JP7469937B2 - Stamp tool holding device and method for manufacturing element array - Google Patents

Description

The present invention relates to a stamp tool holding device and a method for manufacturing an element array.

When transporting extremely small parts, the use of a stamp-shaped transport tool (stamp tool) with many protrusions on its surface is being considered. An example of such a stamp-shaped transport tool is disclosed in the following Patent Document 1. Conventionally, stamp tools have been disclosed that enable the detachment of transported objects due to thermal expansion.

One example of a very small part that is expected to be transported by the stamp tool is an LED element called a mini LED or micro LED. Mini LEDs and micro LEDs are extremely small compared to conventional general LED elements, with widths of 1-8 μm, lengths of 5-10 μm, and heights of 0.5-3 μm.

As in conventional technology, LED displays are manufactured by picking up LED elements from a wafer on which a large number of such elements are arranged and transferring them to a substrate that corresponds to the display, but the wafers on which the LEDs are supplied vary widely depending on the wafer manufacturer and the application.

When transporting LED elements to a substrate, wafers of different specifications may be swapped in and out, in which case a stamp tool compatible with each wafer must be used. The stamp surface of the stamp tool is prone to attracting dirt and dust, and if dirt or dust adheres to the stamp surface, there is a risk that the elements being transported may not be picked up properly. For example, if the elements are part of a display element, pixel defects may occur.

US Publication No. 2017/0173852 A1

The present invention was made in consideration of the above-mentioned circumstances, and its purpose is to provide a stamp tool holding device capable of holding a stamp tool while keeping the stamp surface of the stamp tool clean, and a method for manufacturing an element array using the same.

In order to achieve the above object, the stamp tool holding device according to the present invention comprises:
A stamp tool holding device having an installation stage on which a stamp tool having a stamp layer having a portion to which a transport target element can be detachably attached is detachably installed,
The installation stage has an installation surface in which an accommodating recess for accommodating the stamp layer is formed, and the installation surface has a suction hole formed therein that can detachably adsorb a portion of the stamp tool located around the stamp layer.

In the stamp tool holding device according to the present invention, with the stamp layer housed inside the housing recess, negative pressure is introduced into the suction hole, causing a part of the stamp tool to be adsorbed and detached to the installation surface. As a result, the inside of the housing recess is sealed, and dirt and dust are less likely to adhere to the stamp surface of the stamp layer housed inside the housing recess, making it possible to install the stamp tool while keeping the stamp surface clean.

Preferably, the installation stage is detachably fixed to the base. The stamp tool needs to be replaced in response to customer requests, a substrate (the substrate may be a sheet; the same applies below) on which elements as the transport target elements are fabricated, etc. By preparing multiple installation stages in accordance with changes in the stamp tool, it is possible to respond to changes in the size of the stamp tool by replacing only the installation stage without replacing the base. In addition, it is preferable that the flatness of each installation stage relative to the base is ensured, and there is no need to adjust the flatness when replacing the stamp tool.

Preferably, the installation stage is formed with a gas circulation hole that communicates with the space within the storage recess and exchanges the gas within the storage recess. By exchanging the gas within the recess, dirt and dust adhering to the surface of the stamp layer contained within the storage recess can be discharged together with the gas, improving the cleanliness of the stamp layer.

A guide means is attached to the upper portion of the installation stage for guiding the stamp layer of the stamp tool along at least the first axis so that it is dropped into the interior of the storage recess. By providing the guide means on the installation stage, it becomes easier to roughly position the stamp tool along at least the first axis (which may also include the second axis). In addition, when the stamp tool is picked up by the transport head, it becomes easier to position the stamp tool relative to the transport head.

Preferably, the guiding means has a plurality of guiding members removably attached to both sides of the installation stage along the first axis, and each of the guiding members has an inclined surface that can engage with the tapered surface of the stamp tool. This configuration makes it easier to roughly position the stamp tool at least along the first axis (which may also include the second axis). It also makes it easier to position the stamp tool relative to the transport head when picking up the stamp tool with the transport head.

Preferably, at least two guide members are attached to each side of the installation stage along the first axis, and the claws of a chuck mechanism (also called a clamp mechanism/similar below) can be inserted along the gap between the two guide members. This configuration makes it possible to position the stamp tool with high precision at least along the first axis (which may also include the second axis). Furthermore, when the stamp tool is picked up by the transport head, the positioning of the stamp tool relative to the transport head (particularly along the first axis) is also more precise.

Preferably, the apparatus further includes a pair of positioning members that are arranged on both sides of the installation stage along the second axis direction and are movable to come into contact with and separate from the edge of the stamp tool installed on the upper part of the installation stage. This configuration makes it possible to perform high-precision positioning of the stamp tool along the second axis in addition to the first axis. In addition, when the stamp tool is picked up by the transport head, it becomes even easier to position the stamp tool relative to the transport head.

A method for manufacturing an element array according to a first aspect of the present invention includes the steps of:
A step of picking up the stamp tool held by any one of the stamp tool holding devices described above with a conveying head;
and simultaneously picking up and transporting a plurality of transport target elements from the substrate using a stamp tool attached to the transport head.

The manufacturing method of the element array according to the first aspect of the present invention makes it possible to easily manufacture an element array having a large number of elements in a short time and at low cost.

A method for manufacturing an element array according to a second aspect of the present invention includes the steps of:
preparing a stamp tool holding device according to any one of the above in a number equal to or greater than the number of substrates on which each of the plurality of types of elements as the transport target elements is arranged;
a step of placing stamp tools prepared for each of the plurality of types of elements in each of the stamp tool holding devices;
a step of picking up the stamp tools held by the stamp tool holding devices corresponding to the respective substrates with a transport head from the stamp tool holding devices, and simultaneously removing and transporting a plurality of the elements from the substrates corresponding to the picked-up stamp tools using the stamp tools attached to the transport head;
and returning the stamp tool from which the plurality of elements have been removed to the corresponding stamp tool holding device after the plurality of elements have been removed and transferred simultaneously.

The manufacturing method of the element array according to the second aspect of the present invention makes it possible to easily manufacture an element array in which many types of elements are arranged, in a short time and at low cost. Moreover, the stamp tools used for each substrate corresponding to each of the multiple types of elements are installed and stored in a dedicated stamp tool holding device, so it is easy to maintain high levels of cleanliness on the stamp surface of each stamp tool while effectively preventing errors in the arrangement of elements.

Preferably, the stamp tool comprises:
a stamp layer having a portion to which an element to be transported can be detachably attached;
A support plate to which the stamp layer is fixed;
The support plate is replaceably attached, and an adapter plate has a mounting surface to which the transport head can be detachably attached.

With this stamp tool, only the support plate to which the stamp layer is fixed can be replaced from the adapter plate, without replacing the entire stamp tool. This makes it easy to prepare stamp tools with different types of stamp layers at low cost. In addition, even if the size of the stamp layer or the size of the support plate is changed, it is easy to standardize the size of the adapter plate, making it easy to share the transport head or installation stage. In addition, because the stamp layer is fixed to the support plate, it is easy to ensure the flatness of the stamp surface of the stamp layer.

