TW201804562A - Adsorption unit plate-like member transporting unit resin sealing apparatus transporting method for plate-like member and sealing method for resin - Google Patents

Abstract

An adsorption unit (1) comprises: a main body unit (10); an inner hollow flow passage (5) of the main body unit (10); and an adsorption unit (110) of an adsorption surface of the main body unit (10). A through-hole (45) is provided to the adsorption unit (110), and the through-hole (45) and the flow passage (5) are connected. The adsorption unit (110) is configured to follow a curve of a planar member.

Description

Adsorption unit, plate-shaped component conveying unit, resin sealing device, plate-shaped component conveying method, and resin sealing method

The present invention relates to an adsorption unit, a plate-like element conveying unit, a resin sealing device, a plate-like element conveying method, and a resin sealing method.

In the past, each electronic component was resin-sealed. However, in recent years, more wafer level packages (WLPs) have been used to perform resin sealing on a state where a plurality of electronic components are mounted on a wafer. Therefore, in the resin sealing device, the number of examples of the adsorption device that holds and transports the wafer before and after the resin sealing is increasing.

Japanese Patent Laid-Open No. 2013-42017 describes a robot in which suction holes for suctioning the outer periphery of a workpiece are formed at three positions on the front end and the bottom side, and a suction path communicating therewith.

For example, in WLP, an electronic component or the like is mounted on a wafer before resin sealing, but the wafer may be bent (deformed) due to the mounting.

In addition, after the resin is sealed, when the resin-sealed wafer is cooled and shrunk after being taken out of the mold, the wafer may be bent (deformed) due to the difference in thermal expansion coefficient (coefficient of thermal expansion) between the wafer and the sealing resin. ).

However, wafer holding described in the conventional patent document 1 It may not be possible to hold the wafer stably because it is not envisaged to hold the warped (deformed) wafer.

The embodiment disclosed herein is an adsorption unit including: a main body portion; a hollow flow path inside the main body portion; and an adsorption portion on an adsorption surface side of the main body portion; a through hole is provided in the adsorption portion; the through hole and the flow The road system is connected; the suction unit is configured to track the bending of the plate-shaped element.

The embodiment disclosed herein is an adsorption unit including: a main body portion; a hollow flow path inside the main body portion; and an adsorption portion on an adsorption surface side of the main body portion; a through hole is provided in the adsorption portion; the through hole and the flow The road system is connected; the adsorption unit includes an adsorption pad; the adsorption pad system includes: a pad center portion, which is provided with a pad opening portion; a pad outer peripheral portion extending from the pad center portion; The position of the center portion of the pad on the closer side extends in a direction different from the outer peripheral portion of the pad; the notch portion is provided on the inner support portion of the pad; the gas is discharged through the flow path and the through hole; and further, the plate-shaped element and the notch portion Exhaust gas between them; the adsorption unit adsorbs the plate-like element; and is configured to elastically deform the adsorption pad by causing the adsorption unit to adsorb the plate-like element.

The embodiment disclosed herein is a plate-shaped component carrying unit, which includes: the above-mentioned adsorption unit; and a moving unit for moving the adsorption unit.

The embodiment disclosed here is a resin sealing device including the above-mentioned plate-shaped component conveying unit and a resin sealing unit.

The embodiment disclosed herein is a method for transporting a plate-shaped element, which includes: a positioning step, in which the adsorption portion of the adsorption unit is located on the plate-shaped element; and an adsorption step, which is performed by exhausting gas through a through-hole and a flow path, so that Suck The attachment part adsorbs the plate-like element; and the moving step is to move the plate-like element adsorbed by the adsorption part.

The embodiment disclosed herein is a resin sealing method, which includes a conveying step of conveying a plate-shaped component using the above-mentioned plate-shaped component conveying method; and a step of performing resin sealing.

According to the embodiment disclosed herein, a curved (deformed) plate-shaped element can be stably held.

The above and other objects, features, aspects, and advantages of the present invention will be understood from the following detailed description of the present invention understood in association with the attached drawings.

1‧‧‧Adsorption unit

2‧‧‧ Adsorption surface side plate

2a‧‧‧outer surface

3‧‧‧ Adsorption Pad

4‧‧‧ adapter

5‧‧‧flow

6‧‧‧sealing material

6a‧‧‧O ring groove

7‧‧‧ back side panel

8‧‧‧ wafer

10‧‧‧Body

11‧‧‧ Release film

12‧‧‧ frame

14‧‧‧Resin supply mechanism

15‧‧‧ Linear Feeder

21‧‧‧ recess

21a‧‧‧ Underside

30‧‧‧ pad center

31‧‧‧ pad periphery

31a‧‧‧far end

32‧‧‧ pad inner support

33‧‧‧ gap

35‧‧‧ pad opening

40‧‧‧ adapter body

41‧‧‧ adapter feet

41a‧‧‧ protrusion

42‧‧‧ flange

45‧‧‧through hole

81‧‧‧ sealing resin (resin molding)

110‧‧‧ Adsorption Department

310a‧‧‧distal end protrusion

310b‧‧‧Distant recess

510‧‧‧ Release film cutting unit

511‧‧‧ film mounting base mounting mechanism

512‧‧‧ roll release film

513‧‧‧ film holder

520‧‧‧resin distribution unit

521‧‧‧Resin Loader

522‧‧‧ post-processing agency

523‧‧‧ film fixed seat moving mechanism

530‧‧‧resin sealed unit

531‧‧‧mould

532‧‧‧Die cavity

533‧‧‧Elastic member

534‧‧‧ bottom plate

540‧‧‧handling unit

541‧‧‧Wafer Loader

542‧‧‧Wafer Containment after Forming

543‧‧‧Wafer Containment Section Before Forming

544‧‧‧mobile unit

Fig. 1 is a plan view of a mode of an adsorption unit according to an embodiment.

