JP2007093305A - Metal-foiled laminate sheet inspection device - Google Patents

Metal-foiled laminate sheet inspection device Download PDF

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JP2007093305A
JP2007093305A JP2005280909A JP2005280909A JP2007093305A JP 2007093305 A JP2007093305 A JP 2007093305A JP 2005280909 A JP2005280909 A JP 2005280909A JP 2005280909 A JP2005280909 A JP 2005280909A JP 2007093305 A JP2007093305 A JP 2007093305A
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metal foil
clad laminate
image
defect
inspection
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JP4434116B2 (en
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Tsutomu Hamatsu
力 濱津
Izuru Yoshizawa
出 吉澤
Kazunobu Morioka
一信 盛岡
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal-foiled laminate sheet inspection device for accurately performing defect inspection in a short time. <P>SOLUTION: This device for determining whether defect 2, such as dents, flaws, pinholes, or wrinkles, exists on the surface of a metal-foiled laminate sheet 1, is equipped with a camera 3 for imaging the surface of the laminate sheet 1, and a reference part 5 for determining whether a defect 2 exists based on an image obtained through the imaging of the camera 3. Design data on a circuit pattern 6 predetermined to be formed on the laminate sheet 1 which is an inspecting object are inputted into the reference part 5. An inspection area 7, including the circuit pattern 6, is set based on the design data. An image 4 is inputted into the reference part 5, the image 4 being only of a portion corresponding to the inspection area 7 of an image on a surface of the laminate sheet 1 imaged by the camera 3. Based on this image, the presence of defect 2 is determined. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、金属箔張り積層板の表面の打痕（圧痕）、キズ、ピンホール、シワなどの欠陥の有無を検査するための装置に関するものである。   The present invention relates to an apparatus for inspecting the presence or absence of defects such as dents (indentations), scratches, pinholes, and wrinkles on the surface of a metal foil-clad laminate.

銅張り積層板などの金属箔張り積層板の表面は外層回路を形成するための金属箔（銅箔など）が設けられている。この金属箔は通常平坦なベタ面であるが、積層工程時の不具合などが原因で金属箔の表面に打痕、キズ、ピンホールなどの欠陥が発生することがある。そして、この欠陥により外層回路の導通性が損なわれたりする不良が発生することがあり、上記欠陥が金属箔張り積層板の歩留まりの低下の原因となっていた。   A metal foil (such as a copper foil) for forming an outer layer circuit is provided on the surface of a metal foil-clad laminate such as a copper-clad laminate. This metal foil is usually a flat solid surface, but defects such as dents, scratches and pinholes may occur on the surface of the metal foil due to problems during the lamination process. And this defect may cause a defect in which the continuity of the outer layer circuit is impaired, and this defect causes a decrease in the yield of the metal foil-clad laminate.

そこで、金属箔の上記欠陥に起因する外層回路の不良対策としては、外層回路の回路形成前に目視にて金属箔張り積層板の表面の外観検査を実施することが行われている（例えば、特許文献１参照）。   Therefore, as a countermeasure against defects in the outer layer circuit due to the above-described defects in the metal foil, it is performed to visually inspect the surface of the metal foil-clad laminate before the circuit formation of the outer layer circuit (for example, Patent Document 1).

しかし、検査対象の金属箔張り積層板において、外層回路を形成する部分としない部分とを目視により判定することは難しく、よって、金属箔張り積層板の表面全面を目視によって検査しなければならず、検査時間が長くなるという問題があった。また、外層回路を形成する部分としない部分とを容易に判断するために、露光時に用いるマスクなどの外層パターンフィルムと照合することも考えられるが、検査時間はほとんど短縮されず、また、欠陥の検査精度にバラツキが生じるという問題があった。
特開平７−６３５３８号公報 However, in the metal foil-clad laminate to be inspected, it is difficult to visually determine the portion that does not form the outer layer circuit and the portion that does not form the outer layer circuit. Therefore, the entire surface of the metal foil-clad laminate must be visually inspected. There was a problem that the inspection time was long. In addition, in order to easily determine the portion that forms the outer layer circuit and the portion that does not form the outer layer circuit, it may be possible to collate with an outer layer pattern film such as a mask used at the time of exposure, but the inspection time is hardly shortened, and the defect There has been a problem that the inspection accuracy varies.
JP-A-7-63538

本発明は上記の点に鑑みてなされたものであり、欠陥の検査を短時間で精度良く行うことができる金属箔張り積層板の検査装置を提供することを目的とするものである。   The present invention has been made in view of the above points, and an object of the present invention is to provide a metal foil-clad laminate inspection apparatus that can accurately inspect defects in a short time.

本発明の金属箔張り積層板の検査装置Ａは、金属箔張り積層板１の表面の打痕、キズ、ピンホール、シワなどの欠陥２の有無を判定するための装置であって、金属箔張り積層板１の表面を撮像するためのカメラ３と、カメラ３の撮像により得られた画像に基づいて欠陥２の有無を判定するためのリファレンス部５とを備え、リファレンス部５には、検査対象の金属箔張り積層板１に形成する予定の回路パターン６の設計データが入力されて、この設計データに基づいて回路パターン６を包含する検査エリア７が設定されると共に、リファレンス部５にはカメラ３で撮像された金属箔張り積層板１の表面の画像のうち検査エリア７に相当する部分のみの画像４が入力され、この画像に基づいて欠陥２の有無が判定されることを特徴とするものである。   An inspection apparatus A for a metal foil-clad laminate according to the present invention is an apparatus for determining the presence or absence of defects 2 such as dents, scratches, pinholes, wrinkles on the surface of a metal foil-clad laminate 1, A camera 3 for imaging the surface of the laminated laminate 1 and a reference unit 5 for determining the presence or absence of a defect 2 based on an image obtained by imaging of the camera 3 are provided. The design data of the circuit pattern 6 to be formed on the target metal foil-clad laminate 1 is input, and an inspection area 7 including the circuit pattern 6 is set based on this design data. Of the image of the surface of the metal foil-clad laminate 1 imaged by the camera 3, only the image 4 corresponding to the inspection area 7 is input, and the presence or absence of the defect 2 is determined based on this image. What to do That.

