TW201420300A - Adhesion jig and method of using the same - Google Patents

Adhesion jig and method of using the same Download PDF

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Publication number
TW201420300A
TW201420300A TW102103312A TW102103312A TW201420300A TW 201420300 A TW201420300 A TW 201420300A TW 102103312 A TW102103312 A TW 102103312A TW 102103312 A TW102103312 A TW 102103312A TW 201420300 A TW201420300 A TW 201420300A
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Taiwan
Prior art keywords
workpiece
fixture
opening
bonding
platform
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TW102103312A
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Chinese (zh)
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TWI505923B (en
Inventor
Chih-Feng Wang
You-Qiang Su
Zhuang Liu
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Tpk Touch Solutions Xiamen Inc
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Publication of TW201420300A publication Critical patent/TW201420300A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • B32B38/1841Positioning, e.g. registration or centering during laying up
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives

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  • Automatic Assembly (AREA)
  • Telephone Set Structure (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

An adhesion jig comprises a base having a central opening and a plurality of sidewalls surrounding said opening, an adhesion stage supported in said opening of the base for a first workpiece to be placed thereon. The peripheral of said first workpiece is designed to exceed the peripheral of said adhesion stage when it is placed on the stage, and at least one restricting portions formed on the base for confining the position of a second workpiece loaded from outside, so that the second workpiece may be precisely adhered with the first workpiece placed on the stage. A method of using said adhesion jig is also provided for preventing the contamination caused by the overflow of the adhesive.

Description

貼合治具暨其使用方法 Fitting fixture and its use method

本發明大體上關於一種治具,更具體言之,其係關於一種貼合治具及其使用方法。 The present invention generally relates to a jig, and more particularly to a conforming jig and method of use thereof.

治具(jig)是一種用來協助控制工件或機件位置或引導其動作的一種工具,藉由控制工件或機件的位置或動作,治具可起到準確、安全、快速地重複工序中某部位之製作步驟的功效,故其在加工業或組裝業中被廣泛地應用。治具會隨著其不同的應用領域與客製化需求而呈現多種的型態,舉凡機械加工治具、沖壓治具、熱處理治具、焊接治具、或是裝配治具等,都是業界常見的治具類型。就某些型態而言,治具亦可被視為是一種工裝夾具(fixture),兩者在功能上並無顯著的不同。 A jig is a tool used to assist in controlling the position of a workpiece or part or guiding its movement. By controlling the position or movement of a workpiece or part, the jig can be used to repeat the process accurately, safely and quickly. The efficacy of the manufacturing steps of a certain part is widely used in the processing industry or the assembly industry. The fixtures will be presented in a variety of styles depending on their application areas and customization requirements. All machining tools, stamping fixtures, heat treatment fixtures, welding fixtures, or assembly fixtures are the industry. Common types of fixtures. For some types, the fixture can also be considered a fixture, and there is no significant difference in functionality between the two.

治具同樣也被應用在現今的智慧型手機的組裝領域中,在此應用中,觸控基板(sensor glass)一般會先與外側的保護性玻璃蓋板(cover glass)進行對位與貼合,之後觸控面板才會與內側的液晶面板、電路板、以及機殼等部件進行整體的組裝。就上述觸控基板與玻璃蓋板的貼合步驟而言,目前業界通常是利用一特製的貼合治具來使觸控基板能準確地與玻璃 蓋板貼合。 The jig is also used in the assembly field of today's smart phones. In this application, the sensor glass is generally aligned and fitted with the outer protective glass. Then, the touch panel is assembled integrally with the inner liquid crystal panel, the circuit board, and the casing. For the bonding step of the touch substrate and the glass cover, the industry generally uses a special bonding fixture to accurately contact the touch substrate with the glass. The cover is fitted.

下文中將透過第1圖與第2圖來說明上述貼合步驟的細節。首先,第1圖繪示出一般智慧型手機組裝中習用的貼合治具的立體圖。如第1圖所示,一般智慧型手機組裝中習用的貼合治具100係呈塊板狀的座體態樣,其中央有一承載區域101用以放置要進行貼合的觸控基板。承載區域101平台的四周形成有多個凸起的限位部103,如圖中所示的角落部位,其可限制放置在承載區域101上的觸控基板的位置。同時,在各限位部103外側的部位則形成有階梯部105,其係用來限制玻璃蓋板在接近與觸控基板貼合的部位時的位置。透過上述限位部103與階梯部105的配置設計,習用的貼合治具100得以使玻璃蓋板與觸控基板準確地貼合。然而,儘管上述習用的貼合治具100可以達成準確貼合之功效,在實作中習用的貼合治具100會產生不少的製程問題,後續將以第2圖來解說此問題。 Details of the above bonding step will be described below through Figs. 1 and 2. First, Fig. 1 is a perspective view showing a conventional fitting jig in a general smart phone assembly. As shown in FIG. 1 , the conventional bonding fixture 100 used in the assembly of a smart phone has a block-shaped seat body shape, and has a bearing area 101 at the center for placing a touch substrate to be attached. A plurality of raised limiting portions 103 are formed around the platform of the carrying area 101, such as the corner portions shown in the figure, which can limit the position of the touch substrate placed on the carrying area 101. At the same time, a step portion 105 is formed at a portion outside the respective limiting portions 103 for restricting the position of the cover glass when it is close to the portion to be bonded to the touch substrate. Through the arrangement design of the limiting portion 103 and the step portion 105, the conventional bonding jig 100 allows the glass cover to be accurately attached to the touch substrate. However, although the conventional fitting jig 100 can achieve the effect of accurate fitting, the conventional fitting jig 100 in practice can cause a lot of process problems, and the problem will be explained later in FIG.

