JP6364162B2 - Method for manufacturing printed wiring board - Google Patents

Description

  The present invention relates to a substrate, a metal foil or a metal plate, and a laminate, a printed wiring board, an electronic device, and a method for manufacturing a printed wiring board.

  In a small electronic device such as a smartphone or a tablet PC, a flexible printed wiring board (hereinafter referred to as FPC) is adopted because of easy wiring and light weight. In recent years, with the enhancement of functions of these electronic devices, the signal transmission speed has been increased, and impedance matching has become an important factor in FPC. As a measure for impedance matching with respect to an increase in signal capacity, a resin insulation layer (for example, polyimide) serving as a base of an FPC has been increased in thickness. On the other hand, processing such as bonding to a liquid crystal substrate and mounting of an IC chip is performed on the FPC, but the alignment at this time is the resin insulation remaining after etching the copper foil in the laminate of the copper foil and the resin insulating layer The visibility of the resin insulation layer is important because it is performed through a positioning pattern that is visible through the layer.

  Moreover, the copper clad laminated board which is a laminated board of copper foil and a resin insulating layer can also be manufactured even if it uses the rolled copper foil by which roughening plating was given to the surface. This rolled copper foil usually uses tough pitch copper (oxygen content of 100 to 500 ppm by weight) or oxygen-free copper (oxygen content of 10 ppm by weight or less) as a raw material, and after hot rolling these ingots, It is manufactured by repeating cold rolling and annealing to a thickness.

As such a technique, for example, in Patent Document 1, a polyimide film and a low-roughness copper foil are laminated, and a light transmittance at a wavelength of 600 nm of the film after copper foil etching is 40% or more, a haze value. An invention relating to a copper clad laminate having (HAZE) of 30% or less and an adhesive strength of 500 N / m or more is disclosed.
Further, Patent Document 2 has an insulating layer in which a conductive layer made of electrolytic copper foil is laminated, and the light transmittance of the insulating layer in the etching region when the circuit is formed by etching the conductive layer is 50% or more. In a flexible printed wiring board for chip-on-flex (COF), the electrolytic copper foil has a rust-proofing layer made of a nickel-zinc alloy on an adhesive surface bonded to an insulating layer, and the surface roughness (Rz) of the adhesive surface ) Is 0.05 to 1.5 μm, and the specular gloss at an incident angle of 60 ° is 250 or more, and an invention relating to a flexible printed wiring board for COF is disclosed.
Moreover, in patent document 3, in the processing method of the copper foil for printed circuits, after the roughening process by copper-cobalt-nickel alloy plating on the surface of copper foil, a cobalt-nickel alloy plating layer is formed, and also zinc-nickel An invention relating to a method for treating a copper foil for printed circuit, characterized by forming an alloy plating layer is disclosed.

  JP 2004-98659 A   WO2003 / 096776   Japanese Patent No. 2849059

In Patent Document 1, a low-roughness copper foil obtained by improving adhesion with an organic treatment agent after blackening treatment or plating treatment is broken due to fatigue in applications where flexibility is required for a copper-clad laminate. May be inferior in resin transparency.
Moreover, in patent document 2, the roughening process is not made and the adhesive strength of copper foil and resin is low and inadequate in uses other than the flexible printed wiring board for COF.
Furthermore, in the processing method described in Patent Document 3, Cu-Co-Ni fine processing on the copper foil was possible, but the resin after bonding the copper foil with the resin and removing it by etching was excellent. Transparency is not realized.
The present invention provides a base material excellent in transparency, a metal foil or metal plate excellent in transparency of the base material after being well bonded to the base material and removing the metal foil or metal plate by etching, and Provided laminates, printed wiring boards and electronic devices used. Moreover, this invention provides the manufacturing method of the printed wiring board which can produce efficiently with sufficient precision using the base material excellent in transparency.

  As a result of extensive research, the present inventors have controlled the ten-point average roughness Rz of a part or the whole of at least one surface to a predetermined multiple or less with respect to the wavelength λ of light incident on the substrate surface. Thus, it has been found that the transparency of the substrate is improved.

  In one aspect of the present invention completed based on the above knowledge, when the wavelength of light incident on the substrate surface is λ, the ten-point average roughness Rz of at least a part of or the entire surface is 2. The base material is 1 × λ or less.

  In another aspect of the present invention, a base material having a local peak sum average distance S of 4.1 × λ or less at least part of one surface or the whole when the wavelength of light incident on the base material surface is λ. It is.

  In yet another aspect of the present invention, the wavelength of light incident on the substrate surface is set to λ with respect to the substrate surface after the copper foil is laminated on the substrate surface and subsequently removed by etching. Is a copper foil having a 10-point average roughness Rz of 2.1 × λ or less on a part or the whole of at least one surface.

  In yet another aspect of the present invention, the wavelength of light incident on the substrate surface is set to λ with respect to the substrate surface after the copper foil is laminated on the substrate surface and subsequently removed by etching. In this case, the copper foil is such that at least one part of the surface or the entire local summit average interval S is 4.1 × λ or less.

  In still another aspect of the present invention, the present invention provides a laminated plate configured by laminating the copper foil of the present invention and a base material.

  In still another aspect, the present invention is a printed wiring board using the substrate of the present invention.

  In yet another aspect, the present invention is a printed wiring board using the laminate of the present invention.

  In still another aspect, the present invention is an electronic device using the printed wiring board of the present invention.

  In yet another aspect, the present invention is a method of manufacturing a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards of the present invention.

  In yet another aspect, the present invention includes a step of connecting at least one printed wiring board of the present invention and another printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention. This is a method of manufacturing a printed wiring board in which two or more printed wiring boards are connected.

  In still another aspect, the present invention is a method for manufacturing a printed wiring board, comprising at least a step of connecting the printed wiring board of the present invention and a component.

