TW201343381A - Laminate and copper-clad laminate using same - Google Patents

Abstract

Provided is a surface-treated copper foil for copper-clad laminate, where the copper foil adheres favorably to resin and leaves the resin with outstanding transparency after the copper foil is removed by etching. In the surface-treated copper foil for copper-clad laminate, roughening particles are formed on the surface of the copper foil by means of a roughening treatment. The average roughness (Rz) of the roughening treatment surface is 0.5-1.3 μm. The gloss of the roughening treatment surface is 0.5-68, and the ratio (A/B) of the surface area (A) of the roughening particles to the area (B) obtained when the roughening particles are viewed in plan view from the copper foil surface side, is 2.00-2.45.

Description

Surface treated copper foil for copper clad laminate and copper clad laminate using same

The present invention relates to a surface-treated copper foil for a copper-clad laminate and a copper-clad laminate using the same, and more particularly to a copper-clad laminate which is preferable in the field of transparency of a resin which is required to be etched after the copper foil is etched. Surface treated copper foil and copper clad laminate using the same.

For small electronic devices such as smart phones and tablet PCs, flexible printed wiring boards (hereinafter referred to as FPCs) are used because of the ease of wiring or light weight. In recent years, with the high functionality of these electronic devices, the speed of signal transmission has been increasing, and impedance matching has become an important factor in FPC. As a method of impedance matching in response to an increase in signal capacity, a thick layer of a resin insulating layer (for example, polyimide) which is a base of an FPC has been developed. On the other hand, the FPC is processed such as bonding of a liquid crystal substrate or mounting of an IC wafer, but in this case, the alignment is visually recognized by a resin insulating layer remaining after etching through a copper foil that has passed through the copper clad laminate. Since the pattern is carried out, the visibility of the resin insulating layer becomes important.

Further, the copper clad laminate may be produced by using a rolled copper foil whose surface is subjected to rough plating. The rolled copper foil is usually produced by using hot copper (oxygen content of 100 to 500 ppm by weight) or oxygen-free copper (oxygen content of 10 ppm by weight or less) as a material for hot pressing the ingots. After the delay, the cold rolling and annealing are repeated until a certain thickness is reached. Patent Document 1 proposes to use a low-roughness electrolytic foil having a high surface gloss as a conductor layer.

On the other hand, in Patent Document 2, as a copper foil having excellent flexibility, a rolled copper foil having a depth of sump of 2.0 μm or less on a surface formed by a cold rolling step under conditions such as oil film control has been proposed.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-98659

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2001-58203

In Patent Document 1, the low-roughness copper foil obtained by the improvement of the adhesiveness by the blackening treatment or the organic treatment agent after the plating treatment is used for the purpose of requiring flexibility for the copper-clad laminate. In the case of disconnection, there is a case where the resin has poor transparency. Further, even if a rolled copper foil having a sump state as described in Patent Document 2 is used, sufficient transparency of the resin cannot be obtained. As described above, in the prior art, the resin after the rolled copper foil is removed by etching has low transparency, and the alignment of the wafer cannot be smoothly performed.

The present invention provides a copper foil for a copper-clad laminate substrate which is excellent in transparency of a resin which is excellent in adhesion to a resin and which is removed by etching.

As a result of intensive studies, the present inventors have found that the surface average roughness Rz of the side of the copper foil and the resin substrate is affected by the transparency of the resin after the copper foil is removed by etching. In other words, it was found that the larger the surface average roughness Rz of the side of the copper foil and the resin substrate, the worse the resin transparency after etching the copper foil.

The present invention, which is based on the above findings, is a surface-treated copper foil for a copper-clad laminate which has roughened particles formed on the surface of the copper foil by roughening treatment, and the average of the roughened surface is obtained. The roughness Rz is 0.5 to 1.3 μm, and the gloss of the roughened surface is 0.5 to 68, and the ratio A of the surface area A of the roughened particles to the area B obtained when the roughened particles are observed from the surface side surface of the copper foil. B is 2.00~2.45.

In one embodiment of the surface-treated copper foil for a copper-clad laminate according to the present invention, the average roughness Rz is 0.5 to 1.1 μm.