Preferably, the support plate is replaceably attached to the adapter plate by an adhesive layer. By using an adhesive layer, the support plate can be easily and replaceably attached to the adapter plate, and the flatness of the support plate, i.e., the flatness of the stamp surface of the stamp layer, can be easily ensured.

Preferably, the elements to be transported are a plurality of elements formed on the surface of a substrate, the stamp layer has a plurality of protrusions formed thereon corresponding to the elements, and the elements are detachably attached to each of the protrusions. This configuration makes it easy to simultaneously remove a plurality of elements as the elements to be transported from the substrate and transfer or implement them.

Preferably, the support plate has a glass plate or a ceramic plate having a flat surface. This configuration makes it easier to ensure the flatness of the support plate, i.e., the flatness of the stamp surface of the stamp layer. In particular, by configuring the support plate from a glass plate, it becomes easier to form an adhesive surface around the stamp layer.

Preferably, a tapered surface is formed on the side of the adapter plate, the outer diameter of which decreases toward the support plate. The claws of the clamping mechanism can be detachably engaged with the tapered surface formed on the side of the adapter plate. This also increases the force with which the stamp tool is attached to the transport head by the clamping mechanism. Furthermore, it becomes easier to position the stamp tool along the inclined surface of the guide member installed on the top of the installation stage for the stamp tool.

Preferably, the maximum width of the adapter plate is greater than the width of the support plate. This configuration makes it easier for the inclined surface of the guide member and the tapered surface of the stamp tool to engage.

Preferably, the surface of the support plate facing the adapter plate has an insertable surface that faces the tapered surface of the adapter plate. The presence of an insertable surface on the support plate of the stamp tool makes it easier for the claws of the clamp mechanism to detachably engage with the tapered surface on the side of the adapter plate.

Preferably, an adhesive surface is formed around the stamp layer on the surface of the support plate facing the stamp layer. The presence of an adhesive surface on the support plate of the stamp tool makes it possible to adsorb the support plate to the installation surface of the installation stage for the stamp tool, making it easier to seal and hold the stamp layer inside the accommodating recess. The stamp layer inside the accommodating recess is kept clean.

A shim plate may be interposed between the stamp layer and the adapter plate to adjust the parallelism (flatness) of the support plate. This configuration improves the flatness of the support plate and also improves the flatness of the stamp surface.

The method for manufacturing an element array according to a third aspect of the present invention includes a step of simultaneously removing and transporting a plurality of elements to be transported from a substrate using any of the stamp tools described above. With the method for manufacturing an element array of the present invention, an element array having a large number of elements can be manufactured easily, quickly, and at low cost.

FIG. 1A is a schematic front view and an enlarged view of a main part of a stamp tool according to an embodiment of the present invention. FIG. 1B is a schematic front view of a stamp tool according to another embodiment of the present invention. FIG. 1C is a schematic plan view of a variation of the stamp tool of FIG. 1B. FIG. 1D is a cross-sectional view of the stamp tool taken along line ID-ID shown in FIG. 1C. FIG. 1E is a cross-sectional view of the stamp tool taken along line IE-IE shown in FIG. 1C. FIG. 2A is a schematic diagram of a transport device including a transport head that detachably transports the stamp tool shown in FIG. 1A. FIG. 2B is a schematic diagram of the transport device showing a state in which the transport head shown in FIG. 2A is gripping the stamp tool. FIG. 3A is a schematic diagram of the conveying apparatus showing a state before picking up an element from a semiconductor substrate. FIG. 3B is a schematic diagram of the transfer apparatus illustrating a state in which the stamp layer of the stamp tool is being pressed against an element on a semiconductor substrate from the state shown in FIG. 3A. FIG. 3C is a schematic diagram of the transfer device showing a state after the element has been picked up from the semiconductor substrate. FIG. 4A is a partial schematic view showing details of a claw portion of a clamp mechanism used in a transport device according to another embodiment of the present invention. FIG. 4B is a partial schematic view showing details of a claw portion of a clamp mechanism used in a transport device according to another embodiment of the present invention. FIG. 5A is a schematic cross-sectional view of a device formed on a semiconductor substrate. FIG. 5B is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transfer device. FIG. 5C1 is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transfer device and then placed on a mounting substrate (sheet). FIG. 5C2 is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transport device and then placed on a first transfer substrate (sheet). FIG. 5D is a schematic cross-sectional view showing a state in which the element array arranged on the first transfer substrate (sheet) has been transferred to the second transfer substrate (sheet). FIG. 5E is a schematic cross-sectional view showing the state before the element array arranged on the second transfer substrate (sheet) is transferred to the mounting substrate (sheet). FIG. 5F is a schematic cross-sectional view showing the state after the element array arranged on the second transfer substrate (sheet) has been transferred to the mounting substrate (sheet). FIG. 6A is a schematic perspective view of a stamp stage on which the stamp tool shown in FIG. 1A is installed. FIG. 6B is a plan view of the stamp stage shown in FIG. 6A, showing the positioning members in an open state. FIG. 6C is a plan view of the stamp stage shown in FIG. 6A, showing the positioning member in a closed state. FIG. 7 is a schematic cross-sectional view of the stamp stage taken along line VII-VII shown in FIG. 6A. FIG. 8 is a side view of the stamp stage shown in FIG. 6A as viewed from the Y-axis direction. Figure 9 is a schematic diagram showing the relationship between a stamp table on which the stamp stage shown in Figure 6A is placed, an element table on which the element formation substrate shown in Figure 5A is placed, a mounting table on which the mounting substrate shown in Figure 5C1 is placed, and a transport head. FIG. 10 is a schematic diagram showing a state in which the relative positions of the transport head and the table are changed from the state shown in FIG. FIG. 11 is a schematic diagram showing a state in which the relative positions of the transport head and the table are changed from the state shown in FIG.

The present invention will now be described with reference to the embodiments shown in the drawings.

As shown in Fig . 2A, a conveying apparatus 20 according to this embodiment includes a stamp tool 10 and a conveying head 22. As shown in Fig. 1A, the stamp tool 10 includes a stamp layer 12, a support plate 14, and an adapter plate 16.

The stamp layer 12 has a matrix of protrusions 11 that protrude downward along the Z axis at predetermined intervals in the X-axis and Y-axis directions. The X-axis width x1 of the protrusions 11 and the X-axis interval x2 between adjacent protrusions 11 are determined according to, for example, the X-axis width x3 of the element 32r for emitting red light (an example of an element to be transported) mounted on the surface of the mounting substrate 70 shown in FIG. 5F and the X-axis interval x4 between them.

Although not shown in FIG. 1A, the same applies to the width of the protrusions 11 in the Y-axis direction and the distance between adjacent protrusions 11 in the Y-axis direction. The protrusions 11 are arranged in a matrix on the lower surface of the stamp layer 12, and the number of protrusions 11 arranged is not particularly limited, but may range from one to several hundred thousand.

In this embodiment, in the drawings, the X-axis (first axis), Y-axis (second axis), and Z-axis (third axis) are approximately perpendicular to each other, the X-axis and Y-axis are parallel to the planar direction of the stamp layer 12, and the Z-axis is parallel to the protruding direction of the convex portion 11.