In another aspect of the present invention,
A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected by joining a first printed wiring board and a second printed wiring board,
The first and second printed wiring boards have a base material and wiring,
The first printed wiring board has a mark,
The ten-point average roughness Rz of a part or the entire surface of the substrate of the first printed wiring board is 2.1 × (wavelength λ of light used for mark detection) or less,
Irradiating the mark on the first printed wiring board with light through the substrate of the first printed wiring board;
Detecting the transmitted light or reflected light of the irradiated light;
Detecting a position of the mark based on a position where the transmitted light or reflected light is detected; and
Positioning the first printed wiring board and / or the second printed wiring board based on the position of the detected mark;
Is a method of manufacturing a printed wiring board including

In another aspect of the present invention,
A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected by joining a first printed wiring board and a second printed wiring board,
The first and second printed wiring boards have a base material and wiring,
The first printed wiring board has a mark,
A partial or total local summit average interval S of the surface of the substrate of the first printed wiring board is 4.1 × (wavelength λ of light used for mark detection) or less,
Irradiating the mark on the first printed wiring board with light through the substrate of the first printed wiring board;
Detecting the transmitted light or reflected light of the irradiated light;
Detecting a position of the mark based on a position where the transmitted light or reflected light is detected; and
Positioning the first printed wiring board and / or the second printed wiring board based on the position of the detected mark;
Is a method of manufacturing a printed wiring board including

  According to the present invention, a base material excellent in transparency, a metal foil or metal plate excellent in transparency of the base material after being well bonded to the base material and removing the metal foil or metal plate by etching, and A laminated board, a printed wiring board, and an electronic device using the same can be provided. Moreover, according to this invention, the manufacturing method of the printed wiring board which can be efficiently produced with sufficient precision using the base material excellent in transparency can be provided.

〔Base material〕
The base material that can be used in the present invention preferably has characteristics applicable to printed wiring boards and the like, for example, paper base phenolic resin, paper base epoxy resin, synthetic fiber cloth base epoxy resin for rigid PWB. Glass cloth / paper composite base material epoxy resin, glass cloth / glass nonwoven fabric composite base material epoxy resin, glass cloth base material epoxy resin, etc. are used, polyester film, polyimide film, liquid crystal polymer (LCP) film etc. for FPC Can be used.

  Although the thickness in particular of the base material of this invention is not restrict | limited, For example, it can be set as 1-10000 micrometers, 5-5000 micrometers, 10-1000 micrometers, or 15-500 micrometers.

In the substrate of the present invention, when the wavelength of light incident on the substrate surface is λ, the ten-point average roughness Rz of at least a part of or the entire surface is 2.1 × λ or less. According to such a configuration, since irregular reflection (diffuse reflection) of light on the substrate surface can be suppressed, the intensity of reflected light or transmitted light used for mark detection is less likely to become weak, which is effective. It is.
Further, the base material of the present invention preferably has a ten-point average roughness Rz of at least one of the surfaces or the entire surface of 1.6 × λ or less, more preferably 1.1 × λ or less. More preferably, it is 0.8 × λ or less.
When the incident light is not short-wavelength light, the wavelength having the highest light intensity is defined as λ.
The lower limit of Rz need not be specified, but typically, for example, 0.0001 × λ or more, or 0.0005 × λ or more, or 0.001 × λ or more, or 0.002 × λ or more. It is.

In the base material of the present invention, when the wavelength of light incident on the surface of the base material is λ, a local peak sum average interval S of at least one of the surfaces or the entire surface is 4.1 × λ or less. Here, S indicates an average interval S between local peaks defined in JIS B0601-1994. According to such a configuration, since irregular reflection (diffuse reflection) of light on the substrate surface can be suppressed, the intensity of reflected light or transmitted light used for mark detection is less likely to become weak, which is effective. It is.
Further, in the base material of the present invention, a local peak sum average distance S of at least one of the surfaces or the whole is preferably 3.6 × λ or less, more preferably 3.1 × λ or less, It is still more preferably 2.6 × λ or less, even more preferably 2.1 × λ or less, even more preferably 1.6 × λ or less.
When the incident light is not single wavelength light, the wavelength having the highest light intensity is defined as λ.
The lower limit of S need not be specified, but typically, for example, 0.00001 × λ or more, or 0.00005 × λ or more, or 0.0001 × λ or more, or 0.0002 × λ or more. Or 0.001 × λ or more.

[Production method of substrate]
The substrate of the present invention can be produced by the following four methods.
(1) Etching is performed on the substrate surface using an etching solution. (2) The substrate surface is processed by laser irradiation.
(3) The substrate surface is mechanically polished with a grindstone or buff (abrasive grains 4500 to 6000, 1000 to 2000 rpm, 1 to 120 seconds).
(4) After the metal foil or metal plate having a predetermined surface form is bonded to the base material from the surface side, the metal foil or metal plate is removed by etching or the like, whereby the surface form of the metal foil or metal plate Is transferred to the substrate surface.
Even if the etching is not performed, the substrate may be used as it is without performing the above (1) to (4) if the desired values of Rz and S of the surface are satisfied.

The etching conditions used in the manufacturing method (1) are shown below.
When the substrate is a resin, etching is performed in the following order.
(Etching condition A)
Etching solution: 30-50 g / L KMnO ₄ or NaMnO ₄ , 20 g / L NaOH, remaining water Treatment temperature: room temperature Soaking time: 15-25 minutes Stirrer rotation speed: 200-400 rpm
(Etching condition B)
Etching solution: 70 to 110 g / L KMnO ₄ or NaMnO ₄ , 3 to 10 g / L HCl, remaining water Treatment temperature: 47 to 52 ° C.
・ Immersion time: 15 to 35 minutes ・ Stirrer rotation speed: 200 to 400 rpm
(Neutralization conditions)
-Neutralization treatment solution: L-ascorbic acid 60-100 g / L
・ Processing temperature: Room temperature ・ Immersion time: 3-5 minutes ・ No stirring

When the substrate is inorganic, etching is performed under the following conditions.
(Etching condition 1)
Etching treatment liquid: ammonium hydrogen fluoride 1-3 mass%, remaining water Treatment temperature: 30-50 ° C
・ Immersion time: 10 to 30 minutes ・ Stirrer rotation speed: 200 to 400 rpm

(Etching condition 2)
Etching treatment liquid: An etching liquid containing hydrofluoric acid and / or ammonium hydrogen fluoride and phosphoric acid and / or ammonium phosphate salt and containing ammonium hydrogen fluoride and / or ammonium phosphate salt. Thus, hydrofluoric acid and / or ammonium hydrogen fluoride is 0.05 to 5% by weight, phosphoric acid and / or ammonium phosphate is 0.3 to 50% by weight, and the balance is water.
-Processing temperature: 30-50 ° C
・ Immersion time: 10 to 30 minutes ・ Stirrer rotation speed: 200 to 400 rpm

(Etching condition 3)
Etching is performed with a solution containing aluminum halide in the etching solution under the etching treatment condition 2. The other conditions are the same as the etching process condition 2.

