Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/26—Bombardment with radiation
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J1/00—Photometry, e.g. photographic exposure meter
  • G01J1/02—Details
  • G01J1/0228—Control of working procedures; Failure detection; Spectral bandwidth calculation
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J1/00—Photometry, e.g. photographic exposure meter
  • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
  • G01J1/429—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to measurement of ultraviolet light
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/8806—Specially adapted optical and illumination features
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70008—Production of exposure light, i.e. light sources
  • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J1/00—Photometry, e.g. photographic exposure meter
  • G01J1/02—Details
  • G01J2001/0276—Protection
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
  • G01J1/00—Photometry, e.g. photographic exposure meter
  • G01J1/02—Details
  • G01J2001/0276—Protection
  • G01J2001/0285—Protection against laser damage
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
  • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
  • G01N21/956—Inspecting patterns on the surface of objects
  • G01N2021/95676—Masks, reticles, shadow masks

Definitions

• the present invention generally relates to a method and system for rejuvenating or repairing an imaging sensor degraded by high energy light exposure, and, in particular, a method and system for rejuvenating or repairing an imaging sensor of a mask or wafer inspection tool degraded by extreme ultraviolet light or deep ultraviolet tight exposure.
• Inspection tools and procedures are commonly implemented during the fabrication of semiconductor devices. Inspection toots are used at various stages of the semiconductor device fabrication process in order to image semiconductor wafers and the lithography masks used to form the patterns on the semiconductor wafers.
• Fabricating semiconductor devices such as logic and memory devices typically includes processing a substrate such as a semiconductor wafer using a large number of semiconductor fabrication processes to form various features and multiple levels of the semiconductor devices, in some cases, extreme ultraviolet (EUV) and/or deep ultraviolet (DUV) light are used to image the various features of a given mask or wafer.
• EUV extreme ultraviolet
• DUV deep ultraviolet
• the exposure of an imaging sensor (e.g., CCD imaging sensor) of an inspection tool to EUV or DUV light may lead to degradation of the given imaging sensor.
• the degradation of one or more imaging sensors of an inspection tool leads to reduced processing and analysis throughput.
• imaging sensor degradation is commonly countered by simply replacing a given imaging sensor once the imaging sensor has reached a selected level degradation or at pre-selected usage levels based on anticipated degradation. This technique, however, leads to increased downtime of the given inspection tool, reducing efficiency and throughput,
• an apparatus may include, but is not limited to, a rejuvenation illumination system configured to selectably illuminate a portion of an imaging sensor of an imaging system with illumination suitable for at least partially rejuvenating the imaging sensor degraded by exposure to at least one of extreme ultraviolet light or deep ultraviolet light; and a controller communicatively coupled to the rejuvenation illumination system and configured to direct the rejuvenation illumination system t illuminate the imaging sensor for one or more illumination cycles during a non-imaging state of the imaging sensor.
• a rejuvenation illumination system configured to selectably illuminate a portion of an imaging sensor of an imaging system with illumination suitable for at least partially rejuvenating the imaging sensor degraded by exposure to at least one of extreme ultraviolet light or deep ultraviolet light
• a controller communicatively coupled to the rejuvenation illumination system and configured to direct the rejuvenation illumination system t illuminate the imaging sensor for one or more illumination cycles during a non-imaging state of the imaging sensor.
• a method for rejuvenating an imaging sensor degraded by exposure to EUV or DUV light may include, but is not limited to, illuminating a portion of an imaging sensor of an imaging system during a non-imaging state of the imaging sensor with illumination suitable for at least partially rejuvenating the imaging sensor degraded by exposure to at least one of extreme ultraviolet light or deep ultraviolet light; monitoring the temperature of the imaging sensor; and responsive to the monitored temperature of the imaging sensor, establishing or maintaining the temperature of the imaging sensor by adjusting a power output level of illumination impinging on the imaging sensor.
• FIG. 1A illustrates a block diagram view of a system for rejuvenating a degraded imaging sensor, in accordance with one embodiment of the present invention.