FIG. 2 is an enlarged plan view of one of the bifurcated front end portions of the adsorption unit shown in FIG. 1. FIG.

Fig. 3 is a sectional view taken along the line III-III of Fig. 2;

Fig. 4 is a sectional view taken along the line IV-IV of Fig. 2.

Fig. 5 is an enlarged sectional view of a pattern of a distal end of a peripheral portion of a pad.

FIG. 6 is a cross-sectional view schematically showing a state where the adsorption unit of the embodiment adsorbs a wafer as an example of a curved plate-shaped element.

FIG. 7 is a cross-sectional view in a pattern of an adsorption unit of an embodiment before wafer adsorption.

FIG. 8 is a cross-sectional view of a mode of a suction unit according to an embodiment when a wafer is suctioned.

Fig. 9 (a) is a plan view on the pattern of the outer surface of the side surface of the suction surface, and Fig. 9 (b) is a plan view on the pattern of the inner surface of the side of the suction surface opposite to the outer surface.

Fig. 10 (a) is a plan view on the pattern of the inner surface of the back side plate, and Fig. 10 (b) is a plan view on the pattern of the outer surface of the back side plate on the opposite side to the inner surface.

Fig. 11 (a) is a plan view of the adapter in a mode, and Fig. 11 (b) is a sectional view along the XIB-XIB mode in Fig. 11 (a).

FIG. 12 is a schematic cross-sectional view illustrating a part of the steps of an example of the method of assembling the adsorption unit of the embodiment.

Fig. 13 is a schematic configuration diagram of a resin sealing device according to an embodiment using an adsorption unit according to the embodiment.

Fig. 14 (a) is a perspective view of a mode when the pre-formed wafer storage section is viewed from the side, and Fig. 14 (b) is a front view of the mode when the pre-formed wafer storage section is viewed from the front.

Fig. 15 is a plan view schematically illustrating an example of a resin sealing method according to the embodiment.

FIG. 16 is a schematic plan view illustrating an example of the resin sealing method of the embodiment.

Fig. 17 is a plan view schematically illustrating an example of a resin sealing method according to the embodiment.

Fig. 18 is a plan view schematically showing an example of a resin sealing method according to the embodiment.

FIG. 19 is a diagram illustrating an example of a resin sealing method of an embodiment Floor plan.

Fig. 20 is a plan view schematically illustrating an example of a resin sealing method according to the embodiment.

Fig. 21 is a plan view schematically showing an example of a resin sealing method according to the embodiment.

Fig. 22 is a plan view schematically illustrating an example of a resin sealing method according to the embodiment.

Fig. 23 is a plan view schematically illustrating an example of a resin sealing method according to the embodiment.

Fig. 24 is a plan view schematically illustrating an example of a resin sealing method according to the embodiment.

Fig. 25 is a plan view schematically showing an example of a resin sealing method according to the embodiment.

Fig. 26 is a plan view schematically showing an example of a resin sealing method according to the embodiment.

Fig. 27 is a plan view schematically showing an example of a resin sealing method according to the embodiment.

Fig. 28 is a schematic plan view of a modification of the adsorption unit of the embodiment.

Fig. 29 is a schematic configuration diagram of a modification of the resin sealing device of the embodiment.

Hereinafter, embodiments will be described. In addition, in the drawings used in the description of the embodiments, the same symbols are used to indicate the same or corresponding parts.

Fig. 1 is a plan view showing a mode of an adsorption unit according to an embodiment of an example of the adsorption unit of the present invention. The adsorption unit 1 shown in FIG. 1 includes a bifurcated body portion 10, an adsorption portion 110, which is an adsorption surface side plate 2 provided on the adsorption surface side constituting the body portion 10, and a hollow flow path 5, which is It is provided inside the main body part 10. The adsorption unit 110 is composed of an adsorption pad 3 and an adapter 4 supporting the adsorption pad 3. The shape of the body portion 10 is not particularly limited to a branch shape. The shape of the body portion 10 may be, for example, a rod shape, a C shape, a circle, or a rectangle.

FIG. 2 is an enlarged plan view showing a pattern of one of the branched front ends of the adsorption unit 1 shown in FIG. 1. Fig. 3 is a cross-sectional view taken along the line III-III in Fig. 2 and Fig. 4 is a cross-sectional view taken along the line IV-IV in Fig. 2.