  In the production methods (2) and (3) above, laser irradiation or mechanical polishing with a grindstone can be performed using a general laser irradiation apparatus or mechanical polishing apparatus.

  In the production method of (4) above, the metal foil or metal plate to be bonded to the substrate is not particularly limited. For example, nickel foil, aluminum foil, alloy foil, nickel plate, aluminum plate, alloy plate, etc. are used. Typically, a copper foil can be used. Here, the copper foil will be specifically described.

  The copper foil used in the present invention may be either an electrolytic copper foil or a rolled copper foil. There is no restriction | limiting in particular also about the thickness of the copper foil which can be used for this invention, What is necessary is just to adjust to the thickness suitable for practical use suitably. For example, it can be about 2 to 300 μm. However, when the copper foil of the present invention is also used as a circuit material, the copper foil thickness is 5 to 105 μm, preferably 12 to 70 μm, and typically about 18 to 35 μm.

  Usually, the surface of the copper foil that adheres to the base material, that is, the roughened surface, has a fist-like electric surface on the surface of the copper foil after degreasing in order to improve the peel strength of the copper foil after lamination. A roughening process is carried out to wear. Although the electrolytic copper foil has irregularities at the time of manufacture, the irregularities are further increased by enhancing the convex portions of the electrolytic copper foil by roughening treatment. In the present invention, this roughening treatment can be performed by copper-cobalt-nickel alloy plating, copper-nickel-phosphorus alloy plating, or the like. Ordinary copper plating or the like may be performed as a pretreatment before roughening, and ordinary copper plating or the like may be performed as a finishing treatment after roughening in order to prevent electrodeposits from dropping off. The content of treatment may be somewhat different between the rolled copper foil and the electrolytic copper foil.

  The rolled copper foil includes a copper alloy foil containing one or more elements such as Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, and V. When the concentration of the above elements increases (for example, 10% by mass or more in total), the conductivity may decrease. The conductivity of the rolled copper foil is preferably 50% IACS or more, more preferably 60% IACS or more, and still more preferably 80% IACS or more.

Copper as roughening treatment - cobalt - nickel alloy plating, by electrolytic plating, coating weight is to be the 15~40mg / dm ² of copper -100~3000μg / dm ² of cobalt -100~1500μg / dm ² of nickel It can be carried out so as to form a ternary alloy layer. When the adhesion amount of Co is less than 100 μg / dm ² , the heat resistance may deteriorate and the etching property may deteriorate. If the amount of Co deposition exceeds 3000 μg / dm ² , it is not preferable when the influence of magnetism must be taken into account, etching spots may occur, and acid resistance and chemical resistance may deteriorate. When the Ni adhesion amount is less than 100 μg / dm ² , the heat resistance may deteriorate. On the other hand, if the Ni adhesion amount exceeds 1500 μg / dm ² , the etching residue may increase. A preferable Co adhesion amount is 1000 to 2500 μg / dm ² , and a preferable nickel adhesion amount is 500 to 1200 μg / dm ² . Here, the etching stain means that Co remains without being dissolved when etched with copper chloride, and the etching residue means that Ni remains without being dissolved when alkaline etching is performed with ammonium chloride. It means that.

An example of a general bath and plating conditions for forming such a ternary copper-cobalt-nickel alloy plating is as follows:
Plating bath composition: Cu 10-20 g / L, Co 1-10 g / L, Ni 1-10 g / L
pH: 1-4
Temperature: 30-50 ° C
Current density D _k : 20 to 30 A / dm ²
Plating time: 1-5 seconds

After the roughening treatment, a cobalt-nickel alloy plating layer of nickel having an adhesion amount of 200 to 3000 μg / dm ² and cobalt-100 to 700 μg / dm ² can be formed on the roughened surface. This treatment can be regarded as a kind of rust prevention treatment in a broad sense. This cobalt-nickel alloy plating layer needs to be performed to such an extent that the adhesive strength between the copper foil and the substrate is not substantially reduced. If the amount of cobalt adhesion is less than 200 μg / dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance may be deteriorated. As another reason, if the amount of cobalt is small, the treated surface becomes reddish, which is not preferable. If the amount of cobalt deposition exceeds 3000 μg / dm ² , it is not preferable when the influence of magnetism must be taken into account, and etching spots may occur, and acid resistance and chemical resistance may deteriorate. A preferable cobalt adhesion amount is 500-2500 microgram / dm < ² >. On the other hand, if the nickel adhesion amount is less than 100 μg / dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance may be deteriorated. When nickel exceeds 1300 microgram / dm < ² >, alkali etching property will worsen. A preferable nickel adhesion amount is 200 to 1200 μg / dm ² .

An example of the conditions for cobalt-nickel alloy plating is as follows:
Plating bath composition: Co 1-20 g / L, Ni 1-20 g / L
pH: 1.5-3.5
Temperature: 30-80 ° C
Current density D _k : 1.0 to 20.0 A / dm ²
Plating time: 0.5-4 seconds

According to the present invention, a zinc plating layer having an adhesion amount of 30 to 250 μg / dm ² is further formed on the cobalt-nickel alloy plating. If the zinc adhesion amount is less than 30 μg / dm ² , the heat deterioration rate improving effect may be lost. On the other hand, when the zinc adhesion amount exceeds 250 μg / dm ² , the hydrochloric acid resistance deterioration rate may be extremely deteriorated. Preferably, the zinc adhesion amount is 30 to 240 μg / dm ² , more preferably 80 to 220 μg / dm ² .