As shown in FIG. 1A, the protruding height z1 of the convex portion 11 of the stamp layer 12 is determined in relation to the Z-axis height z2 of the element 32r shown in FIG. 5B, and is preferably, for example, 1 to 8 times the Z-axis height z2. The Z-axis thickness z3 of the stamp layer 12 is not particularly limited, but is preferably about 0.25 times or more the protruding height z1 of the convex portion 11. The X-axis width x3 of the element 32r (and the Y-axis width is approximately the same) is, for example, 1 to 150 μm, and its height z2 is, for example, 1 to 150 μm.

The stamp layer 12 and the protrusions 11 may be made of different materials as long as they are strongly bonded, but they may also be made of the same material. By being made of the same material, the risk of the protrusions 11 peeling off from the stamp layer 12 is reduced. At least the protrusions 11 are made of an adhesive material, and can adhere with a predetermined adhesive force F2 to the element 32r arranged with a predetermined fixing force F1 on the element formation substrate 30 shown in FIG. 5B. The material and shape of the protrusions 11 are determined so that when the lower end of the protrusions 11 is pressed against the upper surface of the element 32r with a predetermined force, the adhesive force F2 of the protrusions 11 to the element 32r is greater than the fixing force F1 of the element 32r to the substrate 30.

The material of the convex portion 11 is not particularly limited, but examples include viscoelastic elastomers such as polydimethylsiloxane (PDMS), organic silicon compounds, and polyether rubber. The stamp layer 12 may be made of the same material as the convex portion 11, but it is preferable that the surface of the stamp layer 12 other than the convex portion 11 does not have adhesiveness. It is preferable that the element 32r is not picked up by adhesive force other than the convex portion 11.

As shown in FIG. 1A, the stamp layer 12 is fixed to a support plate 14. The support plate 14 is made of a material that is more rigid and has excellent flatness than the stamp layer 12, and is preferably made of a glass plate, a metal plate, a ceramic plate, or the like. The thickness of the support plate 14 is not particularly limited, but is preferably 0.5 mm or more.

The stamp layer 12 may be formed directly on the surface of the support plate 14, or may be fixed thereto by an adhesive layer. In either case, the stamp layer 12 is fixed to the surface of the support plate 14 with an adhesion force that is much stronger than the adhesive force F2 shown in FIG. 5B. In a later process, the element 32r is peeled off from the protrusion 11 and placed on, for example, the mounting substrate 70 shown in FIG. 5C1. At that time, it is important that the stamp layer 12 does not peel off from the support plate 14.

As shown in FIG. 1A, the support plate 14 is removably fixed to the adhesive surface 16b of the adapter plate 16 by an adhesive layer 15 on the surface opposite the stamp layer 12. The adhesive strength between the support plate 14 and the adapter plate 16 by the adhesive layer 15 is sufficiently higher than the adhesive strength F2 shown in FIG. 5B. However, when replacing the stamp layer 12 after repeated use, the support plate 14 can be removed from the adhesive surface 16b of the adapter plate 16. The adhesive layer 15 may be made of a double-sided adhesive tape or the like.

The widths of the support plate 14 in the X-axis direction and the Y-axis direction are preferably larger than those of the stamp layer 12, and also larger than the widths of the adhesive surface 16b of the adapter plate 16 in the X-axis direction and the Y-axis direction. On the surface of the support plate 14 on the stamp layer side, a flat adsorbable surface 14b on which the stamp layer 12 is not formed is formed around the stamp layer 12. In this embodiment, the stamp layer 12 is rectangular when viewed from the Z-axis direction, but the support plate 14 may be rectangular or circular. The adsorbable surface 14b can be detachably attached to the installation surface 84 of the installation stage 82 shown in FIG. 7.

The upper surface of the adapter plate 16 opposite the adhesive surface 16b is a flat mounting surface 16a, and at least both side surfaces in the X-axis direction of the adapter plate 16 are tapered surfaces 16c so that the area of the mounting surface 16a is larger than the area of the adhesive surface 16b. In other words, at least the side surfaces in the X-axis direction of the adapter plate 16 are formed with tapered surfaces 16c whose outer diameter decreases toward the stamp layer 12.

In this embodiment, the tapered surface 16c is formed on both side surfaces of the adapter plate 16 in the Y-axis direction, and the tapered surface 16c is formed along the entire circumference of the side surface of the adapter plate 16. In this embodiment, the adapter plate 16 has a rectangular shape when viewed from the Z-axis direction, and it is preferable that at least the maximum width of the adapter plate 16 in the X-axis direction is larger than the width of the support plate 14 in the X-axis direction. As shown in FIG. 7, the maximum width of the adapter plate 16 in the Y-axis direction may be approximately the same as the width of the support plate 14 in the Y-axis direction, or it may be larger or smaller than that.

On the surface opposite to the suction surface 14b of the support plate 14 shown in FIG. 1A, a flat insertable surface 14c facing the tapered surface 16c is formed around the adhesive surface 16b of the adapter plate 16. On the insertable surfaces 14c located on both sides in the X-axis direction, the claws 26a of the chuck mechanism 26 shown in FIG. 2B engage with the tapered surfaces 16c of the adapter plate 16. Also, the inclined surfaces 89 of the guide members 88 of the installation stage 82 shown in FIG. 6A and FIG. 8 engage with the tapered surfaces 16c of the adapter plate 16 located on both sides in the X-axis direction.

The thickness of the adapter plate 16 in the Z-axis direction shown in FIG. 1A is sufficiently larger than the thickness of the support plate 14, and is preferably 1.2 times or more, and preferably 2 to 6 times, the thickness of the support plate 14. In addition, the outer peripheral edge of the mounting surface 16a on the upper surface of the adapter plate 16 is formed with an edge 16d consisting of a chamfered portion or an R portion.

The edge portions 16d of the adapter plate 16 located on both sides in the Y-axis direction are abutted by the tip surfaces 92 of a pair of positioning members 90 shown in Figures 6A to 6C and 7, and position the stamp tool 10 placed on the installation stage 82 in the Y-axis direction. The stamp tool 10 is positioned in the X-axis direction by the inclined surfaces 89 of the guide members 88 shown in Figures 6A and 8, and the claws 26a of the clamping mechanism 26 of the transport device 20 shown in Figure 2B.

The attachment surface 16a on the upper surface of the adapter plate 16 shown in FIG. 1A is capable of adsorbing the suction surface 24 of the transport head 22 of the transport device 20 shown in FIG. 2A. The suction surface 24 of the transport head 22 is formed with a vacuum suction hole as the main attachment means, and by generating negative pressure in the vacuum suction hole, the attachment surface 16a of the adapter plate 16 of the stamp tool 10 is vacuum-adsorbed onto the suction surface 24. The vacuum adsorption force of the suction surface 24 on the attachment surface 16a of the adapter plate 16 of the stamp tool 10 is tentatively referred to as the main attachment force F3a.