現在請參照第2圖,其繪示出上述習用的貼合治具100在實際貼合期間的截面圖,此截面圖係以第1圖中的線A-A’為截線所作成,其可清楚地表示出玻璃蓋板、觸控基板、限位部以及階梯部之間的相對位置與距離。如第2圖所示,玻璃蓋板107與觸控基板109之間係藉由貼合膠111(如一水膠)來相互貼合,貼合膠111會經由自由溢膠的方式在貼合面上潤濕擴散。在習知技術中,由於觸控基板109是利用貼合治具的限位部103來達到固定位置的效果,故可以從圖中看到 觸控基板109的周緣109a會非常接近限位部103,甚至與之接觸。另一方面,玻璃蓋板107係從貼合治具100上方往下與觸控基板109進行貼合,在接近觸控基板109時,玻璃蓋板107會透過貼合治具100的階梯部外壁105a來限制其位置,使得玻璃蓋板107能與下方的觸控基板109精確對位並均勻貼合。最後玻璃蓋板107的貼合面係位於接近階梯部平台105b的高度水平,其與觸控基板109之間會有微小的間隙讓貼合膠111透過毛細現象自然地溢膠、潤濕擴散。 Referring now to FIG. 2, there is shown a cross-sectional view of the conventional bonding jig 100 during the actual bonding, which is made by taking the line A-A' in FIG. 1 as a cross line. The relative position and distance between the glass cover, the touch substrate, the limiting portion, and the step portion can be clearly indicated. As shown in FIG. 2, the glass cover 107 and the touch substrate 109 are adhered to each other by a bonding glue 111 (such as a water-repellent glue), and the adhesive 111 is applied to the bonding surface via a free overflow. Wetting and diffusion. In the prior art, since the touch substrate 109 is a fixed position by using the limiting portion 103 of the bonding jig, it can be seen from the figure. The peripheral edge 109a of the touch substrate 109 is very close to or even in contact with the limiting portion 103. On the other hand, the glass cover 107 is attached to the touch substrate 109 from above the bonding fixture 100. When approaching the touch substrate 109, the glass cover 107 passes through the outer wall of the step of the bonding fixture 100. 105a is used to limit its position so that the glass cover 107 can be accurately aligned with the underlying touch substrate 109 and uniformly adhered. Finally, the bonding surface of the glass cover 107 is located close to the height level of the stepped platform 105b, and there is a slight gap between the glass cover 107 and the touch substrate 109, so that the adhesive film 111 naturally overflows and wets and spreads through the capillary phenomenon.

從第2圖中可以清楚地看到,由於習知貼合治具100的限位部103與階梯部105的緊鄰式一體設計,使得觸控基板109的部分周緣以及玻璃蓋板107的貼合面在貼合時會很靠近階梯部105的角落部位105c,如以虛線所圈出的區域所示,如此將會使貼合膠111因為毛細現象而潤濕擴散到貼合治具100上。此過度溢膠之現象會對治具造成污染,而影響到後續其他觸控基板以及玻璃蓋板的貼合作業。故此,目前業界仍需改良現今智慧型手機組裝中習用的貼合治具之設計,以期能解決上述諸多先前技術固有的問題。 It can be clearly seen from FIG. 2 that a part of the periphery of the touch substrate 109 and the glass cover 107 are attached due to the close-fitting design of the limiting portion 103 of the conventional fitting jig 100 and the step portion 105. The face will be very close to the corner portion 105c of the step portion 105, as shown by the area circled by the broken line, so that the glue 111 will be wetted and spread onto the bonding jig 100 due to the capillary phenomenon. This excessive gelation phenomenon will cause pollution to the fixture, and affect the subsequent cooperation of other touch substrates and glass cover sheets. Therefore, the industry still needs to improve the design of the fitting fixtures used in today's smart phone assembly, in order to solve the problems inherent in many of the above prior art.