本発明の金属箔張り積層板の検査装置Ａは、金属箔張り積層板１の表面の打痕、キズ、ピンホール、シワなどの欠陥２の有無を判定するための装置であって、金属箔張り積層板１の表面を撮像するためのカメラ３と、カメラ３の撮像により得られた画像に基づいて欠陥２の有無を判定するためのリファレンス部５とを備え、リファレンス部５には、検査対象の金属箔張り積層板１に形成する予定の回路パターン６の設計データが入力されて、この設計データに基づいて回路パターン６を包含する検査エリア７が設定されると共に、リファレンス部５にはカメラ３で撮像された金属箔張り積層板１の表面全部の画像８が入力されて、この画像８の検査エリア７に相当する部分のみについて欠陥２の有無が判定されることを特徴とするものである。   The inspection apparatus A for a metal foil-clad laminate of the present invention is an apparatus for determining the presence or absence of defects 2 such as dents, scratches, pinholes, wrinkles, etc. on the surface of a metal foil-clad laminate 1, A camera 3 for imaging the surface of the laminated laminate 1 and a reference unit 5 for determining the presence or absence of a defect 2 based on an image obtained by imaging of the camera 3 are provided. The design data of the circuit pattern 6 to be formed on the target metal foil-clad laminate 1 is input, and an inspection area 7 including the circuit pattern 6 is set based on this design data. An image 8 of the entire surface of the metal foil-clad laminate 1 imaged by the camera 3 is input, and the presence or absence of the defect 2 is determined only for the portion corresponding to the inspection area 7 of the image 8 Is

本発明にあっては、検査エリア７は、回路パターン６の外形に沿って回路パターン６を拡大した領域であることが好ましい。   In the present invention, the inspection area 7 is preferably an area obtained by enlarging the circuit pattern 6 along the outer shape of the circuit pattern 6.

また、本発明にあっては、欠陥２の有無の検査結果を発生領域別に集計・表示する機能を備えることが好ましい。   Moreover, in this invention, it is preferable to provide the function which totals and displays the inspection result of the presence or absence of the defect 2 according to generation | occurrence | production area | region.

本発明では、欠陥の有無の判定を回路パターンの設計データに基づいて回路パターンが形成される部分のみに対して行うために、金属箔張り積層板の表面全面を目視で判定したり、あるいは露光時に用いるマスクと照合しながら金属箔張り積層板の表面を目視で判定したりする場合に比べて、欠陥の判定を短時間で精度良く行うことができるものである。   In the present invention, since the determination of the presence or absence of defects is performed only on the portion where the circuit pattern is formed based on the design data of the circuit pattern, the entire surface of the metal foil-clad laminate is visually determined or exposed. Compared with the case where the surface of the metal foil-clad laminate is visually determined while collating with the mask used sometimes, the defect can be determined accurately in a short time.

以下、本発明を実施するための最良の形態を説明する。   Hereinafter, the best mode for carrying out the present invention will be described.

図１に本発明の金属箔張り積層板１の検査装置Ａの一例を示す。この検査装置Ａは、金属箔張り積層板１の表面を撮像するためのカメラ３を有する検出部２０と、カメラ３の撮像により得られた画像データに基づいて金属箔張り積層板１の表面の打痕、キズ、ピンホール、シワなどの欠陥２の有無を判定するリファレンス部５とを備えている。   FIG. 1 shows an example of an inspection apparatus A for a metal foil-clad laminate 1 of the present invention. The inspection apparatus A includes a detection unit 20 having a camera 3 for imaging the surface of the metal foil-clad laminate 1 and the surface of the metal foil-clad laminate 1 based on image data obtained by imaging with the camera 3. And a reference unit 5 for determining the presence or absence of defects 2 such as dents, scratches, pinholes, and wrinkles.

検出部２０には、カメラ３の下方に金属箔張り積層板１を載置するための検査台２１が設けられている。カメラ３としてはＣＣＤカメラなどを用いることができる。   The detection unit 20 is provided with an inspection table 21 for placing the metal foil-clad laminate 1 below the camera 3. As the camera 3, a CCD camera or the like can be used.

リファレンス部５は、カメラ３で得られた画像データから欠陥２の有無を判定するためのプログラムが組み込まれたパーソナルコンピュータなどの電子計算機で形成することができる。   The reference unit 5 can be formed by an electronic computer such as a personal computer in which a program for determining the presence or absence of the defect 2 from the image data obtained by the camera 3 is incorporated.

そして、この検査装置Ａを用いて金属箔張り積層板１の検査を行うにあたっては、以下のようにして行う（図１、２参照）。   And when inspecting the metal foil-clad laminate 1 using the inspection apparatus A, it is performed as follows (see FIGS. 1 and 2).