In this embodiment, the chuck mechanism 26 is attached to the transport head 22 via an opening/closing mechanism 28. Claw portions 26a are formed on the inside of the chuck mechanism 26. The chuck mechanism 26 including the claw portions 26a is moved in the X-axis direction by the opening/closing mechanism 28, for example, so that the claw portions 26a open the entire lower surface of the suction surface 24 as shown in FIG. 2A, or the claw portions 26a are positioned below both sides of the suction surface 24 in the X-axis direction as shown in FIG. 2B.

Each claw 26a is formed with a tapered engagement surface 26b. The tapered surface of the engagement surface 26b is shaped to match the tapered surface 16c of the adapter plate 16 of the stamp tool 10, and is capable of engaging with the tapered surface 16c. As shown in FIGS. 2A-2B, before the mounting surface 16a of the adapter plate 16 is attracted to the suction surface 24 of the transport head 22, the claws 26a of the chuck mechanism 26 are opened by the opening/closing mechanism 28. After the mounting surface 16a of the adapter plate 16 is attracted to the suction surface 24 of the transport head 22, the chuck mechanism 26 moves in a direction in which the claws 26a are closed by the opening/closing mechanism 28, and the engagement surface 26b engages with the tapered surface 16c.

As a result, the stamp tool 10 is attached to the transport head 22 with a total attachment force F3, which is the sum of the main attachment force F3a by the vacuum suction holes formed in the transport head 22 as the main attachment means and the secondary attachment force F3b by the chuck mechanism 26 as the secondary attachment means. As the transport head 22 becomes smaller, it tends to be difficult to make the main attachment force F3 by the vacuum suction holes of the transport head 22 alone larger than the fixing force F1 shown in FIG. 5B. In this embodiment, the secondary attachment force F3b by the chuck mechanism 26 as the secondary attachment means is added to the main attachment force F3a, so that the total attachment force F3 (= F3a + F3b) is reliably larger than the fixing force F1.

Next, we will explain a method for manufacturing a display element array using a conveying device 20 having a stamp tool 10 according to this embodiment.

First, the transport device 20 shown in FIG. 2A picks up the stamp tool 10 arranged on the installation stage 82 shown in FIGS. 6A to 8. In this embodiment, it is preferable to prepare at least three stamp tools, for example for the three primary colors of light, R, G, and B, and each stamp tool is preferably installed on its respective installation stage 82. Alternatively, the installation stage 82 is replaced with respect to the base 81 for each stamp tool 10 for R, G, and B.

The base 81 of the installation stage 82 is positioned and fixed on the stamping table 100 shown in Figures 9 to 11. The stamping table 100 is positioned and fixed, for example, on the integrated table 110. In the example shown in Figures 9 to 11, only a single stamping table is shown installed on the integrated table 110.

However, on the integrated table 110, for example, three stamp tables 100 to which bases 81 for three mounting stages 82 are respectively fixed, one for each stamp tool 10 for R, G, and B, may be arranged side by side at a predetermined interval in the Y-axis direction.

In addition to the three stamp tables 100, three large stamp tables to which bases for the three installation stages are fixed, each for a stamp tool of different sizes for R, G, and B, may be arranged side by side at a predetermined interval in the Y-axis direction. These three large stamp tables of different sizes are arranged outside the three stamp tables 100 of smaller sizes in the X-axis direction.

In this embodiment, as shown in Figures 9 to 11, in addition to the stamp table 100, the element table 102 and the mounting table 104 are positioned and fixed on the integrated table 110. The element table 102 is a table on which the element formation substrate 30 shown in Figure 5A is positioned and detachably fixed.

9 to 11 show that only a single element table 102 is installed. However, on the integrated table 110, three element tables 102 may be arranged side by side at a predetermined interval in the Y-axis direction, on which three element formation substrates 30 are positioned and detachably fixed, for example for each of the elements 32r, 32g, 32b for R, G, and B. The element table 102 and the stamp table 100 are arranged apart in the X-axis direction on the integrated table 110.

The mounting table 104 is a table on which the mounting board 70 shown in FIG. 5C1 is positioned and detachably fixed. The mounting board 70 is placed on the integrated table 110, separated from the element table 102 in the Y-axis direction. In this embodiment, a single mounting board 70 is positioned and fixed to the integrated table 110. Alternatively, multiple mounting boards 70 may be positioned and fixed to the integrated table 110.

The upper surfaces of the tables 100, 102, and 104, which are positioned and fixed on the integrated table 110, are preferably substantially on the same X-Y plane, but are not necessarily on the same plane. By making the upper surfaces of the tables 100, 102, and 104 substantially on the same X-Y plane, the movement amount along the Z axis of the transport head 22 that moves relatively above the tables 100, 102, and 104 can be made substantially the same, making it easier to control the movement of the transport head 22 along the Z axis. Above the Z axis of the tables 100, 102, and 104, which are positioned and fixed on the integrated table 110, the transport head 22 of the transport device 20 can be moved in the X-axis and Y-axis directions and positioned. The integrated table 110 is configured to be relatively movable along the X-Y plane including the X-axis and Y-axis with respect to the transport head 22.

To improve positioning accuracy, it is preferable that the transport head 22 moves only in the Z-axis direction relative to each of the tables 100, 102, and 104, and each of the tables 100, 102, and 104 moves along the X-Y plane relative to the transport head 22. Alternatively, the transport head may move only in the X-axis or Y-axis and Z-axis directions, and each of the tables 100, 102, and 104 moves along the Y-axis or X-axis relative to the transport head 22. Alternatively, the transport head may move in the X-axis, Y-axis, and Z-axis directions, and each of the tables 100, 102, and 104 may be fixed and not move.

Although the integrated table 110 shown in Figures 9 to 11 is illustrated as a single member, it does not necessarily have to be composed of a single member, but may be composed of multiple members. The element table 102 and the mounting table 104 may be positioned and fixed to the same base and move in the same direction (for example, the Y-axis direction) in common. Furthermore, the integrated table 110 may be separated so that the stamp table 100 (including stamp tables of different sizes) moves, for example, in the Y-axis direction, separately from the tables 102 and 104. In that case, it is preferable that the transport head 22 is movable in the X-axis direction as well as the Z-axis direction.

In the following explanation, one installation stage 82 shown in Figures 6A to 8 will be described, but the same applies to the other installation stages. As shown in Figures 6A and 7, the block-shaped installation stage 82 is installed on a base 81 so that it can be freely attached, detached, and replaced using, for example, bolts. As shown in Figure 7, an accommodation recess 86 and an installation surface 84 are formed in the upper part of the installation stage 82 in the Z-axis direction so as to surround the accommodation recess 86. The accommodation recess 86 is formed, for example, by countersinking the center of the upper surface of the square prism-shaped stage 82. As shown in Figure 7, the stamp layer 12 of the stamp tool 10 is designed to fit completely into the accommodation recess 86.

In addition, the installation surface 84 formed around the accommodating recess 86 has suction holes 85 formed at multiple locations in the circumferential direction, allowing the suction surface 14b of the support plate 14 to be suctioned and held detachably on the installation surface 84. In addition, the accommodating recess 86 is connected to multiple gas circulation holes 83 formed in the stage 82. By suctioning the suction surface 14b of the support plate 14 to the installation surface 84, the accommodating recess 86 can be sealed except for the gas circulation holes 83. By flowing clean gas into the accommodating space 86 through the gas circulation holes 83, dust and impurities adhering to the stamp layer 12 can be discharged to the outside.

