JP5236362B2 - Proximity exposure apparatus and substrate transfer method for proximity exposure apparatus - Google Patents

Description

  The present invention relates to a proximity exposure apparatus that performs pre-alignment of a substrate by acquiring images of two orthogonal edges of a rectangular substrate mounted on a chuck with a CCD camera or the like, and a substrate transport method of the proximity exposure apparatus. .

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection system that projects a photomask (hereinafter referred to as “mask”) pattern onto a substrate using a lens or a mirror, and a small gap (proximity gap) between the mask and the substrate. There is a proximity method in which a mask pattern is provided and transferred to a substrate. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  The proximity exposure apparatus includes a chuck for mounting and fixing a substrate, and the chuck is mounted on a stage for aligning the substrate. The substrate is usually transferred to the chuck by a handling arm such as a robot. Then, after the substrate is transported to the chuck, before the substrate is aligned, the substrate is pre-aligned to make the position and angle of the substrate substantially constant with respect to the optical system of the exposure apparatus.

In Patent Document 1, an edge sensor that detects the edge of a substrate is arranged at a reference position corresponding to two orthogonal sides of the substrate in the pre-alignment of the substrate, and the substrate and the edge sensor are moved relative to each other. A technique for correcting the angle and position of the stage from the amount of movement until the edge of the stage is detected by the edge sensor is disclosed. In the technique described in Patent Document 1, since it is necessary to relatively move the substrate and the edge sensor to detect the edge of the substrate, it takes time to pre-align the substrate. In recent years, therefore, an image acquisition device such as a CCD camera is used to acquire images of the edges of two orthogonal sides of the substrate mounted on the chuck, and the substrate is pre-aligned based on the acquired image. .
JP-A-9-90308

  The image acquisition device for pre-alignment of the substrate has a predetermined visual field range, and when the position or angle of the substrate mounted on the chuck is greatly deviated, the edge of the substrate deviates from the visual field range of the image acquisition device. Edge images cannot be acquired. The substrate is usually mounted on a cooling plate and cooled before being transported to the chuck, and is transported from the cooling plate to the chuck after cooling. Therefore, conventionally, before transferring the substrate to the chuck, the edge of the substrate mounted on the cooling plate is pushed by a guide roller or the like to move the substrate, thereby correcting the positional deviation of the substrate. However, in recent years, when the size of the substrate increases with the increase in the screen size of the display panel, the friction between the substrate and the cooling plate increases, and the substrate cannot move on the cooling plate, making it difficult to correct the displacement of the substrate. It was. Moreover, when the force which pushes the edge of a board | substrate is enlarged, the problem that a board | substrate will be damaged generate | occur | produced.

  The subject of this invention is conveying a board | substrate to a chuck | zipper so that the edge of two orthogonal sides of a board | substrate may not remove | deviate from the visual field range of the image acquisition apparatus for pre-alignment.

  A proximity exposure apparatus according to the present invention includes a chuck on which a rectangular substrate is mounted, a plurality of image acquisition devices that acquire images of two orthogonal edges of the substrate mounted on the chuck, and a stage that moves the chuck. Proximity exposure equipment that pre-aligns the substrate mounted on the chuck by moving the chuck based on the images acquired by multiple image acquisition devices. Cooling plate for cooling the substrate, detection means for detecting the positions of two orthogonal edges of the substrate mounted on the cooling plate, substrate transfer means for transferring the substrate from the cooling plate to the chuck, and detection results of the detection means From the position of the substrate mounted on the cooling plate in the XY direction and the amount of angle deviation in the θ direction. Before the means transports the substrate from the cooling plate to the chuck, the chuck is moved by the stage, and the chuck is moved in the XY direction by the amount of deviation of the position in the XY direction and the angle in the θ direction of the substrate mounted on the cooling plate. Then, after the substrate transport means transports the substrate from the cooling plate to the chuck, the chuck moves the chuck by the stage before the plurality of image acquisition devices acquire images of two orthogonal edges of the substrate. Control means for returning the position of the chuck in the XY direction and the rotation in the θ direction.