まず、検査対象の金属箔張り積層板１の表面の金属箔に形成する予定の回路パターン６の設計データをリファレンス部５に入力する（矢印イで示す）。ここで、検査対象の金属箔張り積層板１は、絶縁層の表面に銅箔等の金属箔を有しているものであって、例えば、片面又は両面銅張り積層板や内層回路入りの片面又は両面銅張り積層板などを例示することができる。また、回路パターン６の設計データとしては、回路パターン６を設計する段階で使用したＣＡＤ２２で作成したデータを用いることができ、例えば、ガーバーフォーマットの設計データを用いることができる。このように回路パターン６の設計データを用いることにより、露光時に用いるマスクを用いて目視で回路パターン６を認識する場合に比べて、短時間で精密に回路パターン６をリファレンス部５に入力することができる。   First, design data of a circuit pattern 6 to be formed on the metal foil on the surface of the metal foil-clad laminate 1 to be inspected is input to the reference unit 5 (indicated by an arrow a). Here, the metal foil-clad laminate 1 to be inspected has a metal foil such as a copper foil on the surface of the insulating layer. For example, the single-sided or double-sided copper-clad laminate or a single-side containing an inner layer circuit Or a double-sided copper clad laminated board etc. can be illustrated. Further, as the design data of the circuit pattern 6, data created by the CAD 22 used at the stage of designing the circuit pattern 6 can be used. For example, design data in Gerber format can be used. By using the design data of the circuit pattern 6 in this way, the circuit pattern 6 can be accurately input to the reference unit 5 in a shorter time than when the circuit pattern 6 is visually recognized using a mask used during exposure. Can do.

次に、リファレンス部５では、上記で入力された設計データに基づいて検査エリア７が作成されて設定される。この検査エリア７は、図３（ａ）に示す回路パターン６を全部包含するものであるが（図３（ｂ）参照）、検査エリア７はその外形が回路パターン６の外形に沿って形成されたものであって、回路パターン６を拡大した領域であることが好ましい。この場合、検査エリア７の外縁と回路パターン６の外縁との間の寸法Ｗは５〜５０μｍとすることができるが、この寸法の設定は、設計データに基づいて検査エリア７を作成するためにリファレンス部５に組み込まれたプログラムにより可変となっている。そして、検査エリア７は回路パターン６を拡大した領域であるので、広い範囲で検査することができ、金属箔張り積層板１のカメラ３や検査台２１に対する位置合わせ精度が低くて位置合わせ誤差が生じたり、検査エリア７に相当する部分の画像４を取り込む際の精度が低くて欠陥２のサイズ認識誤差が生じた場合でも、欠陥２の見逃しを少なくすることができる。   Next, in the reference unit 5, an inspection area 7 is created and set based on the design data input as described above. The inspection area 7 includes the entire circuit pattern 6 shown in FIG. 3A (see FIG. 3B), but the inspection area 7 is formed along the outer shape of the circuit pattern 6. It is preferable that the area is an enlarged area of the circuit pattern 6. In this case, the dimension W between the outer edge of the inspection area 7 and the outer edge of the circuit pattern 6 can be 5 to 50 μm. The setting of this dimension is for creating the inspection area 7 based on the design data. It is variable by a program incorporated in the reference unit 5. Since the inspection area 7 is an enlarged area of the circuit pattern 6, the inspection area 7 can be inspected in a wide range, and the alignment accuracy of the metal foil-clad laminate 1 with respect to the camera 3 and the inspection table 21 is low, resulting in an alignment error. Even if the size recognition error of the defect 2 occurs due to low accuracy when the image 4 of the portion corresponding to the inspection area 7 is captured, the defect 2 can be reduced.

次に、検出部２０の検査台２１の上に検査対象の金属箔張り積層板１を載置する。ここで、検査する金属箔が上側に向くように金属箔張り積層板１をセットする。次に、検査台２１に載置した金属箔張り積層板１の上面の金属箔に光を照射する（矢印ロで示す）。この光の照射は任意の条件で行うことができるが、例えば、金属箔張り積層板１の上面（水平面）に対して、１５〜７０°の上方から照射することが好ましく、また、光の波長は４００〜８００ｎｍであることが好ましく、また、光の強さは１０００〜３０００ｍｃｄであることが好ましい。   Next, the metal foil-clad laminate 1 to be inspected is placed on the inspection table 21 of the detection unit 20. Here, the metal foil-clad laminate 1 is set so that the metal foil to be inspected faces upward. Next, the metal foil on the upper surface of the metal foil-clad laminate 1 placed on the inspection table 21 is irradiated with light (indicated by arrow b). Although this light irradiation can be performed under arbitrary conditions, for example, it is preferable to irradiate from 15 to 70 ° above the upper surface (horizontal plane) of the metal foil-clad laminate 1, and the wavelength of the light Is preferably 400 to 800 nm, and the light intensity is preferably 1000 to 3000 mcd.

