TW201351054A - Exposure device - Google Patents
Exposure device Download PDFInfo
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- TW201351054A TW201351054A TW102105950A TW102105950A TW201351054A TW 201351054 A TW201351054 A TW 201351054A TW 102105950 A TW102105950 A TW 102105950A TW 102105950 A TW102105950 A TW 102105950A TW 201351054 A TW201351054 A TW 201351054A
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- circuit board
- printed circuit
- exposure
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- exposed
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
本發明係有關於一種印刷電路板之曝光裝置。 The present invention relates to an exposure apparatus for a printed circuit board.
在用以製造電路形成於基板雙面之印刷電路板的曝光裝置,排列2台曝光裝置,並將基板之反轉裝置設置於該曝光裝置之間,進行基板雙面之曝光。又,因為在藉輸送帶從曝光裝置往反轉裝置搬運印刷電路板時或藉反轉裝置反轉時印刷電路板偏離基準位置,所以為了修正該位置,將預對準裝置設置於反轉裝置的出口側。 In an exposure apparatus for manufacturing a printed circuit board having a circuit formed on both sides of a substrate, two exposure apparatuses are arranged, and a substrate inversion apparatus is disposed between the exposure apparatuses to perform exposure on both sides of the substrate. Further, since the printed circuit board is displaced from the reference position when the printed circuit board is transported from the exposure device to the inverting device by the transport device or when the reverse device is reversed, the pre-aligned device is placed in the inverting device in order to correct the position. The exit side.
因此,在這種曝光裝置,具有引起裝置之複雜化、生產線之加長、費用之上漲或製造時間之增長、生產力之降低等的問題。 Therefore, in such an exposure apparatus, there is a problem that the apparatus is complicated, the production line is lengthened, the cost is increased, the manufacturing time is increased, the productivity is lowered, and the like.
因此,自以往進行各種嘗試,例如在專利文獻1,提議藉由將印刷電路板固定後使其反轉,防止位置偏差,而廢除反轉裝置之出口側的預對準裝置。 Therefore, various attempts have been made in the past. For example, in Patent Document 1, it is proposed to eliminate the positional deviation by fixing the printed circuit board and then reverse the position, and to abolish the pre-alignment device on the exit side of the inverting device.
[專利文獻1]特開平7-251921號公報 [Patent Document 1] Japanese Patent Publication No. 7-251921
可是,在上述之以往的構成,可廢除對準裝置,但是需要用以從曝光裝置往反轉裝置或從反轉裝置往曝光裝置搬運印刷電路板之搬運輸送帶等的搬運裝置,而具有裝置整體依然是複雜的問題。 However, in the above-described conventional configuration, the alignment device can be eliminated, but a transfer device such as a conveyance belt for transporting the printed circuit board from the exposure device to the reversing device or the reversing device is required, and the device is provided. The whole is still a complicated issue.
本發明之目的在於解決該習知技術的問題。 The object of the present invention is to solve the problems of the prior art.
為了達成該目的,本發明之印刷電路板之曝光裝置的特徵在於包括:一面側曝光部,係對印刷電路板之一面側進行曝光;另一面側曝光部,係對該印刷電路板之另一面側進行曝光;交接部,係設置於該曝光部與曝光部之間,為了在另一方之曝光部對在一方之曝光部結束曝光之印刷電路板進行曝光,而進行交接;一面側吸附手臂,係吸附並固定該印刷電路板之一面側後,在該一面側曝光部與該交接部之間移送印刷電路板;另一面側吸附手臂,係吸附並固定該印刷電路板之另一面側後,在該另一面側曝光部與該交接部之間移送印刷電路板;及手臂轉動機構,係安裝於該一面側吸附手臂或另一面側吸附手臂中的至少一方,藉由使該吸附手臂轉動,而使印刷電路板反轉180度;在該交接部,藉該手臂轉動機構使吸附手臂轉動,而使印刷電路板反轉後,在該一面側吸附手臂與該另一面側吸附手臂之間進行印刷電路板的交接。 In order to achieve the object, an exposure apparatus for a printed circuit board according to the present invention includes: one surface side exposure portion for exposing one side of a printed circuit board; and the other side side exposure portion for the other side of the printed circuit board The side is exposed; the delivery portion is disposed between the exposure portion and the exposure portion, and is exposed to expose the printed circuit board that has been exposed at one of the exposure portions in the other exposure portion; After adsorbing and fixing one side of the printed circuit board, the printed circuit board is transferred between the one-side exposed portion and the interface; the other side is attracted to the other side, and the other side of the printed circuit board is adsorbed and fixed. The printed circuit board is transferred between the other surface side exposure unit and the delivery unit; and the arm rotation mechanism is attached to at least one of the one side suction arm or the other side adsorption arm, and the adsorption arm is rotated. And rotating the printed circuit board by 180 degrees; at the intersection, the arm rotating mechanism rotates the adsorption arm, and after the printed circuit board is reversed, the one A printed circuit board for delivery of suction side of the adsorption with the other arm between the arm side.
