、110a、111b、112打開,而於第1再濃縮用吸附塔102a中實行清洗步驟,於第2再濃縮用吸附塔102b中實行減壓步驟。 In the operating state (g) of the second pressure swing adsorption device 101, the 20th, 23rd, 24th, 27th, 31st, and 33rd on-off valves 106c, 107c, 108a, 110a, 111b, 112 are opened. , the remaining on-off valves are closed. The adsorption step is carried out in the third reconcentration adsorption column 102c by opening the 20th and 23rd on-off valves 106c and 107c. By opening the 24th, 27th, 31st, and 33rd on-off valves 108a, 110a, 111b, and 112, the first reconcentration adsorption tower 102a performs a washing step in the second reconcentration adsorption column 102b. Perform a decompression step.

於第1變壓式吸附裝置1之運轉狀態(h)中,將第3、第6、第10、第14、第16開關閥6c、7c、10a、11b、12打開,將剩餘之開關閥關閉。藉由將第3、第6開關閥6c、7c打開,而於第3濃縮用吸附塔2c中緊接著運轉狀態(g)繼續實行吸附步驟。藉由將第10、第14、第16開關閥10a、11b、12打開,而於第1濃縮用吸附塔2a中實行升壓用均壓步驟,於第2濃縮用吸附塔2b中實行解吸用均壓步驟。 In the operating state (h) of the first pressure swing adsorption device 1, the third, sixth, tenth, fourteenth, and sixteenth on-off valves 6c, 7c, 10a, 11b, and 12 are opened, and the remaining on-off valves are opened. shut down. By opening the third and sixth on-off valves 6c and 7c, the adsorption step is continued in the third concentration adsorption column 2c in the operating state (g). By opening the 10th, 14th, and 16th on-off valves 10a, 11b, and 12, the pressure equalization step is performed in the first concentration adsorption column 2a, and the second concentration adsorption column 2b is used for desorption. Pressure equalization step.

於第2變壓式吸附裝置101之運轉狀態(h)'中,將第20、第23、第 27、第31、第33開關閥106c、107c、110a、111b、112打開,將剩餘之開關閥關閉。藉由將第20、第23開關閥106c、107c打開,而於第3再濃縮用吸附塔102c中緊接著運轉狀態(g)'繼續實行吸附步驟。藉由將第27、第31、第33開關閥110a、111b、112打開,而於第1再濃縮用吸附塔102a中實行升壓用均壓步驟,於第2再濃縮用吸附塔102b中實行解吸用均壓步驟。 In the operating state (h) of the second pressure swing adsorption device 101, the 20th, 23rd, and the 27. The 31st and 33rd on-off valves 106c, 107c, 110a, 111b, 112 are opened to close the remaining on-off valves. By opening the 20th and 23rd on-off valves 106c and 107c, the adsorption step is continued in the third reconcentration adsorption tower 102c in the operating state (g)'. By opening the 27th, 31st, and 33rd on-off valves 110a, 111b, and 112, the pressure equalization step is performed in the first re-concentration adsorption tower 102a, and is carried out in the second re-concentration adsorption tower 102b. The depressurization step is used for desorption.

於第1變壓式吸附裝置1之運轉狀態(i)中,將第3、第6、第8、第13、第17開關閥6c、7c、8b、11a、14打開,將剩餘之開關閥關閉。藉由將第3、第6、第13、第17開關閥6c、7c、11a、14打開,而於第1濃縮用吸附塔2a中實行升壓步驟,於第3濃縮用吸附塔2c中緊接著運轉狀態(h)繼續實行吸附步驟。藉由將第8開關閥8b打開,而於第2濃縮用吸附塔2b中實行解吸步驟。 In the operating state (i) of the first pressure swing adsorption device 1, the third, sixth, eighth, thirteenth, and seventeenth on-off valves 6c, 7c, 8b, 11a, and 14 are opened, and the remaining on-off valves are opened. shut down. By opening the third, sixth, thirteenth, and seventeenth on-off valves 6c, 7c, 11a, and 14 , the first concentration adsorption column 2a is subjected to a pressure increasing step, and the third concentration adsorption column 2c is tightly closed. Then, in the operating state (h), the adsorption step is continued. The desorption step is carried out in the second concentration adsorption column 2b by opening the eighth on-off valve 8b.

於第2變壓式吸附裝置101之運轉狀態(i)'中,將第20、第23、第25、第30、第34開關閥106c、107c、108b、111a、114打開,將剩餘之開關閥關閉。藉由將第20、第23、第30、第34開關閥106c、107c、111a、114打開,而於第1再濃縮用吸附塔102a中實行升壓步驟,於第3再濃縮用吸附塔102c中緊接著運轉狀態(h)'繼續實行吸附步驟。藉由將第25開關閥108b打開,而於第2再濃縮用吸附塔102b中實行解吸步驟。 In the operating state (i) of the second pressure swing adsorption device 101, the 20th, 23rd, 25th, 30th, and 34th on-off valves 106c, 107c, 108b, 111a, and 114 are opened, and the remaining switches are turned on. The valve is closed. By opening the 20th, 23rd, 30th, and 34th on-off valves 106c, 107c, 111a, and 114, a step of boosting is performed in the first reconcentration adsorption column 102a, and the third reconcentration adsorption column 102c is opened. Immediately following the operating state (h) 'continues the adsorption step. The desorption step is carried out in the second reconcentration adsorption column 102b by opening the 25th on-off valve 108b.

於濃縮用吸附塔2a、2b、2c中之某個塔內實行吸附步驟時,經由原料氣體導入流路向該濃縮用吸附塔內部導入原料氦氣G1。藉由原料氦氣G1之壓力將濃縮用吸附塔內部加壓至吸附壓力。吸附壓力可利用第1壓力調節閥26a進行調節。藉此,所導入之原料氦氣G1所含之雜質氣體於加壓下經吸附劑吸附。又,未被吸附劑吸附之氣體作為濃縮氦氣G2自濃縮用吸附塔內部經由濃縮氣體流路而被排出。較佳為以濃縮氦氣G2之氦濃度成為40vol%~80vol%之方式設定第1變壓 式吸附裝置1中之吸附步驟之重複間隔。更佳為以濃縮氦氣G2之氦濃度成為50vol%~70vol%之方式設定第1變壓式吸附裝置1中之吸附步驟之重複間隔。例如預先經過實驗求出由第1濃度感測器24所檢測出之原料氦氣G1之濃度、利用第3流量控制閥25進行調節之流量、濃縮氦氣G2之目標濃度及吸附步驟之重複間隔之間的關係,基於該關係,設定與檢測濃度、調節流量及目標濃度對應之吸附步驟之重複間隔即可。關於第1變壓式吸附裝置1中之吸附步驟之重複間隔,可藉由對濃縮用純化處理循環之1個循環之時間進行規定而設定,關於該設定變更,只要對濃縮用純化處理循環之1個循環中之吸附步驟之實行時間與解吸步驟之實行時間進行變更即可。 When the adsorption step is performed in one of the adsorption columns 2a, 2b, and 2c for concentration, the raw material argon gas G1 is introduced into the concentration adsorption column through the raw material gas introduction flow path. The inside of the adsorption adsorption column is pressurized to the adsorption pressure by the pressure of the raw material helium G1. The adsorption pressure can be adjusted by the first pressure regulating valve 26a. Thereby, the impurity gas contained in the introduced raw material helium G1 is adsorbed by the adsorbent under pressure. Further, the gas adsorbed by the adsorbent is discharged as a concentrated helium gas G2 from the inside of the adsorption tower for concentration via the concentrated gas flow path. It is preferable to set the first transformation pressure so that the concentration of the helium gas G2 is 40 vol% to 80 vol%. The repetition interval of the adsorption step in the adsorption device 1. More preferably, the repetition interval of the adsorption step in the first pressure swing adsorption device 1 is set such that the concentration of the helium gas G2 is 50 vol% to 70 vol%. For example, the concentration of the raw material helium gas G1 detected by the first concentration sensor 24, the flow rate adjusted by the third flow rate control valve 25, the target concentration of the concentrated helium gas G2, and the repetition interval of the adsorption step are experimentally obtained in advance. Based on the relationship, the relationship between the adsorption step corresponding to the detection concentration, the adjustment flow rate, and the target concentration may be set. The repetition interval of the adsorption step in the first pressure swing adsorption device 1 can be set by specifying the time of one cycle of the purification purification treatment cycle, and the setting is changed as long as the purification treatment cycle is concentrated. The execution time of the adsorption step in one cycle and the execution time of the desorption step may be changed.

於再濃縮用吸附塔102a、102b、102c中之某個塔內實行吸附步驟時,經由濃縮氣體導入流路向該再濃縮用吸附塔內部導入濃縮氦氣G2。藉由濃縮氦氣G2之壓力將再濃縮用吸附塔內部加壓至吸附壓力。吸附壓力可利用第2壓力調節閥126a進行調節。藉此,所導入之濃縮氦氣G2所含之雜質氣體於加壓下經吸附劑吸附。又,未被吸附劑吸附之氣體作為再濃縮氦氣G7自再濃縮用吸附塔內部經由再濃縮氣體流路而被排出。較佳為以再濃縮氦氣G7之氦濃度成為目標純度、例如99.999vol%以上之方式設定第2變壓式吸附裝置101中之吸附步驟之重複間隔。例如預先經過實驗求出由第1濃度感測器124所檢測出之再濃縮氦氣G7之濃度、由第2流量感測器121所檢測出之濃縮氦氣G2之流量、再濃縮氦氣G7之目標濃度及吸附步驟之重複間隔之間的關係,基於該關係,設定與檢測濃度、檢測流量及目標濃度對應之吸附步驟之重複間隔即可。關於第2變壓式吸附裝置101中之吸附步驟之重複間隔,可藉由對再濃縮用純化處理循環之1個循環之時間進行規定而設定,關於該設定變更,只要對再濃縮用純化處理循環之1個循環中之吸附步驟之實行時間與解吸步驟之實行時間進行變更即 可。 When the adsorption step is performed in one of the adsorption towers 102a, 102b, and 102c for reconcentration, the concentrated helium gas G2 is introduced into the adsorption column for reconcentration via the concentrated gas introduction flow path. The inside of the adsorption column is further pressurized to the adsorption pressure by the pressure of the concentrated helium gas G2. The adsorption pressure can be adjusted by the second pressure regulating valve 126a. Thereby, the impurity gas contained in the introduced concentrated helium gas G2 is adsorbed by the adsorbent under pressure. Further, the gas which is not adsorbed by the adsorbent is discharged as a reconcentrated helium gas G7 from the inside of the adsorption tower for reconcentration via the reconcentrated gas flow path. It is preferable to set the repetition interval of the adsorption step in the second pressure swing adsorption apparatus 101 such that the concentration of the reconcentrated helium G7 becomes the target purity, for example, 99.999 vol% or more. For example, the concentration of the reconcentrated helium gas G7 detected by the first concentration sensor 124, the flow rate of the concentrated helium gas G2 detected by the second flow rate sensor 121, and the reconcentrated helium G7 are obtained experimentally in advance. Based on the relationship between the target concentration and the repetition interval of the adsorption step, the repetition interval of the adsorption step corresponding to the detection concentration, the detection flow rate, and the target concentration may be set. The repetition interval of the adsorption step in the second pressure swing adsorption apparatus 101 can be set by specifying the time of one cycle of the purification treatment cycle for reconcentration, and the setting is changed by the purification treatment for reconcentration. The execution time of the adsorption step in one cycle of the cycle and the execution time of the desorption step are changed. can.

