JP2022098289A - Multi-element transfer device and manufacturing method of element array - Google Patents

Abstract

To provide a multi-element transfer device for efficiently transferring an element to be transferred such as an element by using a stamp tool, and a manufacturing method of an element array using the multi-element transfer device.SOLUTION: A device includes a stamp table 100 to which an installation stage 82 on which a stamp tool 10 is detachably installed is fixed, a transport head 22 capable of picking up the stamp tool 10 installed on the installation stage 82, a first table 102 to which a first substrate 50 on which an element 32r is arranged is detachably fixed, and a second table 104 to which a second substrate 70 having a surface on which the element 32r arranged on the first substrate 50 is transferred and replaced by the stamp tool 10 is detachably fixed.SELECTED DRAWING: Figure 10

Description

The present invention relates to a multi-element transfer device and a method for manufacturing an element array.

In transporting extremely small parts, it is being considered to use a stamp-shaped transport tool (stamp tool) having a large number of convex portions on the surface. The following Patent Document 1 discloses an example of the stamp-shaped transport tool. Conventionally, a stamp tool for enabling withdrawal of a transport target by a coefficient of thrmal expansion has been disclosed.

As an example of the extremely small parts that are supposed to be transported by the stamp tool, there are LED elements called mini LEDs and micro LEDs. The mini LED and the micro LED have a width of 1 to 8 μm, a length of 5 to 10 μm, and a height of 0.5 to 3 μm, which are very small as compared with those of a conventional general LED element.

As in the prior art, LED displays are manufactured by picking up elements from a wafer in which a large number of such LED elements are arranged and transporting them to a substrate corresponding to a display. There is a demand for devices and methods for efficiently transporting elements to be transported such as elements.

United States 2017/0173852A1 Gazette

The present invention has been made in view of such an actual situation, and an object thereof is to manufacture a multi-element transfer device for efficiently transferring an element to be transferred such as an element by using a stamp tool, and an element array using the multi-element transfer device. Is to provide a method.

In order to achieve the above object, the multi-element transfer device according to the present invention is
A stamp table on which at least one stamp tool having a stamp layer having a portion to which a plurality of elements to be transported can be detachably adhered is detachably installed.
A transport head capable of picking up at least one stamp tool installed on the stamp table,
A first table on which the first substrate on which the element to be transported is arranged is detachably fixed, and a first table.
It is a multi-element transfer device having a second table on which a second substrate having a surface on which the transfer target element arranged on the first substrate is transferred and transferred by the stamp tool is detachably fixed. hand,
The stamp table and the first table are arranged along the first axis.
The first table and the second table are arranged along a second axis intersecting the first axis.
The transport head is movable relative to at least the stamping table along a third axis that intersects both the first axis and the second axis.
The stamp tool has a mounting surface on the opposite side of the stamp layer to which the transport head can be detachably mounted.
The stamp tool is mounted on the stamp table so that the mounting surface faces upward along the third axis.
The first table and the second table can move relative to the transfer head at least along the second axis.
The stamping table is characterized in that it can move relative to the transport head at least along the first axis.

In the multi-element transfer device according to the present invention, the stamp tool is attached to the stamp table so that the attachment surface faces upward along the third axis, and the first table and the second table are different from each other with respect to the transfer head. , At least relative to the second axis, and relative to the transfer head, the stamping table is at least relative to the first axis.

Therefore, the transport head is relatively movable on the stamp table, the first table, and the second table. Further, by using the stamp tool held by the transport head, it is possible to simultaneously transfer a large number of transport target elements from the surface of the first substrate of the first table to the surface of the second substrate of the second table. Further, the stamp tool after the transfer target element is transferred from the first substrate to the second substrate is returned to the original stamping table by using the transfer head. As described above, in the multi-element transfer device of the present invention, the element to be transferred such as an element can be efficiently transferred by using the stamp tool.

Further, when transferring a transfer target element such as a plurality of types of elements from a plurality of first substrates corresponding to each to a single second substrate, a transfer target is used by using a stamp tool different for each type. Elements can be transferred. Therefore, it is easy to transfer different types of transfer target elements to a single second substrate in a set arrangement, and it is easy to efficiently manufacture an element array with few pixel defects, for example. be.

Preferably, the first substrate comprises a plurality of element placement substrates on which different types of transport target elements are respectively arranged.
The second substrate is a single mounting substrate or a single transfer substrate.
The stamp table includes a plurality of installation stages that detachably hold stamp tools corresponding to the plurality of element placement boards.

Also preferably, the multi-element transfer device
The transport head
A stamp tool corresponding to each of the plurality of element placement boards is picked up from the corresponding installation stage, and the stamp tool is picked up.
Using the picked-up stamp tool, the element to be transported is taken out from the corresponding element placement board.
As if to transfer the taken-out transport element to the second substrate,
Further, it has a control means for driving and controlling the positional relationship between the transfer head, the first table, the second table, and the stamping table.

With this configuration, when transferring elements to be transported such as multiple types of elements from a plurality of element placement boards corresponding to each to a single second board, different stamp tools can be used for each type. It is possible to transfer the element to be transported by using it. Therefore, it is easy to transfer different types of transfer target elements to a single second substrate in a set arrangement, and it is easy to efficiently manufacture an element array with few pixel defects, for example. be.

Preferably, the multi-element transfer device is
When the transport head holding the stamp tool is located on the first substrate, two directions capable of entering the space between the surface of the first substrate and the stamp layer of the stamp tool. It also has an imaging means capable of simultaneous imaging, and has
The image pickup means simultaneously images the stamp surface of the stamp layer and the surface of the first substrate.

Preferably, the multi-element transfer device further has a fine adjustment mechanism that changes the relative position of the transfer head and the first substrate based on the detection signal captured by the image pickup means. By adjusting the relative position between the transfer head and the first board with the fine adjustment mechanism, the stamp layer of the stamp tool and the transfer target element arranged on the surface of the first board are accurately aligned. It becomes possible to hold a large number of small-sized transfer target elements on the stamp surface of the stamp layer with high accuracy.

The fine adjustment mechanism may change the relative rotation angle of the transfer head around the third axis based on the detection signal captured by the image pickup means. With this configuration, the alignment between the stamp surface of the stamp layer and the transfer target element arranged on the surface of the first substrate becomes more accurate.

Preferably, the multi-element transfer device is
A first-axis positioning mechanism that positions and adjusts the relative position of the stamp tool with respect to the transport head along the first axis.
It has a second axis positioning mechanism that positions and adjusts the relative position of the stamp tool with respect to the stamp table along the second axis that intersects the first axis.

With this configuration, the positioning of the stamp tool along the second axis is performed using the second axis positioning mechanism with reference to the stamp table, and the positioning of the stamp tool along the first axis is performed. It can be performed by using the first axis positioning mechanism with the conveyor head as a reference. Therefore, the positioning mechanism for the transport head becomes simple and light. As a result, the drive control of the transfer head becomes easy, and the accuracy of the transfer position by the transfer head is improved.

Further, although the stamp tool is positioned along the second axis with respect to the stamp table, it is not necessary to accurately position the stamp tool along the first axis. Therefore, the positioning mechanism of the stamp table can be simplified and the required space of the stamp table can be minimized. Therefore, the movement control of the stamp table becomes easy. Further, the alignment of the stamp table and the transport head may be performed with high accuracy only along the second axis, for example, and the alignment along the first axis may be rough. This is because the positioning of the stamp tool along the first axis is performed by the first positioning mechanism with reference to the transport head.

Preferably, the first axis positioning mechanism also serves as a mounting means for detachably mounting the stamp tool on the transport head. Since the mounting means also serves as a positioning mechanism, it is not necessary to separately equip the transport head with a positioning mechanism as a component other than the mounting means.

Further, the mounting means is not particularly limited, and examples thereof include a chuck mechanism (clamp mechanism). The chuck mechanisms are provided on opposite sides of each other along the first axis of the transport head, and are provided so as to be movable in contact with and away from the stamp tool.

Preferably, the second axis positioning mechanism is
At least a pair of second positioning members arranged on both sides of the installation stage fixed to the stamp table along the second axial direction and capable of abutting and separating from the stamp tool installed on the installation stage. Have.

With this configuration, it is possible to perform highly accurate positioning of the stamp tool along the second axis with respect to the installation stage. Further, when the stamp tool is picked up by the transfer head, the positioning of the stamp tool with respect to the transfer head becomes easier.

Preferably, the installation stage has an installation surface formed with an accommodating recess for accommodating the stamp layer, and a part of the stamp tool located around the stamp layer can be attached to and detached from the installation surface. A suction hole that can be adsorbed is formed in.

With this configuration, a part of the stamp tool is detachably attracted to the installation surface by introducing a negative pressure into the suction hole while the stamp layer is housed inside the storage recess. As a result, the inside of the storage recess is sealed, and dust and dirt are less likely to adhere to the stamp surface of the stamp layer housed inside the storage recess, and a stamp tool is installed while keeping the stamp surface clean. It will be possible to keep it.