Two guide members 88 are detachably attached to the upper side of both sides of the stage 82 that are approximately perpendicular to the X-axis by bolts or the like. An inclined surface 89 is formed on the upper side of the inner surface of the guide member 88. The tapered surface 16c of the adapter plate 16 shown in FIG. 1A can contact each of the inclined surfaces 89, and the tapered surface 16c facing the X-axis direction of the adapter plate 16 slides along each inclined surface 89. Therefore, the adapter plate 16 of the stamp tool 10 is dropped onto the stage 82 while sliding on the inclined surface 89, and the stamp layer 12 is accommodated inside the accommodation recess 86 as shown in FIG. 7. In addition, the stamp tool 10 is roughly aligned in the X-axis direction with respect to the stage 82.

As shown in FIG. 6A, the four guide members 88 are attached to the stage 82 so as to be positioned inside both edges 16d in the Y-axis direction of the adapter plate 16 of the stamp tool 10. On both sides of the stage 82 in the Y-axis direction, Y-axis positioning members 90 are arranged so as to be movable in the Y-axis direction. The positioning members 90 each have a tip surface 92 that faces each other along the Y-axis and, as shown in FIG. 7, each can abut against the edge 16d in the Y-axis direction of the adapter plate 16. When the tip surfaces 92 abut against the edge 16d in the Y-axis direction of the adapter plate 16, the stamp tool 10 is positioned in the Y-axis direction relative to the stage 82.

Next, a method for picking up the stamp tool 10 from the installation stage 82 shown in Figures 6A and 7 using the transport device 20 shown in Figure 2A will be described.

First, the stamp tool 10 is positioned in the Y-axis direction on the stage 82 using the positioning member 90. Then, as shown in FIG. 9, the positional relationship between the stamp table 100 and the transport head 22 on the XY axis is changed, and the stage 82 shown in FIG. 8 moves together with the base 81 to position the stage 82 below the transport head 22 of the transport device 20 shown in FIG. 2A. Note that the transport head 22 may be moved without moving the stage 82, or both may be moved. The transport head 22 may be rotated around the Z-axis as necessary.

After positioning the stamp tool 10 on the stage 82 below the Z axis of the transport head 22, the head 22 is moved downward along the Z axis, the lower end of the transport head 22 is brought into contact with the mounting surface 16a of the adapter plate 16, and vacuum suction by the transport head 22 is initiated. Next, as shown in Figures 2A and 2B, the clamp mechanism 26 is closed, and the engagement surfaces 26b of the claws 26a are engaged with the tapered surfaces 16c located on both sides of the adapter plate 16 in the X axis direction.

Then, the pair of positioning members 90 shown in FIG. 7 are opened in the Y-axis direction, and the tip surfaces 92 are released from contact with the edge 16d of the adapter plate 16. Before and after this, the suction holes 85 of the stage 82 release the support plate 14 from suction to the stage mounting surface 84. Then, by moving the transport head 22 upward on the Z-axis, as shown in FIG. 2B, the stamp tool 10 is positioned on the lower end of the transport head 22 in the X-axis and Y-axis, and is held in a state in which the horizontality of the stamp tool 10 is maintained.

Next, as shown in FIG. 2B, with the stamp tool 10 attached to the transport head 22, the transport device 20 is moved relatively in the X-axis and Y-axis directions to be positioned on the element table 102 as shown in FIG. 10. On the element table 102 shown in FIG. 10, the element formation substrate 30 is positioned and placed as shown in FIG. 3A. On the surface of the element formation substrate 30, as shown in FIG. 5A, for example, a red light emitting element 32r, a green light emitting element 32g, or a blue light emitting element 32b is fabricated. The substrate 30 may be, for example, a sapphire substrate, a glass substrate, a GaAs substrate, or a SiC substrate, depending on the type of element (blue light emitting element, red light emitting element, green light emitting element, etc.).

In this embodiment, the elements 32r, 32g, and 32b are, for example, micro LED elements. In the following description, only the element 32r will be described, but the same operation is performed for the other elements 32g and 32b using different stamp tools 10. It is preferable to prepare a stamp tool 10 for each of the different types of elements 32r, 32g, and 32b, but the transport head 22 can be used in common.

The stamp tool 10 in the standby state is placed, for example, on the stage 82 shown in Figures 6A and 7, and the stamp layer 12 is sealed inside the storage recess 86 and kept clean. The stamp tool 10 in the standby state that is not held by the transport head 22 may be placed, for example, on the stamp table 100 shown in Figure 9, or may be placed on a separate stamp table that is placed next to the table 100 shown in Figure 9 along the Y axis.

As shown in Figures 3A and 3B, the conveying device 20 is moved downward in the Z-axis direction, and the protrusions 11 of the stamp tool 10 are pressed against the upper surface of the element 32r of the substrate 30. As a result, the element 32r adheres to the protrusions 11. Then, as shown in Figure 3C, the stamp tool 10 is lifted upward in the Z-axis direction together with the conveying device 20. As a result, as shown in Figure 5B, the element 32r adheres to each protrusion 11, and the element 32r is picked up from the substrate 30 together with the protrusions 11. The element 32r left on the substrate 30 is later picked up by the stamp layer 10 of the conveying device 20 in the same manner.

Next, the element 32r picked up by the convex portion 11 of the stamp layer 10 is transported by the transport device 20 onto the mounting substrate 70 shown in FIG. 5C1, for example, and mounted thereon. The mounting substrate 70 shown in FIG. 5C1 is positioned and placed on the mounting table 104 shown in FIG. 10. Therefore, as shown in FIGS. 10 and 11, the element table 102 and the mounting table 104 are moved relative to the transport head 22 in the Y-axis direction, and the transport head 22 is positioned above the mounting table.

Then, the array of elements 32r adhered to the convex portion 11 of the stamp layer 12 shown in FIG. 5B is transferred onto the mounting substrate 70 shown in FIG. 5C1. To do this, the elements 32r adhered to the convex portion 11 of the stamp layer 12 are pressed against the surface of the mounting substrate 70, and then the stamp layer 12 is lifted together with the conveying device 20. As a result, multiple elements 32r are simultaneously transferred onto the surface of the mounting substrate 70. By repeating the above operation according to the size of the mounting substrate 70, a large number of elements 32r are arranged in a matrix on the mounting substrate 70. After use, the stamp tool 10 is returned to the stage 82 of the original stamp tool holding device 80 by the conveying head 22.

The other elements 32g and 32b are also transported to the substrate 70 in the same manner as above. Three elements 32r, 32g, and 32b for R, G, and B make up one pixel unit, and these pixel units can be arranged in a matrix to form a color display screen.