As shown in FIGS. 2 to 4, the through-hole 45 is provided at the center of the suction section 110. The suction pad 3 is arranged so as to surround the periphery of the through hole 45. The suction pad 3 includes: a pad center portion 30 provided with a pad opening portion 35; a pad outer peripheral portion 31 extended in an oblique direction (expansion, extension, extension, elongation) from a distal end of the pad center portion 30; and a pad inner portion The support portion 32 extends in a direction different from the pad outer peripheral portion 31 from a position closer to the side of the pad center portion 30 than the pad outer peripheral portion 31. In addition, the "distal end" means the end on the side of the through-hole 45 away from the center of the adsorption section 110 and its peripheral portion, and the "proximal end" means the end on the side of the through-hole 45 near the center of the adsorption section 110 and Its peripheral part. The “distal side” means the side of the through-hole 45 that is far from the center of the suction section 110, and the “proximal side” means the side of the through-hole 45 that is close to the center of the suction section 110. The direction in which the pad outer peripheral portion 31 extends from the distal end of the pad center portion 30 is not particularly limited to an oblique direction. E.g, After extending in a direction parallel to the outer surface 2a of the suction surface side plate 2, the outer surface 2a may be extended in a vertical direction.

As shown in FIGS. 2 to 4, the pad outer peripheral portion 31 has a distal end 31 a. In the present embodiment, the distal end 31 a means a portion on the far side of the pad outer peripheral portion 31 after the direction of extension of the pad outer peripheral portion 31 of the pad central portion 30 is changed. At least a part of the surface of the distal end 31a comes into contact with the plate-shaped element when the plate-shaped element is adsorbed. The suction unit 1 according to the embodiment includes at least the pad outer peripheral portion 31 and the distal end 31a so as to track the bending of the plate-like element so that the plate-like element can be stably held by the suction.

The plate-shaped element may be, for example, a wafer before resin sealing or a substrate before resin sealing, or a wafer after resin sealing or a substrate after resin sealing. Electronic components (chips) and the like may be mounted on the plate-shaped components, or may not be mounted. The shape of the plate-like element may be circular or rectangular in a plan view, for example. As long as the plate-like element is capable of being adsorbed by the adsorption unit 1, any shape and form may be used. In addition, the plate-like element (a lens, a micro-lens array, an optical module, a light guide plate, or a connector can be manufactured as a single piece) may be a resin-molded article or an automobile element.

FIG. 5 is an enlarged sectional view showing a pattern of the distal end 31 a of the pad outer peripheral portion 31. As shown in FIG. 5, the distal end 31 a of the pad outer peripheral portion 31 includes: two distal end convex portions 310 a protruding on the distal side of the pad outer peripheral portion 31; and a distal end concave portion 310 b attached to two The distal end convex portions 310a are recessed from the distal end 31a toward the proximal side. By adopting such a configuration, the flexibility of the distal end 31a of the pad outer peripheral portion 31 is improved, and the distal end 31a of the pad outer peripheral portion 31 can more easily track the curved plate-like element, and can hold the curved plate-like element more stably.

As shown in FIGS. 3 and 4, the recessed portion 21 is provided on the proximal end of the outer surface 2 a of the suction surface side plate 2 of the main body portion 10. In this embodiment, the recessed portion 21 can be formed into a circular groove shape. Before the plate-shaped component is attracted, the distal end 31a of the pad outer peripheral portion 31 is located away from the annular groove-shaped recess 21, and when the plate-shaped component is adsorbed, the far end 31a of the pad outer peripheral portion 31 is connected to the concave portion. The bottom surface 21a of 21 is in contact. The pad inner support portion 32 can be set higher than the outer surface 2 a of the adapter 4 and the suction surface side plate 2. With such a configuration, when the plate-shaped element is adsorbed, the plate-shaped element does not come into contact with the outer surface 2a or the adapter 4 of the side surface 2 of the adsorption surface, and is in contact with the distal end 31a or the pad of the outer peripheral portion 31 of the pad. The inner support portion 32 is in contact with both the distal end 31 a of the pad outer peripheral portion 31 and the pad inner support portion 32. Therefore, when the plate-shaped element is adsorbed, damage to the plate-shaped element caused by the elastic deformation of the adsorption pad 3 and the contact of the plate-shaped element with the outer surface 2a of the side surface 2 of the adsorption surface or the adapter 4 can be suppressed ( In the case of a plate, since the plate-shaped element is supported by the distal end 31a of the pad outer peripheral portion 31 or the pad inner support portion 32, or by both the distal end 31a of the pad outer peripheral portion 31 and the pad inner support portion 32, it is possible to suppress the Damage to the plate-like element caused by the contact between the outer surface 2a of the suction side plate 2 or the adapter 4). In addition, when the plate-shaped element is adsorbed, the distal end 31 a of the pad outer peripheral portion 31 of the plate-shaped element may be in contact with the bottom surface 21 a of the recessed portion 21. Thereby, the thickness of the entire adsorption unit 1 in a state where the plate-shaped element is adsorbed can be reduced by the amount of only the depth of the recessed portion 21 as compared with a case where the recessed portion 21 is not provided. In addition, when the plate-shaped element is adsorbed, the outer periphery of the pad when the distal end 31a of the pad outer peripheral portion 31 is in contact with the bottom surface 21a of the recessed portion 21 (when the recessed portion 21 is not provided is the outer surface 2a of the adsorption surface side plate 2). The height of the distal end 31a of the portion 31 (the distance between the distal end 31a and the outer surface 2a of the adsorption surface side plate 2) becomes equal It is preferable to set the height of the pad inner support portion 32 (the distance between the pad inner support portion 32 and the outer surface 2 a of the suction surface side plate 2). Furthermore, when the plate-shaped component is adsorbed, if the height of the distal end 31a of the pad outer peripheral portion 31 and the height of the pad inner support portion 32 are adjusted so that the plate-shaped component and the outer surface 2a of the side surface 2 of the suction surface or the adapter 4 do not In a state of being in contact with a small gap therebetween, the entire thickness of the adsorption unit 1 in a state where the plate-shaped element is adsorbed can be reduced. The suction surface of the adapter 4 is set to be the same surface as the outer surface 2 a of the suction surface side plate 2, or the suction surface of the adapter 4 is preferably lower than the outer surface 2 a of the suction surface side plate 2. Thereby, because the adapter 4 does not protrude from the outer surface 2a of the suction surface side plate 2a, the height of the distal end 31a of the outer peripheral portion 31 of the pad at the time of the adsorption of the plate-shaped element and the The height is set lower for that amount. With this, for example, even in the case where the wafer receiving section is a narrow-pitch groove (chip cassette) prescribed by the SEMI standard, the wafer 8 can be inserted into and out of the groove, so that the wafer 8 and The narrow space between the circles 8 can also be easily inserted into the adsorption unit 1.