In another embodiment of the surface-treated copper foil for a copper-clad laminate according to the present invention, the average roughness Rz is 0.6 to 0.9 μm.

In still another embodiment of the surface-treated copper foil for a copper-clad laminate according to the present invention, the gloss is 1.0 to 40.

In still another embodiment of the surface-treated copper foil for a copper-clad laminate according to the present invention, the gloss is 4.8 to 35.

In still another embodiment of the surface-treated copper foil for a copper-clad laminate according to the present invention, the A/B is 2.00 to 2.30.

In still another embodiment of the surface-treated copper foil for a copper-clad laminate according to the present invention, the A/B is 2.00 to 2.15.

After the copper foil is bonded to both surfaces of the resin substrate having a thickness of 50 μm from the roughened surface side, when the copper foil is removed by etching, the light transmittance of the resin substrate is 30% or more.

In another aspect, the present invention provides a copper clad laminate which is formed by laminating the surface-treated copper foil and a resin substrate.

In still another aspect, the present invention is a printed wiring board using the surface treated copper foil of the present invention.

In another aspect, the invention is an electronic machine using the printed wiring board of the invention.

In still another aspect of the invention, there is provided a method of manufacturing a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards of the present invention.

In another aspect, the present invention is a method of manufacturing a printed wiring board to which two or more printed wiring boards are connected, comprising at least one printed wiring board of the present invention and another printed wiring board of the present invention or not The step of connecting the printed wiring boards corresponding to the printed wiring board of the present invention.

In still another aspect, the present invention is an electronic device using one or more printed wiring boards to which at least one printed wiring board of the present invention is connected.

In still another aspect, the present invention is a method of manufacturing a printed wiring board comprising at least the step of connecting the printed wiring board of the present invention to a component.

In another aspect, the present invention provides a method of manufacturing a printed wiring board to which two or more printed wiring boards are connected, comprising at least one step of printing at least one printed wiring board of the present invention and another printing of the present invention. A wiring board or a step of connecting the printed wiring board which does not correspond to the printed wiring board of the present invention; and a step of connecting the printed wiring board to which the two or more printed wiring boards of the present invention are connected, to the component.

According to the present invention, it is possible to provide a surface-treated copper foil for a copper-clad laminate substrate which is excellent in transparency of a resin which is excellent in adhesion to a resin and which is removed by etching.

Fig. 1 is an observation photograph of the printed matter of (a) Comparative Example 1, (b) Example 1, (c) Example 2, (d) Example 7, and (e) Example 3 at the time of visual evaluation.

Fig. 2 is a SEM observation photograph of the surface of the copper foil of (a) Comparative Example 1, (b) Example 1, (c) Example 2, (d) Example 7 and (e) Example 3 at the time of Rz evaluation.

(Form of surface treated copper foil and manufacturing method)

The copper foil used in the present invention may be either an electrolytic copper foil or a rolled copper foil. In general, the roughening treatment of the surface of the copper foil after degreasing is performed by the nodular plating for the purpose of improving the peeling strength of the copper foil after the copper foil is adhered to the surface of the resin substrate, that is, the roughened surface. The electrolytic copper foil has irregularities at the time of production, but the convex portion of the electrolytic copper foil is reinforced by the roughening treatment, and the unevenness is further increased. In the present invention, the roughening treatment can be carried out by copper-cobalt-nickel alloy plating. As a pretreatment before roughening, conventional copper plating or the like is performed, and as a roughening finishing treatment, usual copper plating or the like is performed in order to prevent the plating material from falling off. It is also present in the case of rolling copper foil and electrolytic copper foil, so that the contents of the treatment are slightly different. In the present invention, such an advance is also included The processing and the finishing treatment are included, and the known processing relating to the roughening of the copper foil is included as needed, and is collectively referred to as roughening treatment.