• FIG. 18 illustrates a block diagram view of a system for rejuvenating a degraded imaging sensor, in accordance with one embodiment of the present invention.
• FIG. 1C illustrates a block diagram view of a system for rejuvenating a degraded imaging sensor, in accordance with one embodiment of the present invention.
• FIG. 2 illustrates a process flow diagram of a method for rejuvenating a degraded imaging sensor, in accordance with one embodiment of the present invention.
• FIGS. 1 A through 2 a system and method for rejuvenating an imaging sensor degraded by exposure to extreme ultraviolet (EUV) or deep ultraviolet (DUV) light is described in accordance with the present invention.
• the present disclosure is directed toward embodiments for illuminating an imaging sensor (e.g. CCD sensor) of a semiconductor wafer and mask measurement system (e.g., inspection system) degraded by exposure to EUV or DUV light.
• the system of the present invention may selectabiy illuminate a degraded imaging sensor during non- operation phases of the given imaging or measurement system.
• various embodiments of the present invention may be used to rejuvenate (i.e., reverse degradation caused by high energy light exposure) without removing the imaging sensor from the measurement or imaging system.
• the rejuvenation of the imaging sensor may be performed in-situ or ex-situ.
• the system and method of the present invention includes selectabiy illuminating th imaging sensor of given measurement or imaging system with near infrared, visible or near ultraviolet light with enough intensity to heat the substrate of the imaging sensor to, causing the temperature of the substrate of the imaging sensor to rise and therefore accelerate the imaging sensor rejuvenation process.
• FIG, 1A illustrates a block diagram view of the rejuvenating system 100, in accordance with one embodiment of the present invention.
• the system 100 may include a rejuvenation illumination system 102 configured to selectabiy illuminate one or more imaging sensors 104 of an imaging system 106.
• the illumination system 102 is suitable for at least partially rejuvenating an imaging sensor degraded by exposure to EUV or DUV light.
• the system may include a controller 108.
• the controller 108 is communicatively coupled (e.g., wireline or wireless coupling) to the rejuvenation illumination system 102.
• the controller 108 is configured to direct, or control, the rejuvenation illumination system 102 in order to illuminate the one or more imaging sensors 104 of the imaging system 106 with one or more cycles of illumination.
• the controller 108 is configured to cause the rejuvenation illumination system 102 to illuminate the imaging sensor 104 with one or more cycles of illumination (i.e., light) suitable for at least partially rejuvenating the sensor 104.
• the controller 108 is configured to cause the rejuvenation illumination system 102 to illuminate the one or more imaging sensors 104 durin one or more non-imaging states (i.e., imaging sensor is not in operation) of the imaging sensor 104. in this regard, the controller 108 is configured to cause the rejuvenation illumination system 102 to illuminate a given imaging sensor 104 at times when the imaging sensor 104 is not being used by the imaging system 106 for image detection,
• the imaging sensor 104 may include a semiconductor based imaging sensor, in one embodiment, the imaging sensor 104 include charged coupled device (CCD) imaging sensor. In a further embodiment, the imaging sensor 104 may include a silicon-based CCD sensor.
• CCD charged coupled device
• th rejuvenation illumination system 102 may include one or more illumination sources 1 10 configured to generate light suitable for at least partially rejuvenating an imaging sensor 104 degraded by exposure to high energy light, such as EUV or DUV light.
• the rejuvenation illumination system 102 may include one or more illumination sources 104 configured to generate illumination having a wavelength suitable for absorption by a substrate of the imaging sensor 104.
• the light generated and emitted by the illumination source 1 10 of the illumination system 102 may include light efficiently absorbed by the silicon substrate such that illumination from the illumination source 1 10 can adequatel heat the sensor 104.
• light having a wavelength of greate than 900 nm is generally not efficiently absorbed by a silicon substrate of a CCD detector. It is noted, however, that the particular absorption threshold for a particular implementation of the present invention is dictate to th specific absorption characteristics of the sensor 104.