  In addition, the substrate exposure method of the proximity exposure apparatus according to the present invention includes a chuck on which a rectangular substrate is mounted, a plurality of image acquisition devices that acquire images of two orthogonal edges of the substrate mounted on the chuck, and a chuck A proximity exposure apparatus substrate transport method for pre-aligning a substrate mounted on a chuck by moving a chuck by a stage based on images acquired by a plurality of image acquisition devices. The substrate before being transported to the chuck is mounted on the cooling plate and cooled, the positions of the two orthogonal edges of the substrate are detected, the position of the substrate mounted on the cooling plate in the XY direction and the angle in the θ direction Before the substrate is transported from the cooling plate to the chuck, the X of the substrate mounted on the cooling plate is detected. Before moving the substrate in the XY direction and rotating in the θ direction by the amount of deviation of the position in the direction and the angle in the θ direction, transporting the substrate from the cooling plate to the chuck, and acquiring images of the two orthogonal edges of the substrate, The position of the chuck in the XY direction and the rotation in the θ direction are restored.

  Before the substrate is transferred from the cooling plate to the chuck, the chuck is moved in the XY direction and rotated in the θ direction by the amount of deviation of the position in the XY direction and the angle in the θ direction of the substrate mounted on the cooling plate. The XY direction position and the θ direction angle with respect to the chuck are mounted on the chuck with no deviation. After the substrate is transported from the cooling plate to the chuck, the position of the chuck in the XY direction and the rotation in the θ direction are returned to the original state before acquiring the images of the two orthogonal edges of the substrate. The position in the XY direction and the angle in the θ direction of the substrate are constant.

  Furthermore, in the proximity exposure apparatus according to the present invention, the detection means has a plurality of sensors for detecting edges of two orthogonal sides of a rectangular substrate mounted vertically on the chuck, and a rectangular substrate mounted horizontally on the chuck. And a plurality of sensors for detecting edges of two orthogonal sides. Further, the substrate transport method of the proximity exposure apparatus according to the present invention is a rectangular substrate in which two orthogonal edges of a rectangular substrate mounted vertically on the chuck are detected by a plurality of sensors and mounted horizontally on the chuck. Are detected by a plurality of other sensors. The orientation of the substrate to be mounted on the cooling plate must be different between the case where the rectangular substrate is mounted vertically on the chuck and the case where the substrate is mounted horizontally. Two orthogonal edges of a rectangular substrate mounted vertically on a chuck are detected by multiple sensors, and two orthogonal edges of a rectangular substrate mounted horizontally on a chuck are detected by different sensors. Therefore, it is possible to cope with both the case where the rectangular substrate is mounted vertically on the chuck and the case where it is mounted horizontally.

  According to the present invention, the substrate before being transported to the chuck is mounted on the cooling plate and cooled, and the positions of the two orthogonal edges of the substrate are detected, and the position of the substrate mounted on the cooling plate in the XY direction. And before detecting the amount of angle deviation in the θ direction and transporting the substrate from the cooling plate to the chuck, the position of the substrate mounted on the cooling plate in the XY direction and the amount of angle deviation in the θ direction are in the XY direction. Rotate and rotate in the θ direction, transport the substrate from the cooling plate to the chuck, and undo the position in the XY direction and the rotation in the θ direction of the chuck before acquiring images of the edges of the two orthogonal sides of the substrate Thus, the position in the XY direction and the angle in the θ direction of the substrate mounted on the chuck can be made constant. Accordingly, the substrate can be transported to the chuck so that the edges of the two orthogonal sides of the substrate do not deviate from the visual field range of the pre-alignment image acquisition apparatus.

  Furthermore, the two orthogonal edges of the rectangular substrate mounted vertically on the chuck are detected by a plurality of sensors, and the two orthogonal edges of the rectangular substrate mounted horizontally on the chuck are detected by another sensor. In this case, the rectangular substrate can be mounted on the chuck either vertically or horizontally.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the proximity exposure apparatus according to the embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a mask holder 20, an image processing apparatus 30, a CCD camera 31, 32, 33, 34, 35, 36, a cooling plate 40, a base 41, a substrate edge detection device 50, a substrate edge detection sensor, a main controller 60, a stage drive circuit 70, and a substrate transfer robot 80. . In FIG. 2, the image processing device 30, the substrate edge detection device 50, the main control device 60, the stage drive circuit 70, and the substrate transport robot 80 are omitted. In addition to these, the proximity exposure apparatus includes an irradiation optical system that irradiates exposure light, a gap sensor, an alignment sensor, a temperature control unit that manages temperature in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is at a delivery position for delivering a substrate. CCD cameras 31, 32, 33, 34, 35 and 36 for pre-alignment are arranged above the delivery position. As will be described later, the CCD cameras 31, 32, and 33 acquire images of two orthogonal edges of a substrate that is vertically mounted on the chuck 10. As will be described later, the CCD cameras 34, 35, and 36 acquire images of two orthogonal edges of the substrate mounted horizontally on the chuck 10.