有鑒於前述習知技術之作法容易導致過度溢膠之問題,本發明特以提出了一種新穎的貼合治具設計,其捨棄了一般習知技術中兩件貼合工件都藉由限位部或限位特徵來固定位 置之作法,而採用新穎的單工件式限位設計來進行貼合。如此,貼合膠就不會因為工件與貼合治具過於接近而引起毛細現象,進而導致過度溢膠等問題。 In view of the above-mentioned prior art techniques, the problem of excessive overfilling is easily caused, and the present invention proposes a novel design of a fitting fixture, which discards the conventional technique in which two pieces of the fitting workpiece are supported by the limiting portion. Or limit feature to fix the position In the same way, a novel single-piece limit design is used for the fit. In this way, the bonding glue does not cause capillary phenomenon due to the workpiece being too close to the bonding fixture, which may cause problems such as excessive glue overflow.

根據本發明之一態樣,其貼合治具包含一座體,其中央具有一開口及具有環繞該開口的複數個側壁;一承載台,其懸設在該座體的開口中,該承載台用以承載一第一工件,承載時該第一工件的周緣會超出該承載台的周緣且與該側壁間隔一定距離、以及至少一限位部設在該座體上,用以限制一從外部進入該開口的第二工件的位置,使得第二工件可以準確地與承載在該承載台上的該第一工件貼合。 According to one aspect of the invention, a fitting fixture includes a body having an opening in the center and a plurality of side walls surrounding the opening; a mounting platform suspended in the opening of the housing, the carrier For carrying a first workpiece, the circumference of the first workpiece may exceed the circumference of the loading platform and be spaced apart from the sidewall, and at least one limiting portion is disposed on the base for limiting an external The position of the second workpiece entering the opening is such that the second workpiece can be accurately engaged with the first workpiece carried on the stage.

根據本發明之另一態樣,其提出了一種貼合治具的使用方法,其步驟包含提供一貼合治具,該貼合治具包含一具有中央開口的座體、一懸設在該座體中央開口的承載台以及至少一設在該座體上的限位部,其中該限位部用以限制工件從外部進入該開口的位置;將一第一工件設置在該承載台上,使得該第一工件的周緣超出該承載台的周緣且與環繞該開口的側壁間隔一定距離;使一第二工件經過該限位部的限位,使得該第二工件可以準確地與承載在該承載台上的該第一工件貼合。 According to another aspect of the present invention, a method of using a fitting jig is provided, the method comprising the steps of providing a fitting jig comprising a seat having a central opening, a suspension a central opening of the base and at least one limiting portion disposed on the base, wherein the limiting portion is configured to limit a position of the workpiece from the outside into the opening; and a first workpiece is disposed on the carrying platform So that the circumference of the first workpiece extends beyond the circumference of the loading platform and is spaced apart from the sidewall surrounding the opening; the second workpiece passes through the limit of the limiting portion, so that the second workpiece can be accurately carried The first workpiece on the stage is attached.

無疑地,本發明的這類目的與其他目的在閱者讀過下文以多種圖示與繪圖來描述的較佳實施例細節說明後將變得更為顯見。 The objectives and other objects of the present invention will become more apparent from the written description of the appended claims.

在下文的細節描述中,元件符號會標示在隨附的圖示中成為其中的一部份,並且以可實行該實施例之特例描述方式來表示。這類實施例會說明足夠的細節俾使該領域之一般技藝人士得以具以實施。閱者須瞭解到本發明中亦可利用其他的實施例或是在不悖離所述實施例的前提下作出結構性、邏輯性、及電性上的改變。因此,下文之細節描述將不欲被視為是一種限定,反之,其中所包含的實施例將由隨附的申請專利範圍來加以界定。 In the detailed description that follows, the component symbols are marked as part of the accompanying drawings and are described in the manner in which the particular embodiments of the embodiments can be practiced. Such embodiments will be described in sufficient detail to enable those of ordinary skill in the art to practice. The reader is aware that other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the embodiments. Therefore, the following detailed description is not to be considered as a limitation, and the embodiments included herein are defined by the scope of the accompanying claims.

首先請參照第3圖,其繪示出根據本發明較佳實施例中一貼合治具200的立體圖。如第3圖所示,貼合治具200的主體是一座體201,其呈框架態樣。座體201的中間具有一開口203及具有環繞該開口的複數個側壁204,一承載台205係懸設在座體201的開口203中。座體201更包含一連接承載台205的支撐件,承載台205可藉由支撐件207懸設在開口203中,且可與環繞開口203的側壁204間隔一定距離。側壁204的數量、位置和形狀可根據所貼合的工件作調整。承載台205係設來承載一第一工件,如智慧型手機中的觸控基板(sensor glass)部件。在本實施例中,承載台205的承載面高度高於該支撐件207的高度,以避免貼合時貼合膠溢膠沾黏到支撐件207。 Referring first to Figure 3, a perspective view of a fitting jig 200 in accordance with a preferred embodiment of the present invention is illustrated. As shown in Fig. 3, the main body of the fitting jig 200 is a body 201 which is in the form of a frame. The base 201 has an opening 203 in the middle thereof and a plurality of side walls 204 surrounding the opening. A loading platform 205 is suspended in the opening 203 of the base 201. The base 201 further includes a support member that connects the carrier 205. The carrier 205 can be suspended in the opening 203 by the support member 207 and can be spaced apart from the sidewall 204 of the surrounding opening 203. The number, location and shape of the side walls 204 can be adjusted depending on the workpiece being attached. The carrier 205 is configured to carry a first workpiece, such as a sensor glass component in a smart phone. In this embodiment, the height of the bearing surface of the carrying platform 205 is higher than the height of the supporting member 207, so as to prevent the adhesive glue from sticking to the supporting member 207 when the bonding is performed.