Preferably, the installation stage is detachably fixed to a base fixed to the stamping table. The stamp tool needs to be replaced according to the request of the customer or the substrate on which the element as the element to be transported is built. By preparing multiple installation stages according to the change of the stamp tool, it is possible to respond to the size change of the stamp tool by exchanging only the installation stage without replacing the base. Further, it is preferable that each installation stage has a flatness with respect to the base, and it is not necessary to adjust the flatness even when the stamp tool is replaced.

Preferably, the installation stage is formed with a gas flow hole that communicates with the space in the accommodating recess and replaces the gas in the accommodating recess. By replacing the gas in the recess, dust and dirt adhering to the surface of the stamp layer housed inside the storage recess can be discharged together with the gas, and the cleanliness of the stamp layer is improved.

Preferably, the installation stage is equipped with a guiding means for guiding the stamp tool along at least the first axis. By providing the guiding means on the installation stage, it becomes easy to roughly position the stamp tool along the first axis. Further, when the stamp tool is picked up by the transfer head, highly accurate positioning along the first axis of the stamp tool with respect to the transfer head becomes easy.

Preferably, the guiding means has a plurality of guiding members detachably attached to both sides of the installation stage along the first axis. Preferably, each of the guide members is formed with an inclined surface that can be engaged with the tapered surface of the stamp tool. This configuration further facilitates the schematic positioning of the stamp tool along the first axis.

Preferably, at least two guide members are mounted on both sides of the installation stage along the first axis, and the first axis positioning mechanism is inserted along the gap between the two guide members. It is possible to contact the stamp tool. With such a configuration, the stamp tool can be easily positioned with respect to the transport head in spite of its simple configuration.

The method for manufacturing an element array of the present invention is characterized in that a plurality of elements to be transferred are simultaneously taken out from a substrate and transferred by using the multi-element transfer device according to any one of the above to manufacture an element array. ..

In the method for manufacturing an element array of the present invention, an element array having a large number of elements positioned and arranged with high accuracy can be easily manufactured in a short time and at low cost.

Preferably, the stamp tool
A stamp layer with a part where the element to be transported can be detachably adhered,
A support plate to which the stamp layer is fixed and
It has an adapter plate having a mounting surface to which the support plate can be detachably attached and the transport head can be detachably attached.

With this stamp tool, only the support plate to which the stamp layer is fixed can be replaced from the adapter plate without replacing the entire stamp tool. Therefore, it becomes easy to prepare a stamp tool having different types of stamp layers at low cost. Further, even if the size of the stamp layer and the size of the support plate are changed, it becomes easy to unify the size of the adapter plate, and it becomes easy to share the transfer head or the installation stage. Further, since the stamp layer is fixed to the support plate, it is easy to secure the flatness of the stamp surface of the stamp layer.

Preferably, the support plate is replaceably attached to the adapter plate by an adhesive layer. By using the adhesive layer, the support plate can be easily and interchangeably attached to the adapter plate, and it is easy to secure the flatness of the support plate, that is, the flatness of the stamp surface of the stamp layer.

Preferably, the transfer target element is a plurality of elements formed on the surface of the substrate, and the stamp layer is formed with a plurality of convex portions corresponding to the elements, and the convex portions are formed with the convex portions. The element is detachably adhered. With such a configuration, it becomes easy to simultaneously take out a plurality of elements as a plurality of transfer target elements from the substrate and transfer or mount them.

Preferably, the support plate has a glass plate or a ceramic plate having a flat surface. With such a configuration, it is easy to secure the flatness of the support plate, that is, the flatness of the stamp surface of the stamp layer. Further, in particular, by forming the support plate with a glass plate, it becomes easy to form an adsorbable surface around the stamp layer.

Preferably, the side surface of the adapter plate is formed with a tapered surface whose outer diameter becomes smaller toward the support plate. The claw portion of the clamp mechanism (chuck mechanism) can be detachably engaged with the tapered surface formed on the side surface of the adapter plate. In addition, the mounting force of the stamp tool on the transport head by the clamp mechanism can be increased. Further, the stamp tool can be easily positioned along the inclined surface of the guide member installed on the upper part of the installation stage for the stamp tool.

Preferably, the maximum width of the adapter plate is made larger than the width of the support plate. With such a configuration, the inclined surface of the guide member and the tapered surface of the stamp tool are easily engaged with each other.

Preferably, the surface of the support plate on the adapter plate side has a insertable surface facing the tapered surface of the adapter plate. The presence of an insertable surface on the support plate of the stamp tool facilitates the detachable engagement of the claws of the clamp mechanism with the tapered surface on the side surface of the adapter plate.

Preferably, an adsorptive surface is formed around the stamp layer on the surface of the support plate on the stamp layer side. The presence of a suctionable surface on the support plate of the stamp tool makes it possible to suck the support plate on the installation surface of the installation stage for the stamp tool, making it easier to seal and hold the stamp layer inside the accommodating recess. .. The stamp layer in the containment recess is kept clean.

A shim plate for adjusting the parallelism (flatness) of the support plate may be interposed between the stamp layer and the adapter plate. With this configuration, the flatness of the support plate is improved, and the flatness of the stamped surface is also improved.

FIG. 1A is a schematic front view and an enlarged view of a main part of the stamp tool according to the embodiment of the present invention. FIG. 1B is a schematic front view of a stamp tool according to another embodiment of the present invention. FIG. 2A is a schematic view of a transfer device including a transfer head that detachably conveys the stamp tool shown in FIG. 1A. FIG. 2B is a schematic view of a transport device showing a state in which the stamp tool is being gripped by the transport head shown in FIG. 2A. FIG. 3A is a schematic view of a transport device showing a state before picking up an element from a semiconductor substrate. FIG. 3B is a schematic view of a transport device showing a state in which the stamp layer of the stamp tool is pressed against the element on the semiconductor substrate from the state shown in FIG. 3A. FIG. 3C is a schematic view of a transport device showing a state after picking up an element from a semiconductor substrate. FIG. 4A is a partial schematic view showing the details of the claw portion of the clamp mechanism used in the transport device according to another embodiment of the present invention. FIG. 4B is a partial schematic view showing the details of the claw portion of the clamp mechanism used in the transport device according to another embodiment of the present invention. FIG. 5A is a schematic cross-sectional view of an element formed on a semiconductor substrate. FIG. 5B is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transport device. FIG. 5C1 is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transport device and then arranged on a mounting substrate (sheet). FIG. 5C2 is a schematic cross-sectional view showing a state in which an element on a semiconductor substrate is picked up by a stamp tool of a transport device and then arranged on a first transfer substrate (sheet). FIG. 5D is a schematic cross-sectional view showing a state in which the element array arranged on the first transfer substrate (sheet) is transferred to the second transfer substrate (sheet). FIG. 5E is a schematic cross-sectional view showing a state before the element array arranged on the second transfer substrate (sheet) is transferred to the mounting substrate (sheet). FIG. 5F is a schematic cross-sectional view showing a state after the element array arranged on the second transfer substrate (sheet) is transferred to the mounting substrate (sheet). FIG. 6A is a schematic perspective view of a stamp stage on which the stamp tool shown in FIG. 1A is installed. FIG. 6B is a plan view of the stamp stage shown in FIG. 6A, showing a state in which the positioning member is open. FIG. 6C is a plan view of the stamp stage shown in FIG. 6A, showing a state in which the positioning member is closed. FIG. 7 is a schematic cross-sectional view of the stamp stage along lines VII-VII shown in FIG. 6A. FIG. 8 is a side view in which the transfer head shown in FIG. 2A is added to the side view of the stamp stage shown in FIG. 6A as viewed from the Y-axis direction. 9 shows a stamp table on which the stamp stage shown in FIG. 6A is arranged, an element table on which the element forming substrate shown in FIG. 5A is arranged, and a mounting table on which the mounting substrate shown in FIG. 5C1 is arranged. It is a schematic diagram which shows the relationship with a transfer head. FIG. 10 is a schematic view showing a state in which the relative positions of the transfer head and the table are changed from the state shown in FIG. FIG. 11 is a schematic view showing a state in which the relative positions of the transfer head and the table are changed from the state shown in FIG.

Hereinafter, the present invention will be described based on the embodiments shown in the drawings.

As shown in FIGS. 9 to 11, the multi-element transfer device 200 includes a transfer device 20, a stamp table 100, an element table 102 as a first table, and a mounting table 102 as a second table. It has a table 104. As shown in FIG. 2A, the transfer device 20 has a transfer head 22 that detachably conveys the stamp tool 10.

(Stamp tool)
First, the stamp tool 10 will be mainly described. As shown in FIG. 1A, the stamp tool 10 has a stamp layer 12, a support plate 14, and an adapter plate 16.

