JP5900370B2 - 塗布膜形成方法、塗布膜形成装置及び記憶媒体 - Google Patents

塗布膜形成方法、塗布膜形成装置及び記憶媒体 Download PDF

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Publication number
JP5900370B2
JP5900370B2 JP2013021416A JP2013021416A JP5900370B2 JP 5900370 B2 JP5900370 B2 JP 5900370B2 JP 2013021416 A JP2013021416 A JP 2013021416A JP 2013021416 A JP2013021416 A JP 2013021416A JP 5900370 B2 JP5900370 B2 JP 5900370B2
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Japan
Prior art keywords
substrate
coating film
coating
wafer
mist
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Japanese (ja)
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JP2014151249A (ja
JP2014151249A5 (enExample
Inventor
康三 立花
康三 立花
吉原　孝介
孝介 吉原
京田　秀治
秀治 京田
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2013021416A priority Critical patent/JP5900370B2/ja
Priority to TW103103249A priority patent/TW201436882A/zh
Priority to PCT/JP2014/052439 priority patent/WO2014123085A1/ja
Publication of JP2014151249A publication Critical patent/JP2014151249A/ja
Publication of JP2014151249A5 publication Critical patent/JP2014151249A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013021416A 2013-02-06 2013-02-06 塗布膜形成方法、塗布膜形成装置及び記憶媒体 Active JP5900370B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013021416A JP5900370B2 (ja) 2013-02-06 2013-02-06 塗布膜形成方法、塗布膜形成装置及び記憶媒体
TW103103249A TW201436882A (zh) 2013-02-06 2014-01-28 塗佈膜形成方法、塗佈膜形成裝置及記憶媒體
PCT/JP2014/052439 WO2014123085A1 (ja) 2013-02-06 2014-02-03 塗布膜形成方法、塗布膜形成装置及び記憶媒体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013021416A JP5900370B2 (ja) 2013-02-06 2013-02-06 塗布膜形成方法、塗布膜形成装置及び記憶媒体

Publications (3)

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JP2014151249A JP2014151249A (ja) 2014-08-25
JP2014151249A5 JP2014151249A5 (enExample) 2015-03-19
JP5900370B2 true JP5900370B2 (ja) 2016-04-06

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JP2013021416A Active JP5900370B2 (ja) 2013-02-06 2013-02-06 塗布膜形成方法、塗布膜形成装置及び記憶媒体

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JP (1) JP5900370B2 (enExample)
TW (1) TW201436882A (enExample)
WO (1) WO2014123085A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5886935B1 (ja) * 2014-12-11 2016-03-16 東京エレクトロン株式会社 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置
DE102015100579A1 (de) * 2015-01-15 2016-07-21 Ev Group E. Thallner Gmbh Verfahren und Vorrichtung zum Beschichten von Substraten
JP6212066B2 (ja) * 2015-03-03 2017-10-11 東京エレクトロン株式会社 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置
JP6059793B2 (ja) * 2015-12-11 2017-01-11 東京エレクトロン株式会社 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置
JP6728009B2 (ja) * 2016-09-26 2020-07-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN108855776B (zh) * 2017-05-08 2020-08-14 致伸科技股份有限公司 离心注胶系统及其方法
CN110560327A (zh) * 2018-06-05 2019-12-13 深圳市旭控科技有限公司 一种硅片涂源装置
JP7202968B2 (ja) * 2019-05-09 2023-01-12 東京エレクトロン株式会社 塗布処理方法、塗布処理装置及び記憶媒体
JP7344726B2 (ja) * 2019-09-13 2023-09-14 東京エレクトロン株式会社 塗布処理方法、塗布処理装置及び記憶媒体
CN112415854A (zh) * 2020-11-23 2021-02-26 华虹半导体(无锡)有限公司 改善晶圆光刻胶涂布效果的方法
CN114653503A (zh) * 2020-12-23 2022-06-24 盛美半导体设备(上海)股份有限公司 涂胶机及其工艺腔
JP2024060970A (ja) 2022-10-20 2024-05-07 東京エレクトロン株式会社 カップ、液処理装置及び液処理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01204421A (ja) * 1988-02-10 1989-08-17 Hitachi Ltd ホトレジスト塗布方法
JPH0462831A (ja) * 1990-06-25 1992-02-27 Toshiba Corp ホトレジスト塗布方法
JP2591360B2 (ja) * 1991-05-08 1997-03-19 株式会社日立製作所 フォトレジストの塗布方法
JPH0945611A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 回転式基板塗布装置
JP3453073B2 (ja) * 1998-10-14 2003-10-06 東京エレクトロン株式会社 塗布処理装置
US6322626B1 (en) * 1999-06-08 2001-11-27 Micron Technology, Inc. Apparatus for controlling a temperature of a microelectronics substrate
JP3990998B2 (ja) * 2003-03-14 2007-10-17 東京エレクトロン株式会社 塗布装置及び塗布方法
JP4597847B2 (ja) * 2005-11-28 2010-12-15 株式会社フジクラ 成膜装置
JP2009220046A (ja) * 2008-03-17 2009-10-01 Seiko Epson Corp 塗布装置
JP5511451B2 (ja) * 2010-03-16 2014-06-04 中央発條株式会社 自動車用スタビライザの製造方法

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JP2014151249A (ja) 2014-08-25
WO2014123085A1 (ja) 2014-08-14
TW201436882A (zh) 2014-10-01

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