承載台205周遭的座體201上則形成有多個限位部209,如圖中所示分設在承載台205外側的四個角落或是分設在座 體201的四個角落處,其高度會高於承載台205,使得一第二工件在接近承載台205時會先受到此些限位部209的限位,以定位在預定的貼合位置上。貼合治具200上還可形成有凹槽210,方便用夾具夾取貼合後的工件。 A plurality of limiting portions 209 are formed on the base 201 surrounding the carrying platform 205, and are disposed at four corners outside the carrying platform 205 or are respectively arranged in the seat as shown in the figure. At the four corners of the body 201, the height of the body 201 is higher than that of the loading platform 205, so that a second workpiece is firstly restrained by the limiting portions 209 when approaching the loading platform 205 to be positioned at a predetermined bonding position. . The fitting jig 200 can also be formed with a groove 210 for facilitating the clamping of the attached workpiece by the clamp.

現在請參照第4圖,其繪示出根據本發明較佳實施例中一第一工件211承載在第3圖中貼合治具200的承載台205上的頂視圖。如第4圖所示,一第一工件211係放置在承載台205上。在較佳的情況下,承載台205所承載的第一工件211的周緣會超出承載台205的周緣,如此將可確保貼合期間塗佈在第一工件211上的貼合膠即便溢出也不會沾污到第一工件211下方的承載台205。在本發明實施例中,第一工件211與承載台205都呈矩形態樣。然在其他實施例中,第一工件211與承載台205亦可為其他形狀,如圓形,甚或是不規則形,端視所欲貼合的工件設計而定。再者,在本發明實施例中,貼合治具200的開口203大小係設計成當第一工件211放置在承載台205上時,第一工件211的周緣會與環繞開口203的側壁204間隔一定的距離,如此將可確保貼合期間第一工件211不會與座體201的側壁204過於接近而導致貼合膠潤濕沾染到座體201。同樣地,為避免貼合膠潤濕沾染到限位部209,第一工件211會與限位部209之間間隔一定距離。 Referring now to FIG. 4, a top view of a first workpiece 211 carried on a carrier 205 of the bonding fixture 200 in FIG. 3 is illustrated in accordance with a preferred embodiment of the present invention. As shown in FIG. 4, a first workpiece 211 is placed on the carrier 205. In a preferred case, the circumference of the first workpiece 211 carried by the carrier 205 may exceed the circumference of the carrier 205, thus ensuring that even if the adhesive applied to the first workpiece 211 during the bonding process overflows, The carrier 205 under the first workpiece 211 is contaminated. In the embodiment of the present invention, the first workpiece 211 and the carrying platform 205 are both in a rectangular shape. In other embodiments, the first workpiece 211 and the carrier 205 may have other shapes, such as a circular shape or even an irregular shape, depending on the design of the workpiece to be attached. Moreover, in the embodiment of the present invention, the opening 203 of the bonding fixture 200 is sized such that when the first workpiece 211 is placed on the carrier 205, the circumference of the first workpiece 211 is spaced from the sidewall 204 of the surrounding opening 203. A certain distance, this will ensure that the first workpiece 211 will not be too close to the side wall 204 of the seat 201 during the bonding process, causing the adhesive glue to wet and contaminate the body 201. Similarly, in order to prevent the adhesive glue from being wetted and contaminated to the limiting portion 209, the first workpiece 211 is spaced apart from the limiting portion 209 by a certain distance.

復參照第4圖,在本發明較佳實施例中,貼合治具200上還可具有多個可移動式的定位件(或定位爪)213,定位件213設置在承載台205四周,用來定位所欲承載的第一工件 211在承載台205上的位置。例如定位件213可進行X方向與Y方向的移動來推動放置在承載台205上的第一工件211,以將第一工件211移動到預定的貼合位置上。在另一實施例中,定位件213可通過吸附方式移動第一工件211,進而達到定位第一工件211的目的。另外,可移動式的定位件(或定位爪)213也可以是遠離限位部209而設置,以避免溢膠部分會如習知般的緊鄰式設計而汙染到定位件或限位部。 Referring to FIG. 4, in the preferred embodiment of the present invention, the bonding fixture 200 may further include a plurality of movable positioning members (or positioning claws) 213 disposed around the carrying platform 205. To locate the first workpiece to be carried The position of 211 on the carrier 205. For example, the positioning member 213 can move in the X direction and the Y direction to push the first workpiece 211 placed on the stage 205 to move the first workpiece 211 to a predetermined bonding position. In another embodiment, the positioning member 213 can move the first workpiece 211 by suction, thereby achieving the purpose of positioning the first workpiece 211. In addition, the movable positioning member (or positioning claw) 213 may also be disposed away from the limiting portion 209 to prevent the overflow portion from being contaminated to the positioning member or the limiting portion as is conventionally known.