The surface of the mounting substrate 70 is preferably coated with anisotropic conductive paste (ACP). Alternatively, anisotropic conductive film (ACF) is preferably disposed thereon. As shown in FIG. 5C1, after the elements 32r, 32g, and 32b are disposed on the substrate 70 via the ACP or ACF, each of the elements 32r, 32g, and 32b is pressed toward the substrate 70 and heated using a heating and pressurizing device (not shown). As a result, the terminals of each of the elements 32r, 32g, and 32b can be connected to the circuit pattern of the mounting substrate.

In the transport device 20 according to this embodiment, the mounting force F3 of the transport head 22 on the mounting surface 16a of the adapter plate 16 shown in FIG. 2B is greater than the fixing force F1 shown in FIG. 5B, and the adhesive force F2 of the protrusions 11 of the stamp layer 12 on the element 32r is greater than the fixing force F1. Therefore, the stamp tool 10 can easily pick up and transport the element 32r arranged on the surface of the substrate 30 from the substrate 30 without being left behind on the substrate 30 side.

In addition, in this embodiment, the mounting force F3 of the transport head 22 on the mounting surface 16a of the adapter plate 16 shown in FIG. 2B is the sum of the primary mounting force F3a corresponding to the suction force of the vacuum suction hole and the secondary mounting force F3b of the clamp mechanism 26 as a secondary mounting means. In other words, in this embodiment, simply by providing a clamp mechanism 26 to a general transport head 22 having a vacuum suction hole, it is easy to make the mounting force F3 of the transport head 22 on the mounting surface 16a of the adapter plate 16 larger than the fixing force F1 of the element 32r to the substrate 30 shown in FIG. 5B.

Furthermore, in this embodiment, tapered surfaces 16c are formed on both side surfaces of the adapter plate 16 in the X-axis direction, with the outer diameter decreasing toward the stamp layer 12. The claws 26a of the clamping mechanism 26 can engage with the tapered surfaces 16c. This configuration makes it easier for the claws 26a of the clamping mechanism 26 to detachably engage with the tapered surfaces 16c on the side surfaces of the adapter plate 16. It also makes it possible to increase the mounting force F3 of the stamp tool 10 to the transport head 22 by the clamping mechanism 26.

In addition, tapered surfaces 16c, whose outer diameter decreases toward the stamp layer 12, are formed on both sides of the adapter plate 16 in the X-axis direction, making it easy to roughly position the stamp tool 10 in the X-axis direction along the inclined surface 89 of the guide member 88 installed on the top of the stage 82 shown in FIG. 6A. In particular, as shown in FIG. 1A, the maximum width of the adapter plate 16 in the X-axis direction is larger than the width of the support plate 14, making it easier for the inclined surface 89 of the guide member 88 and the tapered surface 16c of the stamp tool 10 to engage with each other.

In addition, the presence of the insertable surface 14c on the support plate 14 of the stamp tool 10 makes it easier for the claw portion 26a of the clamp mechanism 26 to detachably engage with the tapered surface 16c on the side of the adapter plate 16. The presence of the insertable surface 14c forms a space between the tapered surface 16c, so that when positioning the claw portion 26a of the clamp mechanism 26 to start engaging with the tapered surface 16c, it is possible to determine the engagement start position based on the space. Furthermore, the presence of the suction surface 14b on the support plate 14 of the stamp tool 10 makes it possible to suction the support plate 14 on the installation surface 84 of the stage 82 as shown in FIG. 7, making it easier to seal and hold the stamp layer 12 inside the storage recess 86. The suction surface 14b can be easily formed around the stamp layer 12 by forming the support plate 14 from a glass plate or the like.

The stamp tool 10 further has a support plate 14 to which the stamp layer 12 is fixed and to which the adapter plate 16 is replaceably attached. With this configuration, it is possible to replace only the support plate 14 to which the stamp layer 12 is fixed from the adapter plate 16 without replacing the entire stamp tool 10. This makes it easy to prepare stamp tools 10 having different types of stamp layers 12 at low cost. In addition, by sharing the adapter plate 16, it is not necessary to use different types of conveying heads to match the stamp tools, and the overall configuration of the conveying device can be simplified.

In this embodiment, the stamp layer 12 is formed with a plurality of protrusions 11 corresponding to the elements 32r (32g, 32b), and the elements 32r (32g, 32b) are detachably attached to each of the protrusions 11. With this configuration, a large number of elements 32r (32g, 32b) can be simultaneously removed from the substrate 30. With the manufacturing method of the element array of this embodiment, an element array having a large number of elements 32r (32g, 32b) can be easily manufactured.

In addition, in this embodiment, as shown in FIG. 6A, the installation stage 82 is replaceably attached to the base 81. Therefore, a stage 82 corresponding to the stamp tool 10 may be prepared in advance, and when replacing with a different type of stamp tool 10, only the stage 82 may be replaced. Since the flatness of the stage 82 is ensured with respect to the base 81, there is no need to adjust the flatness of the stamp tool when replacing the stamp tool 10.

Therefore, in this embodiment, the transport head 22 can smoothly pick up the stamp tool 10 from the installation stage 82 without causing suction errors by the transport head 22 or gripping errors by the clamping mechanism 26.

As shown in FIG. 7, in the stamp tool holding device 80 according to this embodiment, with the stamp layer 12 housed inside the housing recess 86, negative pressure is introduced into the suction hole 85, so that the adapter plate 14 of the stamp tool 10 is detachably attached to the installation surface 84. As a result, the inside of the housing recess 86 is sealed, and dirt and dust are less likely to adhere to the stamp surface (convex portion 11) of the stamp layer 12 housed inside the housing recess 86, making it possible to install the stamp tool 10 while keeping the stamp surface clean.

In addition, in this embodiment, the installation stage 82 is detachably fixed to the base 81. The stamp tool 10 needs to be replaced in response to customer requests or the substrate 30 on which elements as transport target elements are fabricated. By preparing multiple installation stages 82 in accordance with changes in the stamp tool 10, it is possible to accommodate changes in the size of the stamp tool 10 by replacing only the installation stages 82 without replacing the base 81. Furthermore, the flatness of each installation stage 82 relative to the base 81 is ensured, and there is no need to adjust the flatness when replacing the stamp tool 10.

Furthermore, in this embodiment, the installation stage 82 is formed with a gas circulation hole 83 that communicates with the space within the storage recess 86 and replaces the gas within the storage recess 86. By replacing the gas within the recess 86, dirt and dust adhering to the surface of the stamp layer 12 contained within the storage recess 86 can be discharged together with the gas, improving the cleanliness of the stamp layer 12.

As shown in FIG. 6A, in this embodiment, a guide member 88 is attached to the top of the installation stage 82 to guide the stamp layer 12 of the stamp tool 10 at least along the X axis so that it is dropped into the inside of the storage recess 86. By providing the guide member 88 on the installation stage 82, it becomes easier to roughly position the stamp tool 10 at least along the X axis. In addition, when the stamp tool 10 is picked up by the transport head 22, it also becomes easier to position the stamp tool 10 relative to the transport head 22.

