TW201510285A - Continuous manufacturing method for electrolytic metal foil and continuous manufacturing device for electrolytic metal foil - Google Patents

Continuous manufacturing method for electrolytic metal foil and continuous manufacturing device for electrolytic metal foil Download PDF

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TW201510285A
TW201510285A TW103123764A TW103123764A TW201510285A TW 201510285 A TW201510285 A TW 201510285A TW 103123764 A TW103123764 A TW 103123764A TW 103123764 A TW103123764 A TW 103123764A TW 201510285 A TW201510285 A TW 201510285A
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metal foil
anode
electrolytic
cathode drum
metal
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TW103123764A
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Chinese (zh)
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Takuo Ito
Akihiro Kato
Atsumi Takeuchi
Katsumi Hamaguchi
Yukinori Iguchi
Takamichi Kishi
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Permelec Electrode Ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

Provided are a continuous manufacturing method and manufacturing device for electrolytic metal foil that can prevent nonuniformity of current caused by lead adhering to insoluble metal positive electrodes, can prevent reductions in quality of the metal foil because of bubbles generated on these positive electrodes, can improve yield, can reduce cell voltage, and can prevent accelerated consumption of insoluble metal positive electrodes by additives. The continuous manufacturing method and device for an electrolytic metal foil, wherein the method, which uses a device having a rotating cylindrical negative electrode drum that is partially immersed in an electrolyte for forming a metal foil and an insoluble metal positive electrode having an arc-like shape and a part facing that drum, is characterized in that the device has a structure such that a barrier film is disposed adhering to the surface of the insoluble metal positive electrode, a negative electrode chamber is formed between the negative electrode drum and the barrier film, and a positive electrode chamber is formed on the back side of the positive electrode, and characterized in that an electrolyte for forming the metal foil is supplied inside the negative electrode chamber, an acid solution supplied within the positive electrode chamber, electrolysis carried out, metal foil that is electrolytically deposited on the surface of the negative electrode drum peeled from the negative electrode drum, and the metal foil manufactured continuously.

Description

電解金屬箔的連續製造方法及電解金屬箔連續製造裝置 Continuous manufacturing method of electrolytic metal foil and continuous manufacturing device of electrolytic metal foil

本發明係關於一種適合於各種電解金屬箔、尤其是電解銅箔之連續製造之電解金屬箔的連續製造方法及電解金屬箔連續製造裝置。 The present invention relates to a continuous manufacturing method of an electrolytic metal foil suitable for continuous manufacture of various electrolytic metal foils, particularly electrolytic copper foils, and a continuous manufacturing apparatus for electrolytic metal foils.

作為自習知以來進行之利用連續電解法製造各種金屬箔之技術之例,已知有作為製造印刷配線板之基礎材料之電解銅箔之連續製造。例如,如專利文獻1所記載般,於習知之電解銅箔之連續電解裝置中使用有轉筒狀(圓筒型)之陰極、及將使用鉛-銀合金等之鉛合金電極用作陽極者。 As an example of a technique for producing various metal foils by continuous electrolysis, which has been known since the prior art, continuous production of an electrolytic copper foil as a base material for manufacturing a printed wiring board has been known. For example, as described in Patent Document 1, a tubular (cylindrical) cathode and a lead alloy electrode using a lead-silver alloy or the like are used as an anode in a conventional electrolytic device for electrolytic copper foil. .

該鉛合金電極具備對例如硫酸銅溶液等高濃度之酸性金屬鹽溶液之耐酸性。而且,鉛合金電極因構成成分即鉛之熔點較低,故而亦具有如下優點,即容易進行沿著陰極之轉筒面之形狀而形成對向之彎曲之陽極之對向面之加工,且亦容易於電解裝置之設置現場進行加工。即,鉛合金電極發揮良好之加工性且作業性優異,因此被廣泛使用。 The lead alloy electrode has acid resistance to a high concentration acidic metal salt solution such as a copper sulfate solution. Further, since the lead alloy electrode has a low melting point of lead, which is a constituent component, it has an advantage that it is easy to process the opposite surface of the oppositely curved anode along the shape of the rotating drum surface of the cathode. It is easy to process on site of the electrolyzer. In other words, the lead alloy electrode is widely used because it exhibits good workability and is excellent in workability.

然而,伴隨該電解銅箔之連續電解裝置大型化,而難以於同一面內使鉛合金電極之合金組成均勻化。又,對於作為電解液而使用之酸系溶液中之鉛合金電極而言,合金組成之變動、結晶構造之差異等批次間之差異顯著影響到電解時之極化性能,難以製造跟隨技 術進步之高品質之電解銅箔。 However, as the continuous electrolysis apparatus of the electrolytic copper foil is enlarged, it is difficult to homogenize the alloy composition of the lead alloy electrode in the same plane. Further, in the lead alloy electrode in the acid solution used as the electrolytic solution, the difference in the composition of the alloy and the difference in the crystal structure significantly affect the polarization performance at the time of electrolysis, and it is difficult to manufacture a follow-up technique. High-quality electrolytic copper foil with advanced technology.

而且,鉛合金電極伴隨電解之消耗較大而容易產生電極面之形狀變化,維護成本亦增大,自消耗之電極進入至電解液中之鉛成分有時變化為金屬鉛、鉛離子、酸鉛、氧化鉛等成分並混入至電解銅箔中,從而成為各種製品不良之原因。 Moreover, the lead alloy electrode is likely to cause a change in the shape of the electrode surface due to the large consumption of electrolysis, and the maintenance cost is also increased. The lead component which enters the electrolyte from the electrode which is consumed is sometimes changed to metal lead, lead ion, acid lead. The components such as lead oxide are mixed into the electrolytic copper foil, which causes various products to be defective.

因此,為了解決該等問題點,近年來使用不溶性金屬電極來代替鉛合金電極,該不溶性金屬電極係於鈦等閥金屬表面被覆有包含鉑族金屬或其氧化物之導電性電極物質。 Therefore, in order to solve such problems, in recent years, an insoluble metal electrode has been used in place of a lead alloy electrode, and a surface of a valve metal such as titanium is coated with a conductive electrode material containing a platinum group metal or an oxide thereof.

於使用不溶性金屬電極之習知之電解銅箔之連續電解方法中,如專利文獻1所記載般採用有如下之金屬箔連續電解方法,即,使用配置有將一部分浸漬於金屬箔產生用電解液而旋轉之圓筒狀陰極轉筒、及對向於該陰極轉筒且包圍該陰極轉筒周圍之一部分之剖面圓弧狀之不溶性金屬陽極的裝置,將上述金屬箔產生用電解液供給至上述陰極轉筒與上述陽極之間而使金屬箔電著於上述陰極轉筒上,並將電著之金屬箔自上述陰極轉筒剝離而連續地製造金屬箔。然而,所使用之不溶性金屬陽極係使用包圍上述陰極轉筒之周圍之一部分之剖面圓弧狀之不溶性金屬陽極,其形狀複雜,於利用不溶性金屬電極代替習知之鉛合金電極來替換上述陽極之情形時,存在不僅難以進行其之成形,亦難以更換電極(再活化處理)等問題。 In the continuous electrolysis method of the conventional electrolytic copper foil using the insoluble metal electrode, as described in the patent document 1, the following metal foil continuous electrolysis method is used, that is, the part is immersed in the electrolyte solution for metal foil generation. a rotating cylindrical cathode drum and an apparatus for facing the cathode drum and surrounding an arc-shaped insoluble metal anode of a portion around the cathode drum, and supplying the metal foil generating electrolyte to the cathode A metal foil is electrically connected to the cathode drum between the drum and the anode, and the metal foil is peeled off from the cathode drum to continuously produce a metal foil. However, the insoluble metal anode used uses a cross-sectional arc-shaped insoluble metal anode surrounding a portion of the periphery of the cathode drum, and has a complicated shape, and replaces the anode with an insoluble metal electrode instead of a conventional lead alloy electrode. At the time, there are problems in that it is difficult to form the electrode and it is difficult to replace the electrode (reactivation treatment).

因此,於使用該種不溶性金屬電極作為陽極之情形時,如專利文獻2所示,使用如下之不溶性電極構造體,即設置與陰極轉筒對向且包圍其周圍之一部分之剖面圓弧狀之陽極架台或供電板,利用螺絲等裝卸自如之安裝器件將於板狀或者曲面狀之電極基體之電解作用面之至少一部分形成有電極被覆之薄板狀不溶性金屬陽極固定於 該架台或供電板之表面,並且於與電極基體之薄板狀之不溶性金屬陽極之接觸面形成有電極被覆。 Therefore, when such an insoluble metal electrode is used as the anode, as shown in Patent Document 2, an insoluble electrode structure is used, that is, a cross-sectional arc shape which is opposite to the cathode drum and surrounds a portion thereof The anode frame or the power supply plate is fixed to the at least one part of the electrolytic action surface of the plate-shaped or curved electrode substrate by a detachable mounting device such as a screw or the like, and the thin plate-shaped insoluble metal anode is formed by electrode coating. The surface of the gantry or the power supply board is formed with an electrode coating on a contact surface with a thin plate-shaped insoluble metal anode of the electrode substrate.

銅箔作為電子、電氣材料而尤其被大量使用於印刷配線板用途。印刷配線板之高性能化、高可靠性化在推進,因此要求特性複雜且多樣化。對於成為該印刷配線板之構成材料之一之銅箔亦同樣有嚴格之品質要求。 Copper foil is widely used as a printed circuit board in a large amount as an electronic or electrical material. The high performance and high reliability of printed wiring boards are advancing, so the characteristics are required to be complicated and diverse. There is also a strict quality requirement for the copper foil which is one of the constituent materials of the printed wiring board.

藉此,箔之管理標準變得嚴格,且箔厚均衡之標準亦變得嚴格。又,關於影響銅箔品質之添加劑亦使用各種添加劑,不溶性電極之觸媒消耗變大而短壽命化。 Thereby, the management standard of the foil becomes strict, and the standard of the foil thickness balance becomes strict. Further, various additives are also used for the additive which affects the quality of the copper foil, and the consumption of the catalyst of the insoluble electrode is increased and the life is shortened.