次に、上記のような光の照射を行って金属箔張り積層板１の上面の金属箔で光を上方に反射しながら、カメラ３により金属箔張り積層板１の外観（金属箔張り積層板１の上面の金属箔の全体）を撮像する（矢印ハで示す）。次に、カメラ３により撮像された金属箔張り積層板１の外観の画像（画像データ）のうち、検査エリア７に相当する部分のみの画像（画像データ）４をカメラ３からリファレンス部５に転送して取り込んで入力する（矢印ニで示す）。この場合、リファレンス部５から検出部２０に向って検査エリア７が指定され（矢印ホで示す）、この指定に基づいて検査エリア７に相当する部分の画像４がカメラ３からリファレンス部５に取り込まれる。このように検査エリア７に相当する部分のみの画像４をカメラ３からリファレンス部５に転送して取り込むので、金属箔張り積層板１の上面の画像の全部をリファレンス部５に取り込む場合に比べて、転送するデータ量を少なくすることができ、短時間で処理をすることができる。   Next, while irradiating the light as described above and reflecting light upward with the metal foil on the upper surface of the metal foil-clad laminate 1, the camera 3 gives the appearance of the metal foil-clad laminate 1 (metal foil-clad laminate). 1 is taken (indicated by an arrow C). Next, of the appearance image (image data) of the metal foil-clad laminate 1 imaged by the camera 3, only the image (image data) 4 corresponding to the inspection area 7 is transferred from the camera 3 to the reference unit 5. And input (indicated by arrow D). In this case, the inspection area 7 is designated from the reference unit 5 toward the detection unit 20 (indicated by an arrow e), and the image 4 of the portion corresponding to the examination area 7 is captured from the camera 3 to the reference unit 5 based on this designation. It is. As described above, since the image 4 of only the portion corresponding to the inspection area 7 is transferred from the camera 3 to the reference unit 5 and captured, the entire image on the upper surface of the metal foil-clad laminate 1 is captured in the reference unit 5. The amount of data to be transferred can be reduced and processing can be performed in a short time.

次に、リファレンス部５に取り込んだ上記画像４に基づいて、金属箔張り積層板１の上面の金属箔の欠陥２の有無をリファレンス部５で判定する。ここで、リファレンス部５による欠陥２の有無の判定は、上記画像４中に欠陥２の痕跡２４が存在するか否かで判断する。すなわち、図２に示すように、欠陥２の痕跡２４は正常な部分（欠陥２以外のフラットな部分）と比較すると明暗が異なっているので、この違いを取り込んだ画像４からリファレンス部５に組み込まれたプログラムにより検出して欠陥２の有無を判定するのである。このように検査エリア７に相当する部分のみの画像４に基づいて欠陥２の有無を判定するので、金属箔張り積層板１の上面の画像の全部について、欠陥２の有無を判定する場合に比べて、判定するデータ量を少なくすることができ、短時間で処理をすることができる。しかも、回路パターン６が形成されない部分については欠陥２の有無の判定を行わないために、効率よく精度を高くして判定することができる。尚、金属箔の回路パターン６を形成しない部分に欠陥２が存在していても実害がないので、上記判定は行わない。   Next, based on the image 4 captured in the reference portion 5, the reference portion 5 determines whether or not there is a metal foil defect 2 on the upper surface of the metal foil-clad laminate 1. Here, the determination of the presence or absence of the defect 2 by the reference unit 5 is performed based on whether or not the trace 24 of the defect 2 exists in the image 4. That is, as shown in FIG. 2, the trace 24 of the defect 2 is different in brightness from the normal portion (a flat portion other than the defect 2), and is incorporated into the reference portion 5 from the image 4 incorporating this difference. The presence or absence of the defect 2 is determined by detection by the program. Thus, since the presence or absence of the defect 2 is determined based on the image 4 of only the portion corresponding to the inspection area 7, compared to the case where the presence or absence of the defect 2 is determined for all the images on the upper surface of the metal foil-clad laminate 1. Therefore, the amount of data to be determined can be reduced, and processing can be performed in a short time. Moreover, since it is not determined whether or not the defect 2 is present in the portion where the circuit pattern 6 is not formed, the determination can be made with high accuracy and efficiency. In addition, even if the defect 2 exists in the part which does not form the circuit pattern 6 of metal foil, since there is no actual harm, the said determination is not performed.

そして、この判定により欠陥２が有るとされた場合は、金属箔張り積層板１は不合格とされてその後の回路形成工程などが行われない。一方、上記判定により欠陥２が無いとされた場合は、金属箔張り積層板１は合格とされてその後の回路形成工程などが行われる。従って、不良品の金属箔張り積層板１に対して次工程の回路形成工程などが行われないために、歩留まりを向上させることができる。   If it is determined by this determination that the defect 2 is present, the metal foil-clad laminate 1 is rejected, and the subsequent circuit formation process or the like is not performed. On the other hand, when it is determined that there is no defect 2 by the above determination, the metal foil-clad laminate 1 is accepted and the subsequent circuit formation process or the like is performed. Therefore, since the next circuit forming step or the like is not performed on the defective metal foil-clad laminate 1, the yield can be improved.

また、上記検査装置Ａにおいて、複数枚の金属箔張り積層板１を検査した後、欠陥２の有無の検査結果を発生領域別に集計・表示する機能を備えることが好ましい。この機能は、例えば、リファレンス部５を形成する電子計算機に集計・表示用のプログラムを組み込んで実現することができる。また、この機能は、具体的には、検査エリア７を複数の小エリア７ａ…に分割し、各小エリア７ａにおける欠陥２の発生個数を集計した後、図４に示すように、リファレンス部５が備えるディスプレイ等に表示するようにして行うことができる。図４のものでは、４９個の小エリア７ａ…に分割し、小エリア７ａ…内に示した数字が欠陥２の発生個数である。   Moreover, in the said inspection apparatus A, after inspecting the several metal foil clad laminated board 1, it is preferable to provide the function which totals and displays the test result of the presence or absence of the defect 2 according to the generation | occurrence | production area | region. This function can be realized, for example, by incorporating an aggregation / display program into an electronic computer forming the reference unit 5. Specifically, this function divides the inspection area 7 into a plurality of small areas 7a... And totalizes the number of occurrences of defects 2 in each small area 7a, and then, as shown in FIG. This can be performed by displaying on a display or the like included in the display. In FIG. 4, it is divided into 49 small areas 7a... And the numbers shown in the small areas 7a.