In this embodiment, the guide members 88 are removably attached to both sides of the installation stage 82 along the X-axis, and each guide member 88 has an inclined surface 89 that can engage with the tapered surface 16c of the stamp tool 10. This configuration makes it easier to roughly position the stamp tool 10 at least along the X-axis. In addition, when the stamp tool 10 is picked up by the transport head 22, it also becomes easier to position the stamp tool 10 relative to the transport head 22.

In this embodiment, at least two guide members 88 are attached to each side of the installation stage 82 along the X-axis, and the claw portion 26a of the chuck mechanism 26 shown in FIG. 2A can be inserted along the gap between the two guide members 88. This configuration makes it possible to position the stamp tool 10 with high precision at least along the X-axis. Furthermore, when the stamp tool 10 is picked up by the transport head 22, the positioning of the stamp tool 10 relative to the transport head 22 (particularly along the X-axis) is also more precisely performed.

As shown in Figures 6A to 6C, a pair of positioning members 90 that can move in contact with and away from the edge 16d of the stamp tool 10 installed on the upper part of the installation stage 82 are arranged on both sides of the installation stage 82 along the Y axis direction. This configuration makes it possible to position the stamp tool 10 with high precision along the Y axis in addition to the X axis. In addition, when the stamp tool 10 is picked up by the transport head 22, it becomes even easier to position the stamp tool 10 relative to the transport head 22.

The method for manufacturing an element array according to this embodiment includes the steps of:
A step of preparing stamp tool holding devices 80 in a number equal to or greater than the number of substrates 30 on which each of a plurality of types of elements as elements to be transported is arranged;
A step of placing stamp tools 10 prepared for each of the plurality of types of elements on each stamp tool holding device 80;
a step of picking up the stamp tools 10 held by the stamp tool holding devices 80 corresponding to the respective substrates 30 with a transport head 22 from the stamp tool holding devices 80, and simultaneously removing and transporting a plurality of elements 32r (or 32g, 32b) from the substrates 30 corresponding to the picked-up stamp tools 10 using the stamp tool 10 attached to the transport head 22;
The method includes a step of simultaneously removing and transporting the multiple elements 32r (or 32g, 32b), and then returning the stamp tool 10 from which the multiple elements 32r (or 32g, 32b) have been removed to the corresponding stamp tool holding device 80.

The manufacturing method of the element array according to this embodiment allows an element array in which multiple types of elements 32r, 32g, and 32b are arranged to be manufactured easily, in a short time, and at low cost. Moreover, the stamp tools 10 used for each substrate 30 corresponding to each of the multiple types of elements 32r, 32g, and 32b are installed and stored in a dedicated stamp tool holding device 80, so it is easy to maintain high levels of cleanliness on the stamp surface of each stamp tool 10 while effectively preventing misalignment of the elements 32r, 32g, and 32b.

1B , in the stamp tool 10a used in the transport device of this embodiment, a shim plate 18 for adjusting the parallelism of the support plate 14 is interposed between the stamp layer 12 and the adapter plate 16. An inclined surface 14a is formed on a part of the side surface of the support plate, and the shim plate 18 engages with the inclined surface 14a, making it possible to adjust the parallelism of the support plate 14. By using a mode in which the shim plate 18 is installed between the support plate 14 and the adapter plate 16 via an adhesive layer 15, it is possible to adjust the parallelism of the support plate 14.

The purpose of installing the shim plate 18 is to adjust the parallelism, and the location at which the shim plate 18 is installed is not limited to this. The shim plate 18 may be installed across the entire periphery of the adapter plate 16, or may be installed intermittently. For example, as shown in Figures 1C, 1D, and 1E, adhesive layers 15 may be provided at each of the four corners of the adapter plate 16, and shim plates 18 may be provided between the adhesive surface 16b and the support plate 14 at only two locations on one side in the Y-axis direction, via the adhesive layers 15. This configuration makes it possible to make small parallelism adjustments when the adapter plate 16 (or the support plate 14) is rectangular.

That is, as shown in FIG. 1C, if the adapter plate 16 (or the support plate 14) is rectangular, the parallelism can be adjusted by placing a shim plate 18 on one of the opposing sides. Also, if the adapter plate 16 (or the support plate 14) is circular, the parallelism can be adjusted by placing a shim plate 18 on one of the arc regions at a point-symmetric position.

More specifically, for example, as shown in FIG. 1E, when the thickness of the stamp layer 12 varies along the Y-axis direction, a shim plate 18 can be placed in the gap between the support plate 14 and the adapter plate 16 on one side of the Y-axis direction. This makes the mounting surface 16a parallel to the stamp surface of the stamp layer 12, making it possible to adjust the parallelism. Note that in FIG. 1E, the thickness and inclination of the stamp layer 12, shim plate 18, and adhesive layer 15 are shown larger than they actually are to make the explanation easier to understand.

The other configurations and effects of the transport device and stamp tool of this embodiment are the same as those of the first embodiment, and detailed description thereof will be omitted.

As shown in FIG. 4A, in the conveying device of this embodiment, an elastically deformable engagement protrusion 26c is attached to the engagement surface 26b of the claw portion 26a of the chuck mechanism 26, and the engagement protrusion 26c is capable of engaging with the tapered surface 16c of the adapter plate 16. The engagement protrusion 26c may be made of, for example, a spring material and may protrude in an arc shape from the engagement surface 26b. Also, as shown in FIG. 4B, the engagement surface 26b does not necessarily have to be a flat surface, and may be a convex curved surface capable of engaging with the tapered surface 16c of the adapter plate 16. The other configurations and effects of the conveying device and stamp tool of this embodiment are the same as those of the first or second embodiment, and detailed description thereof will be omitted.

In this embodiment , a method of mounting elements by a transfer method using the apparatus according to the first to third embodiments will be described. In the following description, the description of the parts that overlap with the first to third embodiments will be omitted.

In the method of this embodiment, as shown in FIG. 5B, the element 32r picked up by the convex portion 11 of the stamp layer 10 is transported by the transport device 20 onto the first transfer substrate 50 shown in FIG. 5C2, for example, and placed on the adhesive layer 52.

The array of elements 32r adhered to the convex portions 11 of the stamp layer 12 shown in FIG. 5B is transferred onto the adhesive layer 52 of the substrate 50, which is made of an adhesive sheet or the like, shown in FIG. 5C2. To this end, the elements 32r adhered to the convex portions 11 of the stamp layer 12 are pressed against the surface of the adhesive layer 52, and then the stamp layer 12 is lifted together with the conveying device 20. As a result, multiple elements 32r are simultaneously transferred onto the surface of the adhesive layer 52. Note that before this, the conveying device 20 shown in FIG. 3C is moved above the substrate 50 shown in FIG. 5C2 by the conveying mechanism of the conveying device 20.

The adhesive strength of the adhesive layer 52 of the adhesive sheet made of the substrate 50 is adjusted so that it is greater than the adhesive strength of the protrusions 11. The adhesive layer 52 is made of an adhesive resin such as natural rubber, synthetic rubber, acrylic resin, or silicone rubber, and its thickness z4 is preferably about 0.5 to 2.0 times the height z2 (see FIG. 5B) of the element 32r. Note that, in order to facilitate the movement of the element 32r from the protrusions 11 to the adhesive layer 52, an operation (such as applying heat) may be performed to make the element 32r easier to peel from the protrusions 11.