As shown in FIG. 2, in this embodiment, three pad inner support portions 32 are provided, and notch portions 33 are provided between adjacent pad inner support portions 32. The notch portion 33 is provided on the pad inner support portion 32 so as to communicate with the air (air) between the plate-shaped element, the space surrounded by the distal end 31a of the pad outer peripheral portion 31, and the through hole 45 when the plate-shaped element is adsorbed. Between the sections. Therefore, the height of the notch portion 33 is set to be lower than the height of the pad inner support portion 32.

As shown in FIGS. 2 and 4, the through-hole 45 communicates with the flow path 5 so that the gas can move freely. The main body portion 10 is constructed by superimposing and fixing these members on the suction surface side plate 2 on the suction surface side and the rear surface side plate 7 on the back side opposite to the suction surface side system. The flow path 5 is provided on the back of the main body portion 10 A recessed portion of a part of the side plate 7 is composed of a space surrounded by the suction surface side plate 2 or the adapter 4 arranged on the suction surface side of the rear side plate 7.

As shown in FIGS. 3 and 4, the adapter 4 includes: an adapter body portion 40 provided with a through hole 45; and a flange 42, which is an end from one of the adapter body portions 40 (in this embodiment) The upper end of the morphology system) extends in a direction parallel to the surface on the suction surface side of the main body portion 10 (the outer surface 2a of the suction surface side plate 2 in this embodiment); and the adapter leg portion 41 is from the adapter body portion. The other end (lower end) of 40 extends in a direction parallel to the surface on the suction surface side of the main body portion 10. The adapter leg portion 41 includes a protruding portion 41 a that extends from the distal end of the adapter leg portion 41 in the direction of the flange 42 (above the embodiment).

The adapter 4 is arranged on the back side plate 7 so that the flange 42 faces the suction side plate 2 side. The suction pad 3 is attached to the adapter 4 by fitting the adapter body 40 into the pad opening 35 of the suction pad 3. The suction pad 3 is attached to the adapter 4 such that the distal end 31 a of the pad outer peripheral portion 31 is located away from the outer surface 2 a of the suction surface side plate 2.

As shown in FIGS. 3 and 4, in order to suppress air leakage from the flow path 5, a ring-shaped sealing material 6 is arranged on the periphery of the ring-shaped adapter leg 41 of the adapter 4. The sealing material 6 is sealed between the protruding portion 41 a at the distal end of the adapter leg portion 41 of the adapter 4 and the suction surface side plate 2. As shown in FIGS. 3 and 4, the protruding portion 41 a of the distal end of the adapter leg portion 41 is fitted (press-fitted) into the sealing material 6. Thereby, it can be reliably sealed.

FIG. 6 is a cross-sectional view schematically showing a state in which the adsorption unit 1 of the embodiment adsorbs a wafer 8 as an example of a curved plate-shaped element. As shown in FIG. 6, the adsorption unit 1 of the embodiment is configured as a pad outer periphery. Since the distal end 31 a of the portion 31 can track the bending of the wafer 8, the bent wafer 8 can be stably held. In addition, as shown in FIG. 6, when the wafer 8 is bent downward into a convex shape, from the viewpoint of more firmly adsorbing the bent wafer 8 by the adsorption pad 3 (making the adsorption pad 3 easier to track the curved wafer 8 8), the suction pad 3 can be arranged close to the center of the wafer 8. Also, in contrast to FIG. 6, when the wafer 8 is bent upward into a convex shape, from the viewpoint of more strongly adsorbing the bent wafer 8 by the suction pad 3 (making the suction pad 3 easier to track the wafer 8 that is bent) (Viewpoint) The suction pad 3 may be disposed away from the center of the wafer 8. The configuration can also be changed by replacing the suction side plate 2 or the like, or a plurality of parts including the suction part not using the suction unit 1 can be set in advance, and the use part can be selected, and the through hole 45 (see Fig. 6 shows, for example, the amount of changing the arrangement of the adsorption pad 3 by a length of only W).