Copper roughening treatment of the present invention as - Co - Ni alloy plating may be formed by a plating deposition amount of 15 ~ 40mg / dm ² of copper -100 ~ 3000μg / dm ² of cobalt -100 ~ 900μg / dm ² It is implemented by means of a ternary alloy layer such as nickel. When the Co adhesion amount is less than 100 μg/dm ² , the heat resistance is deteriorated, and the etching property is deteriorated. When the amount of Co adhesion exceeds 3000 μg/dm ² , it is necessary to take into consideration the influence of magnetic influence, and etch stains are generated, and acid resistance and chemical resistance may be deteriorated. If the Ni adhesion amount is less than 100 μg/dm ² , the heat resistance may be deteriorated. On the other hand, when the Ni adhesion amount exceeds 900 μg/dm ² , the etching residue increases. Preferably, the Co adhesion amount is 1000 to 2000 μg/dm ² , and preferably the nickel adhesion amount is 200 to 400 μg/dm ² . Here, the term "etching stain" refers to a case where Co is not dissolved and is left in the case of etching by copper chloride, and the term "etching residue" refers to a case where alkali etching is performed by ammonium chloride, and Ni is not dissolved. And the residual situation.

An example of a common bath and plating conditions for forming such a ternary copper-cobalt-nickel alloy plating is as follows: plating bath composition: Cu 10-20 g/L, Co 1 10 g/L, Ni 1 ~10g/L

pH: 1~4

Temperature: 40~50°C

Current density D _k : 20~30A/dm ²

Plating time: 1~5 seconds

After the roughening treatment, a cobalt-nickel alloy plating layer having a cobalt content of from 200 to 3000 μg/dm ^{2 to} 100 to 700 μg/dm ² of nickel may be formed on the roughened surface. This treatment can be regarded as a rust-proof treatment in a broad sense. The cobalt-nickel alloy plating layer must be applied to such an extent that the adhesion strength between the copper foil and the substrate is substantially reduced. When the cobalt adhesion amount is less than 200 μg/dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance are deteriorated. Further, as another reason, if the amount of cobalt is small, the treated surface becomes reddish, which is not preferable. When the cobalt adhesion amount exceeds 3000 μg/dm ² , it is unfavorable when it is necessary to consider the influence of magnetic properties, and etch stains are generated, and deterioration of acid resistance and chemical resistance is considered. A preferred amount of cobalt adhesion is 500 to 3000 μg/dm ² . On the other hand, when the nickel adhesion amount is less than 100 μg/dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance are deteriorated. If the nickel exceeds 700 μg/dm ² , the alkali etching property is deteriorated. A preferred nickel adhesion amount is 200 to 600 μg/dm ² .

Further, one example of the conditions of cobalt-nickel alloy plating is as follows: plating bath composition: Co 1~20g/L, Ni 1~20g/L

pH: 1.5~3.5

Temperature: 30~80°C

Current density D _k : 1.0~20.0A/dm ²

Plating time: 0.5~4 seconds

According to the present invention, a zinc plating layer having an adhesion amount of 10 to 80 μg/dm ² is further formed on the cobalt-nickel alloy plating. When the amount of zinc adhesion is less than 10 μg/dm ² , the effect of improving the heat deterioration rate may be lost. On the other hand, if the Zn deposition amount exceeds 80μg / dm ^2, the situation is extremely deteriorated resistance ratio to hydrochloric acid deterioration of the presence. Preferably, the zinc adhesion amount is 20 to 60 μg/dm ² , more preferably 30 to 50 μg/dm ² .

One example of the above zinc plating conditions is as follows: plating bath composition: Zn 100~300g/L

pH: 3~4

Temperature: 50~60°C

Current density D _k : 0.1~0.5A/dm ²

Plating time: 1~3 seconds

Further, a zinc alloy plating layer such as zinc-nickel alloy plating may be formed instead of the zinc plating layer, or may be formed on the outermost surface by a chromate treatment or a coating of a decane coupling agent. Rust layer.

