TW201427080A - 奈米線尺寸之光電結構及改質其經選定部分之方法 - Google Patents

奈米線尺寸之光電結構及改質其經選定部分之方法 Download PDF

Info

Publication number
TW201427080A
TW201427080A TW102138762A TW102138762A TW201427080A TW 201427080 A TW201427080 A TW 201427080A TW 102138762 A TW102138762 A TW 102138762A TW 102138762 A TW102138762 A TW 102138762A TW 201427080 A TW201427080 A TW 201427080A
Authority
TW
Taiwan
Prior art keywords
layer
nanowires
nanowire
conductive
substance
Prior art date
Application number
TW102138762A
Other languages
English (en)
Chinese (zh)
Inventor
史考特 布萊德 海納
丹尼爾 布萊斯 湯普森
辛西雅 樂美
Original Assignee
Glo公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Glo公司 filed Critical Glo公司
Publication of TW201427080A publication Critical patent/TW201427080A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes

Landscapes

  • Led Devices (AREA)
TW102138762A 2012-10-26 2013-10-25 奈米線尺寸之光電結構及改質其經選定部分之方法 TW201427080A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261718884P 2012-10-26 2012-10-26
US14/059,658 US9178106B2 (en) 2012-10-26 2013-10-22 Nanowire sized opto-electronic structure and method for modifying selected portions of same

Publications (1)

Publication Number Publication Date
TW201427080A true TW201427080A (zh) 2014-07-01

Family

ID=50545182

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102138762A TW201427080A (zh) 2012-10-26 2013-10-25 奈米線尺寸之光電結構及改質其經選定部分之方法

Country Status (5)

Country Link
US (2) US9178106B2 (enExample)
EP (1) EP2912698B1 (enExample)
JP (1) JP6322197B2 (enExample)
TW (1) TW201427080A (enExample)
WO (1) WO2014066371A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114788023A (zh) * 2019-12-10 2022-07-22 三星显示有限公司 发光元件和包括该发光元件的显示装置

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012101718B4 (de) * 2012-03-01 2025-08-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
JP6293157B2 (ja) 2012-10-26 2018-03-14 グロ アーベーGlo Ab ナノワイヤサイズの光電構造及びその選択された部分を改質する方法
KR20150103661A (ko) * 2012-10-26 2015-09-11 글로 에이비 나노와이어 led 구조 및 이를 제조하는 방법
US9178106B2 (en) 2012-10-26 2015-11-03 Glo Ab Nanowire sized opto-electronic structure and method for modifying selected portions of same
EP2973752A4 (en) 2013-03-15 2016-11-09 Glo Ab DIELECTRIC FILM WITH HIGH BREAKING INDEX TO INCREASE EXTRACTION EFFICIENCY OF NANODRAHT LEADS
FR3004006B1 (fr) * 2013-03-28 2016-10-07 Aledia Dispositif electroluminescent a nanofils actifs et nanofils de contact et procede de fabrication
CN204138341U (zh) * 2013-04-18 2015-02-04 崔波 硅衬底上的硅柱阵列
US9972750B2 (en) * 2013-12-13 2018-05-15 Glo Ab Use of dielectric film to reduce resistivity of transparent conductive oxide in nanowire LEDs
KR102188497B1 (ko) 2014-03-27 2020-12-09 삼성전자주식회사 나노구조 반도체 발광소자
DE102014107167B4 (de) 2014-05-21 2022-04-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Halbleiterbauelements mit einer Strukturschicht mit einer Mehrzahl von dreidimensionalen Strukturelementen und strahlungsemittierendes Halbleiterbauelement mit einer Strukturschicht mit einer Mehrzahl von dreidimensionalen Strukturelementen
DE102014117892A1 (de) * 2014-12-04 2016-06-09 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement sowie optoelektronisches Bauteil
EP3127747A1 (fr) * 2015-08-07 2017-02-08 Valeo Vision Dispositif d'éclairage et/ou de signalisation pour véhicule automobile
EP3365480A1 (en) * 2015-10-20 2018-08-29 King Abdullah University Of Science And Technology Nanowires-based light emitters on thermally and electrically conductive substrates and of making same
DE102015120778B4 (de) * 2015-11-30 2021-09-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102016102876A1 (de) * 2016-02-18 2017-08-24 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
CN207396531U (zh) 2017-01-31 2018-05-22 杭州探真纳米科技有限公司 一种悬臂末端纳米探针
US10840223B2 (en) * 2017-03-23 2020-11-17 Intel Corporation Augmented reality display systems with super-lambertian LED source
JP7007547B2 (ja) * 2017-04-11 2022-01-24 日亜化学工業株式会社 発光素子の製造方法
US10418499B2 (en) 2017-06-01 2019-09-17 Glo Ab Self-aligned nanowire-based light emitting diode subpixels for a direct view display and method of making thereof
GB201718897D0 (en) 2017-11-15 2017-12-27 Microsoft Technology Licensing Llc Superconductor-semiconductor fabrication
US10707374B2 (en) 2017-09-15 2020-07-07 Glo Ab Etendue enhancement for light emitting diode subpixels
JP7137066B2 (ja) 2018-10-23 2022-09-14 日亜化学工業株式会社 発光素子の製造方法
US11024792B2 (en) 2019-01-25 2021-06-01 Microsoft Technology Licensing, Llc Fabrication methods
CN115004390A (zh) * 2019-12-24 2022-09-02 密歇根大学董事会 第iii族氮化物激子异质结构
FR3118290A1 (fr) * 2020-12-17 2022-06-24 Aledia Dispositif optoélectronique à diodes électroluminescentes tridimensionnelles de type axial