尤其是,於電解銅箔中要抑制同一面內之厚度不均之要求變得顯著。即,於電解銅箔之情形時,自使用電解銅箔製造之印刷配線板上之微間距電路之形成、多層印刷配線板之薄層化等之加工精度、縮小尺寸等之提升的方面考慮,要求更薄且厚度不均較少之電解銅箔。 In particular, the demand for suppressing the thickness unevenness in the same surface in the electrolytic copper foil becomes remarkable. In the case of the electrolytic copper foil, it is considered from the viewpoints of the formation of a fine pitch circuit on a printed wiring board manufactured using an electrolytic copper foil, the processing precision of the multilayer printed wiring board, and the like, and the reduction in size and the like. Electrolytic copper foil which is thinner and less uneven in thickness is required.

由此,期望有能抑制以電解銅箔為首之電解金屬箔之同一面內之厚度不均的電解金屬箔連續製造裝置、及使用該電解金屬箔連續製造裝置所獲得之厚度不均較少之電解金屬箔。 Therefore, it is desired to have an electrolytic metal foil continuous production apparatus capable of suppressing thickness unevenness in the same plane of the electrolytic metal foil including the electrolytic copper foil, and a thickness unevenness obtained by using the electrolytic metal foil continuous production apparatus. Electrolytic metal foil.

然而,於使用專利文獻2所記載之不溶性金屬陽極,且藉由專利文獻1所記載之方法而製造電解銅箔之情形時,電解室僅成為形成於陰極轉筒與不溶性金屬電極之間之1室,含有鉛之電解液於製造箔時作為氧化鉛而析出於不溶性金屬電極上。該析出之氧化鉛於操作中脫落而成為電流分佈不均勻之原因。又,該附著之氧化鉛於電解停止時,作為不良導電體即硫酸鉛化而成為電流分佈不均勻之原因,且成為不溶性金屬電極之壽命變短之主要原因。 However, when the electrolytic copper foil is produced by the method described in Patent Document 1, the electrolytic chamber is formed only between the cathode drum and the insoluble metal electrode. In the chamber, the electrolyte containing lead is deposited as an oxidation lead on the insoluble metal electrode when the foil is manufactured. The precipitated lead oxide falls off during the operation and becomes a cause of uneven current distribution. In addition, when the lead oxide adhered to the lead is desulfurized as a defective conductor, the current distribution is uneven, and the life of the insoluble metal electrode is shortened.

又,附著之鉛以鉛化合物之狀態脫落至電解液中。該鉛化合物被捲入於銅箔中而成為箔品質降低或針孔之原因,從而不溶性電極被交換。 Further, the adhered lead falls into the electrolytic solution in the state of a lead compound. The lead compound is entangled in the copper foil to cause a decrease in the quality of the foil or pinholes, so that the insoluble electrodes are exchanged.

又,作為添加劑,主要使用明膠,但近來作為銅箔之添加劑,使用硫脲、HEC(羥乙基纖維素)之添加劑及其等之組合。其等加速不溶性電極之觸媒消耗而成為電極之短壽命化之主要原因。 Further, gelatin is mainly used as an additive, but recently, as an additive for copper foil, a combination of thiourea, HEC (hydroxyethyl cellulose), and the like has been used. Such acceleration of the catalyst consumption of the insoluble electrode is a major cause of shortening the life of the electrode.

又,於不溶性金屬電極上產生之氧氣之氣泡附著於陰極轉筒而成為針孔之原因。 Further, the bubbles of oxygen generated on the insoluble metal electrode adhere to the cathode drum and become pinholes.

另一方面,作為印刷用輥之鍍銅、印刷配線基板之通孔鍍銅、來自電解銅箔等酸系鍍銅浴之鍍銅技術,於專利文獻3中揭示有如下方法,即藉由陽離子交換膜將陽極室與陰極室分離而進行鍍銅。 On the other hand, as a copper plating method for a copper plate for printing, a copper plating for a through-hole of a printed wiring board, and a copper plating technique for an acid-based copper plating bath such as an electrolytic copper foil, Patent Document 3 discloses a method in which a cation is used. The exchange membrane separates the anode chamber from the cathode chamber to perform copper plating.

專利文獻3係如下者,即於陽極室內一併設置不溶性金屬陽極與可溶性之銅陽極,並藉由陽離子交換膜遮擋、分離該等陽極,於陽極室內,自銅陽極產生之陽極黏質物於陽極室內溶解,且黏質物不會移動至陰極室內之電鍍液中,陰極室內之陰極液未被陽極黏質物污染,從而形成均勻且優異之電鍍被覆。 Patent Document 3 is a method in which an insoluble metal anode and a soluble copper anode are collectively disposed in an anode chamber, and the anode is blocked and separated by a cation exchange membrane, and an anode viscous substance generated from a copper anode is anoded in the anode chamber. The interior dissolves, and the viscous material does not move into the plating solution in the cathode chamber, and the catholyte in the cathode chamber is not contaminated by the anode viscous material, thereby forming a uniform and excellent plating coating.

然而,於專利文獻3中,未對收納陽極之陽極室供給包含添加物之電鍍液,而供給有與電鍍液相同之成分即硫酸銅/硫酸。 However, in Patent Document 3, the plating solution containing the additive is not supplied to the anode chamber in which the anode is housed, and copper sulfate/sulfuric acid which is the same component as the plating solution is supplied.

又,於專利文獻3中,陽離子交換膜係安裝於筒狀之陽極室框之壁面,該陽離子交換膜係與陽極隔開而設置,未直接保持於陽極之表面,從而未與不溶性金屬陽極零間隙化。因此,於專利文獻3中具有如下缺點,即於陽極與陰極間產生液中氣泡,溶液電阻上升,且電壓、電力變高。 Further, in Patent Document 3, the cation exchange membrane is attached to the wall surface of the cylindrical anode chamber frame, and the cation exchange membrane is provided separately from the anode, and is not directly held on the surface of the anode, so that it is not zero with the insoluble metal anode. Clearance. Therefore, Patent Document 3 has a drawback in that bubbles in the liquid are generated between the anode and the cathode, the solution resistance is increased, and the voltage and electric power are increased.

進而,專利文獻3係批次式地製造電解金屬之技術,無法連續製 造電解金屬箔。 Further, Patent Document 3 is a technique for manufacturing electrolytic metal in batch form, and cannot be continuously manufactured. Electrolytic metal foil.

又,專利文獻4與專利文獻3相同,係與印刷用輥之鍍銅、印刷配線基板之通孔鍍銅、來自電解銅箔等硫酸鍍銅浴之鍍銅技術相關者,於專利文獻4中,未於陽極室內收納可溶性之銅陽極,而設置有矩形狀之陽極室框作為陽極室,並於其中收納有不溶性金屬陽極,與專利文獻3相同,陽離子交換膜係貼附於矩形狀之陽極室框之側壁,且未與不溶性金屬陽極零間隙化或有限化,具有與專利文獻3所記載之技術相同之缺點 In addition, Patent Document 4 is the same as Patent Document 3, and is related to copper plating of a printing roller, copper plating of a through hole of a printed wiring board, and copper plating technology of a copper sulfate bath such as an electrolytic copper foil. A rectangular copper anode is not housed in the anode chamber, and a rectangular anode chamber frame is provided as an anode chamber, and an insoluble metal anode is accommodated therein. As in Patent Document 3, the cation exchange membrane is attached to a rectangular anode. The side wall of the chamber frame is not zero-gap or limited with the insoluble metal anode, and has the same disadvantages as the technique described in Patent Document 3.

專利文獻5並非與電鍍裝置相關者,而為與電鍍用不溶性金屬陽極相關者,於專利文獻5中,設置有矩形狀之陽極室框作為陽極室框,並於其中收納有不溶性金屬陽極,或者於其壁之一部分形成有不溶性金屬陽極,與專利文獻3相同,陽離子交換膜係貼附於矩形狀之陽極室框之側壁,但未與不溶性金屬陽極零間隙化或有限化,具有與專利文獻3所記載之技術相同之缺點。 Patent Document 5 is not related to a plating apparatus, and is related to an insoluble metal anode for plating. In Patent Document 5, a rectangular anode chamber frame is provided as an anode chamber frame, and an insoluble metal anode is accommodated therein, or An insoluble metal anode is formed on one of the walls thereof. As in Patent Document 3, the cation exchange membrane is attached to the side wall of the rectangular anode chamber frame, but is not gapped or limited with the insoluble metal anode, and has a patent document. The shortcomings of the techniques described in 3 are the same.

專利文獻6及7均為與可撓性覆銅積層板之製造方法相關之發明,雖有對於藉由陽離子交換膜而將陽極與陰極分離之記載,但關於作為裝置之構造完全未揭示,用以藉由陽離子交換膜分離陽極與陰極之構成亦不清楚,當然,未記載用以使陽離子交換膜與不溶性金屬陽極零間隙化或有限化之構成要件。 Patent Documents 6 and 7 are all related to the method for producing a flexible copper-clad laminate. Although the anode and the cathode are separated by a cation exchange membrane, the structure as a device is not disclosed at all. The configuration in which the anode and the cathode are separated by the cation exchange membrane is also unclear. Of course, the constituent elements for zero-gap or limited the cation exchange membrane and the insoluble metal anode are not described.