於濃縮用吸附塔2a、2b、2c中之某個塔內實行減壓步驟時,該濃縮用吸附塔內部與第1連通流路、被實行清洗步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔內部、第1逸氣流路連通,壓力逐漸減小。此時,處於減壓步驟之濃縮用吸附塔之內部氣體G4被導入至處於清洗步驟之濃縮用吸附塔內。減壓步驟中之濃縮用吸附塔之內部壓力之減小幅度對應於被導入至處於清洗步驟之濃縮用吸附塔內之氣體量。 When the pressure reduction step is performed in one of the adsorption towers 2a, 2b, and 2c for concentration, the inside of the adsorption adsorption tower and the first communication passage, and the adsorption towers 2a, 2b, and 2c for performing the washing step are used. In another tower, the first airflow path is connected, and the pressure is gradually reduced. At this time, the internal gas G4 of the adsorption column for concentration in the depressurization step is introduced into the adsorption column for concentration in the washing step. The reduction in the internal pressure of the concentration adsorption column in the depressurization step corresponds to the amount of gas introduced into the concentration adsorption column in the washing step.

於再濃縮用吸附塔102a、102b、102c中之某個塔內實行減壓步驟時,該再濃縮用吸附塔內部與第2連通流路、被實行清洗步驟之再濃縮用吸附塔102a、102b、102c中之另外某個塔內部、第2逸氣流路連通,壓力逐漸減小。此時,處於減壓步驟之再濃縮用吸附塔之內部氣體G9被導入至處於清洗步驟之再濃縮用吸附塔內。減壓步驟中之再濃縮用吸附塔之內部壓力之減小幅度對應於被導入至處於清洗步驟之再濃縮用吸附塔內之氣體量。 When the pressure reduction step is performed in one of the adsorption towers 102a, 102b, and 102c for reconcentration, the inside of the adsorption column for reconcentration and the second communication channel and the adsorption column 102a, 102b for reconcentration in which the cleaning step is performed In another one of 102c, the inside of the other tower and the second escape flow path are connected, and the pressure is gradually reduced. At this time, the internal gas G9 of the reconcentration adsorption column which is in the depressurization step is introduced into the reconcentration adsorption column which is in the washing step. The reduction in the internal pressure of the adsorption column for reconcentration in the depressurization step corresponds to the amount of gas introduced into the adsorption column for reconcentration in the washing step.

於濃縮用吸附塔2a、2b、2c中之某個塔內實行解吸用均壓步驟時,該濃縮用吸附塔內部經由第1連通流路與實行升壓用均壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔內部連通,藉此較減壓步驟結束時壓力進一步減小。此時,處於解吸用均壓步驟之濃縮用吸附塔之內部氣體G5被導入至處於升壓用均壓步驟之濃縮用吸附塔內。處於解吸用均壓步驟之濃縮用吸附塔內部與處於升壓用均壓步驟之濃縮用吸附塔內部成為均壓,因此處於升壓用均壓步驟之濃縮用吸附塔之內部壓力上升至與處於解吸用均壓步驟之濃縮用吸附塔之內部壓力均等之程度。 When the desorption step for desorption is carried out in one of the adsorption columns 2a, 2b, and 2c for concentration, the inside of the adsorption column for concentration is passed through the first communication channel and the adsorption column 2a for concentration for performing the pressure equalization step. Another one of the columns 2b, 2c is internally connected, whereby the pressure is further reduced at the end of the depressurization step. At this time, the internal gas G5 of the concentration adsorption column which is in the depressurization pressure equalization step is introduced into the concentration adsorption column which is in the pressure equalization step. Since the inside of the adsorption adsorption column for the desorption desorption step and the inside of the adsorption adsorption column for the pressure equalization step are equalized, the internal pressure of the concentration adsorption column in the pressure equalization step is raised to and The internal pressure of the adsorption column for concentration in the depressurization pressure equalization step is equal.

於再濃縮用吸附塔102a、102b、102c中之某個塔內實行解吸用均壓步驟時,該再濃縮用吸附塔內部經由第2連通流路與實行升壓用均 壓步驟之再濃縮用吸附塔102a、102b、102c中之另外某個塔內部連通,藉此較減壓步驟結束時壓力進一步減小。此時,處於解吸用均壓步驟之再濃縮用吸附塔之內部氣體G10被導入至處於升壓用均壓步驟之再濃縮用吸附塔內。處於解吸用均壓步驟之再濃縮用吸附塔內部與處於升壓用均壓步驟之再濃縮用吸附塔內部成為均壓,因此處於升壓用均壓步驟之再濃縮用吸附塔之內部壓力上升至與處於解吸用均壓步驟之再濃縮用吸附塔之內部壓力均等之程度。 When a desorption depressing step is performed in one of the reconcentration adsorption columns 102a, 102b, and 102c, the reconcentration adsorption column is internally connected to the booster via the second communication channel. The reconcentration of the pressure step is further communicated with the other of the adsorption towers 102a, 102b, 102c, whereby the pressure is further reduced at the end of the depressurization step. At this time, the internal gas G10 of the reconcentration adsorption column which is in the depressurization pressure equalization step is introduced into the reconcentration adsorption column which is subjected to the pressure equalization step. The inside of the adsorption column for reconcentration in the depressurization pressure equalization step and the inside of the adsorption column for reconcentration in the step of pressure equalization for pressure increase are equalized, so that the internal pressure of the adsorption column for reconcentration in the pressure equalization step is increased. To the extent that the internal pressure of the adsorption column for reconcentration in the depressurization pressure equalization step is equal.

於濃縮用吸附塔2a、2b、2c中之某個塔內實行解吸步驟時,該濃縮用吸附塔內部與第1逸氣流路連通,較解吸用均壓步驟結束時壓力逐漸減小,減壓至藉由第2壓力調節閥26b所調節之壓力,雜質氣體自吸附劑解吸。解吸出之雜質氣體作為逸氣G3自濃縮用吸附塔內部經由第1逸氣流路被排出。將解吸步驟末期之濃縮用吸附塔內部之壓力設為高出大氣壓若干之壓力,以於解吸步驟中逸氣G3藉由自身壓力自第1逸氣流路向循環流路流動而到達原料氣體用緩衝槽22、或者自第1釋放用配管44被釋放至常壓空間中。 When the desorption step is performed in one of the adsorption columns 2a, 2b, and 2c for concentration, the inside of the adsorption adsorption column is connected to the first flow path, and the pressure is gradually decreased at the end of the desorption depressing step, and the pressure is reduced. The impurity gas is desorbed from the adsorbent by the pressure regulated by the second pressure regulating valve 26b. The desorbed impurity gas is discharged as the outgas G3 from the inside of the adsorption adsorption tower via the first escape flow path. The pressure inside the adsorption tower at the end of the desorption step is set to a pressure higher than atmospheric pressure, so that in the desorption step, the outgas G3 flows from the first escape gas flow path to the circulation flow path by its own pressure to reach the raw material gas buffer tank. 22. Or, the first release pipe 44 is released into the normal pressure space.

於再濃縮用吸附塔102a、102b、102c中之某個塔內實行解吸步驟時,該再濃縮用吸附塔內部與第2逸氣流路連通,較解吸用均壓步驟結束時壓力逐漸減小,減壓至藉由第4壓力調節閥126b所調節之壓力,雜質氣體自吸附劑解吸。解吸出之雜質氣體作為逸氣G8自再濃縮用吸附塔內部經由第2逸氣流路被排出。將解吸步驟末期之再濃縮用吸附塔內部之壓力設為高出大氣壓若干之壓力,以於解吸步驟中逸氣G8藉由自身壓力自第2逸氣流路向循環流路流動而到達原料氣體用緩衝槽22、或者自第2釋放用配管144被釋放至常壓空間中。 When the desorption step is performed in one of the reconcentration adsorption towers 102a, 102b, and 102c, the inside of the reconcentration adsorption tower communicates with the second escape flow path, and the pressure gradually decreases at the end of the desorption depressing step. The pressure is reduced to the pressure adjusted by the fourth pressure regulating valve 126b, and the impurity gas is desorbed from the adsorbent. The desorbed impurity gas is discharged as the outgas G8 from the inside of the adsorption tower for reconcentration via the second escape flow path. The pressure inside the adsorption tower for reconcentration at the end of the desorption step is set to a pressure higher than atmospheric pressure, so that in the desorption step, the escape gas G8 flows from the second escape gas flow path to the circulation flow path by its own pressure to reach the buffer for the raw material gas. The groove 22 or the second release pipe 144 is released into the normal pressure space.

於濃縮用吸附塔2a、2b、2c中之某個塔內實行升壓步驟時,該濃縮用吸附塔內部經由第1連通流路與實行吸附步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔內部連通。此時,自實行吸附步驟之濃縮 用吸附塔所排出之濃縮氦氣G2之一部分被導入至處於升壓步驟之濃縮用吸附塔內,藉此處於升壓步驟之濃縮用吸附塔之內部被加壓,壓力上升至吸附壓力或吸附壓力附近。 When the pressure increasing step is performed in one of the adsorption towers 2a, 2b, and 2c for concentration, the inside of the concentration adsorption column is passed through the first communication channel and the adsorption column 2a, 2b, and 2c for performing the adsorption step. In addition, a certain tower is internally connected. At this time, the concentration of the adsorption step is performed. A portion of the concentrated helium gas G2 discharged from the adsorption tower is introduced into the concentration adsorption column in the step of increasing pressure, whereby the inside of the adsorption adsorption column in the step of increasing pressure is pressurized, and the pressure rises to adsorption pressure or adsorption. Near the pressure.