Further, in the surface-treated copper foil of the present invention, a secondary particle layer of copper may be formed on the surface of the copper foil, and a secondary particle layer composed of a ternary alloy may be formed on the primary particle layer as a roughening treatment. The ternary alloy is composed of copper, cobalt and nickel. In this case, one of the plating conditions of the primary particles of copper is as follows: plating bath composition: Cu 10~25g/L, sulfuric acid 50~100g/L

Temperature: 25~50°C

Current density D _k : 10~70A/dm ²

Plating time: 5~25 seconds

Coulomb amount 50~500As/dm ²

One example of the plating conditions of the secondary particles is as follows: plating bath composition: Cu 10~20g/L, nickel 5~15g/L, cobalt 5~15g/L

pH: 2~3

Temperature: 30~50°C

Current density D _k : 20~60A/dm ²

Plating time: 1~5 seconds

Coulomb amount 30~70As/dm ²

(surface roughness Rz)

In the surface-treated copper foil of the present invention, roughened particles are formed on the surface of the copper foil by roughening treatment, and the average roughness Rz of the roughened surface is 0.5 to 1.3 μm. With such a configuration, the peeling strength is increased, and the resin is satisfactorily adhered to, and the light transmittance of the resin after the copper foil is removed by etching is improved. As a result, alignment or the like at the time of mounting the IC wafer via the positioning pattern that is visually recognized by the resin is facilitated. When the average roughness Rz is less than 0.5 μm, the roughening treatment of the surface of the copper foil is insufficient, and it is not possible to sufficiently adhere to the resin. On the other hand, when the average roughness Rz exceeds 1.3 μm, the unevenness of the surface of the resin after the copper foil is removed by etching is increased, and as a result, The light transmittance of the resin becomes poor. The average roughness Rz of the roughened surface is preferably from 0.5 to 1.1 μm, more preferably from 0.6 to 0.9 μm.

(Transmittance)

Since the surface-treated copper foil of the present invention has the average roughness Rz of the roughened surface as described above, the light transmittance of the resin substrate on which the copper foil is removed is good after being bonded to the resin substrate. Specifically, the surface-treated copper foil of the present invention is bonded to the both sides of the resin substrate having a thickness of 50 μm from the roughened surface side, and when the copper foil is removed by etching, the light transmittance of the resin substrate can be 30. More than %, preferably more than 50%.

(Gloss)

The gloss of the roughened surface of the surface treated copper foil greatly affects the light transmittance of the above resin. That is, the copper foil having a higher glossiness of the roughened surface has a better penetration rate of the above resin. Therefore, the surface treated copper foil of the present invention has a gloss of 0.5 to 68, preferably 1.0 to 40, more preferably 4.8 to 35.

(surface area of particles)

The ratio A/B of the surface area A of the roughened particles to the area B obtained when the roughened particles are observed from the surface side of the copper foil surface has a large influence on the light transmittance of the above resin. That is, when the surface roughness Rz is the same, the copper foil having a smaller A/B ratio has a better transmittance of the resin. Therefore, the surface treated copper foil of the present invention has a ratio A/B of 2.00 to 2.45, preferably 2.00 to 2.30, more preferably 2.00 to 2.15.

The morphology or formation density of the particles can be determined by controlling the current density at the time of particle formation and the plating time, and the surface roughness Rz, the glossiness, and the area ratio A/B of the particles can be controlled.

The surface-treated copper foil of the present invention can be bonded to the resin substrate from the roughened surface side to produce a copper clad laminate. The resin substrate is not particularly limited as long as it has characteristics suitable for use in a printed wiring board or the like. For example, for a rigid PWB application, a paper substrate phenol resin, a paper substrate epoxy resin, or a synthetic fiber cloth substrate ring can be used. Oxygen resin, glass cloth-paper composite substrate epoxy resin, glass cloth-glass non-woven composite substrate epoxy resin, glass cloth substrate epoxy resin, etc. For FPC use, a polyester film or a polyimide film can be used.

In the case of hard PWB use, a prepreg is prepared in which a substrate such as a glass cloth is impregnated with a resin to cure the resin to a semi-hardened state. This can be carried out by laminating the surface of the copper foil from the opposite side of the coating layer to the prepreg and heating and pressing it.

The copper-clad laminate of the present invention can be used for various printed wiring boards (PWB), and is not particularly limited. For example, from the viewpoint of the number of layers of the conductor pattern, it can be applied to a single-sided PWB, a double-sided PWB, or a multilayer PWB ( Three or more layers are applicable to hard PWB, flexible PWB (FPC), and hard/flexible PWB from the viewpoint of the type of the insulating substrate material.

