CN105589608A - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
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- CN105589608A CN105589608A CN201410557940.0A CN201410557940A CN105589608A CN 105589608 A CN105589608 A CN 105589608A CN 201410557940 A CN201410557940 A CN 201410557940A CN 105589608 A CN105589608 A CN 105589608A
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- edge
- substrate
- board treatment
- substrate board
- projection
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Abstract
The invention relates to the field of panel display, in particular to a substrate processing device. The Substrate processing device comprises a bearing table board and an illuminating element near the bearing table board. At least a first surface is arranged on the bearing table board. One first surface is at least provided with a first bearing area used for bearing a first substrate and a second substrate combined by means of a combination layer. One first substrate is located between one first substrate and one second substrate. One first substrate is at least provided with a first edge. The position where one first bearing area is located near one first edge is at least provided with one opening. The illuminating element is used for sending light beams. The light beams are used for radiating one first edge via one opening.
Description
Technical field
The present invention relates to technical field of flat panel display, relate in particular to a kind of substrate board treatment.
Background technology
At present, capacitive touch screen due to wear-resistant, life-span is long and also in light loss and system behavio(u)r moreTool advantage, it has been subject to pursuing of market, and is widely used in portable type electronic product, medicine equipment, silverThe fields such as row terminal system.
The production of capacitance type touch-control panel is by sensor base material (there is electrically conducting transparent circuit on surface) and cover plateThe adhesive composition that is bonded together for glass, conventional method is on sensor base material, to put adhesive, willCover-plate glass is aimed at the laminating of sensor base material, then the module heating the level that thoroughly do not merge left standstill,Adhesive is merged fully between two-layer panel, and this technique is called levelling.
But in above-mentioned levelling technique, because the mobility of described adhesive is larger, the glue that easily overflows is to phaseOn the equipment of pass, and be difficult to remove the glue that overflows, thereby can have influence on follow-up precuring, solidify and otherThe laminating operation of contact panel and glass cover-plate.
Summary of the invention
In view of this, the invention provides a kind of substrate board treatment that is conducive to prevent excessive glue.
Described processing substrate provided by the invention at least comprises: a carrying platen and and be arranged on described carryingNear light-emitting component platen, described carrying platen at least has a first surface, on described first surface extremelyHave less one first bearing area, described the first bearing area is for carrying by one the of a binder course combinationOne substrate and a second substrate, described first substrate between described first surface and second substrate, described inFirst substrate at least has one first edge, and near that described the first bearing area is positioned at described the first edge extremelyHave less an opening, described light-emitting component is used for sending light beam, and described light beam is for irradiating by described openingTo described the first edge.
In described substrate board treatment provided by the invention, described light-emitting component is arranged at described carrying platenBelow, described light beam points to described opening by described light-emitting component.
In described substrate board treatment provided by the invention, described the first edge is at described the first table at least partlyProjection on face falls into the projection of described opening on described first surface.
In described substrate board treatment provided by the invention, described first substrate is rectangular, and it also has secondEdge, the 3rd edge and the 4th edge, described the first edge, the first edge, the 3rd edge and the 4th edgeEnd to end successively, jointly form the edge of described first substrate, described the first bearing area is positioned at instituteNear of stating the second edge, the 3rd edge and the 4th edge at least has respectively an opening, at least partly described inThe second edge, the 3rd edge and the 4th projection of edge on described first surface fall into respectively described opening and existIn projection on described first surface.
In described substrate board treatment provided by the invention, described first surface has multiple described the first carryingsRegion, every described the first bearing area is for carrying described first substrate and the second substrate of a combination, multipleDescribed the first bearing area is matrix and is arranged in described first surface.
In described substrate board treatment provided by the invention, described binder course is liquid glue layer.
In described substrate board treatment provided by the invention, linearly type of described the first edge, described opening isStrip, the long limit of described strip and described the first edge be arranged in parallel.
In described substrate board treatment provided by the invention, the throwing of described first substrate on described first surfaceShadow falls into the projection of described second substrate on described first surface, and described first substrate is perpendicular to describedSpan in the first edge direction be less than described second substrate perpendicular in described the first edge direction acrossDegree.
In described substrate board treatment provided by the invention, described opening is in abutting connection with a side tool at described the first edgeHave one the 5th edge, the projection of described the 5th edge on described first surface and described the first edge are describedProjection on first surface overlaps.
In described substrate board treatment provided by the invention, described first substrate is contact panel, described secondSubstrate is cover plate, and described substrate board treatment also comprises an absorptive element, and described absorptive element is by described firstSubstrate adsorption is on the first surface at described the first place, bearing area, and described light beam is ultraviolet curing lightBundle.