於再濃縮用吸附塔102a、102b、102c中之某個塔內實行升壓步驟時,該再濃縮用吸附塔內部經由第2連通流路與實行吸附步驟之再濃縮用吸附塔102a、102b、102c中之另外某個塔內部連通。此時,自實行吸附步驟之再濃縮用吸附塔所排出之再濃縮氦氣G7之一部分被導入至處於升壓步驟之再濃縮用吸附塔內,藉此處於升壓步驟之再濃縮用吸附塔之內部被加壓,壓力上升至吸附壓力或吸附壓力附近。 When the pressure increasing step is performed in one of the adsorption towers 102a, 102b, and 102c for reconcentration, the inside of the adsorption column for reconcentration passes through the second communication channel and the adsorption columns 102a and 102b for reconcentration that perform the adsorption step, Another tower in 102c is internally connected. At this time, a portion of the reconcentrated helium gas G7 discharged from the adsorption column for reconcentration which is subjected to the adsorption step is introduced into the adsorption column for reconcentration in the step of increasing pressure, whereby the adsorption column for reconcentration in the step of increasing pressure is used. The inside is pressurized and the pressure rises to the vicinity of the adsorption pressure or the adsorption pressure.

於濃縮用吸附塔2a、2b、2c中之某個塔內實行清洗步驟時,該某個濃縮用吸附塔處於解吸步驟後且升壓步驟前之狀態。處於該解吸步驟後且升壓步驟前之狀態的濃縮用吸附塔2a、2b、2c中之某個塔內部經由第1連通流路與處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔內部連通,又,與第1逸氣流路連通。藉此,向處於解吸步驟後且升壓步驟前之狀態的濃縮用吸附塔2a、2b、2c中之某個塔內導入處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔之內部氣體G4後並作為逸氣G3'排出,藉此可實行對該處於解吸步驟後且升壓步驟前之狀態的濃縮用吸附塔2a、2b、2c中之某個塔之內部進行清洗之清洗步驟。自該處於清洗步驟之濃縮用吸附塔2a、2b、2c中之某個塔所排出之逸氣G3'包含處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔之內部氣體G4所含之氦氣。該逸氣G3'自第1逸氣流路經由循環流路到達原料氣體用緩衝槽22,或者經由第1釋放用配管44被釋放至常壓空間中。 When a washing step is performed in one of the adsorption columns 2a, 2b, and 2c for concentration, the certain adsorption column is in a state after the desorption step and before the pressure increasing step. One of the concentration adsorption towers 2a, 2b, and 2c in the state after the desorption step and before the pressure-up step passes through the first communication channel and the concentration adsorption column 2a, 2b, 2c in the depressurization step. The other of the towers communicates internally and is in communication with the first escape flow path. In this way, the other one of the concentration adsorption columns 2a, 2b, and 2c in the state after the desorption step and before the pressure increase step is introduced into the concentration adsorption column 2a, 2b, and 2c in the pressure reduction step. After the internal gas G4 of the towers is discharged as the outgas G3', the inside of one of the adsorption towers 2a, 2b, 2c for concentration after the desorption step and before the pressure increasing step can be carried out. Cleaning step of cleaning. The outgas G3' discharged from one of the concentration adsorption columns 2a, 2b, 2c in the washing step contains the inside of another one of the concentration adsorption columns 2a, 2b, 2c in the depressurization step Helium contained in gas G4. The escape gas G3' reaches the raw material gas buffer tank 22 through the circulation flow path from the first escape flow path, or is released into the normal pressure space via the first release pipe 44.

於再濃縮用吸附塔102a、102b、102c中之某個塔內實行清洗步驟時,該某個再濃縮用吸附塔處於解吸步驟後且升壓步驟前之狀態。該處於解吸步驟後且升壓步驟前之狀態的再濃縮用吸附塔102a、102b、 102c中之某個塔內部經由第2連通流路與處於減壓步驟之再濃縮用吸附塔102a、102b、102c中之另外某個塔內部連通,又,與第2逸氣流路連通。藉此,向處於解吸步驟後且升壓步驟前之狀態的再濃縮用吸附塔102a、102b、102c中之某個塔內導入處於減壓步驟之再濃縮用吸附塔102a、102b、102c中之另外某個塔之內部氣體G9後並作為逸氣G8'排出,藉此可實行對該處於解吸步驟後且升壓步驟前之狀態的再濃縮用吸附塔102a、102b、102c中之某個塔之內部進行清洗之清洗步驟。自該處於清洗步驟之再濃縮用吸附塔102a、102b、102c中之某個塔所排出之逸氣G8'包含處於減壓步驟之再濃縮用吸附塔102a、102b、102c中之另外某個塔之內部氣體G9所含之氦氣。該逸氣G8'自第2逸氣流路經由循環流路到達原料氣體用緩衝槽22,或者經由第2釋放用配管144被釋放至常壓空間中。 When a washing step is performed in one of the columns for reconcentration adsorption columns 102a, 102b, and 102c, the certain reconcentration adsorption column is in a state after the desorption step and before the pressure increasing step. The adsorption column 102a, 102b for reconcentration in a state after the desorption step and before the pressure increasing step, The inside of one of the columns 102c communicates with the inside of another one of the adsorption towers 102a, 102b, and 102c for reconcentration in the depressurization step via the second communication passage, and communicates with the second escape flow path. Thereby, the reconcentration adsorption towers 102a, 102b, and 102c in the reconcentration step are introduced into the reconcentration adsorption towers 102a, 102b, and 102c in the depressurization step in a state in which the reconcentration adsorption towers 102a, 102b, and 102c are in a state after the desorption step and before the pressure increase step. Further, the internal gas G9 of a certain column is discharged as the outgas G8', whereby one of the columns for reconcentration adsorption towers 102a, 102b, 102c which is in the state after the desorption step and before the pressure increasing step can be carried out. The cleaning step of cleaning inside. The outgas G8' discharged from one of the reconcentration adsorption columns 102a, 102b, 102c in the washing step includes another one of the reconcentration adsorption columns 102a, 102b, 102c in the depressurization step The helium contained in the internal gas G9. The escape gas G8 ′ reaches the raw material gas buffer tank 22 through the circulation flow path from the second escape flow path, or is released into the atmospheric pressure space via the second release pipe 144 .

於第1變壓式吸附裝置1中,關於自處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔向處於清洗步驟之濃縮用吸附塔2a、2b、2c中之某個塔所導入之氣體量,根據向濃縮用吸附塔2a、2b、2c內導入之原料氦氣G1之氦濃度之變化而變更。即,關於該氣體量,若原料氦氣G1之氦濃度變高則增多,若氦濃度變低則減少,藉此實現最佳化。因此,如下所述,將清洗步驟之實行時間設為一定,並且藉由第1流量控制閥13調節第1連通流路中所流通之氣體流量。進而,於本實施形態中,於向濃縮用吸附塔2a、2b、2c內導入之原料氦氣G1之氦濃度為預先設定之設定值以下時,將該氣體量設為零,不實行清洗步驟。 In the first pressure swing adsorption apparatus 1, one of the concentration adsorption towers 2a, 2b, and 2c in the concentration step from the adsorption step 2a, 2b, and 2c in the pressure reduction step is one of the adsorption adsorption towers 2a, 2b, and 2c in the cleaning step. The amount of gas introduced into each of the columns is changed in accordance with the change in the concentration of the cesium gas G1 introduced into the adsorption columns 2a, 2b, and 2c for concentration. In other words, the amount of the gas increases as the concentration of the helium gas G1 becomes higher, and decreases as the concentration of the helium decreases. Therefore, as described below, the execution time of the washing step is made constant, and the flow rate of the gas flowing through the first communication passage is adjusted by the first flow rate control valve 13. Furthermore, in the present embodiment, when the enthalpy concentration of the raw material argon gas G1 introduced into the concentration adsorption towers 2a, 2b, and 2c is equal to or lower than a predetermined set value, the gas amount is set to zero, and the washing step is not performed. .

為了向處於清洗步驟之濃縮用吸附塔2a、2b、2c中之某個塔內導入處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔之內部氣體,將第1連通流路中之某個開關閥打開。因此,清洗步驟中向濃縮用吸附塔2a、2b、2c中之某個塔所導入之氣體量對應於清洗步驟之實 行時間與連通流路中所流通之氣體流量之積。本實施形態之清洗步驟之實行時間被設為預先設定之一定時間,將該一定之實行時間記憶於控制裝置20。 In order to introduce the internal gas of another one of the concentration adsorption towers 2a, 2b, 2c in the depressurization step into one of the concentration adsorption columns 2a, 2b, 2c in the washing step, the first communication is performed. One of the switching valves in the flow path is open. Therefore, the amount of gas introduced into one of the concentration adsorption towers 2a, 2b, 2c in the washing step corresponds to the cleaning step. The product of the line time and the flow of gas flowing through the connected flow path. The execution time of the cleaning step in the present embodiment is set to a predetermined time set in advance, and the constant execution time is stored in the control device 20.

又,關於清洗步驟中向濃縮用吸附塔2a、2b、2c中之某個塔所導入之氣體量,可藉由利用第1流量控制閥13調節第1連通流路中所流通之氣體流量而進行變更。因此,將清洗步驟中向濃縮用吸附塔2a、2b、2c中之某個塔導入之氣體G4於第1連通流路中之流量與向濃縮用吸附塔2a、2b、2c導入之原料氦氣G1之氦濃度之間的預先設定之對應關係記憶於控制裝置20。 In addition, the amount of gas introduced into one of the concentration adsorption towers 2a, 2b, and 2c in the cleaning step can be adjusted by adjusting the gas flow rate in the first communication passage by the first flow rate control valve 13. Make changes. Therefore, the flow rate of the gas G4 introduced into one of the concentration adsorption towers 2a, 2b, and 2c in the cleaning step in the first communication flow path and the raw material helium gas introduced into the adsorption adsorption towers 2a, 2b, and 2c are concentrated. The predetermined correspondence between the concentrations of G1 is stored in the control device 20.

藉由控制裝置20為了實行所記憶之實行時間對應之清洗步驟而控制開關閥,並基於所記憶之對應關係利用第1流量控制閥13變更調節氣體流量,以可根據由第1濃度感測器24所檢測出之原料氦氣G1之氦濃度之變化而變更清洗步驟中自處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔向濃縮用吸附塔2a、2b、2c中之某個塔所導入之氣體量。又,將氦濃度之預先設定之設定值記憶於控制裝置20內,於由第1濃度感測器24所檢測出之氦濃度為所記憶之設定值以下時,利用第1流量控制閥13將氣體流量調節為零,不實行清洗步驟。 The control device 20 controls the on-off valve in order to execute the cleaning step corresponding to the stored execution time, and changes the flow rate of the adjustment gas by the first flow rate control valve 13 based on the stored correspondence relationship, so that the first concentration sensor can be used. In the washing step, the other adsorption towers 2a, 2b, and 2c for concentration from the adsorption adsorption towers 2a, 2b, and 2c in the depressurization step in the washing step are changed in accordance with the change in the concentration of the helium gas G1 detected by the raw material 24; The amount of gas introduced by one of the towers. Further, the preset set value of the erbium concentration is stored in the control device 20, and when the enthalpy concentration detected by the first concentration sensor 24 is equal to or lower than the stored set value, the first flow rate control valve 13 is used. The gas flow is adjusted to zero and no cleaning steps are performed.

