JPS618607A - Detecting method of reference position of multilayered printed wiring board - Google Patents

Detecting method of reference position of multilayered printed wiring board

Info

Publication number
JPS618607A
JPS618607A JP13058684A JP13058684A JPS618607A JP S618607 A JPS618607 A JP S618607A JP 13058684 A JP13058684 A JP 13058684A JP 13058684 A JP13058684 A JP 13058684A JP S618607 A JPS618607 A JP S618607A
Authority
JP
Japan
Prior art keywords
mark
layer material
wiring board
circuit pattern
line width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13058684A
Other languages
Japanese (ja)
Inventor
Takeshi Tomizaki
富崎 武士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP13058684A priority Critical patent/JPS618607A/en
Publication of JPS618607A publication Critical patent/JPS618607A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To realize an easy method which facilitates automatic detection and automatic work by forming a grating mark of plural lines with different line width at one corner of an internal layer material circuit pattern flank, and boring a spot facing hole and then detecting a reference position through a photosensor. CONSTITUTION:The grating type mark C is formed at a corner part of the surface of an internal layer material 1 where a circuit pattern B is formed. The mark C is formed of couples of lines with different line width at four upper and lower, and right and left sides of a center intersection, and the line width increases successively outward. An XY table 8 and a photodetector 9 and a projector 9a which are arranged above and below the table are provided as a detecting device, and the detection output of the photodetector 9 is inputted to and processed by a signal processing circuit 10, arithmetic processing circuit 12, control processing circuit 13, etc. In this constitution, the mark-C corresponding part of the corner part of the external layer material of the wiring board on the table 8 is bored until the copper plate on the reverse surface is peeled off. The photosensor generates a photodetection signal based upon the line width of the mark C facing the hole. The circuit 10 decides on the line width and the array state in the XY direction and decides on the center point of the mark C from previously stored data, and the circuit 13 moves the table 8 to perform up to boring work.

Description

【発明の詳細な説明】 〔技術分野〕 本発明は多層プリント配線板の基準位置検出方法に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a reference position detection method for a multilayer printed wiring board.

〔背景技術〕[Background technology]

多層プリント配線板Aは第4図に示すような例えば4層
のものでは内層材(1)と、上、下の外層材(2a)、
(2b)とを積層することによって形成されるものであ
る。つまり内層材fi+は紙フェノール又はカラスエボ
士シ等の絶縁体(3)を基材として用い、この絶縁体(
3)の上、下表面に銅箔(4)を貼着して形成せるもの
で、外層材(2a)、(2b)を積層するに当っては予
め回路パターンをエツチング等圧よって形成する。外層
材(2a)、(2b)はプリづレジ状態の絶縁体(6)
を内層材(1)の上、下表面に積層すると共に、銅箔(
6)を夫々の絶縁体(6)の表面に積層して形成され、
加熱加圧成形することで内層材(11と一体となる。と
ころで外層材(2a)、(2b)の銅箔(6)を用いて
回路パターンを形成する場合には回路間隔が紙フエノー
ル基材で10.25−s、ガラスエボ+シ基材では0.
15、であるため内層材ftl側の回路パターンとの位
置関係が正確でなければ、後でスルホールの穴あけを行
なった場合に外層材(2a)、(2b)側の回路パター
ンと内層材+1+側の回路パターンの位置ずれによって
回路形成ができないという問題がある。
For example, in the case of a four-layer multilayer printed wiring board A as shown in FIG. 4, there is an inner layer material (1), upper and lower outer layer materials (2a),
(2b). In other words, the inner layer material fi+ uses an insulator (3) such as paper phenol or crow eboshi as a base material, and this insulator (
It is formed by adhering copper foil (4) to the upper and lower surfaces of 3), and before laminating the outer layer materials (2a) and (2b), a circuit pattern is formed in advance by etching with equal pressure. The outer layer materials (2a) and (2b) are insulators (6) in a pre-registered state.
are laminated on the upper and lower surfaces of the inner layer material (1), and copper foil (
6) is laminated on the surface of each insulator (6),
By heating and pressure forming, it becomes integrated with the inner layer material (11).By the way, when forming a circuit pattern using the copper foil (6) of the outer layer materials (2a) and (2b), the circuit spacing is similar to that of the paper phenol base material. 10.25-s, and 0.25-s for glass evo+shi base material.
15, so if the positional relationship with the circuit pattern on the inner layer material ftl side is not accurate, when through holes are drilled later, the circuit pattern on the outer layer material (2a), (2b) side and the inner layer material +1+ side There is a problem that circuit formation cannot be performed due to the positional shift of the circuit pattern.

