TW201510285A - 電解金屬箔的連續製造方法及電解金屬箔連續製造裝置 - Google Patents

電解金屬箔的連續製造方法及電解金屬箔連續製造裝置 Download PDF

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Publication number
TW201510285A
TW201510285A TW103123764A TW103123764A TW201510285A TW 201510285 A TW201510285 A TW 201510285A TW 103123764 A TW103123764 A TW 103123764A TW 103123764 A TW103123764 A TW 103123764A TW 201510285 A TW201510285 A TW 201510285A
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TW
Taiwan
Prior art keywords
metal foil
anode
electrolytic
cathode drum
metal
Prior art date
Application number
TW103123764A
Other languages
English (en)
Chinese (zh)
Inventor
Takuo Ito
Akihiro Kato
Atsumi Takeuchi
Katsumi Hamaguchi
Yukinori Iguchi
Takamichi Kishi
Original Assignee
Permelec Electrode Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Permelec Electrode Ltd filed Critical Permelec Electrode Ltd
Publication of TW201510285A publication Critical patent/TW201510285A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
TW103123764A 2013-07-18 2014-07-10 電解金屬箔的連續製造方法及電解金屬箔連續製造裝置 TW201510285A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013149687A JP2015021154A (ja) 2013-07-18 2013-07-18 電解金属箔の連続製造方法及び電解金属箔連続製造装置

Publications (1)

Publication Number Publication Date
TW201510285A true TW201510285A (zh) 2015-03-16

Family

ID=52346037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103123764A TW201510285A (zh) 2013-07-18 2014-07-10 電解金屬箔的連續製造方法及電解金屬箔連續製造裝置

Country Status (3)

Country Link
JP (1) JP2015021154A (ja)
TW (1) TW201510285A (ja)
WO (1) WO2015008564A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627920B (zh) * 2017-03-23 2018-07-01 Ykk股份有限公司 Electrodeposition coating device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108425135B (zh) * 2017-02-15 2020-02-07 金居开发股份有限公司 电解铜箔的生产设备及其电流调整控制装置
CN108649183B (zh) * 2018-05-14 2021-01-22 山东金宝电子股份有限公司 一种锂离子电池负极集流体用微孔铜箔的制备方法
CN114686961B (zh) * 2022-04-21 2023-06-02 河南理工大学 一种电铸成型、打孔一体化的多孔铜箔制造系统及方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58177487A (ja) * 1982-04-08 1983-10-18 Sumitomo Metal Ind Ltd 隔膜電解メツキ方法および装置
JPS6026689A (ja) * 1983-07-26 1985-02-09 Sumitomo Metal Ind Ltd 電析による金属箔の製造方法および装置
JP2510422B2 (ja) * 1988-05-25 1996-06-26 ペルメレック電極 株式会社 プリント基板の銅メッキ方法
JPH0673393B2 (ja) * 1988-09-09 1994-09-14 ペルメレック電極株式会社 プリント基板の銅メッキ方法
JPH0819551B2 (ja) * 1989-03-10 1996-02-28 日新製鋼株式会社 鉄系電着方法及び装置
DE4344387C2 (de) * 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
JP3639134B2 (ja) * 1998-12-25 2005-04-20 株式会社荏原製作所 基板めっき装置
JP2003073889A (ja) * 2001-08-29 2003-03-12 Nikko Materials Co Ltd 半導体ウエハの電気銅めっき方法、同装置及びこれらによってめっきされたパーティクル付着の少ない半導体ウエハ
JP2006316328A (ja) * 2005-05-16 2006-11-24 Daiso Co Ltd ２層フレキシブル銅張積層板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI627920B (zh) * 2017-03-23 2018-07-01 Ykk股份有限公司 Electrodeposition coating device
CN110431257B (zh) * 2017-03-23 2021-10-08 Ykk株式会社 电沉积涂装装置

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Publication number Publication date
JP2015021154A (ja) 2015-02-02
WO2015008564A1 (ja) 2015-01-22

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