このように、欠陥２の有無の検査結果を発生領域別に集計・表示することによって、この検査工程よりも前工程（金属箔張り積層板の積層成形工程から切断工程までの工程）で不良が起こりやすい箇所を容易に特定することができ、この検査結果を前工程にフィードバックすることによって、欠陥２の発生の削減を図ることができるものである。   In this way, by counting and displaying the inspection results for the presence or absence of defect 2 for each occurrence region, defects occur in the previous process (from the metal foil-clad laminate to the cutting process) before this inspection process. Easy locations can be easily identified, and the occurrence of defects 2 can be reduced by feeding back the inspection results to the previous process.

図５に本発明の金属箔張り積層板１の検査装置Ａの他例を示す。この検査装置Ａは図１に示す検査装置Ａと同様の検出部２０とリファレンス部５とを備えており、以下のようにして金属箔張り積層板１の検査を行う（図６参照）。   FIG. 5 shows another example of the inspection apparatus A for the metal foil-clad laminate 1 of the present invention. This inspection apparatus A includes a detection unit 20 and a reference unit 5 similar to the inspection apparatus A shown in FIG. 1, and inspects the metal foil-clad laminate 1 as follows (see FIG. 6).

まず、上記と同様にして、検査対象の金属箔張り積層板１の表面の金属箔に形成する予定の回路パターン６の設計データをリファレンス部５に入力する（矢印イで示す）。この実施の形態で使用される設計データも回路パターン６を設計する段階で使用したＣＡＤ２２で作成したデータである。次に、リファレンス部５では上記と同様にして設計データに基づいて検査エリア７が作成されて設定される。ここで作成される検査エリア７も、図３に示すように、回路パターン６を全部包含するものであり、また、検査エリア７の外形が回路パターン６の外形に沿って形成されたものであって、回路パターン６を拡大した領域であることが好ましい。尚、図６においては回路パターン６をそのまま検査エリア７として図を示した。   First, in the same manner as described above, design data of the circuit pattern 6 to be formed on the metal foil on the surface of the metal foil-clad laminate 1 to be inspected is input to the reference unit 5 (indicated by an arrow a). The design data used in this embodiment is also data created by the CAD 22 used at the stage of designing the circuit pattern 6. Next, in the reference unit 5, an inspection area 7 is created and set based on the design data in the same manner as described above. The inspection area 7 created here also includes the entire circuit pattern 6 as shown in FIG. 3, and the outer shape of the inspection area 7 is formed along the outer shape of the circuit pattern 6. Thus, an area in which the circuit pattern 6 is enlarged is preferable. In FIG. 6, the circuit pattern 6 is shown as the inspection area 7 as it is.

次に、上記と同様にして、検出部２０の検査台２１の上に検査対象の金属箔張り積層板１を載置する。次に、上記と同様にして、光の照射を行って（矢印ロで示す）金属箔張り積層板１の上面の金属箔で光を上方に反射しながら、カメラ３により金属箔張り積層板１の外観（金属箔張り積層板１の上面の金属箔の全体）を撮像する（矢印ハで示す）。次に、カメラ３により撮像された金属箔張り積層板１の外観の画像をカメラ３からリファレンス部５に転送して取り込んで入力する。すなわち、上記実施の形態では、検査エリア７に相当する部分のみの画像がカメラ３からリファレンス部５に取り込まれるが、この実施の形態では、金属箔張り積層板１の上面の金属箔の全体の画像８がリファレンス部５に取り込まれる。   Next, the metal foil-clad laminate 1 to be inspected is placed on the inspection table 21 of the detection unit 20 in the same manner as described above. Next, in the same manner as described above, the metal foil-clad laminate 1 is reflected by the camera 3 while irradiating light (indicated by an arrow b) and reflecting light upward with the metal foil on the upper surface of the metal foil-clad laminate 1. Is taken (indicated by an arrow C) of the external appearance (the entire metal foil on the upper surface of the metal foil-clad laminate 1). Next, an image of the appearance of the metal foil-clad laminate 1 picked up by the camera 3 is transferred from the camera 3 to the reference unit 5 and input. That is, in the above embodiment, only the image corresponding to the inspection area 7 is captured from the camera 3 to the reference unit 5. In this embodiment, the entire metal foil on the upper surface of the metal foil-clad laminate 1 is used. The image 8 is captured by the reference unit 5.