そこで従来にあっては内層材filの表面周辺に丸に十
の字のカイトマーク(7)を第5図に示すように銅箔(
4)で形成しておいて、多層プリント配線板Aの完成後
にガイドマーク(7)の位置に対応させて、ドリル刃の
先端が平坦なドリルでガイドマーク(7)の最寸前迄の
座ぐり穴を明け、外層材(2a)。
Therefore, in the past, a kite mark (7) in the shape of a cross in a circle was placed around the surface of the inner layer material fil, as shown in Figure 5, using copper foil (
4), and after completing the multilayer printed wiring board A, use a drill with a flat tip to counterbore the position of the guide mark (7) to the closest point to the guide mark (7). Drill a hole and remove the outer layer material (2a).

(2b)外からも分るようにし、このガイドマーク(7
)を用いて外層材(2a)、(2b)の銅箔(81で回
路パターンを形成する際の基準点にするようにしていた
(2b) Make sure that this guide mark (7) is visible from the outside.
) was used as a reference point when forming a circuit pattern using the copper foil (81) of the outer layer materials (2a) and (2b).

しかしながら従来の座ぐり穴の加工は人の勘に頼って行
なっていたため、座ぐり穴明けの工程が自動化できなか
った。そこでガイドマーク(7)の位置を人の勘に頼る
ことなく発見しやすくするためにガイドマーク(7)の
表面に已ニルテープ等の薄いフィルム状物を貼付けてお
いて、加熱成形後に外層材(2a)、(2b)表面の銅
箔(6)がフィルム状物の厚み分だけ突出して、その部
分の光沢が周囲と異なるようにした方法が提案されてい
るが、しかしながら光沢具合がまちまちのため、検出が
かなり困難であり、自動化も容易でないという欠点があ
る。
However, conventional counterbore hole machining relies on human intuition, making it impossible to automate the counterbore hole drilling process. Therefore, in order to make it easier to find the position of the guide mark (7) without relying on human intuition, a thin film-like material such as lint tape is pasted on the surface of the guide mark (7), and the outer layer material ( 2a), (2b) A method has been proposed in which the copper foil (6) on the surface protrudes by the thickness of the film-like object so that the gloss of that part is different from that of the surrounding area. , they have the disadvantage of being quite difficult to detect and not easy to automate.

〔発明の目的〕[Purpose of the invention]

本発明はこのような欠点に鑑みて為されたもので、その
目的とするところは内層材の回路パターンの基準位置検
出が簡単に行なえて、上記基準位置の自動検出、自動加
工が容易である多層プリント配線板の基準位置検出方法
を提供するにある。
The present invention has been made in view of these drawbacks, and its purpose is to easily detect the reference position of the circuit pattern of the inner layer material, and to facilitate automatic detection and automatic processing of the reference position. The present invention provides a method for detecting a reference position of a multilayer printed wiring board.

〔発明の開示〕[Disclosure of the invention]

実施例 第1図は本発明に使用する多層プリント配線板への内層
材(4]の要部を示すものであり、回路パターンBを形
成せる面の偏部に格子状のマークCを形成してある。こ
のマークCの中心位置と、真のカイトマークDの中心位
置とは内層材tllの側縁に平行せる同一直線上にあり
、中心間の距離aと、マークCの中心位置とが分かれば
カイトマークD、つまり回路パターンBの基準位置を判
定することが分かるのである。マークCは第2図に示す
ようにマークCの上、下の中心線Oyと、左、右の中心
線OXとの交点がマークCの中心であり、中心線oyを
境として対称の対の線1s Y s 7?s Y1bY
+ b Vlls Y r Is Y  と、中心線O
xを境として対称の対の線11xH11xs /IXI
/!XN IRX、18Xとを1mJ+間隔で配置し交
叉させて格子状のマークとしたものである。そして線1
+Yとl、X5lzY  とIs x s Is Yと
J、Xの線巾を等しくし且つ、lsYと11 X% b
 Yとl黛X11sYとl、xの順で段々と線巾を太く
したものである。
Embodiment FIG. 1 shows the main part of the inner layer material (4) for the multilayer printed wiring board used in the present invention, in which a grid mark C is formed on the uneven part of the surface on which the circuit pattern B is formed. The center position of this mark C and the center position of the true kite mark D are on the same straight line parallel to the side edge of the inner layer material tll, and the distance a between the centers and the center position of mark C are If you know this, you can determine the reference position of the kite mark D, that is, the circuit pattern B.The mark C is located between the upper and lower center lines Oy of the mark C, and the left and right center lines, as shown in Figure 2. The intersection with OX is the center of mark C, and the pair of lines 1s Y s 7?s Y1bY are symmetrical with the center line oy as the border.
+ b Vlls Y r Is Y and center line O
Pair of lines symmetrical with respect to x 11xH11xs /IXI
/! XN IRX and 18X are arranged at 1 mJ+ intervals and crossed to form a grid-like mark. and line 1
+Y and l, X5lzY and Is x s Is Y and J, make the line width of X equal, and lsY and 11
The line width is gradually increased in the order of Y, l, x11s, l, and x.