又,在本發明,更包括:搬入搬出裝置,係設置於該一面側曝光部與另一面側曝光部之交接部的相反側,並從該曝光部搬入或搬出印刷電路板;及印刷電路板之對準裝置,係設置於該搬入搬出裝置;可進行使印刷電路板從該一面側曝光部往另 一面側曝光部流動的步驟、與相反地進行使印刷電路板從另一面側曝光部往一面側曝光部流動之步驟的雙方。 Moreover, the present invention further includes: a loading/unloading device provided on a side opposite to a delivery portion of the one-side exposure portion and the other-surface exposure portion, and loading or unloading a printed circuit board from the exposure portion; and a printed circuit board The alignment device is provided in the loading/unloading device; and the printed circuit board can be moved from the one side to the other The step of flowing the one-side exposure portion and the step of flowing the printed circuit board from the other surface-side exposure portion to the one-side exposure portion are reversed.
若依據本發明之曝光裝置,因為不使用以往之反轉裝置,而在交接部藉吸附手臂直接進行印刷電路板的交接,所以不會發生印刷電路板之基準位置的偏差,而不需要將預對準部設置於下游側之曝光部的入口側。又,因為印刷電路板的反轉係藉設置於吸附手臂的手臂轉動機構進行,所以亦不需要反轉裝置。進而,因為從一方之曝光部至另一方之曝光部,全部利用吸附手臂移送印刷電路板,所以具有不必另外將搬運裝置設置於曝光部之間的效果。又,可彈性地應付生產線,而具有亦不需要改造費用等。 According to the exposure apparatus of the present invention, since the conventional inverting apparatus is not used, the transfer board directly transfers the printed circuit board by the suction arm, so that the deviation of the reference position of the printed circuit board does not occur, and the pre-processing is not required. The alignment portion is provided on the inlet side of the exposure portion on the downstream side. Moreover, since the reversal of the printed circuit board is performed by the arm rotation mechanism provided in the suction arm, the reversing device is not required. Further, since all of the exposure portions from one exposure portion to the other are transferred to the printed circuit board by the adsorption arm, there is an effect that it is not necessary to separately provide the conveyance device between the exposure portions. Moreover, the production line can be flexibly handled, and there is no need for modification costs or the like.
