TW201436882A - 塗佈膜形成方法、塗佈膜形成裝置及記憶媒體 - Google Patents
塗佈膜形成方法、塗佈膜形成裝置及記憶媒體 Download PDFInfo
- Publication number
- TW201436882A TW201436882A TW103103249A TW103103249A TW201436882A TW 201436882 A TW201436882 A TW 201436882A TW 103103249 A TW103103249 A TW 103103249A TW 103103249 A TW103103249 A TW 103103249A TW 201436882 A TW201436882 A TW 201436882A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- coating
- wafer
- liquid
- coating film
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 135
- 239000011248 coating agent Substances 0.000 title claims abstract description 134
- 238000000034 method Methods 0.000 title claims abstract description 43
- 230000015572 biosynthetic process Effects 0.000 title description 6
- 239000007788 liquid Substances 0.000 claims abstract description 139
- 239000003595 mist Substances 0.000 claims abstract description 79
- 238000001816 cooling Methods 0.000 claims abstract description 30
- 238000004528 spin coating Methods 0.000 claims abstract description 16
- 239000007787 solid Substances 0.000 claims abstract description 9
- 239000010419 fine particle Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 119
- 230000002093 peripheral effect Effects 0.000 claims description 21
- 238000007599 discharging Methods 0.000 claims description 6
- 238000004590 computer program Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 40
- 238000009834 vaporization Methods 0.000 abstract description 10
- 230000008016 vaporization Effects 0.000 abstract description 10
- 238000000859 sublimation Methods 0.000 abstract description 2
- 230000008022 sublimation Effects 0.000 abstract description 2
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000001556 precipitation Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 154
- 229920002120 photoresistant polymer Polymers 0.000 description 75
- 239000007789 gas Substances 0.000 description 20
- 238000012545 processing Methods 0.000 description 18
- 238000005192 partition Methods 0.000 description 16
- 239000003085 diluting agent Substances 0.000 description 11
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013021416A JP5900370B2 (ja) | 2013-02-06 | 2013-02-06 | 塗布膜形成方法、塗布膜形成装置及び記憶媒体 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201436882A true TW201436882A (zh) | 2014-10-01 |
Family
ID=51299680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103103249A TW201436882A (zh) | 2013-02-06 | 2014-01-28 | 塗佈膜形成方法、塗佈膜形成裝置及記憶媒體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5900370B2 (enExample) |
| TW (1) | TW201436882A (enExample) |
| WO (1) | WO2014123085A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107210246A (zh) * | 2015-01-15 | 2017-09-26 | Ev 集团 E·索尔纳有限责任公司 | 用于涂装基体的方法和装置 |
| CN107871691A (zh) * | 2016-09-26 | 2018-04-03 | 株式会社斯库林集团 | 基板处理方法和基板处理装置 |
| TWI623816B (zh) * | 2015-03-03 | 2018-05-11 | 東京威力科創股份有限公司 | 塗布處理方法、電腦記錄媒體及塗布處理裝置 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5886935B1 (ja) * | 2014-12-11 | 2016-03-16 | 東京エレクトロン株式会社 | 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置 |
| JP6059793B2 (ja) * | 2015-12-11 | 2017-01-11 | 東京エレクトロン株式会社 | 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置 |
| CN108855776B (zh) * | 2017-05-08 | 2020-08-14 | 致伸科技股份有限公司 | 离心注胶系统及其方法 |
| CN110560327A (zh) * | 2018-06-05 | 2019-12-13 | 深圳市旭控科技有限公司 | 一种硅片涂源装置 |
| JP7202968B2 (ja) * | 2019-05-09 | 2023-01-12 | 東京エレクトロン株式会社 | 塗布処理方法、塗布処理装置及び記憶媒体 |
| JP7344726B2 (ja) * | 2019-09-13 | 2023-09-14 | 東京エレクトロン株式会社 | 塗布処理方法、塗布処理装置及び記憶媒体 |
| CN112415854A (zh) * | 2020-11-23 | 2021-02-26 | 华虹半导体(无锡)有限公司 | 改善晶圆光刻胶涂布效果的方法 |
| CN114653503A (zh) * | 2020-12-23 | 2022-06-24 | 盛美半导体设备(上海)股份有限公司 | 涂胶机及其工艺腔 |
| JP2024060970A (ja) | 2022-10-20 | 2024-05-07 | 東京エレクトロン株式会社 | カップ、液処理装置及び液処理方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01204421A (ja) * | 1988-02-10 | 1989-08-17 | Hitachi Ltd | ホトレジスト塗布方法 |
| JPH0462831A (ja) * | 1990-06-25 | 1992-02-27 | Toshiba Corp | ホトレジスト塗布方法 |
| JP2591360B2 (ja) * | 1991-05-08 | 1997-03-19 | 株式会社日立製作所 | フォトレジストの塗布方法 |
| JPH0945611A (ja) * | 1995-07-27 | 1997-02-14 | Dainippon Screen Mfg Co Ltd | 回転式基板塗布装置 |
| JP3453073B2 (ja) * | 1998-10-14 | 2003-10-06 | 東京エレクトロン株式会社 | 塗布処理装置 |
| US6322626B1 (en) * | 1999-06-08 | 2001-11-27 | Micron Technology, Inc. | Apparatus for controlling a temperature of a microelectronics substrate |
| JP3990998B2 (ja) * | 2003-03-14 | 2007-10-17 | 東京エレクトロン株式会社 | 塗布装置及び塗布方法 |
| JP4597847B2 (ja) * | 2005-11-28 | 2010-12-15 | 株式会社フジクラ | 成膜装置 |
| JP2009220046A (ja) * | 2008-03-17 | 2009-10-01 | Seiko Epson Corp | 塗布装置 |
| JP5511451B2 (ja) * | 2010-03-16 | 2014-06-04 | 中央発條株式会社 | 自動車用スタビライザの製造方法 |
-
2013
- 2013-02-06 JP JP2013021416A patent/JP5900370B2/ja active Active
-
2014
- 2014-01-28 TW TW103103249A patent/TW201436882A/zh unknown
- 2014-02-03 WO PCT/JP2014/052439 patent/WO2014123085A1/ja not_active Ceased
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107210246A (zh) * | 2015-01-15 | 2017-09-26 | Ev 集团 E·索尔纳有限责任公司 | 用于涂装基体的方法和装置 |
| TWI623816B (zh) * | 2015-03-03 | 2018-05-11 | 東京威力科創股份有限公司 | 塗布處理方法、電腦記錄媒體及塗布處理裝置 |
| CN107871691A (zh) * | 2016-09-26 | 2018-04-03 | 株式会社斯库林集团 | 基板处理方法和基板处理装置 |
| CN107871691B (zh) * | 2016-09-26 | 2022-01-04 | 株式会社斯库林集团 | 基板处理方法和基板处理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014151249A (ja) | 2014-08-25 |
| JP5900370B2 (ja) | 2016-04-06 |
| WO2014123085A1 (ja) | 2014-08-14 |
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