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3988429B2 (ja) * 2001-10-10 2007-10-10 ソニー株式会社 半導体発光素子、画像表示装置及び照明装置とその製造方法
US7335908B2 (en) 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
US7132677B2 (en) 2004-02-13 2006-11-07 Dongguk University Super bright light emitting diode of nanorod array structure having InGaN quantum well and method for manufacturing the same
US7276389B2 (en) * 2004-02-25 2007-10-02 Samsung Electronics Co., Ltd. Article comprising metal oxide nanostructures and method for fabricating such nanostructures
US20070158661A1 (en) 2006-01-12 2007-07-12 Rutgers, The State University Of New Jersey ZnO nanostructure-based light emitting device
KR101375435B1 (ko) 2006-03-08 2014-03-17 큐나노 에이비 Si 상의 에피택셜 반도체 나노와이어를 금속 없이 합성하기 위한 방법
EP1994552B1 (en) * 2006-03-10 2020-12-30 UNM Rainforest Innovations Two-phase growth of group iii-v nanowires
EP2064745A1 (en) * 2006-09-18 2009-06-03 QuNano AB Method of producing precision vertical and horizontal layers in a vertical semiconductor structure
WO2008140611A2 (en) 2006-12-18 2008-11-20 The Regents Of The University Of California Nanowire array-based light emitting diodes and lasers
WO2008079076A1 (en) * 2006-12-22 2008-07-03 Qunano Ab Led with upstanding nanowire structure and method of producing such
KR101524319B1 (ko) 2007-01-12 2015-06-10 큐나노 에이비 시준 리플렉터를 갖는 나노구조 led 어레이
EP2102899B1 (en) 2007-01-12 2020-11-11 QuNano AB Nitride nanowires and method of producing such
WO2008123927A1 (en) * 2007-04-05 2008-10-16 The Board Of Trustees Of The University Of Illinois Biosensors with porous dielectric surface for fluorescence enhancement and methods of manufacture
WO2008129861A1 (ja) * 2007-04-18 2008-10-30 Panasonic Corporation 発光素子
JP4954039B2 (ja) * 2007-11-29 2012-06-13 三菱電機株式会社 半導体装置の製造方法
JP2009147140A (ja) 2007-12-14 2009-07-02 Panasonic Corp 発光素子および発光素子の製造方法
EP2289106A4 (en) * 2008-06-13 2014-05-21 Qunano Ab CAPACITOR MOS NANOSTRUCTURE
CN103022282B (zh) 2008-07-07 2016-02-03 格罗有限公司 纳米结构led
KR20100080094A (ko) 2008-12-31 2010-07-08 삼성전자주식회사 방사형 이종접합 구조의 나노 막대를 이용한 발광 다이오드
EP2446467A4 (en) 2009-06-26 2014-07-02 California Inst Of Techn METHOD FOR PRODUCING PASSIVATED SILICON NANODRICES AND APPARATUS THUS OBTAINED THEREFOR
US20110079766A1 (en) * 2009-10-01 2011-04-07 Isaac Harshman Wildeson Process for fabricating iii-nitride based nanopyramid leds directly on a metalized silicon substrate
KR101134493B1 (ko) 2010-03-19 2012-04-13 삼성엘이디 주식회사 발광 다이오드 및 이의 제조 방법
EP2583317A4 (en) 2010-06-18 2016-06-15 Glo Ab NANODRAHT LED STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF
JP5981426B2 (ja) 2010-06-24 2016-08-31 グロ アーベーGlo Ab 配向されたナノワイヤー成長用のバッファ層を有する基板
KR101710159B1 (ko) 2010-09-14 2017-03-08 삼성전자주식회사 Ⅲ족 질화물 나노로드 발광소자 및 그 제조 방법
US20130200391A1 (en) 2010-09-28 2013-08-08 North Carolina State University Gallium nitride based structures with embedded voids and methods for their fabrication
KR20120040550A (ko) * 2010-10-19 2012-04-27 삼성엘이디 주식회사 반도체 발광소자 및 그 제조방법
KR20120055390A (ko) * 2010-11-23 2012-05-31 삼성엘이디 주식회사 발광소자 및 그 제조방법
KR20120070809A (ko) * 2010-12-22 2012-07-02 엘지이노텍 주식회사 발광 소자, 및 발광 소자 패키지
US8409892B2 (en) * 2011-04-14 2013-04-02 Opto Tech Corporation Method of selective photo-enhanced wet oxidation for nitride layer regrowth on substrates
WO2013025874A2 (en) 2011-08-16 2013-02-21 Brightedge Technologies, Inc. Page reporting
US8350249B1 (en) 2011-09-26 2013-01-08 Glo Ab Coalesced nanowire structures with interstitial voids and method for manufacturing the same
CN104769732A (zh) * 2012-09-18 2015-07-08 Glo公司 纳米角锥体大小的光电子结构及其制造方法
US9178106B2 (en) 2012-10-26 2015-11-03 Glo Ab Nanowire sized opto-electronic structure and method for modifying selected portions of same
JP6293157B2 (ja) 2012-10-26 2018-03-14 グロ アーベーGlo Ab ナノワイヤサイズの光電構造及びその選択された部分を改質する方法
KR20150103661A (ko) 2012-10-26 2015-09-11 글로 에이비 나노와이어 led 구조 및 이를 제조하는 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114788023A (zh) * 2019-12-10 2022-07-22 三星显示有限公司 发光元件和包括该发光元件的显示装置
US12294041B2 (en) 2019-12-10 2025-05-06 Samsung Display Co., Ltd. Light emitting element having a semiconductor main body core with a first end inclined and second end width smaller than the core