1‧‧‧曝光 1‧‧‧ exposure
2‧‧‧交接部 2‧‧‧Transfer Department
3‧‧‧曝光部 3‧‧‧Exposure Department
5‧‧‧吸附手臂 5‧‧‧Adsorbing arm
6‧‧‧吸附手臂 6‧‧‧Adsorbing arm
7‧‧‧手臂轉動機構 7‧‧‧ Arm rotation mechanism
10‧‧‧搬入搬出部 10‧‧‧ Moving in and out
11‧‧‧輥輸送帶 11‧‧‧Roller conveyor belt
15‧‧‧基座 15‧‧‧Base
30‧‧‧搬入搬出部 30‧‧‧ Moving in and out
31‧‧‧輥輸送帶 31‧‧‧Roller conveyor belt
35‧‧‧基座 35‧‧‧Base
50‧‧‧行駛軌道 50‧‧‧Travel track
51‧‧‧行駛基座 51‧‧‧Drive base
52‧‧‧Z軸 52‧‧‧Z axis
53‧‧‧Y軸 53‧‧‧Y axis
54‧‧‧吸附機構 54‧‧‧Adsorption mechanism
60‧‧‧行駛軌道 60‧‧‧Travel track
61‧‧‧行駛基座 61‧‧‧Drive base
62‧‧‧Z軸 62‧‧‧Z axis
63‧‧‧Y軸 63‧‧‧Y axis
64‧‧‧吸附機構 64‧‧‧Adsorption mechanism
70‧‧‧旋轉馬達 70‧‧‧Rotary motor
99‧‧‧印刷電路板 99‧‧‧Printed circuit board
第1圖係表示本發明之一實施形態的示意平面圖。 Fig. 1 is a schematic plan view showing an embodiment of the present invention.
第2圖係表示本發明之一實施形態的示意立面圖。 Fig. 2 is a schematic elevational view showing an embodiment of the present invention.
第3圖係本發明之一實施形態之一面側及另一面側吸附手臂5的立面圖。 Fig. 3 is a front elevational view showing the suction arm 5 on the front side and the other side of one embodiment of the present invention.
第4圖係本發明之一實施形態之一面側及另一面側吸附手臂5的平面圖。 Fig. 4 is a plan view showing the surface side and the other surface side adsorption arm 5 according to an embodiment of the present invention.
以下,根據圖面,說明本發明之實施形態。 Hereinafter, embodiments of the present invention will be described based on the drawings.
第1圖係本發明之用以製造印刷電路板之曝光裝置的平面圖,第2圖係立面圖。 Fig. 1 is a plan view showing an exposure apparatus for manufacturing a printed circuit board of the present invention, and Fig. 2 is an elevational view.
本曝光裝置具有進行一面側之曝光的一面側曝光部1、交接部2及進行另一面側之曝光的另一面側曝光部3,這些依序大致等間隔地配設成直線狀。曝光部1具有搬入搬出部10,曝光部3具有搬入搬出部30,從前步驟搬入印刷電路板99或向下一步驟搬出印刷電路板99。 In the exposure apparatus, the one-side exposure unit 1 and the delivery unit 2 that expose the other side are exposed, and these are arranged in a straight line at substantially equal intervals. The exposure unit 1 has a loading/unloading unit 10, and the exposure unit 3 has a loading/unloading unit 30, and carries the printed circuit board 99 from the previous step or carries out the printed circuit board 99 in the next step.
即,在前步驟被施加光阻劑的印刷電路板99係從搬入搬出部10經由曝光部1、交接部2及曝光部3,在一面側及另一面側之表背被曝光後,從搬入搬出部30被送至下一步驟。又,如後述所示,在相反的流程亦可應付,在此情況,從搬入搬出部30經由曝光部3、交接部2及曝光部1後,從搬入搬出部10被送至下一步驟。 In other words, the printed circuit board 99 to which the photoresist is applied in the previous step is transferred from the loading/unloading unit 10 through the exposure unit 1, the delivery unit 2, and the exposure unit 3, and the front and back sides of the other side are exposed. The carry-out unit 30 is sent to the next step. Further, as will be described later, the reverse flow can be handled. In this case, the loading/unloading unit 30 is sent from the loading/unloading unit 10 to the next step after passing through the exposure unit 3, the delivery unit 2, and the exposure unit 1.
曝光部1、3係構成為分別具有基座15、基座35,將印刷電路板99載置基座,並藉對準裝置(未圖示)對準位置後,從曝光光源(未圖示)發出曝光光,將遮罩(未圖示)上所畫的圖案印相於印刷電路板99上。 The exposure units 1 and 3 are configured to have a susceptor 15 and a susceptor 35, respectively, and the printed circuit board 99 is placed on the susceptor, and is aligned by an alignment device (not shown), and then exposed from a light source (not shown). The exposure light is emitted, and the pattern drawn on the mask (not shown) is printed on the printed circuit board 99.