如上述般,雖於專利文獻3~7中揭示有藉由陽離子交換膜分離陽極室與陰極室而進行之電解方法,但於該等方法中,陽離子交換膜係與不溶性金屬陽極隔開而配置,且陽離子交換膜與不溶性金屬陽極未被零間隙化,可認為起因在此,根據該等習知技術無法改善因附著於不溶性金屬電極上之鉛所引起之電流不均勻化或因於不溶 性電極上產生之氣泡所引起之銅箔品質降低,且無法提高良率,又,無法防止氣泡或附著鉛之影響,無法降低電池電壓。而且,亦無法防止因添加劑所引起之不溶性電極之消耗加速。 As described above, in Patent Documents 3 to 7, an electrolytic method in which an anode chamber and a cathode chamber are separated by a cation exchange membrane is disclosed, but in these methods, a cation exchange membrane is disposed apart from an insoluble metal anode. Further, the cation exchange membrane and the insoluble metal anode are not zero-gap, and it is considered that the current is not able to improve the current unevenness or the insolubilization due to the lead attached to the insoluble metal electrode according to the conventional techniques. The quality of the copper foil caused by the bubbles generated on the electrodes is lowered, and the yield cannot be improved. Moreover, the influence of bubbles or adhesion of lead cannot be prevented, and the battery voltage cannot be lowered. Moreover, it is also impossible to prevent the consumption of the insoluble electrode due to the additive from accelerating.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2001-81592號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-81592

[專利文獻2]日本專利特開平5-202498號公報 [Patent Document 2] Japanese Patent Laid-Open No. Hei 5-202498

[專利文獻3]日本專利第3455705號公報 [Patent Document 3] Japanese Patent No. 3455705

[專利文獻4]日本專利第3903120號公報 [Patent Document 4] Japanese Patent No. 3903120

[專利文獻5]日本專利第3928013號公報 [Patent Document 5] Japanese Patent No. 3928013

[專利文獻6]日本專利特開2006-316328號公報 [Patent Document 6] Japanese Patent Laid-Open Publication No. 2006-316328

[專利文獻7]日本專利第4560726號公報 [Patent Document 7] Japanese Patent No. 4560726

本發明之目的在於提供一種電解金屬箔連續製造方法及製造裝置,可解決該等習知技術之問題點,防止因附著於不溶性金屬陽極上之鉛所引起之電流不均勻化或因於不溶性金屬陽極上產生之氣泡所引起之銅箔品質降低,且可提高良率,消除氣泡或附著鉛之影響,降低電池電壓,又,可防止因添加劑所引起之不溶性金屬陽極之消耗加速。 An object of the present invention is to provide a method and a manufacturing apparatus for continuously manufacturing an electrolytic metal foil, which can solve the problems of the prior art and prevent current unevenness caused by lead attached to an insoluble metal anode or due to insoluble metal. The quality of the copper foil caused by the bubbles generated on the anode is lowered, the yield can be improved, the effect of bubbles or adhesion of lead can be eliminated, the battery voltage can be lowered, and the consumption of the insoluble metal anode caused by the additive can be prevented from being accelerated.

在本發明中之第1解決手段中,用於達成上述目的而提供一種電解金屬箔連續製造方法,該電解金屬箔連續製造方法係使用 具有圓筒狀陰極轉筒與剖面圓弧狀之不溶性金屬陽極之裝置,該圓筒狀陰極轉筒係具有以一部分浸漬於金屬箔產生用電解液之方式而進行旋轉之構造,該剖面圓弧狀之不溶性金屬陽極係以對向於該陰極轉筒之周圍之一部分之方式加以配置,且將其周圍之一部分加以包圍;將上述金屬箔產生用電解液供給至上述陰極轉筒之表面而使金屬箔電著於上述陰極轉筒上,並將電著之金屬箔自上述陰極轉筒加以剝離,從而連續製造金屬箔,上述電解金屬箔連續製造方法之特徵在於:上述裝置係具有以下之構造,即:於上述不溶性金屬陽極之剖面圓弧狀之表面以密接之方式配置有隔膜,且於上述陰極轉筒與該隔膜之間形成有陰極室,並且於上述不溶性金屬陽極之背面側形成有陽極室;且利用以下之方式連續地製造金屬箔,即:將金屬箔產生用電解液供給至上述陰極室內,將酸溶液供給至上述陽極室內而進行電解,將於上述陰極轉筒之表面所電解析出之金屬箔自上述陰極轉筒加以剝離。 In the first solution of the present invention, in order to achieve the above object, a method for continuously manufacturing an electrolytic metal foil, which is used in a continuous manufacturing method, is provided. An apparatus having a cylindrical cathode drum and an insoluble metal anode having an arcuate cross section, the cylindrical cathode drum having a structure in which a part of the cylindrical cathode drum is immersed in an electrolyte for generating a metal foil, and the section arc The insoluble metal anode is disposed so as to face a portion of the periphery of the cathode drum, and surrounds one of the surrounding portions; and the electrolyte solution for generating metal foil is supplied to the surface of the cathode drum The metal foil is electrically connected to the cathode drum, and the metal foil is peeled off from the cathode drum to continuously manufacture the metal foil. The method for continuously manufacturing the electrolytic metal foil is characterized in that the apparatus has the following structure That is, a separator is disposed on the arcuate surface of the insoluble metal anode in a close contact manner, and a cathode chamber is formed between the cathode drum and the separator, and a back surface side of the insoluble metal anode is formed An anode chamber; and the metal foil is continuously produced by the following method: supplying the metal foil generating electrolyte to the above Chamber, the acid solution is fed to the anode chamber and the electrolysis, the electrolytic deposition will be the surface of the cathode drum of the metal foil to be peeled off from the cathode drum.

於本發明中之第2解決手段中,用於達成上述目的而提供一種電解金屬箔連續製造方法,其特徵在於:上述金屬箔為銅箔,上述金屬箔產生用電解液為硫酸銅溶液,且上述酸溶液為純硫酸溶液。 In the second solution of the present invention, in order to achieve the above object, a method for continuously producing an electrolytic metal foil is provided, characterized in that the metal foil is a copper foil, and the electrolyte for generating the metal foil is a copper sulfate solution, and The above acid solution is a pure sulfuric acid solution.

於本發明中之第3解決手段中,用於達成上述目的而提供一種電解金屬箔連續製造方法,其特徵在於:上述隔膜為陽離子交換膜。 In a third solution of the present invention, in order to achieve the above object, a method for continuously producing an electrolytic metal foil according to the present invention is characterized in that the separator is a cation exchange membrane.

於本發明中之第4解決手段中,用於達成上述目的而提供一種電解金屬箔連續製造方法,其特徵在於:上述隔膜為陰離子交 換膜。 In the fourth solution of the present invention, in order to achieve the above object, a method for continuously manufacturing an electrolytic metal foil is provided, characterized in that the separator is an anion Change the film.

於本發明中之第5解決手段中,用於達成上述目的而提供一種電解金屬箔連續製造方法,其特徵在於:上述隔膜為中性隔膜。 In the fifth solution of the present invention, in order to achieve the above object, a method for continuously producing an electrolytic metal foil according to the present invention is characterized in that the separator is a neutral separator.

於本發明中之第6解決手段中,用於達成上述目的而提供一種電解金屬箔連續製造方法,其特徵在於:上述陽離子交換膜為全氟磺酸膜。 In the sixth solution of the present invention, in order to achieve the above object, a method for continuously producing an electrolytic metal foil according to the present invention is characterized in that the cation exchange membrane is a perfluorosulfonic acid membrane.

於本發明中之第7解決手段中,用於達成上述目的而提供一種電解金屬箔連續製造裝置,該電解金屬箔連續製造裝置係用於連續地製造金屬箔而具有以下之部分而成,即具有:圓筒狀陰極轉筒,其具有以一部分浸漬於金屬箔產生用電解液之方式而進行旋轉之構造;剖面圓弧狀之不溶性金屬陽極,其對向於該陰極轉筒之周圍之一部分,且將其周圍之一部分加以包圍;將上述金屬箔產生用電解液供給至上述陰極轉筒之表面而使金屬箔電著在上述陰極轉筒上之裝置;及將電著之金屬箔自上述陰極轉筒加以剝離之裝置;上述電解金屬箔連續製造裝置之特徵在於具備有:電解部,其包括有:隔膜,其於上述不溶性金屬陽極之剖面圓弧狀之表面以密接之方式加以配置;陰極室,其形成於上述陰極轉筒與該隔膜之間;及陽極室,其形成於上述不溶性金屬陽極之背面側;用於將金屬箔產生用電解液供給至上述陰極室內之裝置;用於將酸溶液供給至上述陽極室內之裝置;及用於將於上述陰極轉筒之表面所電解析出之金屬箔自上述陰極轉筒加以剝離而連續地捲取金屬箔之裝置。 In the seventh solution of the present invention, in order to achieve the above object, an apparatus for continuously producing an electrolytic metal foil which is used for continuously producing a metal foil and having the following portions is provided, that is, The cylindrical cathode drum has a structure in which a part of the anode is immersed in an electrolyte for generating a metal foil, and an insoluble metal anode having an arc-shaped cross section is opposed to a portion around the cathode drum. And surrounding one of the surrounding portions; a device for supplying the metal foil generating electrolyte to the surface of the cathode drum to electrically charge the metal foil on the cathode drum; and an electric metal foil from the above The apparatus for continuously peeling off a cathode drum; the apparatus for continuously manufacturing an electrolytic metal foil characterized by comprising: an electrolysis unit comprising: a separator disposed in close contact with an arc-shaped surface of the insoluble metal anode; a cathode chamber formed between the cathode drum and the separator; and an anode chamber formed on the back of the insoluble metal anode a device for supplying a metal foil generating electrolyte into the cathode chamber; a device for supplying an acid solution into the anode chamber; and a metal foil for electrically analyzing the surface of the cathode drum A device for continuously stripping a metal foil from the above-mentioned cathode drum.

再者,於本說明書中,所謂將隔膜密接於不溶性金屬陽 極之剖面圓弧狀之表面而配置係指包含如下狀態之任一狀態,即:不溶性金屬陽極與隔膜整體或部分地密接之狀態(零間隙化狀態);及隔著微小間隔而配置之狀態(有限化狀態)。 Furthermore, in the present specification, the membrane is in close contact with the insoluble metal cation. The arrangement of the arc-shaped surface of the pole section refers to any state in which the insoluble metal anode and the separator are in close contact with each other or partially (zero-gap state); and the state in which the insoluble metal anode is disposed with a small interval (limited state).

根據本發明,於使用將其一部分浸漬於金屬箔產生用電解液而旋轉之構造之圓筒狀陰極轉筒、及與該轉筒之一部分對向而配置之剖面圓弧狀之不溶性金屬陽極之習知技術中,藉由設為新將隔膜密接於該剖面圓弧狀之不溶性金屬陽極之表面而設置之構成,而可獲得以下之顯著之效果。 According to the present invention, a cylindrical cathode drum having a structure in which a part thereof is immersed in a metal foil-generating electrolytic solution and an insoluble metal anode having a cross-sectional arc shape disposed opposite to one of the rotating tubes is used. In the conventional technique, by providing a structure in which a new separator is closely attached to the surface of the arc-shaped insoluble metal anode, the following remarkable effects can be obtained.