於該情形時,清洗步驟中向濃縮用吸附塔2a、2b、2c中之某個塔所導入之氣體量對應於處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔於清洗步驟開始時之內壓與清洗步驟結束時之內壓的壓力差δP。因此,藉由根據由第1濃度感測器24所檢測出之氦濃度之變化而變更壓力差δP,從而使清洗步驟中向濃縮用吸附塔2a、2b、2c中之某個塔導入之氣體量成為最佳即可。例如於檢測氦濃度為5vol%以下時,利用第1流量控制閥13將氣體流量調節為零而不實行清洗步驟,以使該壓力差δP成為零。又,於檢測氦濃度超過5vol%之情形時,預先經過實驗對由第1流量控制閥13所調節之連通流路中所流通之氣體 流量與原料氦氣G1之氦濃度之間的關係進行規定,以可隨著檢測氦濃度之增加而增大該壓力差δP。例如規定如檢測氦濃度為10vol%時壓力差δP成為50kPa、檢測氦濃度成為15vol%時壓力差δP成為80kPa、檢測氦濃度成為25vol%時壓力差δP成為100kPa之第1連通流路中所流通之氣體流量與原料氦氣G1之氦濃度之間的關係。關於利用第1流量控制閥13進行之氣體流量調節,只要對濃縮用純化處理步驟之每1個循環進行1次即可,但若原料氦氣G1之濃度變動較小,則亦可對每複數個循環進行1次。 In this case, the amount of gas introduced into one of the concentration adsorption columns 2a, 2b, 2c in the washing step corresponds to another one of the concentration adsorption columns 2a, 2b, 2c in the depressurization step. The pressure difference δP at the internal pressure at the beginning of the washing step and the internal pressure at the end of the washing step. Therefore, by introducing the pressure difference δP according to the change in the enthalpy concentration detected by the first concentration sensor 24, the gas introduced into one of the concentration adsorption columns 2a, 2b, and 2c in the cleaning step is introduced. The quantity is the best. For example, when the enthalpy concentration is 5 vol% or less, the gas flow rate is adjusted to zero by the first flow rate control valve 13 without performing a washing step so that the pressure difference δP becomes zero. Further, when detecting that the cerium concentration exceeds 5 vol%, the gas flowing through the communication path regulated by the first flow rate control valve 13 is experimentally tested in advance. The relationship between the flow rate and the concentration of the raw material helium G1 is specified so as to increase the pressure difference δP as the concentration of the detected helium increases. For example, when the pressure difference δP is 50 kPa when the ruthenium concentration is 10 vol%, the pressure difference δP is 80 kPa when the ruthenium concentration is 15 vol%, and the first communication channel is circulated when the pressure difference δP is 100 kPa when the ruthenium concentration is 25 vol%. The relationship between the gas flow rate and the enthalpy concentration of the raw material helium G1. The gas flow rate adjustment by the first flow rate control valve 13 may be performed once for each cycle of the purification processing step for concentration. However, if the concentration fluctuation of the raw material gas G1 is small, it may be for each plural number. One cycle is performed once.

於根據原料氦氣G1中之氦濃度之變化而變更清洗步驟中自處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔向濃縮用吸附塔2a、2b、2c中之某個塔所導入之氣體量的情形時,處於升壓用均壓步驟之濃縮用吸附塔內部與處於解吸用均壓步驟之濃縮用吸附塔內部成為均壓之時間點上之壓力發生變化。因此,較佳為於使處於升壓步驟之濃縮用吸附塔之內壓升至吸附壓力時,亦使自處於吸附步驟之濃縮用吸附塔向處於升壓步驟之濃縮用吸附塔導入之濃縮氦氣G2之量發生變化。於該情形時,於升壓步驟中,將升壓步驟之時間設為預先設定之一定值,藉由第2流量控制閥15調節第1連通流路中所流通之氣體流量即可。因此,只要預先經過實驗對由第2流量控制閥15所調節之第1連通流路中所流通之氣體流量與原料氦氣G1之氦濃度之間的關係進行規定即可。 In the washing step, the other one of the concentration adsorption columns 2a, 2b, 2c in the depressurization step is added to the concentration adsorption column 2a, 2b, 2c in accordance with the change in the concentration of the ruthenium in the raw material krypton G1. In the case of the amount of gas introduced into a certain column, the pressure at the time point when the inside of the adsorption column for the pressure equalization step is equalized and the inside of the concentration column for concentration in the step of concentration for desorption is equalized. Therefore, it is preferred that when the pressure inside the concentration adsorption column in the step of increasing pressure is raised to the adsorption pressure, the concentration adsorption column from the adsorption column in the adsorption step is introduced into the concentration adsorption column in the concentration step. The amount of gas G2 changes. In this case, in the step of boosting, the time of the step of increasing the pressure is set to a predetermined constant value, and the flow rate of the gas flowing through the first communication passage is adjusted by the second flow rate control valve 15. Therefore, the relationship between the flow rate of the gas flowing through the first communication passage adjusted by the second flow rate control valve 15 and the concentration of the helium gas G1 of the raw material may be defined in advance.

作為用以根據原料氦氣G1中之氦濃度之變化而變更清洗步驟中自處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔向濃縮用吸附塔2a、2b、2c中之某個塔所導入之氣體量的變化例,亦可調節清洗步驟之實行時間。於該情形時,無需藉由第1流量控制閥13控制流量。 The other adsorption towers 2a, 2b, 2c for concentration from the adsorption adsorption towers 2a, 2b, and 2c in the purification step in the purification step are changed in accordance with the change in the concentration of rhodium in the raw material helium G1. The variation of the amount of gas introduced by one of the towers can also adjust the execution time of the cleaning step. In this case, it is not necessary to control the flow rate by the first flow rate control valve 13.

即,清洗步驟中向濃縮用吸附塔2a、2b、2c中之某個塔導入之氣 體量對應於清洗步驟之實行時間與連通流路中所流通之氣體流量的積,因此藉由調節清洗步驟之實行時間可變更該氣體量。 That is, the gas introduced into one of the concentration adsorption towers 2a, 2b, 2c in the washing step The volume corresponds to the product of the execution time of the washing step and the gas flow rate flowing through the communication passage, and therefore the amount of gas can be changed by adjusting the execution time of the washing step.

因此,將清洗步驟之實行時間與原料氦氣G1中之氦濃度之間的預先設定之對應關係記憶於控制裝置20內。基於由控制裝置20所記憶之對應關係而變更清洗步驟之實行時間、即用於實行清洗步驟之開關閥之控制時間,以根據由濃度感測器24所檢測出之原料氦氣G1之氦濃度之變化而變更清洗步驟中自處於減壓步驟之濃縮用吸附塔2a、2b、2c中之另外某個塔向濃縮用吸附塔2a、2b、2c中之某個塔所導入之氣體量。再者,於欲在變更清洗步驟之實行時間之情況下不變更吸附步驟之實行時間之情形時,變更升壓步驟、解吸步驟之實行時間。例如於欲在不變更運轉狀態(a)~(c)中之第1吸附塔2a中之吸附步驟之實行時間之情況下變更運轉狀態(a)中之清洗步驟之實行時間的情形時,只要變更運轉狀態(c)中之升壓步驟、解吸步驟之實行時間即可。除以此外,以與上述實施形態相同之方式進行控制即可。 Therefore, the preset correspondence relationship between the execution time of the washing step and the enthalpy concentration in the raw material krypton gas G1 is stored in the control device 20. The execution time of the cleaning step, that is, the control time of the on-off valve for performing the cleaning step, is changed based on the correspondence relationship stored by the control device 20 to be based on the concentration of the germanium G1 of the raw material G1 detected by the concentration sensor 24. The amount of gas introduced into one of the concentration adsorption towers 2a, 2b, and 2c from the adsorption towers 2a, 2b, and 2c in the depressurization step in the washing step is changed. Further, when it is desired to change the execution time of the adsorption step without changing the execution time of the cleaning step, the execution time of the pressure increasing step and the desorption step is changed. For example, when it is desired to change the execution time of the cleaning step in the operation state (a) without changing the execution time of the adsorption step in the first adsorption tower 2a in the operation states (a) to (c), It is sufficient to change the execution time of the step of boosting and the step of desorbing in the operating state (c). Alternatively, the control may be performed in the same manner as in the above embodiment.

於第2變壓式吸附裝置101中,自處於減壓步驟之再濃縮用吸附塔102a、102b、102c中之另外某個塔向處於清洗步驟之再濃縮用吸附塔102a、102b、102c中之某個塔所導入之氣體量被設為預先設定之一定量。為了成為該一定之氣體量,而將清洗步驟之實行時間設為一定,並藉由第3流量控制閥113調節於連通流路中所流通之氣體流量。又,對應於該氣體量,將升壓步驟之時間設為預先設定之一定值,藉由第4流量控制閥115調節第2連通流路中所流通之氣體流量。 In the second pressure swing adsorption device 101, one of the reconcentration adsorption columns 102a, 102b, and 102c in the depressurization step is in the reconcentration adsorption column 102a, 102b, 102c in the cleaning step. The amount of gas introduced by a certain tower is set to a predetermined amount. In order to achieve the constant gas amount, the execution time of the washing step is made constant, and the third flow rate control valve 113 adjusts the flow rate of the gas flowing through the communication passage. Further, in accordance with the amount of the gas, the time of the step of increasing the pressure is set to a predetermined value, and the flow rate of the gas flowing through the second communication passage is adjusted by the fourth flow rate control valve 115.