(Layering board and positioning method using the printed wiring board using the same)

A method of positioning the laminated sheet of the surface-treated copper foil and the resin substrate of the present invention will be described. First, a laminate of a surface-treated copper foil and a resin substrate is prepared. Specific examples of the laminated sheet of the surface-treated copper foil and the resin substrate of the present invention include a laminated board produced by the main substrate, the attached circuit board, and the flexibility for electrically connecting the same. In an electronic device having a printed circuit board, the flexible printed circuit board is accurately positioned and pressed against the wiring end portion of the main body substrate and the attached circuit board, wherein the flexible printed circuit board is a resin substrate such as polyimide. At least one surface is formed with a copper wiring. In other words, in this case, the laminated board is a laminated body in which the wiring end portions of the flexible printed circuit board and the main substrate are bonded by pressure bonding, or the flexible printed circuit board and the circuit are bonded by pressure bonding. A laminated board to which the wiring ends of the substrate are bonded. The laminate has indicia formed from a portion of the copper wiring or other material. The position of the mark is not particularly limited as long as it can be photographed by a resin such as a CCD camera through the resin constituting the laminate. Here, the mark refers to a mark (mark) for detecting the position or positioning of a laminated board, a printed wiring board, or the like.

In the laminate prepared in this manner, if the mark is photographed by a photographing means through the resin, the position of the mark can be satisfactorily detected. Moreover, the position of the mark can be detected in such a manner, and based on the position of the detected mark, the table can be performed well. The surface of the laminate of the copper foil and the resin substrate is treated. Further, in the case where a printed wiring board is used as the laminated board, the photographing means can similarly detect the position of the mark by such a positioning method, thereby more accurately positioning the printed wiring board.

Therefore, it is considered that when one printed wiring board is connected to another printed wiring board, connection failure is reduced and the yield is improved. Further, as a method of connecting one printed wiring board to another printed wiring board, a connection via solder or an anisotropic conductive film (ACF) or an anisotropic conductive paste (Anisotropic Conductive Paste) can be used. A known connection method such as connection of ACP) or connection via a conductive adhesive. Further, in the present invention, the "printed wiring board" also includes a printed wiring board on which components are mounted, a printed circuit board, and a printed circuit board. Further, two or more printed wiring boards of the present invention may be connected to each other to manufacture a printed wiring board to which two or more printed wiring boards are connected, and at least one printed wiring board of the present invention and another printing of the present invention may be used. A wiring board or a printed wiring board which does not correspond to the printed wiring board of the present invention is connected, and an electronic device is manufactured using such a printed wiring board. Furthermore, in the present invention, the copper wiring is also included in the "copper circuit". Further, the printed wiring board of the present invention can be connected to a component to manufacture a printed wiring board. Further, at least one of the printed wiring boards of the present invention may be connected to another printed wiring board of the present invention or a printed wiring board which does not correspond to the printed wiring board of the present invention, and further, the connection of the present invention is two. The printed wiring board of the above printed wiring board is connected to the component, whereby a printed wiring board in which two or more printed wiring boards are connected is manufactured. Here, examples of the "parts" include electronic components such as a connector, an LCD (Liquid Crystal Display), and a glass substrate used in an LCD, and include an IC (Integrated Circuit) and an LSI (Large scale integrated circuit). Electronic components such as IC chips, large-scale integrated circuits, VLSI (Very Large Scale Integrated Circuit), and ULSI (Ultra-Large Scale Integration) LSI wafer, VLSI wafer, ULSI wafer); components for shielding (protecting) electronic circuits from electromagnetic waves, etc., and parts required for fixing a mask or the like to a printed wiring board.