交接部2被設定於曝光部1與曝光部3之間,在交接部2進行印刷電路板99之反轉與交接。 The delivery unit 2 is set between the exposure unit 1 and the exposure unit 3, and the delivery unit 2 performs reverse rotation and delivery of the printed circuit board 99.
在該曝光裝置,設置吸附並搬運印刷電路板99之一面側的一面側吸附手臂5、與吸附並搬運印刷電路板99之另一面側的另一面側吸附手臂6。吸附手臂5具有行駛軌道50,該行駛軌道50係橫跨搬入搬出部10、曝光部1及交接部2並在X方向延伸,可將印刷電路板99從搬入搬出部10搬往曝光部1,再從曝光部1搬至交接部2。又,構成為可在反方向從交接部2搬往曝光部1,再從曝光部1搬至搬入搬出部10。 In the exposure apparatus, the one side suction arm 5 which adsorbs and conveys one surface side of the printed circuit board 99, and the other side adsorption arm 6 which adsorbs and conveys the other side of the printed circuit board 99 are provided. The adsorption arm 5 has a traveling rail 50 that extends across the loading/unloading unit 10, the exposure unit 1 and the delivery unit 2 in the X direction, and can transport the printed circuit board 99 from the loading/unloading unit 10 to the exposure unit 1. Then, it is moved from the exposure unit 1 to the delivery unit 2. Further, it is configured to be carried from the delivery unit 2 to the exposure unit 1 in the reverse direction, and then to the loading/unloading unit 10 from the exposure unit 1.
吸附手臂6具有行駛軌道60,該行駛軌道60係橫跨搬入搬出部30、曝光部3及交接部2並在X方向延伸,可將印刷電路板99從交接部2搬往曝光部3,再從曝光部3搬至搬入搬出部30。又,構成為可在反方向從搬入搬出部30搬搬往曝光部3,再從曝光部3搬至交接部2。 The adsorption arm 6 has a traveling rail 60 that extends across the loading/unloading unit 30, the exposure unit 3, and the delivery unit 2 in the X direction, and can transport the printed circuit board 99 from the delivery unit 2 to the exposure unit 3, and then It is moved from the exposure unit 3 to the loading/unloading unit 30. Moreover, it is comprised so that it can carry out to the exposure part 3 from the loading/unloading part 30 in the reverse direction, and is carried out from the exposure part 3 to the delivery part 2.
此外,在本實施形態,行駛軌道60係配置於行駛軌道50的上方,在交接部2,如後述所示,空出在印刷電路板99轉動時不會接觸的間隔。 Further, in the present embodiment, the traveling rail 60 is disposed above the traveling rail 50, and as shown later, the intersection portion 2 is vacated at intervals that are not in contact when the printed circuit board 99 is rotated.
如第3圖所示,吸附手臂5包括:在行駛軌道50行駛的行駛基座51、及從行駛基座51在上方向所延伸設置的Z軸52。在該Z軸52,設置在基座15之寬度方向、Y方向所延伸出的Y軸53,Y軸53被安裝成可在Z軸52上在上下方向升降。藉本構成,Y軸53構成為可在Z方向上下升降,而且可在X方向行駛。 As shown in FIG. 3, the adsorption arm 5 includes a travel base 51 that travels on the travel rail 50, and a Z-axis 52 that extends from the travel base 51 in the upward direction. The Z-axis 52 is provided with a Y-axis 53 extending in the width direction and the Y-direction of the susceptor 15, and the Y-axis 53 is attached so as to be movable up and down in the vertical direction on the Z-axis 52. According to this configuration, the Y-axis 53 is configured to be movable up and down in the Z direction and to travel in the X direction.
吸附機構54安裝於Y軸53,並構成為藉該吸附機構54吸附並固定印刷電路板99後,搬運印刷電路板99。 The suction mechanism 54 is attached to the Y-axis 53 and configured to carry the printed circuit board 99 after the suction and suction of the printed circuit board 99 by the suction mechanism 54.