Hereinafter, referring to the cross-sectional views in the mode of FIGS. 7 and 8, an example of a mechanism for the adsorption unit 1 of the embodiment to adsorb a curved plate-shaped element. FIG. 7 is a cross-sectional view of a model of the adsorption unit 1 before the adsorption of the wafer 8 as an example of a plate-like element. FIG. 8 is a diagram illustrating the implementation of the adsorption of the wafer 8 as an example of a plate-like element. A sectional view of the adsorption unit 1 in a mode. In addition, for convenience of explanation, the adapter 4 and the sealing material 6 are not shown in FIGS. 7 and 8.

First, as shown in FIG. 7, the adsorption pad 3 of the adsorption unit 1 of the embodiment is placed on the wafer 8. Here, the opposite side of the wafer 8 from the adsorption unit 1 is sealed with a hardened sealing resin (resin molded body) 81, and the wafer 8 is bent into a convex shape on the adsorption unit 1 side.

Next, as shown in FIG. The air 9 in the space on the surrounding wafer 8 is exhausted to the outside through the flow path 5. At this time, the air between the distal end 31a of the pad outer peripheral portion 31 and the pad inner support portion 32 moves to the space inside the pad inner support portion 32 through the notch portion 33, and then passes through the through hole 45 and the flow path 5 And discharged to the outside. As a result, the wafer 8 is moved to the suction unit 1 side, and the suction pad 3 is elastically deformed by the approached wafer 8. The suction pad 3 tracks (imitates) the shape of the wafer 8 and the wafer 8 is It is in contact with the distal end 31a of the pad outer peripheral portion 31 or the pad inner support portion 32 (or both of the far end 31a of the pad outer peripheral portion 31 and the pad inner support portion 32) and is held by the adsorption pad 3. In the adsorption unit 1 according to the embodiment, at least the pad outer peripheral portion 31 and the distal end 31 a are configured to track the bending of the wafer 8 by the formation of the distal end recessed portion 310 b or the like. Therefore, the adsorption unit 1 of the embodiment can stably adsorb and hold the curved wafer 8. In addition, by providing the notch portion 33 between the pad inner support portions 32, the adsorption diameter D2 (adsorption area) larger than the adsorption diameter D1 (adsorption area) when the adsorption pad 3 does not have the notch portion 33 can be held Wafer 8. Thereby, since the adsorption force of the adsorption wafer 8 can be suppressed from being reduced, high-speed conveyance of the wafer 8 or the flipping operation of the front and back of the wafer 8 can be performed. In addition, the adsorption unit 1 is configured such that, when the wafer 8 is adsorbed, only a portion mainly in contact with the wafer 8 protrudes to the outside of the adsorption surface side plate 2. The other parts of the adsorption pad 3 are housed in the adsorption unit 1. That is, the structure of the adsorption unit 1 can be made thin.

The wafer 8 that is adsorbed and held by the adsorption unit 1 can be transported to another location by a plate-shaped component handling device including a moving unit (not shown) for moving the adsorption unit 1.

Hereinafter, an example of an assembling method of the adsorption unit 1 according to the embodiment will be described with reference to FIGS. 9 to 12. Fig. 9 (a) shows the suction surface side plate 2 FIG. 9 (b) is a plan view of the outer surface pattern, and is a plan view of the inner surface of the suction surface side plate 2 opposite to the outer surface. Fig. 10 (a) is a plan view showing the pattern of the inner surface of the back side plate 7 and Fig. 10 (b) is a plan view showing the pattern of the outer surface of the back side plate 7 on the opposite side to the inner surface. Fig. 11 (a) shows a plan view of the adapter 4 in a mode, and Fig. 11 (b) shows a cross-sectional view in a mode along the XIB-XIB of Fig. 11 (a). In addition, two plates of the suction side plate 2 and the back side plate 7 may be fixed by bolts, or may be fixed by an adhesive material.

First, as shown in the sectional view of the pattern in FIG. 12, the adapter 4 made of, for example, a metal shown in FIG. 11 is set in the back side plate 7 made of, for example, a metal shown in FIG. 10 (a). On the surface. Next, a sealing material 6 made of, for example, rubber is provided on the convex portion 41 a of the distal end of the adapter leg portion 41 of the adapter 4. Then, the suction surface side plate 2 is provided on the back side plate 7 such that the inner surface of the metal suction surface side plate 2 shown in FIG. 9 (b) faces the adapter 4 side, for example. Next, the suction side plate 2 and the back side plate 7 are fixed. Then, as shown in FIG. 3 and FIG. 4, for example, the pad opening portion 35 of the suction pad 3 made of rubber is fitted into the adapter main body portion 40 of the adapter 4 to attach the suction pad 3 to the adapter. 4. As described above, the assembly of the adsorption unit 1 according to the embodiment is completed.

In addition, as shown in FIG. 9 and FIG. 10, the O-ring groove 6a is provided on the inner surfaces of the suction surface side plate 2 and the back side plate 7, respectively, and the O ring is fixed to the suction surface side plate in a state where the O ring is provided in the O ring groove 6a. 2 and the back side plate 7 can be sealed more reliably.