再者,承載台205的承載面上可設有多個氣孔214,在以定位件213定位第一工件211後,第一工件211可經由氣孔214以真空吸附方式固定在承載台205上,避免貼合時因第一工件211的移動而造成貼合不正確。在另一實施例中,承載台205可具有一定的黏著性,進而可以黏著方式固定第一工件211。在又一實施例中,當第一工件211為具有磁性的物質時,可於承載台205下方增加一磁力吸附裝置,通過磁力吸附的方式將第一工件211固定於承載台205上。 Furthermore, the bearing surface of the loading platform 205 can be provided with a plurality of air holes 214. After the first workpiece 211 is positioned by the positioning member 213, the first workpiece 211 can be fixed on the loading platform 205 via the air hole 214 by vacuum adsorption. The bonding is incorrect due to the movement of the first workpiece 211 during the bonding. In another embodiment, the carrier 205 can have a certain adhesiveness, and the first workpiece 211 can be fixed in an adhesive manner. In another embodiment, when the first workpiece 211 is a substance having magnetic properties, a magnetic attraction device may be added under the loading platform 205 to fix the first workpiece 211 to the carrier 205 by magnetic attraction.

接著請參照第5圖,其繪示出本發明較佳實施例中一第二工件215在貼合期間受到貼合治具200限位的頂視圖。在本發明實施例中,預定要與承載台205上的第一工件211進行貼合的第二工件215,如智慧型手機中的玻璃蓋板部件(cover glass),會先在壓合機台(未示於圖中)上進行點膠步驟,將貼合膠先均勻潤濕散佈在第二工件215的貼合面上。在貼合期間,壓合機台會將第二工件215從貼合治具200的 上方送入貼合治具200的開口203中。在此步驟,第二工件215會經過承載台205上方開口203四周座體201上所設的多個限位部209。在本發明實施例中,第二工件215的面積會大於第一工件之面積211,舉例言之,智慧型手機中的觸控基板面積會小於外層的保護性玻璃蓋板,約略僅佔該玻璃蓋板上未形成有遮蔽層的螢幕顯示區域而已。如第3圖與第5圖所示,貼合治具200的每一限位部209可為具有特定輪廓形狀的凹部,其形狀將會對應到所欲限位之第二工件215的周緣輪廓。如此,在多個限位部209的共同作用下,經過開口203的第二工件215將可被精確地限制在預定的貼合位置上,且在與第一工件211的貼合時位置不會因受力不均而偏移。 Next, please refer to FIG. 5, which illustrates a top view of a second workpiece 215 being restrained by the conforming jig 200 during the bonding process in the preferred embodiment of the present invention. In the embodiment of the present invention, the second workpiece 215, which is intended to be attached to the first workpiece 211 on the carrying platform 205, such as a cover glass in a smart phone, is first placed on the press machine. The dispensing step is carried out (not shown), and the bonding glue is uniformly wetted and spread on the bonding surface of the second workpiece 215. During the fitting, the press machine will take the second workpiece 215 from the fitting jig 200 The upper portion is fed into the opening 203 of the fitting jig 200. In this step, the second workpiece 215 passes through a plurality of limiting portions 209 provided on the base 201 around the opening 203 above the carrying platform 205. In the embodiment of the present invention, the area of the second workpiece 215 is larger than the area 211 of the first workpiece. For example, the area of the touch substrate in the smart phone is smaller than the protective glass cover of the outer layer, which occupies only the glass. The screen display area of the cover layer is not formed on the cover. As shown in FIGS. 3 and 5, each of the limiting portions 209 of the fitting jig 200 may be a recess having a specific contour shape, the shape of which will correspond to the contour of the second workpiece 215 of the desired limit. . Thus, under the joint action of the plurality of limiting portions 209, the second workpiece 215 passing through the opening 203 can be accurately restricted to a predetermined bonding position, and the position is not aligned with the first workpiece 211. Offset due to uneven force.