An example of the galvanizing conditions is as follows:
Plating bath composition: Zn 100 to 300 g / L
pH: 3-4
Temperature: 50-60 ° C
Current density D _k : 0.1 to 0.5 A / dm ²
Plating time: 1-3 seconds

  A zinc alloy plating layer such as zinc-nickel alloy plating may be formed instead of the zinc plating layer, and a rust prevention layer may be formed on the outermost surface by chromate treatment or application of a silane coupling agent. Good.

[Surface roughness Rz]
In the copper foil of the present invention, roughened particles are formed on the surface of the copper foil by the roughening treatment, and the average roughness Rz of the TD on the roughened treatment surface may be controlled to 0.30 to 0.80 μm. . With such a configuration, the peel strength is increased and the substrate is satisfactorily adhered to the substrate, and the degree of haze (haze value) of the substrate after the copper foil is removed by etching is reduced and the transparency is increased. . As a result, alignment and the like when mounting an IC chip through a positioning pattern that is visible through the substrate are facilitated. When the average roughness Rz of TD is less than 0.30 μm, the surface of the copper foil is not sufficiently roughened and cannot be sufficiently adhered to the substrate. On the other hand, when the average roughness Rz of TD is more than 0.80 μm, the unevenness on the surface of the base material after the copper foil is removed by etching increases, and as a result, the haze value of the base material increases. The average roughness Rz of the TD on the roughened surface is preferably 0.30 to 0.70 μm, more preferably 0.35 to 0.60 μm, still more preferably 0.35 to 0.55 μm, and 0.35 to Even more preferred is 0.50 μm.

[Glossiness]
The glossiness at an incident angle of 60 degrees in the rolling direction (MD) of the roughened surface of the copper foil greatly affects the haze value of the substrate. That is, the haze value of the above-mentioned substrate becomes smaller as the copper foil has a higher glossiness on the roughened surface. For this reason, the copper foil of the present invention has a glossiness of the roughened surface of 80 to 350%, preferably 90 to 300%, more preferably 90 to 250%, and 100 to 250%. More preferably.

  Here, in order to further improve the visibility effect of the present invention, it is also important to control the TD roughness (Rz) and the glossiness of the surface of the copper foil before the surface treatment on the treatment side. Specifically, the surface roughness (Rz) of TD of the copper foil before the surface treatment is 0.30 to 0.80 μm, preferably 0.30 to 0.50 μm, and the incident angle 60 in the rolling direction (MD). After the surface treatment, if the glossiness at 350 degrees is 350 to 800%, preferably 500 to 800%, the current density is higher than the conventional roughening treatment and the roughening treatment time is shortened. The glossiness at an incident angle of 60 degrees in the rolling direction (MD) of the copper foil is 90 to 350%. Such a copper foil can be produced by adjusting the oil film equivalent of rolling oil (high gloss rolling), or by chemical polishing such as chemical etching or electrolytic polishing in a phosphoric acid solution. Thus, it is easy to control the surface roughness (Rz) and the surface area of the copper foil after the treatment by setting the TD surface roughness (Rz) and the glossiness of the copper foil before the treatment within the above range. Can do.

  Further, the copper foil before the roughening treatment preferably has an MD 60 degree gloss of 500 to 800%, more preferably 501 to 800%, and even more preferably 510 to 750%. . If the 60-degree glossiness of MD of the copper foil before the roughening treatment is less than 500%, the haze value may be higher than the case of 500% or more, and if it exceeds 800%, it is difficult to produce. Problems may arise.

High gloss rolling can be performed by setting the oil film equivalent defined by the following formula to 13,000 to 24000 or less.
Oil film equivalent = {(rolling oil viscosity [cSt]) × (sheet feeding speed [mpm] + roll peripheral speed [mpm])} / {(roll biting angle [rad]) × (yield stress of material [kg / mm ² ])}
The rolling oil viscosity [cSt] is a kinematic viscosity at 40 ° C.
In order to set the oil film equivalent to 13,000 to 24,000, a known method such as using a low-viscosity rolling oil or slowing the sheet passing speed may be used.
Chemical polishing is performed over a long period of time using an etching solution such as sulfuric acid-hydrogen peroxide-water system or ammonia-hydrogen peroxide-water system at a concentration lower than usual.

  The ratio C (C = (60 degree gloss of MD) / (60 degree gloss of TD)) of the 60 degree gloss of MD and 60 degree gloss of TD on the roughened surface is 0.80 to 1. 40 is preferred. If the ratio C between the 60 ° glossiness of MD and the 60 ° glossiness of TD on the roughened surface is less than 0.80, the haze value may be higher than when the ratio C is 0.80 or more. Further, if the ratio C is greater than 1.40, the haze value may be higher than when the ratio C is 1.40 or less. The ratio C is more preferably 0.90 to 1.35, and even more preferably 1.00 to 1.30.

[Haze value]
Since the copper foil of the present invention has the average roughness Rz and glossiness of the roughened surface as described above, the haze value of the base material where the copper foil is removed after being bonded to the base material. Becomes smaller. Here, the haze value (%) is a value calculated by (diffuse transmittance) / (total light transmittance) × 100. Specifically, the copper foil of the present invention has a haze value of 20 to 20 when the copper foil is removed by etching after being bonded to both surfaces of a 50 μm thick substrate from the surface of the roughening treatment. It is preferably 70%, more preferably 30 to 55%.

[Particle surface area]
The ratio A / B between the surface area A of the roughened particles and the area B obtained when the roughened particles are viewed in plan from the copper foil surface side greatly affects the haze value of the substrate. That is, if the surface roughness Rz is the same, the haze value of the above-mentioned base material becomes smaller as the copper foil having a smaller ratio A / B. For this reason, as for the copper foil of this invention, the said ratio A / B is 1.90-2.40, and it is preferable that it is 2.00-2.20.