On the stamp layer 12, convex portions 11 projecting downward on the Z axis are formed in a matrix at predetermined intervals in the X-axis direction and the Y-axis direction. The X-axis direction width x1 of the convex portion 11 and the X-axis direction spacing x2 of these adjacent convex portions 11 are mounted on the surface of the mounting substrate (hereinafter, the substrate may be a sheet) 70 shown in FIG. 5F, for example. An element for emitting red light (an example of an element to be conveyed) is determined according to the width x3 in the X-axis direction of 32r and the distance x4 in the X-axis direction thereof.

Although not shown in FIG. 1A, the same applies to the width of the convex portion 11 in the Y-axis direction and the distance between the adjacent convex portions 11 in the Y-axis direction. The convex portions 11 are arranged in a matrix on the lower surface of the stamp layer 12, and the number of the convex portions 11 is not particularly limited, but is 1 to several hundred thousand.

In the present embodiment, in the drawings, the X-axis (first axis), the Y-axis (second axis), and the Z-axis (third axis) are substantially perpendicular to each other, and the X-axis and the Y-axis are the stamp layer 12. Is parallel to the plane direction of, and the Z axis is parallel to the projecting direction of the convex portion 11.

As shown in FIG. 1A, the protruding height z1 of the convex portion 11 of the stamp layer 12 is determined in relation to the Z-axis direction height z2 of the element 32r shown in FIG. 5B, for example, the Z-axis direction height z2. It is preferably 1 to 8 times. The thickness z3 of the stamp layer 12 in the Z-axis direction is not particularly limited, but is preferably about 0.25 times or more the protruding height z1 of the convex portion 11. The width x3 in the X-axis direction of the element 32r (the width in the Y-axis direction is also about the same) is, for example, 1 to 150 μm, and the height z2 is, for example, 1 to 150 μm.

The stamp layer 12 and the convex portion 11 may be made of different materials as long as they are strongly joined, but may be made of the same material. By being made of the same material, the possibility that the convex portion 11 is peeled off from the stamp layer 12 is reduced. At least the convex portion 11 is made of a material having adhesiveness, and the element 32r arranged on the element forming substrate 30 shown in FIG. 5B with a predetermined fixing force F1 can be adhered with a predetermined adhesive force F2. It has become. When the lower end of the convex portion 11 is pressed against the upper surface of the element 32r with a predetermined force, the adhesive force F2 of the convex portion 11 with respect to the element 32r becomes larger than the fixing force F1 of the element 32r with respect to the substrate 30. The material and shape of 11 have been determined.

The material of the convex portion 11 is not particularly limited, and examples thereof include polydimethylsiloxane (PDMS), an organic silicon compound, and a viscoelastic elastomer such as polyether rubber. The stamp layer 12 may also be made of the same material as the convex portion 11, but it is preferable that the surface of the stamp layer 12 other than the convex portion 11 does not have adhesiveness. It is preferable not to pick up the element 32r by the adhesive force except for the convex portion 11.

As shown in FIG. 1A, the stamp layer 12 is fixed to the support plate 14. The support substrate 14 is made of a material having higher rigidity than the stamp layer 12 and having excellent flatness, and is preferably made of a glass plate, a metal plate, a ceramic plate, or the like. The thickness of the support plate 14 is not particularly limited, but is preferably 0.5 mm or more.

The stamp layer 12 may be formed directly on the surface of the support plate 14, or may be fixed by an adhesive layer. In any case, the stamp layer 12 is fixed to the surface of the support plate 14 with an adhesive force sufficiently higher than the adhesive force F2 shown in FIG. 5B. Since the element 32r is peeled off from the convex portion 11 and placed on the mounting substrate 70 shown in FIG. 5C1 in a later step, it is important that the stamp layer 12 is not peeled off from the support plate 14 at that time. Is.

As shown in FIG. 1A, the support plate 14 is detachably fixed to the adhesive surface 16b of the adapter plate 16 by the adhesive layer 15 on the surface opposite to the stamp layer 12. The adhesive strength between the support plate 14 and the adapter plate 16 by the adhesive layer 15 is sufficiently higher than the adhesive strength F2 shown in FIG. 5B. However, when the stamp layer 12 is replaced after repeated use, the support plate 14 can be removed from the adhesive surface 16b of the adapter plate 16. The adhesive layer 15 may be made of double-sided adhesive tape or the like.

The width in the X-axis direction and the width in the Y-axis direction of the support plate 14 may be larger than those in the stamp layer 14, and moreover, the width in the X-axis direction and the width in the Y-axis direction of the adhesive surface 16b of the adapter plate 16 may be larger. preferable. On the surface of the support plate 14 on the stamp layer side, a flat adsorptionable surface 14b on which the stamp layer 12 is not formed is formed around the stamp layer 12. In the present embodiment, the stamp layer 12 has a rectangular shape when viewed from the Z-axis direction, but the support plate 14 may be rectangular or circular. The adsorptionable surface 14b can be detachably attached to the installation surface 84 of the installation stage 82 shown in FIG. 7.

The upper surface of the adapter plate 16 opposite to the adhesive surface 16b is a flat mounting surface 16a, and the area of the mounting surface 16a is at least the X axis of the adapter plate 16 so as to be larger than the area of the adhesive surface 16b. Both side surfaces in the direction are tapered surfaces 16c. That is, a tapered surface 16c whose outer diameter becomes smaller toward the stamp layer 12 is formed on at least the side surface of the adapter plate 16 in the X-axis direction.

In the present embodiment, the tapered surface 16c is also formed on both side surfaces of the adapter plate 16 in the Y-axis direction, and the tapered surface 16c is formed along the entire circumference of the side surface of the adapter plate 16. In the present embodiment, the adapter plate 16 has a rectangular shape when viewed from the Z-axis direction, and it is preferable that at least the maximum width in the X-axis direction of the adapter plate 16 is larger than the width in the X-axis direction of the support plate 14. .. As shown in FIG. 7, the maximum width in the Y-axis direction of the adapter plate 16 may be substantially the same as the width in the Y-axis direction of the support plate 14, and may be larger or smaller than that.

On the surface of the support plate 14 opposite to the adsorptionable surface 14b shown in FIG. 1A, a flat insertable surface 14c facing the tapered surface 16c is formed around the adhesive surface 16b of the adapter plate 16. On the insertable surfaces 14c located on both sides in the X-axis direction, the tapered surface 16c of the adapter plate 16 has the claws of the chuck mechanism (also referred to as the clamp mechanism / first axis positioning mechanism) 26 shown in FIG. 2B, respectively. 26a engages. Further, the inclined surfaces 89 of the guide member 88 of the installation stage 82 shown in FIGS. 6A and 8 are engaged with the tapered surfaces 16c of the adapter plates 16 located on both sides in the X-axis direction.

The thickness of the adapter plate 16 shown in FIG. 1A in the Z-axis direction is sufficiently larger than the thickness of the support plate 14, preferably 1.2 times or more, preferably about 2 to 6 times the thickness of the support plate 14. be. An edge portion 16d composed of a chamfered portion or an R portion is formed on the outer peripheral edge portion of the mounting surface 16a on the upper surface of the adapter plate 16.

The tip surface 92 of the pair of positioning members (second axis positioning mechanism) 90 shown in FIGS. 6A to 6C and FIG. 7 abuts on the edges 16d of the adapter plate 16 located on both sides in the Y-axis direction, and the installation stage. The position of the stamp tool 10 placed on the 82 in the Y-axis direction is positioned. Approximate positioning of the X-axis position of the stamp tool 10 is performed by the inclined surface 89 of the guide member 88 shown in FIGS. 6A and 8, and high-precision positioning is performed by the clamp of the transport device 20 shown in FIGS. 2B and 8. The claw portion 26b of the mechanism 26 performs this.

(Conveyor)
Next, the transport device will be mainly described. The suction surface 24 of the transfer head 22 of the transfer device 20 shown in FIG. 2A can be sucked onto the mounting surface 16a on the upper surface of the adapter plate 16 shown in FIG. 1A. A vacuum suction hole as a main mounting means is formed on the suction surface 24 of the transport head 22, and by generating a negative pressure in the vacuum suction hole, the suction surface 24 has a mounting surface of the adapter plate 16 of the stamp tool 10. 16a is vacuum-sucked. The vacuum suction force of the stamp tool 10 on the mounting surface 16a of the adapter plate 16 by the suction surface 24 is assumed to be the main mounting force F3a.

Further, in the present embodiment, the chuck mechanism 26 is attached to the transport head 22 via the opening / closing mechanism 28. A claw portion 26a is formed inside the chuck mechanism 26. The chuck mechanism 26 including the claw portion 26a is moved in the X-axis direction by, for example, the opening / closing mechanism 28, and the claw portion 26a opens the entire lower surface of the suction surface 24 as shown in FIG. 2A, or as shown in FIG. 2B. In addition, the claw portion 26a is located below both sides of the suction surface 24 in the X-axis direction.