In the adsorption unit 1 of the embodiment manufactured as described above, the adsorption pad 3 can be easily replaced without disassembling the adsorption unit 1.

Moreover, as a material of the adsorption surface side plate 2 and the back surface side plate 7, for example, iron, steel, ceramics, or the like can be used.

FIG. 13 is a schematic configuration diagram of a resin sealing device according to an embodiment using the adsorption unit 1 according to the embodiment. As shown in FIG. 13, the resin sealing device of the embodiment includes a conveying unit 540, a resin sealing unit 530, a resin spreading unit 520, and a release film cutting unit 510. The adsorption unit 1 according to the embodiment is arranged on the transfer unit 540.

The transfer unit 540 includes a wafer loader 541, a post-forming wafer storage portion 542, a pre-forming wafer storage portion 543, and a moving unit 544. The wafer loader 541 holds the wafer 8 and is movable between a transfer unit 540, a resin sealing unit 530, a resin spreading unit 520, and a release film cutting unit 510. The formed wafer accommodating portion 542 can accommodate the resin-sealed wafer 8. The pre-mold wafer storage portion 543 can store the wafer 8 before the resin sealing. The moving unit 544 can move the adsorption unit 1.

The resin sealing unit 530 includes an upper mold (not shown) and a lower mold 531 including a lower mold cavity 532. The release film 11 can be disposed on the lower mold cavity 532. The resin sealing unit 530 can perform resin sealing of the wafer 8 on which electronic components and the like are mounted.

The resin dispersing unit 520 includes a resin loader 521, a post-processing mechanism 522, a film holder moving mechanism 523, a linear feeder 15, a resin supply mechanism 14, and a frame 12. The resin dispersing unit 520 can absorb and fix the release film 11 to the lower end surface of the frame 12 made of, for example, a circular frame using a resin loader 521, and then the particles are fed from the resin supply mechanism 14 through the linear feeder 15 The resin is spread on the release film 11. The frame 14 is not particularly limited to a circular shape. The frame may be, for example, a rectangular frame.

The release film cutting unit 510 includes a roll-shaped release film 512, a film fixing base mounting mechanism 511, and a film holder 513. In the release film cutting unit 510, the long release film 11 is drawn from the roll-shaped release film 512, and a part of the release film 11 is set on a film fixing base (not shown) placed on the film fixing base mounting mechanism 511. (Shown), and cut it into a circle, thereby obtaining a circular release film 11. The film holder 513 can fix the front end of the release film withdrawn from the roll-shaped release film 512 and can withdraw the release film from the roll-shaped release film 512.

An example of a resin sealing method according to an embodiment using the resin sealing device according to the embodiment will be described below with reference to FIGS. 14 to 27. First, as shown in FIGS. 14 (a) and 14 (b), the suction unit 1 is inserted into the lower side of the wafer 8 on which the electronic component 13 accommodated in the pre-mold wafer accommodation portion 543 is mounted, and the wafer After the circle 8 is adsorbed on the adsorption unit 1, the adsorption unit 1 is taken out from the pre-mold wafer accommodation portion 543. Here, the wafer 8 is taken out from the wafer housing portion 543 before the molding with the mounting side of the electronic component 13 as the upper side. In addition, Fig. 14 (a) is a perspective view of a mode when the pre-mold wafer accommodation portion 543 is viewed from the side, and Fig. 14 (b) is a front view of the mode when the pre-mold wafer accommodation portion 543 is viewed from the front. Illustration.

Next, as shown in the side view on the pattern in FIG. 15, the wafer 8 adsorbed by the adsorption unit 1 is reversed, and the mounting side of the electronic component 13 of the wafer 8 is taken as the lower side. Then, the suction unit 1 is moved by the moving unit 544. As shown in the side view on the pattern in FIG. It is set on the wafer loader 541.

Next, as shown in the side view on the pattern in FIG. The wafer loader 541 on which the wafer 8 is placed moves between the upper mold 551 and the lower mold 531 of the resin sealing unit 530. Then, the wafer 8 is set in the upper mold 551 with the mounting side of the electronic component 13 as the lower side. The lower mold 531 includes a side member 531a, a bottom member 531b, an elastic member 533, and a lower mold base plate 534, which constitute a lower mold cavity 532.

Next, as shown in the side view on the pattern in FIG. 18, the release film 11 containing the particulate resin 81 a is transported into the frame 12 between the upper mold 551 and the lower mold 531 on which the wafer 8 is set. The release film 11 is conveyed by the resin loader 521. In this embodiment, the particulate resin 81a is used, but instead of the particulate resin 81a, a powdery resin or a liquid (fluid) resin may be used.

Then, as shown in the side view on the mode in FIG. 19, the mold release film 11 on which the granular resin 81 a is set is set on the lower mold cavity 532 of the lower mold 531. Next, as shown in the side view on the pattern in FIG. 20, the air in the lower mold cavity 532 is exhausted from between the side member 531a and the bottom member 531b, so that the inside of the mold release film 11 and the lower mold cavity 532 are discharged. Face tightly. Thereby, the granular resin 81a is supplied into the lower mold cavity 532.

