TW201408153A - 改善陶瓷貫孔基板上金屬表面粗糙度之方法 - Google Patents

改善陶瓷貫孔基板上金屬表面粗糙度之方法 Download PDF

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Publication number
TW201408153A
TW201408153A TW101128512A TW101128512A TW201408153A TW 201408153 A TW201408153 A TW 201408153A TW 101128512 A TW101128512 A TW 101128512A TW 101128512 A TW101128512 A TW 101128512A TW 201408153 A TW201408153 A TW 201408153A
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TW
Taiwan
Prior art keywords
plating
ceramic substrate
seed layer
line
forming
Prior art date
Application number
TW101128512A
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English (en)
Chinese (zh)
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TWI451821B (enExample
Inventor
曾翔瑋
陳冠州
張漢中
周政鋒
林展立
徐元辰
Original Assignee
立誠光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 立誠光電股份有限公司 filed Critical 立誠光電股份有限公司
Priority to TW101128512A priority Critical patent/TW201408153A/zh
Priority to US13/944,673 priority patent/US20140041909A1/en
Priority to CN201310322863.6A priority patent/CN103533765A/zh
Publication of TW201408153A publication Critical patent/TW201408153A/zh
Application granted granted Critical
Publication of TWI451821B publication Critical patent/TWI451821B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
TW101128512A 2012-08-07 2012-08-07 改善陶瓷貫孔基板上金屬表面粗糙度之方法 TW201408153A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW101128512A TW201408153A (zh) 2012-08-07 2012-08-07 改善陶瓷貫孔基板上金屬表面粗糙度之方法
US13/944,673 US20140041909A1 (en) 2012-08-07 2013-07-17 Ceramic Substrate and Method for Reducing Surface Roughness of Metal Filled Via Holes Thereon
CN201310322863.6A CN103533765A (zh) 2012-08-07 2013-07-29 改善陶瓷贯孔基板上金属表面粗糙度的方法及陶瓷基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101128512A TW201408153A (zh) 2012-08-07 2012-08-07 改善陶瓷貫孔基板上金屬表面粗糙度之方法

Publications (2)

Publication Number Publication Date
TW201408153A true TW201408153A (zh) 2014-02-16
TWI451821B TWI451821B (enExample) 2014-09-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128512A TW201408153A (zh) 2012-08-07 2012-08-07 改善陶瓷貫孔基板上金屬表面粗糙度之方法

Country Status (3)

Country Link
US (1) US20140041909A1 (enExample)
CN (1) CN103533765A (enExample)
TW (1) TW201408153A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI751293B (zh) * 2017-03-03 2022-01-01 南韓商印可得股份有限公司 微電路形成方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105491795B (zh) * 2014-09-18 2018-07-03 浙江德汇电子陶瓷有限公司 一种陶瓷金属化基板的制造方法和由该方法制造的陶瓷金属化基板
CN104600184B (zh) * 2014-12-31 2017-07-07 东莞市凯昶德电子科技股份有限公司 一种在陶瓷基板上电镀亮银的方法
CN104640344A (zh) * 2015-02-16 2015-05-20 上海贺鸿电子有限公司 镀铜的陶瓷线路板及其制造方法
CN105624749B (zh) * 2016-03-28 2018-07-10 上海申和热磁电子有限公司 一种陶瓷基板表面金属化的方法
CN106535501A (zh) * 2016-10-17 2017-03-22 奥士康精密电路（惠州）有限公司 一种高厚径比线路板的孔金属化方法
US10700252B2 (en) * 2017-04-18 2020-06-30 Bridgelux Chongqing Co., Ltd. System and method of manufacture for LED packages
CN107708296A (zh) * 2017-10-19 2018-02-16 深圳职业技术学院 一种高导热的金属基电路板及其制作方法
TWI687531B (zh) * 2018-01-26 2020-03-11 謝孟修 陶瓷電路板及其製法
CN111490018A (zh) * 2019-01-29 2020-08-04 瑷司柏电子股份有限公司 具有金属导热凸块接垫的陶瓷基板元件、组件及制法
CN110459668B (zh) * 2019-08-16 2020-12-25 国网河南省电力公司邓州市供电公司 一种大功率led散热基板的制备方法
JP7287210B2 (ja) * 2019-09-19 2023-06-06 コニカミノルタ株式会社 画像処理装置及びプログラム
CN111628063A (zh) * 2020-03-04 2020-09-04 深圳雷曼光电科技股份有限公司 一种Micro-LED的固晶方法
DE112021003875A5 (de) * 2020-07-21 2023-05-25 Ams-Osram International Gmbh Optoelektronisches halbleiterbauteil, herstellungsverfahren und basisplatte
CN112178591A (zh) * 2020-09-18 2021-01-05 广州光联电子科技有限公司 一种激光用波长转换装置的制备方法及波长转换装置
CN112419915A (zh) * 2020-12-04 2021-02-26 深圳市前海恒云联科技有限公司 一种基于pet双面金属材料的柔性透明led显示器
CN112930044B (zh) * 2021-02-06 2022-03-22 深圳市迅捷兴科技股份有限公司 电路板三种不同表面处理制作方法
CN113966099B (zh) * 2021-06-30 2024-06-11 西安空间无线电技术研究所 一种适用于固放产品的微波集成电路薄膜加厚工艺
US20230096301A1 (en) * 2021-09-29 2023-03-30 Catlam, Llc. Circuit Board Traces in Channels using Electroless and Electroplated Depositions
CN114695129A (zh) * 2022-02-17 2022-07-01 中国电子科技集团公司第十三研究所 表面凹槽金属化热沉结构陶瓷管壳的制备方法及陶瓷管壳
CN115348740A (zh) * 2022-08-08 2022-11-15 中国电子科技集团公司第十三研究所 陶瓷基板的制造方法、陶瓷基板及陶瓷外壳
CN116283361B (zh) * 2022-12-31 2023-12-05 博睿光电(泰州)有限公司 一种dpa陶瓷线路板及其制作方法
CN115802598B (zh) * 2023-01-31 2023-10-31 博睿光电(泰州)有限公司 一种陶瓷基板及其制作方法和应用
CN120322138A (zh) * 2025-06-11 2025-07-15 四川科尔威光电科技有限公司 一种铜互连半导体制冷器的填孔方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297155B1 (en) * 1999-05-03 2001-10-02 Motorola Inc. Method for forming a copper layer over a semiconductor wafer
KR100632556B1 (ko) * 2005-01-28 2006-10-11 삼성전기주식회사 인쇄회로기판의 제조방법
TW201124023A (en) * 2009-12-31 2011-07-01 Ta I Technology Co Ltd Method of forming conductive socket of ceramic heat dissipation substrate.
CN102157436A (zh) * 2010-02-11 2011-08-17 中芯国际集成电路制造(上海)有限公司 一种降低金属损伤的电镀铜方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI751293B (zh) * 2017-03-03 2022-01-01 南韓商印可得股份有限公司 微電路形成方法

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US20140041909A1 (en) 2014-02-13
TWI451821B (enExample) 2014-09-01
CN103533765A (zh) 2014-01-22

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