• the rejuvenation illumination system 102 may include one or more illumination sources 1 10 configured to generate illumination having an energy low enough (i.e. , a wavelength large enough) to substantially avoid degradation of the imaging sensor 104.
• the light generated and emitted by the illurnination source 1 10 of the illumination system 102 may include light having a wavelength above approximately 350 nm, which is sufficient to avoid causing additional damage to the imaging sensor 104.
• the illumination source 1 0 of the rejuvenation illumination system 102 may include, but is not limited to, an one of near IR light source, a visible light source or a near UV light source,
• the one or more illumination sources 1 10 of the rejuvenating illumination system 102 should be configured to emit light between an absorption threshold and a damage threshold, which are defined by the material properties of the imaging sensor 04.
• the one or more illumination sources 1 10 of the rejuvenating illumination system 102 may be configured to emit illumination at a wavelength between 350 and 900 nm, which define the damage and absorption thresholds, respectively, for a silicon based CCD detector, 018]
• the rejuvenation illumination system 102 includes one or more illumination sources 1 10 configured to emit illumination having a power level (e.g. , 1 watt) capable of heating a substrate above a rejuvenation temperature threshold, in this regard, the rejuvenation temperature threshold is interpreted to as a temperatur required to attain a selected level of degradation reversal (i.e. , rejuvenation) in a given degraded imaging sensor 104.
• the minimum temperature threshold may be approximately 60 "C.
• the rejuvenation illumination system 102 includes one or more illumination sources 1 0 configured to emit illumination capable of limiting the heating of the substrate of a given imaging sensor 104 such that the temperature of the substrate does not exceed a selected degradation threshold.
• the minimum temperature threshold may be approximately 80 ° C.
• the one or more illumination sources 110 of the rejuvenation illumination system 102 may be configured to heat a substrate of the imaging sensor 104 to a temperature between the absorption and degradation thresholds.
• the illumination source 110 may b configured to heat the silicon substrate to a temperature between 60° and 80 °C,
• the rejuvenation illumination system 02 may include one or more illumination sources 1 10 configured to illuminate the imaging sensor 104 continuously over a selected time interval.
• the selected time interval may include, but is not limited to one hour. In another embodiment, it is recognized that the time interval may significantly exceed 1 hour.
• a time for equilibration should be allowed in order to allow the imaging sensor 104 to return to its normal operating temperature prior to a subsequent image/measurement acquisition.
• the time required for imaging sensor 104 equilibration following rejuvenation may include, but is not limited to, one minute,
• the one or more illumination sources 102 are configured to illuminate the imaging senso 104 with a series of exposure intervals.
• each exposure of the imaging sensor may last fo a selected exposure interval time.
• the exposure intervals i.e., ON state
• the exposure intervals may be separated in time by a series of "OFF*' states, wherein th duration of the "OFF" states is also selectable. It is noted herein that the summed time of exposure may include, but is not limited to, one o more hours,
• the one or more illumination sources 110 of the rejuvenation illumination system 102 may include one or more pulsed lasers.
• a short laser pulse of high intensity may act to heat substantially only the silicon of the imaging sensor in the vicinity of the interface between the silicon and the thin transparent film disposed on the top surface of the silicon, it is noted herein that a pulsed lase with a wavelength between 350 and 550 nm will not generally penetrate more than approximately I pm into silicon and wilt heat the interface, film and top tayer of silicon, it is further noted herein that since the degradation is caused by effects at the interface and in the transparent film, th present invention acts to provide heat in the imaging sensor architecture where it is effectively used.
• an exposure region of an imaging sensor it is possible to locally heat an exposure region of an imaging sensor to a high temperature (e.g., approximately 300 °C), without significantly raising the temperature of the underlying silicon or detector package.
• silicon of a CCD imaging sensor will efficiently spread heat laterally. As such, it may be necessary to mov the beam between or during pulses in order to rejuvenate the complete active area of the imaging sensor 104.