  A mask holder 20 for holding the mask 2 is installed above the exposure position where the substrate is exposed. The mask holder 20 holds the periphery of the mask 2 by vacuum suction. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate, whereby the pattern of the mask 2 is transferred to the surface of the substrate and a pattern is formed on the substrate.

  In FIG. 2, the chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (lateral direction in FIG. 2). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5, and moves along the Y guide 6 in the Y direction (the drawing depth direction in FIG. 2). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the chuck 10. In FIG. 1, the stage drive circuit 70 drives the X stage 5, the Y stage 7, and the θ stage 8 under the control of the main controller 60.

  As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. At the transfer position, the substrate mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. At the exposure position, the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction cause a step movement of the substrate mounted on the chuck 10 in the XY direction. Then, the substrate is aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Further, the gap between the mask 2 and the substrate is adjusted by moving and tilting the mask holder 20 in the Z direction (vertical direction in FIG. 2) by a Z-tilt mechanism (not shown).

  In the present embodiment, the gap between the mask 2 and the substrate is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support 9 is provided with a Z-tilt mechanism to The gap between the mask 2 and the substrate may be adjusted by moving and tilting 10 in the Z direction.

  1 and 2, a cooling plate 40 for cooling the substrate 1 before being transferred to the chuck 10 is provided before the exposure position. In FIG. 2, the cooling plate 40 is supported by a table 41. In FIG. 1, a substrate transfer robot 80 is disposed beside the cooling plate 40. The substrate transfer robot 80 transfers the substrate 1 to the cooling plate 40 from a transfer line (not shown). Then, when the chuck 10 is at the delivery position, the substrate transport robot 80 transports the substrate 1 from the cooling plate 40 to the chuck 10 and transports the exposed substrate from the chuck 10 to a transport line (not shown).

  Inside the cooling plate 40, a plurality of push-up pins (not shown) are accommodated. The cooling plate 40 raises the push-up pin to receive the substrate 1 from the handling arm 81 of the substrate transfer robot 80, and lowers the push-up pin to bring the substrate 1 into contact with the cooling surface. Further, the cooling plate 40 raises the push-up pin to lift the substrate 1 from the cooling surface, and the handling arm 81 of the substrate transfer robot 80 receives the substrate 1 from the tip of the push-up pin.

  Similarly, a plurality of push-up pins (not shown) are accommodated in the chuck 10. The chuck 10 raises the push-up pin to receive the substrate from the handling arm 81 of the substrate transport robot 80, and lowers the push-up pin to bring the substrate into contact with the surface. Further, the chuck 10 raises the push-up pin to lift the substrate from the surface, and the handling arm 81 of the substrate transfer robot 80 receives the substrate from the tip of the push-up pin.

  Around the cooling plate 40, there are arranged light projecting portions 51a, 52a, 53a, 54a, 55a, 56a and light receiving portions 51b, 52b, 53b, 54b, 55b, 56b of the substrate edge detection sensor. As shown in FIG. 2, the light projecting unit 51 a and the light receiving unit 51 b are installed facing each other across the substrate 1 mounted on the cooling plate 40. The same applies to the light projecting unit 52a and the light receiving unit 52b, the light projecting unit 53a and the light receiving unit 53b, the light projecting unit 54a and the light receiving unit 54b, the light projecting unit 55a and the light receiving unit 55b, and the light projecting unit 56a and the light receiving unit 56b. As will be described later, the light receiving portions 51b, 52b, and 53b detect the edges of two orthogonal sides of the substrate 1 that is mounted vertically on the chuck 10. As will be described later, the light receiving portions 54b, 55b, and 56b detect the edges of two orthogonal sides of the substrate that is mounted horizontally on the chuck 10.