根據上述實施形態及變化例,藉由使用第1變壓式吸附裝置1純化原料氦氣G1可連續地排出氦氣富集之濃縮氦氣G2,藉由使用第2變壓式吸附裝置101再次純化該濃縮氦氣G2可連續地排出氦氣進一步富集之再濃縮氦氣G7。即,藉由變壓式吸附法分2階段純化原料氦氣G1,可連續地獲得作為高純度氦氣之再濃縮氦氣G7。藉此,與如先 前般以1階段純化原料氦氣之情形相比,於純化稀薄氦氣時,未使吸附系統大規模化便可靈活應對原料氣體流量與濃度之變動,可效率良好地獲得目標純度之氦氣。又,由於可將逸氣G3、G3'、G8、G8'所含之氦氣再利用,故而可提高回收率,無論於原料氦氣G1之氦濃度超過20vol%之情形時或於原料氦氣G1因經循環逸氣稀釋而氦濃度未達20vol%之情形時,藉由本發明方法均可效率良好地獲得目標純度之氦氣。進而,於第1變壓式吸附裝置1中,隨著向濃縮用吸附塔2a、2b、2c各者所導入之原料氦氣G1之氦濃度變低而減少用以對濃縮用吸附塔2a、2b、2c中之某個塔之內部進行清洗步驟所導入之氣體量,藉此可防止氦氣回收率發生不必要之下降。藉此,可工業性地將稀薄氦氣以小規模設備效率良好地純化為高純度。 According to the above-described embodiment and the modification, the helium-enriched concentrated helium gas G2 can be continuously discharged by purifying the raw material helium G1 by using the first pressure swing adsorption device 1, and the second pressure swing adsorption device 101 is used again. The concentrated helium G2 is purified to continuously discharge the re-concentrated helium G7 from which helium is further enriched. That is, the reductive helium G7 which is a high-purity helium gas can be continuously obtained by purifying the raw material helium G1 in two stages by a pressure swing adsorption method. Take this Compared with the case where the raw material helium gas is purified in the first stage, the raw material gas flow rate and the concentration fluctuation can be flexibly handled without purifying the large-scale adsorption system, and the target purity helium can be efficiently obtained. . Moreover, since the helium contained in the outgassing G3, G3', G8, and G8' can be reused, the recovery rate can be improved, regardless of whether the concentration of the raw material helium G1 exceeds 20 vol% or the raw material is helium. When G1 is diluted by the cyclic outgassing and the cerium concentration is less than 20 vol%, the target purity helium can be efficiently obtained by the method of the present invention. Further, in the first pressure swing type adsorption device 1, the concentration of the raw material helium gas G1 introduced into each of the concentration adsorption towers 2a, 2b, and 2c is lowered, and the adsorption column 2a for concentration is reduced. The amount of gas introduced in the cleaning step in one of the columns 2b and 2c prevents an unnecessary drop in the helium recovery rate. Thereby, the lean helium gas can be industrially purified to high purity in a small-scale apparatus.

[實施例] [Examples] [實施例1] [Example 1]

使用純化系統α,依據上述實施形態而純化原料氦氣G1。 The raw material helium G1 was purified according to the above embodiment using the purification system α.

關於原料氦氣G1,將氦濃度設為15.3vol%,作為雜質氣體之空氣之濃度設為84.7vol%。 Regarding the raw material krypton G1, the cerium concentration was 15.3 vol%, and the concentration of the air as the impurity gas was 84.7 vol%.

向第1變壓式吸附裝置1之原料氦氣G1之供給流量係設為150NL/h。 The supply flow rate to the raw material helium gas G1 of the first pressure swing type adsorption device 1 was set to 150 NL/h.

濃縮用吸附塔2a、2b、2c分別為不鏽鋼製,具有內徑37mm、內部高度1000mm之圓筒形狀,容量約1L。對濃縮用吸附塔2a、2b、2c分別積層填充約0.7L之5A型沸石、約0.3L之活性碳作為吸附劑。 Each of the adsorption adsorption towers 2a, 2b, and 2c is made of stainless steel, and has a cylindrical shape having an inner diameter of 37 mm and an internal height of 1000 mm, and has a capacity of about 1 L. The concentration adsorption columns 2a, 2b, and 2c were respectively filled with about 0.7 L of zeolite 5A and about 0.3 L of activated carbon as an adsorbent.

再濃縮用吸附塔102a、102b、102c分別為不鏽鋼製,具有內徑23mm、內部高度500mm之圓筒形狀,容量約0.2L。對再濃縮用吸附塔102a、102b、102c分別積層填充約0.14L之活性碳、約0.06L之5A型沸石作為吸附劑。 Each of the adsorption-concentrating adsorption towers 102a, 102b, and 102c is made of stainless steel, and has a cylindrical shape having an inner diameter of 23 mm and an inner height of 500 mm, and has a capacity of about 0.2 liter. The reconcentration adsorption columns 102a, 102b, and 102c were respectively filled with about 0.14 L of activated carbon and about 0.06 L of 5A zeolite as an adsorbent.

作為第1變壓式吸附裝置1中之純化處理步驟,於濃縮用吸附塔 2a、2b、2c各自中依序實行吸附步驟365秒、減壓步驟40秒、解吸用均壓步驟20秒、解吸步驟305秒、清洗步驟40秒、升壓用均壓步驟20秒、升壓步驟305秒。自運轉狀態(a)開始至運轉狀態(i)結束為止之1個循環之時間為1095秒。 As a purification treatment step in the first pressure swing adsorption device 1, in the adsorption tower for concentration Each of 2a, 2b, and 2c sequentially performs an adsorption step of 365 seconds, a depressurization step of 40 seconds, a desorption depressing step of 20 seconds, a desorption step of 305 seconds, a washing step of 40 seconds, a step-up step of pressure increasing for 20 seconds, and a step-up. Step 305 seconds. The time from one start of the operation state (a) to the end of the operation state (i) is 1095 seconds.

處於吸附步驟之濃縮用吸附塔2a、2b、2c之內部壓力之最大值係設為0.85MPa(錶壓)。處於減壓步驟之濃縮用吸附塔2a、2b、2c於清洗步驟開始時之內壓與清洗步驟結束時之內壓的壓力差δP係設為80kPa。處於解吸步驟末期、清洗步驟末期之濃縮用吸附塔2a、2b、2c之內部壓力係設為5kPa(錶壓)。 The maximum internal pressure of the adsorption columns 2a, 2b, and 2c in the adsorption step was set to 0.85 MPa (gauge pressure). The pressure difference δP of the internal pressure at the start of the washing step and the internal pressure at the end of the washing step in the adsorption columns 2a, 2b, and 2c in the depressurization step was set to 80 kPa. The internal pressure of the adsorption adsorption towers 2a, 2b, and 2c at the end of the desorption step and at the end of the washing step was set to 5 kPa (gauge pressure).

濃縮氦氣G2之流量為33.9NL/h,氦濃度為61vol%(利用島津製作所製造之GC-TCD進行測定),將該濃縮氦氣G2導入至第2變壓式吸附裝置101內。 The flow rate of the concentrated helium gas G2 was 33.9 NL/h, and the ruthenium concentration was 61 vol% (measured by GC-TCD manufactured by Shimadzu Corporation), and the concentrated helium gas G2 was introduced into the second pressure swing adsorption apparatus 101.

作為第2變壓式吸附裝置101中之純化處理步驟,於再濃縮用吸附塔102a、102b、102c各自中依序實行吸附步驟283秒、減壓步驟60秒、解吸用均壓步驟20秒、解吸步驟203秒、清洗步驟60秒、升壓用均壓步驟20秒、升壓步驟203秒。自運轉狀態(a)'開始至運轉狀態(i)'結束為止之1個循環之時間為849秒。 As a purification treatment step in the second pressure swing adsorption apparatus 101, the adsorption step 283 seconds, the pressure reduction step 60 seconds, and the desorption decompression step 20 seconds are sequentially performed in each of the reconcentration adsorption columns 102a, 102b, and 102c. The desorption step was 203 seconds, the washing step was 60 seconds, the boosting pressure equalization step was 20 seconds, and the pressure increasing step was 203 seconds. The time from one cycle of the operation state (a) to the end of the operation state (i) is 849 seconds.

處於吸附步驟之再濃縮用吸附塔102a、102b、102c之內部壓力之最大值係設為0.8MPa(錶壓)。處於減壓步驟之再濃縮用吸附塔102a、102b、102c於清洗步驟開始時之內壓與清洗步驟結束時之內壓的壓力差δP係設為150kPa。處於解吸步驟末期、清洗步驟末期之濃縮用吸附塔2a、2b、2c之內部壓力係設為5kPa(錶壓)。 The maximum internal pressure of the reconcentration adsorption columns 102a, 102b, and 102c in the adsorption step was set to 0.8 MPa (gauge pressure). The pressure difference δP of the internal pressure at the start of the washing step at the start of the washing step and the pressure at the end of the washing step at the end of the washing step in the depressurization step is set to 150 kPa. The internal pressure of the adsorption adsorption towers 2a, 2b, and 2c at the end of the desorption step and at the end of the washing step was set to 5 kPa (gauge pressure).

逸氣G3、G3'、G8、G8'未被再利用而釋放至常壓空間中。 The outgassing G3, G3', G8, G8' are not reused and released into the atmospheric space.

再濃縮氦氣G7之流量為15.1NL/h,雜質濃度為8.3vol ppm(利用島津製作所製造之GC-TCD進行測定)。整個步驟之氦氣回收率為65.7%。 The flow rate of the re-concentrated helium G7 was 15.1 NL/h, and the impurity concentration was 8.3 vol ppm (measured by GC-TCD manufactured by Shimadzu Corporation). The helium recovery rate for the entire step was 65.7%.

[實施例2] [Embodiment 2]

於第2變壓式吸附裝置101中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為12.8NL/h,雜質濃度設為0.7vol ppm。除此以外設為與實施例1相同。該情形時之整個步驟之氦氣回收率為55.8%。 In the second pressure swing adsorption apparatus 101, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, and the flow rate of the concentrated helium gas G7 was 12.8 NL/h, and the impurity concentration was 0.7 vol ppm. Other than this, it is the same as that of the first embodiment. The helium recovery rate for the entire step in this case was 55.8%.

[實施例3] [Example 3]

設想原料氦氣G1自實施例1之穩定狀態之濃度變動,將原料氦氣G1之氦濃度變更為5.4vol%、空氣濃度變更為95.6vol%。清洗步驟未實施。於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為11.3NL/h,氦濃度設為60vol%。又,於第2變壓式吸附裝置101中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為4.4NL/h,雜質濃度設為8.5vol ppm。除此以外設為與實施例1相同。該情形時之整個步驟之氦氣回收率為54.6%。 The concentration fluctuation of the raw material helium G1 from the steady state of Example 1 was assumed, and the ruthenium concentration of the raw material helium G1 was changed to 5.4 vol%, and the air concentration was changed to 95.6 vol%. The cleaning step was not implemented. In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was 11.3 NL/h, and the ruthenium concentration was 60 vol%. Further, in the second pressure swing adsorption apparatus 101, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, and the flow rate of the concentrated helium gas G7 was 4.4 NL/h, and the impurity concentration was 8.5 vol ppm. Other than this, it is the same as that of the first embodiment. The helium recovery rate for the entire step in this case was 54.6%.

[實施例4] [Example 4]

於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為46.2NL/h,氦濃度設為45vol%。又,於第2變壓式吸附裝置101中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為14.3NL/h,雜質濃度設為8.4vol ppm。除此以外設為與實施例1相同。該情形時之整個步驟之氦氣回收率為62.4%。 In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was set to 46.2 NL/h, and the ruthenium concentration was set to 45 vol%. Further, in the second pressure swing adsorption apparatus 101, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, and the flow rate of the concentrated helium gas G7 was 14.3 NL/h, and the impurity concentration was 8.4 vol ppm. Other than this, it is the same as that of the first embodiment. The helium recovery rate for the entire step in this case was 62.4%.