首先,根據本發明,藉由隔膜而被分離而形成有陽極室與陰極室,不溶性金屬陽極配置於藉由該隔膜而與陰極室隔離之陽極室內,對陽極室內供給包含純硫酸般之純酸溶液之陽極液,另一方面,陰極配置於藉由上述隔膜而與陽極室隔離之陰極室內,對該陰極室內供給包含鉛或添加劑之硫酸銅溶液般之金屬箔產生用電解液(陰極液),因此不溶性金屬陽極僅與包含純酸溶液之陽極液接觸,而不會與含有包含鉛或添加劑之硫酸銅溶液之陰極液接觸,因此並無鉛或添加劑析出於不溶性金屬陽極之虞。 First, according to the present invention, an anode chamber and a cathode chamber are separated by a separator, and an insoluble metal anode is disposed in an anode chamber separated from the cathode chamber by the separator, and a pure acid containing pure sulfuric acid is supplied to the anode chamber. The anolyte of the solution, on the other hand, the cathode is disposed in the cathode chamber separated from the anode chamber by the separator, and the electrolyte for producing a metal foil (cathode liquid) is supplied to the cathode chamber by a copper sulfate solution containing lead or an additive. Therefore, the insoluble metal anode is only in contact with the anolyte containing the pure acid solution, and is not in contact with the catholyte containing the copper sulfate solution containing lead or the additive, so that no lead or the additive is precipitated from the insoluble metal anode.

又,根據本發明,於製造箔時並無氧化鉛析出於不溶性金屬陽極上之情況,因此無因脫落之鉛化合物所引起之電流分佈之不均勻化,且長期維持銅箔之均勻性,故而不會因附著鉛之影響而導致要更換不溶性金屬陽極。 Moreover, according to the present invention, since there is no case where lead oxide is deposited on the insoluble metal anode at the time of producing the foil, there is no unevenness in current distribution due to the lead compound which has fallen off, and the uniformity of the copper foil is maintained for a long period of time. The insoluble metal anode is not replaced due to the adhesion of lead.

進而,根據本發明,無因硫酸銅溶液般之金屬箔產生用電解液中之添加劑所引起之不溶性金屬陽極之觸媒消耗加速,因此可達成不溶性金屬陽極之長壽命化。 Further, according to the present invention, the catalyst consumption of the insoluble metal anode caused by the additive in the electrolytic solution for producing a metal foil such as a copper sulfate solution is not accelerated, so that the life of the insoluble metal anode can be extended.

又,根據本發明,鉛化合物之向銅箔之捲入消失,可提高箔品質及利用針孔之減低而提高良率。 Moreover, according to the present invention, the entrapment of the lead compound into the copper foil disappears, and the quality of the foil can be improved and the pinhole can be reduced to improve the yield.

而且,根據本發明,隔膜直接配置於不溶性金屬陽極之表面,且上述陽極與隔膜密接配置,因此於不溶性金屬陽極上產生之氣泡被直接自陽極室排出而不會移動至陰極室,因此可對電解析出於陰極表面之金屬箔消除因氣泡所引起之針孔。因此,根據本發明,可防止因於不溶性金屬陽極上產生之氣泡所引起之銅箔品質降低,且可提高良率。 Moreover, according to the present invention, the separator is disposed directly on the surface of the insoluble metal anode, and the anode is disposed in close contact with the separator, so that bubbles generated on the insoluble metal anode are directly discharged from the anode chamber without moving to the cathode chamber, so Electrochemical analysis of the metal foil from the surface of the cathode eliminates pinholes caused by air bubbles. Therefore, according to the present invention, it is possible to prevent the quality of the copper foil caused by the bubbles generated on the insoluble metal anode from being lowered, and the yield can be improved.

1‧‧‧電解槽 1‧‧‧electrolyzer

2‧‧‧陰極轉筒 2‧‧‧Cathode rotating drum

3‧‧‧不溶性金屬陽極 3‧‧‧Insoluble metal anode

4‧‧‧隔膜 4‧‧‧Separator

5‧‧‧陰極室 5‧‧‧Cathode chamber

6‧‧‧供電板 6‧‧‧Power supply board

7‧‧‧陽極室 7‧‧‧Anode chamber

8‧‧‧金屬箔產生用電解液供給管 8‧‧‧Electrolyte supply tube for metal foil generation

9‧‧‧酸溶液供給管 9‧‧‧Acid solution supply pipe

10‧‧‧金屬箔 10‧‧‧metal foil

11‧‧‧金屬箔捲取輥 11‧‧‧Metal foil take-up rolls

12‧‧‧構成不溶性金屬陽極3之形成為短條狀之長方形狀之陽極網孔 12‧‧‧A rectangular mesh forming an insoluble metal anode 3 formed into a short strip shape

13‧‧‧供電凸座 13‧‧‧Power supply

14‧‧‧埋頭螺釘 14‧‧‧ countersunk screws

15‧‧‧供電板6之凸緣部 15‧‧‧Flange of the power supply board 6

16‧‧‧襯墊 16‧‧‧ cushion

17‧‧‧凸緣 17‧‧‧Flange

18‧‧‧埋頭螺釘 18‧‧‧ countersunk screws

19‧‧‧蓋帽式螺母 19‧‧‧Cap nut

20‧‧‧溢流槽 20‧‧‧Overflow trough

21‧‧‧硫酸銅溶液儲槽 21‧‧‧ copper sulfate solution storage tank

22‧‧‧銅溶解槽 22‧‧‧ copper dissolution tank

23‧‧‧硫酸溶液儲槽 23‧‧‧ sulfuric acid solution storage tank

圖1係表示作為本發明之電解金屬箔連續製造裝置之一實施形態之連續製造電解銅箔之裝置之基本構造的示意圖。 Fig. 1 is a schematic view showing the basic configuration of an apparatus for continuously producing an electrolytic copper foil as an embodiment of the electrolytic metal foil continuous production apparatus of the present invention.

圖2係於使用於本發明之電解金屬箔連續製造裝置之不溶性金屬陽極之表面配置有隔膜之狀態之一實施形態之一部分切除立體圖。 Fig. 2 is a partially cutaway perspective view showing one embodiment of a state in which a separator is disposed on the surface of an insoluble metal anode of the electrolytic metal foil continuous manufacturing apparatus of the present invention.

圖3係圖2之C剖面圖。 Figure 3 is a cross-sectional view taken along line C of Figure 2.

以下,將本發明之實施之形態與圖式一併進行說明。 Hereinafter, the form of implementation of the present invention will be described together with the drawings.

圖1係表示作為本發明之電解金屬箔連續製造裝置之一實施形態之連續製造電解銅箔之裝置之基本構造者。該電解銅箔裝置於電解槽1中設置有鈦或鎳製之圓筒狀陰極轉筒2。該陰極轉筒2具有可旋轉之構造,且係以於部分地(大致下半部分)浸漬於金屬箔產生用電解液中之狀態下旋轉之方式配置於電解槽1中。而且,以包圍該陰極轉筒2之外周下半部分之方式設置有剖面圓弧狀之不溶性金屬陽極3,陰極轉筒2之外周下半部分成為與不溶性金屬陽極3對向而配置之狀態。本發明之電解金屬箔連續製造裝置之特徵在於以如下方式設 置,即於該對向之部分上之陰極轉筒2與不溶性金屬陽極3之間設置有一定之間隙,進而於不溶性金屬陽極3之剖面圓弧狀之表面密接有隔膜4而配置。於本發明之裝置中,藉由設為上述構造,於上述陰極轉筒2與密接於不溶性金屬陽極3之表面而設置之隔膜4之間形成有間隙,並將該間隙作為陰極室5。於圖1所例示之本發明之電解金屬箔連續製造裝置中,不溶性金屬陽極3安裝於供電板6,將不溶性金屬陽極3之與設置有隔膜4之側相反之背面側與供電板6之內壁之間隙作為陽極室7。上述之間隙中之間隔並非均與習知之相同之構成之電解金屬箔連續製造裝置之間隔不同,為相同之設計即可。於本發明中重要的是藉由將隔膜4密接於不溶性金屬陽極3之表面而設置,進而劃分為陰極室5與陽極室7。 Fig. 1 is a view showing a basic structure of an apparatus for continuously producing an electrolytic copper foil as an embodiment of an apparatus for continuously producing an electrolytic metal foil according to the present invention. The electrolytic copper foil device is provided with a cylindrical cathode drum 2 made of titanium or nickel in the electrolytic cell 1. The cathode drum 2 has a rotatable structure and is disposed in the electrolytic cell 1 so as to be partially (substantially lower half) immersed in the molten metal generating electrolyte. In addition, an insoluble metal anode 3 having an arcuate cross section is provided so as to surround the lower half of the outer circumference of the cathode drum 2, and the lower half of the outer circumference of the cathode drum 2 is placed opposite to the insoluble metal anode 3. The electrolytic metal foil continuous manufacturing apparatus of the present invention is characterized in that it is designed as follows In the meantime, a certain gap is provided between the cathode drum 2 and the insoluble metal anode 3 on the opposite portion, and the separator 4 is placed in close contact with the arc-shaped surface of the insoluble metal anode 3. In the apparatus of the present invention, a gap is formed between the cathode drum 2 and the separator 4 which is provided in close contact with the surface of the insoluble metal anode 3, and the gap is used as the cathode chamber 5. In the electrolytic metal foil continuous manufacturing apparatus of the present invention illustrated in Fig. 1, the insoluble metal anode 3 is attached to the power supply board 6, and the back side of the insoluble metal anode 3 opposite to the side on which the diaphragm 4 is provided is inside the power supply board 6. The gap of the wall serves as the anode chamber 7. The interval between the gaps described above is not the same as that of the conventional electrolytic metal foil continuous manufacturing apparatus having the same configuration, and may be the same design. It is important in the present invention to provide the separator 4 in close contact with the surface of the insoluble metal anode 3, and further divide into the cathode chamber 5 and the anode chamber 7.