第3図は本発明の一実施例の全体概WI5構成図を示し
、図中(8)はX−Yテーブルで、このx−Yテーブル
(8)上方には光透過型のバーフードリータのような光
tシサの投光器(9)を配置してある。投光器(9)の
検出出力は信号処理回路(I0)によって線巾の検出及
び位置関係の判定処理が行なわれるようになっている。
FIG. 3 shows an overall schematic diagram of the WI5 configuration of an embodiment of the present invention. In the figure, (8) is an X-Y table, and above this X-Y table (8) is a light-transmissive bar food reader. A light projector (9) of the type shown above is arranged. The detection output of the projector (9) is subjected to line width detection and positional relationship determination processing by a signal processing circuit (I0).

X−Yテーブル(8)下方には前記投光器(9)に対置
される投光器(9a)が配置されている。信号処理回路
(lO)は線巾の検出及び各線の位置関係の判定によっ
て、マークCの中心位置を決定し、その座標データを演
算処理回路(12)に与えるようになっている。演算処
理回路02)は座標データと、予めインプットされて記
憶してあるマークCの中心位置からガイドマークDの中
心までの距離とKよってX−Yテーブル(8)上のガイ
ドマークDの中心座標データを算出し、該データをX−
Yテーブル(8)及びドリル装置(I4)の制御回路0
3iに与えるようになっている。
A projector (9a) opposite to the projector (9) is arranged below the X-Y table (8). The signal processing circuit (lO) determines the center position of the mark C by detecting the line width and determining the positional relationship of each line, and provides the coordinate data to the arithmetic processing circuit (12). The arithmetic processing circuit 02) calculates the center coordinates of the guide mark D on the X-Y table (8) based on the coordinate data and the distance K from the center position of the mark C to the center of the guide mark D, which has been input and stored in advance. Calculate the data and convert the data to
Control circuit 0 for Y table (8) and drill device (I4)
It is designed to be given to 3i.

しかしてまず、X−Yテーブル(8)上に配置された多
層プリシト配線板Aの隅部に、つまり内層材fl)のマ
ークCに対応する位置に、例えば7〜FEwφ程度の長
孔からなる座ぐり穴を外層材(2a)、(2b)の上下
面の銅箔を剥がす程度に穿孔する。そのため絶縁材を介
して座ぐり穴にはマークCの線の幾本かが臨むことにな
る。次にこの下面側の座ぐり穴の下方に投光器(9a)
を移動させると共に上面側の座ぐり穴の上方に受光器(
9)を位置させて、投光器(9a)、受光器(9)をx
−Y方向にやや移動させると、投光器(9a)から出た
光は座ぐり穴及びガラスエボ士シ等の透明性或いは肉薄
で光透過可能な絶縁材(5)を介して受光器(9)に受
光される上述の移動によって座ぐり穴に臨んだマークC
の線の巾に応じた受光信号が信号処理回路(10)に取
込まれる。信号処理回路(10)は受光信号によって線
の巾とそのX−Y方向の並び方を判定して予め記憶して
あるマークCのパターンデータから座ぐり穴に対してマ
ークCの中心点があるかを判定する。この判定した中心
点を原点とする座標データを信号処理回路(+01 i
;1次の演算処理回路02)K与える。演算処理回路(
1″4はこの原点座標から、予め記憶してあるガイドマ
ークDの中心までの距離aデータより、ガイドマークD
の中心に対応する座標点データを制御処理回路0萄へ転
送する。
First, in the corner of the multilayer printed circuit board A placed on the X-Y table (8), that is, in the position corresponding to the mark C of the inner layer material fl), a long hole of about 7 to FEwφ is formed. Counterbore holes are bored to the extent that the copper foils on the upper and lower surfaces of the outer layer materials (2a) and (2b) can be peeled off. Therefore, some of the lines marked C will be exposed to the counterbore through the insulating material. Next, place the floodlight (9a) below the counterbore hole on the bottom side.
while moving the receiver (
9), and move the emitter (9a) and receiver (9) to
- When moved slightly in the Y direction, the light emitted from the projector (9a) is transmitted to the receiver (9) through a transparent or thin insulating material (5) such as a counterbore and glass ejector. Mark C facing the counterbore hole due to the above-mentioned movement of the received light
A light reception signal corresponding to the width of the line is taken into the signal processing circuit (10). The signal processing circuit (10) determines the width of the lines and how they are arranged in the X-Y direction based on the received light signal, and determines whether there is a center point of the mark C with respect to the counterbore hole based on the pattern data of the mark C stored in advance. Determine. The signal processing circuit (+01 i
;Primary arithmetic processing circuit 02) Give K. Arithmetic processing circuit (
1″4 is the distance a from the origin coordinates to the center of the guide mark D stored in advance.
The coordinate point data corresponding to the center of is transferred to the control processing circuit 0.