次に、リファレンス部５に取り込んだ上記画像に基づいて、金属箔張り積層板１の上面の金属箔の欠陥２の有無をリファレンス部５で判定する。ここで、リファレンス部５による欠陥２の有無の判定は、リファレンス部５に取り込まれた金属箔張り積層板１の上面の金属箔の全体の画像８のうち、検査エリア７に相当する部分のみについて行われる。すなわち、金属箔張り積層板１の上面の金属箔の全体の画像８と検査エリア７とを重ねて、この重なった部分の画像中に欠陥２の痕跡２４が存在するか否かで判断する。欠陥２の痕跡２４であるか否かの判断は上記と同様にして行う。このように検査エリア７に相当する部分のみについて欠陥２の有無を判定するので、金属箔張り積層板１の上面の画像の全部について、欠陥２の有無を判定する場合に比べて、判定するデータ量を少なくすることができ、短時間で処理をすることができる。しかも、回路パターン６が形成されない部分については欠陥２の有無の判定を行わないために、効率よく精度を高くして判定することができる。   Next, based on the image captured in the reference unit 5, the reference unit 5 determines whether or not there is a metal foil defect 2 on the upper surface of the metal foil-clad laminate 1. Here, the determination of the presence or absence of the defect 2 by the reference portion 5 is performed only for the portion corresponding to the inspection area 7 in the entire image 8 of the metal foil on the upper surface of the metal foil-clad laminate 1 taken into the reference portion 5. Done. That is, the entire image 8 of the metal foil on the upper surface of the metal foil-clad laminate 1 and the inspection area 7 are overlapped, and it is determined whether or not the trace 24 of the defect 2 exists in the overlapped image. Whether or not it is the trace 24 of the defect 2 is determined in the same manner as described above. As described above, since the presence or absence of the defect 2 is determined only for the portion corresponding to the inspection area 7, the determination data is compared with the case where the presence or absence of the defect 2 is determined for all the images on the upper surface of the metal foil-clad laminate 1. The amount can be reduced, and processing can be performed in a short time. Moreover, since it is not determined whether or not the defect 2 is present in the portion where the circuit pattern 6 is not formed, the determination can be made with high accuracy and efficiency.

また、この判定により欠陥２が有るとされた場合は、上記と同様に、金属箔張り積層板１は不合格とされてその後の回路形成工程などが行われず、上記判定により欠陥２が無いとされた場合は、金属箔張り積層板１は合格とされてその後の回路形成工程などが行われるので、歩留まりを向上させることができる。さらに、この検査装置Ａにおいても上記と同様に、複数枚の金属箔張り積層板１を検査した後、欠陥２の有無の検査結果を発生領域別に集計・表示する機能を備えることができる。   Moreover, when it is determined that there is a defect 2 by this determination, the metal foil-clad laminate 1 is rejected as in the above, and the subsequent circuit formation process or the like is not performed. In such a case, the metal foil-clad laminate 1 is accepted and the subsequent circuit forming process is performed, so that the yield can be improved. Further, in the inspection apparatus A, as described above, after inspecting a plurality of metal foil-clad laminates 1, it is possible to have a function of counting and displaying the inspection results for the presence or absence of defects 2 by occurrence area.

以下本発明を実施例によって具体的に説明する。   Hereinafter, the present invention will be described specifically by way of examples.

（実施例１）
図１に示す検査装置（銅箔反射方式自動外観検査機）Ａを用いて、金属箔張り積層板１の欠陥２を検査した。金属箔張り積層板１は５００ｍｍ×５００ｍｍ×厚み１．６ｍｍの両面銅張り積層板を用いた。この金属箔張り積層板１の両面の金属箔の表面には長さ５ｍｍ、深さ１０μｍ以下のキズを欠陥２として形成した。 Example 1
A defect 2 of the metal foil-clad laminate 1 was inspected using an inspection apparatus (copper foil reflection type automatic appearance inspection machine) A shown in FIG. As the metal foil-clad laminate 1, a double-sided copper-clad laminate having a size of 500 mm × 500 mm × thickness 1.6 mm was used. Scratches having a length of 5 mm and a depth of 10 μm or less were formed as defects 2 on the surfaces of the metal foils on both surfaces of the metal foil-clad laminate 1.

一方、金属箔張り積層板１に形成する予定の回路パターン６をＣＡＤ２２で設計し、この設計データ（ガーバーデータ）をリファレンス部５に入力して検査エリア７を作成した。図７に示すように、回路パターン６は一つの金属箔張り積層板１に２行３列に並べて６個形成されるように設計した。また、図３（ａ）に示すように、検査エリア７は回路パターン６に相当する部分（ガーバーデータ通り）とした。   On the other hand, the circuit pattern 6 to be formed on the metal foil-clad laminate 1 is designed by the CAD 22, and this design data (Gerber data) is input to the reference unit 5 to create the inspection area 7. As shown in FIG. 7, the circuit pattern 6 was designed so that six circuit patterns 6 were formed on one metal foil-clad laminate 1 in 2 rows and 3 columns. In addition, as shown in FIG. 3A, the inspection area 7 is a portion corresponding to the circuit pattern 6 (as per Gerber data).

次に、上記の金属箔張り積層板１を検査台２１に載置した。この時、金属箔張り積層板１の一方の金属箔を上向きにしてカメラ３の方に向けた。次に、波長６６０ｎｍの光を金属箔張り積層板１の金属箔の上方３５°の角度から照射しながらカメラ３で撮像し、検査エリア７に相当する部分の画像４をカメラ３からリファレンス部５に取り込んだ。次に、リファレンス部５により上記画像４中に欠陥２の痕跡２４が存在するか否かを判断させて、金属箔張り積層板１に形成した上記欠陥２の有無を判定させた。   Next, the metal foil-clad laminate 1 was placed on the inspection table 21. At this time, one metal foil of the metal foil-clad laminate 1 was directed upward toward the camera 3. Next, the camera 3 picks up an image 4 corresponding to the inspection area 7 from the camera 3 while irradiating light having a wavelength of 660 nm from an angle of 35 ° above the metal foil of the metal foil-clad laminate 1. Incorporated. Next, the reference part 5 was made to judge whether or not the trace 24 of the defect 2 was present in the image 4, and the presence or absence of the defect 2 formed on the metal foil-clad laminate 1 was judged.