於上述之陰極室5連接有金屬箔產生用電解液供給管8,於經由隔膜4密接於表面而成之不溶性金屬陽極3而與該陰極室5隔開之陽極室7連接有純酸溶液供給管9。而且,通過該等管而硫酸銅溶液等金屬箔產生用電解液自金屬箔產生用電解液槽被導入至陰極室5,且硫酸等純酸溶液被導入至陽極室7。硫酸銅溶液等金屬箔產生用電解液例如以圖1所示之流程,自陰極室5溢流至溢流槽20,並儲存於硫酸銅溶液儲槽21。儲存於硫酸銅溶液儲槽21之硫酸銅溶液以如下方式循環使用,即於銅溶解槽22中溶解金屬銅而產生之新的硫酸銅溶液隨時供給,而補給藉由電解而使用之銅成分,又,供給至陽極室7之純硫酸溶液自陽極室7溢流並儲存於硫酸溶液儲槽23而循環使用。 The electrolyte solution supply pipe 8 for metal foil generation is connected to the cathode chamber 5, and the insoluble metal anode 3 which is adhered to the surface via the separator 4 is connected to the anode chamber 7 which is separated from the cathode chamber 5 by a pure acid solution supply. Tube 9. In addition, the metal foil generating electrolyte solution such as a copper sulfate solution is introduced into the cathode chamber 5 from the metal foil generating electrolyte tank by the tubes, and a pure acid solution such as sulfuric acid is introduced into the anode chamber 7. An electrolytic solution for generating a metal foil such as a copper sulfate solution overflows from the cathode chamber 5 to the overflow tank 20, for example, in the flow shown in FIG. 1, and is stored in the copper sulfate solution storage tank 21. The copper sulfate solution stored in the copper sulfate solution storage tank 21 is recycled in such a manner that a new copper sulfate solution produced by dissolving metallic copper in the copper dissolution tank 22 is supplied at any time, and the copper component used for electrolysis is supplied. Further, the pure sulfuric acid solution supplied to the anode chamber 7 overflows from the anode chamber 7 and is stored in the sulfuric acid solution storage tank 23 for recycling.

圖1中之10為成為製品之金屬箔,11為金屬箔捲取輥。 In Fig. 1, 10 is a metal foil to be a product, and 11 is a metal foil take-up roll.

圖2係於使用於本發明之電解金屬箔連續製造裝置之不溶性金屬陽極之表面配置有隔膜之狀態之一實施形態之一部分切除立 體圖,圖3係表示圖2之C剖面圖。 2 is a partial cutaway view of one embodiment of a state in which a separator is disposed on the surface of an insoluble metal anode used in the continuous manufacturing apparatus for electrolytic metal foil of the present invention; FIG. 3 is a cross-sectional view taken along line C of FIG. 2 .

如圖2、圖3所示,不溶性金屬陽極3係以如下方式組裝,即形成為短條狀之複數個長方形之網孔形狀之陽極片12,以相互抵接之方式配置於形成為圓周之四分之一之圓弧狀之供電板6之表面,且利用埋頭螺釘14裝卸自如地固定於複數個供電凸座13,並沿著供電板6之圓弧。形成為圓周之四分之一之圓弧狀之供電板6隔著金屬箔產生用電解液供給管8及酸溶液供給管9而設置於圓筒狀陰極轉筒2之下部之兩側。 As shown in FIG. 2 and FIG. 3, the insoluble metal anode 3 is assembled in such a manner that a plurality of rectangular mesh-shaped anode sheets 12 formed in a short strip shape are arranged to be circumferentially abutting each other. The surface of the one-fourth arc-shaped power supply plate 6 is detachably fixed to the plurality of power supply bosses 13 by the countersunk screws 14 and along the arc of the power supply plate 6. The power supply plate 6 formed in an arc shape of one quarter of the circumference is provided on both sides of the lower portion of the cylindrical cathode drum 2 via the metal foil generating electrolyte supply pipe 8 and the acid solution supply pipe 9.

將隔膜4貼合於如上所述般組裝之不溶性金屬陽極3之表面,使隔膜4之4邊重疊於供電板6之凸緣部15,利用襯墊16覆蓋該重疊部位,並於其上設置凸緣17。其後,利用蓋帽式螺母19將夾於凸緣17與凸緣部15(包含與膜重疊之部位)之間之襯墊16裝卸自如地緊固於埋頭螺釘18與凸緣17上(將周圍密封熔接)。 The separator 4 is bonded to the surface of the insoluble metal anode 3 assembled as described above, and the four sides of the separator 4 are superposed on the flange portion 15 of the power supply plate 6, and the overlapping portion is covered by the spacer 16, and is placed thereon. Flange 17. Thereafter, the gasket 16 sandwiched between the flange 17 and the flange portion 15 (including the portion overlapping the film) is detachably fastened to the countersunk screw 18 and the flange 17 by the cap nut 19 (to the periphery) Seal welding).

如上所述,藉由使用襯墊16於供電板6之4邊按壓密封隔膜4,而形成流過供電板6之內壁側之液體之流路(陽極室7)。 As described above, by pressing the sealing diaphragm 4 on the four sides of the power supply board 6 by using the spacer 16, a flow path (anode chamber 7) of the liquid flowing through the inner wall side of the power supply board 6 is formed.

繼而,關於本發明之電解金屬箔連續製造方法之1例,對上述金屬箔為銅箔、上述金屬箔產生用電解液為硫酸銅溶液、且上述酸溶液為純硫酸溶液之情形進行說明。 In the first embodiment of the method for continuously producing an electrolytic metal foil according to the present invention, the case where the metal foil is a copper foil, the electrolyte solution for producing the metal foil is a copper sulfate solution, and the acid solution is a pure sulfuric acid solution will be described.

設置於電解槽1中之鈦製或鎳製之圓筒狀陰極轉筒2係以部分性地(大致下半部分)浸漬於金屬箔產生用電解液即硫酸銅溶液中之狀態向圖1之箭頭方向旋轉。金屬箔產生用電解液即硫酸銅溶液自陰極轉筒2之中心部之下方且自金屬箔產生用電解液供給管8流入至形成於陰極轉筒2與隔膜4之間之陰極室5內。該硫酸銅溶液含有用以改善所形成之銅箔之性狀之明膠等大量之添加劑,且以循環之方式構成, 於循環中途,將成為金屬箔之原料之金屬銅溶解並添加至硫酸銅溶液中,從而調整硫酸銅溶液之濃度。又,酸溶液即純硫酸溶液自陰極轉筒2之中心部之下方且自酸溶液供給管9流入至形成於不溶性金屬陽極3之背面側之供電板6之內壁側之陽極室7內。該純硫酸溶液亦以循環之方式構成。於陰極轉筒2與不溶性金屬陽極3之間,經由整流器(未圖示)將既定之電壓施加於兩者之間而進行電解。 The cylindrical cathode drum 2 made of titanium or nickel provided in the electrolytic cell 1 is partially (substantially lower half) immersed in a copper sulfate solution which is an electrolytic solution for metal foil production, and is in the state of FIG. Rotate in the direction of the arrow. The copper foil solution for metal foil generation is supplied from the metal foil generating electrolyte supply pipe 8 to the cathode chamber 5 formed between the cathode drum 2 and the separator 4 from below the center portion of the cathode drum 2. The copper sulfate solution contains a large amount of additives such as gelatin for improving the properties of the formed copper foil, and is formed in a cyclic manner. In the middle of the cycle, the metallic copper which is the raw material of the metal foil is dissolved and added to the copper sulfate solution to adjust the concentration of the copper sulfate solution. Further, the acid solution, that is, the pure sulfuric acid solution, flows from the acid solution supply pipe 9 from below the center portion of the cathode drum 2 to the anode chamber 7 formed on the inner wall side of the power supply plate 6 on the back side of the insoluble metal anode 3. The pure sulfuric acid solution is also formed in a cyclic manner. Electrolysis is performed between the cathode drum 2 and the insoluble metal anode 3 via a rectifier (not shown) by applying a predetermined voltage therebetween.

隨著陰極轉筒2旋轉,自硫酸銅溶液電著之銅厚度增大,且於達到某一厚度以上時金屬箔10即銅箔被剝離而連續地捲取於金屬箔捲取輥11上。 As the cathode drum 2 rotates, the thickness of the copper which is electrolyzed from the copper sulfate solution increases, and when the thickness reaches a certain thickness or more, the metal foil 10, that is, the copper foil, is peeled off and continuously wound up on the metal foil take-up roll 11.

其結果,本發明之適合於各種電解金屬箔、尤其是電解 銅箔之製造之電解金屬箔連續製造方法及電解金屬箔連續製造裝置可發揮如下作用效果。 As a result, the present invention is suitable for various electrolytic metal foils, especially electrolysis The continuous production method of the electrolytic metal foil for producing copper foil and the continuous production apparatus for electrolytic metal foil can exert the following effects.

1)不溶性金屬陽極3可藉由隔膜4而與包含大量添加劑之硫酸銅溶液等金屬箔產生用電解液隔離,不與該電解液中之添加劑及鉛離子接觸而停留於純硫酸溶液等酸溶液中,其結果,可提高陽極之壽命等。又,鉛化合物不析出於不溶性金屬陽極3上,因此亦可期待電池電壓之降低。 1) The insoluble metal anode 3 can be isolated from the metal foil generating electrolyte such as a copper sulfate solution containing a large amount of additives by the separator 4, and does not remain in contact with the additive and lead ions in the electrolyte to stay in an acid solution such as a pure sulfuric acid solution. As a result, the life of the anode and the like can be improved. Further, since the lead compound is not precipitated on the insoluble metal anode 3, the battery voltage can be expected to be lowered.

2)即便於不溶性金屬陽極3之表面形成有鉛及其微粒子,亦可利用隔膜4阻隔,即便出現鉛等脫落,亦無對形成於陰極轉筒上之銅箔等金屬箔產生惡劣影響之虞。 2) Even if lead and its fine particles are formed on the surface of the insoluble metal anode 3, it can be blocked by the separator 4, and even if lead or the like falls off, there is no adverse effect on the metal foil such as copper foil formed on the cathode drum. .

3)即便於Cu係樹枝狀結晶成長於不溶性金屬陽極3之表面之情形時,亦可防止因此而產生之短路。又,鉛不析出於不溶性金屬陽極3上,因此可維持電流分佈之均勻化,藉此有可能填滿極間,其結果,可降低電壓、降低電力。 3) Even when the Cu-based dendritic crystal grows on the surface of the insoluble metal anode 3, the short-circuit thus generated can be prevented. Further, since lead is not deposited on the insoluble metal anode 3, the current distribution can be made uniform, and the electrode can be filled. As a result, the voltage can be lowered and the electric power can be reduced.