A tapered engaging surface 26b is formed on each claw portion 26a. The tapered surface of the engaging surface 26b matches the shape of the tapered surface 16c of the adapter plate 16 of the stamp tool 10, and can be engaged with the tapered surface 16c. As shown in FIGS. 2A to 2B, before the mounting surface 16a of the adapter plate 16 is attracted to the suction surface 24 of the transport head 22, the chuck mechanism 26 has the claw portion 26a opened by the opening / closing mechanism 28. After the mounting surface 16a of the adapter plate 26 is attracted to the suction surface 24 of the transfer head 22, the chuck mechanism 26 moves in the direction in which the claw portion 26a is closed by the opening / closing mechanism 28, and the engaging surface 26b becomes the tapered surface 16c. Engage.

As a result, the stamp tool 10 has a total mounting force of the main mounting force F3a formed in the transport head 22 by the vacuum suction hole as the main mounting means and the sub-mounting force F3b by the chuck mechanism 26 as the sub-mounting means. At F3, it is attached to the transport head 22. With the miniaturization of the transport head 22, it tends to be difficult to increase the main mounting force F3 alone by the vacuum suction hole of the transport head 22 to be larger than the fixing force F1 shown in FIG. 5B. In the present embodiment, the sub-mounting force F3b by the chuck mechanism 26 as the sub-mounting means is applied to the main mounting force F3a, so that the total mounting force F3 (= F3a + F3b) is surely larger than the fixing force F1.

Further, by mounting the stamp tool 10 on the transport head 22 by the chuck mechanism 26, the stamp tool 10 (specifically, the convex portion of the stamp layer 12) is attached to the transport head 22 along the X axis. Positioned.

(Manufacturing method of display element array and equipment used for manufacturing)
Next, a method of manufacturing the display element array according to the present embodiment, an installation stage that is a part of the stamp tool positioning device, and other devices will be described.

First, the transport device 20 shown in FIG. 2A goes to pick up the stamp tool 10 arranged on the installation stage 82 shown in FIGS. 6A to 8. In this embodiment, at least three stamp tools are preferably prepared, for example for the three primary colors of light, R, G and B, and each stamp tool is preferably on the respective installation stage 82. It is installed in. Alternatively, for each stamp tool 10 for R, G and B, the installation stage 82 is replaced with respect to the base 81.

The base 81 of the installation stage 82 is positioned and fixed on the stamping table 100 shown in FIGS. 9 to 11. The stamping table 100 is positioned and fixed on, for example, the integrated table 110. In the example shown in FIGS. 9 to 11, it is shown that only a single stamping table is installed in the integrated table 110.

However, on the integrated table 110, for example, for each stamp tool 10 for R, G and B, there are three stamping tables 100 to which each base 81 for the three installation stages 82 is fixed. They may be arranged side by side at predetermined intervals in the axial direction.

In addition to the three stamp tables 100, there are three large stamp tables in which each base for each of the three installation stages is fixed for each stamp tool for R, G, and B of different sizes. They may be arranged side by side at predetermined intervals in the Y-axis direction. These three large stamp tables having different sizes are arranged outside the X-axis direction with respect to the three stamp tables 100 having a smaller size.

In the present embodiment, as shown in FIGS. 9 to 11, in addition to the stamping table 100, the element table 102 and the mounting table 104 are positioned and fixed on the integrated table 110. The element table 102 is a table in which the element forming substrate 30 shown in FIG. 5A is positioned and detachably fixed.

In addition, in FIGS. 9 to 11, it is shown that only a single element table 102 is installed. However, on the integrated table 110, for example, for each of the elements 32r, 32g, 32b for R, G, and B, the three element forming substrates 30 are positioned and detachably fixed for each of the three elements. The tables 102 may be arranged side by side at predetermined intervals in the Y-axis direction. Alternatively, in the present embodiment, the three element forming substrate element arrangement substrates 30 may be positioned and detachably fixed on the single element table 102. The element table 102 and the stamp table 100 are arranged apart from each other in the X-axis direction on the integrated table 110.

The mounting table 104 is a table in which the mounting board 70 shown in FIG. 5C1 is positioned and detachably fixed. The mounting substrate 70 is arranged on the integrated table 110 with respect to the element table 102 in the Y-axis direction. In this embodiment, a single mounting substrate 70 is positioned and fixed to the integrated table 110. Further, a plurality of mounting boards 70 may be positioned and fixed to the integrated table 110.

The upper surfaces of the tables 100, 102, and 104 positioned and fixed to the integrated table 110 are preferably substantially the same XY planes, but do not necessarily have to be the same planes. By making the upper surfaces of the tables 100, 102, and 104 substantially the same XY planes, the amount of movement along the Z axis of the transport head 22 that has moved relative to the upper side of the tables 100, 102, and 104 is substantially the same. This makes it easy to control the movement of the transport head 22 along the Z axis. Above each of the tables 100, 102, and 104 positioned and fixed to the integrated table 110 in the Z-axis direction, the transfer head 22 of the transfer device 20 can be moved and arranged in the X-axis and Y-axis directions. There is. The integrated table 110 is configured to be relatively movable along an XY plane including an X-axis and a Y-axis with respect to the transfer head 22.

In order to improve the positioning accuracy, the transfer head 22 moves only in the Z-axis direction with respect to the tables 100, 102 and 104, and the tables 100, 102 and 104 move XY with respect to the transfer head 22. It is preferable to move along a plane. Alternatively, the transfer head may move only in the X-axis or Y-axis and Z-axis directions, so that the tables 100, 102, and 104 move along the Y-axis or X-axis with respect to the transfer head 22. .. Alternatively, the transport head may move to the X-axis, Y-axis, and Z-axis, and the tables 100, 102, and 104 may be fixed without moving.

Further, although the integrated table 110 shown in FIGS. 9 to 11 is shown as a single member, it is not necessarily composed of a single member, but may be composed of a plurality of members. Further, the element table 102 and the mounting table 104 may be positioned and fixed to the same base and may move in the same direction (for example, in the Y-axis direction) in common. Further, apart from those tables 102 and 104, the integrated table 110 may be separated so that the stamping table 100 (including stamping tables of different sizes) moves, for example, in the Y-axis direction. In that case, it is preferable that the transport head 22 can move not only in the Z-axis direction but also in the X-axis direction.

In the following description, one installation stage 82 shown in FIGS. 6A to 8 will be described, but the same applies to the other installation stages. As shown in FIGS. 6A and 7, the block-shaped installation stage 82 is detachably installed on the base 81 by using, for example, bolts. As shown in FIG. 7, an accommodating recess 86 and an installation surface 84 are formed so as to surround the accommodating recess 86 at the upper portion of the installation stage 82 in the Z-axis direction. The accommodating recess 86 is formed, for example, by counterbore forming the central portion of the upper surface of the square pillar-shaped stage 82. As shown in FIG. 7, the stamp layer 12 of the stamp tool 10 completely penetrates into the accommodating recess 86.

Further, the installation surface 84 formed around the accommodating recess 86 has suction holes 85 formed at a plurality of locations in the circumferential direction, and the suctionable surface 14b of the support plate 14 is detachably attracted to the installation surface 84. It can be held. Further, a plurality of gas flow holes 83 formed in the stage 82 communicate with the accommodating recess 86. By adsorbing the adsorbable surface 14b of the support plate 14 to the installation surface 84, the accommodating recess 86 can be sealed except for the gas flow hole 83. Reason for gas By flowing the cleaning gas into the accommodation space 86 through the through hole 83, dust and impurities adhering to the stamp layer 12 can be discharged to the outside.

Two guide members 88 on each side are detachably attached by bolts or the like above both side surfaces substantially perpendicular to the X axis of the stage 82. An inclined surface 89 is formed on the upper side of the inner surface of the guide member 88. The tapered surface 16c of the adapter plate 16 shown in FIG. 1A is in contact with each inclined surface 89, and the tapered surface 16c of the adapter plate 16 facing the X-axis direction slides along each inclined surface 89. Therefore, the adapter plate 16 of the stamp tool 10 is dropped onto the stage 82 while sliding on the inclined surface 89, and the stamp layer 12 is accommodated inside the accommodating recess 86 as shown in FIG. 7. Further, the stamp tool 10 is roughly aligned with respect to the stage 82 in the X-axis direction.

As shown in FIG. 6A, the four guide members 88 are attached to the stage 82 so as to be located inside the both edges 16d of the adapter plate 16 of the stamp tool 10 in the Y-axis direction. Positioning members (second axis positioning mechanism) 90 in the Y-axis direction are arranged on both sides of the stage 82 in the Y-axis direction so as to be movable in the Y-axis direction. Each of the positioning members 90 is formed with a tip surface 92, and these tip surfaces 92 face each other along the Y axis, and as shown in FIG. 7, each of the tip surfaces 92 is an edge in the Y axis direction of the adapter plate 16. It is possible to contact the portion 16d. When the tip surface 92 abuts on the edge portion 16d of the adapter plate 16 in the Y-axis direction, the stamp tool 10 is positioned in the Y-axis direction with respect to the stage 82.