吸附機構54係形成板狀的矩形形狀,如第4圖所示,在其中心線安裝於Y軸53。 The suction mechanism 54 is formed in a plate-like rectangular shape, and as shown in FIG. 4, is attached to the Y-axis 53 at its center line.
在本實施形態,在吸附手臂5具有手臂轉動機構7,Y軸53構成為藉手臂轉動機構7的旋轉馬達70可轉動配管360度。藉本構成,吸附手臂5構成為可在其中心線使印刷電路板99轉動180度後使其反轉。 In the present embodiment, the adsorption arm 5 has an arm rotation mechanism 7, and the Y-axis 53 is configured to be rotatable by a rotation motor 70 of the arm rotation mechanism 7 by 360 degrees. With this configuration, the adsorption arm 5 is configured to be reversed by rotating the printed circuit board 99 by 180 degrees on its center line.
吸附手臂6亦一樣,如第3圖所示,包括:在行駛軌道60行駛的行駛基座61、及從行駛基座61在上方向所延 伸設置的Z軸62。在該Z軸62,設置在基座35之寬度方向、Y方向所延伸出的Y軸63,Y軸63被安裝成可在Z軸62上在上下方向升降。藉本構成,Y軸63構成為可在Z方向上下升降,而且可在X方向行駛。 The same applies to the adsorption arm 6, as shown in Fig. 3, including: the travel base 61 traveling on the traveling rail 60, and extending from the traveling base 61 in the upper direction. Extend the set Z axis 62. The Z-axis 62 is provided with a Y-axis 63 extending in the width direction and the Y-direction of the susceptor 35, and the Y-axis 63 is attached so as to be movable up and down on the Z-axis 62. According to this configuration, the Y-axis 63 is configured to be movable up and down in the Z direction and to travel in the X direction.
吸附機構64安裝於Y軸63,並構成為藉該吸附機構64吸附並固定印刷電路板99後,搬運印刷電路板99。 The adsorption mechanism 64 is attached to the Y-axis 63, and is configured to carry the printed circuit board 99 after the adsorption mechanism 64 adsorbs and fixes the printed circuit board 99.
吸附機構64構成板狀的矩形形狀,如第4圖所示,在其中心線安裝於Y軸63。 The suction mechanism 64 is formed in a plate-like rectangular shape, and as shown in FIG. 4, is attached to the Y-axis 63 at its center line.
搬入搬出部10具有輥輸送帶11,輥輸送帶11係與來自前步驟的輥輸送帶11’連接,並構成為搬入來自前步驟的印刷電路板99。又,構成為相反地從輥輸送帶11向輥輸送帶11’搬出印刷電路板99。 The loading/unloading unit 10 has a roller conveyor belt 11 which is connected to the roller conveyor belt 11' from the previous step, and is configured to carry the printed circuit board 99 from the previous step. Further, the printed circuit board 99 is carried out from the roller conveyor belt 11 to the roller conveyor belt 11' in the opposite direction.
搬入搬出部30亦一樣,具有輥輸送帶31,輥輸送帶31係與來自下一步驟的輥輸送帶31’連接,並構成為向下一步驟搬出印刷電路板99。又,構成為相反地從輥輸送帶11’向輥輸送帶11搬入印刷電路板99。 Similarly to the loading/unloading unit 30, the roller conveyor belt 31 is connected to the roller conveyor belt 31' from the next step, and is configured to carry out the printed circuit board 99 in the next step. Further, the printing is performed on the printed circuit board 99 from the roller conveyor belt 11' to the roller conveyor belt 11 in the opposite direction.
搬入搬出部10與搬入搬出部30分別具有是預對準裝置的對準板(未圖示),更在對準板設置止動器(未圖示)與可移動的對準銷(未圖示)。又,對準板具有吸附並固定印刷電路板99的吸附裝置。 Each of the loading/unloading unit 10 and the loading/unloading unit 30 has an alignment plate (not shown) that is a pre-alignment device, and a stopper (not shown) and a movable alignment pin are provided on the alignment plate (not shown). Show). Further, the alignment plate has an adsorption device that adsorbs and fixes the printed circuit board 99.