4)不溶性金屬陽極3與隔膜4係密接配置,且被零間隙化或有限化,因此陽極與陰極間之液中氣泡消失,可降低溶液電阻,並可降低電壓、降低電力。 4) The insoluble metal anode 3 and the separator 4 are closely arranged, and are zero-gap or limited, so that bubbles in the liquid between the anode and the cathode disappear, the solution resistance can be lowered, and the voltage and power can be reduced.

再者,將隔膜4密接於不溶性金屬陽極3之表面而配置之方法並無特別限定,亦可使用如下方法代替如上述般設置襯墊16、凸緣17、埋頭螺釘18、蓋帽式螺母19,即為利用微型網孔按壓之方法、利用橫向之支撐體按壓之方法、利用PTFE(poly tetra fluoro ethylene,聚四氟乙烯)線等按壓之方法等。 Further, the method of disposing the separator 4 on the surface of the insoluble metal anode 3 is not particularly limited, and instead of providing the gasket 16, the flange 17, the countersunk screw 18, and the cap nut 19 as described above, the following method may be used. That is, a method of pressing with a micro mesh, a method of pressing with a lateral support, a method of pressing with a PTFE (polytetrafluoroethylene) wire, or the like.

又,於將隔膜4貼合於不溶性金屬陽極3之表面之情形時,需要使隔膜4密接於不溶性金屬陽極3之表面而配置,但如上述般,密接之狀態可為不溶性金屬陽極3與隔膜4整體或部分地密接之狀態(零間隙化狀態),亦可為隔著微小間隔而配置之狀態(有限化狀態),其調整例如可藉由改變襯墊16之厚度而進行。 Further, when the separator 4 is bonded to the surface of the insoluble metal anode 3, the separator 4 needs to be placed in close contact with the surface of the insoluble metal anode 3, but as described above, the intimate state may be the insoluble metal anode 3 and the separator. The state in which the whole or part is closely adhered (zero-gap state) may be a state (limited state) that is disposed with a small interval therebetween, and the adjustment may be performed, for example, by changing the thickness of the spacer 16.

如於圖1中所例示般,不溶性金屬陽極3並不限定於將形成為短條狀之複數個長方形之網孔形狀之陽極片12以相互抵接之方式配置於加工為曲面狀之供電板6之表面者,例如,亦可為以沿著供電板6之形狀之方式形成為一片圓弧狀之網孔形狀之板狀體。又,不溶性金屬陽極3並不限定於先前例示之直接安裝於供電板6之方法,例如亦可經由加工為曲面狀之電極架台等而安裝於供電板6。 As illustrated in FIG. 1 , the insoluble metal anode 3 is not limited to the anode sheet 12 having a plurality of rectangular mesh shapes formed in a short strip shape, and is disposed on the power supply board processed into a curved shape so as to be in contact with each other. The surface of the surface of 6 may be, for example, a plate-like body formed into a circular arc-shaped mesh shape along the shape of the power supply plate 6. Further, the insoluble metal anode 3 is not limited to the method of directly mounting on the power supply board 6 as exemplified above, and may be attached to the power supply board 6 via, for example, an electrode stand processed into a curved shape.

又,於本發明中使用之不溶性金屬陽極3較佳為藉由鈦般之閥金屬形成電極基體,並於其表面形成有電極被覆。此時之電極被覆可根據電極之使用目的而形成任意之電極被覆,例如,於使用硫酸溶液作為酸溶液之情形時,較佳為使用利用包含氧化銥之被覆作為電極被覆者。 Further, the insoluble metal anode 3 used in the present invention preferably has an electrode substrate formed of a valve metal of titanium and has an electrode coating formed on the surface thereof. The electrode coating at this time can form any electrode coating depending on the purpose of use of the electrode. For example, when a sulfuric acid solution is used as the acid solution, it is preferable to use a coating containing cerium oxide as an electrode coating.

又,作為使用於本發明之隔膜4,可使用陽離子交換膜、陰離子交換膜、中性隔膜。即便使用任一隔膜,如表1所示,鉛粒不會混入至作為製品之銅箔,且於銅箔品質及銅箔外觀之方面亦無較大差異。 Further, as the separator 4 used in the present invention, a cation exchange membrane, an anion exchange membrane, or a neutral separator can be used. Even if any of the separators were used, as shown in Table 1, the lead particles were not mixed into the copper foil as a product, and there was no significant difference in the quality of the copper foil and the appearance of the copper foil.

再者,如表1所示,於使用陽離子交換膜作為隔膜4之情形時,與使用陰離子交換膜或中性隔膜之情形相比,於電池電壓、電流效率、陽極壽命之方面可獲得更佳之結果。作為其理由,可推測為如下,即因為於使用陽離子交換膜之情形時,電荷向銅離子之交換速度受膜中之質子移動限制。 Further, as shown in Table 1, in the case where a cation exchange membrane is used as the separator 4, it is better in terms of battery voltage, current efficiency, and anode life as compared with the case of using an anion exchange membrane or a neutral membrane. result. The reason for this is presumed to be that, since the cation exchange membrane is used, the exchange rate of charge to copper ions is restricted by the proton movement in the membrane.

另一方面,於使用陰離子交換膜之情形時,與使用陽離子交換膜之情形相比,如下述之實施例6、7所示,有電池電壓稍微變高,電流效率亦稍微降低之傾向,但於陽極之壽命、銅箔品質及銅箔外觀之方面無較大差異。 On the other hand, in the case of using an anion exchange membrane, as compared with the case of using a cation exchange membrane, as shown in the following Examples 6 and 7, there is a tendency that the battery voltage is slightly increased and the current efficiency is slightly lowered, but There is no significant difference in the life of the anode, the quality of the copper foil, and the appearance of the copper foil.

又,於使用中性隔膜之情形時,與使用陽離子交換膜之情形相比,如下述之實施例8所示,有陽極之壽命稍微減短之傾向,但於電池電壓、電流效率、銅箔品質及銅箔外觀之方面無較大差異。於該情形時,陽極之壽命稍微減短之理由可考慮為如下,即因為於使用中性隔膜之情形時,無法完全分離陽極液與陰極液而產生一部分混合之情況。 Further, in the case of using a neutral separator, as compared with the case of using a cation exchange membrane, as shown in the following Example 8, the life of the anode tends to be slightly shortened, but in battery voltage, current efficiency, and copper foil. There is no big difference in the quality and appearance of the copper foil. In this case, the reason why the life of the anode is slightly shortened can be considered as follows, because in the case of using a neutral separator, the anolyte and the catholyte cannot be completely separated and a part of the mixture is mixed.

[實施例] [Examples]

接下來,對本發明之實施例進行說明,但本發明並不限定於該等實施例。 Next, the embodiments of the present invention will be described, but the present invention is not limited to the embodiments.

<實施例1> <Example 1> 1)不溶性金屬陽極之製作條件(A) 1) Conditions for the production of insoluble metal anodes (A)

利用鐵砂(# 120尺寸)對JIS之1種鈦板之表面實施乾式噴砂處理,其次,於20%硫酸水溶液中(105℃)進行10分鐘酸洗處理,並進行電極基板之清洗處理。將清洗過之電極基板放置於電弧離子電鍍裝置,進行純鈦材料之電弧離子電鍍被覆。被覆條件如下所述。 The surface of one type of titanium plate of JIS was subjected to dry blasting treatment using iron sand (#120 size), and then, pickling treatment was performed for 10 minutes in a 20% sulfuric acid aqueous solution (105 ° C), and the electrode substrate was cleaned. The cleaned electrode substrate is placed in an arc ion plating apparatus, and an arc ion plating coating of a pure titanium material is performed. The coating conditions are as follows.

標靶:JIS之1種鈦圓板(對背面進行水冷) Target: a titanium disc of JIS (water-cooled on the back)

真空度:1.0×10-2Torr(Ar氣體置換導入) Degree of vacuum: 1.0 × 10 -2 Torr (Ar gas substitution introduced)

通入電力:500W(3.0KV) Access to electricity: 500W (3.0KV)

基板溫度:150℃(電弧離子電鍍時) Substrate temperature: 150 ° C (when arc ion plating)

時間:35分鐘 Time: 35 minutes

塗佈厚度:2微米(重量增加換算) Coating thickness: 2 microns (weight gain conversion)

當於電弧離子電鍍被覆後測定X射線繞射時,可觀察到歸屬於基板主體之尖銳的結晶性峰與歸屬於濺鍍被覆之寬的圖案,從而可知該被覆為非晶質。 When the X-ray diffraction was measured after the arc ion plating coating, a sharp crystal peak belonging to the substrate main body and a pattern belonging to the sputtering coating were observed, and it was found that the coating was amorphous.

其次,將四氯化銥、五氯化鉭溶解於35%鹽酸作為塗佈液,將該塗佈液刷塗於完成上述電弧離子電鍍被覆處理之基板並乾燥後,於空氣循環式之電爐中(550℃、20分鐘)進行熱分解被覆,從而形成包含氧化銥與氧化鉭之固溶體之電極觸媒層。上述刷塗之1次之塗佈厚度係以換算為銥金屬而大致成為1.0g/m2之方式設定上述塗佈液之量。 Next, ruthenium tetrachloride and antimony pentachloride are dissolved in 35% hydrochloric acid as a coating liquid, and the coating liquid is brushed on the substrate subjected to the above arc ion plating coating treatment and dried, and then placed in an air circulating electric furnace. (550 ° C, 20 minutes) Thermal decomposition coating was carried out to form an electrode catalyst layer containing a solid solution of cerium oxide and cerium oxide. The coating thickness of the first application of the brushing was set such that the amount of the coating liquid was approximately 1.0 g/m 2 in terms of a base metal.

製作出將該塗佈~煅燒操作重複12次而成者。使用圖1所示之電解銅箔連續製造裝置並於以下條件下對如上所述般製造之不溶性金屬陽極進行電解。 The coating-calcination operation was repeated 12 times. The insoluble metal anode manufactured as described above was subjected to electrolysis using the electrolytic copper foil continuous production apparatus shown in Fig. 1 under the following conditions.