（実施例２）
図５に示す検査装置（銅箔反射方式自動外観検査機）Ａを用いて、金属箔張り積層板１の欠陥２を検査した。金属箔張り積層板１は実施例１と同様のものを用い、欠陥２も同様に形成した。また、検査エリア７も実施例１と同様にして作成し、リファレンス部５に設定した。さらに、実施例１と同様にして、検査台２１に載置した金属箔張り積層板１の金属箔に光を照射しながらカメラ３で撮像し、金属箔張り積層板１の金属箔の全体の画像８をカメラ３からリファレンス部５に取り込んだ。次に、リファレンス部５により上記画像８中のうちの検査エリア７に相当する部分のみについて欠陥２の痕跡２４が存在するか否かを判断させて、金属箔張り積層板１に形成した上記欠陥２の有無を判定させた。 (Example 2)
A defect 2 of the metal foil-clad laminate 1 was inspected using an inspection apparatus (copper foil reflection type automatic appearance inspection machine) A shown in FIG. The metal foil-clad laminate 1 was the same as in Example 1, and the defect 2 was formed in the same manner. The inspection area 7 was also created in the same manner as in Example 1 and set in the reference unit 5. Further, in the same manner as in Example 1, an image is taken with the camera 3 while irradiating the metal foil of the metal foil-clad laminate 1 placed on the inspection table 21 with light, and the entire metal foil of the metal foil-clad laminate 1 is captured. The image 8 was captured from the camera 3 to the reference unit 5. Next, the reference part 5 determines whether or not the trace 24 of the defect 2 exists only in the part corresponding to the inspection area 7 in the image 8, and the defect formed in the metal foil-clad laminate 1 is determined. The presence or absence of 2 was determined.

（比較例１）
金属箔張り積層板１は実施例１と同様のものを用い、欠陥２も同様に形成した。また、欠陥２の検査は、外層パターンフィルムを用いて金属箔張り積層板１の金属箔の表面と照合して目視により行った。 (Comparative Example 1)
The metal foil-clad laminate 1 was the same as in Example 1, and the defect 2 was formed in the same manner. Further, the defect 2 was inspected visually by checking the surface of the metal foil of the metal foil-clad laminate 1 using an outer layer pattern film.

上記実施例１、２及び比較例１を用いて１００枚の金属箔張り積層板１の両面について欠陥２の検査を行い、検査時間と検査精度とを求めた。検査時間は全ての金属箔張り積層板１の両面の検査が終了するまでの時間とし、検査精度は金属箔張り積層板１に形成した全ての欠陥２の個数に対して検査（検出）された欠陥２の数の割合で表した。結果を表１に示す。   Using Examples 1 and 2 and Comparative Example 1, 100 defects of metal foil-clad laminate 1 were inspected for defect 2, and the inspection time and inspection accuracy were determined. The inspection time is the time until the inspection of both surfaces of all the metal foil-clad laminates 1 is completed, and the inspection accuracy is inspected (detected) for the number of all defects 2 formed in the metal foil-clad laminate 1. Expressed as a percentage of the number of defects 2. The results are shown in Table 1.

Figure 2007093305
Figure 2007093305

表１から明らかなように、実施例１、２は比較例１に比べて検査時間が短く、検査精度も高くなった。   As is apparent from Table 1, Examples 1 and 2 had a shorter inspection time and higher inspection accuracy than Comparative Example 1.

（実施例３）
実施例１において、欠陥２を金属箔の回路パターン６の形成予定位置の近傍に意図的に形成した。ここで、回路パターン６の形成予定位置の近傍とは、回路パターン６の形成予定位置の外縁から５μｍ内側に入った位置から１０μｍ外側に出た位置までの間である。また、欠陥２は金属箔張り積層板１の一枚当たり５０個形成した。 (Example 3)
In Example 1, the defect 2 was intentionally formed in the vicinity of the planned formation position of the circuit pattern 6 of the metal foil. Here, the vicinity of the position where the circuit pattern 6 is to be formed refers to the interval from the position 5 mm inside from the outer edge of the circuit pattern 6 formation position to the position 10 μm outside. In addition, 50 defects 2 were formed per metal foil-clad laminate 1.

そして、この欠陥２を形成した金属箔張り積層板１を実施例１と同様にして検査した。   Then, the metal foil-clad laminate 1 on which this defect 2 was formed was inspected in the same manner as in Example 1.

（実施例４）
欠陥２を形成した金属箔張り積層板１としては実施例３と同様のものを用いた。また、検査エリア７は、図３（ｂ）に示すように、回路パターン６に相当する部分と回路パターン６の周囲をＷ＝５μｍの幅（ガーバーデータよりも約２画素分拡大）で囲む部分に相当する部分とを合わせて形成した。そして、その他の構成は実施例１と同様にして、欠陥２を形成した金属箔張り積層板１を検査した。 Example 4
As the metal foil-clad laminate 1 on which the defect 2 was formed, the same one as in Example 3 was used. In addition, as shown in FIG. 3B, the inspection area 7 is a portion that surrounds the portion corresponding to the circuit pattern 6 and the periphery of the circuit pattern 6 with a width of W = 5 μm (enlarged by about 2 pixels from Gerber data). And a portion corresponding to the above. And the other structure was carried out similarly to Example 1, and the metal foil clad laminated board 1 in which the defect 2 was formed was test | inspected.