現在請參照第6圖,其繪示出根據本發明較佳實施例中貼合治具200在實際貼合期間的截面圖,此截面圖係以第5圖中的線B-B’為截線所作成,其可清楚表示出第一工件211、第二工件215、承載台205、以及限位部209之間的相對位置與距離。如第6圖所示,第一工件211係固定在承載台205上,其周緣超出承載台205的周緣。第二工件215貼合面的特定區域上佈有貼合膠217,在貼合期間,第二工件215會從貼合治具200上方進入開口203中,並受到限位部209的限位,使得第二工件215的貼合區域能精確地與第一工件211對準並貼合。從第6圖中可以清楚地看出,第一工件211與第二工件215兩工件中,只有面積較大的第二工件 215會受到限位部209的限位而與貼合治具200接近或接觸。面積較小的第一工件211因為不是利用貼合治具200的限位部209來限位,故其周緣不會與貼合治具200接近或接觸(承載台205除外)。 Referring now to Figure 6, there is shown a cross-sectional view of the bonding jig 200 during actual bonding in accordance with a preferred embodiment of the present invention. The cross-sectional view is taken as line B-B' in Figure 5 The line is made to clearly show the relative position and distance between the first workpiece 211, the second workpiece 215, the carrier 205, and the limiting portion 209. As shown in Fig. 6, the first workpiece 211 is fixed to the carrier 205 with its periphery exceeding the circumference of the carrier 205. The specific surface of the bonding surface of the second workpiece 215 is covered with a bonding glue 217. During the bonding, the second workpiece 215 enters the opening 203 from above the bonding fixture 200 and is limited by the limiting portion 209. The conforming area of the second workpiece 215 can be accurately aligned and conformed to the first workpiece 211. It can be clearly seen from Fig. 6 that among the two workpieces of the first workpiece 211 and the second workpiece 215, only the second workpiece having a larger area is present. The 215 is subjected to the restriction of the stopper portion 209 to approach or contact the bonding fixture 200. Since the first workpiece 211 having a small area is not limited by the stopper portion 209 of the bonding jig 200, the periphery thereof does not come close to or contact with the bonding jig 200 (except for the carrying table 205).

根據上述本發明實施例所提出之貼合治具200,本發明亦提出了該貼合治具的使用方法,其步驟包含先提供一如第3圖的貼合治具,該貼合治具包含一具有中央開口203的座體201、一懸設在該座體201中央開口203的承載台205以及至少一設在該座體201上的限位部209,其中該限位部209用以限制工件從外部進入該開口203的位置(該貼合治具的其他元件與相對應說明,已於上述實施例中揭露,在此不再贅述),再將一第一工件211設置在該貼合治具的承載台205上(如第4圖所示),使得該第一工件211的周緣超出該承載台205的周緣且與環繞該承載台開口203的側壁間隔一定距離,最後使一第二工件215經過該些限位部而被限位(如第5圖與第6圖所示),因而使該第二工件215可以準確地與承載在該承載台上的該第一工件211貼合。貼合過程中,貼合膠可預先形成於第一工件211上,或者預先形成於第二工件215上。 According to the bonding fixture 200 proposed by the embodiment of the present invention, the present invention also provides a method for using the bonding fixture, the method comprising the steps of providing a bonding fixture as shown in FIG. 3, the bonding fixture The base 201 includes a central opening 203, a mounting base 205 suspended from the central opening 203 of the base 201, and at least one limiting portion 209 disposed on the base 201. The limiting portion 209 is used for the limiting portion 209. Limiting the position of the workpiece from the outside into the opening 203 (other components of the fitting jig and corresponding descriptions have been disclosed in the above embodiments, and will not be described herein again), and a first workpiece 211 is placed on the sticker. The carrier 205 of the fixture (as shown in FIG. 4) is such that the circumference of the first workpiece 211 extends beyond the circumference of the carrier 205 and is spaced apart from the sidewall surrounding the opening 203 of the stage, and finally makes a The two workpieces 215 are constrained by the limiting portions (as shown in FIGS. 5 and 6), thereby enabling the second workpiece 215 to be accurately attached to the first workpiece 211 carried on the loading platform. Hehe. In the bonding process, the bonding glue may be formed on the first workpiece 211 in advance or formed on the second workpiece 215 in advance.

本發明提出的該貼合治具的使用方法更包含使用一可移動的定位件來定位該第一工件設置在該承載台上的位置。本發明提出的該貼合治具的使用方法更包含利用真空吸附方式或黏著方式將該第一工件固定在該承載台上,或是利用磁力 吸附方式將該第一工件固定在該承載台上。 The method of using the fitting jig of the present invention further comprises using a movable positioning member to position the first workpiece on the stage. The method for using the bonding fixture provided by the invention further comprises fixing the first workpiece to the loading platform by vacuum adsorption or adhesion, or using a magnetic force The first workpiece is fixed to the stage by an adsorption method.