2)隔膜 2) Diaphragm

使用下述陽離子交換膜,與不溶性金屬陽極密接而零間隙化。 The cation exchange membrane described below was used to adhere to the insoluble metal anode to have a zero gap.

a:Nafion117(DuPont公司之註冊商標) a: Nafion 117 (registered trademark of DuPont)

b:Nafion551(DuPont公司之註冊商標) b: Nafion 551 (registered trademark of DuPont)

c:Nafion424(DuPont公司之註冊商標) c: Nafion 424 (registered trademark of DuPont)

3)電解條件 3) Electrolysis conditions

電流密度:60A/dm2 Current density: 60A/dm 2

電解溫度:60℃ Electrolysis temperature: 60 ° C

陰極液成分:硫酸銅溶液 Catholyte composition: copper sulfate solution

銅濃度:70g/L Copper concentration: 70g/L

硫酸濃度:100g/L Sulfuric acid concentration: 100g/L

明膠:20ppm Gelatin: 20ppm

鉛濃度:20ppm Lead concentration: 20ppm

陽極液成分:純硫酸溶液 Anode liquid composition: pure sulfuric acid solution

硫酸濃度:100g/L Sulfuric acid concentration: 100g/L

其結果,如表1所示,於電池電壓、製箔電流效率、陽極壽命、銅箔品質、銅箔外觀之所有方面均獲得良好之結果。 As a result, as shown in Table 1, good results were obtained in all aspects of battery voltage, foil current efficiency, anode life, copper foil quality, and copper foil appearance.

<實施例2> <Example 2> 1)不溶性金屬陽極之製作條件(B) 1) Conditions for the production of insoluble metal anodes (B)

利用鐵砂(# 120尺寸)對JIS之1種鈦板之表面進行乾式噴砂處理,接下來,於20%硫酸水溶液中(105℃)進行10分鐘酸洗處理,並進行電極基板之清洗處理。將五氯化鉭與四氯化鈦溶解於35%鹽酸而作為塗佈液並塗佈於清洗過之電極基板,於空氣循環式之電爐中(550℃、20分鐘)進行熱分解被覆,從而形成中間層。 The surface of one type of titanium plate of JIS was subjected to dry blasting treatment using iron sand (#120 size), followed by pickling treatment in a 20% sulfuric acid aqueous solution (105 ° C) for 10 minutes, and cleaning treatment of the electrode substrate. The antimony pentachloride and titanium tetrachloride were dissolved in 35% hydrochloric acid, applied as a coating liquid to the cleaned electrode substrate, and thermally decomposed and coated in an air circulating electric furnace (550 ° C, 20 minutes). Form an intermediate layer.

繼而,將四氯化銥、五氯化鉭溶解於35%鹽酸而作為塗佈液,將其刷塗於已完成上述中間層形成之基板並乾燥後,於空氣循環式之電爐中(550℃、20分鐘)進行熱分解被覆,從而形成包含氧化銥與氧化鉭之固溶體之電極觸媒層。上述刷塗之1次之塗佈厚度係以換算為銥金屬而大致成為1.0g/m2之方式設定上述塗佈液之量。 Then, antimony tetrachloride and antimony pentachloride were dissolved in 35% hydrochloric acid as a coating liquid, which was applied to the substrate on which the intermediate layer was formed and dried, and then placed in an air circulating electric furnace (550 ° C). 20 minutes) Thermal decomposition coating was carried out to form an electrode catalyst layer containing a solid solution of cerium oxide and cerium oxide. The coating thickness of the first application of the brushing was set such that the amount of the coating liquid was approximately 1.0 g/m 2 in terms of a base metal.

製作出將該塗佈~煅燒操作重複12次而成者。使用圖1所示之電解銅箔連續製造裝置並於以下條件下對如上所述般製造之不溶性金屬陽極進行電解。 The coating-calcination operation was repeated 12 times. The insoluble metal anode manufactured as described above was subjected to electrolysis using the electrolytic copper foil continuous production apparatus shown in Fig. 1 under the following conditions.

2)隔膜 2) Diaphragm

使用與實施例1相同之陽離子交換膜,與不溶性金屬陽極密接而零間隙化。 The same cation exchange membrane as in Example 1 was used, and the insoluble metal anode was adhered to each other to have a zero gap.

3)電解條件 3) Electrolysis conditions

使用與實施例1相同之電解條件。 The same electrolysis conditions as in Example 1 were used.

其結果,如表1所示,於電池電壓、製箔電流效率、陽極壽命、銅箔品質、銅箔外觀之所有方面均獲得良好之結果。 As a result, as shown in Table 1, good results were obtained in all aspects of battery voltage, foil current efficiency, anode life, copper foil quality, and copper foil appearance.

<實施例3> <Example 3> 1)不溶性金屬陽極之製作條件 1) Conditions for the production of insoluble metal anodes

以與實施例1相同之條件(A)製作。 It was produced under the same conditions (A) as in Example 1.

2)隔膜 2) Diaphragm

使用與實施例1相同之陽離子交換膜,與不溶性金屬陽極密接而零間隙化。 The same cation exchange membrane as in Example 1 was used, and the insoluble metal anode was adhered to each other to have a zero gap.

3)電解條件 3) Electrolysis conditions

除將電流密度變更為30A/dm2以外,使用與實施例1相同之電解條件。 The same electrolysis conditions as in Example 1 were used except that the current density was changed to 30 A/dm 2 .

其結果,如表1所示,於電池電壓、製箔電流效率、陽極壽命、銅箔品質、銅箔外觀之所有方面均獲得良好之結果。 As a result, as shown in Table 1, good results were obtained in all aspects of battery voltage, foil current efficiency, anode life, copper foil quality, and copper foil appearance.

<實施例4> <Example 4> 1)不溶性金屬陽極之製作條件 1) Conditions for the production of insoluble metal anodes

以與實施例1相同之條件(A)製作。 It was produced under the same conditions (A) as in Example 1.

2)隔膜 2) Diaphragm

使用與實施例1相同之陽離子交換膜,與不溶性金屬陽極密接而零間隙化。 The same cation exchange membrane as in Example 1 was used, and the insoluble metal anode was adhered to each other to have a zero gap.

3)電解條件 3) Electrolysis conditions

除將電流密度變更為80A/dm2以外,使用與實施例1相同之電解條件。 The same electrolysis conditions as in Example 1 were used except that the current density was changed to 80 A/dm 2 .

其結果,如表1所示,於電池電壓、製箔電流效率、陽極壽命、銅箔品質、銅箔外觀之所有方面均獲得良好之結果。 As a result, as shown in Table 1, good results were obtained in all aspects of battery voltage, foil current efficiency, anode life, copper foil quality, and copper foil appearance.

<實施例5> <Example 5> 1)不溶性金屬陽極之製作條件 1) Conditions for the production of insoluble metal anodes

以與實施例1相同之條件(A)製作。 It was produced under the same conditions (A) as in Example 1.

2)隔膜 2) Diaphragm

使用下述陽離子交換膜,與不溶性金屬陽極密接,但並非零間隙化,而是有限化。 The following cation exchange membrane was used in close contact with the insoluble metal anode, but it was not zero-gap, but was limited.

Nafion117(DuPont公司之註冊商標) Nafion 117 (registered trademark of DuPont)

3)電解條件 3) Electrolysis conditions

使用與實施例1相同之電解條件。 The same electrolysis conditions as in Example 1 were used.

其結果,如表1所示,於電池電壓、製箔電流效率、陽極壽命、銅箔品質、銅箔外觀之所有方面均獲得良好之結果。 As a result, as shown in Table 1, good results were obtained in all aspects of battery voltage, foil current efficiency, anode life, copper foil quality, and copper foil appearance.

<實施例6> <Example 6> 1)不溶性金屬陽極之製作條件 1) Conditions for the production of insoluble metal anodes

以與實施例1相同之條件(A)製作。 It was produced under the same conditions (A) as in Example 1.

2)隔膜 2) Diaphragm

使用下述陰離子交換膜,與不溶性金屬陽極密接而零間隙化。 The anion exchange membrane described below was used to adhere to the insoluble metal anode to have a zero gap.

Neosepta A-0300(ASTOM公司之註冊商標) Neosepta A-0300 (registered trademark of ASTOM Corporation)

3)電解條件 3) Electrolysis conditions

使用與實施例1相同之電解條件。 The same electrolysis conditions as in Example 1 were used.

其結果,如表1所示,電池電壓稍微上升,製箔電流效率稍微降低,但陽極壽命、銅箔品質、銅箔外觀獲得良好之結果。 As a result, as shown in Table 1, the battery voltage slightly increased, and the foil-forming current efficiency was slightly lowered, but the anode life, the quality of the copper foil, and the appearance of the copper foil were good.

<實施例7> <Example 7> 1)不溶性金屬陽極之製作條件 1) Conditions for the production of insoluble metal anodes

以與實施例2相同之條件(B)製作。 It was produced under the same conditions (B) as in Example 2.

2)隔膜 2) Diaphragm

使用下述陰離子交換膜,與不溶性金屬陽極密接而零間隙化。 The anion exchange membrane described below was used to adhere to the insoluble metal anode to have a zero gap.

Neosepta A-0300(ASTOM公司之註冊商標) Neosepta A-0300 (registered trademark of ASTOM Corporation)

3)電解條件 3) Electrolysis conditions

使用與實施例1相同之電解條件。 The same electrolysis conditions as in Example 1 were used.

其結果,如表1所示,電池電壓稍微上升,製箔電流效率稍微降低,但陽極壽命、銅箔品質、銅箔外觀獲得良好之結果。 As a result, as shown in Table 1, the battery voltage slightly increased, and the foil-forming current efficiency was slightly lowered, but the anode life, the quality of the copper foil, and the appearance of the copper foil were good.

<實施例8> <Example 8> 1)不溶性金屬陽極之製作條件 1) Conditions for the production of insoluble metal anodes

以與實施例1相同之條件(A)製作。 It was produced under the same conditions (A) as in Example 1.

2)隔膜 2) Diaphragm

使用下述中性隔膜與不溶性金屬陽極密接並零間隙化。 The following neutral separator was used to adhere to the insoluble metal anode and zero gap.

Yumicron Y9201T(Yuasa Membrane System公司之註冊商標) Yumicron Y9201T (registered trademark of Yuasa Membrane System)

3)電解條件 3) Electrolysis conditions

使用與實施例1相同之電解條件。 The same electrolysis conditions as in Example 1 were used.