[實施例5] [Example 5]

於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為26.6NL/h,氦濃度設為75vol%。又,於第2變壓式吸附裝置101中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為14.6NL/h,雜質 濃度設為8.3vol ppm。除此以外設為與實施例1相同。該情形時之整個步驟之氦氣回收率為63.5%。 In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was set to 26.6 NL/h, and the ruthenium concentration was set to 75 vol%. Further, in the second pressure swing type adsorption device 101, the repetition interval of the adsorption step is changed by adjusting the adsorption step time, and the flow rate of the concentrated helium gas G7 is set to 14.6 NL/h, and the impurity is The concentration was set to 8.3 vol ppm. Other than this, it is the same as that of the first embodiment. The helium recovery rate for the entire step in this case was 63.5%.

[實施例6] [Embodiment 6]

將自第2變壓式吸附裝置101所排出之逸氣G8、G8'全部經由循環流路混入至原料氦氣G1中。於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為45.1NL/h,氦濃度設為60vol%。又,於第2變壓式吸附裝置101中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為20.2NL/h,雜質濃度設為8.5vol ppm。除此以外設為與實施例1相同。該情形時之整個步驟之氦氣回收率為88.1%。 All of the outgassing G8 and G8' discharged from the second pressure swing adsorption device 101 are mixed into the raw material gas G1 via the circulation flow path. In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was 45.1 NL/h, and the ruthenium concentration was 60 vol%. Further, in the second pressure swing adsorption apparatus 101, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, and the flow rate of the concentrated helium gas G7 was set to 20.2 NL/h, and the impurity concentration was set to 8.5 vol ppm. Other than this, it is the same as that of the first embodiment. The helium recovery rate for the entire step in this case was 88.1%.

[實施例7] [Embodiment 7]

將占自第1變壓式吸附裝置1所排出之逸氣G3、G3'總量50%者經由循環流路混入至原料氦氣G1。於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為47.9NL/h,氦濃度設為61vol%。又,於第2變壓式吸附裝置101中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為20.8NL/h,雜質濃度設為8.1vol ppm。除此以外設為與實施例1相同。該情形時之整個步驟之氦氣回收率為90.5%。 The total amount of the outgass G3 and G3' discharged from the first pressure swing adsorption device 1 is 50% mixed into the raw material gas G1 via the circulation flow path. In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was 47.9 NL/h, and the ruthenium concentration was 61 vol%. Further, in the second pressure swing adsorption apparatus 101, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G7 was 20.8 NL/h, and the impurity concentration was 8.1 vol ppm. Other than this, it is the same as that of the first embodiment. The helium recovery rate for the entire step in this case was 90.5%.

[實施例8] [Embodiment 8]

設想原料氦氣G1自實施例1之穩定狀態之濃度變動,將原料氦氣G1之氦濃度變更為5.4vol%,空氣濃度變更為95.6vol%。清洗步驟係與實施例1相同之方式實施。於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為10.3NL/h,氦濃度設為61%。又,於第2變壓式吸附裝置101中,調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為3.8NL/h,雜質濃度設為8.0vol ppm。除此以外設為與實施例1相同。該 情形時之整個步驟之氦氣回收率為47.1%。 The concentration fluctuation of the raw material helium G1 from the steady state of Example 1 was assumed, and the enthalpy concentration of the raw material helium G1 was changed to 5.4 vol%, and the air concentration was changed to 95.6 vol%. The washing step was carried out in the same manner as in Example 1. In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was 10.3 NL/h, and the ruthenium concentration was 61%. Further, in the second pressure swing adsorption apparatus 101, the adsorption step time was adjusted to change the repetition interval of the adsorption step, and the flow rate of the concentrated helium gas G7 was set to 3.8 NL/h, and the impurity concentration was set to 8.0 vol ppm. Other than this, it is the same as that of the first embodiment. The The helium recovery rate for the entire step was 47.1%.

[實施例9] [Embodiment 9]

於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為68.9NL/h,氦濃度設為30vol%。又,於第2變壓式吸附裝置101中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為13.2NL/h,雜質濃度設為8.1vol ppm。除此以外設為與實施例1相同。該情形時之整個步驟之氦氣回收率為57.6%。 In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was set to 68.9 NL/h, and the ruthenium concentration was set to 30 vol%. Further, in the second pressure swing adsorption apparatus 101, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, and the flow rate of the concentrated helium gas G7 was 13.2 NL/h, and the impurity concentration was 8.1 vol ppm. Other than this, it is the same as that of the first embodiment. The helium recovery rate for the entire step in this case was 57.6%.

[實施例10] [Embodiment 10]

於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為19.6NL/h,氦濃度設為90vol%。又,於第2變壓式吸附裝置101中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,再濃縮氦氣G7之流量設為13.3NL/h,雜質濃度設為8.1vol ppm。除此以外設為與實施例1相同。該情形時之整個步驟之氦氣回收率為57.8%。 In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was 19.6 NL/h, and the ruthenium concentration was 90 vol%. Further, in the second pressure swing adsorption apparatus 101, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, and the flow rate of the concentrated helium gas G7 was 13.3 NL/h, and the impurity concentration was 8.1 vol ppm. Other than this, it is the same as that of the first embodiment. The helium recovery rate for the entire step in this case was 57.8%.

[比較例1] [Comparative Example 1]

不使用第2變壓式吸附裝置101,僅使用第1變壓式吸附裝置1進行原料氦氣G1之純化。於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為8.6NL/h,雜質濃度設為8.9vol ppm。除此以外,使用第1變壓式吸附裝置1進行純化時之其他條件設為與實施例1相同。該情形時之整個步驟之氦氣回收率為37.3%。 The raw material helium gas G1 is purified only by the first pressure swing type adsorption device 1 without using the second pressure swing type adsorption device 101. In the first pressure swing adsorption apparatus 1, the repetition interval of the adsorption step was changed by adjusting the adsorption step time, the flow rate of the concentrated helium gas G2 was 8.6 NL/h, and the impurity concentration was 8.9 vol ppm. Other conditions in the case of performing purification using the first pressure swing adsorption device 1 were the same as in the first embodiment. The helium recovery rate for the entire step in this case was 37.3%.

[比較例2] [Comparative Example 2]

不使用第2變壓式吸附裝置101,僅使用第1變壓式吸附裝置1進行原料氦氣G1之純化。於第1變壓式吸附裝置1中,藉由調整吸附步驟時間而變更吸附步驟之重複間隔,濃縮氦氣G2之流量設為2.9 NL/h,雜質濃度設為2.2vol ppm。除此以外,使用第1變壓式吸附裝置1進行純化時之其他條件設為與實施例1相同。該情形時之整個步驟之氦氣回收率為12.6%。 The raw material helium gas G1 is purified only by the first pressure swing type adsorption device 1 without using the second pressure swing type adsorption device 101. In the first pressure swing adsorption device 1, the repetition interval of the adsorption step is changed by adjusting the adsorption step time, and the flow rate of the concentrated helium gas G2 is set to 2.9. NL/h, the impurity concentration was set to 2.2 vol ppm. Other conditions in the case of performing purification using the first pressure swing adsorption device 1 were the same as in the first embodiment. The helium recovery rate for the entire step in this case was 12.6%.

通過將上述實施例與比較例進行比較,可確認所獲得之高純度氦氣之流量及回收率較大,稀薄之原料氦氣被效率良好地純化為高純度。通過將實施例3與實施例8進行比較,可確認藉由根據原料氦氣之氦濃度而變更清洗步驟中向濃縮用吸附塔所導入之氣體量,回收率獲得提高。由實施例6、7可確認藉由將逸氣再利用而回收率獲得提高。 By comparing the above examples with the comparative examples, it was confirmed that the obtained high-purity helium gas flow rate and recovery rate were large, and the thin raw material helium gas was efficiently purified to high purity. By comparing Example 3 with Example 8, it was confirmed that the amount of gas introduced into the adsorption tower for concentration in the washing step was changed by the concentration of rhodium in the raw material, and the recovery rate was improved. From Examples 6 and 7, it was confirmed that the recovery rate was improved by recycling the outgas.

本發明並不限定於上述實施形態、實施例、變化例。例如作為各吸附裝置中之純化處理步驟,解吸用均壓步驟與升壓用均壓步驟並非必須,亦可於減壓步驟後實行解吸步驟,於清洗步驟後實行升壓步驟。又,各吸附裝置中之吸附塔數量並不限定於3個塔,只要為複數個即可。進而,亦可藉由將吸附裝置數量設為3個以上而將再濃縮氦氣進一步濃縮,從而實現分3階段以上純化原料氦氣,籍此即便原料氦氣之氦濃度未達1vol%,亦可效率良好地獲得高純度氦氣。 The present invention is not limited to the above embodiments, examples, and modifications. For example, as the purification treatment step in each adsorption device, the depressurization pressure equalization step and the pressure increase pressure equalization step are not essential, and the desorption step may be performed after the depressurization step, and the pressure increasing step may be performed after the washing step. Further, the number of adsorption columns in each adsorption device is not limited to three columns, and may be plural. Further, by further concentrating the reconcentrated helium gas by setting the number of adsorption devices to three or more, the raw material helium gas can be purified in three or more stages, whereby the concentration of the raw material helium gas is less than 1 vol%. High purity helium can be obtained efficiently.

1‧‧‧第1變壓式吸附裝置 1‧‧‧1st variable pressure adsorption device

2a、2b、2c‧‧‧濃縮用吸附塔 2a, 2b, 2c‧‧‧ Concentration adsorption tower

21‧‧‧第1流量感測器 21‧‧‧1st flow sensor

22‧‧‧原料氣體用緩衝槽 22‧‧‧Material gas buffer tank

22a‧‧‧緩衝槽22之貯藏量測定用感測器 22a‧‧‧Sensor for measuring the storage volume of the buffer tank 22

23‧‧‧壓縮機 23‧‧‧Compressor

24‧‧‧第1濃度感測器 24‧‧‧1st concentration sensor

25‧‧‧第3流量控制閥 25‧‧‧3rd flow control valve

26a‧‧‧第1壓力調節閥 26a‧‧‧1st pressure regulating valve

26b‧‧‧第2壓力調節閥 26b‧‧‧2nd pressure regulating valve

41‧‧‧第1循環配管(循環流路) 41‧‧‧1st circulating pipe (circulating flow path)

42‧‧‧第1切換閥 42‧‧‧1st switching valve

43‧‧‧第2循環配管(循環流路) 43‧‧‧2nd cycle piping (circulating flow path)

44‧‧‧第1釋放用配管 44‧‧‧1st release piping

101‧‧‧第2變壓式吸附裝置 101‧‧‧2nd variable pressure adsorption device

102a、102b、102c‧‧‧再濃縮用吸附塔 102a, 102b, 102c‧‧‧reconcentration adsorption tower

121‧‧‧第2流量感測器 121‧‧‧2nd flow sensor

122‧‧‧濃縮氣體用緩衝槽 122‧‧‧Buffer tank for concentrated gas

124‧‧‧第2濃度感測器 124‧‧‧2nd concentration sensor

126a‧‧‧第3壓力調節閥 126a‧‧‧3rd pressure regulating valve

126b‧‧‧第4壓力調節閥 126b‧‧‧4th pressure regulating valve

141‧‧‧第3循環配管(循環流路) 141‧‧‧3rd cycle piping (circulating flow path)