Next, a method of picking up the stamp tool 10 from the installation stage 82 shown in FIGS. 6A and 7 using the transfer device 20 shown in FIG. 2A will be described.

First, the positioning member 90 is used to position the stamp tool 10 in the Y-axis direction on the stage 82. After that, as shown in FIG. 9, the positional relationship of the XY axes between the stamp table 100 and the transfer head 22 is changed, the stage 82 shown in FIG. 8 moves together with the base 81, and the transfer device shown in FIG. 2A. The stage 82 is positioned below the transport head 22 of 20. The transfer head 22 may be moved without moving the stage 82, or both of them may be moved. The transport head 22 may be rotated around the Z-axis core, if necessary.

After the stamp tool 10 on the stage 82 is positioned below the Z-axis of the transfer head 22, the head 22 is moved below the Z-axis, and the lower end of the transfer head 22 is brought into contact with the mounting surface 16a of the adapter plate 16. , Vacuum suction by the transfer head 22 is started. Next, as shown in FIGS. 2A to 2B, the clamp mechanism 26 is closed, and the engaging surfaces 26b of the claw portion 26a are engaged with the tapered surfaces 16c located on both sides of the adapter plate 16 in the X-axis direction. Positioning in the X-axis direction is performed. Further, the engaging surface 26b of the claw portion 26a is provided with a stopper surface as needed, and the stopper surface abuts on the edge portion 16d in the X-axis direction of the adapter plate 16 in the X-axis direction of the stamp tool 10. Positioning may be performed.

After that, the pair of positioning members 90 shown in FIG. 7 are opened in the Y-axis direction to release the contact of the tip surface 92 with the edge portion 16d of the adapter plate 16. Before and after that, the suction hole 85 of the stage 82 releases the support plate 14 from being attracted to the installation surface 84 of the stage. After that, if the transport head 22 is moved above the Z-axis, the stamp tool 10 is positioned at the lower end of the transport head 22 on the X-axis and the Y-axis as shown in FIG. 2B, and the stamp tool 10 is positioned. The levelness is maintained.

Next, as shown in FIG. 2B, with the stamp tool 10 attached to the transport head 22, the transport device 20 is relatively moved in the X-axis and Y-axis directions, and as shown in FIG. 10, the element table 102 Position it on top. As shown in FIG. 10, the multi-element transfer device 200 has a stamp on the surface of the element forming substrate 30 (see FIG. 3A) installed on the element table 102 and a stamp of the stamp tool 10 held on the transfer head 22. It has an image pickup apparatus 122 as an image pickup means capable of simultaneously taking images in two directions capable of entering the space between the layers 12. The image pickup apparatus 122 can be retracted and moved from below the transport head 22. Further, a similar image pickup apparatus 122 may be inserted between the transfer heads 22 when they are moved onto the mounting table 104.

As shown in FIG. 3A, the image pickup apparatus 122 can simultaneously image the convex portion 11 (see FIG. 2B) on the stamp surface of the stamp layer 12 and the surface of the element forming substrate 30. As shown in FIG. 10, the image pickup device 122 is communicably connected to the control device 120 as a control means. The control device 120 receives a detection signal from the image pickup device 122 and controls a fine adjustment mechanism (not shown) that changes the relative position between the transfer head 22 and the element forming substrate 30.

The fine adjustment mechanism finely adjusts and moves the relative position of the transfer head 22 with respect to the substrate 30 along the X-axis and the Y-axis, and finely adjusts the relative angle of the transfer head 22 itself with respect to the substrate 30 around the Z axis. And may include a mechanism for moving. Further, the mechanism for finely adjusting and moving the relative positions of the transfer head 22 with respect to the substrate 30 along the X-axis and the Y-axis is the X of the transfer head 22 with respect to the element table 102 (mounting table 104 or stamp table). It may be included in a main drive that changes the relative position along the axis and the Y axis. The main drive device and the fine adjustment mechanism are controlled by the control device 120. Further, the control device 120 also controls the movement of the transfer device 20 including the transfer head 22 shown in FIG. 8 in the Z-axis direction, the drive of the chuck mechanism 26, the drive of the positioning member 90 shown in FIG. 6A, and the like.

As shown in FIG. 3A, the element forming substrate 30 is positioned and arranged on the element table 102 shown in FIG. 10. As shown in FIG. 5A,, for example, a red light emitting element 32r, a green light emitting element 32g, or a blue light emitting element 32b is built on the surface of the element forming substrate 30. The substrate 30 may be different depending on, for example, the type of element (blue light emitting element, red light emitting element, green light emitting element, etc.), but for example, a sapphire substrate, a glass substrate, a GaAs substrate, a SiC substrate, or the like is used.

In this embodiment, the elements 32r, 32g, 32b are, for example, micro LED elements. In the following description, only the element 32r will be described, but the same operation is performed for the other elements 32g and 32b by using different stamp tools 10. The stamp tool 10 is preferably prepared for each type of different elements 32r, 32g, 32b, but the transfer head 22 can be used in common.

The standby stamp tool 10 is installed, for example, on the stage 82 shown in FIGS. 6A and 7, and the stamp layer 12 is sealed inside the accommodating recess 86 and kept in a clean state. The standby stamp tool 10 that is not held by the transfer head 22 may be arranged on, for example, the stamp table 100 shown in FIG. 9, but is arranged next to the table 100 shown in FIG. 9 along the Y axis. They may be placed in different stamp tables.

The image pickup apparatus 122 shown in FIG. 3A simultaneously images the convex portion 11 (see FIG. 2B) on the stamp surface of the stamp layer 12 and the surface of the element forming substrate 30, and controls the detection signal as shown in FIG. The device 120 receives the signal and uses the fine adjustment mechanism to change the relative position between the transfer head 22 and the element forming substrate 30 shown in FIG. 3A. As a result, the arrangement of the convex portions 11 on the stamp surface of the stamp layer 12 and the arrangement of the elements 32r formed on the surface of the substrate 30 are accurately aligned. As a result, it becomes possible to hold a large number of small-sized elements 32r on the stamp surface of the stamp layer 12 with high accuracy.

After that, as shown in FIGS. 3A to 3B, the image pickup device 122 is moved from the lower position of the transfer head 22 to retract, and then the transfer device 20 is moved downward in the Z-axis direction to make the stamp tool 10 convex. The portion 11 is pressed against the upper surface of the element 32r of the substrate 30. As a result, the element 32r adheres to the convex portion 11. After that, as shown in FIG. 3C, the stamp tool 10 is lifted upward in the Z-axis direction together with the transfer device 20. As a result, as shown in FIG. 5B, the element 32r adheres to each convex portion 11, and the element 32r is picked up from the substrate 30 together with the convex portion 11. The element 32r left on the substrate 30 is later picked up by the stamp layer 10 of the transport device 20 in the same manner.

Next, the element 32r picked up by the convex portion 11 of the stamp layer 10 is conveyed and mounted by the transfer device 20 on, for example, the mounting substrate (the substrate may be a sheet / the same applies hereinafter) 70 shown in FIG. 5C1. .. The mounting board 70 shown in FIG. 5C1 is positioned and arranged on the mounting table 104 shown in FIG. Therefore, as shown in FIGS. 10 to 11, the main drive device is driven by the control device 120, and the element table 102 and the mounting table 104 are relatively moved in the Y-axis direction with respect to the transfer head 22 to move the transfer head. 22 is located on the mounting table.

After that, the array of the elements 32r adhered to the convex portion 11 of the stamp layer 12 shown in FIG. 5B is transferred onto the mounting substrate 70 shown in FIG. 5C1. Therefore, the element 32r adhered to the convex portion 11 of the stamp layer 12 is pressed against the surface of the mounting substrate 70, and then the stamp layer 12 is lifted together with the transport device 20. As a result, a plurality of elements 32r are simultaneously transferred to the surface of the mounting substrate 70. If the above operation is repeated according to the size of the mounting substrate 70, a large number of elements 32r are arranged in a matrix on the mounting substrate 70. The stamp tool 10 after use is returned to the stage 82 of the original stamp tool holding device 80 installed on the stamp table 100 by the transfer head 22.

As shown in FIG. 5C1, the other elements 32g and 32b are also conveyed to the substrate 70 in the same manner as described above by using the stamp tool 10 which is different for each type of the elements 32g and 32b. The three elements 32r, 32g, and 32b of R, G, and B constitute one pixel unit, and the pixel units are arranged in a matrix to form a color display screen.

It is preferable that the surface of the mounting substrate 70 is coated with an anisotropic conductive paste (ACP). Alternatively, it is preferable that an anisotropic conductive film (ACF) is arranged. As shown in FIG. 5C1, the elements 32r, 32 g. After the 32b is placed on the substrate 70 via the ACP or ACF, the elements 32r, 32g, 32b may be pressed in the direction of the substrate 70 to heat them by using a heating and pressurizing device (not shown). .. As a result, the terminals of the elements 32r, 32g, and 32b can be connected to the circuit pattern of the mounting board.