上記実施例３、４について、上記と同様の検査精度を算出した。結果を表２に示す。   For Examples 3 and 4, the same inspection accuracy as above was calculated. The results are shown in Table 2.

Figure 2007093305
Figure 2007093305

表２から明らかなように、実施例３よりも検査エリア７の広い実施例４の方が検査精度が高くなった。   As is clear from Table 2, the inspection accuracy of Example 4 having a wider inspection area 7 was higher than that of Example 3.

本発明の実施の形態の一例を示す概略図である。It is the schematic which shows an example of embodiment of this invention. 同上の動作を示すフロー図である。It is a flowchart which shows operation | movement same as the above. （ａ）は回路パターンの一例を示す平面図、（ｂ）は検査エリアの一例を示す平面図である。(A) is a top view which shows an example of a circuit pattern, (b) is a top view which shows an example of an inspection area. 同上の検査エリアの分割の一例を示す説明図である。It is explanatory drawing which shows an example of a division | segmentation of an inspection area same as the above. 同上の他の実施の形態の一例を示す概略図である。It is the schematic which shows an example of other embodiment same as the above. 図５の検査装置の動作を示すフロー図である。It is a flowchart which shows operation | movement of the test | inspection apparatus of FIG. 実施例における金属箔張り積層板と検査エリアの一例を示す概略図である。It is the schematic which shows an example of the metal foil clad laminated board and inspection area in an Example.

符号の説明Explanation of symbols

１ 金属箔張り積層板
２ 欠陥
３ カメラ
４ 画像
５ リファレンス部
６ 回路パターン
７ 検査エリア DESCRIPTION OF SYMBOLS 1 Metal foil clad laminated board 2 Defect 3 Camera 4 Image 5 Reference part 6 Circuit pattern 7 Inspection area

Claims (4)

金属箔張り積層板の表面の打痕、キズ、ピンホール、シワなどの欠陥の有無を判定するための装置であって、金属箔張り積層板の表面を撮像するためのカメラと、カメラの撮像により得られた画像に基づいて欠陥の有無を判定するためのリファレンス部とを備え、リファレンス部には、検査対象の金属箔張り積層板に形成する予定の回路パターンの設計データが入力されて、この設計データに基づいて回路パターンを包含する検査エリアが設定されると共に、リファレンス部にはカメラで撮像された金属箔張り積層板の表面の画像のうち検査エリアに相当する部分のみの画像が入力され、この画像に基づいて欠陥の有無が判定されることを特徴とする金属箔張り積層板の検査装置。   An apparatus for determining the presence or absence of defects such as dents, scratches, pinholes, wrinkles, etc. on the surface of a metal foil-clad laminate, a camera for imaging the surface of the metal foil-clad laminate, and imaging of the camera And a reference part for determining the presence or absence of defects based on the image obtained by the above, to the reference part, design data of the circuit pattern to be formed on the metal foil-clad laminate to be inspected is input, Based on this design data, an inspection area that includes the circuit pattern is set, and an image of only the portion corresponding to the inspection area of the image of the surface of the metal foil-clad laminate captured by the camera is input to the reference portion. An inspection apparatus for a metal foil-clad laminate, wherein the presence or absence of a defect is determined based on the image. 金属箔張り積層板の表面の打痕、キズ、ピンホール、シワなどの欠陥の有無を判定するための装置であって、金属箔張り積層板の表面を撮像するためのカメラと、カメラの撮像により得られた画像に基づいて欠陥の有無を判定するためのリファレンス部とを備え、リファレンス部には、検査対象の金属箔張り積層板に形成する予定の回路パターンの設計データが入力されて、この設計データに基づいて回路パターンを包含する検査エリアが設定されると共に、リファレンス部にはカメラで撮像された金属箔張り積層板の表面全部の画像が入力されて、この画像の検査エリアに相当する部分のみについて欠陥の有無が判定されることを特徴とする金属箔張り積層板の検査装置。   An apparatus for determining the presence or absence of defects such as dents, scratches, pinholes, wrinkles, etc. on the surface of a metal foil-clad laminate, a camera for imaging the surface of the metal foil-clad laminate, and imaging of the camera And a reference part for determining the presence or absence of defects based on the image obtained by the above, to the reference part, design data of the circuit pattern to be formed on the metal foil-clad laminate to be inspected is input, Based on this design data, an inspection area including a circuit pattern is set, and an image of the entire surface of the metal foil-clad laminate imaged by the camera is input to the reference portion, which corresponds to the inspection area of this image An inspection apparatus for a metal foil-clad laminate, wherein the presence or absence of a defect is determined only for a portion to be processed. 検査エリアは、回路パターンの外形に沿って回路パターンを拡大した領域であることを特徴とする請求項１又は２に記載の金属箔張り積層板の検査装置。   3. The inspection apparatus for a metal foil-clad laminate according to claim 1, wherein the inspection area is an area in which the circuit pattern is enlarged along the outer shape of the circuit pattern. 欠陥の有無の判定結果を発生領域別に集計・表示する機能を備えて成ることを特徴とする請求項１乃至３のいずれかに記載の金属箔張り積層板の検査装置。   The metal foil-clad laminate inspection apparatus according to any one of claims 1 to 3, further comprising a function of counting and displaying the determination result of the presence / absence of defects for each occurrence region.
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