對準板構成為可升降,並構成為可取得位於該輥輸送帶11、輥輸送帶31之下側的狀態與位於上側的狀態。 The alignment plate is configured to be movable up and down, and is configured to be in a state in which the roller conveyor belt 11 and the roller conveyor belt 31 are located on the lower side and a state on the upper side.
而且,構成為在輥輸送帶11、輥輸送帶31接受印刷電路板99後,使對準板上升,在下收容輥輸送帶11與輥輸送帶31, 藉止動器限制印刷電路板99的行進方向位置,而且藉對準銷調整寬度方向位置,進行預對準。預對準後,藉吸附裝置在預對準位置固定印刷電路板99。 Further, after the roller conveyor belt 11 and the roller conveyor belt 31 receive the printed circuit board 99, the alignment plate is raised, and the roller conveyor belt 11 and the roller conveyor belt 31 are accommodated in the lower portion. The position of the traveling direction of the printed circuit board 99 is restricted by the stopper, and the position in the width direction is adjusted by the alignment pin to perform pre-alignment. After pre-alignment, the printed circuit board 99 is secured in the pre-aligned position by the adsorption device.
其次,說明動作。在第1圖與第2圖,說明生產線從左流動至右之情況的動作。 Next, explain the action. In the first and second figures, the operation of the production line flowing from the left to the right will be described.
將印刷電路板99從前步驟經由輥輸送帶11’搬運至輥輸送帶11上時,在此被對準後,被對準板吸附並固定。 When the printed circuit board 99 is transported from the previous step to the roller conveyor belt 11 via the roller conveyor belt 11', it is aligned and fixed by the alignment plate.
吸附手臂5移至該印刷電路板99的上方後,吸附機構54下降,吸附並固定印刷電路板99的上面,並搬運至曝光部1,將印刷電路板99載置於基座15上後解除吸附,吸附手臂5退避至既定位置。 After the adsorption arm 5 is moved over the printed circuit board 99, the suction mechanism 54 is lowered, the upper surface of the printed circuit board 99 is sucked and fixed, and transported to the exposure unit 1, and the printed circuit board 99 is placed on the susceptor 15 and then released. Adsorption, the adsorption arm 5 retreats to a predetermined position.
在曝光部1,進行印刷電路板99的對準後,對其一面側進行曝光。 After the alignment of the printed circuit board 99 is performed in the exposure unit 1, one side is exposed.
曝光結束後,藉吸附機構54再吸附印刷電路板99的一面側,並將印刷電路板99搬運至交接部2。在交接部2,驅動手臂轉動機構7的旋轉馬達70,如第3圖所示,使印刷電路板99轉動180度後,使印刷電路板99反轉。藉此,印刷電路板99之未曝光的另一面側朝向上方向。 After the exposure is completed, the one side of the printed circuit board 99 is again adsorbed by the suction mechanism 54, and the printed circuit board 99 is transported to the delivery unit 2. In the delivery unit 2, the rotary motor 70 of the arm rotation mechanism 7 is driven, and as shown in Fig. 3, the printed circuit board 99 is rotated by 180 degrees, and the printed circuit board 99 is reversed. Thereby, the other exposed side of the printed circuit board 99 is oriented upward.
接著,如第2圖所示,吸附手臂6移至交接部2,其吸附機構64下降後,吸附並固定反轉後朝上之印刷電路板99的另一面側。同時解除吸附機構54的固定,吸附手臂6將印刷電路板99搬運至曝光部3,將印刷電路板99載置於基座35後,解除固定,吸附手臂6退避至既定位置。印刷電路板99係在基座35上被對準後,對該另一面側進行曝光。 Next, as shown in Fig. 2, the adsorption arm 6 is moved to the delivery portion 2, and after the suction mechanism 64 is lowered, the other side of the printed circuit board 99 which is reversed and upward is sucked and fixed. At the same time, the fixing of the suction mechanism 54 is released, the adsorption arm 6 transports the printed circuit board 99 to the exposure unit 3, the printed circuit board 99 is placed on the susceptor 35, and the fixing is released, and the adsorption arm 6 is retracted to a predetermined position. The printed circuit board 99 is aligned on the susceptor 35 and exposed to the other side.