In the transfer device 20 according to the present embodiment, the attachment force F3 of the adapter plate 16 to the attachment surface 16a by the transfer head 22 shown in FIG. 2B is larger than the fixing force F1 shown in FIG. 5B, and the protrusion of the stamp layer 12 with respect to the element 32r. The adhesive force F2 of the portion 11 is larger than the fixing force F1. Therefore, the stamp tool 10 can easily pick up and convey the element 32r arranged on the surface of the substrate 30 from the substrate 30 without being left on the substrate 30 side.

Further, in the present embodiment, the mounting force F3 on the mounting surface 16a of the adapter plate 16 by the transport head 22 shown in FIG. 2B is a main mounting force F3a corresponding to the suction force of the vacuum suction hole and a clamp mechanism as a sub-mounting means. It is the total with the auxiliary mounting force F3b by 26. That is, in the present embodiment, only by providing the clamp mechanism 26 on the general transport head 22 having the vacuum suction hole, the mounting force F3 of the transport head 22 on the mounting surface 16a of the adapter plate 16 is measured by the element shown in FIG. 5B. It becomes easy to make the fixing force F1 of 32r to the substrate 30 larger than that of F1.

Further, in the present embodiment, tapered surfaces 16c whose outer diameter becomes smaller toward the stamp layer 12 are formed on both side surfaces of the adapter plate 16 in the X-axis direction. Further, the claw portion 26a of the clamp mechanism 26 can be engaged with the tapered surface 16c. With this configuration, the claw portion 26a of the clamp mechanism 26 can be easily detachably engaged with the tapered surface 16c on the side surface of the adapter plate 16. Further, the mounting force F3 of the stamp tool 10 on the transport head 22 by the clamp mechanism 26 can be increased. Further, by detachably engaging the claw portion 26a of the clamp mechanism 26 with the tapered surface 16c on the side surface of the adapter plate 16, the stamp tool 10 can be positioned with respect to the transport head 22 in the X-axis direction at the same time.

Further, by forming tapered surfaces 16c whose outer diameter becomes smaller toward the stamp layer 12 on both side surfaces of the adapter plate 16 in the X-axis direction, the guide installed on the upper part of the stage 82 shown in FIG. 6A. Rough positioning of the stamp tool 10 in the X-axis direction along the inclined surface 89 of the member 88 becomes easy. In particular, as shown in FIG. 1A, the maximum width of the adapter plate 16 in the X-axis direction is larger than the width of the support plate 14, so that the inclined surface 89 of the guide member 88 and the tapered surface 16c of the stamp tool 10 Is easier to engage.

Further, since the insertable surface 14c is present on the support plate 14 of the stamp tool 10, the claw portion 26a of the clamp mechanism 26 can be easily detachably engaged with the tapered surface 16c on the side surface of the adapter plate 16. Further, since the suctionable surface 14b is present on the support plate 14 of the stamp tool 10, the support plate 14 can be adsorbed on the installation surface 84 of the stage 82 as shown in FIG. 7, and the stamp layer 12 is accommodated in the recess. It is easy to seal and hold inside the 86. The adsorbable surface 14b can be easily formed around the stamp layer 12 by forming the support plate 14 with a glass plate or the like.

The stamp tool 10 further includes a support plate 14 to which the stamp layer 12 is fixed and the adapter plate 16 is interchangeably attached. With this configuration, only the support plate 14 to which the stamp layer 12 is fixed can be replaced from the adapter plate 16 without replacing the entire stamp tool 10. Therefore, it becomes easy to prepare the stamp tool 10 having different types of stamp layers 12 at low cost. Further, by using the adapter plate 16 in common, it is not necessary to use different types of transfer heads according to the stamp tool, and the overall configuration of the transfer device can be simplified.

In the present embodiment, the stamp layer 12 is formed with a plurality of convex portions 11 corresponding to the elements 32r (32g, 32b), and the elements 32r (32g, 32b) are detachably adhered to each convex portion 11. Will be done. With this configuration, a large number of elements 32r (32g, 32b) can be taken out from the substrate 30 at the same time. In the method for manufacturing an element array of the present embodiment, an element array having a large number of elements 32r (32g, 32b) can be easily manufactured.

Further, in the present embodiment, as shown in FIG. 6A, the installation stage 82 is replaceably mounted on the base 81. Therefore, when the stage 82 corresponding to the stamp tool 10 is prepared and replaced with a different type of stamp tool 10, only the stage 82 may be replaced. Since the flatness of the stage 82 is secured with respect to the base 81, it is not necessary to adjust the flatness of the stamp tool when the stamp tool 10 is replaced.

Therefore, in the present embodiment, the transfer head 22 can satisfactorily pick up the stamp tool 10 from the installation stage 82 without causing a suction error by the transfer head 22 or a gripping error by the clamp mechanism 26.

As shown in FIG. 7, in the stamp tool holding device 80 according to the present embodiment, the stamp tool 10 is provided with a negative pressure by introducing a negative pressure into the suction hole 85 in a state where the stamp layer 12 is housed inside the storage recess 86. The adapter plate 14 is detachably attached to the installation surface 84. As a result, the inside of the storage recess 86 is sealed, and dust and dirt are less likely to adhere to the stamp surface (convex portion 11) of the stamp layer 12 housed inside the storage recess 86, and the stamp surface is made clean. It becomes possible to install the stamp tool 10 while keeping it.

Further, in the present embodiment, the installation stage 82 is detachably fixed to the base 81. The stamp tool 10 needs to be replaced in response to a customer's request, a substrate 30 on which an element as a transfer target element is built, or the like. By preparing a plurality of installation stages 82 according to the change of the stamp tool 10, the size of the stamp tool 10 can be changed by exchanging only the installation stage 82 without replacing the base 81. Can be done. Further, each installation stage 82 has a flatness with respect to the base 81, and it is not necessary to adjust the flatness even when the stamp tool 10 is replaced.

Further, in the present embodiment, the installation stage 82 is formed with a gas flow hole 83 that communicates with the space in the accommodation recess 86 and replaces the gas in the accommodation recess 86. By replacing the gas in the recess 86, dust and dirt adhering to the surface of the stamp layer 12 housed inside the storage recess 86 can be discharged together with the gas, and the cleanliness of the stamp layer 12 can be improved. improves.

As shown in FIG. 6A, in the present embodiment, in the upper part of the installation stage 82, a guide member that guides the stamp layer 12 of the stamp tool 10 into the inside of the accommodating recess 86 at least along the X axis. 88 is attached. By providing the guide member 88 on the installation stage 82, it becomes easy to roughly position the stamp tool 10 at least along the X axis. Further, when the stamp tool 10 is picked up by the transport head 22, the stamp tool 10 can be easily positioned with respect to the transport head 22.

In the present embodiment, the guide member 88 is detachably attached to both sides of the installation stage 82 along the X axis, and each guide member 88 is inclined so as to be engaged with the tapered surface 16c of the stamp tool 10. A surface 89 is formed. With such a configuration, it becomes easier to roughly position the stamp tool 10 at least along the X axis. Further, when the stamp tool 10 is picked up by the transfer head 22, the positioning of the stamp tool 10 with respect to the transfer head 22 becomes easier.

In the present embodiment, at least two guide members 88 are mounted on both sides of the installation stage 82 along the X axis, and the chuck mechanism 26 shown in FIG. 2A is provided along the gap between the two guide members 88. Claw portion 26a can be inserted. With this configuration, it is possible to perform highly accurate positioning of the stamp tool 10 at least along the X axis. Further, when the stamp tool 10 is picked up by the transfer head 22, the positioning of the stamp tool 10 with respect to the transfer head 22 (particularly, the positioning along the X axis) becomes more accurate.

As shown in FIGS. 6A to 6C, a pair of sides of the installation stage 82 that can abut and move away from the edge 16d of the stamp tool 10 installed on the upper part of the installation stage 82 along the Y-axis direction. The positioning member 90 is arranged. With this configuration, it is possible to perform highly accurate positioning of the stamp tool 10 along the Y axis in addition to the X axis. Further, when the stamp tool 10 is picked up by the transfer head 22, the positioning of the stamp tool 10 with respect to the transfer head 22 becomes easier.

Further, the stamp tool positioning device of the present embodiment includes the installation stage 82 shown in FIG. 7, the transport head 22 shown in FIG. 8, the clamp mechanism 26 as the first axis positioning mechanism, and the positioning as the second axis positioning mechanism. It has a member 90. That is, in the present embodiment, the positioning of the stamp tool 10 along the Y axis is performed by using the positioning member 90 with the installation stage 82 as a reference, and the stamp tool 10 is positioned along the X axis. As shown in FIG. 2B, the positioning can be performed by using the clamp mechanism 26 with the transfer head 22 as a reference. Therefore, the positioning mechanism for the transport head 22 can be simplified and the transport head can be made lighter. As a result, the drive control of the transfer head 22 becomes easy, and the transfer position accuracy by the transfer head 22 is improved.