Then, as shown in the side view on the pattern in FIG. 21, the granular resin 81a in the cavity 532 of the lower mold is heated by the lower mold 531 heated in the heating section (not shown), thereby melting and melting as a melt. The resin 81b raises the lower mold 531 again. At this time (before the lower mold 531 is raised, and the upper mold 551 and the lower mold 531 are in contact with each other through the wafer 8 and the mold release film 11), it can also be made to be interrupted by an external air blocking member (not shown) in the forming mold. Outside air, and then use a vacuum pump to exhaust the air in the mold. Next, as shown in the side view on the pattern in FIG. 22, the upper mold 551 and the lower mold 531 contact through the wafer 8 and the release film 11 to raise the lower mold 531, Thereby, the molten resin 81b is immersed in the electronic component 13 on the wafer 8, and a fixed time elapses, whereby the molten resin 81b is hardened, and the resin sealing of the electronic component 13 is performed.

Then, as shown in the side view on the pattern in FIG. 23, the lower mold 531 is moved downward, and the release film 11 is peeled from the cured sealing resin (resin molded body) 81. Next, as shown in the side view on the pattern in FIG. 24, the wafer loader 541 removes the wafer 8 sealed with the resin of the sealing resin (resin molding) 81 from the upper mold 551, and The mounting side is placed on the wafer loader 541 as a lower side. Then, the wafer loader 541 provided with the resin-sealed wafer 8 is moved from the resin sealing unit 530 to the transfer unit 540.

Next, as shown in the side view on the pattern in FIG. 25, the resin-sealed wafer 8 has the mounting side of the electronic component 13 as the lower side and is sucked by the suction unit 1. Then, as shown in the side view on the pattern in FIG. 26, the wafer 8 sucked by the suction unit 1 is inverted, the mounting side of the electronic component 13 is set as the upper side, and the suction unit 1 is moved by the moving unit 544. Next, as shown in the side view in the mode of FIG. 27 (a) and the front view in the mode of FIG. 27 (b), the suction unit 1 sets the wafer with the mounting side of the electronic component 13 as the upper side. 8 After accommodating the cassettes in the post-forming wafer accommodating portion 542, the adsorption is released. As described above, the resin sealing using the adsorption unit 1 of the embodiment and the subsequent wafer storage are completed.

As the resin sealing method of the above-mentioned embodiment, chip down molding is shown as an example of compression molding. With the surface on the mounting side of the electronic component 13 of the wafer 8 facing downward (that is, the wafer is facing downward), the wafer 8 is set in the upper mold 551, and the resin is supplied to the lower mold 531. Lower mold 531 is melted by the resin heater (because the supplied resin is in a liquid state due to being heated and becomes low in viscosity), the lower mold 531 is raised, the electronic component 13 is dipped in the molten resin 81b, and the mold is locked, (after a fixed time After) the resin hardens and the molding is finished.

On the other hand, in the other example where the surface of the electronic component 13 on the wafer 8 is faced down and resin-sealed compression molding is performed, the wafer is formed downward because the electronic component 13 on the wafer 8 is placed on the side The surface is facing up, so the wafer 8 is set in the lower mold 531. Therefore, the resin is supplied onto the wafer 8. For resin sealing, a thermosetting resin containing a filler (such as silica) is used. Therefore, even liquid resins have high viscosity at room temperature. Therefore, when the electronic component 13 and the like are provided, it is taken for granted that granular resin, powdered resin, or pre-formed resin, etc. Even when a liquid resin is supplied to the electronic component 13 and the like, it is in an uneven state ( The supply state of the resin between the part where the electronic component 13 is installed and the part where it is not provided becomes uneven. Also, the electronic component 13 is often arranged on the wafer 8 in a plurality. The position is uneven and the supply state becomes non-uniform.) Since the resin is supplied, there is a high possibility that the sealing resin after molding is not filled (internal gaps or insufficient sealing resin on the outside).

Therefore, the resin sealing is preferably performed by the wafer being formed downward. However, in the device before and after the resin sealing step, the wafer 8 is usually supplied to the device with the wafer facing upward, and the wafer 8 is discharged with the wafer facing upward. Therefore, in consideration of both the front and back steps, in the case of resin sealing by forming the wafer downward as in the embodiment, the front and back of the wafer 8 supplied from the previous step with the wafer facing up is flipped to set the wafer. With the wafer 8 facing downward, the wafer 8 is set in the upper mold 551 and moved forward. Row forming is performed to flip the formed wafer 8 back and front. For later steps, the wafer 8 needs to be discharged with the wafer facing up.

Fig. 28 is a plan view showing a modified example of the adsorption unit 1 according to the embodiment. The modified example of the adsorption unit 1 shown in FIG. 28 is characterized in that it has a quadrilateral body portion 10 and can adsorb rectangular plate-shaped elements. Other than that, it has the same structure as the adsorption unit 1 of the embodiment.

FIG. 29 shows a schematic configuration of a modification of the resin sealing device of the embodiment. It is characterized by having three resin sealing units according to the embodiment shown in FIG. 29, and the number of resin sealing units can be increased or decreased. Other than that, it has the same configuration as the resin sealing device of the embodiment.

As mentioned above, although embodiment and modification were demonstrated, the structure which combined each said embodiment and modification suitably is also planned from the beginning.