透過本發明的設計,第一工件與第二工件之間的貼合膠即便溢膠也不會接觸到貼合治具,故可防止過度溢膠所造成的污染情形發生,亦可避免水膠浪費,或是點膠量及貼合厚度不穩定等問題。 Through the design of the invention, the bonding glue between the first workpiece and the second workpiece does not contact the bonding fixture even if the glue is overflowed, so that the contamination caused by excessive overflow can be prevented, and the water glue can be avoided. Waste, or problems such as the amount of glue dispensed and the thickness of the fit.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

100‧‧‧貼合治具 100‧‧‧Fitting fixture

101‧‧‧承載區域 101‧‧‧bearing area

103‧‧‧限位部 103‧‧‧Limited

105‧‧‧階梯部 105‧‧‧Steps

105a‧‧‧限位部外壁 105a‧‧‧The outer wall of the limit

105b‧‧‧限位部平台 105b‧‧‧Limited Platform

105c‧‧‧角落部位 105c‧‧‧ corner parts

107‧‧‧玻璃蓋板 107‧‧‧glass cover

109‧‧‧觸控基板 109‧‧‧Touch substrate

109a‧‧‧周緣 109a‧‧‧ Periphery

111‧‧‧貼合膠 111‧‧‧Finishing glue

200‧‧‧貼合治具 200‧‧‧Fit fixture

201‧‧‧座體 201‧‧‧ body

203‧‧‧開口 203‧‧‧ openings

205‧‧‧承載台 205‧‧‧bearing station

207‧‧‧支撐件 207‧‧‧Support

209‧‧‧限位部 209‧‧‧Limited

210‧‧‧凹槽 210‧‧‧ Groove

211‧‧‧第一工件 211‧‧‧First workpiece

213‧‧‧定位件 213‧‧‧ Positioning parts

214‧‧‧氣孔 214‧‧‧ stomata

215‧‧‧第二工件 215‧‧‧second workpiece

217‧‧‧貼合膠 217‧‧‧Finishing glue

本說明書含有附圖併於文中構成了本說明書之一部分,俾使閱者對本發明實施例有進一步的瞭解。該些圖示係描繪了本發明一些實施例並連同本文描述一起說明了其原理。在該些圖示中:第1圖繪示出一般智慧型手機組裝中習用的貼合治具的立體圖;第2圖繪示出第1圖中習用的貼合治具在實際貼合期間的截面圖;第3圖繪示出根據本發明較佳實施例中一貼合治具的立體圖;第4圖繪示出根據本發明較佳實施例中一第一工件承載在第3圖中貼合治具的承載台上的頂視圖;第5圖繪示出本發明較佳實施例中一第二工件在貼合期 間受到貼合治具限位的頂視圖;以及第6圖繪示出第3圖中貼合治具在實際貼合期間的截面圖。 The present specification contains the drawings and constitutes a part of the specification in the specification, and the reader will further understand the embodiments of the invention. The drawings depict some embodiments of the invention and, together with the description herein. In the drawings, FIG. 1 is a perspective view showing a conventional jig for fitting in a general smart phone assembly, and FIG. 2 is a view showing a conventional jig in the first drawing during the actual fitting. 3 is a perspective view of a fitting jig in accordance with a preferred embodiment of the present invention; and FIG. 4 is a view showing a first workpiece carried in FIG. 3 in accordance with a preferred embodiment of the present invention. a top view on the carrier of the fixture; Figure 5 illustrates a second workpiece in the preferred embodiment of the invention during the bonding period A top view of the conformal fixture limit; and a cross-sectional view of the fit fixture during the actual fit in FIG.

須注意本說明書中的所有圖示皆為圖例性質。為了清楚與方便圖示說明之故,圖示中的各部件在尺寸與比例上可能會被誇大或縮小地呈現。圖中相同的參考符號一般而言會用來標示修改後或不同實施例中對應或類似的特徵。 It should be noted that all the illustrations in this specification are of the nature of the legend. For the sake of clarity and convenience of illustration, the various components in the drawings may be exaggerated or reduced in size and proportion. The same reference numbers are used in the drawings to refer to the corresponding or similar features in the modified or different embodiments.

200‧‧‧貼合治具 200‧‧‧Fit fixture

203‧‧‧開口 203‧‧‧ openings

205‧‧‧承載台 205‧‧‧bearing station

209‧‧‧限位部 209‧‧‧Limited

211‧‧‧第一工件 211‧‧‧First workpiece

215‧‧‧第二工件 215‧‧‧second workpiece

217‧‧‧貼合膠 217‧‧‧Finishing glue

Claims (16)