曝光結束後,藉吸附機構64吸附並固定印刷電路板99的另一面側,並向搬入搬出部30搬運。然後,將印刷電路板99從輥輸送帶31移送至輥輸送帶31’,送至下一步驟。 After the exposure is completed, the other side of the printed circuit board 99 is sucked and fixed by the suction mechanism 64, and is carried to the carry-in/out unit 30. Then, the printed circuit board 99 is transferred from the roll conveyor belt 31 to the roll conveyor belt 31', and is sent to the next step.
在上述,說明從左向右流動之生產線的情況,但是從右向左流動之生產線的動作亦大致相同,在此情況,在搬入搬出部30進行預對準。又,在交接部2,藉吸附手臂6搬運已結束另一面側之曝光的印刷電路板99,在此藉反轉180度之吸附機構54吸附印刷電路板99的下側(一面側),吸附機構54轉動180度而復原,藉此,使印刷電路板99反轉。因為其他的動作係上述之動作的相反,所以省略說明。 In the above, the case of the production line flowing from left to right will be described, but the operation of the production line flowing from right to left is also substantially the same. In this case, the loading/unloading unit 30 performs pre-alignment. Further, in the delivery unit 2, the printed circuit board 99 that has finished the exposure on the other side is transported by the suction arm 6, and the lower side (one side) of the printed circuit board 99 is adsorbed by the suction mechanism 54 reversed by 180 degrees. The mechanism 54 is rotated by 180 degrees to be restored, whereby the printed circuit board 99 is reversed. Since the other operations are the reverse of the above-described operations, the description will be omitted.
如以上之說明所示,若依據本發明之曝光裝置,因為藉吸附手臂5進行印刷電路板99的搬運、反轉,並將其直接交給吸附手臂6,所以不會發生印刷電路板99的位置偏差。又,在從右向左之生產線的情況,亦因為藉吸附手臂6搬運印刷電路板99,並直接交給吸附手臂5,再藉吸附手臂5反轉,所以不會發生印刷電路板99的位置偏差。因此,不需要反轉裝置或反轉後的對準裝置,而可簡化裝置。又,因為在交接部2之反轉係以印刷電路板99之中心線為軸的反轉,所以亦可使交接部2本身的空間變成最小。 As shown in the above description, according to the exposure apparatus of the present invention, since the conveyance arm 5 carries and reverses the printed circuit board 99 and directly transfers it to the adsorption arm 6, the printed circuit board 99 does not occur. Positional deviation. Further, in the case of the production line from the right to the left, since the printed circuit board 99 is carried by the suction arm 6, and is directly delivered to the adsorption arm 5, and the suction arm 5 is reversed, the position of the printed circuit board 99 does not occur. deviation. Therefore, the inverting device or the inverted alignment device is not required, and the device can be simplified. Further, since the inversion of the delivery unit 2 is reversed by the center line of the printed circuit board 99, the space of the delivery unit 2 itself can be minimized.
進而,因為在曝光部1與曝光部3之間,使用輥輸送帶等,所以抑制灰塵的產生。 Further, since a roller conveyor belt or the like is used between the exposure unit 1 and the exposure unit 3, generation of dust is suppressed.
50‧‧‧行駛軌道 50‧‧‧Travel track
53‧‧‧Y軸 53‧‧‧Y axis
63‧‧‧Y軸 63‧‧‧Y axis
60‧‧‧行駛軌道 60‧‧‧Travel track
15、35‧‧‧基座 15, 35‧‧‧ Pedestal
10‧‧‧搬入搬出部 10‧‧‧ Moving in and out
1‧‧‧曝光部 1‧‧‧Exposure Department
2‧‧‧交接部 2‧‧‧Transfer Department
3‧‧‧曝光部 3‧‧‧Exposure Department
30‧‧‧搬入搬出部 30‧‧‧ Moving in and out
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