• advantage of this embodiment of the present invention includes th ability to achieve much higher temperatures than in the continuous wave case described throughout the present disclosure. Higher achievable temperatures, in turn, lead to more complete imaging sensor rejuvenation in a smaller amount of time, allowing for more frequent rejuvenation and shorter imaging system down times.
• the one or more illumination sources 1 10 of the rejuvenation illumination system 102 may include a light emitting diode. In another embodiment of the present invention, the one or more illumination sources 1 10 of the rejuvenation illumination system 102 may include a narrow band source, such as, but not limited to, a laser. In one embodiment of the present invention, the one or more illumination sources 1 10 of th rejuvenation illumination system 102 may include broadband source, such as, but not limited to a broadband lamp,
• FIGS. 1A through 1C depict various high-level block diagram views of the various configurations of the system 100 suitable for selectabty illuminating one or more portions of an imaging sensor 104, in accordance with embodiments of the present invention.
• the rejuvenation illumination system 102 may include one or more illumination sources 1 0 aligned off-axis with respect to the normal illumination pathway 106 of the inspection/imaging system 106.
• Light traveling from the output of the illumination source(s) 10 of the rejuvenation illumination system 102 does not interfere with the normal imaging process carried out by the imaging sensor 104 on the sample 105 ⁇ or mask) disposed on stage 109 In this regard, tight traveling along the optical pathway defined by the illumination source 110 and the imaging sensor 104 does not interfere with light traveling along the optical pathway 107 (e.g., collection pathway) of the imaging/inspection system 106.
• the optical pathway 107 e.g., collection pathway
• the system 100 may include one or more optical elements used to direct, focus, or filter illumination emanating from the one or more illumination sources 110,
• the system 100 may include one or more lenses 103 configured to focus illumination from the illumination sources 110 onto the imaging sensor 104,
• the configuration illustrated in FIG, A is not limiting as numerous equivalent embodiments are within the scope of the present invention.
• the illumination source 110 may be positioned at numerous positions relative to the imaging sensor 104 provided such positioning allows light emitted by th one or more illumination sources 110 to impinge on the sensor 104 along a direction that is off-axis from the optical pathway of the illumination system of the imaging/inspection system 106,
• the rejuvenation illumination system 102 may include one or more illumination sources 110 and one or more actuatable (e.g., translational or rotational) mirrors 1 2 configured to selectably establish a temporary optical pathway 116 between the one or more illumination sources 1 10 and a portion of the imaging sensor 104.
• a mirror 112 may be disposed on an actuatabl stage 1 4 (e.g., translatable stage or rotatable stage) configured to selectably move the mirror in a manner that allows for the selectable establishment of an illumination pathway 1 6 between the one or more illumination sources 102 and the imaging sensor 104 during times the sensor 104 is in a non-imaging iO state, as shown in FIG.
• the actuatable stage may be a manually actuatable stage 114, In another embodiment, actuatable stage 1 4 may be communicatively coupled to the controller 108. In a further embodiment, the controller is configured to direct the actuatable stage 1 4 to move the mirror in order to establish the temporary illumination optical pathway 116 described above.
• the system 100 may include one or more devices suitable for inhibiting light reflected from the imaging sensor 104 from entering the imaging/inspection system 106. It is noted herein that light reflected from imaging sensor 104 and the associated sensor package may cause damage or heating if the reflected light is able to travel into the imaging system 106. As such, in one embodiment, the imaging sensor 104 may be illuminated by the illumination sources 1 10 at a nonzero angle of incidence. In a further embodiment, the system 100 may include a non-reflective beam stop configured to block light reflected from one or more portions of the imaging sensor 104.
• FIG. 1C illustrates a block diagram view of a rejuvenation system 100 equipped with thermal monitoring capabilities, in accordance with one embodiment of the present invention.
• a thermal monitoring device e.g., thermocouple and the like
• the thermal monitoring device 1 16 is communicatively couple to the controller 108.
• the controller 108 may measure the temperature of one or more portions of the imaging sensor 104 and transmit the measured temperature to the controller 108.