  By controlling the current density and the plating time during particle formation, the particle morphology and formation density are determined, and the surface roughness Rz, glossiness, and particle area ratio A / B can be controlled.

  As described above, the copper foil of the present invention has a ratio A / B of 1.90 to 2 between the surface area A of the roughened particles and the area B obtained when the roughened particles are planarly viewed from the copper foil surface side. .40, and surface irregularities are large. Further, since the average TD roughness Rz of the roughened surface is controlled to 0.30 to 0.80 μm, there is no extremely rough portion on the surface. On the other hand, the glossiness of the roughened surface is as high as 80 to 350%. Considering these, it can be seen that in the copper foil of the present invention, the particle size of the roughened particles on the roughened surface is controlled to be small. The particle diameter of the roughened particles affects the transparency of the base material after the copper foil is etched away. However, the copper foil of the present invention has a surface average roughness on the side adhered to the base material in this way. Rz, glossiness, and the ratio of the surface area of the roughened particles to the area obtained when the roughened particles are viewed in plan from the copper foil surface side are controlled within the range of the present invention. Is reduced within an appropriate range. For this reason, the transparency of the base material after the copper foil is removed by etching is improved, and the peel strength is also improved.

  In the printed wiring board or copper-clad laminate, the surface roughness (Rz), particle area ratio (A / B), and gloss of the copper circuit or copper foil surface can be obtained by dissolving and removing the resin. The degree can be measured.

  In the method (4), after the copper foil as described above is bonded to the base material from the treated surface side, the copper foil is removed by etching or the like, thereby transferring the surface form of the copper foil to the base material surface. And the base material of the said surface form can be produced.

[Laminate]
In addition, the copper foil of this invention can be bonded together to a base material from the roughening process surface side, and a laminated body can be manufactured. In the case of the rigid PWB, a prepreg is prepared by impregnating a base material such as a glass cloth with a resin and curing the resin to a semi-cured state. It can be carried out by superposing a copper foil on the prepreg from the opposite surface of the coating layer and heating and pressing. In the case of FPC, it is laminated on a copper foil under high temperature and high pressure without using an adhesive on a substrate such as a polyimide film, or a polyimide precursor is applied, dried, cured, etc. A laminated board can be manufactured by performing.

  The laminate of the present invention can be used for various printed wiring boards (PWB) and is not particularly limited. For example, from the viewpoint of the number of layers of the conductor pattern, the single-sided PWB, the double-sided PWB, and the multilayer PWB (3 It is applicable to rigid PWB, flexible PWB (FPC), and rigid flex PWB from the viewpoint of the type of insulating substrate material.

[Method of manufacturing printed wiring board]
A method for producing a printed wiring board of the present invention will be described. First, a laminate of copper foil and substrate is prepared. As a specific example of the laminated board of the copper foil and the base material of the present invention, the main body substrate and the attached circuit board and at least one surface of the base material such as polyimide used for electrically connecting them are provided. In an electronic device composed of a flexible printed circuit board on which copper wiring is formed, a laminated board manufactured by accurately positioning the flexible printed circuit board and crimping the flexible printed circuit board to the wiring ends of the main circuit board and the attached circuit board is mentioned. It is done. That is, in this case, the laminated board is a laminate in which the wiring end portions of the flexible printed circuit board and the main body substrate are bonded together by pressure bonding, or the wiring edge portions of the flexible printed circuit board and the circuit board are bonded together by pressure bonding. Laminated board. The laminated board has a mark formed of a part of the copper wiring and a separate material. The position of the mark is not particularly limited as long as it can be photographed by photographing means such as a CCD camera through the base material constituting the laminated plate. Here, the mark refers to a mark used to detect, position, or align the position of a laminated board, printed wiring board, or the like.

  In the laminated plate thus prepared, when the above-described mark is photographed by the photographing means through the resin, the position of the mark can be detected satisfactorily. And the position of the said mark can be detected in this way, and the positioning of the laminated board of copper foil and a base material can be favorably performed based on the detected position of the mark. Similarly, when a printed wiring board is used as the laminated board, the photographing means can detect the position of the mark well by such a positioning method, and the printed wiring board can be positioned more accurately.

  Therefore, when one printed wiring board and another printed wiring board are connected, it is considered that the connection failure is reduced and the yield is improved. In addition, as a method of connecting one printed wiring board and another printed wiring board, connection via soldering or anisotropic conductive film (ACF), anisotropic conductive paste (Anisotropic Conductive Paste, A known connection method such as connection via ACP) or connection via a conductive adhesive can be used. In the present invention, the “printed wiring board” includes a printed wiring board, a printed circuit board, and a printed board on which components are mounted. Also, it is possible to manufacture a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards according to the present invention, and at least one printed wiring board according to the present invention. One printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention can be connected, and an electronic apparatus can be manufactured using such a printed wiring board.

  In the present invention, “copper circuit” includes copper wiring. Furthermore, the printed wiring board of the present invention may be connected to a component to produce a printed wiring board. Further, at least one printed wiring board of the present invention is connected to another printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention. A printed wiring board in which two or more printed wiring boards are connected may be manufactured by connecting two or more printed wiring boards and components. Here, as “components”, connectors, LCDs (Liquid Crystal Display), electronic components such as glass substrates used in LCDs, ICs (Integrated Circuits), LSIs (Large scale integrated circuits), VLSIs (Very Large scales) ), Electronic components including semiconductor integrated circuits such as ULSI (Ultra-Large Scale Integration) (for example, IC chips, LSI chips, VLSI chips, ULSI chips), components for shielding electronic circuits, and covers on printed wiring boards Examples include parts necessary for fixing.