142‧‧‧第2切換閥 142‧‧‧2nd switching valve

143‧‧‧第4循環配管(循環流路) 143‧‧‧4th cycle piping (circulating flow path)

144‧‧‧第2釋放用配管 144‧‧‧Second release piping

G1‧‧‧原料氦氣 G1‧‧‧ raw material helium

G2‧‧‧濃縮氦氣 G2‧‧‧ Concentrated helium

G3、G3'‧‧‧逸氣 G3, G3'‧‧‧ 逸气

G7‧‧‧再濃縮氦氣 G7‧‧‧ reconcentrated helium

G8、G8'‧‧‧逸氣 G8, G8'‧‧‧ 逸气

α‧‧‧氦氣之純化系統 Α‧‧‧氦气的净化系统

Claims (16)

一種氦氣之純化方法,其係使用包含複數個濃縮用吸附塔之第1變壓式吸附裝置與包含複數個再濃縮用吸附塔之第2變壓式吸附裝置對包含雜質氣體之原料氦氣進行純化之方法,且上述各濃縮用吸附塔及上述各再濃縮用吸附塔收納有優先於氦氣吸附雜質氣體之吸附劑,向上述各濃縮用吸附塔依序導入上述原料氦氣,於上述各濃縮用吸附塔中依序實行吸附步驟、減壓步驟、解吸步驟及升壓步驟,該吸附步驟係使所導入之上述原料氦氣所含之雜質氣體於加壓下吸附於上述吸附劑並將未被上述吸附劑吸附之濃縮氦氣排出,該減壓步驟係減小內部壓力,該解吸步驟係使雜質氣體自上述吸附劑解吸而作為逸氣排出,該升壓步驟係提昇內部壓力,對用以自上述第1變壓式吸附裝置排出上述濃縮氦氣之流路連接用以向上述第2變壓式吸附裝置之複數個上述再濃縮用吸附塔各者導入上述濃縮氦氣之流路,向上述各再濃縮用吸附塔依序導入上述濃縮氦氣,於上述各再濃縮用吸附塔中依序實行吸附步驟、減壓步驟、解吸步驟及升壓步驟,該吸附步驟係使所導入之上述濃縮氦氣所含之雜質氣體於加壓下吸附於上述吸附劑並將未被上述吸附劑吸附之再濃縮氦氣排出,該減壓步驟係減小內部壓力,該解吸步驟係使雜質氣體自上述吸附劑解吸而作為逸氣排出,該升壓步驟係提昇內部壓力。 A method for purifying helium, which uses a first pressure swing adsorption device comprising a plurality of adsorption adsorption columns and a second pressure swing adsorption device comprising a plurality of adsorption columns for reconcentration to produce helium gas containing an impurity gas. a method of purifying, wherein each of the adsorption column for concentration and the adsorption column for each of the reconcentration stores an adsorbent that preferentially adsorbs the impurity gas in the helium gas, and sequentially introduces the raw material helium gas into each of the adsorption columns for concentration. Each of the adsorption adsorption towers sequentially performs an adsorption step, a depressurization step, a desorption step, and a pressure increasing step, wherein the adsorption step is performed by adsorbing the impurity gas contained in the introduced raw material helium gas under pressure to the adsorbent. The concentrated helium gas which is not adsorbed by the adsorbent is discharged, and the depressurizing step is to reduce the internal pressure. The desorbing step causes the impurity gas to be desorbed from the adsorbent to be discharged as an outgas, and the step of increasing the pressure is to increase the internal pressure. a plurality of the above-mentioned reconcentration adsorptions for connecting the concentrated helium gas from the first pressure swing adsorption device to the second pressure swing adsorption device Each of the towers is introduced into the flow path of the concentrated helium gas, and the concentrated helium gas is sequentially introduced into the adsorption towers for reconcentration, and the adsorption step, the pressure reduction step, and the desorption step are sequentially performed in each of the adsorption towers for reconcentration. a step of pressurizing the impurity gas contained in the introduced concentrated helium gas adsorbed to the adsorbent under pressure and discharging the re-concentrated helium gas not adsorbed by the adsorbent, the depressurization step The internal pressure is reduced, and the desorbing step causes the impurity gas to be desorbed from the adsorbent to be discharged as an outgas, and the step of boosting is to raise the internal pressure. 如請求項1之氦氣之純化方法,其中將向上述各濃縮用吸附塔所導入之上述原料氦氣之氦濃度設為20vol%以下。 The method for purifying xenon according to claim 1, wherein the concentration of the helium gas of the raw material introduced into each of the adsorption towers for concentration is 20 vol% or less. 如請求項1之氦氣之純化方法,其中以上述濃縮氦氣之氦濃度成為40vol%~80vol%之方式設定上述第1變壓式吸附裝置中之上述吸附步驟之重複間隔。 The method for purifying xenon according to claim 1, wherein the repetition interval of the adsorption step in the first pressure swing adsorption device is set such that the concentration of the concentrated helium gas is 40 vol% to 80 vol%. 如請求項1之氦氣之純化方法,其中將向上述各濃縮用吸附塔所導入之上述原料氦氣之氦濃度設為20vol%以下,且以上述濃縮氦氣之氦濃度成為40vol%~80vol%之方式設定上述第1變壓式吸附裝置中之上述吸附步驟之重複間隔。 The method for purifying xenon according to claim 1, wherein the concentration of the ruthenium of the raw material introduced into each of the adsorption towers for concentration is 20 vol% or less, and the enthalpy concentration of the concentrated helium gas is 40 vol% to 80 vol. In the % mode, the repetition interval of the adsorption step in the first pressure swing adsorption device is set. 如請求項1之氦氣之純化方法,其中以自上述各再濃縮用吸附塔於上述吸附步驟所排出之上述再濃縮氦氣之氦濃度成為99.999vol%以上之方式設定上述第2變壓式吸附裝置中之上述吸附步驟之重複間隔。 The purification method of the helium gas according to claim 1, wherein the second pressure-change type is set such that the concentration of the re-concentrated helium gas discharged from the adsorption step in the adsorption step is 99.999 vol% or more. The repetition interval of the above adsorption step in the adsorption device. 如請求項1之氦氣之純化方法,其中將向上述各濃縮用吸附塔所導入之上述原料氦氣之氦濃度設為20vol%以下,且以自上述各再濃縮用吸附塔於上述吸附步驟所排出之上述再濃縮氦氣之氦濃度成為99.999vol%以上之方式設定上述第2變壓式吸附裝置中之上述吸附步驟之重複間隔。 The method for purifying xenon according to claim 1, wherein the concentration of the helium gas of the raw material introduced into each of the adsorption towers for concentration is 20 vol% or less, and the adsorption column for each reconcentration is used in the adsorption step. The repetition interval of the adsorption step in the second pressure swing adsorption device is set such that the concentration of the reconcentrated helium gas discharged is 99.999 vol% or more. 如請求項1之氦氣之純化方法,其中將向上述各濃縮用吸附塔所導入之上述原料氦氣之氦濃度設為20vol%以下,且以上述濃縮氦氣之氦濃度成為40vol%~80vol%之方式設定上述第1變壓式吸附裝置中之上述吸附步驟之重複間隔,且以自上述各再濃縮用吸附塔於上述吸附步驟所排出之上述再濃縮氦氣之氦濃度成為99.999vol%以上之方式設定上述第2變壓式吸附裝置中之上述吸附步驟之重複間隔。 The method for purifying xenon according to claim 1, wherein the concentration of the ruthenium of the raw material introduced into each of the adsorption towers for concentration is 20 vol% or less, and the enthalpy concentration of the concentrated helium gas is 40 vol% to 80 vol. In the method of %, the repetition interval of the adsorption step in the first pressure swing adsorption device is set, and the concentration of the reconcentrated helium gas discharged from the adsorption column for each reconcentration in the adsorption step is 99.999 vol%. In the above manner, the repetition interval of the adsorption step in the second pressure swing adsorption device is set. 如請求項1至7中任一項之氦氣之純化方法,其中藉由向處於上述解吸步驟後且上述升壓步驟前之狀態的上述某個濃縮用吸附塔內部,導入處於上述減壓步驟之上述另外某個濃縮用吸附塔 之內部氣體後並作為逸氣排出,而實行對處於上述解吸步驟後且上述升壓步驟前之狀態的上述某個濃縮用吸附塔內部進行清洗之清洗步驟,根據向上述濃縮用吸附塔導入之上述原料氦氣之氦濃度之變化,而變更上述清洗步驟中自處於上述減壓步驟之上述另外某個濃縮用吸附塔向上述某個濃縮用吸附塔所導入之氣體量。 The method for purifying helium according to any one of claims 1 to 7, wherein the introduction into the above-mentioned decompression step is performed by the inside of the above-mentioned adsorption column which is in the state after the desorption step and before the step of the step of increasing One of the above-mentioned adsorption towers for concentration After the internal gas is discharged as a gas, a washing step of washing the inside of the concentration adsorption column after the desorption step and before the pressure increasing step is performed, and the step is introduced to the concentration adsorption column. The amount of gas introduced into the above-mentioned adsorption column by the other adsorption column in the above-described decompression step in the above-described washing step is changed by changing the concentration of helium in the raw material. 如請求項8之氦氣之純化方法,其中於向上述濃縮用吸附塔所導入之上述原料氦氣之氦濃度為預先設定之設定值以下時,不實行上述清洗步驟。 The method for purifying xenon according to claim 8, wherein the washing step is not carried out when the concentration of the helium gas of the raw material introduced into the adsorption column for concentration is equal to or lower than a predetermined setting value. 如請求項1至7中任一項之氦氣之純化方法,其中對上述原料氦氣混入自上述第1變壓式吸附裝置與上述第2變壓式吸附裝置中之至少一者所排出之上述逸氣。 The method for purifying helium according to any one of claims 1 to 7, wherein the raw material helium gas is mixed into at least one of the first pressure swing adsorption device and the second pressure swing adsorption device. The above air. 如請求項8之氦氣之純化方法,其中對上述原料氦氣混入自上述第1變壓式吸附裝置與上述第2變壓式吸附裝置中之至少一者所排出之上述逸氣。 The method for purifying helium according to claim 8, wherein the raw material helium gas is mixed with the outgas discharged from at least one of the first pressure swing adsorption device and the second pressure swing adsorption device. 如請求項9之氦氣之純化方法,其中對上述原料氦氣混入自上述第1變壓式吸附裝置與上述第2變壓式吸附裝置中之至少一者所排出之上述逸氣。 The method for purifying helium according to claim 9, wherein the raw material helium gas is mixed with the outgas discharged from at least one of the first pressure swing adsorption device and the second pressure swing adsorption device. 