Further, in the stamp tool positioning device of the present embodiment, the stamp tool 10 is positioned along the Y axis with respect to the installation stage 82, but the stamp tool 10 does not need to be accurately positioned along the X axis. Therefore, the positioning mechanism on the installation stage 82 can be simplified, and the required space on the installation stage 82 can be minimized. Therefore, the movement control of the installation stage 82 becomes easy. Further, the alignment between the installation stage 82 and the transfer head 22 may be performed with high accuracy only along the Y axis, for example, and the alignment along the X axis may be rough. This is because the positioning of the stamp tool 10 along the X axis is performed by the clamp mechanism 26 with reference to the transport head 22.

Further, in the present embodiment, the clamp mechanism 26 also serves as a mounting means for detachably mounting the stamp tool 10 on the transport head 22. Since the clamp mechanism 26 as the mounting means also serves as the positioning mechanism, it is not necessary to separately equip the transport head 22 with the positioning mechanism as a component other than the mounting means.

In the multi-element transfer device 200 according to the present embodiment shown in FIG. 10, as shown in FIG. 8, the stamp tool 10 is placed on the stage 82 of the stamp table 100 so that the mounting surface 16 faces upward along the Z axis. It is attached. Further, as shown in FIG. 10, the element table 102 and the mounting table 104 can move relative to the transfer head 22 at least along the Y axis, and the stamp table 100 can move relative to the transfer head 22. Can move relative to at least along the X-axis.

Therefore, the transport head 22 is relatively movable on the stamp table 100, the element table 102, and the mounting table 104. Further, using the stamp tool 10 held by the transport head 22, a large number of elements 32r (32 g, 32b) can be mounted from the surface of the element forming substrate 30 of the element table 102 to the mounting substrate 70 of the mounting table 104. It can be transferred to the surface at the same time. Further, the stamp tool 10 after the element 32r is transferred from the element forming substrate 32r to the mounting substrate 70 is returned to the installation stage 82 of the original stamping table 100 by using the transfer head 22. As described above, in the multi-element transfer device 200 of the present embodiment, a large number of elements 32r (32 g, 32b) can be efficiently transferred by using the stamp tool 10.

Further, when transferring a plurality of types of elements 32r, 32g, 32b from a plurality of element forming substrates 30 corresponding to each to a single mounting substrate 70, a stamp tool 10 different for each type is used. Therefore, the respective elements 32r, 32g, and 32b can be transferred. Therefore, it is easy to transfer elements 32r, 32g, 32b of different types to a single mounting substrate 70 in a set arrangement, and for example, an element array with few pixel defects can be efficiently manufactured. Is easy.

The method for manufacturing the element array of the present embodiment includes a step of transporting the stamp tool 10 positioned by the stamp tool positioning device by the transport head 22 and a step of transporting the stamp tool 10 by the transport head 22.
It has a step of simultaneously taking out elements 32r (32g, 32b) as a plurality of transfer target elements from the substrate 30 and transporting them by using the stamp tool 10 mounted on the transport head 22.

In the method for manufacturing an element array of the present embodiment, an element array having a large number of elements positioned and arranged with high accuracy can be easily manufactured in a short time and at low cost.

A method for manufacturing an element array according to another embodiment is as follows.
A step of preparing the stamp tool holding device 80 with the same number or more as the number of substrates 30 on which each of the plurality of types of elements as the transfer target element is arranged, and
Each stamp tool holding device 80 has a step of installing a stamp tool 10 prepared for each of a plurality of types of the elements, and a step of installing the stamp tool 10.
The stamp tool 10 held by each stamp tool holding device 80 corresponding to each board 30 is picked up by the transfer head 22 from the stamp tool holding device 80, and transferred from the board 30 corresponding to the picked up stamp tool 10. A process of simultaneously taking out and transporting a plurality of elements 32r (or 32g, 32b) using the stamp tool 10 mounted on the head 22.
After the plurality of elements 32r (or 32g, 32b) are simultaneously taken out and conveyed, the stamp tool 10 after the plurality of elements 32r (or 32g, 32b) are taken out is transferred to the corresponding empty stamp tool holding device 80. It has a step of returning.

In the method for manufacturing an element array according to the present embodiment, an element array in which a large number of types of elements 32r, 32g, 32b are arranged can be easily manufactured in a short time and at low cost. Moreover, in order to install and store the stamp tool 10 used for each substrate 30 corresponding to the plurality of types of elements 32r, 32g, 32b in the dedicated stamp tool holding device 80, the elements 32r, 32g, 32b It is easy to maintain high quality of the stamp surface of each stamp tool 10 while effectively preventing misalignment and the like.

As shown in FIG. 1B of the second embodiment , in the stamp tool 10a used in the transport device of the present embodiment, a shim plate for adjusting the parallelism of the support plate 14 between the stamp layer 12 and the adapter plate 16. 18 is intervening. An inclined surface 14a is formed on a part of the side surface of the support plate, and the shim plate 18 is engaged with the inclined surface 14a so that the parallelism of the support plate 14 can be adjusted.

Other configurations and operational effects of the transport device and the stamp tool of the present embodiment are the same as those of the first embodiment, and detailed description thereof will be omitted.

As shown in FIG. 4A of the third embodiment , in the transport device of the present embodiment, the elastically deformable engaging convex portion 26c is mounted on the engaging surface 26b of the claw portion 26a of the chuck mechanism 26, and the engaging convex portion 26c thereof is engaged with the engaging surface 26b. The convex portion 26c can be engaged with the tapered surface 16c of the adapter plate 16. The engaging convex portion 26c is made of, for example, a spring material, and may project from the engaging surface 26b in an arc shape. Further, as shown in FIG. 4B, the engaging surface 26b does not necessarily have to be a flat surface, and may be a convex curved surface that can be engaged with the tapered surface 16c of the adapter plate 16. Other configurations and effects of the transport device and the stamp tool of the present embodiment are the same as those of the first embodiment or the second embodiment, and detailed description thereof will be omitted.

Fourth Embodiment In this embodiment, a method of mounting an element by a transfer method using the devices according to the first to third embodiments described above will be described. In the following description, the description of the portion overlapping with the first to third embodiments described above will be omitted.

In the method of the present embodiment, as shown in FIG. 5B, the element 32r picked up by the convex portion 11 of the stamp layer 10 is transferred onto, for example, the first transfer substrate (second substrate) 50 shown in FIG. 5C2. It is conveyed by 20 and placed on the adhesive layer 52.

The array of elements 32r adhered to the convex portion 11 of the stamp layer 12 shown in FIG. 5B is transferred onto the adhesive layer 52 of the substrate 50 made of the adhesive sheet or the like shown in FIG. 5C2. Therefore, the element 32r adhered to the convex portion 11 of the stamp layer 12 is pressed against the surface of the adhesive layer 52, and then the stamp layer 12 is lifted together with the transport device 20. As a result, the plurality of elements 32r are simultaneously transferred to the surface of the adhesive layer 52. Before that, the transfer device 20 shown in FIG. 3C is moved onto the substrate 50 shown in FIG. 5C2 by the transfer mechanism of the transfer device 20.

The adhesive strength of the adhesive layer 52 is adjusted so that the adhesive strength of the adhesive layer 52 of the adhesive sheet made of the substrate 50 is larger than the adhesive strength of the convex portion 11. The adhesive layer 52 is made of an adhesive resin such as natural rubber, synthetic rubber, acrylic resin, and silicone rubber, and its thickness z4 is preferably 0, which is the height z2 of the element 32r (see FIG. 5B). It is about 5 to 2.0 times. In addition, in order to smooth the movement of the element 32r from the convex portion 11 to the adhesive layer 52, an operation (for example, applying heat) for facilitating the peeling of the element 32r from the convex portion 11 may be applied.

Other elements 32g and 32b are also transferred to the adhesive layer 52 of the substrate 50 in the same manner as described above. The three elements 32r, 32g, and 32b of R, G, and B constitute one pixel unit, and the pixel units are arranged in a matrix to form a color display screen.

Next, as shown in FIG. 5D, the entire array of the three elements 32r, 32g, 32b arranged on the surface of the first transfer substrate 50 is transferred to the adhesive layer 62 of the second transfer substrate 60. , Each terminal of the element 32r, 32g, 32b is arranged so as to face the outside of the substrate 60. For this transfer, for example, a method such as a laser lift method may be used, or a method such as transfer using a difference in adhesive strength or transfer accompanied by heat peeling may be used. A tin-plated film may be formed on each terminal by an electroless plating method or the like while the terminals of the elements 32r, 32g, and 32b face the outside of the substrate 60.

Next, as shown in FIGS. 5E and 5F, the entire arrangement of the three elements 32r, 32g, and 32b is transferred from the adhesive layer 62 of the substrate 60 to the mounting substrate 70. For the transfer, for example, a method such as a laser lift method may be used, or a method such as a transfer using a difference in adhesive strength or a transfer accompanied by heat peeling may be used.