其結果,如表1所示,陽極壽命稍微降低,但電池電壓、製箔電流效率、陽極壽命、銅箔品質、銅箔外觀獲得良好之結果。 As a result, as shown in Table 1, the anode life was slightly lowered, but the battery voltage, the foil current efficiency, the anode life, the copper foil quality, and the appearance of the copper foil were excellent.

<比較例1> <Comparative Example 1> 1)不溶性金屬陽極之製作條件 1) Conditions for the production of insoluble metal anodes

以與實施例1相同之條件(A)製作。 It was produced under the same conditions (A) as in Example 1.

2)隔膜 2) Diaphragm

設為無隔膜。 Set to no diaphragm.

3)電解條件 3) Electrolysis conditions

使用與實施例1相同之電解條件。然而,僅使用陰極液而未使用陽極液。 The same electrolysis conditions as in Example 1 were used. However, only the catholyte is used and the anolyte is not used.

其結果,如表1所示,陽極壽命大幅度降低。 As a result, as shown in Table 1, the anode life was greatly reduced.

<比較例2> <Comparative Example 2> 1)不溶性金屬陽極之製作條件 1) Conditions for the production of insoluble metal anodes

以與實施例2相同之條件(B)製作。 It was produced under the same conditions (B) as in Example 2.

2)隔膜 2) Diaphragm

設為無隔膜。 Set to no diaphragm.

3)電解條件 3) Electrolysis conditions

使用與實施例1相同之電解條件。然而,僅使用陰極液而未使用陽極液。 The same electrolysis conditions as in Example 1 were used. However, only the catholyte is used and the anolyte is not used.

其結果,如表1所示,陽極壽命大幅度降低。 As a result, as shown in Table 1, the anode life was greatly reduced.

(產業上之可利用性) (industrial availability)

根據本發明,可防止於使用習知之裝置之製造方法中產生之因附著於不溶性金屬陽極上之鉛所引起之電流不均勻化、或因於不溶性金屬陽極上產生之氣泡所引起之銅箔品質降低,而可提高金屬箔之製品良率,並且可消除氣泡或附著鉛之影響,降低電池電壓,而且,可防止因添加劑所導致之不溶性金屬陽極之消耗加速,因此可高效地且連續製造品質良好之電解金屬箔,且可利用於除了電解銅箔之其他各種電解金屬箔之製造領域,故而期待其廣泛之利用。 According to the present invention, it is possible to prevent the unevenness of the current caused by the lead attached to the insoluble metal anode generated by the manufacturing method of the conventional device, or the quality of the copper foil caused by the bubble generated on the insoluble metal anode. Reduced, can improve the yield of metal foil products, and can eliminate the influence of bubbles or attached lead, reduce the battery voltage, and prevent the consumption of insoluble metal anodes caused by additives, so that the quality can be efficiently and continuously manufactured. A good electrolytic metal foil is used in the field of manufacturing various other electrolytic metal foils other than electrolytic copper foil, and thus it is expected to be widely used.

1‧‧‧電解槽 1‧‧‧electrolyzer

2‧‧‧陰極轉筒 2‧‧‧Cathode rotating drum

3‧‧‧不溶性金屬陽極 3‧‧‧Insoluble metal anode

4‧‧‧隔膜 4‧‧‧Separator

5‧‧‧陰極室 5‧‧‧Cathode chamber

6‧‧‧供電板 6‧‧‧Power supply board

7‧‧‧陽極室 7‧‧‧Anode chamber

8‧‧‧金屬箔產生用電解液供給管 8‧‧‧Electrolyte supply tube for metal foil generation

9‧‧‧酸溶液供給管 9‧‧‧Acid solution supply pipe

10‧‧‧金屬箔 10‧‧‧metal foil

11‧‧‧金屬箔捲取輥 11‧‧‧Metal foil take-up rolls

20‧‧‧溢流槽 20‧‧‧Overflow trough

21‧‧‧硫酸銅溶液儲槽 21‧‧‧ copper sulfate solution storage tank

22‧‧‧銅溶解槽 22‧‧‧ copper dissolution tank

23‧‧‧硫酸溶液儲槽 23‧‧‧ sulfuric acid solution storage tank

Claims (7)

一種電解金屬箔連續製造方法,其使用具有圓筒狀陰極轉筒與剖面圓弧狀之不溶性金屬陽極之裝置,該圓筒狀陰極轉筒係具有以一部分浸漬於金屬箔產生用電解液之方式而進行旋轉之構造,該剖面圓弧狀之不溶性金屬陽極係以對向於該陰極轉筒之周圍之一部分之方式加以配置,且將其周圍之一部分加以包圍;將上述金屬箔產生用電解液供給至上述陰極轉筒之表面而使金屬箔電著在上述陰極轉筒上,並將電著之金屬箔自上述陰極轉筒加以剝離,從而連續地製造金屬箔;上述電解金屬箔連續製造方法之特徵在於:上述裝置係具有以下之構造,即:於上述不溶性金屬陽極之剖面圓弧狀之表面以密接之方式配置有隔膜,且於上述陰極轉筒與該隔膜之間形成有陰極室,並且於上述不溶性金屬陽極之背面側形成有陽極室;且利用以下之方式連續地製造金屬箔,即:將金屬箔產生用電解液供給至上述陰極室內,將酸溶液供給至上述陽極室內而進行電解,將於上述陰極轉筒之表面所電解析出之金屬箔自上述陰極轉筒加以剝離。 A method for continuously producing an electrolytic metal foil, which comprises a device having a cylindrical cathode drum and an insoluble metal anode having a circular arc shape, the cylindrical cathode drum having a part of being immersed in an electrolyte for producing a metal foil And a rotating structure, wherein the arc-shaped insoluble metal anode is disposed so as to face a portion of the periphery of the cathode drum, and surrounds one of the surrounding portions; and the electrolyte for generating the metal foil Supplying to the surface of the cathode drum, electrically discharging the metal foil on the cathode drum, and peeling off the electroplated metal foil from the cathode drum, thereby continuously manufacturing the metal foil; the electrolytic metal foil continuous manufacturing method The device has a structure in which a separator is disposed in close contact with an arcuate surface of the insoluble metal anode, and a cathode chamber is formed between the cathode drum and the diaphragm. And an anode chamber is formed on the back side of the insoluble metal anode; and the metal foil is continuously produced by the following method, : A metal foil to produce the cathode chamber is supplied with an electrolyte, an acid solution is supplied to the anode chamber and the electrolysis, the electrolytic deposition will be the surface of the cathode drum of the metal foil to be peeled off from the cathode drum. 如申請專利範圍第1項之電解金屬箔連續製造方法,其中,上述金屬箔為銅箔,上述金屬箔產生用電解液為硫酸銅溶液,且上述酸溶液為純硫酸溶液。 The method for continuously producing an electrolytic metal foil according to the first aspect of the invention, wherein the metal foil is a copper foil, the electrolyte for generating the metal foil is a copper sulfate solution, and the acid solution is a pure sulfuric acid solution. 如申請專利範圍第1或2項之電解金屬箔連續製造方法,其中,上述隔膜為陽離子交換膜。 The method for continuously producing an electrolytic metal foil according to claim 1 or 2, wherein the separator is a cation exchange membrane. 如申請專利範圍第1或2項之電解金屬箔連續製造方法,其 中,上述隔膜為陰離子交換膜。 A method for continuously manufacturing an electrolytic metal foil according to claim 1 or 2, In the above, the separator is an anion exchange membrane. 如申請專利範圍第1或2項之電解金屬箔連續製造方法,其中,上述隔膜為中性隔膜。 The method for continuously producing an electrolytic metal foil according to claim 1 or 2, wherein the separator is a neutral separator. 如申請專利範圍第1或2項之電解金屬箔連續製造方法,其中,上述隔膜為陽離子交換膜,且該陽離子交換膜為全氟陽離子交換膜。 The method for continuously producing an electrolytic metal foil according to claim 1 or 2, wherein the separator is a cation exchange membrane, and the cation exchange membrane is a perfluorocation exchange membrane. 一種電解金屬箔連續製造裝置,其用於連續地製造金屬箔而具有以下之部分而成,即具有:圓筒狀陰極轉筒,其具有以一部分浸漬於金屬箔產生用電解液之方式而進行旋轉之構造;剖面圓弧狀之不溶性金屬陽極,其對向於該陰極轉筒之周圍之一部分,且將其周圍之一部分加以包圍;將上述金屬箔產生用電解液供給至上述陰極轉筒之表面而使金屬箔電著在上述陰極轉筒上之裝置;及將電著之金屬箔自上述陰極轉筒加以剝離之裝置;上述電解金屬箔連續製造裝置之特徵在於具備有:電解部,其包括有:隔膜,其於上述不溶性金屬陽極之剖面圓弧狀之表面以密接之方式加以配置;陰極室,其形成於上述陰極轉筒與該隔膜之間;及陽極室,其形成於上述不溶性金屬陽極之背面側;用於將金屬箔產生用電解液供給至上述陰極室內之裝置;用於將酸溶液供給至上述陽極室內之裝置;及用於將於上述陰極轉筒之表面所電解析出之金屬箔自上述陰極轉筒加以剝離而連續地捲取金屬箔之裝置。 An apparatus for continuously producing an electrolytic metal foil, which is used for continuously producing a metal foil, and has a cylindrical cathode drum having a part of being immersed in an electrolytic solution for producing a metal foil. a rotating structure; an arc-shaped insoluble metal anode that is opposite to a portion of the periphery of the cathode drum and surrounded by a portion thereof; and the electrolyte for generating metal foil is supplied to the cathode drum a device for electrically driving a metal foil on the cathode drum; and a device for peeling off the electroplated metal foil from the cathode drum; the electrolytic metal foil continuous manufacturing device characterized by comprising: an electrolysis portion; The method includes: a separator disposed on the arcuate surface of the insoluble metal anode in a close contact manner; a cathode chamber formed between the cathode drum and the separator; and an anode chamber formed in the insoluble property a back side of the metal anode; a device for supplying a metal foil generating electrolyte into the cathode chamber; for supplying an acid solution to The anode chamber of said apparatus; and will for the electrolytic deposition of the surface of the cathode drum of the metal foil to be peeled off from the cathode drum means of a metal foil wound continuously.
TW103123764A 2013-07-18 2014-07-10 Continuous manufacturing method for electrolytic metal foil and continuous manufacturing device for electrolytic metal foil TW201510285A (en)

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