制御処理回路a句は演算処理回路(+2)からのデータ
に基いてパルスを一タ(図示せず)を駆動してX・Yテ
ーブル(8)上の前記データに対応する所定の座標点が
丁度X−Yチーづル(8)上方に配置してあるドリル装
置(+41のドリル刃下方に位置するようにX・Yテー
ブル(8)を移動制御するのである。そして移動終了と
ともにドリル装置θ→を制御処理回路(13)は下方移
動させてX−Yテーブル(8)上の多層づリント配線板
Aに座ぐり穴を穿孔させるのである。
The control processing circuit a drives a pulse (not shown) based on the data from the arithmetic processing circuit (+2) to locate a predetermined coordinate point corresponding to the data on the XY table (8). The movement of the X/Y table (8) is controlled so that it is located just below the drill blade (+41) located above the XY tool (8).Then, when the movement is completed, the drill device θ → is moved downward by the control processing circuit (13) to punch a counterbore hole in the multilayer lint wiring board A on the X-Y table (8).

この座ぐり穴の穿孔が終了すると、ドリル装置04)を
上方位置へ復帰させ、ガイドマーク(7)が複数設けて
いる場合には次のガイドマーク(7)に対応する座標点
がドリル装置(14)下方に位置するようにX・Yテー
ブル(8)を制御処理回路O鴇は演算処理回路Hからの
データに基いて移動制御するのである。
When this counterbore hole drilling is completed, the drill device 04) is returned to the upper position, and if there are multiple guide marks (7), the coordinate point corresponding to the next guide mark (7) is set to the drill device (04). 14) The control processing circuit (O) controls the movement of the X/Y table (8) based on data from the arithmetic processing circuit (H) so that it is positioned below.

尚ガイドマークDに対する座ぐり穴を穿けず、基準点の
座標位置を求めて穴あけを行なっても勿論よい。
It is of course possible to drill the hole by finding the coordinate position of the reference point instead of drilling the counterbore hole corresponding to the guide mark D.

〔発明の効果〕〔Effect of the invention〕

本発明は光が透過可能な絶縁体の表面に金属箔で予め回
路パターンを形成してある内層材の回路パターン側面上
に、光が透過可能な別の絶縁体七該絶縁体の表面に積層
した金属箔とから々る外層材を積層して形成する多層プ
リント配線板において、内層材の回路パターンの隅部に
、中心から上下、左右に対称に位置する対の線を同一巾
とし且つ少なくとも同方向に位置する他の対の線とは異
なる巾とした格子状のマークを設け、マークの位置に対
応する多層プリント配線板の上下面より上下面にある金
属箔を剥がす程度で且つマークの複数の線が臨む程度の
大きさの座ぐり穴を穿孔し、上下の座ぐり穴を介して投
受光器を対向配置した透過型光センサにて座ぐり穴に臨
んだマークの各線の配置パターンを判別してマークの中
心を判定し、この中心位置から所定定距離にある内層材
の回路パターンの基準位置を検出するので、従来のよう
な人の肋や、或いは識別が困難な光沢検出とは異なって
確実に回路パターン基準位置の検出が行なえ、X−Yチ
ーづルの組合せ等で穴あけ作業の自動化が図れ、大いに
生産性の向上が図れるという効果を奏する。
In the present invention, a circuit pattern is formed in advance using metal foil on the surface of an insulator through which light can pass, and another insulator through which light can pass is laminated on the surface of the insulator on the side surface of the circuit pattern of an inner layer material. In a multilayer printed wiring board formed by laminating a thin metal foil and a loose outer layer material, at the corner of the circuit pattern of the inner layer material, pairs of wires located symmetrically from the center vertically and horizontally are of the same width and at least A grid-like mark with a width different from that of other pairs of lines located in the same direction is provided, and the metal foil on the upper and lower surfaces of the multilayer printed wiring board corresponding to the position of the mark is peeled off from the upper and lower surfaces of the multilayer printed wiring board. A transmission-type optical sensor with a counterbore hole large enough to allow multiple lines to face each other and a transmitter/receiver placed facing each other through the upper and lower counterbore holes is used to determine the arrangement pattern of each line of the mark facing the counterbore hole. The center of the mark is determined by determining the center of the mark, and the reference position of the circuit pattern on the inner layer material at a predetermined distance from this center position is detected. Differently, the circuit pattern reference position can be reliably detected, and the drilling work can be automated by combining X-Y teeth, etc., and productivity can be greatly improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に用いる多層プリント配線板の内層材の
要部の上面図、第2図は同上に用いるマ銅箔、(9)は
受光器、(9a)は投光器、Aid多層プリント配線板
、Cはマーク、11X + it Y z It x、
12Y・・・け線である。
Figure 1 is a top view of the main parts of the inner layer material of the multilayer printed wiring board used in the present invention, Figure 2 is the copper foil used in the same, (9) is the light receiver, (9a) is the emitter, and the Aid multilayer printed wiring. Board, C is mark, 11X + it Y z It x,
12Y... This is the horizontal line.