In described substrate board treatment provided by the invention, owing to being at least positioned at institute in described the first bearing areaNear of stating the first edge of first substrate is provided with opening, and be provided with near of described carrying platen send outOptical element, the light beam that described light-emitting component sends is irradiated to described the first edge by described opening. When leading toFirst substrate and the second substrate of crossing a binder course combination are carried on described the first bearing area and carry out levellingWhen technique, because light beam can be radiated at described the first edge, thereby, can incite somebody to action at the liquid glue of binder courseWhen flowing out but not reserving, described light beam just solidifies described liquid glue, therefore, can prevent described liquidGlue is spilled on described carrying platen or other equipment, prevents equipment pollution. Described substrate board treatment due toIn levelling technique, complete the first of described binder course and solidified, therefore reduced the work of follow-up precuringSkill, simplifies technique.
Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of the substrate board treatment 100 of a preferred embodiments provided by the invention;
Fig. 2 is the cross section of substrate board treatment 100 shown in Fig. 1 along a preferred embodiments of A-A directionSchematic diagram;
Fig. 3 is the structural representation of the substrate board treatment 200 of another preferred embodiments provided by the inventionFigure;
Substrate board treatment 200 shown in Fig. 4 Fig. 3 shows along the cross section of a preferred embodiments of A-A directionIntention;
Fig. 5 is the structural representation of the substrate board treatment 300 of another preferred embodiments provided by the inventionFigure.
Detailed description of the invention
For substrate board treatment provided by the invention is described, carry out below in conjunction with Figure of description and explanatory noteElaborate.
Please refer to its substrate board treatment 100 that is a preferred embodiments provided by the invention of Fig. 1 and Fig. 2Structural representation and shown in substrate board treatment 100 cutting along a preferred embodiments of A-A directionFace schematic diagram. Described substrate board treatment 100 at least comprises a carrying platen 101 and a light-emitting component (figureIn not shown), described carrying platen 101 at least has a first surface 101a, described first surface 101aAt least have one first bearing area 110, a binder course is passed through for carrying in described the first bearing area 110One first substrate 102 of (not shown) combination and a second substrate 103.
Described first surface 101a has multiple described the first bearing areas 110, every described the first supporting regionTerritory 110 is for carrying described first substrate 102 and the second substrate 103 of a combination, and multiple described first holdsCarrying region 110 is matrix and is arranged in described first surface 101a.
Described first substrate 102 between described first surface 101a and second substrate 103, this enforcementIn mode, described first substrate 102 is contact panel, and described second substrate 103 is to touch for the protection of describedThe cover plate of control panel. The projection of described first substrate 102 on described first surface 101a falls into describedIn the projection of two substrates 103 on described first surface 101a, described first substrate 102 is perpendicular to instituteState span in the first edge 102a direction and be less than described second substrate 103 perpendicular to described the first edgeSpan in 102a direction. In other embodiments, first substrate and second substrate can be respectively aobviousShow panel and contact panel, or be respectively contact panel or color membrane substrates etc. First substrate, the second basePlate also can be determined as the case may be in the span perpendicular on the first edge.
In present embodiment, described first substrate 102 is rectangular, and it has the first edge 102a, secondEdge 102b, the 3rd edge 102c and the 4th edge 102d, described the first edge 102a, the second edge102b, the 3rd edge 102c and the 4th edge 102d are end to end successively, jointly form described first substrateEdge 102, described the first bearing area 110 is positioned at described the first edge 102a, the second edgeNear of 102b, the 3rd edge 102c and the 4th edge 102d has respectively an opening 11, at least partlyDescribed the first edge 102a, the second edge 102b, the 3rd edge 102c and the 4th edge 102d are describedProjection on first surface 101a falls into respectively the projection of described opening 11 on described first surface 101aIn. In other embodiments, described opening also can be positioned at first edge or of described first substrateIn two edges, the 3rd edge and the 4th edge near at least one edge. In other embodiments, the first baseIt is trapezoidal, circular or oval that plate can also be etc., and each edge of described first substrate can have multipleOpening.
Concrete, described the first edge 102a, the second edge 102b, the 3rd edge 102c and the 4th edgeAll types linearly of 102d, described opening 11 is elongated, described in strip the long limit of opening 11 respectively withDescribed the first edge, the second edge 102b, the 3rd edge 102c and the 4th edge 102d be arranged in parallel,The plane at described the first edge 102a and place, described long limit and described first surface 101a out of plumb.
Described light-emitting component is positioned near of described carrying platen 101, and it is for sending light beam R, described lightBundle R is irradiated to the first edge 102a, second edge of described first substrate 102 by described opening 11102b, the 3rd edge 102c and the 4th edge 102d. In present embodiment, described light-emitting component is arranged atThe below of described carrying platen 101, concrete, described light beam R is positioned at of described first substrate 102The below of one edge 102a, the second edge 102b, the 3rd edge 102c and the 4th edge 102d, described inLight beam R points to described opening 11 by described light-emitting component, described light beam R and described first surface 101aVertical setting. In other embodiments, light beam R also can with the non-perpendicular setting of first surface 101a.