一種貼合治具,包含:一座體,其中央具有一開口及具有環繞該開口的複數個側壁;一承載台,其懸設在該座體的開口中,該承載台用以承載一第一工件,承載時該第一工件的周緣會超出該承載台的周緣且與環繞該開口的側壁間隔一定距離;以及至少一限位部,設在該座體上用以限制一從外部進入該開口的第二工件的位置,使得該第二工件可以準確地與承載在該承載台上的該第一工件貼合。 A fitting fixture comprising: a body having an opening in the center and a plurality of side walls surrounding the opening; a carrying platform suspended in the opening of the seat, the carrying platform for carrying a first a workpiece, the peripheral edge of the first workpiece may exceed a circumference of the carrier and be spaced apart from a sidewall surrounding the opening; and at least one limiting portion is disposed on the base for restricting an external access to the opening The position of the second workpiece is such that the second workpiece can be accurately engaged with the first workpiece carried on the stage. 如申請專利範圍第1項所述的貼合治具,其中該貼合治具更包含可移動的定位件,該定位件設置在該承載台四周且/或遠離該至少一限位部而設置,用來定位所欲承載的該第一工件在該承載台上的位置。 The affixing jig of claim 1, wherein the affixing fixture further comprises a movable positioning member, and the positioning member is disposed around the loading platform and/or away from the at least one limiting portion. And for positioning the position of the first workpiece to be carried on the loading platform. 如申請專利範圍第1項所述的貼合治具,其中該座體更包括一連接該承載台的支撐件,該承載台藉由該支撐件懸設在該座體的開口中。 The fitting jig according to claim 1, wherein the base further comprises a support member connected to the loading platform, the support platform being suspended in the opening of the base body by the support member. 如申請專利範圍第1項所述的貼合治具,其中該承載台係以真空吸附方式或黏著方式固定該第一工件。 The bonding fixture of claim 1, wherein the loading platform fixes the first workpiece by vacuum adsorption or adhesion. 如申請專利範圍第1項所述的貼合治具,其中該第一工件具有磁性,且該第一工件通過磁力吸附的方式固定於該承載台上。 The bonding jig of claim 1, wherein the first workpiece has magnetic properties, and the first workpiece is fixed to the loading platform by magnetic attraction. 如申請專利範圍第1項所述的貼合治具,其中該承載台的承載面高度高於該支撐件的高度。 The fitting jig according to claim 1, wherein the carrying surface of the carrying platform has a height higher than a height of the supporting member. 如申請專利範圍第1項所述的貼合治具,其中該些限位部的高度高於該承載台。 The bonding jig of claim 1, wherein the height of the limiting portion is higher than the carrying platform. 如申請專利範圍第1項所述的貼合治具,其中該些限位部分設在該座體的四個角落且與該第一工件間隔一定距離。 The bonding fixture of claim 1, wherein the limiting portions are disposed at four corners of the housing and spaced apart from the first workpiece by a distance. 如申請專利範圍第1項所述的貼合治具,其中該限位部為具有特定輪廓形狀的凹部,其形狀對應到所欲限位之該第二工件的周緣輪廓。 The fitting jig according to claim 1, wherein the limiting portion is a concave portion having a specific contour shape, and the shape corresponds to a peripheral contour of the second workpiece to be constrained. 如申請專利範圍第1項所述的貼合治具,其中該第二工件的面積大於該第一工件的面積。 The bonding fixture of claim 1, wherein the second workpiece has an area larger than an area of the first workpiece. 如申請專利範圍第1項所述的貼合治具,其中該第一工件是觸控面板。 The bonding fixture of claim 1, wherein the first workpiece is a touch panel. 如申請專利範圍第1項所述的貼合治具,其中該第二工件是玻璃蓋板。 The bonding fixture of claim 1, wherein the second workpiece is a glass cover. 一種貼合治具的使用方法,其步驟包含:提供一貼合治具,該貼合治具包含一具有中央開口的座體、一懸設在該座體中央開口的承載台以及至少一設在該座體上的限位部,其中該限位部用以限制工件從外部進入該開口的位置;將一第一工件設置在該承載台上,使得該第一工件的周緣超出該承載台的周緣且與環繞該開口的側壁間隔一定距離;以及使一第二工件經過該限位部的限位,使得該第二工件可以準確地與承載在該承載台上的該第一工件貼合。 A method for using a fitting fixture, the method comprising: providing a fitting fixture, the fitting fixture comprising a seat body having a central opening, a carrying platform suspended from a central opening of the seat body, and at least one a limiting portion on the seat body, wherein the limiting portion is configured to limit a position at which the workpiece enters the opening from the outside; and a first workpiece is disposed on the loading platform such that a circumference of the first workpiece exceeds the loading platform a peripheral edge and spaced apart from a side wall surrounding the opening; and a second workpiece passing the limit of the limiting portion, so that the second workpiece can be accurately fitted to the first workpiece carried on the carrying platform . 如申請專利範圍第13項所述的貼合治具的使用方法,更包含使用一可移動的定位件來定位該第一工件設置在該承載台上的位置。 The method of using the fitting jig according to claim 13 further includes using a movable positioning member to position the first workpiece on the stage. 如申請專利範圍第14項所述的貼合治具的使用方法,更包含利用真空吸附方式或黏著方式將該第一工件固定在該承載台上。 The method for using the bonding fixture according to claim 14, further comprising fixing the first workpiece to the loading platform by vacuum adsorption or adhesion. 如申請專利範圍第14項所述的貼合治具的使用方法,更 包含利用磁力吸附方式將該第一工件固定在該承載台上。 For example, the method of using the bonding fixture described in claim 14 of the patent application is further The method includes magnetically adsorbing the first workpiece on the platform.
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