Claims (1)

【特許請求の範囲】[Claims] (1)光が透過可能な絶縁体の表面に金属箔で予め回路
パターンを形成してある内層材の回路パターン側面上に
、光が透過可能な別の絶縁体と該絶縁体の表面に積層し
た金属箔とからなる外層材を積層して形成する多層プリ
ント配線板において、内層材の回路パターンの隅部に、
中心から上下、左右に対称に位置する対の線を同一巾と
し且つ少なくとも同方向に位置する他の対の線とは異な
る巾とした格子状のマークを設け、マークの位置に対応
する多層プリント配線板の上下面より上下面にある金属
箔を剥がす程度で且つマークの複数の線が臨む程度の大
きさの座ぐり穴を穿孔し、上下の座ぐり孔を介して投受
光器を対向配置した透過型光センサにて座ぐり穴に臨ん
だマークの各線の配置パターンを判別してマークの中心
を判定し、この中心位置から所定距離にある内層材の回
路パターンの基準位置を検出することを特徴とする多層
プリント配線板の基準位置検出方法。
(1) A circuit pattern is formed in advance using metal foil on the surface of an insulator that allows light to pass through. On the side surface of the circuit pattern of the inner layer material, another insulator that allows light to pass through is laminated on the surface of the insulator. In a multilayer printed wiring board formed by laminating an outer layer material made of metal foil, the corner of the circuit pattern of the inner layer material is
A multilayer print that corresponds to the position of the mark by providing a lattice-like mark in which pairs of lines located symmetrically from the center up and down and left and right have the same width and at least a width different from other pairs of lines located in the same direction. Drill a counterbore hole large enough to peel off the metal foil on the upper and lower sides of the wiring board and to expose the multiple lines of the mark, and place the emitter and receiver facing each other through the upper and lower counterbore holes. The center of the mark is determined by determining the arrangement pattern of each line of the mark facing the counterbore using a transmissive optical sensor, and the reference position of the circuit pattern of the inner layer material is detected at a predetermined distance from this center position. A reference position detection method for a multilayer printed wiring board, characterized by:
JP13058684A 1984-06-25 1984-06-25 Detecting method of reference position of multilayered printed wiring board Pending JPS618607A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13058684A JPS618607A (en) 1984-06-25 1984-06-25 Detecting method of reference position of multilayered printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13058684A JPS618607A (en) 1984-06-25 1984-06-25 Detecting method of reference position of multilayered printed wiring board

Publications (1)

Publication Number Publication Date
JPS618607A true JPS618607A (en) 1986-01-16

Family

ID=15037748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13058684A Pending JPS618607A (en) 1984-06-25 1984-06-25 Detecting method of reference position of multilayered printed wiring board

Country Status (1)

Country Link
JP (1) JPS618607A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093305A (en) * 2005-09-27 2007-04-12 Matsushita Electric Works Ltd Metal-foiled laminate sheet inspection device
JP2015025106A (en) * 2013-07-25 2015-02-05 Jx日鉱日石金属株式会社 Base material, metallic foil or metal plate and laminate sheet, printed wiring board, electronic equipment and manufacturing method of printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093305A (en) * 2005-09-27 2007-04-12 Matsushita Electric Works Ltd Metal-foiled laminate sheet inspection device
JP2015025106A (en) * 2013-07-25 2015-02-05 Jx日鉱日石金属株式会社 Base material, metallic foil or metal plate and laminate sheet, printed wiring board, electronic equipment and manufacturing method of printed wiring board

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