• the controller 108 may establish and maintain a temperature of the imaging sensor 104 by directing the output power of the one or more illumination sources 110.
• the controller 108 may control the current of the LEO illumination source in order to control the output power of the illumination source 110 and thereby establish and maintain a desired temperature in the imaging sensor 104.
• the imaging system 106 is used in a normal operating mode with exposure of the imaging sensor 104 (e.g., CCD o TDI) to EUV or DUV light. After a fixed period of time of accumulated exposure (e.g., fixed based on anticipated level of degradation of the given time), a given imaging process is completed and a mirror 112 is moved into place and the one or more illumination sources 1 0 (e.g., laser, tamp or LED) of the rejuvenation system 100 are engaged.
• the imaging sensor 104 e.g., CCD o TDI
• EUV or DUV light e.g., EUV or DUV light
• a given imaging process is completed and a mirror 112 is moved into place and the one or more illumination sources 1 0 (e.g., laser, tamp or LED) of the rejuvenation system 100 are engaged.
• the one or more illumination sources 1 0 e.g., laser, tamp or LED
• the mirror is positioned into a location allowing for the temporary establishment of a rejuvenation illumination pathway 116, allowing the one or more illumination sources 110 to expose at least a portion of the imaging sensor 104 with uniform itlumination (e.g., near UV, visible or near IR light). Due to the exposure to the rejuvenating illumination, the imaging sensor 104 may b heated and the temperature may be monitored using a temperature sensor 118 (e.g., thermocouple) embedded in the substrate of the imaging sensor 104, whereby the temperature results are collected by controller 108.
• a temperature sensor 118 e.g., thermocouple
• the power output of the one or more itlumi ation sources 110 may be controlled by the controller 108 in order to stabilize the imaging sensor 104 at a selected temperature (e.g., 80° C), Then, the temperature of the imaging sensor 104 may be maintained at the selected temperature for a selected amount of time (e.g., 15 minutes).
• a new sample may be loaded onto the sample stage 1 9. Following the heating cycle of the imaging sensor 104 using the rejuvenation illumination system 102, the illumination sources may be turned off, allowing the imaging sensor 104 to cool.
• the mirror 112 Upon reaching a normal operating temperature ⁇ e.g., 35 ° C), the mirror 112 is moved in a manner to terminate the temporary rejuvenation optical pathway 116, allowing a normal imaging process to be carried out using the imaging senso 104 and the optical pathway 107,
• FIG. 2 illustrates a process flow 200 for rejuvenating an imagin sensor degraded by extreme ultraviolet or deep uitravioient light, in accordance with on ⁇ embodiment of the present invention.
• a portion of an imaging sensor of an imaging system is illuminated during a non-imaging state of the imaging sensor with illumination suitable for at least partially rejuvenating the imaging sensor degraded by exposure to at least one of extreme ultraviolet tight or deep ultraviolet light.
• the temperature of the imaging sensor is monitored.
• the temperature of the Imaging sensor may be established or maintained by adjusting a power output level of illumination imping ins on the imaging sensor.
• each of the embodiments of the method described above may include arty other step(s) of any other method(s) described herein.
• each of the embodiments of the method described above may be performed by any of the systems described herein.
• controller 108 includes a single computer system or, alternatively, a multiple computer system.
• different subsystems of the system 100 may include a computer system suitable for carrying out at least a portion of the steps described above.
• the one or more computer systems may be configured to perform any other step(s) of any of the method embodiments described herein.
• the controller 10S may include, but is not limited to, a personal computer system, mainframe computer system, workstation, image computer, parallel processor, or any other device known in the art.
• the term "computer system,” “computing systemis),” or “computer control system” may be broadly defined to encompass any device(s) having one or more processors, which execute instructions from a memory medium.
• Program instructions implementing methods such as those described herein may be transmitted over or stored on carrier medium.
• the carrier medium may be a transmission medium such as a wire, cable, or wireless transmission link.
• the carrier medium may also include a storage medium such as a read-only memory, a random access memory, a magnetic or optical disk, or a magnetic tape.

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