The other elements 32g and 32b are also transferred to the adhesive layer 52 of the substrate 50 in the same manner as described above. Three elements 32r, 32g, and 32b for R, G, and B make up one pixel unit, and these pixel units can be arranged in a matrix to form a color display screen.

Next, as shown in FIG. 5D, all of the arrangement of the three elements 32r, 32g, and 32b arranged on the surface of the first transfer substrate 50 is transferred to the adhesive layer 62 of the second transfer substrate 60, and the terminals of the elements 32r, 32g, and 32b are arranged so that they face the outside of the substrate 60. For this transfer, a method such as the laser lift method may be used, or a method such as transfer using the difference in adhesive strength or transfer involving heat peeling may be used. With the terminals of the elements 32r, 32g, and 32b facing the outside of the substrate 60, a tin plating film may be formed on each terminal by electroless plating or the like.

Next, as shown in Figures 5E and 5F, the entire arrangement of the three elements 32r, 32g, and 32b is transferred from the adhesive layer 62 of the substrate 60 to the mounting substrate 70. For this transfer, a method such as the laser lift method may be used, or a method such as transfer using differences in adhesive strength or transfer involving thermal peeling may be used.

After the transfer, in order to connect the terminals of each of the elements 32r, 32g, and 32b to the circuit pattern of the mounting substrate, it is preferable to apply anisotropic conductive paste (ACP) or place an anisotropic conductive film on the surface of the mounting substrate 70. As shown in FIG. 5F, after the elements 32r, 32g, and 32b are placed on the substrate 70 via ACP or ACF, each of the elements 32r, 32g, and 32b is pressed toward the substrate 70 and heated using a heating and pressurizing device (not shown). As a result, the terminals of each of the elements 32r, 32g, and 32b can be connected to the circuit pattern of the mounting substrate.

The present invention is not limited to the above-described embodiment, and can be modified in various ways within the scope of the present invention.

For example, the transport head 22 may be provided with at least one of an electrostatic adsorption mechanism, a fitting mechanism, and a screw mechanism as a secondary mounting means other than the clamp mechanism 26. Providing these mechanisms on the transport head also makes it easier to make the mounting force F3 of the transport head 22 on the mounting surface 16a of the adapter plate 16 greater than the fixing force F1 of the element 32r (32g, 32b as well) on the substrate 30.

In addition, in the above-described embodiment, vacuum suction through a vacuum suction hole is used as the main attachment means of the transport head 22, but in the present invention, it is not necessary to use vacuum suction, and the stamp tool 10 may be detachably attached to the transport head 22 using only the clamp mechanism 26. Alternatively, an electrostatic suction mechanism, a fitting mechanism, a screw mechanism, or other attachment/detachment device may be attached to the transport head 22 as the main attachment means other than the clamp mechanism 26.

Furthermore, the stamp tool held by the stamp tool holding device according to the above-described embodiment is not limited to the stamp tool 10 described above, but may be other stamp tools.

In addition, the transport device 20 according to this embodiment is used to pick up the elements 32r (32g, 32b) from the element formation substrate 30, but the use is not limited to this, and it may also be used to pick up the elements 32r (32g, 32b) from a substrate (sheet) with an adhesive layer that has been transferred from the substrate 30 by a laser lift method or the like.

The conveying device 20 according to this embodiment can also be used to pick up elements other than the red, green, and blue light emitting elements 32r, 32g, and 32b. Examples of other display elements include fluorescent elements. In addition, the other elements are not limited to display elements, and may be electronic elements such as light receiving elements, ceramic capacitors, and chip inductors, or semiconductor elements.

REFERENCE SIGNS LIST 10: stamp tool 11: convex portion 12: stamp layer 14: support plate 14a: inclined surface 14b: adsorbable surface 14c: insertable surface 15: adhesive layer 16: adapter plate 16a: mounting surface 16b: adhesive surface 16c: tapered surface 16d: edge portion 18: shim plate 20: conveying device 22: conveying head 24: adsorption surface 26: chuck mechanism 26a: claw portion 26b: engagement surface 26c: engagement convex portion 28: opening/closing mechanism 30: element formation substrate 32r, 32g, 32b: element 50: first transfer substrate (sheet)
52: Adhesive layer 60: Second transfer substrate (sheet)
DESCRIPTION OF SYMBOLS 62: Adhesive layer 70: Mounting substrate 80: Stamp tool holding device 81: Base 82: Stage 83: Gas flow hole 84: Installation surface 85: Suction hole 86: Storage recess 88: Guide member 89: Inclined surface 90: Positioning member 92: Tip surface 100: Stamp table 102: Element table 104: Mounting table 110: Integration table

Claims (9)

A stamp tool holding device having an installation stage on which a stamp tool having a stamp layer having a portion to which a transport target element can be detachably attached is detachably installed,
The stamp tool holding device is characterized in that the installation stage has an installation surface in which an accommodating recess for accommodating the stamp layer is formed, and the installation surface has a suction hole formed therein that can detachably adsorb a part of the stamp tool located around the stamp layer. The stamp tool holding device according to claim 1, wherein the installation stage is removably fixed to the base. The stamp tool holding device according to claim 1 or 2, wherein the installation stage is formed with a gas flow hole that communicates with the space within the storage recess and replaces the gas within the storage recess. A stamp tool holding device according to any one of claims 1 to 3, in which a guide means is attached to the upper part of the installation stage, for guiding the stamp layer of the stamp tool along at least the first axis so that it is dropped into the interior of the storage recess. the guide means includes a plurality of guide members removably attached to both sides of the installation stage along the first axis,
5. The stamp tool holding device according to claim 4, wherein each of said guide members is formed with an inclined surface which is engageable with a tapered surface of said stamp tool. At least two guide members are attached to each side of the installation stage along the first axis,
6. The stamp tool holding device according to claim 5, wherein a claw portion of the chuck mechanism can be inserted along the gap between the two guide members. The stamp tool holding device according to any one of claims 1 to 6 further comprises a pair of positioning members arranged on both sides of the installation stage along the second axis direction and capable of moving in contact with and away from the edge of the stamp tool installed on the upper part of the installation stage. A step of picking up the stamp tool held by the stamp tool holding device according to any one of claims 1 to 7 with a conveying head;
and simultaneously removing and transporting a plurality of transport target elements from the substrate using a stamp tool attached to the transport head. A step of preparing the stamp tool holding device according to any one of claims 1 to 7 in a number equal to or greater than the number of substrates on which each of the plurality of types of elements as the transport target elements is arranged;
a step of placing stamp tools prepared for each of the plurality of types of elements in each of the stamp tool holding devices;
a step of picking up the stamp tools held by the stamp tool holding devices corresponding to the respective substrates with a transport head from the stamp tool holding devices, and simultaneously removing and transporting a plurality of the elements from the substrates corresponding to the picked-up stamp tools using the stamp tools attached to the transport head;
and then returning the stamp tool from which the elements have been removed to the corresponding stamp tool holding device after simultaneously removing and transporting the plurality of elements.

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