  Hereinafter, a substrate transport method of a proximity exposure apparatus according to an embodiment of the present invention will be described. FIG. 3 is a plan view showing the position of the CCD camera for pre-alignment and the position of the substrate edge detection sensor for the substrate mounted vertically on the chuck. The CCD camera 31 for pre-alignment is disposed above an edge extending in the X direction of the substrate 1 mounted vertically on the chuck 10 indicated by a broken line. The CCD cameras 32 and 33 for pre-alignment are disposed above the edge extending in the Y direction of the substrate 1 mounted vertically on the chuck 10 indicated by broken lines.

  In the present embodiment, when the substrate transport robot 80 transports the substrate 1 from the cooling plate 40 to the chuck 10, the substrate 1 is rotated 90 degrees so that it is mounted vertically on the chuck 10 indicated by the broken line in FIG. 3. The substrate 1 is mounted horizontally on the cooling plate 40. The light emitting portion 51a and the light receiving portion 51b of the substrate edge detection sensor are disposed above and below the edge of the substrate 1 mounted horizontally on the cooling plate 40 and extending in the Y direction, and the light projecting portion 52a of the substrate edge detection sensor. The light receiving unit 52b, the light projecting unit 53a, and the light receiving unit 53b are arranged above and below the edge of the substrate 1 mounted horizontally on the cooling plate 40 and extending in the X direction.

  FIG. 4 is a plan view showing the position of the CCD camera for pre-alignment and the position of the substrate edge detection sensor for the substrate mounted horizontally on the chuck. The CCD camera 34 for pre-alignment is disposed above the edge extending in the Y direction of the substrate 1 mounted horizontally on the chuck 10 indicated by a broken line. The CCD cameras 35 and 36 for pre-alignment are disposed above the edge extending in the X direction of the substrate 1 mounted horizontally on the chuck 10 indicated by a broken line.

  The substrate 1 mounted horizontally on the chuck 10 indicated by the broken line in FIG. 4 is mounted vertically on the cooling plate 40. The light emitting portion 54a and the light receiving portion 54b of the substrate edge detection sensor are disposed above and below the edge extending in the X direction of the substrate 1 mounted vertically on the cooling plate 40, and the light projection portion 55a of the substrate edge detection sensor. The light receiving unit 55b and the light projecting unit 56a and the light receiving unit 56b are arranged above and below the edge of the substrate 1 mounted in the cooling plate 40 in the vertical direction and extending in the Y direction.

  FIG. 5 is a side view of the substrate edge detection sensor viewed in the direction of arrow A in FIG. FIG. 6 is a side view of the substrate edge detection sensor viewed in the direction of arrow B in FIG. In the present embodiment, the edges of two orthogonal sides of the substrate 1 are detected while the substrate 1 is lifted by the push-up pins 42 of the cooling plate 40. The light projecting portions 51a, 52a, 53a or 54a, 55a, 56a of the substrate edge detection sensor irradiate the edge of the substrate 1 with light having a predetermined width. The light receiving portions 51b, 52b, 53b, 54b, 55b, and 56b of the substrate edge detection sensor are composed of line sensors including a plurality of light receiving elements. Each light receiving element receives light emitted from the light projecting units 51a, 52a, 53a or 54a, 55a, 56a, and outputs a detection signal corresponding to the intensity of the received light. Since the light received through the substrate 1 and the light directly received without passing through the substrate 1 have different intensities, the detection signals of the light receiving portions 51b, 52b, 53b or 54b, 55b, 56b The intensity changes before and after the edges of

  In FIG. 1, the substrate edge detection device 50 detects the positions of the edge extending in the X direction and the edge extending in the Y direction of the substrate 1 from the detection signals of the light receiving portions 51b, 52b, 53b or 54b, 55b, 56b. The main control device 60 compares the positions of the edge extending in the X direction and the edge extending in the Y direction of the substrate 1 detected by the substrate edge detection device 50 with the reference position registered in advance, and the substrate mounted on the cooling plate 40 The position of 1 in the XY direction and the amount of deviation of the angle in the θ direction are detected.

  In order to detect the amount of deviation of the position of the substrate 1 in the XY direction and the angle in the θ direction, the edge of the substrate 1 may be detected at least one point in the XY direction. In this embodiment, the substrate 1 By detecting two edges in the X direction or the Y direction, it is possible to accurately detect the displacement of the position of the substrate 1 in the XY direction and the angle in the θ direction.