Furthermore, the positioning method according to the embodiment of the present invention may include a step of moving a laminate (including a laminate of a copper foil and a resin substrate or a printed wiring board). In the moving step, for example, it can be moved by a conveyor such as a belt conveyor or a chain conveyor, or moved by a moving device having an arm mechanism, or moved by floating the laminated plate by using a gas. a mobile device or a moving means, or a moving device or a moving means (including a roller or a bearing) that moves a laminated plate by rotating an object such as a substantially cylindrical shape, a moving device that uses a hydraulic pressure as a power source, or Moving means, moving device or moving means using air pressure as power source, moving device or moving means using motor as power source, and linear guiding platform with bracket moving type, bracket moving air guiding platform, stacked linear guiding The mobile device or moving means of the platform such as the platform and the linear motor drive platform moves. Further, a moving step of a known moving means can be performed.

Furthermore, the positioning method of the embodiment of the present invention can also be applied to a surface mounter or a chip mounter.

Further, the laminated board of the surface-treated copper foil and the resin substrate which are positioned in the present invention may be a printed wiring board having a resin board and a circuit provided on the resin board. Moreover, in this case, the above-mentioned mark may be the above circuit.

In the present invention, "positioning" includes "the case of detecting the position of a mark or an object". Further, in the present invention, the "alignment" includes a case where the marker or the object is moved to a specific position based on the detected position after detecting the position of the marker or the object.

[Examples]

In Examples 1 to 15 and Comparative Examples 1 to 8, copper foil was prepared, and plating treatment was performed on one surface under the conditions described in Tables 1 to 4 as a roughening treatment. Here, the rolled copper foil of the fine copper (JIS H3100 C1100R) manufactured by JX Nippon Mining & Metal Co., Ltd. was used as the copper foils of Examples 1 to 12 and Comparative Examples 2 to 6, 8. Further, an electrolytic copper foil HLPLC foil manufactured by JX Nippon Mining & Metal Co., Ltd. was used as the copper foils of Examples 13 to 15 and Comparative Examples 1 and 7.

Each of the samples of the examples and comparative examples produced as described above was subjected to various evaluations as follows.

(1) Determination of surface roughness (Rz);

The ten-point average roughness of the roughened surface was measured in accordance with JIS B0601-1994 using a contact roughness meter SP-11 manufactured by Kosaka Research Institute Co., Ltd. The measurement position was changed in parallel with the rolling direction under the conditions of a measurement reference length of 0.8 mm, an evaluation length of 4 mm, a cutoff value of 0.8 mm, and a conveyance speed of 0.1 mm/sec, and the measurement was performed ten times to obtain the value in ten measurements.

(2) area ratio of particles (A/B);

The surface area of the roughened particles is determined using a laser microscope. The three-dimensional surface area A in the area equivalent to 100 × 100 μm (9924.4 μm ² in the actual data) of the roughened surface was measured using a laser microscope VK8500 manufactured by KEYENCE Co., Ltd., and by a three-dimensional surface area A ÷ The method of dimension surface area B = area ratio (A/B) is set.

(3) glossiness;

The roughened surface was measured at an incident angle of 60 degrees in a direction perpendicular to the rolling direction using a gloss meter portable gloss meter PG-1 manufactured by Nippon Denshoku Co., Ltd. according to JIS Z8741.

(4) light transmittance;

The copper foil was bonded to both surfaces of a polyimide film (thickness: 50 μm) to which a thermosetting adhesive for lamination was applied, and the copper foil was removed by etching (aqueous solution of ferric chloride) to prepare a sample film. The obtained resin layer was measured using a spectrophotometer V-660 manufactured by JASCO Corporation, and the light transmittance was measured by setting a slit of 10 mm and a wavelength of 620 nm.

(5) visibility (resin transparency);

The copper foil was bonded to both surfaces of a polyimide film (thickness: 50 μm) to which a thermosetting adhesive for lamination was applied, and the copper foil was removed by etching (aqueous solution of ferric chloride) to prepare a sample film. The printed matter is adhered to one side of the obtained resin layer, and the visibility of the printed matter is determined from the opposite side through the resin layer. The outline of the printed matter was evaluated as "○" (passed), and the profile deformed was evaluated as "x" (failed).

(6) peel strength (follow strength);

According to PC-TM-650, the normal peel strength was measured by a tensile tester AUTOGRAPH 100, and the normal peel strength of 0.7 N/mm or more was used as a substrate for a copper clad laminate.

