TW201350828A - 用於將曝露於極紫外光或深紫外光而劣化之成像感測器恢復之系統及方法 - Google Patents
用於將曝露於極紫外光或深紫外光而劣化之成像感測器恢復之系統及方法 Download PDFInfo
- Publication number
- TW201350828A TW201350828A TW102113161A TW102113161A TW201350828A TW 201350828 A TW201350828 A TW 201350828A TW 102113161 A TW102113161 A TW 102113161A TW 102113161 A TW102113161 A TW 102113161A TW 201350828 A TW201350828 A TW 201350828A
- Authority
- TW
- Taiwan
- Prior art keywords
- illumination
- imaging sensor
- imaging
- recovery
- sources
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 178
- 238000000034 method Methods 0.000 title claims description 26
- 230000003716 rejuvenation Effects 0.000 title abstract description 7
- 238000005286 illumination Methods 0.000 claims abstract description 150
- 238000011084 recovery Methods 0.000 claims description 61
- 238000006731 degradation reaction Methods 0.000 claims description 20
- 230000015556 catabolic process Effects 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 238000012806 monitoring device Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000004044 response Effects 0.000 claims description 4
- 238000012544 monitoring process Methods 0.000 claims 1
- 238000007689 inspection Methods 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 229910052732 germanium Inorganic materials 0.000 description 9
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000593 degrading effect Effects 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 206010036790 Productive cough Diseases 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000001149 cognitive effect Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0228—Control of working procedures; Failure detection; Spectral bandwidth calculation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/429—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to measurement of ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J2001/0276—Protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J2001/0276—Protection
- G01J2001/0285—Protection against laser damage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- Biochemistry (AREA)
- High Energy & Nuclear Physics (AREA)
- Signal Processing (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Plasma & Fusion (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261623557P | 2012-04-12 | 2012-04-12 | |
| US13/860,230 US10096478B2 (en) | 2012-04-12 | 2013-04-10 | System and method for rejuvenating an imaging sensor degraded by exposure to extreme ultraviolet or deep ultraviolet light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201350828A true TW201350828A (zh) | 2013-12-16 |
Family
ID=49328193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102113161A TW201350828A (zh) | 2012-04-12 | 2013-04-12 | 用於將曝露於極紫外光或深紫外光而劣化之成像感測器恢復之系統及方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10096478B2 (enExample) |
| EP (1) | EP2837174A4 (enExample) |
| JP (1) | JP6181154B2 (enExample) |
| KR (2) | KR102161393B1 (enExample) |
| TW (1) | TW201350828A (enExample) |
| WO (1) | WO2013155391A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6239881B2 (ja) * | 2013-07-10 | 2017-11-29 | 浜松ホトニクス株式会社 | 画像取得装置及び画像取得方法 |
| US10361105B2 (en) * | 2014-12-03 | 2019-07-23 | Kla-Tencor Corporation | Determining critical parameters using a high-dimensional variable selection model |
| JP7067875B2 (ja) * | 2017-06-06 | 2022-05-16 | アズビル株式会社 | 火炎検出システム及び劣化指標算出装置 |
| CN117098978A (zh) * | 2021-05-11 | 2023-11-21 | 极光先进雷射株式会社 | 线传感器的劣化评价方法、谱计测装置和计算机可读介质 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4680616A (en) * | 1986-05-09 | 1987-07-14 | Chronar Corp. | Removal of defects from semiconductors |
| JP2000223541A (ja) * | 1999-01-27 | 2000-08-11 | Hitachi Ltd | 欠陥検査装置およびその方法 |
| US6831679B1 (en) * | 2000-02-17 | 2004-12-14 | Deepsea Power & Light Company | Video camera head with thermal feedback lighting control |
| JP2004014710A (ja) | 2002-06-05 | 2004-01-15 | Nikon Corp | 計測方法、被検光学系の調整方法、投影露光方法、撮像装置、計測装置、被検光学系の調整装置、投影露光装置および撮像装置の製造方法 |
| US7110113B1 (en) * | 2002-11-13 | 2006-09-19 | Kla-Tencor Technologies Corporation | Film measurement with interleaved laser cleaning |
| US7525659B2 (en) * | 2003-01-15 | 2009-04-28 | Negevtech Ltd. | System for detection of water defects |
| GB2399971B (en) | 2003-01-22 | 2006-07-12 | Proneta Ltd | Imaging sensor optical system |
| US20070030466A1 (en) * | 2004-08-09 | 2007-02-08 | Nikon Corporation | Exposure apparatus control method, exposure method and apparatus using the control method, and device manufacturing method |
| JP5042494B2 (ja) * | 2005-12-22 | 2012-10-03 | インテル コーポレイション | 散乱光の角度分布を使ったマスクブランクの欠陥の検出および特性評価 |
| US7515822B2 (en) | 2006-05-12 | 2009-04-07 | Microsoft Corporation | Imaging systems' direct illumination level adjusting method and system involves adjusting operation of image sensor of imaging system based on detected level of ambient illumination |
| US20080058602A1 (en) | 2006-08-30 | 2008-03-06 | Karl Storz Endovision | Endoscopic device with temperature based light source control |
| US20110102565A1 (en) * | 2006-09-29 | 2011-05-05 | Xinghua Wang | Spectral Imaging System |
| US8514278B2 (en) | 2006-12-29 | 2013-08-20 | Ge Inspection Technologies Lp | Inspection apparatus having illumination assembly |
| US7619227B2 (en) | 2007-02-23 | 2009-11-17 | Corning Incorporated | Method of reducing radiation-induced damage in fused silica and articles having such reduction |
| US8559014B2 (en) * | 2009-09-25 | 2013-10-15 | Hwan J. Jeong | High-resolution, common-path interferometric imaging systems and methods |
| KR101793316B1 (ko) * | 2011-03-16 | 2017-11-02 | 케이엘에이-텐코 코포레이션 | 박막 스펙트럼 순도 필터 코팅을 갖는 영상 센서를 사용하는 ｅｕｖ 화학선 레티클 검사 시스템 |
-
2013
- 2013-04-10 US US13/860,230 patent/US10096478B2/en active Active
- 2013-04-12 KR KR1020197033892A patent/KR102161393B1/ko active Active
- 2013-04-12 WO PCT/US2013/036335 patent/WO2013155391A1/en not_active Ceased
- 2013-04-12 TW TW102113161A patent/TW201350828A/zh unknown
- 2013-04-12 KR KR1020147031526A patent/KR20140143228A/ko not_active Ceased
- 2013-04-12 EP EP13775277.0A patent/EP2837174A4/en not_active Withdrawn
- 2013-04-12 JP JP2015505936A patent/JP6181154B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2837174A1 (en) | 2015-02-18 |
| JP2015521367A (ja) | 2015-07-27 |
| KR20190132699A (ko) | 2019-11-28 |
| EP2837174A4 (en) | 2016-01-06 |
| JP6181154B2 (ja) | 2017-08-16 |
| KR20140143228A (ko) | 2014-12-15 |
| US10096478B2 (en) | 2018-10-09 |
| KR102161393B1 (ko) | 2020-09-29 |
| WO2013155391A1 (en) | 2013-10-17 |
| US20130295695A1 (en) | 2013-11-07 |
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