The positioning method according to the embodiment of the present invention may include a step of moving a laminated board (including a laminated board of copper foil and a substrate and a printed wiring board). In the moving process, for example, it may be moved by a conveyor such as a belt conveyor or a chain conveyor, may be moved by a moving device provided with an arm mechanism, or may be moved by floating a laminated plate using gas. It may be moved by a moving means, a moving device or moving means (including a roller or a bearing) that moves a laminated plate by rotating an object such as a substantially cylindrical shape, a moving device or moving means that uses hydraulic pressure as a power source, Moving devices and moving means powered by air pressure, moving devices and moving means powered by motors, gantry moving linear guide stages, gantry moving air guide stages, stacked linear guide stages, linear motor drive stages, etc. It may be moved by a moving device or moving means having a stage. Moreover, you may perform the movement process by a well-known moving means. In the step of moving the laminated plate, the laminated plate can be moved for alignment. Then, it is considered that by performing alignment, connection failure is reduced and yield is improved when one printed wiring board is connected to another printed wiring board or components.
The positioning method according to the embodiment of the present invention may be used for a surface mounter or a chip mounter.
Moreover, the printed wiring board which has the circuit provided on the base material and the said base material may be sufficient as the laminated board of the copper foil and base material positioned in this invention. In that case, the mark may be the circuit.

In the present invention, “positioning” includes “detecting the position of a mark or an object”. In the present invention, “alignment” includes “after detecting the position of a mark or object, moving the mark or object to a predetermined position based on the detected position”.
Further, in the present invention, there is provided a method for determining the wavelength of the inspection light source based on the surface state of the substrate, a determination device for performing the determination method, the determination determination program, and a computer-readable recording medium on which the determination determination program is recorded. Can be provided. Furthermore, the present invention provides a method for determining the surface state of a substrate based on the wavelength of the above-described inspection light source, a determination device for performing the determination method, the determination program, and a computer-readable recording medium on which the determination program is recorded. can do.

According to another aspect of the printed wiring board manufacturing method of the present invention, there is provided a printed wiring board in which two or more printed wiring boards are connected by joining the first printed wiring board and the second printed wiring board. In the manufacturing method, the first and second printed wiring boards have a base material and wiring, the first printed wiring board has a mark, and the base of the first printed wiring board The ten-point average roughness Rz of a part or the entire surface of the material is 2.1 × (wavelength λ of light used for mark detection) or less, and the mark of the first printed wiring board has the first The step of irradiating light through the substrate of the printed wiring board 1, the step of detecting transmitted light or reflected light of the irradiated light, and the position of the mark based on the position where the transmitted light or reflected light is detected The detection step and the position of the detected mark. Then, it is a manufacturing method of a printed wiring board including the process of positioning the said 1st printed wiring board and / or the said 2nd printed wiring board. According to such a configuration, by using a base material having good visibility, it is possible to accurately position and align the wiring board, and to manufacture a printed wiring board with good efficiency. .
Further, between the step of detecting the position of the mark and the step of positioning the printed wiring board, the presence or absence of the mark on the first printed wiring board is determined based on the detected transmitted light or reflected light. A step of determining may be provided.

According to another aspect of the printed wiring board manufacturing method of the present invention, there is provided a printed wiring board in which two or more printed wiring boards are connected by joining the first printed wiring board and the second printed wiring board. In the manufacturing method, the first and second printed wiring boards have a base material and wiring, the first printed wiring board has a mark, and the base of the first printed wiring board A local peak sum average interval S of a part of or the entire surface of the material is 4.1 × (wavelength λ of light used for mark detection) or less, and the first printed wiring board has the first mark on the mark. The step of irradiating light through the substrate of the printed wiring board, the step of detecting transmitted light or reflected light of the irradiated light, and detecting the position of the mark based on the position where the transmitted light or reflected light is detected And at the position of the detected mark A printed wiring board manufacturing method including a step of positioning the first printed wiring board and / or the second printed wiring board based on the first printed wiring board. According to such a configuration, by using a base material having good visibility, it is possible to accurately position and align the wiring board, and to manufacture a printed wiring board with good efficiency. .
Further, between the step of detecting the position of the mark and the step of positioning the printed wiring board, the presence or absence of the mark on the first printed wiring board is determined based on the detected transmitted light or reflected light. A step of determining may be provided.

(Foil making process)
Electrodeposition was carried out on a stainless steel cylindrical cathode under the electrolytic solution and electrolysis conditions shown below to obtain a copper foil having a predetermined thickness. In Examples 1-16, it was set as the electrolytic copper foil (however, Example 11 is aluminum foil) with a thickness of 35 micrometers.

(Electrolytic solution composition in the foil making process)
Cu (as Cu ²⁺ ): 100 g / L
H ₂ SO ₄ : 100 g / L
As additives, Cl (as chloride ions), glue, and thiourea were added at each addition amount listed in Table 1.

(Electrolytic conditions for the foil making process)
Liquid temperature: 57 ° C
Current density: 40-80 A / dm ²
Electrolyte flow rate: 4.0 m / sec

  In Example 11, an aluminum foil having a thickness of 20 μm obtained by rolling was used as a metal foil other than copper foil. Rz of the surface to be bonded to the adhesive was measured with a surf coder SE-3C manufactured by Kosaka Laboratory, and was 1.0 μm before the surface treatment.

(Roughening treatment)
In Examples 6 to 8 and 11, the matte surface of the copper foil and the surface of the aluminum foil obtained in the foil-making process were subjected to the two-stage roughening treatment shown below.