Although the embodiment of the present invention has been described, the embodiment disclosed this time should be considered as an example in all matters and not intended to be a limitation. The scope of the present invention is based on the scope of the patent application, and it is intended to include all changes within the meaning and scope equivalent to the scope of the patent application.

1‧‧‧Adsorption unit

2‧‧‧ Adsorption surface side plate

3‧‧‧ Adsorption Pad

4‧‧‧ adapter

5‧‧‧flow

10‧‧‧Body

110‧‧‧ Adsorption Department

Claims (19)

An adsorption unit includes: a main body portion; a hollow flow path inside the main body portion; and an adsorption portion on an adsorption surface side of the main body portion; a through hole is provided in the adsorption portion; the through hole is in communication with the flow path system The adsorption unit is configured to track the bending of the plate-like element. For example, the adsorption unit of the first patent application range, wherein the adsorption unit includes an adsorption pad; the adsorption pad system includes: a pad central portion, which is provided with an opening portion of the pad; and an outer peripheral portion of the pad extending from the central portion of the pad. For example, the adsorption unit of the patent application No. 2 is configured such that at least a part of the surface of the distal end of the outer peripheral portion of the pad is in contact with the plate-like element when the plate-like element is being suctioned, and can track the bending of the plate-like element . For example, in the adsorption unit of claim 3, the distal end of the outer peripheral portion of the pad includes a distal end recess that is recessed from the distal end to the proximal side. For example, the adsorption unit of the patent application No. 3, wherein the concave portion is provided on the adsorption surface side of the body portion; before the adsorption of the plate-shaped element, the distal end of the outer peripheral portion of the pad is located away from the concave portion. When the plate-shaped element is adsorbed, the distal end of the outer peripheral portion of the pad is located in contact with the concave portion. For example, the adsorption unit of the patent application No. 5 wherein the recess is a ring-shaped groove. For example, the adsorption unit of the second patent application range, wherein the adsorption pad further includes a pad inner support portion, and the pad inner support portion is located at a position closer to the pad than the pad center portion on the side closer to the pad than the outer peripheral portion of the pad. The outer peripheral portion stretches in different directions; during the adsorption of the plate-shaped element, the inner support portion of the pad supports the plate-shaped element together with the outer peripheral portion of the pad. For example, the adsorption unit of the seventh scope of the patent application, wherein the notch portion is provided on the inner support portion of the pad. For example, the adsorption unit of the second patent application range, wherein the adsorption unit includes an adapter supporting the adsorption pad; the adapter includes: an adapter body portion provided with the through hole; a flange, from One end of the through-hole of the adapter body portion extends in a direction parallel to the surface on the suction surface side of the body portion; and the adapter leg portion is from the through-hole of the adapter body portion The other end extends in a direction parallel to the surface on the side of the suction surface of the body portion; the adapter foot portion includes an extension from the distal end of the adapter foot portion in the direction of the flange. Protrusion. For example, the suction unit of the patent application No. 9 wherein the pad body is embedded in the opening of the pad through the adapter body, and the suction pad is mounted on the adapter. For example, if the adsorption unit of the first patent application scope is adapted to the bending of the plate-shaped element, the configuration of the adsorption unit can be changed. For example, the adsorption unit of the scope of patent application No. 1 can be inserted into the gap of a plurality of plate-shaped element accommodating portions accommodated in the plurality of plate-shaped elements via a predetermined gap. An adsorption unit includes: a main body portion; a hollow flow path inside the main body portion; and an adsorption portion on an adsorption surface side of the main body portion; a through hole is provided in the adsorption portion; the through hole is in communication with the flow path system The adsorption unit includes an adsorption pad; the adsorption pad system includes: a pad center portion, which is provided with a pad opening portion; a pad outer peripheral portion extending from the pad center portion; and a pad inner support portion, which extends from the outer periphery of the pad The position of the center portion of the pad closer to the portion extends in a direction different from the outer peripheral portion of the pad; the notch portion is provided on the inner support portion of the pad; the gas is discharged through the flow path and the through hole; The gas is exhausted between the plate-shaped element and the notch portion; the adsorption portion adsorbs the plate-shaped element; and the structure is configured to elastically deform the adsorption pad by causing the adsorption portion to adsorb the plate-shaped element. A plate-shaped component handling unit includes: an adsorption unit such as the first item in the scope of patent application; and a moving unit for moving the adsorption unit. A resin sealing device includes: a plate-shaped component handling unit such as the item No. 14 of the scope of patent application, and a resin sealing unit. For example, the number of resin sealing units can be increased or decreased by applying the resin sealing device of the 15th patent scope. A method for conveying a plate-shaped component includes: a positioning step of positioning the suction portion of the suction unit such as the item 1 or 13 of the patent application on the plate-shaped component; and a suction step of passing the through-hole and the flow The gas is exhausted from the path to cause the adsorption portion to adsorb the plate-shaped element; and the moving step is to move the plate-shaped element adsorbed by the adsorption portion. For example, the method for conveying a plate-shaped component according to item 17 of the scope of patent application, further comprising the step of reversing the plate-shaped component adsorbed by the adsorption unit. A resin sealing method includes: a conveying step of conveying the plate-shaped element using a plate-shaped element conveying method such as the item 17 of the scope of patent application; and a step of performing resin sealing.