Described substrate board treatment 100 also comprises an absorptive element (not shown), described absorptive elementCan be positioned at the below of described carrying platen 101, described first substrate 102 is adsorbed in institute by described absorptive elementThe first surface 101a that states 110 places, the first bearing area is upper, and described light beam R is ultraviolet curing light beam,Described binder course is liquid glue layer. In other embodiments, first substrate also can be solid by an adhesive linkageOn described first surface.
In the substrate board treatment that present embodiment provides, due at least in described the first bearing area 110Near that is positioned at the first edge 102a of described first substrate 102 is provided with opening 11, and in described carryingNear of platen 101 is provided with light-emitting component, and the light beam R that described light-emitting component sends is by described opening11 are irradiated to described the first edge 102a. When passing through the first substrate 102 and second of a binder course combinationWhen substrate 103 is carried on described the first bearing area 110 and carries out levelling technique, due to light beam, R canBe radiated at described the first edge 102a, thereby, can will flow out but not reserve at the liquid glue of binder courseTime, described light beam R just solidifies described liquid glue, therefore, can prevent that described liquid glue is spilled over to instituteState on carrying platen 101 or other equipment, prevent equipment pollution. Described substrate board treatment 100 due toWhen levelling technique, complete the first of described binder course and solidified, therefore reduced the technique of follow-up precuring,Technique is simplified.
As shown in Figure 3, Figure 4, its substrate board treatment that is another preferred embodiments provided by the invention200 structural representation with and along the schematic cross-section of A-A direction. Described substrate board treatment 200Comprise a carrying platen 201 and a light-emitting component, described carrying platen 201 at least has a first surface201a, described first surface 201a at least has one first bearing area 210, described the first bearing area210 for carrying a first substrate 202 and one second base by a binder course (not shown) combinationPlate 203, described first substrate 202 at least has one first edge 202a, and described light-emitting component sends light beamR’。
Substrate board treatment 200 shown in Fig. 3, Fig. 4 and the substrate board treatment 100 shown in Fig. 1, Fig. 2One of difference be, described opening 21 has one the 5th edge in abutting connection with a side of described the first edge 202a21a, projection and the described first edge 202a of described the 5th edge 20a on described first surface 201aProjection on described first surface 201a overlaps, i.e. described the 5th edge 21a and described the first edge 202aIn the same plane, and described plane is vertical with described first surface 201a. Two of difference is,Described light beam R ' not with vertical setting of described first surface 201a. In other embodiments, light beam R 'Can also vertically with first surface arrange.
As shown in Figure 5, the substrate board treatment 300 that it is another preferred embodiments provided by the inventionStructural representation. Described substrate board treatment 300 comprises a carrying platen and a light-emitting component, described in holdMicroscope carrier plate at least has a first surface, and described first surface at least has one first bearing area 310, instituteState the first bearing area 310 for carrying by a first substrate of a binder course (not shown) combination302 and a second substrate 303.
Described substrate board treatment 300 is with the difference of substrate board treatment 100 shown in Fig. 1, Fig. 2,The edge that described the first bearing area 310 is positioned at described first substrate 301 has an annular opening 31, instituteThe projection of the edge of stating first substrate 301 on described first surface all falls into described opening 31 describedIn projection on first surface. Accordingly, described light beam also arranges around described annular opening 31.
In the substrate board treatment 300 of present embodiment, because described annular opening 31 is surrounded on describedOne substrate 301 arranges, and described light beam is also around described annular opening 31, therefore, and can be by described combinationLiquid glue to be overflowed in layer all solidified before overflowing, and had overcome the processing substrate shown in Fig. 1, Fig. 3In device, some position of first substrate is because of defect that printing opacity may not be cured to.
Be more than the preferred embodiments of substrate board treatment provided by the invention, can not be interpreted as thisThe restriction of bright rights protection scope, those skilled in the art should know, and is not departing from the present invention designUnder prerequisite, also can do multiple improvement or replacement, these all improvement or replacement all should be in power of the present inventionIn profit protection domain, the scope of the present invention should be as the criterion with claim.
Claims (10)
1. a substrate board treatment, is characterized in that: it comprises a carrying platen and and is arranged on instituteState near the light-emitting component of carrying platen, described carrying platen at least has a first surface, described the first tableOn face, at least have one first bearing area, a binder course combination is passed through for carrying in described the first bearing areaA first substrate and a second substrate, described first substrate be positioned at described first surface and second substrate itBetween, described first substrate at least has one first edge, and described the first bearing area is positioned at described the first edgeNear at least there is an opening, described light-emitting component is used for sending light beam, described in described light beam is used for passing throughOpening is irradiated to described the first edge.