After transfer, in order to connect the terminals of each element 32r, 32g, 32b to the circuit pattern of the mounting board, for example, the surface of the mounting board 70 is coated with an anisotropic conductive paste (ACP). Or, it is preferable to arrange an anisotropic conductive film. As shown in FIG. 5F, the elements 32r, 32g. After the 32b is placed on the substrate 70 via the ACP or ACF, the elements 32r, 32g, 32b may be pressed in the direction of the substrate 70 to heat them by using a heating and pressurizing device (not shown). As a result, the terminals of the elements 32r, 32g, and 32b can be connected to the circuit pattern of the mounting board.

The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

For example, the stamp tool is not limited to the stamp tool 10 of the above-described embodiment, and other stamp tools can be used. Further, the transport head 22 may use an electrostatic suction mechanism, a fitting mechanism, a screwing mechanism, or the like as the first axis positioning mechanism other than the clamp mechanism 26. By providing these mechanisms on the transport head, the stamp tool 10 can be easily positioned with respect to the transport head 22.

Further, in the above-described embodiment, vacuum suction by a vacuum suction hole is used as the main mounting means of the transfer head 22, but in the present invention, it is not always necessary to use vacuum suction, and the first shaft such as the clamp mechanism 26 is used. The stamp tool 10 may be detachably attached to the transport head 22 only by the positioning mechanism. Further, in the above-described embodiment, if positioning is possible without using the clamp mechanism 26 and the stamp tool 10 can be detachably held with sufficient holding force with respect to the transport head 22, the transport head can be held. A vacuum suction mechanism or an electrostatic suction mechanism may be attached.

Further, in the above-described embodiment, as shown in FIG. 8, a single stamping table 100 is prepared for each single installation stage 82, but these plurality of stamping tables 100 are all the same. As it is driven along the X-axis and / or the Y-axis, it can be regarded as a single stamping table 100. Of course, three or more installation stages 82 may be arranged on a single stamp table 100. Similarly, as shown in FIG. 3A, a single element table 102 is prepared for each single element forming substrate 30, but the plurality of element tables 102 are all the same. Since it is driven along the X-axis and / or the Y-axis, it can be regarded as a single element table 102. Of course, three or more element forming substrates 30 may be arranged on a single element table 100.

Further, the transport device 20 having the stamp tool positioning device according to the present embodiment is used for picking up the element 32r (32 g, 32b) from the element forming substrate 30, but the application is not limited to this, and the laser lift from the substrate 30. It may be used for picking up the element 32r (32g, 32b) from the substrate (sheet) with the adhesive layer transferred by the method or the like.

Further, the transport device 20 having the stamp tool positioning device according to the present embodiment can also be used for picking up elements other than the elements 32r, 32g, 32b for red, green and blue light emission. Examples of other display elements include fluorescent elements and the like. Further, the other element is not limited to the display element, but may be an electronic element such as a light receiving element, a ceramic capacitor, a chip inductor, or a semiconductor element.

10 ... Stamp tool 11 ... Convex part 12 ... Stamp layer 14 ... Support plate 14a ... Inclined surface 14b ... Adsorbable surface 14c ... Insertable surface 15 ... Adhesive layer 16 ... Adapter plate 16a ... Mounting surface 16b ... Adhesive surface 16c ... Tapered Surface 16d ... Edge 18 ... Sim plate 20 ... Conveyor device 22 ... Conveyor head 24 ... Suction surface 26 ... Chuck mechanism (first axis positioning mechanism)
26a ... Claw portion 26b ... Engagement surface 26c ... Engagement convex portion 28 ... Opening / closing mechanism 30 ... Element forming substrate (first substrate / element placement substrate)
32r, 32g, 32b ... Element 50 ... First transfer substrate (second substrate / sheet)
52 ... Adhesive layer 60 ... Second transfer substrate (sheet)
62 ... Adhesive layer 70 ... Mounting board (second board / sheet)
80 ... Stamp tool holding device 81 ... Base 82 ... Stage 83 ... Gas flow hole 84 ... Installation surface 85 ... Suction hole 86 ... Containment recess 88 ... Guide member 89 ... Inclined surface 90 ... Positioning member (second axis positioning mechanism)
92 ... Tip surface 100 ... Stamp table 102 ... Element table (first table)
104 ... Mounting table (second table)
110 ... Integrated table 120 ... Control device (control means)
122 ... Imaging device (imaging means)
200 ... Multi-element transfer device

Claims (13)

A stamp table on which at least one stamp tool having a stamp layer having a portion to which a plurality of elements to be transported can be detachably adhered is detachably installed.
A transport head capable of picking up at least one stamp tool installed on the stamp table,
A first table on which the first substrate on which the element to be transported is arranged is detachably fixed, and a first table.
It is a multi-element transfer device having a second table on which a second substrate having a surface on which the transfer target element arranged on the first substrate is transferred and transferred by the stamp tool is detachably fixed. hand,
The stamp table and the first table are arranged along the first axis.
The first table and the second table are arranged along a second axis intersecting the first axis.
The transport head is movable relative to at least the stamping table along a third axis that intersects both the first axis and the second axis.
The stamp tool has a mounting surface on the opposite side of the stamp layer to which the transport head can be detachably mounted.
The stamp tool is mounted on the stamp table so that the mounting surface faces upward along the third axis.
The first table and the second table can move relative to the transfer head at least along the second axis.
The stamping table is a multi-element transfer device that can move relative to the transfer head at least along the first axis. The first substrate includes a plurality of element-arranged substrates on which different types of the elements to be transported are arranged.
The second substrate is a single mounting substrate or a single transfer substrate.
The stamp table includes a plurality of installation stages that detachably hold stamp tools corresponding to the plurality of element placement boards.
The transport head
A stamp tool corresponding to each of the plurality of element placement boards is picked up from the corresponding installation stage, and the stamp tool is picked up.
Using the picked-up stamp tool, the element to be transported is taken out from the corresponding element placement board.
As if to transfer the taken-out transport element to the second substrate,
The multi-element transfer device according to claim 1, further comprising a control means for driving and controlling the positional relationship between the transfer head, the first table, the second table, and the stamp table. When the transport head holding the stamp tool is located on the first substrate, two directions capable of entering the space between the surface of the first substrate and the stamp layer of the stamp tool. It also has an imaging means capable of simultaneous imaging, and has
The multi-element transfer device according to claim 1 or 2, wherein the image pickup means simultaneously images the stamp surface of the stamp layer and the surface of the first substrate. The multi-element transfer device according to claim 3, further comprising a fine adjustment mechanism for changing the relative position between the transfer head and the first substrate based on the detection signal captured by the image pickup means. The multi-element transfer device according to claim 4, wherein the fine adjustment mechanism changes the relative rotation angle of the transfer head around the third axis based on the detection signal captured by the image pickup means. A first axis positioning mechanism that positions and adjusts the relative position of the stamp tool with respect to the transfer head along the first axis.
The multi according to any one of claims 1 to 5, further comprising a second axis positioning mechanism that positions and adjusts the relative position of the stamp tool with respect to the stamp table along the second axis. Element transfer device. The multi-element transfer device according to claim 6, wherein the first axis positioning mechanism also serves as a mounting means for mounting the stamp tool on the transport head in a detachable manner. The multi according to claim 7, wherein the mounting means is provided on opposite sides to each other along the first axis of the transport head, and has a chuck mechanism provided so as to be movable in contact with and away from the stamp tool. Element transfer device. The second axis positioning mechanism is
At least a pair of second positioning members arranged on both sides of the installation stage fixed to the stamp table along the second axial direction and capable of abutting and moving away from the stamp tool installed on the installation stage. The multi-element transfer device according to any one of claims 6 to 8. The installation stage has an installation surface in which an accommodating recess for accommodating the stamp layer is formed, and a part of the stamp tool located around the stamp layer can be detachably attracted to the installation surface. The multi-element transfer device according to claim 9, wherein the suction holes are formed. The multi-element transfer device according to claim 9 or 10, wherein the installation stage is equipped with a guiding means for guiding the stamp tool along at least the first axis. A method for manufacturing an element array for manufacturing an element array by simultaneously taking out and transferring a plurality of transfer target elements from a substrate by using the multi-element transfer device according to any one of claims 1 to 11. The process of preparing an installation stage in which the stamp tool is detachably held with the same number or more as the number of element placement boards on which each of multiple types of elements is placed, and
A process of installing stamp tools prepared for each of a plurality of types of the elements on each of the installation stages, and a process of installing the stamp tools.
The stamp tool held on each installation stage corresponding to each element placement board is picked up by the transfer head from the installation stage, and is attached to the transfer head from the element placement board corresponding to the picked up stamp tool. The process of simultaneously taking out and transporting a plurality of the elements using a stamp tool, and
A method for manufacturing an element array, comprising a step of simultaneously taking out and transporting a plurality of the elements, and then returning the stamp tool after the plurality of the elements are taken out to the corresponding empty installation stage.

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