Also Published As

Publication number Publication date
US9799796B2 (en) 2017-10-24
EP2912698A4 (en) 2016-04-06
EP2912698B1 (en) 2018-04-04
US9178106B2 (en) 2015-11-03
WO2014066371A1 (en) 2014-05-01
JP6322197B2 (ja) 2018-05-09
EP2912698A1 (en) 2015-09-02
US20160141450A1 (en) 2016-05-19
US20140117307A1 (en) 2014-05-01
JP2015536566A (ja) 2015-12-21

Similar Documents

Publication Publication Date Title
US9799796B2 (en) Nanowire sized opto-electronic structure and method for modifying selected portions of same
JP6486519B2 (ja) ナノワイヤサイズの光電構造及びその選択された部分を改質する方法
US8921141B2 (en) Nanopyramid sized opto-electronic structure and method for manufacturing of same
TWI601310B (zh) 奈米線發光二極體結構及其製造方法
TW201515091A (zh) 藉由乾式蝕刻移除3d半導體結構之方法
TW201515269A (zh) 用於平整化及界定奈米線裝置之活化區的絕緣層
JP2016519421A (ja) ナノワイヤledの抽出効率を向上させる高誘電体膜
US9059355B2 (en) Stopping an etch in a planar layer after etching a 3D structure
TWI636952B (zh) 使用介電膜以減少奈米線發光二極體中之透明導電氧化物之電阻率
WO2014143991A1 (en) Nanowire led structure with decreased leakage and method of making same
TW201511334A (zh) 具有經減低漏電之奈米線發光二極體結構及其製造方法
CN116636010A (zh) 具有轴向三维发光二极管的光电子器件