2. substrate board treatment as claimed in claim 1, is characterized in that: described light-emitting component settingIn the below of described carrying platen, described light beam points to described opening by described light-emitting component.
3. substrate board treatment as claimed in claim 1, is characterized in that: at least part of described firstThe projection of edge on described first surface falls into the projection of described opening on described first surface.
4. substrate board treatment as claimed in claim 3, is characterized in that: described first substrate is squareShape, it also has the second edge, the 3rd edge and the 4th edge, described the first edge, the first edge,Three edges and the 4th edge are end to end successively, jointly form the edge of described first substrate, and describedNear that one bearing area is positioned at described the second edge, the 3rd edge and the 4th edge at least has out respectivelyMouthful, described the second edge, the 3rd edge and the 4th projection of edge on described first surface divide at least partlyDo not fall into the projection of described opening on described first surface.
5. substrate board treatment as claimed in claim 1, is characterized in that: described first surface hasMultiple described the first bearing areas, every described the first bearing area is for carrying the described first substrate of a combinationAnd second substrate, multiple described the first bearing areas are matrix and are arranged in described first surface.
6. substrate board treatment as claimed in claim 1, is characterized in that: described binder course is liquidGlue-line.
7. substrate board treatment as claimed in claim 4, is characterized in that: described the first edge is straightLine style, described opening is elongated, and the long limit of described strip and described the first edge be arranged in parallel.
8. substrate board treatment as claimed in claim 7, is characterized in that: described first substrate is in instituteThe projection of stating on first surface falls into the projection of described second substrate on described first surface, described firstSubstrate is being less than described second substrate perpendicular to described perpendicular to the span in described the first edge directionSpan in one edge direction.
9. substrate board treatment as claimed in claim 1, is characterized in that: described in described opening adjacencyOne side at the first edge has one the 5th edge, projection and the institute of described the 5th edge on described first surfaceStating the projection of the first edge on described first surface overlaps.
10. substrate board treatment as claimed in claim 1, is characterized in that: described first substrate is for touchingControl panel, described second substrate is cover plate, described substrate board treatment also comprises an absorptive element, described suctionAttached element is adsorbed in described first substrate on the first surface at described the first place, bearing area, described light beamFor ultraviolet curing light beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410557940.0A CN105589608A (en) | 2014-10-20 | 2014-10-20 | Substrate processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410557940.0A CN105589608A (en) | 2014-10-20 | 2014-10-20 | Substrate processing device |
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| Publication Number | Publication Date |
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| CN105589608A true CN105589608A (en) | 2016-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410557940.0A Pending CN105589608A (en) | 2014-10-20 | 2014-10-20 | Substrate processing device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201274285Y (en) * | 2008-10-10 | 2009-07-15 | 华映视讯（吴江）有限公司 | Substrate bearing platform |
| CN203046420U (en) * | 2012-11-29 | 2013-07-10 | 宸鸿科技(厦门)有限公司 | Gluing fixture |
| CN103847216A (en) * | 2012-11-29 | 2014-06-11 | 宸鸿科技(厦门)有限公司 | Applying jig and using method thereof |
| CN104526609A (en) * | 2014-12-30 | 2015-04-22 | 深圳秋田微电子有限公司 | General tooling fixture for laminating multiple layers of sheets |
| CN204278695U (en) * | 2014-10-20 | 2015-04-22 | 浙江金徕镀膜有限公司 | A kind of Base Plate Lamination Device |
-
2014
- 2014-10-20 CN CN201410557940.0A patent/CN105589608A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201274285Y (en) * | 2008-10-10 | 2009-07-15 | 华映视讯（吴江）有限公司 | Substrate bearing platform |
| CN203046420U (en) * | 2012-11-29 | 2013-07-10 | 宸鸿科技(厦门)有限公司 | Gluing fixture |
| CN103847216A (en) * | 2012-11-29 | 2014-06-11 | 宸鸿科技(厦门)有限公司 | Applying jig and using method thereof |
| CN204278695U (en) * | 2014-10-20 | 2015-04-22 | 浙江金徕镀膜有限公司 | A kind of Base Plate Lamination Device |
| CN104526609A (en) * | 2014-12-30 | 2015-04-22 | 深圳秋田微电子有限公司 | General tooling fixture for laminating multiple layers of sheets |
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| CB02 | Change of applicant information |
Address after: 321016 No. 333, Chung Xue street, Wucheng District, Jinhua, Zhejiang. Applicant after: Zhejiang Lai Bao Technology Co., Ltd. Address before: 321016 No. 333, Chung Xue street, Wucheng District, Jinhua, Zhejiang. Applicant before: Zhejiang Jinley Coating Co., Ltd. |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160518 |
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| WD01 | Invention patent application deemed withdrawn after publication |