  In FIG. 1, the main controller 60 controls the stage drive circuit 70 before the substrate transport robot 80 transports the substrate 1 from the cooling plate 40 to the chuck 10 so that the chuck 10 is detected in the X and Y directions of the detected substrate 1. Is moved in the XY direction and rotated in the θ direction by the amount of the deviation of the position and the angle in the θ direction. In the present embodiment, when the substrate transport robot 80 transports the substrate 1 from the cooling plate 40 to the chuck 10, the substrate 1 is rotated by 90 degrees, so that the position of the substrate 1 mounted on the cooling plate 40 in the X direction is set. The chuck 10 is moved in the Y direction by the amount of deviation, and the chuck 10 is moved in the X direction by the amount of deviation of the position in the Y direction of the substrate 1 mounted on the cooling plate 40. Then, the chuck 10 is rotated in the θ direction by the amount of deviation of the angle in the θ direction of the substrate 1 mounted on the cooling plate 40.

  Subsequently, the substrate transport robot 80 transports the substrate 1 from the cooling plate 40 to the chuck 10. After the substrate transport robot 80 transports the substrate 1 from the cooling plate 40 to the chuck 10, the main controller 60 determines that the pre-alignment CCD cameras 31, 32, 33 or 34, 35, 36 are perpendicular to the substrate 1. Before acquiring the edge image, the stage drive circuit 70 is controlled to restore the position of the chuck 10 in the XY direction and the rotation in the θ direction.

  Before the substrate 1 is transferred from the cooling plate 40 to the chuck 10, the chuck 10 is moved in the XY direction and the θ direction by the amount of deviation of the position in the XY direction and the angle in the θ direction of the substrate 1 mounted on the cooling plate 40. Since it rotates, the substrate 1 is mounted on the chuck 10 in a posture in which there is no deviation in the position in the XY direction and the angle in the θ direction with respect to the chuck 10. Then, after the substrate 1 is transported from the cooling plate 40 to the chuck 10, the position of the chuck 10 in the XY direction and the rotation in the θ direction are restored before the images of the edges of the two orthogonal sides of the substrate 1 are acquired. The position in the XY direction and the angle in the θ direction of the substrate 1 mounted on the chuck 10 are constant.

  When the substrate 1 is mounted vertically on the chuck 10, the pre-alignment CCD cameras 31, 32, and 33 acquire images of two orthogonal edges of the substrate 1 mounted on the chuck 10. When the substrate 1 is mounted horizontally on the chuck 10, the pre-alignment CCD cameras 34, 35, 36 acquire images of two orthogonal edges of the substrate 1 mounted on the chuck 10. The image processing device 30 processes the images of the edges of the two orthogonal sides of the substrate 1 acquired by the CCD cameras 31, 32, 33 or 34, 35, 36, and the substrate mounted on the chuck 10 at the delivery position. The position in the XY direction and the angle in the θ direction are detected. The main control device 60 performs pre-alignment of the substrate 1 based on the detection result of the image processing device 30.

  According to the embodiment described above, the substrate 1 before being transported to the chuck 10 is mounted on the cooling plate 40 and cooled, and the positions of the two orthogonal edges of the substrate 1 are detected, and the cooling plate 40 is Before the substrate 1 is transported from the cooling plate 40 to the chuck 10, the chuck 10 is mounted on the cooling plate 40 before the substrate 1 is transported from the cooling plate 40 to the chuck 10. The substrate 1 is transported from the cooling plate 40 to the chuck 10 by moving in the XY direction and rotated in the XY direction by the amount of deviation of the position in the XY direction and the angle in the θ direction. Before the acquisition, the position in the XY direction and the rotation in the θ direction of the chuck 10 are restored, so that the position in the XY direction and the angle in the θ direction of the substrate 1 mounted on the chuck 10 are constant. Can be. Therefore, the substrate 1 can be transported to the chuck 10 so that the edges of the two orthogonal sides of the substrate 1 do not deviate from the visual field range of the CCD camera 31, 32, 33 or 34, 35, 36 for pre-alignment. .