(Roughening process at the first stage)
The purpose of the first stage roughening treatment is to generate nuclei of roughened particles on the surface of the metal foil by electrodepositing Cu fine particles at a current density exceeding the limit current density of copper ion diffusion on the outermost surface of the metal foil. It is.
(Electrolytic solution composition)
Cu (as Cu ²⁺ ): 10-30 g / L
H ₂ SO _4: 50~150g / L
As: 1-2000 mg / L
W: 1 to 100 mg / L
(Roughening conditions)
Liquid temperature: 20-50 degreeC
Current density: 20 to 100 A / dm ²
Energizing time: 1-10 seconds

(Roughening process in the second stage)
The purpose of the second stage roughening treatment is to grow the roughened particle nuclei by applying smooth plating on the nuclei of the coarsened particles generated in the first stage roughening treatment, and to obtain a roughened particle having a predetermined size. To make particles.
(Electrolytic solution composition)
Cu (as Cu ²⁺ ): 20-60 g / L
_{H 2 SO 4: 50~150g / L} ( roughening treatment conditions)
Liquid temperature: 30-60 degreeC
Current density: 1 to 50 A / dm ²
Energizing time: 1-10 seconds

(Surface treatment process)
In Examples 1-8 and 10-11, the surface coating treatment (a) shown below on one side of the matte surface (rough surface, precipitation surface) or aluminum foil (Example 11) of the copper foil obtained in the foil-making process ), (B), (c), (d), and (e) were selected and processed. Table 1 shows the combinations of surface treatments applied in each example. The coating amount of each surface coating treatment layer was calculated by dissolving the surface coating layer with dilute nitric acid and then measuring the concentration of the coating treatment layer component element in the solution by the ICP-AES method.

(A) Cu-Zn alloy plating treatment (electrolyte composition, pH)
NaCN: 10-30 g / L
NaOH: 40-100 g / L
Cu (CN) ₂ : 60 to 120 g / L
Zn (CN) ₂ : 1 to 10 g / L
pH: 10-13
(Electrolytic conditions)
Liquid temperature: 50-80 degreeC
Current density: 10 A / dm ²
Plating time: 4 seconds Coating amount: 5.0 mg / dm ²

(B) Ni—Zn alloy plating treatment (electrolyte composition, pH)
Zn (as Zn2 ⁺ ): 12-25 g / L
Ni (as Ni ²⁺ ): 1-8 g / L
pH: 2.0-4.0
(Electrolytic conditions)
Liquid temperature: 25-50 degreeC
Current density: 10 A / dm ²
Plating time: 2 seconds Coating amount: 1.5 mg / dm ²

(C) Cu—Ni alloy plating treatment (electrolyte composition, pH)
Cu (as Cu ²⁺ ): 0.01 to 5.0 g / L
Ni (as Ni ²⁺ ): 5 to 25 g / L
pH: 2.0-4.0
(Electrolysis conditions)
Liquid temperature: 25-50 degreeC
Current density: 5 A / dm ²
Plating time: 2 seconds Coating amount: 1.0 mg / dm ²

(D) Co-Ni alloy plating treatment (electrolyte composition, pH)
Co (as Co ²⁺ ): 0.1-6.0 g / L
Ni (as Ni ²⁺ ): 5 to 20 g / L
pH: 2.0-4.0
(Electrolytic conditions)
Liquid temperature: 25-50 degreeC
Current density: 5 A / dm ²
Plating time: 3 seconds Coating amount: 3.0 mg / dm ²

(E) Electrolytic chromate treatment (electrolyte composition, pH)
_{K 2 Cr 2 O 7: 2.0~6.0g} / L
Zn (as Zn ²⁺ ): 0 to 0.5 g / L
Na ₂ SO ₄ : 5 to 15 g / L
pH: 3.5-5.0
(Electrolytic conditions)
Liquid temperature: 20-60 degreeC
Current density: 2.0 A / dm ²
Plating time: 2 seconds Coating amount: 0.15 mg / dm ²

As Example 17, a rolled copper foil obtained by adding 30 mass ppm of Ag to oxygen-free copper standardized in JIS H3100 C1020 was used. The rolled copper foil was subjected to final cold rolling (cold rolling after the final recrystallization annealing) at a value of an oil film equivalent of 14,000, so-called “high gloss rolling”, and further subjected to electrolytic polishing. “Electropolishing” is a condition of 67% phosphoric acid + 10% sulfuric acid + 23% water and a voltage of 10 V / cm ² for 40 seconds (the amount of polishing becomes 1 to 2 μm after 10 seconds of electropolishing). went. The copper foil thickness was 12 μm, the roughness in the TD direction was 0.25 μm, the glossiness was 792% in the MD direction, 771% in the TD direction, and MD / TD was 1.03.

(Preparation of substrate sample)
(Examples 1-17)
Next, Kaneka polyimide having a thickness of 50 μm was prepared as a base material, and the metal foil was laminated on both sides from the treatment surface side, and then an etching treatment was performed under the following conditions to remove the metal foil.
・ Etching condition equipment: Spray type small etching equipment Spray pressure: 0.2MPa
Etching solution: Ferric chloride aqueous solution (specific gravity 40 Baume)
Liquid temperature: 50 ° C

(Example 18)
Moreover, as Example 18, Kaneka polyimide having a thickness of 50 μm was prepared as a base material, and surface processing on both surfaces of the base material was performed by etching under the following conditions.
Etching conditions Etching was performed in the order of etching processing conditions A → etching processing conditions B → neutralization processing conditions.
(Etching condition A)
Etching solution: 40 g / L NaMnO ₄ , 20 g / L NaOH, balance water Processing temperature: room temperature Dipping time: 25 minutes Stirrer rotation speed: 300 rpm
(Etching condition B)
Etching solution: 70 g / L KMnO ₄ , 8 g / L HCl, remaining water Treatment temperature: 50 ° C.
・ Immersion time: 15 minutes ・ Agitator rotation speed: 300 rpm
(Neutralization conditions)
・ Neutralization treatment liquid: L-ascorbic acid 80 g / L
・ Processing temperature: Room temperature ・ Immersion time: 3 minutes ・ No stirring

(Example 19)
Further, as Example 19, a glass substrate having a thickness of 100 μm was prepared as a base material, and surface processing on both surfaces of the base material was performed by etching under the following conditions.
・ Etching conditions ・ Etching treatment liquid: ammonium hydrogen fluoride 2 mass%, remaining water ・ Processing temperature: 40 ° C.
・ Immersion time: 20 minutes ・ Stirrer rotation speed: 300 rpm

(Example 20)
In addition, as Example 20, a Kaneka polyimide having a thickness of 50 μm was prepared as a base material, and the surface processing of both surfaces of the base material was performed by irradiating with an excimer laser at an interval of 2 μm for 15 ns.