一種氦氣之純化系統,其包括包含複數個濃縮用吸附塔之第1變壓式吸附裝置、與包含複數個再濃縮用吸附塔之第2變壓式吸附裝置,且上述各濃縮用吸附塔及上述各再濃縮用吸附塔收納有優先於氦氣吸附雜質氣體之吸附劑,上述第1變壓式吸附裝置包含:用以向上述各濃縮用吸附塔導入上述原料氦氣之原料氣體導入流路、用以自上述各濃縮用吸附塔排出濃縮氦氣之濃縮氣體流路、用以自上述各濃縮用吸附 塔排出逸氣之第1逸氣流路、用以使上述濃縮用吸附塔中之某個塔與另外某個塔相互連通之第1連通流路、對上述各濃縮用吸附塔與上述原料氣體導入流路之間個別地進行開關之原料氣體導入路開關閥、對上述各濃縮用吸附塔與上述濃縮氣體流路之間個別地進行開關之濃縮氣體路開關閥、對上述各濃縮用吸附塔與上述第1逸氣流路之間個別地進行開關之第1逸氣路開關閥、及對上述各濃縮用吸附塔與上述第1連通流路之間個別地進行開關之第1連通路開關閥,上述第2變壓式吸附裝置包含:用以與上述濃縮氣體流路連接並向上述各再濃縮用吸附塔導入上述濃縮氦氣之濃縮氣體導入流路、用以自上述各再濃縮用吸附塔排出再濃縮氦氣之再濃縮氣體流路、用以自上述各再濃縮用吸附塔排出逸氣之第2逸氣流路、用以使上述再濃縮用吸附塔中之某個塔與另外某個塔相互連通之第2連通流路、對上述各再濃縮用吸附塔與上述濃縮氣體導入流路之間個別地進行開關之濃縮氣體導入路開關閥、對上述各再濃縮用吸附塔與上述再濃縮氣體流路之間個別地進行開關之再濃縮氣體路開關閥、對上述各再濃縮用吸附塔與上述第2逸氣流路之間個別地進行開關之第2逸氣路開關閥、及對上述各再濃縮用吸附塔與上述第2連通流路之間個別地進行開關之第2連通路開關閥,上述開關閥分別被製成包含開關用致動器之自動閥並與控制裝置連接以可個別地執行開關動作,藉由上述控制裝置控制上述各開關閥,以於上述各濃縮用吸附塔中依序實行吸附步驟、減壓步驟、解吸步驟及升壓步驟並於上述各再濃縮用吸附塔中依序實行吸附步驟、減壓步驟、解吸步驟及升壓步驟,上述各濃縮用吸附塔中之吸附步驟係使所 導入之上述原料氦氣所含之雜質氣體於加壓下吸附於上述吸附劑並將未被上述吸附劑吸附之濃縮氦氣排出,減壓步驟係減小內部壓力,解吸步驟係使雜質氣體自上述吸附劑解吸而作為逸氣排出,升壓步驟係提昇內部壓力;上述各再濃縮用吸附塔中之吸附步驟係使所導入之上述濃縮氦氣所含之雜質氣體於加壓下吸附於上述吸附劑並將未被上述吸附劑吸附之再濃縮氦氣排出,減壓步驟係減小內部壓力,解吸步驟係使雜質氣體自上述吸附劑解吸而作為逸氣排出,升壓步驟係提昇內部壓力。 A purification system for helium gas, comprising: a first pressure swing adsorption device comprising a plurality of adsorption adsorption columns; and a second pressure swing adsorption device comprising a plurality of adsorption columns for reconcentration, and each of the adsorption adsorption towers And each of the reconcentration adsorption towers contains an adsorbent that preferentially adsorbs the impurity gas, and the first pressure swing adsorption apparatus includes a raw material gas introduction flow for introducing the raw material helium gas into each of the concentration adsorption towers. a concentrated gas flow path for discharging concentrated helium gas from each of the adsorption towers for concentration, for use in adsorption for each concentration a first communication flow path through which the tower discharges the outgas, a first communication flow path for allowing one of the adsorption adsorption towers to communicate with another column, and the introduction of the concentration adsorption column and the raw material gas a raw material gas introduction switch valve that is separately opened and closed between the flow paths, and a concentrated gas path on-off valve that individually switches between the respective adsorption adsorption towers and the concentrated gas flow path, and the adsorption towers for each concentration a first air passage opening and closing valve that is individually opened and closed between the first air flow paths, and a first communication path switching valve that individually switches between the respective adsorption adsorption towers and the first communication flow path, The second pressure swing type adsorption device includes a concentrated gas introduction flow path for connecting the concentrated gas flow path to the respective reconcentration adsorption columns and introducing the concentrated helium gas, and the adsorption column for each reconcentration a reconcentrated gas flow path for discharging the re-concentrated helium gas, a second escape gas flow path for discharging the outgas from each of the reconcentration adsorption towers, and one of the towers for the reconcentration adsorption tower and another tower a second communication channel that is interconnected, a concentrated gas introduction path switch valve that individually switches between the respective reconcentration adsorption columns and the concentrated gas introduction flow path, and the adsorption column and the re-concentration adsorption column a re-concentrated gas path switching valve that is separately opened and closed between the concentrated gas flow paths, a second escapeable gas switching valve that individually switches between the respective reconcentrating adsorption columns and the second escape flow path, and a pair a second communication path switching valve that is individually opened and closed between each of the reconcentration adsorption towers and the second communication flow path, wherein the switching valves are respectively formed as an automatic valve including a switching actuator and connected to the control device The switching operation can be individually performed, and the respective switching valves are controlled by the control device to sequentially perform an adsorption step, a pressure reduction step, a desorption step, and a pressure increasing step in each of the concentration adsorption columns, and use the respective reconcentration The adsorption step, the depressurization step, the desorption step and the pressure increasing step are sequentially performed in the adsorption tower, and the adsorption step in each of the adsorption towers for concentration is The impurity gas contained in the lead gas introduced into the raw material is adsorbed to the adsorbent under pressure and the concentrated helium gas not adsorbed by the adsorbent is discharged, and the depressurization step reduces the internal pressure, and the desorption step is to make the impurity gas The adsorbent is desorbed and discharged as an outgas, and the step of increasing pressure is to raise the internal pressure; and the adsorption step in each of the reconcentration adsorption towers is such that the impurity gas contained in the introduced concentrated helium gas is adsorbed under pressure The adsorbent discharges the reconcentrated helium gas which is not adsorbed by the adsorbent, and the depressurizing step reduces the internal pressure. The desorbing step causes the impurity gas to be desorbed from the adsorbent to be discharged as an outgas, and the step of boosting increases the internal pressure. . 如請求項13之氦氣之純化系統,其中利用上述控制裝置控制上述各開關閥,以藉由向處於上述解吸步驟後且上述升壓步驟前之狀態的上述某個濃縮用吸附塔內部導入處於上述減壓步驟之上述另外某個濃縮用吸附塔之內部氣體後並作為逸氣排出,而實行對處於上述解吸步驟後且上述升壓步驟前之狀態的上述某個濃縮用吸附塔內部進行清洗之清洗步驟,且其包含對上述第1連通流路中所流通之氣體流量進行調節之流量控制閥,上述流量控制閥被製成包含流量調節用致動器之自動閥並與上述控制裝置連接以可執行流量調節動作,且包含對上述原料氦氣之氦濃度進行檢測並與上述控制裝置連接之感測器,將上述清洗步驟之預先設定之一定實行時間記憶於上述控制裝置,將上述清洗步驟中自處於上述減壓步驟之上述另外某個濃縮用吸附塔向上述某個濃縮用吸附塔導入之氣體於上述第1連通流路中之流量、與向上述濃縮用吸附塔導入之上述原料氦氣之氦濃度之間的預先設定之對應關係記憶於上述控制裝置, 藉由上述控制裝置為了實行所記憶之上述實行時間對應之上述清洗步驟而控制上述開關閥,並基於上述對應關係利用上述流量控制閥變更調節氣體流量,以根據由上述感測器所檢測出之氦濃度之變化而變更上述清洗步驟中向上述某個濃縮用吸附塔導入之氣體量。 The purification system of the helium gas of claim 13, wherein the respective switching valves are controlled by the control device to be introduced into the inside of the certain concentration adsorption column after the desorption step and before the pressure increasing step After the internal gas of the other adsorption adsorption column of the above-mentioned decompression step is discharged as an outgas, the inside of the above-mentioned adsorption column which is in the state after the desorption step and before the pressure increase step is performed. a cleaning step including a flow rate control valve for regulating a flow rate of a gas flowing through the first communication passage, wherein the flow rate control valve is an automatic valve including a flow rate adjusting actuator and is connected to the control device And performing a flow adjustment operation, and including a sensor for detecting a radon concentration of the raw material helium gas and connected to the control device, and storing a predetermined execution time of the cleaning step in the control device, and cleaning the cleaning In the step, the other adsorption column for the concentration in the above-mentioned decompression step is adsorbed to the above certain concentration. A preset correspondence relationship between the flow rate of the gas introduced into the memory of the communication to the first flow path, the helium concentration in the raw material with the introduction of helium gas to the adsorption column was concentrated to the control means, The control device controls the on-off valve in order to execute the cleaning step corresponding to the stored execution time, and changes the flow rate of the adjustment gas by the flow control valve based on the correspondence relationship, based on the detection by the sensor. The amount of gas introduced into the above-described adsorption column in the above-described washing step is changed in the above-described washing step. 如請求項13之氦氣之純化系統,其包含對向上述濃縮用吸附塔導入之上述原料氦氣之氦濃度進行檢測並與上述控制裝置連接之感測器,且將上述清洗步驟之實行時間與上述原料氦氣中之氦濃度之間的預先設定之對應關係記憶於上述控制裝置,藉由上述控制裝置基於上述對應關係而變更上述清洗步驟之實行時間,以根據由上述感測器所檢測出之氦濃度之變化而變更上述清洗步驟中向上述某個濃縮用吸附塔導入之氣體量。 The purification system of the helium gas of claim 13, comprising: a sensor for detecting a radon concentration of the raw material helium introduced into the concentration adsorption tower and connected to the control device, and performing the cleaning step Presetting the correspondence relationship with the radon concentration in the raw material helium gas is stored in the control device, and the control device changes the execution time of the cleaning step based on the correspondence relationship to be detected by the sensor The amount of gas introduced into the above-described adsorption column in the above-described washing step is changed in accordance with the change in the concentration of the mash. 如請求項13至15中任一項之氦氣之純化系統,其包含用以將上述第1逸氣流路與上述第2逸氣流路中之至少一者與上述原料氣體導入流路進行連接之循環流路。 The helium purification system according to any one of claims 13 to 15, comprising a method for connecting at least one of the first gas flow path and the second gas flow path to the raw material gas introduction flow path Circulating flow path.
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