  Further, two orthogonal edges of the rectangular substrate 1 mounted vertically on the chuck 10 are detected by a plurality of substrate edge detection sensors, and the two orthogonal sides of the rectangular substrate 1 mounted horizontally on the chuck 10 are detected. By detecting the edge by a plurality of other substrate edge detection sensors, it is possible to cope with both the case where the rectangular substrate 1 is mounted vertically on the chuck and the case where it is mounted horizontally.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. 1 is a side view of a proximity exposure apparatus according to an embodiment of the present invention. It is a top view which shows the position of the CCD camera for pre-alignment, and the position of a board | substrate edge detection sensor about the board | substrate mounted vertically on a chuck | zipper. It is a top view which shows the position of the CCD camera for pre-alignment, and the position of a board | substrate edge detection sensor about the board | substrate mounted horizontally on a chuck | zipper. FIG. 4 is a side view of the substrate edge detection sensor viewed in the direction of arrow A in FIG. 3. FIG. 5 is a side view of the substrate edge detection sensor viewed in the direction of arrow B in FIG. 4.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support 10 Chuck 20 Mask holder 30 Image processing device 31, 32, 33, 34, 35, 36 CCD camera 40 Cooling plate 41 units 50 Substrate edge detection devices 51a, 52a, 53a, 54a, 55a, 56a Substrate edge detection sensor (light projecting unit)
51b, 52b, 53b, 54b, 55b, 56b Substrate edge detection sensor (light receiving unit)
60 Main controller 70 Stage drive circuit 80 Substrate transfer robot 81 Handling arm

Claims (4)

A chuck for mounting a rectangular substrate;
A plurality of image acquisition devices for acquiring images of two orthogonal edges of the substrate mounted on the chuck;
A stage for moving the chuck,
A proximity exposure apparatus that performs pre-alignment of a substrate mounted on the chuck by moving the chuck by the stage based on images acquired by the plurality of image acquisition apparatuses,
A cooling plate for mounting and cooling the substrate before being transferred to the chuck;
Detecting means for detecting the positions of the edges of two orthogonal sides of the substrate mounted on the cooling plate;
Substrate transport means for transporting a substrate from the cooling plate to the chuck;
Before detecting the position of the substrate mounted on the cooling plate in the XY direction and the angle deviation in the θ direction from the detection result of the detection unit, the substrate transfer unit transfers the substrate from the cooling plate to the chuck. Further, the chuck is moved by the stage, the chuck is moved in the XY direction by the amount of deviation in the XY direction and the angle in the θ direction of the substrate mounted on the cooling plate, and rotated in the θ direction. After the substrate transport means transports the substrate from the cooling plate to the chuck, the plurality of image acquisition devices move the chuck by the stage before acquiring images of two orthogonal edges of the substrate, A proximity exposure apparatus comprising: control means for restoring the position of the chuck in the XY direction and the rotation in the θ direction. The detection means includes a plurality of sensors that detect edges of two orthogonal sides of a rectangular substrate mounted vertically on the chuck;
The proximity exposure apparatus according to claim 1, further comprising: a plurality of sensors that detect edges of two orthogonal sides of a rectangular substrate mounted horizontally on the chuck. A chuck for mounting a rectangular substrate;
A plurality of image acquisition devices that acquire images of two orthogonal edges of the substrate mounted on the chuck;
A stage for moving the chuck,
A substrate transport method for a proximity exposure apparatus that performs pre-alignment of a substrate mounted on a chuck by moving a chuck on a stage based on images acquired by a plurality of image acquisition devices,
The substrate before being transferred to the chuck is mounted on the cooling plate and cooled,
Detecting the positions of the two orthogonal edges of the substrate, detecting the position of the substrate mounted on the cooling plate in the XY direction and the angle deviation in the θ direction,
Before transporting the substrate from the cooling plate to the chuck, the chuck is moved in the XY direction and rotated in the θ direction by the amount of deviation in the XY direction position and the θ direction angle of the substrate mounted on the cooling plate,
Transfer the substrate from the cooling plate to the chuck,
A method for transporting a substrate of a proximity exposure apparatus, wherein the image is acquired by returning the position of the chuck in the XY direction and the rotation in the θ direction before acquiring images of edges of two orthogonal sides of the substrate. Two orthogonal edges of a rectangular substrate mounted vertically on the chuck are detected by multiple sensors,
4. The method of transporting a substrate of a proximity exposure apparatus according to claim 3, wherein edges of two orthogonal sides of a rectangular substrate mounted horizontally on the chuck are detected by another plurality of sensors.

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