(Example 21)
Also, as Example 21, a glass substrate having a thickness of 100 μm was prepared as a base material and polished with a buff using No. 6000 abrasive grains (cooling the buff with a water shower at 1500 rpm for 2 seconds). The surface processing of both sides was performed.

(Example 22)
The process was the same as Example 1 except that only one side of the resin substrate was treated.

Various evaluation was performed as follows about the metal foil of the Example and comparative example which were produced as mentioned above, and the base material which surface-treated.
(1) Measurement of surface roughness (Rz);
About a metal foil and a base material sample, the ten-point average roughness was measured about the roughening surface based on JISB0601-1994 using the Kosaka Laboratory Co., Ltd. contact-corrosion meter Surfcorder SE-3C. Measurement standard length 0.8mm, evaluation length 4mm, cut-off value 0.25mm, feed rate 0.1mm / sec. Perpendicular to rolling direction (in TD, in case of electrolytic copper foil, in foil passing direction) The measurement position was changed 10 times (perpendicularly), and the values for 10 measurements were obtained.
In addition, surface roughness (Rz) was calculated | required similarly about the metal foil before surface treatment.

(2) Measurement of local peak top average distances S and Sm on the surface;
About metal foil and a base-material sample, local peak sum average space | interval S and average space | interval Sm were measured using Keyence Corporation VK-8510. The measurement method used was a line roughness-JIS94 mode.

(3) Peel strength (adhesion strength);
About the base material sample, based on PC-TM-650, the normal peel strength was measured with the tensile tester Autograph 100, and the normal peel strength of 0.7 N / mm or more could be used for laminated substrate applications.

(4) Light transmittance;
About the obtained base material, the light transmittance was measured by slit 10mm using the spectrophotometer V-660 by JASCO Corporation. The wavelengths of light used were λ1 (0.940 μm, equivalent to an infrared light emitting LED), λ2 (0.694 μm, equivalent to a ruby laser), λ3 (0.532 μm, equivalent to a Nd: YAG laser), λ4 (0.351 μm, Excimer laser equivalent), λ5 (0.157 μm, equivalent to excimer laser), λ6 (0.555 μm, equivalent to fluorescent lamp).

(5) Yield A mark of 20 μm × 20 μm square was provided on the surface of the obtained base material by electroless copper plating. And it tried to detect the said mark with a CCD camera (light source: fluorescent lamp) or a laser detector (light source: laser, light emitting diode) through a base material. When 10 times out of 10 were detected, “◎◎”, when 9 times out of 10 were detected, “◎”, when 7-8 times were detected, “◯”, 6 times detected. Tables 1 to 3 show the conditions and evaluation of each test described above, where “△” is 5 or less and “X” is detected.

Claims (10)

A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected by joining a first printed wiring board and a second printed wiring board,
The first and second printed wiring boards have a base material and wiring,
The first printed wiring board has a mark,
The ten-point average roughness Rz of the surface of the substrate of the first printed wiring board is 2.1 × (wavelength λ of light used for mark detection) or less,
Irradiating the mark on the first printed wiring board with light through the substrate of the first printed wiring board;
Detecting the transmitted light or reflected light of the irradiated light;
Detecting a position of the mark based on a position where the transmitted light or reflected light is detected; and
Positioning the first printed wiring board and / or the second printed wiring board based on the position of the detected mark;
A method of manufacturing a printed wiring board including: Between the step of detecting the position of the mark and the step of positioning the printed wiring board, the presence or absence of the mark on the first printed wiring board is determined based on the detected transmitted light or reflected light. method for manufacturing a printed wiring board according to claim 1 comprising the step. Printed circuit according to claim 1 or 2 or less (the wavelength λ of the light used for detection of the mark) ten-point average roughness Rz of 1.1 × the surface of the substrate of the first printed circuit board A manufacturing method of a board. To any one of claims 1 to 3 or less (the wavelength λ of the light used for detection of the mark) the first local peaks mean spacing S of the surface of the substrate of the printed wiring board is 4.1 × The manufacturing method of the printed wiring board of description. The printed wiring board production according to claim 4 , wherein an average interval S of local peaks on the surface of the substrate of the first printed wiring board is 2.1 x (wavelength λ of light used for mark detection) or less. Method. A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected by joining a first printed wiring board and a second printed wiring board,
The first and second printed wiring boards have a base material and wiring,
The first printed wiring board has a mark,
The local peak sum average distance S of the surface of the base material of the first printed wiring board is 4.1 × (wavelength λ of light used for mark detection) or less,
Irradiating the mark on the first printed wiring board with light through the substrate of the first printed wiring board;
Detecting the transmitted light or reflected light of the irradiated light;
Detecting a position of the mark based on a position where the transmitted light or reflected light is detected; and
Positioning the first printed wiring board and / or the second printed wiring board based on the position of the detected mark;
A method of manufacturing a printed wiring board including: Between the step of detecting the position of the mark and the step of positioning the printed wiring board, the presence or absence of the mark on the first printed wiring board is determined based on the detected transmitted light or reflected light. The manufacturing method of the printed wiring board of Claim 6 provided with a process. Printed wiring board according to claim 6 or 7 or less (the wavelength λ of the light used for detection of the mark) local peaks mean spacing S is 2.1 × the surface of the substrate of the first printed circuit board Manufacturing method. A method for detecting the position of a mark on a printed wiring board having a substrate and wiring,
Irradiating light having a wavelength λ of 10-point average roughness Rz / 2.1 or more of the surface of the substrate of the printed wiring board through the substrate of the printed wiring board;
Detecting transmitted light or reflected light of the irradiated light,
A method of detecting a position of a mark on the printed wiring board based on a position where the transmitted light or reflected light is detected. A method for detecting the position of a mark on a printed wiring board having a substrate and wiring,
Irradiating light having a wavelength λ of a local peak sum average distance S / 4.1 or more of the surface of the substrate of the printed wiring board through the substrate of the printed wiring board;
Detecting transmitted light or reflected light of the irradiated light,
A method of detecting a position of a mark on the printed wiring board based on a position where the transmitted light or reflected light is detected.