Further, in the printed wiring board or the copper clad laminate, the surface roughness (Rz) and the area ratio of the particles (2) can be measured on the surface of the copper circuit or the copper foil by dissolving and removing the resin ( A/B), and (3) gloss.

The conditions and evaluation of each of the above tests are shown in Table 5.

(Evaluation results)

The penetration rates, visibility, and peel strength of Examples 1 to 15 were all good.

In Comparative Examples 1, 2, and 5, the average roughness Rz of the roughened surface exceeded 1.3 μm, so the transmittance was poor.

In Comparative Example 3, the glossiness exceeded 68, so the peel strength was poor.

In Comparative Example 4, the area ratio A/B was less than 2.00, so the peel strength was poor.

In Comparative Example 6, the average roughness Rz of the roughened surface was less than 0.5 μm, so the peel strength was poor.

In Comparative Example 7, the glossiness was less than 0.5, so the transmittance was poor.

In Comparative Example 8, the area ratio A/B exceeded 2.45, so the transmittance was poor.

Fig. 1 shows the observations of (a) Comparative Example 1, (b) Example 1, (c) Example 2, (d) Example 7 and (e) Example 3 at the time of the above-mentioned visibility evaluation. photo.

Fig. 2 shows the surface of the copper foil of (a) Comparative Example 1, (b) Example 1, (c) Example 2, (d) Example 7 and (e) Example 3 in the above Rz evaluation. SEM observation photos.

Claims (17)

A surface-treated copper foil for a copper-clad laminate, wherein coarsened particles are formed on the surface of the copper foil by roughening treatment, and an average roughness Rz of the roughened surface is 0.5 to 1.3 μm, and the surface is roughened The ratio A/B of the surface area A of the roughened particles and the area B obtained by observing the roughened particles from the plane of the surface of the copper foil is from 2.00 to 2.45. The surface-treated copper foil for a copper-clad laminate according to the first aspect of the invention, wherein the average roughness Rz is 0.5 to 1.1 μm. The surface-treated copper foil for a copper-clad laminate according to the second aspect of the invention, wherein the average roughness Rz is 0.6 to 0.9 μm. The surface-treated copper foil for a copper-clad laminate according to the first aspect of the invention, wherein the gloss is 1.0 to 40. A surface-treated copper foil for a copper-clad laminate according to the fourth aspect of the invention, wherein the gloss is 4.8 to 35. The surface-treated copper foil for a copper-clad laminate according to the first aspect of the patent application, wherein the A/B is 2.00 to 2.30. A surface-treated copper foil for a copper-clad laminate according to claim 6 wherein the A/B is 2.00 to 2.15. The surface-treated copper foil for a copper-clad laminate according to the first aspect of the invention, wherein the copper foil is bonded to both sides of a resin substrate having a thickness of 50 μm from the roughened surface side, and then When the copper foil is removed, the light transmittance of the resin substrate is 30% or more. A copper-clad laminate comprising a surface-treated copper foil according to any one of claims 1 to 8 and a resin substrate. A printed wiring board using the surface-treated copper foil according to any one of claims 1 to 8. An electronic machine using the printed wiring board of claim 10 of the patent application. A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected, which is a method of connecting two or more printed wiring boards of claim 10 of the patent application. A method of manufacturing a printed wiring board to which two or more printed wiring boards are connected, comprising at least one printed wiring board of claim 10 and another printed wiring board of claim 10 or not The step of connecting the printed wiring board of the printed wiring board of claim 10 of the patent application. An electronic device using one or more printed wiring boards to which at least one printed wiring board of claim 12 is connected. An electronic device using one or more printed wiring boards to which at least one printed wiring board of claim 13 is connected. A method of manufacturing a printed wiring board comprising at least the step of connecting a printed wiring board of claim 10 to a component. A method of manufacturing a printed wiring board to which two or more printed wiring boards are connected, comprising at least one step of printing at least one printed wiring board of claim 10 and printing wiring of another application patent item 10 The board is not equivalent to the step of connecting the printed wiring board of the printed wiring board of claim 10; and the connection of the printed wiring board of claim 10 or the connection of the patent application section 13 has two or more printing The step of connecting the printed wiring board of the wiring board to the parts.